WO2011122847A3 - Optical device module and method for fabricating same - Google Patents

Optical device module and method for fabricating same Download PDF

Info

Publication number
WO2011122847A3
WO2011122847A3 PCT/KR2011/002178 KR2011002178W WO2011122847A3 WO 2011122847 A3 WO2011122847 A3 WO 2011122847A3 KR 2011002178 W KR2011002178 W KR 2011002178W WO 2011122847 A3 WO2011122847 A3 WO 2011122847A3
Authority
WO
WIPO (PCT)
Prior art keywords
optical device
module
region
substrate
fabricating same
Prior art date
Application number
PCT/KR2011/002178
Other languages
French (fr)
Korean (ko)
Other versions
WO2011122847A8 (en
WO2011122847A2 (en
Inventor
남기명
송태환
전영철
Original Assignee
주식회사 포인트 엔지니어링
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 주식회사 포인트 엔지니어링 filed Critical 주식회사 포인트 엔지니어링
Publication of WO2011122847A2 publication Critical patent/WO2011122847A2/en
Publication of WO2011122847A3 publication Critical patent/WO2011122847A3/en
Publication of WO2011122847A8 publication Critical patent/WO2011122847A8/en

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/03—Use of materials for the substrate
    • H05K1/05—Insulated conductive substrates, e.g. insulated metal substrate
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L25/00—Assemblies consisting of a plurality of semiconductor or other solid state devices
    • H01L25/03—Assemblies consisting of a plurality of semiconductor or other solid state devices all the devices being of a type provided for in a single subclass of subclasses H10B, H10F, H10H, H10K or H10N, e.g. assemblies of rectifier diodes
    • H01L25/04—Assemblies consisting of a plurality of semiconductor or other solid state devices all the devices being of a type provided for in a single subclass of subclasses H10B, H10F, H10H, H10K or H10N, e.g. assemblies of rectifier diodes the devices not having separate containers
    • H01L25/075—Assemblies consisting of a plurality of semiconductor or other solid state devices all the devices being of a type provided for in a single subclass of subclasses H10B, H10F, H10H, H10K or H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group H10H20/00
    • H01L25/0753—Assemblies consisting of a plurality of semiconductor or other solid state devices all the devices being of a type provided for in a single subclass of subclasses H10B, H10F, H10H, H10K or H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group H10H20/00 the devices being arranged next to each other
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/481—Disposition
    • H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/48225—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
    • H01L2224/48227—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation connecting the wire to a bond pad of the item
    • H01L33/486—
    • H01L33/62—
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09209—Shape and layout details of conductors
    • H05K2201/09654—Shape and layout details of conductors covering at least two types of conductors provided for in H05K2201/09218 - H05K2201/095
    • H05K2201/09663—Divided layout, i.e. conductors divided in two or more parts
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10007—Types of components
    • H05K2201/10106—Light emitting diode [LED]
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/03—Metal processing
    • H05K2203/0315—Oxidising metal

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Semiconductor Lasers (AREA)
  • Led Device Packages (AREA)

Abstract

The present invention relates to an optical device module and to a method for fabricating same, which enable the production of a desired circuit configuration by forming at least one optical device package on a module substrate, wherein the optical device module is capable of easily dissipating heat. A disclosed optical device module according to one example of the present invention comprises at least one optical device package and a module substrate. The optical device package comprises: an optical device substrate including a first optical device region, a second optical device region separated from the first optical device region, and an optical device insulation layer formed between the first module region and the second module region; and an optical device formed at the upper portion of the optical device substrate. The module substrate is formed at the lower portion of the optical device package and comprises: a first module region; a second module region separated from the first module region; and a first module insulation layer formed between the first module region and the second module region. The first module region and the second module region are electrically connected to the first optical device region and the second optical device region, respectively, and are made of metal.
PCT/KR2011/002178 2010-03-31 2011-03-30 Optical device module and method for fabricating same WO2011122847A2 (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
KR1020100029461A KR101098533B1 (en) 2010-03-31 2010-03-31 Optical Element Module and fabricating method thereof
KR10-2010-0029461 2010-03-31

Publications (3)

Publication Number Publication Date
WO2011122847A2 WO2011122847A2 (en) 2011-10-06
WO2011122847A3 true WO2011122847A3 (en) 2012-01-12
WO2011122847A8 WO2011122847A8 (en) 2014-03-27

Family

ID=44720414

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/KR2011/002178 WO2011122847A2 (en) 2010-03-31 2011-03-30 Optical device module and method for fabricating same

Country Status (2)

Country Link
KR (1) KR101098533B1 (en)
WO (1) WO2011122847A2 (en)

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR101306247B1 (en) 2012-05-11 2013-09-17 (주)포인트엔지니어링 Method for light emitting device of back light unit and the light emitting device and array thereof
KR101373710B1 (en) 2012-12-12 2014-03-13 (주)포인트엔지니어링 Led metal substrate and method for manufacturing the substrate
US9595642B2 (en) 2015-06-29 2017-03-14 Point Engineering Co., Ltd. Chip substrate comprising a plated layer and chip package using the same

Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20070210317A1 (en) * 2006-03-13 2007-09-13 Industrial Technology Research Institute High power light emitting device assembly with ESD protection ability and the method of manufacturing the same
KR100759016B1 (en) * 2006-06-30 2007-09-17 서울반도체 주식회사 Light emitting diode
KR20080057881A (en) * 2006-12-21 2008-06-25 엘지전자 주식회사 Printed circuit board, light emitting apparatus having the same and method for manufacturing thereof
KR20090084261A (en) * 2008-01-31 2009-08-05 알티전자 주식회사 Light emitting diode package
US20090309106A1 (en) * 2005-06-03 2009-12-17 Shen-Nan Tong Light-emitting device module with a substrate and methods of forming it

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20090309106A1 (en) * 2005-06-03 2009-12-17 Shen-Nan Tong Light-emitting device module with a substrate and methods of forming it
US20070210317A1 (en) * 2006-03-13 2007-09-13 Industrial Technology Research Institute High power light emitting device assembly with ESD protection ability and the method of manufacturing the same
KR100759016B1 (en) * 2006-06-30 2007-09-17 서울반도체 주식회사 Light emitting diode
KR20080057881A (en) * 2006-12-21 2008-06-25 엘지전자 주식회사 Printed circuit board, light emitting apparatus having the same and method for manufacturing thereof
KR20090084261A (en) * 2008-01-31 2009-08-05 알티전자 주식회사 Light emitting diode package

Also Published As

Publication number Publication date
KR101098533B1 (en) 2011-12-26
WO2011122847A8 (en) 2014-03-27
KR20110109651A (en) 2011-10-06
WO2011122847A2 (en) 2011-10-06

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