WO2012037796A1 - Simulation platform for integrated circuit manufacturing equipment - Google Patents

Simulation platform for integrated circuit manufacturing equipment Download PDF

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Publication number
WO2012037796A1
WO2012037796A1 PCT/CN2011/071276 CN2011071276W WO2012037796A1 WO 2012037796 A1 WO2012037796 A1 WO 2012037796A1 CN 2011071276 W CN2011071276 W CN 2011071276W WO 2012037796 A1 WO2012037796 A1 WO 2012037796A1
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WO
WIPO (PCT)
Prior art keywords
subsystem
protocol
layer
subsystems
simulation
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Application number
PCT/CN2011/071276
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French (fr)
Chinese (zh)
Inventor
徐华
王巍
高士云
李博
李垒
赖太阳
邹龙庆
Original Assignee
清华大学
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
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Publication date
Priority claimed from CN2010102886771A external-priority patent/CN101937361A/en
Priority claimed from CN201010288676A external-priority patent/CN101957878B/en
Priority claimed from CN 201010288680 external-priority patent/CN101968742B/en
Priority claimed from CN2010102902539A external-priority patent/CN101944123B/en
Priority claimed from CN 201010290245 external-priority patent/CN101969476B/en
Priority claimed from CN201010290261.3A external-priority patent/CN101957879B/en
Priority claimed from CN2010102919173A external-priority patent/CN101957851B/en
Priority claimed from CN 201010291914 external-priority patent/CN101964788B/en
Priority claimed from CN 201010291919 external-priority patent/CN101976203B/en
Priority claimed from CN2010102919313A external-priority patent/CN101957880A/en
Application filed by 清华大学 filed Critical 清华大学
Publication of WO2012037796A1 publication Critical patent/WO2012037796A1/en

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    • GPHYSICS
    • G06COMPUTING; CALCULATING OR COUNTING
    • G06FELECTRIC DIGITAL DATA PROCESSING
    • G06F30/00Computer-aided design [CAD]
    • G06F30/20Design optimisation, verification or simulation

Definitions

  • the invention belongs to the field of computer application technology and integrated circuit equipment, and particularly relates to a simulation platform for an integrated circuit manufacturing device for simulating an instrument in integrated circuit manufacturing. Background technique
  • an off-the-shelf simulation platform is needed to fully reflect the effect of the algorithm in the actual production operation, and the guiding algorithm improvement strategy and parameter online adjustment method are obtained.
  • the use of the simulation platform can accurately test the equipment control system software, which can reduce the failure of the control system software execution and the integrated circuit manufacturing process, can solve the process stability of the integrated circuit process equipment, process reliability, reduce equipment maintenance time, and maximize the degree Improve equipment utilization.
  • the simulation platform is a test that is critical to the software on the hardware.
  • Simulation platform interface The simulation system supplier should provide the solution for different control system interfaces, mainly including two kinds of interfaces: communication level interface and physical I / O level interface.
  • the existing simulation system of integrated circuit manufacturing equipment has the following disadvantages:
  • the simulation system and the key technologies are designed by each company specifically for a certain manufacturing equipment, and the simulation system cannot be configured according to different manufacturing equipment requirements, thereby failing to Meet the needs of different hardware for different projects, so it is not universal. Summary of the invention
  • An object of the present invention is to solve at least one of the above technical drawbacks and to provide a simulation platform for an integrated circuit manufacturing apparatus.
  • An embodiment of the present invention provides a simulation platform for an integrated circuit manufacturing device, including: a plurality of instruments to be simulated, a plurality of boards, each of the plurality of boards including a plurality of channels, wherein Each of the plurality of channels is connected to a pin of one of the plurality of instruments to be simulated; and an emulation computer, wherein the emulation computer communicates with the plurality of instruments to be simulated through the plurality of boards, Simulating a plurality of devices to be simulated, the simulation computer comprising: a protocol layer processor, wherein the protocol layer processor is configured to establish a plurality of communication protocols in the simulation platform, and generate corresponding to the plurality of communication protocols a protocol layer configuration file, and communicating with the plurality of instruments to be simulated by the plurality of boards according to the plurality of communication protocols; a device layer processor, wherein the device layer processor is used to establish the simulation platform a plurality of devices, and generating a device layer configuration file corresponding to the plurality of devices, and
  • the protocol layer configuration file, the device layer configuration file, the subsystem layer configuration file, and the system layer configuration file are saved in an XML file format.
  • the protocol layer processor includes: a protocol configuration module, where the protocol configuration module is configured to establish the multiple communication protocols in the simulation platform, and generate and a protocol layer configuration file corresponding to the communication protocol; and a protocol operation module, wherein the protocol operation module is configured to configure the module The configured communication protocol performs a connection test for verification.
  • the protocol type includes an Ethernet protocol, a serial port protocol, an analog 10 protocol, a digital 10 protocol, and a DeviceNet protocol.
  • the protocol layer configuration file when the protocol type of the communication protocol is an Ethernet protocol or a serial port protocol, the protocol layer configuration file further includes a protocol format, where the protocol format includes a command name and a command carried The attribute parameter of the attribute.
  • the protocol layer processor further includes: a protocol encapsulation module, where the protocol encapsulation module further includes a data unpacking interface and a data packet when the protocol type is an Ethernet protocol or a serial port protocol An interface, the data unpacking interface, configured to parse data sent by the multiple boards; and the data packet interface is configured to perform a packet operation on data sent to the multiple boards.
  • the device layer processor includes: a device configuration module, where the device configuration module is configured to establish multiple devices in the simulation platform, and generate devices corresponding to the multiple devices a layer configuration file to configure the plurality of devices, and the protocol layer configuration file corresponding to the plurality of devices is loaded to the plurality of devices to enable each device to perform with the device to be simulated by using the communication protocol And a device running module, where the device running module is configured to verify the configured device, and simulate the multiple devices after passing the verification.
  • the device layer configuration file includes: a device name and a type; a device attribute, where the device attribute includes a device attribute name, a device attribute type, a device attribute maximum value, and a device The minimum value of the attribute and the default value of the attribute of the device;
  • the device control command includes the name of the device control command, the delivery direction of the device control command, and the content of the device control command;
  • the device action includes the device An action name and a device control command coupled with the action name, a number of steps of the action, and a device action type corresponding to each step; and a coupling relationship inside the device, the coupling relationship inside the device includes a coupling condition and the The coupling relationship command corresponding to the coupling condition.
  • the device action type includes a command behavior, an action condition, a delay wait, a change rule, and return information.
  • the device configuration module is further configured to add one or more devices to the multiple devices, or delete one or more devices from the multiple devices.
  • the device running module includes: a first verification unit, configured to perform verification on the device configured by the device configuration module; and a first port initialization unit, configured to generate and pass verification Device of the device controls the corresponding physical port, and checks whether the physical port conflicts.
  • the physical port is initialized;
  • the first command management unit is configured to send or receive a device control command;
  • a first simulation unit configured to execute a simulation action corresponding to the device control command;
  • a first error management unit configured to record error information in a device layer simulation process in a log form.
  • the subsystem layer processor includes: a subsystem configuration module, where the subsystem configuration module is configured to establish multiple subsystems in the simulation platform, and generate and the multiple subsystems Corresponding child a system layer configuration file to configure the plurality of subsystems, wherein each of the subsystems includes a plurality of devices, and the device layer configuration files corresponding to the plurality of subsystems are loaded to the plurality of subsystems for configuration The plurality of devices in each subsystem; and a subsystem running module, the subsystem running module is configured to verify the configured subsystem, and simulate the plurality of subsystems after passing the verification.
  • the subsystem layer configuration file includes: a subsystem attribute, the subsystem attribute includes a property name of the subsystem, a device attribute inside the subsystem, and an internal device of the subsystem
  • the attributes include the name of the device, the type of the device, and the physical port;
  • the coupling condition between the devices, the coupling condition of the device includes the name of the coupled device, the coupling condition, and the coupling trigger command;
  • the coupling relationship between the devices, and the coupling relationship between the devices includes the device The coupling action between the two, the name of the coupling device, the number of steps of the coupling action, and the type of coupling action corresponding to each step.
  • the type of coupling action includes device behavior, coupled action conditions, and delay of the coupling action.
  • the subsystem configuration module is further configured to add one or more subsystems to the multiple subsystems, or delete one or more subsystems from the multiple subsystems; Adding one or more of the devices to each subsystem or deleting one or more of the devices from the various subsystems.
  • the subsystem running module includes: a second verification unit, configured to verify the subsystem configured by the subsystem configuration module; and a second port initialization unit, configured to generate a physical port corresponding to a device control command of the device inside the verified subsystem, and checking whether the physical port conflicts, when checking that the physical port has no conflict, running the device inside the subsystem and the physical The port is initialized;
  • the second command management unit is configured to receive or send a device control command of the device inside the subsystem;
  • the second simulation unit is configured to execute a simulation corresponding to the device control command of the device inside the subsystem Acting, and triggering the coupling condition, performing a corresponding coupling action according to the coupling condition; and a second error management unit, configured to record error information in the subsystem layer simulation process in the form of a log.
  • the system layer processor includes: a system configuration module, where the system configuration module is configured to establish multiple systems in the simulation platform, and generate a system corresponding to the multiple systems a layer configuration file to configure the plurality of systems, wherein each of the systems includes a plurality of subsystems, and the subsystem layer configuration files corresponding to the plurality of systems are loaded to the plurality of systems to configure each The plurality of subsystems in the system; and a system operation module, wherein the system operation module is configured to verify the configured system, and after the verification, perform simulation on the multiple systems.
  • the system layer configuration file includes: a system attribute, where the system attribute includes a system name, system description information, a subsystem attribute inside the system, and a subsystem attribute of the system includes: The name of the subsystem and the equipment within each subsystem; and the coupling relationship between the subsystems.
  • the system configuration module is further configured to add one or more systems to the multiple systems, or delete one or more systems from the multiple systems; In each of the systems One or more of the subsystems are added, or one or more of the subsystems are deleted from the various systems.
  • the system operation module includes: a third verification unit, configured to verify the system configured by the system configuration module; and a third port initialization unit, configured to generate and pass verification The physical port corresponding to the device control command of the device in the subsystem inside the system, checking whether the physical port conflicts, and when checking that the physical port has no conflict, running the subsystem inside the system and the subsystem
  • the internal device, and the physical port is initialized; a third command management unit, configured to receive or send a device control command of a device in a subsystem inside the system; and a third simulation unit, configured to execute The device controls a simulation action corresponding to the command, and triggers a coupling condition between the devices, and performs a corresponding coupling action according to the coupling condition; and a third error management unit is configured to perform a system layer simulation process in the form of a log Error message.
  • the simulation platform for the integrated circuit manufacturing device is a general software simulation platform implemented by Visual Studio 2008 .NET based on the Windows XP operating system.
  • the simulation platform includes a protocol layer processor, a device layer processor, a subsystem layer processor, and a system layer processor.
  • the protocol layer processor may encapsulate the driver of the communication protocol required by the simulation platform, and provide a protocol layer configuration file with the protocol layer configuration content to the device layer, so that the device layer passes the command of the subsystem layer.
  • the communication protocol stipulates that the transceiver mode performs the simulation action, thereby implementing communication with the instrument to be simulated.
  • the device layer processor can complete the configuration of the device, including device attributes, control commands, actions, and internal coupling, and provide the written device layer configuration content device layer configuration file to the subsystem layer for subsystem layer query. And calling, in addition to the management of the device, including adding, deleting, saving and editing devices, and then communicating with the instrument to be simulated through the communication protocol configured by the protocol layer, and performing device layer simulation.
  • the subsystem layer processor can complete the configuration and management of the subsystem, including the properties of the subsystem and the devices inside the subsystem, adding or deleting devices in the subsystem by querying and invoking the device layer configuration file, and allowing the user to combine the devices into Complete subsystems, and management of the coupling relationship between each device within each subsystem, provide subsystem layer configuration files written with subsystem layer configuration content to the system layer for system layer query and call, in the above configuration After completion, the simulation of the subsystem layer is performed.
  • the system layer processor can complete the configuration and management of the system, including the attributes of the system and the subsystems inside the system. By adding and deleting subsystems by querying and calling the subsystem layer configuration file, and supporting the user to combine the subsystems into complete The system, as well as the management of the coupling between the various subsystems within each system, to perform system layer simulation.
  • the simulation platform for the integrated circuit manufacturing device provided by the embodiment of the present invention can flexibly configure the protocol layer, the device layer, the subsystem layer and the system layer of the simulation platform according to different hardware required in different projects and different usage methods of the same hardware. And the simulation platform is accurate, real-time and scalable.
  • FIG. 1 is a schematic structural diagram of a simulation platform for an integrated circuit manufacturing device according to an embodiment of the present invention
  • FIG. 2 is a schematic overall structural diagram of a simulation platform for an integrated circuit manufacturing device according to an embodiment of the present invention. The main interface of the simulation platform for integrated circuit manufacturing equipment;
  • FIG. 4 is a configuration management main interface of a simulation platform for an integrated circuit manufacturing device according to an embodiment of the present invention
  • FIG. 5 is a main operation and operation interface of a simulation platform for an integrated circuit manufacturing device according to an embodiment of the present invention
  • FIG. 7 is a schematic overall structural diagram of a protocol layer according to an embodiment of the present invention.
  • FIG. 9 is a configuration interface of an Ethernet protocol according to an embodiment of the present invention.
  • 10 is a configuration interface of a serial port protocol according to an embodiment of the present invention.
  • 11 is a configuration interface of an analog I/O protocol according to an embodiment of the present invention.
  • FIG. 13 is a flowchart of data unpacking according to an embodiment of the present invention.
  • connection test interface of a protocol running module verification configuration protocol according to an embodiment of the present invention
  • FIG. 16 is a communication flowchart of a simulation platform for an integrated circuit manufacturing device according to an embodiment of the present invention
  • FIG. 17 is a schematic structural diagram of a device layer processor according to an embodiment of the present invention
  • FIG. 18 is a schematic overall structural diagram of a device layer according to an embodiment of the present invention.
  • FIG. 19 is a schematic structural diagram of a device layer according to an embodiment of the present invention.
  • 21 is a hierarchical interface of a Dev i ce according to an embodiment of the present invention.
  • FIG. 22 is an interface for creating a device name and a device type according to an embodiment of the present invention.
  • 24 is a configuration interface of a control command of a device according to an embodiment of the present invention.
  • 25 is a configuration interface of an action name of a device according to an embodiment of the present invention.
  • 26 is a configuration interface of action content of a device according to an embodiment of the present invention.
  • 27 is a configuration interface of an action condition according to an embodiment of the present invention.
  • 29 is a configuration interface of a variation rule according to an embodiment of the present invention.
  • Figure 30 (a) shows a configuration interface in which the variation rule is a user-defined configuration according to an embodiment of the present invention
  • FIG. 30(b) is a configuration interface of a PID change rule according to an embodiment of the present invention.
  • Figure 30 (c) shows a configuration interface of a change rule of P I according to an embodiment of the present invention
  • FIG. 30( d ) is a configuration interface whose change rule is a direct assignment according to an embodiment of the present invention
  • FIG. 31 is a configuration interface of returning information according to an embodiment of the present invention
  • 33 is a configuration interface of coupling conditions inside a device according to an embodiment of the present invention.
  • FIG. 34 is a schematic structural diagram of a device running module according to an embodiment of the present invention.
  • FIG. 35 is a configuration interface of a physical interface according to an embodiment of the present invention.
  • 36 is a flowchart of a device operation module according to an embodiment of the present invention.
  • 38 is a schematic structural diagram of a subsystem layer processor according to an embodiment of the present invention.
  • 39 is a general architectural diagram of a subsystem layer according to an embodiment of the present invention.
  • FIG. 40 is a class diagram of a subsystem layer according to an embodiment of the present invention.
  • 41 is a flowchart of configuration management of a subsystem configuration module according to an embodiment of the present invention.
  • 43 is a creation interface of a subsystem according to an embodiment of the present invention.
  • 45 is a configuration interface of coupling conditions between devices according to an embodiment of the present invention.
  • FIG. 46 is a configuration diagram of a coupling relationship name between devices according to an embodiment of the present invention.
  • FIG. 47 is a configuration interface of a coupling action between devices according to an embodiment of the present invention.
  • FIG. 48 is a configuration interface of delay of a coupling action according to an embodiment of the present invention.
  • 49 is a configuration interface of device behavior of a coupling action according to an embodiment of the present invention.
  • FIG. 50 is a configuration interface of a coupling action condition according to an embodiment of the present invention.
  • 51 is a schematic structural diagram of a subsystem operation module according to an embodiment of the present invention.
  • 53 is an operation management interface of a subsystem running module according to an embodiment of the present invention.
  • FIG. 54 is a schematic structural diagram of a system layer processor according to an embodiment of the present invention.
  • Figure 55 is a diagram showing the overall architecture of a system layer according to an embodiment of the present invention.
  • Figure 56 is a diagram showing the class structure of a system layer according to an embodiment of the present invention.
  • 57 is a flowchart of configuration management of a system configuration module according to an embodiment of the present invention.
  • FIG. 58 is a system hierarchical management interface according to an embodiment of the present invention.
  • FIG. 59 is a system creation interface according to an embodiment of the present invention.
  • 60 is an interface for adding a subsystem to a system according to an embodiment of the present invention.
  • 61 is a schematic structural diagram of a system operation module according to an embodiment of the present invention.
  • 62 is a flowchart of operation of a system operation module according to an embodiment of the present invention.
  • FIG. 63 is an operation management interface of a system operation module according to an embodiment of the present invention.
  • FIG. 64 is a flowchart of operation of a simulation platform for an integrated circuit manufacturing device according to an embodiment of the present invention. detailed description
  • FIG. 1 is a schematic structural diagram of a simulation platform for an integrated circuit manufacturing apparatus according to an embodiment of the present invention.
  • the simulation platform for integrated circuit manufacturing equipment includes a plurality of instruments to be simulated, a plurality of boards, and a simulation computer. Wherein each board comprises a plurality of channels, each channel being connected to a pin of one of the plurality of simulation instruments.
  • the simulation computer communicates with multiple instruments to be simulated through multiple boards to simulate multiple instruments to be simulated.
  • the emulation computer includes a protocol layer processor 1000, a device layer processor 2000, a subsystem layer processor 3000, and a system layer processor 4000.
  • the protocol layer processor 1000 is configured to establish multiple communication protocols in the simulation platform, and generate a protocol layer configuration file corresponding to multiple communication protocols, and multiple communication protocols completed according to the foregoing configuration pass multiple boards and multiple
  • the simulation device performs communication;
  • the device layer processor 2000 is configured to establish a plurality of devices in the simulation platform, and generate a device layer configuration file corresponding to the plurality of devices, and load the protocol layer processor 1000 according to the established multiple devices.
  • a protocol layer configuration file corresponding to multiple devices, and each device is managed and simulated at the device layer.
  • the device layer configuration file includes the device name and type, device attributes, device control commands, device actions, and internal coupling relationships;
  • the subsystem layer processor 3000 is configured to establish a plurality of subsystems in the simulation platform, and generate subsystem layer configuration files corresponding to the plurality of subsystems, wherein each subsystem includes one or more established in the device layer processor 2000.
  • Device and loaded from device layer processor 20 according to multiple subsystems established 00 device layer configuration file corresponding to devices in multiple subsystems, and management and subsystem layer simulation of each subsystem and devices in each subsystem, wherein the subsystem layer configuration file includes subsystem attributes and subsystem internals Device attributes, coupling conditions between devices, and coupling relationships between devices; system layer processor 4000 is used to establish multiple systems in the simulation platform, and generate system layer configuration files corresponding to multiple systems, where each system Include one or more subsystems established in the subsystem layer processor 3000, and load subsystem subsystem profiles corresponding to subsystems of the plurality of systems from the subsystem layer processor 3000 according to the established multiple systems, The management and system layer simulations are performed for each system and subsystems in each system.
  • the subsystem layer configuration file includes subsystem attributes and subsystem internals Device attributes, coupling conditions between devices, and coupling relationships between devices
  • system layer processor 4000 is used to establish multiple systems in the simulation platform, and generate system layer configuration files corresponding to multiple systems, where each system Include one or more sub
  • the system layer configuration files include system attributes, subsystem attributes within the system, and coupling relationships between subsystems.
  • the protocol layer configuration file, the device layer configuration file, the subsystem layer configuration file, and the system layer configuration file are all saved in the XML (Extens ens i b l e Markup Language) file format.
  • the system layer, the subsystem layer, the device layer, and the protocol layer are configured and managed by using a visual user operation interface, and the layer-by-layer query and call configuration files are performed through the system layer, the subsystem layer, the device layer, and the protocol layer. And transmitting and receiving control commands to realize communication between the simulation platform and the instrument to be simulated, and then perform corresponding simulation actions.
  • the user creates a new project on the main interface of the simulation platform of the embodiment of the present invention, and then creates components required for each layer, including protocols, devices, subsystems, and systems, and components. Configuration properties and commands corresponding to the interface.
  • Figure 4 shows the main interface of the configuration management (Conf ig ) of the simulation platform.
  • the user can configure the properties of each component by obtaining the default values (preset values) of the corresponding components of each layer, and then displaying them on the operation interface. After modifying the properties on the operation interface, the property change values of the corresponding components are updated into the XML file and saved. After the configuration of the simulation platform is completed, verify the correctness of the configuration, that is, verify whether the configured components can communicate with the instrument to be simulated, and perform simulation running after the verification configuration is correct.
  • Figure 5 shows the main interface of the operation and management of the simulation platform.
  • protocol layer processor 1000 the device layer processor 2000, the subsystem layer processor 3000, and the system layer processor 4000 are described in detail below in conjunction with specific embodiments.
  • the protocol layer processor 1000 includes a protocol configuration module 1100 and a protocol execution module 1200.
  • the protocol configuration module 1100 is configured to establish multiple communication protocols in the simulation platform, and generate a protocol layer configuration file corresponding to the multiple communication protocols, so that the simulation platform can pass the board and the device to be simulated according to the configured communication protocol.
  • the protocol running module 1200 is configured to perform a connection test on the communication protocol configured by the protocol configuration module 1100, thereby verifying whether communication with the instrument to be simulated can be achieved through the communication protocol. When the communication with the instrument to be simulated can be realized by verification, that is, according to the communication protocol, the protocol to be simulated can be communicated with the protocol to be simulated.
  • the protocol layer configuration module 1100 can configure and manage protocols for the protocol layer, including creating one or more protocols, saving one or more protocols, or deleting one or more protocols from multiple protocols.
  • the protocol layer configuration module 1100 configures a communication protocol to the simulation platform by generating a protocol layer configuration file.
  • the protocol layer configuration file includes a protocol type and a protocol format of one or more communication protocols.
  • protocol types may include Ethernet protocols, serial protocols, analog 10 protocols, digital 10 protocols, and DeviceNet protocols. Since the simulation platform provides a unified calling interface to the outside, a communication base class derives four communication subclasses, and the base class provides a unified interface, and the subclass provides a specific communication mode implementation method.
  • the direct I/O (Direct-IO) class is responsible for the management of the above two communication interfaces; the serial port Serialport implements the communication management of the serial protocol.
  • Ethernet class realizes communication management of Ethernet protocol
  • DeviceNet implements communication management of DeviceNet protocol
  • management of the above four communication interface classes is realized by communication management class.
  • the call to the communication interface relative to the upper layer of the protocol layer (such as the device layer, subsystem layer or system layer) only needs to apply to the communication interface management class.
  • the protocol configuration module 1100 can configure all communication parameters except the physical port to the DeviceNet interface.
  • the DeviceNet class will open a thread to process the received data after receiving the data, and the receiving data thread will continue to listen to the port, ready to receive new data. Since a device monopolizes a physical port, the thread is no longer opened during the process of sending data, and the transmission process is controlled within a single device, and no two data are simultaneously transmitted. Among them, the DeviceNet protocol uses a unified protocol format, so no custom protocol format is required.
  • the protocol configuration module 1100 can configure a user-defined command format for the Ethernet interface.
  • the Ethernet class (the Ethernet class) will open a thread after receiving the data. The received data is processed, and the receiving data thread continues to listen to the port, ready to receive new data. Since a device monopolizes a port, the process of sending data no longer turns on the thread, and the single device internally controls the sending process so that no two data are simultaneously transmitted.
  • the protocol configuration module 11 00 can configure the baud rate, stop bit, handshake signal, data bit, and check mode of the serial port.
  • the serial port class (Ser i a l por t ) will open a thread to process the received data after receiving the data, and the receiving data thread will continue to listen to the serial port, ready to receive new data. Since a device monopolizes a port, the process of sending data no longer turns on the thread, and the single device internally controls the sending process, so that no two data are simultaneously transmitted.
  • the simulation platform of the embodiment of the present invention uses the analog 10 board, and can set the level range of each channel of the analog 10 and the corresponding relationship between the analog 10 channel and the actual physical channel.
  • this data changes compared with the previous data, it means that new data comes, and the new layer needs to be transmitted to the upper layer (such as device layer, subsystem layer or system layer).
  • the data Since the data received by the analog 10-port is analog, it is judged whether the two data are consistent according to the error of the two data before and after. If the error of the two data before and after exceeds a certain range, it means that new data comes.
  • the analog 10 protocol uses a unified protocol format, so there is no need to customize the protocol format.
  • the simulation platform of the embodiment of the present invention uses a digital 10 card to set the high and low range of the digital 10 and the corresponding relationship between the 10 channels and the actual physical channel.
  • each thread of the number 10 is responsible for one board channel.
  • the digital 10 protocol uses a unified protocol format, so no custom protocol format is required.
  • the communication protocols used in the same instant are the same, but the protocol formats of each device are different from each other, so the configuration process of the Ethernet protocol and the serial port protocol is performed. In the middle, you need to customize the protocol format.
  • the protocol format of the communication protocol can be divided into three types of fields according to its function:
  • the command name is mainly used to identify a command, which is equivalent to the name of the command. By distinguishing the command field, different commands are distinguished.
  • the command is a command for interaction between the instrument to be simulated and the simulation computer.
  • Attribute parameters are mainly used to represent the value or name of an attribute.
  • the instrument to be simulated sends a parameter query command to the simulation computer, it is necessary to use the field of the type to indicate the name of the attribute parameter to be queried.
  • the simulation computer returns a value to a parameter of the instrument to be simulated or the instrument to be simulated sets an attribute parameter to the simulation computer
  • the attribute parameter is required to represent the specific value of the parameter.
  • the protocol layer processor 1000 further includes a protocol encapsulation module 1300.
  • the protocol encapsulation module 1300 includes a data unpacking interface and a data encapsulation interface.
  • the data unpacking interface and the data packet interface are used to perform unpacking operations and packet operations on the data transmitted between the simulation computer and the instrument to be simulated.
  • the process of performing data unpacking through the data unpacking interface includes the following steps:
  • the S1301 emulation side receives the data, ie the data sent from the board to the emulation computer.
  • S1302 converts a string into a character array
  • S1309 determines whether there is still a protocol field not processed, if yes, execute S1303; if not, execute S1310;
  • the S1310 unpacking process ends.
