WO2011105836A3 - 실리케이트계 전구체를 이용한 질화물계 형광체의 제조방법 - Google Patents

실리케이트계 전구체를 이용한 질화물계 형광체의 제조방법 Download PDF

Info

Publication number
WO2011105836A3
WO2011105836A3 PCT/KR2011/001304 KR2011001304W WO2011105836A3 WO 2011105836 A3 WO2011105836 A3 WO 2011105836A3 KR 2011001304 W KR2011001304 W KR 2011001304W WO 2011105836 A3 WO2011105836 A3 WO 2011105836A3
Authority
WO
WIPO (PCT)
Prior art keywords
nitride
silicate
precursors
phosphors
preparing
Prior art date
Application number
PCT/KR2011/001304
Other languages
English (en)
French (fr)
Other versions
WO2011105836A2 (ko
Inventor
김창해
최강식
유화성
이정표
채혜원
문인모
정우철
Original Assignee
한국화학연구원
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 한국화학연구원 filed Critical 한국화학연구원
Publication of WO2011105836A2 publication Critical patent/WO2011105836A2/ko
Publication of WO2011105836A3 publication Critical patent/WO2011105836A3/ko

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09K—MATERIALS FOR MISCELLANEOUS APPLICATIONS, NOT PROVIDED FOR ELSEWHERE
    • C09K11/00—Luminescent, e.g. electroluminescent, chemiluminescent materials
    • C09K11/08—Luminescent, e.g. electroluminescent, chemiluminescent materials containing inorganic luminescent materials
    • C09K11/77—Luminescent, e.g. electroluminescent, chemiluminescent materials containing inorganic luminescent materials containing rare earth metals
    • C09K11/7728—Luminescent, e.g. electroluminescent, chemiluminescent materials containing inorganic luminescent materials containing rare earth metals containing europium
    • C09K11/77342—Silicates
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09K—MATERIALS FOR MISCELLANEOUS APPLICATIONS, NOT PROVIDED FOR ELSEWHERE
    • C09K11/00—Luminescent, e.g. electroluminescent, chemiluminescent materials
    • C09K11/08—Luminescent, e.g. electroluminescent, chemiluminescent materials containing inorganic luminescent materials
    • C09K11/77—Luminescent, e.g. electroluminescent, chemiluminescent materials containing inorganic luminescent materials containing rare earth metals
    • C09K11/7728—Luminescent, e.g. electroluminescent, chemiluminescent materials containing inorganic luminescent materials containing rare earth metals containing europium
    • C09K11/77347—Silicon Nitrides or Silicon Oxynitrides
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805—Shape
    • H01L2224/4809—Loop shape
    • H01L2224/48091—Arched
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/481—Disposition
    • H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
    • H01L2224/48247—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a bond pad of the item
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/481—Disposition
    • H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
    • H01L2224/48257—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a die pad of the item
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/49—Structure, shape, material or disposition of the wire connectors after the connecting process of a plurality of wire connectors
    • H01L2224/491—Disposition
    • H01L2224/49105—Connecting at different heights
    • H01L2224/49107—Connecting at different heights on the semiconductor or solid-state body
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/73—Means for bonding being of different types provided for in two or more of groups H01L2224/10, H01L2224/18, H01L2224/26, H01L2224/34, H01L2224/42, H01L2224/50, H01L2224/63, H01L2224/71
    • H01L2224/732—Location after the connecting process
    • H01L2224/73251—Location after the connecting process on different surfaces
    • H01L2224/73265—Layer and wire connectors
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
    • H01L2924/181—Encapsulation
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
    • H01L33/50—Wavelength conversion elements
    • H01L33/501—Wavelength conversion elements characterised by the materials, e.g. binder
    • H01L33/502—Wavelength conversion materials

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Inorganic Chemistry (AREA)
  • Materials Engineering (AREA)
  • Organic Chemistry (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Luminescent Compositions (AREA)

Abstract

본 발명은 질화물계 형광체의 제조방법에 관한 것으로서, 더욱 상세하게는 유로피움을 활성제로 사용하고, 알칼리토금속과 규소를 주성으로 하는 실리케이트계 전구체를 원료물질로 사용하여 질화규소(Si3N4) 단독 화합물 또는 질화규소(Si3N4)와 이산화규소(SiO2)의 혼합물과 소성시켜 질화물계 형광체를 제조하는 방법에 관한 것이다.
PCT/KR2011/001304 2010-02-25 2011-02-24 실리케이트계 전구체를 이용한 질화물계 형광체의 제조방법 WO2011105836A2 (ko)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
KR10-2010-0017302 2010-02-25
KR20100017302 2010-02-25

Publications (2)

Publication Number Publication Date
WO2011105836A2 WO2011105836A2 (ko) 2011-09-01
WO2011105836A3 true WO2011105836A3 (ko) 2012-01-05

Family

ID=44507448

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/KR2011/001304 WO2011105836A2 (ko) 2010-02-25 2011-02-24 실리케이트계 전구체를 이용한 질화물계 형광체의 제조방법

Country Status (2)

Country Link
KR (1) KR101196847B1 (ko)
WO (1) WO2011105836A2 (ko)

