WO2012039170A1

WO2012039170A1 - Circuit substrate working machine and circuit substrate working system

Info

Publication number: WO2012039170A1
Application number: PCT/JP2011/064168
Authority: WO
Inventors: 謙磁塚田; 神藤　高広; 和裕杉山
Original assignee: 富士機械製造株式会社
Priority date: 2010-09-21
Filing date: 2011-06-21
Publication date: 2012-03-29
Also published as: JP2012069587A

Abstract

An objective is to improve practicality in forming conductive circuits on circuit substrates in a circuit substrate working machine and a circuit substrate working system. Head retaining units are disposed on a second x-axis slide of a head moving device of a circuit substrate working module, said head retaining units alternately made to retain a mounting head, a jet head (28), and a heating head. The jet head (28) comprises a printing mechanism (102), further comprising a discharge nozzle (118) and a discharge driving device (120), said jet head (28) being moved by the head moving unit upon a substrate retaining device, and printing a conductive circuit forming agent on the circuit substrate. One of eight circuit substrate working modules, which configure a circuit substrate working system, retains the jet head (28), and another module retains the heating head, carrying out printing and heating of the conductive circuit forming agent on a circuit substrate (46). Repairs to conductive circuits formed improperly due to design errors are carried out by the addition of conductive circuits, as are the forming of conductive circuits according to the conditions of electronic circuit components mounted on the circuit substrate.

Description

Circuit board working machine and circuit board working system

The present invention relates to a circuit board working machine and a circuit board working system, and more particularly to formation of a conductive circuit on a circuit board.

An apparatus for forming a conductive circuit on a circuit board is described in Patent Documents 1 and 2 below. The device described in Patent Document 1 is a device that adds a new conductive circuit to a circuit board on which a conductive circuit is already formed. The device described in Patent Document 2 is a circuit board on which a conductive circuit is not yet formed. A device for printing a conductive circuit forming agent in order to form a conductive circuit. All of these are apparatuses for ejecting a conductive circuit forming agent onto a circuit board by an ink jet head, and are dedicated apparatuses for adding and forming conductive circuits, respectively.

JP 2006-13223 A Japanese Patent Application Laid-Open No. 2007-234811

The present invention has been made under the above circumstances, and has an object to improve practicality such as formation of a conductive circuit for a circuit board in a circuit board working machine and a circuit board working system.

The above-described problems include: a circuit board working machine; (a) a board holding device that holds a circuit board; (b) a mounting head that mounts an electronic circuit component on the circuit board held by the board holding device; c) a print head for printing a conductive circuit forming agent for forming a conductive circuit on the circuit board held by the substrate holding device; and (d) a head holding capable of selectively holding the mounting head and the print head. And (e) a relative movement device that relatively moves the head holding portion and the substrate holding device, and both mounting electronic circuit components and forming a conductive circuit on the circuit board held by the substrate holding device. It is solved by making it possible to implement.
The conductive circuit formed here may be one in which conductivity is expressed or may not be expressed. If the conductive circuit forming agent exhibits conductivity only by printing, conductivity can be obtained by printing, and if post-treatment such as heating is required for the expression of conductivity, the conductivity is not obtained by printing alone. It is because it cannot be obtained.
The relative movement device may be a device that moves the head holding unit relative to the substrate holding device without moving the substrate holding device, and moves the substrate holding device relative to the head holding unit without moving the head holding unit. An apparatus may be used, and an apparatus that moves both the head holding unit and the substrate holding apparatus may be used.

The above-mentioned problem is also configured by arranging a plurality of counter circuit board work modules side by side in the counter circuit board work system, and at least one of the plurality of counter circuit board work modules is connected to the counter circuit board work machine according to the present invention. It is solved by doing.
For circuit board work, in addition to mounting electronic circuit components on the circuit board and printing the conductive circuit, for example, application of adhesive, printing of solder cream, inspection of work performed on the circuit board, printed There is heating of the conductive circuit forming agent.

