WO2012003616A1 - Light emitting diode package structure having optical lens with fluorescent layer - Google Patents

Light emitting diode package structure having optical lens with fluorescent layer Download PDF

Info

Publication number
WO2012003616A1
WO2012003616A1 PCT/CN2010/001691 CN2010001691W WO2012003616A1 WO 2012003616 A1 WO2012003616 A1 WO 2012003616A1 CN 2010001691 W CN2010001691 W CN 2010001691W WO 2012003616 A1 WO2012003616 A1 WO 2012003616A1
Authority
WO
WIPO (PCT)
Prior art keywords
optical lens
fluorescent layer
package structure
lens
light emitting
Prior art date
Application number
PCT/CN2010/001691
Other languages
French (fr)
Chinese (zh)
Inventor
胡仲孚
吴永富
刘奎江
Original Assignee
盈胜科技股份有限公司
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 盈胜科技股份有限公司 filed Critical 盈胜科技股份有限公司
Publication of WO2012003616A1 publication Critical patent/WO2012003616A1/en

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
    • H01L33/50—Wavelength conversion elements
    • H01L33/507—Wavelength conversion elements the elements being in intimate contact with parts other than the semiconductor body or integrated with parts other than the semiconductor body
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805—Shape
    • H01L2224/4809—Loop shape
    • H01L2224/48091—Arched
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/481—Disposition
    • H01L2224/48135—Connecting between different semiconductor or solid-state bodies, i.e. chip-to-chip
    • H01L2224/48137—Connecting between different semiconductor or solid-state bodies, i.e. chip-to-chip the bodies being arranged next to each other, e.g. on a common substrate
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/481—Disposition
    • H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
    • H01L2224/48247—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a bond pad of the item
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L25/00—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof
    • H01L25/03—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes
    • H01L25/04—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers
    • H01L25/075—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group H01L33/00
    • H01L25/0753—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group H01L33/00 the devices being arranged next to each other
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
    • H01L33/58—Optical field-shaping elements

