WO2012067023A1 - Unité de rétroéclairage et dispositif d'affichage à cristaux liquides - Google Patents

Unité de rétroéclairage et dispositif d'affichage à cristaux liquides Download PDF

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Publication number
WO2012067023A1
WO2012067023A1 PCT/JP2011/076021 JP2011076021W WO2012067023A1 WO 2012067023 A1 WO2012067023 A1 WO 2012067023A1 JP 2011076021 W JP2011076021 W JP 2011076021W WO 2012067023 A1 WO2012067023 A1 WO 2012067023A1
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Prior art keywords
heat spreader
led substrate
led
pin
heat
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PCT/JP2011/076021
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English (en)
Japanese (ja)
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寺川　大輔
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シャープ株式会社
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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L25/00—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof
    • H01L25/03—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes
    • H01L25/04—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers
    • H01L25/075—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group H01L33/00
    • H01L25/0753—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group H01L33/00 the devices being arranged next to each other
    • G—PHYSICS
    • G02—OPTICS
    • G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
    • G02F1/00—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
    • G02F1/01—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour 
    • G02F1/13—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour  based on liquid crystals, e.g. single liquid crystal display cells
    • G02F1/133—Constructional arrangements; Operation of liquid crystal cells; Circuit arrangements
    • G02F1/1333—Constructional arrangements; Manufacturing methods
    • G02F1/1335—Structural association of cells with optical devices, e.g. polarisers or reflectors
    • G02F1/1336—Illuminating devices
    • G02F1/133602—Direct backlight
    • G02F1/133603—Direct backlight with LEDs
    • G—PHYSICS
    • G02—OPTICS
    • G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
    • G02F1/00—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
    • G02F1/01—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour 
    • G02F1/13—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour  based on liquid crystals, e.g. single liquid crystal display cells
    • G02F1/133—Constructional arrangements; Operation of liquid crystal cells; Circuit arrangements
    • G02F1/1333—Constructional arrangements; Manufacturing methods
    • G02F1/1335—Structural association of cells with optical devices, e.g. polarisers or reflectors
    • G02F1/1336—Illuminating devices
    • G02F1/133602—Direct backlight
    • G02F1/133608—Direct backlight including particular frames or supporting means
    • G—PHYSICS
    • G02—OPTICS
    • G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
    • G02F1/00—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
    • G02F1/01—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour 
    • G02F1/13—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour  based on liquid crystals, e.g. single liquid crystal display cells
    • G02F1/133—Constructional arrangements; Operation of liquid crystal cells; Circuit arrangements
    • G02F1/1333—Constructional arrangements; Manufacturing methods
    • G02F1/1335—Structural association of cells with optical devices, e.g. polarisers or reflectors
    • G02F1/1336—Illuminating devices
    • G02F1/133628—Illuminating devices with cooling means
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
    • H01L33/64—Heat extraction or cooling elements

