WO2012026647A1 - 디지털 x선 검출장치 - Google Patents
디지털 x선 검출장치 Download PDFInfo
- Publication number
- WO2012026647A1 WO2012026647A1 PCT/KR2010/006857 KR2010006857W WO2012026647A1 WO 2012026647 A1 WO2012026647 A1 WO 2012026647A1 KR 2010006857 W KR2010006857 W KR 2010006857W WO 2012026647 A1 WO2012026647 A1 WO 2012026647A1
- Authority
- WO
- WIPO (PCT)
- Prior art keywords
- ray detection
- fitting grooves
- detection array
- ray
- shock absorbing
- Prior art date
Links
- 238000001514 detection method Methods 0.000 claims abstract description 55
- 230000035939 shock Effects 0.000 claims abstract description 44
- 230000008878 coupling Effects 0.000 claims description 28
- 238000010168 coupling process Methods 0.000 claims description 28
- 238000005859 coupling reaction Methods 0.000 claims description 28
- 238000000034 method Methods 0.000 claims description 10
- 239000010409 thin film Substances 0.000 abstract description 10
- 239000010408 film Substances 0.000 abstract description 6
- 238000010521 absorption reaction Methods 0.000 abstract 2
- 239000000463 material Substances 0.000 description 12
- 239000011521 glass Substances 0.000 description 7
- 239000000758 substrate Substances 0.000 description 7
- BUGBHKTXTAQXES-UHFFFAOYSA-N Selenium Chemical compound [Se] BUGBHKTXTAQXES-UHFFFAOYSA-N 0.000 description 2
- 239000003990 capacitor Substances 0.000 description 2
- 238000003384 imaging method Methods 0.000 description 2
- 229910052711 selenium Inorganic materials 0.000 description 2
- 239000011669 selenium Substances 0.000 description 2
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 description 1
- 239000000853 adhesive Substances 0.000 description 1
- 230000001070 adhesive effect Effects 0.000 description 1
- 229910052799 carbon Inorganic materials 0.000 description 1
- 238000006243 chemical reaction Methods 0.000 description 1
- 238000002059 diagnostic imaging Methods 0.000 description 1
- 238000009413 insulation Methods 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 239000007787 solid Substances 0.000 description 1
Images
Classifications
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01T—MEASUREMENT OF NUCLEAR OR X-RADIATION
- G01T1/00—Measuring X-radiation, gamma radiation, corpuscular radiation, or cosmic radiation
- G01T1/16—Measuring radiation intensity
-
- A—HUMAN NECESSITIES
- A61—MEDICAL OR VETERINARY SCIENCE; HYGIENE
- A61B—DIAGNOSIS; SURGERY; IDENTIFICATION
- A61B6/00—Apparatus or devices for radiation diagnosis; Apparatus or devices for radiation diagnosis combined with radiation therapy equipment
- A61B6/42—Arrangements for detecting radiation specially adapted for radiation diagnosis
- A61B6/4208—Arrangements for detecting radiation specially adapted for radiation diagnosis characterised by using a particular type of detector
- A61B6/4233—Arrangements for detecting radiation specially adapted for radiation diagnosis characterised by using a particular type of detector using matrix detectors
-
- A—HUMAN NECESSITIES
- A61—MEDICAL OR VETERINARY SCIENCE; HYGIENE
- A61B—DIAGNOSIS; SURGERY; IDENTIFICATION
- A61B6/00—Apparatus or devices for radiation diagnosis; Apparatus or devices for radiation diagnosis combined with radiation therapy equipment
- A61B6/42—Arrangements for detecting radiation specially adapted for radiation diagnosis
- A61B6/4283—Arrangements for detecting radiation specially adapted for radiation diagnosis characterised by a detector unit being housed in a cassette
Definitions
- the present invention relates to a digital X-ray detection apparatus for obtaining a digital image using a thin film transistor (TFT) without a film.
- TFT thin film transistor
- the digital X-ray detection apparatus is formed in a form in which the X-ray detection array is fixed in the outer case.
- the X-ray detection array may include a glass substrate, a thin film transistor stacked on the glass substrate, a photoconversion material layer of amorphous selenium stacked on the thin film transistor, an insulating layer formed on the photoconversion material layer, and insulation.
- a top electrode formed over the layer.
- the X-rays When X-rays are irradiated onto the X-ray detection array, the X-rays create electron-hole pairs in the photoconversion material layer.