Definitions

  • the invention relates to an optical lens with a fluorescent layer applied to an LED package structure, in particular, an optical lens in which a fluorescent layer is embedded in a package structure, and can help heat dissipation and combine light mixing and light guiding functions.
  • Package structure in particular, an optical lens in which a fluorescent layer is embedded in a package structure, and can help heat dissipation and combine light mixing and light guiding functions.
  • a light-emitting diode is a solid-state semiconductor component that combines two kinds of carriers generated by a current through a diode to release energy in the form of light. It has the advantages of light weight, fast response speed, high efficiency, and the like. The field has gradually penetrated various industries.
  • FIG. 1 is a cross-sectional view of a prior art multi-layer array type LED package structure, including a substrate 10, a package module 12, a lead frame 14 and a cover 16 disposed on the substrate 10.
  • the lowermost layer of the package structure is used to integrate the substrate 10 and the lead frame 14 .
  • the substrate 10 is provided with LED die 18 arranged in an array, and the substrate 10 is made of a metal material.
  • the die 18 is electrically connected to the lead frame 14 , and the cover 16 is sealed with the package module 12 , wherein the LED die 18 is formed with an insulating protective layer 20 , and the insulating protective layer 20 covers the
  • the LED die 18 has at least one phosphor layer 22 formed on the insulating protective layer 20.
  • the disadvantage of the prior art is that the fluorescent layer on the LED chip directly absorbs the thermal energy generated by the light emission.
  • the heat resistance temperature and the thermal stability of the fluorescent layer are low, and once the heat of the light emitting chip is conducted to the fluorescent layer, The deterioration of the fluorescent material affects the luminous efficiency and the change of the chromaticity of the light.
  • the fluorescent material is formed on the light-emitting chip by injection or coating. It is often necessary to use an excessive amount of fluorescent material to ensure uniform coverage of the fluorescent layer on the light-emitting chip, which is very wasteful. The cost of raw materials, in addition, if the fluorescent layer is flawed, the light-emitting chip can not be recycled.
  • the main object of the present invention is to provide an optical lens having a fluorescent layer applied to an LED package structure, wherein the optical lens of the present invention can be separately preformed, and a fluorescent layer is embedded inside the group.
  • Optical inspection can be performed on the optical lens before installation. It can be installed when the measurement is correct.
  • the optical lens can be determined according to various light application methods, which not only shortens the manufacturing time but also has light guiding and light mixing. The features are designed to meet a variety of light application purposes.
  • Another object of the present invention is to provide an optical lens having a fluorescent layer applied to an LED package structure, which has a heat-conducting structure capable of effectively assisting the light-emitting diode, wherein an optical lens in which the fluorescent layer is embedded is spaced from the light-emitting component The distance allows the thermal energy generated by the illuminating component to be directly discharged to the air, thereby ensuring the quality of the fluorescent material and prolonging its service life.
  • Another object of the present invention is to provide an optical lens having a fluorescent layer applied to a light emitting diode package structure, wherein the amount of use of the fluorescent material can be controlled according to the number of optical lenses, and the prefabricated optical lens is independent of the light emitting component.
  • the components can not only save the cost of the fluorescent material, but also make full use of the LED chip.
  • the specific method of the present invention includes: an optical lens having a fluorescent layer applied to an LED package structure, comprising: a reverse, at least one optical lens, a lens cover and a package, wherein the substrate is located in the package structure The lowermost portion, the lens cover is located at an uppermost portion of the package structure, the optical lens is located above the substrate and below the lens cover, and the substrate is provided with a plurality of light emitting components, the package is used for packaging the substrate and The lens cover is disposed above the light emitting component through the package, the fluorescent lens is internally embedded with a fluorescent layer, and the optical lens is not in contact with the light emitting component.
  • FIG. 1 is a cross-sectional view of a prior art light emitting diode package structure.
  • Fig. 2 is a schematic cross-sectional view showing an optical lens having a fluorescent layer applied to an LED package structure of the present invention.
  • Fig. 3 is a view showing an embodiment of an optical lens having a fluorescent layer applied to an LED package structure of the present invention. .
  • Fig. 4 is a partially enlarged view showing the optical lens of Fig. 3 of the present invention.
  • Fig. 5 is a view showing another embodiment of an optical lens having a fluorescent layer applied to an LED package structure of the present invention.
  • Fig. 6 is a partially enlarged view showing the optical lens of Fig. 5 of the present invention.
  • Fig. 7 is a view showing still another embodiment of an optical lens having a fluorescent layer applied to an LED package structure of the present invention.
  • Figure 8 is a partial enlarged view showing the optical lens of Figure 7 of the present invention. detailed description
  • the optical lens having a fluorescent layer applied to the LED package structure includes a substrate 3 and at least one optical lens 4.
  • a lens cover 5 and a package body 6 are disposed at a bottommost portion of the package structure.
  • the lens cover 5 is located at an uppermost portion of the package structure.
  • the optical lens 4 is located above the substrate 3 and the lens cover 5
  • the light-emitting component 31 is disposed on the substrate 3 in an array arrangement, and the light-emitting component 31 is wire-bonded and encapsulated on the back surface of the light-emitting component 31.
  • the two lead frames 61 in the package body 6 are electrically connected, wherein the light emitting component 31 can be an LED die.
  • the optical lens 4 is disposed above the light emitting component 31 through the package body 6.
  • the optical lens 4 does not contact the light emitting component 31, but is spaced apart from the light emitting component 31 by the distance.
  • the area enclosed by the light-emitting component 31 and the optical lens 4 is a heat-dissipating space A, so that the heat energy generated by the light-emitting component 31 when light is generated can be directly dissipated into the heat-dissipating space A, so as to prevent heat energy from being directly transmitted to the optical lens.
  • the luminous efficiency of the light-emitting component is increased and the working life thereof is increased.
  • the optical lens 4 has a quadrangular shape, a circular shape, an elliptical shape or a polygonal shape.
  • the fluorescent lens 41 is embedded in the optical lens 4, so that the function of mixing light can be provided, and the top surface of the optical lens 4 can be a plane, a concave surface, a convex surface or other suitable form, and the optical lens 4
  • the bottom surface can be a flat surface, a concave surface, a convex surface or other suitable form, wherein the optical lens 4 can be manufactured before the package, and the appropriate lens pattern can be pre-formed according to different light-emitting modes.
  • the optical lens 4 of the first embodiment of the present invention is a flat lens.
  • the top surface and the bottom surface of the optical lens 41 are both planar, so that light can be directly projected through the flat lens, and the use of the fluorescent layer 41 can be achieved.
  • the required light output form and light color, and the pre-formed lens can test the optical wave length of the optical lens 4 and other optical tests in advance. Since the optical lens 4 can be separately manufactured in advance, the use of the fluorescent material can be accurately controlled, which can effectively avoid The waste of the fluorescent material and the light-emitting component not only reduces the manufacturing cost and improves the manufacturing efficiency, but also produces a corresponding light-emitting diode package structure depending on the place of use and the purpose of use.
  • the pre-manufactured optical lens 4 can be blown out to form an optical lens 4 having a hollow layer.
  • the empty layer is filled with a fluorescent material to form a fluorescent layer 41, or the preformed portion of the optical lens 4 can be completed by blowing a molded lens portion around the fluorescent material.
  • the package body 6 is used to encapsulate the substrate 3 and the lens cover 5 .
  • the optical lens 4 is disposed between the light-emitting component 31 and the lens cover 5 .
  • the optical lens 4 can pass through the package 6 as described above.
  • a reflector cover 7 is further disposed between the optical lens and the package body 6.
  • the reflector cover 7 is fixed on the inner circumferential surface of the package body 6 for reflection.
  • the light emitted by the light component 31, the reflector 7 is the main component supporting the optical lens 4.
  • the optical lens 4 can be disposed on the reflector 7, or the reflector 7 can be formed with a groove (the surface is not Shown), the optical lens 4 can thus be securely mounted in the recess.
  • FIG. 3 is a schematic view showing an embodiment of an optical lens having a fluorescent layer applied to an LED package structure according to the present invention.
  • FIG. 4 it is a partial enlarged view of the optical lens of FIG. 3 of the present invention.
  • the optical lens 4 of the present invention is a concave lens, and both the top surface and the bottom surface are concave. Therefore, the light emitted from the light-emitting component 31 can be dissipated through the optical lens 4, thereby controlling the light-emitting form. With the use of the fluorescent layer 41, a predetermined color of light can be obtained.
  • FIG. 5 a schematic view of another embodiment of an optical lens having a fluorescent layer applied to an LED package structure according to the present invention is shown in FIG. 6, which is a partial enlarged view of the optical lens of FIG.
  • the optical t-mirror 4 of the present invention is a convex lens, and both the top surface and the bottom surface are convex, so that the light emitted from the light-emitting assembly 31 can be concentrated through the optical lens 4 to obtain the desired light output.
  • the form, in combination with the use of the phosphor layer 41, can obtain a predetermined color of light.
  • FIG. 7 is a schematic view showing still another embodiment of an optical lens having a fluorescent layer applied to an LED package structure according to the present invention.
  • FIG. 8 a partial enlarged view of the optical lens of FIG. 7 of the present invention is shown.
  • the first optical lens 81 and the second optical lens 83 are further used.
  • the top surface and the bottom surface of the first optical lens 81 are both planar, and a first fluorescent layer 811 is embedded therein.
  • the bottom surface and the top surface of the second optical lens 83 are respectively a plane and a concave surface, and a second fluorescent layer 831 is embedded therein, and the first optical lens 81 can be disposed on the inner surface of the reflective cover 7, the second optical lens 83 is stacked above the first optical lens 81, and the second optical lens 83 is located below the lens cover 5.
  • the fluorescent material used by the first fluorescent layer 811 and the second fluorescent layer 831 is actually required.
  • the desired light-emitting color is obtained by matching the different lens patterns of the first optical lens 81 and the second optical lens 83 to obtain the desired light-emitting form. It should be noted that the number of optical lenses described above is determined by actual needs, and is merely illustrative of the examples used herein. It is intended to limit the scope of the invention.

