WO2011105448A1

WO2011105448A1 - Printing plate, thin film manufacturing method using the same, and organic el element manufacturing method

Info

Publication number: WO2011105448A1
Application number: PCT/JP2011/054026
Authority: WO
Inventors: 行一六原
Original assignee: 住友化学株式会社
Priority date: 2010-02-25
Filing date: 2011-02-23
Publication date: 2011-09-01
Also published as: JP2011173359A; TW201213160A

Abstract

The disclosed printing plate is further provided with a first film more flexible than the glass plate, which is covered by the first film. The first film is disposed between the glass plate and protrusions, which are disposed so as to contact the first film. The printing plate is further provided with a second film which is more flexible than the glass plate, which is disposed between the first film and the second film, and protrusions are provided on the first film. Optimally, both the first film and the second film are configured from the same material.

Description

Printing plate, method for producing thin film using the same, and method for producing organic EL element

The present invention relates to a printing plate, a method for producing a thin film using the printing plate, and a method for producing an organic EL (Electro Luminescence) element using the printing plate.

As a plate printing method capable of applying a pattern of ink to a printing medium, a relief printing method and an intaglio printing method are known. On the surface of the printing plate used in the plate printing method, irregularities of a predetermined pattern corresponding to the printing pattern are formed. At the time of printing, first, ink is held on the convex portion or concave portion of the printing plate, and this is pressed against the printing material, whereby the ink is applied in a pattern (see, for example, Patent Document 1).

JP 2006-252787 A

At present, printing plates made of resin or rubber are frequently used in the plate printing method, but this printing plate is slightly deformed and changes its dimensions when used. Therefore, even if a printing plate on which a concavo-convex pattern is formed with high accuracy is used, the printing pattern may slightly deviate from the intended pattern.

Especially in the printing field where fine pattern coating is required, even a slight misalignment of the print pattern may not be allowed. For example, in the field of display devices that use organic EL elements as light sources for pixels, highly precise pattern coating is required. In the display device, a large number of organic EL elements are arranged in a matrix with slight intervals in the row direction and the column direction, respectively. An organic EL layer constituting a part of the organic EL element can be formed by a coating method, and it has been studied to form this organic EL layer by a plate printing method. In this case, it is necessary to pattern-apply ink containing the material used as an organic EL layer in the position corresponding to a pixel. Since each pixel is arranged in a fine pattern, it is difficult to selectively apply ink to all the pixels only by slightly changing the dimensions of the printing plate. For example, when the printing plate is aligned with reference to the pixel located at the center in the row direction, the position of the reference pixel and the printing plate match, but the size of the printing plate slightly changes. As a result, the pixel located at the end in the row direction may not match the printing plate. Then, for example, the ink to be applied to the adjacent pixel may be applied to an unintended pixel. Particularly in the case of manufacturing a display device with a large screen, since the area to be printed becomes large, it becomes more difficult to accurately apply ink to all the pixels.

Therefore, an object of the present invention is to provide a printing plate capable of applying a highly accurate pattern.

The printing plate of the present invention includes a glass plate and a convex portion provided on the glass plate.

Moreover, it is preferable that the printing plate of the present invention further includes a first film exhibiting higher flexibility than the glass plate, and the glass plate is covered with the first film.

In the printing plate of the present invention, it is preferable that the first film is provided between the glass plate and the convex portion, and the convex portion is provided in contact with the first film.

The printing plate of the present invention further includes a second film exhibiting higher flexibility than the glass plate, and the glass plate is provided between the first film and the second film, The convex portion is preferably provided on the first film.

In the printing plate of the present invention, it is preferable that the first film and the second film are made of the same material.

In the method for producing a thin film of the present invention, it is preferable that the printing plate is used to print ink on a printing material and solidify the ink to form a thin film.

