WO2011122847A2

WO2011122847A2 - Optical device module and method for fabricating same

Info

Publication number: WO2011122847A2
Application number: PCT/KR2011/002178
Authority: WO
Inventors: 남기명; 송태환; 전영철
Original assignee: 주식회사 포인트 엔지니어링
Priority date: 2010-03-31
Filing date: 2011-03-30
Publication date: 2011-10-06
Also published as: WO2011122847A8; WO2011122847A3; KR101098533B1; KR20110109651A

Abstract

The present invention relates to an optical device module and to a method for fabricating same, which enable the production of a desired circuit configuration by forming at least one optical device package on a module substrate, wherein the optical device module is capable of easily dissipating heat. A disclosed optical device module according to one example of the present invention comprises at least one optical device package and a module substrate. The optical device package comprises: an optical device substrate including a first optical device region, a second optical device region separated from the first optical device region, and an optical device insulation layer formed between the first module region and the second module region; and an optical device formed at the upper portion of the optical device substrate. The module substrate is formed at the lower portion of the optical device package and comprises: a first module region; a second module region separated from the first module region; and a first module insulation layer formed between the first module region and the second module region. The first module region and the second module region are electrically connected to the first optical device region and the second optical device region, respectively, and are made of metal.

Description

Optical device module and its manufacturing method

The present invention relates to an optical device module and a method of manufacturing the same.

Optical devices refer to devices that generate light by receiving an electrical signal. Such optical devices are used in various fields, and in particular, they are widely used in the field of displays. For this reason, implementation of various circuit structures for optical devices is required.

On the other hand, light emitting diodes (LEDs) among optical devices are rapidly increasing in use because they can generate light with higher efficiency and higher luminance than conventional photon elements. Such light emitting diodes generate light by a combination of electrons and holes, which inevitably generate heat in addition to light. By the way, if the heat of the light emitting diode is not radiated, there is a risk of element breakage, and operation efficiency is lowered.

The present invention can implement a desired circuit structure by forming at least one optical device package on a module substrate, and provides an optical device module and a method of manufacturing the same that can easily perform heat dissipation.

An optical device module according to the present invention includes a first optical device region, a second optical device region spaced apart from the first optical device region, and an optical device insulating layer formed between the first module region and the second module region. At least one optical device package including an optical device substrate and an optical device formed on the optical device substrate; And a first module insulating layer formed under the optical device package and formed between a first module region, a second module region spaced apart from the first module region, and between the first module region and the second module region. The module module includes a module substrate, wherein each of the first module region and the second module region is electrically connected to each of the first optical device region and the second optical device region, and is formed of a metal material.

The module substrate may further include a second module insulating layer formed to contact the lower surfaces of the first module region and the second module region.

The first module region and the second module region may be formed of any one selected from copper, a copper alloy, aluminum, and an aluminum alloy.

The first optical device region and the second optical device region may be formed of any one selected from copper, a copper alloy, aluminum, and an aluminum alloy.

In addition, the optical device module according to the present invention may further include a solder layer formed between the first module region and the first optical device region, and between the second module region and the second optical device region.

The optical device may be coupled to an upper portion of the first optical device region, and the optical device package may further include a conductive wire connecting the optical device to the second optical device region.

The optical device package may be spaced apart along the longitudinal direction of one first module insulating layer, and may overlap each other to cross the first module insulating layer.

The first module insulating layer may include a first layer formed to contact the side surface of the first module region; A second layer formed in contact with a side of the second module region; And a third layer formed between the first and second layers, wherein the module substrate is a third module region formed between the first and third layers and between the second and third layers. Each of the optical device packages overlapping each of the first, second, and third layers over each of the first, second, and third layers; The first optical device region and the second optical device region of the adjacent optical device package may be electrically connected to each other.

The first module insulating layer may include a first layer formed to contact the side surface of the first module region; And a second layer formed to be in contact with a side surface of the second module region, wherein the module substrate includes a third module region formed between the first layer and the second layer, and the optical device package includes: Spaced apart along the longitudinal direction of the first layer and the second layer and overlapping the first layer and the second layer to cross each of the first layer and the second layer, the third module substrate; The second optical device region of the optical device package overlapping the first layer and the first optical device region of the optical device package overlapping the second layer may be electrically connected together.

The module substrate may be formed such that the second module region surrounds the first module region.

The optical device package may be disposed on the module substrate such that the optical device corresponds to the first module area. The first module region may be formed of a metal material having a higher thermal conductivity than the second module region. The first module area and the second module area may be formed of the same metal material, and an area of the first module area may be larger than that of the second module area.

The optical device package may be disposed on the module substrate such that the optical device corresponds to the second module area. The second module region may be formed of a metal material having a higher thermal conductivity than the first module region.

The first module area and the second module area may be formed of the same metal material, and the area of the second module area may be larger than that of the first module area.

A method of manufacturing an optical device module according to the present invention includes a first optical device region, a second optical device region spaced apart from the first optical device region, and interposed between the first optical device region and the second optical device region. An optical device package preparing step of preparing at least one optical device package including an optical device substrate including a first optical device insulation layer and an optical device formed on the optical device substrate; Preparing a module substrate comprising a first module region, a second module region spaced apart from the first module region, and a first module insulating layer formed between the first module region and the second module region. step; And an optical device package coupling step of coupling the optical device package to an upper portion of the module substrate, wherein the optical device package coupling step includes the first optical device area and the second module area, respectively; It is electrically connected to each of the second optical device region, each of the first module region and the second module region is characterized in that formed of a metallic material.

The preparing of the module substrate may include forming a pattern layer to surround upper and lower surfaces of the metal plate; Anodizing a region exposed to the outside of the pattern layer to form the first module substrate, the second module region, and the first module insulating layer on the metal plate to form the first module substrate; And removing the pattern layer to expose the module substrate. In the preparing of the module substrate, after forming the first module insulating layer, the first module region is formed by removing a portion of the pattern layer, which is located below the metal plate, and anodizing the region exposed to the outside of the pattern layer. And a second module insulating layer in contact with the bottom surface of the second module region.

