EP2660004A4 - Diamond surface polishing method - Google Patents

Diamond surface polishing method Download PDF

Info

Publication number
EP2660004A4
EP2660004A4 EP11852528.6A EP11852528A EP2660004A4 EP 2660004 A4 EP2660004 A4 EP 2660004A4 EP 11852528 A EP11852528 A EP 11852528A EP 2660004 A4 EP2660004 A4 EP 2660004A4
Authority
EP
European Patent Office
Prior art keywords
polishing method
surface polishing
diamond surface
diamond
polishing
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
EP11852528.6A
Other languages
German (de)
French (fr)
Other versions
EP2660004B1 (en
EP2660004A1 (en
Inventor
Ryozo SHIROISHI
Kenichi Takao
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Toyo Seikan Group Holdings Ltd
Original Assignee
Toyo Seikan Group Holdings Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from JP2010292145A external-priority patent/JP5817116B2/en
Application filed by Toyo Seikan Group Holdings Ltd filed Critical Toyo Seikan Group Holdings Ltd
Publication of EP2660004A1 publication Critical patent/EP2660004A1/en
Publication of EP2660004A4 publication Critical patent/EP2660004A4/en
Application granted granted Critical
Publication of EP2660004B1 publication Critical patent/EP2660004B1/en
Active legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Classifications

    • BPERFORMING OPERATIONS; TRANSPORTING
    • B24GRINDING; POLISHING
    • B24BMACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B1/00Processes of grinding or polishing; Use of auxiliary equipment in connection with such processes
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B24GRINDING; POLISHING
    • B24BMACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B19/00Single-purpose machines or devices for particular grinding operations not covered by any other main group
    • B24B19/22Single-purpose machines or devices for particular grinding operations not covered by any other main group characterised by a special design with respect to properties of the material of non-metallic articles to be ground
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B24GRINDING; POLISHING
    • B24BMACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B21/00Machines or devices using grinding or polishing belts; Accessories therefor
    • B24B21/04Machines or devices using grinding or polishing belts; Accessories therefor for grinding plane surfaces
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B24GRINDING; POLISHING
    • B24BMACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B21/00Machines or devices using grinding or polishing belts; Accessories therefor
    • B24B21/16Machines or devices using grinding or polishing belts; Accessories therefor for grinding other surfaces of particular shape
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B24GRINDING; POLISHING
    • B24BMACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B7/00Machines or devices designed for grinding plane surfaces on work, including polishing plane glass surfaces; Accessories therefor
    • B24B7/02Machines or devices designed for grinding plane surfaces on work, including polishing plane glass surfaces; Accessories therefor involving a reciprocatingly-moved work-table
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B24GRINDING; POLISHING
    • B24BMACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B7/00Machines or devices designed for grinding plane surfaces on work, including polishing plane glass surfaces; Accessories therefor
    • B24B7/20Machines or devices designed for grinding plane surfaces on work, including polishing plane glass surfaces; Accessories therefor characterised by a special design with respect to properties of the material of non-metallic articles to be ground
    • B24B7/22Machines or devices designed for grinding plane surfaces on work, including polishing plane glass surfaces; Accessories therefor characterised by a special design with respect to properties of the material of non-metallic articles to be ground for grinding inorganic material, e.g. stone, ceramics, porcelain
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B24GRINDING; POLISHING
    • B24BMACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B9/00Machines or devices designed for grinding edges or bevels on work or for removing burrs; Accessories therefor
    • B24B9/02Machines or devices designed for grinding edges or bevels on work or for removing burrs; Accessories therefor characterised by a special design with respect to properties of materials specific to articles to be ground
    • B24B9/06Machines or devices designed for grinding edges or bevels on work or for removing burrs; Accessories therefor characterised by a special design with respect to properties of materials specific to articles to be ground of non-metallic inorganic material, e.g. stone, ceramics, porcelain
    • B24B9/16Machines or devices designed for grinding edges or bevels on work or for removing burrs; Accessories therefor characterised by a special design with respect to properties of materials specific to articles to be ground of non-metallic inorganic material, e.g. stone, ceramics, porcelain of diamonds; of jewels or the like; Diamond grinders' dops; Dop holders or tongs
    • B24B9/166Machines or devices designed for grinding edges or bevels on work or for removing burrs; Accessories therefor characterised by a special design with respect to properties of materials specific to articles to be ground of non-metallic inorganic material, e.g. stone, ceramics, porcelain of diamonds; of jewels or the like; Diamond grinders' dops; Dop holders or tongs using heat
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B24GRINDING; POLISHING
    • B24DTOOLS FOR GRINDING, BUFFING OR SHARPENING
    • B24D3/00Physical features of abrasive bodies, or sheets, e.g. abrasive surfaces of special nature; Abrasive bodies or sheets characterised by their constituents
    • B24D3/02Physical features of abrasive bodies, or sheets, e.g. abrasive surfaces of special nature; Abrasive bodies or sheets characterised by their constituents the constituent being used as bonding agent
    • B24D3/04Physical features of abrasive bodies, or sheets, e.g. abrasive surfaces of special nature; Abrasive bodies or sheets characterised by their constituents the constituent being used as bonding agent and being essentially inorganic
    • B24D3/06Physical features of abrasive bodies, or sheets, e.g. abrasive surfaces of special nature; Abrasive bodies or sheets characterised by their constituents the constituent being used as bonding agent and being essentially inorganic metallic or mixture of metals with ceramic materials, e.g. hard metals, "cermets", cements