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Power Engineering (AREA)
  • Led Device Packages (AREA)

Abstract

A light emitting diode package structure having an optical lens with a fluorescent layer is provided. The structure comprises a substrate (3), at least an optical lens (4), a lens cover (5) and a package body (6),wherein the optical lens (4) is located above the substrate (3) and under the lens cover (5), a plurality of light emitting modules (31) are disposed on the substrate(3), the optical lens (4) is disposed above the light emitting modules (31) by means of the package body (6),a fluorescent layer (41) is disposed inside the optical lens (4), and the optical lens (4) is separated from the light emitting modules (31). The structure can prevent moisture from penetrating the fluorescent layer, save the fluorescent material, and reduce the manufacturing cost.

Description

具有荧光层的光学透镜的发光二极管封装结构  Light-emitting diode package structure of optical lens with fluorescent layer
技术领域 Technical field
本发明涉及一种应用于发光二极管封装结构的具有荧光层的光学透镜，尤其是 在封装结构中设置了封埋有荧光层的光学透镜，且可帮助散热及兼具混光及导光功 能的封装结构。 背景技术  The invention relates to an optical lens with a fluorescent layer applied to an LED package structure, in particular, an optical lens in which a fluorescent layer is embedded in a package structure, and can help heat dissipation and combine light mixing and light guiding functions. Package structure. Background technique
发光二极管为一种固态的半导体组件，利用电流通过二极管内产生的二种载子 相互结合， 将能量以光的形式释放出来， 具有体积轻巧、 反应速度快及高效率等优 势， 使发光二极管应用领域逐渐跨足各产业界。  A light-emitting diode is a solid-state semiconductor component that combines two kinds of carriers generated by a current through a diode to release energy in the form of light. It has the advantages of light weight, fast response speed, high efficiency, and the like. The field has gradually penetrated various industries.
请参阅图 1所示， 为现有技术的多层式阵列型发光二极管封装结构的剖视图， 其包含有一基板 10、 一封装模块 12、 一导线架 14及一罩体 16 , 该基板 10设于该 封装结构的最下层， 该封装模块 12用以将该基板 10与该导线架 14结合成一体， 该基板 10上装设有为阵列排列的发光二极管晶粒 18且基板 10为金属材质， 发光 二极管晶粒 18与该导线架 14并形成电性连接，该罩体 16则与该封装模块 12相封 合，其中发光二极管晶粒 18形成有一绝缘保护层 20，该绝缘保护层 20包覆所述发 光二极管晶粒 18 , 该绝缘保护层 20之上至少再形成一荧光层 22。  1 is a cross-sectional view of a prior art multi-layer array type LED package structure, including a substrate 10, a package module 12, a lead frame 14 and a cover 16 disposed on the substrate 10. The lowermost layer of the package structure is used to integrate the substrate 10 and the lead frame 14 . The substrate 10 is provided with LED die 18 arranged in an array, and the substrate 10 is made of a metal material. The die 18 is electrically connected to the lead frame 14 , and the cover 16 is sealed with the package module 12 , wherein the LED die 18 is formed with an insulating protective layer 20 , and the insulating protective layer 20 covers the The LED die 18 has at least one phosphor layer 22 formed on the insulating protective layer 20.
然而现有技术的缺点为发光二极管晶粒上的荧光层会直接吸收由发光时产生 的热能， 一般荧光层的耐热温度及热稳定度偏低， 一旦发光芯片的热传导至该荧光 层， 将造成荧光材料的变质影响发光效率以及光色度改变， 另外将荧光材料以注入 或涂布方式形成在发光芯片上，往往须使用过量的荧光材料以确保发光芯片上均匀 覆盖有荧光层， 非常浪费原料成本， 另外若荧光层有瑕疵会导致发光芯片无法回收 使用， 再者现有技术需在荧光层制程后， 才可以进行各项光学测试， 因此业界需要 一种可事先作光学测试、 可节省制造成本、 帮助散热且可混光及导光的发光二极管 封装结构。 发明内容  However, the disadvantage of the prior art is that the fluorescent layer on the LED chip directly absorbs the thermal energy generated by the light emission. Generally, the heat resistance temperature and the thermal stability of the fluorescent layer are low, and once the heat of the light emitting chip is conducted to the fluorescent layer, The deterioration of the fluorescent material affects the luminous efficiency and the change of the chromaticity of the light. In addition, the fluorescent material is formed on the light-emitting chip by injection or coating. It is often necessary to use an excessive amount of fluorescent material to ensure uniform coverage of the fluorescent layer on the light-emitting chip, which is very wasteful. The cost of raw materials, in addition, if the fluorescent layer is flawed, the light-emitting chip can not be recycled. In addition, the prior art needs to perform various optical tests after the fluorescent layer process, so the industry needs an optical test in advance, which can save. Light-emitting diode package structure that is cost-effective, helps to dissipate heat, and can mix and guide light. Summary of the invention
