WO2012002718A2 - Board-type built-in antenna comprising a surface-mounted antenna unit, and method for manufacturing same - Google Patents

Board-type built-in antenna comprising a surface-mounted antenna unit, and method for manufacturing same Download PDF

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Publication number
WO2012002718A2
WO2012002718A2 PCT/KR2011/004736 KR2011004736W WO2012002718A2 WO 2012002718 A2 WO2012002718 A2 WO 2012002718A2 KR 2011004736 W KR2011004736 W KR 2011004736W WO 2012002718 A2 WO2012002718 A2 WO 2012002718A2
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WO
WIPO (PCT)
Prior art keywords
antenna
dimensional structure
antenna unit
substrate
board
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PCT/KR2011/004736
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French (fr)
Korean (ko)
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WO2012002718A3 (en
Inventor
강혁진
이재호
김국현
이경섭
Original Assignee
주식회사 네오펄스
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Publication of WO2012002718A2 publication Critical patent/WO2012002718A2/en
Publication of WO2012002718A3 publication Critical patent/WO2012002718A3/en

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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01Q—ANTENNAS, i.e. RADIO AERIALS
    • H01Q1/00—Details of, or arrangements associated with, antennas
    • H01Q1/12—Supports; Mounting means
    • H01Q1/22—Supports; Mounting means by structural association with other equipment or articles
    • H01Q1/24—Supports; Mounting means by structural association with other equipment or articles with receiving set
    • H01Q1/241—Supports; Mounting means by structural association with other equipment or articles with receiving set used in mobile communications, e.g. GSM
    • H01Q1/242—Supports; Mounting means by structural association with other equipment or articles with receiving set used in mobile communications, e.g. GSM specially adapted for hand-held use
    • H01Q1/243—Supports; Mounting means by structural association with other equipment or articles with receiving set used in mobile communications, e.g. GSM specially adapted for hand-held use with built-in antennas
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01Q—ANTENNAS, i.e. RADIO AERIALS
    • H01Q9/00—Electrically-short antennas having dimensions not more than twice the operating wavelength and consisting of conductive active radiating elements
    • H01Q9/04—Resonant antennas
    • H01Q9/30—Resonant antennas with feed to end of elongated active element, e.g. unipole
    • H01Q9/42—Resonant antennas with feed to end of elongated active element, e.g. unipole with folded element, the folded parts being spaced apart a small fraction of the operating wavelength

Definitions

  • the present invention relates to a board-type built-in antenna including a surface mount antenna unit and a method for manufacturing the same, and more particularly, it is possible to provide a board-type built-in antenna optimized for band characteristics by easily changing antenna characteristics, and to reduce manufacturing costs.
  • the present invention relates to a board-type built-in antenna including a surface mount antenna unit which can be used, and a method of manufacturing the same.
  • antennas of terminals are continuously developed to accommodate different signals transmitted and received in various mobile communication networks.
  • these antennas are designed in an optimized form in consideration of frequency characteristics, frequency bands, and frequency transmission paths of signals.
  • the antennas are gradually being reduced in consideration of the aesthetic appearance of the terminals, and antennas mounted on the outside of the terminal are integrated with the various circuits of the board and integrated or stacked on the internal circuit board of the terminal. It is developing.
  • the internal antenna which is configured in a planar shape inside the terminal, has a lower performance when receiving signals than external antennas mounted on the external terminal, and internal signals generated from circuits integrated in the terminal board are applied to the signals received by the antenna. Due to interference or ingress, their performance is low and their use is decreasing.
  • an inverted F-type antenna having a three-dimensional structure, a dielectric antenna implementing an antenna pattern on a dielectric, and the like are used.
  • the space utilization is low, the cost is very high, and the development and adjustment process is complicated, so that an alternative antenna is gradually required.
  • the present invention is to mount the three-dimensional antenna unit consisting of a single metal body to the flat antenna to improve the performance of the antenna than the conventional flat antenna, and at the same time by applying the three-dimensional antenna unit in a form suitable for mass production lower price than the conventional three-dimensional antenna
  • the purpose is to realize it.
  • the present invention is not only to freely adjust the connection form between the antenna pattern fixed to the substrate, but also to variously modify the shape of the connection structure, to provide an optimized antenna for the desired frequency band easily.
  • the present invention provides an antenna that can improve the antenna performance and at the same time reduce the manufacturing cost by providing an antenna structure that can minimize the effects of signal interference or inflow with other adjacent substrates and the ground of the adjacent substrate.
  • the purpose is.
  • an object of the present invention is to mass-produce a three-dimensional antenna unit in the form of a surface mount type, and to mount the planar antenna in a surface mount manner so that the antenna can be mass-produced with high yield and low cost.
  • an object of the present invention is to be able to share a three-dimensional antenna unit or a flat base antenna substrate on which the antenna unit is mounted to reduce the development / production / management costs.
  • the board-type built-in antenna including a surface-mounted antenna unit installed on the substrate according to the present invention for achieving the above object is a surface-mounted to connect the circuit board with the antenna pattern and the different antenna pattern to the circuit board It includes a surface mount antenna unit including at least one or more three-dimensional structure consisting of only a metal radiator.
  • the three-dimensional structure may have a band characteristic by bending the developed conductive metal, and the three-dimensional structure may be partially spaced apart from the circuit board.
  • the three-dimensional structure may further include a radiation area extension extending to the portion according to the band characteristics.
  • each of the three-dimensional structures included in the surface mount antenna unit may have different three-dimensional shapes by adjusting lengths or areas to optimize band characteristics.
  • the surface mount antenna unit may further include an extension unit interconnecting the three-dimensional structures different from each other according to band characteristics.
  • the three-dimensional structure may include at least two or more connection ends, such that each connection end and one end of a different antenna pattern are interconnected.
  • a method of manufacturing a board-type built-in antenna including a surface mount antenna unit installed on a board according to the present invention includes a first step of forming an antenna pattern on a circuit board and a metal radiator according to band characteristics. And mounting at least one solid structure configured to connect the antenna patterns different from each other to the circuit board.
  • the manufacturing method of the substrate-type embedded antenna including the surface-mounted antenna unit according to the present invention further comprises a third step of configuring the extension portion interconnecting the different three-dimensional structure according to the band characteristics to be spaced apart from the circuit board. Can be.
  • the second step may be characterized by determining the band characteristics by adjusting the length or area of the three-dimensional structure.
  • the second step may be surface-mounted so that a part of the three-dimensional structure is spaced apart from the circuit board.
  • the present invention is to mount the surface-mounted antenna portion consisting of a single metal body to the flat antenna to improve the performance of the antenna than the conventional flat antenna, and at the same time by applying the surface-mount antenna portion in a form suitable for mass production of the existing three-dimensional antenna It has the effect of solving the problems that are difficult to apply to the robustness and mass production.
  • the board-type built-in antenna including a surface-mounted antenna unit including a surface-mounted antenna unit according to the present invention
  • a part of the three-dimensional structure constituting the surface-mounted antenna unit is spaced apart from the circuit board, and the degree of separation from the circuit board can be freely adjusted.
  • Antenna performance can be greatly improved by minimizing distortion of the signal due to ground or internal noise.
  • the substrate-type built-in antenna including the surface-mount antenna portion according to the present invention can easily change the shape of the three-dimensional structure constituting the surface-mount antenna portion to a form optimized for the band characteristics, the antenna pattern pre-formed on the circuit board By utilizing the same as the connection between the three-dimensional structure and the antenna pattern or by changing the shape of the three-dimensional structure there is an effect that can increase the ease of manufacture of the substrate-type built-in antenna optimized for the band characteristics and at the same time reduce the cost.
  • the present invention has the effect of mass-producing an antenna with high yield and low cost by mass-producing a three-dimensional antenna unit in the form of a surface mount type and mounting it on a flat antenna in a surface mount manner.
  • the present invention can share the three-dimensional antenna unit or the planar base antenna substrate on which the antenna unit is mounted has the effect of reducing the development / production / management cost.
  • 1 is a view showing a built-in antenna to which the conventional chip device is applied.
  • FIG. 2 is a block diagram of a substrate-type built-in antenna including a surface-mounted antenna unit according to the present invention.
