WO2012048771A1 - Prozessmaschine, insbesondere zum bearbeiten und/oder inspizieren von substraten - Google Patents
Prozessmaschine, insbesondere zum bearbeiten und/oder inspizieren von substraten Download PDFInfo
- Publication number
- WO2012048771A1 WO2012048771A1 PCT/EP2011/004204 EP2011004204W WO2012048771A1 WO 2012048771 A1 WO2012048771 A1 WO 2012048771A1 EP 2011004204 W EP2011004204 W EP 2011004204W WO 2012048771 A1 WO2012048771 A1 WO 2012048771A1
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- WO
- WIPO (PCT)
- Prior art keywords
- transport
- transport device
- substrates
- machine according
- process device
- Prior art date
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Classifications
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B65—CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
- B65G—TRANSPORT OR STORAGE DEVICES, e.g. CONVEYORS FOR LOADING OR TIPPING, SHOP CONVEYOR SYSTEMS OR PNEUMATIC TUBE CONVEYORS
- B65G37/00—Combinations of mechanical conveyors of the same kind, or of different kinds, of interest apart from their application in particular machines or use in particular manufacturing processes
- B65G37/005—Combinations of mechanical conveyors of the same kind, or of different kinds, of interest apart from their application in particular machines or use in particular manufacturing processes comprising two or more co-operating conveying elements with parallel longitudinal axes
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67155—Apparatus for manufacturing or treating in a plurality of work-stations
- H01L21/6719—Apparatus for manufacturing or treating in a plurality of work-stations characterized by the construction of the processing chambers, e.g. modular processing chambers
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
- H01L21/67703—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations between different workstations
- H01L21/67724—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations between different workstations by means of a cart or a vehicule
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
- H01L21/67763—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations the wafers being stored in a carrier, involving loading and unloading
- H01L21/67775—Docking arrangements
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
- H05K13/0061—Tools for holding the circuit boards during processing; handling transport of printed circuit boards
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
- H05K13/04—Mounting of components, e.g. of leadless components
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
- H05K3/12—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using thick film techniques, e.g. printing techniques to apply the conductive material or similar techniques for applying conductive paste or ink patterns
- H05K3/1216—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using thick film techniques, e.g. printing techniques to apply the conductive material or similar techniques for applying conductive paste or ink patterns by screen printing or stencil printing
Definitions
- Process machine in particular for processing and / or inspecting substrates
- the invention relates to a process machine, in particular for processing and / or inspecting substrates, in particular circuit boards, printed circuit boards, solar cells or the like, with at least one transport device for transporting the substrate with at least one processing device for processing, in particular for processing and / or inspecting the substrates ,
- the invention further relates to a method directed thereto.
- Today platinum printers such as those used for printing of boards, especially printed circuit boards, use, have an inlet and a spout, fed via the inlet to be printed boards via a normally external conveyor and the outlet over the processed, especially printed circuit boards be removed via a normally external conveyor again, for example, fed to a further processing.
- Today's substrate or platinum printers are integrated systems, which have the actual processing-making process device with its own transport path and the transport device for the boards within the process unit between inlet and outlet.
- inspection devices are also integrated into the board printer which, for example, provides incorrect printing or insufficient printing. make borrowing and allow the direct rework in Platinendrucker without the substrate to be printed, so in particular the board, must be removed from the workflow.
- the respective processing unit which consists, for example, of a screen-printing template for the passage of solder paste and a screen-printing squeegee, which applies solder paste to the board or the substrate through the screen-printing stencil, and of a lifting and conveying unit, which supplies the board for the purpose of printing the Siebdruckschablone creates and supplies to the actual place of printing / processing or dissipates, are hereby incorporated respectively in the board printer.
- Such an integrated board printer is known for example from DE 103 1 1 821. Due to the desired high throughput speeds with consistently high and reliable precision, this requires complex and permanently secure fastenings, in particular screw connections.
- the transport device and the process device are designed as a separate module unit that is in each case self-standing, wherein the module units can be combined with one another in such a way that the transport device carries out the transport of the boards by the process device.
- transport device and process device according to the invention are designed as separate module units. Each of these module units is self-standing.
