WO2012067026A1 - Method for producing color filter, display element, and color filter - Google Patents

Abstract

Provided are: a method for producing a color filter that is useful in increasing brightness; a display element having superior display properties; and the color filter that is useful in increasing brightness. The method for producing a color filter (10) has: a step for forming a colored pattern (6) using a colored composition on a substrate (5); and a step for forming irregularities at the surface of the colored pattern (6). The irregularities preferably are formed by an etching method, a nanoimprinting method, or a grinding method. Preferably, the method further has a step for forming a protective film (8) on the colored pattern (6) to which the irregularities have been formed.

Description

Color filter manufacturing method, display element, and color filter

The present invention relates to a method for manufacturing a color filter, a display element, and a color filter.

The color filter transmits light in a specific wavelength region of visible light, and generates colored transmitted light. A liquid crystal display element using liquid crystal cannot develop color by itself, but can function as a color liquid crystal display element by using a color filter. The color filter is also used for color display of an organic EL (Electro Luminescence) element using a white light emitting layer, electronic paper, and the like. Furthermore, if a color filter is used, color imaging of a solid-state imaging device such as a CCD image sensor or a CMOS image sensor becomes possible.

Generally, a color filter is composed of a transparent substrate such as glass and a minute coloring pattern containing red, green and blue pigments or dyes. The coloring pattern is provided on the transparent substrate and arranged in a regular shape such as a lattice shape.

The following are known as color filter manufacturing methods. For example, a colored radiation-sensitive composition is applied on a transparent substrate or a transparent substrate on which a light-shielding layer having a desired pattern is formed, as a colored composition that is sensitive to appropriate irradiation rays. Next, after the coating film is dried, the dried coating film is irradiated with radiation (hereinafter referred to as “exposure”) through a mask and subjected to a development treatment. This is a method for obtaining a colored pattern (see, for example, Patent Document 1 or 2). Moreover, the method etc. which obtain the pattern of each color by the inkjet system using a coloring thermosetting resin composition are also known (for example, refer patent document 3).

In recent years, demands for higher image quality and higher brightness for display elements have been increasing. For this reason, the color filter is required to have such characteristics that can improve the performance. Specifically, a color filter having a high brightness stimulus value (Y) in the CIE color system is required.

In response to such demands, for example, use of a new pigment such as polyhalogenated zinc phthalocyanine (see Patent Document 4) or use of a dye (see Patent Document 5) as a colorant has been proposed. ing.

JP-A-2-144502 JP-A-3-53201 JP 2000-310706 A JP 2007-284589 A JP 2010-32999 A

However, in the case of a pigment dispersion type colored composition, it is said that there is a technical limit to the method of increasing the luminance by increasing the Y value of the color filter by improving the pigment and composition.

On the other hand, a coloring pattern formed using a coloring composition containing a dye has a problem that heat resistance and solvent resistance are remarkably inferior compared with a coloring pattern formed using a coloring composition containing a pigment. . Therefore, when mass-producing a color filter using a coloring composition containing a dye, it is necessary to improve performance such as improvement of heat resistance and solvent resistance in addition to improvement of luminance.

The present invention has been made in view of the above problems. That is, an object of the present invention is to provide a method for producing a color filter useful for increasing the brightness, a display element having excellent display characteristics, and a color filter useful for increasing the brightness.

A first aspect of the present invention includes a step of forming a colored pattern on a substrate;
And a step of forming irregularities on the surface of the colored pattern.

In the first aspect of the present invention, the unevenness is preferably formed by an etching method, a nanoimprint method or a polishing method.

1st aspect of this invention WHEREIN: The process of forming an unevenness | corrugation on the surface of a coloring pattern forms a resist pattern on a coloring pattern, and performs the etching process to the coloring pattern exposed from a resist pattern, and forms an unevenness | corrugation It can be.

In the first aspect of the present invention, it is preferable that the height of the projection is 10 nm or more and the width of the bottom of the projection is 10 nm or more.

In the first aspect of the present invention, the coloring pattern includes at least one of a red coloring pattern and a green coloring pattern, and forms an unevenness on the surface of at least one of the red coloring pattern and the green coloring pattern. can do.

It is preferable that the first aspect of the present invention further includes a step of forming a protective film on the colored pattern on which the unevenness is formed.

The second aspect of the present invention relates to a display element having the color filter manufactured according to the first aspect of the present invention.

A third aspect of the present invention is a color filter having a plurality of colored patterns on a substrate,
Concavities and convexities are formed on the surface of the colored pattern of at least one of the colored patterns, and the height of the convex portions of the concave and convex portions is 10 nm or more, and the width of the base of the convex portions is 10 nm or more. It is what.

According to the first aspect of the present invention, a method of manufacturing a color filter useful for increasing the brightness is provided.
According to the 2nd aspect of this invention, the display element excellent in the display characteristic is provided.
According to the third aspect of the present invention, a color filter useful for increasing the brightness is provided.

It is typical sectional drawing of the color liquid crystal display element provided with the color filter of this Embodiment. 3 is a surface SEM photograph of the red cured film obtained in Examples 1 to 3 and Comparative Example 1. 2 is a cross-sectional SEM photograph of a red cured film obtained in Examples 1 to 3 and Comparative Example 1. 3 is a surface SEM photograph of the green cured film obtained in Examples 4 to 6 and Comparative Example 2. 4 is a cross-sectional SEM photograph of a green cured film obtained in Examples 4 to 6 and Comparative Example 2. It is a surface SEM photograph of the blue cured film obtained in Example 7, Example 8, and Comparative Example 3. 4 is a cross-sectional SEM photograph of a blue cured film obtained in Example 7, Example 8, and Comparative Example 3.

As a result of intensive studies, the present inventors have found that the above-described problems can be solved by forming irregularities on the surface of the colored pattern of each color constituting the color filter, and have completed the present invention.
Hereinafter, this embodiment will be described in detail.

<Color filter manufacturing method>
The inventor has found that the extraction efficiency of light transmitted through the colored pattern can be increased by forming irregularities on the surface of the colored pattern. For this reason, the manufacturing method of the color filter of this Embodiment is characterized by including the process of following (1) and (2) at least.
(1) Step of forming a colored pattern on the substrate (2) Step of forming irregularities on the surface of the colored pattern

Hereinafter, the steps (1) and (2) will be described in detail with specific examples.

