TWI429927B - A transfer unit, an additional member for the transport unit, and a test device - Google Patents
A transfer unit, an additional member for the transport unit, and a test device Download PDFInfo
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- TWI429927B TWI429927B TW100120405A TW100120405A TWI429927B TW I429927 B TWI429927 B TW I429927B TW 100120405 A TW100120405 A TW 100120405A TW 100120405 A TW100120405 A TW 100120405A TW I429927 B TWI429927 B TW I429927B
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- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
- G01R31/28—Testing of electronic circuits, e.g. by signal tracer
- G01R31/2851—Testing of integrated circuits [IC]
- G01R31/2886—Features relating to contacting the IC under test, e.g. probe heads; chucks
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- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
- G01R31/28—Testing of electronic circuits, e.g. by signal tracer
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- H—ELECTRICITY
- H03—ELECTRONIC CIRCUITRY
- H03H—IMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS; RESONATORS
- H03H7/00—Multiple-port networks comprising only passive electrical elements as network components
- H03H7/38—Impedance-matching networks
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- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
- G01R1/02—General constructional details
- G01R1/06—Measuring leads; Measuring probes
- G01R1/067—Measuring probes
- G01R1/06772—High frequency probes
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- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
- G01R31/28—Testing of electronic circuits, e.g. by signal tracer
- G01R31/282—Testing of electronic circuits specially adapted for particular applications not provided for elsewhere
- G01R31/2822—Testing of electronic circuits specially adapted for particular applications not provided for elsewhere of microwave or radiofrequency circuits
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Description
本發明是關於傳送單元、傳送單元所用的追加構件及試驗裝置。The present invention relates to an additional member and a test device for a transport unit and a transport unit.
已知有一種用以試驗半導體電路等被試驗元件之試驗裝置。試驗裝置,經由連接器,將設置有試驗電路之測試板與載置有被試驗元件之元件板,加以電性連接。(例如參照專利文獻1)A test apparatus for testing a test element such as a semiconductor circuit is known. The test apparatus electrically connects the test board provided with the test circuit and the element board on which the test element is mounted via a connector. (For example, refer to Patent Document 1)
專利文獻1:日本特開第2008-224591號公報Patent Document 1: Japanese Patent Laid-Open Publication No. 2008-224591
在連接器的端子長度長之場合,則端子的電感分量就變得不可忽視。以往,在測試板等之上設置電容分量,用以與該電感分量抵銷,藉此將傳送系統的阻抗加以匹配至預定值。但是該電容分量,是被設置在傳送系統的端部的測試板等,而不是均等分布在傳送系統中,所以若在傳送系統中傳送的信號變成高頻率,則會分別對電感分量和電容分量的信號造成影響。In the case where the length of the terminal of the connector is long, the inductance component of the terminal becomes non-negligible. In the past, a capacitance component was placed on a test board or the like for offsetting the inductance component, thereby matching the impedance of the transmission system to a predetermined value. However, the capacitance component is a test board or the like disposed at the end of the transmission system, and is not evenly distributed in the transmission system. Therefore, if the signal transmitted in the transmission system becomes a high frequency, the inductance component and the capacitance component are respectively. The signal has an effect.
為了解決上述問題,在本發明的態樣中,提供一種傳送單元,是用以傳送電性信號之傳送單元,其具備:信號傳送部,其傳送電性信號;基準電位部,其被設置成與信號傳送部平行,並被給予基準電位;以及傳導體,其利用彼此分開設置的至少兩個連接點,與基準電位部作電性連接,且相對於信號傳送部的至少一部分區域,延伸至第2方向中的上側,該第2方向垂直於第1方向,該第一方向是由基準電位部朝向信號傳送部之方向;其中,至少兩個連接點,被形成於傳導體上,且與基準電位部以能夠分離之方式作接觸。In order to solve the above problems, in an aspect of the present invention, a transmission unit is provided, which is a transmission unit for transmitting an electrical signal, comprising: a signal transmission unit that transmits an electrical signal; and a reference potential portion that is set to Parallel to the signal transmission portion and given a reference potential; and a conductor that is electrically connected to the reference potential portion by at least two connection points that are provided separately from each other, and extends to at least a portion of the signal transmission portion to In the upper side of the second direction, the second direction is perpendicular to the first direction, wherein the first direction is a direction in which the reference potential portion faces the signal transmission portion; wherein at least two connection points are formed on the conductor, and The reference potential portion is in contact with each other in a separable manner.
另外,上述的發明概要,並非將本發明的必要特徵全部列舉者,又,這些特徵群的子組合,也能作為發明。Further, the above summary of the invention is not intended to enumerate all the essential features of the invention, and a sub-combination of these features can also be used as an invention.
