WO2011158983A1 - Method for bonding lead frames for a semiconductor device - Google Patents

Method for bonding lead frames for a semiconductor device Download PDF

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Publication number
WO2011158983A1
WO2011158983A1 PCT/KR2010/003960 KR2010003960W WO2011158983A1 WO 2011158983 A1 WO2011158983 A1 WO 2011158983A1 KR 2010003960 W KR2010003960 W KR 2010003960W WO 2011158983 A1 WO2011158983 A1 WO 2011158983A1
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WO
WIPO (PCT)
Prior art keywords
welding
lead frame
lead frames
bonding
cutting
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Application number
PCT/KR2010/003960
Other languages
French (fr)
Korean (ko)
Inventor
유춘환
류재칠
김성호
Original Assignee
Ryu Chun Whan
Ryu Jae Chil
Kim Sung Ho
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Filing date
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Application filed by Ryu Chun Whan, Ryu Jae Chil, Kim Sung Ho filed Critical Ryu Chun Whan
Publication of WO2011158983A1 publication Critical patent/WO2011158983A1/en

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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer or carrier concentration layer
    • H01L21/48—Manufacture or treatment of parts, e.g. containers, prior to assembly of the devices, using processes not provided for in a single one of the subgroups H01L21/06 - H01L21/326
    • H01L21/4814—Conductive parts
    • H01L21/4821—Flat leads, e.g. lead frames with or without insulating supports