(1) Step of forming a colored pattern on a substrate First, a substrate is prepared. As the substrate, for example, a transparent glass substrate such as borosilicate glass, aluminoborosilicate glass, alkali-free glass, quartz glass, synthetic quartz glass, soda lime glass, and white sapphire can be used. Also, acrylic such as polymethyl methacrylate, polyamide, polyacetal, polybutylene terephthalate, polyethylene terephthalate, polyethylene naphthalate, triacetyl cellulose, syndiotactic polystyrene, polyphenylene sulfide, polyether ketone, polyether ether ketone, fluororesin, poly A transparent resin film such as ether nitrile, polycarbonate, modified polyphenylene ether, polycyclohexene, polynorbornene resin, polysulfone, polyethersulfone, polyarylate, polyamideimide, polyetherimide, or thermoplastic polyimide can also be used. In particular, alkali-free glass is a material having a small coefficient of thermal expansion, and is preferably used from the viewpoint of excellent dimensional stability and characteristics in high-temperature heat treatment.

Moreover, on these substrates, if desired, in addition to chemical treatment and plasma treatment with a silane coupling agent, etc., a silicon dioxide film is formed by ion plating, sputtering, gas phase reaction or vacuum deposition, etc. Appropriate pretreatment can be applied.

Next, a light-shielding layer (black matrix) is formed on the substrate so as to partition a portion where a pixel is to be formed. For example, a metal thin film such as chromium formed by sputtering or vapor deposition is processed into a desired pattern by using a photolithography method. Alternatively, a coloring composition containing a black colorant may be applied on a substrate and processed into a desired pattern by a photolithography method. The thickness of the light shielding layer made of a metal thin film is usually preferably 0.1 μm to 0.2 μm. On the other hand, the thickness of the light shielding film formed using the black coloring composition is preferably about 1 μm.
In some cases, the light shielding layer is unnecessary, and in this case, the process of forming the light shielding layer can be omitted.

Next, for example, a negative radiation-sensitive colored radiation-sensitive composition containing a red colorant is applied onto the substrate. Next, pre-baking is performed to evaporate the solvent, thereby forming a coating film. Then, after exposing a coating film through a photomask, it develops with an alkali developing solution, and the unexposed part of a coating film is dissolved and removed. Thereafter, preferably, post-baking is performed to form a pixel array in which red coloring patterns are arranged in a predetermined arrangement.

Next, a negative radiation-sensitive colored radiation-sensitive composition containing a green colorant is applied onto the substrate on which the red coloring pattern is formed, and the green coloring pattern is formed in the same manner as described above. Form a pixel array arranged in a predetermined arrangement.

Further, a negative radiation-sensitive colored radiation-sensitive composition containing a blue colorant is applied onto the substrate on which each of the red and green coloring patterns is formed. A pixel array in which coloring patterns are arranged in a predetermined arrangement is formed.

As described above, a color filter in which a pixel array of the three primary colors of red, green and blue is arranged on the substrate is obtained. However, in the present embodiment, the order in which the colored patterns of the respective colors are formed on the substrate is not limited to the above example. The order of forming each color can be changed as appropriate.

When applying the colored radiation-sensitive composition to the substrate, a spray method, a roll coating method, a spin coating method (spin coating method), a slit die coating method, a bar coating method, or the like can be appropriately selected. In view of obtaining a coating film having a uniform film thickness, it is preferable to employ a spin coating method or a slit die coating method.

The pre-bake is usually performed by combining vacuum drying and heat drying. The drying under reduced pressure is usually performed until the pressure reaches 50 Pa to 200 Pa. The conditions for heat drying are usually about 1 to 10 minutes at a temperature of 70 to 110 ° C. using a hot plate. The thickness of the applied coating is usually 0.6 μm to 8.0 μm, preferably 1.2 μm to 5.0 μm, as the film thickness after drying.

Examples of radiation light sources used for exposure include lamp light sources such as xenon lamps, halogen lamps, tungsten lamps, high-pressure mercury lamps, ultrahigh-pressure mercury lamps, metal halide lamps, medium-pressure mercury lamps, and low-pressure mercury lamps, argon ion lasers, and YAG lasers. And laser light sources such as a XeCl excimer laser and a nitrogen laser. In general, the emitted wavelength is preferably in the range of 190 nm to 450 nm. The exposure dose of radiation is generally preferably 10 J / m ² to 10,000 J / m ² .

Examples of the alkali developer include sodium carbonate, sodium hydroxide, potassium hydroxide, tetramethylammonium hydroxide, choline, 1,8-diazabicyclo- [5.4.0] -7-undecene, 1,5-diazabicyclo An aqueous solution such as-[4.3.0] -5-nonene is preferably used. An appropriate amount of a water-soluble organic solvent such as methanol or ethanol, a surfactant, or the like can be added to the alkaline developer. Incidentally, after the alkali development treatment, washing with water is usually performed.

As the development processing method, for example, a shower development method, a spray development method, a dip (immersion) development method, or a paddle (liquid accumulation) development method can be applied. The development conditions can be, for example, 5 seconds to 300 seconds at room temperature.

The post-baking conditions can be set at, for example, 180 ° C. to 280 ° C. for about 20 minutes to 40 minutes when a hot air heating furnace is used.

The film thickness of the colored pattern formed as described above is usually 0.5 μm to 5.0 μm, preferably 1.0 μm to 3.0 μm.

As another example of forming a colored pattern on a substrate, there is a method for obtaining pixels of each color by an ink jet method disclosed in Japanese Patent Application Laid-Open Nos. 7-318723 and 2000-310706.

In this method, first, a partition having a light shielding function is formed on the surface of the substrate. Next, for example, a colored thermosetting composition containing a red colorant is discharged into the partition wall by an ink jet apparatus. Thereafter, pre-baking is performed to evaporate the solvent. Next, the coating film is exposed as necessary, and then cured by post-baking to form a red pixel pattern.

Next, a colored thermosetting composition containing a green colorant is discharged onto the substrate on which the red colored pattern is formed by an ink jet apparatus to form a green pixel pattern in the same manner as described above.

Furthermore, a colored thermosetting composition containing a blue colorant is ejected onto the substrate on which each of the red and green colored patterns is formed by an ink jet apparatus to form a blue pixel pattern in the same manner as described above.

As described above, a color filter in which coloring patterns of the three primary colors of red, green, and blue are arranged on the substrate is obtained. However, in the present embodiment, the order of forming the coloring patterns of the respective colors is not limited to the above example. The order of forming each color can be changed as appropriate.