The preparing of the module substrate may include preparing a plurality of metal plates and forming an adhesive member on an interface of the metal plates; Laminating the metal plates to each other through the adhesive member; And sawing the metal plate in a direction perpendicular to the boundary surface to form the first substrate region, the second module region, and the first module insulating layer on the metal plate to form the module substrate. . The preparing of the module substrate may include forming a pattern layer on an upper portion of the module substrate and anodizing a region exposed to the outside of the pattern layer to contact the bottom surface of the first module region and the second module region. An insulating layer can be further formed.

The preparing of the module substrate may include: anodizing a plurality of grooves formed in at least one of the surfaces of the base material along a length direction; Positioning a plurality of the base materials so that the grooves engage with each other, and coupling the base material and the members by positioning the members inside the grooves; And cutting the bonded base material and the member in the stacking direction of the base material to separate each module substrate.

The preparing of the module substrate may include: anodizing the inside of the through hole penetrating the opposite surface from the one surface of the base material; Combining the base material and the member by placing the member whose volume is contracted by being exposed to an environment of a temperature lower than room temperature in the through hole; Heating the combined base material and the member to fill the inside of the through hole; And cutting the bonded base material and the member in the stacking direction of the base material to separate each module substrate.

An optical device module and a method of manufacturing the same according to an embodiment of the present invention may implement a light emitting device having a desired circuit structure by disposing at least one optical device package on a module substrate.

In addition, the optical device module and the manufacturing method according to an embodiment of the present invention can be easily discharged heat generated in the optical device package to the outside by forming a module substrate of a conductive and heat-resistant metal material.

1A to 1C are cross-sectional views, plan views, and equivalent circuit diagrams of an optical device module according to an embodiment of the present invention.

2A and 2B are plan and equivalent circuit diagrams of an optical device module according to another exemplary embodiment of the present invention.

3A and 3B are a plan view and an equivalent circuit diagram of an optical device module according to another embodiment of the present invention.

4 is a plan view of an optical device module according to another embodiment of the present invention.

5 is a plan view of an optical device module according to another embodiment of the present invention.

FIG. 6 is a flowchart for describing a method of manufacturing the optical device module illustrated in FIGS. 3A and 3B.

7 to 11 are diagrams for describing a method of manufacturing the optical device module of FIG. 6.

12 is a flowchart for explaining another method of manufacturing the optical device module illustrated in FIGS. 3A and 3B.

13A to 13D are diagrams for describing another manufacturing method of the optical device module of FIG. 11.

FIG. 14 is a flowchart for describing a method of manufacturing the optical device module illustrated in FIG. 4.

15A to 15D are diagrams for describing a method of manufacturing the optical device module of FIG. 14.

FIG. 16 is a flowchart for explaining another method of manufacturing the optical device module illustrated in FIG. 4.

17A to 17E are diagrams for describing another method of manufacturing the optical device module of FIG. 16.

Hereinafter, exemplary embodiments of the present invention will be described in detail with reference to the accompanying drawings so that those skilled in the art can easily practice the present invention.

Hereinafter, the configuration of an optical device module according to an embodiment of the present invention.

1A and 1B, an optical device module 100 according to an embodiment of the present invention includes at least one optical device package 110, a module substrate 120, and a solder layer 130.

The optical device package 110 includes an optical device substrate 111, an optical device 117, a conductive wire 118, and a protective layer 119. Meanwhile, in FIG. 1B, the optical device module 100 is illustrated with the protective layer 119 of the optical device package 110 removed.

The optical device substrate 111 has a plate shape including an upper surface 112 and a lower surface 113, which is the opposite surface of the upper surface 112. The optical device substrate 111 supports the optical device 117. The optical device substrate 111 may include a first optical device region 114, a second optical device region 115 and a first optical device region 114 spaced apart from side surfaces of the first optical device region 114. The optical device insulating layer 116 is disposed between the two optical device regions 115.

The first optical device region 114 and the second optical device region 115 are formed of a metal material, for example, any one selected from copper, a copper alloy, aluminum, and an aluminum alloy, such that the optical device substrate 111 May serve as the first electrode and the second electrode. The first optical device region 114 and the second optical device region 115 are electrically connected to the positive electrode (+) and the negative electrode (-) of the optical device 117, respectively, to be electrically connected to the optical device 117. It provides a path for the signal input and output, and easily emits heat of the optical element 117 to the outside.

The optical device insulating layer 116 penetrates in a vertical direction, that is, in a thickness direction from the upper surface 112 to the lower surface 113 of the optical device substrate 111. The optical device insulating layer 116 may include a first optical device region 114 connected in a horizontal direction when the first optical device region 114 and the second optical device region 115 are formed of aluminum or an aluminum alloy. The area between the second optical device regions 115 may be formed by anodizing, or may be formed of an adhesive bonded between the first optical device region 114 and the second optical device region 115 after anodizing. . In addition, the optical device insulating layer 116 may include the first optical device region 114 and the second optical light when the first optical device region 114 and the second optical device region 115 are formed of copper or a copper alloy. It may be formed of an insulating adhesive bonded between the device regions 115. The optical device insulating layer 116 electrically insulates the first optical device region 114 and the second optical device region 115 from each other. In FIG. 1A, the photonic device insulating layer 116 is illustrated to have a side surface formed flat along the vertical direction. However, the anodization is simultaneously performed on the upper surface 112 and the lower surface 113 of the optical device substrate 111. It may also be formed in the shape of the concave double cone (double cone).

The optical device 117 is formed on the optical device substrate 111. The optical device 117 is formed above the first optical device region 114 among the regions of the optical device substrate 111. In addition, the optical device 117 may be attached to the upper surface 112 of the first optical device region 111 through a conductive adhesive (not shown). The optical device 117 emits light and may emit light to the upper portion of the optical device substrate 111. The optical device 117 may be formed of a light emitting diode (LED). In addition, the optical device 117 is electrically connected to the first optical device region 114 and the second optical device region 115. Therefore, the signal of the power input through the optical device substrate 111 is transmitted to the optical device 117 through the first optical device region 114 and the second optical device region 115.

The conductive wire 118 connects the second optical device region 115 and the negative electrode (−) of the optical device 117. Such conductive wire 118 is typically formed of gold, copper or aluminum to ensure high electrical conductivity.

The protective layer 119 is formed to surround the optical device 117 and the conductive wire 118 on the optical device substrate 111. The protective layer 119 protects the optical device 117 and the conductive wire 118 from external pressure.

