WO2012007995A1 - Transmission unit, supplementary member used for transmission unit, and test equipment - Google Patents

Transmission unit, supplementary member used for transmission unit, and test equipment Download PDF

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Publication number
WO2012007995A1
WO2012007995A1 PCT/JP2010/004583 JP2010004583W WO2012007995A1 WO 2012007995 A1 WO2012007995 A1 WO 2012007995A1 JP 2010004583 W JP2010004583 W JP 2010004583W WO 2012007995 A1 WO2012007995 A1 WO 2012007995A1
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WO
WIPO (PCT)
Prior art keywords
transmission unit
reference potential
signal
side parallel
signal transmission
Prior art date
Application number
PCT/JP2010/004583
Other languages
French (fr)
Japanese (ja)
Inventor
伸 崎山
Original Assignee
株式会社アドバンテスト
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 株式会社アドバンテスト filed Critical 株式会社アドバンテスト
Priority to PCT/JP2010/004583 priority Critical patent/WO2012007995A1/en
Priority to KR1020117013661A priority patent/KR101230297B1/en
Priority to JP2011523642A priority patent/JPWO2012007995A1/en
Priority to TW100120405A priority patent/TWI429927B/en
Publication of WO2012007995A1 publication Critical patent/WO2012007995A1/en

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    • GPHYSICS
    • G01MEASURING; TESTING
    • G01RMEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R31/00Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
    • G01R31/28Testing of electronic circuits, e.g. by signal tracer
    • G01R31/2851Testing of integrated circuits [IC]
    • G01R31/2886Features relating to contacting the IC under test, e.g. probe heads; chucks
    • GPHYSICS
    • G01MEASURING; TESTING
    • G01RMEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R31/00Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
    • G01R31/28Testing of electronic circuits, e.g. by signal tracer
    • HELECTRICITY
    • H03ELECTRONIC CIRCUITRY
    • H03HIMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS; RESONATORS
    • H03H7/00Multiple-port networks comprising only passive electrical elements as network components
    • H03H7/38Impedance-matching networks
    • GPHYSICS
    • G01MEASURING; TESTING
    • G01RMEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R1/00Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
    • G01R1/02General constructional details
    • G01R1/06Measuring leads; Measuring probes
    • G01R1/067Measuring probes
    • G01R1/06772High frequency probes
    • GPHYSICS
    • G01MEASURING; TESTING
    • G01RMEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R31/00Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
    • G01R31/28Testing of electronic circuits, e.g. by signal tracer
    • G01R31/282Testing of electronic circuits specially adapted for particular applications not provided for elsewhere
    • G01R31/2822Testing of electronic circuits specially adapted for particular applications not provided for elsewhere of microwave or radiofrequency circuits