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Chemical & Material Sciences (AREA)
  • Ceramic Engineering (AREA)
  • Inorganic Chemistry (AREA)
  • Grinding And Polishing Of Tertiary Curved Surfaces And Surfaces With Complex Shapes (AREA)
  • Polishing Bodies And Polishing Tools (AREA)
  • Grinding-Machine Dressing And Accessory Apparatuses (AREA)
  • Crystals, And After-Treatments Of Crystals (AREA)
  • Laser Beam Processing (AREA)
EP11852528.6A 2010-12-28 2011-07-26 Diamond surface polishing method Active EP2660004B1 (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2010292145A JP5817116B2 (en) 2010-02-03 2010-12-28 Diamond surface polishing method
PCT/JP2011/066952 WO2012090540A1 (en) 2010-12-28 2011-07-26 Diamond surface polishing method

Publications (3)

Publication Number Publication Date
EP2660004A1 EP2660004A1 (en) 2013-11-06
EP2660004A4 true EP2660004A4 (en) 2017-11-22
EP2660004B1 EP2660004B1 (en) 2021-07-14

Family

ID=46384055

Family Applications (1)

Application Number Title Priority Date Filing Date
EP11852528.6A Active EP2660004B1 (en) 2010-12-28 2011-07-26 Diamond surface polishing method

Country Status (5)

Country Link
EP (1) EP2660004B1 (en)
KR (2) KR101785183B1 (en)
CN (1) CN103282157B (en)
BR (1) BR112013015008B1 (en)
WO (1) WO2012090540A1 (en)

Families Citing this family (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE102013218446A1 (en) * 2013-09-13 2015-03-19 Cemecon Ag Tool and method for cutting fiber reinforced materials
JP6488775B2 (en) * 2015-03-09 2019-03-27 東洋製罐グループホールディングス株式会社 Diamond surface polishing method and apparatus for carrying out the same
CN107457616B (en) * 2017-09-07 2019-07-26 哈尔滨工业大学 A kind of diamond crystal surface chemical mechanical polishing method based on nano-nickel powder
CN110774153B (en) * 2019-10-23 2022-02-08 华侨大学 Polishing method of large-size single crystal diamond
CN110774118B (en) * 2019-10-23 2021-04-30 华侨大学 Grinding method of large-size single crystal diamond
CN114012512B (en) * 2021-10-29 2022-08-16 哈尔滨工业大学 Small ball head magnetorheological polishing method based on joint assistance of laser heating, water bath heating and chemical action
CN115229647B (en) * 2022-07-20 2023-08-29 华侨大学 Device for polishing diamond with assistance of femtosecond laser and polishing method thereof

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH08175826A (en) * 1994-12-22 1996-07-09 Canon Inc Method for polishing diamond film
EP1052058A2 (en) * 1999-05-12 2000-11-15 THE STATE OF JAPAN, as Represented by the DIRECTOR GENERAL of the AGENCY of INDUSTRIAL SCIENCE and TECHNOLOGY Grinding & polishing tool for diamond, method for polishing diamond and polished diamond, single crystal diamond and sintered diamond compact obtained thereby
JP2001198833A (en) * 2000-01-21 2001-07-24 Natl Inst Of Advanced Industrial Science & Technology Meti Diamond grinding wheel and diamond grinding method, ground diamond body obtained thereby, single-crystal diamond, sintered diamond body, composite diamond grinding wheel, and diamond grinding wheel segment
JP2005231022A (en) * 2004-01-22 2005-09-02 Tokyo Metropolis Method and device for polishing diamond