本发明的主要目的在于提供一种应用于发光二极管封装结构的具有荧光层的 光学透镜， 其中， 本发明的光学透镜可单独预制成型， 其内部封埋有一荧光层， 组 装前即可针对光学透镜执行各项光学检测， 待测定无误时再予以安装， 其光学透镜 可依据各种光应用方式而决定其型式，如此不仅可縮短制造时间且同时具有导光及 混光的功能， 以满足各种光应用目的。 The main object of the present invention is to provide an optical lens having a fluorescent layer applied to an LED package structure, wherein the optical lens of the present invention can be separately preformed, and a fluorescent layer is embedded inside the group. Optical inspection can be performed on the optical lens before installation. It can be installed when the measurement is correct. The optical lens can be determined according to various light application methods, which not only shortens the manufacturing time but also has light guiding and light mixing. The features are designed to meet a variety of light application purposes.
本发明的另一目的在于提供一种应用于发光二极管封装结构的具有荧光层的 光学透镜， 其具有可有效帮助发光二极管的导热结构， 其中封埋有荧光层的光学透 镜与发光组件间隔一适当距离， 使发光组件产生的热能可直接排散到空气,. 藉以确 保荧光材料的质量及延长其使用寿命。  Another object of the present invention is to provide an optical lens having a fluorescent layer applied to an LED package structure, which has a heat-conducting structure capable of effectively assisting the light-emitting diode, wherein an optical lens in which the fluorescent layer is embedded is spaced from the light-emitting component The distance allows the thermal energy generated by the illuminating component to be directly discharged to the air, thereby ensuring the quality of the fluorescent material and prolonging its service life.
本发明的另一目的在于提供一种应用于发光二极管封装结构的具有荧光层的 光学透镜， 其中可根据光学透镜的数量来控制荧光材料的使用量， 并且预制完成的 光学透镜为独立于发光組件的构件， 如此不仅可节省荧光材料的成本， 还可以充分 利用发光二极管芯片。  Another object of the present invention is to provide an optical lens having a fluorescent layer applied to a light emitting diode package structure, wherein the amount of use of the fluorescent material can be controlled according to the number of optical lenses, and the prefabricated optical lens is independent of the light emitting component. The components can not only save the cost of the fluorescent material, but also make full use of the LED chip.
其中， 本发明的具体手段包含有： 一种应用于发光二极管封装结构的具有荧光 层的光学透镜， 包含一 反、 至少一光学透镜、 一透镜罩及一封装体， 该基板位于 该封装结构的最底层部分， 该透镜罩位于该封装结构的最上层部分， 该光学透镜位 于该基板的上方与该透镜罩的下方， 该基板上设有多个发光组件， 该封装体用以封 装该基板与该透镜罩， 该光学透镜可透过该封装体而配置于所述发光组件 上方， 该光学透镜内部封埋有一荧光层， 并且该光学透镜未接触于所述发光组件。 附图说明  The specific method of the present invention includes: an optical lens having a fluorescent layer applied to an LED package structure, comprising: a reverse, at least one optical lens, a lens cover and a package, wherein the substrate is located in the package structure The lowermost portion, the lens cover is located at an uppermost portion of the package structure, the optical lens is located above the substrate and below the lens cover, and the substrate is provided with a plurality of light emitting components, the package is used for packaging the substrate and The lens cover is disposed above the light emitting component through the package, the fluorescent lens is internally embedded with a fluorescent layer, and the optical lens is not in contact with the light emitting component. DRAWINGS
图 1为现有技术的发光二极管封装结构的剖视图。  1 is a cross-sectional view of a prior art light emitting diode package structure.
图 2为显示本发明的应用于发光二极管封装结构的具有荧光层的光学透镜的剖 面示意图。  Fig. 2 is a schematic cross-sectional view showing an optical lens having a fluorescent layer applied to an LED package structure of the present invention.
图 3为显示本发明的应用于发光二极管封装结构的具有荧光层的光学透镜的一 实施例示意图。 .  Fig. 3 is a view showing an embodiment of an optical lens having a fluorescent layer applied to an LED package structure of the present invention. .
图 4为显示本发明的图 3的光学透镜的局部放大图。  Fig. 4 is a partially enlarged view showing the optical lens of Fig. 3 of the present invention.
图 5为显示本发明的应用于发光二极管封装结构的具有荧光层的光学透镜的另 一实施例示意图。  Fig. 5 is a view showing another embodiment of an optical lens having a fluorescent layer applied to an LED package structure of the present invention.
图 6为显示本发明的图 5的光学透镜的局部放大图。  Fig. 6 is a partially enlarged view showing the optical lens of Fig. 5 of the present invention.
图 7为显示本发明的应用于发光二极管封装结构的具有荧光层的光学透镜的又 一实施例示意图。  Fig. 7 is a view showing still another embodiment of an optical lens having a fluorescent layer applied to an LED package structure of the present invention.
图 8为显示本发明的图 7的光学透镜的局部放大图。 具体实施方式 Figure 8 is a partial enlarged view showing the optical lens of Figure 7 of the present invention. detailed description
以下配合说明书附图对本发明的实施方式做更详细的说明， 以使本领域技术人 员在研读本说明书后能据以实施。  The embodiments of the present invention will be described in more detail below with reference to the accompanying drawings, so that those skilled in the art can.