Definitions

  • the present invention relates to a backlight unit and a liquid crystal display device.
  • the present invention relates to a backlight unit using a light emitting diode (LED) as a light source and a liquid crystal display device including the backlight unit.
  • the present invention also relates to an LED illumination device using an LED as a light source. Note that this application claims priority based on Japanese Patent Application No. 2010-257851 filed on November 18, 2010, the entire contents of which are incorporated herein by reference. .
  • the liquid crystal display device includes a liquid crystal panel in which liquid crystal is sealed between a pair of translucent substrates, and a backlight disposed on the back side of the liquid crystal panel.
  • a backlight disposed on the back side of the liquid crystal panel.
  • light emitted from the backlight is irradiated from the back side of the liquid crystal panel, so that an image displayed on the liquid crystal panel can be visually recognized.
  • An LED backlight includes a side edge method in which a light guide plate is disposed on the back side of a liquid crystal panel, an LED is disposed on a side surface of the light guide plate, and light is incident on the light guide plate.
  • LEDs are arranged in an array just below the back side of the liquid crystal panel.
  • the LED When an electric current is supplied to the LED that is the light source of the LED backlight to emit light, the LED generates heat and the internal temperature of the LED rises.
  • the heat radiation of the LED is insufficient, the temperature inside the LED excessively increases, which may cause a decrease in light emission efficiency or deterioration of the element itself.
  • the LED Since the LED is a light source smaller than the CCFL, even if the power consumption is the same, the heat is concentrated in a narrower region in the LED. That is, the LED tends to increase in temperature per unit area. For these reasons, when an LED is used as a light source, a technique for efficiently releasing heat from the LED to the outside is required.
  • Patent Document 1 includes a heat dissipation member that dissipates heat of an LED in a direct-type LED backlight. Further, Patent Document 2 is provided with a heat radiating plate on which LEDs are arranged in a direct type LED backlight, and the heat radiating plate is made of aluminum and has fins attached thereto. In these direct type backlights, it is easy to take a layout in which a large heat dissipation member or heat dissipation plate is arranged. In both cases, a heat dissipation plate with a relatively large area is connected to the LED to release heat from the LED to the outside. Like to do.
  • Patent Document 3 discloses a bulb-shaped LED lighting device.
  • the LED chip is fixed to the LED substrate.
  • a thermal conduction pad is disposed between the LED substrate and the case, and thermal energy generated from the LED chip on the LED substrate is conducted to the case through the thermal conduction pad.
  • a heat conduction pad between the LED substrate and the heat dissipation member in order to ensure that the LED substrate and the heat dissipation member are in close contact with each other.
  • a heat conduction pad there are many cases where it is difficult to introduce a heat conductive pad into an LED backlight under conditions where demand for cost reduction is severe.
  • the adhesion between the LED substrate and the heat radiating member is lowered, there arises a problem that the heat radiating property is deteriorated.
  • the main objective is to provide the backlight unit and liquid crystal display device which can improve the heat dissipation of a LED board, without using a heat conductive pad. It is in.
  • a backlight unit is a backlight unit that irradiates light to a liquid crystal panel, and includes an LED substrate on which a plurality of LED elements are arranged, and a heat spreader that dissipates heat of the LED substrate, and the LED
  • the substrate is fixed to the heat spreader by at least a first pin and a second pin, and the LED substrate has an intermediate portion between the first pin and the second pin, and the heat spreader
  • the intermediate portion of the LED substrate before being fixed has a convex portion protruding toward the heat spreader, and the intermediate portion of the LED substrate after being fixed to the heat spreader is the It has a flat part which contacts the contact surface of a heat spreader.
  • a light guide plate into which light from the plurality of LED elements is introduced, and a backlight chassis in which the LED substrate, the heat spreader, and the light guide plate are stored.
  • a liquid crystal display device is a liquid crystal display device including the backlight unit.
  • the method for manufacturing a backlight unit according to the present invention includes a step (a) of preparing an LED substrate on which a plurality of LED elements are arranged, and fixing the LED substrate to a heat spreader by at least a first pin and a second pin. Step (b), and before the step (b), the intermediate portion of the LED substrate between the first pin and the second pin has a protrusion protruding toward the heat spreader. And in the step (b), the convex part of the intermediate part contacts the contact surface of the heat spreader, and thereby the convex part of the intermediate part becomes a flat part.
  • the convex portion of the LED substrate is formed by pressing with a pair of molds.
  • the LED illumination device is an LED illumination device using an LED element as a light source, and includes an LED substrate on which a plurality of LED elements are arranged, and a heat spreader that dissipates heat of the LED substrate, and the LED substrate Is fixed to the heat spreader by at least a first pin and a second pin, and the LED board has an intermediate portion between the first pin and the second pin, and is fixed to the heat spreader.
