WO2011116526A1 - 射频高功率热管散热器 - Google Patents

射频高功率热管散热器 Download PDF

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Publication number
WO2011116526A1
WO2011116526A1 PCT/CN2010/071346 CN2010071346W WO2011116526A1 WO 2011116526 A1 WO2011116526 A1 WO 2011116526A1 CN 2010071346 W CN2010071346 W CN 2010071346W WO 2011116526 A1 WO2011116526 A1 WO 2011116526A1
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Prior art keywords
heat
heat dissipation
heat pipe
radio frequency
high power
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PCT/CN2010/071346
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English (en)
French (fr)
Inventor
孙陈
梁珏
付勇
胡亚星
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海能达通信股份有限公司
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Priority to PCT/CN2010/071346 priority Critical patent/WO2011116526A1/zh
Publication of WO2011116526A1 publication Critical patent/WO2011116526A1/zh

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    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/20—Modifications to facilitate cooling, ventilating, or heating
    • H05K7/2029—Modifications to facilitate cooling, ventilating, or heating using a liquid coolant with phase change in electronic enclosures
    • H05K7/20336—Heat pipes, e.g. wicks or capillary pumps

Definitions

  • the invention belongs to the field of professional wireless communication, and relates to a heat sink for a base station and a relay station type product, in particular to a heat sink for a radio frequency high power amplifier.
  • heat dissipation efficiency For the thermal design of RF high-power amplifiers, which belongs to the intersection of thermal design and RF circuit design, the following three elements must be considered: heat dissipation efficiency, RF grounding, and heat sink volume. Generally, the heat dissipation efficiency is increased, and the heat sink volume is increased, which is a contradiction factor. RF grounding requires the RF power amplifier to be in close contact with the heat sink to ensure minimal grounding resistance. Therefore, the key technology of heat dissipation design is to balance the three technical requirements of heat dissipation efficiency, heat sink volume and RF grounding.
  • the heat dissipation technology of the existing RF high-power amplifier usually adopts a heat dissipation method of aluminum or copper profiles and fins.
  • Some radiators also have fans on the fins for forced air cooling.
  • these radiators are bulky and cannot meet the needs of miniaturization of equipment.
  • the KG510 repeater on the market uses a large-area aluminum radiator, which is placed on the top of the chassis and takes up a lot of space, so the built-in duplexer cannot be installed.
  • the TB9100 base station also uses a pure aluminum profile radiator, which is bulky and takes up a lot of space.
  • the MX800 transfer table uses a nautical-grade pure aluminum profile radiator, which has a reduced volume and reduced weight, but the cost is extremely high and the supply is small.
  • the technical problem to be solved by the present invention is that the heat pipe technology is introduced into the heat sink of the radio frequency high power amplifier and meets the requirements of the radio frequency grounding, so as to provide a large volume or high cost defect of the existing radio frequency high power amplifier.
  • a heat sink that is small in size, high in heat dissipation efficiency, and small in grounding resistance.
  • the technical solution adopted by the present invention to solve the technical problem is to construct a radio frequency high-power heat pipe heat sink, by embedding a heat pipe and a mask on the heat dissipation base, and closely installing and installing the RF high-power amplifier chip on the mask.
  • the PCB board reduces the thermal resistance and grounding resistance between the RF high power amplifier chip and the heat sink base.
  • the present invention provides a radio frequency high-power heat pipe heat sink, comprising a heat dissipation base and a heat dissipation fan, wherein a lower surface of the heat dissipation base is provided with fins, and the heat dissipation fan is fixed on a lower surface of the heat dissipation base, and the
  • the heat sink further includes a heat pipe and a mask, the heat pipe is embedded in an upper surface of the heat dissipation base, and the mask covers the heat pipe.
  • the present invention can generate high-efficiency heat conduction capability equivalent to ten times or even tens of times of ordinary metal by providing a heat pipe in the heat dissipation base, thereby effectively improving the radio frequency.
  • Thermal performance of high power heat pipe radiators is also embedded on the heat pipe, and a mask for closely contacting the PCB board on which the RF high power amplifier chip is mounted is added on the heat pipe, thereby reducing the RF high power amplifier while ensuring contact flatness and assembly accuracy.