- the processing unit for example the screen printing table or the screen printing stencil or the squeegee
- the process device is detached from the transport device, the process device and the transport device are each self-standing. Storage or storage with additional means, as is common in the art, is not required. Transport equipment and process equipment can be easily separated from each other and put together again.
- the modular units are formed in such a way that the transport device carries out the transport of the substrates through the process device.
- the transport therefore does not take place by devices of the board printer itself, but rather by the transport device designed as a separate module unit, which is combined with the process device for this purpose. It is therefore possible to combine a transport device with one or another process device, as desired for the application.
- the advantage over the prior art is that a first process device can be combined with the transport device and produce in the ongoing production mode, while another process device, which is not currently combined with a transport device, for a new, different production run is being converted.
- the second process device retrofitted outside the actual production can easily be combined with the transport device, resulting in only minimal time loss for the removal of the first process device and insertion of the second process device for the same one Transport device results.
- this also possible failures of process equipment be easily buffered, for example, if a second process device is available as a replacement, which must be inserted in the event of failure of the first process device only in their place in the production. In this way, the manufacturing operation can continue as long as the first, defective process device is upgraded.
- the transport device and / or the process device is or are provided with or in each case with a chassis and / or with a pedestal.
- the transport device and / or process device can be moved from one position to another without much effort.
- Both transport device and process device advantageously have a combination of chassis and pedestal, with the chassis being activated for transporting one of the two devices, for example via a lever mechanism known in the prior art, but the chassis is deactivated for production operation and the pedestal used for fixed, steady state. In this way it is very advantageous to combine firm and reliable conditions on the one hand with easy transportability on the other hand. Furthermore, it is advantageously provided that a plurality of transport devices are provided, which can be combined with one another such that at least one common transport path is formed for the substrates.
- the transport device according to the invention therefore does not serve solely for the transport of substrates or of substrate to be printed or processed by the process device, but is designed so that it can be formed by combining a plurality of transport devices to form a transport line.
- the transport devices are for this purpose designed in such a manner as independent modules that at one end of the transport path, which is realized for example via a conveyor belt in the sense of an endless conveying path, the feed of the substrates and at the other end of the conveying path of the outlet, for example, the transfer to the next transport device.
- Several such transport devices can therefore be combined to any transportation line.
- a continuous production line or production line can be formed.
- At least one of the process devices of the transport road can be assigned to a selectable location. Consequently, a transport device formed from a plurality of transport devices can be assigned a process device at a selectable location; in particular, it is provided that a plurality of process devices can be assigned to a transport road formed in this way. Consequently, it is possible to form a continuous transport line from a plurality of (similar) transport devices, for example as a production line, wherein process devices can be arranged at arbitrary, selectable points of this transport line.
- process devices can perform different tasks, for example one process device the process of printing and another process device the process of board or substrate separation or inspection.
- transport devices and process devices can be freely combined in the sequence according to selectable criteria. However, a not only from the process ago ago very advantageous, but also a spatial flexibility is achieved.
- a process device performs only one task, such as printing the board or substrate.
- Another, their downstream process device causes, for example, the inspection.
- Such arrangements are not mandatory, but are intended to show that the proposed modular system of Prozeßinric.htun- gene and transport facilities the respective user extraordinarily much freedom in construction and design of its production process and its production line.
- At least one printing device, an inspection device, a 3-trennungseinrich- device, a marking device, an identification device, a drying device and / or a furnace device are provided as a process means.
- the different process devices can optionally be combined with the transport device. If, for example, a separation of an entire printed circuit board takes place, then the use separation device is combined with the transport device. If substrates are to be marked or marked substrates are identified, then the marking device or the identification device is connected to the transport device accordingly. For drying and / or heating, the drying and / or furnace devices are combined with the transport device.
- process facilities can be provided.
- the transport device has a transport road section or several transport road sections.
- the at least one transport road section is formed by the conveying device of the transport device.
- the transport road section is the section of the transport road formed by a plurality of transport devices, which is formed from the beginning of the conveyor to the exit of the conveyors of the respective individual transport device.
- the transport device has a plurality of parallel transport road sections, ie that a plurality of identical or different substrates and substrate sizes can be conveyed in parallel on the same transport device but on different transport road sections.