Family Cites Families (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5858190B2 (en) * 1981-11-10 1983-12-23 株式会社東芝 Diamond polishing method
JPH0775818B2 (en) * 1986-08-08 1995-08-16 株式会社東芝 Diamond member processing method
JP3096943B2 (en) 1992-12-07 2000-10-10 鋼鈑工業株式会社 Laser polishing method and apparatus for diamond and diamond product using the same
JP3144752B2 (en) 1994-05-24 2001-03-12 キヤノン株式会社 Polishing method of diamond film
JPH09117852A (en) * 1995-10-26 1997-05-06 Dainippon Printing Co Ltd Fine pattern partial grinding device
CN2561551Y (en) * 2002-08-23 2003-07-23 郑州磨料磨具磨削研究所 Abrasive band polisher for diamond saw discs
CN101310923A (en) * 2007-05-23 2008-11-26 房丰洲 Novel diamond grinding method using localized heating

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH08175826A (en) * 1994-12-22 1996-07-09 Canon Inc Method for polishing diamond film
EP1052058A2 (en) * 1999-05-12 2000-11-15 THE STATE OF JAPAN, as Represented by the DIRECTOR GENERAL of the AGENCY of INDUSTRIAL SCIENCE and TECHNOLOGY Grinding & polishing tool for diamond, method for polishing diamond and polished diamond, single crystal diamond and sintered diamond compact obtained thereby
JP2001198833A (en) * 2000-01-21 2001-07-24 Natl Inst Of Advanced Industrial Science & Technology Meti Diamond grinding wheel and diamond grinding method, ground diamond body obtained thereby, single-crystal diamond, sintered diamond body, composite diamond grinding wheel, and diamond grinding wheel segment
JP2005231022A (en) * 2004-01-22 2005-09-02 Tokyo Metropolis Method and device for polishing diamond

Non-Patent Citations (1)

* Cited by examiner, † Cited by third party
Title
See also references of WO2012090540A1 *

Also Published As

Publication number Publication date
WO2012090540A1 (en) 2012-07-05
BR112013015008B1 (en) 2021-04-13
EP2660004B1 (en) 2021-07-14
BR112013015008A2 (en) 2016-08-09
KR20150104214A (en) 2015-09-14
CN103282157B (en) 2016-05-18
EP2660004A1 (en) 2013-11-06
CN103282157A (en) 2013-09-04
KR20130092606A (en) 2013-08-20
KR101785183B1 (en) 2017-10-12

Similar Documents

Publication Publication Date Title
EP2583779A4 (en) Gear grinding method
EP2782552B8 (en) Nail polish
IL231935A0 (en) Polishing pad and method for producing same
EP2679342A4 (en) Polishing composition
EP2507013A4 (en) Dual tapered shaped abrasive particles
SG11201401560VA (en) Double-side polishing method
EP2925489A4 (en) Smooth diamond surfaces and cmp method for forming
SI2174717T1 (en) Grinding method
GB201109207D0 (en) Diamond tools
SG11201401309PA (en) Composition for polishing purposes, polishing method using same, and method for producing substrate
EP2698809A4 (en) Polishing pad and manufacturing method therefor
EP2698811A4 (en) Polishing pad and manufacturing method therefor
EP2585254A4 (en) Nonwoven abrasive wheel
EP2628567A4 (en) Polishing composition
EP2594352A4 (en) Surface coating cutting tool
EP2767568A4 (en) Polishing slurry, and polishing method
EP2605270A4 (en) Polishing composition and polishing method
GB201006359D0 (en) Diamond microelectrode
EP2596152A4 (en) Surface treatment
EP2698810A4 (en) Polishing pad and manufacturing method therefor
EP2671658A4 (en) Gear grinding method
EP2660004A4 (en) Diamond surface polishing method
SI2364813T1 (en) Honing tool
GB201004373D0 (en) method for sythesising diamond
EP2461943A4 (en) Abrasive tool having controlled porosity distribution

