WO2011120236A1

WO2011120236A1 - Power amplifier fixing device and communication equipment

Info

Publication number: WO2011120236A1
Application number: PCT/CN2010/071544
Authority: WO
Inventors: 陈军; 潘政; 孙红业; 朱国富; 车固勇; 魏征; 范雄新
Original assignee: 海能达通信股份有限公司
Priority date: 2010-04-02
Filing date: 2010-04-02
Publication date: 2011-10-06

Abstract

A power amplifier fixing device and a communication equipment are disclosed. The power amplifier fixing device is used to fix the power amplifier (40) onto PCB (printed circuit board) (50), and comprises a U-shape slice (30) which is made of electrically and thermally conductive material. A fixing position is disposed on the concave of the U-shape slice (30) to fix GND plane of the power amplifier (40). Both ends of the U-shape slice (30) are curved outwards respectively and extended to form two extended planes to electrically connect with GND signal of PCB (50) and permanently connect with PCB (50). Through using the power amplifier fixing device, the power amplifier itself does not bear any deformation stress, has low ground impedance which ensures consistency of electrical property, and has good grounding and heat dissipation effect. The power amplifier fixing device can be used for either a single power amplifier or the combination of power amplifiers, and ensures consistency when multiple power amplifiers are connected in parallel.

Description

Power amplifier fixing device and communication device

Technical field

The present invention relates to the field of communication devices, and more particularly to a mounting device and a communication device for a high power RF power amplifier of a mobile communication device.

Background technique

In today's information society, people usually want to receive useful information conveniently and conveniently at any time and place. Therefore, various portable wireless communication devices are widely used in people's daily life. In wireless communication devices, an antenna for transmitting and receiving radio waves to transmit radio signals is undoubtedly one of the most important components. For a large number of handheld terminal devices, the antenna should not only be thin and light, but also preferably operate in dual frequency and have a wider frequency band.

The RF power amplifier is the heart of the communication equipment. The grounding impedance and heat dissipation of the RF power amplifier determine the reliability and cost of the entire amplifier. The RF power amplifier uses a dedicated power amplifier module, which ensures the grounding effect and heat dissipation performance, but the cost is high, and each dedicated power amplifier module requires a specific mounting mechanism to match, which brings the overall structural design of the device. Great limit. It is of great economic importance to use a low-cost general-purpose RF power amplifier tube to design a highly reliable amplifier.

Generally, off-the-shelf power amplifier modules are mostly designed and manufactured by power amplifier manufacturers. The power amplifier 11 is directly soldered to a heat dissipating copper sheet 12. As shown in FIG. 1, the heat dissipating copper sheet 12 is connected to the ground inside the power amplifier 11. During installation, the heat-dissipating copper sheet 12 is in direct contact with the grounding copper foil of the PCB board (not shown), and has a low grounding resistance. A heat-insulating soft pad is added between the heat-dissipating copper sheet 12 and the heat-dissipating base to improve the power amplifier. Thermal performance. In this way, the power amplifier module is dedicated, the device procurement cost is high, and the structural design is limited by the shape of the power amplifier module, which is not flexible.

As shown in FIG. 2, the second common practice is to add a conductive and thermally conductive soft pad between the power amplifier 23 and the heat sink base 24 to improve the contact between the power amplifier 23 and the heat sink base 24, such as indium foil, Graphite film, conductive silica gel, and the like.

The gasket used in this way is a compromise between heat conduction and electrical conduction, not having excellent thermal and electrical conductivity at the same time; or it is itself a highly toxic substance such as indium foil. In the present solution, the connection path between the power amplifier 23 and the PCB board 21 is grounded: the power amplifier 23 first transfers current to the heat sink base 24, and then the current is transmitted from the heat sink base 24 to the ground of the PCB board 21, thereby increasing the grounding link and grounding. The impedance is also increased. Between the power amplifier 23 and the heat sink base 24, a good electrical performance connection must be ensured between the heat sink base 24 and the PCB board 21 to ensure sufficient RF power output.