参阅图 2 , 为本发明的应用于发光二极管封装结构的具有荧光层的光学透镜的 剖面示意图。 图中显示出本发明的第一实施例， 并藉以详细说明本发明内容， 其中 本发明所提供的应用于发光二极管封装结构的具有荧光层的光学透镜包括一基板 3、 至少一光学透镜 4、一透镜罩 5及一封装体 6 , 该基板 3位于该封装结构的最底 层部分， 该透镜罩 5位于该封装结构的最上层部分， 该光学透镜 4位于该基板 3的 上方与该透镜罩 5的下方， 该 反 3上设有多个发光组件 31 , 所述发光组件 31以 阵列排列的方式设置于该基板 3上， 所述发光组件 31以打线接合 ( Wire bonding ) 方式与封设于封装体 6中的两导线架 61形成电性连接的关系， 其中该发光组件 31 可以是一发光二极管晶粒。  Referring to Fig. 2, there is shown a cross-sectional view of an optical lens having a fluorescent layer applied to an LED package structure of the present invention. The first embodiment of the present invention is shown in the drawings, and the present invention is described in detail. The optical lens having a fluorescent layer applied to the LED package structure includes a substrate 3 and at least one optical lens 4. a lens cover 5 and a package body 6 are disposed at a bottommost portion of the package structure. The lens cover 5 is located at an uppermost portion of the package structure. The optical lens 4 is located above the substrate 3 and the lens cover 5 The light-emitting component 31 is disposed on the substrate 3 in an array arrangement, and the light-emitting component 31 is wire-bonded and encapsulated on the back surface of the light-emitting component 31. The two lead frames 61 in the package body 6 are electrically connected, wherein the light emitting component 31 can be an LED die.
该光学透镜 4透过该封装体 6而配置于所述发光组件 31的上方，该光学透镜 4 并未接触到所述发光组件 31 , 而是与所迷发光组件 31相隔有一间距， 而所述发光 组件 31与该光学透镜 4围成的区域为一散热空间 A, 如此所述发光组件 31产生光 线时所制造热能则可直接逸散到该散热空间 A, 以避免热能直接传导到该光学透镜 4中， 同时提升发光组件的发光效能及增加其工作寿命， 其中该光学透镜 4呈一四 边形、 一圆形、 一椭圆形或一多边型的形状。  The optical lens 4 is disposed above the light emitting component 31 through the package body 6. The optical lens 4 does not contact the light emitting component 31, but is spaced apart from the light emitting component 31 by the distance. The area enclosed by the light-emitting component 31 and the optical lens 4 is a heat-dissipating space A, so that the heat energy generated by the light-emitting component 31 when light is generated can be directly dissipated into the heat-dissipating space A, so as to prevent heat energy from being directly transmitted to the optical lens. In the fourth embodiment, the luminous efficiency of the light-emitting component is increased and the working life thereof is increased. The optical lens 4 has a quadrangular shape, a circular shape, an elliptical shape or a polygonal shape.
其中该光学透镜 4内部并封埋有一荧光层 41 ,如此可提供混光的功能，并且该 光学透镜 4的顶面可以是一平面、 一凹面、 一凸面或其它适当形式, 而该光学透镜 4的底面可以是一平面、 一凹面、 一凸面或其它适当形式， 其中该光学透镜 4可预 先于封装前制造， 并可依据不同出光方式来预制适当的透镜型式。  The fluorescent lens 41 is embedded in the optical lens 4, so that the function of mixing light can be provided, and the top surface of the optical lens 4 can be a plane, a concave surface, a convex surface or other suitable form, and the optical lens 4 The bottom surface can be a flat surface, a concave surface, a convex surface or other suitable form, wherein the optical lens 4 can be manufactured before the package, and the appropriate lens pattern can be pre-formed according to different light-emitting modes.
比如在本发明第一实施例的光学透镜 4为一平板透镜， 该光学透镜 41的顶面 与底面皆为一平面， 使光线经由平板透镜可以直接投射出去， 再配合荧光层 41 的 使用藉以达成所需的出光形式及光色， 另外预制成型的透镜可事先测试光学透镜 4 的光波长度及其它光学测试， 由于光学透镜 4可单独事先地制造， 可精确控管荧光 材料的使用， 可有效避免荧光材料及发光组件的浪费， 不仅降低制造成本及提高制 造效率， 更能依据使用场所及使用目的的考虑， 制造出相对应的发光二极管封装结 构。  For example, the optical lens 4 of the first embodiment of the present invention is a flat lens. The top surface and the bottom surface of the optical lens 41 are both planar, so that light can be directly projected through the flat lens, and the use of the fluorescent layer 41 can be achieved. The required light output form and light color, and the pre-formed lens can test the optical wave length of the optical lens 4 and other optical tests in advance. Since the optical lens 4 can be separately manufactured in advance, the use of the fluorescent material can be accurately controlled, which can effectively avoid The waste of the fluorescent material and the light-emitting component not only reduces the manufacturing cost and improves the manufacturing efficiency, but also produces a corresponding light-emitting diode package structure depending on the place of use and the purpose of use.
其中可预制造的光学透镜 4可以先吹出成型一具有中空层的光学透镜 4， 该中 空层供荧光材料注入而形成一荧光层 41，或者亦可于荧光材料的周边吹出成型透镜 部份而完成该光学透镜 4的预制。 要注意的是， 上述本发明的第一实施^中所使用 的平板透镜只是用以方便说明的实例而已， 并不是用以限定本发明的范围， 亦即任 何形式的透镜都落在本发明的范围之内。 The pre-manufactured optical lens 4 can be blown out to form an optical lens 4 having a hollow layer. The empty layer is filled with a fluorescent material to form a fluorescent layer 41, or the preformed portion of the optical lens 4 can be completed by blowing a molded lens portion around the fluorescent material. It is to be noted that the above-described flat lens used in the first embodiment of the present invention is merely an example for convenience of explanation, and is not intended to limit the scope of the present invention, that is, any form of lens falls on the present invention. Within the scope.