Legal Events

Date Code Title Description
PUAI Public reference made under article 153(3) epc to a published international application that has entered the european phase

Free format text: ORIGINAL CODE: 0009012

STAA Information on the status of an ep patent application or granted ep patent

Free format text: STATUS: REQUEST FOR EXAMINATION WAS MADE

17P Request for examination filed

Effective date: 20130531

AK Designated contracting states

Kind code of ref document: A1

Designated state(s): AL AT BE BG CH CY CZ DE DK EE ES FI FR GB GR HR HU IE IS IT LI LT LU LV MC MK MT NL NO PL PT RO RS SE SI SK SM TR

DAX Request for extension of the european patent (deleted)
RA4 Supplementary search report drawn up and despatched (corrected)

Effective date: 20171025

RIC1 Information provided on ipc code assigned before grant

Ipc: B24B 9/16 20060101ALI20171019BHEP

Ipc: B24B 1/00 20060101AFI20171019BHEP

Ipc: B24B 7/02 20060101ALI20171019BHEP

Ipc: B24B 21/04 20060101ALI20171019BHEP

Ipc: B24D 3/06 20060101ALI20171019BHEP

REG Reference to a national code

Ref country code: DE

Ref legal event code: R079

Ref document number: 602011071381

Country of ref document: DE

Free format text: PREVIOUS MAIN CLASS: B24B0001000000

Ipc: B24B0019220000

GRAP Despatch of communication of intention to grant a patent

Free format text: ORIGINAL CODE: EPIDOSNIGR1

STAA Information on the status of an ep patent application or granted ep patent

Free format text: STATUS: GRANT OF PATENT IS INTENDED

RIC1 Information provided on ipc code assigned before grant

Ipc: B24B 19/22 20060101AFI20210330BHEP

Ipc: B24B 21/04 20060101ALI20210330BHEP

Ipc: B24B 21/16 20060101ALI20210330BHEP

Ipc: B24B 1/00 20060101ALI20210330BHEP

Ipc: B24B 7/22 20060101ALI20210330BHEP

Ipc: B24D 3/06 20060101ALI20210330BHEP

Ipc: B24B 7/02 20060101ALI20210330BHEP

Ipc: B24B 9/16 20060101ALI20210330BHEP

INTG Intention to grant announced

Effective date: 20210429

GRAS Grant fee paid

Free format text: ORIGINAL CODE: EPIDOSNIGR3

GRAA (expected) grant

Free format text: ORIGINAL CODE: 0009210

STAA Information on the status of an ep patent application or granted ep patent

Free format text: STATUS: THE PATENT HAS BEEN GRANTED

AK Designated contracting states

Kind code of ref document: B1

Designated state(s): AL AT BE BG CH CY CZ DE DK EE ES FI FR GB GR HR HU IE IS IT LI LT LU LV MC MK MT NL NO PL PT RO RS SE SI SK SM TR

REG Reference to a national code

Ref country code: GB

Ref legal event code: FG4D

REG Reference to a national code

Ref country code: DE

Ref legal event code: R096

Ref document number: 602011071381

Country of ref document: DE

REG Reference to a national code

Ref country code: IE

Ref legal event code: FG4D

REG Reference to a national code

Ref country code: AT

Ref legal event code: REF

Ref document number: 1410269

Country of ref document: AT

Kind code of ref document: T

Effective date: 20210815

REG Reference to a national code

Ref country code: LT

Ref legal event code: MG9D

REG Reference to a national code

Ref country code: NL

Ref legal event code: MP

Effective date: 20210714

REG Reference to a national code

Ref country code: AT

Ref legal event code: MK05

Ref document number: 1410269

Country of ref document: AT

Kind code of ref document: T

Effective date: 20210714

PG25 Lapsed in a contracting state [announced via postgrant information from national office to epo]

Ref country code: HR

Free format text: LAPSE BECAUSE OF FAILURE TO SUBMIT A TRANSLATION OF THE DESCRIPTION OR TO PAY THE FEE WITHIN THE PRESCRIBED TIME-LIMIT

Effective date: 20210714

Ref country code: SE

Free format text: LAPSE BECAUSE OF FAILURE TO SUBMIT A TRANSLATION OF THE DESCRIPTION OR TO PAY THE FEE WITHIN THE PRESCRIBED TIME-LIMIT