In addition, the protective layer 119 may be formed by mixing a conventional fluorescent material with an epoxy resin. The fluorescent material is excited when the visible light or the ultraviolet light generated from the optical device 117 is applied, and then generates the visible light as it is stabilized. Accordingly, the protective layer 119 formed of a fluorescent material may convert light generated from the optical device 117 into red cyan light (RGB) light or white light. Accordingly, the optical device module 100 including the optical device 117 may be used as a backlight unit (BLU) of a liquid crystal display panel.

Although not shown, a partition wall may be further formed on the outer surface of the protective layer 119. The barrier rib may be formed of an epoxy resin having good light reflectivity, a photosensitive barrier rib paste (PSR), or a mixture thereof, and in some cases, may be formed of silicon. In addition, a receiving groove accommodating the optical device 117 may be formed in the optical device substrate 111, and a reflective layer may be further formed on an inner surface of the receiving groove. The reflective layer reflects the light reaching the optical device substrate 117 among the light generated from the optical device 117, and may be formed of silver (Ag) to increase the amount of light reflected from the reflective layer.

The module substrate 120 is formed in a plate shape including a top surface 121 and a bottom surface 122, which is an opposite surface of the top surface 121, and is formed below the optical device package 110. The module substrate 120 supports the optical device package 110 and is connected to an external PCB. The module substrate 120 may include a first module region 123, a second module region 124 spaced apart from a side surface of the first module region 123, and a first module region 123 and a second module region. And a first module insulating layer 125 formed between 124. In addition, the module substrate 120 may further include a second module insulating layer 126 formed below.

The first module region 123 and the second module region 124 may be formed of a metal material, for example, any one material selected from copper, copper alloy, aluminum, aluminum alloy, and aluminum nitride, thereby providing a module substrate 120. May serve as the first electrode and the second electrode. The first module region 123 and the second module region 124 are electrically connected to the first optical device region 114 and the second optical device region 115, respectively, to form the first optical device region 114 and the first optical device region 114. Together with the two optical device regions 115, the optical device 117 provides a path for inputting and outputting electrical signals, and easily emits heat from the optical device 117 to the outside.

The first module insulating layer 125 penetrates in a vertical direction, that is, in a thickness direction from the top surface 121 to the bottom surface 122 of the module substrate 120. When the first module region 123 and the second module region 124 are formed of aluminum or an aluminum alloy, the first module insulating layer 125 may be connected to the first module region 123 and the second in the horizontal direction. The region between the module regions 124 may be formed by anodizing, or may be formed of an adhesive bonded between the first module region 123 and the second module region 124 after anodizing. In addition, when the first module region 123 and the second module region 124 are formed of copper or a copper alloy, the first module insulating layer 125 may include the first module region 123 and the second module region ( It may be formed of an insulating adhesive bonded between the 124. The first module insulating layer 125 electrically insulates the first module region 123 and the second module region 124 from each other. In FIG. 1A, the first module insulating layer 125 is illustrated to have a side surface formed flat along the vertical direction. However, the anodization is simultaneously performed on the upper surface 121 and the lower surface 122 of the module substrate 120. It may also be formed in the shape of the concave double cone (double cone).

The second module insulating layer 126 has a lower surface 122 of the module substrate 120, that is, the first module region 123 and the second module, except for a ground portion (not shown) below the module substrate 120. The lower surface of the region 124 is formed in contact with. The second module insulating layer 126 may include the first module region 123 and the second module region 124 when the first module region 123 and the second optical device region 124 are formed of aluminum or an aluminum alloy. ) May be formed by anodizing the bottom surface between the layers or may be formed of an insulating sheet bonded to the bottom surface of the first module region 123, the second module region 124, and the first module insulating layer 125. . In addition, when the first module region 123 and the second module region 124 are formed of copper or a copper alloy, the second module insulating layer 126 may include the first module region 123 and the second module region ( 124 and an insulating sheet bonded to the lower surface of the first module insulating layer 125. The second module insulating layer 126 prevents unnecessary short circuit between the module substrate 120 and an external circuit (not shown). In FIG. 1A, although the second module insulating layer 126 is formed by anodizing and has a groove in a lower portion of the first module insulating layer 125 to which anodizing is weakly applied, the second module insulating layer is illustrated. When 126 is formed of an insulating sheet, it may have a flat shape as a whole.

The module substrate 120 formed as described above may have at least one optical device package 110 disposed to implement a desired circuit structure. In FIG. 1B, the plurality of optical device packages 110 are spaced apart along the longitudinal direction of one first module insulating layer 125 and overlap each other to cross one first module insulating layer 125. The first optical device region 114 of the optical device substrate 111 of the optical device package 110 is electrically connected to the first module region 123 of the module substrate 120. Since the second optical device region 115 is electrically connected to the second module region 124 of the module substrate 120, a parallel circuit structure of the optical device package 110 as shown in FIG. 1C may be implemented.

The solder layer 130 is formed between the first optical device region 114 and the first module region 123 and between the second optical device region 115 and the second module region 124. The solder layer 130 electrically connects the optical device package 110 and the module substrate 120. To this end, the solder layer 130 is formed of a conductive solder material. Meanwhile, when the first module region 123 and the second module region 124 of the module substrate 120 are formed of aluminum or an aluminum alloy, solder directly on the first module region 123 and the second module region 124. It may be difficult to form layer 130. In this case, although not shown, first, any one selected from a combination of gold, silver, and nickel copper on the first module region 123 and the second module region 124 may be electroless plated, electroplated, paste, or spray. (Plasma Arc Spraying Method, Cold Spraying Method), ink printing method , or any combination thereof, may be plated to form an electrode layer, and the solder layer 130 may be formed thereon. In addition, zinc (Zn), antimony (Sb), titanium (Ti), silicon (Si), aluminum (Al), copper (Cu), etc., in an alloy of lead and tin as a material of the solder layer 130 without additional plating. By using the aluminum-only solder made by adding a small amount, the soldering may be performed while removing the oxide films formed on the surfaces of the first module region 123 and the second module region 124.

As described above, the optical device module 100 according to the embodiment of the present invention arranges the at least one optical device package 110 on the module substrate 120 to have a desired circuit structure, for example, the optical device package 110. The light emitting device can be implemented in a parallel circuit structure.

In addition, the optical device module 100 according to an embodiment of the present invention is to form a module substrate 120 of a conductive and heat-dissipating metal material to easily discharge heat generated in the optical device package 110 to the outside. Can be.