以下,雖然透過發明的實施形態來說明本發明,但是以下實施形態並非用以限定關於發明的申請專利範圍,又並非所有的在實施形態中說明的特徵的組合都是發明所必要的解決手段。Hereinafter, the present invention will be described by way of embodiments of the invention, but the following embodiments are not intended to limit the scope of the invention, and not all combinations of features described in the embodiments are the means of the invention.
第1圖是表示試驗裝置100的構成例。試驗裝置100,是用以試驗半導體電路等的被試驗元件200之裝置,其具備:測試頭30、母板20及元件板10。元件板10,用以載置被試驗元件200。母板20,用以將元件板10及測試頭30,加以電性連接。例如,母板20,具有:端子14,其要電性連接至已被設置在元件板10上的端子12;以及端子16,其要電性連接至已被設置在測試頭30上的端子18。FIG. 1 is a view showing an example of the configuration of the test apparatus 100. The test apparatus 100 is a device for testing a device under test 200 such as a semiconductor circuit, and includes a test head 30, a mother board 20, and an element board 10. The element board 10 is for placing the object under test 200. The motherboard 20 is used to electrically connect the component board 10 and the test head 30. For example, the motherboard 20 has a terminal 14 to be electrically connected to the terminal 12 that has been disposed on the component board 10, and a terminal 16 that is electrically connected to the terminal 18 that has been disposed on the test head 30. .
測試頭30,經由母板20及元件板10而與被試驗元件200作電性連接。測試頭30,對於被試驗元件200,供給規定的邏輯圖案的試驗信號、電源電力等。又,測試頭30,測定被試驗元件200輸出的信號。The test head 30 is electrically connected to the device under test 200 via the mother board 20 and the element board 10. The test head 30 supplies a test signal of a predetermined logic pattern, power supply power, and the like to the device under test 200. Further, the test head 30 measures the signal output from the test element 200.
在測試頭30的內部,收納有複數個測試板40,這些測試板40,設有用以生成試驗信號等之試驗電路、或是用以測定被試驗元件200所輸出的信號之試驗電路等。各個測試板40,具有端子42。端子42,經由傳送單元50,被電性連接至測試頭30的對應的端子18。傳送單元50,在端子18與端子42之間,傳送電性信號或電力。Inside the test head 30, a plurality of test boards 40 are housed, and the test boards 40 are provided with a test circuit for generating a test signal or the like, or a test circuit for measuring a signal output from the test element 200. Each test board 40 has a terminal 42. The terminal 42 is electrically connected to the corresponding terminal 18 of the test head 30 via the transfer unit 50. The transfer unit 50 transmits an electrical signal or power between the terminal 18 and the terminal 42.
第2A圖是表示傳送單元50的側面圖的一例。第2B圖是表示傳送單元50的俯視圖的一例。第2C圖是表示傳送單元50的剖面圖的一例。傳送單元50,具備:基準電位部52、信號傳送部54及傳導體60。信號傳送部54,在端子42與端子18之間傳送電性信號。信號傳送部54,只要是傳送路徑即可,其兩端附近電性連接至端子42及端子18。FIG. 2A is an example of a side view showing the transfer unit 50. FIG. 2B is an example of a plan view showing the transfer unit 50. FIG. 2C is an example of a cross-sectional view showing the transfer unit 50. The transmission unit 50 includes a reference potential unit 52, a signal transmission unit 54, and a conductor 60. The signal transmission unit 54 transmits an electrical signal between the terminal 42 and the terminal 18. The signal transmission unit 54 may be a transmission path, and is electrically connected to the terminal 42 and the terminal 18 in the vicinity of both ends.
基準電位部52,在端子42與端子18之間,被設定成與信號傳送部54平行,並被給予基準電位。基準電位,也能是接地電位。基準電位部52,也能由端子42或端子18而被給予基準電位。又,基準電位部52,被設置在信號傳送部54的附近。例如,基準電位部52,也能被設置在與信號傳送部54相距數mm之處。較佳是,被設置在與信號傳送部54相距1mm以下之處。又,傳送單元50,也能具有連接部,其將基準電位部52及信號傳送部54,以相對於各個端子18及端子42可自由地裝上卸下之方式進行固定。The reference potential portion 52 is set in parallel with the signal transmission portion 54 between the terminal 42 and the terminal 18, and is given a reference potential. The reference potential can also be the ground potential. The reference potential portion 52 can also be given a reference potential from the terminal 42 or the terminal 18. Further, the reference potential portion 52 is provided in the vicinity of the signal transmission portion 54. For example, the reference potential portion 52 can also be disposed at a distance of several mm from the signal transmission portion 54. Preferably, it is disposed at a distance of 1 mm or less from the signal transmission portion 54. Further, the transfer unit 50 may have a connection portion that fixes the reference potential portion 52 and the signal transmission portion 54 so as to be detachably attachable to the respective terminals 18 and 42.