In the counter circuit board working machine according to the present invention, the electronic circuit component is mounted on the circuit board when the mounting head is held by the head holding unit, and the circuit board is conductive when the print head is held. The circuit is printed. One counter circuit board working machine can be used as an electronic circuit component mounting machine or a conductive circuit forming machine. Compared to the case where a working machine dedicated to mounting and a working machine dedicated to conductive circuit formation are provided, The practicality of the work machine can be improved, and the apparatus cost, apparatus installation space, and the like can be reduced.

In the circuit board working system in which a plurality of circuit board work modules are arranged side by side, the work on the circuit board is performed in parallel by the plurality of work modules. The configuration apparatus is shared by a plurality of work modules, and it is possible to flexibly cope with a change in the type of circuit board on which work is performed. Furthermore, according to the present invention, since the conductive circuit can be formed in the counter circuit board working system, a dedicated conductive circuit forming machine is not required as in the case where the conductive circuit is formed outside the counter circuit board system. The conductive circuit can be formed at a low cost. In addition, the electronic circuit component can be mounted immediately after forming the conductive circuit, or the conductive circuit can be formed immediately after mounting the electronic circuit component.

Aspects of the Invention

In the following, the invention which is recognized as being claimable in the present application (hereinafter, referred to as “claimable invention”. The claimable invention is a subordinate concept invention of the present invention which is the invention described in the claims) And may include inventions of a superordinate concept or another concept of the present invention). As with the claims, each aspect is divided into sections, each section is numbered, and is described in a form that cites the numbers of other sections as necessary. This is for the purpose of facilitating the understanding of the claimable invention, and is not intended to limit the combinations of the constituent elements constituting the claimable invention to those described in the following sections. In other words, the claimable invention should be construed in consideration of the description accompanying each section, the description of the embodiment, the prior art, the common general technical knowledge, and the like. An aspect in which a constituent element is added and an aspect in which the constituent element is deleted from the aspect of each section can be an aspect of the claimable invention.

In each of the following terms, (1) corresponds to claim 1, (2) corresponds to claim 2, and (3) corresponds to claim 3.

(1) a board holding device for holding a circuit board;
A mounting head for mounting electronic circuit components on a circuit board held by the substrate holding device;
A print head for printing a conductive circuit forming agent for forming a conductive circuit on a circuit board held by the substrate holding device;
A head holding portion capable of selectively holding the mounting head and the print head;
And a relative movement device that relatively moves the head holding portion and the substrate holding device, and is a counter circuit capable of both mounting electronic circuit components and forming a conductive circuit on a circuit board held by the substrate holding device. Board work machine.
(2) The counter circuit board working machine according to (1), wherein the print head is a jet head including a discharge nozzle and a discharge driving device that discharges the conductive circuit forming agent to the discharge nozzle.
According to the jet head, it is easy to cope with requirements such as the shape and size of the conductive circuit to be formed.
(3) A plurality of counter circuit board work modules are arranged side by side, and at least one of the plurality of counter circuit board work modules is the counter circuit board work machine described in (1) or (2). Anti-circuit board working system.

It is a perspective view which shows the circuit board working system which is embodiment of claimable invention. It is a perspective view which shows a part of said counter circuit board working system. It is a perspective view which shows the mounting apparatus of the circuit board work module which comprises the said circuit board work system. It is a perspective view which shows the multiple types of mounting head selectively hold | maintained at the said counter circuit board work module. It is a perspective view which shows the printing head hold | maintained at the head holding part of the said circuit board work module. It is a perspective view which shows the heating head hold | maintained at the said head holding | maintenance part. It is a perspective view which shows the part hold | maintained at the head holding | maintenance part of the said head holding | maintenance part and a mounting head. It is a figure which shows the head fixing device of the said head holding | maintenance part in the cross section in a side surface and a front, respectively. It is a figure explaining an example of formation of the conductive circuit with respect to the circuit board by the said print head. It is a figure explaining another example of formation of the conductive circuit with respect to the circuit board by the said print head.

Hereinafter, embodiments of the claimable invention will be described with reference to the respective drawings. In addition to the following embodiment, the claimable invention can be implemented in various modifications based on the knowledge of those skilled in the art, including the aspects described in the above [Aspect of the Invention] section.