Hereinafter, the configuration of an optical device module according to another embodiment of the present invention will be described.

2A and 2B are plan and equivalent circuit diagrams of an optical device module according to another exemplary embodiment of the present invention. Parts having the same configuration and operation as those of the foregoing embodiment are denoted by the same reference numerals, and will be described below with emphasis on differences.

2A and 2B, an optical device module 200 according to another embodiment of the present invention includes at least one optical device package 110, a module substrate 220, and a solder layer (130 of FIG. 1A). do. Meanwhile, in FIG. 2A, the optical device module 200 is illustrated with the protective layer 119 of the optical device package 110 removed.

The module substrate 220 includes a first module region 123, a second module region 124, a first module insulating layer 225, and a third module region 227.

Unlike the first module insulating layer 125 illustrated in FIG. 1B, the first module insulating layer 225 includes a first layer 225a, a second layer 225b, and a third layer 225c. The first layer 225a is formed in contact with the side of the first module region 123, and the second layer 225b is formed in contact with the side of the second module region 124, and the third layer 225c. ) Is formed between the first layer and the second layer.

The third module region 227 is formed between the first layer 225a and the third layer 225c and between the second layer 225b and the third layer 225c.

At least one optical device package 110 is disposed in the module substrate 220 formed as described above to implement a desired circuit structure. In FIG. 2A, at least one photonic device package 110 has a first layer 225a and a second layer 225b on top of each of the first layer 225a, the second layer 225b and the third layer 225c. And overlap each of the third layers 225c. The first optical device region 114 and the second optical device region 115 of the adjacent optical device packages of the at least one optical device package 110 are electrically connected together to the third module region 227 together. Specifically, the first optical device region 114 of the optical device package 110 overlapping the first layer 225a is electrically connected to the first module region 123, and the second module region 124 is electrically connected to the first module region 124. A third module region, which is electrically connected to the second photonic device region 115 of the photonic device package 110 overlying the second layer 225b, is located between the first layer 225a and the third layer 225c. In 227, the first optical device region of the optical device package 110 overlapping the second optical device region 115 and the third layer 225c of the optical device package 110 overlapping the first layer 225a. An optical device package 110 overlying the second layer 225b in a third module region 227 which is electrically connected together and between the second layer 225b and the third layer 225c. The first optical device region 114 and the second optical device region 115 of the optical device package 110 overlapping the third layer 225c are electrically connected together. As a result, a series circuit structure of the optical device package 110 as shown in FIG. 2B may be implemented.

As described above, in the optical device module 200 according to another embodiment of the present invention, the at least one optical device package 110 is disposed on the module substrate 220 so as to provide a desired circuit structure, for example, the optical device package 110. The light emitting device can be implemented with a series circuit structure of

3A and 3B are a plan view and an equivalent circuit diagram of an optical device module according to another embodiment of the present invention. Parts having the same configuration and operation as those of the foregoing embodiment are denoted by the same reference numerals, and will be described below with emphasis on differences.

3A and 3B, an optical device module 200 according to another embodiment of the present invention may include at least one optical device package 110, a module substrate 320, and a solder layer (130 of FIG. 1A). Include. Meanwhile, in FIG. 3A, the optical device module 300 is illustrated with the protective layer 119 of the optical device package 110 removed.

The module substrate 320 includes a first module region 123, a second module region 124, a first module insulating layer 325, and a third module region 327.

Unlike the first module insulating layer 125 illustrated in FIG. 1B, the first module insulating layer 325 includes a first layer 325a and a second layer 325b. The first layer 325a is formed in contact with the side of the first module region 123, and the second layer 325b is formed in contact with the side of the second module region 124.

The third module region 227 is formed between the first layer 325a and the second layer 325b.

In the module substrate 320 formed as described above, at least one optical device package 110 may be disposed to implement a desired circuit structure. In FIG. 3A, at least one optical device package 110 is disposed spaced apart along the length direction of the first layer 325a and the second layer 325b, and the first layer 325a and the second layer 325b. Overlaid on each top to separate each of the first layer 325a and the second layer 325b. The first optical device region 114 and the second optical device region 115 of adjacent optical device packages of the at least one optical device package 110 are electrically connected together to the third module region 327 together. Specifically, the first optical device region 114 of the optical device package 110 overlapping the first layer 325a is electrically connected to the first module region 123, and the first module region 123 is electrically connected to the second module region 124. The second optical device region 115 of the optical device package 110 overlapping the second layer 225b is electrically connected, and the third module region is located between the first layer 325a and the second layer 325b. In 327, the first optical device region of the optical device package 110 overlapping the second optical device region 115 and the second layer 325b of the optical device package 110 overlapping the first layer 325a. 114 are electrically connected together. As a result, the serial / parallel circuit structure of the optical device package 110 as shown in FIG. 3B may be implemented.

As described above, in the optical device module 300 according to another embodiment of the present invention, by arranging at least one optical device package 110 on the module substrate 320, a desired circuit structure, for example, an optical device package ( The light emitting device can be implemented with the serial / parallel circuit structure of 110.

4 is a plan view of an optical device module according to another embodiment of the present invention. Parts having the same configuration and operation as those of the foregoing embodiment are denoted by the same reference numerals, and will be described below with emphasis on differences.

Referring to FIG. 4, an optical device module 400 according to another embodiment of the present invention includes at least one optical device package 110, a module substrate 420, and a solder layer (130 of FIG. 1A). Meanwhile, in FIG. 4, the optical device module 400 is illustrated with the protective layer 119 of the optical device package 110 removed.

The module substrate 420 is formed under the optical device package 110, as shown in the module substrate 120 of FIG. 1B, and supports the optical device package 110 and is connected to an external PCB. The module substrate 420 includes a first module region 423, a second module region 424, and a first module insulating layer 425. In addition, the module substrate 420 may further include a second module insulating layer (not shown) formed below.

The first module region 423 may be positioned substantially at the center of the module substrate 420 and may have a planar shape of a polygon such as a circle, a quadrilateral, and a pentagon.

The second module region 424 is spaced apart from the side surface of the first module region 423 and is formed to surround the first module region 423.

Since the first module region 423 and the second module region 424 are formed of the same material as the first module region 123 and the second module region 124 of FIG. 1B and have the same role, duplicate descriptions are omitted. Let's do it.