傳導體60,利用彼此分開設置的至少兩個連接點62,與基準電位部52作電性連接。本例的傳導體60,利用在其兩端附近所設置的兩個連接點62,與基準電位部52作電性連接。傳導體60,相對於信號傳送部54的至少一部分區域,延伸至第2方向中的上側,該第2方向垂直於第1方向,該第一方向是由基準電位部52朝向信號傳送部54之方向。如第2B圖所示,傳導體60,具有:基準側平行部64、信號側平行部68及延伸部66。The conductor 60 is electrically connected to the reference potential portion 52 by at least two connection points 62 which are provided separately from each other. The conductor 60 of this example is electrically connected to the reference potential portion 52 by two connection points 62 provided near both ends thereof. The conductor 60 extends to at least an upper portion of the second direction with respect to at least a portion of the signal transmission portion 54 that is perpendicular to the first direction, and the first direction is directed by the reference potential portion 52 toward the signal transmission portion 54. direction. As shown in FIG. 2B, the conductor 60 has a reference side parallel portion 64, a signal side parallel portion 68, and an extension portion 66.
基準側平行部64,相對於基準電位部52,被設置在第二方向中的上側。又,基準側平行部64,在端子42與端子18之間,被設置成與基準電位部52平行。又,基準側平行部64,利用在其兩端所設置的兩個連接點62來與基準電位部52作電性連接。The reference side parallel portion 64 is provided on the upper side in the second direction with respect to the reference potential portion 52. Further, the reference side parallel portion 64 is provided in parallel with the reference potential portion 52 between the terminal 42 and the terminal 18. Further, the reference side parallel portion 64 is electrically connected to the reference potential portion 52 by two connection points 62 provided at both ends thereof.
兩個連接點62,在傳導體60中與基準側平行部64形成一體。各個連接點62,只要與基準電位部52以可以分離之方式接觸即可。傳送單元50,也能更具備外殼(housing),其以使傳導體60經由連接點62接觸到基準電位部52之狀態來保持該傳導體60。The two connection points 62 are integrally formed with the reference side parallel portion 64 in the conductor 60. Each of the connection points 62 may be in contact with the reference potential portion 52 so as to be separable. The transfer unit 50 can also be further provided with a housing that holds the conductor 60 in a state in which the conductor 60 contacts the reference potential portion 52 via the connection point 62.
信號側平行部68,相對於信號傳送部54的至少一部分區域,被設置在第二方向中的上側。又,信號側平行部68,在端子42與端子18之間,被設置成與基準側平行部64和信號傳送部54的該至少一部分區域平行。信號側平行部68的長度,也能與基準側平行部64的長度相同。The signal side parallel portion 68 is provided on the upper side in the second direction with respect to at least a part of the signal transmitting portion 54. Further, the signal side parallel portion 68 is provided between the terminal 42 and the terminal 18 so as to be parallel to the reference side parallel portion 64 and the at least a portion of the signal transmission portion 54. The length of the signal side parallel portion 68 can also be the same as the length of the reference side parallel portion 64.
延伸部66,在基準側平行部64和信號側平行部68之間的一部分區域中,被設置成由基準側平行部64延伸至信號側平行部68,以使基準側平行部64和信號側平行部68作電性連接。本例的延伸部66,被設置成為了將基準側平行部64的一端與信號側平行部68的一端結合而延伸。另外,延伸部66被設置的區域,不限於該區域。延伸部66,也能被設置成為了將基準側平行部64的兩端與信號側平行部68的兩端結合而延伸。又,基準側平行部64、信號側平行部68及延伸部66,也能形成一片板狀物。The extension portion 66, in a partial region between the reference side parallel portion 64 and the signal side parallel portion 68, is provided to extend from the reference side parallel portion 64 to the signal side parallel portion 68 such that the reference side parallel portion 64 and the signal side The parallel portions 68 are electrically connected. The extension portion 66 of this example is provided so as to extend one end of the reference side parallel portion 64 and one end of the signal side parallel portion 68. In addition, the area where the extending portion 66 is provided is not limited to this area. The extending portion 66 may be provided so as to extend both ends of the reference side parallel portion 64 and both ends of the signal side parallel portion 68. Further, the reference side parallel portion 64, the signal side parallel portion 68, and the extending portion 66 can also form a single plate.
如第2B圖及第2C圖所示,信號側平行部68,也能以橫跨信號傳送部54的預定區間,並在第二方向上覆蓋信號傳送部54之方式形成。該區間,也能佔據端子42與端子18之間的區間的一半以上。又,如第2C圖所示,信號側平行部68與信號傳送部54在第二方向上的距離,也能比基準電位部52與信號傳送部54在第一方向上的距離更小。As shown in FIGS. 2B and 2C, the signal side parallel portion 68 can be formed so as to cover the signal transmission portion 54 in a predetermined interval across the signal transmission portion 54. This section can also occupy more than half of the section between the terminal 42 and the terminal 18. Further, as shown in FIG. 2C, the distance between the signal side parallel portion 68 and the signal transmission portion 54 in the second direction can be made smaller than the distance between the reference potential portion 52 and the signal transmission portion 54 in the first direction.
