WO2012004106A1 - Electrically conductive connection between two contact surfaces - Google Patents

Electrically conductive connection between two contact surfaces Download PDF

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Publication number
WO2012004106A1
WO2012004106A1 PCT/EP2011/060031 EP2011060031W WO2012004106A1 WO 2012004106 A1 WO2012004106 A1 WO 2012004106A1 EP 2011060031 W EP2011060031 W EP 2011060031W WO 2012004106 A1 WO2012004106 A1 WO 2012004106A1
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WO
WIPO (PCT)
Prior art keywords
electrically conductive
contact surfaces
conductive connection
metal
metal wire
Prior art date
Application number
PCT/EP2011/060031
Other languages
German (de)
French (fr)
Inventor
Hans Rappl
Original Assignee
Continental Automotive Gmbh
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Continental Automotive Gmbh filed Critical Continental Automotive Gmbh
Publication of WO2012004106A1 publication Critical patent/WO2012004106A1/en

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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
    • H01L24/85—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a wire connector
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K31/00—Processes relevant to this subclass, specially adapted for particular articles or purposes, but not covered by only one of the preceding main groups
    • B23K31/02—Processes relevant to this subclass, specially adapted for particular articles or purposes, but not covered by only one of the preceding main groups relating to soldering or welding
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K2101/00—Articles made by soldering, welding or cutting
    • B23K2101/36—Electric or electronic devices
    • B23K2101/38—Conductors
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    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/00014—Technical content checked by a classifier the subject-matter covered by the group, the symbol of which is combined with the symbol of this group, being disclosed without further technical details
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    • H01R4/00—Electrically-conductive connections between two or more conductive members in direct contact, i.e. touching one another; Means for effecting or maintaining such contact; Electrically-conductive connections having two or more spaced connecting locations for conductors and using contact members penetrating insulation
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Definitions

  • Metal ribbon Such an electrically conductive connection is known for example from DE 10 2006 025 870 AI. There are two contact surfaces by means of one of several layers
  • Bonden is a long-known
  • the object of the invention is to provide an electrically conductive connection that allows the connection of different contact surfaces while still being automated and thus inexpensive to manufacture.
  • the object is achieved in a generic electrically conductive connection characterized in that at least one of the connected to the contact surfaces by bonding ends of the metal wire or metal strip in addition to the
  • Connection could not be permanently charged. By the additional welding process according to the invention, however, a good electrical and mechanically stable connection is achieved.
  • the contact surface to be welded is relatively thin, for example a copper conductor on a printed circuit board (PCB), a metal plate is advantageously applied to this contact surface, for example soldered, onto which then the end of the metal wire or
  • PCB printed circuit board
  • Metallbitzchens first bonded and then welded. This process is also easy to automate, since the metal plate can be applied and soldered together with semiconductor or other components to be placed, for example.
  • Figure 3 The arrangement of a metal plate on a
  • FIG. 1 shows a first circuit carrier 1, from which an electrically conductive connection is made to a second circuit carrier 2.
  • an electrical component 3 is arranged on the first circuit carrier 1 and a first contact surface 12 is provided.
  • the second circuit carrier 2 is formed metallic in the example shown.
  • a bond ribbon 4 which is constructed in the illustrated example of two layers, which are indicated by a dashed line.
  • the first layer 5 is made of copper, for example, and the second layer 7 of aluminum, so that on the one hand a high current carrying capacity is given by the copper and good bondability through the aluminum.
  • the bond ribbon may have the usual rectangular cross section today, but any cross sections, as disclosed for example in DE 10 2006 025 868 AI, possible.
  • the invention is instead of a bond ribbon with a
  • Such a coated tape has the advantage of being for bonding at first
  • Circuit board 1 is optimally suited.
  • multi-layer ribbon can be used in sandwich construction. It is also possible to use tapes with surfaces that are applied, for example, galvanically or chemically. Here, surface layers in the range of a few hundred to several micrometers are possible.
  • FIG. 2 shows short weld seams 11 which connect the copper layer 5 of the bonding tape 4 to the metal of the second circuit substrate 2.
  • the aluminum layer 7 is bridged. Instead of the short welds, a continuous weld seam can also be guided around the contact point.
  • the welding process can be produced by resistance welding, gap electrode welding or other welding methods. Laser welding is particularly suitable because it allows fully automatic production of welds in an adapted form.
  • the second circuit substrate 2 is not made of solid metal but, for example, as a printed circuit board with copper conductor tracks 8 applied thereon
  • Copper tracks 8 a weld with a on it

Abstract

The invention relates to an electrically conductive connection between two contact surfaces (1, 2) by means of a metal wire or metal strip (4) that is bonded to the contact surfaces (1, 2). At least one of the ends of the metal wire (4) or metal strip that are bonded to the contact surfaces (1, 2) is also welded (11) to the contact surface (2; 8).

