WO2012015131A1 - Multiband chip antenna mounting substrate and multiband chip antenna device comprising same - Google Patents

Multiband chip antenna mounting substrate and multiband chip antenna device comprising same Download PDF

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Publication number
WO2012015131A1
WO2012015131A1 PCT/KR2011/000323 KR2011000323W WO2012015131A1 WO 2012015131 A1 WO2012015131 A1 WO 2012015131A1 KR 2011000323 W KR2011000323 W KR 2011000323W WO 2012015131 A1 WO2012015131 A1 WO 2012015131A1
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WO
WIPO (PCT)
Prior art keywords
pad
chip antenna
disposed
ground
substrate
Prior art date
Application number
PCT/KR2011/000323
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French (fr)
Korean (ko)
Inventor
정해영
김민성
전찬익
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(주)파트론
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Publication of WO2012015131A1 publication Critical patent/WO2012015131A1/en

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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01Q—ANTENNAS, i.e. RADIO AERIALS
    • H01Q1/00—Details of, or arrangements associated with, antennas
    • H01Q1/12—Supports; Mounting means
    • H01Q1/22—Supports; Mounting means by structural association with other equipment or articles
    • H01Q1/24—Supports; Mounting means by structural association with other equipment or articles with receiving set
    • H01Q1/241—Supports; Mounting means by structural association with other equipment or articles with receiving set used in mobile communications, e.g. GSM
    • H01Q1/242—Supports; Mounting means by structural association with other equipment or articles with receiving set used in mobile communications, e.g. GSM specially adapted for hand-held use
    • H01Q1/243—Supports; Mounting means by structural association with other equipment or articles with receiving set used in mobile communications, e.g. GSM specially adapted for hand-held use with built-in antennas
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01Q—ANTENNAS, i.e. RADIO AERIALS
    • H01Q1/00—Details of, or arrangements associated with, antennas
    • H01Q1/36—Structural form of radiating elements, e.g. cone, spiral, umbrella; Particular materials used therewith
    • H01Q1/38—Structural form of radiating elements, e.g. cone, spiral, umbrella; Particular materials used therewith formed by a conductive layer on an insulating support
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01Q—ANTENNAS, i.e. RADIO AERIALS
    • H01Q1/00—Details of, or arrangements associated with, antennas
    • H01Q1/44—Details of, or arrangements associated with, antennas using equipment having another main function to serve additionally as an antenna, e.g. means for giving an antenna an aesthetic aspect
    • H01Q1/46—Electric supply lines or communication lines
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01Q—ANTENNAS, i.e. RADIO AERIALS
    • H01Q5/00—Arrangements for simultaneous operation of antennas on two or more different wavebands, e.g. dual-band or multi-band arrangements
    • H01Q5/30—Arrangements for providing operation on different wavebands
    • H01Q5/307—Individual or coupled radiating elements, each element being fed in an unspecified way
    • H01Q5/314—Individual or coupled radiating elements, each element being fed in an unspecified way using frequency dependent circuits or components, e.g. trap circuits or capacitors