藉由以上的構成,相對於信號傳送部54,能橫跨信號傳送部54的預定區間來分布規定的電容分量。因此,即使在信號傳送部54的電感分量比較大之場合,也能相對於高頻率的信號,匹配信號傳送部54的阻抗。With the above configuration, a predetermined capacitance component can be distributed across a predetermined section of the signal transmission unit 54 with respect to the signal transmission unit 54. Therefore, even when the inductance component of the signal transmission portion 54 is relatively large, the impedance of the signal transmission portion 54 can be matched with respect to the signal of the high frequency.
第3圖表示傳送單元50的等價電路的一例。信號傳送部54和基準電位部52,具有其長度所對應的電感分量70。相對於此,藉由設置傳導體60,能將規定的電容分量72,以橫跨預定的區間之方式分布。因此,即使在傳送高頻率的信號之場合,也能利用電容分量72來抵銷電感分量70。另外,電感分量74,表示傳導體60的電感分量。FIG. 3 shows an example of an equivalent circuit of the transfer unit 50. The signal transfer portion 54 and the reference potential portion 52 have an inductance component 70 corresponding to the length thereof. On the other hand, by providing the conductor 60, the predetermined capacitance component 72 can be distributed across a predetermined section. Therefore, even in the case of transmitting a high frequency signal, the capacitance component 72 can be utilized to offset the inductance component 70. In addition, the inductance component 74 represents the inductance component of the conductor 60.
第4圖是表示傳導體60的構造例。在本例中,基準側平行部64的兩端,朝向基準電位部52之方向彎曲而形成。藉此,基準側平行部64的兩端,具有朝向基準電位部52之方向的彈性。基準側平行部64的兩端的彎曲部分,在朝向基準電位部52之方向被按壓,藉此,作為連接點62而發揮機能。Fig. 4 is a view showing an example of the structure of the conductor 60. In this example, both ends of the reference side parallel portion 64 are formed to be curved in the direction of the reference potential portion 52. Thereby, both ends of the reference side parallel portion 64 have elasticity toward the direction of the reference potential portion 52. The curved portion at both ends of the reference-side parallel portion 64 is pressed in the direction toward the reference potential portion 52, thereby functioning as the connection point 62.
信號側平行部68,也能具有幾乎是平板的形狀。又,在信號傳送部54和基準電位部52是彎曲的場合,則信號側平行部68和基準側平行部64,也能沿著信號傳送部54和基準電位部52而彎曲。The signal side parallel portion 68 can also have a shape almost flat. Further, when the signal transmission portion 54 and the reference potential portion 52 are curved, the signal side parallel portion 68 and the reference side parallel portion 64 can be bent along the signal transmission portion 54 and the reference potential portion 52.
另外,基準側平行部64的兩端的形狀,不限於第4圖所示的形狀。在第4圖所示的例中,基準側平行部64的兩端,往基準電位部52的延伸方向的反方向被折回,但是,在其他例中,基準側平行部64的兩端的形狀,也能不往基準電位部52的延伸方向的反方向被折回,而朝向基準電位部52的方向彎曲。更具體來說,基準側平行部64,也能具有:隨著靠近其兩端,而與基準電位部52的距離變近的區域。Further, the shape of both ends of the reference side parallel portion 64 is not limited to the shape shown in Fig. 4 . In the example shown in FIG. 4, both ends of the reference side parallel portion 64 are folded back in the opposite direction to the direction in which the reference potential portion 52 extends. However, in other examples, the shapes of both ends of the reference side parallel portion 64 are It is also possible to bend back in the direction opposite to the direction in which the reference potential portion 52 is folded without being folded back in the direction opposite to the extending direction of the reference potential portion 52. More specifically, the reference side parallel portion 64 may have a region closer to the reference potential portion 52 as it approaches both ends thereof.
第5A圖是表示外殼80的剖面圖的一例,該外殼80以使傳導體60接觸到基準電位部52的狀態來保持該傳導體60。第5B圖是表示外殼80的俯視圖的一例。第5C圖是表示被設置在外殼80中之分隔壁86的側視圖的一例。5A is an example of a cross-sectional view showing the outer casing 80 that holds the conductor 60 in a state in which the conductor 60 is brought into contact with the reference potential portion 52. FIG. 5B is an example of a plan view showing the outer casing 80. FIG. 5C is an example of a side view showing the partition wall 86 provided in the outer casing 80.