Definitions

  • the present invention relates to a method of joining a lead frame for a semiconductor device, and more particularly, when the base material and the welding rod are made of the same material when welding the end and the end of the lead frame continuously supplied, a suitable welding current is first supplied.
  • the present invention relates to a method of joining a lead frame for a semiconductor device, in which a lead frame made of the same material as that of a welding rod can be easily joined by removing impurities together with preheating by welding and then joining them through secondary welding.
  • the lead frame is one of the core components constituting the semiconductor package together with the semiconductor chip, and is a semiconductor material that simultaneously performs the role of a lead connecting the inside and the outside of the semiconductor package and the support of the semiconductor chip.
  • the lead frame supplies and supports semiconductor integrated electricity, and its material is nickel / iron alloy or copper alloy, and an IC (Integrated Circuit) chip is placed thereon and a package such as ceramics becomes a semiconductor device.
  • Chips are very small in size, making it difficult to directly supply electricity, and since the heat generation is high, the lead frame serves to supply electricity and facilitates heat dissipation.
  • the semiconductor frame includes a pad that holds a chip as a memory device and maintains a static state.
  • the structure includes an internal lead line and an external lead line connecting the chip to the pad.
  • a semiconductor lead frame having such a structure is usually manufactured by two methods, a stamping process and an etching process.
  • the lead frame manufactured through the above process includes a lead frame body for fixing a semiconductor chip of the final package device, and a lead frame leg portion electrically connected to the semiconductor chip fixed to the lead frame body by a wire; It is comprised including the resin body which molds this lead frame main body and a lead frame leg part.
  • Semiconductor packages including semiconductor chips, are usually produced in large quantities at once to increase production efficiency and reduce production costs.
  • the lead frames supplied are continuously wound on a round wheel of a certain size. After all of the long lead frame wound on one wheel is supplied, the end portion of the lead frame wound on the first wheel and the first part of the lead frame of the next wheel to be supplied are continuously connected.
  • the lead frame ends of the wheels are joined together by welding to connect the first parts of the lead frames of other wheels.
  • the material of the lead frame that is commonly used is zinc alloy, nickel alloy, iron alloy or copper alloy is used.
  • the welding rod and the lead frame used for welding are the same material, when welding is performed, the lead frame and the welding rod are made of the same material so that the current supplied does not react and flows, and thus the welding is not performed. Occurred frequently.
  • the welding is performed by the conventional method as described above.
  • the welding rod and the lead frame do not react to the current, and thus the welding is performed. Not frequently occurred.
  • the present invention is to solve the above problems, when the base material and the electrode is made of the same type of material by supplying a suitable welding current to remove the impurities along with the preheating through the primary welding and then welding through the secondary welding
  • the present invention provides a method of joining a lead frame for a semiconductor device that can be easily bonded to a lead frame made of the same material.
  • the present invention is a cutting part for cutting the end of the lead frame and the end and the end of the lead frame cut by the cutting part by using a welding rod made of the same material as the lead frame
  • a joining apparatus for a lead frame comprising a welding part, the method comprising: aligning an end of a lead frame different from an end of the lead frame to the welding part; Firstly supplying a welding current after contacting the electrode at an end of the aligned lead frame; First pressing the welding part of the lead frame to which the welding current is supplied for a predetermined time; Collecting information on a bonding state of the first pressurized welding part by using a sensor part; Supplying a second welding current to the first pressurized welding part; And pressurizing the welding part supplied with the welding current secondly for a predetermined time.
  • the electrode and the lead frame may be made of a metal material containing copper.
  • the pressing force applied to the welding portion is characterized in that 1 ⁇ 5bar.
  • the welding current supplied to the welding portion is characterized in that 900 ⁇ 1200A.
  • the welding can be completed by releasing the contact between the electrode and the welding site.
  • the step of confirming the information on the bonding state may be made in a state in which the electrode maintains contact with the welding portion.
  • the electrode when the base material and the electrode is made of the same material, the electrode is made of the same material as the electrode by supplying a suitable welding current to remove the preheating and impurities through the first welding and then joining the second electrode by welding. Lead frames can also be easily joined and prevent defects.
  • FIG. 1 is an external perspective view of a bonding apparatus of a lead frame for a semiconductor device applied to an embodiment of the present invention.
  • FIG. 2 is an exemplary view showing a state of a cutting and welding process using the apparatus of FIG.
  • FIG. 3 is a view showing a state of the cutting unit of FIG.
  • FIG. 4 is a view showing a working state of FIG.
  • FIG. 5 is a view showing a state of the welded portion of FIG.
  • FIG. 6 is a view showing a working state of FIG.
  • FIG. 7 is a block diagram showing a bonding process of a lead frame for a semiconductor device according to an embodiment of the present invention.
  • FIG. 8 is a block diagram showing a bonding process of a lead frame for a conventional semiconductor device.
  • Bonding method of the lead frame for a semiconductor device according to a preferred embodiment of the present invention (hereinafter referred to as a 'bonding method') using the welding rod end and end of the lead frame 10 cut by the cutting unit 120 It is a method for constant welding.
  • the lead frame and the welding rod is conventionally the same material by welding the welding portion continuously for 2 times If it is made of a welding can not be easily performed, there are technical features.
  • FIG. 1 to 6 illustrate a bonding apparatus (hereinafter referred to as a bonding device) of a lead frame for a semiconductor device for performing the method of bonding the lead frame for a semiconductor device of the present invention.
  • the bonding apparatus 100 is a device that can be connected to the end and the end of the lead frame 10 by constant welding, which is composed of a main body 110, a cutting unit 120 and a welding unit 130.
  • the main body 110 is a place where the cutting unit 120 and the welding unit 130 is installed, the lower end surface of the main body 110 is a plurality of rotation means 111 that can easily move the bonding apparatus in place as needed Rotating wheels are coupled, one side of the main body 110 is formed a door 112 that can be opened and closed. An inner space is formed in the door part 112, and other equipment necessary for work can be stored and used.
  • a handle 113 is formed on an upper side of the main body 110 to allow an operator to easily move the bonding apparatus, and a cutting unit 120 and a welding unit 130 on the upper side of the main body 110.
  • the panel portion 114 which can operate the operation of is formed.
  • the panel portion 114 is provided with a plurality of operation buttons, the operation button is a power button (114a) for turning on / off the operation of the bonding device, the operation of the cutting unit 120 and the welding unit 130 by the operator
  • a selection button 114b for selecting a function
  • an emergency button 114c for arbitrarily stopping the operation of the bonding apparatus in case of an emergency during operation of the bonding apparatus, and a cutting unit 120 and a welding unit 130. It consists of a pair of start button (114d) to operate.
  • the power button 114a is first turned on and the selection button 114b is operated to select the cutting part 120 and the welding part 130, and then Press the start button 114d of the pair simultaneously with both hands to work. In this case, if only one of the pair of start buttons 114d is pressed, the operation is not performed.
  • Reference numeral 114e denotes a work lamp, which is a lamp that informs the operator of the welded state when the primary welding of the lead frame 10 by the welding unit 130 is completed. It is difficult for the operator to check the welding state with the naked eye because the welding is performed at the time of welding. Therefore, when the welding is completed through the primary welding and the secondary welding is not necessary, the work lamp is turned on so that the worker is welded. You will be informed.
  • the welding rod and the lead frame are made of the same material, the welding is sometimes completed by one welding.
  • the work lamp is turned on to inform the user. This is to prevent unnecessary secondary welding from being performed.
  • the cutting unit 120 cuts the lead frame 10 formed and supplied on the upper surface of the main body 110, which is a fixed frame 121, a cutting jig 122, The cutting die 123, the guide bar 124, and the first cylinder 125 are configured to be included.
  • the fixed frame 121 is provided with both vertical members 121b formed at a predetermined height and disposed at intervals, and horizontal members 121a coupled to upper ends of the two vertical members, and both vertical members 121b are provided.
  • the lower portion of the main body is fixedly coupled to open the front / rear of the upper surface.
  • the cutting jig 122 is detachably coupled to the upper surface of the cutting jig seating portion 115 provided on the upper surface of the main body 110, and the insertion portion 122a in which the lead frame is seated in the central area is recessed. It is formed, and paired with the cutting mold 123 serves to fix the position so that the lead frame 10 supplied from the outside can be cut.
  • the lead frame 10 varies in type according to the type of semiconductor package, and the cutting jig is mounted differently according to the type of the lead frame 10.
  • Positioning holes 11 are formed at both sides of the lead frame 10 at predetermined intervals, and an insertion portion in which the lead frame 10 may be placed when the lead frame 10 is inserted onto the cutting jig 122 ( A plurality of positioning pins 122b are provided on the 122a to insert the positioning holes 11 of the lead frame to maintain the cutting position at which the lead frame is cut by the cutting mold 123.
  • the lead frame is always cut to a certain portion, whereby a welded portion welded by the welder 130 becomes constant, and the lead frames to be interconnected can maintain a constant pattern product. The defect of can be eliminated.
  • the cutting mold 123 is coupled to the guide bar 124 so as to allow up / down slide movement, and a central region thereof is coupled to one side of the first cylinder 125 to perform up / down slide movement by a user operation.
  • a central region thereof is coupled to one side of the first cylinder 125 to perform up / down slide movement by a user operation.
  • the guide bar 124 is fixedly coupled to both sides of the upper surface of the cutting jig seating portion 115 to extend a predetermined height, and the cutting mold 123 is positioned at the cutting portion of the lead frame so that the cutting mold can be constantly cut. By guiding the position, the cutting die 123 moves up and down along the guide bar 124.
  • the first cylinder 125 is fixedly coupled to the upper end of the fixing frame 121 to vertically move the cutting mold 123 by the power supplied by the air cylinder.
  • the power source of the first cylinder 125 is high pressure air, which is formed and supplied by an air compressor (not shown).
  • Two air lines 125a are coupled to the first cylinder 125, and the air lines 125a are connected to an air compressor (not shown) to supply or discharge compressed air to the first cylinder 125 side.
  • the pressure of the air supplied and discharged to the first cylinder 125 side can be adjusted through a pressure control valve (not shown).
  • the air cylinder is exemplified as the first cylinder, but it is clear that other types of cylinders such as a hydraulic cylinder may be used.
  • the welding portion 130 of the welding device 100 applied to the present invention is a portion which is formed on the upper surface of the main body 110 to weld the end and the end of the lead frame cut by the cutting unit 120, mutually, This includes the base 131, the welding jig 132, the guide 133, the welding table 134, and the second cylinder 135.
  • the base part 131 is fixedly coupled to the upper surface of the main body 110, and the welding jig 132, the guide part 133, the welding table, and the second cylinder 135, which will be described later, are positioned on the base part 131. To the side.
  • the welding jig 132 is a place where the lead frame 10 is placed at the time of welding.
  • the welding jig 132 is equipped with a different type of welding jig 132 according to the type of the lead frame like the cutting jig 122 described above.
  • the welding jig 132 is formed in the inserting portion 132a on which the lead frame 10 is placed. On the inserting portion 132a, the positioning holes 11 formed on both sides of the lead frame are inserted and coupled to the lead frame. A plurality of positioning pins 132b are formed to determine the weld position to be welded.
  • Guide portion 133 is coupled to the upper one side of the base portion 131, the front of the welding table 134 to be described later to serve to guide the vertical movement by the air cylinder (not shown)
  • the second cylinder 135 is coupled to the rear surface of the guide part 133.
  • the welding table 134 is coupled to the guide part 133 to connect the end and the end of the lead frame cut through the cutting part 120 while moving up and down by a user operation.
  • the welding table 134 moves up and down by the operation of the air cylinder, which is the second cylinder 135.
  • a welding rod 136 welding the end and the end of the lead frame by a current supplied in contact with the end and the end of the lead frame is disposed on the welding table 134 disposed on the upper side of the welding jig 132. Is provided.
  • a sensor unit 137 is provided around the welding rod 136 to check the welding state of the welding portion performed by the welding rod 136.
  • the sensor unit collects information on the welding portion of the lead frame performed through the welding rod and delivers the collected information to a control unit (not shown) provided separately.
  • control unit turns on the work lamp 114e provided in the operation panel so that the operator can easily identify the completion of the welding.
  • the second cylinder 135 may be operated upward from the controller side to automatically release contact between the end of the lead frame and the welding rod.
  • the second cylinder 135 is operated by compressed air supplied by an air compressor (not shown), which is an external power source, and on the second cylinder 135, two air lines 135a for supplying and discharging are respectively provided. In combination.
  • the operator turns on the power button 114a to cut an end portion of the lead frame 10 to be welded and connected, and places the lead frame 10 on the cutting jig 122.
  • the cutting unit 120 may be operated by operating the selection button 114b and pressing the pair of start buttons 114d simultaneously to cut the cutting mold 123. Can be cut by
  • the worker moves the lead frame 10 ′ to be connected to the cut lead frame 10 onto the welding jig 132 of the welder 130 to be aligned.
  • the welding unit 130 may be operated by operating the selection button 114b, and the second cylinder 135 is lowered by simultaneously pressing a pair of start buttons 114d to form a welding rod together with the welding table 134. 136 is vertically lowered to contact the end of the lead frame disposed on the welding jig 132.
  • a welding current is supplied to flow the welding current through the welding portion, and then the contact with the welding rod 136 and the welding portion.
  • the welding portion is pressurized at a constant pressure for a predetermined time to complete the primary welding.
  • the welding current supplied to the welding portion is supplied to 900 ⁇ 1200A, the pressure is applied to the welding portion of 1 ⁇ 5bar It is preferably carried out under pressure.
  • the welding part of which the primary welding is completed may check the information about the welding state of the welding part through the sensor part 137 provided around the electrode while the electrode 10 is in contact with the welding part.
  • control unit checks the state information of the welded portion first welded by the sensor unit 114, and when welding is good, the second cylinder 135 is operated vertically upward so that the welding rod is spaced apart from the welded portion. .
  • the user can easily identify that the secondary welding is necessary by checking the welded portion after the primary welding through the sensor unit 114 so as not to turn on the work lamp 114e when the welding is not performed properly. Do it.
  • the same welding current as that of the primary welding flows, and then pressurizes the welding portion at a constant pressure through the contact of the welding rod for a predetermined time to perform the secondary welding. You are done.
  • the welding current and the pressing force supplied during the secondary welding are performed in the same size as the welding current and the pressing force used in the primary welding.
  • the welding part is preheated by the welding current supplied through the primary welding, and impurities present on the surface are removed, and the welding is performed by the secondary welding continuously performed to make the material of the lead frame and the welding rod. Even if it is made of the same kind, the welding can be easily made.
  • the user can be notified of the necessity of the secondary welding through the work lamp, thereby eliminating defects, increasing the reliability of the product, and preventing unnecessary welding. It is.