- At least two transport devices can be arranged next to one another transversely to the transport direction to form at least two parallel transport roads.
- the transport devices can therefore be combined in such a way, for example, back to back, that their parallel transport road sections at least two parallel transport roads form.
- the direction of the transport devices is here freely selectable, in particular reversible. Details show the figures.
- each transport device and / or each process device has at least one own drive.
- drive here is meant not only a device for moving to be transported or machined boards or the like, but each power source in the sense of Motor, which allows the transport or the implementation of the process in transport facilities or in process equipment.
- each transport device and each process device is self-sufficient with regard to the respective operations to be performed by it.
- the module concept of the invention is thus taken into account, namely because each transport device and each process device, taken in isolation, forms an independent unit which can be used at random locations within a production process.
- the process device and the transport device are not dependent on drives of the production line.
- Each process device and each transport device preferably has its own drive device for the processes to be carried out in and with it. It is further provided that the process device in each case has at least one introduction jaw for the partial or complete acceptance of at least one transport device.
- an insertion jaw is understood as meaning an open-edged recess of the process device which, for the purpose of combination with one or more transport devices, engages over or encompasses the transport device, depending on the width of the process device. The insertion jaw consequently encompasses the at least one transport device when the process device is combined with the transport device.
- a process device can also engage two or more transport devices, even if it is designed accordingly.
- the process device for the partial or complete reception of the at least one trans- Port worn transversely, in particular perpendicular to the transport direction of the transport device on the latter can be driven / fed.
- the transport direction of the boards of the at least one transport device (for example, when forming a transport line, as stated above) thus takes place in one direction, and transversely to the feeding or the feeding of the process device.
- the process device can be easily withdrawn from an existing transport device, which is part of a transport line / production line, transversely to the transport direction of the substrates and returned again. Process equipment and transport means of a transport line can therefore be easily separated and recombined without any intervention in the transport road would be required.
- the process device is simply removed across the course of the transport line and fed back, for example, after a conversion.
- the transport device and the processing device on the merging of the module units on automatically coupling plug-in and / or alignment can be ensured in this way that on the one hand by the alignment with high precision required for the machining process and manufacturing position accuracy is reproducibly set and held, the automatically coupling plug-in elements in turn electrical connections, For example, to transfer energy / electricity and / or data effect.
- the automatic coupling is preferably carried out in such a way that it is inevitable when feeding or driving transversely to the transport direction. tion of the transport device without further action by an operator.
- the manual connection of cables and plugs / sockets can be avoided in this way.
- the alignment elements can be designed, for example, as rails or runners or as bushes / bolt pairs which, for example, preferably have oblique or conical insertion and / or alignment aids.
- the transport device causes the continuous inflow and outflow of substrates to be processed or processed in the process device.
- Particularly flexible and cost-effective production lines can be formed in this way, which take into account in particular the short ArtszykJen modern electronic products, such as mobile phones.
- the transport device has a substantially C-shape, wherein the C has an upper and a lower leg and a leg connecting the center piece, and wherein the legs of the C arranged substantially transversely to the transport direction of the transport device are.
- the process device has a substantially C-shape, wherein the legs of the C of the process device are substantially transverse to the transport direction of the transport device of the substrate when the process device is combined with the transport device.
- the C can also be interpreted as lying U.
- the legs of the C of the transport device and the legs of the C-shape of the process device mesh with one another when the transport device and the process device are combined. Accordingly, the legs of the respective C-shapes of the transport device and the process device are not at the same height, so that they could be combined on impact, but have different heights with respect to a reference level, for example a floor. If the process device combined with the transport device, comb the legs of the respective C with those of the other. Details show the figures.
- a method for processing substrates, in particular circuit boards, printed circuit boards, solar cells or the like, with at least one transport device for transporting the substrates and at least one process device, in particular for processing and / or inspecting the substrates. It is provided that the transport device and the process device are combined in such a way as separate, each self-standing module units, that the transport device carries out the transport of the substrates by the process device. The transport of the substrate by the process device is therefore different in the prior art common PCB printers, effected by the transport device.