- the electron-hole pair is accelerated by the voltage applied to the top electrode so that the electrons move to the external electrode, and the holes are charged to the capacitor of the TFT through the upper electrode of the TFT.
- the charged voltage can detect the X-ray detection image by the switching operation of the TFT.
- the above-described digital X-ray detection apparatus is frequently used outside of the X-ray imaging system, and thus, the digital X-ray detection apparatus is likely to be exposed to a force applied from the outside. For example, there may be a case where the digital X-ray detecting device falls and is shocked while moving or in use, or is shocked from the outside.
- components of the X-ray detection array such as the photoconversion material layer, the thin film transistor, and the glass substrate, which are susceptible to damage in the digital X-ray detection apparatus, may be damaged.
- a problem may occur in which the performance of the digital X-ray detection apparatus is deteriorated. Therefore, there is a need for a method that can protect the X-ray detection array from impact.
- An object of the present invention is to solve the above problems, and to provide a digital X-ray detection apparatus that can protect the components of the X-ray detection array that are easily damaged from impact.
- a digital X-ray detection apparatus comprising: an X-ray detection array configured to detect an X-ray image during X-ray irradiation of a subject; A support plate supporting a lower side of the X-ray detection array and having a plurality of first coupling parts spaced apart from each other on a lower surface thereof; An outer case accommodating the X-ray detection array and the support plate and having second coupling parts formed on the inner bottom thereof to correspond to the first coupling parts, respectively; And shock absorbing members arranged between the lower surface of the support plate and the inner bottom surface of the outer case, each upper end coupled to the first coupling part, and each lower end coupled to the second coupling part.
- the support plate can be fixed to the outer case by coupling the upper and lower ends of the shock absorbing members to the support plate and the outer case without fixing the support plate to the outer case with screws or locking devices.
- the shock since the shock may be absorbed by the shock absorbing members during external shock, damage to components of the X-ray detection array, such as a photoconversion material layer, a thin film transistor, and a glass substrate, which are easily damaged, may be prevented.
- the first and second coupling parts may be formed in a groove shape in which upper and lower ends of the shock absorbing member are fitted, and thus, assembly convenience may be increased.
- FIG. 1 is a cross-sectional view of a digital X-ray detection apparatus according to an embodiment of the present invention.
- FIG. 2 is an exploded perspective view illustrating a process in which the shock absorbing members are coupled to the support plate and the outer case in FIG. 1;
- FIG. 3 is a cross-sectional view illustrating a modified example of the first and second coupling parts of FIG. 1.
- FIG. 4 is an exploded perspective view for explaining a process in which the shock absorbing members are coupled to the first and second coupling parts in FIG. 3.
- FIG. 5 is an exploded perspective view showing a modified example of the first and second fitting grooves and the shock absorbing member in FIG. 2;
- FIG. 6 is an exploded perspective view showing a modified example of the shock absorbing member in FIG. 2;
- FIG. 1 is a cross-sectional view of a digital X-ray detection apparatus according to an embodiment of the present invention.
- 2 is an exploded perspective view illustrating a process in which the shock absorbing members are coupled to the support plate and the outer case in FIG. 1.
- the digital X-ray detection apparatus 100 includes an X-ray detection array 110, a support plate 120, an outer case 130, and shock absorbing members 140. .
- the X-ray detection array 110 detects an X-ray image when X-ray irradiation of a subject.
- the X-ray detection array 110 may be configured to directly convert X-rays to electric charges.
- the X-ray detection array 110 may include a glass substrate, a thin film transistor stacked on the glass substrate, a photoelectric conversion material layer 111 of amorphous selenium stacked on the thin film transistor, and a photoconversion material layer 111. ) And an insulating layer formed on the insulating layer and a top electrode formed on the insulating layer.
- X-rays When X-rays are irradiated onto the X-ray detection array 110 from above, X-rays cause ionization in the photoconversion material layer 111 to form electron-hole pairs.
- the electron-hole pair is accelerated by the voltage applied to the top electrode so that the electrons move to the external electrode, and the holes are charged to the capacitor of the TFT through the upper electrode of the TFT.
- the charged voltage can detect the X-ray detection image by the switching operation of the TFT.
- the support plate 120 supports the lower side of the X-ray detection array 110 by mounting the X-ray detection array 110 on the upper surface.
- a circuit board 101 may be mounted on a bottom surface of the support plate 120, and the circuit board 101 may be electrically connected to the X-ray detection array 110 by the connection member 102.