  • the data unpacking interface parses out the command name of the data and the parameters and control information of the command. Among them, since the Boolean communication protocol and the numeric communication protocol format have only one field, one byte, the parameters carried by the name and the command all refer to one byte of data.
  • the process of performing data encapsulation through the data encapsulation interface includes the following steps:
  • the emulation computer sends data, that is, sends data from the emulation computer to the board.
  • the data packet process In the data packet process, according to the content of the protocol format, fill in the command name in the command name field, in the parameter The field fills in the parameter value, the checksum field is calculated in the checksum field, and the data is sent as string type data. If it is a Boolean communication protocol or a numerical communication protocol, it is not necessary to perform complicated operations, and it is only necessary to judge whether the data to be transmitted is 1 or 0, thereby directly transmitting 1 or 0 to the 10 port.
  • the protocol layer When creating a protocol configuration communication parameter, the protocol layer does not give the configuration content of the physical port. Because a device may have multiple communication methods, it will be done in different communication modes when receiving commands. To differentiate, the emulation platform configures the physical port only when devices are added at the subsystem level.
  • the protocol layer configuration file saves the protocol data in an XML format.
  • the emulation platform uses XML files to store protocol data, so that when the user needs the protocol, the XML file can be directly read, which is convenient to operate.
  • the protocol operation module 1200 needs to perform a connection test on the communication protocol to verify the communication protocol.
  • Figure 15 shows the connection test interface of the protocol running module. When there is data transmission between the simulation computer and the instrument to be simulated, it means that the communication protocol is verified.
  • the verified communication protocol allows communication with a plurality of instruments to be simulated in accordance with the protocol format of the communication protocol.
  • the simulation platform communicates with the instrument to be simulated through the physical port, and includes the following steps: S1601: Initialize the communication port;
  • S1603 Detect whether data is received, if it receives data, execute S1604; otherwise, execute S1605;
  • S1605 Waiting for a predetermined time, in an embodiment of the present invention, the predetermined time may be 50 milliseconds; S1606: determining whether to close the port, if it is determined to close the port, executing S1607; otherwise, executing S1603;
  • the protocol layer processor 1000 of the embodiment of the present invention can configure a communication protocol required by the simulation platform, and can further provide a protocol layer configuration file written with protocol layer configuration content to the device layer, so that the device layer receives the subsystem.
  • the communication protocol is specified by the communication protocol to perform the simulation operation, thereby implementing communication with the instrument to be simulated.
  • the device layer processor 2000 includes a device configuration module 2100 and a device operation module 2200.
  • the device configuration module 21 00 is configured to establish multiple devices in the simulation platform, and generate a device layer configuration file corresponding to the multiple devices to configure the established multiple devices, and configure the protocol layer processor 1000.
  • the layer profile is correspondingly loaded to a plurality of configured devices such that each device can communicate with the instrument to be simulated through a communication protocol configured in the protocol layer configuration file.
  • the device operation module 22 00 is used to verify the configured device, that is, whether the device can communicate with the instrument to be simulated. When the device is verified, it can communicate with the instrument to be simulated and simulate the device layer.
  • Figure 18 shows an overall architectural diagram of the device layer.
  • the device layer configuration module 2100 can configure and manage devices at the device layer, including creating one or more devices, saving devices, deleting one or more devices from multiple devices, or opening one or more devices.
  • the device layer configuration module 2100 configures multiple devices by generating a device layer configuration file.
  • the device layer configuration file includes the name and type of the device, device attributes, device control commands, device actions, and coupling relationships within the device.
  • the device attributes include the attribute name of the device, the attribute type of the device, the maximum value of the device, the minimum value of the device, and the default value of the device.
  • the device control command includes the name of the device control command and the device control command.
  • the device action types include command behavior, action condition, delay wait, change rule, and return information.
  • the internal coupling relationship of the device includes a device name, a coupling attribute name, a coupling condition, and a coupling relationship command corresponding to the coupling condition.
  • the device layer configuration file may save the data in an XML format.
  • the device layer configuration module 2100 configuration management flow will be described below with reference to FIG.
  • the Device information tree consists of the Device node and the Action leaf, Command, and Property leaf nodes.
  • a Device can contain any Action (Action), Command (Control) and Property leaf nodes, and the Action, Command, and Property nodes must belong to a Device ( Equipment) Node.
  • the device configuration module 2100 creates the name and type of the device, it has the following functions: Add: Create the device name and the type of the device.
  • Delete The added device name and type can be deleted from the device name list.
  • Save Save the device name and type as an XML file for easy reading.
  • the device configuration module 2100 selects the device that needs to be configured according to the created device list.
  • the device configuration module 2100 creates the device attribute, it has the following functions:
  • the configured device attribute contents include attribute name, attribute type (for example: int, string, etc.), attribute maximum (optional), attribute minimum (optional), and attribute default (initial) value.
  • the added device properties can be removed from the device properties list.
  • Save Save the device properties as an XML file for easy reading.
  • the type of device attribute includes a Boolean type or a numeric type, and the like. Then fill in the maximum, minimum and default initial values of the attribute in the text box below. If there is no maximum, minimum or default initial value for the attribute, the value that does not exist is allowed to be null.
  • click Add to add the device properties to the list on the right.
  • the device configuration module 2100 selects the device that needs to be configured with the control command.
  • the device configuration module 2100 has the following functions when creating the device control command:
  • the command direction includes receiving, sending, and sending to itself. Wherein, when the command direction is sent to itself, in order to trigger the in-device coupling.
  • the contents of the command added include the protocol name, protocol address range, protocol address, command description, number of command attributes, and device attributes in the specified command.
  • the protocol and the control command have a one-to-one correspondence, that is, one control command corresponds to one protocol format.
  • the protocol name can be selected from various protocols created when the protocol is configured.
  • Protocol address range When the protocol is serial port and TCP/IP protocol, since the protocol layer encapsulates the protocol format for the two types of protocols, there may be multiple segments of the String type protocol field. Therefore, it is necessary to specify which segment of the field the command belongs to. Field. In one embodiment of the invention, the protocol address range is optional.
  • Protocol Address Used to specify the physical address or port number to which the control command is sent.
  • Number of command attributes The number of device attributes carried by this control command.
  • Specify the device attribute in the command Used to specify the device attribute carried in the control command.
  • the control device has three device attributes, and specifies the attribute contents of the three device attributes.
  • the added device command can be deleted from the device command list.
  • Save Save the device command as an XML file.
  • the first step fill in the command name corresponding to the command name in the text box corresponding to CommandName, select the sending direction of the control command in the drop-down menu corresponding to CommandDirection (ie, judge the control command to send or receive), and then in CommandNote Fill in a brief description of the control command.
  • the protocol name to be used by the control command in the ProtocolName drop-down option.
  • Fill in the name in the text box corresponding to ParameterNumber To make the number of parameters, click OK and then click OK. Then in the table below, the filled number of columns will be automatically generated.
  • Each column represents a parameter, and then there will be a drop-down menu below each parameter.
  • the option is all the attribute names configured before, after selecting the corresponding attribute name, click Add to add the attribute name to the list on the right. In the list on the right, you can edit and delete the added options. Click OK when the configuration is complete to return to the device configuration management interface. If you need to edit and delete later, you can repeat the above actions.
  • the device configuration module 2100 creates device actions including the following functions:
  • Figure 25 shows the configuration interface of the device action name.
  • the first page is the ActionManager page that creates the action name
  • the other page is the ActionEdit page that sets the action content. You need to create the action name on the ActionManager page before setting the content for each new action in the ActionEdit page.
  • the device action types include Command Behavior, Condition, WaitTime, VariationalRule, and Return Info.
  • the first step is to select the name of the action created before in the drop-down menu corresponding to ActionName.
  • the second step select the name of the previously created command in the drop-down menu corresponding to CommandName.
  • the third step the text box corresponding to the Number of Steps is filled in the number of action types executed by the action after receiving the specified command, and the fourth step is to configure the action type to be executed in order, first In the drop-down menu corresponding to Step No., select the Step corresponding to the quantity filled in the third step to configure. For example, if you fill in 3 in the third step, it means that you need to perform 3 types of actions, then Step 1 to Step 3 appear in the drop-down menu corresponding to SepNo. For example, if you select Stepl, you can configure the action type for this step below.
  • the configuration of the device action is as follows:
  • Configure command behavior This action type is to assign a device attribute to the specified command when the device command is configured.
  • click Command Behavior to execute the parameters passed in the command corresponding to the corresponding device attributes configured in the previous step, that is, the function in Step3 to set and edit the communication protocol used by the device.
  • the action type is to perform the next step when determining what the device attribute meets. Wherein, the determined action conditions can be combined, and the action to be performed can be selected after the judgment. For example: When the flow rate of the device MFC is greater than 1000, perform one step, otherwise perform another step.
  • the configuration includes: device attributes (selected according to the created device attribute list), conditional judgment (including greater than, less than, judge whether the two are equal, less than or equal to, greater than or equal to), attribute value (the attribute value requires the user) Specify), logical relationship (and, or, XOR), so that many conditional judgments can be combined into one conditional judgment. New action conditions are added to the action condition list.
  • a pop-up interface will be displayed for the user to customize, as shown in Figure 27.
  • Step box select the execution action type after determining the condition in the drop-down menu corresponding to NextStep, and select another execution action type after the judgment condition in the drop-down menu corresponding to NextStep in the Else Step box (both are allowed to be empty) ). For example, if the action of waiting is satisfied under the condition that the pressure is greater than or equal to 0.6, select 3-WaitTime in the Then Step box; otherwise, execute the return command action, and in the Else Ste box, select the return information (Return Info). Then click the Add button to add to the list on the right, corresponding to the judgment conditions defined above. In the list on the right, you can edit and delete the added options. Click OK when the configuration is complete to return to the device action configuration interface. If you need to edit and delete later, you can repeat the above actions.
  • Configure delay wait This action type is the execution time waiting for the corresponding time.
  • the configuration includes: wait time and the next step.
  • the waiting time is how long it needs to be executed, and the unit is ms.
  • the next step is to pick the next step.
  • the wait time configuration interface shown in Figure 28
  • Click OK after the configuration is complete to return to the device action configuration interface.
  • the delay time can be given by the designer with reference to the actual device.
  • Configuration change rule This action type is used to specify the change rule of device attributes.
  • the configuration includes: device attributes (selected according to the created device attribute list), change rules, custom change rules interface, and next steps.
  • the change rules include PID, PI, direct assignment and customization, which are selected by the user.
  • Custom Change Rule The interface is used to let the user define the change rules of the attribute. The next step is to pick the next step.
  • Figure 29 shown). As shown in Figure 29, select the parameter name to be changed in the Property drop-down option, and select the change rule of the parameter (such as PID, PI, user-defined and direct assignment) in the drop-down menu corresponding to VariationalRule.
  • Configuration return information This action type specifies the return information of the device to the instrument to be simulated.
  • the configuration includes: Command name (selected according to the return type in the created device command list), Protocol name (meaning the same as the configuration command, selected according to the created protocol list), Set the attributes of the command (set the return information Device properties), the next step (select the next step).
  • Delete The added content can be deleted in the device action name list, action condition list, and device action list. Save: Save the device action as an XML file.
  • Device Configuration Module 2100 Configuring the internal coupling relationship of the device includes the following functions:
  • Add Create a device internal match. Edit: You can edit any of the device's internal coupling relationships after the creation is complete. Delete: The added device internal coupling can be removed from the device's internal coupling list.
  • Save Save the internal coupling relationship of the device into an XML file for easy reading by the user.
  • a single coupling condition or a plurality of coupling conditions are first determined.
  • a judgment condition is added when there are a plurality of coupling conditions.
  • select the previously configured device attribute from the drop-down menu corresponding to the Property and select the relationship with the following values in the drop-down menu corresponding to the Relationship, including greater than, less than, equal to, greater than or equal to Less than or equal to 5 types. Then enter the value associated with the attribute in the text box corresponding to Value. For example, when the pressure is greater than 0.5, select the pressure in Property, select Greater in Relationship, and fill in 0.5 in Value.
  • the configured device parameters are first monitored, and the value is judged whether the coupling condition is satisfied.
  • the coupling relationship command is triggered, and the coupling relationship command is transmitted to the device running module 2200 as an internal message delivery interface to perform the corresponding device behavior action.
  • the device execution module 2200 performs simulation of the device layer based on the configuration of the device configuration module 2100.
  • the device running module 2200 includes a first verification unit 2201, where the first verification unit 2201 is configured to verify the device configured by the device configuration module 2100.
  • the first port initialization unit 2202 is configured to generate and The physical port corresponding to the device control command of the device is verified, and the physical port is checked for conflict. When the physical port is in conflict, the physical port is initialized.
  • the first command management unit 2203 is configured to send or receive a device control command.
  • the first simulation unit 2204 is configured to execute a simulation action corresponding to the device control command; and the first error management unit 2205 is configured to record error information in the device layer simulation process in the form of a log.
  • the first verification unit 2201 needs to verify the configured device.
  • the user needs to add the communication physical port of the device, as shown in Figure 35, because the device's rec command uses TCP/IP. Protocol, so you need to fill in the physical port information of TCP/IP.
  • the verified device can communicate with the instrument to be simulated through the physical port, it indicates that the device passes the verification.
  • the device execution module 2200 can receive and send commands and perform related actions.
  • the device execution module 2200 performs simulation of the device layer, including the device receiving the data and performing corresponding actions, changing the parameter values of the device, and the system interface (shown in FIG. 37) dynamically displaying the parameters of the device in the form of a table.
  • the value includes the following steps:
  • S3602 Detect whether the physical ports conflict. When detecting physical port conflicts, execute S3610 to end the simulation; otherwise, execute S3603;
  • S3606 The port receives the data, triggering an event
  • S3608 Determine whether to end the simulation. If it is judged to continue the simulation, execute S3609; otherwise, execute S3610;
  • Figure 37 shows the operation management interface of the device running module 2200.
  • the device running module 2200 performs the device layer simulation, all the parameter information of the device configuration is listed in the table on the right, and the state of the parameters can be refreshed in time, and the log information on the right side is continuously displayed and sent. Information and error logs. Similarly, if you need to stop or exit the device, right-click on the relevant menu.
  • the embodiment of the present invention provides that the device layer processor can complete the configuration of the device, including the attributes, control commands, actions, and internal couplings of the device, and provides the device layer configuration content device layer configuration file to the subsystem layer. It can be queried and invoked by the subsystem layer, and can also complete the management of the device, including adding, deleting, saving and editing devices, and then communicating with the instrument to be simulated through the communication protocol configured by the protocol layer, and performing device layer simulation. .
  • the subsystem layer processor 3000 includes a subsystem configuration module 3100 and a subsystem operation module 3200.
  • the subsystem configuration module 3100 is configured to establish one or more subsystems in the simulation platform, and generate a subsystem layer configuration file corresponding to the one or more subsystems to configure one or more subsystems to the subsystem layer, where Each subsystem includes one or more devices that load device layer configuration files for device layer configuration module 2100 to one or more subsystems to configure devices in each subsystem.
  • the subsystem running module 3200 is used to verify the configured subsystem, that is, whether the subsystem can communicate with the instrument to be simulated. After verification, the subsystem layer is simulated.
  • Figure 39 shows an overall architectural diagram of the subsystem layer.
  • the subsystem layer configuration module 3100 can manage multiple subsystems and devices inside each subsystem, including adding one or more subsystems to multiple subsystems, and deleting In addition to one or more subsystems or save save subsystems, one or more devices created and configured by device layer processor 2000 are added or deleted to the various subsystems to be combined into a complete subsystem.
  • the subsystem layer configuration module 3100 is configured with multiple subsystems by generating a subsystem layer configuration file. As shown in FIG.
  • the subsystem layer configuration file includes: a subsystem attribute, including a subsystem attribute name; a device attribute inside the subsystem, including a device name, a device type, and a physical port; and a coupling condition between devices, Including the name of the coupling device, the coupling condition and the command to trigger the coupling; the coupling relationship between the devices, the coupling action between the devices, the name of the coupling device, the number of steps of the coupling action, and the type of coupling action corresponding to each step, wherein the coupling action type includes Device behavior, coupled action conditions, and delays in coupled actions.
  • the subsystem layer configuration file can save data in an XML format. Since multiple devices in the subsystem are established and configured for the device layer processor 2000, most of the content in the subsystem layer configuration file is the content of the device layer, and the coupling conditions and relationships between the communication physical interface and the device.
  • the configuration management process of the subsystem configuration module 3100 is described below with reference to FIG. 41, including the following steps: S4101: Entering the subsystem layer;
  • the Subsystem information tree consists of a Subsystem node and a leaf node containing the device name.
  • a subsystem can contain any leaf node containing the device name, and the device name node must belong to a certain node. Subsystem nodes.
  • the subsystem configuration module 3100 configures the subsystem name to include the following functions:
  • the added subsystem name can be removed from the list of subsystem names.
  • Save Save the subsystem name as an XML file for easy reading by the user.
  • the subsystem configuration module 3100 adds devices to the subsystem including the following functions:
  • Add Add a device inside the subsystem by loading the device layer configuration file.
  • the device is first named because the device with the same device name and different internal logic may appear, so the device name corresponds to the base class to which it belongs. Because the same device may have multiple communication protocols, different communication protocols have different command formats to send to the emulation platform, and all commands of the device need to be bound to the physical port of the actual communication protocol.
  • the added device name can be deleted from the device name list.
  • Save Save the device name as an XML file for easy reading by the user.
  • S4106 Create a coupling relationship list; After adding devices to the subsystem, you need to manage the coupling relationship between the devices.
  • the coupling relationship between the device and the coupling relationship between the devices are respectively implemented at the device layer and the subsystem layer.
  • the coupling relationship between the triggering devices includes two ways: First, when the attribute of a certain device reaches a critical value, the coupling action of another device is triggered, and the coupling condition between the devices is required to be customized. Secondly, when the device receives a certain command, it directly triggers the coupling action of another device or determines whether certain attributes of the current device satisfy the condition and then trigger the coupling action of the other device. Since the method of triggering the coupling condition is implemented by another device transmitting the configured command through the internal messaging interface, it is necessary to define a coupling command corresponding to the coupling action by the user, that is, to configure the coupling relationship between the devices.
  • the subsystem configuration module 3100 configures coupling conditions between devices, including:
  • the added inter-device coupling conditions can be removed from the list of coupling conditions between devices.
  • the number of steps in the action is set, and the coupling action is refined into multiple steps, each of which corresponds to a type of coupled action.
  • the types of coupling actions include: device behavior, coupled action conditions, and delays of coupled actions.
  • Configure Delay Waiting This action type waits for the corresponding time to execute the simulation action.
  • the configuration includes: wait time and the next step.
  • the waiting time is how long it needs to be executed, and the unit is milliseconds. In one embodiment of the invention, the latency may be 120 milliseconds.
  • the next step is to pick the next step. As shown in Figure 47, select the delay button, and the configuration interface shown in Figure 48 pops up, setting the delay time in milliseconds.
  • Configure device behavior This action type is the behavior of directly executing the specified device. As shown in Figure 47, select the Execute Action button, and the configuration interface shown in Figure 49 pops up to perform the coupling action of the device. Select the device, select the action of the device, click the OK button to exit the setting interface, and click the cancel button to cancel the setting.
  • the action type is to perform the next step when determining what the device attribute meets.
  • the conditions in which the judgment is made may be combined. After the judgment, select the action to be performed. For example: When the flow rate of the device MFC is greater than 1000, do not know, otherwise perform another step.
  • the configuration includes: device attributes, where the device attributes are selected according to the created device attribute list; conditional judgments, including greater than, less than, equal to, less than or equal to, greater than or equal to; attribute values, the attribute values require user designation; Relationships, including and, or, or XOR, can combine many conditional judgments into one conditional judgment. New action conditions are added to the action condition list.
  • the condition judgment button is selected, and the configuration interface as shown in Fig. 50 is popped up, and the condition judgment action is set. Select the device, device parameters, and coupling conditions. According to the true and false of the coupling condition, the corresponding steps are performed. When coupled to the list on the right, click the OK button to exit the device page and click the Cancel button to cancel this setting.
  • Delete can be deleted in the list of coupled action names and action conditions
  • the subsystem operation module 3200 includes a second verification unit 3201, a second port initialization unit 3202, a second command management unit 3203, a second simulation unit 3204, and a second error management unit 3205.
  • the second verification unit 3201 is configured to verify the subsystem configured by the subsystem configuration module 3100; the second port initialization unit 3202 is configured to generate a physical port corresponding to the device control command of the device inside the verified subsystem.
  • the second command management unit 3203 is configured to receive or send the device control command of the device inside the subsystem;
  • the second simulation unit 3204 is configured to execute a simulation action corresponding to the device control command, and trigger a coupling condition, and perform a corresponding coupling action according to the coupling condition;
  • the second error management unit 3205 is configured to record the subsystem layer in the process of the log layer simulation process. Error message.
  • the second verification unit 3201 needs to verify the configured subsystem, that is, whether the configured subsystem can communicate with the instrument to be simulated through the physical port. If the verification is passed, that is, the subsystem can communicate with the instrument to be simulated, the subsystem operation module 3200 begins to perform the simulation of the subsystem layer.
  • the subsystem running module 3200 performs the simulation of the subsystem layer including the following steps:
  • S5202 detects whether the physical ports conflict, if the conflict occurs, execute S5210; otherwise, execute S5203;
  • S5203 runs equipment inside the subsystem
  • the S5204 device port is initialized.
  • the S5205 binds the port to receive data delegation.
  • S5206 triggering event to perform coupling action processing
  • S5208 Determine whether to end the simulation, if it is judged to end the simulation, execute 5210; otherwise, execute S5209;
  • a window pops up prompting the user to start the subsystem, and can receive and send commands and perform related actions, and the subsystem is listed in the table on the right. All the equipment and all the parameter information of the device configuration can refresh the status of these parameters in time, and the log information on the right will continuously display the received and sent information and the error log, which is determined by the second error management unit. 3205 is recorded in the form of a log.
  • the subsystem layer processor 3000 of the embodiment of the present invention can complete the configuration and management of the subsystem, including the attributes of the subsystem and the devices inside the subsystem, adding or deleting devices in the subsystem by querying and calling the device layer configuration file, and Support users to combine devices into complete subsystems, and manage the coupling relationship between each device inside each subsystem, and provide subsystem layer configuration files written with subsystem layer configuration content to the system layer for system layer query And call, after the above configuration is completed, perform the simulation of the subsystem layer.
  • the system layer processor 4000 includes a system configuration module 4100, configured to establish multiple systems in the simulation platform, and generate system layer configuration files corresponding to multiple systems to configure multiple systems, where each The system includes one or more subsystems, and the subsystem layer configuration file of the subsystem configuration module 3100 is loaded into multiple systems to configure subsystems in each system; the system operation module 4200 is configured to verify the configured system, Simulate the system through verification.
  • a system configuration module 4100 configured to establish multiple systems in the simulation platform, and generate system layer configuration files corresponding to multiple systems to configure multiple systems, where each The system includes one or more subsystems, and the subsystem layer configuration file of the subsystem configuration module 3100 is loaded into multiple systems to configure subsystems in each system; the system operation module 4200 is configured to verify the configured system, Simulate the system through verification.
  • Figure 55 shows an overall architectural diagram of the system layer.
  • the system configuration module 4100 can manage multiple systems and subsystems within each system, including adding one or more systems to multiple systems, deleting one or more systems from multiple systems, saving, and then to each system.
  • One or more subsystems established and configured by subsystem layer processor 3000 are added or deleted to be combined into a complete system.
  • the system configuration module 4100 configures a plurality of systems by generating a system layer configuration file.
  • the system layer configuration file includes: system attributes, including system name and system description information; subsystem attributes inside the system, including the name of the subsystem and the devices inside each subsystem, including the attributes of the device and the attributes of the protocol corresponding to the device. ; and the coupling relationship with the subsystem.
  • the system layer configuration file can save data in an XML format.
  • the system configuration module 4100 performs a system layer configuration management process, which includes the following steps: S5701: Enter the system layer;
  • the System information tree consists of a system node and a leaf node containing the device name.
  • a system can contain any leaf node containing the device name, and the device name node must belong to a system node.
  • Figure 59 shows the interface for creating a system.
  • the system configuration module 4200 creates a system including the following functions: Add: Create a system name.
  • Delete The added system name can be deleted from the system name list.
  • Save Save the system name as an XML file for easy reading by the user.
  • S5703 judging whether to edit the system, if it is judged to edit the system, executing S5702; otherwise, executing S5704; S5704: saving the system;
  • System Configuration Module The 4200 Add Subsystem includes the following features:
  • Add Add the subsystem to which the system belongs.
  • the sub-systems created previously are listed for user selection by loading the subsystem layer configuration file, and the selected ones are added to the created system.
  • the added subsystem name can be removed from the list of subsystem names.
  • Save Save the list of subsystem classes as an XML file for easy reading by the user.
  • the system operation module 4200 includes a third verification unit 4201, wherein the third verification unit 4201 is configured to verify the system configured by the system configuration module 4100; the third port initialization unit 4202, wherein the third port initialization unit 4202 is used to generate a physical port corresponding to the device control command of the device in the subsystem inside the system, and check whether the physical port conflicts.
  • the third verification unit 4201 is configured to verify the system configured by the system configuration module 4100
  • the third port initialization unit 4202 wherein the third port initialization unit 4202 is used to generate a physical port corresponding to the device control command of the device in the subsystem inside the system, and check whether the physical port conflicts.
  • the third command management unit 4203 wherein the third command management unit 4203 is configured to receive or send a device control command of the device in the subsystem inside the system
  • the third simulation unit 4204 wherein the third simulation The unit 4204 is configured to execute a simulation action corresponding to the device control command, and trigger a coupling condition between the devices, and perform a corresponding coupling action according to the coupling condition
  • a third error management unit 4205 wherein the third error management unit 4205 is configured to log Formal system layer simulation process error Information.
  • the third verification unit 4201 needs to verify the configured system, that is, whether the configured system can communicate with the instrument to be simulated through the physical port.
  • the system operation module 4200 can begin to perform simulation of the system layer.
  • S6202 Check whether the physical ports are in conflict. If the physical port conflict is determined, execute S6211; otherwise, execute S6203.
  • S6206 The port receives the data and triggers the event.
  • S6207 parsing the data and performing a coupling action;
  • S6209 Determine whether to end the simulation. If it is judged to end the simulation, execute S6211; otherwise, execute S6210; S6210: continue to wait for receiving data;
  • the 4200 operation simulation mainly completes the dynamic simulation function of the system. Since the system is a collection of several subsystems, there is no coupling between the subsystems.
  • the device receives the data and performs the corresponding action, changes the parameter value of the device, and then triggers the coupling relationship of the subsystem to perform corresponding processing. Finally, the main system interface dynamically displays the parameter values of each device in the subsystem in the form of a table.
  • the system running module 4200 can receive and send commands and perform related actions, and in the table on the right, all the subsystems and subsystems included in the system are listed, and the device configuration is included. All the parameter information can be refreshed in time, and the log information on the right side will continuously display the received and sent information and the error log, and the log of the above error is provided by the third error management unit 4205.