  • the thermal resistance and grounding resistance between the chip and the heat sink base solves the problem of RF grounding.
  • FIG. 1 is a process diagram of assembling a radio frequency high power heat pipe radiator in a preferred embodiment of the present invention
  • FIG. 2 is a perspective view of the heat sink base of Figure 1;
  • Figure 3 is a front elevational view of the heat sink base of Figure 1;
  • Figure 4 is a cross-sectional view of the heat sink base of Figure 3 at A-A;
  • Figure 5 is a schematic structural view of the PCB board of Figure 1;
  • Figure 6 is a schematic structural view of the heat conducting bracket of Figure 1;
  • Figure 7 is a schematic view showing the structure of the mask of Figure 1.
  • Heat pipe technology uses the principle of phase change of working fluid to improve heat dissipation efficiency. It has been widely used in various industries and can be used in combination with natural heat dissipation.
  • the heat pipe is used for heat dissipation, and the heat dissipation efficiency is high, the heat sink is small in size, and the cost is appropriate.
  • heat pipe heat sinks are now mainly used in the PC industry, consumer electronics industry, medical equipment, and the public mobile communications industry. In these industries, high-power heat dissipation design applications generally do not have RF grounding requirements, and the heat source is in close contact with the heat sink base.
  • the invention introduces the heat pipe technology into the field of radio frequency high-power amplifiers.
  • the contact of the "copper-copper" contact in the long-term application causes the contact resistance to change, the processing method may be difficult to control, the amount of tin is difficult to control, and the heat-conductive filling material is used. It must be ensured that the material has good electrical and thermal conductivity and is very costly (eg indium alloy). More importantly, these contact methods do not meet the RF grounding requirements of RF high power amplifiers. Therefore, the present invention needs to solve the problem of radio frequency grounding while introducing heat pipe technology into the heat sink of the radio frequency high power amplifier.
  • FIG. 1 is a process diagram of assembling a radio frequency high power heat pipe heat sink according to a preferred embodiment of the present invention.
  • the RF high-power heat pipe radiator provided by the present invention includes a heat dissipation base 1 , a heat dissipation fan 2 , a heat pipe 3 , and a mask 4 .
  • FIG. 2 and FIG. 3 are respectively a perspective view and a front view of the heat dissipation base of FIG. 1 .
  • the heat dissipation base 1 is made of a conventional pure aluminum profile, and can also be made of a pure copper profile.
  • the heat sink base 1 is provided with fins 11 on the lower surface.
  • the heat dissipation fan 2 is fixed to the lower surface of the heat dissipation base 1.
  • the heat dissipation fan 2 includes a fan 21 and a dust-proof fan cover 22.
  • the heat dissipation fan 2 can be installed between the fins 11 and embedded in the plane of the fins 11, thereby increasing the contact area and facilitating heat dissipation of the profile. In other embodiments of the present invention, the heat dissipation fan 2 may also be disposed along the fins 11 on the lower surface of the heat dissipation base 1.
  • the heat pipe 3 is embedded in the upper surface of the heat dissipation base 1.
  • the mask 4 covers the heat pipe 3.
  • the heat dissipation base 1 is provided with a cavity matching the shape of the heat pipe 3 and a structure corresponding to the mask 4 to mount the heat pipe 3 and the mask 4. It is to be noted that the present invention can embed the heat pipe 3 and the mask 4 from the upper surface into the heat sink base 1 by any means known to those skilled in the art.
  • the mask 4, the heat pipe 3, and the heat dissipation base 1 are welded together by reflow soldering. Please refer to FIG. 4 , which is a cross-sectional view of the heat dissipation base of FIG. 3 at A-A. As shown in FIG.
  • the heat sink further includes a shield cover 5 mounted on the upper surface of the heat dissipation base 1, and the shield cover 5 serves to reduce radiation spurs of the transmitter.
  • the shielding cover 5 and the heat dissipation base 1 form a closed cavity 12, and the heat pipe 3 can be installed in the sealed cavity 12 and closely fitted with the heat dissipation base 1.
  • the heat sink also includes a chip 6 of a radio frequency high power amplifier.
  • the heat sink further includes a heat conductive bracket 7 and a PCB board 8.