The first module insulating layer 425 is formed by anodizing a second module region 424, and is disposed along a circumference between the first module region 423 and the second module region 424.

The optical device package 110 is disposed on the module substrate 420 formed as described above so that the optical device 117 corresponds to the first module region 423, and the optical device package 110 is formed of the first module insulating layer ( 425). Specifically, the optical device 117 is installed in the first optical device region 114, the first optical device region 114 is electrically connected to the first module region 423, and the second optical device region 115 is provided. ) Is electrically connected to the second module region 424. In this case, the first module region 423 is preferably formed of a metal material having a higher thermal conductivity than the second module region 424. This is to increase the effect of emitting heat generated from the optical device 117 through the first module region 423. Meanwhile, when the first module region 423 and the second module region 424 are formed of a metal material having the same thermal conductivity, the area of the first module region 423 is larger than that of the second module region 424. Therefore, the effect of emitting heat generated from the optical device 117 through the first module region 423 may be enhanced.

As described above, in the optical device module 400 according to another embodiment of the present invention, by arranging at least one optical device package 110 on the module substrate 420, a desired circuit structure, for example, an optical device package ( The light emitting device may be implemented using the parallel circuit structure of 110.

In addition, the optical device module 400 according to another embodiment of the present invention is formed of a conductive and heat-dissipating metal material of the module substrate 420 to easily discharge heat generated in the optical device package 110 to the outside You can.

5 is a plan view of an optical device module according to another embodiment of the present invention. Parts having the same configuration and operation as those of the foregoing embodiment are denoted by the same reference numerals, and will be described below with emphasis on differences.

Referring to FIG. 5, an optical device module 500 according to another embodiment of the present invention includes at least one optical device package 110, a module substrate 520, and a solder layer (130 of FIG. 1A). Meanwhile, the optical device module 500 is illustrated in FIG. 5 with the protective layer 119 of the optical device package 110 removed.

The module substrate 520 is formed under the optical device package 110, as shown in the module substrate 120 of FIG. 1B, and supports the optical device package 110 and is connected to an external PCB. The module substrate 520 includes a first module region 523, a second module region 524, and a first module insulating layer 525. In addition, the module substrate 520 may further include a second module insulating layer (not shown) formed below.

The first module region 523, the second module region 524, and the first module insulating layer 525 may include the first module region 423, the second module region 424, and the first module illustrated in FIG. 4. Similar to insulating layer 425.

However, the optical device 117 is disposed on the module substrate 525 including the first module region 523, the second module region 524, and the first module insulating layer 525. The optical device package 110 is disposed to correspond to the photonic device package 110, and the optical device package 110 crosses the first module insulating layer 525. Specifically, an optical device 117 is installed in the first optical device region 114, the first optical device region 114 is electrically connected to the second module region 524, and the second optical device region 115 is provided. ) Is electrically connected to the first module region 523. In this case, it is preferable that the second module region 524 is formed of a metal material having a higher thermal conductivity than the first module region 523. This is to increase the effect of emitting heat generated from the optical device 117 through the second module region 524. Meanwhile, when the second module region 524 and the first module region 523 are formed of a metal material having the same thermal conductivity, the area of the second module region 524 is larger than that of the first module region 523. Therefore, the effect of dissipating heat generated from the optical device 117 through the second module region 523 may be enhanced.

As described above, the optical device module 500 according to another embodiment of the present invention has a desired circuit structure, for example, parallel circuit structure, by arranging at least one optical device package 110 on the module substrate 520. A light emitting device can be implemented.

In addition, the optical device module 500 according to another embodiment of the present invention is to form a module substrate 520 made of a conductive and heat-dissipating metal material to easily discharge heat generated in the optical device package 110 to the outside You can.

Hereinafter, a method of manufacturing an optical device module according to an embodiment of the present invention will be described by taking an example of a manufacturing method of the optical device module illustrated in FIGS. 3A and 3B.

6 is a flowchart for describing a method of manufacturing the optical device module illustrated in FIGS. 3A and 3B, and FIGS. 7 to 11 are views for explaining a method of manufacturing the optical device module of FIG. 6.

Referring to FIG. 6, one method of manufacturing the optical device module 300 illustrated in FIGS. 3A and 3B may include an optical device package preparing step S1, a module substrate preparing step S2, and an optical device package combining step S3. It includes.

Referring to FIG. 7, the optical device package preparing step S1 may include a first optical device region 114, a second optical device region 115 spaced apart from a side of the first optical device region 114, and a first optical device package 114. An optical device substrate 111 including an optical device insulating layer 116 interposed between the optical device region 114 and the second optical device region 115, and an optical device formed on the optical device substrate 111. At least one optical device package 110 including 117 is prepared. The optical device package 110 may include a conductive wire 118 that electrically connects the optical device 117 and the second optical device region 115, and protects the optical device 117 and the conductive wire 118. The layer 119 may be further included. Since the optical device package 110 has already been described in detail above, duplicate description thereof will be omitted.

8A to 8E, the module substrate preparing step S1 may include a first module region (123 of FIG. 3A) and a second module region (124 of FIG. 3A) spaced apart from side surfaces of the first module region 123. ), And a module substrate (320 of FIG. 3A) including a first module insulating layer (325 of FIG. 3A) formed between the first module region 123 and the second module region 124.

First, as shown in FIG. 8A, the module substrate preparation step S2 forms the pattern layer 10 to cover the top and bottom surfaces of the metal plate 320 ′. The metal plate 320 ′ may be formed of any one material selected from copper, a copper alloy, aluminum, and an aluminum alloy. In addition, the pattern layer 10 may be formed through exposure and development after applying a mask solution, or by attaching a patterned film.

In addition, as shown in FIG. 8B, the module substrate preparation step S2 is anodized on an area exposed to the outside by the pattern layer 10 to form a first layer 325a and a second layer 325b. A first module insulating layer 325 is formed. The first module insulating layer 325 is formed to penetrate in the thickness direction of the metal plate 320 ', that is, in the vertical direction, and is formed along the length direction of the metal plate 320'. The first module insulating layer 325 separates the metal plate 320 ′ into the first module region 123, the second module region 124, and the third module region 327, thereby forming the first module region 123. ), A module substrate 320 having a second module region 124 and a third module region 327. In addition, although the first module insulating layer 325 is illustrated to have a flat side along the vertical direction, a double cone having a concave center at the side as anodizing proceeds from the top and bottom surfaces of the metal plate 320 ′. It may be formed to have a shape of). On the other hand, after the formation of the first module insulating layer 325, fine pores present in the interior of the first module insulating layer 325 using any one selected from BCB (Benzocyclobuten), insulating organic material and distilled water or a combination thereof. By filling or blocking the opening of the micropores of the pores may be further performed a sealing process or a curing process.