FIG. 1 shows the appearance of a circuit board working system (hereinafter abbreviated as working system) which is an embodiment of the claimable invention. This work system is configured by arranging a plurality of counter circuit board work modules 10 (hereinafter abbreviated as modules 10) arranged in a row adjacent to each other on a common base 12. ing. The plurality of modules 10 share the work for the circuit board and perform it in parallel.

The module 10 is described in detail in, for example, Japanese Patent Application Laid-Open No. 2004-104075, and parts other than those related to the claimable invention will be briefly described.
As shown in FIG. 2, each module 10 has a module main body 18 as a main body frame, a substrate transport device 20, a substrate holding device 22, a component supply device 24, a mounting head 26, and a jet head 28 as a print head (see FIG. 5). ), A heating head 30 (see FIG. 6), a head moving device 32, a reference mark imaging device 34 (see FIG. 3), a component imaging device 36, and a control device 38. Each of the

heads

26, 28, and 30 is a work head that performs work on the circuit board, and constitutes a work device together with the head moving device 32.

As shown in FIG. 2, the substrate transfer device 20 includes two

substrate conveyors

40 and 42, and is provided in the center portion of the bed 44 constituting the module body 18 in the front-rear direction of the module 10. Are transported in a horizontal direction parallel to the direction in which the modules 10 are arranged. The substrate holding device 22 is provided for each of the two

substrate conveyors

40 and 42. In this embodiment, the support member for supporting the circuit board 46 from below and the side edges parallel to the conveying direction of the circuit board 46 are provided. A clamping member for clamping is provided, and the circuit board 46 is held in a posture in which a work surface on which the work is performed is horizontal. In the present embodiment, the conveyance direction of the circuit board 46 by the substrate conveyance device 20 is the X-axis direction, and is a plane parallel to the mounting surface of the circuit board 46 held by the substrate holding device 22. The direction orthogonal to the Y-axis direction.

The component supply device 24 is provided on one side in the Y-axis direction with respect to the substrate transfer device 20 of the bed 44 and on the front side of the module 10. The component supply device 24 supplies electronic circuit components by, for example, a tape feeder 50 (hereinafter abbreviated as a feeder 50), which is a kind of component feeder as a component supply tool, and includes a plurality of feeders 50 and the feeders. And a feeder holding device (not shown) to which 50 is attached. Each of the plurality of feeders 50 holds a plurality of the same electronic circuit components, and is attached to the feeder holding device in a state where the respective component supply units are arranged along the X-axis direction. The component supply device 24 may be a device that supplies electronic circuit components by a tray that is a kind of component supply tool.

In this embodiment, the head moving device 32 includes an X-axis direction moving device 64 and a Y-axis direction moving device 66 as shown in FIG. The Y-axis direction moving device 66 includes a linear motor 70 provided on a crown 68 constituting the module main body 18 so as to straddle the component supply unit of the component supply device 24 and the two substrate holding devices 22, and serves as a movable member. The Y-axis slide 72 is moved to an arbitrary position in the Y-axis direction. The X-axis direction moving device 64 is provided on the Y-axis slide 72 and is moved in the X-axis direction with respect to the Y-axis slide 72 and is relatively moved in the X-axis direction with respect to each other. And an X-axis slide moving device 78 for moving these

slides

74 and 76 in the X-axis direction (only a moving device for moving the second X-axis slide 76 is shown in FIG. 3). Each of the two X-axis slide moving devices includes, for example, a servo motor which is a kind of an electric rotary motor serving as a drive source, and a feed screw mechanism including a ball screw and a nut. Move to any position in the axial direction.

The

heads

26, 28 and 30 are alternatively mounted on the second X-axis slide 76, and are orthogonal to each other in a plane parallel to the work surface of the circuit board 46 held by the board holding device 22 by the head moving device 32. Can be moved to a direction including at least one component in two directions, and can be moved to an arbitrary position in a moving region straddling the component supply unit of the component supply device 24 and the two substrate holding devices 22. .

The mounting head 26 holds electronic circuit components by a suction nozzle 80 which is a kind of component holder. The mounting head 26 holds the suction nozzle 80 and has a different number of nozzle holders 82 constituting the holder holder. A plurality of types of mounting heads 26 are prepared, and are selectively mounted on the second X-axis slide 76 according to the type of circuit board 46 on which the electronic circuit components are mounted.