  • the RF high power amplifier chip 6 is first fused with the heat conduction bracket 7 by reflow soldering, and then soldered to the upper surface of the PCB board 8 by reflow soldering.
  • the PCB board 8 is covered on the mask 4 and fixed to the heat sink base 1 by screws.
  • the heat dissipation process of the heat pipe radiator provided by the embodiment of the present invention is analyzed below.
  • the heat source of the radio frequency high-power amplifier chip-heat conduction bracket heat conduction-mask heat conduction-heat pipe heat conduction-heat dissipation base heat conduction-heat dissipation fan strong convection heat dissipation The process performs heat dissipation.
  • FIG. 5 and FIG. 6 are respectively a schematic structural view of the PCB board and the heat conducting bracket in FIG. 1 .
  • the middle portion of the heat conducting bracket 7 provided by the embodiment of the present invention is bent to form a space to accommodate the RF high power amplifier chip 6.
  • FIG. 7 is a structural diagram of the mask in FIG. 1 .
  • the mask 4 is provided with a heat conductive copper block 41 of the same shape at a position corresponding to the RF high power amplifier chip 6. Therefore, the heat can be quickly transmitted to the heat pipe 3 through the heat conductive copper block 41 of the RF high power amplifier chip 6, which saves heat dissipation area and improves heat dissipation efficiency.
  • the appearance of the mask structure has solved the problem of difficult assembly of copper tubes and high cost assembly.
  • the independent mask structure can achieve low-cost finishing, ensure contact flatness, and achieve accurate assembly positioning.
  • the heat pipe 3 is a core component of the embodiment of the present invention.
  • the embodiment of the present invention can quickly dissipate heat to all corners of the heat dissipation base by virtue of its high efficiency heat transfer feature, so that the heat dissipation fan can quickly dissipate heat.
  • the heat pipe 3 used in the embodiment of the present invention is a sintered copper pipe, and the purpose of the sintered structure is to make a small amount of liquid form a capillary phenomenon inside the copper pipe.
  • the working principle of the heat pipe is as follows: the principle of low-pressure phase change of liquid is used to produce high-efficiency heat conduction capability, and its heat conduction capacity is ten times or even tens of times higher than that of ordinary metal.
  • the inside of the heat pipe is evacuated, and the liquid forms a saturated state of liquid vapor inside the heat pipe. When the temperature of one end of the heat pipe rises, the liquid in the heat pipe will rapidly vaporize, bringing the heat to the other end of the relatively low temperature, and the hot steam will quickly become cold. Condensation, flowing back to the higher end of the heat pipe through the sintered capillary structure, as long as there is a temperature difference across the heat pipe, this cycle will continue.
  • heat generated by the RF high-power amplifier chip 6 is diffused through the heat sink base 1. This requires that the structure of the heat sink base 1 must be very reasonable, otherwise the heat dissipation efficiency will be low.
  • the shape and structure design of the radiator is based on detailed heat dissipation analysis, and the basic structural model is obtained. Then through actual test comparison, the unique shape and structure are finally determined.
  • heat is efficiently dissipated by providing fins on the lower surface of the heat dissipation base 1.
  • the heat dissipation fan 2 includes a fan 21 and a fan cover 22, and is fixed to the heat dissipation base 1 by a fixing screw.
  • the embodiment of the invention designs the radio frequency high-power heat pipe radiator product through the above scheme and tests its performance.
  • Some technical specifications related to the heat sink design are as follows:
  • the performance parameters of the heat sink designed by the embodiment of the present invention are as follows:
  • the temperature rise of the 50W full load launching radiator does not exceed 10 °C;
  • the above data indicates that the heat pipe heat sink manufactured by the embodiment of the present invention has small volume, high heat dissipation efficiency and good RF grounding.
  • the product of the embodiment of the invention can be applied to a base station/transposition station product in the field of professional wireless communication, the application frequency band is 30 MHz to 900 MHz, and the power output is 25 W to 1000 W (more than 100 W is mainly applied to short wave communication). These products are widely used in general and cluster systems in the public safety, military, government, railway, petrochemical, forestry, construction, property management, and hotel industries.