- FIG. 1 shows a transport device and a process device in side view
- FIG. 2 shows a transport device and a processing device in three-dimensional representation
- FIG. 3 shows a transport device and a processing device combined to form a board printer
- FIG. 4 shows a production line of several platinum printers connected in series
- FIG. 5 shows a production line of a plurality of board printers
- FIG. 6 plugging and aligning elements on the process device and transport device;
- Figure 8 plugging and aligning the assembly of transport device and process device to board printer.
- FIG. 1 shows a transport device 1 and a process device 2 in a side view, wherein both TE1 and PE2 are designed as independent, self-standing module units 42.
- the transport device 1 has a pedestal 3, which is essentially L-shaped and is provided on the underside with preferably adjustable stand elements 4 for the level-setting installation of the transport device 1.
- the pedestal 3 carries the top side a conveyor 5, which in the present embodiment, two parallel endless conveyor elements 6, which are driven by a separate, not shown here drive 43 in the transport device 1.
- the process device 2 has a chassis 7 with brakable transport rollers 8, which permit the process device 2 to be moved by means of the chassis 7, in particular to the transport device 1 to and from the transport device 1.
- the process device 2 is designed for at least partially receiving the transport device 1 to this approachable.
- the process device 2 has an insertion jaw 9 for such a receptacle, wherein when the process device 2 is fed, the insertion jaw 9 of the process device 2 surrounds at least the conveying device 5 of the transport device 1 at least on the top and bottom sides.
- the transport device has a C-shape 10, wherein the C 11 of the C-shape 10 has an upper leg 12, which is formed by the conveyor 5, and a lower leg 13, of a to the conveyor 5 substantially parallel part the pedestal 3 of the transport device 1 is formed.
- transport device 1 and process device 2 When pushing together of transport device 1 and process device 2 in the direction of arrow R transport device 1 and process device 2 via alignment 14 automatically when assembling transport device 1 and process device 2 in the process for carrying out, for example, the printing of substrates, in particular boards 16 with solder paste, not shown required Position brought so that the relative position of the transport device 1 and process device 2 is given to each other exactly and reproducibly. This ensures that the processing elements 15 provided for the process execution (shown only by way of example) of the process device 2 lie in correct relative position to blanks 16 conveyed on the endless conveying element 6 of the transport device 1.
- FIG. 2 shows the transport device 1 and the process device 2 in a three-dimensional view.
- the transport device 1 has the pedestal 3 with the alignment elements 14 on the lower legs 13 of the pedestal 3 and slide rails 17 on the upper side of the lower leg 13, which enable a defined, aligned sliding of a support element 8 of the process device 2, if the process device 2 on the transport device 1 is supplied and combined to form a process machine 19, in particular a platinum printer 20.
- the support member 18 in this case belongs to a chassis 21 of the process device 2, which includes 18 next to the support member further stabilizing and supporting elements of the process device 2, and the rack with the Fah 7 is cooperatively connected, such that the chassis 7, the feeding of the process device 2 allowed on the transport device 1, wherein upon sliding of the support member 18 of the process device 2 on the slide rails 17 of the transport Device 1, the chassis 21 is preferably non-positively connected to the pedestal 3 of the transport device 1, so that the transport rollers 8 can be folded away on the chassis 7 of the process device 2, retracted or braked and a relative movement of the process device 2 to the transport device 1 is no longer readily and unintentionally he follows.
- the Einzhoumaul 9 of the process device 2 in this case surrounds the conveyor 5 of the transport device 1 in such a way that it is completely overlapped by the process device 2 and funded on the endless conveyor elements 6 of the conveyor 5, not shown here substrates, such as boards, from the process device edited and / or inspected.
- FIG. 3 shows a transport device 1 and a process device 2, which have been assembled to form the process machine 19, namely the board printer 20, and cooperate with one another.
- the introduction jaw 9 of the process device 2 completely engages over the conveying device 5 of the transport device 1 in such a manner that boards 16 conveyed on the conveying device 5 by means of the endless conveying elements 6 can be processed by the processing elements 15 of the processing device 2.
- processing elements 15 of the processing device 2 are designed as lifting elements 22, the boards 16 for the purpose of processing of the endless conveyor elements 6 of the transport device 1 stand out and in a suitable processing position, for example above the endless conveyor elements 6, within the process device 2 bring.