外殼80,要被固定在基準電位部52和信號傳送部54上,且利用傳導體60的插入,而使各個連接點62按壓並接觸至基準電位部52。在外殼80形成有插入孔,基準電位部52和信號傳送部54沿著該插入孔的底面而貫通該插入孔,且基準側平行部64和信號側平行部68沿著該插入孔的頂面插入。該插入孔,藉由分隔壁86,而被分離成基準側區域82和信號側區域84。The outer casing 80 is fixed to the reference potential portion 52 and the signal transmission portion 54, and each of the connection points 62 is pressed and brought into contact with the reference potential portion 52 by the insertion of the conductor 60. An insertion hole is formed in the outer casing 80, and the reference potential portion 52 and the signal transmission portion 54 penetrate the insertion hole along the bottom surface of the insertion hole, and the reference side parallel portion 64 and the signal side parallel portion 68 are along the top surface of the insertion hole. insert. The insertion hole is separated into the reference side region 82 and the signal side region 84 by the partition wall 86.
在基準側區域82中,被基準電位部52沿著底面貫通,且被基準側平行部64沿著頂面插入。又,在信號側區域84中,被信號傳送部54沿著底面貫通,且被信號側平行部68沿著頂面插入。In the reference side region 82, the reference potential portion 52 penetrates along the bottom surface, and the reference-side parallel portion 64 is inserted along the top surface. Further, in the signal side region 84, the signal transmitting portion 54 penetrates along the bottom surface, and is inserted along the top surface by the signal side parallel portion 68.
分隔壁86,橫跨外殼80的全長,由插入孔的底面直到頂面,被形成在插入孔的大約中央。但是,要被插入延伸部66之區域中,沒有形成分隔壁86。也就是說,分隔壁86,在要被插入延伸部66之區域中,具有與延伸部66大約相同形狀的缺口部88。藉此,分隔壁86,在插入孔的一端中,相對於插入孔的頂面,被形成具有間隙。The partition wall 86, which spans the entire length of the outer casing 80, is formed at approximately the center of the insertion hole from the bottom surface of the insertion hole to the top surface. However, the partition wall 86 is not formed in the region to be inserted into the extension portion 66. That is, the partition wall 86 has a notch portion 88 having the same shape as the extension portion 66 in the region to be inserted into the extension portion 66. Thereby, the partition wall 86 is formed with a gap in one end of the insertion hole with respect to the top surface of the insertion hole.
第6圖是表示外殼80的斜視圖的一例,該外殼80已插入有基準電位部52、信號傳送部54及傳導體60。如上述,基準電位部52,沿著基準側區域82的底面,貫通外殼80。又,信號傳送部54,沿著信號側區域84的底面,貫通外殼80。Fig. 6 is a view showing an example of a perspective view of the outer casing 80 in which the reference potential portion 52, the signal transmission portion 54, and the conductor 60 are inserted. As described above, the reference potential portion 52 penetrates the outer casing 80 along the bottom surface of the reference side region 82. Further, the signal transmission unit 54 penetrates the casing 80 along the bottom surface of the signal side region 84.
基準側平行部64和信號側平行部68,沿著基準側區域82和信號側區域84的頂面而被插入。又,延伸部66,被插入至如第5C圖所示的缺口部88。另外,傳導體60,以其沒有形成延伸部66之側的端部作為前頭,而由形成有缺口部88之側,被插入外殼80中。藉由這種構成,能將藉由延伸部66來進行連接之基準側平行部64和信號側平行部68,插入基準側區域82和信號側區域84。The reference side parallel portion 64 and the signal side parallel portion 68 are inserted along the top surfaces of the reference side region 82 and the signal side region 84. Further, the extending portion 66 is inserted into the notch portion 88 as shown in Fig. 5C. Further, the conductor 60 is inserted into the outer casing 80 from the side on which the side of the extending portion 66 is not formed, as the front end, and the side on which the notch portion 88 is formed. With this configuration, the reference side parallel portion 64 and the signal side parallel portion 68 which are connected by the extending portion 66 can be inserted into the reference side region 82 and the signal side region 84.
第7A圖是表示被插入基準側區域82中之基準側平行部64的側面圖的一例。基準側平行部64的兩端附近以外,是沿著基準側區域82的頂面配置。又,基準側平行部64的兩端附近的連接點62,利用基準側平行部64被插入基準側區域82中,而往基準電位部52的方向被按壓。例如,基準側平行部64的兩端中的彎曲高度,會比由基準電位部52的頂面直到基準側區域82的頂面為止的高度,稍微大一些。基準側平行部64的兩端中的彎曲區域,在高度方向上有彈性,所以基準側平行部64,能利用被插入基準側區域82中,來使該彎曲區域在高度方向上被壓縮,而往基準電位部52的方向被按壓。FIG. 7A is an example of a side view showing the reference-side parallel portion 64 inserted into the reference side region 82. The vicinity of both ends of the reference side parallel portion 64 is disposed along the top surface of the reference side region 82. Further, the connection point 62 near the both ends of the reference side parallel portion 64 is inserted into the reference side region 82 by the reference side parallel portion 64, and is pressed in the direction of the reference potential portion 52. For example, the bending height at both ends of the reference side parallel portion 64 is slightly larger than the height from the top surface of the reference potential portion 52 to the top surface of the reference side region 82. The curved region in both ends of the reference side parallel portion 64 is elastic in the height direction, so that the reference side parallel portion 64 can be inserted into the reference side region 82 to compress the curved region in the height direction. The direction toward the reference potential portion 52 is pressed.
