WO2011139501A3 - Pad conditioning sweep torque modeling to achieve constant removal rate - Google Patents

Pad conditioning sweep torque modeling to achieve constant removal rate Download PDF

Info

Publication number
WO2011139501A3
WO2011139501A3 PCT/US2011/032319 US2011032319W WO2011139501A3 WO 2011139501 A3 WO2011139501 A3 WO 2011139501A3 US 2011032319 W US2011032319 W US 2011032319W WO 2011139501 A3 WO2011139501 A3 WO 2011139501A3
Authority
WO
WIPO (PCT)
Prior art keywords
polishing pad
removal rate
pad conditioning
achieve constant
conditioning
Prior art date
Application number
PCT/US2011/032319
Other languages
French (fr)
Other versions
WO2011139501A2 (en
Inventor
Sivakumar Dhandapani
Gregory E. Menk
Sang J. Cho
Jason Garcheung Fung
Christopher D. Cocca
Stan D. Tsai
Shou-Sung Chang
Charles C. Garretson
Original Assignee
Applied Materials, Inc.
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Applied Materials, Inc. filed Critical Applied Materials, Inc.
Priority to CN2011800073435A priority Critical patent/CN102782814A/en
Priority to US13/129,351 priority patent/US20130122783A1/en
Priority to JP2013507995A priority patent/JP2013526057A/en
Priority to KR1020127021075A priority patent/KR20130059312A/en
Publication of WO2011139501A2 publication Critical patent/WO2011139501A2/en
Publication of WO2011139501A3 publication Critical patent/WO2011139501A3/en

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer or carrier concentration layer
    • H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic System or AIIIBV compounds with or without impurities, e.g. doping materials
    • H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
    • H01L21/302—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to change their surface-physical characteristics or shape, e.g. etching, polishing, cutting
    • H01L21/304—Mechanical treatment, e.g. grinding, polishing, cutting
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B53/00—Devices or means for dressing or conditioning abrasive surfaces
    • B24B53/017—Devices or means for dressing, cleaning or otherwise conditioning lapping tools
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B24B37/04—Lapping machines or devices; Accessories designed for working plane surfaces
    • B24B37/042—Lapping machines or devices; Accessories designed for working plane surfaces operating processes therefor
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B53/00—Devices or means for dressing or conditioning abrasive surfaces

Abstract

A method and apparatus for conditioning a polishing pad in a CMP system is provided. In one embodiment, a method for conditioning a polishing pad includes applying a down force to the conditioning disk that urges the conditioning disk against the polishing pad, measuring a torque required to sweep the conditioning disk across the polishing pad, determining a change in down force by comparing the measured torque to a model force profile (MFP), and adjusting the down force that the conditioning disk applies against the polishing pad in response to the determined change.
PCT/US2011/032319 2010-04-30 2011-04-13 Pad conditioning sweep torque modeling to achieve constant removal rate WO2011139501A2 (en)

Priority Applications (4)

Application Number Priority Date Filing Date Title
CN2011800073435A CN102782814A (en) 2010-04-30 2011-04-13 Pad conditioning sweep torque modeling to achieve constant removal rate
US13/129,351 US20130122783A1 (en) 2010-04-30 2011-04-13 Pad conditioning force modeling to achieve constant removal rate
JP2013507995A JP2013526057A (en) 2010-04-30 2011-04-13 Pad-adjusted sweep torque modeling to achieve constant removal rate
KR1020127021075A KR20130059312A (en) 2010-04-30 2011-04-13 Pad conditioning sweep torque modeling to achieve constant removal rate

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US33030010P 2010-04-30 2010-04-30
US61/330,300 2010-04-30

Publications (2)

Publication Number Publication Date
WO2011139501A2 WO2011139501A2 (en) 2011-11-10
WO2011139501A3 true WO2011139501A3 (en) 2012-02-23

Family

ID=44904300

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/US2011/032319 WO2011139501A2 (en) 2010-04-30 2011-04-13 Pad conditioning sweep torque modeling to achieve constant removal rate

Country Status (6)

Country Link
US (1) US20130122783A1 (en)
JP (1) JP2013526057A (en)
KR (1) KR20130059312A (en)
CN (1) CN102782814A (en)
TW (1) TWI568534B (en)
WO (1) WO2011139501A2 (en)