  • the embodiment of the present invention by providing a heat pipe in the heat dissipation base, high-efficiency heat conduction capability equivalent to ten times or even tens of times of ordinary metal can be generated, and the heat dissipation performance of the RF high-power heat pipe heat sink is effectively improved.
  • the heat pipe is embedded in the heat sink base, including the upper surface embedding and the lower surface embedding.
  • the advantage is that the fin can be formed once with the heat dissipation base, which has high structural strength and cost saving; the disadvantage is that the upper surface integrity is destroyed, and the RF grounding is added when the embodiment of the present invention is applied to the RF high power amplifier. Difficulties. If the heat pipe is embedded from the lower surface, the advantage is that the upper surface is complete and easy to process, the plane precision is high, and the PCB board and the chip are in good contact; the disadvantage is that the fin needs to be separately processed and welded to the lower surface, the processing cost is high, and the fin structure strength is low.
  • the embodiment of the present invention solves the radio frequency grounding problem of the radio frequency high power amplifier chip, the PCB board and the heat dissipation base by using the mask design on the basis of the upper surface embedding method, so that the PCB board and the radio frequency power are made.
  • the amplifier chip and the heat sink base are in close contact, ensuring a small grounding resistance, and the fins on the lower surface can be integrally formed with the heat sink base, which has high structural strength and saves cost.
  • the RF high-power amplifier chip is soldered on the PCB board to closely adhere to the mask, and the heat-conducting bracket can directly transmit the heat generated by the RF high-power amplifier chip to the mask, thereby reducing The thermal resistance between the RF high power amplifier chip and the heat sink base.