Moreover, the manufacturing method of the organic EL element of this invention is a manufacturing method of an organic EL element provided with a pair of electrodes and the organic EL layer provided between the electrodes, and forms one electrode of the pair of electrodes. A step of printing an organic EL ink containing a material to be the organic EL layer on the one electrode using the printing plate, and solidifying the organic EL ink, and an organic EL ink is formed on the one electrode. A step of forming a layer, and a step of forming the other of the pair of electrodes on the organic EL layer.

According to the present invention, a printing plate capable of applying a highly accurate pattern can be obtained.

FIG. 1 is a diagram schematically showing a printing plate according to an embodiment of the present invention. FIG. 2 is a diagram schematically showing a printing plate according to another embodiment of the present invention. FIG. 3 is a diagram schematically showing a printing plate according to still another embodiment of the present invention. FIG. 4 is a diagram schematically showing a printing plate according to still another embodiment of the present invention. FIG. 5 is a diagram schematically illustrating a printing apparatus 41 including a printing plate. FIG. 6 is a longitudinal sectional view of a display device including an organic EL element. FIG. 7 is a longitudinal sectional view of the organic EL element. FIG. 8 is a longitudinal sectional view of the organic EL element. FIG. 9 is a longitudinal sectional view of the organic EL element. FIG. 10 is a longitudinal sectional view of the organic EL element. FIG. 11 is a longitudinal sectional view of the organic EL element. FIG. 12 is a longitudinal sectional view of the organic EL element. FIG. 13 is a longitudinal sectional view of the organic EL element. FIG. 14 is a longitudinal sectional view of the organic EL element.

The printing plate of the present invention has a glass plate and a convex portion provided on the glass plate. FIG. 1 is a diagram schematically showing a printing plate according to an embodiment of the present invention. The printing plate of the present invention can be applied to both a relief printing plate and an intaglio printing plate. Hereinafter, the relief printing plate will be described. When printing is performed after removing the ink on the convex portions with a doctor blade or the like so that the ink remains only in the concave portions between the convex portions, this printing plate can also function as an intaglio printing plate.

As shown in FIG. 1, the printing plate 101 includes a glass plate 102 and a convex portion 103. In the present embodiment, the convex portion 103 is provided in contact with the glass plate 102.

On the glass plate 102, a convex portion 103 having a pattern corresponding to the pattern of the thin film of ink to be formed on the printing medium is formed. For example, when a plurality of strip-shaped thin films are formed on a printing medium, a plurality of protrusions extending in a predetermined direction with a predetermined distance from each other so as to correspond to the pattern of the strip-shaped thin film Is provided on the printing plate. Further, for example, when forming a plurality of thin films arranged in a matrix, that is, a plurality of thin films arranged at predetermined intervals in a predetermined row direction and at predetermined intervals in a predetermined column direction. In the case of forming, the printing plate is provided with a plurality of convex portions arranged in a matrix so as to correspond to the patterns of the plurality of thin films.

The glass plate is less likely to change dimensions when used. By forming the convex portions on such a glass plate, the interval between the convex portions is hardly changed, and as a result, highly accurate pattern application is possible. Since the printing plate is pressed against the printing medium at the time of printing, the printing plate is deformed by the stress at that time, and the dimensions are changed. Printing plates that are frequently used today, such as flexographic printing plates, have large dimensional changes due to stress, but glass plates are less likely to change dimensions when used, so that it is possible to apply patterns with higher accuracy than conventional printing plates. Become. In addition, for example, a glass plate has a lower coefficient of thermal expansion than a metal plate, so that even if the temperature differs between when the printing plate is prepared and when the printing plate is used, the printing plate caused by the temperature difference The change in dimensions is small. Further, the change in the size of the printing plate is small even with respect to the temperature change in the printing process. Therefore, highly accurate pattern application is possible. In particular, in this embodiment, since the convex part 103 is directly provided in contact with the glass plate 2 with a small dimensional change, the space | interval between the convex parts 103 does not change easily, and more highly accurate pattern application | coating is attained.