Abstract

The present invention relates to a method for bonding lead frames for a semiconductor device; and more specifically to a method for bonding lead frames for a semiconductor device intended to facilitate bonding of lead frames made of the same kind of material as welding rods, through a primary welding process for preheating and for removing impurities, by supplying an optimal welding current during welding of the ends of lead frames that are supplied consecutively in the case where the welding rods are made of the same kind of material as a base material of the lead frame, and then bonding the lead frames through a secondary welding process. Using a lead frame bonding apparatus equipped with a cutting unit for cutting the end of a lead frame and a welding unit for inter-welding the ends of lead frames that are cut by the cutting unit using a welding rod made of the same kind of material as the lead frame, lead frames for a semiconductor device are bonded by the following method of the present invention, which comprises the steps of: aligning an end of the lead frame and an end of another lead frame at the welding unit; contacting the welding rod with the ends of the aligned lead frames, followed by the primary supply of a welding current; subjecting a welded region of the lead frames, to which the welding current has been supplied, to a primary pressurization for a certain period of time; collecting, by using a sensor, information on a bonding state of the primarily pressurized welding region; performing the secondary supply of a welding current to the welded region that has been primarily pressurized; and subjecting the welded region of the lead frames, to which the welding current has been supplied secondarily, to a secondary pressurization for a certain period of time.