As illustrated in FIG. 8C, the module substrate preparing step S2 is performed by separating the pattern layer 10 from the module substrate 320. The pattern layer 10 may be removed through an ashing process in the case of a mask solution, and may be removed by being detached from the module substrate 320 in the case of a film. Here, only a portion of the pattern layer 10 positioned below the module substrate 310 is removed to form the second module insulating layer 126 of FIG. 3A, thereby exposing the lower portion of the module substrate 310 to the outside.

In addition, as illustrated in FIG. 8D, the module substrate preparing step S2 may be performed by anodizing the first module region 123 and the second module region 124 disposed under the exposed module substrate 320. The module insulating layer 126 is formed.

Referring to FIG. 9, in the combining of the optical device package S3, each of the first module area 123 and the second module area 124 may be divided into a first optical device area 114 and a second optical device area 115. ) Is electrically connected to each other. Specifically, in the optical device package coupling step S3, the first optical device region 114 is attached to the first module region 123 through the solder layer 130 to be electrically connected to the second optical device region. 115 is attached to and electrically connected to the second module region 124. Meanwhile, when the first module region 123 and the second module region 124 of the module substrate 120 are formed of aluminum or an aluminum alloy, solder directly on the first module region 123 and the second module region 124. It may be difficult to form layer 130. In this case, although not shown, the optical device package coupling step S3 may be performed by electrolessly selecting any one of a combination of gold, silver, and nickel copper on the first module region 123 and the second module region 124. The electrode layer is formed by plating through any one or a combination of the plating method, the electrolytic plating method, the paste method, the spray method (plasma arc spray method, the cold spray method), and the ink printing method , and the solder layer 130 is formed thereon. Can be formed. In addition, the optical device package bonding step (S3) is zinc (Zn), antimony (Sb), titanium (Ti), silicon (Si) in the alloy of lead and tin as a material of the solder layer 130 without additional plating, By using an aluminum-only solder made by adding a small amount of aluminum (Al) and copper (Cu), soldering can be performed while removing oxide films formed on the surfaces of the first module region 123 and the second module region 124. have.

The optical device module 300 manufactured by the above manufacturing method cuts the module substrate 320 along the sawing line SL, as shown in FIG. 10, for another desired circuit structure. The branch may be implemented as another optical device module.

Meanwhile, FIG. 11 illustrates an example of an optical device module capable of implementing various circuit structures by a sawing process. For example, when the module substrate 610 is cut along the sawing line SL1, the optical device of FIG. The module 100 may be implemented, and when the module substrate 610 is cut along the sawing line SL2, the optical device module 200 of FIG. 2A may be implemented, and the module substrate along the sawing line SL3 may be implemented. When cutting 610, the optical device module 300 of FIG. 3A may be implemented.

Hereinafter, another manufacturing method of the optical device module illustrated in FIGS. 3A and 3B will be described with reference to the manufacturing method of the optical device module according to an exemplary embodiment of the present invention.

12 is a flowchart for explaining another method of manufacturing the optical device module illustrated in FIGS. 3A and 3B, and FIGS. 13A to 13D are views for explaining another method of manufacturing the optical device module of FIG. 11.

Referring to FIG. 12, another method of manufacturing the optical device module 300 illustrated in FIGS. 3A and 3B may include an optical device package preparing step S1, a module substrate preparing step S12, and an optical device package combining step S3. It includes. Since the optical device package preparing step S1 and the optical device package combining step S3 have already been described above, a redundant description thereof will be omitted.

13A to 13D, the module substrate preparation step S12 may include a first module region (123 of FIG. 3A) and a second module region (124 of FIG. 3A) spaced apart from side surfaces of the first module region 123. ), And a module substrate (320 of FIG. 3A) including a first module insulating layer (325 of FIG. 3A) formed between the first module region 123 and the second module region 124.

First, as shown in FIG. 13A, the module substrate preparing step S12 prepares three metal plates 320 ′ made of a plate shape. Here, the metal plate 320 ′ is illustrated as three, but is not limited thereto. The metal plate 320 ′ may be provided in a number corresponding to an area of the substrate. The metal plate 320 ′ may be made of any one selected from aluminum, aluminum alloy, copper, and copper alloy. In addition, the metal plate 320 ′ may then be anodized to increase the adhesion between the adhesive member and the dielectric plate, and to increase the insulation and voltage resistance of the metal plate 320 ′. In addition, the metal plate 320 ′ may have a surface roughness by sand blasting, chemical etching, grinding, or polishing the interface to increase adhesion to the adhesive member. Each metal plate 320 ′ is positioned side by side in the vertical direction, and then constitutes each region of the module substrate. In addition, the module substrate preparing step (S12) forms adhesive members 325a ′ and 325 b ′ on the interface between the metal plates 320 ′. The adhesive members 325a 'and 325b' couple the metal plates 320 ', but the metal plates 320' are electrically independent of each other. The adhesive members 325a 'and 325b' may be formed of an adhesive in a liquid form or a film in a sheet form. The adhesive members 325a 'and 325b' then form the first module insulating layer 325 of the module substrate 320. In addition, in the module substrate preparing step S12, the metal plate 320 ′ is laminated through the adhesive members 325a ′ and 325b ′. That is, adhesive members 325a 'and 325b' are provided between the metal plates 320 'to provide adhesion and electrical insulation.

In addition, as shown in FIG. 13B, the module substrate preparing step S12 may be performed by sawing the metal plates 320 ′ stacked in the vertical direction through the adhesive members 325a ′ and 325 b ′ in the vertical direction. Step 320 is formed. As a result, the metal plate 320 'constitutes the first module region 123, the second module region 124, and the third optical element region 327 of the module substrate 320, respectively, and the adhesive member (( 325a 'and 325b' constitute the first module insulating layer 325 of the module substrate 320. As a result, the spacing t in the horizontal direction during sawing is in the final vertical direction of the module substrate 320. In addition, a polishing process may be further performed to remove burrs and scratches and to more efficiently reflect the light source of the optical device.