Definitions

  • the present invention relates to a transmission unit, an additional member used for the transmission unit, and a test apparatus.
  • test apparatus for testing a device under test such as a semiconductor circuit is known.
  • the test apparatus electrically connects a test board on which a test circuit is provided and a device board on which a device under test is placed via a connector (see, for example, Patent Document 1).
  • Patent Document 1 Japanese Patent Application Laid-Open No. 2008-224591
  • the inductance component of the terminal cannot be ignored.
  • a capacitance component that cancels out the inductance component is provided on a test board or the like, thereby matching the impedance of the transmission system to a predetermined value.
  • the capacitance component is provided on a test board or the like at the end of the transmission system and is not evenly distributed in the transmission system, when the signal transmitted through the transmission system becomes a high frequency, the inductance component and the capacitance component signal are converted. The effect of each appears.
  • a transmission unit that transmits an electric signal, the signal transmission unit that transmits the electric signal, and the signal transmission unit that is provided in parallel with the reference potential are provided.
  • the reference potential unit is electrically connected to the reference potential unit at at least two connection points provided apart from each other, and at least a part of the signal transmission unit is connected to the signal transmission unit from the reference potential unit.
  • a conductor extending to the upper side in a second direction perpendicular to the first direction, and at least two connection points are formed in the conductor and provide a transmission unit that is detachably in contact with the reference potential portion To do.
  • FIG. 2 shows a configuration example of a test apparatus 100.
  • An example of the side view of the transmission unit 50 is shown.
  • An example of a top view of the transmission unit 50 is shown.
  • An example of a cross-sectional view of the transmission unit 50 is shown.
  • An example of the equivalent circuit of the transmission unit 50 is shown.
  • the structural example of the conductor 60 is shown.
  • An example of a cross-sectional view of the housing 80 that holds the conductor 60 in a state of being in contact with the reference potential portion 52 is shown.
  • An example of a top view of the housing 80 is shown.
  • An example of the side view of the partition wall 86 provided in the housing 80 is shown.
  • An example of the perspective view of the housing 80 in which the reference electric potential part 52, the signal transmission part 54, and the conductor 60 were inserted is shown.
  • region 82 is shown.
  • region 84 is shown.
  • a top view of another structural example of the conductor 60 is shown.
  • Another structural example of the housing 80 is shown.
  • the side view of the partition 86 in the housing 80 shown in FIG. 9 is shown.
  • An arrangement example of a plurality of transmission units 50 is shown.
  • FIG. 1 shows a configuration example of the test apparatus 100.
  • the test apparatus 100 is an apparatus for testing a device under test 200 such as a semiconductor circuit, and includes a test head 30, a motherboard 20, and a device board 10.
  • the device board 10 mounts the device under test 200.
  • the motherboard 20 electrically connects the device board 10 and the test head 30.
  • the motherboard 20 includes a terminal 14 that is electrically connected to the terminal 12 provided on the device board 10, and a terminal 16 that is electrically connected to the terminal 18 provided on the test head 30.
  • the test head 30 is electrically connected to the device under test 200 via the mother board 20 and the device board 10.
  • the test head 30 supplies a test signal having a predetermined logic pattern, power supply power, and the like to the device under test 200.
  • the test head 30 measures a signal output from the device under test 200.
  • test boards 40 Inside the test head 30 are stored a plurality of test boards 40 provided with a test circuit for generating a test signal or the like, or a test circuit for measuring a signal output from the device under test 200.
  • Each test board 40 has a terminal 42.
  • the terminal 42 is electrically connected to the corresponding terminal 18 of the test head 30 via the transmission unit 50.
  • the transmission unit 50 transmits an electrical signal or power between the terminal 18 and the terminal 42.
  • FIG. 2A shows an example of a side view of the transmission unit 50.
  • FIG. 2B shows an example of a top view of the transmission unit 50.
  • FIG. 2C shows an example of a cross-sectional view of the transmission unit 50.
  • the transmission unit 50 includes a reference potential unit 52, a signal transmission unit 54, and a conductor 60.
  • the signal transmission unit 54 transmits an electrical signal between the terminal 42 and the terminal 18.
  • the signal transmission unit 54 may be a transmission path in which the vicinity of both ends is electrically connected to the terminal 42 and the terminal 18.
  • the reference potential section 52 is provided between the terminal 42 and the terminal 18 in parallel with the signal transmission section 54, and is supplied with a reference potential.
  • the reference potential may be a ground potential.
  • a reference potential may be applied to the reference potential unit 52 from the terminal 42 or the terminal 18.
  • the reference potential unit 52 is provided in the vicinity of the signal transmission unit 54.
  • the reference potential unit 52 may be provided at a distance of several mm from the signal transmission unit 54, and more preferably at a distance of 1 mm or less from the signal transmission unit 54.
  • the transmission unit 50 may have a connector part that detachably fixes the reference potential part 52 and the signal transmission part 54 to the terminal 18 and the terminal 42, respectively.
  • the conductor 60 is electrically connected to the reference potential portion 52 at at least two connection points 62 that are provided apart from each other.
  • the conductor 60 of this example is electrically connected to the reference potential portion 52 at two connection points 62 provided near both ends.
  • the conductor 60 extends to the upper side in the second direction perpendicular to the first direction from the reference potential unit 52 toward the signal transmission unit 54 with respect to at least a part of the signal transmission unit 54.
  • the conductor 60 of this example includes a reference side parallel part 64, a signal side parallel part 68, and an extending part 66.
  • the reference side parallel part 64 is provided on the upper side in the second direction with respect to the reference potential part 52.
  • the reference-side parallel part 64 is provided between the terminal 42 and the terminal 18 in parallel with the reference potential part 52. Further, the reference side parallel part 64 is electrically connected to the reference potential part 52 by two connection points 62 provided at both ends.
  • connection points 62 are formed integrally with the reference side parallel part 64 in the conductor 60. Each connection point 62 may contact the reference potential portion 52 in a separable manner.
  • the transmission unit 50 may further include a housing that holds the conductor 60 in contact with the reference potential portion 52 via the connection point 62.
  • the signal side parallel part 68 is provided on the upper side in the second direction with respect to at least a part of the signal transmission part 54.
  • the signal side parallel part 68 is provided between the terminal 42 and the terminal 18 in parallel with the at least part of the reference side parallel part 64 and the signal transmission part 54.
  • the length of the signal side parallel part 68 may be the same as the length of the reference side parallel part 64.
  • the extending portion 66 is provided so as to extend from the reference side parallel portion 64 to the signal side parallel portion 68 in a partial region between the reference side parallel portion 64 and the signal side parallel portion 68.
  • the side parallel part 68 is electrically connected.
  • the extending portion 66 of this example is provided by extending so as to join one end of the reference side parallel portion 64 and one end of the signal side parallel portion 68.
  • stretching part 66 is provided is not limited to the said area
  • the extending portion 66 may be provided so as to extend both ends of the reference side parallel portion 64 and both ends of the signal side parallel portion 68.
  • the reference side parallel part 64, the signal side parallel part 68, and the extending part 66 may be formed in a single plate shape.
  • the signal side parallel part 68 may be formed so as to cover the signal transmission part 54 in the second direction over a predetermined section of the signal transmission part 54.
  • the section may occupy more than half of the section between the terminal 42 and the terminal 18.
  • the distance between the signal side parallel part 68 and the signal transmission part 54 in the second direction may be smaller than the distance between the reference potential part 52 and the signal transmission part 54 in the first direction.
  • a predetermined capacity component can be distributed to the signal transmission unit 54 over a predetermined section of the signal transmission unit 54. For this reason, even when the inductance component of the signal transmission unit 54 is relatively large, the impedance of the signal transmission unit 54 can be matched to a high-frequency signal.
  • FIG. 3 shows an example of an equivalent circuit of the transmission unit 50.
  • the signal transmission unit 54 and the reference potential unit 52 have an inductance component 70 corresponding to the length thereof.
  • the predetermined capacitance component 72 can be distributed over a predetermined section. For this reason, the inductance component 70 can be canceled by the capacitance component 72 even when a high-frequency signal is transmitted.