Description

반도체 장치용 리드 프레임의 접합방법Bonding method of lead frame for semiconductor device
본 발명은 반도체 장치용 리드 프레임의 접합 방법에 관한 것으로, 좀더 상세하게는 연속적으로 공급되는 리드프레임의 단부와 단부의 용접시 모재와 용접봉이 동종의 재질로 이루어진 경우 적정 용접전류를 공급하여 1차 용접을 통해 예열과 함께 불순물을 제거시킨 후 2차 용접을 통해 접합시킴으로써 용접봉과 동종의 재질로 이루어진 리드프레임도 손쉽게 접합시킬 수 있는 반도체 장치용 리드 프레임의 접합 방법에 관한 것이다.The present invention relates to a method of joining a lead frame for a semiconductor device, and more particularly, when the base material and the welding rod are made of the same material when welding the end and the end of the lead frame continuously supplied, a suitable welding current is first supplied. The present invention relates to a method of joining a lead frame for a semiconductor device, in which a lead frame made of the same material as that of a welding rod can be easily joined by removing impurities together with preheating by welding and then joining them through secondary welding.
통상, 리드 프레임은 반도체 칩과 함께 반도체 패키지를 이루는 핵심 구성 요소의 하나로서 반도체 패키지의 내부와 외부를 연결하여 주는 도선(Lead)의 역할과 반도체 칩을 지지해주는 역할을 동시에 수행하는 반도체 소재이다. 즉, 반도체 집체 전기를 공급하고 이를 지지해 주는 역할을 하는 것으로, 이의 재질은 니켈·철합금 또는 동합금으로서 이 가운데 IC(집적회로)칩을 올려놓고 세라믹스 등의 패키지를 씌우면 반도체 기기가 된다.In general, the lead frame is one of the core components constituting the semiconductor package together with the semiconductor chip, and is a semiconductor material that simultaneously performs the role of a lead connecting the inside and the outside of the semiconductor package and the support of the semiconductor chip. In other words, it supplies and supports semiconductor integrated electricity, and its material is nickel / iron alloy or copper alloy, and an IC (Integrated Circuit) chip is placed thereon and a package such as ceramics becomes a semiconductor device.
칩(chip)은 크기가 매우 작아 직접 전기를 공급하기 어렵고, 발열이 심하기 때문에 리드 프레임이 전기를 공급하는 역할을 하고, 열 발산을 용이하게 한다.Chips are very small in size, making it difficult to directly supply electricity, and since the heat generation is high, the lead frame serves to supply electricity and facilitates heat dissipation.
이러한 반도체 프레임은 기억소자인 칩을 탑재하여 정적인 상태를 유지하여 주는 패드(Pad)와. 칩을 패드에 연결하여 주는 내부 리드선(Internal Lead Line) 및 외부 리드선(External Lead Line)을 포함하는 구조로 이루어진다.The semiconductor frame includes a pad that holds a chip as a memory device and maintains a static state. The structure includes an internal lead line and an external lead line connecting the chip to the pad.
이와 같은 구조를 가지는 반도체 리드 프레임은 통상 스템핑 공정(Stamping)과, 에칭 공정(Etching Process)이라는 두 가지 방법에 의하여 제조된다.A semiconductor lead frame having such a structure is usually manufactured by two methods, a stamping process and an etching process.
상기한 공정을 거쳐서 제조된 리드 프레임은 최종적 패키지장치의 반도체 칩을 고정하는 리드 프레임 본체와, 이 리드 프레임 본체에 고정되는 반도체 칩과 와이어로 연결되어서 전기적으로 도전되는 리드 프레임 다리부와; 이 리드 프레임 본체 및 리드 프레임 다리부를 몰딩하도록 하는 수지체를 포함하여 구성된다.The lead frame manufactured through the above process includes a lead frame body for fixing a semiconductor chip of the final package device, and a lead frame leg portion electrically connected to the semiconductor chip fixed to the lead frame body by a wire; It is comprised including the resin body which molds this lead frame main body and a lead frame leg part.
반도체 칩을 포함한 반도체 패키지는 보통 생산효율을 높이고, 생산 원가를 낮추기 위해 한번에 대량으로 생산하게 되는데, 여기에 공급되는 리드 프레임은 일정한 크기의 둥근 휠에 감겨서 연속적으로 공급된다. 하나의 휠에 감긴 긴 리드 프레임이 전부 공급되고 나면, 처음 휠에 감겨 있던 리드 프레임의 끝 부분과 다음에 공급되는 다른 휠의 리드 프레임의 처음 부분을 연결하여 연속 공급하게 된다.Semiconductor packages, including semiconductor chips, are usually produced in large quantities at once to increase production efficiency and reduce production costs. The lead frames supplied are continuously wound on a round wheel of a certain size. After all of the long lead frame wound on one wheel is supplied, the end portion of the lead frame wound on the first wheel and the first part of the lead frame of the next wheel to be supplied are continuously connected.
처음 휠의 리드 프레임 끝 부분과 다음에 공급되는 다른 휠의 리드 프레임 처음 부분을 연결해주기 위해 용접 방식으로 상호 접합 연결하게 된다.First, the lead frame ends of the wheels are joined together by welding to connect the first parts of the lead frames of other wheels.
즉, 도 8에 도시된 바와 같이, 리드프레임의 단부와 연결하고자 하는 다른 리드프레임의 단부가 일정부분 중첩되도록 위치시키고, 용접부위에 용접봉을 접촉시킨 후 전류를 흘려보내 주고, 용접부위를 일정압력으로 가압하여 용접을 완료하게 된다.That is, as shown in Figure 8, the end of the lead frame and the other end of the lead frame to be connected to be overlapped with a certain portion, the welding rod to contact the welding portion to send a current, the welding portion at a constant pressure Pressurized to complete welding.
한편, 통상적으로 사용되는 리드프레임의 재질은 아연합금, 니켈합금, 철합금 또는 구리합금이 이용되고 있다.On the other hand, the material of the lead frame that is commonly used is zinc alloy, nickel alloy, iron alloy or copper alloy is used.
그런데, 용접시 사용되는 용접봉과 리드프레임의 재질이 동일한 경우 용접을 수행하게 되면, 모재인 리드프레임과 용접봉이 동종의 재질로 이루어져 있어 공급되는 전류가 반응을 하지 못하고 흘러버려 용접이 이루어지지 못하는 경우가 빈번히 발생하였다.However, when the welding rod and the lead frame used for welding are the same material, when welding is performed, the lead frame and the welding rod are made of the same material so that the current supplied does not react and flows, and thus the welding is not performed. Occurred frequently.
일례로, 구리로 이루어진 용접봉을 사용하고 리드프레임 역시 구리로 이루어진 경우 상기와 같은 종래의 방법으로 용접을 수행하게 되면, 용접을 위해 전류를 흘려주게 되면 용접봉과 리드프레임이 전류에 반응하지 못하여 용접이 되지 않는 경우가 빈번히 발생하였다.For example, when a welding rod made of copper is used and the lead frame is made of copper, the welding is performed by the conventional method as described above. When the current is flowed for welding, the welding rod and the lead frame do not react to the current, and thus the welding is performed. Not frequently occurred.
본 발명은 상기와 같은 문제점을 해결하기 위한 것으로, 모재와 용접봉이 동종의 재질로 이루어진 경우 적정 용접전류를 공급하여 1차 용접을 통해 예열과 함께 불순물을 제거시킨 후 2차 용접을 통해 접합시킴으로써 용접봉과 동종의 재질로 이루어진 리드프레임도 손쉽게 접합시킬 수 있는 반도체 장치용 리드 프레임의 접합 방법을 제공하는 데 있다.The present invention is to solve the above problems, when the base material and the electrode is made of the same type of material by supplying a suitable welding current to remove the impurities along with the preheating through the primary welding and then welding through the secondary welding The present invention provides a method of joining a lead frame for a semiconductor device that can be easily bonded to a lead frame made of the same material.
상기와 같은 목적을 달성하기 위하여 본 발명은 리드프레임의 단부를 절단하는 커팅부와 상기 커팅부에 의해 절단된 리드 프레임의 단부와 단부를 상기 리드프레임과 동종의 재질로 이루어진 용접봉을 이용하여 상호 용접하는 용접부를 포함하는 리드 프레임의 접합 장치에 있어서, 상기 리드프레임의 단부와 다른 리드프레임의 단부를 상기 용접부에 정렬시키는 단계; 상기 정렬된 리드프레임의 단부에 상기 용접봉을 접촉시킨 후 용접전류를 1차 공급하는 단계; 상기 용접전류가 공급된 리드프레임의 용접부위를 일정시간 1차 가압하는 단계; 상기 1차 가압된 용접부위의 접합상태에 대한 정보를 센서부를 이용하여 수집하는 단계; 상기 1차 가압된 용접부위에 용접전류를 2차 공급하는 단계; 및 상기 용접전류가 2차 공급된 용접부위를 일정시간 2차 가압하는 단계;를 포함한다.In order to achieve the above object, the present invention is a cutting part for cutting the end of the lead frame and the end and the end of the lead frame cut by the cutting part by using a welding rod made of the same material as the lead frame A joining apparatus for a lead frame comprising a welding part, the method comprising: aligning an end of a lead frame different from an end of the lead frame to the welding part; Firstly supplying a welding current after contacting the electrode at an end of the aligned lead frame; First pressing the welding part of the lead frame to which the welding current is supplied for a predetermined time; Collecting information on a bonding state of the first pressurized welding part by using a sensor part; Supplying a second welding current to the first pressurized welding part; And pressurizing the welding part supplied with the welding current secondly for a predetermined time.
바람직하게는, 상기 용접봉과 리드프레임은 구리가 함유된 금속재질로 이루어질 수 있다.Preferably, the electrode and the lead frame may be made of a metal material containing copper.
바람직하게는, 상기 용접부위에 가해지는 가압력은 1~5bar인 것을 특징으로 한다.Preferably, the pressing force applied to the welding portion is characterized in that 1 ~ 5bar.
바람직하게는, 상기 용접부위에 공급되는 용접전류는 900~1200A인 것을 특징으로 한다.Preferably, the welding current supplied to the welding portion is characterized in that 900 ~ 1200A.
바람직하게는, 상기 접합상태에 대한 정보를 확인하는 단계 후에는 접합상태가 양호한 경우 상기 용접봉과 용접부위의 접촉을 해제시켜 용접을 완료할 수 있다.Preferably, after the step of checking the information on the bonding state, if the bonding state is good, the welding can be completed by releasing the contact between the electrode and the welding site.
바람직하게는, 상기 접합상태에 대한 정보를 확인하는 단계는 상기 용접봉이 용접부위에 접촉을 유지한 상태에서 이루어질 수 있다.Preferably, the step of confirming the information on the bonding state may be made in a state in which the electrode maintains contact with the welding portion.
상기와 같은 본 발명에 의하면, 모재와 용접봉이 동종의 재질로 이루어진 경우 적정 용접전류를 공급하여 1차 용접을 통해 예열 및 불순물을 제거시킨 후 2차 용접을 통해 접합시킴으로써 용접봉과 동종의 재질로 이루어진 리드프레임도 손쉽게 접합시키고 불량을 방지할 수 있는 효과가 있다.According to the present invention as described above, when the base material and the electrode is made of the same material, the electrode is made of the same material as the electrode by supplying a suitable welding current to remove the preheating and impurities through the first welding and then joining the second electrode by welding. Lead frames can also be easily joined and prevent defects.
도 1은 본 발명의 실시 예에 적용되는 반도체 장치용 리드 프레임의 접합 장치의 외관 사시도. 1 is an external perspective view of a bonding apparatus of a lead frame for a semiconductor device applied to an embodiment of the present invention.
도 2는 도 1의 장치를 이용한 커팅 및 용접 공정의 상태를 보여주는 예시도.2 is an exemplary view showing a state of a cutting and welding process using the apparatus of FIG.
도 3은 도 1의 커팅부의 모습을 보여주는 도면.3 is a view showing a state of the cutting unit of FIG.
도 4는 도 3의 작업상태를 보여주는 도면.4 is a view showing a working state of FIG.
도 5는 도 1의 용접부의 모습을 보여주는 도면.5 is a view showing a state of the welded portion of FIG.
도 6은 도 5의 작업 상태를 보여주는 도면.6 is a view showing a working state of FIG.
도 7은 본 발명의 실시예에 따른 반도체 장치용 리드 프레임의 접합 공정을 도시한 블럭도.7 is a block diagram showing a bonding process of a lead frame for a semiconductor device according to an embodiment of the present invention.
도 8은 종래의 반도체 장치용 리드 프레임의 접합 공정을 도시한 블럭도.8 is a block diagram showing a bonding process of a lead frame for a conventional semiconductor device.
이하, 본 발명의 바람직한 실시예를 도면을 참조하여 더욱 상세히 설명하기로 한다.Hereinafter, preferred embodiments of the present invention will be described in more detail with reference to the drawings.
이하에서, 발명의 이해를 돕기 위해 도면부호를 부가함에 있어 동일한 구성요소에 대해서는 비록 다른 도면에 표시되었다 하더라도 동일한 도면부호를 사용하기로 한다.In the following description, the same reference numerals will be used to refer to the same elements even though they are shown in different drawings in order to add reference numerals to help understand the present invention.