- the support plate 120 is formed on the lower surface such that the plurality of first coupling parts 121 are spaced apart from each other. The first coupling parts 121 are for coupling with the upper ends of the shock absorbing members 140.
- the outer case 130 is formed to accommodate the X-ray detection array 110 and the support plate 120.
- the outer case 130 may wrap and protect the X-ray detection array 110 and may be made of a material such as carbon to mitigate an impact from the outside.
- the outer case 130 may include a cabinet 131 and a cover 132.
- the cabinet 131 has a flat bottom surface and four wall surfaces, and has an open top shape.
- the cover 132 is formed to cover the upper opening of the cabinet 131, and is fixed to the cabinet 131 while covering the upper opening of the cabinet 131.
- second coupling parts 133 are formed on the inner bottom, that is, the inner bottom of the cabinet 131 to correspond to the first coupling parts 121, respectively.
- the second coupling parts 133 are for coupling with each lower end of the shock absorbing members 140.
- the shock absorbing members 140 are arranged upright between the lower surface of the support plate 120 and the inner bottom surface of the outer case 130. In addition, each of the shock absorbing members 140 is coupled to the first coupling portion 121 and each of the lower edges is coupled to the second coupling portion 133.
- the shock absorbing members 140 When an impact is applied to the digital X-ray detection apparatus 100 by a force or a drop applied from the outside, the shock absorbing members 140 are deformed in the up-down direction or in the left-right direction to absorb the shock. Accordingly, the shock transmitted to the X-ray detection array 110 may be reduced.
- the support plate 120 may be fixed to the outer case 130.
- the shock absorbing member 140 may be made of a material such as rubber. The hardness of the rubber serves to fix the support plate 120 so that the side of the X-ray detection array 110 does not hit the wall surface of the outer case 130 during an external impact, and at the same time serves to absorb the external impact. Can be set.
- the upper and lower ends of the shock absorbing members 140 may be supported by the support plate 120 without fixing the support plate 120 to the outer case 130 with a screw or a locking device.
- the support plate 120 may be fixed to the outer case 130.
- the shock absorbing members 140 may absorb shocks during external shocks, and thus, components of the X-ray detection array 110 which are easily damaged, such as the photoconversion material layer 111, a thin film transistor, and a glass substrate, may be used. Damage can be prevented.
- the buffer member 150 may be inserted between the upper surface of the X-ray detection array 110 and the inner upper surface of the outer case 130.
- the buffer member 150 serves as a buffer between the X-ray detection array 110 and the outer case 130 to protect the upper surface of the X-ray detection array 110.
- the buffer member 150 may be made of a material such as sponge, rubber, or the like. In this case, the buffer member 150 may also serve to insulate the X-ray detection array 110 from the outside.
- the buffer member 150 may be inserted into a compressed state between the upper surface of the X-ray detection array 110 and the inner upper surface of the outer case 130 to press the X-ray detection array 110. Accordingly, the support plate 120 may be more stably fixed by the force that the buffer member 150 presses the X-ray detection array 110 and the force that the shock absorbing members 140 support the support plate 120. have.
- the first coupling portion 121 is formed of a first fitting groove 122 to which the upper end of the shock absorbing member 140 is fitted
- the second coupling portion 133 is a lower end of each of the shock absorbing members 140
- the fitting may be formed of the second fitting grooves 134. Accordingly, the upper and lower ends of the shock absorbing members 140 are fitted into the first and second fitting grooves 122 and 134 to assemble the shock absorbing members 140 to the support plate 120 and the outer case 130. ) Can be combined. Therefore, assembly convenience can be increased. At least one end of the upper and lower ends of the shock absorbing member 140 may be attached to the first fitting groove 122 or the second fitting groove 134 by an adhesive and more firmly fixed.
- the first fitting grooves 122 are recessed in the protrusions 123 protruding from the lower surface of the support plate 120, respectively, and the second fitting grooves 134 protruding from the inner bottom of the outer case 130.
- Each of the concave portions 135 may be concave.
- the first fitting grooves 122 are formed concave on the bottom surface of the support plate 120, respectively, and the second fitting grooves 134 are formed in the outer case 130.
- the inner bottom may be concave, respectively.
- any one of the first fitting groove 122 and the second fitting groove 134 may be formed as shown in FIG. 2, and the other may be formed as shown in FIG. 4.
- Each of the first fitting grooves 122 and the second fitting grooves 134 may have a circular cross section.