  • FIG. 3 is a view showing an embodiment of the shape of the three-dimensional structure constituting the surface mount antenna unit according to the present invention.
  • FIG. 4 is a view showing an embodiment of the connection to the antenna pattern of the three-dimensional structure constituting the surface mount antenna unit according to the present invention.
  • Figure 5 shows an embodiment of an extension for interconnecting the three-dimensional structure according to the present invention.
  • Figure 6 is a graph showing the standing wave ratio of the substrate-type built-in antenna and the conventional planar antenna including a surface mount antenna unit according to the present invention.
  • FIG. 7 is a table illustrating antenna gain and efficiency of a board-type embedded antenna and a conventional planar antenna including a surface mount antenna unit according to the present invention.
  • the present invention comprises a surface-mounted three-dimensional structure consisting of only the metal radiator as an antenna unit, and a surface consisting of at least one three-dimensional structure that is surface-mounted to connect between the antenna pattern to a substrate-type built-in antenna having an antenna pattern according to the band characteristics
  • a board-type embedded antenna including a mounted antenna unit.
  • FIG. 1 Among the internal antennas currently provided, as shown in FIG. 1, there is a built-in antenna in which a chip-type passive element 10 operating as part of the antenna is added to the PCB 30 on which the antenna pattern 20 is formed.
  • a passive element is applied to the antenna matching unit, but in some cases, a chip type passive element 10 may be applied to the antenna pattern 20 as shown in FIG. 1 to compensate for the length of the antenna.
  • the chip-type passive element 10 operates as a part of the antenna but does not have a radiation characteristic in itself, the actual antenna gain is lowered, thereby degrading the performance of the entire antenna.
  • the built-in antenna to which the chip-type passive element 10 is applied determines both the chip-type passive element 10 and the antenna pattern 20 so as to be optimized for the frequency characteristic, the chip-type passive element ( 10)
  • the antenna pattern 20 itself since the antenna pattern 20 itself must be redesigned, there is a problem in that the circuit board optimized for the existing band cannot be used as it is when the desired frequency band is changed.
  • the chip-type passive element 10 since the chip-type passive element 10 is closely connected to the PCB 30, the chip-type passive element 10 may be connected by a signal flowing from or interfering with another PCB substrate 40 or by grounding of the adjacent PCB substrate 40. In the built-in antenna to which the is applied, signal distortion occurs internally, thereby degrading antenna performance.
  • the built-in antenna to which the chip-type passive element shown in FIG. 1 is applied does not achieve the object of the present invention.
  • the substrate-type built-in antenna using a surface-mounted antenna unit is composed of the antenna pattern constituting the antenna and at least one three-dimensional structure for optimizing the antenna characteristics for the band by interconnecting the different antenna pattern
  • the surface mount antenna unit may be formed of only a metal radiator capable of radiating to improve antenna performance.
  • an antenna optimized for band characteristics may be provided by changing a length, an area, a structure, or a connection form of the three-dimensional structure constituting the surface mount antenna unit.
  • the board-type built-in antenna including the surface mount antenna unit according to the present invention may include a circuit board 300 having an antenna pattern 200 and the antenna pattern 200 different from each other on the circuit board. It is composed of a surface-mounted antenna unit consisting of at least one or more three-dimensional structure 100 which is surface-mounted to connect ().
  • the circuit board 300 is separated from the main board 400 of the terminal, and the RF part of the main board 400 and one end of the antenna pattern 200 formed on the circuit board 300 are connected and signaled. It may be configured to transmit and receive, one main board 400 may be configured to include the substrate-type built-in antenna.
  • the surface mount antenna unit includes at least one three-dimensional structure 100, and the three-dimensional structure 100 includes only a metal radiator.
  • the three-dimensional structure 100 is surface-mounted on the circuit board so that both ends thereof interconnect different antenna patterns 200 formed on the circuit board.
  • the three-dimensional structure 100 is a surface mount device (SMD), and the three-dimensional structure 100, which is a surface-mounted device whose length or area is adjusted according to a band characteristic, is adjacent to different antenna patterns (SMD), and the three-dimensional structure 100, which is a surface-mounted device whose length or area is adjusted according to a band characteristic, is adjacent to different antenna patterns (SMD).
  • SMD surface mount device
  • the three-dimensional structure 100 which is a surface-mounted device whose length or area is adjusted according to a band characteristic, is adjacent to different antenna patterns
  • Surface mounting of the interconnects 200 allows automation equipment to be used, thus reducing manufacturing costs.
  • the band characteristics of the antenna can be easily changed as described below.
  • conventional three-dimensional antennas such as an inverted F-type antenna or an antenna including a dielectric, are difficult to mass-produce because they are bulky to be mounted on a circuit board in the surface-mounting method as described above, and to produce the corresponding stereo antennas themselves. Even though manual work is required, the cost is high and the yield is low.
  • a part of the entire antenna pattern corresponding to the band characteristics is formed on the circuit board 300 in a planar shape 200, but the antenna The remaining part of the pattern is replaced with at least one or more three-dimensional structure 100 included in the surface mount antenna unit.
  • the three-dimensional structure 100 can be used as a surface-mounted device, mass production is possible, and thus a manufacturing cost can be greatly reduced compared to a conventional three-dimensional antenna, and the three-dimensional structure 100 is small in volume and size. It has high rigidity and maximizes space utilization by design of layout and structure.
  • the three-dimensional structure 100 may be designed as a corresponding structure according to the structure of the case to be coupled. At the same time, since the three-dimensional structure 100 is spaced apart from the circuit board 300, it is possible to reduce the influence of the signal introduced or interfered from the adjacent circuit of the planar antenna, thereby improving antenna performance.
  • the three-dimensional structure 100 is simply characterized in that the length, area or structural deformation is easy to change the characteristics of the antenna for a particular band is free. Through this, it is possible to easily provide an antenna optimized for the band characteristics.
  • the degree of separation from the circuit board 300 when manufacturing the three-dimensional structure 100 varies the height or bending shape of the three-dimensional structure 100 by using a space formed between the circuit board 300 and the case of the terminal.
  • the shape may be variously changed to be optimized for various band characteristics.
  • the surface mount antenna unit may be composed of a plurality of the three-dimensional structure 100, as shown in Figure 2 (b), by adjusting the number of the three-dimensional structure 100 to optimize the band characteristics different It may be arranged to connect between the antenna pattern 200.
  • Figure 3 (a) is a view showing the basic shape of the three-dimensional structure constituting the surface-mounted antenna portion, as described above
  • the three-dimensional structure 100 interconnects different antenna patterns 200 to compensate for the frequency band characteristics, and at the same time, a portion of the three-dimensional structure is spaced apart from the circuit board 300 to increase radiation efficiency. The performance of the antenna is improved.
  • the three-dimensional structure 100 further includes a radiation area extension 110 extending a part of the area to ensure a wide radiation area, thereby increasing radiation efficiency. It can also increase bandwidth.
  • the radiation portion of the three-dimensional structure 100 in accordance with the band characteristics can be produced by zigzag long length, through which the three-dimensional structure 100 of Figure 3 (a)
  • the antenna performance can be improved by ensuring the antenna length corresponding to different bands while occupying the same space as).
  • FIG. 4 illustrates various embodiments in which the three-dimensional structure constituting the surface mount antenna unit according to the present invention selectively interconnects different antenna patterns 200 formed on the circuit board 300 to receive a desired band.
  • the three-dimensional structure 100 illustrated in FIG. 4A has three connection terminals 120 different from the three-dimensional structure 100 illustrated in FIG. Pattern 200 may be interconnected.
  • connection terminals 120 may be used to change characteristics of the on-board antenna.
  • the band characteristics of the built-in antenna may be changed by adjusting the separation distance of the remaining radiating portion except for the connection end 120 to the circuit board 300 of the three-dimensional structure. At this time, the separation distance can be freely adjusted in the space between the circuit board and the outer case of the terminal to ensure the autonomy of the antenna design.