第7B圖是表示被插入信號側區域84中之信號側平行部68的側面圖的一例。信號側平行部68,是沿著信號側區域84的頂面配置。在信號側區域84中,也能設置保持部,該保持部將信號側平行部68保持在相距信號傳送部54預定距離。該保持部,也能是被形成在信號側區域84的側面的溝。將信號傳送部54契合(engage)至該溝,藉此固定信號傳送部54。Fig. 7B is a view showing an example of a side view of the signal side parallel portion 68 inserted into the signal side region 84. The signal side parallel portion 68 is disposed along the top surface of the signal side region 84. In the signal side region 84, a holding portion that holds the signal side parallel portion 68 at a predetermined distance from the signal transmission portion 54 can also be provided. The holding portion may be a groove formed on the side surface of the signal side region 84. The signal transmission unit 54 is engaged to the groove, whereby the signal transmission unit 54 is fixed.
第8圖是表示傳導體60的其他構造例的俯視圖。本例的傳導體60,其延伸部66,是為了結合基準側平行部64的兩端與信號側平行部68的兩端而延伸設置。基準側平行部64和信號側平行部68的兩端以外的區域,只要不形成延伸部66即可。Fig. 8 is a plan view showing another structural example of the conductor 60. The conductor 60 of this example has an extending portion 66 extending in order to join both ends of the reference side parallel portion 64 and both ends of the signal side parallel portion 68. The region other than the both ends of the reference side parallel portion 64 and the signal side parallel portion 68 may be formed without forming the extending portion 66.
藉由這種構成,能提高傳導體60的強度。又,能防止信號側平行部68變成短截(stub)形狀,而能減少信號的反射等所造成的雜訊。但是,如本例般,延伸部66被設置在傳導體60的兩端之場合,就不能如第5A圖至第5C圖所示地將傳導體60插入外殼80中。With this configuration, the strength of the conductor 60 can be improved. Further, it is possible to prevent the signal side parallel portion 68 from becoming a stub shape, and it is possible to reduce noise caused by reflection of signals or the like. However, as in the case of the present embodiment, when the extending portions 66 are provided at both ends of the conductor 60, the conductor 60 cannot be inserted into the casing 80 as shown in Figs. 5A to 5C.
第9圖是表示外殼80的其他構造例。本例的外殼80,用以保持如第8圖所示的傳導體60。本例的外殼80,具有頂面構件90和底面構件92。Fig. 9 is a view showing another configuration example of the outer casing 80. The outer casing 80 of this example is for holding the conductor 60 as shown in FIG. The outer casing 80 of this example has a top surface member 90 and a bottom surface member 92.
頂面構件90,用以形成基準側區域82和信號側區域84的頂面。又,底面構件92,用以形成基準側區域82和信號側區域84的底面和側面。利用頂面構件90和底面構件92的組合,形成基準側區域82和信號側區域84的封閉空間。頂面構件90和底面構件92,被設置成可自由地裝上卸下。The top member 90 is configured to form a top surface of the reference side region 82 and the signal side region 84. Further, the bottom member 92 is for forming the bottom surface and the side surface of the reference side region 82 and the signal side region 84. The closed space of the reference side region 82 and the signal side region 84 is formed by a combination of the top member 90 and the bottom member 92. The top member 90 and the bottom member 92 are provided to be freely attached and detached.
第10圖是表示第9圖所示的外殼80中的分隔壁86的側面圖。在本例的分隔壁86的兩端,形成有與如第8圖所示的傳導體60的兩端的延伸部66大約相同形狀的缺口部88。分隔壁86,也能與底面構件92一體成形。Fig. 10 is a side view showing the partition wall 86 in the outer casing 80 shown in Fig. 9. At both ends of the partition wall 86 of this example, the notch portion 88 having the same shape as the extending portion 66 of both ends of the conductor 60 shown in Fig. 8 is formed. The partition wall 86 can also be integrally formed with the bottom member 92.