Families Citing this family (20)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US8626458B2 (en) * 2009-11-05 2014-01-07 Vibration Technologies, Llc Method and system for measuring the dynamic response of a structure during a machining process
JP5511600B2 (en) * 2010-09-09 2014-06-04 株式会社荏原製作所 Polishing equipment
US8758085B2 (en) * 2010-10-21 2014-06-24 Applied Materials, Inc. Method for compensation of variability in chemical mechanical polishing consumables
JP5927083B2 (en) 2012-08-28 2016-05-25 株式会社荏原製作所 Dressing process monitoring method and polishing apparatus
CN103531509A (en) * 2013-09-26 2014-01-22 苏州经贸职业技术学院 Method for precisely positioning circle center on workbench
US9312142B2 (en) * 2014-06-10 2016-04-12 Globalfoundries Inc. Chemical mechanical polishing method and apparatus
GB201417861D0 (en) * 2014-10-09 2014-11-26 Rolls Royce Plc Abrasive processing method
JP6307428B2 (en) * 2014-12-26 2018-04-04 株式会社荏原製作所 Polishing apparatus and control method thereof
JP6444785B2 (en) * 2015-03-19 2018-12-26 株式会社荏原製作所 Polishing apparatus, control method therefor, and dressing condition output method
KR101695805B1 (en) * 2016-08-18 2017-01-12 정우엔텍 주식회사 CMP equipment conditioner structure
JP6357260B2 (en) * 2016-09-30 2018-07-11 株式会社荏原製作所 Polishing apparatus and polishing method
US10675732B2 (en) * 2017-04-18 2020-06-09 Taiwan Semiconductor Manufacturing Company, Ltd. Apparatus and method for CMP pad conditioning
JP7050152B2 (en) * 2017-11-16 2022-04-07 アプライド マテリアルズ インコーポレイテッド Predictive filter for monitoring polishing pad wear rate
US10857651B2 (en) * 2017-11-20 2020-12-08 Taiwan Semiconductor Manufacturing Company Ltd. Apparatus of chemical mechanical polishing and operating method thereof
US11292101B2 (en) * 2017-11-22 2022-04-05 Taiwan Semiconductor Manufacturing Co., Ltd. Chemical mechanical polishing apparatus and method
US11389928B2 (en) * 2017-11-30 2022-07-19 Taiwan Semiconductor Manufacturing Co., Ltd. Method for conditioning polishing pad
KR20200043214A (en) * 2018-10-17 2020-04-27 주식회사 케이씨텍 Conditioner of chemical mechanical polishing apparatus
US11794305B2 (en) 2020-09-28 2023-10-24 Applied Materials, Inc. Platen surface modification and high-performance pad conditioning to improve CMP performance
CN112476227A (en) * 2020-11-27 2021-03-12 华虹半导体(无锡)有限公司 Chemical mechanical polishing device
CN117260407B (en) * 2023-11-20 2024-03-12 铭扬半导体科技(合肥)有限公司 Detection method of polishing equipment

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6306008B1 (en) * 1999-08-31 2001-10-23 Micron Technology, Inc. Apparatus and method for conditioning and monitoring media used for chemical-mechanical planarization
US20020106971A1 (en) * 2001-02-06 2002-08-08 Rodriquez Jose Omar Method and apparatus for conditioning a polishing pad
US6953382B1 (en) * 2004-06-24 2005-10-11 Novellus Systems, Inc. Methods and apparatuses for conditioning polishing surfaces utilized during CMP processing
US20090318060A1 (en) * 2008-06-23 2009-12-24 Applied Materials, Inc. Closed-loop control for effective pad conditioning

Family Cites Families (20)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP3031345B2 (en) * 1998-08-18 2000-04-10 日本電気株式会社 Polishing apparatus and polishing method
JP4030247B2 (en) * 1999-05-17 2008-01-09 株式会社荏原製作所 Dressing device and polishing device
US20040182721A1 (en) * 2003-03-18 2004-09-23 Applied Materials, Inc. Process control in electro-chemical mechanical polishing
US6517414B1 (en) * 2000-03-10 2003-02-11 Appied Materials, Inc. Method and apparatus for controlling a pad conditioning process of a chemical-mechanical polishing apparatus
US7101799B2 (en) * 2001-06-19 2006-09-05 Applied Materials, Inc. Feedforward and feedback control for conditioning of chemical mechanical polishing pad
US7011566B2 (en) * 2002-08-26 2006-03-14 Micron Technology, Inc. Methods and systems for conditioning planarizing pads used in planarizing substrates
US20050061674A1 (en) * 2002-09-16 2005-03-24 Yan Wang Endpoint compensation in electroprocessing
JP2004186493A (en) * 2002-12-04 2004-07-02 Matsushita Electric Ind Co Ltd Method and arrangement for chemomechanical polishing
DE10324429B4 (en) * 2003-05-28 2010-08-19 Advanced Micro Devices, Inc., Sunnyvale Method for operating a chemical-mechanical polishing system by means of a sensor signal of a polishing pad conditioner
US7052371B2 (en) * 2003-05-29 2006-05-30 Tbw Industries Inc. Vacuum-assisted pad conditioning system and method utilizing an apertured conditioning disk
US6931330B1 (en) * 2003-06-30 2005-08-16 Lam Research Corporation Methods for monitoring and controlling chemical mechanical planarization
DE10345381B4 (en) * 2003-09-30 2013-04-11 Advanced Micro Devices, Inc. A method and system for controlling chemical mechanical polishing using a sensor signal from a pad conditioner
US7040958B2 (en) * 2004-05-21 2006-05-09 Mosel Vitelic, Inc. Torque-based end point detection methods for chemical mechanical polishing tool which uses ceria-based CMP slurry to polish to protective pad layer
US20070212983A1 (en) * 2006-03-13 2007-09-13 Applied Materials, Inc. Apparatus and methods for conditioning a polishing pad
US7840305B2 (en) * 2006-06-28 2010-11-23 3M Innovative Properties Company Abrasive articles, CMP monitoring system and method
US8065031B2 (en) * 2006-09-14 2011-11-22 Tokyo Seimitsu Co., Ltd Polishing end point detection method utilizing torque change and device thereof
DE102007015503B4 (en) * 2007-03-30 2013-03-21 Globalfoundries Inc. Method and system for controlling chemical mechanical polishing by taking into account zone specific substrate data
US8096852B2 (en) * 2008-08-07 2012-01-17 Applied Materials, Inc. In-situ performance prediction of pad conditioning disk by closed loop torque monitoring
US8221193B2 (en) * 2008-08-07 2012-07-17 Applied Materials, Inc. Closed loop control of pad profile based on metrology feedback
US20130217306A1 (en) * 2012-02-16 2013-08-22 Taiwan Semiconductor Manufacturing Co., Ltd. CMP Groove Depth and Conditioning Disk Monitoring