Description

Beschreibung description
Elektrisch leitende Verbindung zwischen zwei Kontaktflächen Die Erfindung betrifft eine elektrisch leitende Verbindung zwischen zwei Kontaktflächen mittels eines durch Bonden mit den Kontaktflächen verbundenen Metalldrahtes oder Electrically conductive connection between two contact surfaces The invention relates to an electrically conductive connection between two contact surfaces by means of a metal wire connected by bonding to the contact surfaces or
Metallbändchens . Eine solche elektrisch leitende Verbindung ist beispielsweise aus der DE 10 2006 025 870 AI bekannt. Dort werden zwei Kontaktflächen mittels eines aus mehreren Schichten Metal ribbon. Such an electrically conductive connection is known for example from DE 10 2006 025 870 AI. There are two contact surfaces by means of one of several layers
aufgebauten metallischen Bondbändchens durch Bonden constructed metallic bond ribbon by bonding
miteinander verbunden. connected with each other.
Bonden ist dabei eine seit langem bekannte Bonden is a long-known
Verbindungstechnik, bei der ein metallischer Draht oder ein metallisches Bändchen mittels Druck und Temperatur und/oder Ultraschall mit einer metallischen Kontaktfläche verschweißt wird. Um eine gut leitende und mechanisch stabile Verbindung herzustellen, ist es jedoch erforderlich, einerseits  Connection technique in which a metallic wire or a metal ribbon is welded by means of pressure and temperature and / or ultrasound with a metallic contact surface. However, to make a good conductive and mechanically stable connection, it is necessary, on the one hand
zueinander passende Materialien auszuwählen und andererseits für eine ausreichende Sauberkeit der Oberflächen der to select suitable materials and on the other hand for a sufficient cleanliness of the surfaces of
Materialien zu sorgen. Dies ist bei der Verbindung von To provide materials. This is at the connection of
Halbleiterchips mit Kontaktflächen zumeist kein Problem, da diese Fertigung in Reinräumen statt findet. Bei der Fertigung von Bauteilen oder Geräten der Leistungselektronik erfolgen jedoch viele Fertigungsschritte außerhalb von Reinräumen, so dass Kontaktoberflächen bereits verunreinigt sein können. Vor allem wenn zwei Schaltungsträger miteinander verbunden werden sollen, kommt es häufig vor, dass die Kontaktflächen des einen nicht zuverlässig bondbar sind. Semiconductor chips with contact surfaces usually no problem, as this production takes place in clean rooms. In the manufacture of components or devices of power electronics, however, many manufacturing steps outside of clean rooms, so that contact surfaces may already be contaminated. Especially when two circuit carriers are to be connected to each other, it often happens that the contact surfaces of one are not reliably bondable.
Die Aufgabe der Erfindung ist es, eine elektrisch leitende Verbindung anzugeben, die die Verbindung unterschiedlicher Kontaktflächen erlaubt und dabei trotzdem automatisiert und damit kostengünstig herzustellen ist. Die Aufgabe wird bei einer gattungsgemäßen elektrisch leitenden Verbindung dadurch gelöst, dass zumindest eines der mit den Kontaktflächen durch Bonden verbundenen Enden des Metalldrahtes oder Metallbändchens zusätzlich mit der The object of the invention is to provide an electrically conductive connection that allows the connection of different contact surfaces while still being automated and thus inexpensive to manufacture. The object is achieved in a generic electrically conductive connection characterized in that at least one of the connected to the contact surfaces by bonding ends of the metal wire or metal strip in addition to the
Kontaktfläche verschweißt ist. Contact surface is welded.
Durch den vorherigen Bondvorgang wird aufgrund nicht Due to the previous bonding process is not due
zueinander passender Materialien oder verschmutzte Matching materials or soiled
Oberflächen nur ein „Anheften" des Metalldrahtes oder Surfaces just a "pinning" of the metal wire or
Metallbändchens auf der Kontaktfläche erzielt; diese Achieved metal strip on the contact surface; these
Verbindung könnte jedoch nicht dauerhaft belastet werden. Durch den erfindungsgemäßen zusätzlichen Schweißvorgang wird jedoch eine gute elektrische und auch mechanisch stabile Verbindung erzielt.  Connection could not be permanently charged. By the additional welding process according to the invention, however, a good electrical and mechanically stable connection is achieved.