首先,基準側平行部64和信號側平行部68,要被配置在底面構件92。再者,將傳導體60,以其兩端的延伸部66會與缺口部88契合之方式,配置至底面構件92。然後,使頂面構件90嵌合至底面構件92。藉此,利用頂面構件90,基準側平行部64的連接點62,被按壓至基準電位部52。藉由這種構成,能將如第8圖所示的傳導體60,收納在外殼80中。First, the reference side parallel portion 64 and the signal side parallel portion 68 are to be disposed on the bottom surface member 92. Further, the conductor 60 is disposed on the bottom member 92 such that the extending portions 66 at both ends thereof are in contact with the notch portion 88. Then, the top member 90 is fitted to the bottom member 92. Thereby, the connection point 62 of the reference side parallel portion 64 is pressed to the reference potential portion 52 by the top surface member 90. With this configuration, the conductor 60 as shown in Fig. 8 can be housed in the casing 80.
第11圖是表示複數個傳送單元50的配置例。如第11圖所示,各個傳送單元50的信號側平行部68,也能被配置在自己的傳送單元50中的信號傳送部54與其他任一個傳送單元50中的信號傳送部54之中間。藉由這種配置,能利用基準電位的傳導體60來包圍信號傳送部54的周圍。Fig. 11 is a diagram showing an example of the arrangement of a plurality of transfer units 50. As shown in Fig. 11, the signal side parallel portion 68 of each of the transfer units 50 can also be disposed between the signal transfer portion 54 of the own transfer unit 50 and the signal transfer portion 54 of any other transfer unit 50. With this arrangement, the periphery of the signal transmission portion 54 can be surrounded by the conductor 60 of the reference potential.
另外,相關於第1圖至第11圖所說明的傳導體60和外殼80,也能是追加構件,其被用於含有信號傳送部54和基準電位部52之傳送單元50中。例如,傳導體60和外殼80,是一種追加構件,用以提升已經實際運作的試驗裝置100中的傳送單元50的性能。至少兩個連接點62,能相對於基準電位部52以可裝上卸下之方式作接觸,所以對於已經運作的傳送單元50,能容易地追加傳導體60和外殼80。因此,相較於設計製造新的傳送單元50,能更廉價地將傳送單元50加以高性能化。Further, the conductor 60 and the casing 80 described with reference to FIGS. 1 to 11 may be additional members used in the transmission unit 50 including the signal transmission portion 54 and the reference potential portion 52. For example, the conductor 60 and the outer casing 80 are additional components for enhancing the performance of the transfer unit 50 in the test apparatus 100 that has actually been operated. Since at least two connection points 62 can be attached to the reference potential portion 52 so as to be detachable, the conductor 60 and the outer casing 80 can be easily added to the already-operated transfer unit 50. Therefore, the transfer unit 50 can be improved in performance more inexpensively than the design and manufacture of the new transfer unit 50.
又,因為將連接點62分開設置,所以連接點62能容易地保持彈性。因此,即使將連接點62設計成相對於基準電位部52可裝上卸下,也能防止基準電位部52和基準側平行部64的電性接觸的信賴性降低。Also, since the connection points 62 are separately provided, the connection points 62 can easily maintain elasticity. Therefore, even if the connection point 62 is designed to be detachably attached to the reference potential portion 52, the reliability of electrical contact between the reference potential portion 52 and the reference side parallel portion 64 can be prevented from being lowered.
又,在傳導體60上的連接點62的數目,並不限於兩個。連接點62,也能設置更多個。但是較佳為至少在基準側平行部64的兩端,設置連接點62。也能將複數個連接點62,設置成隔開大約相等的間隔。Also, the number of connection points 62 on the conductor 60 is not limited to two. More points can be set by connecting the points 62. However, it is preferable to provide the connection point 62 at least at both ends of the reference side parallel portion 64. It is also possible to arrange a plurality of connection points 62 to be spaced apart by approximately equal intervals.
以上,雖然使用實施形態來說明本發明,但是本發明的技術範圍並不受限於上述實施形態所記載的範圍。業者係明白能夠將各種變更或改良施加至上述實施形態中。從申請專利範圍的記載能夠明白,施加有這樣的變更或改良之形態也能構包含在本發明的技術範圍中。The present invention has been described above using the embodiments, but the technical scope of the present invention is not limited to the scope described in the above embodiments. It is understood that various changes or improvements can be applied to the above embodiments. It is understood from the description of the scope of the patent application that the form in which such changes or improvements are applied can also be included in the technical scope of the present invention.
在申請專利範圍、說明書、及圖式中所示的裝置、系統、程式、以及方法中的動作、程序、步驟、及階段等各個處理的實行順序,只要不特別明示「更前」、「以前」等,或沒有將前面處理的輸出用在後面處理,則應該留意係能夠以任意順序加以實現。關於在申請專利範圍、說明書、及圖式中的動作流程,即使在方便上係使用「首先」、「接著」等來進行說明,但是並不意味必須以這個順序來實施。The order of execution of the processes, procedures, steps, and stages in the devices, systems, programs, and methods shown in the claims, the description, and the drawings is not specifically stated as "before" or "before" Etc., or if the previously processed output is not used for later processing, it should be noted that it can be implemented in any order. The operation flow in the patent application scope, the specification, and the drawings is described using "first", "continued", etc., in convenience, but it does not mean that it must be implemented in this order.