In addition, the above-mentioned partition fulfill | performs not only the light-shielding function but the function for the coloring composition of each color discharged in the division not to mix colors. Therefore, the film thickness is thicker than the light shielding layer (black matrix) used in the first example. A partition is normally formed using a black composition.

The substrate used for forming the color filter, the light source of radiation, and the pre-baking and post-baking methods and conditions are the same as in the first example. The film thickness of the colored pattern formed by the inkjet method is about the same as the height of the partition wall.

In the present embodiment, the color pattern constituting the color filter is not limited to red, green, and blue, but may be a color pattern having three primary colors of yellow, magenta, and cyan. In addition to the coloring patterns corresponding to the pixels of the three primary colors, the fourth and fifth coloring patterns can also be formed. For example, as disclosed in JP-T-2005-523465, etc., a fourth pixel (yellow pixel) for expanding the color specification range in addition to the coloring patterns corresponding to the three primary color pixels of red, green and blue And a fifth pixel (cyan pixel) can be arranged.

The coloring pattern is usually formed using a radiation-sensitive or thermosetting coloring composition. The coloring composition used in the step of forming the coloring pattern contains at least a coloring agent, a binder resin, and a crosslinking agent. Moreover, a photoinitiator can be contained as needed for the purpose of imparting radiation sensitivity to the colored composition. The colored composition is usually used as a liquid composition by blending a solvent. Hereinafter, each component will be described.

The colorant is not particularly limited as long as it has colorability, and the color and material can be appropriately selected according to the use of the color filter. Specifically, any of pigments, dyes, and natural pigments can be used as the colorant. Since the color filter is required to have high color purity, brightness, contrast and the like, a pigment, a dye or a mixture thereof is preferably used.

As the pigment, either an organic pigment or an inorganic pigment can be used.

Examples of the organic pigment include compounds classified as pigments in the color index (CI; issued by The Society of Dyer's and Colorists). Preferably, the following color index (CI) names are given.

C. I. Pigment yellow 83, C.I. I. Pigment yellow 138, C.I. I. Pigment yellow 139, C.I. I. Pigment yellow 150, C.I. I. Pigment yellow 180, C.I. I. Pigment yellow 211;
C. I. Pigment orange 38;

C. I. Pigment red 166, C.I. I. Pigment red 177, C.I. I. Pigment red 224, C.I. I. Pigment red 242, C.I. I. Pigment red 254;
C. I. Pigment violet 23;

C. I. Pigment blue 1, C.I. I. Pigment blue 15: 6, C.I. I. Pigment blue 80;
C. I. Pigment green 7, C.I. I. Pigment green 36, C.I. I. Pigment green 58;
C. I. Pigment brown 23, C.I. I. Pigment brown 25;
C. I. Pigment black 1, C.I. I. Pigment Black 7.

Examples of inorganic pigments include titanium oxide, barium sulfate, calcium carbonate, zinc white, lead sulfate, yellow lead, zinc yellow, red bean (red iron oxide (III)), cadmium red, ultramarine blue, bitumen, chromium oxide green, and cobalt. Examples include green, amber, titanium black, synthetic iron black, and carbon black.

In the present embodiment, it is preferable to use the organic pigment by refining primary particles by so-called salt milling. As a salt milling method, for example, a method disclosed in Japanese Patent Laid-Open No. 8-179111 can be employed.

The dye can be appropriately selected from various oil-soluble dyes, direct dyes, acid dyes and metal complex dyes. For example, the following color index (CI) names are given.

C. I. Solvent Yellow 4, C.I. I. Solvent Yellow 14, C.I. I. Solvent Yellow 15, C.I. I. Solvent Yellow 24, C.I. I. Solvent Yellow 82, C.I. I. Solvent Yellow 88, C.I. I. Solvent Yellow 94, C.I. I. Solvent Yellow 98, C.I. I. Solvent Yellow 162, C.I. I. Solvent yellow 179;
C. I. Solvent Red 45, C.I. I. Solvent red 49;
C. I. Solvent Orange 2, C.I. I. Solvent Orange 7, C.I. I. Solvent Orange 11, C.I. I. Solvent Orange 15, C.I. I. Solvent Orange 26, C.I. I. Solvent orange 56;
C. I. Solvent Blue 35, C.I. I. Solvent Blue 37, C.I. I. Solvent Blue 59, C.I. I. Solvent blue 67;

C. I. Acid Yellow 17, C.I. I. Acid Yellow 29, C.I. I. Acid Yellow 40, C.I. I. Acid Yellow 76;
C. I. Acid Red 91, C.I. I. Acid Red 92, C.I. I. Acid Red 97, C.I. I. Acid Red 114, C.I. I. Acid Red 138, C.I. I. Acid Red 151;
C. I. Acid Orange 51, C.I. I. Acid Orange 63;
C. I. Acid Blue 80, C.I. I. Acid Blue 83, C.I. I. Acid Blue 90;
C. I. Acid Green 9, C.I. I. Acid Green 16, C.I. I. Acid Green 25, C.I. I. Acid Green 27.

In the present embodiment, the colorants can be used alone or in admixture of two or more.

The binder resin used in the coloring composition is not particularly limited, but preferably contains a polymer having an acidic functional group. Examples of the acidic functional group include a carboxyl group, a phenolic hydroxyl group, an imido acid group, a sulfo group, a sulfino group, and a sulfeno group. Of these, a carboxyl group is preferably used.

Examples of the polymer having a carboxyl group include, for example, JP-A-5-19467, JP-A-6-230212, JP-A-7-140654, JP-A-7-207211, and JP-A-8-259876. JP-A-9-325494, JP-A-10-31308, JP-A-10-300902, JP-A-11-140144, JP-A-11-174224, JP-A-11-231523, Examples include polymers disclosed in Kaihei 11-258415, JP-A 2000-56118, JP-A 2002-296778, JP-A 2004-101728, and JP-A 2008-181095. it can.

In this embodiment, the binder resin can be used alone or in combination of two or more.

The crosslinking agent used for the coloring composition is not particularly limited as long as it is a compound having two or more polymerizable groups. Examples of the polymerizable group include an ethylenically unsaturated group, an oxiranyl group, an oxetanyl group, and an N-alkoxymethylamino group.

In this embodiment, as the crosslinking agent, a compound having two or more (meth) acryloyl groups or a compound having two or more N-alkoxymethylamino groups is preferably used.