  • the surface mount antenna unit connects different antenna patterns 200 formed on the circuit board 300 and extends the interconnected plurality of three-dimensional structures 100 spaced apart from each other. It may further include a 130, the extension portion 130 is also composed of a radiator in the same manner as the three-dimensional structure 100 to extend the bandwidth of the antenna or in combination with the three-dimensional structure 100 optimized for band characteristics Can provide a constructive structure.
  • All three-dimensional structures as described above are composed of only the radiator, and the size and volume of the three-dimensional structure can be applied to a manufacturing method suitable for mass production such as press, mold, die casting, or molding as it is, so that manufacturing cost can be greatly reduced, thereby greatly improving yield. You can.
  • the three-dimensional structure can be applied to SMD equipment through a compact structure, reel-type packaging is applied to the SMD facilitates mass production. In addition, it can be easily applied to general-purpose SMD lines.
  • FIG. 6 is a view showing a standing wave ratio (VSWR), Figure 6 (a) is a standing wave ratio of a conventional planar antenna, Figure 6 (b) is a standing wave of a substrate-type built-in antenna including a surface-mounted antenna unit according to the present invention Ratio (VSWR).
  • VSWR standing wave ratio
  • the standing wave ratio of the substrate-type built-in antenna including the surface-mounted antenna unit according to the present invention is higher than the standing wave ratio of the conventional planar antenna, which is a surface-mounted antenna unit consisting of the at least one three-dimensional structure It can be seen that the antenna performance is improved by minimizing the effects of interference or incoming signals and ground from the outside.
  • Figure 7 is a table showing the antenna gain and antenna efficiency according to Figure 7 (a) is for the conventional planar antenna
  • Figure 7 (b) is a substrate-type built-in antenna including a surface mount antenna unit according to the present invention It is about.
  • the substrate-type embedded antenna including the surface-mounted antenna unit according to the present invention can be seen that the antenna gain is higher due to the same reason as in FIG. . Accordingly, it can be seen that the antenna efficiency is higher than that of the conventional planar antenna.
  • the surface mount antenna unit of the board-type built-in antenna according to the present invention replaces a part of the planar antenna pattern with a three-dimensional structure to minimize the loss of the signal due to the inflow, interference, or ground of the internal signal in the terminal that changes the antenna characteristics.
  • the antenna performance can be greatly improved, and the three-dimensional structure that performs this role can be applied as a surface-mounted device, thereby easily mass-producing a problem of the existing three-dimensional antenna.

Abstract

The present invention relates to a board-type built-in antenna comprising a surface-mounted antenna unit and to a method for manufacturing same, and more particularly, to a board-type built-in antenna comprising a surface-mounted antenna unit and to a method for manufacturing same according to which the characteristics of the antenna can be easily changed to provide a board-type built-in antenna that is optimized in accordance with the characteristics of a band, and reduce manufacturing costs. According to the present invention, the surface-mounted antenna unit, which is constituted by a single metal body alone, is mounted on a planar antenna, to thereby improve the performance of the antenna as compared to conventional planar antennas. In addition, the surface-mounted antenna unit of the antenna of the present invention is improved to a form that is suitable for mass production, thus achieving superior solidity which is the same as that of conventional solid antennas, and overcoming the problems of conventional solid antennas, such as difficulties in mass production.

Description

표면실장형 안테나부를 포함한 기판형 내장 안테나 및 그 제조방법Substrate-type built-in antenna including surface-mounted antenna and its manufacturing method
본 발명은 표면실장형 안테나부를 포함한 기판형 내장 안테나 및 그 제조방법에 관한 것으로, 더욱 상세히는 안테나 특성의 변경이 용이하여 대역특성에 최적화된 기판형 내장 안테나를 제공할 수 있으며, 제조비용을 절감할 수 있는 표면실장형 안테나부를 포함한 기판형 내장 안테나 및 그 제조방법에 관한 것이다.The present invention relates to a board-type built-in antenna including a surface mount antenna unit and a method for manufacturing the same, and more particularly, it is possible to provide a board-type built-in antenna optimized for band characteristics by easily changing antenna characteristics, and to reduce manufacturing costs. The present invention relates to a board-type built-in antenna including a surface mount antenna unit which can be used, and a method of manufacturing the same.
현재 다양한 이동통신망에서 송수신되는 서로 다른 신호를 수용하기 위하여 단말기들의 안테나는 지속적으로 발전하고 있다. 특히, 이러한 안테나들은 신호의 주파수 특성, 주파수 대역 및 주파수 전달 경로 등을 고려하여 각각 최적화된 형태로 설계되고 있다.At present, antennas of terminals are continuously developed to accommodate different signals transmitted and received in various mobile communication networks. In particular, these antennas are designed in an optimized form in consideration of frequency characteristics, frequency bands, and frequency transmission paths of signals.
더하여, 최근 안테나들은 단말기들의 외관상 미관을 고려하여 점점 축소되고 있으며, 단말기의 외부에 장착되던 안테나들이 기판의 각종 회로와 연동하여 단말기의 내부 회로 기판에 집적되거나 적층배치될 수 있는 평면형 안테나의 형태로 발전하고 있다.In addition, in recent years, the antennas are gradually being reduced in consideration of the aesthetic appearance of the terminals, and antennas mounted on the outside of the terminal are integrated with the various circuits of the board and integrated or stacked on the internal circuit board of the terminal. It is developing.
그러나, 현재 단말기 내부에 평면형으로 구성되는 이러한 내장형 안테나는 단말기 외부에 장착되는 외장형 안테나들보다 신호 수신시 성능이 많이 떨어지며, 단말기 기판에 집적된 회로에서 발생하는 내부적인 신호가 안테나가 수신하는 신호에 간섭하거나 유입하기 때문에 성능이 낮아 그 사용이 줄어들고 있다.However, the internal antenna, which is configured in a planar shape inside the terminal, has a lower performance when receiving signals than external antennas mounted on the external terminal, and internal signals generated from circuits integrated in the terminal board are applied to the signals received by the antenna. Due to interference or ingress, their performance is low and their use is decreasing.
현재 이와 같은 문제점을 개선시키기 위해서, 입체적 구조의 역 F형 안테나, 유전체 상에 안테나 패턴을 구현한 유전체 안테나 등을 이용하고 있다. 하지만, 이러한 입체형 안테나의 경우에는 공간활용성이 낮고 비용이 상당히 높을 뿐만 아니라 개발과 조정과정이 복잡하여 차츰 대안적인 안테나를 요구하고 있는 실정이다.Currently, in order to improve such a problem, an inverted F-type antenna having a three-dimensional structure, a dielectric antenna implementing an antenna pattern on a dielectric, and the like are used. However, in the case of such a three-dimensional antenna, the space utilization is low, the cost is very high, and the development and adjustment process is complicated, so that an alternative antenna is gradually required.
본 발명은 단일 금속체만으로 구성된 입체형 안테나부를 평면 안테나에 실장하여 기존 평면 안테나보다 안테나의 성능을 개선시킬 수 있도록 하는 동시에, 상기 입체형 안테나부를 대량생산에 적합한 형태로 적용하여 기존 입체 안테나보다 낮은 가격을 실현하는데 그 목적이 있다.The present invention is to mount the three-dimensional antenna unit consisting of a single metal body to the flat antenna to improve the performance of the antenna than the conventional flat antenna, and at the same time by applying the three-dimensional antenna unit in a form suitable for mass production lower price than the conventional three-dimensional antenna The purpose is to realize it.
또한, 본 발명은 기판에 고정된 안테나 패턴 사이의 연결 형태를 자유로이 조절할 수 있을 뿐 아니라 연결 구조물의 형태를 다양하게 변형하여, 원하는 주파수 대역에 대한 최적화된 안테나를 용이하게 제공하는데 그 목적이 있다.In addition, the present invention is not only to freely adjust the connection form between the antenna pattern fixed to the substrate, but also to variously modify the shape of the connection structure, to provide an optimized antenna for the desired frequency band easily.
더하여, 본 발명은 인접한 다른 기판과의 신호 간섭 또는 유입과 인접 기판의 접지로 인한 영향을 최소화할 수 있는 안테나 구조를 제공하여 안테나 성능을 개선시킴과 동시에 제작비용을 절감할 수 있는 안테나를 제공하는데 그 목적이 있다.In addition, the present invention provides an antenna that can improve the antenna performance and at the same time reduce the manufacturing cost by providing an antenna structure that can minimize the effects of signal interference or inflow with other adjacent substrates and the ground of the adjacent substrate. The purpose is.