- the lifting elements 22 lower and lay the now processed boards 16 again on the endless conveyor elements. 6 the transport device 1, so that they are conveyed out of the process device 2 by means of the transport device 1 in order to be transferred, for example, to a further, following transport device 1 for further processing or for removal.
- FIG. 4 shows a transporting road 23 which is formed by three transport devices 1 connected in series, namely a first transporting device 24, a second transporting device 25 and a third transporting device 26.
- the first transporting device 24 and the third transporting device 26 are in each case cooperating with a process device 2 combined, whereby in each case a pressure and / or Inspektionsmäschine 19 is formed.
- the second transport device 25 is not combined in this illustration with a process device 2, it is therefore no process machine 19 is formed, but there is only a transport road section 27, which is formed by the second transport device 25, following the first transport means 24 and followed by the third transport means 26, the transport line 23 is formed.
- the transport line 23 can therefore be subdivided into transport road sections 27, each transport road section 27 corresponding to the conveying length of a conveyor 5 of each transport device 1.
- an arbitrarily long transportation line 23 suitable for the respective applications can be formed from a plurality of transport devices 1, wherein each transport device 1 is attached to each one for the processing process or desired manufacturing process necessary or useful point with a process device 2 can be combined in such a way that the processing of the boards to be machined 1 6 takes place at the desired location in the course of the manufacturing process.
- this process device 2 exemplified by the second process device 28 located at the second transport device 25, is shown by the transport line 23, namely its Assigned transport device 1 with the respective transport road section 27, withdrawn and replaced by another process device 2, here exemplified at a 2a-processing device 29, replaced.
- the transport line 23 is blocked with the current production process not by retooling or failure or maintenance of a single process device 2 or, as is common in the art, a single process machine unnecessarily long, but can be maintained or retrofitted process device 2 in very shortly removed from the transport line 23, so taken from the current production process and replaced by another process device 2, whereby the manufacturing process can be resumed very quickly or continued or restarted with other products.
- a system 30 of transport devices 1 and process devices 2 can be realized to form highly flexible production lines 31.
- FIG. 5 shows two sections of two production lines 31, namely a first production line section 32 and a second production line section 33.
- Each production line section 32, 33 is formed by four transport devices 1, which are each paired with their backs 34 in pairs, and the transport road sections 27 each have two parallel endless conveyor elements 6, so that each production line section 32, 33 has a total of four parallel endless conveyor elements 6, that promotes four lanes.
- an extraordinarily flexible production capacity which can be rapidly converted during production, is achieved in this way.
- FIG. 6 shows a side view of a section of a process machine 19, namely a platinum printer 20, as described above.
- the latter has the transport device 1 with the base frame 3 and the process device 2 with the chassis 7, as described above, the chassis 7 having transport rollers 8 but at a distance d to a stand surface 36 for the process machine 19, since the chassis 7 is pushed onto the slide rails 17 shown in Figure 2 of the pedestal 3 of the conveyor 1 and the transport rollers 8 of the base 36 to effect a safe and immovable state the process machine 19 are lifted.
- the process device 2 is in this case positioned relative to the transport device 1 by means of the aligning elements 1 already described in Figure 2 in the desired relative position and connected and contacted by means of automatically coupling plug-in elements 37 electrically and in terms of data transmission.
- Both the aligning elements 14 and the plug-in elements 37 are in this case designed to be self-acting, so that they inevitably receive the desired position or contacting. An intervention by an operator or machine operator is not required for aligning the transport device 1 and the process device 2 relative to one another and for contacting them.
- the process device 2 in this case has the lifting elements 22 already described, ie the boards 16 to be processed by the endless conveying elements 6 lift the transport device 1 and bring into the relative position required for processing to processing elements 15 of the process device 2, for example screen printing 38, bring. After processing on or by means of the processing elements 1 5, the boards are returned by downward movement of the lifting elements 22 back to the endless conveyor elements 6 of the respective transport device 1, so that they can be promoted by the endless conveyor elements 6 from the area of the process device 2 addition.
- FIG. 7 once again shows, by way of example, alignment elements 14 which are arranged between parallel running slide rails 17 on the upper side of the lower legs 13 of foot frames 3 of transport devices 1.