Further, in the second mode, a device (not shown) for adding a power amplifier 23 is required, and the device for mounting the power amplifier is pressed by the screw 22, and the power amplifier 23 is fixed to the heat sink base 24, and the power of the upper screw 22 is applied. The stress directly in the amplifier 23 is subjected to deformation. In order to have good electrical conduction and heat dissipation performance, the screw 22 is required to be tight. When the upper screw 22 is applied, the power amplifier 23 is subjected to excessive deformation stress and is at risk of damage.

Summary of the invention

The technical problem to be solved by the present invention is to provide a low-cost power amplifier tube mounting device for the above-mentioned defects of the prior art, which ensures that the power amplifier tube has excellent grounding and heat dissipation, and has high functional consistency. It is also convenient for production assembly.

The technical solution adopted by the present invention to solve the technical problem thereof is:

Constructing a power amplifier fixing device for fixing a power amplifier on a PCB, wherein a U-shaped piece made of an electrically and thermally conductive material is provided, and a concave surface of the U-shaped piece is provided with a fixing surface for fixing the power amplifier a fixed position of the ground plane;

The two ends of the U-shaped piece are respectively bent and extended outward to form two extending faces for electrically connecting with the grounding signal on the PCB board and for fixedly connecting the PCB board.

The power amplifier fixing device of the present invention, wherein a concave surface of the U-shaped piece is flush with a ground plane of the power amplifier, and two extending faces of the U-shaped piece and an input/output signal pin of the power amplifier Flush.

The power amplifier fixing device of the present invention, wherein the fixed bit is a square groove of a size corresponding to a total area of a ground plane of one or more of the installed power amplifiers, and the power amplifier is soldered at The fixed position.

The power amplifier fixing device of the present invention, wherein two fixing surfaces are respectively provided with fixing holes, and the fixing holes are provided with fastening for connecting the U-shaped piece to the PCB board Pieces.

In the power amplifier fixing device of the present invention, the conductive heat conductive material for preparing the U-shaped sheet is copper or a copper alloy.

The present invention also provides a communication device, comprising a PCB board for performing a communication function, wherein the PCB board is provided with a power amplifier, wherein the power amplifier is fixed on the PCB board by a power amplifier fixing device;

Wherein the power amplifier fixing device comprises a U-shaped piece made of an electrically and thermally conductive material, and a concave surface of the U-shaped piece is provided with a fixing position for fixing the power amplifier;

The communication device of the present invention, wherein the PCB board is provided with a through hole, the edge portion of the through hole is exposed to the ground copper, and the bottom surface of the U-shaped piece passes through the through hole, the U-shaped piece Two extending faces are caught at an edge of the through hole, and are in contact with a portion of the through hole having a grounded copper;

Fixing holes are respectively disposed on the two extending surfaces, and the fixing holes are provided with fasteners for connecting the U-shaped piece to the PCB board;

And a hole corresponding to the fixing hole on the two extending surfaces is opened in a region of the through hole at which the grounding copper is exposed, and the fastener passes through the corresponding fixing hole and the hole to fix the U-shaped piece in the On the PCB board.

In the communication device of the present invention, the bottom surface of the U-shaped piece is flush with the ground plane of the power amplifier, and the two extended faces of the U-shaped piece are flush with the input and output signal pins of the power amplifier. ;

The area of the PCB board mated with the input and output signal pins of the power amplifier is exposed to copper, so that the input and output signal pins of the power amplifier are electrically connected to the input and output signal terminals on the PCB.

The communication device of the present invention, wherein the electrically and thermally conductive material used to prepare the U-shaped sheet is copper or a copper alloy.

The communication device of the present invention, wherein the communication device further comprises a heat dissipation base, and the heat dissipation base is provided with a convex surface or a groove surface for placing the bottom surface of the U-shaped piece;

A thermal pad or thermal grease is disposed between the outer bottom surface of the U-shaped piece and the heat dissipation base.