이외에도, 본 발명은 입체형 안테나부를 표면 실장형 부품형태로 양산하여 표면실장 방식으로 평면 안테나에 실장함으로써 높은 수율과 낮은 비용으로 안테나를 양산할 수 있도록 하는데 그 목적이 있다.In addition, an object of the present invention is to mass-produce a three-dimensional antenna unit in the form of a surface mount type, and to mount the planar antenna in a surface mount manner so that the antenna can be mass-produced with high yield and low cost.
또한, 본 발명은 입체형 안테나부나 해당 안테나부가 실장되는 평면형 베이스 안테나 기판을 공용화할 수 있어 개발/생산/관리 비용을 절감할 수 있도록 하는데 그 목적이 있다.In addition, an object of the present invention is to be able to share a three-dimensional antenna unit or a flat base antenna substrate on which the antenna unit is mounted to reduce the development / production / management costs.
상기한 목적을 달성하기 위한 본 발명에 따른 기판에 설치되는 표면실장형 안테나부를 포함한 기판형 내장 안테나는, 안테나 패턴이 형성된 회로기판과, 상기 회로 기판에 서로 다른 상기 안테나 패턴을 연결하도록 표면실장되며 금속 방사체만으로 구성된 적어도 하나 이상의 입체구조물을 포함하는 표면실장형 안테나부를 포함한다.The board-type built-in antenna including a surface-mounted antenna unit installed on the substrate according to the present invention for achieving the above object is a surface-mounted to connect the circuit board with the antenna pattern and the different antenna pattern to the circuit board It includes a surface mount antenna unit including at least one or more three-dimensional structure consisting of only a metal radiator.
이때, 상기 입체구조물은 전개된 도전 금속을 절곡하여 대역특성을 가지도록 할 수 있으며, 상기 입체구조물은 일부분이 상기 회로기판과 이격되어 구성될 수 있다.In this case, the three-dimensional structure may have a band characteristic by bending the developed conductive metal, and the three-dimensional structure may be partially spaced apart from the circuit board.
또한, 상기 입체구조물은 대역특성에 따라 상기 일부분에 연장되는 방사영역 확장부를 더 포함할 수 있다.In addition, the three-dimensional structure may further include a radiation area extension extending to the portion according to the band characteristics.
더하여, 상기 표면실장형 안테나부에 포함된 상기 입체 구조물 각각은 대역특성에 최적화되도록 길이 또는 면적을 조절하여 서로 다른 입체 형상을 가지도록 할 수도 있다.In addition, each of the three-dimensional structures included in the surface mount antenna unit may have different three-dimensional shapes by adjusting lengths or areas to optimize band characteristics.
이외에도, 상기 표면 실장형 안테나부는 대역특성에 따라 서로 다른 상기 입체구조물을 상호 연결하는 연장부를 더 포함할 수도 있다.In addition, the surface mount antenna unit may further include an extension unit interconnecting the three-dimensional structures different from each other according to band characteristics.
그밖에, 상기 입체구조물은 적어도 두개 이상의 연결단을 포함하여, 상기 각 연결단과 서로 다른 안테나 패턴의 일단을 상호 연결하도록 할 수 있다.In addition, the three-dimensional structure may include at least two or more connection ends, such that each connection end and one end of a different antenna pattern are interconnected.
상기한 목적을 달성하기 위한 본 발명에 따른 기판에 설치되는 표면실장형 안테나부를 포함한 기판형 내장 안테나의 제조 방법은, 회로 기판에 안테나 패턴을 형성하는 제 1단계와, 대역특성에 따라 금속 방사체만으로 구성된 적어도 하나 이상의 입체구조물을 상기 회로 기판에 서로 다른 상기 안테나 패턴을 연결하도록 표면실장하는 제 2단계를 포함한다.In order to achieve the above object, a method of manufacturing a board-type built-in antenna including a surface mount antenna unit installed on a board according to the present invention includes a first step of forming an antenna pattern on a circuit board and a metal radiator according to band characteristics. And mounting at least one solid structure configured to connect the antenna patterns different from each other to the circuit board.
이때, 본 발명에 따른 표면실장형 안테나부를 포함한 기판형 내장 안테나의 제조방법은 대역특성에 따라 서로 다른 상기 입체구조물을 상호 연결하는 연장부를 상기 회로 회판과 이격되도록 구성하는 제 3단계를 더 포함할 수 있다.At this time, the manufacturing method of the substrate-type embedded antenna including the surface-mounted antenna unit according to the present invention further comprises a third step of configuring the extension portion interconnecting the different three-dimensional structure according to the band characteristics to be spaced apart from the circuit board. Can be.
또한, 상기 제 2단계는 상기 입체구조물의 길이 또는 면적을 조절하여 대역 특성을 결정하는 것을 특징으로 할 수 있다.In addition, the second step may be characterized by determining the band characteristics by adjusting the length or area of the three-dimensional structure.
더하여, 상기 제 2단계는 상기 입체구조물의 일부분이 상기 회로 기판과 이격되도록 표면실장하는 것을 특징으로 할 수 있다.In addition, the second step may be surface-mounted so that a part of the three-dimensional structure is spaced apart from the circuit board.
본 발명은 단일 금속체만으로 구성된 표면실장형 안테나부를 평면 안테나에 실장하여 기존 평면 안테나보다 안테나의 성능을 개선시킬 수 있도록 하는 동시에, 상기 표면실장형 안테나부를 대량생산에 적합한 형태로 적용하여 기존 입체 안테나가 가지는 견고성 및 대량생산에 적용되기 어려운 문제점을 해결할 수 있는 효과가 있다.The present invention is to mount the surface-mounted antenna portion consisting of a single metal body to the flat antenna to improve the performance of the antenna than the conventional flat antenna, and at the same time by applying the surface-mount antenna portion in a form suitable for mass production of the existing three-dimensional antenna It has the effect of solving the problems that are difficult to apply to the robustness and mass production.
또한, 본 발명에 따른 표면실장형 안테나부를 포함한 기판형 내장 안테나는 상기 표면실장형 안테나부를 구성하는 입체구조물의 일부가 회로 기판과 이격되며, 회로 기판과의 이격정도를 자유로이 조절할 수 있어 회로기판의 접지 또는 내부적인 노이즈에 의한 신호의 왜곡을 최소화하여 안테나 성능을 크게 개선시킬 수 있다.In addition, in the board-type built-in antenna including a surface-mounted antenna unit according to the present invention, a part of the three-dimensional structure constituting the surface-mounted antenna unit is spaced apart from the circuit board, and the degree of separation from the circuit board can be freely adjusted. Antenna performance can be greatly improved by minimizing distortion of the signal due to ground or internal noise.
더하여, 본 발명에 따른 표면실장형 안테나부를 포함한 기판형 내장 안테나는 상기 표면실장형 안테나부를 구성하는 입체구조물의 형태를 대역특성에 최적화된 형태로 용이하게 변경할 수 있어, 회로 기판에 기형성된 안테나 패턴을 그대로 활용하여 상기 입체구조물과 안테나 패턴의 연결 또는 상기 입체구조물의 형태를 변경하여 대역특성에 최적화된 기판형 내장 안테나의 제작 편의성을 높임과 동시에 비용을 절감할 수 있는 효과가 있다.In addition, the substrate-type built-in antenna including the surface-mount antenna portion according to the present invention can easily change the shape of the three-dimensional structure constituting the surface-mount antenna portion to a form optimized for the band characteristics, the antenna pattern pre-formed on the circuit board By utilizing the same as the connection between the three-dimensional structure and the antenna pattern or by changing the shape of the three-dimensional structure there is an effect that can increase the ease of manufacture of the substrate-type built-in antenna optimized for the band characteristics and at the same time reduce the cost.