Sollte die zu verschweißende Kontaktfläche relativ dünn sein, beispielsweise eine Kupferleiterbahn auf einem Printed- Circuit-Board (PCB) , wird in vorteilhafter Weise auf dieser Kontaktfläche ein Metallplättchen angebracht, beispielsweise verlötet, auf das dann das Ende des Metalldrahtes oder If the contact surface to be welded is relatively thin, for example a copper conductor on a printed circuit board (PCB), a metal plate is advantageously applied to this contact surface, for example soldered, onto which then the end of the metal wire or
Metallbändchens zunächst gebondet und anschließend geschweißt wird. Auch dieser Vorgang ist leicht automatisierbar, da das Metallplättchen beispielsweise zusammen mit zu platzierenden Halbleiter- oder sonstigen Bauteilen aufgebracht und verlötet werden kann.  Metallbändchens first bonded and then welded. This process is also easy to automate, since the metal plate can be applied and soldered together with semiconductor or other components to be placed, for example.
In vorteilhafter Weise wird insbesondere für elektrisch leitende Verbindungen, die hohe Ströme tragen müssen, ein zumindest einseitig mit Aluminium beschichtetes Advantageously, in particular for electrically conductive compounds which have to carry high currents, at least one side coated with aluminum
Kupferbändchen verwendet. Copper ribbon used.
Um bei sich überkreuzender Anordnung solcher Metallbändchen einen elektrischen Kontakt zu vermeiden, ist in vorteilhafter Weise in einer Weiterbildung der Erfindung die den In order to avoid an electrical contact with intersecting arrangement of such metal bands, is in an advantageous embodiment of the invention, the
Kontaktflächen abgewandte Seite der Metallbändchen mit einer isolierenden Schicht versehen. Die Erfindung wird nachfolgend anhand von Figuren mit Hilfe von Ausführungsbeispielen näher beschrieben. Dabei zeigen: Figur 1 Die grundsätzliche Anordnung einer elektrisch Contact surfaces facing away from the metal strip provided with an insulating layer. The invention will be described in more detail below with reference to figures with the aid of exemplary embodiments. 1 shows the basic arrangement of an electrical
leitenden Verbindung zwischen zwei  conducting connection between two
Schaltungsträgern mittels einer Bondverbindung,  Circuit carriers by means of a bond connection,
Figur 2 In einem Ausschnitt die erfindungsgemäße Figure 2 in a section of the invention
Schweißverbindung und  Welded joint and
Figur 3 Die Anordnung eines Metallplättchens auf einer Figure 3 The arrangement of a metal plate on a
dünnen Kontaktfläche.  thin contact surface.
Die Figur 1 zeigt einen ersten Schaltungsträger 1, von dem zu einem zweiten Schaltungsträger 2 eine elektrisch leitende Verbindung hergestellt ist. Auf dem ersten Schaltungsträger 1 ist beispielsweise ein elektrisches Bauteil 3 angeordnet sowie eine erste Kontaktfläche 12 vorgesehen. Der zweite Schaltungsträger 2 ist im dargestellten Beispiel metallisch ausgebildet. Zur Verbindung dient ein Bondbändchen 4, das im dargestellten Beispiel aus zwei Schichten aufgebaut ist, die durch eine strichpunktierte Linie angedeutet sind. Dabei ist die erste Schicht 5 beispielsweise aus Kupfer und die zweite Schicht 7 aus Aluminium, so dass durch das Kupfer einerseits eine hohe Stromtragfähigkeit und durch das Aluminium eine gute Bondbarkeit gegeben ist. Das Bondbändchen kann dabei den heute üblichen rechteckigen Querschnitt haben, jedoch sind beliebige Querschnitte, wie sie beispielsweise in der DE 10 2006 025 868 AI offenbart sind, möglich. Außerdem ist die Erfindung statt mit einem Bondbändchen auch mit einem FIG. 1 shows a first circuit carrier 1, from which an electrically conductive connection is made to a second circuit carrier 2. For example, an electrical component 3 is arranged on the first circuit carrier 1 and a first contact surface 12 is provided. The second circuit carrier 2 is formed metallic in the example shown. To connect a bond ribbon 4, which is constructed in the illustrated example of two layers, which are indicated by a dashed line. In this case, the first layer 5 is made of copper, for example, and the second layer 7 of aluminum, so that on the one hand a high current carrying capacity is given by the copper and good bondability through the aluminum. The bond ribbon may have the usual rectangular cross section today, but any cross sections, as disclosed for example in DE 10 2006 025 868 AI, possible. In addition, the invention is instead of a bond ribbon with a
Bonddraht mit rundem Querschnitt realisierbar. Bonding wire with round cross section feasible.
In der Leistungselektronik, wo hohe Strome fließen, wird zumeist ein massives Kupferband mit Abmessungen von In power electronics, where high currents flow, is usually a massive copper strip with dimensions of
beispielsweise 2mm x 0,2 mm verwendet, wobei dieses for example, 2mm x 0.2mm, using this