For example, the mounting head 26a shown in FIG. 4 (a) has one nozzle holder 82a and holds one suction nozzle 80a, and the mounting head 26b shown in FIG. 4 (b) has a plurality of, for example, three nozzle holders 82b. With the above (12 in the illustrated example), a maximum of 12 suction nozzles 80b can be held. The

suction nozzles

80a and 80b have a diameter of a component suction surface constituted by a tip surface of the suction tube, and a diameter of a background forming plate that forms a background when the electronic circuit component is imaged in a circular shape in plan view. The suction nozzle 80a is larger in diameter than the suction nozzle 80b, and the suction nozzle 80a is used for mounting a large electronic circuit component.

In the mounting head 26a, the nozzle holder 82a is moved up and down by an elevating device provided in the head main body 84a, and rotated around its own axis by the holder rotating device. In the mounting head 26b, the plurality of nozzle holders 82b are held by a rotating body, and the rotating body is rotated by the rotating body rotating device, so that it is moved to a preset component suction mounting position and lifted and lowered by the lifting device. And rotated around its own axis by the holder rotating device. The

head bodies

84a and 84b are covered with

covers

86a and 86b to cover the lifting device and the like. As shown in FIG. 3, the reference mark imaging device 34 is mounted on the second X-axis slide 76 and is moved together with any of the

heads

26, 28, and 30 by the head moving device 32.

The jet head 28 prints a conductive circuit forming agent on the circuit board 46, and performs printing in the same manner as the ink jet head of the ink jet printer. Therefore, as shown in FIG. 5, the present jet head 28 includes a head main body 100, a printing mechanism 102 and a tank 104 provided in the head main body 100, and in this embodiment, printing is performed by a shear mode type piezo method. It is supposed to do.

The head main body 100 is covered with a cover 110 in the same manner as the head main body 84 of the mounting head 26 to cover a part of the printing mechanism 102 and the like. In this embodiment, the printing mechanism 102 uses a commercially available printing mechanism used in an inkjet printer, for example, a printing mechanism manufactured by Toshiba Tec Corporation, and a mechanism main body 116 and a discharge nozzle provided in the mechanism main body 116. 118 and the discharge driving device 120.

In the mechanism body 116, a plurality of pressure chambers are provided in a line. Each of the pair of side walls of the pressure chambers is formed by a piezo element, and the piezo elements of the plurality of pressure chambers constitute the ejection driving device 120. The mechanism main body 116 is also provided with a drive circuit for driving a plurality of piezoelectric elements for each pressure chamber together with the ejection drive device 120. The mechanism body 116 is further provided with discharge ports that communicate with each of the plurality of pressure chambers and open to the outside of the mechanism body 160, and the plurality of discharge ports constitute discharge nozzles 118. In the present embodiment, in a state where the jet head 28 is attached to the second X-axis slide 76, the printing mechanism 102 is connected to the head main body so that the direction in which the plurality of discharge ports of the discharge nozzle 118 are aligned is parallel to the X-axis direction. 100.

In the tank 104, a conductive circuit forming agent is accommodated. As the conductive circuit forming agent, for example, Ag1TeH (manufactured by ULVAC Material Co., Ltd.) or NPS-J (manufactured by Harima Chemicals Co., Ltd.) is used. The tank 104 is connected to the mechanism main body 116 by a hose 122, and the conductive circuit forming agent is supplied from a reservoir (not shown) formed in the mechanism main body 116 to a pressure chamber through a supply port formed for each of the pressure chambers. Is done.

The heating head 30 includes a head body 130 and a heating mechanism 132 as shown in FIG. The head main body 130 is covered with a cover 134 in the same manner as the head main body 84, and a part of the heating mechanism 132 is covered. In the present embodiment, the heating mechanism 132 is configured to spot-heat the object with laser light, and includes a laser oscillator and a lens system.