Definitions

  • the present invention is a multi-band chip antenna mounting substrate and a multi-band chip antenna device including the same.
  • the antenna included in the mobile communication terminal is also a reality in pursuit of high performance and miniaturization.
  • most mobile communication terminal antennas have been converted to built-in types, and also require high efficiency, broadband, or multi-band. Since the frequency bands used in the world are different from country to country, a mobile communication terminal is manufactured using a multi-band antenna that can operate in multiple frequency bands with one antenna.
  • the conventional multi-band chip antenna has no tuning point to easily change the resonant frequency, so it is not easy to adjust the resonant frequency. Therefore, it is difficult to easily adjust the resonant frequency in multiple bands with one antenna. there was.
  • the technical problem to be solved by the present invention is to provide a multi-band chip antenna mounting substrate that is easy to tune the resonant frequency for multiple frequency bands.
  • Another technical problem to be solved by the present invention is to provide a multi-band chip antenna device that is easy to tune the resonant frequency for multiple frequency bands.
  • One aspect of the multiband chip antenna mounting substrate of the present invention for achieving the above technical problem is a ground pattern, the first to third ground line, the first to third ground line disposed to be connected to the ground pattern First to third pads disposed to be connected to the second pads, a power feeding line to be connected to the second pads, and a concentrated water purifying element disposed to be connected to at least one of the first to third ground lines and the power feeding lines. .
  • One aspect of the multiband chip antenna device of the present invention for achieving the above another technical problem is a substrate for mounting the multiband chip antenna mounting according to the present invention, and the substrate is disposed on at least one surface of the dielectric block And a multiband chip antenna including first to third radiator patterns, wherein the substrate is connected to a ground pattern, first to third ground lines disposed to be connected to the ground pattern, and first to third ground lines, respectively.
  • a multiband device comprising: first to third pads disposed; a feeding line arranged to be connected to the second pad; and a concentrated water purifying element arranged to be connected to at least one of the first to third ground lines and the feeding line;
  • the first to third radiator patterns of the chip antenna are arranged to be connected to the first to third pads, respectively.
  • the multi-band chip antenna mounting substrate and the multi-band chip antenna apparatus including the same it is possible to reduce the size of the antenna and to easily tune the frequency band of the chip antenna to suit various frequency bands.
  • the size of the antenna is reduced through the patterned radiators, but the frequency band is adjusted by adjusting only the lumped constant elements without directly changing the patterned radiators.
  • tuning there is an advantage that can easily tune the band for the frequency used in each country.
  • FIG 1 and 2 are layout views of a multi-band chip antenna mounting substrate according to an embodiment of the present invention.
  • 3 and 4 are layout views of a multi-band chip antenna mounting substrate according to modified embodiments of an embodiment of the present invention.
  • FIG. 5 is a layout view of a multi-band chip antenna mounting substrate according to another embodiment of the present invention.
  • FIG. 6 and 7 are layout views of a multi-band chip antenna mounting substrate according to modified embodiments of another embodiment of the present invention.
  • FIG. 8 is a perspective view of a multiband chip antenna device according to an embodiment of the present invention.
  • 9 to 11 are layout views of a multiband chip antenna of a multiband chip antenna device according to an embodiment of the present invention.
  • the present invention is a multi-band chip antenna mounting substrate and a multi-band chip antenna device including the same.
  • FIGS. 1 and 2 a multiband chip antenna mounting substrate according to an embodiment of the present invention will be described with reference to FIGS. 1 and 2.
  • FIG. 1 and 2 are layout views of a multi-band chip antenna mounting substrate according to an embodiment of the present invention.
  • FIG. 1 is a layout view of one surface (eg, an upper surface) of a substrate for mounting a multi-band chip antenna according to an embodiment of the present invention
  • FIG. 2 is a multi-band chip antenna mounting according to an embodiment of the present invention. It is a layout view of the other surface (for example, lower surface) of the substrate for a use.
  • the substrate 10 may include a ground pattern 20, first to third ground lines 32, 34, and 36, first to third pads 72, 74, and 76, and a power supply.
  • the line 40 may include lumped elements 50a and 50b.
  • the ground pattern 20 may be disposed on one surface (eg, an upper surface) of the substrate to define a ground region.
  • the inside of the ground pattern, that is, the area surrounded by the ground pattern 20 may be defined as an ungrounded area.
  • the ground pattern 20 may be connected to an external ground electrode (not shown).
  • the first to third ground lines 32, 34, and 36 may be connected to the ground pattern 20.
  • the first to third ground lines 32, 34, and 36 may be connected to the ground pattern 20 in the non-grounding region defined above.
  • each of the first ground line 32 and the third ground line 36 may include the first ground line 32 and the first ground line 36, respectively, as shown in FIG. 1, from the ground pattern 20 to the ungrounded area on one surface (eg, the upper surface) of the substrate. May be disposed to protrude in a direction (eg, X direction), and the second ground line 34 may be disposed in the non-grounded area on the other surface (eg, the bottom surface) of the substrate as shown in FIG. 2. ) May protrude in a second direction (eg, the Y direction).
  • the second ground line 34 may be connected to the second pad 74 to be described later, for example, through the via 60.
  • the first to third pads 72, 74, and 76 may be disposed to be connected to the first to third ground lines 32, 34, and 36, respectively.
  • the first to third pads 72, 74, and 76 may be arranged to be connected to the first to third ground lines 32, 34, and 36, respectively, in the ungrounded area.
  • the first to third pads 72, 74, and 76 may have a second direction (eg, Y direction) in an ungrounded area on one surface (eg, upper surface) of the substrate as shown in FIG. 1. It may be formed to be spaced apart by a predetermined interval to extend side by side.
  • the first and third pads 72 and 76 are disposed to be connected to the first and third ground lines 32 and 36 protruding from the ground pattern 20 in a first direction (for example, X direction).
  • the second pad 74 may protrude from the ground pattern 20 in the second direction (for example, the Y direction) and be disposed in the second ground line 34 and the via 60. It may be arranged to be connected via.
  • the first to third pads 72, 74, and 76 may be formed of one pad, respectively, but the first to third pads 72, 74, and 76 may be separated pads as illustrated in FIG. 1. It may consist of Specifically, the first pad 72 may be formed of the first-first pad 72a and the first-second pad 72b spaced apart from each other, and the second pad 74 may be the second-first pad spaced apart from each other.
  • the third pad 76 may include a 3-1 pad 76a and a 3-2 pad 76b spaced apart from each other.
  • the first to third connection pads 82, 84, and 86 are spaced apart from each other, for example, the first-first pad 72a, the first-second pad 72b, and the second-first pad 74a.
  • the second-second pad 74b, the third-first pad 76a, and the third-second pad 76b may be connected to each other.
  • the feed line 40 may be arranged to be connected to the second pad 74.
  • the feed line 40 may be used as a line for transmitting or receiving a signal to the multi-band chip antenna (100 in FIG. 8).
  • the lumped water purifying elements 50a and 50b may be arranged to be connected to at least one of the first to third ground lines 32, 34, 36, and the feed line 40.
  • FIG. 1 illustrates only the centralized water purification device 50a disposed to be connected to the power supply line 40 and the centralized water purification device 50b disposed to be connected to the third ground line 36, the present invention is limited thereto. It is not. That is, the lumped water purification elements 50a and 50b may be arranged to be connected to at least one of the first to third ground lines 32, 34, 36, and the power supply line 40 as necessary.
  • the lumped constant elements 50a and 50b may be configured by, for example, a combination of a resistor (not shown), an inductor (not shown), and a capacitor (not shown).
  • the lumped constant elements 50a and 50b may be used to adjust, for example, a resonance frequency or an impedance of a multiband chip antenna device to be described later. That is, the user may modify a combination of an inductor (not shown) and a capacitor (not shown) in the lumped constant elements 50a and 50b to adjust, for example, a resonance frequency or an impedance of the multiband chip antenna device to be described later. have.
  • FIG. 1 shows that the length L of the first ground line 32 and the length L of the second ground line 36 are the same, the present invention is not limited thereto.
  • first, second, etc. are used to describe various components, these components are of course not limited by these terms. These terms are only used to distinguish one component from another. Therefore, of course, the first component mentioned below may be a second component within the technical spirit of the present invention.
  • 3 and 4 are layout views of a multi-band chip antenna mounting substrate according to modified embodiments of an embodiment of the present invention.
  • FIG. 3 and 4 are modified examples of the embodiment shown in FIG. 1, and portions overlapping with those described in FIGS. 1 and 2 will be omitted for the sake of effective description. Only the characteristic parts of the modified embodiment shown in FIG. 4 will be described.
  • the lumped water purification elements 50a and 50b may be arranged to be connected to at least one of the first to third ground lines 32, 34, 36 and the power feeding line 40 as necessary.
  • the multiband chip antenna mounting substrate according to the modified embodiment of the present invention illustrated in FIG. 3 is different from the embodiment of the first embodiment of the present invention, and includes a lumped constant element 50a disposed to be connected to the power supply line 40.
  • the lumped water purification device 50c may be disposed to be connected to the ground line 32, and the lumped water purification device 50b may be disposed to be connected to the third ground line 36.
  • the first ground line 32 of the substrate for mounting a multi-band chip antenna according to a modified embodiment of the embodiment of the present invention.
  • the length L1 and the length L2 of the second ground line 36 may be different from each other.
  • the length L1 of the first ground line 32 and the length L2 of the second ground line 36 having different lengths may correspond to, for example, a resonance frequency or an impedance of the multiband chip antenna device to be described later. May affect That is, the user adjusts the length L1 of the first ground line 32 and the length L2 of the second ground line 36, and thus, for example, a resonance frequency or impedance of the multiband chip antenna device to be described later. Can be adjusted.
  • the second pad 74 of the multiband chip antenna mounting substrate includes first subpads 74a and 74b and second subpads 74c and 74d. At least one of the first subpads 74a and 74b and the second subpads 74c and 74d may be connected to the power supply line 40. That is, although the second pad 74 illustrated in FIG. 5 is illustrated in which the first sub pads 74a and 74b are connected to the feed line 40, the present invention is not limited thereto. In the second pad 74 of another embodiment of the present invention, the second sub pads 74c and 74d may be connected to the feed line 40.
  • the second ground line 34 of the substrate for mounting a multi-band chip antenna is disposed on one surface (eg, the upper surface) of the substrate 10. It may be arranged to be connected to the two sub pads 74c and 74d. That is, in the multi-band chip antenna mounting substrate according to another embodiment of the present invention, the second ground line 34 is not connected to the second pad 74 through the via (60 in FIG. 1), and the substrate ( 10 may be disposed on one surface (eg, an upper surface) and connected to the second sub pads 74c and 74d.
  • all of the first to third ground lines 32, 34, and 36 may be disposed on one surface (eg, the upper surface) of the substrate 10.
  • the concentrated water purifying element 50d may be disposed to be connected to the second ground line 34 disposed on one surface (eg, the upper surface) of the substrate 10.
  • the length L1 of the first ground line 32 and the length L2 of the third ground line 36 are the same, but the present invention is not limited thereto. If necessary, the length L1 of the first ground line 32 and the length L2 of the third ground line 36 may be modified to be different.
  • FIG. 5 discloses the concentrated water purifying elements 50a, 50b, 50c, and 50d arranged to be connected to the first to third ground lines 32, 34, 36 and the power supply line 40, but this is also required. You can omit / add as much as you want.
  • the board for mounting a multi-band chip antenna according to another exemplary embodiment of the present invention may further include a fourth ground line 38. That is, in this case, as shown in FIG. 2, the second ground line 34 is disposed to be connected to the second pad 74 through the via 60 on the other surface (eg, the lower surface) of the substrate.
  • the four ground lines 38 are disposed to protrude from the ground pattern 20 in a second direction (for example, Y direction) on one surface (for example, upper surface) of the substrate to form second sub pads 74c and 74d. It can be connected with.
  • Other matters are the same as those of the multiband chip antenna mounting substrate according to the above-described embodiments, and thus redundant description thereof will be omitted.
  • the fourth ground line 38 of the substrate for mounting a multi-band chip antenna according to another modified embodiment of the present invention has a ground pattern on one surface (for example, an upper surface) of the substrate. 20) may be arranged so as not to protrude from.
  • Other matters are also the same as those of the multiband chip antenna mounting substrate according to the above-described embodiments, and thus redundant descriptions thereof will be omitted.
  • the multi-band chip antenna (100 of FIG. 8) is described as an example of being manufactured with a surface mount device (SMD), but the present invention is not limited thereto. That is, hereinafter, a multiband chip antenna (FIG. 8) using a surface mount technology (SMT) for attaching a component lead to a surface with solder or the like without inserting the lead of a component into a hole of a substrate (for example, a PCB). 100) is described as an example mounted on the multi-band chip antenna mounting substrate (10 of FIG. 8), but this is only one example, and the present invention is not limited thereto.
  • SMT surface mount technology
  • FIG. 8 is a perspective view of a multiband chip antenna device according to an embodiment of the present invention
  • FIGS. 9 to 11 are layout views of the multiband chip antenna of the multiband chip antenna device according to an embodiment of the present invention.
  • FIG. 9 is a top plan view of the multiband chip antenna
  • FIG. 10 is a side view of the multiband chip antenna
  • FIG. 11 is a bottom view of the multiband chip antenna.
  • the multiband chip antenna device refers to an assembly in which a multiband chip antenna in which various radiator patterns are formed on a dielectric block is formed on a multiband chip antenna mounting substrate according to various embodiments described above.
  • the multiband chip antenna is mounted on the substrate using SMT as an example, the present invention is not limited thereto.
  • a multiband chip antenna apparatus may include a multiband chip antenna mounting substrate 10 and a multiband chip antenna 100.
  • the multi-band chip antenna mounting substrate 10 may be applied to all of the multi-band chip antenna mounting substrate 10 according to various embodiments described above. That is, although only one substrate 10 of the various embodiments described above is shown in FIG. 8, the present invention is not limited to that shown in FIG. 8.
  • the multiband chip antenna 100 may include first to third radiator patterns 102, 104, and 106 disposed on at least one surface of the dielectric block.
  • the first to third radiator patterns 102, 104, and 106 may be mounted to be connected to the first to third pads 72, 74, and 76 of the substrate 10, respectively.
  • FIG. 8 illustrates that the first to third radiator patterns 102, 104, and 106 are spaced apart from each other, the present invention is not limited thereto. That is, a portion connected to the first pad 72 among the radiator patterns formed on the dielectric block may be defined as the first radiator pattern 102, and a portion connected to the second pad 74 may be the second radiator pattern 104. The portion connected to the third pad 76 may be defined as the third radiator pattern 106. 9 to 11 illustrate such first to third radiator patterns 102, 104, and 106.
  • the first to third pads 72, 74, and 76 of the substrate 10 may be symmetrically disposed about the second pad 74, and the first to third pads of the multiband chip antenna 100.
  • the radiator patterns 102, 104, and 106 may be symmetrically disposed about the second radiator pattern 104. In this case, even if the left and right directions of the multi-band chip antenna 100 are reversed, mounting on the substrate 10 may be advantageous.
  • the feed line 40, the first and second radiator patterns 102 and 104, and the first ground line 32 may form a first signal path. That is, the first signal path is formed of, for example, a feed line 40, first and second radiator patterns 102 and 104, and a first ground line 32, and has a signal having a first frequency. Can be sent or received.
  • the feed line 40, the second and third radiator patterns 104 and 106, and the third ground line 36 may form a second signal path. That is, the second signal path is formed of, for example, a feed line 40, second and third radiator patterns 104 and 106, and a third ground line 36, and has a signal having a second frequency. Can be sent or received.
  • the first frequency and the second frequency may be different frequencies. That is, for example, the first frequency may be high frequency, the second frequency may be cursed, and vice versa. Accordingly, the multiband chip antenna apparatus according to an embodiment of the present invention may be a multiband antenna capable of transmitting or receiving signals having different frequencies.
  • the lumped constant elements 50a to 50d may serve to adjust the transmission and reception frequency. That is, by adjusting the inductance or capacitance in the lumped constant elements 50a to 50d, it is possible to easily adjust the transmission / reception frequency without having to adjust the length of the first to third radiator patterns 102, 104 and 106 formed in the dielectric block. .
  • the impedance of the antenna device may be adjusted by adjusting the inductor or capacitance in the lumped constant elements 50a to 50d. Therefore, in the multi-band chip antenna apparatus according to various embodiments of the present invention, the size of the antenna can be reduced, but it is possible to easily tune the band for various frequencies. Furthermore, the difficulty of developing by changing the radiator patterns 102, 104, 106 on the dielectric block for frequency tuning or the like can be compensated for, thereby reducing the development cost and shortening the development period.