Particularly preferred crosslinking agents include, for example, trimethylolpropane triacrylate, pentaerythritol triacrylate, dipentaerythritol pentaacrylate, dipentaerythritol hexaacrylate, a compound obtained by reacting pentaerythritol triacrylate with succinic anhydride, dipenta A compound obtained by reacting erythritol pentaacrylate with succinic anhydride, a caprolactone-modified polyfunctional (meth) acrylate described in paragraphs [0015] to [0018] of JP-A No. 11-44955, N, N, N ′, N ′, N ″, N ″ -hexa (alkoxymethyl) melamine or N, N, N ′, N′-tetra (alkoxymethyl) benzoguanamine can be mentioned.

In the present embodiment, the crosslinking agents can be used alone or in combination of two or more.

The photopolymerization initiator used in the coloring composition generates an active species capable of initiating the curing reaction of the above-mentioned crosslinking agent upon exposure to radiation such as visible light, ultraviolet light, far ultraviolet light, electron beam or X-ray. It is a compound that can be

Preferred photopolymerization initiators include, for example, thioxanthone compounds, acetophenone compounds, biimidazole compounds, triazine compounds, O-acyloxime compounds, onium salt compounds, benzoin compounds, benzophenone compounds, α-diketones. Compounds, polynuclear quinone compounds, diazo compounds, imide sulfonate compounds, and the like.

In this embodiment, the photopolymerization initiator can be used in combination with a known sensitizer or a hydrogen donor. Moreover, a photoinitiator can be used individually or in mixture of 2 or more types.

The solvent used in the colored composition is preferably a solvent that disperses or dissolves each component constituting the colored composition and does not react with these components and has appropriate volatility.

In the present embodiment, preferable solvents include, for example, propylene glycol monomethyl ether, ethylene glycol monomethyl ether acetate, propylene glycol monomethyl ether acetate, propylene glycol monoethyl ether acetate, 3-methoxybutyl acetate, diethylene glycol dimethyl ether, diethylene glycol methyl ethyl ether. , Cyclohexanone, 2-heptanone, 3-heptanone, 1,3-butylene glycol diacetate, 1,6-hexanediol diacetate, ethyl lactate, ethyl 3-methoxypropionate, methyl 3-ethoxypropionate, 3-ethoxypropion Ethyl acetate, 3-methyl-3-methoxybutylpropionate, n-butyl acetate, i-butyl acetate, Acid n- amyl acetate, i- amyl, n- butyl propionate, ethyl butyrate, i- propyl, and butyric acid n- butyl or ethyl pyruvate.

In the present embodiment, the solvents can be used alone or in combination of two or more.

The colored composition of the present embodiment can further contain other components as necessary. For example, as other components, a pigment dispersant such as an acrylic copolymer, polyurethane, polyester, polyethyleneimine and polyallylamine; a surfactant such as a fluorosurfactant and a silicon surfactant; vinyltrimethoxysilane; Vinyltriethoxysilane, vinyltris (2-methoxyethoxy) silane, 3-glycidoxypropyltrimethoxysilane, 3-glycidoxypropylmethyldimethoxysilane, 3-methacryloyloxypropyltrimethoxysilane and 3-mercaptopropyltrimethoxy Examples thereof include adhesion promoters such as silane.

(2) Step of forming irregularities on the surface of the colored pattern The method of forming irregularities on the surface of the colored pattern formed by the above steps is not particularly limited. For example, etching, nanoimprinting, or cerium oxide particles A polishing method using the above can be used.

As the etching method, either dry etching or wet etching can be applied. Dry etching is a method of etching a material with a reactive gas (etching gas), ions, or radicals. On the other hand, wet etching is a method of etching a material with a liquid.

In consideration of manufacturing cost, wet etching with acid or alkali is preferable. On the other hand, when the reproducibility of the uneven formation is taken into consideration, dry etching suitable for fine processing is preferable.

Dry etching includes a method in which a material is exposed to a reactive gas (reactive gas etching) and a reactive ion etching in which gas is ionized and radicalized by plasma to perform etching.

There are various types of dry etching apparatuses using reactive ion etching. In either method, the apparatus configuration is substantially the same. That is, in a chamber maintained at a required vacuum pressure, an electromagnetic wave or the like is applied to the etching gas to turn the gas into plasma. At the same time, a high frequency voltage is applied to the cathode on which the sample substrate is placed in the chamber. Thereby, ion species and radical species in the plasma are accelerated and collided in the direction of the sample, and sputtering by ions and chemical reaction of the etching gas are caused simultaneously to perform microfabrication of the sample.

In the present embodiment, after the colored pattern is formed by the above-described steps, it is possible to directly perform the etching process on the colored pattern as it is. Further, after forming a resist pattern serving as a mask on the colored pattern using photolithography technology, the colored pattern portion exposed from the resist pattern may be etched. According to this method, it is possible to select a colored pattern of a desired color from among a plurality of colored patterns, and to provide unevenness, and to provide a desired degree of unevenness at a desired location. is there.

Also, in the nanoimprint method, a master on which a concavo-convex pattern of several tens to several hundreds of nanometers is formed in advance by electron beam lithography or the like is pressed against a substrate on which a colored pattern is formed, and the concavo-convex of the master is transferred to the colored pattern. More specifically, US Pat. No. 5,772,905, S.A. Y. Chou et al, Appl. Phys. Lett. 76, 3114 (1995) or the like. Even by the nanoimprint method, it is possible to select a colored pattern of a desired color from among a plurality of colored patterns, and to provide unevenness, and to provide a desired degree of unevenness at a desired location. .

As described above, by forming irregularities on the surface of the colored pattern formed using the colored composition, it is possible to increase the light extraction efficiency that passes through the colored pattern. Such an effect is particularly remarkable in a red coloring pattern and a green coloring pattern. Therefore, at least one of the red and green coloring patterns may be selected to provide unevenness on the surface.

The size of the unevenness formed on the surface of the colored pattern can be adjusted to a desired value, but preferably the height of the convex part is 10 nm or more and the width of the base of the convex part is 10 nm or more. In the present embodiment, the height of the convex portion is more preferably 50 nm or more, further preferably in the range of 50 nm to 200 nm, and particularly preferably in the range of 80 nm to 200 nm. On the other hand, the width of the convex portion is preferably 20 nm or more, and more preferably in the range of 20 nm to 200 nm. In addition, the size of the unevenness formed on the surface of the colored pattern is measured by image analysis of the SEM photograph. Moreover, when it aims at improving the Y value of a color filter, it is preferable that the unevenness | corrugation is formed in the surface of 30% or more of the total pixel area of the coloring pattern which is going to form an unevenness | corrugation. In that case, it is preferable that the region in which the unevenness is formed is configured to be uniformly distributed over the entire color filter and within any one pixel without being partially biased.