As will be described later, the printing plate is usually used by being wound around a cylindrical plate cylinder (see FIG. 5). Therefore, it is necessary to bend the printing plate along the surface of the plate cylinder. Although depending on the curvature of the plate cylinder surface, if the glass plate is too thick, it is difficult to bend the printing plate along the plate cylinder surface. Therefore, the glass plate is preferably thin. The thickness of the glass plate is usually 10 μm to 200 μm, preferably 10 μm to 30 μm.

The glass plate is made of, for example, soda-lime glass, borosilicate glass, or Vycor (registered trademark) glass. Vycor glass is produced by removing B ₂ O ₃ from borosilicate glass (main component: B ₂ O ₃ / SiO ₂ ), and is a product of Corning Corp., USA, where 96% of the component is silica glass. is there. These glasses are inorganic glasses made of an inorganic material. The linear expansion coefficient of the glass plate used for the printing plate is usually 0.5 × 10 ⁻⁶ to 10 × 10 ⁻⁶ / K, preferably 0.5 × 10 ⁻⁶ to 3 × 10 ⁻⁶ / K. .

The convex part 103 provided on the glass plate 102 is comprised by resin, such as acrylate resin and a polyimide, for example. The convex portion 103 is formed in a predetermined pattern by photolithography using, for example, a photosensitive resin.

FIG. 2 is a diagram schematically showing a printing plate according to another embodiment of the present invention. The printing plate 11 of the present embodiment further includes a first film 14 that exhibits higher flexibility than the glass plate 12. The flexural modulus of the film 14 is lower than that of the glass plate 12, and when a force is applied between both ends spaced apart along the surface direction by a unit distance, and each is bent, the distance and the force are the same. If so, the amount of bending of the first film 14 is larger than the amount of bending of the glass plate 12. The back surface of the glass plate 12 is covered with the first film 14. In this embodiment, the 1st film 14, the glass plate 12, and the convex part 13 are laminated | stacked in this order. The first film 14 and the glass plate 12 are bonded together via a predetermined adhesive layer AD.

The first film 14 is made of, for example, polyethylene terephthalate or polyethylene naphthalate. The thickness of the first film 14 is usually about 10 to 100 μm, and preferably 10 to 30 μm. Moreover, the 1st film 14 shows the flexibility higher than the glass plate 12, and the tensile elasticity modulus is lower than a glass plate. For example, the tensile elastic modulus of quartz glass is 70 GPa, whereas the tensile elastic modulus of the first film 14 is about 2 to 5 GPa.

The adhesive layer AD is made of, for example, an epoxy resin system, a polyimide resin system, a silicone resin system, a phenol resin system, a silicone resin system, or an acrylic resin system.

A printing plate consisting only of a glass plate and a convex portion may be broken when mounted on a plate cylinder or moved, and the operability may not be good, but it is the first that exhibits higher flexibility than a glass plate. By providing the film 14, the generation of cracks can be suppressed and the operability of the printing plate can be improved. The material of the glass plate 12 and the convex portion 13 is the same as the material of the glass plate 102 and the convex portion 103 in the embodiment of FIG. 1, and this embodiment is structurally different from the embodiment of FIG. Differ only in that the first film 14 is further provided.

FIG. 3 is a diagram schematically showing a printing plate according to still another embodiment of the present invention. The printing plate 21 of the present embodiment is different from the printing plate of the embodiment shown in FIG. That is, in the embodiment shown in FIG. 2, the convex portion is provided on the glass plate, whereas the printing plate 21 of the present embodiment has the convex portion 23 provided in contact with the first film 24. The first film 24 is provided between the glass plate 22 and the convex portion 23.