Abstract

The present invention relates to a multiband chip antenna device which allows easy resonant frequency tuning. The multiband chip antenna device according to this invention comprises: a multiband chip antenna mounting substrate; and a multiband chip antenna which is mounted on the substrate and comprises first to third radiator patterns disposed on at least one side of a dielectric block. The substrate comprises a grounding pattern, first to third grounding lines so arranged as to connect to the grounding pattern, first to third pads so arranged as to respectively connect to the first to third grounding lines, a feed line so arranged as to connect to the second pad, and a lumped-parameter element so arranged as to connect to at least one line of the first to third grounding lines and the feed line. The first to third radiator patterns of the multiband chip antenna are so arranged as to respectively connect to the first to third pads. The present invention enables miniaturization of the size of antennas and at the same time facilitaion of tuning the frequency band of the chip antenna so as to match a variety of frequency bands.

Description

멀티밴드 칩 안테나 실장용 기판 및 이를 포함하는 멀티밴드 칩 안테나 장치Multiband chip antenna mounting board and multiband chip antenna device including the same
본 발명은 멀티밴드 칩 안테나 실장용 기판 및 이를 포함하는 멀티밴드 칩 안테나 장치이다.The present invention is a multi-band chip antenna mounting substrate and a multi-band chip antenna device including the same.
무선 통신 분야의 비약적인 발전으로, 이동 통신 단말기의 기능들은 점점 다양해지고, 그 크기는 점점 소형화되어 가고 있다. 따라서, 이러한 이동 통신 단말기에 포함되는 안테나 역시 고성능, 소형화를 추구하고 있는 현실이다. 현재 대부분의 이동 통신 단말 안테나는 내장형으로 전환된 실정이며, 또한 고효율, 광대역 또는 멀티 대역을 요구하고 있다. 그리고, 세계에서 사용되는 주파수 대역은 나라마다 다르게 시스템을 구축하고 있기 때문에, 하나의 안테나로 여러 주파수 대역에 동작 가능한 다중 대역 안테나를 사용하여 이동통신용 단말기를 제작하고 있다.With the rapid development of the field of wireless communication, the functions of mobile communication terminals are becoming more and more diverse, and the size thereof is getting smaller and smaller. Therefore, the antenna included in the mobile communication terminal is also a reality in pursuit of high performance and miniaturization. Currently, most mobile communication terminal antennas have been converted to built-in types, and also require high efficiency, broadband, or multi-band. Since the frequency bands used in the world are different from country to country, a mobile communication terminal is manufactured using a multi-band antenna that can operate in multiple frequency bands with one antenna.
하지만, 종래의 다중 대역 칩 안테나는 각각의 공진 주파수를 손쉽게 변경할 수 있는 튜닝 포인트가 없어 공진 주파수 조절이 용이하지 못하였으며, 따라서 하나의 안테나를 가지고 여러 대역으로 공진 주파수를 용이하게 조절하지 못하는 단점이 있었다.However, the conventional multi-band chip antenna has no tuning point to easily change the resonant frequency, so it is not easy to adjust the resonant frequency. Therefore, it is difficult to easily adjust the resonant frequency in multiple bands with one antenna. there was.
본 발명이 해결하고자 하는 기술적 과제는 다중 주파수 대역에 대한 공진 주파수의 조율이 용이한 멀티밴드 칩 안테나 실장용 기판을 제공하는 것이다.The technical problem to be solved by the present invention is to provide a multi-band chip antenna mounting substrate that is easy to tune the resonant frequency for multiple frequency bands.
본 발명이 해결하고자 하는 다른 기술적 과제는 다중 주파수 대역에 대한 공진 주파수의 조율이 용이한 멀티밴드 칩 안테나 장치를 제공하는 것이다.Another technical problem to be solved by the present invention is to provide a multi-band chip antenna device that is easy to tune the resonant frequency for multiple frequency bands.
본 발명의 기술적 과제들은 이상에서 언급한 기술적 과제로 제한되지 않으며, 언급되지 않은 또 다른 기술적 과제들은 아래의 기재로부터 당업자에게 명확하게 이해될 수 있을 것이다.Technical problems of the present invention are not limited to the technical problems mentioned above, and other technical problems not mentioned will be clearly understood by those skilled in the art from the following description.
상기 기술적 과제를 달성하기 위한 본 발명의 멀티밴드 칩 안테나 실장용 기판의 일 태양(aspect)은, 접지패턴, 접지패턴과 접속되게 배치된 제1 내지 제3 접지라인, 제1 내지 제3 접지라인에 각각 접속되게 배치된 제1 내지 제3 패드, 제2 패드에 접속되게 배치된 급전라인, 및 제1 내지 제3 접지라인 및 급전라인 중 적어도 어느 하나와 접속되게 배치된 집중정수소자를 포함한다.One aspect of the multiband chip antenna mounting substrate of the present invention for achieving the above technical problem is a ground pattern, the first to third ground line, the first to third ground line disposed to be connected to the ground pattern First to third pads disposed to be connected to the second pads, a power feeding line to be connected to the second pads, and a concentrated water purifying element disposed to be connected to at least one of the first to third ground lines and the power feeding lines. .
상기 다른 기술적 과제를 달성하기 위한 본 발명의 멀티밴드 칩 안테나 장치의 일 태양은, 상기 본 발명에 따른 멀티밴드 칩 안테나 실장용 기판, 및 기판 상에 실장되고, 유전체 블록의 적어도 일면에 배치된 제1 내지 제3 방사체 패턴을 포함하는 멀티밴드 칩 안테나를 포함하되, 기판은 접지패턴과, 접지패턴과 접속되게 배치된 제1 내지 제3 접지라인과, 제1 내지 제3 접지라인에 각각 접속되게 배치된 제1 내지 제3 패드와, 제2 패드에 접속되게 배치된 급전라인과, 제1 내지 제3 접지라인 및 급전라인 중 적어도 어느 하나와 접속되게 배치된 집중정수소자를 포함하고, 멀티밴드 칩 안테나의 제1 내지 제3 방사체 패턴은 각각 제1 내지 제3 패드에 접속되게 배치된다.One aspect of the multiband chip antenna device of the present invention for achieving the above another technical problem is a substrate for mounting the multiband chip antenna mounting according to the present invention, and the substrate is disposed on at least one surface of the dielectric block And a multiband chip antenna including first to third radiator patterns, wherein the substrate is connected to a ground pattern, first to third ground lines disposed to be connected to the ground pattern, and first to third ground lines, respectively. A multiband device comprising: first to third pads disposed; a feeding line arranged to be connected to the second pad; and a concentrated water purifying element arranged to be connected to at least one of the first to third ground lines and the feeding line; The first to third radiator patterns of the chip antenna are arranged to be connected to the first to third pads, respectively.
기타 실시예들의 구체적인 사항들은 상세한 설명 및 도면들에 포함되어 있다.Specific details of other embodiments are included in the detailed description and the drawings.
본 발명에 따른 멀티밴드 칩 안테나 실장용 기판 및 이를 포함하는 멀티밴드 칩 안테나 장치에 의하면 안테나의 크기를 소형화하면서 동시에 다양한 주파수 대역에 맞도록 칩 안테나의 주파수 대역을 용이하게 조율하는 것이 가능하다. According to the multi-band chip antenna mounting substrate and the multi-band chip antenna apparatus including the same according to the present invention, it is possible to reduce the size of the antenna and to easily tune the frequency band of the chip antenna to suit various frequency bands.
즉, 본 발명의 다양한 실시예들에 따른 멀티밴드 칩 안테나 장치의 경우, 패턴화된 방사체들을 통해 안테나의 크기는 소형화되지만, 패턴화된 방사체들을 직접 변경하지 않고, 집중정수소자만을 조절하여 주파수 대역을 조율함으로써, 각 나라에 사용되는 주파수에 맞는 대역을 용이하게 조율할 수 있는 장점이 있다. That is, in the case of a multi-band chip antenna apparatus according to various embodiments of the present invention, the size of the antenna is reduced through the patterned radiators, but the frequency band is adjusted by adjusting only the lumped constant elements without directly changing the patterned radiators. By tuning, there is an advantage that can easily tune the band for the frequency used in each country.
나아가서, 본 발명에 의하면 안테나의 패턴을 변경하여 개발하는 어려움을 보완해 개발비를 줄이고, 개발 기간을 단축시킬 수 있게 된다.Furthermore, according to the present invention, it is possible to compensate for the difficulty of developing by changing the pattern of the antenna to reduce the development cost and shorten the development period.
도 1 및 도 2는 본 발명의 일 실시예에 따른 멀티밴드 칩 안테나 실장용 기판의 배치도들이다.1 and 2 are layout views of a multi-band chip antenna mounting substrate according to an embodiment of the present invention.
도 3 및 도 4는 본 발명의 일 실시예의 변형 실시예들에 따른 멀티밴드 칩 안테나 실장용 기판의 배치도들이다.3 and 4 are layout views of a multi-band chip antenna mounting substrate according to modified embodiments of an embodiment of the present invention.
도 5는 본 발명의 다른 실시예에 따른 멀티밴드 칩 안테나 실장용 기판의 배치도이다.5 is a layout view of a multi-band chip antenna mounting substrate according to another embodiment of the present invention.
도 6 및 도 7은 본 발명의 다른 실시예의 변형 실시예들에 따른 멀티밴드 칩 안테나 실장용 기판의 배치도들이다.6 and 7 are layout views of a multi-band chip antenna mounting substrate according to modified embodiments of another embodiment of the present invention.
도 8은 본 발명의 일 실시예에 따른 멀티밴드 칩 안테나 장치의 사시도이다.8 is a perspective view of a multiband chip antenna device according to an embodiment of the present invention.
도 9 내지 도 11은 본 발명의 일 실시예에 따른 멀티밴드 칩 안테나 장치의 멀티밴드 칩 안테나의 배치도들이다.9 to 11 are layout views of a multiband chip antenna of a multiband chip antenna device according to an embodiment of the present invention.
본 발명은 멀티밴드 칩 안테나 실장용 기판 및 이를 포함하는 멀티밴드 칩 안테나 장치이다.The present invention is a multi-band chip antenna mounting substrate and a multi-band chip antenna device including the same.
이하 도 1 및 도 2를 참조하여, 본 발명의 일 실시예에 따른 멀티밴드 칩 안테나 실장용 기판에 대해 설명한다.Hereinafter, a multiband chip antenna mounting substrate according to an embodiment of the present invention will be described with reference to FIGS. 1 and 2.
도 1 및 도 2는 본 발명의 일 실시예에 따른 멀티밴드 칩 안테나 실장용 기판의 배치도들이다. 구체적으로, 도 1은 본 발명의 일 실시예에 따른 멀티밴드 칩 안테나 실장용 기판의 일면(예를 들어, 상면)의 배치도이고, 도 2는 본 발명의 일 실시예에 따른 멀티밴드 칩 안테나 실장용 기판의 타면(예를 들어, 하면)의 배치도이다. 1 and 2 are layout views of a multi-band chip antenna mounting substrate according to an embodiment of the present invention. Specifically, FIG. 1 is a layout view of one surface (eg, an upper surface) of a substrate for mounting a multi-band chip antenna according to an embodiment of the present invention, and FIG. 2 is a multi-band chip antenna mounting according to an embodiment of the present invention. It is a layout view of the other surface (for example, lower surface) of the substrate for a use.