  • the inductance component 74 indicates the inductance component of the conductor 60.
  • FIG. 4 shows a structural example of the conductor 60.
  • both ends of the reference side parallel part 64 are formed to bend in the direction toward the reference potential part 52. Accordingly, both ends of the reference side parallel part 64 have elasticity in a direction toward the reference potential part 52.
  • the curved portions at both ends of the reference side parallel part 64 function as the connection point 62 by being pressed in the direction toward the reference potential part 52.
  • the signal side parallel part 68 may have a substantially flat plate shape. When the signal transmission unit 54 and the reference potential unit 52 are curved, the signal side parallel unit 68 and the reference side parallel unit 68 may be curved along the signal transmission unit 54 and the reference potential unit 52.
  • both ends of the reference potential portion 52 is not limited to the shape shown in FIG. In the example shown in FIG. 4, both ends of the reference potential portion 52 are folded back in the direction opposite to the extending direction of the reference potential portion 52. In other examples, both ends of the reference potential portion 52 are connected to the reference potential portion 52. It may be curved in the direction toward the reference potential section 52 without being folded back in the direction opposite to the extending direction. More specifically, the reference potential unit 52 may have a region in which the distance from the reference potential unit 52 becomes closer as approaching both ends.
  • FIG. 5A shows an example of a cross-sectional view of the housing 80 that holds the conductor 60 in contact with the reference potential portion 52.
  • FIG. 5B shows an example of a top view of the housing 80.
  • FIG. 5C shows an example of a side view of the partition wall 86 provided in the housing 80.
  • the housing 80 is fixed to the reference potential section 52 and the signal transmission section 54, and the conductor 60 is inserted to press and contact each connection point 62 to the reference potential section 52.
  • the housing 80 has an insertion hole through which the reference potential portion 52 and the signal transmission portion 54 penetrate along the bottom surface, and the reference side parallel portion 64 and the signal side parallel portion 68 are inserted along the top surface.
  • the insertion hole is separated into a reference side region 82 and a signal side region 84 by a partition wall 86.
  • the reference potential portion 52 penetrates along the bottom surface, and the reference side parallel portion 64 is inserted along the top surface.
  • the signal transmission unit 54 penetrates along the bottom surface, and the signal side parallel portion 68 is inserted along the top surface.
  • the partition wall 86 is formed from the bottom surface to the top surface of the insertion hole substantially at the center of the insertion hole over the entire length of the housing 80. However, the partition wall 86 is not formed in the region where the extending portion 66 is inserted. That is, the partition wall 86 has a cutout portion 88 having substantially the same shape as the extending portion 66 in a region where the extending portion 66 is inserted. Accordingly, the partition wall 86 at one end of the insertion hole is formed with a gap with respect to the upper surface of the insertion hole.
  • FIG. 6 shows an example of a perspective view of the housing 80 in which the reference potential section 52, the signal transmission section 54, and the conductor 60 are inserted.
  • the reference potential portion 52 penetrates the housing 80 along the bottom surface of the reference side region 82.
  • the signal transmission unit 54 penetrates the housing 80 along the bottom surface of the signal side region 84.
  • the reference side parallel part 64 and the signal side parallel part 68 are inserted along the upper surfaces of the reference side region 82 and the signal side region 84. Further, the extending portion 66 is inserted into the notch 88 shown in FIG. 5C. The conductor 60 is inserted into the housing 80 from the side where the notch 88 is formed, starting from the end on the side where the extending portion 66 is not formed. With such a configuration, the reference side parallel part 64 and the signal side parallel part 68 connected by the extending part 66 can be inserted into the reference side region 82 and the signal side region 84.
  • FIG. 7A shows an example of a side view of the reference side parallel part 64 inserted into the reference side region 82. Except for the vicinity of both ends of the reference side parallel part 64, the reference side parallel part 64 is arranged along the upper surface of the reference side region 82. Further, the connection points 62 near both ends of the reference side parallel part 64 are pressed in the direction of the reference potential part 52 when the reference side parallel part 64 is inserted into the reference side region 82. For example, the height of the curvature at both ends of the reference side parallel part 64 is slightly larger than the height from the upper surface of the reference potential part 52 to the upper surface of the reference side region 82.
  • the curved region at both ends of the reference side parallel part 64 have elasticity in the height direction, the curved region is compressed in the height direction by inserting the reference side parallel part 64 into the reference side region 82, and the reference potential It is pressed in the direction of the part 52.
  • FIG. 7B shows an example of a side view of the signal side parallel part 68 inserted into the signal side region 84.
  • the signal side parallel part 68 is disposed along the upper surface of the signal side parallel part 68.
  • the signal side region 84 may be provided with a holding unit that holds the signal side parallel part 68 at a predetermined distance from the signal transmission unit 54.
  • the holding portion may be a groove formed on the side surface of the signal side region 84.
  • the signal transmission unit 54 is fixed by engaging the signal transmission unit 54 with the groove.
  • FIG. 8 shows a top view of another structure example of the conductor 60.
  • the extending portion 66 is provided so as to extend both ends of the reference side parallel portion 64 and both ends of the signal side parallel portion 68. In the region other than both ends of the reference side parallel portion 64 and the signal side parallel portion 68, the extending portion 66 may not be formed.
  • the strength of the conductor 60 can be improved. Further, it is possible to prevent the signal side parallel portion 68 from becoming a stub shape and to reduce noise due to signal reflection or the like. However, when the extending portions 66 are provided at both ends of the conductor 60 as in this example, the conductor 60 cannot be inserted into the housing 80 shown in FIGS. 5A to 5C.
  • FIG. 9 shows another structural example of the housing 80.
  • the housing 80 of this example holds the conductor 60 shown in FIG.
  • the housing 80 of this example has a top member 90 and a bottom member 92.
  • the upper surfaces of the reference side region 82 and the signal side region 84 are formed.
  • the bottom surface member 92 is formed with the bottom surface and side surfaces of the reference side region 82 and the signal side region 84.
  • FIG. 10 shows a side view of the partition wall 86 in the housing 80 shown in FIG. At both ends of the partition wall 86 in this example, cutout portions 88 having substantially the same shape as the extending portions 66 at both ends of the conductor 60 shown in FIG. 8 are formed.
  • the partition wall 86 may be formed integrally with the bottom surface member 92.
  • the reference side parallel part 64 and the signal side parallel part 68 are arranged on the bottom surface member 92. Then, the conductor 60 is disposed on the bottom surface member 92 such that the extending portions 66 at both ends engage with the cutout portions 88. Then, the top member 90 is fitted to the bottom member 92. As a result, the connection point 62 of the reference side parallel part 64 is pressed against the reference potential part 52 by the upper surface member 90. With such a configuration, the conductor 60 shown in FIG. 8 can be stored in the housing 80.
  • FIG. 11 shows an arrangement example of a plurality of transmission units 50.
  • the signal side parallel part 68 of each transmission unit 50 is arranged between the signal transmission part 54 of its own transmission unit 50 and the signal transmission part 54 of any other transmission unit 50. May be. With this arrangement, the signal transmission unit 54 can be surrounded by the conductor 60 having the reference potential.
  • the conductor 60 and the housing 80 described with reference to FIGS. 1 to 11 may be additional members used in the transmission unit 50 including the signal transmission unit 54 and the reference potential unit 52.
  • the conductor 60 and the housing 80 are additional members used to improve the performance of the transmission unit 50 in the test apparatus 100 that is already in operation. Since at least two connection points 62 are detachably in contact with the reference potential unit 52, the conductor 60 and the housing 80 can be easily added to the transmission unit 50 that is already in operation. Therefore, it is possible to improve the performance of the transmission unit 50 at a lower cost than designing and manufacturing the transmission unit 50 anew.
  • connection points 62 are provided apart from each other, the connection points 62 can be easily given elasticity. For this reason, even if the connection point 62 is detachably provided to the reference potential portion 52, it is possible to prevent the reliability of the electrical connection between the reference potential portion 52 and the reference side parallel portion 64 from being lowered.
  • connection points 62 in the conductor 60 is not limited to two. More connection points 62 may be provided. However, it is preferable that the connection points 62 are provided at least at both ends of the reference side parallel portion 64. The plurality of connection points 62 may be provided at substantially equal intervals.