  • the intermediate portion of the LED substrate before being heated has a convex portion protruding toward the heat spreader, and the intermediate portion of the LED substrate after being fixed to the heat spreader is the heat It has a flat part which contacts the contact surface of a spreader.
  • the intermediate portion of the LED substrate before being fixed to the heat spreader has a convex portion protruding toward the heat spreader, and the intermediate portion of the LED substrate after being fixed to the heat spreader.
  • FIG. 1 is a perspective view schematically showing a configuration of a liquid crystal display device 100 according to an embodiment of the present invention.
  • (A) And (b) is process sectional drawing which shows the process of fixing the LED board 32 in the embodiment of this invention to the heat spreader 34.
  • FIG. FIG. 4 is a cross-sectional view of a stacked body 135 in which an LED substrate 132 is fixed to a heat spreader 34 through a heat conductive pad 137. It is sectional drawing of the laminated body 35 of the LED board 32 and the heat spreader 34 in embodiment of this invention.
  • (A) to (c) are process cross-sectional views illustrating a process of fixing the LED substrate 32 to the heat spreader 34.
  • FIG. 1 is sectional drawing which shows the optical sheet 20, the light-guide plate 30, LED board 32, and the heat spreader 34 in embodiment of this invention. It is process sectional drawing for demonstrating the manufacturing method of the LED board 32 which has the convex part 33a in embodiment of this invention.
  • FIG. 1 is an exploded perspective view schematically showing a configuration of a liquid crystal display device 100 according to an embodiment of the present invention.
  • the liquid crystal display device 100 of this embodiment includes a liquid crystal panel 10 that displays an image, and a backlight unit 50 that irradiates the liquid crystal panel 10 with light.
  • the backlight unit 50 of the present embodiment includes an LED substrate 32 on which a plurality of LED elements 31 are arranged, and a heat spreader 34 that dissipates heat from the LED substrate 32.
  • the LED substrate 32 is fixed to the heat spreader 34 by at least a first pin and a second pin.
  • the heat spreader 34 is in contact with the LED substrate 32 and serves as a heat dissipation member for the LED element 31.
  • the heat spreader 34 of the present embodiment is made of a metal material (for example, aluminum) having good thermal conductivity.
  • the illustrated heat spreader 34 has a flat plate shape.
  • LED elements 31 are arranged in a row on the LED substrate 32 bonded to the heat spreader 34 so as to face the end face 30 a of the light guide plate 30.
  • Each LED element 31 consists of a white LED chip, for example.
  • the light from the LED element 31 is introduced into the light guide plate 30. Specifically, light emitted from the LED element 31 is incident on an end surface (a surface facing the LED substrate 32) 30 a of the light guide plate 30, then propagates through the light guide plate 30, and the main surface 30 m of the light guide plate 30. Then, the back side of the liquid crystal panel 10 is irradiated.
  • the backlight unit 50 of the present embodiment is a side-edge type LED backlight including the light guide plate 30.
  • the light guide plate 30, the LED substrate 32, and the heat spreader 34 are accommodated in the backlight chassis 40.
  • the backlight chassis 40 is made of a metal material (for example, aluminum, iron, etc.), and is a sheet metal member that covers the entire back surface of the backlight unit 50 and the liquid crystal panel 10.
  • a reflection plate 39 is disposed between the light guide plate 30 and the backlight chassis 40.
  • the liquid crystal panel 10 and the backlight chassis 40 are housed in the exterior cabinet 70.
  • the exterior cabinet 70 in this example includes a front side cabinet (bezel) 71 that holds the outer frame region of the liquid crystal panel 10 and a back side cabinet 72 that can accommodate the backlight chassis 40.
  • the exterior cabinet 70 is made of, for example, a metal material (typically aluminum or iron) or a resin material.
  • an optical sheet 20 (20a to 20c) is provided between the liquid crystal panel 10 and the light guide plate 30.
  • the optical sheets 20a to 20c are, for example, a lens sheet, a prism sheet, and a diffusion plate, but other optical members can also be used.
  • the liquid crystal panel 10 of the present embodiment generally has a rectangular shape as a whole, and is composed of a pair of translucent substrates (glass substrates) 11 and 12. Both the substrates 11 and 12 are arranged to face each other, and a liquid crystal layer (not shown) is provided between them.
  • the liquid crystal layer is made of a liquid crystal material whose optical characteristics change with application of an electric field between the substrates 11 and 12.
  • a sealing agent (not shown) is provided on the outer edge portions of the substrates 11 and 12 to seal the liquid crystal layer. Further, polarizing plates 13 and 13 are attached to the outer surfaces of both the substrates 11 and 12, respectively.
  • the back side of the substrates 11 and 12 is the array substrate (TFT substrate) 11, while the front side is the color filter substrate (CF substrate) 12.
  • the liquid crystal panel 10 of the present embodiment has a size of, for example, 20 inches to 110 inches (typically 32 inches to 60 inches).
  • FIG. 2 (a) and 2 (b) are process cross-sectional views showing a process of fixing the LED substrate 32 of the present embodiment to the heat spreader 34.
  • FIG. FIG. 2A shows the configuration of the LED substrate 32 before being fixed to the heat spreader 34.
  • FIG. 2B shows a configuration of the LED substrate 32 after being fixed to the heat spreader 34.