도 1 및 도 2를 참조하면, 기판(10)은 접지패턴(20), 제1 내지 제3 접지라인(32, 34, 36), 제1 내지 제3 패드(72, 74, 76), 급전라인(40), 집중정수소자(lumped element)(50a, 50b)를 포함할 수 있다.1 and 2, the substrate 10 may include a ground pattern 20, first to third ground lines 32, 34, and 36, first to third pads 72, 74, and 76, and a power supply. The line 40 may include lumped elements 50a and 50b.
접지패턴(20)은 기판의 일면(예를 들어, 상면)상에 배치되어 접지영역을 정의할 수 있다. 이러한 접지패턴의 안쪽, 즉, 접지패턴(20)으로 둘러싸인 영역은 비접지영역으로 정의될 수 있다. 이러한 접지패턴(20)은 외부의 접지전극(미도시)과 접속될 수 있다.The ground pattern 20 may be disposed on one surface (eg, an upper surface) of the substrate to define a ground region. The inside of the ground pattern, that is, the area surrounded by the ground pattern 20 may be defined as an ungrounded area. The ground pattern 20 may be connected to an external ground electrode (not shown).
제1 내지 제3 접지라인(32, 34, 36)은 접지패턴(20)과 접속되어 배치될 수 있다. 구체적으로 제1 내지 제3 접지라인(32, 34, 36)은 앞서 정의한 비접지영역에 접지패턴(20)과 접속되어 배치될 수 있다.The first to third ground lines 32, 34, and 36 may be connected to the ground pattern 20. In detail, the first to third ground lines 32, 34, and 36 may be connected to the ground pattern 20 in the non-grounding region defined above.
더욱 구체적으로, 제1 접지라인(32) 및 제3 접지라인(36)은 각각 도 1에 도시된 것처럼 기판의 일면(예를 들어, 상면)상의 비접지영역에 접지패턴(20)으로부터 제1 방향(예를 들어, X방향)으로 돌출되어 배치될 수 있고, 제2 접지라인(34)은 도 2에 도시된 것처럼 기판의 타면(예를 들어, 하면)상의 비접지영역에 접지패턴(20)으로부터 제2 방향(예를 들어, Y방향)으로 돌출되어 배치될 수 있다. 이러한 제2 접지라인(34)은 예를 들어, 비아(60)를 통해, 후술할 제2 패드(74)와 접속될 수 있다.More specifically, each of the first ground line 32 and the third ground line 36 may include the first ground line 32 and the first ground line 36, respectively, as shown in FIG. 1, from the ground pattern 20 to the ungrounded area on one surface (eg, the upper surface) of the substrate. May be disposed to protrude in a direction (eg, X direction), and the second ground line 34 may be disposed in the non-grounded area on the other surface (eg, the bottom surface) of the substrate as shown in FIG. 2. ) May protrude in a second direction (eg, the Y direction). The second ground line 34 may be connected to the second pad 74 to be described later, for example, through the via 60.
제1 내지 제3 패드(72, 74, 76)는 제1 내지 제3 접지라인(32, 34, 36)에 각각 접속되게 배치될 수 있다. 구체적으로, 제1 내지 제3 패드(72, 74, 76)는 비접지영역에 제1 내지 제3 접지라인(32, 34, 36)에 각각 접속되게 배치될 수 있다.The first to third pads 72, 74, and 76 may be disposed to be connected to the first to third ground lines 32, 34, and 36, respectively. In detail, the first to third pads 72, 74, and 76 may be arranged to be connected to the first to third ground lines 32, 34, and 36, respectively, in the ungrounded area.
더욱 구체적으로, 제1 내지 제3 패드(72, 74, 76)는 도 1에 도시된 것처럼 기판의 일면(예를 들어, 상면)상의 비접지영역에 제2 방향(예를 들어, Y방향)으로 일정간격 이격되어 나란하게 연장되어 형성될 수 있다. 제1 및 제3 패드(72, 76)는 접지패턴(20)으로부터 제1 방향(예를 들어, X방향)으로 돌출되어 배치된 제1 및 제3 접지라인(32, 36)과 접속되도록 배치될 수 있고, 제2 패드(74)는 앞서 설명한 바와 같이, 접지패턴(20)으로부터 제2 방향(예를 들어, Y방향)으로 돌출되어 배치된 제2 접지라인(34)과 비아(60)를 통해 접속되도록 배치될 수 있다.More specifically, the first to third pads 72, 74, and 76 may have a second direction (eg, Y direction) in an ungrounded area on one surface (eg, upper surface) of the substrate as shown in FIG. 1. It may be formed to be spaced apart by a predetermined interval to extend side by side. The first and third pads 72 and 76 are disposed to be connected to the first and third ground lines 32 and 36 protruding from the ground pattern 20 in a first direction (for example, X direction). As described above, the second pad 74 may protrude from the ground pattern 20 in the second direction (for example, the Y direction) and be disposed in the second ground line 34 and the via 60. It may be arranged to be connected via.
한편, 제1 내지 제3 패드(72, 74, 76)는 각각 하나의 패드로 이루어질 수도 있으나, 제1 내지 제3 패드(72, 74, 76)는 도 1에 도시된 바와 같이 각각 분리된 패드들로 이루어질 수도 있다. 구체적으로, 제1 패드(72)는 서로 이격된 제1-1 패드(72a)와 제1-2 패드(72b)로 이루어질 수 있고, 제2 패드(74)는 서로 이격된 제2-1 패드(74a)와 제2-2 패드(74b)로 이루어질 수 있으며, 제3 패드(76)는 서로 이격된 제3-1 패드(76a)와 제3-2 패드(76b)로 이루어질 수 있다. 이 때, 제1 내지 제3 연결패드(82, 84, 86)는 각각 서로 이격되어 배치된 제1-1 패드(72a)와 제1-2 패드(72b), 제2-1 패드(74a)와 제2-2 패드(74b), 및 제3-1 패드(76a)와 제3-2 패드(76b)가 서로 접속되도록 배치될 수 있다.Meanwhile, the first to third pads 72, 74, and 76 may be formed of one pad, respectively, but the first to third pads 72, 74, and 76 may be separated pads as illustrated in FIG. 1. It may consist of Specifically, the first pad 72 may be formed of the first-first pad 72a and the first-second pad 72b spaced apart from each other, and the second pad 74 may be the second-first pad spaced apart from each other. The third pad 76 may include a 3-1 pad 76a and a 3-2 pad 76b spaced apart from each other. In this case, the first to third connection pads 82, 84, and 86 are spaced apart from each other, for example, the first-first pad 72a, the first-second pad 72b, and the second-first pad 74a. And the second-second pad 74b, the third-first pad 76a, and the third-second pad 76b may be connected to each other.
급전라인(40)은 제2 패드(74)에 접속되게 배치될 수 있다. 이러한 급전라인(40)은 멀티밴드 칩 안테나(도 8의 100)에 신호를 송신 또는 수신하는 선로로 이용될 수 있다.The feed line 40 may be arranged to be connected to the second pad 74. The feed line 40 may be used as a line for transmitting or receiving a signal to the multi-band chip antenna (100 in FIG. 8).
집중정수소자(50a, 50b)는 제1 내지 제3 접지라인(32, 34, 36) 및 급전라인(40) 중 적어도 어느 하나와 접속되게 배치될 수 있다. 비록 도 1에는 급전라인(40)에 접속되게 배치된 집중정수소자(50a)와 제3 접지라인(36)에 접속되게 배치된 집중정수소자(50b)만 도시되어 있으나, 본 발명이 이에 제한되는 것은 아니다. 즉, 집중정수소자(50a, 50b)는 필요에 따라 제1 내지 제3 접지라인(32, 34, 36) 및 급전라인(40) 중 적어도 어느 하나에 접속되게 배치될 수 있다.The lumped water purifying elements 50a and 50b may be arranged to be connected to at least one of the first to third ground lines 32, 34, 36, and the feed line 40. Although FIG. 1 illustrates only the centralized water purification device 50a disposed to be connected to the power supply line 40 and the centralized water purification device 50b disposed to be connected to the third ground line 36, the present invention is limited thereto. It is not. That is, the lumped water purification elements 50a and 50b may be arranged to be connected to at least one of the first to third ground lines 32, 34, 36, and the power supply line 40 as necessary.
나아가서, 집중정수소자(50a, 50b)는 예를 들어, 저항(미도시), 인덕터(미도시), 커패시터(미도시)의 조합으로 구성될 수 있다. 이러한 집중정수소자(50a, 50b)는 후술할 멀티밴드 칩 안테나 장치의 예를 들어, 공진 주파수 또는 임피던스 등을 조절하는데 사용될 수 있다. 즉, 사용자는 집중정수소자(50a, 50b) 내의 인덕터(미도시), 커패시터(미도시)의 조합을 변형하여, 후술할 멀티밴드 칩 안테나 장치의 예를 들어, 공진 주파수 또는 임피던스 등을 조절할 수 있다.Further, the lumped constant elements 50a and 50b may be configured by, for example, a combination of a resistor (not shown), an inductor (not shown), and a capacitor (not shown). The lumped constant elements 50a and 50b may be used to adjust, for example, a resonance frequency or an impedance of a multiband chip antenna device to be described later. That is, the user may modify a combination of an inductor (not shown) and a capacitor (not shown) in the lumped constant elements 50a and 50b to adjust, for example, a resonance frequency or an impedance of the multiband chip antenna device to be described later. have.
한편, 도 1에는 제1 접지라인(32)의 길이(L)와 제2 접지라인(36)의 길이(L)가 서로 동일한 것이 도시되어 있으나, 본 발명은 이에 제한되지 않는다.Meanwhile, although FIG. 1 shows that the length L of the first ground line 32 and the length L of the second ground line 36 are the same, the present invention is not limited thereto.
본 발명의 이점 및 특징, 그리고 그것들을 달성하는 방법은 첨부되는 도면과 함께 상세하게 후술되어 있는 실시예들을 참조하면 명확해질 것이다. 그러나 본 발명은 이하에서 개시되는 실시예들에 한정되는 것이 아니라 서로 다른 다양한 형태로 구현될 것이며, 단지 본 실시예들은 본 발명의 개시가 완전하도록 하며, 본 발명이 속하는 기술분야에서 통상의 지식을 가진 자에게 발명의 범주를 완전하게 알려주기 위해 제공되는 것이며, 본 발명은 청구항의 범주에 의해 정의될 뿐이다. 도면에서 표시된 구성요소의 크기 및 상대적인 크기는 설명의 명료성을 위해 과장된 것일 수 있다.Advantages and features of the present invention and methods for achieving them will be apparent with reference to the embodiments described below in detail with the accompanying drawings. However, the present invention is not limited to the embodiments disclosed below, but will be implemented in various forms, and only the present embodiments are intended to complete the disclosure of the present invention, and the general knowledge in the art to which the present invention pertains. It is provided to fully convey the scope of the invention to those skilled in the art, and the present invention is defined only by the scope of the claims. The size and relative size of the components shown in the drawings may be exaggerated for clarity of explanation.
명세서 전체에 걸쳐 동일 참조 부호는 동일 구성 요소를 지칭하며, "및/또는"은 언급된 아이템들의 각각 및 하나 이상의 모든 조합을 포함한다.Like reference numerals refer to like elements throughout the specification, and "and / or" includes each and every combination of one or more of the mentioned items.
본 명세서에서 사용된 용어는 실시예들을 설명하기 위한 것이며 본 발명을 제한하고자 하는 것은 아니다. 본 명세서에서, 단수형은 문구에서 특별히 언급하지 않는 한 복수형도 포함한다. 명세서에서 사용되는 "포함한다(comprises)" 및/또는 "이루어지다(made of)"는 언급된 구성요소, 단계, 동작 및/또는 소자는 하나 이상의 다른 구성요소, 단계, 동작 및/또는 소자의 존재 또는 추가를 배제하지 않는다.The terminology used herein is for the purpose of describing particular embodiments only and is not intended to be limiting of the invention. In this specification, the singular also includes the plural unless specifically stated otherwise in the phrase. As used herein, “comprises” and / or “made of” refers to a component, step, operation, and / or element that includes one or more other components, steps, operations, and / or elements. It does not exclude existence or addition.