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  • Engineering & Computer Science (AREA)
  • General Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Tests Of Electronic Circuits (AREA)
  • Measuring Leads Or Probes (AREA)

Abstract

Provided is a transmission unit transmitting an electrical signal and comprising: a signal transmission portion for transmitting an electrical signal; a reference potential portion provided in parallel with the signal transmission portion and provided with a reference potential; and a conductor electrically connected to the reference potential portion at at least two connection points provided apart from each other and extending to the upside of at least part of the region of the signal transmission portion in a second direction perpendicular to a first direction heading from the reference potential portion toward the signal transmission portion. The at least two connection points are formed on the conductor and make contact with the reference potential portion in a separable fashion.

Description

伝送ユニット、伝送ユニットに用いる追加部材および試験装置Transmission unit, additional member used in transmission unit and test device
 本発明は、伝送ユニット、伝送ユニットに用いる追加部材および試験装置に関する。 The present invention relates to a transmission unit, an additional member used for the transmission unit, and a test apparatus.
 半導体回路等の被試験デバイスを試験する試験装置が知られている。試験装置は、試験回路が設けられるテストボードと、被試験デバイスが載置されるデバイスボードとを、コネクタを介して電気的に接続する(例えば特許文献1参照)。
 特許文献1 特開2008-224591号公報
A test apparatus for testing a device under test such as a semiconductor circuit is known. The test apparatus electrically connects a test board on which a test circuit is provided and a device board on which a device under test is placed via a connector (see, for example, Patent Document 1).
Patent Document 1 Japanese Patent Application Laid-Open No. 2008-224591
 コネクタの端子長が長い場合、端子のインダクタンス成分が無視できなくなる。従来は、当該インダクタンス成分を相殺する容量成分をテストボード等に設けることで、伝送系のインピーダンスを所定値に整合させている。しかし当該容量成分は、伝送系の端部のテストボード等に設けられ、伝送系に均等に分布していないので、伝送系を伝送する信号が高周波数になると、インダクタンス成分および容量成分の信号への影響がそれぞれあらわれてしまう。 When the connector terminal length is long, the inductance component of the terminal cannot be ignored. Conventionally, a capacitance component that cancels out the inductance component is provided on a test board or the like, thereby matching the impedance of the transmission system to a predetermined value. However, since the capacitance component is provided on a test board or the like at the end of the transmission system and is not evenly distributed in the transmission system, when the signal transmitted through the transmission system becomes a high frequency, the inductance component and the capacitance component signal are converted. The effect of each appears.
 上記課題を解決するために、本発明の態様においては、電気信号を伝送する伝送ユニットであって、電気信号を伝送する信号伝送部と、信号伝送部と平行して設けられ、基準電位が与えられる基準電位部と、互いに離間して設けられる少なくとも2つの接続点で基準電位部と電気的に接続され、且つ、信号伝送部の少なくとも一部の領域に対して、基準電位部から信号伝送部に向かう第1方向と垂直な第2方向における上側まで延伸する伝導体とを備え、少なくとも2つの接続点は、伝導体に形成され、且つ、基準電位部と分離可能に接触する伝送ユニットを提供する。 In order to solve the above-described problems, according to an aspect of the present invention, a transmission unit that transmits an electric signal, the signal transmission unit that transmits the electric signal, and the signal transmission unit that is provided in parallel with the reference potential are provided. The reference potential unit is electrically connected to the reference potential unit at at least two connection points provided apart from each other, and at least a part of the signal transmission unit is connected to the signal transmission unit from the reference potential unit. And a conductor extending to the upper side in a second direction perpendicular to the first direction, and at least two connection points are formed in the conductor and provide a transmission unit that is detachably in contact with the reference potential portion To do.
 なお、上記の発明の概要は、本発明の必要な特徴の全てを列挙したものではない。また、これらの特徴群のサブコンビネーションもまた、発明となりうる。 Note that the above summary of the invention does not enumerate all the necessary features of the present invention. In addition, a sub-combination of these feature groups can also be an invention.
試験装置100の構成例を示す。2 shows a configuration example of a test apparatus 100. 伝送ユニット50の側面図の一例を示す。An example of the side view of the transmission unit 50 is shown. 伝送ユニット50の上面図の一例を示す。An example of a top view of the transmission unit 50 is shown. 伝送ユニット50の断面図の一例を示す。An example of a cross-sectional view of the transmission unit 50 is shown. 伝送ユニット50の等価回路の一例を示す。An example of the equivalent circuit of the transmission unit 50 is shown. 伝導体60の構造例を示す。The structural example of the conductor 60 is shown. 伝導体60を基準電位部52に接触させた状態で保持するハウジング80の、断面図の一例を示す。An example of a cross-sectional view of the housing 80 that holds the conductor 60 in a state of being in contact with the reference potential portion 52 is shown. ハウジング80の上面図の一例を示す。An example of a top view of the housing 80 is shown. ハウジング80に設けられる隔壁86の側面図の一例を示すAn example of the side view of the partition wall 86 provided in the housing 80 is shown. 基準電位部52、信号伝送部54および伝導体60が挿入されたハウジング80の斜視図の一例を示す。An example of the perspective view of the housing 80 in which the reference electric potential part 52, the signal transmission part 54, and the conductor 60 were inserted is shown. 基準側領域82に挿入された基準側平行部64の側面図の一例を示す。An example of the side view of the reference | standard side parallel part 64 inserted in the reference | standard side area | region 82 is shown. 信号側領域84に挿入された信号側平行部68の側面図の一例を示す。An example of the side view of the signal side parallel part 68 inserted in the signal side area | region 84 is shown. 伝導体60の他の構造例における上面図を示す。A top view of another structural example of the conductor 60 is shown. ハウジング80の他の構造例を示す。Another structural example of the housing 80 is shown. 図9に示したハウジング80における隔壁86の側面図を示す。The side view of the partition 86 in the housing 80 shown in FIG. 9 is shown. 複数の伝送ユニット50の配置例を示す。An arrangement example of a plurality of transmission units 50 is shown.
 以下、発明の実施の形態を通じて本発明を説明するが、以下の実施形態は請求の範囲にかかる発明を限定するものではない。また、実施形態の中で説明されている特徴の組み合わせの全てが発明の解決手段に必須であるとは限らない。 Hereinafter, the present invention will be described through embodiments of the invention. However, the following embodiments do not limit the invention according to the claims. In addition, not all the combinations of features described in the embodiments are essential for the solving means of the invention.
 図1は、試験装置100の構成例を示す。試験装置100は、半導体回路等の被試験デバイス200を試験する装置であって、テストヘッド30、マザーボード20、および、デバイスボード10を備える。デバイスボード10は、被試験デバイス200を載置する。マザーボード20は、デバイスボード10およびテストヘッド30を電気的に接続する。例えばマザーボード20は、デバイスボード10に設けられた端子12と電気的に接続する端子14、および、テストヘッド30に設けられた端子18と電気的に接続する端子16を有する。 FIG. 1 shows a configuration example of the test apparatus 100. The test apparatus 100 is an apparatus for testing a device under test 200 such as a semiconductor circuit, and includes a test head 30, a motherboard 20, and a device board 10. The device board 10 mounts the device under test 200. The motherboard 20 electrically connects the device board 10 and the test head 30. For example, the motherboard 20 includes a terminal 14 that is electrically connected to the terminal 12 provided on the device board 10, and a terminal 16 that is electrically connected to the terminal 18 provided on the test head 30.
 テストヘッド30は、マザーボード20およびデバイスボード10を介して被試験デバイス200と電気的に接続される。テストヘッド30は、被試験デバイス200に対して、所定の論理パターンの試験信号、電源電力等を供給する。また、テストヘッド30は、被試験デバイス200が出力する信号を測定する。 The test head 30 is electrically connected to the device under test 200 via the mother board 20 and the device board 10. The test head 30 supplies a test signal having a predetermined logic pattern, power supply power, and the like to the device under test 200. The test head 30 measures a signal output from the device under test 200.
 テストヘッド30の内部には、試験信号等を生成する試験回路、または、被試験デバイス200が出力する信号を測定する試験回路等が設けられた複数のテストボード40が格納される。それぞれのテストボード40は端子42を有する。端子42は、伝送ユニット50を介してテストヘッド30の対応する端子18と電気的に接続される。伝送ユニット50は、端子18および端子42の間で、電気信号または電力を伝送する。 Inside the test head 30 are stored a plurality of test boards 40 provided with a test circuit for generating a test signal or the like, or a test circuit for measuring a signal output from the device under test 200. Each test board 40 has a terminal 42. The terminal 42 is electrically connected to the corresponding terminal 18 of the test head 30 via the transmission unit 50. The transmission unit 50 transmits an electrical signal or power between the terminal 18 and the terminal 42.