该封装体 6用以封装该基板 3与该透镜罩 5 , 该光学透镜 4设置于所述发光组 件 31与该透镜罩 5之间， 如前所述该光学透镜 4可透过该封装体 6而配置于所述 发光組件 31的上方， 或者， 该光学透镜与 4该封装体 6之间可进一步设置有一反 射罩 7，该反射罩 7固设于该封装体 6的内周面上以反射所 光组件 31发出的光， 该反射罩 7为支撑该光学透镜 4的主要构件，该光学透镜 4可安置于该反射罩 7之 上， 或者该反射罩 7可形成有一凹槽 （图面未显示）， 如此该光学透镜 4可稳固地 安装在该凹槽中。  The package body 6 is used to encapsulate the substrate 3 and the lens cover 5 . The optical lens 4 is disposed between the light-emitting component 31 and the lens cover 5 . The optical lens 4 can pass through the package 6 as described above. A reflector cover 7 is further disposed between the optical lens and the package body 6. The reflector cover 7 is fixed on the inner circumferential surface of the package body 6 for reflection. The light emitted by the light component 31, the reflector 7 is the main component supporting the optical lens 4. The optical lens 4 can be disposed on the reflector 7, or the reflector 7 can be formed with a groove (the surface is not Shown), the optical lens 4 can thus be securely mounted in the recess.
参阅图 3， 为本发明应用于发光二极管封装结构的具有荧光层的光学透镜的一 实施例示意图， 参阅图 4， 为本发明的图 3的光学透镜的局部放大图。 在图中， 本 发明的该光学透镜 4 为一凹透镜， 其顶面与底面皆为一凹面状， 因此发光组件 31 的射出光线经由该光学透镜 4可以发散出去， 藉以控制的出光形式， 再配合荧光层 41的使用， 即可获得预定的光色。  3 is a schematic view showing an embodiment of an optical lens having a fluorescent layer applied to an LED package structure according to the present invention. Referring to FIG. 4, it is a partial enlarged view of the optical lens of FIG. 3 of the present invention. In the figure, the optical lens 4 of the present invention is a concave lens, and both the top surface and the bottom surface are concave. Therefore, the light emitted from the light-emitting component 31 can be dissipated through the optical lens 4, thereby controlling the light-emitting form. With the use of the fluorescent layer 41, a predetermined color of light can be obtained.
参阅图 5, 为本发明的应用于发光二极管封装结构的具有荧光层的光学透镜的 另一实施例示意图， 参阅图 6， 为本发明的图 5的光学透镜的局部放大图。 在图 5 中， 本发明的该光学t镜 4为一凸透镜， 其顶面与底面皆为一凸面状， 因此发光组 件 31的射出光线经由该光学透镜 4可以汇聚起来， 藉以获得所需的出光形式， 再 配合荧光层 41的使用， 即可获得预定的光色。  Referring to FIG. 5, a schematic view of another embodiment of an optical lens having a fluorescent layer applied to an LED package structure according to the present invention is shown in FIG. 6, which is a partial enlarged view of the optical lens of FIG. In FIG. 5, the optical t-mirror 4 of the present invention is a convex lens, and both the top surface and the bottom surface are convex, so that the light emitted from the light-emitting assembly 31 can be concentrated through the optical lens 4 to obtain the desired light output. The form, in combination with the use of the phosphor layer 41, can obtain a predetermined color of light.
参阅图 7 , 为本发明的应用于发光二极管封装结构的具有荧光层的光学透镜的 又一实施例示意图， 参阅图 8， 为本发明的图 7的光学透镜的局部放大图。在图中， 本发明可进一步使用一第一光学透镜 81及一第二光学透镜 83,该第一光学透镜 81 的顶面与底面皆为一平面，其内封埋有一第一荧光层 811，第二光学透镜 83的底面 与顶面分别为一平面与一凹面， 其内封埋有一第二荧光层 831， 第一光学透镜 81 可安置于该反射罩 7的内面上，该第二光学透镜 83则叠设于该第一光学透镜 81的 上方， 该第二光学透镜 83则位于该透镜罩 5的下方， 该第一荧光层 811与第二荧 光层 831所使用的荧光材料视实际需求而定， 以获得所需出光颜色， 再藉由第一光 学透镜 81及第二光学透镜 83不同透镜型式的搭配来获得所需的出光形式。要注意 的是， 上述的光学透镜的数目祝实际需要而定， 在此仅是说明用的实例而已， 并非 用以限制本发明的范围。 FIG. 7 is a schematic view showing still another embodiment of an optical lens having a fluorescent layer applied to an LED package structure according to the present invention. Referring to FIG. 8, a partial enlarged view of the optical lens of FIG. 7 of the present invention is shown. In the figure, the first optical lens 81 and the second optical lens 83 are further used. The top surface and the bottom surface of the first optical lens 81 are both planar, and a first fluorescent layer 811 is embedded therein. The bottom surface and the top surface of the second optical lens 83 are respectively a plane and a concave surface, and a second fluorescent layer 831 is embedded therein, and the first optical lens 81 can be disposed on the inner surface of the reflective cover 7, the second optical lens 83 is stacked above the first optical lens 81, and the second optical lens 83 is located below the lens cover 5. The fluorescent material used by the first fluorescent layer 811 and the second fluorescent layer 831 is actually required. The desired light-emitting color is obtained by matching the different lens patterns of the first optical lens 81 and the second optical lens 83 to obtain the desired light-emitting form. It should be noted that the number of optical lenses described above is determined by actual needs, and is merely illustrative of the examples used herein. It is intended to limit the scope of the invention.
以上所述仅为用以解释本发明的较佳实施例，并非企图据以对本发明做任何形 式上的限制， 因此， 凡有在相同的创作精神下所作有关本发明的任何修饰或变更， 皆仍应包括在本发明意图保护的范畴。  The above description is only for the purpose of explaining the preferred embodiments of the present invention, and is not intended to limit the invention in any way. Therefore, any modifications or changes relating to the present invention in the same spirit of creation are It should still be included in the scope of the invention as intended.