비록 제1, 제2 등이 다양한 구성요소들을 서술하기 위해서 사용되나, 이들 구성요소들은 이들 용어에 의해 제한되지 않음은 물론이다. 이들 용어들은 단지 하나의 구성요소를 다른 구성요소와 구별하기 위하여 사용하는 것이다. 따라서, 이하에서 언급되는 제1 구성요소는 본 발명의 기술적 사상 내에서 제2 구성요소일 수도 있음은 물론이다.Although the first, second, etc. are used to describe various components, these components are of course not limited by these terms. These terms are only used to distinguish one component from another. Therefore, of course, the first component mentioned below may be a second component within the technical spirit of the present invention.
다른 정의가 없다면, 본 명세서에서 사용되는 모든 용어(기술 및 과학적 용어를 포함)는 본 발명이 속하는 기술분야에서 통상의 지식을 가진 자에게 공통적으로 이해될 수 있는 의미로 사용될 수 있을 것이다. 또 일반적으로 사용되는 사전에 정의되어 있는 용어들은 명백하게 특별히 정의되어 있지 않는 한 이상적으로 또는 과도하게 해석되지 않는다.Unless otherwise defined, all terms (including technical and scientific terms) used in the present specification may be used in a sense that can be commonly understood by those skilled in the art. In addition, the terms defined in the commonly used dictionaries are not ideally or excessively interpreted unless they are specifically defined clearly.
도 3 및 도 4는 본 발명의 일 실시예의 변형 실시예들에 따른 멀티밴드 칩 안테나 실장용 기판의 배치도들이다.3 and 4 are layout views of a multi-band chip antenna mounting substrate according to modified embodiments of an embodiment of the present invention.
도 3 및 도 4에 도시된 변형된 실시예는 상기 도 1에 도시된 일 실시예의 변형으로서, 상기 도 1 및 도 2에서 설명된 부분과 중복되는 부분은 효과적인 설명을 위하여 생략하고 상기 도 3 및 도 4에 도시된 변형된 실시예의 특징적인 부분만을 설명하기로 한다.3 and 4 are modified examples of the embodiment shown in FIG. 1, and portions overlapping with those described in FIGS. 1 and 2 will be omitted for the sake of effective description. Only the characteristic parts of the modified embodiment shown in FIG. 4 will be described.
본 발명에서 집중정수소자(50a, 50b)는 필요에 따라 제1 내지 제3 접지라인(32, 34, 36) 및 급전라인(40) 중 적어도 어느 하나에 접속되게 배치될 수 있는데, 상기 도 1의 일 실시예와 다르게 도 3에 도시된 본 발명의 일 실시예의 변형 실시예에 따른 멀티밴드 칩 안테나 실장용 기판은 급전라인(40)에 접속되게 배치된 집중정수소자(50a)와, 제1 접지라인(32)에 접속되게 배치된 집중정수소자(50c)와, 제3 접지라인(36)에 접속되게 배치된 집중정수소자(50b)를 포함할 수 있다.In the present invention, the lumped water purification elements 50a and 50b may be arranged to be connected to at least one of the first to third ground lines 32, 34, 36 and the power feeding line 40 as necessary. The multiband chip antenna mounting substrate according to the modified embodiment of the present invention illustrated in FIG. 3 is different from the embodiment of the first embodiment of the present invention, and includes a lumped constant element 50a disposed to be connected to the power supply line 40. The lumped water purification device 50c may be disposed to be connected to the ground line 32, and the lumped water purification device 50b may be disposed to be connected to the third ground line 36.
나아가서 상기 도 1에 도시된 본 발명에 따른 일 실시예와 다르게 도 3 및 도 4에서는, 본 발명의 일 실시예의 변형 실시예에 따른 멀티밴드 칩 안테나 실장용 기판의 제1 접지라인(32)의 길이(L1)와 제2 접지라인(36)의 길이(L2)는 서로 다를 수 있다. 이 경우, 서로 다른 길이의 제1 접지라인(32)의 길이(L1)와 제2 접지라인(36)의 길이(L2)는 후술할 멀티밴드 칩 안테나 장치의 예를 들어, 공진 주파수 또는 임피던스 등에 영향을 줄 수 있다. 즉, 사용자는 제1 접지라인(32)의 길이(L1)와 제2 접지라인(36)의 길이(L2)를 조절하여, 후술할 멀티밴드 칩 안테나 장치의 예를 들어, 공진 주파수 또는 임피던스 등을 조절할 수 있다.3 and 4, unlike the embodiment according to the present invention illustrated in FIG. 1, the first ground line 32 of the substrate for mounting a multi-band chip antenna according to a modified embodiment of the embodiment of the present invention. The length L1 and the length L2 of the second ground line 36 may be different from each other. In this case, the length L1 of the first ground line 32 and the length L2 of the second ground line 36 having different lengths may correspond to, for example, a resonance frequency or an impedance of the multiband chip antenna device to be described later. May affect That is, the user adjusts the length L1 of the first ground line 32 and the length L2 of the second ground line 36, and thus, for example, a resonance frequency or impedance of the multiband chip antenna device to be described later. Can be adjusted.
다음 도 5 내지 도 7을 참조하여, 본 발명의 다른 실시예 및 그 변형 실시예들에 따른 멀티밴드 칩 안테나 실장용 기판에 대해 설명한다. 이하에서는 앞서 설명한 본 발명의 일 실시예 및 그 변형 실시예들에 따른 멀티밴드 칩 안테나 실장용 기판과 중복되는 사항에 대해서는 그 설명을 생략하도록 한다. 즉, 이하에서는 그 차이점만을 중심으로 설명하도록 한다.Next, a multi-band chip antenna mounting substrate according to another embodiment and modified embodiments thereof will be described with reference to FIGS. 5 to 7. Hereinafter, descriptions on the overlapping matters with the multi-band chip antenna mounting substrate according to the exemplary embodiment and modified embodiments thereof will be omitted. That is, the following description will focus only on the differences.
도 5를 참조하면, 본 발명의 다른 실시예에 따른 멀티밴드 칩 안테나 실장용 기판의 제2 패드(74)는 제1 서브패드(74a, 74b)와 제2 서브패드(74c, 74d)를 포함하고, 제1 서브패드(74a, 74b)와 제2 서브패드(74c, 74d) 중 적어도 어느 하나는 급전라인(40)에 접속될 수 있다. 즉, 도 5에 도시된 제2 패드(74)는 제1 서브패드(74a, 74b)가 급전라인(40)에 접속된 것이 도시되어 있으나, 본 발명이 이에 제한되는 것은 아니다. 본 발명의 또 다른 실시예의 제2 패드(74)는 제2 서브패드(74c, 74d)가 급전라인(40)에 접속될 수도 있다.Referring to FIG. 5, the second pad 74 of the multiband chip antenna mounting substrate according to another embodiment of the present invention includes first subpads 74a and 74b and second subpads 74c and 74d. At least one of the first subpads 74a and 74b and the second subpads 74c and 74d may be connected to the power supply line 40. That is, although the second pad 74 illustrated in FIG. 5 is illustrated in which the first sub pads 74a and 74b are connected to the feed line 40, the present invention is not limited thereto. In the second pad 74 of another embodiment of the present invention, the second sub pads 74c and 74d may be connected to the feed line 40.
다시 도 5를 참조하면, 본 발명의 다른 실시예에 따른 멀티밴드 칩 안테나 실장용 기판의 제2 접지라인(34)은 기판(10)의 일면(예를 들어, 상면)상에 배치되되, 제2 서브패드(74c, 74d)에 접속되게 배치될 수 있다. 즉, 본 발명의 다른 실시예에 따란 멀티밴드 칩 안테나 실장용 기판의 경우, 제2 접지라인(34)이 비아(도 1의 60)를 통해 제2 패드(74)와 접속되지 않고, 기판(10)의 일면(예를 들어, 상면)상에 배치되어 제2 서브패드(74c, 74d)에 접속되게 배치될 수 있다.Referring back to FIG. 5, the second ground line 34 of the substrate for mounting a multi-band chip antenna according to another embodiment of the present invention is disposed on one surface (eg, the upper surface) of the substrate 10. It may be arranged to be connected to the two sub pads 74c and 74d. That is, in the multi-band chip antenna mounting substrate according to another embodiment of the present invention, the second ground line 34 is not connected to the second pad 74 through the via (60 in FIG. 1), and the substrate ( 10 may be disposed on one surface (eg, an upper surface) and connected to the second sub pads 74c and 74d.
이 경우, 제1 내지 제3 접지라인(32, 34, 36)은 모두 기판(10)의 일면(예를 들어, 상면)상에 배치될 수 있다. 한편, 집중정수소자(50d)는 기판(10)의 일면(예를 들어, 상면)상에 배치된 제2 접지라인(34)과 접속되게 배치될 수 있다.In this case, all of the first to third ground lines 32, 34, and 36 may be disposed on one surface (eg, the upper surface) of the substrate 10. Meanwhile, the concentrated water purifying element 50d may be disposed to be connected to the second ground line 34 disposed on one surface (eg, the upper surface) of the substrate 10.
앞서 설명한 바와 마찬가지로, 도 5에는 제1 접지라인(32)의 길이(L1)와 제3 접지라인(36)의 길이(L2)가 서로 동일한 것이 개시되어 있으나, 본 발명이 이에 제한되지는 않는다. 필요에 따라, 제1 접지라인(32)의 길이(L1)와 제3 접지라인(36)의 길이(L2)는 얼마든지 서로 다르게 변형될 수 있다. 또한, 도 5에는 제1 내지 제3 접지라인(32, 34, 36) 및 급전라인(40)에 접속되게 배치된 집중정수소자(50a, 50b, 50c, 50d)가 개시되어 있으나, 이 역시 필요에 따라 얼마든지 생략/추가가 가능하다.As described above, in FIG. 5, the length L1 of the first ground line 32 and the length L2 of the third ground line 36 are the same, but the present invention is not limited thereto. If necessary, the length L1 of the first ground line 32 and the length L2 of the third ground line 36 may be modified to be different. In addition, FIG. 5 discloses the concentrated water purifying elements 50a, 50b, 50c, and 50d arranged to be connected to the first to third ground lines 32, 34, 36 and the power supply line 40, but this is also required. You can omit / add as much as you want.
다음 도 6을 참조하면, 본 발명의 다른 실시예의 변형 실시예에 따른 멀티밴드 칩 안테나 실장용 기판은 제4 접지라인(38)을 더 포함할 수 있다. 즉, 이 경우 제2 접지라인(34)은 도 2에 도시된 바와 같이 기판의 타면(예를 들어, 하면)상에 비아(60)을 통해 제2 패드(74)와 접속되도록 배치되고, 제4 접지라인(38)은 기판의 일면(예를 들어, 상면)상에 접지패턴(20)으로부터 제2 방향(예를 들어, Y방향)으로 돌출되게 배치되어 제2 서브패드(74c, 74d)와 접속될 수 있다. 기타 다른 사항들은 앞서 설명한 실시예들에 따른 멀티밴드 칩 안테나 실장용 기판과 동일한바 중복된 설명은 생략하도록 한다.Next, referring to FIG. 6, the board for mounting a multi-band chip antenna according to another exemplary embodiment of the present invention may further include a fourth ground line 38. That is, in this case, as shown in FIG. 2, the second ground line 34 is disposed to be connected to the second pad 74 through the via 60 on the other surface (eg, the lower surface) of the substrate. The four ground lines 38 are disposed to protrude from the ground pattern 20 in a second direction (for example, Y direction) on one surface (for example, upper surface) of the substrate to form second sub pads 74c and 74d. It can be connected with. Other matters are the same as those of the multiband chip antenna mounting substrate according to the above-described embodiments, and thus redundant description thereof will be omitted.
다음 도 7을 참조하면, 본 발명의 다른 실시예의 다른 변형 실시예에 따른 멀티밴드 칩 안테나 실장용 기판의 제4 접지라인(38)은 기판의 일면(예를 들어, 상면)상에 접지패턴(20)으로부터 돌출되지 않게 배치될 수도 있다. 기타 다른 사항들은 역시 앞서 설명한 실시예들에 따른 멀티밴드 칩 안테나 실장용 기판과 동일한바 중복된 설명은 생략하도록 한다.Next, referring to FIG. 7, the fourth ground line 38 of the substrate for mounting a multi-band chip antenna according to another modified embodiment of the present invention has a ground pattern on one surface (for example, an upper surface) of the substrate. 20) may be arranged so as not to protrude from. Other matters are also the same as those of the multiband chip antenna mounting substrate according to the above-described embodiments, and thus redundant descriptions thereof will be omitted.