이외에도, 본 발명은 입체형 안테나부를 표면 실장형 부품형태로 양산하여 표면실장 방식으로 평면 안테나에 실장함으로써 높은 수율과 낮은 비용으로 안테나를 양산할 수 있는 효과가 있다.In addition, the present invention has the effect of mass-producing an antenna with high yield and low cost by mass-producing a three-dimensional antenna unit in the form of a surface mount type and mounting it on a flat antenna in a surface mount manner.
또한, 본 발명은 입체형 안테나부나 해당 안테나부가 실장되는 평면형 베이스 안테나 기판을 공용화할 수 있어 개발/생산/관리 비용을 절감할 수 있는 효과가 있다.In addition, the present invention can share the three-dimensional antenna unit or the planar base antenna substrate on which the antenna unit is mounted has the effect of reducing the development / production / management cost.
도 1은 기존의 칩소자를 적용한 내장형 안테나를 도시한 도면.1 is a view showing a built-in antenna to which the conventional chip device is applied.
도 2는 본 발명에 따른 표면실장형 안테나부를 포함한 기판형 내장 안테나의 구성도.2 is a block diagram of a substrate-type built-in antenna including a surface-mounted antenna unit according to the present invention.
도 3은 본 발명에 따른 표면실장형 안테나부를 구성하는 입체구조물의 형태에 대한 실시예를 도시한 도면.3 is a view showing an embodiment of the shape of the three-dimensional structure constituting the surface mount antenna unit according to the present invention.
도 4는 본 발명에 따른 표면실장형 안테나부를 구성하는 입체구조물의 안테나 패턴에 대한 연결의 실시예를 도시한 도면.4 is a view showing an embodiment of the connection to the antenna pattern of the three-dimensional structure constituting the surface mount antenna unit according to the present invention.
도 5는 본 발명에 따른 입체구조물을 상호 연결하는 연장부에 대한 실시예를 도시한 도면.Figure 5 shows an embodiment of an extension for interconnecting the three-dimensional structure according to the present invention.
도 6은 본 발명에 따른 표면실장형 안테나부를 포함한 기판형 내장 안테나와 기존 평면 안테나의 정재파비를 도시한 그래프.Figure 6 is a graph showing the standing wave ratio of the substrate-type built-in antenna and the conventional planar antenna including a surface mount antenna unit according to the present invention.
도 7은 본 발명에 따른 표면실장형 안테나부를 포함한 기판형 내장 안테나와 기존 평면 안테나의 안테나 이득 및 효율을 도시한 표.FIG. 7 is a table illustrating antenna gain and efficiency of a board-type embedded antenna and a conventional planar antenna including a surface mount antenna unit according to the present invention. FIG.
본 발명은 금속방사체만으로 구성된 표면실장형 입체구조물을 안테나부로 구성하고, 대역특성에 따라 안테나 패턴이 기형성된 기판형 내장 안테나에 상기 안테나 패턴 사이를 연결하도록 표면실장되는 적어도 하나 이상의 입체구조물로 구성된 표면실장형 안테나부를 포함한 기판형 내장 안테나를 제공한다.The present invention comprises a surface-mounted three-dimensional structure consisting of only the metal radiator as an antenna unit, and a surface consisting of at least one three-dimensional structure that is surface-mounted to connect between the antenna pattern to a substrate-type built-in antenna having an antenna pattern according to the band characteristics Provided is a board-type embedded antenna including a mounted antenna unit.
현재 제공되고 있는 내장 안테나 중에서, 도 1에 도시된 바와 같이 안테나의 일부로 동작하는 칩형 수동소자(10)를 안테나 패턴(20)이 형성된 PCB(30)에 추가한 형태의 내장형 안테나가 있다.Among the internal antennas currently provided, as shown in FIG. 1, there is a built-in antenna in which a chip-type passive element 10 operating as part of the antenna is added to the PCB 30 on which the antenna pattern 20 is formed.
일반적으로 안테나 매칭부에 수동소자가 적용되지만, 경우에 따라서는 안테나의 길이를 보상하기 위해 도 1에 도시된 바와 같이 칩형 수동 소자(10)를 안테나 패턴(20)에 적용하기도 한다.Generally, a passive element is applied to the antenna matching unit, but in some cases, a chip type passive element 10 may be applied to the antenna pattern 20 as shown in FIG. 1 to compensate for the length of the antenna.
그러나, 상기 칩형 수동소자(10)는 안테나의 일부로 동작하기는 하지만 그 자체로 방사특성이 없어 실제 안테나 이득은 낮아지게 되므로 전체 안테나의 성능이 열화된다.However, although the chip-type passive element 10 operates as a part of the antenna but does not have a radiation characteristic in itself, the actual antenna gain is lowered, thereby degrading the performance of the entire antenna.
또한, 이러한 칩형 수동소자(10)를 적용한 내장형 안테나는 주파수 특성에 최적화되도록 칩형 수동소자(10)와 안테나 패턴(20)을 함께 결정하기 때문에, 다른 주파수 대역에 대하여 최적화 하기 위해서는 상기 칩형 수동소자(10) 뿐만 아니라 안테나 패턴(20) 자체를 모두 재설계해야 하므로 원하는 주파수 대역의 변경시 기존 대역에 최적화된 회로 기판을 그대로 사용하지 못하는 문제점이 있다.In addition, since the built-in antenna to which the chip-type passive element 10 is applied determines both the chip-type passive element 10 and the antenna pattern 20 so as to be optimized for the frequency characteristic, the chip-type passive element ( 10) In addition, since the antenna pattern 20 itself must be redesigned, there is a problem in that the circuit board optimized for the existing band cannot be used as it is when the desired frequency band is changed.
더하여, 상기 칩형 수동소자(10)가 PCB(30)에 밀착되어 연결되므로 인접한 다른 PCB 기판(40)으로부터 유입되거나 간섭하는 신호나 인접 PCB 기판(40)의 접지에 의해 상기 칩형 수동소자(10)가 적용된 내장형 안테나에서 내부적으로 신호의 왜곡이 발생하여 안테나 성능이 떨어지게 된다.In addition, since the chip-type passive element 10 is closely connected to the PCB 30, the chip-type passive element 10 may be connected by a signal flowing from or interfering with another PCB substrate 40 or by grounding of the adjacent PCB substrate 40. In the built-in antenna to which the is applied, signal distortion occurs internally, thereby degrading antenna performance.
따라서, 상술한 바와 같은 이유로 도 1에 도시된 칩형 수동소자가 적용된 내장형 안테나는 본 발명의 목적을 달성하지 못한다.Therefore, the built-in antenna to which the chip-type passive element shown in FIG. 1 is applied does not achieve the object of the present invention.
반면, 본 발명에 따른 표면실장형 안테나부를 이용한 기판형 내장 안테나는 안테나를 구성하는 상기 안테나 패턴과, 서로 다른 상기 안테나 패턴을 상호 연결하여 대역에 대한 안테나 특성을 최적화하는 적어도 하나 이상의 입체구조물로 구성된 상기 표면실장형 안테나부를 방사가 가능한 금속방사체만으로 구성하여 안테나 성능을 향상시키도록 한다.On the other hand, the substrate-type built-in antenna using a surface-mounted antenna unit according to the present invention is composed of the antenna pattern constituting the antenna and at least one three-dimensional structure for optimizing the antenna characteristics for the band by interconnecting the different antenna pattern The surface mount antenna unit may be formed of only a metal radiator capable of radiating to improve antenna performance.
이때, 상기 표면실장형 안테나부를 구성하는 입체구조물의 길이, 면적, 구조 또는 상기 안테나 패턴과의 연결형태를 변경하여 대역 특성에 최적화된 안테나를 제공할 수 있다.In this case, an antenna optimized for band characteristics may be provided by changing a length, an area, a structure, or a connection form of the three-dimensional structure constituting the surface mount antenna unit.