The display characteristics of the display element can be enhanced by further providing a protective film on the colored pattern having the irregularities formed in this manner. Examples of the protective film include organic films or organic-inorganic hybrid films formed from curable compositions, or inorganic films such as SiNx films and SiOx films. In this Embodiment, it is preferable to form a protective film using a curable composition.

As a method for forming a protective film using a curable resin composition, for example, a method disclosed in Japanese Patent Application Laid-Open No. 4-53879 or Japanese Patent Application Laid-Open No. 6-192389 can be employed. According to this method, first, the curable resin composition is applied to the substrate surface on which the colored pattern is formed, and the solvent is removed by pre-baking to obtain a coating film. The coating film is exposed and developed as necessary to obtain a desired pattern, and then post-baked to form a protective film.

The radiation light source used when forming the protective film, and the pre-baking and post-baking methods and conditions are as described in (1) Coloring pattern in the step of forming a coloring pattern on the substrate using the coloring composition It is the same as the method of forming. The thickness of the protective film thus formed is usually 0.1 μm to 8.0 μm, preferably 0.1 μm to 6.0 μm.

Examples of the curable resin composition used for forming the protective film include thermosetting resin compositions disclosed in JP-A-3-188153 and JP-A-4-53879, and JP-A-6-192389. The radiation-sensitive resin composition disclosed in Japanese Patent Laid-Open No. 8-183819 and the like, and the polyorganosiloxane disclosed in Japanese Patent Laid-Open No. 2006-195420 or 2008-208342 are included. A curable composition etc. can be mentioned.

According to the color filter manufacturing method of the present embodiment, a color filter having a high brightness stimulus value (Y) in the CIE color system can be obtained. Therefore, a display element with high luminance can be obtained by using the color filter of this embodiment mode. The color filter of this embodiment includes, for example, various color filters including a color filter for a color liquid crystal display element, a color filter for color separation of a solid-state image sensor, a color filter for an organic EL display element, and a color filter for electronic paper. It is suitable as.

<Color filter>
The color filter of the present embodiment is a color filter manufactured by the above-described color filter manufacturing method of the present embodiment.

Specifically, the color filter of this embodiment has a pixel array in which coloring patterns of the three primary colors of red, green, and blue including the above-described pigments and dyes are arranged in a predetermined arrangement, and this pixel array Are arranged on the substrate. The color pattern constituting the color filter may be a color pattern having three primary colors of yellow, magenta, and cyan. Further, as described above, in addition to the coloring patterns corresponding to the three primary color pixels of red, green and blue, the fourth pixel (yellow pixel) and the fifth pixel (cyan pixel) for expanding the color specification range are arranged. As such, the fourth and fifth colored patterns can also be formed.

In addition, the color filter of the present embodiment preferably has a light shielding layer (black matrix) so as to partition a portion where a pixel is formed on the substrate. It is also possible to have no light shielding layer.

In the color filter of the present embodiment, fine irregularities formed by the above-described etching method, nanoimprint method or polishing method are provided on the surface of the colored pattern. The size of the projections and depressions can be adjusted to a desired value, but it is preferable that the height of the projection is 10 nm or more and the width of the bottom of the projection is 10 nm or more. Further, the height of the convex portion is preferably 50 nm or more, more preferably in the range of 50 nm to 200 nm, and particularly preferably in the range of 80 nm to 200 nm. On the other hand, the width of the convex portion is preferably 20 nm or more, and more preferably in the range of 20 nm to 200 nm.

In addition, when the purpose is to improve the Y value of the color filter, it is preferable that unevenness is formed on the surface of 30% or more of the total pixel area of the colored pattern to be unevenly formed. In that case, as described above, the region in which the unevenness is formed on the surface of the colored pattern is uniformly distributed throughout the color filter and even in any one pixel without being biased to a part of the region. It is preferable that it is comprised.

The color filter of the present embodiment preferably has a protective film on the colored pattern on which irregularities are formed. By having the protective film, the process resistance of the color filter in the manufacturing process of the display element can be improved. Examples of the protective film include an organic film or an organic-inorganic hybrid film formed from a curable composition, or an inorganic film such as a SiNx film and a SiOx film, as described above. In this Embodiment, it is preferable to form a protective film using a curable composition.

Since the color filter of the present embodiment has the above-described configuration, the brightness stimulation value (Y) in the CIE color system is high. Therefore, this color filter is useful as various color filters including, for example, color filters for color liquid crystal display elements, color filters for color separation of solid-state imaging elements, color filters for organic EL display elements, and color filters for electronic paper. It is.

<Display element>
The display element of this embodiment has the color filter of this embodiment described above. Specific examples of the display element include a color liquid crystal display element, an organic EL display element, and electronic paper.

The color liquid crystal display element of this embodiment can have the following structure.

The color liquid crystal display element has, for example, a structure in which a driving substrate on which a thin film transistor (TFT) is disposed and another substrate on which the color filter of this embodiment is provided face each other through a liquid crystal layer. It can be. Alternatively, the color liquid crystal display element includes a substrate in which the color filter of this embodiment is formed on the surface of a driving substrate on which a thin film transistor (TFT) is disposed, and an ITO (Indium Tin Oxide) electrode. It is also possible to adopt a structure in which the substrate on which the film is formed faces the liquid crystal layer. The latter structure has the advantage that the aperture ratio can be remarkably improved, and a bright and high-definition liquid crystal display element can be obtained.

FIG. 1 is a schematic cross-sectional view of a color liquid crystal display element having a color filter of the present embodiment.

A liquid crystal display element 1 shown in FIG. 1 is an example of the color liquid crystal display element of the present embodiment, and is a TN (Twisted Nematic) type liquid crystal mode display element driven by a TFT. This color liquid crystal display element has a structure in which the driving substrate and the substrate on which the color filter is formed face each other with a TN liquid crystal layer interposed therebetween. That is, as shown in FIG. 1, TFTs (not shown) and transparent pixel electrodes 3 are arranged in a lattice pattern on the side of the transparent substrate 2 in contact with the liquid crystal 13 to constitute a driving substrate. . Further, on the side of the transparent substrate 5 that is in contact with the liquid crystal 13, the red, green, and blue coloring patterns 6, the black matrix 7, and the protection provided on the coloring patterns 6 are positioned opposite to the pixel electrodes 3. A color filter 10 having a film 8 is arranged. Here, the fine irregularities described above are provided on the surface of the colored pattern 6. Further, a transparent common electrode 11 is provided on the color filter 10.