이하에서는 멀티밴드 칩 안테나(도 8의 100)가 표면실장부품(SMD, Surface Mount Device)으로 제조된 것을 예로 들어 설명하나 본 발명이 이에 제한되는 것은 아니다. 즉, 이하에서는 부품의 리드를 기판(예를 들어, PCB)의 구멍에 삽입하지 않고 땜납재 등으로 표면에 부착시키는 표면실장기술(SMT: Surface Mount Technology)을 이용하여 멀티밴드 칩 안테나(도 8의 100)가 멀티밴드 칩 안테나 실장용 기판(도 8의 10)에 실장되는 것을 예로 들어 설명하나, 이는 하나의 예시에 불과하며, 본 발명이 이에 제한되는 것은 아니다.Hereinafter, the multi-band chip antenna (100 of FIG. 8) is described as an example of being manufactured with a surface mount device (SMD), but the present invention is not limited thereto. That is, hereinafter, a multiband chip antenna (FIG. 8) using a surface mount technology (SMT) for attaching a component lead to a surface with solder or the like without inserting the lead of a component into a hole of a substrate (for example, a PCB). 100) is described as an example mounted on the multi-band chip antenna mounting substrate (10 of FIG. 8), but this is only one example, and the present invention is not limited thereto.
도 8 내지 도 11을 참조하여, 본 발명의 일 실시예에 따른 멀티밴드 칩 안테나 장치에 대해 설명한다.8 to 11, a multiband chip antenna device according to an embodiment of the present invention will be described.
도 8은 본 발명의 일 실시예에 따른 멀티밴드 칩 안테나 장치의 사시도이고, 도 9 내지 도 11은 본 발명의 일 실시예에 따른 멀티밴드 칩 안테나 장치의 멀티밴드 칩 안테나의 배치도들이다. 구체적으로 도 9는 멀티밴드 칩 안테나의 상면 배치도이고, 도 10은 멀티밴드 칩 안테나의 측면 배치도이며, 도 11은 멀티밴드 칩 안테나의 하면 배치도이다.8 is a perspective view of a multiband chip antenna device according to an embodiment of the present invention, and FIGS. 9 to 11 are layout views of the multiband chip antenna of the multiband chip antenna device according to an embodiment of the present invention. Specifically, FIG. 9 is a top plan view of the multiband chip antenna, FIG. 10 is a side view of the multiband chip antenna, and FIG. 11 is a bottom view of the multiband chip antenna.
이하에서, 멀티밴드 칩 안테나 장치라 함은, 앞서 설명한 다양한 실시예들에 따른 멀티밴드 칩 안테나 실장용 기판 상에 유전체 블록에 다양한 방사체 패턴이 형성된 멀티밴드 칩 안테나가 실장된 집합체를 의미한다. 그리고, 앞서 설명한 바와 같이 여기서는 멀티밴드 칩 안테나가 SMT를 이용해 기판에 실장된 것을 예로 들어 설명하나 본 발명이 이에 제한되는 것은 아니다.Hereinafter, the multiband chip antenna device refers to an assembly in which a multiband chip antenna in which various radiator patterns are formed on a dielectric block is formed on a multiband chip antenna mounting substrate according to various embodiments described above. As described above, although the multiband chip antenna is mounted on the substrate using SMT as an example, the present invention is not limited thereto.
도 8을 참조하면, 본 발명의 일 실시예에 따른 멀티밴드 칩 안테나 장치는 멀티밴드 칩 안테나 실장용 기판(10)과 멀티밴드 칩 안테나(100)를 포함할 수 있다.Referring to FIG. 8, a multiband chip antenna apparatus according to an embodiment of the present invention may include a multiband chip antenna mounting substrate 10 and a multiband chip antenna 100.
멀티밴드 칩 안테나 실장용 기판(10)은 앞서 설명한 다양한 실시예들에 따른 멀티밴드 칩 안테나 실장용 기판(10)이 모두 적용될 수 있다. 즉, 비록 도 8에는 앞서 설명한 다양한 실시예들 중 하나의 기판(10)만 도시되어 있으나, 본 발명이 도 8에 도시된 것에 제한되는 것은 아니다.The multi-band chip antenna mounting substrate 10 may be applied to all of the multi-band chip antenna mounting substrate 10 according to various embodiments described above. That is, although only one substrate 10 of the various embodiments described above is shown in FIG. 8, the present invention is not limited to that shown in FIG. 8.
멀티밴드 칩 안테나(100)는 유전체 블록의 적어도 일면에 배치된 제1 내지 제3 방사체 패턴(102, 104, 106)을 포함할 수 있다. 그리고, 제1 내지 제3 방사체 패턴(102, 104, 106)은 각각 기판(10)의 제1 내지 제3 패드(72, 74, 76)에 접속되게 실장될 수 있다. 비록, 도 8에는 제1 내지 제3 방사체 패턴(102, 104, 106)이 서로 이격되어 배치된 것이 도시되어 있으나, 본 발명이 이에 제한되는 것은 아니다. 즉, 유전체 블록에 형성된 방사체 패턴 중 제1 패드(72)에 접속되는 부분은 제1 방사체 패턴(102)으로 정의할 수 있고, 제2 패드(74)에 접속되는 부분은 제2 방사체 패턴(104)으로 정의할 수 있으며, 제3 패드(76)에 접속되는 부분은 제3 방사체 패턴(106)으로 정의할 수 있다. 도 9 내지 도 11에는 이러한 제1 내지 제3 방사체 패턴(102, 104, 106)이 예시적으로 도시되어 있다.The multiband chip antenna 100 may include first to third radiator patterns 102, 104, and 106 disposed on at least one surface of the dielectric block. The first to third radiator patterns 102, 104, and 106 may be mounted to be connected to the first to third pads 72, 74, and 76 of the substrate 10, respectively. Although FIG. 8 illustrates that the first to third radiator patterns 102, 104, and 106 are spaced apart from each other, the present invention is not limited thereto. That is, a portion connected to the first pad 72 among the radiator patterns formed on the dielectric block may be defined as the first radiator pattern 102, and a portion connected to the second pad 74 may be the second radiator pattern 104. The portion connected to the third pad 76 may be defined as the third radiator pattern 106. 9 to 11 illustrate such first to third radiator patterns 102, 104, and 106.
한편, 기판(10)의 제1 내지 제3 패드(72, 74, 76)는 제2 패드(74)를 중심으로 대칭형으로 배치될 수 있고, 멀티밴드 칩 안테나(100)의 제1 내지 제3 방사체 패턴(102, 104, 106)은 제2 방사체 패턴(104)을 중심으로 대칭형으로 배치될 수 있다. 이 경우, 멀티밴드 칩 안테나(100)의 좌우 방향이 뒤바뀌더라도 기판(10)에 실장이 가능한 장점이 있을 수 있다.Meanwhile, the first to third pads 72, 74, and 76 of the substrate 10 may be symmetrically disposed about the second pad 74, and the first to third pads of the multiband chip antenna 100. The radiator patterns 102, 104, and 106 may be symmetrically disposed about the second radiator pattern 104. In this case, even if the left and right directions of the multi-band chip antenna 100 are reversed, mounting on the substrate 10 may be advantageous.
도 8을 다시 참조하면, 급전라인(40)과, 제1 및 제2 방사체 패턴(102, 104)과, 제1 접지라인(32)은 제1 신호경로를 형성할 수 있다. 즉, 제1 신호경로는 예를 들어, 급전라인(40)과, 제1 및 제2 방사체 패턴(102, 104)과, 제1 접지라인(32)으로 형성되되, 제1 주파수를 갖는 신호를 송신 또는 수신할 수 있다.Referring back to FIG. 8, the feed line 40, the first and second radiator patterns 102 and 104, and the first ground line 32 may form a first signal path. That is, the first signal path is formed of, for example, a feed line 40, first and second radiator patterns 102 and 104, and a first ground line 32, and has a signal having a first frequency. Can be sent or received.
또한, 급전라인(40)과, 제2 및 제3 방사체 패턴(104, 106)과, 제3 접지라인(36)은 제2 신호경로를 형성할 수 있다. 즉, 제2 신호경로는 예를 들어, 급전라인(40)과, 제2 및 제3 방사체 패턴(104, 106)과, 제3 접지라인(36)으로 형성되되, 제2 주파수를 갖는 신호를 송신 또는 수신할 수 있다.In addition, the feed line 40, the second and third radiator patterns 104 and 106, and the third ground line 36 may form a second signal path. That is, the second signal path is formed of, for example, a feed line 40, second and third radiator patterns 104 and 106, and a third ground line 36, and has a signal having a second frequency. Can be sent or received.
여기서, 제1 주파수와 제2 주파수는 서로 다른 주파수일 수 있다. 즉, 예를 들어, 제1 주파수는 고주파이고, 제2 주파수는 저주파일 수 있으며, 이와 반대도 가능하다. 따라서, 본 발명의 일 실시예에 따른 멀티밴드 칩 안테나 장치는 서로 다른 주파수를 갖는 신호를 송신 또는 수신할 수 있는 멀티밴드 안테나일 수 있다.Here, the first frequency and the second frequency may be different frequencies. That is, for example, the first frequency may be high frequency, the second frequency may be cursed, and vice versa. Accordingly, the multiband chip antenna apparatus according to an embodiment of the present invention may be a multiband antenna capable of transmitting or receiving signals having different frequencies.
이 때, 집중정수소자(50a~50d)는 이러한 송수신 주파수를 조절하는 역할을 할 수 있다. 즉, 집중정수소자(50a~50d)내의 인덕턴스 또는 커패시턴스를 조절함으로써 유전체 블록에 형성된 제1 내지 제3 방사체 패턴(102, 104, 106) 길이를 조절할 필요 없이, 용이하게 송수신 주파수의 조절이 가능하다. 또한, 앞서 설명한 바와 같이 집중정수소자(50a~50d)내의 인덕터 또는 커패시턴스를 조절함으로써 안테나 장치의 임피던스 조절도 가능하다. 따라서, 본 발명의 다양한 실시예들에 따른 멀티밴드 칩 안테나 장치의 경우, 안테나의 크기는 소형화 시킬 수 있으되, 다양한 주파수에 맞는 대역을 용이하게 조율하는 것이 가능하다. 나아가, 주파수 조율 등을 위해 유전체 블록 상의 방사체 패턴(102, 104, 106)을 변경하여 개발하는 어려움을 보완할 수 있어, 개발비를 줄이고, 개발 기간을 단축시킬 수 있게 된다.At this time, the lumped constant elements 50a to 50d may serve to adjust the transmission and reception frequency. That is, by adjusting the inductance or capacitance in the lumped constant elements 50a to 50d, it is possible to easily adjust the transmission / reception frequency without having to adjust the length of the first to third radiator patterns 102, 104 and 106 formed in the dielectric block. . In addition, as described above, the impedance of the antenna device may be adjusted by adjusting the inductor or capacitance in the lumped constant elements 50a to 50d. Therefore, in the multi-band chip antenna apparatus according to various embodiments of the present invention, the size of the antenna can be reduced, but it is possible to easily tune the band for various frequencies. Furthermore, the difficulty of developing by changing the radiator patterns 102, 104, 106 on the dielectric block for frequency tuning or the like can be compensated for, thereby reducing the development cost and shortening the development period.
이상 첨부된 도면을 참조하여 본 발명의 실시예들을 설명하였으나, 본 발명은 상기 실시예들에 한정되는 것이 아니라 서로 다른 다양한 형태로 제조될 수 있으며, 본 발명이 속하는 기술분야에서 통상의 지식을 가진 자는 본 발명의 기술적 사상이나 필수적인 특징을 변경하지 않고서 다른 구체적인 형태로 실시될 수 있다는 것을 이해할 수 있을 것이다. 그러므로 이상에서 기술한 실시예들은 모든 면에서 예시적인 것이며 한정적이 아닌 것으로 이해해야만 한다.Although the embodiments of the present invention have been described above with reference to the accompanying drawings, the present invention is not limited to the above embodiments but may be manufactured in various forms, and having ordinary skill in the art to which the present invention pertains. It will be understood by those skilled in the art that the present invention may be embodied in other specific forms without changing the technical spirit or essential features of the present invention. Therefore, it should be understood that the embodiments described above are exemplary in all respects and not restrictive.