본 발명의 바람직한 실시예에 따른 반도체 장치용 리드 프레임의 접합방법(이하 '접합방법'이라 함.)은 커팅부(120)에 의해 절단된 리드 프레임(10)의 단부와 단부를 용접봉을 사용하여 일정하게 용접하여 연결시키기 위한 방법이다.Bonding method of the lead frame for a semiconductor device according to a preferred embodiment of the present invention (hereinafter referred to as a 'bonding method') using the welding rod end and end of the lead frame 10 cut by the cutting unit 120 It is a method for constant welding.
특히, 상기 리드프레임과 동종의 재질로 이루어진 용접봉을 이용하여 상기 리드프레임의 단부를 용접시키는 경우에 적용되는 것으로, 용접부위를 2차에 걸쳐 연속적으로 용접함으로써 종래에 리드프레임과 용접봉이 동종의 재질로 이루어진 경우 불가능하였던 용접을 용이하게 수행할 수 있는데 기술적 특징이 있다.In particular, it is applied to welding the end of the lead frame using a welding rod made of the same type of material as the lead frame, the lead frame and the welding rod is conventionally the same material by welding the welding portion continuously for 2 times If it is made of a welding can not be easily performed, there are technical features.
본 발명의 반도체 장치용 리드 프레임의 접합방법을 수행하기 위한 반도체 장치용 리드 프레임의 접합장치(100, 이하 '접합장치'라 함.)가 도 1 내지 도 6에 도시되어 있다.1 to 6 illustrate a bonding apparatus (hereinafter referred to as a bonding device) of a lead frame for a semiconductor device for performing the method of bonding the lead frame for a semiconductor device of the present invention.
상기 접합장치(100)는 리드 프레임(10)의 단부와 단부를 일정하게 용접하여 연결시킬 수 있는 장치로서, 이는 본체(110)와, 커팅부(120) 및 용접부(130)로 구성된다.The bonding apparatus 100 is a device that can be connected to the end and the end of the lead frame 10 by constant welding, which is composed of a main body 110, a cutting unit 120 and a welding unit 130.
상기 본체(110)는 커팅부(120)와 용접부(130)가 설치되는 곳으로, 본체(110)의 하단면에는 필요에 따른 장소에 접합장치를 용이하게 이동할 수 있는 회전 수단(111)인 다수의 회전바퀴가 결합하고, 본체(110)의 일 측면에는 개폐 가능한 도어부(112)가 형성된다. 이 도어부(112) 내에는 내부 공간이 형성되며, 작업에 필요한 기타 장비 등을 수납하여 사용할 수 있도록 하고 있다.The main body 110 is a place where the cutting unit 120 and the welding unit 130 is installed, the lower end surface of the main body 110 is a plurality of rotation means 111 that can easily move the bonding apparatus in place as needed Rotating wheels are coupled, one side of the main body 110 is formed a door 112 that can be opened and closed. An inner space is formed in the door part 112, and other equipment necessary for work can be stored and used.
그리고, 본체(110)의 상부 일 측에는 작업자가 접합장치를 용이하게 이동시킬 수 있도록 하기 위한 손잡이(113)가 형성되어 있으며, 본체(110)의 상부 타 측에는 커팅부(120)와 용접부(130)의 작동을 조작할 수 있는 패널부(114)가 형성되어 있다.In addition, a handle 113 is formed on an upper side of the main body 110 to allow an operator to easily move the bonding apparatus, and a cutting unit 120 and a welding unit 130 on the upper side of the main body 110. The panel portion 114 which can operate the operation of is formed.
이 패널부(114)에는 다수의 조작버튼이 형성되는데, 이 조작버튼은 접합장치의 작동을 온/오프하는 전원버튼(114a)과, 작업자에 의해 커팅부(120)와 용접부(130)의 작동 기능을 선택할 수 있는 선택버튼(114b)과, 접합장치의 작동 중에 비상상황이 발생할 경우에 임의로 접합장치의 작동을 중단시킬 수 있는 비상버튼(114c), 및 커팅부(120)와 용접부(130)를 작동시키는 한 쌍의 시작버튼(114d)으로 구성된다.The panel portion 114 is provided with a plurality of operation buttons, the operation button is a power button (114a) for turning on / off the operation of the bonding device, the operation of the cutting unit 120 and the welding unit 130 by the operator A selection button 114b for selecting a function, an emergency button 114c for arbitrarily stopping the operation of the bonding apparatus in case of an emergency during operation of the bonding apparatus, and a cutting unit 120 and a welding unit 130. It consists of a pair of start button (114d) to operate.
따라서, 작업자가 접합장치를 가동할 경우에 먼저 전원버튼(114a)을 온(On)시키고, 선택버튼(114b)을 조작하여 커팅부(120)와 용접부(130)의 작업 선택을 한 후, 한 쌍의 시작버튼(114d)을 양손을 이용하여 동시에 눌러서 작업을 하게 된다. 이때 한 쌍의 시작버튼(114d) 중에 하나만을 누를 경우에는 작동이 되지 않으며, 동시에 누를 경우에만 작동이 된다.Therefore, when the operator starts the joining device, the power button 114a is first turned on and the selection button 114b is operated to select the cutting part 120 and the welding part 130, and then Press the start button 114d of the pair simultaneously with both hands to work. In this case, if only one of the pair of start buttons 114d is pressed, the operation is not performed.
도면 부호 114e는 작업램프로서, 이는 용접부(130)에 의한 리드 프레임(10)의 1차 용접 완료시에 용접된 상태를 작업자게 알려주는 램프이다. 용접 시에는 순간적으로 용접이 이루어지기 때문에 작업자가 육안으로 용접 상태를 확인하기 어려우며, 따라서 1차 용접을 통해 용접이 완료되어 2차 용접이 필요가 없는 경우 상기 작업램프가 켜짐으로써 작업자에게 용접 완료 상태를 알려주게 된다. Reference numeral 114e denotes a work lamp, which is a lamp that informs the operator of the welded state when the primary welding of the lead frame 10 by the welding unit 130 is completed. It is difficult for the operator to check the welding state with the naked eye because the welding is performed at the time of welding. Therefore, when the welding is completed through the primary welding and the secondary welding is not necessary, the work lamp is turned on so that the worker is welded. You will be informed.
즉, 용접봉과 리드프레임이 동종의 재질로 이루어진 경우 한 번의 용접에 의해 용접이 완료되는 경우가 간혹 발생하는데 이와 같이 한 번의 용접에 의해 용접이 완료되는 경우에는 상기 작업램프가 점등되어 사용자에게 알려줌으로써 불필요한 2차 용접이 수행되지 않도록 하기 위함이다.That is, when the welding rod and the lead frame are made of the same material, the welding is sometimes completed by one welding. When the welding is completed by one welding, the work lamp is turned on to inform the user. This is to prevent unnecessary secondary welding from being performed.
그리고, 본 발명에 따른 커팅부(120)는 본체(110)의 상부면에 형성되어 공급되는 리드 프레임(10)을 절단하는 곳으로, 이는 고정 프레임(121)과, 커팅 지그(122)와, 커팅 금형(123)과, 가이드 바(124), 및 제1 실린더(125)를 포함하여 구성된다. In addition, the cutting unit 120 according to the present invention cuts the lead frame 10 formed and supplied on the upper surface of the main body 110, which is a fixed frame 121, a cutting jig 122, The cutting die 123, the guide bar 124, and the first cylinder 125 are configured to be included.
상기 고정 프레임(121)은 일정높이로 형성되어 간격을 두고 배치되는 양 수직부재(121b)와, 상기 양 수직부재의 상단에 결합되는 수평부재(121a)로 구비되어, 상기 양 수직부재(121b)의 하부가 상기 본체의 상부면에 전/후면이 개방되도록 고정 결합된다.The fixed frame 121 is provided with both vertical members 121b formed at a predetermined height and disposed at intervals, and horizontal members 121a coupled to upper ends of the two vertical members, and both vertical members 121b are provided. The lower portion of the main body is fixedly coupled to open the front / rear of the upper surface.
상기 커팅 지그(122)는 본체(110)의 상부면에 구비되는 커팅지그안착부(115)의 상부면에 탈착 가능하게 결합되고, 중앙 영역에 상기 리드 프레임이 안착되는 삽입부(122a)가 함몰형성되며, 커팅 금형(123)과 짝을 이루어 외부에서 공급되는 리드 프레임(10)이 절단될 수 있도록 위치를 고정하는 역할을 한다. 리드 프레임(10)은 반도체 패키지의 종류에 따라 그 종류가 다양하며, 리드 프레임(10)의 종류에 따라 커팅 지그도 다르게 장착된다.The cutting jig 122 is detachably coupled to the upper surface of the cutting jig seating portion 115 provided on the upper surface of the main body 110, and the insertion portion 122a in which the lead frame is seated in the central area is recessed. It is formed, and paired with the cutting mold 123 serves to fix the position so that the lead frame 10 supplied from the outside can be cut. The lead frame 10 varies in type according to the type of semiconductor package, and the cutting jig is mounted differently according to the type of the lead frame 10.
리드 프레임(10)의 양측에는 일정 간격으로 위치 결정공(11)이 관통 형성되며, 리드 프레임(10)이 커팅 지그(122) 상에 투입될 때 리드 프레임(10)이 놓일 수 있는 삽입부(122a) 상에는 리드 프레임의 위치 결정공(11)이 삽입되어 리드 프레임이 커팅 금형(123)에 의해 절단되는 절단 위치를 일정하게 유지할 수 있도록 하는 위치 결정핀(122b)이 다수 구비된다.Positioning holes 11 are formed at both sides of the lead frame 10 at predetermined intervals, and an insertion portion in which the lead frame 10 may be placed when the lead frame 10 is inserted onto the cutting jig 122 ( A plurality of positioning pins 122b are provided on the 122a to insert the positioning holes 11 of the lead frame to maintain the cutting position at which the lead frame is cut by the cutting mold 123.
이 위치 결정핀(122b)에 의해 리드 프레임은 항상 일정한 부분에 커팅이 이루어지며, 이에 의해 용접부(130)에 의해 용접되는 용접 부위가 일정하게 되어 상호 연결되는 리드 프레임은 일정한 패턴을 유지할 수 있어 제품의 불량을 없앨 수 있게 된다.By the positioning pin 122b, the lead frame is always cut to a certain portion, whereby a welded portion welded by the welder 130 becomes constant, and the lead frames to be interconnected can maintain a constant pattern product. The defect of can be eliminated.
커팅 금형(123)은 상기 가이드바(124)에 상/하 슬라이드 운동이 가능하도록 결합되고, 그 중앙영역이 상기 제1실린더(125)의 일측과 결합되어 사용자 조작에 의해 상/하 슬라이드 운동을 통해 커팅 지그(122) 상에 투입되는 리드 프레임의 단부를 절단하는 것으로, 이는 후술할 에어 실린더에 의해 작동된다. The cutting mold 123 is coupled to the guide bar 124 so as to allow up / down slide movement, and a central region thereof is coupled to one side of the first cylinder 125 to perform up / down slide movement by a user operation. By cutting the end of the lead frame is put on the cutting jig 122 through, which is operated by the air cylinder to be described later.
가이드 바(124)는 커팅지그안착부(115)의 상부면 양측에 고정결합되어 일정높이 연장형성되며, 커팅 금형(123)이 리드 프레임의 커팅 부분에 위치하여 일정하게 절단할 수 있도록 커팅 금형의 위치를 가이드하는 것으로, 이 가이드 바(124)를 따라 커팅 금형(123)이 상하 운동을 하게 된다.The guide bar 124 is fixedly coupled to both sides of the upper surface of the cutting jig seating portion 115 to extend a predetermined height, and the cutting mold 123 is positioned at the cutting portion of the lead frame so that the cutting mold can be constantly cut. By guiding the position, the cutting die 123 moves up and down along the guide bar 124.
제1 실린더(125)는 고정 프레임(121)의 상단에 고정 결합하여 에어 실린더에 의해 공급되는 동력에 의해 커팅 금형(123)을 상하 운동시키게 된다. 이 제1 실린더(125)의 동력원은 고압의 공기이며, 이는 고압의 공기는 에어 컴프레샤(미도시)에 의해 형성 공급된다. 제1 실린더(125)에는 두 개의 에어 라인(125a)이 결합하는데, 에어 라인(125a)은 에어 컴프레샤(미도시)와 연결되어 제1 실린더(125) 측에 압축 공기를 공급하거나 배출하게 된다.The first cylinder 125 is fixedly coupled to the upper end of the fixing frame 121 to vertically move the cutting mold 123 by the power supplied by the air cylinder. The power source of the first cylinder 125 is high pressure air, which is formed and supplied by an air compressor (not shown). Two air lines 125a are coupled to the first cylinder 125, and the air lines 125a are connected to an air compressor (not shown) to supply or discharge compressed air to the first cylinder 125 side.
제1 실린더(125) 측에 공급 및 배출되는 공기의 압력은 압력 조절 밸브(미도시)를 통해 조절이 가능하다. 본 발명에서는 제1 실린더로서 에어 실린더로 예를 들고 있으나, 유압 실린더 등의 다른 형태의 실린더를 사용하여도 무방함을 밝혀둔다.The pressure of the air supplied and discharged to the first cylinder 125 side can be adjusted through a pressure control valve (not shown). In the present invention, the air cylinder is exemplified as the first cylinder, but it is clear that other types of cylinders such as a hydraulic cylinder may be used.
한편, 본 발명에 적용되는 용접장치(100)의 용접부(130)는 본체(110)의 상부면에 형성되어 커팅부(120)에 의해 절단된 리드 프레임의 단부와 단부를 상호 용접하는 부분으로, 이는 베이스부(131)와, 용접 지그(132)와, 가이드부(133)와, 용접대(134) 및 제2 실린더(135)를 포함하여 구성된다.On the other hand, the welding portion 130 of the welding device 100 applied to the present invention is a portion which is formed on the upper surface of the main body 110 to weld the end and the end of the lead frame cut by the cutting unit 120, mutually, This includes the base 131, the welding jig 132, the guide 133, the welding table 134, and the second cylinder 135.