  • the system layer processor 4000 provided by the embodiment of the present invention can complete system configuration and management, including system attributes and subsystems inside the system, adding or deleting subsystems in the system by querying and calling subsystem layer configuration files, and supporting The user combines the subsystems into a complete system and manages the coupling relationship between the various subsystems within each system to perform system layer simulation.
  • the protocol layer processor 1000, the device layer processor 2000, the subsystem layer processor 3000, and the system layer processor 4000 provided in the above embodiments describe an operational flow of a simulation platform for an integrated circuit manufacturing device according to an embodiment of the present invention. , including the following steps:
  • S6403 After the configuration protocol is completed, the S6404 is executed.
  • the configured protocol can start communication with the instrument to be simulated, and then execute S6413.
  • the protocol configuration module 1100 configures the communication protocol for the simulation platform, and the protocol operation module 1200 can start communication with the instrument to be simulated through the configured protocol.
  • S6405 Configure the device. After the device is configured, run S6406 to start the device layer simulation, and then execute S6413.
  • the device configuration module 2100 configures a communication protocol for the device by loading a protocol layer configuration file, and configures a plurality of devices by generating a device layer configuration file, and the device operation module 2200 performs simulation of the device layer.
  • the subsystem configuration module 3100 loads the devices in the subsystem by loading the device layer configuration file. Configure to configure multiple subsystems by generating a subsystem layer configuration file, and run the module by the subsystem
  • the 3200 performs a simulation of the subsystem layer.
  • the system configuration module 4100 configures the subsystems in the system by loading the subsystem layer configuration file, configures multiple systems by generating system layer configuration files, and performs system layer simulation by the system operation module 4200.
  • S6410 Determine whether to start the simulation of the system layer. If it is judged to execute the simulation of the system layer, execute S6411; otherwise, execute S6413;
  • the simulation platform for the integrated circuit manufacturing device provided by the embodiment of the present invention can flexibly configure the protocol layer, the device layer, the subsystem layer and the system layer of the simulation platform according to different hardware required in different projects and different usage methods of the same hardware. And the simulation platform is accurate, real-time and scalable.

Abstract

A simulation platform for an integrated circuit manufacturing equipment is provided, which includes: multiple instruments to be simulated, multiple board cards and a simulation computer. The simulation computer communicates with the multiple instruments to be simulated via the multiple board cards, so as to simulate the multiple instruments to be simulated. The simulation computer includes: a protocol layer processor for establishing multiple communication protocols in the simulation platform, generating a protocol layer configuration file corresponding to the multiple communication protocols, and communicating with the multiple instruments to be simulated via the multiple board cards according to the multiple communication protocols; a device layer processor for establishing multiple equipments in the simulation platform, generating a device layer configuration file corresponding to the multiple equipments, loading the protocol layer configuration file corresponding to the multiple equipments according to the established multiple equipments, managing the multiple equipments, and simulating the device layer; a subsystem layer processor for establishing multiple subsystems in the simulation platform, generating a subsystem layer configuration file corresponding to the multiple subsystems, managing the multiple subsystems and the equipments in each subsystem, and simulating the subsystem layer; and a system layer processor for establishing multiple systems in the simulation platform, generating a system layer configuration file corresponding to the multiple systems, according to the established multiple systems, loading the subsystem layer configuration file, which is corresponding to the subsystem in one or more systems, to one or more systems, managing the multiple systems and the subsystems in each system, and simulating the system layer.

Description

用于集成电路制造设备的仿真平台 技术领域  Simulation platform for integrated circuit manufacturing equipment
本发明属于计算机应用技术和集成电路装备领域, 特别涉及用于集成电路制造设备 的仿真平台, 用于对集成电路制造中的仪器进行仿真。 背景技术  The invention belongs to the field of computer application technology and integrated circuit equipment, and particularly relates to a simulation platform for an integrated circuit manufacturing device for simulating an instrument in integrated circuit manufacturing. Background technique
随着集成电路芯片集成度的不断提升和芯片功能的不断提高, 人们对工艺的要求越 来越高。 集成电路制造设备的研究和开发面临的主要两个问题包括:  With the increasing integration of integrated circuit chips and the continuous improvement of chip functions, people are increasingly demanding processes. The two main issues facing the research and development of integrated circuit manufacturing equipment include:
1 ) 在集成电路设备研发时, 不但有硬件部分的研发, 同时也有针对该设备的控制 软件系统研发工作。 目前大部分的设备控制软件在进行测试时, 需要首先在仿真环境 下进行验证。 由于在很多情况下, 开发任务非常多样, 单纯为某一个项目开发软件测 试平台不仅耗时过大而且可重用性很差, 从而存在软件测试效率低和定位系统的定位 准确度不高的问题。  1) In the development of integrated circuit equipment, not only the development of the hardware part, but also the development of the control software system for the equipment. At present, most of the device control software needs to be verified in the simulation environment when testing. In many cases, the development tasks are very diverse. It is not only time-consuming and reusable to develop a software testing platform for a single project, so there is a problem that the software testing efficiency is low and the positioning system positioning accuracy is not high.
2 ) 在硬件平台搭建好之后, 受限于硬件条件, 因此需要通过运行硬件测试。 而受 到测试条件的限制, 不能提前对可能出现的故障进行预测。 因此存在集成电路制造设 备的研发成本高和开发周期长的问题。  2) After the hardware platform is built, it is limited to hardware conditions, so it is necessary to run hardware tests. Due to the limitations of the test conditions, it is not possible to predict the possible failures in advance. Therefore, there is a problem that the development cost of the integrated circuit manufacturing equipment is high and the development cycle is long.
在集成电路制造设备的研究、 开发和测试工作中, 仿真具有重要的作用, 体现在 以下方面:  In the research, development and testing of integrated circuit manufacturing equipment, simulation plays an important role in the following aspects:
第一方面, 由于生产过程控制本身的复杂性, 对理论研究不断提出新的要求, 而 理论研究需要借助于仿真工具。  In the first aspect, due to the complexity of the production process control itself, new requirements are constantly put forward for theoretical research, and theoretical research needs to rely on simulation tools.
第二方面, 面对各种系统控制软件包, 需要现成的仿真平台, 全面反映算法在实 际生产运行中的效果, 得到有指导意义的算法改进策略、 参数在线调整方法等。  In the second aspect, in the face of various system control software packages, an off-the-shelf simulation platform is needed to fully reflect the effect of the algorithm in the actual production operation, and the guiding algorithm improvement strategy and parameter online adjustment method are obtained.
仿真平台的使用能够准确测试设备控制系统软件, 可以减少控制系统软件执行与 集成电路制造工艺过程的失败, 能解决集成电路工艺设备的工艺稳定性, 工艺可靠性, 减少设备维修时间, 最大程度的提高设备的利用率。  The use of the simulation platform can accurately test the equipment control system software, which can reduce the failure of the control system software execution and the integrated circuit manufacturing process, can solve the process stability of the integrated circuit process equipment, process reliability, reduce equipment maintenance time, and maximize the degree Improve equipment utilization.
集成电路行业对仿真系统的需求非常大, 而业内对仿真系统的主要需求有如下几  The demand for simulation systems in the integrated circuit industry is very large, and the main needs of the simulation system in the industry are as follows.
1 )仿真平台的使用一-对于新产品开发, 仿真平台是在硬件上对软件至关重要的测 试。 1) Use of the simulation platform - For new product development, the simulation platform is a test that is critical to the software on the hardware.
2)期望 -—仿真平台不是为了完全取代实际的加工设备, 其目的在于测试控制系统 软件, 减少在实际设备上的调试时间。  2) Expectations - The simulation platform is not intended to completely replace the actual processing equipment. The purpose is to test the control system software and reduce the debugging time on the actual equipment.
3)仿真平台接口 -—模拟系统供应商应提供方案面向不同的控制系统界面, 主要包 括 2种接口: 通讯级接口和物理 I /O级接口。  3) Simulation platform interface - The simulation system supplier should provide the solution for different control system interfaces, mainly including two kinds of interfaces: communication level interface and physical I / O level interface.
4)系统配置 -—集成电路设备供应商需要一个仿真平台, 可以很容易地为产品和不 同的配置以及产品提供的每一个自定义进行配置, 在通信接口上达到这个需求。 4) System Configuration - IC equipment suppliers need a simulation platform that can easily be used for products and not The same configuration and each customization provided by the product are configured to meet this requirement on the communication interface.
5)支持测试自动化一-由于仿真系统为了响应控制系统而来的输入, 因此其将不会 进行自动化测试。 仿真系统的设计应当可以完全支持自动测试。  5) Support for test automation - Since the simulation system responds to the control system, it will not be automated. The simulation system should be designed to fully support automated testing.
6)易用性一-便于使用。  6) Ease of use - easy to use.
但是, 现有的集成电路制造设备的仿真系统存在以下缺点: 仿真系统及关键技术均 由各个公司专门针对某一种制造设备而设计, 无法根据不同的制造设备要求对仿真系统 进行配置, 从而无法满足不同项目不同硬件的需求, 因此不具备通用性。 发明内容  However, the existing simulation system of integrated circuit manufacturing equipment has the following disadvantages: The simulation system and the key technologies are designed by each company specifically for a certain manufacturing equipment, and the simulation system cannot be configured according to different manufacturing equipment requirements, thereby failing to Meet the needs of different hardware for different projects, so it is not universal. Summary of the invention
本发明的目的旨在至少解决上述技术缺陷之一,提出了一种用于集成电路制造设备 的仿真平台。  SUMMARY OF THE INVENTION An object of the present invention is to solve at least one of the above technical drawbacks and to provide a simulation platform for an integrated circuit manufacturing apparatus.
本发明实施例一方面提出了一种用于集成电路制造设备的仿真平台, 包括: 多个待 仿真仪器, 多个板卡, 所述多个板卡中的每个包括多个通道, 其中所述多个通道中的每 个与所述多个待仿真仪器中的一个的针脚相连; 和仿真计算机, 所述仿真计算机通过所 述多个板卡与所述多个待仿真仪器进行通信, 用于对多个待仿真仪器进行仿真, 所述仿 真计算机包括: 协议层处理器, 所述协议层处理器用于建立所述仿真平台中的多个通信 协议, 并生成与所述多个通信协议对应的协议层配置文件, 以及根据所述多个通信协议 通过所述多个板卡与所述多个待仿真仪器进行通信; 设备层处理器, 所述设备层处理器 用于建立所述仿真平台中的多个设备, 并生成与所述多个设备对应的设备层配置文件, 并根据建立的所述多个设备加载所述多个设备对应的所述协议层配置文件, 以及对所述 多个设备进行管理并进行设备层的仿真; 子系统层处理器, 所述子系统层处理器用于建 立所述仿真平台中的多个子系统, 并生成与所述多个子系统对应的子系统层配置文件, 其中, 每个所述子系统包括一个或多个在所述设备层处理器中建立的设备, 并根据建立 的所述多个子系统加载所述多个子系统中设备对应的设备层配置文件, 以及对所述多个 子系统以及每个子系统中的设备进行管理并进行子系统层的仿真;和 系统层处理器, 所述系统层处理器用于建立所述仿真平台中的多个系统, 并生成与所述多个系统对应的 系统层配置文件, 其中, 每个所述系统包括一个或多个在所述子系统层处理器中建立的 子系统, 并根据建立的所述一个或多个系统加载所述一个或多个系统中子系统对应的子 系统层配置文件加载至所述多个系统, 以及对所述多个系统以及每个系统中的子系统进 行管理并进行系统层的仿真。  An embodiment of the present invention provides a simulation platform for an integrated circuit manufacturing device, including: a plurality of instruments to be simulated, a plurality of boards, each of the plurality of boards including a plurality of channels, wherein Each of the plurality of channels is connected to a pin of one of the plurality of instruments to be simulated; and an emulation computer, wherein the emulation computer communicates with the plurality of instruments to be simulated through the plurality of boards, Simulating a plurality of devices to be simulated, the simulation computer comprising: a protocol layer processor, wherein the protocol layer processor is configured to establish a plurality of communication protocols in the simulation platform, and generate corresponding to the plurality of communication protocols a protocol layer configuration file, and communicating with the plurality of instruments to be simulated by the plurality of boards according to the plurality of communication protocols; a device layer processor, wherein the device layer processor is used to establish the simulation platform a plurality of devices, and generating a device layer configuration file corresponding to the plurality of devices, and loading the plurality of devices according to the established plurality of devices a protocol layer configuration file, and managing the plurality of devices and performing device layer simulation; a subsystem layer processor, wherein the subsystem layer processor is configured to establish multiple subsystems in the simulation platform, and generate and a subsystem layer configuration file corresponding to the plurality of subsystems, wherein each of the subsystems includes one or more devices established in the device layer processor, and loading the plurality of subsystems according to the established a device layer configuration file corresponding to the device in the plurality of subsystems, and managing the plurality of subsystems and devices in each subsystem and performing subsystem layer simulation; and a system layer processor, wherein the system layer processor is used to establish Computing a plurality of systems in the platform, and generating system layer configuration files corresponding to the plurality of systems, wherein each of the systems includes one or more subsystems established in the subsystem layer processor And loading the subsystem layer configuration file corresponding to the subsystem in the one or more systems according to the one or more systems established To the plurality of systems, and carry out the management of the simulation system, and each of the plurality of sub-systems and the system layer.
在本发明的一个实施例中, 所述协议层配置文件以、 所述设备层配置文件、 所述子 系统层配置文件和所述系统层配置文件以 XML文件格式保存。  In an embodiment of the present invention, the protocol layer configuration file, the device layer configuration file, the subsystem layer configuration file, and the system layer configuration file are saved in an XML file format.
在本发明的一个实施例中, 其中, 所述协议层处理器包括: 协议配置模块, 所述协 议配置模块用于建立所述仿真平台中的所述多个通信协议, 并生成与所述多个通信协议 对应的协议层配置文件; 和协议运行模块, 所述协议运行模块用于对所述协议配置模块 配置后的通信协议进行连接测试以进行验证。 In an embodiment of the present invention, the protocol layer processor includes: a protocol configuration module, where the protocol configuration module is configured to establish the multiple communication protocols in the simulation platform, and generate and a protocol layer configuration file corresponding to the communication protocol; and a protocol operation module, wherein the protocol operation module is configured to configure the module The configured communication protocol performs a connection test for verification.
在本发明的一个实施例中, 其中, 所述协议类型包括以太网协议、 串口协议、 模拟 10协议、 数字 10协议和 DeviceNet协议。  In an embodiment of the present invention, the protocol type includes an Ethernet protocol, a serial port protocol, an analog 10 protocol, a digital 10 protocol, and a DeviceNet protocol.
在本发明的一个实施例中, 其中, 当所述通信协议的协议类型为以太网协议或串口 协议时, 所述协议层配置文件进一步包括协议格式, 所述协议格式包括命令名称和命令 中携带属性的属性参数。  In an embodiment of the present invention, when the protocol type of the communication protocol is an Ethernet protocol or a serial port protocol, the protocol layer configuration file further includes a protocol format, where the protocol format includes a command name and a command carried The attribute parameter of the attribute.
在本发明的一个实施例中, 所述协议层处理器进一步包括: 协议封装模块, 当所述 协议类型为以太网协议或串口协议时, 所述协议封装模块进一步包括数据解包接口和数 据封包接口, 所述数据解包接口, 用于解析由所述多个板卡发送的数据; 所述数据封包 接口, 用于对发送至所述多个板卡的数据进行封包操作。  In an embodiment of the present invention, the protocol layer processor further includes: a protocol encapsulation module, where the protocol encapsulation module further includes a data unpacking interface and a data packet when the protocol type is an Ethernet protocol or a serial port protocol An interface, the data unpacking interface, configured to parse data sent by the multiple boards; and the data packet interface is configured to perform a packet operation on data sent to the multiple boards.
在本发明的一个实施例中, 所述设备层处理器包括: 设备配置模块, 所述设备配置 模块用于建立所述仿真平台中的多个设备, 并生成与所述多个设备对应的设备层配置文 件以对所述多个设备进行配置, 将所述多个设备对应的所述协议层配置文件加载至所述 多个设备以使各个设备通过所述通信协议与所述待仿真仪器进行通信; 和设备运行模 块, 所述设备运行模块用于对配置后的设备进行验证, 且在通过验证后对所述多个设备 进行仿真。  In an embodiment of the present invention, the device layer processor includes: a device configuration module, where the device configuration module is configured to establish multiple devices in the simulation platform, and generate devices corresponding to the multiple devices a layer configuration file to configure the plurality of devices, and the protocol layer configuration file corresponding to the plurality of devices is loaded to the plurality of devices to enable each device to perform with the device to be simulated by using the communication protocol And a device running module, where the device running module is configured to verify the configured device, and simulate the multiple devices after passing the verification.
在本发明的一个实施例中, 其中, 所述设备层配置文件包括: 设备的名称与类型; 设备属性, 所述设备属性包括设备的属性名称、 设备的属性类型、 设备的属性最大值、 设备的属性最小值和设备的属性默认值; 设备控制命令, 所述设备控制命令包括设备控 制命令的名称、 设备控制命令的传递方向和设备控制命令的内容; 设备动作, 所述设备 动作包括设备的动作名称和与所述动作名称耦合的设备控制命令、动作的步骤数目以及 与每一步骤对应的设备动作类型; 和设备内部的耦合关系, 所述设备内部的耦合关系包 括耦合条件和与所述耦合条件对应的耦合关系命令。  In an embodiment of the present invention, the device layer configuration file includes: a device name and a type; a device attribute, where the device attribute includes a device attribute name, a device attribute type, a device attribute maximum value, and a device The minimum value of the attribute and the default value of the attribute of the device; the device control command, the device control command includes the name of the device control command, the delivery direction of the device control command, and the content of the device control command; the device action, the device action includes the device An action name and a device control command coupled with the action name, a number of steps of the action, and a device action type corresponding to each step; and a coupling relationship inside the device, the coupling relationship inside the device includes a coupling condition and the The coupling relationship command corresponding to the coupling condition.
在本发明的一个实施例中, 其中, 所述设备动作类型包括命令行为、 动作条件、 延 迟等待、 变化规律和返回信息。  In an embodiment of the present invention, the device action type includes a command behavior, an action condition, a delay wait, a change rule, and return information.
在本发明的一个实施例中, 其中, 所述设备配置模块还用于向所述多个设备中添加 一个或多个设备, 或者从所述多个设备中删除一个或多个设备。  In an embodiment of the present invention, the device configuration module is further configured to add one or more devices to the multiple devices, or delete one or more devices from the multiple devices.
在本发明的一个实施例中, 所述设备运行模块包括: 第一验证单元, 用于对所述设 备配置模块配置后的所述设备进行验证; 第一端口初始化单元, 用于生成与通过验证的 设备的设备控制命令对应的物理端口, 并检查所述物理端口是否冲突, 当检查所述物理 端口无冲突时, 对所述物理端口进行初始化; 第一命令管理单元, 用于发送或接收所述 设备控制命令; 第一仿真单元, 用于执行与所述设备控制命令对应的仿真动作; 和第一 错误管理单元, 用于以日志的形式记录设备层仿真过程中的错误信息。  In an embodiment of the present invention, the device running module includes: a first verification unit, configured to perform verification on the device configured by the device configuration module; and a first port initialization unit, configured to generate and pass verification Device of the device controls the corresponding physical port, and checks whether the physical port conflicts. When the physical port is checked for conflict, the physical port is initialized; the first command management unit is configured to send or receive a device control command; a first simulation unit, configured to execute a simulation action corresponding to the device control command; and a first error management unit, configured to record error information in a device layer simulation process in a log form.
在本发明的一个实施例中, 所述子系统层处理器包括: 子系统配置模块, 所述子系 统配置模块用于建立所述仿真平台中的多个子系统, 并生成与所述多个子系统对应的子 系统层配置文件以对所述多个子系统进行配置, 其中, 每个所述子系统包括多个设备, 将所述多个子系统对应的所述设备层配置文件加载至所述多个子系统以配置各个子系 统中的所述多个设备; 和子系统运行模块, 所述子系统运行模块用于对配置后的子系统 进行验证, 且在通过验证后对所述多个子系统进行仿真。 In an embodiment of the present invention, the subsystem layer processor includes: a subsystem configuration module, where the subsystem configuration module is configured to establish multiple subsystems in the simulation platform, and generate and the multiple subsystems Corresponding child a system layer configuration file to configure the plurality of subsystems, wherein each of the subsystems includes a plurality of devices, and the device layer configuration files corresponding to the plurality of subsystems are loaded to the plurality of subsystems for configuration The plurality of devices in each subsystem; and a subsystem running module, the subsystem running module is configured to verify the configured subsystem, and simulate the plurality of subsystems after passing the verification.
在本发明的一个实施例中, 其中, 所述子系统层配置文件包括: 子系统属性, 所述 子系统属性包括子系统的属性名称; 子系统内部的设备属性, 所述子系统内部的设备属 性包括设备的名称、 设备的类型和物理端口; 设备间耦合条件, 所述设备间耦合条件包 括耦合设备的名称、 耦合条件和耦合触发命令; 设备间耦合关系, 所述设备间耦合关系 包括设备间的耦合动作, 耦合设备的名称、 所述耦合动作的步骤数目和每一步骤对应的 耦合动作类型。  In an embodiment of the present invention, the subsystem layer configuration file includes: a subsystem attribute, the subsystem attribute includes a property name of the subsystem, a device attribute inside the subsystem, and an internal device of the subsystem The attributes include the name of the device, the type of the device, and the physical port; the coupling condition between the devices, the coupling condition of the device includes the name of the coupled device, the coupling condition, and the coupling trigger command; the coupling relationship between the devices, and the coupling relationship between the devices includes the device The coupling action between the two, the name of the coupling device, the number of steps of the coupling action, and the type of coupling action corresponding to each step.
在本发明的一个实施例中, 其中, 所述耦合动作类型包括设备行为、 耦合动作条件 和耦合动作的延迟。  In an embodiment of the invention, the type of coupling action includes device behavior, coupled action conditions, and delay of the coupling action.
在本发明的一个实施例中, 其中, 子系统配置模块还用于向所述多个子系统中添加 一个或多个子系统, 或者从所述多个子系统中删除一个或多个子系统; 以及向所述各个 子系统中添加一个或多个所述设备, 或者从所述各个子系统中删除一个或多个所述设 备。  In an embodiment of the present invention, the subsystem configuration module is further configured to add one or more subsystems to the multiple subsystems, or delete one or more subsystems from the multiple subsystems; Adding one or more of the devices to each subsystem or deleting one or more of the devices from the various subsystems.
在本发明的一个实施例中, 所述子系统运行模块包括: 第二验证单元, 用于对所述 子系统配置模块配置后的所述子系统进行验证; 第二端口初始化单元, 用于生成与通过 验证的子系统内部的设备的设备控制命令对应的物理端口, 并检查所述物理端口是否冲 突, 当检查所述物理端口无冲突时, 运行所述子系统内部的设备并对所述物理端口进行 初始化; 第二命令管理单元, 用于接收或发送所述子系统内部的设备的设备控制命令; 第二仿真单元, 用于执行与所述子系统内部的设备的设备控制命令对应的仿真动作, 并 触发所述耦合条件, 根据所述耦合条件执行相应的耦合动作; 和第二错误管理单元, 用 于以日志的形式记录子系统层仿真过程中的错误信息。  In an embodiment of the present invention, the subsystem running module includes: a second verification unit, configured to verify the subsystem configured by the subsystem configuration module; and a second port initialization unit, configured to generate a physical port corresponding to a device control command of the device inside the verified subsystem, and checking whether the physical port conflicts, when checking that the physical port has no conflict, running the device inside the subsystem and the physical The port is initialized; the second command management unit is configured to receive or send a device control command of the device inside the subsystem; and the second simulation unit is configured to execute a simulation corresponding to the device control command of the device inside the subsystem Acting, and triggering the coupling condition, performing a corresponding coupling action according to the coupling condition; and a second error management unit, configured to record error information in the subsystem layer simulation process in the form of a log.
在本发明的一个实施例中, 所述系统层处理器包括: 系统配置模块, 所述系统配置 模块用于建立所述仿真平台中的多个系统, 并生成与所述多个系统对应的系统层配置文 件以对所述多个系统进行配置, 其中, 每个所述系统包括多个子系统, 将所述多个系统 对应的所述子系统层配置文件加载至所述多个系统以配置各个系统中的所述多个子系 统; 和系统运行模块, 所述系统运行模块用于对配置后的系统进行验证, 且在通过验证 后进行对所述多个系统进行仿真。  In an embodiment of the present invention, the system layer processor includes: a system configuration module, where the system configuration module is configured to establish multiple systems in the simulation platform, and generate a system corresponding to the multiple systems a layer configuration file to configure the plurality of systems, wherein each of the systems includes a plurality of subsystems, and the subsystem layer configuration files corresponding to the plurality of systems are loaded to the plurality of systems to configure each The plurality of subsystems in the system; and a system operation module, wherein the system operation module is configured to verify the configured system, and after the verification, perform simulation on the multiple systems.
在本发明的一个实施例中, 其中, 所述系统层配置文件包括: 系统属性, 所述系统 属性包括系统名称、 系统说明信息; 系统内部的子系统属性, 所述系统内部的子系统属 性包括子系统的名称和各个子系统内部的设备; 和子系统间的耦合关系。  In an embodiment of the present invention, the system layer configuration file includes: a system attribute, where the system attribute includes a system name, system description information, a subsystem attribute inside the system, and a subsystem attribute of the system includes: The name of the subsystem and the equipment within each subsystem; and the coupling relationship between the subsystems.
在本发明的一个实施例中, 其中, 所述系统配置模块还用于向所述多个系统中添加 一个或多个系统, 或者从所述多个系统中删除一个或多个系统; 以及向所述各个系统中 添加一个或多个所述子系统, 或者从所述各个系统中删除一个或多个所述子系统。 在本发明的一个实施例中, 所述系统运行模块包括: 第三验证单元, 用于对所述系 统配置模块配置后的所述系统进行验证; 第三端口初始化单元, 用于生成与通过验证后 的系统内部的子系统中的设备的设备控制命令对应的物理端口,检查所述物理端口是否 冲突, 当检查所述物理端口无冲突时, 运行所述系统内部的子系统以及所述子系统内部 的所述设备, 并对所述物理端口进行初始化; 第三命令管理单元, 用于接收或发送所述 系统内部的子系统中的设备的设备控制命令; 第三仿真单元, 用于执行与所述设备控制 命令对应的仿真动作, 并触发所述设备间的耦合条件, 根据所述耦合条件执行相应的耦 合动作; 和第三错误管理单元, 用于以日志的形式系统层仿真过程中的错误信息。 In an embodiment of the present invention, the system configuration module is further configured to add one or more systems to the multiple systems, or delete one or more systems from the multiple systems; In each of the systems One or more of the subsystems are added, or one or more of the subsystems are deleted from the various systems. In an embodiment of the present invention, the system operation module includes: a third verification unit, configured to verify the system configured by the system configuration module; and a third port initialization unit, configured to generate and pass verification The physical port corresponding to the device control command of the device in the subsystem inside the system, checking whether the physical port conflicts, and when checking that the physical port has no conflict, running the subsystem inside the system and the subsystem The internal device, and the physical port is initialized; a third command management unit, configured to receive or send a device control command of a device in a subsystem inside the system; and a third simulation unit, configured to execute The device controls a simulation action corresponding to the command, and triggers a coupling condition between the devices, and performs a corresponding coupling action according to the coupling condition; and a third error management unit is configured to perform a system layer simulation process in the form of a log Error message.