Claims (17)

  1. 접지패턴;Grounding pattern;
    상기 접지패턴과 접속되게 배치된 제1 내지 제3 접지라인;First to third ground lines disposed to be connected to the ground pattern;
    상기 제1 내지 제3 접지라인에 각각 접속되게 배치된 제1 내지 제3 패드;First to third pads disposed to be connected to the first to third ground lines, respectively;
    상기 제2 패드에 접속되게 배치된 급전라인; 및A feed line disposed to be connected to the second pad; And
    상기 제1 내지 제3 접지라인 및 상기 급전라인 중 적어도 어느 하나와 접속되게 배치된 집중정수소자를 포함하는 멀티밴드 칩 안테나 실장용 기판.A substrate for mounting a multi-band chip antenna including a lumped constant element disposed to be connected to at least one of the first to third ground lines and the feed line.
  2. 제 1항에 있어서,The method of claim 1,
    상기 제1 접지라인 및 상기 제3 접지라인은 상기 기판의 일면 상에 배치되고, 상기 제2 접지라인은 상기 기판의 타면 상에 배치된 멀티밴드 칩 안테나 실장용 기판.And the first ground line and the third ground line are disposed on one surface of the substrate, and the second ground line is disposed on the other surface of the substrate.
  3. 제 2항에 있어서,The method of claim 2,
    상기 제2 접지라인과 상기 제2 패드는 비아를 통해 접속되는 멀티밴드 칩 안테나 실장용 기판.And the second ground line and the second pad are connected via vias.
  4. 제 1항에 있어서,The method of claim 1,
    상기 제1 접지라인의 길이와 상기 제3 접지라인의 길이는 서로 동일한 멀티밴드 칩 안테나 실장용 기판.And a length of the first ground line and a length of the third ground line are the same.
  5. 제 1항에 있어서,The method of claim 1,
    상기 제1 접지라인의 길이와 상기 제3 접지라인의 길이는 서로 다른 멀티밴드 칩 안테나 실장용 기판.And a length of the first ground line and a length of the third ground line are different from each other.
  6. 제 1항에 있어서,The method of claim 1,
    상기 제1 패드는 제1-1 패드와 상기 제1-1 패드와 이격되어 배치된 제1-2 패드를 포함하고,The first pad may include a 1-1 pad and a 1-2 pad spaced apart from the 1-1 pad.
    상기 제2 패드는 제2-1 패드와 상기 제2-1 패드와 이격되어 배치된 제2-2 패드를 포함하고,The second pad includes a 2-1 pad and a 2-2 pad spaced apart from the 2-1 pad.
    상기 제3 패드는 제3-1 패드와 상기 제3-1 패드와 이격되어 배치된 제3-2 패드를 포함하는 멀티밴드 칩 안테나 실장용 기판.The third pad may include a 3-1 pad and a 3-2 pad spaced apart from the 3-1 pad.
  7. 제 6항에 있어서,The method of claim 6,
    상기 제1-1 패드와 상기 제1-2 패드가 접속되게 배치된 제1 연결패드와,A first connection pad arranged to connect the first-first pad and the first-second pad;
    상기 제2-1 패드와 상기 제2-2 패드가 접속되게 배치된 제2 연결패드와,A second connection pad arranged to connect the second pad and the second pad to the second pad;
    상기 제3-1 패드와 상기 제3-2 패드가 접속되게 배치된 제3 연결패드를 더 포함하는 멀티밴드 칩 안테나 실장용 기판.And a third connection pad disposed such that the 3-1 pad and the 3-2 pad are connected to each other.
  8. 제 1항에 있어서,The method of claim 1,
    상기 집중정수소자는 상기 급전라인에 접속되게 배치된 제1 집중정수소자와,The lumped purified water element may include a first lumped purified water element disposed to be connected to the feed line;
    상기 제1 내지 제3 접지라인 중에 적어도 어느 하나와 접속되게 배치된 제2 집중정수소자를 포함하는 멀티밴드 칩 안테나 실장용 기판.A substrate for mounting a multi-band chip antenna comprising a second centralized constant element disposed to be connected to at least one of the first to third ground lines.
  9. 제 1항에 있어서,The method of claim 1,
    상기 제2 패드는 제1 서브패드와 제2 서브패드를 포함하고,The second pad includes a first sub pad and a second sub pad.
    상기 제1 서브패드와 상기 제2 서브패드 중 적어도 어느 하나는 상기 급전라인에 접속된 멀티밴드 칩 안테나 실장용 기판.At least one of the first sub pad and the second sub pad is connected to the feed line.
  10. 제 9항에 있어서,The method of claim 9,
    상기 제1 내지 제3 접지라인은 상기 기판의 일면 상에 배치되는 멀티밴드 칩 안테나 실장용 기판.And the first to third ground lines are disposed on one surface of the substrate.
  11. 상기 제 1 항 내지 제 10 항 중 어느 한 항의 멀티밴드 칩 안테나 실장용 기판; 및The multi-band chip antenna mounting substrate of any one of claims 1 to 10; And
    상기 기판 상에 실장되고, 유전체 블록에 배치된 방사체 패턴을 포함하는 멀티밴드 칩 안테나를 포함하되,A multiband chip antenna mounted on the substrate and including a radiator pattern disposed on a dielectric block;
    상기 기판은 접지패턴과, 상기 접지패턴과 접속되게 배치된 제1 내지 제3 접지라인과, 상기 제1 내지 제3 접지라인에 각각 접속되게 배치된 제1 내지 제3 패드와, 상기 제2 패드에 접속되게 배치된 급전라인과, 상기 제1 내지 제3 접지라인 및 상기 급전라인 중 적어도 어느 하나와 접속되게 배치된 집중정수소자를 포함하는 멀티밴드 칩 안테나 장치.The substrate may include a ground pattern, first to third ground lines disposed to be connected to the ground pattern, first to third pads disposed to be connected to the first to third ground lines, and the second pad. And a concentrated line element disposed to be connected to at least one of the first to third ground lines and the feed line.
  12. 제 11항에 있어서,The method of claim 11,
    상기 방사체 패턴은 제1 내지 제3 방사체 패턴을 포함하고,The radiator pattern includes first to third radiator patterns,
    상기 제1 내지 제3 방사체 패턴은 각각 상기 제1 내지 제3 패드에 접속되게 배치되는 멀티밴드 칩 안테나 장치.And the first to third radiator patterns are connected to the first to third pads, respectively.
  13. 제 11항에 있어서,The method of claim 11,
    상기 급전라인과, 상기 제1 및 제2 방사체 패턴과, 상기 제1 접지라인을 포함하는 제1 신호경로는 제1 주파수를 갖는 신호를 송신 또는 수신하고,A first signal path including the feed line, the first and second radiator patterns, and the first ground line transmit or receive a signal having a first frequency,
    상기 급전라인과, 상기 제2 및 제3 방사체 패턴과, 상기 제3 접지라인을 포함하는 제2 신호경로는 제2 주파수를 갖는 신호를 송신 또는 수신하는 멀티밴드 칩 안테나 장치.And a second signal path including the feed line, the second and third radiator patterns, and the third ground line, to transmit or receive a signal having a second frequency.
  14. 제 13항에 있어서,The method of claim 13,
    상기 제1 주파수와 상기 제2 주파수는 서로 다른 멀티밴드 칩 안테나 장치.And the first frequency and the second frequency are different from each other.
  15. 제 13항에 있어서,The method of claim 13,
    상기 집중정수소자는 상기 제1 주파수, 상기 제2 주파수 또는 상기 안테나 장치의 임피던스 중 적어도 어느 하나를 조절하는데 이용되는 멀티밴드 칩 안테나 장치.The lumped constant element is used to adjust at least one of the first frequency, the second frequency or the impedance of the antenna device.
  16. 제 11항에 있어서,The method of claim 11,
    상기 제1 패드 및 상기 제3 패드는 상기 제2 패드를 중심으로 서로 대칭으로 배치되고,The first pad and the third pad are disposed symmetrically with respect to the second pad,
    상기 제1 방사체 패턴 및 상기 제3 방사체 패턴은 상기 제2 방사체 패턴을 중심으로 서로 대칭으로 배치된 멀티밴드 칩 안테나 장치.And the first radiator pattern and the third radiator pattern are symmetrically disposed with respect to the second radiator pattern.
  17. 제 11항에 있어서,The method of claim 11,
    상기 멀티밴드 칩 안테나는 표면실장기술(SMT)을 이용하여 상기 기판 상에 실장되는 멀티밴드 칩 안테나 장치.The multiband chip antenna device is mounted on the substrate using a surface mount technology (SMT).
PCT/KR2011/000323 2010-07-26 2011-01-17 Multiband chip antenna mounting substrate and multiband chip antenna device comprising same WO2012015131A1 (en)