An alignment film 12 is provided on each of the substrate 2 and the substrate 5. By rubbing the alignment film 12, uniform alignment of the liquid crystal 13 sandwiched between the substrates 2 and 5 can be realized.

In the substrate 2 and the substrate 5, polarizing plates 14 are respectively arranged on the side opposite to the side in contact with the liquid crystal 13. The distance between the substrate 2 and the substrate 5 is usually 2 μm to 10 μm, and these are fixed to each other by a sealing material 16 provided in the peripheral portion.

In FIG. 1, reference numeral 17 denotes backlight light emitted toward the liquid crystal 13 from a backlight unit (not shown). As the backlight unit, for example, a backlight unit having a structure in which a fluorescent tube such as a cold cathode fluorescent tube (CCFL: Cold Cathode Fluorescent Lamp) and a scattering plate are combined can be used. A backlight unit using a white LED as a light source can also be used. As the white LED, for example, a white LED that obtains white light by mixing a red LED, a green LED, and a blue LED, and a white light by mixing the blue LED, a red LED, and a green phosphor to emit white light. A white LED that obtains white light by mixing white LEDs, a blue LED, a red light emitting phosphor, and a green light emitting phosphor to obtain white light by mixing colors, a white LED that obtains white light by mixing colors with a YAG phosphor, A combination of a blue LED, an orange light emitting phosphor, and a green light emitting phosphor to obtain white light by mixing colors, a white LED, an ultraviolet LED, a red light emitting phosphor, a green light emitting phosphor, and a blue light emitting phosphor And white LEDs that obtain white light by color mixing.

In addition to the TN type described above, the color liquid crystal display element of the present embodiment includes an STN (Super Twisted Nematic) type, an IPS (In-Planes Switching) type, a VA (Vertical Aligned Birefringent) type, an OCB (Optically Compensated Birefring type) and the like. The liquid crystal mode can also be selected.

The organic EL display element having the color filter of the present embodiment can adopt an appropriate structure, and examples thereof include a structure disclosed in Japanese Patent Application Laid-Open No. 11-307242.

The electronic paper having the color filter of the present embodiment can adopt an appropriate structure, and examples thereof include a structure disclosed in Japanese Patent Application Laid-Open No. 2007-41169.

Although the present embodiment has been described above, the present invention is not limited to the above-described embodiment, and various modifications can be made without departing from the scope of the invention.

Hereinafter, the present invention will be described more specifically with reference to examples. However, the present invention is not limited to the following examples.

(Preparation of colorant dispersion)
Preparation Example 1
As a colorant, C.I. I. Pigment Red 254 in 2.3 parts by mass, C.I. I. Pigment Red 177 in 11.4 parts by mass, C.I. I. 1.3 parts by weight of Pigment Yellow 150, 8 parts by weight of BYK (registered trademark) -21324 (manufactured by BYK) (solid content concentration = 40% by weight) as a dispersant, and propylene glycol monomethyl ether acetate / Using a mixed solvent of propylene glycol monoethyl ether = 90/10 (mass ratio) so as to have a solid content concentration of 20%, the mixture was mixed and dispersed by a bead mill for 12 hours to prepare a pigment dispersion (M-1).

Preparation Example 2
As a colorant, C.I. I. 9.7 parts by mass of CI Pigment Green 58, C.I. I. Pigment Yellow 150 (5.3 parts by mass), BYK (registered trademark) -21324 (manufactured by BYK) as a dispersant (8 parts by mass (solid content concentration = 40% by mass)), and propylene glycol monomethyl ether acetate / Using a mixed solvent of propylene glycol monoethyl ether = 90/10 (mass ratio) so as to have a solid content concentration of 20%, the mixture was mixed and dispersed by a bead mill for 12 hours to prepare a pigment dispersion (M-2).

Preparation Example 3
As a colorant, C.I. I. 9.3 parts by mass of CI Pigment Blue 15: 6, C.I. I. 5.7 parts by weight of Pigment Violet, 8 parts by weight of BYK (registered trademark) -21324 (manufactured by BYK) as a dispersant (solid content concentration = 40% by weight), and propylene glycol monomethyl ether acetate / propylene as a solvent Using a mixed solvent of glycol monoethyl ether = 90/10 (mass ratio) so as to have a solid concentration of 20%, the mixture was mixed and dispersed by a bead mill for 12 hours to prepare a pigment dispersion (M-3).

[Synthesis of binder resin]
Synthesis example 1
A flask equipped with a condenser and a stirrer was charged with 2 parts by mass of 2,2′-azobisisobutyronitrile and 200 parts by mass of propylene glycol monomethyl ether acetate, followed by 15 parts by mass of methacrylic acid and 20 parts by mass of N-phenylmaleimide. , 55 parts by mass of benzyl methacrylate, 10 parts by mass of styrene, and 3 parts by mass of 2,4-diphenyl-4-methyl-1-pentene (trade name: NOFMER (registered trademark) MSD, manufactured by NOF Corporation) as a molecular weight regulator. Charged and purged with nitrogen. Thereafter, the mixture was gently stirred to raise the temperature of the reaction solution to 80 ° C., and this temperature was maintained for 5 hours for polymerization to obtain a resin solution (solid content concentration = 33% by mass). The obtained resin was Mw = 16,000 and Mn = 7,000. This resin solution is referred to as “binder resin solution (P1)”.

(Preparation of colored radiation-sensitive composition)
Preparation Example 4
100 parts by mass of the pigment dispersion (M-1), 30 parts by mass of the binder resin solution (P1) as the binder resin (solid content concentration = 33% by mass), 15 parts by mass of dipentaerythritol hexaacrylate as the crosslinking agent, a photopolymerization initiator 2-benzyl-2-dimethylamino-1- (4-morpholinophenyl) butan-1-one and 1 part by mass of 4,4′-bis (diethylamino) benzophenone, DIC stock as a fluorosurfactant A red radiation sensitive composition (CR-1) having a solid content of 22% was prepared by mixing 0.1 part by mass of Megafac (registered trademark) F-554 manufactured by the company and propylene glycol monomethyl ether acetate as a solvent. .

Preparation Example 5
A green radiation-sensitive composition (CR-2) was prepared in the same manner as in Preparation Example 4, except that the pigment dispersion (M-2) was used instead of the pigment dispersion (M-1) in Preparation Example 4. did.