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6306008B1 (en) * 1999-08-31 2001-10-23 Micron Technology, Inc. Apparatus and method for conditioning and monitoring media used for chemical-mechanical planarization
US20020106971A1 (en) * 2001-02-06 2002-08-08 Rodriquez Jose Omar Method and apparatus for conditioning a polishing pad
US6953382B1 (en) * 2004-06-24 2005-10-11 Novellus Systems, Inc. Methods and apparatuses for conditioning polishing surfaces utilized during CMP processing
US20090318060A1 (en) * 2008-06-23 2009-12-24 Applied Materials, Inc. Closed-loop control for effective pad conditioning

Also Published As

Publication number Publication date
KR20130059312A (en) 2013-06-05
TW201206629A (en) 2012-02-16
CN102782814A (en) 2012-11-14
JP2013526057A (en) 2013-06-20
US20130122783A1 (en) 2013-05-16
TWI568534B (en) 2017-02-01
WO2011139501A2 (en) 2011-11-10

Similar Documents

Publication Publication Date Title
WO2011139501A3 (en) Pad conditioning sweep torque modeling to achieve constant removal rate
WO2012174348A3 (en) Systems and methods to assess and optimize energy usage for a facility
WO2015192003A8 (en) System and method for monitoring component service life
WO2014018461A3 (en) Sky polarization sensor for absolute orientation determination
EP2536196A4 (en) Method for controlling drive test measurement record, drive test system and user equipment
FR2979853B1 (en) PNEUMATIC PILOT DEVICE FOR AUTOMATIC INFLATING-DEFLATION OF A TIRE, IN PARTICULAR
WO2011111021A3 (en) System and method for rapid data collection from pressure sensors in a pressure sensing system
EP2887323A4 (en) Control device for alternate reality system, alternate reality system, control method for alternate reality system, program, and recording medium
WO2012061444A3 (en) System for forming emulsions
EP2904357C0 (en) Apparatus comprising an acoustic flowmeter, and method for determining the flow in an object
PT2732250T (en) System to determine if a vehicle is correctly positioned during weighing, a scale ticket data system and methods for using the same
WO2012024254A3 (en) Force and true capacitive touch measurement techniques for capacitive touch sensors
WO2012096532A3 (en) Method and device for setting channel status information measuring resource in a wireless communication system
WO2013188142A3 (en) Virtual demand auditing of devices in a building
WO2010111569A3 (en) System and method for estimating an efficiency of a power device
WO2013061268A3 (en) Method and device for accurate location determination in a specified area
WO2013016640A3 (en) Method and apparatus for monitoring manual chest compression efficiency during cpr
EP2650878A4 (en) Encoding method, encoding device, periodic feature amount determination method, periodic feature amount determination device, program and recording medium
EP3200038A4 (en) Model evaluation device, model evaluation method, and program recording medium
EP2525341A4 (en) Representative calculation system, method, request device, program and recording medium
TWI561136B (en) Method and device for determining the pressure distribution for bonding
EP2930819A4 (en) Charging control device, charging control method, computer program, and recording medium
EP2531928A4 (en) A dock for a portable hard disk and a method for accessing content on a host device using the dock
WO2013072685A3 (en) Method of assessing and condition monitoring of fluid conduits and apparatus therefor
WO2012128996A3 (en) Method of analyzing stopping distance performance efficiency

Legal Events

Date Code Title Description
WWE Wipo information: entry into national phase

Ref document number: 201180007343.5

Country of ref document: CN

WWE Wipo information: entry into national phase

Ref document number: 13129351

Country of ref document: US

121 Ep: the epo has been informed by wipo that ep was designated in this application

Ref document number: 11777801

Country of ref document: EP

Kind code of ref document: A2

ENP Entry into the national phase

Ref document number: 2013507995

Country of ref document: JP

Kind code of ref document: A

ENP Entry into the national phase

Ref document number: 20127021075

Country of ref document: KR

Kind code of ref document: A

NENP Non-entry into the national phase

Ref country code: DE

122 Ep: pct application non-entry in european phase

Ref document number: 11777801

Country of ref document: EP

Kind code of ref document: A2