本发明实施例提供的用于集成电路制造设备的仿真平台时在基于 WindowsXP操作 系统, 釆用 Visual Studio2008 .NET实现的通用的软件仿真平台。 该仿真平台包括协议 层处理器、 设备层处理器、 子系统层处理器和系统层处理器。 其中, 协议层处理器可以 对仿真平台所需要的通信协议的驱动进行封装, 将写有协议层配置内容的协议层配置文 件提供给设备层, 从而使得设备层接收到子系统层的命令后通过通信协议规定收发方式 进行仿真动作, 进而实现与待仿真仪器之间的通信。  The simulation platform for the integrated circuit manufacturing device provided by the embodiment of the present invention is a general software simulation platform implemented by Visual Studio 2008 .NET based on the Windows XP operating system. The simulation platform includes a protocol layer processor, a device layer processor, a subsystem layer processor, and a system layer processor. The protocol layer processor may encapsulate the driver of the communication protocol required by the simulation platform, and provide a protocol layer configuration file with the protocol layer configuration content to the device layer, so that the device layer passes the command of the subsystem layer. The communication protocol stipulates that the transceiver mode performs the simulation action, thereby implementing communication with the instrument to be simulated.
设备层处理器可以完成对设备的配置, 包括设备的属性、 控制命令、 动作和内部耦 合等, 并且将写有的设备层配置内容设备层配置文件提供给子系统层, 以供子系统层查 询和调用, 此外还可以完成对设备的管理, 包括添加、 删除、 保存和编辑设备等, 进而 通过协议层配置后的通讯协议与待仿真仪器进行通信, 并执行设备层的仿真。  The device layer processor can complete the configuration of the device, including device attributes, control commands, actions, and internal coupling, and provide the written device layer configuration content device layer configuration file to the subsystem layer for subsystem layer query. And calling, in addition to the management of the device, including adding, deleting, saving and editing devices, and then communicating with the instrument to be simulated through the communication protocol configured by the protocol layer, and performing device layer simulation.
子系统层处理器可以完成子系统的配置和管理, 包括子系统的属性以及子系统内部 的设备, 通过查询和调用设备层配置文件在子系统中添加或删除设备, 并且支持用户将 设备组合为完整的子系统, 以及管理每个子系统内部的各个设备之间的耦合关系, 将写 有子系统层配置内容的子系统层配置文件提供给系统层, 以供系统层查询和调用, 在上 述配置完成后, 执行子系统层的仿真。  The subsystem layer processor can complete the configuration and management of the subsystem, including the properties of the subsystem and the devices inside the subsystem, adding or deleting devices in the subsystem by querying and invoking the device layer configuration file, and allowing the user to combine the devices into Complete subsystems, and management of the coupling relationship between each device within each subsystem, provide subsystem layer configuration files written with subsystem layer configuration content to the system layer for system layer query and call, in the above configuration After completion, the simulation of the subsystem layer is performed.
系统层处理器可以完成系统的配置和管理, 包括系统的属性以及系统内部的子系 统, 通过查询和调用子系统层配置文件在系统中添加或删除子系统, 并且支持用户将子 系统组合为完整的系统, 以及管理每个系统内部的各个子系统之间的耦合关系, 进而执 行系统层的仿真。  The system layer processor can complete the configuration and management of the system, including the attributes of the system and the subsystems inside the system. By adding and deleting subsystems by querying and calling the subsystem layer configuration file, and supporting the user to combine the subsystems into complete The system, as well as the management of the coupling between the various subsystems within each system, to perform system layer simulation.
本发明实施例提供的用于集成电路制造设备的仿真平台可以根据不同项目中所需 要的硬件的不同以及相同硬件的不同使用方法灵活配置仿真平台的协议层、 设备层、 子 系统层和系统层, 并且该仿真平台具有准确性、 实时性和可扩展的特点。  The simulation platform for the integrated circuit manufacturing device provided by the embodiment of the present invention can flexibly configure the protocol layer, the device layer, the subsystem layer and the system layer of the simulation platform according to different hardware required in different projects and different usage methods of the same hardware. And the simulation platform is accurate, real-time and scalable.
本发明附加的方面和优点将在下面的描述中部分给出, 部分将从下面的描述中变得 明显, 或通过本发明的实践了解到。 附图说明 本发明上述的和 /或附加的方面和优点从下面结合附图对实施例的描述中将变得明 显和容易理解, 其中: The additional aspects and advantages of the invention will be set forth in part in the description which follows. DRAWINGS The above and/or additional aspects and advantages of the present invention will become apparent and readily understood from
图 1为本发明实施例的用于集成电路制造设备的仿真平台的结构示意图; 图 2为本发明实施例的用于集成电路制造设备的仿真平台的总体架构图; 图 3为本发明实施例的用于集成电路制造设备的仿真平台的主界面;  1 is a schematic structural diagram of a simulation platform for an integrated circuit manufacturing device according to an embodiment of the present invention; FIG. 2 is a schematic overall structural diagram of a simulation platform for an integrated circuit manufacturing device according to an embodiment of the present invention; The main interface of the simulation platform for integrated circuit manufacturing equipment;
图 4为本发明实施例的用于集成电路制造设备的仿真平台的配置管理主界面; 图 5为本发明实施例的用于集成电路制造设备的仿真平台的运行管理主界面; 图 6为本发明实施例的协议层处理器的结构示意图;  4 is a configuration management main interface of a simulation platform for an integrated circuit manufacturing device according to an embodiment of the present invention; FIG. 5 is a main operation and operation interface of a simulation platform for an integrated circuit manufacturing device according to an embodiment of the present invention; Schematic diagram of a protocol layer processor of an embodiment of the invention;
图 7为本发明实施例的协议层的总体架构图;  FIG. 7 is a schematic overall structural diagram of a protocol layer according to an embodiment of the present invention; FIG.
图 8为本发明实施例的 Dev i ceNe t协议的配置界面;  8 is a configuration interface of a Dev i ceNe t protocol according to an embodiment of the present invention;
图 9为本发明实施例的以太网协议的配置界面;  FIG. 9 is a configuration interface of an Ethernet protocol according to an embodiment of the present invention;
图 10为本发明实施例的串口协议的配置界面;  10 is a configuration interface of a serial port protocol according to an embodiment of the present invention;
图 11为本发明实施例的模拟 I /O协议的配置界面;  11 is a configuration interface of an analog I/O protocol according to an embodiment of the present invention;
图 12为本发明实施例的数字 I /O协议的配置界面;  12 is a configuration interface of a digital I/O protocol according to an embodiment of the present invention;
图 1 3为本发明实施例的数据解包流程图;  FIG. 13 is a flowchart of data unpacking according to an embodiment of the present invention;
图 14为本发明实施例的数据封包流程图;  14 is a flowchart of a data packet according to an embodiment of the present invention;
图 15为本发明实施例的协议运行模块验证配置协议的连接测试界面;  15 is a connection test interface of a protocol running module verification configuration protocol according to an embodiment of the present invention;
图 16为本发明实施例的用于集成电路制造设备的仿真平台的通信流程图; 图 17为本发明实施例的设备层处理器的结构示意图;  16 is a communication flowchart of a simulation platform for an integrated circuit manufacturing device according to an embodiment of the present invention; FIG. 17 is a schematic structural diagram of a device layer processor according to an embodiment of the present invention;
图 18为本发明实施例的设备层的总体架构图;  FIG. 18 is a schematic overall structural diagram of a device layer according to an embodiment of the present invention; FIG.
图 19为本发明实施例的设备层的类结构图;  FIG. 19 is a schematic structural diagram of a device layer according to an embodiment of the present invention; FIG.
图 20为本发明实施例的设备配置模块的配置管理流程图;  20 is a flowchart of configuration management of a device configuration module according to an embodiment of the present invention;
图 21为本发明实施例的 Dev i ce的层次界面;  21 is a hierarchical interface of a Dev i ce according to an embodiment of the present invention;
图 22为本发明实施例的创建设备名称和设备类型的界面;  FIG. 22 is an interface for creating a device name and a device type according to an embodiment of the present invention;
图 23为本发明实施例的创建和编辑设备属性的界面;  23 is an interface for creating and editing device attributes according to an embodiment of the present invention;
图 24为本发明实施例的设备的控制命令的配置界面;  24 is a configuration interface of a control command of a device according to an embodiment of the present invention;
图 25为本发明实施例的设备的动作名称的配置界面;  25 is a configuration interface of an action name of a device according to an embodiment of the present invention;
图 26为本发明实施例的设备的动作内容的配置界面;  26 is a configuration interface of action content of a device according to an embodiment of the present invention;
图 27为本发明实施例的动作条件的配置界面;  27 is a configuration interface of an action condition according to an embodiment of the present invention;
图 28为本发明实施例的等待时间的配置界面;  28 is a configuration interface of a waiting time according to an embodiment of the present invention;
图 29为本发明实施例的变化规律的配置界面;  29 is a configuration interface of a variation rule according to an embodiment of the present invention;
图 30 ( a ) 为本发明实施例的变化规律为用户自定义的配置界面;  Figure 30 (a) shows a configuration interface in which the variation rule is a user-defined configuration according to an embodiment of the present invention;
图 30 ( b ) 为本发明实施例的变化规律为 P ID的配置界面;  FIG. 30(b) is a configuration interface of a PID change rule according to an embodiment of the present invention;
图 30 ( c ) 为本发明实施例的变化规律为 P I的配置界面;  Figure 30 (c) shows a configuration interface of a change rule of P I according to an embodiment of the present invention;
图 30 ( d ) 为本发明实施例的变化规律为直接赋值的配置界面; 图 31为本发明实施例的返回信息的配置界面; FIG. 30( d ) is a configuration interface whose change rule is a direct assignment according to an embodiment of the present invention; FIG. 31 is a configuration interface of returning information according to an embodiment of the present invention;
图 32为本发明实施例的设备内部的耦合关系的配置界面; 32 is a configuration interface of a coupling relationship inside a device according to an embodiment of the present invention;
图 33为本发明实施例的设备内部的耦合条件的配置界面; 33 is a configuration interface of coupling conditions inside a device according to an embodiment of the present invention;
图 34为本发明实施例的设备运行模块的结构示意图; FIG. 34 is a schematic structural diagram of a device running module according to an embodiment of the present invention;
图 35为本发明实施例的物理接口的配置界面; FIG. 35 is a configuration interface of a physical interface according to an embodiment of the present invention;
图 36为本发明实施例的设备运行模块的流程图; 36 is a flowchart of a device operation module according to an embodiment of the present invention;
图 37为本发明实施例的设备运行模块的运行管理界面; 37 is an operation management interface of a device running module according to an embodiment of the present invention;
图 38为本发明实施例的子系统层处理器的结构示意图; 38 is a schematic structural diagram of a subsystem layer processor according to an embodiment of the present invention;
图 39为本发明实施例的子系统层的总体架构图; 39 is a general architectural diagram of a subsystem layer according to an embodiment of the present invention;
图 40为本发明实施例的子系统层的类结构图; 40 is a class diagram of a subsystem layer according to an embodiment of the present invention;
图 41为本发明实施例的子系统配置模块的配置管理流程图; 41 is a flowchart of configuration management of a subsystem configuration module according to an embodiment of the present invention;
图 42为本发明实施例的子系统层次化管理界面; 42 is a hierarchical management interface of a subsystem according to an embodiment of the present invention;
图 43为本发明实施例的子系统的创建界面; 43 is a creation interface of a subsystem according to an embodiment of the present invention;
图 44为本发明实施例的向子系统中添加设备的界面; 44 is an interface for adding a device to a subsystem according to an embodiment of the present invention;
图 45为本发明实施例的设备间的耦合条件的配置界面; 45 is a configuration interface of coupling conditions between devices according to an embodiment of the present invention;
图 46为本发明实施例的设备间的耦合关系名称配置界面; FIG. 46 is a configuration diagram of a coupling relationship name between devices according to an embodiment of the present invention;
图 47为本发明实施例的设备间的耦合动作的配置界面; FIG. 47 is a configuration interface of a coupling action between devices according to an embodiment of the present invention; FIG.
图 48为本发明实施例的耦合动作的延迟的配置界面; FIG. 48 is a configuration interface of delay of a coupling action according to an embodiment of the present invention; FIG.
图 49为本发明实施例的耦合动作的设备行为的配置界面; 49 is a configuration interface of device behavior of a coupling action according to an embodiment of the present invention;
图 50为本发明实施例的耦合动作条件的配置界面; FIG. 50 is a configuration interface of a coupling action condition according to an embodiment of the present invention; FIG.
图 51为本发明实施例的子系统运行模块的结构示意图; 51 is a schematic structural diagram of a subsystem operation module according to an embodiment of the present invention;
图 52为本发明实施例的子系统运行模块的流程图; 52 is a flowchart of a subsystem running module according to an embodiment of the present invention;
图 53为本发明实施例的子系统运行模块的运行管理界面; 53 is an operation management interface of a subsystem running module according to an embodiment of the present invention;
图 54为本发明实施例的系统层处理器的结构示意图; FIG. 54 is a schematic structural diagram of a system layer processor according to an embodiment of the present invention;
图 55为本发明实施例的系统层的总体架构图; Figure 55 is a diagram showing the overall architecture of a system layer according to an embodiment of the present invention;
图 56为本发明实施例的系统层的类结构图; Figure 56 is a diagram showing the class structure of a system layer according to an embodiment of the present invention;
图 57为本发明实施例的系统配置模块的配置管理流程图; 57 is a flowchart of configuration management of a system configuration module according to an embodiment of the present invention;
图 58为本发明实施例的系统层次化管理界面; FIG. 58 is a system hierarchical management interface according to an embodiment of the present invention;
图 59为本发明实施例的系统创建界面; FIG. 59 is a system creation interface according to an embodiment of the present invention;
图 60为本发明实施例的向系统中添加子系统的界面; 60 is an interface for adding a subsystem to a system according to an embodiment of the present invention;
图 61为本发明实施例的系统运行模块的结构示意图; 61 is a schematic structural diagram of a system operation module according to an embodiment of the present invention;
图 62为本发明实施例的系统运行模块的运行流程图; 62 is a flowchart of operation of a system operation module according to an embodiment of the present invention;
图 63为本发明实施例的系统运行模块的运行管理界面; 以及 FIG. 63 is an operation management interface of a system operation module according to an embodiment of the present invention;
图 64为本发明实施例的用于集成电路制造设备的仿真平台的运行流程图 具体实施方式 FIG. 64 is a flowchart of operation of a simulation platform for an integrated circuit manufacturing device according to an embodiment of the present invention; detailed description
下面详细描述本发明的实施例, 所述实施例的示例在附图中示出, 其中自始至终相 图描述的实施例是示例性的, 仅用于解释本发明, 而不能解释为对本发明的限制。  The embodiments of the present invention are described in detail below, and the examples of the embodiments are illustrated in the accompanying drawings, wherein the embodiments of the embodiments are described by way of example only, and are not to be construed as limiting. .
如图 1所示,根据本发明实施例的用于集成电路制造设备的仿真平台的结构示意图。 用于集成电路制造设备的仿真平台包括多个待仿真仪器、多个板卡和仿真计算机。其中, 每个板卡包括多个通道, 每个通道与多个仿真仪器中的一个的阵脚相连。 仿真计算机通 过多个板卡与多个待仿真仪器进行通信, 从而对多个待仿真仪器进行仿真。 其中, 仿真 计算机包括协议层处理器 1000、 设备层处理器 2000、 子系统层处理器 3000和系统层处 理器 4000。 其中, 协议层处理器 1000用于建立仿真平台中的多个通信协议, 并生成与 多个通信协议对应的协议层配置文件,根据上述配置完成的多个通信协议通过多个板卡 与多个仿真仪器进行通信; 设备层处理器 2000用于建立仿真平台中的多个设备, 并生 成与多个设备对应的设备层配置文件, 并根据建立的多个设备加载来自协议层处理器 1000的与多个设备对应的协议层配置文件, 并对各个设备进行管理以及设备层的仿真, 其中设备层配置文件包括设备的名称与类型、 设备属性、 设备控制命令、 设备动作和设 备内部的耦合关系; 子系统层处理器 3000用于建立仿真平台中的多个子系统, 并生成 与多个子系统对应的子系统层配置文件, 其中, 每个子系统包括一个或多个在设备层处 理器 2000中建立的设备, 并根据建立的多个子系统加载来自设备层处理器 2000的与多 个子系统中设备对应的设备层配置文件, 并对各个子系统以及每个子系统中的设备进行 管理和子系统层的仿真, 其中, 子系统层配置文件包括子系统属性、 子系统内部的设备 属性、 设备间的耦合条件和设备间的耦合关系; 系统层处理器 4000用于建立仿真平台 中的多个系统, 并生成与多个系统对应的系统层配置文件, 其中, 每个系统包括一个或 多个在子系统层处理器 3000 中建立的子系统, 并根据建立的多个系统加载来自子系统 层处理器 3000 的与多个系统中的子系统对应的子系统层配置文件, 并对各个系统以及 每个系统中的子系统进行管理和系统层的仿真, 其中系统层配置文件包括系统属性、 系 统内部的子系统属性以及子系统间的耦合关系, 。 其中, 协议层配置文件、 设备层配置 文件、 子系统层配置文件和系统层配置文件均以 XML ( Ex t ens i b l e Markup Language , 可扩展标记语言) 文件格式保存。  FIG. 1 is a schematic structural diagram of a simulation platform for an integrated circuit manufacturing apparatus according to an embodiment of the present invention. The simulation platform for integrated circuit manufacturing equipment includes a plurality of instruments to be simulated, a plurality of boards, and a simulation computer. Wherein each board comprises a plurality of channels, each channel being connected to a pin of one of the plurality of simulation instruments. The simulation computer communicates with multiple instruments to be simulated through multiple boards to simulate multiple instruments to be simulated. The emulation computer includes a protocol layer processor 1000, a device layer processor 2000, a subsystem layer processor 3000, and a system layer processor 4000. The protocol layer processor 1000 is configured to establish multiple communication protocols in the simulation platform, and generate a protocol layer configuration file corresponding to multiple communication protocols, and multiple communication protocols completed according to the foregoing configuration pass multiple boards and multiple The simulation device performs communication; the device layer processor 2000 is configured to establish a plurality of devices in the simulation platform, and generate a device layer configuration file corresponding to the plurality of devices, and load the protocol layer processor 1000 according to the established multiple devices. A protocol layer configuration file corresponding to multiple devices, and each device is managed and simulated at the device layer. The device layer configuration file includes the device name and type, device attributes, device control commands, device actions, and internal coupling relationships; The subsystem layer processor 3000 is configured to establish a plurality of subsystems in the simulation platform, and generate subsystem layer configuration files corresponding to the plurality of subsystems, wherein each subsystem includes one or more established in the device layer processor 2000. Device, and loaded from device layer processor 20 according to multiple subsystems established 00 device layer configuration file corresponding to devices in multiple subsystems, and management and subsystem layer simulation of each subsystem and devices in each subsystem, wherein the subsystem layer configuration file includes subsystem attributes and subsystem internals Device attributes, coupling conditions between devices, and coupling relationships between devices; system layer processor 4000 is used to establish multiple systems in the simulation platform, and generate system layer configuration files corresponding to multiple systems, where each system Include one or more subsystems established in the subsystem layer processor 3000, and load subsystem subsystem profiles corresponding to subsystems of the plurality of systems from the subsystem layer processor 3000 according to the established multiple systems, The management and system layer simulations are performed for each system and subsystems in each system. The system layer configuration files include system attributes, subsystem attributes within the system, and coupling relationships between subsystems. The protocol layer configuration file, the device layer configuration file, the subsystem layer configuration file, and the system layer configuration file are all saved in the XML (Extens ens i b l e Markup Language) file format.
如图 2所示, 利用可视化用户操作界面对系统层、 子系统层、 设备层和协议层进行 配置及管理, 通过系统层、 子系统层、 设备层和协议层的逐层查询和调用配置文件及收 发控制命令实现仿真平台与待仿真仪器的通信, 进而执行相应的仿真动作。 具体而言, 如图 3所示, 用户在本发明实施例的仿真平台的主界面上创建新工程, 然后创建各个层 次所需要的组件, 包括协议、 设备、 子系统和系统, 并对各个组件配置属性以及接口所 对应的各项命令。 图 4为仿真平台的配置管理( Conf i g )主界面。 用户可以配置各个组 件的属性, 通过获得各层对应组件的默认值(预设值), 然后显示在操作界面上, 用户通 过在操作界面上修改属性, 同时将对应组件的属性变化值更新到 XML文件中并其保存。 在对仿真平台配置完成后, 验证配置的正确性, 即验证配置后的组件是否能与待仿真仪 器进行通信, 当验证配置正确后进行仿真运行环节。图 5为仿真平台的运行管理主界面。 As shown in FIG. 2, the system layer, the subsystem layer, the device layer, and the protocol layer are configured and managed by using a visual user operation interface, and the layer-by-layer query and call configuration files are performed through the system layer, the subsystem layer, the device layer, and the protocol layer. And transmitting and receiving control commands to realize communication between the simulation platform and the instrument to be simulated, and then perform corresponding simulation actions. Specifically, as shown in FIG. 3, the user creates a new project on the main interface of the simulation platform of the embodiment of the present invention, and then creates components required for each layer, including protocols, devices, subsystems, and systems, and components. Configuration properties and commands corresponding to the interface. Figure 4 shows the main interface of the configuration management (Conf ig ) of the simulation platform. The user can configure the properties of each component by obtaining the default values (preset values) of the corresponding components of each layer, and then displaying them on the operation interface. After modifying the properties on the operation interface, the property change values of the corresponding components are updated into the XML file and saved. After the configuration of the simulation platform is completed, verify the correctness of the configuration, that is, verify whether the configured components can communicate with the instrument to be simulated, and perform simulation running after the verification configuration is correct. Figure 5 shows the main interface of the operation and management of the simulation platform.
下面结合具体实施例对协议层处理器 1000、 设备层处理器 2000、 子系统层处理器 3000和系统层处理器 4000进行详细的说明。  The protocol layer processor 1000, the device layer processor 2000, the subsystem layer processor 3000, and the system layer processor 4000 are described in detail below in conjunction with specific embodiments.
如图 6所示, 协议层处理器 1000包括协议配置模块 1100和协议运行模块 1200。 其 中, 协议配置模块 1100用于建立仿真平台中的多个通信协议, 并生成与上述多个通信 协议对应的协议层配置文件,从而使得仿真平台可以根据配置的通信协议通过板卡与待 仿真仪器进行通信。协议运行模块 1200用于对由协议配置模块 1100配置后的通信协议 进行连接测试,从而验证通过该通信协议是否能实现与待仿真仪器的通信。当通过验证, 即根据该通信协议可以实现与待仿真仪器的通信时, 则可以凭该通信协议的协议格式与 待仿真仪器进行通信。  As shown in FIG. 6, the protocol layer processor 1000 includes a protocol configuration module 1100 and a protocol execution module 1200. The protocol configuration module 1100 is configured to establish multiple communication protocols in the simulation platform, and generate a protocol layer configuration file corresponding to the multiple communication protocols, so that the simulation platform can pass the board and the device to be simulated according to the configured communication protocol. Communicate. The protocol running module 1200 is configured to perform a connection test on the communication protocol configured by the protocol configuration module 1100, thereby verifying whether communication with the instrument to be simulated can be achieved through the communication protocol. When the communication with the instrument to be simulated can be realized by verification, that is, according to the communication protocol, the protocol to be simulated can be communicated with the protocol to be simulated.
图 7示出了协议层的总体架构图。 协议层配置模块 1100可以对协议层配置并管理 协议, 包括创建一个或多个协议、 保存一个或多个协议或从多个协议中删除一个或多个 协议。 其中, 协议层配置模块 1100通过生成协议层配置文件以向仿真平台配置通信协 议。 其中, 协议层配置文件包括一个或多个通信协议的协议类型和协议格式。 针对集成 电路制造设备领域的通信类型, 协议类型可以包括以太网协议、 串口协议、 模拟 10协 议、 数字 10协议和 DeviceNet协议。 由于仿真平台对外提供统一调用接口, 一个通信 基类派生出 4个通信子类, 基类提供统一接口, 子类提供具体通信模式的实现方法。 如 图 7所示, 由于模拟 10协议与数字 10协议的相似性, 因此釆用直接 I/0(Direct-IO) 类负责上述两种通信接口的管理; 串口类 Serialport实现对串口协议的通信管理, Ethernet类实现对以太网协议的通信管理, DeviceNet实现对 DeviceNet协议的通信管 理,同时上述四个通信接口类的管理是由通信管理类来实现的。相对于协议层的上层(如 设备层、 子系统层或系统层)对通信接口的调用只需要向通信接口管理类申请即可。  Figure 7 shows the overall architecture of the protocol layer. The protocol layer configuration module 1100 can configure and manage protocols for the protocol layer, including creating one or more protocols, saving one or more protocols, or deleting one or more protocols from multiple protocols. The protocol layer configuration module 1100 configures a communication protocol to the simulation platform by generating a protocol layer configuration file. The protocol layer configuration file includes a protocol type and a protocol format of one or more communication protocols. For communication types in the field of integrated circuit manufacturing equipment, protocol types may include Ethernet protocols, serial protocols, analog 10 protocols, digital 10 protocols, and DeviceNet protocols. Since the simulation platform provides a unified calling interface to the outside, a communication base class derives four communication subclasses, and the base class provides a unified interface, and the subclass provides a specific communication mode implementation method. As shown in Figure 7, due to the similarity between the analog 10 protocol and the digital 10 protocol, the direct I/O (Direct-IO) class is responsible for the management of the above two communication interfaces; the serial port Serialport implements the communication management of the serial protocol. Ethernet class realizes communication management of Ethernet protocol, DeviceNet implements communication management of DeviceNet protocol, and management of the above four communication interface classes is realized by communication management class. The call to the communication interface relative to the upper layer of the protocol layer (such as the device layer, subsystem layer or system layer) only needs to apply to the communication interface management class.
下面结合图 8至图 12描述本发明实施例的五种通信协议。  The five communication protocols of the embodiments of the present invention are described below with reference to Figs. 8 through 12.
1 ) DeviceNet协议  1) DeviceNet protocol
如图 8所示,协议配置模块 1100可以对 DeviceNet接口配置除物理端口之外的所有 通信参数。 为了避免接收数据的丢失, DeviceNet类接收到数据之后将开启一个线程去 处理接收到的数据, 并且接收数据线程则继续监听端口, 准备接收新的数据。 由于一个 设备独占一个物理端口, 因此在发送数据的过程中不再开启线程, 单个设备内部对发送 过程进行控制, 不会出现两个数据同时发送的情况。 其中, DeviceNet协议使用的是统 一的协议格式, 因此不需要自定义协议格式。  As shown in FIG. 8, the protocol configuration module 1100 can configure all communication parameters except the physical port to the DeviceNet interface. In order to avoid the loss of received data, the DeviceNet class will open a thread to process the received data after receiving the data, and the receiving data thread will continue to listen to the port, ready to receive new data. Since a device monopolizes a physical port, the thread is no longer opened during the process of sending data, and the transmission process is controlled within a single device, and no two data are simultaneously transmitted. Among them, the DeviceNet protocol uses a unified protocol format, so no custom protocol format is required.