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  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Physics & Mathematics (AREA)
  • Thermal Sciences (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
  • Cooling Or The Like Of Electrical Apparatus (AREA)

Description

射频高功率热管散热器 技术领域
本发明属于专业无线通信领域，涉及一种用于基站及中转台类产品的散热器，尤其涉及一种用于射频高功率放大器的散热器。
背景技术
在专业无线通信领域，传统的大功率散热装置一般采用纯铝型材或铜材。当散热功耗在50W以上时，单纯采用纯铝型材或铜材散热，散热器的体积会非常大，主机的安装空间也需要随之增加很多。以往由于通信用户容量小，通信设备机房的空间也相对宽裕。随着通信技术的发展，专业无线通信用户量日益增长，基站设备在扩容时会逐渐面临安装空间短缺的问题。为了解决设备安装空间问题，有必要减小散热器的体积，同时保证散热效率，以满足设备小型化的需求。
对于射频高功率放大器的散热设计，属于热设计和射频电路设计的交集范畴，必须要考虑到以下三点要素：散热效率、射频接地、散热器体积。通常要提高散热效率，散热器体积会增加，这是一对矛盾因素。而射频接地则要求射频功率放大器必须与散热器紧密接触以保证极小的接地电阻。因此，散热设计的关键技术为平衡散热效率、散热器体积和射频接地这三项技术要求。
目前在专业无线通信领域，现有的射频高功率放大器的散热技术通常采用铝或铜型材加鳍片的散热方式。一些散热器还在鳍片上装配风扇以进行强迫风冷。然而，这些散热器体积较大，不能满足设备小型化的需求。例如，市场上的KG510中转台采用大面积铝材散热器，置于机箱顶部，占用大量空间，而无法安装内置双工器；TB9100基地台也采用纯铝型材散热器，体积大，占用大量空间； MX800中转台采用航海等级纯铝型材散热器，体积有所减小，重量有所减轻，但是成本极高，货源少。
因此，需要开发一种能够有效对射频高功率放大器进行散热的设备，且能够平衡散热效率、散热器体积和散热器成本。
发明内容
本发明要解决的技术问题在于，针对现有射频高功率放大器的散热器体积大或成本高的缺陷，将热管技术引入到射频高功率放大器的散热器中并使其满足射频接地要求，从而提供一种体积小、散热效率高且接地电阻小的散热器。
本发明解决其技术问题所采用的技术方案是：构造一种射频高功率热管散热器，通过在散热基座上嵌入热管和掩板，并在掩板上紧密覆盖设置安装了射频高功率放大器芯片的PCB板，从而减小射频高功率放大器芯片与散热基座之间的热阻和接地电阻。
本发明提供了一种射频高功率热管散热器，包括散热基座与散热风机，所述散热基座下表面设有鳍片，所述散热风机固定在所述散热基座下表面，且所述散热器还包括热管和掩板，所述热管嵌入所述散热基座上表面，所述掩板覆盖于所述热管上。
实施本发明的射频高功率热管散热器，具有以下有益效果：本发明通过在散热基座中设置热管，可以产生相当于普通金属的十倍甚至数十倍的高效热传导能力，有效地提高了射频高功率热管散热器的散热性能。此外，本发明还在嵌入热管的基础上，在热管上增设安装射频高功率放大器芯片的PCB板紧密接触的掩板，从而在确保接触平面度和装配准确度的同时减小了射频高功率放大器芯片与散热基座之间的热阻和接地电阻，解决了射频接地的难题。
附图说明
下面将结合附图及实施例对本发明作进一步说明，附图中：
图1是本发明优选实施例中射频高功率热管散热器的组装工艺图；
图2是图1中散热基座的立体示意图；
图3是图1中散热基座的正面示意图；
图4是图3中散热基座在A-A处的剖面示意图；
图5是图1中的PCB板的结构示意图；
图6是图1中的导热支架的结构示意图；
图7是图1中的掩板的结构示意图。
具体实施方式
为了使本发明的目的、技术方案及优点更加清楚明白，以下结合附图及实施例，对本发明进行进一步详细说明。
热管技术是利用工质相变原理来提高散热效率，现已广泛应用于各种行业，可以与自然散热冷却方式结合使用。采用热管进行散热，其散热效率高、散热器体积小，且成本适宜。然而，热管散热器现在主要应用于PC行业、消费电子行业、医疗设备和公众移动通信行业中，在这些行业的大功率散热设计应用中，一般没有射频接地要求，热源与散热基座的紧密接触仅仅是为了减小热阻，因此一般采用“铜-铜”接触或直接将热源表面焊接在散热基座表面上，或者在热源与散热基座之间填充低热阻非导电的导热软垫或化合物。本发明将热管技术引入射频高功率放大器领域，这种“铜-铜”接触在长时间应用中表面易氧化导致接触电阻改变，焊接方式会出现加工困难、锡量难以控制，使用导热填充材料则必须保证该材料导电和导热性能良好，成本非常高（例如铟合金）。更重要的是，这些接触方式不能满足射频高功率放大器的射频接地要求。因此，本发明需要在将热管技术引入到射频高功率放大器的散热器的同时解决射频接地的难题。