  • the LED substrate 32 of the present embodiment has a convex portion 33a before being fixed to the heat spreader. Further explanation is as follows.
  • the LED substrate 32 is fixed to the heat spreader 34 by a plurality of pins 36 (36A, 36B).
  • the LED substrate 32 has an intermediate portion 32a between the first pin 36A and the second pin 36B, and the intermediate portion 32a has a convex portion 33a protruding to the heat spreader 34 side.
  • the convex portion 33a formed at the intermediate portion 32a contacts the surface (contact surface) 34a of the heat spreader 34.
  • the distance L between the first pin 36A and the second pin 36B may be appropriately selected depending on the LED substrate 32 and the heat spreader 34 to be used. For example, 30 to 100 mm (typically, 50 mm).
  • the LED substrate 32 is fixed to the heat spreader 34.
  • the intermediate part 32a of the LED substrate 32 after being fixed to the heat spreader 34 comes into contact with the surface (contact surface) 34a of the heat spreader 34, so that the intermediate part 32a is flat from the convex part 33a. 33b.
  • a laminated body 35 of the LED substrate 32 and the heat spreader 34 is formed.
  • the plurality of pins 36 of the present embodiment are screws, and the LED substrate 32 can be fixed to the heat spreader 34 by screwing the LED substrate 32 to the heat spreader 34 with the screws 36.
  • the intermediate portion 32a located between the first screw 36A and the second screw 36B may float from the surface 34a of the heat spreader 34 when thermal expansion occurs after screwing.
  • the convex portion 33a is formed in the intermediate portion 32a before the LED substrate 32 is fixed, so that the force floating from the surface 34a of the heat spreader 34 can be offset by screwing. .
  • the influence of the floating of the LED substrate 32 is alleviated and the adhesion between the LED substrate 32 and the heat spreader 34 is improved. Can do. As a result, the heat dissipation of the LED substrate 32 can be improved without using a heat conductive pad.
  • FIG. 3 shows a configuration of a laminate 135 in which a heat conductive pad 137 exists between the LED substrate 132 on which the LED element 31 is mounted and the heat spreader 34.
  • the LED substrate 132 is bonded to the heat spreader 34 via the heat conductive pad 137. Therefore, even if the LED board 132 is deformed by a screwing force, the LED board 132 can be brought into close contact with the heat spreader 34 through the heat conductive pad 137 without any gap.
  • the heat conductive pad 137 since the heat conductive pad 137 is used, a member cost of the heat conductive pad 137 is generated and an attachment cost of the heat conductive pad 137 is generated. Therefore, when the heat conductive pad 137 is used, the cost of the backlight unit or the liquid crystal display device is increased as a result.
  • the LED substrate 32 and the heat spreader 34 are bonded to each other with good adhesion without using the heat conductive pad 137. Can do. Therefore, the problem of cost increase due to the heat conductive pad 137 can be avoided, and the problem of deterioration in heat dissipation of the LED substrate 32 can be solved.
  • FIGS. 5A and 5B are cross-sectional views for explaining a process of fixing the LED substrate 32 of the present embodiment to the heat spreader 34.
  • FIG. 5C is a diagram when the LED substrate 32 is energized. It is sectional drawing for demonstrating the mode of board
  • an LED substrate 32 is prepared in which convex portions 33a are formed at an intermediate portion 32a located between portions where the first pins 36A and the second pins 36B are inserted.
  • the LED substrate 32 is disposed so as to face the surface 34 a of the heat spreader 34.
  • the first pin 36 ⁇ / b> A and the second pin 36 ⁇ / b> B are inserted into the LED substrate 32 and the heat spreader 34, thereby pressing and fixing the LED substrate 32 against the heat spreader 34.
  • the portion where the first pin 36A and the second pin 36B are inserted is pressed against the heat spreader 34 by the pin pressing force (screwing force) 81.
  • the portion where the convex portion 33a is formed is warped downward, it is pressed against the heat spreader 34 by the so-called spring force 82, and the intermediate portion 32a becomes the flat portion 33b.
  • the LED substrate 32 when the LED substrate 32 is heated when the LED substrate 32 is energized, the LED substrate 32 expands and contracts (specifically, thermally expands). At this time, since the positions of the first pin 36A and the second pin 36B are fixed, the board expansion / contraction force 83 is converted into a force 84 in the floating direction. However, in the configuration of the present embodiment, since there is a downward force 82, the force 84 in the floating direction can be canceled, and the intermediate portion 32a can maintain the flat portion 33b. As a result, it is possible to eliminate the deterioration of the adhesion between the LED substrate 32 and the heat spreader 34.
  • FIGS. 6A and 6B are cross-sectional views for explaining a process of fixing the LED substrate 132 in which the intermediate portion 132a is the flat portion 133a to the heat spreader 34.
  • FIG. 6C is a cross-sectional view for explaining how the substrate expands and contracts when the LED substrate 132 is energized.
  • an LED substrate 132 is prepared in which an intermediate part 132a located between the parts into which the first pin 36A and the second pin 36B are inserted is a flat part 133a.
  • the first pin 36 ⁇ / b> A and the second pin 36 ⁇ / b> B are inserted into the LED substrate 132 and the heat spreader 34, thereby pressing and fixing the LED substrate 132 to the heat spreader 34.
  • the LED substrate 132 is pressed against the heat spreader 34 by the pin pressing force (screwing force) 181.