13C and 13D, in the preparing of the module substrate S12, the pattern layer 20 is formed on the module substrate 320, and the area exposed to the outside of the pattern layer 20 is anodized. Thus, a second module insulating layer 126 is further formed below the module substrate 320.

Hereinafter, a method of manufacturing the optical device module according to an embodiment of the present invention will be described by taking an example of the manufacturing method of the optical device module shown in FIG.

14 is a flowchart for describing a method of manufacturing the optical device module illustrated in FIG. 4, and FIGS. 15A to 15D are views for explaining a method of manufacturing the optical device module of FIG. 14.

Referring to FIG. 14, one manufacturing method of the optical device module 400 illustrated in FIG. 4 includes an optical device package preparing step S1, a module substrate preparing step S22, and an optical device package combining step S3. . Since the optical device package preparing step S1 and the optical device package combining step S3 have already been described above, a redundant description thereof will be omitted.

15A to 15D, the module substrate preparation step S22 may include a first module region 423, a second module region 424 spaced apart from the first module region 423, and a first module region ( A step of preparing a module substrate 420 including a first module insulating layer 425 formed between the 423 and the second module region 424.

First, as shown in FIGS. 15A and 15B, the module substrate preparing step S22 includes a base material 30 and performs anodizing on one surface of the base material 30.

The base material 30 is made of any one selected from copper, a copper alloy, aluminum, and an aluminum alloy, and has at least one surface of the groove 30a. The groove 30a is formed along the longitudinal direction of the base material 10, and a plurality of grooves 30a are spaced apart at regular intervals. When anodizing is performed on the surface of the base material 30 provided with the groove 30a, oxidation occurs to a predetermined thickness along the shape of the surface of the base material 30 to form the anodizing layer 31. On the other hand, after the formation of the anodizing layer 31, the pores of the fine size present in the interior of the anodizing layer 31 is filled using any one or a combination thereof selected from BCB (Benzocyclobuten) and the insulating organic material or the fine pores of the pores Sealing process or curing process to block the inlet of may be further performed.

As shown in FIG. 15C, the module substrate preparing step S22 couples the base material 30 and the member 40 by placing the member 40 between the pair of base materials 30. The base material 30 is coupled to abut between the anodizing layer 31, the member 40 is formed in a cylindrical shape corresponding to the meshed shape of the anodizing layer 31. In addition, the member 40 is formed of any one material selected from copper, a copper alloy, aluminum, and an aluminum alloy, and is matched with the anodizing layer 31 of the base material 30. In this case, an adhesive may be used between the base material 30 and the member 40 in contact with each other to increase the bonding force. In addition, although not separately illustrated, a process of forming a roughness on the member 40 through sand blasting or the like may be further performed to increase the bonding force between the base material 30 and the member 40.

In addition, as shown in FIG. 15D, the module substrate preparing step (S22) forms an individual module substrate 420 by sawing the base material 30 and the member 40 in a coupled state.

The base material 30 and the member 40 are sawed to have a constant size. An anodizing of the first module region 423 corresponding to the member 40, the second module region 424 corresponding to the base material 30, and the base material 30 is formed on the module substrate 420 of FIG. 4 formed by the sawing. The first module insulating layer 425 corresponding to the layer 31 is formed. The first module region 423 and the second module region 424 are spaced apart by the first module insulating layer 425 and are electrically independent.

Hereinafter, another manufacturing method of the optical device module illustrated in FIG. 4 will be described as an example of the manufacturing method of the optical device module according to an exemplary embodiment of the present invention.

16 is a flowchart for describing another method of manufacturing the optical device module illustrated in FIG. 4, and FIGS. 17A to 17E are views for explaining another method of manufacturing the optical device module of FIG. 16.

Referring to FIG. 16, another manufacturing method of the optical device module 400 illustrated in FIG. 4 includes an optical device package preparing step S1, a module substrate preparing step S32, and an optical device package combining step S3. . Since the optical device package preparing step S1 and the optical device package combining step S3 have already been described above, a redundant description thereof will be omitted.

17A to 17E, the module substrate preparing step S32 may include a first module region 423, a second module region 424 spaced apart from the first module region 423, and a first module region ( A step of preparing a module substrate 420 including a first module insulating layer 425 formed between the 423 and the second module region 424.

First, as illustrated in FIGS. 17A and 17B, the module substrate preparing step S32 may include copper, a copper alloy, aluminum, and an aluminum alloy in which at least one through hole 50a is formed from one surface to a corresponding opposite surface. The anodizing device having the base material 50 formed of any one selected from among the anodizing and anodizing the inside of the through hole 50a is formed by oxidizing to a predetermined thickness along the shape of the through hole 50a, and as a result, the anodizing layer 51 is formed. On the other hand, after the anodizing to fill the pores of the fine size present in the interior of the anodizing layer 51 using any one or a combination thereof selected from BCB (Benzocyclobuten) and insulating organic material or to block the inlet of the pores of the pores A sealing process or a curing process may be further performed.

As shown in FIG. 17C, the module substrate preparing step (S32) couples the contracted member 60 ′ to the inside of the anodizing layer 51. Here, the contracted member 60 'is made of any one selected from copper, a copper alloy, aluminum, and an aluminum alloy, and is bonded to the inside of the anodizing layer 51 in a state in which the volume is contracted by being exposed to a cryogenic environment. . In this case, the diameter of the contracted member 60 'is smaller than the inner diameter of the anodizing layer 51, so that the contracted member 60' is easily located inside the anodizing layer 51. Can be.

In addition, as shown in FIG. 17D, the module substrate preparing step S32 increases the temperature in a state in which the base material 50 and the contracted member 60 ′ are coupled to each other. The elevated temperature may be increased by heating, or may be made by standing at room temperature without additional heating. The member 60 ′ contracted at the elevated temperature expands in volume to fill the inside of the anodizing layer 51 of the base material 50. As a result, the member 60 can be firmly fixed to the inside of the anodizing layer 51 without a separate adhesive.

In addition, as shown in FIG. 17E, the module substrate preparing step S32 cuts the base material 50 and the member 60 in a coupled state to form individual module substrates (420 of FIG. 4). In addition, the substrate 420 formed according to the first module region 423 corresponding to the member 60, the second module region 424 corresponding to the base material 50, and the anodizing layer 51 of the base material 50 are formed on the substrate 420. The corresponding first module insulating layer 425 is formed. The first module region 423 and the second module region 424 are spaced apart by the first module insulating layer 425 and are electrically independent.