Preparation Example 6
A blue radiation-sensitive composition (CR-3) was prepared in the same manner as in Preparation Example 4, except that the pigment dispersion (M-3) was used instead of the pigment dispersion (M-1) in Preparation Example 4. did.

Hereinafter, formation of a colored pattern using the red radiation-sensitive composition (CR-1), the green radiation-sensitive composition (CR-2) and the blue radiation-sensitive composition (CR-3) of this example, An example of forming irregularities on the colored pattern will be described. Hereinafter, the colored pattern is referred to as a colored cured film.

Example 1
<Formation of red cured film and unevenness>
The red radiation-sensitive composition (CR-1) was applied on a soda glass substrate using a spin coater, and then pre-baked in a clean oven at 80 ° C. for 10 minutes to form a coating film.

Next, after the substrate on which the coating film was formed was cooled to room temperature, an exposure dose of 400 J / m ² of radiation containing 365 nm, 405 nm, and 436 nm wavelengths was applied to the coating film through a photomask using a high-pressure mercury lamp. And exposed. Thereafter, a developer consisting of a 0.04 mass% potassium hydroxide aqueous solution at 23 ° C. is discharged onto these substrates at a development pressure of 1 kgf / cm ² (nozzle diameter of 1 mm) for 1 minute shower development. went. Thereafter, these substrates were washed with ultrapure water, air-dried, and then post-baked in a clean oven at 230 ° C. for 30 minutes to form a red cured film on the substrates.

The obtained cured film was subjected to a dry etching process using a plasma etching apparatus EXAM manufactured by Shinko Seiki Co., Ltd. to form irregularities on the entire surface of the cured film. At this time, the RF power was 400 W. Table 1 shows dry etching conditions.

Example 2 and Example 3
<Formation of red cured film and unevenness>
A red cured film was formed in the same manner as in Example 1, and unevenness was formed in the same manner as in Example 1 except that the dry etching treatment time was set to the time shown in Table 1.

Comparative Example 1
<Formation of red cured film>
In the same manner as in Example 1, a red cured film was formed. However, the formation of irregularities by the dry etching process performed in Example 1 was not performed.

Example 4
<Formation of green cured film and formation of irregularities>
The green radiation sensitive composition (CR-2) was applied onto a soda glass substrate using a spin coater, and then pre-baked in a clean oven at 80 ° C. for 10 minutes to form a coating film.

Next, after the substrate on which the coating film was formed was cooled to room temperature, an exposure dose of 400 J / m ² of radiation containing 365 nm, 405 nm, and 436 nm wavelengths was applied to the coating film through a photomask using a high-pressure mercury lamp. And exposed. Thereafter, a developer consisting of a 0.04 mass% potassium hydroxide aqueous solution at 23 ° C. is discharged onto these substrates at a development pressure of 1 kgf / cm ² (nozzle diameter of 1 mm) for 1 minute shower development. went. Thereafter, these substrates were washed with ultrapure water, air-dried, and further post-baked in a clean oven at 230 ° C. for 30 minutes to form a green cured film on the substrates.

The obtained cured film was subjected to a dry etching process using a plasma etching apparatus EXAM manufactured by Shinko Seiki Co., Ltd. to form irregularities on the entire surface of the cured film. At this time, the RF power was 400 W. Table 1 shows dry etching conditions.

Example 5 and Example 6
<Formation of green cured film and formation of irregularities>
A green cured film was formed in the same manner as in Example 4, and the irregularities were formed in the same manner as in Example 4 except that the dry etching treatment time was changed to the time shown in Table 1.

Comparative Example 2
<Formation of green cured film>
A green cured film was formed in the same manner as in Example 4. However, the unevenness formation by the dry etching process performed in Example 4 was not performed.

Example 7
<Formation of blue cured film and formation of irregularities>
The blue radiation sensitive composition (CR-3) was applied onto a soda glass substrate using a spin coater, and then pre-baked in a clean oven at 80 ° C. for 10 minutes to form a coating film.

Next, after the substrate on which the coating film was formed was cooled to room temperature, an exposure dose of 400 J / m ² of radiation containing 365 nm, 405 nm, and 436 nm wavelengths was applied to the coating film through a photomask using a high-pressure mercury lamp. And exposed. Thereafter, a developing solution composed of a 0.04 mass% potassium hydroxide aqueous solution at 23 ° C. is discharged to these substrates at a developing pressure of 1 kgf / cm ² (nozzle diameter 1 mm) to perform shower development for 1 minute. It was. Thereafter, these substrates were washed with ultrapure water, air-dried, and further post-baked in a clean oven at 230 ° C. for 30 minutes to form a blue cured film on the substrates.

The obtained cured film was subjected to a dry etching process using a plasma etching apparatus EXAM manufactured by Shinko Seiki Co., Ltd. to form irregularities on the entire surface of the cured film. At this time, the RF power was 400 W. Table 1 shows dry etching conditions.

Example 8
<Formation of blue cured film and formation of irregularities>
A blue cured film was formed in the same manner as in Example 7, and unevenness was formed in the same manner as in Example 7 except that the dry etching treatment time was changed to the time shown in Table 1.

Comparative Example 3
<Formation of blue cured film>
A blue cured film was formed in the same manner as in Example 7. However, the unevenness formation by the dry etching process performed in Example 7 was not performed.

Table 1 shows the dry etching treatment conditions in each of the above examples and comparative examples.

Example 9
<SEM image evaluation>
For each color cured film with irregularities formed in Examples 1 to 8 and Comparative Examples 1 to 3, SEM photographs were taken at a magnification of 40000 times and formed on the surface of each cured film. The state of the unevenness was evaluated.

FIG. 2 is a surface SEM photograph of the red cured film obtained in Examples 1 to 3 and Comparative Example 1.

FIG. 3 is a cross-sectional SEM photograph of the red cured film obtained in Examples 1 to 3 and Comparative Example 1.

FIG. 4 is a surface SEM photograph of the green cured film obtained in Examples 4 to 6 and Comparative Example 2.

FIG. 5 is a cross-sectional SEM photograph of the green cured film obtained in Examples 4 to 6 and Comparative Example 2.

FIG. 6 is a surface SEM photograph of the blue cured film obtained in Example 7, Example 8, and Comparative Example 3.

FIG. 7 is a cross-sectional SEM photograph of the blue cured film obtained in Example 7, Example 8, and Comparative Example 3.