Effective date: 20210714

Ref country code: AT

Free format text: LAPSE BECAUSE OF FAILURE TO SUBMIT A TRANSLATION OF THE DESCRIPTION OR TO PAY THE FEE WITHIN THE PRESCRIBED TIME-LIMIT

Effective date: 20210714

Ref country code: BG

Free format text: LAPSE BECAUSE OF FAILURE TO SUBMIT A TRANSLATION OF THE DESCRIPTION OR TO PAY THE FEE WITHIN THE PRESCRIBED TIME-LIMIT

Effective date: 20211014

Ref country code: LT

Free format text: LAPSE BECAUSE OF FAILURE TO SUBMIT A TRANSLATION OF THE DESCRIPTION OR TO PAY THE FEE WITHIN THE PRESCRIBED TIME-LIMIT

Effective date: 20210714

Ref country code: NL

Free format text: LAPSE BECAUSE OF FAILURE TO SUBMIT A TRANSLATION OF THE DESCRIPTION OR TO PAY THE FEE WITHIN THE PRESCRIBED TIME-LIMIT

Effective date: 20210714

Ref country code: NO

Free format text: LAPSE BECAUSE OF FAILURE TO SUBMIT A TRANSLATION OF THE DESCRIPTION OR TO PAY THE FEE WITHIN THE PRESCRIBED TIME-LIMIT

Effective date: 20211014

Ref country code: PT

Free format text: LAPSE BECAUSE OF FAILURE TO SUBMIT A TRANSLATION OF THE DESCRIPTION OR TO PAY THE FEE WITHIN THE PRESCRIBED TIME-LIMIT

Effective date: 20211115

Ref country code: RS

Free format text: LAPSE BECAUSE OF FAILURE TO SUBMIT A TRANSLATION OF THE DESCRIPTION OR TO PAY THE FEE WITHIN THE PRESCRIBED TIME-LIMIT

Effective date: 20210714

Ref country code: FI

Free format text: LAPSE BECAUSE OF FAILURE TO SUBMIT A TRANSLATION OF THE DESCRIPTION OR TO PAY THE FEE WITHIN THE PRESCRIBED TIME-LIMIT

Effective date: 20210714

Ref country code: ES

Free format text: LAPSE BECAUSE OF FAILURE TO SUBMIT A TRANSLATION OF THE DESCRIPTION OR TO PAY THE FEE WITHIN THE PRESCRIBED TIME-LIMIT

Effective date: 20210714

PG25 Lapsed in a contracting state [announced via postgrant information from national office to epo]

Ref country code: PL

Free format text: LAPSE BECAUSE OF FAILURE TO SUBMIT A TRANSLATION OF THE DESCRIPTION OR TO PAY THE FEE WITHIN THE PRESCRIBED TIME-LIMIT

Effective date: 20210714

Ref country code: LV

Free format text: LAPSE BECAUSE OF FAILURE TO SUBMIT A TRANSLATION OF THE DESCRIPTION OR TO PAY THE FEE WITHIN THE PRESCRIBED TIME-LIMIT

Effective date: 20210714

Ref country code: GR

Free format text: LAPSE BECAUSE OF FAILURE TO SUBMIT A TRANSLATION OF THE DESCRIPTION OR TO PAY THE FEE WITHIN THE PRESCRIBED TIME-LIMIT

Effective date: 20211015

REG Reference to a national code

Ref country code: CH

Ref legal event code: PL

REG Reference to a national code

Ref country code: BE

Ref legal event code: MM

Effective date: 20210731

REG Reference to a national code

Ref country code: DE

Ref legal event code: R097

Ref document number: 602011071381

Country of ref document: DE

PG25 Lapsed in a contracting state [announced via postgrant information from national office to epo]

Ref country code: LI

Free format text: LAPSE BECAUSE OF NON-PAYMENT OF DUE FEES

Effective date: 20210731

Ref country code: DK

Free format text: LAPSE BECAUSE OF FAILURE TO SUBMIT A TRANSLATION OF THE DESCRIPTION OR TO PAY THE FEE WITHIN THE PRESCRIBED TIME-LIMIT