The

heads

26, 28 and 30 are detachably held by a head holding part 150 provided on the second X-axis slide 76. Hereinafter, the mechanism held by the head holding unit 150 and the head holding unit 150 of the

heads

26, 28 and 30 will be described by taking the mounting head 26 as an example.
In the mounting head 26, as shown in FIG. 7, the back surface portion 152 of the head main body 84 constitutes a held portion, and the front portion 154 of the second X-axis slide 76 constitutes a head holding portion 150. As shown in FIG. 7A, the back surface portion 152 of the head main body 84 has two leg portions 156 at the lower portion and an engagement block 158 at the upper portion. On the other hand, as shown in FIG. 7B, the front portion 154 of the second X-axis slide 76 has a leg support portion 160 for supporting the leg portion 156 at the lower portion, and slightly above the leg support portion 160. Two lower engagement rollers 164 are provided.

In addition, a head fixing device 166 that holds and fixes a part of the engagement block 158 is provided at the upper portion of the front portion 154 of the second X-axis slide 76, and 2 below the head fixing device 166 is 2 An engagement hole 168 is provided with two upper engagement rollers 167 for allowing the engagement block 158 to enter. The leg support 160 and the like constitute a head holding part 150 together with the front part 154. In a state where the mounting head 26 is mounted, the back surface portion 152 of the head main body 84 and the front surface portion 154 of the second X-axis slide 76 are made to fit almost exactly.

The leg 156 has a wedge-shaped tip and is fitted to a leg support 160 having a V shape. Thereby, the vertical position of the mounting head 26 is defined. Further, the opposing side surfaces of the portion where the space between the upper portions of the leg portions 156 is made to be in close contact with the outer peripheral surfaces of the two lower engaging rollers 164, and both sides of the engaging block 158 The surface fits snugly between the two upper engaging rollers 167, and these define the left-right position of the mounting head 26.

FIG. 8 shows a cross section of the head fixing device 166. FIG. 8A is a cross section cut at the center in the left-right direction of the second X-axis slide 76, and FIG. 8B is a cross section taken along the plane AA in FIG. 8A. The head fixing device 166 has a structure in which a latching pin 172 is engaged with a latching roller 170 (see FIG. 8) provided on the upper part of the engagement block 158. More specifically, the head fixing device 166 includes a latch pin 172 supported in a pin hole 174 provided in the upper portion of the front portion 154 so as to be vertically movable, and a latch pin operating device 180 that moves the latch pin 172 up and down. It is comprised including. The latch pin actuating device 180 includes a slightly flexible rod 182, a disc-shaped cam plate 184 provided eccentrically at one end of the rod 182, and a generally pipe-like shape that rotatably supports the rod 182. Rod support member 186 and a grip 188 provided at the other end of the rod 182 for rotating the rod 182. The latch pin operating device 180 is attached to the upper portion of the front portion 154 of the second X-axis slide 76 in the rod support member 186 (see FIG. 7). A groove 190 having a width slightly larger than the outer diameter of the cam plate 184 is formed in the upper portion of the latch pin 172, and the cam plate 184 is engaged with the groove 190. When the grip 188 is rotated, the latch pin 172 operates up and down.

The attachment / detachment of the mounting head 26 to / from the head holding portion 150 is performed by an operator. When the mounting head 26 is mounted, the operator rotates the grip 188 in one direction (counterclockwise in this embodiment as viewed from the front) and moves the latching pin 172 upward. The back surface 152 is closely engaged with the front surface 154 of the second X-axis slide 76, and in this state, the grip 188 is rotated in the opposite direction (clockwise as viewed from the front in this embodiment). By operating the grip 188, the latch pin 172 is lowered, and an inclined surface 192 formed at the lower end portion of the latch pin 172 is brought into contact with the outer periphery of the latch roller 170 before the lowest end. Further, by rotating the grip 188, the latching pin 172 latches the latching roller 170 in a state of pressing the mounting head 26 downward and pressing backward by the action of the inclined surface 192. The state is maintained by the frictional force generated between the outer periphery of the cam plate 184 and the lower surface of the groove 190. In order to maintain the state more reliably, the latch pin actuator 180 is provided with a torsion spring 194. The torsion spring 194 biases the rod 182 in the direction in which the latch pin 172 is directed downward. In order to detach the mounting head 26, the grip 188 may be rotated in the opposite direction.

