WO2012012056A3 - Substrate holder to reduce substrate edge stress during chemical mechanical polishing - Google Patents

Substrate holder to reduce substrate edge stress during chemical mechanical polishing Download PDF

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Publication number
WO2012012056A3
WO2012012056A3 PCT/US2011/040745 US2011040745W WO2012012056A3 WO 2012012056 A3 WO2012012056 A3 WO 2012012056A3 US 2011040745 W US2011040745 W US 2011040745W WO 2012012056 A3 WO2012012056 A3 WO 2012012056A3
Authority
WO
WIPO (PCT)
Prior art keywords
substrate
reduce
chemical mechanical
mechanical polishing
stress during
Prior art date
Application number
PCT/US2011/040745
Other languages
French (fr)
Other versions
WO2012012056A2 (en
Inventor
Hung Chih Chen
Samuel Chu-Chiang Hsu
Gautam Shashank
Denis M. Koosau
Original Assignee
Applied Materials, Inc.
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Applied Materials, Inc. filed Critical Applied Materials, Inc.
Priority to CN2011800073717A priority Critical patent/CN102725829A/en
Priority to JP2013520712A priority patent/JP2013531396A/en
Priority to KR1020127021054A priority patent/KR20130088739A/en
Publication of WO2012012056A2 publication Critical patent/WO2012012056A2/en
Publication of WO2012012056A3 publication Critical patent/WO2012012056A3/en

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer or carrier concentration layer
    • H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic System or AIIIBV compounds with or without impurities, e.g. doping materials
    • H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
    • H01L21/302—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to change their surface-physical characteristics or shape, e.g. etching, polishing, cutting
    • H01L21/304—Mechanical treatment, e.g. grinding, polishing, cutting
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B24B37/27—Work carriers
    • B24B37/30—Work carriers for single side lapping of plane surfaces
    • B24B37/32—Retaining rings

Abstract

Embodiments of the present invention generally relate to methods for chemical mechanical polishing a substrate. The methods generally include coupling a first substrate to be polished to a dummy substrate, and removing a portion of the backside of the first substrate to reduce the thickness of the first substrate. The first substrate and the dummy substrate are positioned in a carrier head assembly comprising an inflatable membrane and a support ring. The first substrate is placed in contact with a polishing pad to reduce the surface roughness of the backside of the first substrate. The support ring restricts lateral movement of the inflatable membrane to prevent the first substrate from contacting an interior surface of the carrier head assembly. The support ring is sized to allow vertical movement of the inflatable membrane within the carrier head assembly.
PCT/US2011/040745 2010-07-20 2011-06-16 Substrate holder to reduce substrate edge stress during chemical mechanical polishing WO2012012056A2 (en)

Priority Applications (3)

Application Number Priority Date Filing Date Title
CN2011800073717A CN102725829A (en) 2010-07-20 2011-06-16 Substrate holder to reduce substrate edge stress during chemical mechanical polishing
JP2013520712A JP2013531396A (en) 2010-07-20 2011-06-16 Substrate holder for reducing stress at the substrate edge during chemical mechanical polishing
KR1020127021054A KR20130088739A (en) 2010-07-20 2011-06-16 Substrate holder to reduce substrate edge stress during chemical mechanical polishing

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US12/840,195 US20120021673A1 (en) 2010-07-20 2010-07-20 Substrate holder to reduce substrate edge stress during chemical mechanical polishing
US12/840,195 2010-07-20

Publications (2)

Publication Number Publication Date
WO2012012056A2 WO2012012056A2 (en) 2012-01-26
WO2012012056A3 true WO2012012056A3 (en) 2012-04-12

Family

ID=45494017

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/US2011/040745 WO2012012056A2 (en) 2010-07-20 2011-06-16 Substrate holder to reduce substrate edge stress during chemical mechanical polishing

Country Status (6)

Country Link
US (1) US20120021673A1 (en)
JP (1) JP2013531396A (en)
KR (1) KR20130088739A (en)
CN (1) CN102725829A (en)
TW (1) TW201220381A (en)
WO (1) WO2012012056A2 (en)

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US9873179B2 (en) * 2016-01-20 2018-01-23 Applied Materials, Inc. Carrier for small pad for chemical mechanical polishing
US11298794B2 (en) * 2019-03-08 2022-04-12 Applied Materials, Inc. Chemical mechanical polishing using time share control

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6409583B1 (en) * 1999-05-07 2002-06-25 Tokyo Seimtsu Co., Ltd. Apparatus for polishing wafers
US20020115397A1 (en) * 2000-05-12 2002-08-22 Jiro Kajiwara System and method for CMP head having multi-pressure annular zone subcarrier material removal control
US20030079836A1 (en) * 2001-10-31 2003-05-01 Juen-Kuen Lin Carrier head for chemical mechanical polishing
US20040002291A1 (en) * 2002-06-28 2004-01-01 Lam Research Corp. Partial-membrane carrier head

Family Cites Families (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5820448A (en) * 1993-12-27 1998-10-13 Applied Materials, Inc. Carrier head with a layer of conformable material for a chemical mechanical polishing system
US5993302A (en) * 1997-12-31 1999-11-30 Applied Materials, Inc. Carrier head with a removable retaining ring for a chemical mechanical polishing apparatus
US6436228B1 (en) * 1998-05-15 2002-08-20 Applied Materials, Inc. Substrate retainer
US6450868B1 (en) * 2000-03-27 2002-09-17 Applied Materials, Inc. Carrier head with multi-part flexible membrane
CN100433269C (en) * 2000-05-12 2008-11-12 多平面技术公司 Pneumatic diaphragm head having independent retaining ring and multi-region pressure control, and method to use the same
US6558232B1 (en) * 2000-05-12 2003-05-06 Multi-Planar Technologies, Inc. System and method for CMP having multi-pressure zone loading for improved edge and annular zone material removal control

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6409583B1 (en) * 1999-05-07 2002-06-25 Tokyo Seimtsu Co., Ltd. Apparatus for polishing wafers
US20020115397A1 (en) * 2000-05-12 2002-08-22 Jiro Kajiwara System and method for CMP head having multi-pressure annular zone subcarrier material removal control
US20030079836A1 (en) * 2001-10-31 2003-05-01 Juen-Kuen Lin Carrier head for chemical mechanical polishing
US20040002291A1 (en) * 2002-06-28 2004-01-01 Lam Research Corp. Partial-membrane carrier head

Also Published As

Publication number Publication date
WO2012012056A2 (en) 2012-01-26
TW201220381A (en) 2012-05-16
KR20130088739A (en) 2013-08-08
JP2013531396A (en) 2013-08-01
US20120021673A1 (en) 2012-01-26
CN102725829A (en) 2012-10-10

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