- the alignment elements 14 are in this case preferably designed as leveling alignment elements 39, ie such that they can be individually adjusted in alignment of their support surfaces 40 and lateral contact surfaces 41 in such a way that the desired relative orientation of the seated on them, not shown in Figure 7, from Figure 6 but well apparent process device 2 can be effected.
- Such alignment elements 14 are preferably cone-shaped, at least in sections, or in another geometrical shape independently effecting a desired orientation, so that the desired orientation of the sliding or then seated process device 2 relative to the transport device 1 is determined by the geometry of the alignment elements 14 of FIG alone.
- the alignment elements 14 are in one here Not shown embodiment formed as a cup rolling, which are arranged in the pedestal 3, while preferably the support member 18 has a flat surface, which is associated with the pedestal 3 and the cup rollers / assigned.
- the process device 2 and the transport device 1 are designed in such a way that the process device 2 is driven into the transport device 1, lowered onto the cup rollers and then aligned and fixed.
- Figure 8 shows sections of the transport device 1 during the feeding of a process device 2, namely during the slipping of the chassis 21 on the slide rails 17.
- the relative position of process device 2 and transport device 1 is shatig results from the aligning elements as above 14.
- the electrical or Data-technical contact results from the self-acting plug-in elements 37, which are contacted automatically when merging process device 2 and transport device 1.
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- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- Power Engineering (AREA)
- Mechanical Engineering (AREA)
- Automatic Assembly (AREA)
- Electric Connection Of Electric Components To Printed Circuits (AREA)
Abstract
Description
Claims
Priority Applications (5)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN2011800581521A CN103238379A (zh) | 2010-10-11 | 2011-08-20 | 特别用于处理和/或检查基底的加工机 |
EP11748902.1A EP2628369A1 (de) | 2010-10-11 | 2011-08-20 | Prozessmaschine, insbesondere zum bearbeiten und/oder inspizieren von substraten |
US13/878,354 US20130220773A1 (en) | 2010-10-11 | 2011-08-20 | Process machine, in particular for treating and/or inspecting substrates |
MX2013003949A MX2013003949A (es) | 2010-10-11 | 2011-08-20 | Maquina procesadora, en particular para tratamiento y/o inspeccion de sustratos. |
KR1020137009070A KR20130119917A (ko) | 2010-10-11 | 2011-08-20 | 기판을 처리 및/또는 검사하기 위한 가공기 |
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
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DE102010048909.3 | 2010-10-11 | ||
DE102010048909A DE102010048909A1 (de) | 2010-10-11 | 2010-10-11 | Prozessmaschine, insbesondere zum Bearbeiten und/oder Inspizieren von Substraten |
Publications (1)
Publication Number | Publication Date |
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WO2012048771A1 true WO2012048771A1 (de) | 2012-04-19 |
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Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
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PCT/EP2011/004204 WO2012048771A1 (de) | 2010-10-11 | 2011-08-20 | Prozessmaschine, insbesondere zum bearbeiten und/oder inspizieren von substraten |
Country Status (7)
Country | Link |
---|---|
US (1) | US20130220773A1 (de) |
EP (1) | EP2628369A1 (de) |
KR (1) | KR20130119917A (de) |
CN (1) | CN103238379A (de) |
DE (1) | DE102010048909A1 (de) |
MX (1) | MX2013003949A (de) |
WO (1) | WO2012048771A1 (de) |
Families Citing this family (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
WO2016198174A1 (de) * | 2015-06-09 | 2016-12-15 | Integrated Dynamics Engineering Gmbh | Serviceeinrichtung für ein anlagenmodul |
ITUB20155093A1 (it) * | 2015-11-05 | 2017-05-05 | Siciliana Articoli Tecnici Srl | Apparato per il dosaggio automatizzato e la manipolazione in ambiente controllato di fluidi per processi chimici |