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KR1020100071909A KR101055786B1 (en) 2010-07-26 2010-07-26 Substrate for mounting multiband chip antenna and multiband chip antenna device comprising the same

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Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP3121896A4 (en) * 2014-03-20 2017-11-22 NTN Corporation Chip antenna
EP3157097A4 (en) * 2014-06-13 2017-11-22 NTN Corporation Chip antenna

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR102607579B1 (en) 2018-12-31 2023-11-30 삼성전자주식회사 An electronic device including a multi band antenna

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH1013139A (en) * 1996-06-19 1998-01-16 Murata Mfg Co Ltd Surface mounting type antenna and communication equipment using it
KR100548057B1 (en) * 2005-06-03 2006-02-01 (주)파트론 Surface mount technology antenna apparatus with trio land structure
KR20060094716A (en) * 2005-02-25 2006-08-30 삼성전기주식회사 Antenna module and electric apparatus using the same
JP2006270995A (en) * 2006-05-29 2006-10-05 Kyocera Corp Surface-mounting antenna, antenna apparatus, and method for adjusting resonant frequency

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH1013139A (en) * 1996-06-19 1998-01-16 Murata Mfg Co Ltd Surface mounting type antenna and communication equipment using it
KR20060094716A (en) * 2005-02-25 2006-08-30 삼성전기주식회사 Antenna module and electric apparatus using the same
KR100548057B1 (en) * 2005-06-03 2006-02-01 (주)파트론 Surface mount technology antenna apparatus with trio land structure
JP2006270995A (en) * 2006-05-29 2006-10-05 Kyocera Corp Surface-mounting antenna, antenna apparatus, and method for adjusting resonant frequency

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP3121896A4 (en) * 2014-03-20 2017-11-22 NTN Corporation Chip antenna
EP3157097A4 (en) * 2014-06-13 2017-11-22 NTN Corporation Chip antenna
US10079426B2 (en) 2014-06-13 2018-09-18 Ntn Corporation Chip antenna

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