 図2Aは、伝送ユニット50の側面図の一例を示す。図2Bは、伝送ユニット50の上面図の一例を示す。図2Cは、伝送ユニット50の断面図の一例を示す。伝送ユニット50は、基準電位部52、信号伝送部54および伝導体60を備える。信号伝送部54は、端子42および端子18の間で電気信号を伝送する。信号伝送部54は、両端近傍が端子42および端子18に電気的に接続される伝送路であってよい。 FIG. 2A shows an example of a side view of the transmission unit 50. FIG. 2B shows an example of a top view of the transmission unit 50. FIG. 2C shows an example of a cross-sectional view of the transmission unit 50. The transmission unit 50 includes a reference potential unit 52, a signal transmission unit 54, and a conductor 60. The signal transmission unit 54 transmits an electrical signal between the terminal 42 and the terminal 18. The signal transmission unit 54 may be a transmission path in which the vicinity of both ends is electrically connected to the terminal 42 and the terminal 18.
 基準電位部52は、端子42および端子18の間で信号伝送部54と平行して設けられ、基準電位が与えられる。基準電位は接地電位であってよい。基準電位部52には、端子42または端子18から基準電位が与えられてよい。また、基準電位部52は、信号伝送部54の近傍に設けられる。例えば基準電位部52は、信号伝送部54から数mmの距離に設けられてよく、より好ましくは、信号伝送部54から1mm以下の距離に設けられる。また、伝送ユニット50は、基準電位部52および信号伝送部54を、それぞれ端子18および端子42に対して着脱可能に固定するコネクタ部を有してよい。 The reference potential section 52 is provided between the terminal 42 and the terminal 18 in parallel with the signal transmission section 54, and is supplied with a reference potential. The reference potential may be a ground potential. A reference potential may be applied to the reference potential unit 52 from the terminal 42 or the terminal 18. The reference potential unit 52 is provided in the vicinity of the signal transmission unit 54. For example, the reference potential unit 52 may be provided at a distance of several mm from the signal transmission unit 54, and more preferably at a distance of 1 mm or less from the signal transmission unit 54. Moreover, the transmission unit 50 may have a connector part that detachably fixes the reference potential part 52 and the signal transmission part 54 to the terminal 18 and the terminal 42, respectively.
 伝導体60は、互いに離間して設けられる少なくとも2つの接続点62で基準電位部52と電気的に接続される。本例の伝導体60は、両端近傍に設けられた2つの接続点62で基準電位部52と電気的に接続される。伝導体60は、信号伝送部54の少なくとも一部の領域に対して、基準電位部52から信号伝送部54に向かう第1方向と垂直な第2方向における上側まで延伸する。本例の伝導体60は、図2Bに示すように、伝導体60は、基準側平行部64、信号側平行部68、および、延伸部66を有する。 The conductor 60 is electrically connected to the reference potential portion 52 at at least two connection points 62 that are provided apart from each other. The conductor 60 of this example is electrically connected to the reference potential portion 52 at two connection points 62 provided near both ends. The conductor 60 extends to the upper side in the second direction perpendicular to the first direction from the reference potential unit 52 toward the signal transmission unit 54 with respect to at least a part of the signal transmission unit 54. As shown in FIG. 2B, the conductor 60 of this example includes a reference side parallel part 64, a signal side parallel part 68, and an extending part 66.
 基準側平行部64は、基準電位部52に対して第2方向における上側に設けられる。また、基準側平行部64は、端子42および端子18の間において、基準電位部52と平行して設けられる。また、基準側平行部64は、両端に設けられた2つの接続点62により基準電位部52と電気的に接続される。 The reference side parallel part 64 is provided on the upper side in the second direction with respect to the reference potential part 52. The reference-side parallel part 64 is provided between the terminal 42 and the terminal 18 in parallel with the reference potential part 52. Further, the reference side parallel part 64 is electrically connected to the reference potential part 52 by two connection points 62 provided at both ends.
 2つの接続点62は、伝導体60における基準側平行部64と一体に形成される。それぞれの接続点62は、基準電位部52と分離可能に接触してよい。伝送ユニット50は、伝導体60を、接続点62を介して基準電位部52に接触させた状態で保持するハウジングを更に備えてよい。 The two connection points 62 are formed integrally with the reference side parallel part 64 in the conductor 60. Each connection point 62 may contact the reference potential portion 52 in a separable manner. The transmission unit 50 may further include a housing that holds the conductor 60 in contact with the reference potential portion 52 via the connection point 62.
 信号側平行部68は、信号伝送部54の少なくとも一部の領域に対して、第2方向における上側に設けられる。また、信号側平行部68は、端子42および端子18の間において、基準側平行部64および信号伝送部54の当該少なくとも一部の領域と平行して設けられる。信号側平行部68の長さは、基準側平行部64の長さと同一であってよい。 The signal side parallel part 68 is provided on the upper side in the second direction with respect to at least a part of the signal transmission part 54. The signal side parallel part 68 is provided between the terminal 42 and the terminal 18 in parallel with the at least part of the reference side parallel part 64 and the signal transmission part 54. The length of the signal side parallel part 68 may be the same as the length of the reference side parallel part 64.
 延伸部66は、基準側平行部64および信号側平行部68の間の一部の領域において、基準側平行部64から信号側平行部68に延伸して設けられ、基準側平行部64および信号側平行部68を電気的に接続する。本例の延伸部66は、基準側平行部64の一端と、信号側平行部68の一端とを結合すべく延伸して設けられる。なお、延伸部66が設けられる領域は、当該領域に限定されない。延伸部66は、基準側平行部64の両端と、信号側平行部68の両端とを結合すべく延伸して設けられてよい。また、基準側平行部64、信号側平行部68および延伸部66が、一枚の板状となるように形成されてもよい。 The extending portion 66 is provided so as to extend from the reference side parallel portion 64 to the signal side parallel portion 68 in a partial region between the reference side parallel portion 64 and the signal side parallel portion 68. The side parallel part 68 is electrically connected. The extending portion 66 of this example is provided by extending so as to join one end of the reference side parallel portion 64 and one end of the signal side parallel portion 68. In addition, the area | region where the extending | stretching part 66 is provided is not limited to the said area | region. The extending portion 66 may be provided so as to extend both ends of the reference side parallel portion 64 and both ends of the signal side parallel portion 68. Further, the reference side parallel part 64, the signal side parallel part 68, and the extending part 66 may be formed in a single plate shape.
 図2Bおよび図2Cに示すように、信号側平行部68は、信号伝送部54の予め定められた区間に渡って、信号伝送部54を第2方向において覆うように形成されてよい。当該区間は、端子42および端子18の間の区間の半分以上を占めてよい。また、図2Cに示すように、信号側平行部68と信号伝送部54との第2方向における距離は、基準電位部52と信号伝送部54との第1方向における距離よりも小さくてよい。 2B and 2C, the signal side parallel part 68 may be formed so as to cover the signal transmission part 54 in the second direction over a predetermined section of the signal transmission part 54. The section may occupy more than half of the section between the terminal 42 and the terminal 18. As shown in FIG. 2C, the distance between the signal side parallel part 68 and the signal transmission part 54 in the second direction may be smaller than the distance between the reference potential part 52 and the signal transmission part 54 in the first direction.
 以上のような構成により、信号伝送部54の予め定められた区間にわたって、信号伝送部54に対して所定の容量成分を分布させることができる。このため、信号伝送部54のインダクタンス成分が比較的に大きい場合であっても、高周波数の信号に対して信号伝送部54のインピーダンスを整合させることができる。 With the configuration as described above, a predetermined capacity component can be distributed to the signal transmission unit 54 over a predetermined section of the signal transmission unit 54. For this reason, even when the inductance component of the signal transmission unit 54 is relatively large, the impedance of the signal transmission unit 54 can be matched to a high-frequency signal.
 図3は、伝送ユニット50の等価回路の一例を示す。信号伝送部54および基準電位部52は、その長さに応じたインダクタンス成分70を有する。これに対し、伝導体60を設けることで、所定の容量成分72を、予め定められた区間にわたって分布させることができる。このため、高周波数の信号を伝送する場合であっても、インダクタンス成分70を容量成分72で相殺することができる。なお、インダクタンス成分74は、伝導体60のインダクタンス成分を示す。 FIG. 3 shows an example of an equivalent circuit of the transmission unit 50. The signal transmission unit 54 and the reference potential unit 52 have an inductance component 70 corresponding to the length thereof. On the other hand, by providing the conductor 60, the predetermined capacitance component 72 can be distributed over a predetermined section. For this reason, the inductance component 70 can be canceled by the capacitance component 72 even when a high-frequency signal is transmitted. The inductance component 74 indicates the inductance component of the conductor 60.