이러한 본 발명에 따른 표면실장형 안테나부를 포함한 기판형 내장 안테나의 구성을 도 2를 통해 살펴보기로 한다. 우선 도 2(a)를 참고하면, 본 발명에 따른 표면실장형 안테나부를 포함한 기판형 내장 안테나는 안테나 패턴(200)이 형성된 회로기판(300)과, 상기 회로 기판에 서로 다른 상기 안테나 패턴(200)을 연결하도록 표면실장되는 적어도 하나 이상의 입체구조물(100)로 구성된 표면실장형 안테나부로 구성된다.The configuration of the substrate-type embedded antenna including the surface mount antenna unit according to the present invention will be described with reference to FIG. 2. First, referring to FIG. 2 (a), the board-type built-in antenna including the surface mount antenna unit according to the present invention may include a circuit board 300 having an antenna pattern 200 and the antenna pattern 200 different from each other on the circuit board. It is composed of a surface-mounted antenna unit consisting of at least one or more three-dimensional structure 100 which is surface-mounted to connect ().
이때, 상기 회로 기판(300)은 단말기의 메인 기판(400)과 분리 구성되어, 상기 메인 기판(400)의 RF부와 상기 회로 기판(300)에 형성된 안테나 패턴(200)의 일단이 연결되어 신호를 송수신할 수 있도록 구성될 수 있으며, 하나의 메인기판(400)에 상기 기판형 내장 안테나가 포함되도록 구성할 수도 있다.In this case, the circuit board 300 is separated from the main board 400 of the terminal, and the RF part of the main board 400 and one end of the antenna pattern 200 formed on the circuit board 300 are connected and signaled. It may be configured to transmit and receive, one main board 400 may be configured to include the substrate-type built-in antenna.
한편, 상기 표면실장형 안테나부는 도 2(a)에 도시된 바와 같이 적어도 하나 이상의 입체 구조물(100)로 구성되며, 상기 입체 구조물(100)은 금속 방사체만으로 구성된다. 또한, 상기 입체 구조물(100)은 양단이 상기 회로 기판에 형성된 서로 다른 안테나 패턴(200)을 상호 연결하도록 상기 회로 기판에 표면 실장된다.Meanwhile, as shown in FIG. 2A, the surface mount antenna unit includes at least one three-dimensional structure 100, and the three-dimensional structure 100 includes only a metal radiator. In addition, the three-dimensional structure 100 is surface-mounted on the circuit board so that both ends thereof interconnect different antenna patterns 200 formed on the circuit board.
즉, 상기 입체구조물(100)은 표면실장형 소자(SMD: Surface Mount Devices)로서, 대역 특성에 따라 길이 또는 면적이 조절된 표면실장형 소자인 상기 입체구조물(100)을 인접한 서로 다른 안테나 패턴(200)을 상호 연결하도록 표면실장하는 것을 통해 자동화 설비 이용이 가능하게 되므로 제조비용을 절감할 수 있다. 더하여, 이하에서 설명하는 바와 같이 안테나의 대역특성을 용이하게 변경할 수 있다.That is, the three-dimensional structure 100 is a surface mount device (SMD), and the three-dimensional structure 100, which is a surface-mounted device whose length or area is adjusted according to a band characteristic, is adjacent to different antenna patterns ( Surface mounting of the interconnects 200 allows automation equipment to be used, thus reducing manufacturing costs. In addition, the band characteristics of the antenna can be easily changed as described below.
이에 반해, 역 F형 안테나 또는 유전체를 포함한 안테나와 같은 기존의 입체적인 안테나는 상술한 바와 같은 표면실장 방식으로 회로 기판에 실장하기에는 부피가 상당하여 적용이 어려워 양산이 힘들고, 해당 입체 안테나 자체를 생산할 경우에도 수작업이 필요하여 비용이 높고 수율이 낮다.On the other hand, conventional three-dimensional antennas, such as an inverted F-type antenna or an antenna including a dielectric, are difficult to mass-produce because they are bulky to be mounted on a circuit board in the surface-mounting method as described above, and to produce the corresponding stereo antennas themselves. Even though manual work is required, the cost is high and the yield is low.
본 발명에 따른 표면실장형 안테나부를 포함한 기판형 내장 안테나는 도 2에 도시된 바와 같이 회로 기판(300)에 대역특성에 대응하는 전체 안테나 패턴 중 일부를 평면 형태(200)로 형성하되, 상기 안테나 패턴의 나머지 부분을 상기 표면실장형 안테나부에 포함된 적어도 하나 이상의 입체구조물(100)로 대체하도록 한다.In the board-type built-in antenna including the surface mount antenna unit according to the present invention, as shown in FIG. 2, a part of the entire antenna pattern corresponding to the band characteristics is formed on the circuit board 300 in a planar shape 200, but the antenna The remaining part of the pattern is replaced with at least one or more three-dimensional structure 100 included in the surface mount antenna unit.
이에 따라, 상기 입체 구조물(100)을 표면실장형 소자로 이용할 수 있어 대량 생산이 가능하므로 제조비용을 기존 입체 안테나에 비해 크게 절감할 수 있으며, 상기 입체 구조물(100)은 부피 및 크기가 작으므로 높은 견고성을 지니며, 배치 및 구조물 형태 설계에 의해 공간활용성을 극대화한다. 예를 들어 결합되는 케이스의 구조에 따라 입체구조물(100)을 대응 구조로 설계할 수 있다. 동시에, 상기 입체구조물(100)은 회로 기판(300)과 이격되어 있으므로 상기 평면 안테나가 가지는 인접한 회로로부터 유입되거나 간섭하는 신호의 영향을 줄일 수 있어 안테나 성능을 개선시킬 수 있다.Accordingly, since the three-dimensional structure 100 can be used as a surface-mounted device, mass production is possible, and thus a manufacturing cost can be greatly reduced compared to a conventional three-dimensional antenna, and the three-dimensional structure 100 is small in volume and size. It has high rigidity and maximizes space utilization by design of layout and structure. For example, the three-dimensional structure 100 may be designed as a corresponding structure according to the structure of the case to be coupled. At the same time, since the three-dimensional structure 100 is spaced apart from the circuit board 300, it is possible to reduce the influence of the signal introduced or interfered from the adjacent circuit of the planar antenna, thereby improving antenna performance.
더하여, 상기 입체구조물(100)은 간단히 길이, 면적 또는 구조적인 변형이 용이하여 특정 대역에 대한 안테나 특성의 변경이 자유로운 특징이 있다. 이를 통해, 대역 특성에 최적화된 안테나를 용이하게 제공할 수 있다.In addition, the three-dimensional structure 100 is simply characterized in that the length, area or structural deformation is easy to change the characteristics of the antenna for a particular band is free. Through this, it is possible to easily provide an antenna optimized for the band characteristics.
뿐만 아니라, 상기 입체구조물(100) 제작시 회로 기판(300)과의 이격 정도는 상기 회로 기판(300)과 단말기의 케이스 사이에 형성되는 공간을 이용하여 입체구조물(100)의 높이나 절곡형태를 다양하게 변형할 수 있으므로, 다양한 대역 특성에 최적화되도록 모양을 다양하게 가변할 수 있다.In addition, the degree of separation from the circuit board 300 when manufacturing the three-dimensional structure 100 varies the height or bending shape of the three-dimensional structure 100 by using a space formed between the circuit board 300 and the case of the terminal. The shape may be variously changed to be optimized for various band characteristics.
더하여, 상기 표면실장형 안테나부는 도 2(b)에 도시된 바와 같이 복수의 상기 입체구조물(100)로 구성될 수 있으며, 대역 특성에 최적화되도록 상기 입체구조물(100)의 수를 조절하여 서로 다른 안테나 패턴(200) 사이를 연결하도록 배치할 수 있다.In addition, the surface mount antenna unit may be composed of a plurality of the three-dimensional structure 100, as shown in Figure 2 (b), by adjusting the number of the three-dimensional structure 100 to optimize the band characteristics different It may be arranged to connect between the antenna pattern 200.
이와 같은 표면실장형 안테나부를 구성하는 입체구조물의 구성을 도 3을 통해 상세히 살펴보면, 도 3(a)는 상기 표면실장형 안테나부를 구성하는 상기 입체구조물의 기본 형태를 도시한 도면으로서, 상술한 바와 같이 상기 입체구조물(100)은 서로 다른 안테나 패턴(200)을 상호 연결하여 주파수 대역특성에 대한 길이 보상이 이루어짐과 동시에, 상기 입체구조물의 일부분이 회로 기판(300)과 이격되어 방사효율이 높아지므로 안테나의 성능이 개선된다.Looking at the configuration of the three-dimensional structure constituting such a surface-mounted antenna portion in detail with reference to Figure 3, Figure 3 (a) is a view showing the basic shape of the three-dimensional structure constituting the surface-mounted antenna portion, as described above As described above, the three-dimensional structure 100 interconnects different antenna patterns 200 to compensate for the frequency band characteristics, and at the same time, a portion of the three-dimensional structure is spaced apart from the circuit board 300 to increase radiation efficiency. The performance of the antenna is improved.