10...元件板10. . . Component board
12...端子12. . . Terminal
14...端子14. . . Terminal
16...端子16. . . Terminal
18...端子18. . . Terminal
20...母板20. . . motherboard
30...測試頭30. . . Test head
40...測試板40. . . Test board
42...端子42. . . Terminal
50...傳送單元50. . . Transfer unit
52...基準電位部52. . . Reference potential section
54...信號傳送部54. . . Signal transmission department
60...傳導體60. . . Conductor
62...連接點62. . . Junction
64...基準側平行部64. . . Reference side parallel
66...延伸部66. . . Extension
68...信號側平行部68. . . Signal side parallel
70...電感分量70. . . Inductance component
72...電容分量72. . . Capacitance component
74...電感分量74. . . Inductance component
80...外殼80. . . shell
82...基準側區域82. . . Reference side area
84...信號側區域84. . . Signal side area
86...分隔壁86. . . Partition wall
88...缺口部88. . . Notch
90...頂面構件90. . . Top member
92...底面構件92. . . Bottom member
100...試驗裝置100. . . Test device
200...被試驗元件200. . . Tested component
第1圖是表示試驗裝置100的構成例。FIG. 1 is a view showing an example of the configuration of the test apparatus 100.
第2A圖是表示傳送單元50的側面圖的一例。FIG. 2A is an example of a side view showing the transfer unit 50.
第2B圖是表示傳送單元50的俯視圖的一例。FIG. 2B is an example of a plan view showing the transfer unit 50.
第2C圖是表示傳送單元50的剖面圖的一例。FIG. 2C is an example of a cross-sectional view showing the transfer unit 50.
第3圖表示傳送單元50的等價電路的一例。FIG. 3 shows an example of an equivalent circuit of the transfer unit 50.
第4圖是表示傳導體60的構造例。Fig. 4 is a view showing an example of the structure of the conductor 60.
第5A圖是表示外殼80的剖面圖的一例,該外殼80以使傳導體60接觸到基準電位部52的狀態來保持該傳導體60。5A is an example of a cross-sectional view showing the outer casing 80 that holds the conductor 60 in a state in which the conductor 60 is brought into contact with the reference potential portion 52.
第5B圖是表示外殼80的俯視圖的一例。FIG. 5B is an example of a plan view showing the outer casing 80.
第5C圖是表示被設置在外殼80中之分隔壁86的側視圖的一例。FIG. 5C is an example of a side view showing the partition wall 86 provided in the outer casing 80.
第6圖是表示外殼80的斜視圖的一例,該外殼80已插入有基準電位部52、信號傳送部54及傳導體60。Fig. 6 is a view showing an example of a perspective view of the outer casing 80 in which the reference potential portion 52, the signal transmission portion 54, and the conductor 60 are inserted.
第7A圖是表示被插入基準側區域82中之基準側平行部64的側面圖的一例。FIG. 7A is an example of a side view showing the reference-side parallel portion 64 inserted into the reference side region 82.
第7B圖是表示被插入信號側區域84中之信號側平行部68的側面圖的一例。Fig. 7B is a view showing an example of a side view of the signal side parallel portion 68 inserted into the signal side region 84.
第8圖是表示傳導體60的其他構造例的俯視圖。Fig. 8 is a plan view showing another structural example of the conductor 60.
第9圖是表示外殼80的其他構造例。Fig. 9 is a view showing another configuration example of the outer casing 80.
第10圖是表示第9圖所示的外殼80中的分隔壁86的側面圖。Fig. 10 is a side view showing the partition wall 86 in the outer casing 80 shown in Fig. 9.
第11圖是表示複數個傳送單元50的配置例。Fig. 11 is a diagram showing an example of the arrangement of a plurality of transfer units 50.
18...端子18. . . Terminal
40...測試板40. . . Test board
42...端子42. . . Terminal
50...傳送單元50. . . Transfer unit
52...基準電位部52. . . Reference potential section
60...傳導體60. . . Conductor
62...連接點62. . . Junction
Claims (16)
Applications Claiming Priority (1)
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PCT/JP2010/004583 WO2012007995A1 (en) | 2010-07-14 | 2010-07-14 | Transmission unit, supplementary member used for transmission unit, and test equipment |
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TW201217803A TW201217803A (en) | 2012-05-01 |
TWI429927B true TWI429927B (en) | 2014-03-11 |
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TW100120405A TWI429927B (en) | 2010-07-14 | 2011-06-10 | A transfer unit, an additional member for the transport unit, and a test device |
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KR (1) | KR101230297B1 (en) |
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