Effective date: 20210714

Ref country code: CH

Free format text: LAPSE BECAUSE OF NON-PAYMENT OF DUE FEES

Effective date: 20210731

PLBE No opposition filed within time limit

Free format text: ORIGINAL CODE: 0009261

STAA Information on the status of an ep patent application or granted ep patent

Free format text: STATUS: NO OPPOSITION FILED WITHIN TIME LIMIT

PG25 Lapsed in a contracting state [announced via postgrant information from national office to epo]

Ref country code: SM

Free format text: LAPSE BECAUSE OF FAILURE TO SUBMIT A TRANSLATION OF THE DESCRIPTION OR TO PAY THE FEE WITHIN THE PRESCRIBED TIME-LIMIT

Effective date: 20210714

Ref country code: SK

Free format text: LAPSE BECAUSE OF FAILURE TO SUBMIT A TRANSLATION OF THE DESCRIPTION OR TO PAY THE FEE WITHIN THE PRESCRIBED TIME-LIMIT

Effective date: 20210714

Ref country code: RO

Free format text: LAPSE BECAUSE OF FAILURE TO SUBMIT A TRANSLATION OF THE DESCRIPTION OR TO PAY THE FEE WITHIN THE PRESCRIBED TIME-LIMIT

Effective date: 20210714

Ref country code: MC

Free format text: LAPSE BECAUSE OF FAILURE TO SUBMIT A TRANSLATION OF THE DESCRIPTION OR TO PAY THE FEE WITHIN THE PRESCRIBED TIME-LIMIT

Effective date: 20210714

Ref country code: LU

Free format text: LAPSE BECAUSE OF NON-PAYMENT OF DUE FEES

Effective date: 20210726

Ref country code: EE

Free format text: LAPSE BECAUSE OF FAILURE TO SUBMIT A TRANSLATION OF THE DESCRIPTION OR TO PAY THE FEE WITHIN THE PRESCRIBED TIME-LIMIT

Effective date: 20210714

Ref country code: CZ

Free format text: LAPSE BECAUSE OF FAILURE TO SUBMIT A TRANSLATION OF THE DESCRIPTION OR TO PAY THE FEE WITHIN THE PRESCRIBED TIME-LIMIT

Effective date: 20210714

Ref country code: AL

Free format text: LAPSE BECAUSE OF FAILURE TO SUBMIT A TRANSLATION OF THE DESCRIPTION OR TO PAY THE FEE WITHIN THE PRESCRIBED TIME-LIMIT

Effective date: 20210714

26N No opposition filed

Effective date: 20220419

PG25 Lapsed in a contracting state [announced via postgrant information from national office to epo]

Ref country code: IT

Free format text: LAPSE BECAUSE OF FAILURE TO SUBMIT A TRANSLATION OF THE DESCRIPTION OR TO PAY THE FEE WITHIN THE PRESCRIBED TIME-LIMIT

Effective date: 20210714

Ref country code: IE

Free format text: LAPSE BECAUSE OF NON-PAYMENT OF DUE FEES

Effective date: 20210726

Ref country code: BE

Free format text: LAPSE BECAUSE OF NON-PAYMENT OF DUE FEES

Effective date: 20210731

PG25 Lapsed in a contracting state [announced via postgrant information from national office to epo]

Ref country code: HU

Free format text: LAPSE BECAUSE OF FAILURE TO SUBMIT A TRANSLATION OF THE DESCRIPTION OR TO PAY THE FEE WITHIN THE PRESCRIBED TIME-LIMIT; INVALID AB INITIO

Effective date: 20110726

Ref country code: CY

Free format text: LAPSE BECAUSE OF FAILURE TO SUBMIT A TRANSLATION OF THE DESCRIPTION OR TO PAY THE FEE WITHIN THE PRESCRIBED TIME-LIMIT

Effective date: 20210714

PGFP Annual fee paid to national office [announced via postgrant information from national office to epo]

Ref country code: GB

Payment date: 20230720

Year of fee payment: 13

PGFP Annual fee paid to national office [announced via postgrant information from national office to epo]

Ref country code: FR

Payment date: 20230725

Year of fee payment: 13

Ref country code: DE

Payment date: 20230719

Year of fee payment: 13

PG25 Lapsed in a contracting state [announced via postgrant information from national office to epo]

Ref country code: MK

Free format text: LAPSE BECAUSE OF FAILURE TO SUBMIT A TRANSLATION OF THE DESCRIPTION OR TO PAY THE FEE WITHIN THE PRESCRIBED TIME-LIMIT

Effective date: 20210714