WO2011152625A3 - Wafer polishing apparatus - Google Patents

Wafer polishing apparatus Download PDF

Info

Publication number
WO2011152625A3
WO2011152625A3 PCT/KR2011/003747 KR2011003747W WO2011152625A3 WO 2011152625 A3 WO2011152625 A3 WO 2011152625A3 KR 2011003747 W KR2011003747 W KR 2011003747W WO 2011152625 A3 WO2011152625 A3 WO 2011152625A3
Authority
WO
WIPO (PCT)
Prior art keywords
polishing apparatus
wafer polishing
wafer
polishing
polishing part
Prior art date
Application number
PCT/KR2011/003747
Other languages
French (fr)
Other versions
WO2011152625A2 (en
Inventor
Sang Min An
Original Assignee
Lg Siltron Inc.
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Lg Siltron Inc. filed Critical Lg Siltron Inc.
Priority to JP2013513104A priority Critical patent/JP2013527624A/en
Priority to EP11789983.1A priority patent/EP2577718A2/en
Publication of WO2011152625A2 publication Critical patent/WO2011152625A2/en
Publication of WO2011152625A3 publication Critical patent/WO2011152625A3/en

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B9/00—Machines or devices designed for grinding edges or bevels on work or for removing burrs; Accessories therefor
    • B24B9/02—Machines or devices designed for grinding edges or bevels on work or for removing burrs; Accessories therefor characterised by a special design with respect to properties of materials specific to articles to be ground
    • B24B9/06—Machines or devices designed for grinding edges or bevels on work or for removing burrs; Accessories therefor characterised by a special design with respect to properties of materials specific to articles to be ground of non-metallic inorganic material, e.g. stone, ceramics, porcelain
    • B24B9/065—Machines or devices designed for grinding edges or bevels on work or for removing burrs; Accessories therefor characterised by a special design with respect to properties of materials specific to articles to be ground of non-metallic inorganic material, e.g. stone, ceramics, porcelain of thin, brittle parts, e.g. semiconductors, wafers
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B24B37/02—Lapping machines or devices; Accessories designed for working surfaces of revolution

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Chemical & Material Sciences (AREA)
  • Ceramic Engineering (AREA)
  • Inorganic Chemistry (AREA)
  • Mechanical Treatment Of Semiconductor (AREA)
  • Grinding Of Cylindrical And Plane Surfaces (AREA)

Abstract

Provided is a wafer polishing apparatus. The wafer polishing apparatus comprises a first polishing part and a second polishing part. The first polishing part is disposed at a position higher than a top surface of a wafer and configured to be rotated on a first rotation axis. The second polishing part is disposed at a position lower than a bottom surface of the wafer and configured to be rotated on a second rotation axis.
PCT/KR2011/003747 2010-06-01 2011-05-23 Wafer polishing apparatus WO2011152625A2 (en)

Priority Applications (2)

Application Number Priority Date Filing Date Title
JP2013513104A JP2013527624A (en) 2010-06-01 2011-05-23 Wafer polisher
EP11789983.1A EP2577718A2 (en) 2010-06-01 2011-05-23 Wafer polishing apparatus

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
KR10-2010-0051685 2010-06-01
KR1020100051685A KR101089480B1 (en) 2010-06-01 2010-06-01 Wafer polishing apparatus

Publications (2)

Publication Number Publication Date
WO2011152625A2 WO2011152625A2 (en) 2011-12-08
WO2011152625A3 true WO2011152625A3 (en) 2012-04-19

Family

ID=45022523

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/KR2011/003747 WO2011152625A2 (en) 2010-06-01 2011-05-23 Wafer polishing apparatus

Country Status (5)

Country Link
US (1) US20110294406A1 (en)
EP (1) EP2577718A2 (en)
JP (1) JP2013527624A (en)
KR (1) KR101089480B1 (en)
WO (1) WO2011152625A2 (en)

Families Citing this family (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP5988765B2 (en) * 2012-08-13 2016-09-07 ダイトエレクトロン株式会社 Wafer chamfering method, wafer chamfering apparatus, and jig for angle adjustment
JP6045542B2 (en) * 2014-09-11 2016-12-14 信越半導体株式会社 Semiconductor wafer processing method, bonded wafer manufacturing method, and epitaxial wafer manufacturing method
CN108436684A (en) * 2018-05-30 2018-08-24 郑州博钰特超硬材料制品有限公司 A kind of grinding device for processing of stone
KR102126073B1 (en) * 2018-07-12 2020-06-23 주식회사 영도 Edge polishing apparatus for processing object
CN115256096A (en) * 2022-07-06 2022-11-01 无锡新瑞驰科技有限公司 Motor core surface burring device

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2003127051A (en) * 2001-10-23 2003-05-08 Yac Co Ltd Wafer edge polishing method and device
JP2003151925A (en) * 2001-11-12 2003-05-23 Yac Co Ltd Apparatus for wafer-edge polishing processing
JP2010034429A (en) * 2008-07-31 2010-02-12 Sumco Corp Method of polishing periphery of semiconductor wafer and apparatus thereof

Family Cites Families (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH081493A (en) * 1994-06-17 1996-01-09 Shin Etsu Handotai Co Ltd Mirror finished surface polishing method for wafer chamfering part and mirror finished surface polishing device
JP3010572B2 (en) * 1994-09-29 2000-02-21 株式会社東京精密 Wafer edge processing equipment
US6622334B1 (en) * 2000-03-29 2003-09-23 International Business Machines Corporation Wafer edge cleaning utilizing polish pad material
JP3510584B2 (en) * 2000-11-07 2004-03-29 スピードファム株式会社 Peripheral polishing device for disk-shaped workpiece
JP2002329687A (en) * 2001-05-02 2002-11-15 Speedfam Co Ltd Apparatus and method of polishing periphery of device wafer
JP2002367939A (en) * 2001-06-05 2002-12-20 Speedfam Co Ltd Method for fabricating semiconductor device and apparatus for removing unwanted film on periphery thereof
US7744445B2 (en) * 2004-10-15 2010-06-29 Kabushiki Kaisha Toshiba Polishing apparatus and polishing method
JP2007088143A (en) * 2005-09-21 2007-04-05 Elpida Memory Inc Edge grinding device

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2003127051A (en) * 2001-10-23 2003-05-08 Yac Co Ltd Wafer edge polishing method and device
JP2003151925A (en) * 2001-11-12 2003-05-23 Yac Co Ltd Apparatus for wafer-edge polishing processing
JP2010034429A (en) * 2008-07-31 2010-02-12 Sumco Corp Method of polishing periphery of semiconductor wafer and apparatus thereof

Also Published As

Publication number Publication date
EP2577718A2 (en) 2013-04-10
KR101089480B1 (en) 2011-12-07
WO2011152625A2 (en) 2011-12-08
US20110294406A1 (en) 2011-12-01
JP2013527624A (en) 2013-06-27

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