베이스부(131)는 본체(110)의 상부면에 고정 결합하는 것으로, 후술할 용접 지그(132), 가이드부(133), 용접대, 제2 실린더(135)가 베이스부(131)의 상 측에 결합한다.The base part 131 is fixedly coupled to the upper surface of the main body 110, and the welding jig 132, the guide part 133, the welding table, and the second cylinder 135, which will be described later, are positioned on the base part 131. To the side.
용접 지그(132)는 용접시에 리드 프레임(10)이 놓이는 곳으로, 상술한 커팅 지그(122)와 같이 리드 프레임의 종류에 따라 다른 종류의 용접 지그(132)가 장착된다.The welding jig 132 is a place where the lead frame 10 is placed at the time of welding. The welding jig 132 is equipped with a different type of welding jig 132 according to the type of the lead frame like the cutting jig 122 described above.
그리고, 용접 지그(132)에는 리드 프레임(10)이 놓이는 삽입부(132a)에 형성되며, 이 삽입부(132a) 상에는 리드 프레임의 양측에 형성되는 위치 결정공(11)이 삽입 결합하여 리드 프레임이 용접되는 용접 위치를 결정할 수 있도록 하는 다수의 위치 결정핀(132b)이 형성된다.The welding jig 132 is formed in the inserting portion 132a on which the lead frame 10 is placed. On the inserting portion 132a, the positioning holes 11 formed on both sides of the lead frame are inserted and coupled to the lead frame. A plurality of positioning pins 132b are formed to determine the weld position to be welded.
가이드부(133)는 베이스부(131)의 상부 일 측에 결합하고, 이의 전면에는 후술할 용접대(134)가 결합하여 에어 실린더(미도시)에 의해 상하 운동할 수 있도록 가이드하는 역할을 하며, 가이드부(133)의 배면에는 제2 실린더(135)가 결합한다. Guide portion 133 is coupled to the upper one side of the base portion 131, the front of the welding table 134 to be described later to serve to guide the vertical movement by the air cylinder (not shown) The second cylinder 135 is coupled to the rear surface of the guide part 133.
용접대(134)는 가이드부(133) 상에 결합하여 사용자 조작에 의해 상하 운동을 하면서 커팅부(120)를 통해 커팅된 리드 프레임의 단부와 단부를 상호 용접하여 연결시키는 것이다. 이 용접대(134)는 제2 실린더(135)인 에어 실린더의 작동에 의해 상하 운동을 하게 된다.The welding table 134 is coupled to the guide part 133 to connect the end and the end of the lead frame cut through the cutting part 120 while moving up and down by a user operation. The welding table 134 moves up and down by the operation of the air cylinder, which is the second cylinder 135.
그리고, 상기 용접지그(132)의 상부 측에 배치되는 상기 용접대(134) 측에는 상기 리드 프레임의 단부와 단부에 접촉하여 공급되는 전류에 의해 상기 리드 프레임의 단부와 단부를 용접시키는 용접봉(136)이 구비된다.In addition, a welding rod 136 welding the end and the end of the lead frame by a current supplied in contact with the end and the end of the lead frame is disposed on the welding table 134 disposed on the upper side of the welding jig 132. Is provided.
또한, 상기 용접봉(136)의 주위에는 상기 용접봉(136)에 의해 수행된 용접부위의 용접상태를 확인할 수 있는 센서부(137)가 구비된다.In addition, a sensor unit 137 is provided around the welding rod 136 to check the welding state of the welding portion performed by the welding rod 136.
즉, 상기 센서부는 상기 용접봉을 통해 수행된 리드프레임의 용접부위에 대한 정보를 수집하여 별도로 구비되는 제어부(미도시)측으로 상기 수집된 정보를 전달하여주게 된다.That is, the sensor unit collects information on the welding portion of the lead frame performed through the welding rod and delivers the collected information to a control unit (not shown) provided separately.
만약, 용접부위의 용접이 양호하게 완료된 경우에는 상기 제어부에서 조작패널에 구비된 작업램프(114e)를 점등시킴으로써 작업자가 용접의 완료유무를 용이하게 식별할 수 있도록 한다.If the welding of the welding part is completed well, the control unit turns on the work lamp 114e provided in the operation panel so that the operator can easily identify the completion of the welding.
한편, 용접이 완료되어 상기 작업램프가 점등되는 경우에는 상기 제어부 측에서 상기 제2 실린더(135)를 상부로 작동시켜 리드프레임의 단부와 상기 용접봉의 접촉을 자동으로 해제시킬 수도 있다.On the other hand, when welding is completed and the work lamp is turned on, the second cylinder 135 may be operated upward from the controller side to automatically release contact between the end of the lead frame and the welding rod.
제2 실린더(135)는 외부 동력원인 에어 컴프레샤(미도시)에 의해 공급되는 압축 공기에 의해 작동을 하고, 이 제2 실린더(135) 상에는 공급 및 배출이 각각 이루어지는 두 개의 에어 라인(135a)이 결합하여 있다.The second cylinder 135 is operated by compressed air supplied by an air compressor (not shown), which is an external power source, and on the second cylinder 135, two air lines 135a for supplying and discharging are respectively provided. In combination.
이하, 상기와 같이 구성되는 접합장치를 이용하여 리드프레임의 단부와 단부를 연결시키는 용접방법에 대해 설명하고자 한다.Hereinafter, a welding method of connecting the end and the end of the lead frame using the bonding apparatus configured as described above will be described.
먼저, 작업자는 용접하여 연결하고자 하는 리드 프레임(10)의 단부를 절단하기 위해서 전원버튼(114a)을 온(On) 시키고, 리드 프레임(10)을 커팅 지그(122) 상에 위치시킨다. 커팅 지그(122)에 리드 프레임(10)이 셋팅되면, 선택버튼(114b)을 조작하여 커팅부(120)가 동작될 수 있도록 하고 한 쌍의 시작버튼(114d)을 동시에 눌러서 커팅 금형(123)에 의해 커팅이 될 수 있도록 한다.First, the operator turns on the power button 114a to cut an end portion of the lead frame 10 to be welded and connected, and places the lead frame 10 on the cutting jig 122. When the lead frame 10 is set in the cutting jig 122, the cutting unit 120 may be operated by operating the selection button 114b and pressing the pair of start buttons 114d simultaneously to cut the cutting mold 123. Can be cut by
그리고, 커팅이 완료되면, 작업자는 커팅된 리드 프레임(10)과 연결하고자 하는 리드 프레임(10')을 용접부(130)의 용접 지그(132) 상으로 옮겨 정렬시키게 된다.When the cutting is completed, the worker moves the lead frame 10 ′ to be connected to the cut lead frame 10 onto the welding jig 132 of the welder 130 to be aligned.
다음으로, 선택버튼(114b)을 조작하여 용접부(130)가 작동될 수 있도록 하고 한 쌍의 시작버튼(114d)을 동시에 눌러서 제 2실린더(135)를 하강시켜 용접대(134)와 함께 용접봉(136)을 수직하강시켜 상기 용접 지그(132) 상에 배치된 리드프레임의 단부에 접촉되도록 한다.Next, the welding unit 130 may be operated by operating the selection button 114b, and the second cylinder 135 is lowered by simultaneously pressing a pair of start buttons 114d to form a welding rod together with the welding table 134. 136 is vertically lowered to contact the end of the lead frame disposed on the welding jig 132.
상기 리드프레임(10)의 단부와 단부가 연결되는 용접부위에 상기 용접봉(136)이 접촉하게 되면 용접전류를 공급하여 상기 용접부위에 용접전류를 흘려준 후 상기 용접봉(136)과 용접부위의 접촉을 통하여 상기 용접부위를 일정한 압력으로 일정시간 가압시켜 1차 용접을 완료하게 된다.When the welding rod 136 is in contact with the welding portion that is connected to the end and the end of the lead frame 10, a welding current is supplied to flow the welding current through the welding portion, and then the contact with the welding rod 136 and the welding portion. The welding portion is pressurized at a constant pressure for a predetermined time to complete the primary welding.
이때, 상기 용접봉(136) 및 리드프레임(10)의 재질이 구리가 함유된 금속재질로 이루어진 경우 상기 용접부위에 공급되는 용접전류는 900~1200A로 공급되며, 용접부위에 가압되는 압력은 1~5bar의 압력으로 수행되는 것이 바람직하다.At this time, when the material of the welding rod 136 and the lead frame 10 is made of a metal material containing copper, the welding current supplied to the welding portion is supplied to 900 ~ 1200A, the pressure is applied to the welding portion of 1 ~ 5bar It is preferably carried out under pressure.
이는, 용접부위에 공급되는 용접전류가 900A이하인 경우에는 오버랩이나 용입불량이 발생하고, 용접전류가 1200A이상인 경우에는 언더컷이나 피트가 발생하여 용접불량이 발생하게 되기 때문이다.This is because overlap or penetration failure occurs when the welding current supplied to the welding portion is 900 A or less, and undercut or pit occurs when the welding current is 1200 A or more, resulting in welding failure.
이와 같이 1차 용접이 완료된 용접부위는 상기 용접봉(10)이 용접부위에 접촉된 상태에서 상기 용접봉 주위에 구비된 센서부(137)를 통하여 용접부위의 접합상태에 대한 정보를 확인하게 된다.As described above, the welding part of which the primary welding is completed may check the information about the welding state of the welding part through the sensor part 137 provided around the electrode while the electrode 10 is in contact with the welding part.
즉, 상기 1차 용접에 의해 리드프레임의 단부와 단부가 서로 양호한 상태로 용접이 이루어졌는지를 확인하게 되며, 용접이 양호한 상태로 수행된 경우에는 센서부(137)를 통해 획득한 정보를 상기 제어부(미도시) 측으로 전달하여 패널부(114)에 구비된 작업램프(114e)를 점등시켜 더 이상 불필요한 용접이 이루어지지 않도록 한다.That is, it is checked whether the end of the lead frame and the end of the lead frame are welded to each other in a good state by the primary welding, and when the welding is performed in a good state, the information obtained through the sensor unit 137 is controlled. Transfer to the side (not shown) to turn on the work lamp 114e provided in the panel portion 114 so that unnecessary welding is no longer made.
또한, 상기 제어부는 센서부(114)에 의해 1차 용접된 용접부위의 상태정보를 확인하여 용접이 양호한 경우에는 상기 제2실린더(135)를 수직 상방으로 작동시켜 용접봉을 용접부위로부터 이격되도록 한다.In addition, the control unit checks the state information of the welded portion first welded by the sensor unit 114, and when welding is good, the second cylinder 135 is operated vertically upward so that the welding rod is spaced apart from the welded portion. .
그리고, 1차 용접이 끝난 용접부위를 센서부(114)를 통해 확인하여 용접이 제대로 이루어지지 않은 경우에는 상기 작업램프(114e)를 점등시키지 않도록 함으로써 사용자가 2차 용접이 필요하다는 것을 용이하게 식별할 수 있도록 한다.In addition, the user can easily identify that the secondary welding is necessary by checking the welded portion after the primary welding through the sensor unit 114 so as not to turn on the work lamp 114e when the welding is not performed properly. Do it.
즉, 1차 용접이 끝난 용접부위에 용접봉(136)이 접촉된 상태에서 1차 용접과 동일한 용접전류를 흘려준 후 상기 용접봉의 접촉을 통하여 상기 용접부위를 일정한 압력으로 일정시간 가압시켜 2차 용접을 완료하게 된다.That is, in the state where the welding rod 136 is in contact with the welded end of the primary welding, the same welding current as that of the primary welding flows, and then pressurizes the welding portion at a constant pressure through the contact of the welding rod for a predetermined time to perform the secondary welding. You are done.
이때, 2차 용접시 공급되는 용접전류와 가압력은 1차 용접시 사용되는 용접전류 및 가압력과 동일한 크기로 수행된다.At this time, the welding current and the pressing force supplied during the secondary welding are performed in the same size as the welding current and the pressing force used in the primary welding.
이와 같이 리드프레임의 단부를 용접시키는 용접봉이 동종의 재질로 이루어진 경우, 상술한 바와 같이 용접전류를 두번에 걸쳐 공급하여 용접을 수행하게 된다.As described above, when the electrode for welding the end of the lead frame is made of the same material, welding is performed by supplying the welding current twice over as described above.
즉, 상기 용접부위는 1차 용접을 통해 공급되는 용접전류에 의해 예열이 되는 한편 표면에 존재하는 불순물이 제거되게 되고, 연속적으로 수행되는 2차 용접에 의해 용접이 이루어짐으로써 리드프레임과 용접봉의 재질이 동종으로 이루어진 경우에도 용이하게 용접이 이루어질 수 있게 된다.That is, the welding part is preheated by the welding current supplied through the primary welding, and impurities present on the surface are removed, and the welding is performed by the secondary welding continuously performed to make the material of the lead frame and the welding rod. Even if it is made of the same kind, the welding can be easily made.
또한, 상술한 바와 같이 상기 센서부를 통해 1차 용접된 결과를 확인하여 2차 용접의 필요성을 작업램프를 통해 사용자에게 알려줌으로써 불량을 없애 제품의 신뢰성을 높이는 한편, 불필요한 용접이 이루어지지 않도록 할 수가 있는 것이다.In addition, as described above, by confirming the result of the primary welding through the sensor unit, the user can be notified of the necessity of the secondary welding through the work lamp, thereby eliminating defects, increasing the reliability of the product, and preventing unnecessary welding. It is.