请参阅图1，为本发明优选实施例中射频高功率热管散热器的组装工艺图。如图1所示，本发明提供的射频高功率热管散热器包括散热基座1、散热风机2、热管3和掩板4。
请结合参阅图2和图3，分别为图1中散热基座的立体示意图和正面示意图。其中，散热基座1采用常规的纯铝型材制成，也可采用纯铜型材制成。如图所示，散热基座1在下表面设有鳍片11。散热风机2固定在所述散热基座1下表面。散热风机2包括风扇21和防尘的风扇罩22。在本实施例中，散热风机2可以安装在鳍片11之间，且嵌入鳍片11的平面内，从而增大了接触面积，更有利于型材的散热。在本发明的其它实施例中，散热风机2也可以和鳍片11并排设置在散热基座1的下表面。
热管3嵌入散热基座1上表面。而掩板4覆盖于所述热管3上。散热基座1上设有与热管3形状匹配的空腔和与掩板4对应的结构以安装热管3和掩板4。需要说明地是，本发明可以采用本领域技术人员熟知的任何方式将热管3和掩板4从上表面嵌入散热基座1中。在本实施例中，掩板4、热管3和散热基座1通过回流焊焊接在一起。请参阅图4，为图3中散热基座在A-A处的剖面示意图。如图4所示，该散热器还包括安装在散热基座1上表面的屏蔽盖5，屏蔽盖5用于减小发射机的辐射杂散。在本发明实施例中，屏蔽盖5与散热基座1之间构成密闭空腔12，上述热管3即可以安装在该密闭空腔12内并与散热基座1紧密贴合设置。
散热器还包括射频高功率放大器的芯片6。为了安装该射频高功率放大器芯片6，散热器还包括导热支架7和PCB板8。其中，射频高功率放大器芯片6首先通过回流焊与导热支架7融合在一起，随后通过回流焊焊接在PCB板8的上表面上。PCB板8覆盖在掩板4上，并通过螺钉与散热基座1固定。
下面对本发明实施例提供的热管散热器的散热过程进行分析。在本发明实施例的射频高功率热管散热器中，通过射频高功率放大器芯片发热源——导热支架热传导——掩板热传导——热管热传导——散热基座热传导——散热风机强对流散热的过程进行散热。即高功率放大器芯片产生的大量热量，通过紧贴在芯片表面的导热支架以及掩板将热量传导到热管处，热管通过自身强大的导热能力，将热量迅速传导到散热型材上，然后通过散热风机强对流散热，将型材表面的热量迅速扩散出去。其具体过程如下：
1、导热支架热传导
首先，射频高功率放大器芯片6产生的热量基本上是通过导热支架7传导出来的。因此，导热支架7的固定、加工精度直接影响射频高功率放大器芯片6的工作稳定性。请结合参阅图5和图6，分别为图1中的PCB板和导热支架的结构示意图。如图所示，本发明实施例提供的导热支架7中部弯折形成空间以容纳射频高功率放大器芯片6。
2、掩板热传导
请参阅图7，为图1中的掩板的结构示意图。如图7所示，掩板4在对应于射频高功率放大器芯片6的位置设有与之形状相同的导热铜块41。因此，通过该紧贴射频高功率放大器芯片6的导热铜块41，热量便能迅速传导到热管3，既节省了散热面积，又提高了散热效率。掩板结构的出现，很好地解决了铜管组装困难及高成本组装的问题。独立的掩板结构，既可以实现低成本精加工，确保接触平面度，又能实现装配准确定位等。
3、热管热传导
热管3是本发明实施例的核心器件，本发明实施例借助它高效率的传热特点，能将热量迅速扩散到散热基座各个角落，以便于散热风机能迅速将热量扩散出去。
本发明实施例采用的热管3为烧结型铜管，烧结型结构的目的是，使少量液体在铜管内部形成毛细现象。热管的工作原理如下：利用液体低压相变原理，产生高效热传导能力，它的热传导能力相当于普通金属的十倍甚至数十倍。热管内部被抽成真空，液体在热管内部形成液汽饱和状态，当热管一端温度升高时，热管内液体会迅速汽化，将热量带到温度相对较低的另一端，热蒸汽遇冷会迅速凝结，通过烧结毛细结构流回到热管温度较高的一端，只要热管两端存在温差，这种循环就会一直进行下去。
4、散热基座热传导
射频高功率放大器芯片6产生的热量，绝大部分是通过散热基座1扩散出去的。这就要求散热基座1的结构必须十分合理，否则散热效率会很低。散热器的外形及结构设计，是基于详细的散热防真分析，得出基本结构模型，再通过实际测试对比，最终确定其独有的外形和结构。在本发明实施例中，通过在散热基座1下表面设置鳍片有效地进行散热。
5、散热风机强对流散热
当热量传到散热基座1时，嵌入鳍片内的散热风机2可以将热量快速扩散出去。散热风机2包括风扇21和风扇罩22，并通过固定螺钉固定在散热基座1上。