The power amplifier fixing device of the invention fixes the power amplifier, the power amplifier itself is not subjected to deformation stress, the installation is safe and worry-free, and the U-shaped piece is soldered to the ground of the power amplifier, and the two ends of the U-shaped piece are directly connected to the ground of the PCB board. Contact, low grounding impedance, ensuring the consistency of electrical performance; the heat of the power amplifier is mainly radiated from the bottom of the U-shaped piece to the heat dissipation base, and has excellent grounding and heat dissipation effects; and can be used for one power amplifier alone or The combination of power amplifiers ensures uniformity of multiple power amplifiers in parallel and is easy to assemble.

DRAWINGS

The present invention will be further described below in conjunction with the accompanying drawings and embodiments, in which:

1 is a schematic diagram 1 of a prior art power amplifier fixing method;

2 is a schematic diagram 2 of a prior art power amplifier fixing method;

3 is a schematic structural view of a power amplifier fixing device of the present invention;

4 is a schematic structural view of a power amplifier required to be fixed according to the present invention;

5 is a schematic structural view of a power amplifier of the present invention fixed on a power amplifier fixing device;

6 is a schematic structural view of a PCB board of a communication device of the present invention;

Figure 7 is a cross-sectional view showing the structure of a power amplifier fixed to a PCB board using the power amplifier fixing device of the present invention;

Figure 8 is a cross-sectional view showing a partial structure of a communication device using the power amplifier fixing device of the present invention;

Figure 9 is a schematic view showing the assembly structure of a communication device using the power amplifier fixing device of the present invention.

detailed description

DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS Hereinafter, preferred embodiments of the present invention will be described in detail in conjunction with the drawings.

The power amplifier fixing device of the preferred embodiment of the present invention is used for fixing the power amplifier 40 on the PCB board 50. The structure of the power amplifier 40 is as shown in FIG. 3, and referring to FIGS. 4, 5 and 6, the power amplifier fixing device includes A U-shaped sheet 30 made of an electrically and thermally conductive material is provided on the concave surface 31 of the U-shaped sheet 30 with a fixed position 311 for fixing the power amplifier 40, wherein the ground plane 41 of the power amplifier 40 (which is also the heat dissipating surface of the power amplifier 40) The fixed position 311 is in contact. The two ends of the U-shaped piece 30 (i.e., the vertical two side edges) are respectively bent and extended outward to form two extending faces 32 for electrically connecting to the ground signal on the PCB board 50 and for fixing the connection PCB board 50. .

Since the U-shaped piece 30 itself is made of an electrically and thermally conductive material, the extending faces 32 at both ends of the U-shaped piece 30 are in electrical contact with the grounding signal on the PCB board 50, respectively, and complete the fixed connection with the PCB board 50, the power amplifier 40 is The fixing surface 311 is fixed on the bottom surface of the U-shaped piece 30, and the grounding surface 41 is in contact with the inner bottom surface of the U-shaped piece 30. The heat can be dissipated through the U-shaped piece 30 and the ground between the power amplifier 40 and the PCB board 50 can be realized. connection. Since the power amplifier 40 itself does not need to withstand deformation stress, damage to the power amplifier 40 can be reduced and its service life can be extended.

Preferably, as shown in FIG. 5, the concave surface 31 of the U-shaped piece 30 is flush with the ground plane of the power amplifier 40, and the extended surface 32 of the U-shaped piece 30 is flush with the input and output signal pins 42 of the power amplifier 40. That is, the depth of the concave portion of the U-shaped sheet 30 should be adapted to the thickness of the power amplifier 40 so that the power amplifier 40 can be placed in the U-shaped sheet 30, and the input and output signal pins of the power amplifier 40 can be exactly matched with the PCB board 50. The corresponding pins are electrically connected, and the power amplifier 40 does not sway within the U-shaped piece 30, so that the electrical connection between the power amplifier 40 and the PCB board is more secure.