  • the LED substrate 132 when the LED substrate 132 is heated when the LED substrate 132 is energized, the LED substrate 132 expands and contracts (specifically, thermally expands). At this time, since the positions of the first pin 36A and the second pin 36B are fixed, the substrate expansion / contraction force 183 is converted into a force 184 in the floating direction. In this example, since the downwardly acting force 82 shown in FIG. 5 does not exist, the intermediate portion 132a of the LED substrate 132 is lifted from the surface 34a of the heat spreader 34 by the force 184 in the floating direction. Therefore, when the intermediate portion 132a becomes the curved portion 133b, the adhesion between the LED substrate 132 and the heat spreader 34 is deteriorated, and as a result, the heat dissipation is reduced.
  • FIG. 7 is an exploded perspective view showing the LED substrate 32 and the heat spreader 34 of the present embodiment together with the light guide plate 30.
  • the LED board 32 of the present embodiment can be fixed to the heat spreader 34 by a plurality of pins (36A, 36B) as indicated by an arrow 80. Since the intermediate portion 32a of the LED board 32 is curved toward the heat spreader 34, the problem of floating when the LED board 32 is energized can be solved.
  • the LED element 31 is arranged on the LED substrate 32 so as to face the end face (incident surface) 30a of the light guide plate 30. Light from the LED element 31 enters the end surface (incident surface) 30a of the light guide plate 30 and exits from the main surface (front surface) 30m of the light guide plate 30 to irradiate the liquid crystal panel.
  • FIG. 8 is a perspective view showing the light guide plate 30, the LED substrate 32, and the heat spreader 34.
  • the heat spreader 34 shown in FIG. 8 has a U shape (or a substantially U shape).
  • An LED substrate 32 on which the LED elements 31 are mounted is fixed to the heat spreader 34.
  • the optical sheet 20 is disposed on the light guide plate 30.
  • the upper portion 34t of the heat spreader 34 shown in FIG. 8 has a structure that can fix the optical sheet 20.
  • the lower part 34 s of the heat spreader 34 has a structure that can hold the back surface (lower surface) of the light guide plate 30.
  • the heat spreader 34 has a plate-like structure and a U-shaped structure, but other heat spreaders 34 may be used.
  • the heat spreader 34 may have an L-shaped cross section.
  • the screw was illustrated as the some pin 36, if the LED board 32 can be fixed to the heat spreader 34 with the pin 36, the form of the pin 36 is not restricted to a screw and may be other types.
  • the LED substrate 32 and the heat spreader 34 can be sandwiched and fixed by a clip-like instrument (for example, a clip).
  • two pins (36A, 36B) are shown as the plurality of pins 36 for fixing the LED substrate 32 to the heat spreader 34, three or more pins may be used. If the convex portion 33a is provided at the intermediate portion 32a between the at least two pins (36A, 36B) on the LED substrate 32, the problem of lowering the adhesion between the LED substrate 32 and the heat spreader 34 is alleviated. However, it is of course possible to provide the convex portion 33a at a portion between each of the three or more pins.
  • the LED substrate 32 is disposed between the molds 90 (90A, 90B).
  • the LED board 32 here is a printed board on which the LED element 31 is not yet mounted.
  • the upper mold 90 ⁇ / b> A is provided with a protrusion 91 for producing a convex portion at the intermediate portion 32 a of the LED substrate 32.
  • the lower mold 90 ⁇ / b> B is provided with a concave portion 92 for producing a convex portion at the intermediate portion 32 a of the LED substrate 32.
  • the LED substrate 32 is pressed by the molds 90A and 90B (arrow 95). Thereafter, as shown in FIG. 9C, when the molds 90 ⁇ / b> A and 90 ⁇ / b> B are removed, the convex portion 33 a can be formed in the intermediate portion 32 a of the LED substrate 32. Then, what is necessary is just to mount the LED element 31 in the LED board 32 which has the convex part 33a.
  • the LED substrate 32 having the convex portion 33a can be manufactured by a pressing method using the mold 90. For example, by heating the deformed portion of the LED substrate 32 on which the LED element 31 is mounted (the portion on which the convex portion 33a is to be formed) and making the LED substrate 32 in a deformable state, a deformation process is performed, You may produce the convex part 33a.
  • the image display unit is configured by using one liquid crystal panel 10, but one image display unit (multi-display) is formed by combining a plurality of liquid crystal panels 10. It is also possible to configure.
  • the liquid crystal display device 100 in which such a plurality of liquid crystal panels 10 are combined can be used for a large-screen digital signage (for example, a display device of 100 inches or more).
  • the technique of the embodiment of the present invention can also be used for an LED lighting device that does not include a liquid crystal panel.
  • an LED illumination device that uses LED elements as light sources, and includes an LED substrate 32 on which the LED elements 31 are arranged, and a heat spreader 34 that radiates the heat of the LED substrate 32.
  • the intermediate part 32a of the LED board 32 before fixing to the heat spreader 34 has the convex part 33a which protruded to the heat spreader side, and the intermediate part of the LED board 32 after fixing to the heat spreader 34 32 a has a flat portion 33 b that contacts the contact surface 34 a of the heat spreader 34.
  • the heat dissipation of the LED substrate can be improved without using a heat conduction pad.
  • the present invention it is possible to provide a backlight unit and a liquid crystal display device that can improve the heat dissipation of the LED substrate without using a heat conductive pad.