本发明实施例通过上述方案设计了射频高功率热管散热器产品并对其性能进行检验，其与散热器设计相关的部分技术规格如下：
主机尺寸(W x H x D)：482.6 x 87.6 x 366 mm
重量：8.5kg
工作温度：-30℃～+60℃
正常工作电压：13.6±15% V dc
发射功率：50W
发射电流：≤11A
工作循环：100%
MTBF：100,000小时
通过试验，本发明实施例设计的散热器的性能参数如下：
1. 在室温条件下50W满负载发射散热器温升不超过10℃；
2. 在室温条件下进行烧机实验（50W 100%常发射实验）超过3个月，发射功率稳定在54W；
3. 内部ALT实验经过7轮验证（每轮实验160小时，合计45自然日），发射机工作正常，折合MTBF约为100,000小时；
通过上述数据表明，实施本发明实施例制得的热管散热器体积小、散热效率高且射频接地好。本发明实施例的产品可以应用于专业无线通信领域中的基站/中转台类产品，应用频段为30MHz～900MHz，功率输出为25W～1000W（超过100W主要应用于短波通信）。该类产品在公共安全、军队、政府、铁路、石化、林业、建筑、物业管理、酒店等行业的常规和集群系统都有广泛应用。
综上所述，本发明实施例通过在散热基座中设置热管，可以产生相当于普通金属的十倍甚至数十倍的高效热传导能力，有效地提高了射频高功率热管散热器的散热性能。此外，在现有技术中，热管嵌入散热基座的方式有两种，包括上表面嵌入和下表面嵌入。如果热管从上表面嵌入，优点是鳍片可与散热基座一次成型，结构强度高，节省成本；缺点是破坏上表面完整性，在本发明实施例应用于射频高功率放大器时增加了射频接地的困难。如果热管从下表面嵌入，优点是上表面完整易加工，平面精度高，与PCB板和芯片接触良好；缺点是鳍片需要单独加工并焊接于下表面，加工成本高，鳍片结构强度低。因此，本发明实施例为了降低设备成本，在采用上表面嵌入方式的基础上，利用掩板设计解决了射频高功率放大器芯片、PCB板与散热基座的射频接地问题，使PCB板、射频功率放大器芯片和散热基座紧密接触，保证了极小的接地电阻，同时使下表面的鳍片可以与散热基座一体成型，其结构强度高，节省了成本。本发明实施例中还采用导热支架将射频高功率放大器芯片焊接在PCB板上从而与掩板紧密贴合，该导热支架能够将射频高功率放大器芯片需要产生的热量直接传导至掩板，减小了射频高功率放大器芯片与散热基座之间的热阻。
本发明实施例是根据特定实施例进行描述的，但本领域的技术人员应明白在不脱离本发明实施例范围时，可进行各种变化和等同替换。此外，为适应本发明实施例技术的特定场合或材料，可对本发明实施例进行诸多修改而不脱离其保护范围。因此，本发明实施例并不限于在此公开的特定实施例，而包括所有落入到权利要求保护范围的实施例。

Claims (9)

1、一种射频高功率热管散热器，包括散热基座（1）与散热风机（2），所述散热基座（1）下表面设有鳍片（11），所述散热风机（2）固定在所述散热基座（1）下表面，其特征在于，所述散热器还包括热管（3）和掩板（4），所述热管（3）嵌入所述散热基座（1）上表面，所述掩板（4）覆盖于所述热管（3）上。
2、根据权利要求1所述的射频高功率热管散热器，其特征在于，所述散热器还包括射频高功率放大器芯片（6）、导热支架（7）和PCB板（8），所述导热支架用于通过回流焊与射频高功率放大器芯片（6）融合连接，并通过回流焊焊接在PCB板（8）上表面，所述PCB板（8）覆盖设置于所述掩板（4）上。
3、 根据权利要求2所述的射频高功率热管散热器，其特征在于，所述PCB板（8）通过螺钉固定在所述散热基座（1）内。
4、根据权利要求2所述的射频高功率热管散热器，其特征在于，所述掩板（4）在对应于射频高功率放大器芯片（6）的位置设有与之形状相同的导热铜块（41）。
5、根据权利要求1所述的射频高功率热管散热器，其特征在于，所述掩板（4）、热管（3）和散热基座（1）通过回流焊融合连接。
6、 根据权利要求1所述的射频高功率热管散热器，其特征在于，所述鳍片（11）与散热基座（1）为铝型材且一体成型。
7、 根据权利要求7所述的射频高功率热管散热器，其特征在于，所述散热风机（2）安装在所述鳍片（11）之间，且嵌入所述鳍片（11）的平面内。
8、根据权利要求1所述的射频高功率热管散热器，其特征在于，所述热管（3）为烧结型铜管。
9、根据权利要求1所述的射频高功率热管散热器，其特征在于，所述散热器还包括安装在所述散热基座（1）上表面的用于减小辐射杂散的屏蔽盖（5）。
PCT/CN2010/071346 2010-03-26 2010-03-26 射频高功率热管散热器 WO2011116526A1 (zh)

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