 図4は、伝導体60の構造例を示す。本例において、基準側平行部64の両端は、基準電位部52に向かう方向に湾曲して形成される。これにより、基準側平行部64の両端は、基準電位部52に向かう方向に弾性を有する。基準側平行部64の両端の湾曲部分は、基準電位部52に向かう方向に押圧されることで、接続点62として機能する。 FIG. 4 shows a structural example of the conductor 60. In this example, both ends of the reference side parallel part 64 are formed to bend in the direction toward the reference potential part 52. Accordingly, both ends of the reference side parallel part 64 have elasticity in a direction toward the reference potential part 52. The curved portions at both ends of the reference side parallel part 64 function as the connection point 62 by being pressed in the direction toward the reference potential part 52.
 信号側平行部68は、ほぼ平板の形状を有してよい。また、信号伝送部54および基準電位部52が湾曲している場合、信号側平行部68および基準側平行部68は、信号伝送部54および基準電位部52に沿って湾曲してよい。 The signal side parallel part 68 may have a substantially flat plate shape. When the signal transmission unit 54 and the reference potential unit 52 are curved, the signal side parallel unit 68 and the reference side parallel unit 68 may be curved along the signal transmission unit 54 and the reference potential unit 52.
 なお、基準電位部52の両端の形状は、図4に示す形状に限定されない。図4に示す例では、基準電位部52の両端が、基準電位部52の延伸方向とは逆方向に折り返されているが、他の例では、基準電位部52の両端は、基準電位部52の延伸方向とは逆方向に折り返されずに、基準電位部52に向かう方向に湾曲していてもよい。より具体的には、基準電位部52は、両端に近づくにつれて、基準電位部52との距離が近くなる領域を有してよい。 Note that the shape of both ends of the reference potential portion 52 is not limited to the shape shown in FIG. In the example shown in FIG. 4, both ends of the reference potential portion 52 are folded back in the direction opposite to the extending direction of the reference potential portion 52. In other examples, both ends of the reference potential portion 52 are connected to the reference potential portion 52. It may be curved in the direction toward the reference potential section 52 without being folded back in the direction opposite to the extending direction. More specifically, the reference potential unit 52 may have a region in which the distance from the reference potential unit 52 becomes closer as approaching both ends.
 図5Aは、伝導体60を基準電位部52に接触させた状態で保持するハウジング80の、断面図の一例を示す。図5Bは、ハウジング80の上面図の一例を示す。図5Cは、ハウジング80に設けられる隔壁86の側面図の一例を示す。 FIG. 5A shows an example of a cross-sectional view of the housing 80 that holds the conductor 60 in contact with the reference potential portion 52. FIG. 5B shows an example of a top view of the housing 80. FIG. 5C shows an example of a side view of the partition wall 86 provided in the housing 80.
 ハウジング80は、基準電位部52および信号伝送部54に固定され、且つ、伝導体60が挿入されることで、それぞれの接続点62を基準電位部52に押圧して接触させる。ハウジング80には、基準電位部52および信号伝送部54が底面に沿って貫通し、且つ、基準側平行部64および信号側平行部68が上面に沿って挿入される挿入孔が形成される。当該挿入孔は、隔壁86により、基準側領域82および信号側領域84に分離される。 The housing 80 is fixed to the reference potential section 52 and the signal transmission section 54, and the conductor 60 is inserted to press and contact each connection point 62 to the reference potential section 52. The housing 80 has an insertion hole through which the reference potential portion 52 and the signal transmission portion 54 penetrate along the bottom surface, and the reference side parallel portion 64 and the signal side parallel portion 68 are inserted along the top surface. The insertion hole is separated into a reference side region 82 and a signal side region 84 by a partition wall 86.
 基準側領域82には、底面に沿って基準電位部52が貫通し、且つ、上面に沿って基準側平行部64が挿入される。また、信号側領域84には、底面に沿って信号伝送部54が貫通し、且つ、上面に沿って信号側平行部68が挿入される。 In the reference side region 82, the reference potential portion 52 penetrates along the bottom surface, and the reference side parallel portion 64 is inserted along the top surface. In the signal side region 84, the signal transmission unit 54 penetrates along the bottom surface, and the signal side parallel portion 68 is inserted along the top surface.
 隔壁86は、ハウジング80の全長にわたり、挿入孔の略中央において挿入孔の底面から上面まで形成される。ただし、延伸部66が挿入される領域には、隔壁86が形成されない。つまり、隔壁86は、延伸部66が挿入される領域に、延伸部66と略同一形状の切欠部88を有する。これにより、挿入孔の一端における隔壁86は、挿入孔の上面に対して間隙を有して形成される。 The partition wall 86 is formed from the bottom surface to the top surface of the insertion hole substantially at the center of the insertion hole over the entire length of the housing 80. However, the partition wall 86 is not formed in the region where the extending portion 66 is inserted. That is, the partition wall 86 has a cutout portion 88 having substantially the same shape as the extending portion 66 in a region where the extending portion 66 is inserted. Accordingly, the partition wall 86 at one end of the insertion hole is formed with a gap with respect to the upper surface of the insertion hole.
 図6は、基準電位部52、信号伝送部54および伝導体60が挿入されたハウジング80の斜視図の一例を示す。上述したように、基準電位部52は、基準側領域82の底面に沿ってハウジング80を貫通する。また、信号伝送部54は、信号側領域84の底面に沿ってハウジング80を貫通する。 FIG. 6 shows an example of a perspective view of the housing 80 in which the reference potential section 52, the signal transmission section 54, and the conductor 60 are inserted. As described above, the reference potential portion 52 penetrates the housing 80 along the bottom surface of the reference side region 82. The signal transmission unit 54 penetrates the housing 80 along the bottom surface of the signal side region 84.
 基準側平行部64および信号側平行部68は、基準側領域82および信号側領域84の上面に沿って挿入される。また、延伸部66は、図5Cに示した切欠部88に挿入される。なお、伝導体60は、延伸部66が形成されていない側の端部を先頭にして、切欠部88が形成されている側からハウジング80に挿入される。このような構成により、延伸部66により接続された基準側平行部64および信号側平行部68を、基準側領域82および信号側領域84に挿入することができる。 The reference side parallel part 64 and the signal side parallel part 68 are inserted along the upper surfaces of the reference side region 82 and the signal side region 84. Further, the extending portion 66 is inserted into the notch 88 shown in FIG. 5C. The conductor 60 is inserted into the housing 80 from the side where the notch 88 is formed, starting from the end on the side where the extending portion 66 is not formed. With such a configuration, the reference side parallel part 64 and the signal side parallel part 68 connected by the extending part 66 can be inserted into the reference side region 82 and the signal side region 84.
 図7Aは、基準側領域82に挿入された基準側平行部64の側面図の一例を示す。基準側平行部64の両端近傍以外は、基準側領域82の上面に沿って配置される。また、基準側平行部64の両端近傍の接続点62は、基準側平行部64が基準側領域82に挿入されることで、基準電位部52の方向に押圧される。例えば、基準側平行部64の両端における湾曲の高さは、基準電位部52の上面から基準側領域82の上面までの高さより、わずかに大きい。基準側平行部64の両端における湾曲領域は高さ方向に弾性を有するので、基準側平行部64が基準側領域82に挿入されることで、当該湾曲領域が高さ方向に圧縮され、基準電位部52の方向に押圧される。 FIG. 7A shows an example of a side view of the reference side parallel part 64 inserted into the reference side region 82. Except for the vicinity of both ends of the reference side parallel part 64, the reference side parallel part 64 is arranged along the upper surface of the reference side region 82. Further, the connection points 62 near both ends of the reference side parallel part 64 are pressed in the direction of the reference potential part 52 when the reference side parallel part 64 is inserted into the reference side region 82. For example, the height of the curvature at both ends of the reference side parallel part 64 is slightly larger than the height from the upper surface of the reference potential part 52 to the upper surface of the reference side region 82. Since the curved regions at both ends of the reference side parallel part 64 have elasticity in the height direction, the curved region is compressed in the height direction by inserting the reference side parallel part 64 into the reference side region 82, and the reference potential It is pressed in the direction of the part 52.
 図7Bは、信号側領域84に挿入された信号側平行部68の側面図の一例を示す。信号側平行部68は、信号側平行部68の上面に沿って配置される。信号側領域84には、信号側平行部68を、信号伝送部54から予め定められた距離に保持する保持部が設けられてよい。当該保持部は、信号側領域84の側面に形成された溝であってよい。当該溝に信号伝送部54が係合することで、信号伝送部54が固定される。 FIG. 7B shows an example of a side view of the signal side parallel part 68 inserted into the signal side region 84. The signal side parallel part 68 is disposed along the upper surface of the signal side parallel part 68. The signal side region 84 may be provided with a holding unit that holds the signal side parallel part 68 at a predetermined distance from the signal transmission unit 54. The holding portion may be a groove formed on the side surface of the signal side region 84. The signal transmission unit 54 is fixed by engaging the signal transmission unit 54 with the groove.