2 ) 以太网协议  2) Ethernet protocol
如图 9所示, 协议配置模块 1100可以对以太网接口配置用户自定义的命令格式。 为 了避免接收数据的丢失, 以太网类( Ethernet类)接收到数据之后将开启一个线程去处 理接收到的数据, 而接收数据线程则继续监听端口, 准备接收新的数据。 由于一个设备 独占一个端口,因此发送数据的过程不再开启线程,单个设备内部对发送过程进行控制, 从而不会出现两个数据同时发送的情况。 As shown in FIG. 9, the protocol configuration module 1100 can configure a user-defined command format for the Ethernet interface. In order to avoid the loss of received data, the Ethernet class (the Ethernet class) will open a thread after receiving the data. The received data is processed, and the receiving data thread continues to listen to the port, ready to receive new data. Since a device monopolizes a port, the process of sending data no longer turns on the thread, and the single device internally controls the sending process so that no two data are simultaneously transmitted.
3 ) 串口协议  3) Serial protocol
如图 10所示, 协议配置模块 11 00可以配置串口的波特率、 停止位、 握手信号、 数 据位、 校验方式等内容。 为了避免接收数据的丢失, 串口类 (Ser i a l por t )接收到数据 之后都会开启一个线程去处理接收到的数据, 而接收数据线程则继续监听串口, 准备接 收新的数据。 由于一个设备独占一个端口, 因此发送数据的过程不再开启线程, 单个设 备内部对发送过程进行控制, 从而也不会出现两个数据同时发送的情况。  As shown in Figure 10, the protocol configuration module 11 00 can configure the baud rate, stop bit, handshake signal, data bit, and check mode of the serial port. In order to avoid the loss of received data, the serial port class (Ser i a l por t ) will open a thread to process the received data after receiving the data, and the receiving data thread will continue to listen to the serial port, ready to receive new data. Since a device monopolizes a port, the process of sending data no longer turns on the thread, and the single device internally controls the sending process, so that no two data are simultaneously transmitted.
4 )模拟 10协议  4) Simulation 10 protocol
本发明实施例的仿真平台釆用模拟 10板卡, 可以设置模拟 10的每个通道的电平范 围以及模拟 10通道与实际物理通道的对应关系。 如图 11所示, 当接收到数据后, 如果 此数据与之前的数据相比发生变化则表示有新的数据来到, 需要向上层(如设备层、 子 系统层或系统层) 传输此新的数据。 由于模拟 10口接收到的数据为模拟量, 因此根据 前后两个数据的误差判断两个数据是否一致, 如果前后两个数据的误差超过一定的范围 则表示有新的数据来到。 其中, 模拟 10协议使用的是统一的协议格式, 所以不需要自 定义协议格式。  The simulation platform of the embodiment of the present invention uses the analog 10 board, and can set the level range of each channel of the analog 10 and the corresponding relationship between the analog 10 channel and the actual physical channel. As shown in Figure 11, after receiving the data, if this data changes compared with the previous data, it means that new data comes, and the new layer needs to be transmitted to the upper layer (such as device layer, subsystem layer or system layer). The data. Since the data received by the analog 10-port is analog, it is judged whether the two data are consistent according to the error of the two data before and after. If the error of the two data before and after exceeds a certain range, it means that new data comes. Among them, the analog 10 protocol uses a unified protocol format, so there is no need to customize the protocol format.
5 )数字 10协议  5) Digital 10 Protocol
本发明实施例的仿真平台釆用数字 10板卡, 可以设置数字 10的高低电平范围, 以 及 10通道与实际物理通道的对应关系。 如图 12所示, 数字 10的每个线程负责一个板 卡通道, 当接收到数据后, 如果此数据与之前的数据相比发生了变化就表示有新的数据 来到, 需要向上层 (如设备层、 子系统层或系统层)传输此新的数据。 其中, 数字 10 协议使用的是统一的协议格式, 所以不需要自定义协议格式。  The simulation platform of the embodiment of the present invention uses a digital 10 card to set the high and low range of the digital 10 and the corresponding relationship between the 10 channels and the actual physical channel. As shown in Figure 12, each thread of the number 10 is responsible for one board channel. When the data is received, if this data changes compared with the previous data, it means that new data comes, and the upper layer needs to be The device layer, subsystem layer, or system layer) transmits this new data. Among them, the digital 10 protocol uses a unified protocol format, so no custom protocol format is required.
由于集成电路制造设备领域的设备根据厂家的不同而使用的通信协议不同, 即时使 用的通信协议相同, 但是每种设备的协议格式是互不相同, 因此在对以太网协议和串口 协议的配置过程中, 需要对协议格式进行自定义。  Since the devices in the field of integrated circuit manufacturing equipment use different communication protocols according to different manufacturers, the communication protocols used in the same instant are the same, but the protocol formats of each device are different from each other, so the configuration process of the Ethernet protocol and the serial port protocol is performed. In the middle, you need to customize the protocol format.
通信协议中每个字段的作用也是不同的, 在本发明实施例的仿真平台中通信协议的 协议格式按照其作用可以分为三种类型的字段:  The role of each field in the communication protocol is also different. In the simulation platform of the embodiment of the present invention, the protocol format of the communication protocol can be divided into three types of fields according to its function:
A. 命令名称 ( CommandName )  A. Command Name ( CommandName )
命令名称主要用于标识一个命令, 相当于命令的名称, 通过判断该命令字段区分不 同的命令。 其中, 命令为待仿真仪器与仿真计算机之间交互的命令。  The command name is mainly used to identify a command, which is equivalent to the name of the command. By distinguishing the command field, different commands are distinguished. The command is a command for interaction between the instrument to be simulated and the simulation computer.
B. 属性参数 ( Parame t erName )  B. Attribute parameters ( Parame t erName )
属性参数主要用于表示属性的值或者名称。 当待仿真仪器向仿真计算机发送一个参 数的查询命令的时候, 需要釆用该类型的字段表示将要查询的属性参数的名称。 当仿真 计算机返回给待仿真仪器一个参数的值或者待仿真仪器向仿真计算机设置一个属性参 数的值的时候, 需要使用属性参数表示参数的具体数值。 Attribute parameters are mainly used to represent the value or name of an attribute. When the instrument to be simulated sends a parameter query command to the simulation computer, it is necessary to use the field of the type to indicate the name of the attribute parameter to be queried. When the simulation computer returns a value to a parameter of the instrument to be simulated or the instrument to be simulated sets an attribute parameter to the simulation computer When the value of the number is used, the attribute parameter is required to represent the specific value of the parameter.
C. 其他 ( Other )  C. Other ( Other )
除上述两种类型的字段作用外, 还有没有明确的作用字段, 或者用于进行奇偶校验 的字段, 或者只进行空白数据填充的字段, 上述类型的字段统称为其他类型字段。  In addition to the above two types of field functions, there are no explicit action fields, or fields for parity check, or fields filled with only blank data. Fields of the above type are collectively referred to as other types of fields.
当协议类型为以太网协议或串口协议时,协议层处理器 1000进一步包括协议封装模 块 1300。 其中, 协议封装模块 1300包括数据解包接口和数据封包接口。 为了满足自定 义协议格式的要求, 利用数据解包接口和数据封包接口对仿真计算机与待仿真仪器之间 传递的数据进行解包操作和封包操作。  When the protocol type is an Ethernet protocol or a serial port protocol, the protocol layer processor 1000 further includes a protocol encapsulation module 1300. The protocol encapsulation module 1300 includes a data unpacking interface and a data encapsulation interface. In order to meet the requirements of the custom protocol format, the data unpacking interface and the data packet interface are used to perform unpacking operations and packet operations on the data transmitted between the simulation computer and the instrument to be simulated.
如图 13所示, 通过数据解包接口执行数据解包的过程包括如下步骤:  As shown in FIG. 13, the process of performing data unpacking through the data unpacking interface includes the following steps:
S1301 仿真端 (即仿真计算机)接收到数据, 即从板卡发送到仿真计算机的数据。  The S1301 emulation side (ie the emulation computer) receives the data, ie the data sent from the board to the emulation computer.
S1302 将字符串转换为字符数组;  S1302 converts a string into a character array;
S1303 读取协议字段配置信息;  S1303 reads protocol field configuration information;
S1304 判断字段是否为命令名称;  S1304 determines whether the field is a command name;
S1305 当判断字段为命令名称时, 保存该命令名称;  S1305, when the judgment field is a command name, save the command name;
S1306 当判断字段不为命令名称时, 继续判断该字段是否为参数信息;  S1306, when the judgment field is not the command name, continue to determine whether the field is parameter information;
S1307 当判断字段为参数信息时, 保存该参数信息;  S1307, when the judgment field is parameter information, save the parameter information;
S1308 当判断字段为其他信息时, 忽略不做处理;  S1308 ignores no processing when the judgment field is other information;
S1309 判断是否还有协议字段没有处理, 如果有, 则执行 S1303; 如果没有, 则执 行 S1310;  S1309 determines whether there is still a protocol field not processed, if yes, execute S1303; if not, execute S1310;
S1310 解包过程结束。  The S1310 unpacking process ends.
数据解包接口解析出数据的命令名称以及命令所带的参数以及控制信息。 其中, 由 于布尔型通信协议与数值型通信协议格式只有一个字段, 一个字节, 因此名称与命令所 带的参数均指一个字节的数据。  The data unpacking interface parses out the command name of the data and the parameters and control information of the command. Among them, since the Boolean communication protocol and the numeric communication protocol format have only one field, one byte, the parameters carried by the name and the command all refer to one byte of data.
如图 14所示, 通过数据封包接口执行数据封包的过程包括如下步骤:  As shown in FIG. 14, the process of performing data encapsulation through the data encapsulation interface includes the following steps:
S1401 : 仿真计算机发送数据, 即从仿真计算机发送数据至板卡。  S1401: The emulation computer sends data, that is, sends data from the emulation computer to the board.
S1402: 读取发送协议字段配置信息;  S1402: Read the transmission protocol field configuration information;
S1403: 判断字段是否为命令名称;  S1403: determining whether the field is a command name;
S1404: 如果判断字段为命令名称, 则发送命令名称至发送链表;  S1404: If the judgment field is a command name, send a command name to the sending list;
S1405: 当判断字段不为命令名称时, 继续判断该字段是否为参数信息;  S1405: When the judgment field is not the command name, continue to determine whether the field is parameter information;
S1406: 当判断字段为参数信息时, 查询设备参数值, 将参数值加进发送链表; S1407: 当判断字段为其他信息时, 计算校验和或者填充;  S1406: When the judgment field is the parameter information, query the device parameter value, and add the parameter value to the sending linked list; S1407: When the determining field is other information, calculate the checksum or fill;
S1408: 判断是否还有协议字段没有处理, 如果有, 则执行 S1402; 如果没有, 则执 行 S1409;  S1408: determining whether there is still a protocol field not processed, if yes, executing S1402; if not, executing S1409;
S1409: 封包过程结束。  S1409: The packet process ends.
在数据封包过程中, 根据协议格式的内容, 在命令名称字段填写命令名称, 在参数 字段填写参数值, 在校验和字段计算校验和的值, 数据以字符串类型的数据发送出去。 如果是布尔型通信协议或者数值型通信协议, 不需要进行复杂的操作, 只需要判断要发 送的数据是 1或者 0 , 从而直接向 10端口发送 1或者 0。 In the data packet process, according to the content of the protocol format, fill in the command name in the command name field, in the parameter The field fills in the parameter value, the checksum field is calculated in the checksum field, and the data is sent as string type data. If it is a Boolean communication protocol or a numerical communication protocol, it is not necessary to perform complicated operations, and it is only necessary to judge whether the data to be transmitted is 1 or 0, thereby directly transmitting 1 or 0 to the 10 port.
在创建协议配置通信参数时, 协议层不会给出物理端口的配置内容。 因为一个设备 可能会有多种通信方式, 接收命令时会以不同通信方式来完成。 为了区分, 仿真平台在 子系统层添加设备时才对物理端口进行配置。  When creating a protocol configuration communication parameter, the protocol layer does not give the configuration content of the physical port. Because a device may have multiple communication methods, it will be done in different communication modes when receiving commands. To differentiate, the emulation platform configures the physical port only when devices are added at the subsystem level.
在本发明的一个实施例中, 协议层配置文件釆用 XML格式保存协议数据。 仿真平 台釆用 XML文件来保存协议数据, 从而当用户需要该协议时, 可以直接读取 XML文 件, 操作方便。  In one embodiment of the invention, the protocol layer configuration file saves the protocol data in an XML format. The emulation platform uses XML files to store protocol data, so that when the user needs the protocol, the XML file can be directly read, which is convenient to operate.
当协议配置模块 1100配置完成需要的通信协议后, 协议运行模块 1200需要对该通 信协议进行连接测试以验证该通信协议。 图 15为协议运行模块的连接测试界面。 当仿 真计算机与待仿真仪器之间有数据传输时, 则表示该通信协议通过验证。 通过验证的通 信协议, 可以凭该通信协议的协议格式与多个待仿真仪器进行通信。  After the protocol configuration module 1100 is configured to complete the required communication protocol, the protocol operation module 1200 needs to perform a connection test on the communication protocol to verify the communication protocol. Figure 15 shows the connection test interface of the protocol running module. When there is data transmission between the simulation computer and the instrument to be simulated, it means that the communication protocol is verified. The verified communication protocol allows communication with a plurality of instruments to be simulated in accordance with the protocol format of the communication protocol.
如图 16所示, 仿真平台通过物理端口与待仿真仪器进行通信包括如下步骤: S1601 : 初始化通信端口;  As shown in FIG. 16, the simulation platform communicates with the instrument to be simulated through the physical port, and includes the following steps: S1601: Initialize the communication port;
S1602: 打开通信端口;  S1602: Open the communication port;
S1603: 检测是否收到数据, 如果收到数据则执行 S1604; 否则执行 S1605 ;  S1603: Detect whether data is received, if it receives data, execute S1604; otherwise, execute S1605;
S1604: 对该数据进行处理;  S1604: processing the data;
S1605: 等待预定时间, 在本发明的一个实施例中, 该预定时间可以为 50毫秒; S1606: 判断是否关闭端口, 如果判断关闭端口则执行 S1607 ; 否则执行 S1603 ; S1605: Waiting for a predetermined time, in an embodiment of the present invention, the predetermined time may be 50 milliseconds; S1606: determining whether to close the port, if it is determined to close the port, executing S1607; otherwise, executing S1603;
S1607: 关闭端口, 停止接收数据。 S1607: Close the port and stop receiving data.
本发明实施例的协议层处理器 1000可以对仿真平台所需要的通信协议进行配置, 并 可以进一步将写有协议层配置内容的协议层配置文件提供给设备层, 从而使得设备层接 收到子系统层的命令后通过通信协议规定收发方式进行仿真动作, 进而实现与待仿真仪 器之间的通信。  The protocol layer processor 1000 of the embodiment of the present invention can configure a communication protocol required by the simulation platform, and can further provide a protocol layer configuration file written with protocol layer configuration content to the device layer, so that the device layer receives the subsystem. After the command of the layer, the communication protocol is specified by the communication protocol to perform the simulation operation, thereby implementing communication with the instrument to be simulated.
如图 17所示, 设备层处理器 2000包括设备配置模块 2100和设备运行模块 2200。 其中, 设备配置模块 21 00用于建立仿真平台中的多个设备, 并生成与上述多个设备对 应的设备层配置文件以对建立的多个设备进行配置, 并将协议层处理器 1000的协议层 配置文件对应地加载至多个已配置的设备,从而使得各个设备能够通过协议层配置文件 中配置的通信协议与待仿真仪器进行通信。 设备运行模块 22 00用于对配置后的设备进 行验证, 即验证设备是否能实现与待仿真仪器的通信。 当设备通过验证后, 即可以与待 仿真仪器的通信并实现设备层的仿真。  As shown in FIG. 17, the device layer processor 2000 includes a device configuration module 2100 and a device operation module 2200. The device configuration module 21 00 is configured to establish multiple devices in the simulation platform, and generate a device layer configuration file corresponding to the multiple devices to configure the established multiple devices, and configure the protocol layer processor 1000. The layer profile is correspondingly loaded to a plurality of configured devices such that each device can communicate with the instrument to be simulated through a communication protocol configured in the protocol layer configuration file. The device operation module 22 00 is used to verify the configured device, that is, whether the device can communicate with the instrument to be simulated. When the device is verified, it can communicate with the instrument to be simulated and simulate the device layer.
图 18示出了设备层的总体架构图。设备层配置模块 2100可以设备层配置并管理设 备, 包括创建一个或多个设备、 保存设备、 从多个设备中删除一个或多个设备或打开一 个或多个设备。 其中, 设备层配置模块 2100通过生成设备层配置文件以配置多个设备。 其中, 设备层配置文件包括设备的名称与类型、 设备属性、 设备控制命令、 设备动作和 设备内部的耦合关系。 如图 19所示, 设备属性包括设备的属性名称、 设备的属性类型、 设备的属性最大值、 设备的属性最小值和设备的属性默认值; 设备控制命令包括设备控 制命令的名称、 设备控制命令的传递方向、 设备控制命令的内容、 设备控制命令使用协 议名称、 设备控制命令的命令范围、 设备控制命令的包含属性数量和保护属性名称; 设 备动作包括设备的动作名称和与动作名称耦合的设备控制命令、 动作的步骤数目以及与 每一步骤对应的设备动作类型。 其中, 设备动作类型包括命令行为、 动作条件、 延迟等 待、 变化规律和返回信息; 设备内部的耦合关系包括设备名称、 耦合属性名称、 耦合条 件和与耦合条件对应的耦合关系命令。 在本发明的一个实施例中, 设备层配置文件可以 釆用 XML格式保存数据。 Figure 18 shows an overall architectural diagram of the device layer. The device layer configuration module 2100 can configure and manage devices at the device layer, including creating one or more devices, saving devices, deleting one or more devices from multiple devices, or opening one or more devices. The device layer configuration module 2100 configures multiple devices by generating a device layer configuration file. The device layer configuration file includes the name and type of the device, device attributes, device control commands, device actions, and coupling relationships within the device. As shown in Figure 19, the device attributes include the attribute name of the device, the attribute type of the device, the maximum value of the device, the minimum value of the device, and the default value of the device. The device control command includes the name of the device control command and the device control command. The direction of the transfer, the content of the device control command, the device control command using the protocol name, the command range of the device control command, the number of included attributes of the device control command, and the name of the protection attribute; the device action includes the action name of the device and the device coupled with the action name The number of steps that control commands, actions, and the type of device action that corresponds to each step. The device action types include command behavior, action condition, delay wait, change rule, and return information. The internal coupling relationship of the device includes a device name, a coupling attribute name, a coupling condition, and a coupling relationship command corresponding to the coupling condition. In one embodiment of the invention, the device layer configuration file may save the data in an XML format.
下面参考图 20描述设备层配置模块 2100配置管理流程。  The device layer configuration module 2100 configuration management flow will be described below with reference to FIG.
S2001 : 进入设备层;  S2001: Enter the device layer;
S2002: 创建设备;  S2002: creating a device;
为了方便大量设备的归类和查找, 釆用树状结构来管理。 如图 21所示, Device (设 备 )信息树由 Device节点和 Action (动作)、 Command (控制命令 )和 Property (属性) 三种叶子节点组成。 其中, 一个 Device 中可以包含任意个 Action (动作) 、 Command (控制命令 )和 Property (属性)叶子节点, 而 Action (动作) 、 Command (控制命令 ) 和 Property (属性) 节点必须属于某个 Device (设备) 结点。  In order to facilitate the classification and searching of a large number of devices, it is managed by a tree structure. As shown in Figure 21, the Device information tree consists of the Device node and the Action leaf, Command, and Property leaf nodes. Among them, a Device can contain any Action (Action), Command (Control) and Property leaf nodes, and the Action, Command, and Property nodes must belong to a Device ( Equipment) Node.
如图 22所示, 设备配置模块 2100在创建设备的名称与类型时, 具有以下功能: 添加: 创建设备名称与设备的所属类型。  As shown in Figure 22, when the device configuration module 2100 creates the name and type of the device, it has the following functions: Add: Create the device name and the type of the device.
编辑: 创建完成之后可以对设备属性中的任何一项进行编辑。  Edit: You can edit any of the device properties after the creation is complete.
删除: 可以在设备名称列表中删除添加的设备名称和类型。  Delete: The added device name and type can be deleted from the device name list.
保存: 将设备名称和类型保存成 XML文件, 方便用户读取。  Save: Save the device name and type as an XML file for easy reading.
S2003 : 保存设备列表;  S2003: save the device list;
S2004: 选择设备;  S2004: selecting a device;
S2005 : 创建设备属性;  S2005: Create device attributes;
根据已创建的设备列表选取需要配置属性的设备, 设备配置模块 2100在创建设备 属性时, 具有如下功能:  The device configuration module 2100 selects the device that needs to be configured according to the created device list. When the device configuration module 2100 creates the device attribute, it has the following functions:
添加: 选取设备之后, 添加该设备属性, 新的设备属性会添加进设备属性列表中。 配置的设备属性内容包括属性名称、 属性类型(例如: int, string等)、 属性最大值(可 选) 、 属性最小值 (可选) 、 属性默认(初始)值。  Add: After selecting a device, add the device properties and the new device properties are added to the device properties list. The configured device attribute contents include attribute name, attribute type (for example: int, string, etc.), attribute maximum (optional), attribute minimum (optional), and attribute default (initial) value.
编辑: 创建完成之后可以对设备属性中的任何一项进行编辑。  Edit: You can edit any of the device properties after the creation is complete.
删除: 可以在设备属性列表中删除添加的设备属性。  Delete: The added device properties can be removed from the device properties list.
保存: 将设备属性保存成 XML文件, 方便用户读取。  Save: Save the device properties as an XML file for easy reading.
如图 23 所示, 在 PropertyName 对应的文本框中填入设备的属性名称, 在 Property Type对应的下拉菜单中选取该属性的类型。 在本发明的一个实施例中, 设备属 性的类型包括布尔类型或数值类型等。 然后在下方的文本框中按对应的文字提示填入该 属性的最大值, 最小值和默认初始值。如果不存在属性的最大值, 最小值或默认初始值, 则允许不存在的值为空。 As shown in Figure 23, fill in the property name of the device in the text box corresponding to PropertyName. Select the type of the attribute from the drop-down menu corresponding to the Property Type. In one embodiment of the invention, the type of device attribute includes a Boolean type or a numeric type, and the like. Then fill in the maximum, minimum and default initial values of the attribute in the text box below. If there is no maximum, minimum or default initial value for the attribute, the value that does not exist is allowed to be null.
S2006: 保存设备属性;  S2006: saving device attributes;
如图 23所示, 点击 Add (添加)将设备属性添加到右边的列表。 在右边的列表中, 可以对添加的选项进行编辑和删除。 配置完成之后点击 Save (保存)即保存该设备属性 并可返回设备配置管理界面。 如果之后需要进行编辑和删除, 可以重复上述动作。  As shown in Figure 23, click Add to add the device properties to the list on the right. In the list on the right, you can edit and delete the added options. Click Save after the configuration is complete to save the device properties and return to the device configuration management interface. If you need to edit and delete later, you can repeat the above actions.
S2007 : 创建设备控制命令;  S2007: Create device control commands;
根据已创建的设备列表选取需要配置控制命令的设备, 设备配置模块 2100在创建 设备控制命令时, 具有如下功能:  The device configuration module 2100 selects the device that needs to be configured with the control command. The device configuration module 2100 has the following functions when creating the device control command:
添加: 选取设备之后, 添加设备控制命令的名称、 命令方向和返回信息。 其中, 命 令方向包括接收、 发送、 发送给自身。 其中, 命令方向为发送给自身时, 为了触发设备 内耦合。 添加上步完成之后, 之后添加的命令内容包括协议名称、 协议地址范围、 协议 地址、 命令说明、 命令属性个数和指定命令中的设备属性。  Add: After selecting a device, add the name, command direction, and return information of the device control command. The command direction includes receiving, sending, and sending to itself. Wherein, when the command direction is sent to itself, in order to trigger the in-device coupling. After adding the previous step, the contents of the command added include the protocol name, protocol address range, protocol address, command description, number of command attributes, and device attributes in the specified command.
其中, 协议与控制命令是一一对应的关系, 即一个控制命令对应一种协议格式。 协 议名称可以选取配置协议时创建的各种协议。  The protocol and the control command have a one-to-one correspondence, that is, one control command corresponds to one protocol format. The protocol name can be selected from various protocols created when the protocol is configured.
协议地址范围: 当协议为串口和 TCP/IP协议时, 由于协议层对该两类协议自我封 装了协议格式, 有可能出现多段 String类型的协议字段, 因此需要指定该命令的字段属 于哪一段 String字段。 在本发明的一个实施例中, 该协议地址范围为可选。  Protocol address range: When the protocol is serial port and TCP/IP protocol, since the protocol layer encapsulates the protocol format for the two types of protocols, there may be multiple segments of the String type protocol field. Therefore, it is necessary to specify which segment of the field the command belongs to. Field. In one embodiment of the invention, the protocol address range is optional.
协议地址: 用于指定控制命令发送的物理地址或者端口号。  Protocol Address: Used to specify the physical address or port number to which the control command is sent.
命令说明: 用于对控制命令的文字解释。  Command Description: Used to interpret the text of the control command.
命令属性个数: 该控制命令所带的设备属性个数。  Number of command attributes: The number of device attributes carried by this control command.
指定命令中的设备属性: 用于对该控制命令中所带设备属性进行指定。 例如: 控制 命令所带 3个设备属性, 分别指定 3个设备属性的属性内容。  Specify the device attribute in the command: Used to specify the device attribute carried in the control command. For example: The control device has three device attributes, and specifies the attribute contents of the three device attributes.
将新的设备控制命令会添加进设备命令列表中。  Add new device control commands to the device command list.
编辑: 创建完成之后可以对设备命令中的任何一项进行编辑。  Edit: You can edit any of the device commands after the creation is complete.
删除: 可以在设备命令列表中删除添加的设备命令。  Delete: The added device command can be deleted from the device command list.
保存: 将设备命令保存成 XML文件。  Save: Save the device command as an XML file.
如图 24所示, 首先需要在 DeviceName下拉菜单中选取需要配置的设备。  As shown in Figure 24, you need to select the device to be configured in the DeviceName drop-down menu.