또한, 도 3(b)에 도시된 바와 같이 상기 입체구조물(100)은 일부분의 면적을 연장한 방사영역 확장부(110)를 더 포함하여 방사면적을 넓게 보장함으로써, 방사효율을 증가시킴과 동시에 대역폭을 확장시킬수도 있다.In addition, as shown in FIG. 3 (b), the three-dimensional structure 100 further includes a radiation area extension 110 extending a part of the area to ensure a wide radiation area, thereby increasing radiation efficiency. It can also increase bandwidth.
더하여, 도 3(c)에 도시된 바와 같이, 대역특성에 따라 상기 입체구조물(100)의 방사부분을 지그재그로 구성하여 길이를 길게 제작할 수 있고, 이를 통해 도 3(a)의 입체구조물(100)과 동일한 공간을 차지하면서도 상이한 대역에 대응되는 안테나 길이를 보장하여 안테나 성능을 개선시킬 수 있다.In addition, as shown in Figure 3 (c), the radiation portion of the three-dimensional structure 100 in accordance with the band characteristics can be produced by zigzag long length, through which the three-dimensional structure 100 of Figure 3 (a) The antenna performance can be improved by ensuring the antenna length corresponding to different bands while occupying the same space as).
한편, 도 4는 본 발명에 따른 상기 표면실장형 안테나부를 구성하는 상기 입체구조물이 상기 회로 기판(300)에 형성된 서로 다른 안테나 패턴(200)을 선택적으로 상호 연결하여 원하는 대역을 수신하는 다양한 실시예를 도시한 도면으로서, 도 4(a)에 도시된 입체구조물(100)은 도 3에 도시된 입체구조물(100)과 달리 세 개의 연결단(120)을 구비하여 대역 특성에 대응되도록 서로 다른 안테나 패턴(200)을 상호 연결할 수 있다.Meanwhile, FIG. 4 illustrates various embodiments in which the three-dimensional structure constituting the surface mount antenna unit according to the present invention selectively interconnects different antenna patterns 200 formed on the circuit board 300 to receive a desired band. As shown in FIG. 4A, the three-dimensional structure 100 illustrated in FIG. 4A has three connection terminals 120 different from the three-dimensional structure 100 illustrated in FIG. Pattern 200 may be interconnected.
또한, 도 4(b)에 도시된 바와 같이 상기 입체구조물의 세 개의 연결단(120) 중 일단이 다른 일단과 인접하도록 배치하여 인접 안테나 패턴(200) 사이의 커플링을 유도하여 대역특성에 최적화된 기판형 내장 안테나로 동작하도록 할 수 있으며, 도 4(c)에 도시된 바와 같이 네 개의 연결단(120)을 구비하여 상기 기판형 내장 안테나의 특성을 변경할 수도 있다.In addition, as shown in FIG. 4 (b), one end of the three connection ends 120 of the three-dimensional structure is disposed to be adjacent to the other end to induce coupling between adjacent antenna patterns 200 to optimize the band characteristics. As shown in FIG. 4C, four connection terminals 120 may be used to change characteristics of the on-board antenna.
뿐만 아니라, 상술한 바와 같이 상기 입체구조물의 상기 회로 기판(300)에 대한 연결단(120)을 제외한 나머지 방사부분에 대한 이격거리를 조절하여 상기 기판형 내장 안테나의 대역 특성을 변경할 수도 있다. 이때, 상기 이격거리는 상기 회로 기판과 단말기의 외부 케이스 사이의 공간 내에서 자유로이 조절될 수 있어 안테나 설계의 자율성을 보장한다.In addition, as described above, the band characteristics of the built-in antenna may be changed by adjusting the separation distance of the remaining radiating portion except for the connection end 120 to the circuit board 300 of the three-dimensional structure. At this time, the separation distance can be freely adjusted in the space between the circuit board and the outer case of the terminal to ensure the autonomy of the antenna design.
더하여, 도 5에 도시된 바와 같이 상기 표면실장형 안테나부는 회로 기판(300)에 형성된 서로 다른 안테나 패턴(200)을 연결하며 서로 이격되어 실장된 복수의 입체구조물(100)을 상호 연결하는 연장부(130)를 더 포함할 수 있으며, 상기 연장부(130) 역시 입체구조물(100)과 동일하게 방사체로 구성되어 안테나의 대역폭을 확장시키거나 상기 입체구조물(100)과 더불어 대역특성에 최적화된 복합적인 구조를 제공할 수 있다.In addition, as shown in FIG. 5, the surface mount antenna unit connects different antenna patterns 200 formed on the circuit board 300 and extends the interconnected plurality of three-dimensional structures 100 spaced apart from each other. It may further include a 130, the extension portion 130 is also composed of a radiator in the same manner as the three-dimensional structure 100 to extend the bandwidth of the antenna or in combination with the three-dimensional structure 100 optimized for band characteristics Can provide a constructive structure.
상술한 바와 같은 입체구조물은 모두 방사체만으로 구성되며 크기 및 부피가 작아 프레스, 금형, 다이캐스팅 또는 몰딩 등과 같은 대량생산에 적합한 제조방식을 그대로 적용할 수 있어 제조비용을 크게 절감할 수 있어 수율을 크게 향상시킬 수 있다. 다시말해, 상기 입체 구조물은 소형 구조를 통해 SMD 장비 적용이 가능하며, 상기 SMD에 적용되는 릴형 패키징이 가능하므로 대량생산을 용이하게 한다. 더하여, 범용 SMD 라인에도 용이하게 적용이 가능하다.All three-dimensional structures as described above are composed of only the radiator, and the size and volume of the three-dimensional structure can be applied to a manufacturing method suitable for mass production such as press, mold, die casting, or molding as it is, so that manufacturing cost can be greatly reduced, thereby greatly improving yield. You can. In other words, the three-dimensional structure can be applied to SMD equipment through a compact structure, reel-type packaging is applied to the SMD facilitates mass production. In addition, it can be easily applied to general-purpose SMD lines.
도 6은 정재파비(VSWR)를 도시한 도면으로서, 도 6(a)는 기존 평면 안테나의 정재파비이며, 도 6(b)는 본 발명에 따른 표면실장형 안테나부를 포함한 기판형 내장 안테나의 정재파비(VSWR)를 나타낸다. 도시된 바와 같이, 본 발명에 따른 표면실장형 안테나부를 포함한 기판형 내장 안테나의 정재파비가 기존 평면 안테나의 정재파비보다 높게 나타나는 것을 알 수 있으며, 이는 상기 적어도 하나 이상의 입체구조물로 구성된 표면실장형 안테나부가 외부로부터 간섭 또는 유입되는 신호와 접지의 영향을 최소화하여 전체적인 안테나 성능을 개선시키고 있음을 알 수 있다.6 is a view showing a standing wave ratio (VSWR), Figure 6 (a) is a standing wave ratio of a conventional planar antenna, Figure 6 (b) is a standing wave of a substrate-type built-in antenna including a surface-mounted antenna unit according to the present invention Ratio (VSWR). As shown, it can be seen that the standing wave ratio of the substrate-type built-in antenna including the surface-mounted antenna unit according to the present invention is higher than the standing wave ratio of the conventional planar antenna, which is a surface-mounted antenna unit consisting of the at least one three-dimensional structure It can be seen that the antenna performance is improved by minimizing the effects of interference or incoming signals and ground from the outside.
또한, 도 7은 안테나 이득과 그에 따른 안테나 효율을 도시한 표로서 도 7(a)는 기존 평면안테나에 대한 것이며, 도 7(b)는 본 발명에 따른 표면실장형 안테나부를 포함한 기판형 내장 안테나에 대한 것이다.In addition, Figure 7 is a table showing the antenna gain and antenna efficiency according to Figure 7 (a) is for the conventional planar antenna, Figure 7 (b) is a substrate-type built-in antenna including a surface mount antenna unit according to the present invention It is about.