 図8は、伝導体60の他の構造例における上面図を示す。本例の伝導体60は、延伸部66が、基準側平行部64の両端と、信号側平行部68の両端とを結合すべく延伸して設けられる。基準側平行部64および信号側平行部68の両端以外の領域には、延伸部66が形成されなくてよい。 FIG. 8 shows a top view of another structure example of the conductor 60. In the conductor 60 of the present example, the extending portion 66 is provided so as to extend both ends of the reference side parallel portion 64 and both ends of the signal side parallel portion 68. In the region other than both ends of the reference side parallel portion 64 and the signal side parallel portion 68, the extending portion 66 may not be formed.
 このような構成により、伝導体60の強度を向上させることができる。また、信号側平行部68がスタブ形状となることを防ぎ、信号の反射等によるノイズを低減することができる。ただし、本例のように伝導体60の両端に延伸部66が設けられる場合、図5Aから図5Cに示したハウジング80に伝導体60を挿入することができない。 With such a configuration, the strength of the conductor 60 can be improved. Further, it is possible to prevent the signal side parallel portion 68 from becoming a stub shape and to reduce noise due to signal reflection or the like. However, when the extending portions 66 are provided at both ends of the conductor 60 as in this example, the conductor 60 cannot be inserted into the housing 80 shown in FIGS. 5A to 5C.
 図9は、ハウジング80の他の構造例を示す。本例のハウジング80は、図8に示した伝導体60を保持する。本例のハウジング80は、上面部材90および底面部材92を有する。 FIG. 9 shows another structural example of the housing 80. The housing 80 of this example holds the conductor 60 shown in FIG. The housing 80 of this example has a top member 90 and a bottom member 92.
 上面部材90は、基準側領域82および信号側領域84の上面が形成される。また、底面部材92は、基準側領域82および信号側領域84の底面および側面が形成される。上面部材90および底面部材92を組み合わせることで、基準側領域82および信号側領域84の閉空間が形成される。上面部材90および底面部材92は、着脱可能に設けられる。 In the upper surface member 90, the upper surfaces of the reference side region 82 and the signal side region 84 are formed. The bottom surface member 92 is formed with the bottom surface and side surfaces of the reference side region 82 and the signal side region 84. By combining the top member 90 and the bottom member 92, a closed space for the reference side region 82 and the signal side region 84 is formed. The top member 90 and the bottom member 92 are detachably provided.
 図10は、図9に示したハウジング80における隔壁86の側面図を示す。本例の隔壁86の両端には、図8に示した伝導体60の両端の延伸部66と略同一形状の切欠部88が形成される。隔壁86は、底面部材92と一体に形成されてよい。 FIG. 10 shows a side view of the partition wall 86 in the housing 80 shown in FIG. At both ends of the partition wall 86 in this example, cutout portions 88 having substantially the same shape as the extending portions 66 at both ends of the conductor 60 shown in FIG. 8 are formed. The partition wall 86 may be formed integrally with the bottom surface member 92.
 まず、基準側平行部64および信号側平行部68が、底面部材92に配置される。そして、伝導体60を、両端の延伸部66が切欠部88に係合するように、底面部材92に配置する。そして、上面部材90を底面部材92に嵌合させる。これにより、上面部材90により基準側平行部64の接続点62が、基準電位部52に押圧される。このような構成により、図8に示した伝導体60をハウジング80に格納することができる。 First, the reference side parallel part 64 and the signal side parallel part 68 are arranged on the bottom surface member 92. Then, the conductor 60 is disposed on the bottom surface member 92 such that the extending portions 66 at both ends engage with the cutout portions 88. Then, the top member 90 is fitted to the bottom member 92. As a result, the connection point 62 of the reference side parallel part 64 is pressed against the reference potential part 52 by the upper surface member 90. With such a configuration, the conductor 60 shown in FIG. 8 can be stored in the housing 80.
 図11は、複数の伝送ユニット50の配置例を示す。図11に示すように、それぞれの伝送ユニット50の信号側平行部68は、自己の伝送ユニット50における信号伝送部54と、他のいずれかの伝送ユニット50における信号伝送部54との中間に配置されてよい。このような配置により、信号伝送部54の周囲を基準電位の伝導体60で囲むことができる。 FIG. 11 shows an arrangement example of a plurality of transmission units 50. As shown in FIG. 11, the signal side parallel part 68 of each transmission unit 50 is arranged between the signal transmission part 54 of its own transmission unit 50 and the signal transmission part 54 of any other transmission unit 50. May be. With this arrangement, the signal transmission unit 54 can be surrounded by the conductor 60 having the reference potential.
 なお、図1から図11に関連して説明した伝導体60およびハウジング80は、信号伝送部54および基準電位部52を含む伝送ユニット50に用いられる追加部材であってもよい。例えば、伝導体60およびハウジング80は、既に実働している試験装置100における伝送ユニット50の性能を向上させるために用いられる追加部材である。少なくとも2点の接続点62が、基準電位部52に対して着脱可能に接触するので、既に稼動している伝送ユニット50に対して、伝導体60およびハウジング80を容易に追加することができる。このため、新たに伝送ユニット50を設計および製造するよりも、伝送ユニット50を安価に高性能化することができる。 The conductor 60 and the housing 80 described with reference to FIGS. 1 to 11 may be additional members used in the transmission unit 50 including the signal transmission unit 54 and the reference potential unit 52. For example, the conductor 60 and the housing 80 are additional members used to improve the performance of the transmission unit 50 in the test apparatus 100 that is already in operation. Since at least two connection points 62 are detachably in contact with the reference potential unit 52, the conductor 60 and the housing 80 can be easily added to the transmission unit 50 that is already in operation. Therefore, it is possible to improve the performance of the transmission unit 50 at a lower cost than designing and manufacturing the transmission unit 50 anew.
 また、接続点62を離間して設けているので、接続点62に対して弾性を容易に持たせることができる。このため接続点62を、基準電位部52に対して着脱可能に設けても、基準電位部52および基準側平行部64の電気的接続の信頼性が低下することを防ぐことができる。 Further, since the connection points 62 are provided apart from each other, the connection points 62 can be easily given elasticity. For this reason, even if the connection point 62 is detachably provided to the reference potential portion 52, it is possible to prevent the reliability of the electrical connection between the reference potential portion 52 and the reference side parallel portion 64 from being lowered.
 また、伝導体60における接続点62の数は、2個に限定されない。接続点62は、より多く設けられてよい。ただし、少なくとも基準側平行部64の両端には、接続点62が設けられることが好ましい。複数の接続点62は略等間隔に設けられてよい。 Further, the number of connection points 62 in the conductor 60 is not limited to two. More connection points 62 may be provided. However, it is preferable that the connection points 62 are provided at least at both ends of the reference side parallel portion 64. The plurality of connection points 62 may be provided at substantially equal intervals.
 以上、本発明を実施の形態を用いて説明したが、本発明の技術的範囲は上記実施の形態に記載の範囲には限定されない。上記実施の形態に、多様な変更または改良を加えることが可能であることが当業者に明らかである。その様な変更または改良を加えた形態も本発明の技術的範囲に含まれ得ることが、請求の範囲の記載から明らかである。 As mentioned above, although this invention was demonstrated using embodiment, the technical scope of this invention is not limited to the range as described in the said embodiment. It will be apparent to those skilled in the art that various modifications or improvements can be added to the above-described embodiment. It is apparent from the scope of the claims that the embodiments added with such changes or improvements can be included in the technical scope of the present invention.
 請求の範囲、明細書、および図面中において示した装置、システム、プログラム、および方法における動作、手順、ステップ、および段階等の各処理の実行順序は、特段「より前に」、「先立って」等と明示しておらず、また、前の処理の出力を後の処理で用いるのでない限り、任意の順序で実現しうることに留意すべきである。請求の範囲、明細書、および図面中の動作フローに関して、便宜上「まず、」、「次に、」等を用いて説明したとしても、この順で実施することが必須であることを意味するものではない。 The execution order of each process such as operations, procedures, steps, and stages in the apparatus, system, program, and method shown in the claims, the description, and the drawings is particularly “before” or “prior”. It should be noted that they can be implemented in any order unless the output of the previous process is used in the subsequent process. Regarding the operation flow in the claims, the description, and the drawings, even if it is described using “first”, “next”, etc. for the sake of convenience, it means that it is essential to carry out in this order. is not.
10・・・デバイスボード、12、14、16、18、42・・・端子、20・・・マザーボード、30・・・テストヘッド、40・・・テストボード、50・・・伝送ユニット、52・・・基準電位部、54・・・信号伝送部、60・・・伝導体、62・・・接続点、64・・・基準側平行部、66・・・延伸部、68・・・信号側平行部、70・・・インダクタンス成分、72・・・容量成分、74・・・インダクタンス成分、80・・・ハウジング、82・・・基準側領域、84・・・信号側領域、86・・・隔壁、88・・・切欠部、90・・・上面部材、92・・・底面部材、100・・・試験装置、200・・・被試験デバイス DESCRIPTION OF SYMBOLS 10 ... Device board, 12, 14, 16, 18, 42 ... Terminal, 20 ... Motherboard, 30 ... Test head, 40 ... Test board, 50 ... Transmission unit, 52. ..Reference potential section, 54... Signal transmission section, 60... Conductor, 62 .. connection point, 64 .. reference side parallel section, 66. Parallel part, 70 ... inductance component, 72 ... capacitance component, 74 ... inductance component, 80 ... housing, 82 ... reference side region, 84 ... signal side region, 86 ... Bulkhead, 88 ... Notch, 90 ... Top member, 92 ... Bottom member, 100 ... Test device, 200 ... Device under test