Preferably, as shown in FIG. 3, the fixed position 311 is provided as a slot having a size corresponding to the total area of the ground plane 41 of the one or more power amplifiers 40 mounted, and the power amplifier 40 can be soldered by a surface mount soldering process. In the square slot, a fixed connection and an electrical connection between the power amplifier 40 and the U-shaped piece 30 are achieved.

Preferably, as shown in FIG. 3 and FIG. 7 , fixing holes 321 are respectively disposed on the two extending surfaces 32 , and fasteners 70 for connecting the U-shaped piece 30 to the PCB board 50 may be disposed in the fixing holes 321 . The fastener 70 can be a fixing member such as a screw, and the U-shaped piece 30 is directly fixed on the PCB board 50, so that the power amplifier 40 itself does not need to withstand deformation stress, and the damage to the power amplifier 40 can be reduced, and the service life thereof can be prolonged.

In the embodiment, the conductive heat conductive material used for preparing the U-shaped sheet 30 is preferably made of copper or a copper alloy, which has good electrical and thermal conductivity and is inexpensive, and is convenient for molding.

According to the power amplifier fixing device in the above embodiment, the present invention also provides a communication device, as shown in FIGS. 8 and 9, while referring to FIGS. 5, 6, and 7, including a PCB board for performing a communication function. 50. The PCB 50 is provided with a power amplifier 40 in addition to an element which is indispensable for completing the communication function.

Among them, the power amplifier 40 is fixed on the PCB board 50 by a power amplifier fixing device. The power amplifier fixture includes at least a U-shaped piece 30 made of an electrically and thermally conductive material, and a fixed position 311 for fixing the power amplifier 40 is disposed on the concave surface 31 of the U-shaped piece 30. Both ends of the U-shaped piece 30 are bent outwardly and extended, respectively, to form two extended faces 32 for electrically connecting to the ground signal on the PCB board 50 and for fixing the connection PCB board 50. On the two extending faces 32, preferably, fixing holes 321 are provided, respectively, and the fixing holes 321 are provided with fasteners 70 for connecting the U-shaped piece 30 to the PCB board 50, wherein the fasteners 70 may employ screws or the like.

Correspondingly, as shown in FIGS. 6 and 7, a through hole 51 is provided in the PCB board 50. The size of the through hole 51 is determined by the size of the bottom surface of the U-shaped piece 30, and the through hole 51 can only make the bottom surface of the U-shaped piece 30. Upon successful passage, the two extension faces 32 of the U-shaped piece 30 and the signal input/output pin 42 of the power amplifier 40 cannot pass. The edge portion of the through hole 51 is exposed to copper, and the portion of the copper is grounded, and its area is slightly larger than the area of the extended surface 32 of the U-shaped piece 30. The bottom surface of the U-shaped piece 30 passes through the through hole 51, and the two extending faces 32 are caught at the edge of the through hole 51, and are in contact with the portion of the through hole 51 where the copper is grounded. A hole 52 corresponding to the fixing hole 321 of the two extending faces 32 is opened in a region where the grounding copper is exposed at the edge of the through hole 51. The fastener 70 passes through the corresponding fixing hole 321 and the hole 52 to fix the U-shaped piece 30 to the PCB. On board 50.

The exposed area of the PCB board 50 and the signal input/output pin 42 of the power amplifier 40 is exposed to copper. The exposed copper is connected to the associated circuit and is the input and output end of the signal, and its size is slightly larger than the signal input of the power amplifier 40. Output pin 42.

As shown in FIG. 7, the bottom surface of the U-shaped sheet 30 is flush with the ground plane 41 of the power amplifier 40, and the extended surface 32 at both ends of the U-shaped sheet 30 is flush with the input and output signal pins 42 of the power amplifier 40, and the power is made. The input and output signal pins 42 of the amplifier 40 are in contact with the associated exposed copper regions on the PCB 50 to effect electrical connection of the input and output signal pins 42 of the power amplifier 40 to the PCB board 50.