Kupferband ein- oder auch zweiseitig mit Aluminium mit einer Schichtdicke von zum Beispiel 20μπι bis 40μπι beschichtet sein kann. Diese Beschichtung kann zum Beispiel durch Copper strip one or two sides with aluminum with a layer thickness of, for example 20μπι to 40μπι may be coated. This coating can for example by
Zusammenwalzen erzeugt werden. Ein solches beschichtetes Band hat den Vorteil, dass es für das Bonden auf den ersten Collapsing be generated. Such a coated tape has the advantage of being for bonding at first
Schaltungsträger 1 optimal geeignet ist. Für die Erfindung können auch mehrlagige Bändchen in Sandwich-Aufbau verwendet werden. Es können auch Bändchen mit Oberflächen verwendet werden, die zum Beispiel galvanisch oder chemisch aufgebracht sind. Hier sind Oberflächenschichten im Bereich von einigen lOOnm bis zu einigen Mikrometern möglich. Circuit board 1 is optimally suited. For the invention, multi-layer ribbon can be used in sandwich construction. It is also possible to use tapes with surfaces that are applied, for example, galvanically or chemically. Here, surface layers in the range of a few hundred to several micrometers are possible.
Da der zweite Schaltungsträger 2 gemäß Figur 1 keine Since the second circuit carrier 2 according to Figure 1 no
mechanisch stabile Verbindung mittels Bonden erlaubt, ist das Ende des Bonddrahtes- oder bändchens 4 lediglich durch einen Bondvorgang „angeheftet" und wird gemäß Figur 2 in mechanically stable connection by means of bonding allowed, the end of the bonding wire or ribbon 4 is merely "attached" by a bonding process and is shown in Figure 2 in
erfindungsgemäßer Weise durch einen Schweißvorgang fest mit dem Schaltungsträger 2 verbunden. Figur 2 zeigt dabei kurze Schweißnähte 11, die die Kupferschicht 5 des Bondbändchens 4 mit dem Metall des zweiten Schaltungsträgers 2 verbinden. Die Aluminiumschicht 7 wird dabei überbrückt. Statt den kurzen Schweißnähten kann auch eine durchgehende Schweißnaht um die Kontaktstelle herumgeführt werden. Der Schweißvorgang kann durch Widerstandschweißen, Spaltelektrodenschweißen oder auch andere Schweißverfahren hergestellt werden. Besonders geeignet ist das Laserschweißen, da dabei vollautomatisch Schweißnähte in angepasster Form hergestellt werden können. Für den Fall, dass der zweite Schaltungsträger 2 nicht aus massivem Metall sondern beispielsweise als Printed-Circuit- Board mit darauf aufgebrachten Kupferleiterbahnen 8 according to the invention firmly connected to the circuit substrate 2 by a welding process. FIG. 2 shows short weld seams 11 which connect the copper layer 5 of the bonding tape 4 to the metal of the second circuit substrate 2. The aluminum layer 7 is bridged. Instead of the short welds, a continuous weld seam can also be guided around the contact point. The welding process can be produced by resistance welding, gap electrode welding or other welding methods. Laser welding is particularly suitable because it allows fully automatic production of welds in an adapted form. In the event that the second circuit substrate 2 is not made of solid metal but, for example, as a printed circuit board with copper conductor tracks 8 applied thereon
ausgebildet ist, besteht die Gefahr, dass diese dünnen is formed, there is a risk that these thin
Kupferbahnen 8 einer Verschweißung mit einem darauf Copper tracks 8 a weld with a on it
gebondeten Ende eines Kupferdrahtes oder Kupferbändchens 4 nicht standhalten würden. In vorteilhafter Weise wird daher zunächst ein Metallplättchen 9 elektrisch leitend und mechanisch stabil auf der Leiterbahn 8 aufgebracht, Bonded end of a copper wire or copper ribbon 4 would not withstand. Advantageously, therefore, first a metal plate 9 is applied electrically conductive and mechanically stable on the conductor 8,
beispielsweise verlötet. Das Ende des Metalldrahtes oder Metallbändchens 4 wird dann auf dem Metallplättchen 9 zunächst gebondet und dann verschweißt. Die erfindungsgemäße elektrisch leitende Verbindung zwischen zwei Kontaktflächen ist automatisierbar, so dass auch bei großer Stückzahl eine wirtschaftliche Herstellung möglich ist. Dabei kann die Qualität der Verbindung durch bekannte automatisierte Abläufe sichergestellt werden, wobei keine speziellen Fertigungsvorrichtungen erforderlich sind, sondern auf allgemein verfügbare Vorrichtungen zurückgegriffen werden kann . for example soldered. The end of the metal wire or metal strip 4 is then first bonded to the metal plate 9 and then welded. The inventive electrically conductive connection between two contact surfaces can be automated, so that an economical production is possible even with large quantities. In this case, the quality of the connection can be ensured by known automated processes, with no special manufacturing devices are required, but can be used on commonly available devices.