Claims (6)

  1. 리드프레임의 단부를 절단하는 커팅부와 상기 커팅부에 의해 절단된 리드 프레임의 단부와 단부를 상기 리드프레임과 동종의 재질로 이루어진 용접봉을 이용하여 상호 용접하는 용접부를 포함하는 리드 프레임의 접합 장치에 있어서,In the joining device of the lead frame including a cutting portion for cutting the end of the lead frame and a welding portion for welding the end and end of the lead frame cut by the cutting portion using a welding rod made of the same material as the lead frame In
    상기 리드프레임의 단부와 다른 리드프레임의 단부를 상기 용접부에 정렬시키는 단계;Aligning an end of the lead frame with an end of another lead frame to the weld portion;
    상기 정렬된 리드프레임의 단부에 상기 용접봉을 접촉시킨 후 용접전류를 1차 공급하는 단계;Firstly supplying a welding current after contacting the electrode at an end of the aligned lead frame;
    상기 용접전류가 공급된 리드프레임의 용접부위를 일정시간 1차 가압하는 단계;First pressing the welding part of the lead frame to which the welding current is supplied for a predetermined time;
    상기 1차 가압된 용접부위의 접합상태에 대한 정보를 센서부를 통하여 수집하는 단계;Collecting information on a bonding state of the first pressurized welding part through a sensor part;
    상기 1차 가압된 용접부위에 용접전류를 2차 공급하는 단계; 및Supplying a second welding current to the first pressurized welding part; And
    상기 용접전류가 2차 공급된 용접부위를 일정시간 2차 가압하는 단계;를 포함하는 것을 특징으로 하는 반도체 장치용 리드 프레임의 접합방법.And pressurizing the welding portion supplied with the welding current secondaryly for a predetermined time for a predetermined time.
  2. 제 1항에 있어서,The method of claim 1,
    상기 용접봉과 리드프레임은 구리가 함유된 금속재질로 이루어지는 것을 특징으로 하는 반도체 장치용 리드 프레임의 접합방법.The welding rod and the lead frame is a bonding method of the lead frame for a semiconductor device, characterized in that made of a metallic material containing copper.
  3. 제 2항에 있어서,The method of claim 2,
    상기 용접부위에 가해지는 가압력은 1~5bar인 것을 특징으로 하는 반도체 장치용 리드 프레임의 접합방법.The pressing force applied to the said welding part is the joining method of the lead frame for semiconductor devices characterized by the above-mentioned.
  4. 제 2항에 있어서,The method of claim 2,
    상기 용접부위에 공급되는 용접전류는 900~1200A인 것을 특징으로 하는 반도체 장치용 리드 프레임의 접합방법.Welding current supplied to the welding portion is a bonding method of the lead frame for a semiconductor device, characterized in that 900 ~ 1200A.
  5. 제 1항에 있어서,The method of claim 1,
    상기 접합상태에 대한 정보를 확인하는 단계 후에는 접합상태가 양호한 경우 상기 용접봉과 용접부위의 접촉을 해제시켜 용접을 완료하는 것을 특징으로 하는 반도체 장치용 리드 프레임의 접합방법.And after the checking of the information on the bonded state, in the case where the bonded state is good, welding is completed by releasing contact between the welding rod and the welded part.
  6. 제 1항에 있어서,The method of claim 1,
    상기 접합상태에 대한 정보를 확인하는 단계는 상기 용접봉이 용접부위에 접촉을 유지한 상태에서 이루어지는 것을 특징으로 하는 반도체 장치용 리드 프레임의 접합방법.And confirming the information on the bonding state is performed in a state in which the electrode maintains contact with the welding portion.
PCT/KR2010/003960 2010-06-17 2010-06-18 Method for bonding lead frames for a semiconductor device WO2011158983A1 (en)