From the results of SEM photograph evaluation for each color cured film shown in FIGS. 2 to 7, the size of the unevenness formed on the surface of each color cured film is in the range of 80 nm to 200 nm in height and 20 nm to 200 nm in width. I understood that. It has also been found that the longer the dry etching processing time, the larger the size of the unevenness formed on each color cured film.

Example 10
<Evaluation of chromaticity characteristics>
For each color cured film formed with unevenness obtained in Examples 1 to 8 and Comparative Examples 1 to 3, a color analyzer (MCPD (registered trademark) 2000 manufactured by Otsuka Electronics Co., Ltd.) was used. Chromaticity coordinate values (x, y) and stimulus values (Y) in the CIE color system were measured with a light source and a 2-degree visual field. The evaluation results are shown in Table 2.

Each of the color cured films with irregularities formed in Examples 1 to 8 showed a higher Y value than the cured films obtained in the corresponding comparative examples. In particular, the effect was great in the red cured film and the green cured film in which irregularities were formed, obtained in Examples 1 to 6.

Example 11
<Manufacture and evaluation of color filters>
The red radiation sensitive composition (CR-1) was applied on a glass substrate on which a black matrix was formed using a slit and spin coater, and then pre-baked for 3 minutes on a 90 ° C. hot plate to form a coating film. Formed.

Next, after the substrate on which the coating film was formed was cooled to room temperature, radiation containing 365 nm, 405 nm, and 436 nm was applied to the coating film through a striped photomask using a high-pressure mercury lamp. It exposed with an exposure amount of m ^2. After that, after developing a developing solution composed of a 0.04 mass% potassium hydroxide aqueous solution at 23 ° C. with a developing pressure of 1 kgf / cm ² (nozzle diameter 1 mm) on the obtained substrate, It was washed with ultrapure water and further post-baked in a clean oven at 230 ° C. for 20 minutes. As a result, a red stripe-shaped colored pattern having a chromaticity coordinate value (x, y) equivalent to that in Example 1 was formed on the substrate.

Next, using the green radiation-sensitive composition (CR-2), a chromaticity coordinate value (x, y) equivalent to that in Example 4 is shown next to the red stripe-like colored pattern by the same method. A green striped colored pattern was formed.

Next, using the blue radiation-sensitive composition (CR-3), a chromaticity coordinate value (x, y) equivalent to that in Example 7 is shown next to the green striped colored pattern by the same method. By forming a blue stripe coloring pattern, a color filter composed of red, green and blue stripe coloring patterns was produced.

After each color coloring pattern is formed, dry etching is performed for 40 seconds using plasma etching apparatus EXAM (RF power: 400 W / gas type (flow rate): oxygen (20 ml / min) + argon (5 ml / min)) manufactured by Shinko Seiki Co., Ltd. Processed.

For the obtained color filter, the stimulation value (Y) in white display when a cold cathode fluorescent tube was used as a backlight light source was measured. As a result, the stimulation value (Y) in white display was improved by 0.6 points compared to Comparative Example 4 described later.

Comparative Example 4
<Manufacture and evaluation of color filters>
In the same manner as in Example 10, a color filter composed of red, green, and blue stripe colored patterns was produced. However, the unevenness formation by the dry etching process performed in Example 10 was not performed. About the obtained color filter, when the cold cathode fluorescent tube was used as a backlight light source, the stimulation value (Y) in white display was measured and compared with the Y value of the color filter obtained in Example 10.

Example 12
<Application of color filters to liquid crystal display elements>
Using the color filter comprising the red, green and blue stripe colored patterns obtained in Example 11, and applying the thermosetting resin composition comprising the composition described later on the colored pattern using a slit and spin coater. did. A coating film was formed by pre-baking for 2 minutes on a hot plate at 80 ° C., and further post-baking for 60 minutes in a clean oven at 230 ° C. to form a protective film having a thickness of 1.5 μm.

Next, a liquid crystal display element was manufactured using this color filter. The liquid crystal display element has the same structure as the color liquid crystal display element shown in FIG. The obtained color liquid crystal display element exhibited excellent electrical characteristics and display characteristics.

Next, the thermosetting resin composition used as a protective film for the color filter will be described.

The thermosetting resin composition is a glycidyl methacrylate / styrene / t-butyl methacrylate / dicyclopentanyl methacrylate = 40/10/30/20 (mass ratio) copolymer (number average molecular weight Mn = 6,000). , Molecular weight distribution (Mw / Mn) = 2.0), 100 parts by mass of novolac type epoxy resin (manufactured by Japan Epoxy Resin Co., Ltd., trade name “Epicoat 152”), γ-glycidoxypropyltri 20 parts by mass of methoxysilane and 0.2 parts by mass of surfactant FTX-218 (manufactured by Neos). Diethylene glycol methyl ethyl ether was used as the solvent. The solid content concentration of the thermosetting resin composition was 15% by mass.

DESCRIPTION OF SYMBOLS 1 Liquid crystal display element 2, 5 Substrate 3 Pixel electrode 6 Colored pattern 7 Black matrix 8 Protective film 10 Color filter 11 Common electrode 12 Alignment film 13 Liquid crystal 14 Polarizing plate 16 Sealing material 17 Backlight

Claims (8)

1. Forming a colored pattern on the substrate;
   And a step of forming irregularities on the surface of the colored pattern.
2. The method for producing a color filter according to claim 1, wherein the unevenness is formed by an etching method, a nanoimprint method, or a polishing method.
3. The step of forming irregularities on the surface of the colored pattern is a step of forming the irregularities by forming a resist pattern on the colored pattern and performing an etching process on the colored pattern exposed from the resist pattern. The method for producing a color filter according to claim 1.
4. The method for producing a color filter according to any one of claims 1 to 3, wherein the unevenness has a height of a convex portion of 10 nm or more and a base width of the convex portion of 10 nm or more.
5. The colored pattern includes at least one of a red colored pattern and a green colored pattern, and the unevenness is formed on at least one surface of the red colored pattern and the green colored pattern. The method for producing a color filter according to any one of claims 1 to 4.
6. 6. The method for producing a color filter according to claim 1, further comprising a step of forming a protective film on the colored pattern on which the unevenness is formed.
7. A display element comprising a color filter manufactured by the method according to any one of claims 1 to 6.
8. A color filter having a plurality of colored patterns on a substrate,
   Concavities and convexities are formed on the surface of the colored pattern of at least one of the plurality of colored patterns, the height of the convex portions of the concave and convex portions is 10 nm or more, and the width of the bottom of the convex portions is 10 nm or more. A color filter characterized by

Images