Preferably, as shown in FIG. 7, the communication device of the embodiment further includes a heat dissipation base 60 located under the PCB board 50. The outer bottom surface of the U-shaped piece 30 is in contact with the heat dissipation base 60 to achieve better heat dissipation of the power amplifier 40. . The heat dissipation base 60 is provided with a boss surface 61 or a groove surface 61 corresponding to the size of the bottom area of the U-shaped piece 30, and a screw hole through which the fastener 70 can be disposed is disposed on the heat dissipation base 60 (not shown). The fastener 70 can fix the PCB board 50 and the U-shaped piece 30 together with the heat dissipation base 60.

More preferably, a thermal pad or thermal grease (not shown) is disposed between the outer bottom surface of the U-shaped sheet 30 and the heat dissipation base 60 to achieve better heat dissipation of the power amplifier 40.

The conductive and heat conductive material used for preparing the U-shaped sheet 30 is copper or a copper alloy, and has good electrical and thermal conductivity, and the material is cheap and convenient for molding.

In use, as shown in Figures 7, 8, and 9, while referring to Figure 3, the power amplifier 40 is first soldered to the fixed position 311 of the U-shaped piece 30, and the U-shaped piece 30 of the power amplifier 40 is soldered as a power. The amplifier module is used. The power amplifier module is placed in the through hole 51 of the PCB board 50, so that the two extended faces 32 of the U-shaped piece 30 are in contact with the ground copper on the PCB board 50, and the input and output signal pins 42 of the power amplifier 40 are turned on. The signal is communicated with the PCB board 50. The bottom surface of the U-shaped piece 30 is attached to the convex surface or the concave surface 61 of the heat dissipation base 60, and a thermal pad or thermal grease can be applied between the bottom surface of the U-shaped piece 30 and the heat dissipation base 60. The fastener 70 fixes the U-shaped piece 30 to the PCB board 50 and the heat dissipation base 60, and finally solders the signal input/output pin 42 of the power amplifier 40 to the corresponding exposed copper area on the PCB board 50.

In the installation, the power amplifier fixing device of the present invention can be used for one power amplifier alone, or can be used for multiple power amplifier combinations, and can ensure uniformity when multiple power amplifiers are connected in parallel, and is convenient to assemble. At the same time, since the scheme is to fasten the U-shaped piece, the power amplifier is not directly subjected to the force, and the problem that the power amplifier is easily broken is solved, and the installation is safe and worry-free.

Moreover, with the power amplifier fixing device of the invention, the pin of the power amplifier needs to be soldered to the PCB board only during the first installation process, and the PCB is not required to be soldered after the PCB is removed or installed from the heat dissipation base. Production assembly and maintenance, cleverly solved the problem of heat dissipation and grounding of the power amplifier. Moreover, the U-shaped piece is first fastened with screws, and the pins of the power amplifier are welded, thereby eliminating the system tolerance caused by the tolerance of each part in the assembly, and ensuring the consistency of mass production.

In terms of heat dissipation, the power amplifier fixing device of the present invention ensures that the bottom plane of the U-shaped piece is in close contact with the convex surface or the groove surface of the heat dissipation base, and the heat of the power amplifier is mainly radiated from the bottom of the U-shaped piece to the heat dissipation base, and the U-shaped piece A thermal pad or thermal grease can be added between the bottom and the thermal base. The conductivity of the thermal pad or thermal grease has no effect on the grounding effect of the power amplifier.

In terms of electrical performance, the two extended faces of the U-shaped piece are closely attached to the grounded exposed copper area on the PCB board, and the two ends of the U-shaped piece are directly in contact with the ground of the PCB, thereby reducing the grounding link of the power amplifier, effectively The grounding impedance is reduced to ensure the reliability of the grounding.