In the present embodiment, the module 10 can be provided with various mounting heads 26, but the structure related to the holding mechanism is the same for all the mounting heads 26, and the jet head 28 and the heating head 30. Thus, the work head being held can be detached with one touch, and any work head can be held with one touch.

The control device 38 is composed mainly of a computer, controls the drive source of the device constituting the module 10 such as the substrate transport device 20, and mounts electronic circuit components on the circuit substrate 46 by the mounting head 26, or a jet head. The printing of the conductive circuit forming agent on the circuit board 46 by 28 or the heating by the heating head 30 of the printed conductive circuit forming agent is controlled. The computers of the control devices 38 of the eight modules 10 constituting the work system are each connected to a host computer 200 that controls the entire system via a communication cable (not shown).

In the work system configured as described above, the jet head 28 is held by the head holding unit 150 in one of the plurality of modules 10 as necessary, and the conductive circuit forming agent is applied to the circuit board 46. Printing is performed, and the heating head 30 is held in the other one, and the printed wiring is heated and baked.

For example, when there is a design mistake in wiring and the conductive circuit is formed incorrectly on the circuit board, and the circuit board is not discarded, the mistake can be corrected and used, and electronic circuit components can be mounted, or When the electronic circuit component is mounted and the prototype circuit board is inspected, the conductive circuit needs to be corrected, or the conductive circuit needs to be newly formed due to the circumstances of the electronic circuit component mounted on the circuit board. Etc., a conductive circuit forming agent is printed, a conductive circuit is added, wiring is corrected, or a new conductive circuit is formed. In these cases, in the present embodiment, any of the conductive circuits formed can ignore the resistance value like the lead of the electronic circuit component.

When the configuration of the conductive circuit is modified and the electronic circuit component is mounted on the circuit board 46, the conductive circuit forming agent is printed prior to the mounting of the electronic circuit component on the circuit board. In this case, the jet head 28 is held by the head holding unit 150 of the most upstream module 10 in the substrate transport direction in the work system to function as the printing module 10, and the heating head 30 is connected to the head holding unit 150 of the adjacent module 10. It is held and functions as the heating module 10. In each of the remaining modules 10, the mounting head 26 is held and functions as a mounting module.

The computer of each control device 38 of the printing module 10 and the heating module 10 stores the data related to the printing and heating of the conductive circuit forming agent, for example, the data of the conductive circuit addition position of the circuit board 46, the width and shape of the conductive circuit. 200, the jet head 28, the heating head 30, the head moving device 32, and the like are controlled accordingly.

The circuit board 46 carried into the printing module 10 is held by the board holding device 22 in the same manner as when electronic circuit components are mounted. Then, a plurality of, for example, two reference marks (not shown) formed on the circuit board 46 are imaged by the reference mark imaging device 34, and the position error of the conductive circuit addition portion that is a conductive circuit formation portion is calculated. This position error includes each position error in the X-axis direction and Y-axis direction and a rotational position error that is a position error about an axis perpendicular to the circuit board 46.

The jet head 28 discharges the conductive circuit forming agent toward the circuit board 46 while being moved by the head moving device 32. At this time, according to the print data, a voltage is applied to the piezo element for the pressure chamber connected to the discharge ports necessary for printing among the plurality of discharge ports of the discharge nozzle 118, and the conductive circuit forming agent is discharged from the discharge ports. Sprayed and applied to the circuit board 46. Thereby, for example, as shown in FIG. 9, a line 212 forming a conductive circuit connecting the already formed conductive circuit 210 is printed. The line 212 illustrated in FIG. 9 has a length that is printed at a time in the X-axis direction. The jet head 28 is moved to the print start position and then moved in the Y-axis direction. To print.