第一步, 在 CommandName 对应的文本框中填入设置控制命令的命令名称, 在 CommandDirection对应的下拉菜单中选择该控制命令的发送方向(即判断该控制命令为 发送或者接收) , 然后在 CommandNote里面填入该控制命令的一个简单说明。 第二步, 在 ProtocolName下拉选项中选取该控制命令需要使用的协议名称。 第三步, 需要确认该 条控制命令中所带参数对应的设备属性。 在 ParameterNumber对应的文本框中填入该命 令所带的参数数量, 填写确定之后点击 OK即可, 然后在下方的表格中会自动生成填入 的数字数量的列, 每一列代表一个参数, 然后在每一个参数的下方会有一个下拉菜单选 项, 选项为之前配置的所有属性名称, 选择所对应的属性名称之后, 点击 Add将属性名 称添加进入右边的列表。 在右边的列表中, 可以对添加的选项进行编辑和删除。 配置完 成之后点击 OK即可返回设备配置管理界面。 如果之后需要进行编辑和删除, 可以重复 上述动作。 In the first step, fill in the command name corresponding to the command name in the text box corresponding to CommandName, select the sending direction of the control command in the drop-down menu corresponding to CommandDirection (ie, judge the control command to send or receive), and then in CommandNote Fill in a brief description of the control command. In the second step, select the protocol name to be used by the control command in the ProtocolName drop-down option. In the third step, it is necessary to confirm the device attribute corresponding to the parameter in the control command. Fill in the name in the text box corresponding to ParameterNumber To make the number of parameters, click OK and then click OK. Then in the table below, the filled number of columns will be automatically generated. Each column represents a parameter, and then there will be a drop-down menu below each parameter. Option, the option is all the attribute names configured before, after selecting the corresponding attribute name, click Add to add the attribute name to the list on the right. In the list on the right, you can edit and delete the added options. Click OK when the configuration is complete to return to the device configuration management interface. If you need to edit and delete later, you can repeat the above actions.
S2008 : 保存设备命令;  S2008: save device command;
配置完成之后点击 Save (保存)即保存该设备属性并可返回设备配置管理界面。 如 果之后需要进行编辑和删除, 可以重复上述动作。  Click Save after the configuration is complete to save the device properties and return to the device configuration management interface. If you need to edit and delete later, you can repeat the above actions.
S2009: 选择设备;  S2009: Select device;
根据已创建的设备列表选取需要配置动作的设备。  Select the device for which you want to configure actions based on the list of devices you have created.
S2010: 创建设备动作;  S2010: Create device actions;
设备配置模块 2100创建设备动作包括如下功能:  The device configuration module 2100 creates device actions including the following functions:
添力口:  Add force:
1 )选取设备之后, 添加动作名称, 新的动作名称会添加进动作名称列表, 图 25示 出了设备动作名称的配置界面。 首先需要在 DeviceName下拉菜单中选取需要配置的设 备设置与编辑设备动作界面分了 2 个页面。 其中, 第一个页面为创建动作名称的 ActionManager 页面, 另一个页面为设置动作内容的 ActionEdit 页面。 需要先在 ActionManager页面创建了动作名称之后再在 ActionEdit页面对每个新建动作设置内容。  1) After selecting the device, add the action name, the new action name will be added to the action name list, and Figure 25 shows the configuration interface of the device action name. First, you need to select the device settings you want to configure and the editing device action interface in the DeviceName drop-down menu. The first page is the ActionManager page that creates the action name, and the other page is the ActionEdit page that sets the action content. You need to create the action name on the ActionManager page before setting the content for each new action in the ActionEdit page.
首先在 ActionManager页面, 在 ActionName对应的文本框中填入动作名称, 然后 点击 Add添加进入右边的列表。 在右边的列表中, 可以对添加的选项进行编辑和删除。 配置完成之后点击 ActionEdit选项进入设置动作内容界面,  First on the ActionManager page, fill in the action name in the text box corresponding to the ActionName, then click Add to add to the list on the right. In the list on the right, you can edit and delete the added options. After the configuration is complete, click the ActionEdit option to enter the settings action content interface.
2 )根据创建的动作列表选取需要配置的设备动作;  2) Select the device action to be configured according to the created action list;
3 )根据创建的设备命令列表选取与动作耦合的设备控制命令, 其中, 设备控制命 令包括发送给自身的用来触发设备内的耦合行为,设备只有在接收到相关命令才能执行 相应的动作;  3) selecting, according to the created device command list, a device control command coupled with the action, where the device control command includes a coupling behavior sent to the device for triggering the device, and the device can perform the corresponding action only after receiving the relevant command;
4 )设置动作的步骤数目, 将动作细化为很多步骤, 每一步骤都对应一个设备动作 类型, 整个设备动作分为每一个步骤来执行;  4) Set the number of steps of the action, refine the action into a number of steps, each step corresponds to a device action type, and the entire device action is divided into each step to execute;
5 ) 配置创建完成的每一个步骤。 其中设备动作类型包括命令行为 (Command Behavior )、动作条件( Condition )、延迟等待( WaitTime )、变化规律( VariationalRule )、 返回信息 (Return Info ) 。  5) Configure each step of the creation completion. The device action types include Command Behavior, Condition, WaitTime, VariationalRule, and Return Info.
如图 26所示, 在 ActionEdit界面, 第一步, 在 ActionName对应的下拉菜单中选 取之前创建的动作名称。 第二步, 在 CommandName对应的下拉菜单中选取之前创建的 命令名称。 第三步, 在 The Number of Steps对应的文本框中填入该动作在接收到指定命 令之后, 执行的动作类型数量, 第四步, 需要按顺序对执行的动作类型进行配置, 首先 在 Step No.对应的下拉菜单中, 选取在第三步填入的数量所对应的 Step进行配置。 例如 第三步中填入 3 , 说明要执行 3 种类型的动作, 则在 SepNo.对应的下拉菜单中出现了 Step l到 Step3。 例如选中 Stepl , 则可以在下方对该步骤配置动作类型。 As shown in Figure 26, in the ActionEdit interface, the first step is to select the name of the action created before in the drop-down menu corresponding to ActionName. In the second step, select the name of the previously created command in the drop-down menu corresponding to CommandName. In the third step, the text box corresponding to the Number of Steps is filled in the number of action types executed by the action after receiving the specified command, and the fourth step is to configure the action type to be executed in order, first In the drop-down menu corresponding to Step No., select the Step corresponding to the quantity filled in the third step to configure. For example, if you fill in 3 in the third step, it means that you need to perform 3 types of actions, then Step 1 to Step 3 appear in the drop-down menu corresponding to SepNo. For example, if you select Stepl, you can configure the action type for this step below.
根据不同的动作类型, 对设备动作的配置内容如下:  According to different action types, the configuration of the device action is as follows:
1 ) 配置命令行为: 该动作类型为将配置设备命令时给指定的命令所带设备属性赋 值。  1) Configure command behavior: This action type is to assign a device attribute to the specified command when the device command is configured.
如图 26所示, 点击 Command Behavior, 执行将命令中传递过来的参数与之前配置 的对应设备属性相对应, 即 Step3设置与编辑该设备所用通讯协议的命令中的功能。  As shown in Figure 26, click Command Behavior to execute the parameters passed in the command corresponding to the corresponding device attributes configured in the previous step, that is, the function in Step3 to set and edit the communication protocol used by the device.
2 )配置动作条件: 该动作类型为判断设备属性达到什么要求的时候执行下一步骤。 其中, 判断的动作条件可以组合, 在判断之后可以选择要执行的动作。 例如: 设备 MFC 的流速大于 1000 时, 执行一个步骤, 否则执行另一个步骤。 其中配置的内容包括: 设 备属性(根据创建的设备属性列表来选取) 、 条件判断 (包括大于、 小于、 判断两种是 否相等、 小于或等于、 大于或等于)、属性值(该属性值需要用户指定)、逻辑关系(和、 或、 异或) , 由此可以将很多条件判断组合成一种条件判断。 新的动作条件添加进动作 条件列表。  2) Configure the action condition: The action type is to perform the next step when determining what the device attribute meets. Wherein, the determined action conditions can be combined, and the action to be performed can be selected after the judgment. For example: When the flow rate of the device MFC is greater than 1000, perform one step, otherwise perform another step. The configuration includes: device attributes (selected according to the created device attribute list), conditional judgment (including greater than, less than, judge whether the two are equal, less than or equal to, greater than or equal to), attribute value (the attribute value requires the user) Specify), logical relationship (and, or, XOR), so that many conditional judgments can be combined into one conditional judgment. New action conditions are added to the action condition list.
如图 26所示, 点击 Condition之后, 会弹出界面让用户自定义, 如图 27所示。 首 先添加判断条件, 在 Property 对应的下拉菜单中选取之前配置的设备属性, 在 Relationship 对应的下拉菜单中选取与后面值的关系 (包括大于、 小于、 等于、 大于等 于、 小于等于 5种类型) , 然后再 Value对应的文本框中填入与属性相关的值。 例如当 压力大于 0.5时,则在 Property中选取压力, Relationship中选取大于, Value中填入 0.5。 然后点击 Add按钮, 将条件判断加入右边列表中。 因为判断条件可以同时存在, 因此有 AND , OR、 XOR三种选择。 例如当压力大于 0.5或温度小于 30的时候, 在第一个条件 设置并 Add之后点击 OR , 并且在此时设置第二个条件, 点击 Add则完成添加一个完整 的条件。  As shown in Figure 26, after clicking Condition, a pop-up interface will be displayed for the user to customize, as shown in Figure 27. First, add the judgment condition, select the previously configured device attribute in the drop-down menu corresponding to the Property, and select the relationship with the following values in the drop-down menu corresponding to the Relationship (including greater than, less than, equal to, greater than or equal to, less than or equal to 5 types). Then enter the value associated with the attribute in the text box corresponding to Value. For example, when the pressure is greater than 0.5, the pressure is selected in the Property, the Relationship is selected to be greater than, and the Value is filled with 0.5. Then click the Add button to add the conditional judgment to the list on the right. Because the judgment conditions can exist at the same time, there are three choices of AND, OR and XOR. For example, when the pressure is greater than 0.5 or the temperature is less than 30, click OR after the first condition is set and Add, and set the second condition at this time. Click Add to complete adding a complete condition.
然后在添加完一个判断条件之后, 需要设置判断之后的执行动作。 在 Then Step框 中, NextStep对应的下拉菜单中选取判断该条件之后的执行动作类型,在 Else Step框中, NextStep对应的下拉菜单中选取判断条件之后的另一个执行动作类型(两者允许为空)。 例如在压力大于等于 0.6这个条件下, 满足执行等待的动作, 则在 Then Step框中, 选 择 3-WaitTime;否则执行返回命令动作,则在 Else Ste 框中,选择返回信息( Return Info )。 然后点击 Add按钮添加进入右边列表,与上方定义的判断条件所对应。在右边的列表中, 可以对添加的选项进行编辑和删除。配置完成之后点击 OK即可返回设备动作配置界面。 如果之后需要进行编辑和删除, 可以重复上述动作。  Then, after adding a judgment condition, it is necessary to set the execution action after the judgment. In the Then Step box, select the execution action type after determining the condition in the drop-down menu corresponding to NextStep, and select another execution action type after the judgment condition in the drop-down menu corresponding to NextStep in the Else Step box (both are allowed to be empty) ). For example, if the action of waiting is satisfied under the condition that the pressure is greater than or equal to 0.6, select 3-WaitTime in the Then Step box; otherwise, execute the return command action, and in the Else Ste box, select the return information (Return Info). Then click the Add button to add to the list on the right, corresponding to the judgment conditions defined above. In the list on the right, you can edit and delete the added options. Click OK when the configuration is complete to return to the device action configuration interface. If you need to edit and delete later, you can repeat the above actions.
3 ) 配置延迟等待: 该动作类型为执行动作等待相应时间。 配置的内容包括: 等待 时间和下一步执行的步骤。 其中, 等待时间为需要执行等待多长时间, 单位为 ms。 下 一步执行的步骤用于选取下一步执行的步骤。 如图 26所示, 点击 WaitTime (等待时间)之后, 会进入等待时间配置界面 (图 28 所示)。 在 Delay对应的下拉菜单中选取等待的延迟时间大小。 配置完成之后点击 OK 即可返回设备动作配置界面。其中,延迟时间大小可以由设计方参照实际设备给出选项。 3) Configure delay wait: This action type is the execution time waiting for the corresponding time. The configuration includes: wait time and the next step. The waiting time is how long it needs to be executed, and the unit is ms. The next step is to pick the next step. As shown in Figure 26, after clicking WaitTime, the wait time configuration interface (shown in Figure 28) is entered. Select the waiting delay time in the drop-down menu corresponding to Delay. Click OK after the configuration is complete to return to the device action configuration interface. Among them, the delay time can be given by the designer with reference to the actual device.
4 ) 配置变化规律: 该动作类型用于指定设备属性的变化规律。 配置的内容包括: 设备属性(根据创建的设备属性列表选取) 、 变化规律、 自定义变化规律接口和下一步 执行的步骤。  4) Configuration change rule: This action type is used to specify the change rule of device attributes. The configuration includes: device attributes (selected according to the created device attribute list), change rules, custom change rules interface, and next steps.
其中, 变化规律包括 PID、 PI、 直接赋值和自定义, 由用户选取。 自定义变化规律 接口用于让用户自己定义属性的变化规律。 下一步执行的步骤用于选取下一步执行的步 骤。  Among them, the change rules include PID, PI, direct assignment and customization, which are selected by the user. Custom Change Rule The interface is used to let the user define the change rules of the attribute. The next step is to pick the next step.
如图 26所示, 点击 VariationalRule (变化规律)之后, 进入变化规律配置界面 (图 As shown in Figure 26, after clicking VariationalRule, enter the change rule configuration interface (Figure
29 所示) 。 如图 29 所示, 在 Property 下拉选项中选取需要变化的参数名称, 在 VariationalRule对应的下拉菜单中选取参数的变化规律 (例如 PID , PI, 用户自定义和 直接赋值) 。 图 30 ( a ) 、 图 30 ( b ) 、 图 30 ( c ) 和图 30 ( d ) 分别用户自定义、 PID、 PI和直接赋值的四种变化规律的配置界面。配置完成之后点击 OK即可返回设备动作配 置界面。 29 shown). As shown in Figure 29, select the parameter name to be changed in the Property drop-down option, and select the change rule of the parameter (such as PID, PI, user-defined and direct assignment) in the drop-down menu corresponding to VariationalRule. Figure 30 (a), Figure 30 (b), Figure 30 (c), and Figure 30 (d) configuration interfaces for user-defined, PID, PI, and direct assignment, respectively. Click OK when the configuration is complete to return to the device action configuration interface.
5 ) 配置返回信息: 该动作类型指定设备给待仿真仪器的返回信息。 配置的内容包 括: 命令名称(根据创建的设备命令列表中返回类型里选取) 、 协议名称 (含义与配置 命令相同, 根据创建的协议列表选取) 、 设置命令所带属性(设置该返回信息所带的设 备属性) 、 下一步执行的步骤 (选取下一步执行的步骤) 。  5) Configuration return information: This action type specifies the return information of the device to the instrument to be simulated. The configuration includes: Command name (selected according to the return type in the created device command list), Protocol name (meaning the same as the configuration command, selected according to the created protocol list), Set the attributes of the command (set the return information Device properties), the next step (select the next step).
如图 26所示, 点击 Return Info (返回信息) 之后, 进入回复信息配置界面 (图 31 所示)。 在 CommandName (命令名称)对应的下拉菜单中选取之前配置过的设备命令, 在 ProtocolName (协议名称)对应的下拉菜单中选取之前配置过的协议名称, 然后在下 方的表格中选取需要返回的参数值。配置完成之后点击 OK即可返回设备动作配置界面。  As shown in Figure 26, after clicking Return Info, enter the reply information configuration interface (shown in Figure 31). Select the previously configured device command from the drop-down menu corresponding to CommandName, select the previously configured protocol name from the drop-down menu corresponding to ProtocolName, and then select the parameter value to be returned in the table below. . Click OK when the configuration is complete to return to the device action configuration interface.
同理, 在对下拉菜单中的所有步骤配置之后, 点击 Add按钮添加进入右边列表, 在 右边的列表中, 可以对添加的选项进行编辑和删除。 配置完成之后点击 OK即可返回设 备动作配置界面。 如果之后需要进行编辑和删除, 可以重复上述动作。 新的设备动作会 添加进设备动作列表中。  For the same reason, after configuring all the steps in the drop-down menu, click the Add button to add to the list on the right. In the list on the right, you can edit and delete the added options. Click OK when the configuration is complete to return to the device action configuration interface. If you need to edit and delete later, you can repeat the above actions. New device actions are added to the device action list.
编辑: 创建完成之后可以对添加设备动作中的任何一步进行编辑。  Edit: You can edit any step in the Add Device action after the creation is complete.
删除: 可以在设备动作名称列表、动作条件列表,设备动作列表中删除添加的内容。 保存: 将设备动作保存成 XML文件。  Delete: The added content can be deleted in the device action name list, action condition list, and device action list. Save: Save the device action as an XML file.
S2011 : 保存设备动作;  S2011: save device action;
S2012: 判断是否编辑设备, 如果是, 则执行 S2004; 否则执行 S2013;  S2012: judging whether to edit the device, if yes, executing S2004; otherwise executing S2013;
在配置完成设备的动作之后,进一步配置设备内部的耦合关系。设备配置模块 2100 配置设备内部的耦合关系包括如下功能:  After configuring the action of the device, further configure the coupling relationship inside the device. Device Configuration Module 2100 Configuring the internal coupling relationship of the device includes the following functions:
添加: 创建设备内部禺合关系。 编辑: 创建完成之后可以对设备内部耦合关系中的任何一项进行编辑。 删除: 可以在设备内部耦合列表中删除添加的设备内部耦合。 Add: Create a device internal match. Edit: You can edit any of the device's internal coupling relationships after the creation is complete. Delete: The added device internal coupling can be removed from the device's internal coupling list.
保存: 将设备内部耦合关系保存成 XML文件, 方便用户读取。  Save: Save the internal coupling relationship of the device into an XML file for easy reading by the user.
如图 32所示, 开始设备内部的耦合关系的配置时, 首先判断单个耦合条件或者多 个耦合条件。 当为多个耦合条件时添加判断条件。 如图 33所示, 在 Property (属性)对 应的下拉菜单中选取之前配置的设备属性, 在 Relationship (关系) 对应的下拉菜单中 选取与后面值的关系, 包括大于、 小于、 等于、 大于等于、 小于等于 5种类型。 然后再 Value (值)对应的文本框中填入与属性相关的值。例如当压力大于 0.5时,则在 Property (属性) 中选取压力, Relationship (关系) 中选取大于, Value (值) 中填入 0.5。 然后 点击 Add按钮, 将条件判断加入右边列表中。 因为判断条件可以同时存在, 因此有和、 或、 异或三种选择。 例如当压力大于 0.5或温度小于 30的时候, 在第一个条件设置并 Add之后点击 OR, 并且在此时设置第二个条件, 点击 Add则完成添加一个完整的耦合 条件。  As shown in Fig. 32, when the configuration of the coupling relationship inside the device is started, a single coupling condition or a plurality of coupling conditions are first determined. A judgment condition is added when there are a plurality of coupling conditions. As shown in Figure 33, select the previously configured device attribute from the drop-down menu corresponding to the Property, and select the relationship with the following values in the drop-down menu corresponding to the Relationship, including greater than, less than, equal to, greater than or equal to Less than or equal to 5 types. Then enter the value associated with the attribute in the text box corresponding to Value. For example, when the pressure is greater than 0.5, select the pressure in Property, select Greater in Relationship, and fill in 0.5 in Value. Then click the Add button to add the conditional judgment to the list on the right. Since the judgment conditions can exist at the same time, there are three choices of sum, or, or XOR. For example, when the pressure is greater than 0.5 or the temperature is less than 30, click OR after the first condition is set and Add, and set the second condition at this time. Click Add to complete adding a complete coupling condition.
然后在添加完一个耜合条件之后, 需要设置对应的执行命令, 在 SendSelfCommand 对应的下拉菜单中选取之前配置完成的命令。 然后点击 Add按钮添加进入右边列表, 与 上方定义的判断条件所对应。 在右边的列表中, 可以对添加的选项进行编辑和删除。 配 置完成之后点击 OK即可返回设备动作配置界面。 如果之后需要进行编辑和删除, 可以 重复上述动作。  Then, after adding a matching condition, you need to set the corresponding execution command, and select the previously configured command in the drop-down menu corresponding to SendSelfCommand. Then click the Add button to add to the list on the right, corresponding to the judgment conditions defined above. In the list on the right, you can edit and delete the added options. Click OK when the configuration is complete to return to the device action configuration interface. If you need to edit and delete later, you can repeat the above actions.
在本发明实施例的仿真平台中, 首先会对配置过的设备参数进行监视, 同时对该值 进行判断是否满足耦合条件。 当该设备参数或者属性的值达到配置的临界点时, 则判断 满足耦合条件, 同时触发了耦合关系命令, 将耦合关系命令以内部消息传递接口传递给 设备运行模块 2200以执行相应的设备行为动作来满足用户的配置要求。  In the simulation platform of the embodiment of the present invention, the configured device parameters are first monitored, and the value is judged whether the coupling condition is satisfied. When the value of the device parameter or attribute reaches the configured critical point, it is judged that the coupling condition is satisfied, and the coupling relationship command is triggered, and the coupling relationship command is transmitted to the device running module 2200 as an internal message delivery interface to perform the corresponding device behavior action. To meet the user's configuration requirements.
由于在实际设备运行过程中, 所有的耦合关系以及耦合之后的执行动作都是实时并 行发生的, 因此尽量运用多线程技术做到了所有的这些操作都是实时并行发生的, 从而 最自然的接近实际设备的情况。  Since all coupling relationships and post-coupling executions occur in real time in parallel during the actual device operation, multi-threading techniques are used to achieve all of these operations in real-time and parallel, so that the most natural approach to reality The condition of the device.
S2013 : 配置结束。  S2013: The configuration ends.
设备执行模块 2200在设备配置模块 2100的配置基础上执行设备层的仿真。 其中, 如图 34所示, 设备运行模块 2200包括第一验证单元 2201 , 其中第一验证单元 2201用 于对设备配置模块 2100配置后的设备进行验证; 第一端口初始化单元 2202 , 用于生成 与通过验证的设备的设备控制命令对应的物理端口, 并检查物理端口是否冲突, 当检查 物理端口无冲突时, 对物理端口进行初始化; 第一命令管理单元 2203 , 用于发送或接收 设备控制命令; 第一仿真单元 2204 , 用于执行与设备控制命令对应的仿真动作; 和第一 错误管理单元 2205 , 用于以日志的形式记录设备层仿真过程中的错误信息。  The device execution module 2200 performs simulation of the device layer based on the configuration of the device configuration module 2100. As shown in FIG. 34, the device running module 2200 includes a first verification unit 2201, where the first verification unit 2201 is configured to verify the device configured by the device configuration module 2100. The first port initialization unit 2202 is configured to generate and The physical port corresponding to the device control command of the device is verified, and the physical port is checked for conflict. When the physical port is in conflict, the physical port is initialized. The first command management unit 2203 is configured to send or receive a device control command. The first simulation unit 2204 is configured to execute a simulation action corresponding to the device control command; and the first error management unit 2205 is configured to record error information in the device layer simulation process in the form of a log.
当设备配置完成之后, 第一验证单元 2201需要对配置的设备进行验证。 首先需要 用户添加该设备的通信物理端口, 如图 35所示, 因为设备的 rec命令使用的是 TCP/IP 协议, 因此需要填入 TCP/IP的物理端口信息。 当验证配置后的设备通过物理端口可以 与待仿真仪器进行通信时, 则表示该设备通过验证。 当物理端口配置无误之后, 设备运 行模块 2200就可以接收和发送命令并执行相关动作。 After the device configuration is completed, the first verification unit 2201 needs to verify the configured device. First, the user needs to add the communication physical port of the device, as shown in Figure 35, because the device's rec command uses TCP/IP. Protocol, so you need to fill in the physical port information of TCP/IP. When the verified device can communicate with the instrument to be simulated through the physical port, it indicates that the device passes the verification. After the physical port configuration is correct, the device execution module 2200 can receive and send commands and perform related actions.
如图 36所示, 设备执行模块 2200执行设备层的仿真, 包括设备接收到数据并执行 相应的动作, 改变设备的参数值, 系统界面 (图 37所示) 以表格的形式动态显示设备 的参数值, 包括如下步骤:  As shown in FIG. 36, the device execution module 2200 performs simulation of the device layer, including the device receiving the data and performing corresponding actions, changing the parameter values of the device, and the system interface (shown in FIG. 37) dynamically displaying the parameters of the device in the form of a table. The value includes the following steps:
S3601 : 开始仿真;  S3601: Start the simulation;
S3602: 检测物理端口是否冲突, 当检测物理端口冲突时, 执行 S3610 , 结束仿真; 否则执行 S3603 ;  S3602: Detect whether the physical ports conflict. When detecting physical port conflicts, execute S3610 to end the simulation; otherwise, execute S3603;
S3603 : 将设备参数读取到哈希表中;  S3603: Read the device parameters into the hash table;
S3604: 端口进行初始化;  S3604: The port is initialized;
S3605 : 绑定端口接收数据委托;  S3605: Bind port receives data delegation;
S3606: 端口接收到数据, 触发事件;  S3606: The port receives the data, triggering an event;
S3607 : 解析数据, 执行动作;  S3607: Parsing the data and performing the action;
S3608 : 判断是否结束仿真, 如果判断继续仿真, 则执行 S3609; 否则执行 S3610; S3608: Determine whether to end the simulation. If it is judged to continue the simulation, execute S3609; otherwise, execute S3610;
S3609: 继续等待接收数据; S3609: Continue to wait to receive data;
S3610: 结束仿真。  S3610: End the simulation.
图 37为设备运行模块 2200的运行管理界面。 在设备运行模块 2200执行设备层仿 真的同时在右边的表格中会列出该设备配置的所有参数信息, 能够做到及时刷新这些参 数状态, 并且右边的日志信息会不停的显示收到与发送的信息以及错误的日志。 同样, 如果需要停止或者退出该设备运行, 点击右键的相关菜单即可。  Figure 37 shows the operation management interface of the device running module 2200. When the device running module 2200 performs the device layer simulation, all the parameter information of the device configuration is listed in the table on the right, and the state of the parameters can be refreshed in time, and the log information on the right side is continuously displayed and sent. Information and error logs. Similarly, if you need to stop or exit the device, right-click on the relevant menu.
本发明实施例提供设备层处理器可以完成对设备的配置, 包括设备的属性、 控制命 令、动作和内部耦合等,并且将写有的设备层配置内容设备层配置文件提供给子系统层, 以供子系统层查询和调用, 此外还可以完成对设备的管理, 包括添加、 删除、 保存和编 辑设备等, 进而通过协议层配置后的通讯协议与待仿真仪器进行通信, 并执行设备层的 仿真。  The embodiment of the present invention provides that the device layer processor can complete the configuration of the device, including the attributes, control commands, actions, and internal couplings of the device, and provides the device layer configuration content device layer configuration file to the subsystem layer. It can be queried and invoked by the subsystem layer, and can also complete the management of the device, including adding, deleting, saving and editing devices, and then communicating with the instrument to be simulated through the communication protocol configured by the protocol layer, and performing device layer simulation. .