- the cross-section of the shock absorbing member 140 is the first fitting groove 122 and the second fitting groove so that the upper and lower ends of the shock absorbing member 140 may be fitted into the first and second fitting grooves 122 and 134. It is formed in a circular shape having the same shape as each cross sectional shape of 134. Accordingly, the upper and lower ends of the shock absorbing member 140 may be fixed to the first and second fitting grooves 122 and 134 in a more firmly fitted state.
- each of the first fitting grooves 222 and the second fitting grooves 234 may have a polygonal shape, for example, a hexagon.
- the cross section of each of the first fitting groove 222 and the second fitting groove 234 so that the upper and lower ends of the shock absorbing member 240 can be fitted into the first and second fitting grooves 222 and 234. It is formed in the hexagon which is the same shape as a shape.
- the protrusion 223 of the support plate 120 and the protrusion 235 of the outer case 130 may also be formed in a hexagonal shape.
- shock absorbing members 140 and 240 may be formed in a solid shape as shown in FIGS. 1 to 5, but the shock absorbing members 340 are hollow in the vertical direction as shown in FIG. 6. It is also possible to be formed in the ring shape in which the 341 was formed.
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- Health & Medical Sciences (AREA)
- Life Sciences & Earth Sciences (AREA)
- Medical Informatics (AREA)
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Molecular Biology (AREA)
- High Energy & Nuclear Physics (AREA)
- Biomedical Technology (AREA)
- Animal Behavior & Ethology (AREA)
- Optics & Photonics (AREA)
- Pathology (AREA)
- Radiology & Medical Imaging (AREA)
- Biophysics (AREA)
- Heart & Thoracic Surgery (AREA)
- Veterinary Medicine (AREA)
- Surgery (AREA)
- Nuclear Medicine, Radiotherapy & Molecular Imaging (AREA)
- General Health & Medical Sciences (AREA)
- Public Health (AREA)
- Mathematical Physics (AREA)
- General Physics & Mathematics (AREA)
- Spectroscopy & Molecular Physics (AREA)
- Measurement Of Radiation (AREA)
- Apparatus For Radiation Diagnosis (AREA)
Abstract
Description
Claims (7)
- 피사체에 대한 X선 조사시 X선 영상을 검출하는 X선 검출 어레이;상기 X선 검출 어레이의 하측을 지지하며, 하면에 복수의 제1 결합부들이 서로 이격되게 형성된 지지 판;상기 X선 검출 어레이와 지지 판을 수용하며, 안쪽 저면에 상기 제1 결합부들에 각각 대응되게 제2 결합부들이 형성된 외부 케이스; 및상기 지지 판의 하면과 상기 외부 케이스의 안쪽 저면 사이에 각각 세워져 배열되며, 각 상단이 상기 제1 결합부에 결합되고 각 하단이 상기 제2 결합부에 결합되는 충격흡수부재들;을 포함하는 디지털 X선 검출장치.
- 제1항에 있어서,상기 제1 결합부들은 상기 충격흡수부재들의 각 상단이 끼움 결합되는 제1 끼움 홈들로 형성되며,상기 제2 결합부들은 상기 충격흡수부재들의 각 하단이 끼움 결합되는 제2 끼움 홈들로 형성된 것을 특징으로 하는 디지털 X선 검출장치.
- 제2항에 있어서,상기 제1 끼움 홈들은 상기 지지 판의 하면에 돌출 형성된 돌출부들에 각각 오목하게 형성되며,상기 제2 끼움 홈들은 상기 외부 케이스의 안쪽 저면에 돌출 형성된 돌출부들에 각각 오목하게 형성된 것을 특징으로 하는 디지털 X선 검출장치.
- 제2항에 있어서,상기 제1 끼움 홈들은 상기 지지 판의 하면에 각각 오목하게 형성되며,상기 제2 끼움 홈들은 상기 외부 케이스의 안쪽 저면에 각각 오목하게 형성된 것을 특징으로 하는 디지털 X선 검출장치.
- 제2항에 있어서,상기 제1 끼움 홈들 및 제2 끼움 홈들은 각 횡단면이 원형 또는 다각형으로 형성되며,상기 충격흡수부재들은 각 횡단면이 상기 제1 끼움 홈들 및 제2 끼움 홈들의 각 횡단면 형상과 동일한 형상으로 형성된 것을 특징으로 하는 디지털 X선 검출장치.
- 제1항에 있어서,상기 충격흡수부재들은 상하 방향으로 중공이 형성된 링 형상으로 각각 형성된 것을 특징으로 하는 디지털 X선 검출장치.