At the time of printing, the position error at the portion where the conductive circuit is added is corrected. In this embodiment, each position error in the X-axis and Y-axis directions of the conductive circuit addition location is determined by the position of the jet head 28 when moved to the print start position (in the direction in which the plurality of discharge ports of the discharge nozzle 118 are arranged). The rotational position error is eliminated by converting the print data for printing the line 212 into data that the rotational position error is removed and the line 212 is printed. Is done. The jet head 28 is moved to the corrected position, and the conductive circuit forming agent is printed according to the corrected data, so that the printing is performed accurately.
Data conversion may be performed so that each position error in the X-axis and Y-axis directions is also corrected together with the rotational position error, and printing may be performed according to the correction data obtained thereby.

After printing, the circuit board 46 is released from the holding by the board holding device 22 and carried out to the heating module 10. Then, the circuit board 46 is held by the board holding device 22, the reference mark is imaged by the reference mark imaging device 34, and the position error of the conductive circuit added portion is calculated, and then the heating head 30 is printed along the line 212. The conductive circuit forming agent is heated and fired by being moved while being irradiated with laser light. At this time, the moving position of the heating head 30 is corrected based on the position error, and heating is performed accurately. If the width of the laser beam is larger than the width of the line 212, the movement data of the heating head 30 (the data for moving the heating head 30 along the line 212 and obtained from the print data) is one. The movement data is subjected to data conversion so that each position error and rotational position error in the X-axis and Y-axis directions are corrected, and corrected data is obtained. After the heating, the circuit board 46 is released from the holding by the board holding device 22 and is carried out to the module 10 adjacent to the downstream side of the heating module 10 where electronic circuit components are mounted. The electronic circuit components are mounted in parallel by the six mounting heads 26 each holding the mounting head 26. The mounting of electronic circuit components onto the circuit board 46 by the mounting head 26 is well known, and the description thereof is omitted. If the width of the laser beam is smaller than the width of the line 212, a plurality of movement data of the heating head 30 is created, and data conversion is performed for each movement data.

When a conductive circuit is newly formed due to the convenience of the electronic circuit component mounted on the circuit board 46, the conductive circuit forming agent is printed after the electronic circuit component is mounted.
For example, when a large number of identical electronic circuit components are mounted on a single circuit board, for example, a large number of light emitting diodes (hereinafter abbreviated as LEDs) are mounted on a single circuit board, and a display such as a television or a computer is displayed. When manufacturing a light source such as a backlight of an instrument panel display of a vehicle, a backlight of a vehicle, a front light, or a general lighting device, a conductive circuit may be formed after mounting an electronic circuit component.

Backlights and the like are required to have uniform luminance across the light emitting surface, whereas LEDs are sensitive to changes in the manufacturing process environment (temperature, humidity), etc., and the characteristics, particularly the luminance against the rated current. Can easily be processed and can be processed as the same electronic circuit component in terms of control of the mounting operation, but the electrical characteristic values are different in a plurality of stages. Therefore, the LEDs are divided into a plurality of brightness classes, and each circuit board or each area of a circuit board is equipped with LEDs of the same brightness class, and the current supplied to them is a resistor. By controlling by this, the luminance of the entire light emitting surface is made uniform.

Therefore, a resistor is attached to the circuit board 46. For example, the resistor is mounted on the same surface as the mounting surface on which the LED of the circuit board 46 is mounted, and the resistor mounting circuit 220 shown in FIG. 10A is formed on the mounting surface. The resistor mounting circuit 220 includes a plurality of connection terminals 222. These connection terminals 222 are provided so that at least one of a series circuit and a parallel circuit is formed by mounting the resistor 224. When the connection terminal 222 needs to be short-circuited, two connection terminals 222 are provided. A conductive circuit for connecting the connection terminal 222 is formed, and a short circuit portion 226 is formed.

In a region where LEDs of the same luminance class are mounted on the circuit board 46, a resistance value for making the luminance of the entire light emitting surface uniform is determined according to the luminance class of the mounted LEDs. Therefore, calculation of the resistance value, determination of the type (resistance value), number, and mounting position of the resistor 224 to be mounted on the resistor mounting circuit 220 and mounting of the resistor 224 are performed after mounting the LED, and a short circuit is required. The conductive circuit 226 is formed after the LED and the resistor are mounted.