如图 38所示, 子系统层处理器 3000包括子系统配置模块 3100和子系统运行模块 3200。 其中, 子系统配置模块 3100用于建立仿真平台中的一个或多个子系统, 并生成 与上述一个或多个子系统对应的子系统层配置文件以对子系统层配置一个或多个子系 统, 其中, 每个子系统包括一个或多个设备, 将设备层配置模块 2100 的设备层配置文 件加载至一个或多个子系统以配置每个子系统中的设备。 子系统运行模块 3200用于对 配置后的子系统进行验证, 即验证子系统能否与待仿真仪器进行通信。 通过验证后进行 子系统层的仿真。  As shown in FIG. 38, the subsystem layer processor 3000 includes a subsystem configuration module 3100 and a subsystem operation module 3200. The subsystem configuration module 3100 is configured to establish one or more subsystems in the simulation platform, and generate a subsystem layer configuration file corresponding to the one or more subsystems to configure one or more subsystems to the subsystem layer, where Each subsystem includes one or more devices that load device layer configuration files for device layer configuration module 2100 to one or more subsystems to configure devices in each subsystem. The subsystem running module 3200 is used to verify the configured subsystem, that is, whether the subsystem can communicate with the instrument to be simulated. After verification, the subsystem layer is simulated.
图 39示出了子系统层的总体架构图。 子系统层配置模块 3100可以对多个子系统以 及各个子系统内部的设备进行管理, 包括向多个子系统进行添加一个或多个子系统、 删 除一个或多个子系统或保存保存子系统, 然后向各个子系统中添加或删除一个或多个由 设备层处理器 2000建立并配置的设备, 从而组合为完整的子系统。 其中, 子系统层配 置模块 3100通过生成子系统层配置文件以多个子系统进行配置。 其中, 如图 40所示, 子系统层配置文件包括: 子系统属性, 包括子系统的属性名称; 子系统内部的设备属性, 包括设备的名称、 设备的类型和物理端口; 设备间耦合条件, 包括耦合设备的名称、 耦 合条件和触发耦合的命令; 设备间耦合关系, 设备间的耦合动作, 耦合设备的名称、 耦 合动作的步骤数目和每一步骤对应的耦合动作类型, 其中耦合动作类型包括设备行为、 耦合动作条件和耦合动作的延迟。 在本发明的一个实施例中, 子系统层配置文件可以釆 用 XML格式保存数据。 由于子系统中的多个设备为设备层处理器 2000建立并配置的, 从而在子系统层配置文件中大部分内容为设备层的内容, 以及通信物理接口和设备间的 耦合条件和关系。 Figure 39 shows an overall architectural diagram of the subsystem layer. The subsystem layer configuration module 3100 can manage multiple subsystems and devices inside each subsystem, including adding one or more subsystems to multiple subsystems, and deleting In addition to one or more subsystems or save save subsystems, one or more devices created and configured by device layer processor 2000 are added or deleted to the various subsystems to be combined into a complete subsystem. The subsystem layer configuration module 3100 is configured with multiple subsystems by generating a subsystem layer configuration file. As shown in FIG. 40, the subsystem layer configuration file includes: a subsystem attribute, including a subsystem attribute name; a device attribute inside the subsystem, including a device name, a device type, and a physical port; and a coupling condition between devices, Including the name of the coupling device, the coupling condition and the command to trigger the coupling; the coupling relationship between the devices, the coupling action between the devices, the name of the coupling device, the number of steps of the coupling action, and the type of coupling action corresponding to each step, wherein the coupling action type includes Device behavior, coupled action conditions, and delays in coupled actions. In one embodiment of the invention, the subsystem layer configuration file can save data in an XML format. Since multiple devices in the subsystem are established and configured for the device layer processor 2000, most of the content in the subsystem layer configuration file is the content of the device layer, and the coupling conditions and relationships between the communication physical interface and the device.
下面参考图 41描述子系统配置模块 3100的配置管理流程, 包括如下步骤: S4101 : 进入子系统层;  The configuration management process of the subsystem configuration module 3100 is described below with reference to FIG. 41, including the following steps: S4101: Entering the subsystem layer;
S4102: 选择系统名称;  S4102: Select a system name;
为了方便大量 Subsystem (子系统) 的规类和查找, 釆用树状结构来管理。 如图 42 所示, Subsystem (子系统)信息树由 Subsystem (子系统) 节点和包含设备名称叶子节 点组成, 一个子系统中可以包含任意个包含设备名称叶子节点, 而包含设备名称节点必 须属于某个子系统结点。  In order to facilitate the specification and lookup of a large number of Subsystems, it is managed by a tree structure. As shown in Figure 42, the Subsystem information tree consists of a Subsystem node and a leaf node containing the device name. A subsystem can contain any leaf node containing the device name, and the device name node must belong to a certain node. Subsystem nodes.
S4103 : 配置子系统名称;  S4103: Configure the subsystem name;
如图 43所示, 子系统配置模块 3100配置子系统名称包括如下功能:  As shown in Figure 43, the subsystem configuration module 3100 configures the subsystem name to include the following functions:
添加: 创建子系统名称。  Add: Create a subsystem name.
编辑: 创建完成之后可以对子系统名称中的任何一项进行编辑。  Edit: You can edit any of the subsystem names after the creation is complete.
删除: 可以在子系统名称列表中删除添加的子系统名称。  Delete: The added subsystem name can be removed from the list of subsystem names.
保存: 将子系统名称保存成 XML文件, 方便用户读取。  Save: Save the subsystem name as an XML file for easy reading by the user.
S4104: 向子系统添加设备;  S4104: Add a device to the subsystem;
如图 44所示, 子系统配置模块 3100向子系统添加设备包括如下功能:  As shown in Figure 44, the subsystem configuration module 3100 adds devices to the subsystem including the following functions:
添加: 通过加载设备层配置文件向添加子系统内部的设备。 首先对设备命名, 因为 可能出现同一设备名称而内部逻辑不一样的设备, 因此将该设备名与所属的基类对应。 因为同一设备可能有多种通信协议, 不同的通信协议会有不同的命令格式来发送给仿真 平台, 需要将该设备的所有命令与实际的通信协议物理端口绑定。  Add: Add a device inside the subsystem by loading the device layer configuration file. The device is first named because the device with the same device name and different internal logic may appear, so the device name corresponds to the base class to which it belongs. Because the same device may have multiple communication protocols, different communication protocols have different command formats to send to the emulation platform, and all commands of the device need to be bound to the physical port of the actual communication protocol.
编辑: 创建完成之后可以对设备名称中的任何一项进行编辑。  Edit: You can edit any of the device names after the creation is complete.
删除: 可以在设备名称列表中删除添加的设备名称。  Delete: The added device name can be deleted from the device name list.
保存: 将设备名称保存成 XML文件, 方便用户读取。  Save: Save the device name as an XML file for easy reading by the user.
S4105 : 保存子系统列表;  S4105: save the subsystem list;
S4106: 创建耦合关系列表; 在向子系统中添加设备后, 需要管理设备间的耦合关系。 在本发明实施例的仿真平 台中, 将设备内的耦合关系与设备间的耦合关系放在了设备层与子系统层分别来实现。 S4106: Create a coupling relationship list; After adding devices to the subsystem, you need to manage the coupling relationship between the devices. In the simulation platform of the embodiment of the present invention, the coupling relationship between the device and the coupling relationship between the devices are respectively implemented at the device layer and the subsystem layer.
在子系统层中, 触发设备间的耦合关系包括两种方式: 其一, 当某一设备的属性达 到一个临界值时, 触发了另外一个设备的耦合动作, 需要用户自定义设备间的耦合条件 来实现; 其二, 当设备接收到某一条命令时, 直接触发另一个设备的耦合动作或者判断 当前设备的某些属性是否满足条件再触发另一设备的耦合动作。 因为触发耦合条件的方 式给另外一个设备通过内部消息传递接口发送配置的命令来实现, 所以需要由用户定义 耦合动作对应的耦合命令, 即配置设备间的耦合关系。  In the subsystem layer, the coupling relationship between the triggering devices includes two ways: First, when the attribute of a certain device reaches a critical value, the coupling action of another device is triggered, and the coupling condition between the devices is required to be customized. Secondly, when the device receives a certain command, it directly triggers the coupling action of another device or determines whether certain attributes of the current device satisfy the condition and then trigger the coupling action of the other device. Since the method of triggering the coupling condition is implemented by another device transmitting the configured command through the internal messaging interface, it is necessary to define a coupling command corresponding to the coupling action by the user, that is, to configure the coupling relationship between the devices.
如图 45所示, 子系统配置模块 3100配置设备间的耦合条件, 包括:  As shown in Figure 45, the subsystem configuration module 3100 configures coupling conditions between devices, including:
添加: 创建设备间耦合条件。  Add: Create an inter-device coupling condition.
编辑: 创建完成之后可以对设备间耦合条件中的任何一项进行编辑。  Edit: You can edit any of the inter-device coupling conditions after the creation is complete.
删除: 可以在设备间耦合条件列表中删除添加的设备间耦合条件。  Delete: The added inter-device coupling conditions can be removed from the list of coupling conditions between devices.
保存: 将设备间耦合条件保存成 XML文件, 方便用户读取。  Save: Save the inter-device coupling conditions to an XML file for easy reading by the user.
S4107 : 选择耦合关系名称;  S4107: Select the coupling relationship name;
如图 46所示, 选取子系统之后, 添加耦合关系名称, 新的耦合关系名称会添加进 耦合关系名称列表。 根据创建的耦合关系列表选取需要配置的耦合关系的动作。  As shown in Figure 46, after selecting the subsystem, add the coupling relationship name and the new coupling relationship name will be added to the coupling relationship name list. Select the action of the coupling relationship to be configured according to the created coupling relationship list.
S4108 : 选择耦合设备;  S4108: Select a coupling device;
选取子系统内部需要耦合的设备;  Select devices that need to be coupled within the subsystem;
S4109 : 选择设备控制命令;  S4109: Select device control command;
选择该耦合的设备的接收的设备控制命令;  Selecting a received device control command for the coupled device;
S4110 : 配置动作步骤数量;  S4110: The number of configuration action steps;
S4111 : 选择动作步骤;  S4111: Select an action step;
如图 47所示, 设置动作的步骤数目, 将耦合动作细化为多个步骤, 每一步骤都对 应一个耦合动作类型。 其中, 耦合动作类型包括: 设备行为、 耦合动作条件和耦合动作 的延迟。  As shown in Figure 47, the number of steps in the action is set, and the coupling action is refined into multiple steps, each of which corresponds to a type of coupled action. Among them, the types of coupling actions include: device behavior, coupled action conditions, and delays of coupled actions.
S4112: 配置步骤动作;  S4112: Configuration step action;
配置延迟等待: 该动作类型为执行仿真动作等待相应时间。 配置的内容包括: 等待 时间和下一步执行的步骤。 其中, 等待时间为需要执行等待多长时间, 单位为毫秒。 在 本发明的一个实施例中, 等待时间可以为 120毫秒。 下一步执行的步骤用于选取下一步 执行的步骤。 如图 47所示, 选择延时按钮, 弹出如图 48的配置界面, 设置延时时间, 以毫秒为单位。  Configure Delay Waiting: This action type waits for the corresponding time to execute the simulation action. The configuration includes: wait time and the next step. The waiting time is how long it needs to be executed, and the unit is milliseconds. In one embodiment of the invention, the latency may be 120 milliseconds. The next step is to pick the next step. As shown in Figure 47, select the delay button, and the configuration interface shown in Figure 48 pops up, setting the delay time in milliseconds.
配置设备行为: 该动作类型为直接执行指定设备的行为。 如图 47所示, 选择执行 动作按钮, 弹出如图 49 的配置界面, 执行设备的耦合动作。 选择设备, 选择设备的动 作, 点击 OK按钮退出设置界面, 点击 cancel按钮取消本次设置。  Configure device behavior: This action type is the behavior of directly executing the specified device. As shown in Figure 47, select the Execute Action button, and the configuration interface shown in Figure 49 pops up to perform the coupling action of the device. Select the device, select the action of the device, click the OK button to exit the setting interface, and click the cancel button to cancel the setting.
配置耦合动作条件: 该动作类型为判断设备属性达到什么要求的时候执行下一步 骤, 其中判断的条件可以组合。 在判断之后, 选择要执行的动作。 例如: 设备 MFC的 流速大于 1000时, 执行一个不知, 否则执行另一个步骤。 配置的内容包括: 设备属性, 其中该设备属性根据创建的设备属性列表来选取; 条件判断, 包括大于、 小于、 等于、 小于或等于、 大于或等于; 属性值, 该属性值需要用户指定; 逻辑关系, 包括和、 或、 异或,即可以将很多条件判断组合成一种条件判断。新的动作条件添加进动作条件列表。 Configure the coupling action condition: The action type is to perform the next step when determining what the device attribute meets. The conditions in which the judgment is made may be combined. After the judgment, select the action to be performed. For example: When the flow rate of the device MFC is greater than 1000, do not know, otherwise perform another step. The configuration includes: device attributes, where the device attributes are selected according to the created device attribute list; conditional judgments, including greater than, less than, equal to, less than or equal to, greater than or equal to; attribute values, the attribute values require user designation; Relationships, including and, or, or XOR, can combine many conditional judgments into one conditional judgment. New action conditions are added to the action condition list.
如图 47所示, 选择条件判断按钮, 弹出如图 50的配置界面, 设置条件判断动作。 依次选择设备, 设备参数, 耦合条件。 根据耦合条件的真假, 执行相应的步骤。 当耦合 到右边的列表中, 点击 OK按钮退出设备页面, 点击 Cancel按钮取消本次设置。  As shown in Fig. 47, the condition judgment button is selected, and the configuration interface as shown in Fig. 50 is popped up, and the condition judgment action is set. Select the device, device parameters, and coupling conditions. According to the true and false of the coupling condition, the corresponding steps are performed. When coupled to the list on the right, click the OK button to exit the device page and click the Cancel button to cancel this setting.
S4113: 判断是否需要修改配置, 如果需要则执行 S4110; 否则执行 S4114;  S4113: Determine whether the configuration needs to be modified, if necessary, execute S4110; otherwise, execute S4114;
S4114: 保存耦合动作列表;  S4114: Save the list of coupled actions;
编辑 创建完成之后可以对添加耦合动作中的任何一步进行编辑。  Edit You can edit any step in the Add Coupling action after the creation is complete.
删除 可以在耦合动作名称列表、 动作条件列表中删除添加的内;  Delete can be deleted in the list of coupled action names and action conditions;
保存 将禹合动作保存成 XML文件  Save Save the blending action as an XML file
S4115 保存子系统;  S4115 saves the subsystem;
S4116: 配置结束。  S4116: Configuration is complete.
子系统运行模块 3200包括第二验证单元 3201、 第二端口初始化单元 3202、 第二命 令管理单元 3203、 第二仿真单元 3204和第二错误管理单元 3205。 其中, 第二验证单元 3201用于对子系统配置模块 3100配置后的子系统进行验证; 第二端口初始化单元 3202 用于生成与通过验证的子系统内部的设备的设备控制命令对应的物理端口, 并检查物理 端口是否冲突, 当检查物理端口无冲突时, 运行子系统内部的设备并对物理端口进行初 始化; 第二命令管理单元 3203用于接收或发送子系统内部的设备的设备控制命令; 第 二仿真单元 3204用于执行与设备控制命令对应的仿真动作, 并触发耦合条件, 根据耦 合条件执行相应的耦合动作; 第二错误管理单元 3205用于以日志的形式记录子系统层 仿真过程中的错误信息。  The subsystem operation module 3200 includes a second verification unit 3201, a second port initialization unit 3202, a second command management unit 3203, a second simulation unit 3204, and a second error management unit 3205. The second verification unit 3201 is configured to verify the subsystem configured by the subsystem configuration module 3100; the second port initialization unit 3202 is configured to generate a physical port corresponding to the device control command of the device inside the verified subsystem. And checking whether the physical port conflicts, when checking that the physical port has no conflict, running the device inside the subsystem and initializing the physical port; the second command management unit 3203 is configured to receive or send the device control command of the device inside the subsystem; The second simulation unit 3204 is configured to execute a simulation action corresponding to the device control command, and trigger a coupling condition, and perform a corresponding coupling action according to the coupling condition; the second error management unit 3205 is configured to record the subsystem layer in the process of the log layer simulation process. Error message.
当子系统配置模块 3100配置完成之后, 第二验证单元 3201需要对配置的子系统进 行验证, 即验证配置后的子系统能否通过物理端口与待仿真仪器进行通信。 如果通过验 证, 即子系统可以与待仿真仪器进行通信, 则子系统运行模块 3200开始执行子系统层 的仿真。  After the subsystem configuration module 3100 is configured, the second verification unit 3201 needs to verify the configured subsystem, that is, whether the configured subsystem can communicate with the instrument to be simulated through the physical port. If the verification is passed, that is, the subsystem can communicate with the instrument to be simulated, the subsystem operation module 3200 begins to perform the simulation of the subsystem layer.
如图 52所示, 子系统运行模块 3200进行子系统层的仿真包括如下步骤:  As shown in FIG. 52, the subsystem running module 3200 performs the simulation of the subsystem layer including the following steps:
S5201 开始仿真;  S5201 starts simulation;
S5202 检测物理端口是否冲突, 如果冲突则执行 S5210; 否则执行 S5203;  S5202 detects whether the physical ports conflict, if the conflict occurs, execute S5210; otherwise, execute S5203;
S5203 运行子系统内部的设备;  S5203 runs equipment inside the subsystem;
S5204 设备端口进行初始化;  The S5204 device port is initialized.
S5205 绑定端口接收数据委托; S5206: 触发事件进行耦合动作处理; The S5205 binds the port to receive data delegation. S5206: triggering event to perform coupling action processing;
S5207 : 解析数据, 执行动作;  S5207: Parsing the data and performing the action;
S5208 : 判断是否结束仿真, 如果判断结束仿真, 则执行 5210; 否则执行 S5209; S5208: Determine whether to end the simulation, if it is judged to end the simulation, execute 5210; otherwise, execute S5209;
S5209: 继续等待接收数据; S5209: Continue to wait for receiving data;
S5210: 结束仿真。  S5210: End the simulation.
如图 53所示, 当子系统运行模块 3200运行时, 会弹出一个窗口提示用户已经启动 子系统, 可以接收和发送命令并执行相关动作了, 同时在右边的表格中会列出该子系统 包含的所有设备以及设备配置的所有参数信息, 能够做到及时刷新这些参数状态, 并且 右边的日志信息会不停的显示收到与发送的信息以及错误的日志, 该错误信息由第二错 误管理单元 3205以日志的形式记录。  As shown in FIG. 53, when the subsystem running module 3200 is running, a window pops up prompting the user to start the subsystem, and can receive and send commands and perform related actions, and the subsystem is listed in the table on the right. All the equipment and all the parameter information of the device configuration can refresh the status of these parameters in time, and the log information on the right will continuously display the received and sent information and the error log, which is determined by the second error management unit. 3205 is recorded in the form of a log.
本发明实施例的子系统层处理器 3000可以完成子系统的配置和管理, 包括子系统 的属性以及子系统内部的设备, 通过查询和调用设备层配置文件在子系统中添加或删除 设备, 并且支持用户将设备组合为完整的子系统, 以及管理每个子系统内部的各个设备 之间的耦合关系, 将写有子系统层配置内容的子系统层配置文件提供给系统层, 以供系 统层查询和调用, 在上述配置完成后, 执行子系统层的仿真。  The subsystem layer processor 3000 of the embodiment of the present invention can complete the configuration and management of the subsystem, including the attributes of the subsystem and the devices inside the subsystem, adding or deleting devices in the subsystem by querying and calling the device layer configuration file, and Support users to combine devices into complete subsystems, and manage the coupling relationship between each device inside each subsystem, and provide subsystem layer configuration files written with subsystem layer configuration content to the system layer for system layer query And call, after the above configuration is completed, perform the simulation of the subsystem layer.
如图 54所示, 系统层处理器 4000包括系统配置模块 4100 , 用于建立仿真平台中的 多个系统, 并生成与多个系统对应的系统层配置文件以配置多个系统, 其中, 每个系统 包括一个或多个子系统, 将子系统配置模块 3100 的子系统层配置文件加载至多个系统 以配置每个系统中的子系统; 系统运行模块 4200 , 用于对配置后的系统进行验证, 对通 过验证的系统进行仿真。  As shown in FIG. 54, the system layer processor 4000 includes a system configuration module 4100, configured to establish multiple systems in the simulation platform, and generate system layer configuration files corresponding to multiple systems to configure multiple systems, where each The system includes one or more subsystems, and the subsystem layer configuration file of the subsystem configuration module 3100 is loaded into multiple systems to configure subsystems in each system; the system operation module 4200 is configured to verify the configured system, Simulate the system through verification.
图 55示出了系统层的总体架构图。 系统配置模块 4100可以对多个系统以及各个系 统内的子系统进行管理, 包括向多个系统中添加一个或多个系统、 从多个系统中删除一 个或多个系统、保存, 然后向各个系统中添加或删除一个或多个由子系统层处理器 3000 建立并配置的子系统以组合为完整的系统。 其中, 如图 56所示, 系统配置模块 4100通 过生成系统层配置文件以配置多个系统。 其中系统层配置文件包括: 系统属性, 包括系 统名称、 系统说明信息; 系统内部的子系统属性, 包括子系统的名称和各个子系统内部 的设备, 包括设备的属性以及与设备对应的协议的属性; 和子系统间的耦合关系。 在本 发明的一个实施例中, 系统层配置文件可以釆用 XML格式保存数据。  Figure 55 shows an overall architectural diagram of the system layer. The system configuration module 4100 can manage multiple systems and subsystems within each system, including adding one or more systems to multiple systems, deleting one or more systems from multiple systems, saving, and then to each system. One or more subsystems established and configured by subsystem layer processor 3000 are added or deleted to be combined into a complete system. Wherein, as shown in FIG. 56, the system configuration module 4100 configures a plurality of systems by generating a system layer configuration file. The system layer configuration file includes: system attributes, including system name and system description information; subsystem attributes inside the system, including the name of the subsystem and the devices inside each subsystem, including the attributes of the device and the attributes of the protocol corresponding to the device. ; and the coupling relationship with the subsystem. In one embodiment of the invention, the system layer configuration file can save data in an XML format.
下面参考图 57描述系统配置模块 4100进行系统层配置管理流程, 包括如下步骤: S5701 : 进入系统层;  Referring to FIG. 57, the system configuration module 4100 performs a system layer configuration management process, which includes the following steps: S5701: Enter the system layer;
如图 58所示, 为了方便大量系统的规类和查找, 釆用树状结构来管理。 System (系 统)信息树由系统节点和包含设备名称叶子节点组成, 一个系统中可以包含任意个包含 设备名称叶子节点, 而包含设备名称节点必须属于某个系统结点。  As shown in Figure 58, in order to facilitate the specification and lookup of a large number of systems, it is managed by a tree structure. The System information tree consists of a system node and a leaf node containing the device name. A system can contain any leaf node containing the device name, and the device name node must belong to a system node.
S5702: 创建系统;  S5702: Create a system;
图 59示出了创建系统的界面。 系统配置模块 4200创建系统包括如下功能: 添加: 创建系统名称。 Figure 59 shows the interface for creating a system. The system configuration module 4200 creates a system including the following functions: Add: Create a system name.
编辑: 创建完成之后可以对系统名称中的任何一项进行编辑。  Edit: You can edit any of the system names after the creation is complete.
删除: 可以在系统名称列表中删除添加的系统名称。  Delete: The added system name can be deleted from the system name list.
保存: 将系统名称保存成 XML文件, 方便用户读取。  Save: Save the system name as an XML file for easy reading by the user.
S5703 : 判断是否编辑系统, 如果判断编辑系统, 则执行 S5702; 否则执行 S5704; S5704: 保存系统;  S5703: judging whether to edit the system, if it is judged to edit the system, executing S5702; otherwise, executing S5704; S5704: saving the system;
S5705 : 进入子系统层。  S5705 : Enter the subsystem layer.
配置完系统之后, 向系统中添加子系统。 图 60为向系统中添加子系统的界面。 系 统配置模块 4200添加子系统包括如下功能:  After configuring the system, add subsystems to the system. Figure 60 shows the interface for adding subsystems to the system. System Configuration Module The 4200 Add Subsystem includes the following features:
添加: 添加系统内部的所属子系统。 通过加载子系统层配置文件将之前创建的子系 统列出来供用户选择, 被选中的则添加进创建的系统中。  Add: Add the subsystem to which the system belongs. The sub-systems created previously are listed for user selection by loading the subsystem layer configuration file, and the selected ones are added to the created system.
编辑: 创建完成之后可以对子系统中的任何一项进行编辑。  Edit: You can edit any of the subsystems after the creation is complete.
删除: 可以在子系统名称列表中删除添加的子系统名称。  Delete: The added subsystem name can be removed from the list of subsystem names.
保存: 将子系统类列表保存成 XML文件, 方便用户读取。  Save: Save the list of subsystem classes as an XML file for easy reading by the user.
如图 61所示,系统运行模块 4200包括第三验证单元 4201 ,其中第三验证单元 4201 用于对系统配置模块 4100配置后的系统进行验证; 第三端口初始化单元 4202, 其中第 三端口初始化单元 4202用于生成通过验证的系统内部的子系统中的设备的设备控制命 令对应的物理端口, 检查物理端口是否冲突, 当检查物理端口无冲突时, 运行系统内部 的子系统以及子系统内部的设备, 并对物理端口进行初始化; 第三命令管理单元 4203 , 其中第三命令管理单元 4203用于接收或发送系统内部的子系统中的设备的设备控制命 令; 第三仿真单元 4204 , 其中第三仿真单元 4204用于执行与设备控制命令对应的仿真 动作, 并触发设备间的耦合条件, 根据耦合条件执行相应的耦合动作; 和第三错误管理 单元 4205 , 其中第三错误管理单元 4205用于以日志的形式系统层仿真过程中的错误信 息。  As shown in FIG. 61, the system operation module 4200 includes a third verification unit 4201, wherein the third verification unit 4201 is configured to verify the system configured by the system configuration module 4100; the third port initialization unit 4202, wherein the third port initialization unit 4202 is used to generate a physical port corresponding to the device control command of the device in the subsystem inside the system, and check whether the physical port conflicts. When checking that the physical port has no conflict, the subsystem inside the operating system and the device inside the subsystem are And the physical port is initialized; the third command management unit 4203, wherein the third command management unit 4203 is configured to receive or send a device control command of the device in the subsystem inside the system; the third simulation unit 4204, wherein the third simulation The unit 4204 is configured to execute a simulation action corresponding to the device control command, and trigger a coupling condition between the devices, and perform a corresponding coupling action according to the coupling condition; and a third error management unit 4205, wherein the third error management unit 4205 is configured to log Formal system layer simulation process error Information.
在由系统配置模块 4100完成对系统层的配置后, 第三验证单元 4201需要对已配置 的系统进行验证, 即验证配置后的系统是否可以通过物理端口与待仿真仪器进行通信。 当验证配置后的系统与待仿真仪器进行通信时, 系统运行模块 4200可以开始执行系统 层的仿真。  After the configuration of the system layer is completed by the system configuration module 4100, the third verification unit 4201 needs to verify the configured system, that is, whether the configured system can communicate with the instrument to be simulated through the physical port. When the configured system communicates with the instrument to be simulated, the system operation module 4200 can begin to perform simulation of the system layer.