Claims (11)

  1.  電気信号を伝送する伝送ユニットであって、
     前記電気信号を伝送する信号伝送部と、
     前記信号伝送部と平行して設けられ、基準電位が与えられる基準電位部と、
     互いに離間して設けられる少なくとも2つの接続点で前記基準電位部と電気的に接続され、且つ、前記信号伝送部の少なくとも一部の領域に対して、前記基準電位部から前記信号伝送部に向かう第1方向と垂直な第2方向における上側まで延伸する伝導体と
     を備える伝送ユニット。
    A transmission unit for transmitting electrical signals,
    A signal transmission unit for transmitting the electrical signal;
    A reference potential unit provided in parallel with the signal transmission unit to which a reference potential is applied;
    The reference potential unit is electrically connected to at least two connection points provided at a distance from each other, and at least a part of the signal transmission unit is directed from the reference potential unit to the signal transmission unit. A transmission unit comprising: a conductor extending to an upper side in a second direction perpendicular to the first direction.
  2.  前記少なくとも2つの接続点は、前記伝導体に形成され、且つ、前記基準電位部と分離可能に接触する
     請求項1に記載の伝送ユニット。
    The transmission unit according to claim 1, wherein the at least two connection points are formed on the conductor and are detachably contacted with the reference potential portion.
  3.  前記伝導体は、
     前記基準電位部に対して前記第2方向における上側に、前記基準電位部と平行して設けられ、両端に設けられた2つの前記接続点で前記基準電位部と電気的に接続される基準側平行部と、
     前記信号伝送部の前記少なくとも一部の領域に対して前記第2方向における上側に、前記基準側平行部および前記信号伝送部の前記少なくとも一部と平行して設けられる信号側平行部と、
     前記基準側平行部および前記信号側平行部の間の一部の領域において前記基準側平行部から前記信号側平行部に延伸して設けられ、前記基準側平行部および前記信号側平行部を電気的に接続する延伸部と
     を有する請求項2に記載の伝送ユニット。
    The conductor is
    A reference side that is provided above the reference potential portion in the second direction in parallel with the reference potential portion and is electrically connected to the reference potential portion at the two connection points provided at both ends. Parallel parts;
    A signal side parallel part provided in parallel with the reference side parallel part and the at least part of the signal transmission part above the at least part of the signal transmission part in the second direction;
    In a part of the region between the reference side parallel part and the signal side parallel part, the reference side parallel part and the signal side parallel part are provided to extend from the reference side parallel part to the signal side parallel part. The transmission unit according to claim 2, further comprising: an extending portion that is electrically connected.
  4.  前記基準側平行部の両端は、前記基準電位部に向かう方向に湾曲して形成され、前記基準電位部に向かう方向に押圧されて前記接続点として機能する
     請求項3に記載の伝送ユニット。
    4. The transmission unit according to claim 3, wherein both ends of the reference side parallel portion are curved in a direction toward the reference potential portion and are pressed in a direction toward the reference potential portion to function as the connection points.
  5.  前記延伸部は、前記基準側平行部の一端と、前記信号側平行部の一端とを接続する
     請求項4に記載の伝送ユニット。
    5. The transmission unit according to claim 4, wherein the extending portion connects one end of the reference side parallel portion and one end of the signal side parallel portion.
  6.  前記基準電位部および前記信号伝送部に固定され、且つ、前記伝導体が挿入されることで、前記接続点を前記基準電位部に押圧して接触させるハウジングを更に備える
     請求項5に記載の伝送ユニット。
    The transmission according to claim 5, further comprising a housing fixed to the reference potential unit and the signal transmission unit, and having the conductor inserted to press and contact the connection point to the reference potential unit. unit.
  7.  前記ハウジングは、前記基準電位部および前記信号伝送部が底面に沿って貫通し、且つ、前記基準側平行部および前記信号側平行部が上面に沿って挿入される挿入孔が形成され、
     前記挿入孔には、前記基準電位部および前記基準側平行部が挿入される基準側領域と、前記信号伝送部および前記信号側平行部が挿入される信号側領域とを分離する隔壁が前記底面から前記上面にわたって形成され、且つ、前記延伸部が挿入される領域には、前記隔壁が形成されない
     請求項6に記載の伝送ユニット。
    The housing is formed with an insertion hole through which the reference potential portion and the signal transmission portion penetrate along the bottom surface, and the reference side parallel portion and the signal side parallel portion are inserted along the top surface,
    In the insertion hole, a partition wall that separates a reference side region into which the reference potential portion and the reference side parallel portion are inserted and a signal side region into which the signal transmission portion and the signal side parallel portion are inserted is the bottom surface. The transmission unit according to claim 6, wherein the partition is not formed in a region formed from the top to the top surface and into which the extending portion is inserted.
  8.  前記挿入孔の一端における前記隔壁は、前記上面に対して間隙を有して形成され、
     前記延伸部は、前記間隙に挿入される
     請求項7に記載の伝送ユニット。
    The partition at one end of the insertion hole is formed with a gap with respect to the upper surface,
    The transmission unit according to claim 7, wherein the extending portion is inserted into the gap.
  9.  前記ハウジングは、前記上面を含む上面部材と、前記底面を含む底面部材とが着脱可能に形成される
     請求項7に記載の伝送ユニット。
    The transmission unit according to claim 7, wherein the housing is formed such that a top surface member including the top surface and a bottom surface member including the bottom surface are detachable.
  10.  電気信号を伝送する信号伝送部と、前記信号伝送部と平行して設けられ、基準電位が与えられる基準電位部とを含む伝送ユニットに用いられる追加部材であって、
     互いに離間して設けられる少なくとも2つの接続点で前記基準電位部と電気的に接続され、且つ、前記信号伝送部の少なくとも一部の領域に対して、前記基準電位部から前記信号伝送部に向かう第1方向と垂直な第2方向における上側まで延伸する伝導体と、
     前記基準電位部および前記信号伝送部に固定され、且つ、前記伝導体が挿入されることで、前記接続点を前記基準電位部に押圧して接触させるハウジングと
     を備える追加部材。
    An additional member used in a transmission unit including a signal transmission unit that transmits an electrical signal, and a reference potential unit that is provided in parallel with the signal transmission unit and to which a reference potential is applied,
    The reference potential unit is electrically connected to at least two connection points provided at a distance from each other, and at least a part of the signal transmission unit is directed from the reference potential unit to the signal transmission unit. A conductor extending upward in a second direction perpendicular to the first direction;
    An additional member comprising: a housing fixed to the reference potential section and the signal transmission section and having the conductor inserted to press and contact the connection point to the reference potential section.
  11.  被試験デバイスを試験する試験装置であって、
     前記被試験デバイスを試験する試験回路が設けられたテストボードと、
     前記被試験デバイスを載置するデバイスボードと、
     前記テストボードおよび前記デバイスボードの間で電気信号を伝送する、請求項1から9のいずれか一項に記載の伝送ユニットと
     を備える試験装置。
    A test apparatus for testing a device under test,
    A test board provided with a test circuit for testing the device under test;
    A device board on which the device under test is placed;
    A test apparatus comprising: the transmission unit according to claim 1, which transmits an electrical signal between the test board and the device board.
PCT/JP2010/004583 2010-07-14 2010-07-14 Transmission unit, supplementary member used for transmission unit, and test equipment WO2012007995A1 (en)

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Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20140085290A1 (en) * 2012-09-25 2014-03-27 Lg Display Co., Ltd. Organic light emitting display and method for driving the same

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2008210839A (en) * 2007-02-23 2008-09-11 Advantest Corp Flexible substrate and electronic component testing device

Family Cites Families (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP0784327A1 (en) * 1996-01-11 1997-07-16 Molex Incorporated Transmission line cable
AU2003283737A1 (en) * 2002-12-30 2004-07-22 Koninklijke Philips Electronics N.V. Display device with capacitively connected pads

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2008210839A (en) * 2007-02-23 2008-09-11 Advantest Corp Flexible substrate and electronic component testing device

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20140085290A1 (en) * 2012-09-25 2014-03-27 Lg Display Co., Ltd. Organic light emitting display and method for driving the same
US9418596B2 (en) * 2012-09-25 2016-08-16 Lg Display Co., Ltd. Organic light emitting display and method for driving the same

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