WO2018070931A1 (en) * | 2016-10-14 | 2018-04-19 | Pixel Automation Pte Ltd | Manufacturing apparatus and manufacturing line comprising the manufacturing apparatus |
Citations (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
WO1988010060A1 (en) * | 1987-06-05 | 1988-12-15 | Cimm, Inc. | Method and system for configuring, automating and controlling operations performed on pcbs |
JPH04199690A (ja) * | 1990-11-29 | 1992-07-20 | Ibiden Co Ltd | プリント配線板の切断方法 |
DE10311821A1 (de) | 2003-03-13 | 2004-09-30 | Ekra Eduard Kraft Gmbh Maschinenfabrik | Verfahren und Vorrichtung zum Ausrichten von Substrat und Druckschablone beim Lotpastendruck |
Family Cites Families (13)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US5259881A (en) * | 1991-05-17 | 1993-11-09 | Materials Research Corporation | Wafer processing cluster tool batch preheating and degassing apparatus |
DE3735449A1 (de) * | 1987-10-20 | 1989-05-03 | Convac Gmbh | Fertigungssystem fuer halbleitersubstrate |
US5067218A (en) * | 1990-05-21 | 1991-11-26 | Motorola, Inc. | Vacuum wafer transport and processing system and method using a plurality of wafer transport arms |
US5151303A (en) * | 1990-08-07 | 1992-09-29 | Iit Research Institute | Method and apparatus for using evacuated, detachable web containers with high vacuum treating means |
NL9200446A (nl) * | 1992-03-10 | 1993-10-01 | Tempress B V | Inrichting voor het behandelen van microschakeling-schijven (wafers). |
DE9407482U1 (de) * | 1994-05-05 | 1994-10-06 | Leybold Ag | Funktionseinrichtung für eine Vakuumanlage für die Behandlung von scheibenförmigen Werkstücken |
US5830272A (en) * | 1995-11-07 | 1998-11-03 | Sputtered Films, Inc. | System for and method of providing a controlled deposition on wafers |
US6091498A (en) * | 1996-07-15 | 2000-07-18 | Semitool, Inc. | Semiconductor processing apparatus having lift and tilt mechanism |
US20010051082A1 (en) * | 1997-09-05 | 2001-12-13 | Kirkpatrick Thomas I. | Cost effective modular-linear wafer processing |
US6517691B1 (en) * | 1998-08-20 | 2003-02-11 | Intevac, Inc. | Substrate processing system |
CN1996553A (zh) * | 2001-08-31 | 2007-07-11 | 阿赛斯特技术公司 | 用于半导体材料处理系统的一体化机架 |
US7217076B2 (en) * | 2001-08-31 | 2007-05-15 | Asyst Technologies, Inc. | Semiconductor material handling system |
ITUD20050196A1 (it) * | 2005-11-17 | 2007-05-18 | Gisulfo Baccini | Apparecchiatura per la produzione di celle fotovoltaiche sottili in silicio e di circuiti elettronici in materiale rigido e flessibile |
-
2010
- 2010-10-11 DE DE102010048909A patent/DE102010048909A1/de not_active Ceased
-
2011
- 2011-08-20 CN CN2011800581521A patent/CN103238379A/zh active Pending
- 2011-08-20 KR KR1020137009070A patent/KR20130119917A/ko not_active Application Discontinuation
- 2011-08-20 EP EP11748902.1A patent/EP2628369A1/de not_active Withdrawn
- 2011-08-20 WO PCT/EP2011/004204 patent/WO2012048771A1/de active Application Filing
- 2011-08-20 US US13/878,354 patent/US20130220773A1/en not_active Abandoned
- 2011-08-20 MX MX2013003949A patent/MX2013003949A/es active IP Right Grant
Patent Citations (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
WO1988010060A1 (en) * | 1987-06-05 | 1988-12-15 | Cimm, Inc. | Method and system for configuring, automating and controlling operations performed on pcbs |
JPH04199690A (ja) * | 1990-11-29 | 1992-07-20 | Ibiden Co Ltd | プリント配線板の切断方法 |
DE10311821A1 (de) | 2003-03-13 | 2004-09-30 | Ekra Eduard Kraft Gmbh Maschinenfabrik | Verfahren und Vorrichtung zum Ausrichten von Substrat und Druckschablone beim Lotpastendruck |
Also Published As
Publication number | Publication date |
---|---|
KR20130119917A (ko) | 2013-11-01 |
CN103238379A (zh) | 2013-08-07 |
MX2013003949A (es) | 2013-06-03 |
EP2628369A1 (de) | 2013-08-21 |
US20130220773A1 (en) | 2013-08-29 |
DE102010048909A1 (de) | 2012-04-12 |
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