- 제1항 내지 제6항 중 어느 한 항에 있어서,상기 X선 검출 어레이의 상면과 상기 외부 케이스의 안쪽 상면 사이에 삽입되는 완충부재를 더 포함하는 디지털 X선 검출장치.
Priority Applications (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US13/818,030 US20130153780A1 (en) | 2010-08-24 | 2010-10-07 | Digital x-ray detector |
CN2010800693842A CN103140171A (zh) | 2010-08-24 | 2010-10-07 | 数字x 射线检测装置 |
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
KR1020100082163A KR101118751B1 (ko) | 2010-08-24 | 2010-08-24 | 디지털 x선 검출장치 |
KR10-2010-0082163 | 2010-08-24 |
Publications (1)
Publication Number | Publication Date |
---|---|
WO2012026647A1 true WO2012026647A1 (ko) | 2012-03-01 |
Family
ID=45723628
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
PCT/KR2010/006857 WO2012026647A1 (ko) | 2010-08-24 | 2010-10-07 | 디지털 x선 검출장치 |
Country Status (4)
Country | Link |
---|---|
US (1) | US20130153780A1 (ko) |
KR (1) | KR101118751B1 (ko) |
CN (1) | CN103140171A (ko) |
WO (1) | WO2012026647A1 (ko) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN103371839A (zh) * | 2012-04-27 | 2013-10-30 | Ge医疗系统环球技术有限公司 | X射线检测器的框架和x射线检测器 |
Families Citing this family (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
KR101174477B1 (ko) * | 2010-11-17 | 2012-08-17 | 주식회사 디알텍 | 디지털 x선 검출장치 |
JP5694892B2 (ja) * | 2011-10-19 | 2015-04-01 | 富士フイルム株式会社 | 放射線画像撮影装置 |
JP6878263B2 (ja) * | 2017-12-22 | 2021-05-26 | 富士フイルム株式会社 | 放射線検出装置 |
US20230013291A1 (en) * | 2021-07-16 | 2023-01-19 | Varex Imaging Corporation | X-ray detectors with front mounted sensor substrates |
Citations (4)
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KR20020038022A (ko) * | 2000-11-16 | 2002-05-23 | 윤정기 | 평판형 디지털 x선촬영 카세트 |
US6700126B2 (en) * | 2000-06-09 | 2004-03-02 | Canon Kabushiki Kaisha | Radiographic apparatus |
US7569831B2 (en) * | 2007-09-12 | 2009-08-04 | Carestream Health, Inc. | Assembly features and shock protection for a digital radiography detector |
US20100001195A1 (en) * | 2008-07-02 | 2010-01-07 | Nicholas Ryan Konkle | Methods and apparatus for conducting heat from an electronic assembly while providing shock protection |
Family Cites Families (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2002014168A (ja) * | 2000-06-27 | 2002-01-18 | Canon Inc | X線撮像装置 |
DE102004042365A1 (de) * | 2003-09-12 | 2005-04-14 | Siemens Ag | Röntgendetektor |
-
2010
- 2010-08-24 KR KR1020100082163A patent/KR101118751B1/ko active IP Right Grant
- 2010-10-07 WO PCT/KR2010/006857 patent/WO2012026647A1/ko active Application Filing
- 2010-10-07 CN CN2010800693842A patent/CN103140171A/zh active Pending
- 2010-10-07 US US13/818,030 patent/US20130153780A1/en not_active Abandoned
Patent Citations (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US6700126B2 (en) * | 2000-06-09 | 2004-03-02 | Canon Kabushiki Kaisha | Radiographic apparatus |
KR20020038022A (ko) * | 2000-11-16 | 2002-05-23 | 윤정기 | 평판형 디지털 x선촬영 카세트 |
US7569831B2 (en) * | 2007-09-12 | 2009-08-04 | Carestream Health, Inc. | Assembly features and shock protection for a digital radiography detector |
US20100001195A1 (en) * | 2008-07-02 | 2010-01-07 | Nicholas Ryan Konkle | Methods and apparatus for conducting heat from an electronic assembly while providing shock protection |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN103371839A (zh) * | 2012-04-27 | 2013-10-30 | Ge医疗系统环球技术有限公司 | X射线检测器的框架和x射线检测器 |
Also Published As
Publication number | Publication date |
---|---|
KR20120019057A (ko) | 2012-03-06 |
CN103140171A (zh) | 2013-06-05 |
KR101118751B1 (ko) | 2012-03-13 |
US20130153780A1 (en) | 2013-06-20 |
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