Claims

权刺要求 Spur demand
1. 一种应用于发光二极管封装结构的具有荧光层的光学透镜， 包含一基板、 至少一光学透镜、一透镜罩及一封装体， 该基板位于该封装结构的最底层部分， 该 透镜罩位于该封装结构的最上层部分，该光学透镜位于该基板的上方与该透镜罩的 下方， 该基板上设有多个发光组件， 该封装体用以封装该基板与该透镜罩, 该光学 透镜可透过该封装体而配置于所述发光组件的上方， 其特征在于， An optical lens having a fluorescent layer applied to an LED package structure, comprising a substrate, at least one optical lens, a lens cover and a package, the substrate being located at a bottommost portion of the package structure, the lens cover being located An uppermost portion of the package structure, the optical lens is located above the substrate and below the lens cover, and the substrate is provided with a plurality of light emitting components, the package is used for encapsulating the substrate and the lens cover, and the optical lens can be Disposed above the light emitting component through the package, wherein
该光学透镜内部封埋有一荧光层， 并且该光学透镜未接触于所述发光组件。 A fluorescent layer is embedded inside the optical lens, and the optical lens is not in contact with the light emitting component.
2. 如权利要求 1所述的应用于发光二极管封装结构的具有荧光层的光学透镜， 其特征在于， 该发光组件是一发光二极管晶粒。 2. The optical lens with a fluorescent layer applied to an LED package structure according to claim 1, wherein the light emitting component is a light emitting diode die.
3. 如权利要求 1所述的应用于发光二极管封装结构的具有荧光层的光学透镜， 其特征在于， 所述发光组件以阵列排列的方式设置于该基板上。  3. The optical lens with a fluorescent layer applied to an LED package structure according to claim 1, wherein the light emitting components are arranged on the substrate in an array arrangement.
4. 如权利要求 1所述的应用于发光二极管封装结构的具有荧光层的光学透镜， 其特征在于， 该光学透镜与该封装体之间进一步设置有一反射罩， 该反射罩固设于 该封装体的内周面上以反射所述发光组件发出的光， 而该光学透镜则安置于该反射 罩之上。  The optical lens with a fluorescent layer applied to the LED package structure of claim 1 , further comprising a reflector disposed between the optical lens and the package, the reflector being fixed in the package The inner peripheral surface of the body reflects light emitted by the light emitting component, and the optical lens is disposed on the reflective cover.
5. 如权利要求 1所述的应用于发光二极管封装结构的具有荧光层的光学透镜， 其特征在于， 该反射罩形成有一供该光学透镜安装的凹槽。  5. The optical lens with a fluorescent layer applied to an LED package structure according to claim 1, wherein the reflective cover is formed with a recess for mounting the optical lens.
6. 如权利要求 1所述的应用于发光二极管封装结构的具有荧光层的光学透镜， 其特征在于， 该光学透镜的顶面为一平面、 一凹面或一凸面的至少其中一。  The optical lens with a fluorescent layer applied to the LED package structure according to claim 1, wherein the top surface of the optical lens is at least one of a plane, a concave surface or a convex surface.
7. 如权利要求 1所述的应用于发光二极管封装结构的具有荧光层的光学透镜， 其特征在于， 该光学透镜的底面为一平面、 一凹面或一凸面的至少其中一。  The optical lens with a fluorescent layer applied to the LED package structure according to claim 1, wherein the bottom surface of the optical lens is at least one of a plane, a concave surface or a convex surface.
PCT/CN2010/001691 2010-07-06 2010-10-25 Light emitting diode package structure having optical lens with fluorescent layer WO2012003616A1 (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
CN201010218568.2 2010-07-06
CN2010102185682A CN102315361A (en) 2010-07-06 2010-07-06 Optical lens with fluorescent layer applied to light emitting diode encapsulating structure