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KR1020100057591A KR101151561B1 (en) 2010-06-17 2010-06-17 Connection Method Of Leadframe for Semiconductor Device
KR10-2010-0057591 2010-06-17

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Citations (4)

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Publication number Priority date Publication date Assignee Title
KR0120402B1 (en) * 1994-04-01 1997-10-27 곽노권 Trimming and spot of lead frame
KR0163079B1 (en) * 1993-06-14 1998-12-01 사토 후미오 Manufacture of resin-sealed type semiconductor device, lead frame for mounting plurality of semiconductor element used in manufacturing method thereof and resin-sealed type semiconductor fabricated by manufacturing method
JP2004351509A (en) * 2003-05-30 2004-12-16 Koyabe Seiki:Kk Device for welding inspection
KR100925412B1 (en) * 2008-08-06 2009-11-06 김남훈 Connection Device Of Leadframe for Semiconductor Device

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* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH05315497A (en) * 1992-03-09 1993-11-26 Hoden Seimitsu Kako Kenkyusho Ltd Manufacture of lead frame-shaped product
JPH0736432B2 (en) * 1992-12-28 1995-04-19 メテック北村株式会社 Method for manufacturing semiconductor device

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR0163079B1 (en) * 1993-06-14 1998-12-01 사토 후미오 Manufacture of resin-sealed type semiconductor device, lead frame for mounting plurality of semiconductor element used in manufacturing method thereof and resin-sealed type semiconductor fabricated by manufacturing method
KR0120402B1 (en) * 1994-04-01 1997-10-27 곽노권 Trimming and spot of lead frame
JP2004351509A (en) * 2003-05-30 2004-12-16 Koyabe Seiki:Kk Device for welding inspection
KR100925412B1 (en) * 2008-08-06 2009-11-06 김남훈 Connection Device Of Leadframe for Semiconductor Device

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