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  • Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Nonlinear Science (AREA)
  • Power Engineering (AREA)
  • Liquid Crystal (AREA)
  • General Physics & Mathematics (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Computer Hardware Design (AREA)
  • Chemical & Material Sciences (AREA)
  • Crystallography & Structural Chemistry (AREA)
  • Mathematical Physics (AREA)
  • Optics & Photonics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Planar Illumination Modules (AREA)

Abstract

Une unité de rétroéclairage (50) destinée à exposer un panneau à cristaux liquides (10) à de la lumière comprend un substrat à LED (32) sur lequel une pluralité d'éléments LED (31) sont agencés, et un dissipateur thermique (34) destiné à disperser la chaleur du substrat à LED (32). Le substrat à LED (32) est fixé au dissipateur thermique (34) par au moins une première cheville (36A) et une seconde cheville (36B). Un emplacement intermédiaire (32a) du substrat à LED (32), avant fixation au dissipateur thermique (24), comporte une partie convexe (33a) qui fait saillie vers le côté dissipateur thermique (34), et l'emplacement intermédiaire (32a) du substrat à LED (32), après fixation au dissipateur thermique (34), comporte une partie plate (33b) qui est en contact avec une surface de contact (34a) du dissipateur thermique (34).
PCT/JP2011/076021 2010-11-18 2011-11-11 Unité de rétroéclairage et dispositif d'affichage à cristaux liquides WO2012067023A1 (fr)

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JP2010-257851 2010-11-18
JP2010257851 2010-11-18

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WO2012067023A1 true WO2012067023A1 (fr) 2012-05-24

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Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2021135589A1 (fr) * 2019-12-31 2021-07-08 深圳Tcl数字技术有限公司 Pièce de positionnement, ensemble plaque arrière et son procédé d'installation, et dispositif d'affichage

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2008518384A (ja) * 2004-11-01 2008-05-29 松下電器産業株式会社 発光モジュール、照明装置及び表示装置
JP2010177017A (ja) * 2009-01-29 2010-08-12 Kyocera Corp 光源装置および該光源装置を備える液晶表示装置

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2008518384A (ja) * 2004-11-01 2008-05-29 松下電器産業株式会社 発光モジュール、照明装置及び表示装置
JP2010177017A (ja) * 2009-01-29 2010-08-12 Kyocera Corp 光源装置および該光源装置を備える液晶表示装置

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2021135589A1 (fr) * 2019-12-31 2021-07-08 深圳Tcl数字技术有限公司 Pièce de positionnement, ensemble plaque arrière et son procédé d'installation, et dispositif d'affichage

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