下面参考图 62描述系统运行模块 4200的仿真流程, 包括如下步骤:  The simulation flow of the system operation module 4200 will be described below with reference to FIG. 62, including the following steps:
S6201 : 开始仿真;  S6201: Start simulation;
S6202: 检测物理端口是否冲突, 如果判断物理端口冲突, 则执行 S6211 ; 否则执 行 S6203;  S6202: Check whether the physical ports are in conflict. If the physical port conflict is determined, execute S6211; otherwise, execute S6203.
S6203: 开始运行内部的子系统;  S6203: Start running the internal subsystem;
S6204: 子系统内部运行各个设备;  S6204: Each device runs inside the subsystem;
S6205 : 初始化端口并开始接收数据;  S6205: Initialize the port and start receiving data;
S6206: 端口接收到数据, 触发事件; S6207 : 解析数据, 执行耦合动作; S6206: The port receives the data and triggers the event. S6207: parsing the data and performing a coupling action;
S6208 : 当满足耦合条件时, 执行仿真动作;  S6208: Perform a simulation action when the coupling condition is satisfied;
S6209: 判断是否结束仿真, 如果判断结束仿真, 则执行 S6211 ; 否则执行 S6210; S6210: 继续等待接收数据;  S6209: Determine whether to end the simulation. If it is judged to end the simulation, execute S6211; otherwise, execute S6210; S6210: continue to wait for receiving data;
S6211 : 结束仿真。  S6211 : End the simulation.
系统运行模块 4200运行仿真主要完成系统的动态仿真功能。 由于系统是若干个子 系统的集合, 子系统内部之间没有耦合关系。 设备接收到数据并执行相应的动作, 改变 设备的参数值, 然后触发子系统的耦合关系进行相应的处理, 最后主系统界面以表格的 形式动态显示子系统内各个设备的参数值。  System Operation Module The 4200 operation simulation mainly completes the dynamic simulation function of the system. Since the system is a collection of several subsystems, there is no coupling between the subsystems. The device receives the data and performs the corresponding action, changes the parameter value of the device, and then triggers the coupling relationship of the subsystem to perform corresponding processing. Finally, the main system interface dynamically displays the parameter values of each device in the subsystem in the form of a table.
如图 63所示, 系统运行模块 4200开始启动后, 可以接收和发送命令并执行相关动 作了, 同时在右边的表格中会列出该系统包含的所有子系统和子系统所包含的设备以及 设备配置的所有参数信息, 能够做到及时刷新这些参数状态, 并且右边的日志信息会不 停的显示收到与发送的信息以及错误的日志,上述错误的日志由第三错误管理单元 4205 提供。  As shown in FIG. 63, after the system running module 4200 starts to start, it can receive and send commands and perform related actions, and in the table on the right, all the subsystems and subsystems included in the system are listed, and the device configuration is included. All the parameter information can be refreshed in time, and the log information on the right side will continuously display the received and sent information and the error log, and the log of the above error is provided by the third error management unit 4205.
本发明实施例提供的系统层处理器 4000可以完成系统的配置和管理, 包括系统的 属性以及系统内部的子系统, 通过查询和调用子系统层配置文件在系统中添加或删除子 系统, 并且支持用户将子系统组合为完整的系统, 以及管理每个系统内部的各个子系统 之间的耦合关系, 进而执行系统层的仿真。  The system layer processor 4000 provided by the embodiment of the present invention can complete system configuration and management, including system attributes and subsystems inside the system, adding or deleting subsystems in the system by querying and calling subsystem layer configuration files, and supporting The user combines the subsystems into a complete system and manages the coupling relationship between the various subsystems within each system to perform system layer simulation.
根据上述实施例中提供的协议层处理器 1000、 设备层处理器 2000、 子系统层处理 器 3000和系统层处理器 4000描述根据本发明实施例的用于集成电路制造设备的仿真平 台的运行流程, 包括如下步骤:  The protocol layer processor 1000, the device layer processor 2000, the subsystem layer processor 3000, and the system layer processor 4000 provided in the above embodiments describe an operational flow of a simulation platform for an integrated circuit manufacturing device according to an embodiment of the present invention. , including the following steps:
S6401 : 启动程序;  S6401: Start the program;
S6402: 新建或打开配置;  S6402: Create or open a configuration;
S6403 : 配置协议, 配置协议完成后, 执行 S6404 , 通过已配置的协议可以开始与 待仿真仪器进行通讯, 然后执行 S6413 ;  S6403: After the configuration protocol is completed, the S6404 is executed. The configured protocol can start communication with the instrument to be simulated, and then execute S6413.
在步骤 6403中, 由协议配置模块 1100对仿真平台配置通信协议, 并由协议运行模 块 1200通过已配置的协议可以开始与待仿真仪器进行通讯。  In step 6403, the protocol configuration module 1100 configures the communication protocol for the simulation platform, and the protocol operation module 1200 can start communication with the instrument to be simulated through the configured protocol.
S6405 : 配置设备, 设备配置完成后, 执行 S6406 , 开始执行设备层的仿真, 然后 执行 S6413 ;  S6405: Configure the device. After the device is configured, run S6406 to start the device layer simulation, and then execute S6413.
在步骤 6405中,设备配置模块 2100通过加载协议层配置文件对设备配置通信协议, 并通过生成设备层配置文件对多个设备进行配置, 并由设备运行模块 2200执行设备层 的仿真。  In step 6405, the device configuration module 2100 configures a communication protocol for the device by loading a protocol layer configuration file, and configures a plurality of devices by generating a device layer configuration file, and the device operation module 2200 performs simulation of the device layer.
S6407 : 配置子系统, 子系统配置完成后, 执行 S6408 , 开始执行子系统层的仿真, 然后执行 S6413 ;  S6407: After configuring the subsystem, after the subsystem configuration is completed, execute S6408, start the simulation of the subsystem layer, and then execute S6413;
在步骤 6407中, 子系统配置模块 3100通过加载设备层配置文件对子系统内的设备 进行配置, 通过生成子系统层配置文件对多个子系统进行配置, 并由子系统运行模块In step 6407, the subsystem configuration module 3100 loads the devices in the subsystem by loading the device layer configuration file. Configure to configure multiple subsystems by generating a subsystem layer configuration file, and run the module by the subsystem
3200执行子系统层的仿真。 The 3200 performs a simulation of the subsystem layer.
S6409: 搭建系统;  S6409: Building a system;
在步骤 6409中, 系统配置模块 4100通过加载子系统层配置文件对系统内的子系统 进行配置, 通过生成系统层配置文件对多个系统进行配置, 并由系统运行模块 4200执 行系统层的仿真。  In step 6409, the system configuration module 4100 configures the subsystems in the system by loading the subsystem layer configuration file, configures multiple systems by generating system layer configuration files, and performs system layer simulation by the system operation module 4200.
S6410 : 判断是否开始执行系统层的仿真, 如果判断执行系统层的仿真, 则执行 S6411 ; 否则执行 S6413;  S6410: Determine whether to start the simulation of the system layer. If it is judged to execute the simulation of the system layer, execute S6411; otherwise, execute S6413;
S6411 : 开始与待仿真仪器进行通讯;  S6411: Start communication with the instrument to be simulated;
S6412: 停止仿真;  S6412: Stop the simulation;
S6413 : 仿真结束。  S6413: The simulation ends.
本发明实施例提供的用于集成电路制造设备的仿真平台可以根据不同项目中所需 要的硬件的不同以及相同硬件的不同使用方法灵活配置仿真平台的协议层、 设备层、 子 系统层和系统层, 并且该仿真平台具有准确性、 实时性和可扩展的特点。  The simulation platform for the integrated circuit manufacturing device provided by the embodiment of the present invention can flexibly configure the protocol layer, the device layer, the subsystem layer and the system layer of the simulation platform according to different hardware required in different projects and different usage methods of the same hardware. And the simulation platform is accurate, real-time and scalable.
尽管已经示出和描述了本发明的实施例, 对于本领域的普通技术人员而言, 可以理 解在不脱离本发明的原理和精神的情况下可以对这些实施例进行多种变化、 修改、 替换 和变型, 本发明的范围由所附权利要求及其等同限定。  While the embodiments of the present invention have been shown and described, it will be understood by those skilled in the art The scope of the invention is defined by the appended claims and their equivalents.

Claims

权利要求书 Claim
1、 一种用于集成电路制造设备的仿真平台, 包括: 1. A simulation platform for an integrated circuit manufacturing device, comprising:
多个待仿真仪器,  Multiple instruments to be simulated,
多个板卡, 所述多个板卡中的每个包括多个通道, 其中所述多个通道中的每个与 所述多个待仿真仪器中的一个的针脚相连; 和  a plurality of boards, each of the plurality of boards comprising a plurality of channels, wherein each of the plurality of channels is connected to a pin of one of the plurality of instruments to be simulated; and
仿真计算机, 所述仿真计算机通过所述多个板卡与所述多个待仿真仪器进行通信, 用于对多个待仿真仪器进行仿真, 所述仿真计算机包括:  An emulation computer, wherein the emulation computer communicates with the plurality of instruments to be simulated by the plurality of boards, and is used for simulating a plurality of instruments to be simulated, the emulation computer comprising:
协议层处理器, 所述协议层处理器用于建立所述仿真平台中的多个通信协议, 并生成与所述多个通信协议对应的协议层配置文件, 以及根据所述多个通信协议 通过所述多个板卡与所述多个待仿真仪器进行通信;  a protocol layer processor, configured to establish a plurality of communication protocols in the simulation platform, and generate a protocol layer configuration file corresponding to the plurality of communication protocols, and pass the plurality of communication protocols according to the protocol layer Translating a plurality of boards with the plurality of instruments to be simulated;
设备层处理器, 所述设备层处理器用于建立所述仿真平台中的多个设备, 并生 成与所述多个设备对应的设备层配置文件, 并根据建立的所述多个设备加载所述 多个设备对应的所述协议层配置文件, 以及对所述多个设备进行管理并进行设备 层的仿真;  a device layer processor, where the device layer processor is configured to establish a plurality of devices in the simulation platform, and generate a device layer configuration file corresponding to the multiple devices, and load the device according to the established multiple devices. The protocol layer configuration file corresponding to the multiple devices, and managing the multiple devices and performing device layer simulation;
子系统层处理器, 所述子系统层处理器用于建立所述仿真平台中的多个子系统, 并生成与所述多个子系统对应的子系统层配置文件, 其中, 每个所述子系统包括 一个或多个在所述设备层处理器中建立的设备, 并根据建立的所述多个子系统加 载所述多个子系统中设备对应的设备层配置文件, 以及对所述多个子系统以及每 个子系统中的设备进行管理并进行子系统层的仿真; 和  a subsystem layer processor, the subsystem layer processor is configured to establish a plurality of subsystems in the simulation platform, and generate a subsystem layer configuration file corresponding to the multiple subsystems, where each of the subsystems includes One or more devices established in the device layer processor, and loading device layer configuration files corresponding to devices in the plurality of subsystems according to the established plurality of subsystems, and the plurality of subsystems and each sub The devices in the system are managed and simulated at the subsystem level; and
系统层处理器, 所述系统层处理器用于建立所述仿真平台中的多个系统, 并生 成与所述多个系统对应的系统层配置文件, 其中, 每个所述系统包括一个或多个 在所述子系统层处理器中建立的子系统, 并根据建立的所述多个系统加载所述多 个系统中子系统对应的子系统层配置文件加载至所述多个系统, 以及对所述多个 系统以及每个系统中的子系统进行管理并进行系统层的仿真。  a system layer processor, the system layer processor is configured to establish a plurality of systems in the simulation platform, and generate a system layer configuration file corresponding to the multiple systems, where each of the systems includes one or more a subsystem established in the subsystem layer processor, and loading, according to the established plurality of systems, a subsystem layer configuration file corresponding to a subsystem of the plurality of systems, to the plurality of systems, and The multiple systems and the subsystems in each system are managed and simulated at the system level.
2、 如权利要求 1所述的仿真平台, 其中, 所述协议层配置文件、 所述设备层配置 文件、 所述子系统层配置文件和所述系统层配置文件以 XML文件格式保存。  2. The simulation platform according to claim 1, wherein the protocol layer configuration file, the device layer configuration file, the subsystem layer configuration file, and the system layer configuration file are saved in an XML file format.
3、 如权利要求 1所述的仿真平台, 其中, 所述协议层处理器包括:  3. The simulation platform according to claim 1, wherein the protocol layer processor comprises:
协议配置模块, 所述协议配置模块用于建立所述仿真平台中的所述多个通信协议, 并生成与所述多个通信协议对应的协议层配置文件; 和  a protocol configuration module, where the protocol configuration module is configured to establish the multiple communication protocols in the simulation platform, and generate a protocol layer configuration file corresponding to the multiple communication protocols; and
协议运行模块, 所述协议运行模块用于对所述协议配置模块配置后的通信协议进 行连接测试以进行验证。  The protocol running module is configured to perform a connection test on the communication protocol configured by the protocol configuration module for verification.
4、 如权利要求 3所述的仿真平台, 其中, 所述协议类型包括以太网协议、 串口协 议、 模拟 10协议、 数字 10协议和 DeviceNet协议。 4. The simulation platform according to claim 3, wherein the protocol types include an Ethernet protocol, a serial protocol, an analog 10 protocol, a digital 10 protocol, and a DeviceNet protocol.
5、 如权利要求 4所述的仿真平台, 其中, 当所述通信协议的协议类型为以太网协 议或串口协议时, 所述协议层配置文件进一步包括协议格式, 所述协议格式包括命令 名称和命令中携带属性的属性参数。 The simulation platform according to claim 4, wherein when the protocol type of the communication protocol is an Ethernet protocol or a serial port protocol, the protocol layer configuration file further includes a protocol format, where the protocol format includes a command name and The command carries the attribute parameter of the attribute.
6、 如权利要求 5所述的仿真平台, 其中, 当所述协议类型为以太网协议或串口协 议时, 所述协议层处理器进一步包括协议封装模块, 所述协议封装模块包括:  The emulation platform of claim 5, wherein, when the protocol type is an Ethernet protocol or a serial port protocol, the protocol layer processor further includes a protocol encapsulation module, where the protocol encapsulation module includes:
数据解包接口, 用于解析由所述多个板卡发送的数据;  a data unpacking interface, configured to parse data sent by the plurality of boards;
数据封包接口, 用于对发送至所述多个板卡的数据进行封包操作。  And a data packet interface, configured to perform a packet operation on data sent to the multiple boards.
7、 如权利要求 1所述的仿真平台, 其中, 所述设备层处理器包括:  7. The simulation platform of claim 1, wherein the device layer processor comprises:
设备配置模块, 所述设备配置模块用于建立所述仿真平台中的多个设备, 并生成 与所述多个设备对应的设备层配置文件以对所述多个设备进行配置, 将所述多个设备 对应的所述协议层配置文件加载至所述多个设备以使各个设备通过所述通信协议与所 述待仿真仪器进行通信; 和  a device configuration module, where the device configuration module is configured to establish a plurality of devices in the simulation platform, and generate a device layer configuration file corresponding to the multiple devices to configure the multiple devices, where the multiple The protocol layer configuration file corresponding to the devices is loaded to the plurality of devices to enable each device to communicate with the instrument to be simulated through the communication protocol; and
设备运行模块, 所述设备运行模块用于对配置后的所述多个设备进行验证, 且在 通过验证后对所述多个设备进行仿真。  a device running module, where the device running module is configured to verify the configured multiple devices, and simulate the multiple devices after passing the verification.
8、 如权利要求 7所述的仿真平台, 其中, 所述设备层配置文件包括:  8. The simulation platform of claim 7, wherein the device layer configuration file comprises:
设备的名称与类型;  The name and type of the device;
设备属性, 所述设备属性包括设备的属性名称、 设备的属性类型、 设备的属性最 大值、 设备的属性最小值和设备的属性默认值;  a device attribute, where the device attribute includes a device attribute name, a device attribute type, a device attribute maximum value, a device attribute minimum value, and a device attribute default value;
设备控制命令, 所述设备控制命令包括设备控制命令的名称、 设备控制命令的传 递方向和设备控制命令的内容;  a device control command, where the device control command includes a name of the device control command, a delivery direction of the device control command, and a content of the device control command;
设备动作, 所述设备动作包括设备的动作名称和与所述动作名称耦合的设备控制 命令、 动作的步骤数目以及与每一步骤对应的设备动作类型; 和  a device action, the device action including an action name of the device and a device control command coupled with the action name, a number of steps of the action, and a device action type corresponding to each step;
设备内部的耦合关系, 所述设备内部的耦合关系包括耦合条件和与所述耦合条件 对应的耦合关系命令。  The coupling relationship inside the device, the coupling relationship inside the device includes a coupling condition and a coupling relationship command corresponding to the coupling condition.
9、 如权利要求 8所述的仿真平台, 其中, 所述设备动作类型包括命令行为、 动作 条件、 延迟等待、 变化规律和返回信息。  9. The simulation platform according to claim 8, wherein the device action type comprises a command behavior, an action condition, a delay wait, a change rule, and return information.
10、 如权利要求 7 所述的仿真平台, 其中, 所述设备配置模块还用于向所述多个 设备中添加一个或多个设备, 或者从所述多个设备中删除一个或多个设备。  The simulation platform of claim 7, wherein the device configuration module is further configured to add one or more devices to the multiple devices, or delete one or more devices from the multiple devices. .
11、 如权利要求 8所述的仿真平台, 其中, 所述设备运行模块包括:  The simulation platform of claim 8, wherein the device operation module comprises:
第一验证单元, 用于对所述设备配置模块配置后的所述多个设备进行验证; 第一端口初始化单元, 用于生成与通过验证的所述多个设备的所述设备控制命令 对应的物理端口, 并检查所述物理端口是否冲突, 当检查所述物理端口无冲突时, 对 所述物理端口进行初始化;  a first verification unit, configured to perform verification on the multiple devices that are configured by the device configuration module, where the first port initialization unit is configured to generate, by using the device control command of the multiple devices that are verified Physical port, and checking whether the physical port conflicts, and when checking that the physical port has no conflict, initializing the physical port;
第一命令管理单元, 用于发送或接收所述设备控制命令;  a first command management unit, configured to send or receive the device control command;
第一仿真单元, 用于执行与所述设备控制命令对应的仿真动作; 和 第一错误管理单元, 用于以日志的形式记录设备层仿真过程中的错误信息。 a first simulation unit, configured to execute a simulation action corresponding to the device control command; and The first error management unit is configured to record error information in the device layer simulation process in the form of a log.
12、 如权利要求 2所述的仿真平台, 其中, 所述子系统层处理器包括:  12. The simulation platform of claim 2, wherein the subsystem layer processor comprises:
子系统配置模块, 所述子系统配置模块用于建立所述仿真平台中的多个子系统, 并生成与所述多个子系统对应的子系统层配置文件以对所述多个子系统进行配置, 其 中, 每个所述子系统包括多个设备, 将所述子系统包括的多个设备所对应的所述设备 层配置文件加载至所述多个子系统以配置所述子系统中的所述多个设备; 和  a subsystem configuration module, where the subsystem configuration module is configured to establish a plurality of subsystems in the simulation platform, and generate a subsystem layer configuration file corresponding to the multiple subsystems to configure the multiple subsystems, where Each of the subsystems includes a plurality of devices, and the device layer configuration file corresponding to the plurality of devices included in the subsystem is loaded to the plurality of subsystems to configure the plurality of the subsystems Equipment; and
子系统运行模块, 所述子系统运行模块用于对配置后的多个子系统进行验证, 且 在通过验证后对所述多个子系统进行仿真。  The subsystem running module is configured to verify the configured multiple subsystems, and simulate the multiple subsystems after passing the verification.
13、 如权利要求 12所述的仿真平台, 其中, 所述子系统层配置文件包括: 子系统属性, 所述子系统属性包括子系统的属性名称;  The simulation platform according to claim 12, wherein the subsystem layer configuration file includes: a subsystem attribute, where the subsystem attribute includes an attribute name of the subsystem;
子系统内部的设备属性, 所述子系统内部的设备属性包括设备的名称、 设备的类 型和物理端口;  The device attribute inside the subsystem. The device attributes inside the subsystem include the name of the device, the type of the device, and the physical port.
设备间耦合条件, 所述设备间耦合条件包括耦合设备的名称、 耦合条件和耦合触 发命令;  a coupling condition between devices, the coupling condition of the device includes a name of the coupling device, a coupling condition, and a coupling trigger command;
设备间耦合关系, 所述设备间耦合关系包括设备间的耦合动作, 耦合设备的名称、 所述耦合动作的步骤数目和每一步骤对应的耦合动作类型。  The inter-device coupling relationship includes a coupling action between devices, a name of the coupling device, a number of steps of the coupling action, and a coupling action type corresponding to each step.
14、 如权利要求 13所述的仿真平台, 其中, 所述耦合动作类型包括设备行为、 耦 合动作条件和耦合动作的延迟。  14. The simulation platform of claim 13, wherein the type of coupling action comprises a device behavior, a coupling action condition, and a delay of the coupling action.
15、 如权利要求 14所述的仿真平台, 其中, 子系统配置模块还用于向所述多个子 系统中添加一个或多个子系统, 或者从所述多个子系统中删除一个或多个子系统; 以 及向所述各个子系统中添加一个或多个所述设备, 或者从所述各个子系统中删除一个 或多个所述设备。  The simulation platform according to claim 14, wherein the subsystem configuration module is further configured to add one or more subsystems to the plurality of subsystems, or delete one or more subsystems from the plurality of subsystems; And adding one or more of the devices to the respective subsystems or deleting one or more of the devices from the respective subsystems.
16、 如权利要求 13所述的仿真平台, 其中, 所述子系统运行模块包括: 第二验证单元, 用于对所述子系统配置模块配置后的所述子系统进行验证; 第二端口初始化单元, 用于生成与通过验证的子系统内所述多个设备的设备控制 命令对应的物理端口, 并检查所述物理端口是否冲突, 当检查所述物理端口无冲突时, 运行所述子系统内的所述多个设备并对所述物理端口进行初始化;  The simulation platform according to claim 13, wherein the subsystem operation module comprises: a second verification unit, configured to perform verification on the subsystem configured by the subsystem configuration module; a unit, configured to generate a physical port corresponding to the device control command of the multiple devices in the verified subsystem, and check whether the physical port conflicts, and when the physical port is checked to have no conflict, run the subsystem The plurality of devices within and initializing the physical port;
第二命令管理单元, 用于接收或发送所述子系统内的所述多个设备的设备控制命 令;  a second command management unit, configured to receive or send a device control command of the multiple devices in the subsystem;
第二仿真单元, 用于执行与所述子系统内的所述多个设备的设备控制命令对应的 仿真动作, 并触发所述耦合条件, 根据所述耦合条件执行相应的耦合动作; 和  a second simulation unit, configured to execute a simulation action corresponding to a device control command of the multiple devices in the subsystem, and trigger the coupling condition, and perform a corresponding coupling action according to the coupling condition; and
第二错误管理单元, 用于以日志的形式记录子系统层仿真过程中的错误信息。 The second error management unit is configured to record error information in the subsystem layer simulation process in the form of a log.
17、 如权利要求 2所述的仿真平台, 其中, 所述系统层处理器包括: The simulation platform according to claim 2, wherein the system layer processor comprises:
系统配置模块, 所述系统配置模块用于建立所述仿真平台中的多个系统, 并生成 与所述多个系统对应的系统层配置文件以对所述多个系统进行配置, 其中, 每个所述 系统包括多个子系统, 将所述多个系统对应的所述子系统层配置文件加载至所述多个 系统以配置各个系统中的所述多个子系统; 和 a system configuration module, where the system configuration module is configured to establish a plurality of systems in the simulation platform, and generate a system layer configuration file corresponding to the multiple systems to configure the multiple systems, where each Said The system includes a plurality of subsystems, the subsystem layer configuration files corresponding to the plurality of systems being loaded to the plurality of systems to configure the plurality of subsystems in each system; and
系统运行模块, 所述系统运行模块用于对配置后的所述多个系统进行验证, 且在 通过验证后进行对所述多个系统进行仿真。  And a system running module, where the system running module is configured to verify the configured multiple systems, and after performing verification, perform simulation on the multiple systems.
18、 如权利要求 17所述的仿真平台, 其中, 所述系统层配置文件包括: 系统属性, 所述系统属性包括系统名称和系统说明信息;  The simulation platform according to claim 17, wherein the system layer configuration file includes: a system attribute, where the system attribute includes a system name and system description information;
系统内部的子系统属性, 所述系统内部的子系统属性包括子系统的名称和各个子 系统内部的设备; 和  Subsystem attributes within the system, the subsystem attributes within the system include the name of the subsystem and the devices within each subsystem; and
子系统间的耦合关系。  The coupling relationship between subsystems.
19、 如权利要求 17所述的仿真平台, 其中, 所述系统配置模块还用于向所述多个 系统中添加一个或多个系统, 或者从所述多个系统中删除一个或多个系统; 以及向所 述各个系统中添加一个或多个所述子系统, 或者从所述各个系统中删除一个或多个所 述子系统。  19. The simulation platform of claim 17, wherein the system configuration module is further configured to add one or more systems to the plurality of systems, or delete one or more systems from the plurality of systems And adding one or more of the subsystems to the various systems, or deleting one or more of the subsystems from the various systems.
20、 如权利要求 18所述的仿真平台, 其中, 所述系统运行模块包括:  The simulation platform of claim 18, wherein the system operation module comprises:
第三验证单元, 用于对所述系统配置模块配置后的所述多个系统进行验证; 第三端口初始化单元, 用于生成与通过验证后的系统内的多个子系统中的多个设 备的设备控制命令对应的物理端口, 并检查所述物理端口是否冲突, 当检查所述物理 端口无冲突时, 运行所述系统内部的子系统以及所述子系统内部的所述设备, 并对所 述物理端口进行初始化;  a third verification unit, configured to perform verification on the multiple systems configured by the system configuration module; and a third port initialization unit, configured to generate, by using, multiple devices in the plurality of subsystems in the verified system The device controls a physical port corresponding to the command, and checks whether the physical port conflicts. When checking that the physical port has no conflict, the subsystem inside the system and the device inside the subsystem are operated, and the device is The physical port is initialized;
第三命令管理单元, 用于接收或发送所述系统内部的子系统中的所述设备的所述 设备控制命令;  a third command management unit, configured to receive or send the device control command of the device in a subsystem internal to the system;
第三仿真单元, 用于执行与所述设备控制命令对应的仿真动作, 并触发所述设备 间的耦合条件, 以及根据所述耦合条件执行相应的耦合动作; 和  a third simulation unit, configured to execute a simulation action corresponding to the device control command, trigger a coupling condition between the devices, and perform a corresponding coupling action according to the coupling condition; and
第三错误管理单元, 用于以日志的形式系统层仿真过程中的错误信息。  The third error management unit is used for error information in the system layer simulation process in the form of logs.
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