It is to be understood that those skilled in the art will be able to make modifications and changes in accordance with the above description, and all such modifications and variations are intended to be included within the scope of the appended claims.

Claims

A power amplifier fixing device for fixing a power amplifier (40) on a PCB board (50), characterized by comprising a U-shaped piece (30) made of an electrically and thermally conductive material, the U-shaped piece (30) a concave surface (31) is provided with a fixed position (311) for fixing a ground plane (41) of the power amplifier (40);

The two ends of the U-shaped piece (30) are respectively bent and extended outward to form two extensions for electrically connecting with a ground signal on the PCB board (50) and for fixedly connecting the PCB board (50). Face (32).
The power amplifier fixing device according to claim 1, wherein a concave surface (31) of said U-shaped piece (30) is flush with a ground plane (41) of said power amplifier (40), said U shape The two extended faces (32) of the die (30) are flush with the input and output signal pins (42) of the power amplifier (40).
The power amplifier fixture according to claim 1, wherein said fixed bit (311) is a size and a total area of a ground plane (41) of said one or more said power amplifiers (40) A matching square slot, the power amplifier (40) is soldered to the fixed position (311).
The power amplifier fixing device according to claim 1, wherein a fixing hole (321) is disposed on each of the two extending surfaces (32), and the fixing hole (321) is provided with a fixing hole (321) A U-shaped piece (30) is attached to the fastener (70) of the PCB board (50).
A power amplifier fixture according to claim 1, characterized in that the electrically and thermally conductive material used to prepare the U-shaped sheet (30) is copper or a copper alloy.
A communication device comprising a PCB board (50) for performing a communication function, wherein the PCB board (50) is provided with a power amplifier (40), characterized in that the power amplifier (40) is fixed by a power amplifier fixing device On the PCB board (50);

Wherein the power amplifier fixing device comprises a U-shaped piece (30) made of an electrically and thermally conductive material, and a concave surface (31) of the U-shaped piece (30) is provided with a fixing for fixing the power amplifier (40) Bit (311);

The two ends of the U-shaped piece (30) are respectively bent and extended outward to form two extensions for electrically connecting with a ground signal on the PCB board (50) and for fixedly connecting the PCB board (50). Face (32) .
The communication device according to claim 6, wherein the PCB board (50) is provided with a through hole (51), and an edge portion of the through hole (51) exposes a ground copper, and the U-shaped piece (30) The bottom surface of the U-shaped sheet (30) is stuck at the edge of the through hole (51), and the edge of the through hole (51) is grounded with copper. Part of the contact;

Fixing holes (321) are respectively disposed on the two extending surfaces (32), and the fixing holes (321) are provided for connecting the U-shaped piece (30) to the PCB board (50) Fasteners (70);

A hole (52) corresponding to the fixing hole (321) on the two extending faces (32) is opened in a region where the edge of the through hole (51) is exposed to the ground, and the fastener (70) passes through Corresponding fixing holes (321) and holes (52) for fixing the U-shaped piece (30) on the PCB board (50) .
The communication device according to claim 7, characterized in that the bottom surface of the U-shaped sheet (30) is flush with the ground plane (41) of the power amplifier (40), and the U-shaped sheet (30) The two extension faces (32) are flush with the input and output signal pins (42) of the power amplifier (40);

Extending copper in a region where the PCB board (50) is matched with an input/output signal pin (42) of the power amplifier (40), electrically connecting the input/output signal pin (42) of the power amplifier (40) to Input and output signal terminals on the PCB board (50).
The communication device according to claim 6, characterized in that the electrically and thermally conductive material used to prepare the U-shaped sheet (30) is copper or a copper alloy.
The communication device according to claim 6, wherein the communication device further comprises a heat dissipation base (60), and the heat dissipation base (60) is provided with a boss surface for placing a bottom surface of the U-shaped piece (30) Or groove surface (61);

A thermal pad or thermal grease is disposed between the outer bottom surface of the U-shaped sheet (30) and the heat dissipation base (60).