Families Citing this family (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR101389089B1 (ko) * 2011-06-16 2014-04-29 한국화학연구원 금속실리콘산질화물계 형광체를 이용한 실리콘질화물계 형광체의 제조 방법
KR101356962B1 (ko) * 2011-10-17 2014-02-04 한국과학기술원 산화물계 녹색 형광체 및 그의 제조방법 및 이를 이용한 백색 ｌｅｄ
KR101905547B1 (ko) * 2011-12-06 2018-11-30 엘지이노텍 주식회사 형광체 및 형광체 제조방법
KR101639992B1 (ko) 2015-06-04 2016-07-15 한국화학연구원 알칼리토금속 실리케이트를 이용한 산질화물계 형광체의 제조방법

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP1104799A1 (en) * 1999-11-30 2001-06-06 Patent-Treuhand-Gesellschaft für elektrische Glühlampen mbH Red emitting luminescent material
JP2006206729A (ja) * 2005-01-27 2006-08-10 National Institute For Materials Science 蛍光体とその製造方法および発光器具
JP2006257385A (ja) * 2004-09-09 2006-09-28 Showa Denko Kk 酸窒化物系蛍光体及びその製造法
KR20060109431A (ko) * 2003-11-19 2006-10-20 마쯔시다덴기산교 가부시키가이샤 니트리도실리케이트계 화합물의 제조방법,니트리도실리케이트 형광체 및 니트리도실리케이트형광체를 이용한 발광장치

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP1104799A1 (en) * 1999-11-30 2001-06-06 Patent-Treuhand-Gesellschaft für elektrische Glühlampen mbH Red emitting luminescent material
KR20060109431A (ko) * 2003-11-19 2006-10-20 마쯔시다덴기산교 가부시키가이샤 니트리도실리케이트계 화합물의 제조방법,니트리도실리케이트 형광체 및 니트리도실리케이트형광체를 이용한 발광장치
JP2006257385A (ja) * 2004-09-09 2006-09-28 Showa Denko Kk 酸窒化物系蛍光体及びその製造法
JP2006206729A (ja) * 2005-01-27 2006-08-10 National Institute For Materials Science 蛍光体とその製造方法および発光器具

Also Published As

Publication number Publication date
WO2011105836A2 (ko) 2011-09-01
KR101196847B1 (ko) 2012-11-01
KR20110097735A (ko) 2011-08-31

Similar Documents

Publication Publication Date Title
EP2610217A4 (en) SILICON NITRIDE SILICON NITRIDE POWDER WITH SILICON NITRIDE, LUMINOPHORE USING SAME, USING THE SAME, USING LUMINOPHORE, USING SAME, LUMINOPHORE EN (Sr, Ca) AlSiN3, LUMINOPHORE LA3Si6N11 USING THE SAME AND METHODS FOR PRODUCING THE SAME LUMINOPHORES
MX2010002902A (es) Pirimidinas anti-infecciosas y usos de las mismas.
WO2013102222A8 (en) Nitride phosphors with interstitial cations for charge balance
WO2011031896A3 (en) Pi3 kinase inhibitors and uses thereof
MY148323A (en) Stable, high rate silicon slurry
PH12013500365A1 (en) Anti-infective agents and uses thereof
WO2014014975A8 (en) Red-emitting nitride-based calcium-stabilized phosphors
MX2009006035A (es) Composiciones surfactantes concentradas.
TW201129659A (en) Composition and method for polishing bulk silicon
MY160437A (en) Surface-modified conversion phosphors
PH12013502448A1 (en) Processes and intermediates for making sweet taste enhancers
WO2011008936A3 (en) Cementitious compositions for decreasing the rate of water vapor emissions from concrete and methods for preparing and using the same
WO2009067578A3 (en) New vitamin d receptor activators and methods of making
WO2012044026A3 (ko) 형광체 및 이의 제조방법
WO2009157019A3 (en) Process for preparing ezetimibe using novel allyl intermediates
WO2011105836A3 (ko) 실리케이트계 전구체를 이용한 질화물계 형광체의 제조방법
EP2423293A3 (en) Process for production of SiAlON oxynitride phosphors
EP2245113A4 (en) PHOSPHORESCENT COMPOSITIONS, METHODS FOR PREPARING THE COMPOSITIONS, AND METHODS OF USING THE COMPOSITIONS
MX2009006750A (es) Derivados de azaadamantano espirociclicos y metodos de uso.
WO2014056713A3 (en) Oral care composition
WO2010065278A3 (en) Sealing composition for sealing aluminum nitride and aluminum oxynitride ceramics
WO2010116342A3 (en) Non-steroidal compounds for androgen receptor modulation, processes for the preparation and uses thereof
CA2864342A1 (en) Solid forms comprising inhibitors of hcv ns5a, compositions thereof, and uses therewith
WO2011130072A3 (en) Composition and method for polishing bulk silicon
WO2011146697A3 (en) High strength diamond-sic compacts and method of making same

Legal Events

Date Code Title Description
121 Ep: the epo has been informed by wipo that ep was designated in this application

Ref document number: 11747726

Country of ref document: EP

Kind code of ref document: A2

NENP Non-entry into the national phase

Ref country code: DE

122 Ep: pct application non-entry in european phase

Ref document number: 11747726

Country of ref document: EP

Kind code of ref document: A2