도시된 표에 나타난 바와 같이, 본 발명에 따른 표면실장형 안테나부를 포함한 기판형 내장 안테나는 기존 평면 안테나보다 상술한 도 6과 같은 이유로 인해 안테나 이득이 높으며, 일정한 안테나 이득을 보장하는 것을 알 수 있다. 이에 따른 안테나 효율면에서 기존 평면 안테나보다 높은 성능을 보장하는 것을 알 수 있다.As shown in the illustrated table, the substrate-type embedded antenna including the surface-mounted antenna unit according to the present invention can be seen that the antenna gain is higher due to the same reason as in FIG. . Accordingly, it can be seen that the antenna efficiency is higher than that of the conventional planar antenna.
이와 같이 본 발명에 따른 기판형 내장 안테나의 표면실장형 안테나부는 평면 안테나 패턴의 일부를 입체구조물로 대체하여 안테나 특성을 변경하는 단말기 내의 내부신호의 유입, 간섭 또는 접지에 따른 신호의 손실을 최소화하여, 안테나 성능을 크게 개선시킬 수 있으며, 이러한 역할을 수행하는 상기 입체구조물이 표면실장형 소자로서 적용되어 대량생산이 용이하므로 기존 입체 안테나가 가지는 문제점을 해결할 수 있다.As described above, the surface mount antenna unit of the board-type built-in antenna according to the present invention replaces a part of the planar antenna pattern with a three-dimensional structure to minimize the loss of the signal due to the inflow, interference, or ground of the internal signal in the terminal that changes the antenna characteristics. In addition, the antenna performance can be greatly improved, and the three-dimensional structure that performs this role can be applied as a surface-mounted device, thereby easily mass-producing a problem of the existing three-dimensional antenna.

Claims (11)

  1. 기판에 설치되는 표면실장형 안테나부를 포함한 기판형 내장 안테나에 있어서,In the board-type built-in antenna including a surface-mounted antenna unit provided on the board,
    안테나 패턴이 형성된 회로기판; 및A circuit board on which an antenna pattern is formed; And
    상기 회로 기판에 서로 다른 상기 안테나 패턴을 연결하도록 표면실장되며, 금속 방사체만으로 구성된 적어도 하나 이상의 입체구조물을 포함하는 표면실장형 안테나부Surface-mounted antenna unit which is surface-mounted to connect the different antenna patterns to the circuit board, and includes at least one three-dimensional structure composed only of metal radiators
    를 포함하는 표면실장형 안테나부를 포함한 기판형 내장 안테나.Substrate-type built-in antenna including a surface-mounted antenna unit comprising a.
  2. 청구항 1에 있어서,The method according to claim 1,
    상기 입체구조물은 전개된 도전 금속을 절곡하여 대역특성을 가지도록 하는 것을 특징으로 하는 표면실장형 안테나부를 포함한 기판형 내장 안테나.The three-dimensional structure is a substrate-type built-in antenna including a surface-mounted antenna portion, characterized in that to have a band characteristic by bending the conductive metal deployed.
  3. 청구항 1에 있어서,The method according to claim 1,
    상기 입체구조물은 일부분이 상기 회로기판과 이격되어 구성되는 것을 특징으로 하는 표면실장형 안테나부를 포함한 기판형 내장 안테나.The three-dimensional structure is a substrate type embedded antenna including a surface-mounted antenna portion, characterized in that the portion is configured to be spaced apart from the circuit board.
  4. 청구항 3에 있어서,The method according to claim 3,
    상기 입체구조물은 대역특성에 따라 상기 일부분에 연장되는 방사영역 확장부를 더 포함하는 것을 특징으로 하는 표면실장형 안테나부를 포함한 기판형 내장 안테나.The three-dimensional structure is a substrate-type embedded antenna including a surface-mounted antenna unit further comprises a radiation area extension extending to the portion in accordance with the band characteristics.
  5. 청구항 1에 있어서,The method according to claim 1,
    상기 표면실장형 안테나부에 포함된 상기 입체 구조물 각각은 대역특성에 최적화되도록 길이 또는 면적을 조절하여 서로 다른 입체 형상을 가지는 것을 특징으로 하는 표면실장형 안테나부를 포함한 기판형 내장 안테나.Each of the three-dimensional structures included in the surface mount antenna unit is a substrate-type embedded antenna including a surface-mounted antenna unit, characterized in that having a different three-dimensional shape by adjusting the length or area to optimize the band characteristics.
  6. 청구항 1에 있어서,The method according to claim 1,
    상기 표면 실장형 안테나부는 대역특성에 따라 서로 다른 상기 입체구조물을 상호 연결하는 연장부를 더 포함하는 것을 특징으로 하는 표면실장형 안테나부를 포함한 기판형 내장 안테나.And the surface mount antenna unit further comprises an extension unit interconnecting the three-dimensional structures different from each other according to band characteristics.
  7. 청구항 1에 있어서,The method according to claim 1,
    상기 입체구조물은 적어도 두개 이상의 연결단을 포함하여, 상기 각 연결단과 서로 다른 안테나 패턴의 일단을 상호 연결하는 것을 특징으로 하는 표면실장형 안테나부를 포함한 기판형 내장 안테나.The three-dimensional structure includes at least two connection ends, the substrate-type embedded antenna including a surface-mounted antenna unit, characterized in that for connecting each of the connection end and one end of a different antenna pattern.
  8. 기판에 설치되는 표면실장형 안테나부를 포함한 기판형 내장 안테나의 제조 방법에 있어서,In the manufacturing method of a board-type built-in antenna including a surface-mounted antenna portion provided on the board
    회로 기판에 안테나 패턴을 형성하는 제 1단계; 및A first step of forming an antenna pattern on a circuit board; And
    대역특성에 따라 금속 방사체만으로 구성된 적어도 하나 이상의 입체구조물을 상기 회로 기판에 서로 다른 상기 안테나 패턴을 연결하도록 표면실장하는 제 2단계A second step of surface-mounting at least one three-dimensional structure consisting of only metal radiators according to band characteristics to connect the different antenna patterns to the circuit board;
    를 포함하는 표면실장형 안테나부를 포함한 기판형 내장 안테나의 제조방법.Method of manufacturing a substrate-type built-in antenna including a surface-mounted antenna unit comprising a.
  9. 청구항 8에 있어서,The method according to claim 8,
    대역특성에 따라 서로 다른 상기 입체구조물을 상호 연결하는 연장부를 상기 회로 회판과 이격되도록 구성하는 제 3단계A third step of configuring an extension part which interconnects the three-dimensional structures different from each other according to a band characteristic to be spaced apart from the circuit board
    를 더 포함하는 표면실장형 안테나부를 포함한 기판형 내장 안테나의 제조방법.Method of manufacturing a substrate-type built-in antenna including a surface-mounted antenna portion further comprising.
  10. 청구항 8에 있어서,The method according to claim 8,
    상기 제 2단계는 상기 입체구조물의 길이 또는 면적을 조절하여 대역 특성을 결정하는 것을 특징으로 하는 표면실장형 안테나부를 포함한 기판형 내장 안테나의 제조방법.The second step is a method of manufacturing a substrate-type embedded antenna including a surface-mounted antenna unit, characterized in that for determining the band characteristics by adjusting the length or area of the three-dimensional structure.
  11. 청구항 8에 있어서,The method according to claim 8,
    상기 제 2단계는 상기 입체구조물의 일부분이 상기 회로 기판과 이격되도록 표면실장하는 것을 특징으로 하는 표면실장형 안테나부를 포함한 기판형 내장 안테나의 제조방법.The second step is a surface-mounted antenna manufacturing method including a surface-mounted antenna portion, characterized in that the surface mount so that a portion of the three-dimensional structure is spaced apart from the circuit board.
PCT/KR2011/004736 2010-06-29 2011-06-29 Board-type built-in antenna comprising a surface-mounted antenna unit, and method for manufacturing same WO2012002718A2 (en)

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