Claims

Patentansprüche claims
1. Elektrisch leitende Verbindung zwischen zwei 1. Electrically conductive connection between two
Kontaktflächen (1, 2) mittels eines durch Bonden mit den Kontaktflächen (1, 2) verbundenen Metalldrahtes oder Contact surfaces (1, 2) by means of a bonded by bonding with the contact surfaces (1, 2) metal wire or
Metallbändchens (4), Metal ribbon (4),
dadurch gekennzeichnet,  characterized,
dass zumindest eines der mit den Kontaktflächen (1, 2) durch Bonden verbundenen Enden des Metalldrahtes (4) oder Metallbändchens zusätzlich mit der Kontaktfläche (2; 8) verschweißt (11) ist.  in that at least one of the ends of the metal wire (4) or metal strip connected to the contact surfaces (1, 2) is additionally welded (11) to the contact surface (2; 8).
2. Elektrisch leitende Verbindung nach Anspruch 1, 2. Electrically conductive connection according to claim 1,
dadurch gekennzeichnet, dass zwischen zumindest einem Ende des Metalldrahtes oder Metallbändchens (4) und der entsprechenden Kontaktfläche (2; 8) ein Metallplättchen (9) angebracht ist.  characterized in that between at least one end of the metal wire or metal strip (4) and the corresponding contact surface (2; 8), a metal plate (9) is mounted.
3. Elektrisch leitende Verbindung nach Anspruch 1 oder 2, dadurch gekennzeichnet, dass der Metalldraht oder das3. Electrically conductive connection according to claim 1 or 2, characterized in that the metal wire or the
Metallbändchen (4) mit Aluminium beschichtetem Kupfer gebildet ist. Metallbändchen (4) is formed with aluminum coated copper.
4. Elektrisch leitende Verbindung nach einem der 4. Electrically conductive connection to one of
vorhergehenden Ansprüche, dadurch gekennzeichnet, dass bei preceding claims, characterized in that at
Verwendung eines Metallbändchens (4) dieses einseitig mit einer Isolierschicht versehen ist. Use of a metal strip (4) which is provided on one side with an insulating layer.
PCT/EP2011/060031 2010-07-06 2011-06-16 Electrically conductive connection between two contact surfaces WO2012004106A1 (en)

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