When the conductive circuit is formed after mounting the electronic circuit components in this way, the jet head 28 and the heating head 30 are held in the two modules 10 on the downstream side in the substrate transport direction among the eight modules 10 arranged in a row. . For example, the heating head 30 is held by the most downstream module 10, and the jet head 28 is held by the module 10 adjacent to the upstream side of the module 10. The remaining module 10 holds the mounting head 26, and the LED is mounted on the circuit board 46 and the resistor 224 is mounted.

After the resistor 224 is mounted, if the circuit board 46 carried into the printing module 10 has the connection terminal 222 that needs to be short-circuited, the conductive circuit forming agent is printed. Data on the presence or absence of a short circuit and the short circuit location in the resistor mounting circuit 220 is supplied from the host computer 200. After printing, the circuit board 46 is sent to the downstream module 10, and the printed conductive circuit forming agent is heated by the heating head 30. Data on the presence / absence of heating and the heating location are supplied from the host computer 200. By heating, for example, as shown in FIG. 10B, two resistors 224 are provided in parallel and a resistance circuit having a short-circuit portion 226 is formed. The heating may be performed by a heating device provided separately from the work system.

When it is not necessary to print the conductive circuit forming agent on the circuit board 46, the mounting head 26 is held by the head holding unit 150 in all the modules 10, and only the mounting of the electronic circuit components is performed in the work system.

In the work system of the present embodiment, it is possible to selectively hold three types of heads for all the modules 10, and all the modules 10 are considered to be circuit board work machines that are embodiments of the claimable invention. The module 10 on which the jet head 28 is actually held can also be considered as a counter circuit board working machine that is an embodiment of the claimable invention.

Note that the conductive circuit forming agent may be printed on the circuit board on which the conductive circuit is not yet formed by the print head held by the head holding unit. If this printing is performed in a circuit board working system including a plurality of circuit board working modules, the printing is performed in one or more upstream circuit board modules. Each of the other plurality of circuit board work modules can hold, for example, a heating head, an adhesive application head, a solder printing head, and a mounting head. A screen printer may be provided in the middle of a module row in which a plurality of counter circuit board work modules are arranged, and solder printing may be performed.

Also, a resistor which is a conductive circuit having a predetermined resistance value may be formed by printing a conductive circuit forming agent.

Furthermore, the circuit board working machine is configured such that a printing / heating head having both a printing function and a heating function and a mounting head are selectively held by a head holding unit, and one printing and heating are performed. It may be performed in the counter circuit board working machine.

Also, the conductive circuit forming agent printed on the circuit board may be baked using pulsed light. As an apparatus for performing firing using pulsed light, for example, the SINTERON500benchtopXsystem and the INTERON2000rack-mounted system manufactured by Xenon Corporation are commercially available.

Furthermore, attachment / detachment to / from the head holding unit such as the mounting head may be performed automatically. For example, as described in Japanese Patent Application Laid-Open No. 2006-261325, it is assumed that the mounting head or the like is held by a negative pressure in the head holding portion. When the working head held by the head holding unit requires supply of electric energy for its operation, electric energy is supplied from the head holding unit to the working head along with the holding. Further, the counter circuit board working machine is provided with a head accommodating device for accommodating a working head held by a head holding portion such as a mounting head and a printing head.

10: Mounting module 26: Mounting head 28: Jet head 30: Heating head 32: Head moving device 46: Circuit board 118: Discharge nozzle 120: Discharge drive device

Claims

A substrate holding device for holding a circuit board;
A mounting head for mounting electronic circuit components on a circuit board held by the substrate holding device;
A print head for printing a conductive circuit forming agent for forming a conductive circuit on a circuit board held by the substrate holding device;
A head holding portion capable of selectively holding the mounting head and the print head;
And a relative movement device that relatively moves the head holding portion and the substrate holding device, and is a counter circuit capable of both mounting electronic circuit components and forming a conductive circuit on a circuit board held by the substrate holding device. Board work machine.
The counter circuit board working machine according to claim 1, wherein the print head is a jet head including a discharge nozzle and a discharge driving device that discharges the conductive circuit forming agent to the discharge nozzle.
3. A circuit board working system comprising a plurality of circuit board working modules arranged side by side, wherein at least one of the plurality of circuit board working modules is the circuit board working machine according to claim 1 or 2.