What has been described above is just one embodiment for carrying out the optical device according to the present invention and a method of manufacturing the same, and the present invention is not limited to the above-described embodiment, as claimed in the following claims. Without departing from the gist of the invention, anyone of ordinary skill in the art to which the present invention will have the technical spirit of the present invention to the extent that various modifications can be made.

Claims

An optical device substrate comprising a first optical device region, a second optical device region spaced apart from the first optical device region, and an optical device insulating layer formed between the first module region and the second module region; At least one optical device package including an optical device formed on the optical device substrate; And

A lower portion of the optical device package and including a first module region, a second module region spaced apart from the first module region, and a first module insulating layer formed between the first module region and the second module region. Has a module substrate,

Each of the first module region and the second module region is electrically connected to each of the first optical element region and the second optical element region, and is formed of a metal material.
The method of claim 1,

The module substrate further includes a second module insulating layer formed to contact the lower surface of the first module region and the second module region.
The method of claim 1,

The first module region and the second module region is formed of any one selected from copper, copper alloy, aluminum and aluminum alloy.
The method of claim 1,

And the first optical device region and the second optical device region are formed of any one selected from copper, a copper alloy, aluminum, and an aluminum alloy.
The method of claim 1,

And a solder layer formed between the first module region and the first optical element region, and between the second module region and the second optical element region.
The method of claim 5,

And an electrode layer formed on the lower portion of the solder layer by at least one of electroless plating, electrolytic plating, paste, sprayer and ink printing.
The method of claim 1,

The optical device is coupled to an upper portion of the first optical device region,

The optical device package further comprises a conductive wire connecting the optical device and the second optical device region.
The method of claim 1,

The optical device package is spaced apart along the longitudinal direction of one of the first module insulating layer, the optical device module, characterized in that overlapping to cross the one first module insulating layer.
The method of claim 1,

The first module insulating layer may include a first layer formed to contact the side surface of the first module region; A second layer formed in contact with a side of the second module region; And a third layer formed between the first layer and the second layer,

The module substrate comprises a third module region formed between the first and third layers and between the second and third layers,

Each of the optical device packages overlaps each of the first, second and third layers on top of each of the first, second and third layers,

And the first optical device region and the second optical device region of the optical device package adjacent to the third module region are electrically connected together.
The method of claim 1,

The first module insulating layer may include a first layer formed to contact the side surface of the first module region; And a second layer formed in contact with a side of the second module region,

The module substrate comprises a third module region formed between the first and second layers,

The photonic device package is spaced apart along the length direction of the first and second layers and overlaps the first and second layers over each of the first and second layers,

A second optical device region of the optical device package overlapping the first layer and a first optical device region of the optical device package overlapping the second layer are electrically connected to the third module substrate. Optical element module.
The method of claim 1,

And the module substrate is formed such that the second module region surrounds the first module region.
The method of claim 11,

And the optical device package is disposed on the module substrate such that the optical device corresponds to the first module area.
The method of claim 12,

And the first module region is formed of a metal material having a higher thermal conductivity than the second module region.
The method of claim 12,

The first module region and the second module region are formed of the same metal material,

And an area of the first module region is larger than an area of the second module region.
The method of claim 11,

And the optical device package is disposed on the module substrate so that the optical device corresponds to the second module area.
The method of claim 15,

And the second module region is formed of a metal material having a higher thermal conductivity than the first module region.
The method of claim 15,

The first module region and the second module region are formed of the same metal material,

And an area of the second module area is larger than that of the first module area.
An optical device including a first optical device region, a second optical device region spaced apart from the first optical device region, and a first optical device insulating layer interposed between the first optical device region and the second optical device region An optical device package preparing step of preparing at least one optical device package including a substrate and an optical device formed on the optical device substrate;

Preparing a module substrate comprising a first module region, a second module region spaced apart from the first module region, and a first module insulating layer formed between the first module region and the second module region. step; And

An optical device package coupling step of coupling the optical device package to an upper portion of the module substrate,

The coupling of the optical device package electrically connects each of the first module area and the second module area to each of the first optical device area and the second optical device area,

And each of the first module region and the second module region is formed of a metal material.
The method of claim 18,

The module substrate preparation step

Forming a pattern layer to surround the top and bottom surfaces of the metal plate;

Anodizing a region exposed to the outside of the pattern layer to form the first module substrate, the second module region, and the first module insulating layer on the metal plate to form the first module substrate; And

And removing the pattern layer to expose the module substrate.
The method of claim 19,

The module substrate preparation step

After forming the first module insulating layer, a portion of the pattern layer positioned below the metal plate is removed and anodized a region exposed to the outside of the pattern layer to form a lower surface of the first module region and the second module region. And forming a second module insulating layer in contact with the optical device module.
The method of claim 18,

The module substrate preparation step

Preparing a plurality of metal plates and forming an adhesive member on an interface of the metal plates;

Laminating the metal plates to each other through the adhesive member; And

Sawing the metal plate in a direction perpendicular to the boundary surface to form the first substrate region, the second module region, and the first module insulating layer on the metal plate to form the module substrate. Method for producing an optical device module.
The method of claim 21,

Preparing the module substrate

Forming a pattern layer on the module substrate and anodizing a region exposed to the outside of the pattern layer to further form a second module insulating layer in contact with the lower surface of the first module region and the second module region. A manufacturing method of an optical device module.
The method of claim 18,

The module substrate preparation step

Anodizing a plurality of grooves formed in at least one of the surfaces of the base material along a length direction;

Positioning a plurality of the base materials so that the grooves engage with each other, and coupling the base material and the members by positioning the members inside the grooves; And

And cutting the bonded base material and the member in the stacking direction of the base material to separate each module substrate.
The method of claim 18,

The module substrate preparation step

Anodizing the inside of the through hole penetrating the corresponding opposite surface from one surface of the base material;

Combining the base material and the member by placing the member whose volume is contracted by being exposed to an environment of a temperature lower than room temperature in the through hole;

Heating the combined base material and the member to fill the inside of the through hole; And

And cutting the bonded base material and the member in the stacking direction of the base material to separate each module substrate.