Publications (1)

Publication Number Publication Date
WO2012003616A1 true WO2012003616A1 (en) 2012-01-12

Family

ID=45428325

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/CN2010/001691 WO2012003616A1 (en) 2010-07-06 2010-10-25 Light emitting diode package structure having optical lens with fluorescent layer

Country Status (2)

Country Link
CN (1) CN102315361A (en)
WO (1) WO2012003616A1 (en)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2014189221A1 (en) * 2013-05-23 2014-11-27 엘지이노텍주식회사 Light-emitting module

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN1937268A (en) * 2005-09-22 2007-03-28 三星电机株式会社 Light emitting diode package and method for manufacturing the same
CN101515053A (en) * 2008-02-18 2009-08-26 一诠精密工业股份有限公司 Lens module and illuminating device
CN201732813U (en) * 2010-07-07 2011-02-02 盈胜科技股份有限公司 Optical lens with fluorescent layer applied to light-emitting diode packaging structure

Family Cites Families (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20040223315A1 (en) * 2003-03-03 2004-11-11 Toyoda Gosei Co., Ltd. Light emitting apparatus and method of making same
DE602004028648D1 (en) * 2003-11-25 2010-09-23 Panasonic Elec Works Co Ltd LIGHT-EMITTING COMPONENT WITH A LIGHT DIODE CHIP
DE102006020529A1 (en) * 2005-08-30 2007-03-01 Osram Opto Semiconductors Gmbh Optoelectronic component has semiconductor body emitting electromagnetic radiation that passes through an optical element comprising wavelength conversion material

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN1937268A (en) * 2005-09-22 2007-03-28 三星电机株式会社 Light emitting diode package and method for manufacturing the same
CN101515053A (en) * 2008-02-18 2009-08-26 一诠精密工业股份有限公司 Lens module and illuminating device
CN201732813U (en) * 2010-07-07 2011-02-02 盈胜科技股份有限公司 Optical lens with fluorescent layer applied to light-emitting diode packaging structure

Also Published As

Publication number Publication date
CN102315361A (en) 2012-01-11

Similar Documents

Publication Publication Date Title
US9528666B2 (en) Integrated LED based illumination device
JP5271509B2 (en) Light emitting diode package element with internal meniscus for positioning the lens without bubbles
KR101937643B1 (en) A light emitting module, a lamp, a luminaire and a display device
JP6121915B2 (en) Light emitting module, lamp, lighting fixture, and display device
US8030762B2 (en) Light emitting diode package having anodized insulation layer and fabrication method therefor
WO2012132736A1 (en) Lighting device and light source device
US20090057708A1 (en) LED Light Source Having Improved Resistance to Thermal Cycling
US20100109040A1 (en) Chip coated light emitting diode package and manufacturing method thereof
US20110089815A1 (en) Light-emitting device
JP4752795B2 (en) Light source device for lighting equipment
US8714797B2 (en) Integrally formed multi-layer light-emitting device
JP2010278246A (en) Light emitting module and method of manufacturing the same
WO2017038209A1 (en) Light emission device and method for manufacturing same
JP6566791B2 (en) Light emitting device
JP6646982B2 (en) Light emitting device
JP4417757B2 (en) LIGHT EMITTING DEVICE, ITS MANUFACTURING METHOD, AND LIGHTING DEVICE
KR20100003469A (en) Led package
KR101401919B1 (en) Lighting device of multi level type for integrated high-efficiency
WO2012003616A1 (en) Light emitting diode package structure having optical lens with fluorescent layer
JP2017050344A (en) Light-emitting device
JP6643831B2 (en) Light emitting device
JP2015090853A (en) Luminaire and lens
JP3180453U (en) Integrated high-efficiency lighting device with multilayer structure
JP2013149690A (en) Light-emitting device and illuminating device
JP2017050104A (en) Light emitting device

Legal Events

Date Code Title Description
121 Ep: the epo has been informed by wipo that ep was designated in this application

Ref document number: 10854276

Country of ref document: EP

Kind code of ref document: A1

NENP Non-entry into the national phase

Ref country code: DE

32PN Ep: public notification in the ep bulletin as address of the adressee cannot be established

Free format text: NOTING OF LOSS OF RIGHTS PURSUANT TO RULE 112(1) EPC (EPO FORM 1205A DATED 17/05/2013)

122 Ep: pct application non-entry in european phase

Ref document number: 10854276

Country of ref document: EP

Kind code of ref document: A1