The glass plate may not have high adhesion to other members. For example, the adhesion between the convex portion and the glass plate may not be high, but by forming the convex portion 23 in contact with the first film 24 having higher adhesion than the glass plate 22, the adhesion of the convex portion can be improved. Can be improved. Thereby, durability of the printing plate can be improved. Further, an adhesive layer AD can be interposed between the first film 24 and the glass plate 22 in order to firmly fix them. The materials of the first film 24, the glass plate 22, the convex portion 23, and the adhesive layer AD are the same as the materials of the first film 14, the glass plate 12, the convex portion 13, and the adhesive layer AD of the above-described embodiment, respectively. Thus, the present embodiment is structurally different only in the stacking order as compared with the embodiment of FIG.
FIG. 4 is a diagram schematically showing a printing plate according to still another embodiment of the present invention. The printing plate 31 further includes a second film 35 that exhibits higher flexibility than the glass plate 32. The glass plate 32 is provided between the first film 34 and the second film 35, and the convex portion 33 is provided on the first film 34. That is, the printing plate 31 is configured by laminating the second film 35, the glass plate 32, the first film 34, and the convex portion 33 in this order. The first film 34 and the glass plate 32 are laminated via the adhesive layer AD1, and the glass plate 32 and the second film 35 are laminated via the adhesive layer AD2.

When two plates having different coefficients of thermal expansion are laminated, stress is generated due to the difference between the extension of one plate and the extension of the other plate, causing warpage. In particular, when a glass plate having a low coefficient of thermal expansion is used as one of the plates, the difference in elongation becomes large, so that the warpage also increases. In the present embodiment, a first stress generated between the first film 34 and the glass plate 32 by sandwiching a glass plate having a low coefficient of thermal expansion between the two films, the second film 35 and the glass The second stress generated between the plates 32 cancels out. Therefore, generation | occurrence | production of curvature is suppressed.

It is preferable that the first film 34 and the second film 35 are made of the same material. By forming the first film 34 and the second film 35 with the same material in this way, the first stress and the second stress cancel each other out, so that the occurrence of warpage is further suppressed.

Furthermore, it is preferable that the first film 34 and the second film 35 are made of the same material and have the same thickness. Thus, by using the 1st film 34 and the 2nd film 35 of the mutually same structure, since 1st stress and 2nd stress cancel each other more, generation | occurrence | production of curvature is suppressed more. The materials of the first film 34, the glass plate 32, the convex portion 33, and the adhesive layers AD1 and AD2 are the same as those of the first film 24, the glass plate 22, the convex portion 23, and the adhesive layer AD in the embodiment of FIG. The materials and thicknesses of the first film 34 and the second film 35 in the present embodiment are preferably the same, and the present embodiment is structurally compared to the embodiment of FIG. Is different only in that it further comprises a second film so 35.

Next, a method for producing a thin film using the printing plate described above will be described. FIG. 5 is a diagram schematically illustrating a printing apparatus 41 including the above-described printing plate. The printing apparatus 41 mainly includes an ink supply source 42, a transfer roll 43 to which ink is supplied from the ink supply source 42, and the printing plate (PP) to which the ink supplied to the surface of the transfer roll 43 is transferred. (A printing plate according to any of the embodiments of FIGS. 1 to 4 is shown). Hereinafter, a specific printing apparatus provided with the printing plate PP will be described. However, the configuration of the printing apparatus is not particularly limited as long as the printing plate of each of the above-described embodiments is used, and the printing plate of each of the above-described embodiments Used by being incorporated into various printing apparatuses.

As described above, the printing plate PP is usually wound around the plate cylinder 44 and used. For example, when a printing plate PP provided with stripe-shaped convex portions is used, the printing plate PP extends such that the extending direction of the convex portions coincides with the circumferential direction of the plate cylinder 44 or the convex portions extend. It is wound around the plate cylinder so that the direction coincides with the axial direction of the plate cylinder 44. In the present embodiment, the plate cylinder 44 is rotatably supported around an axis CR1 and is rotated by a driving force from the rotation drive mechanism DRV1. In FIG. 5, the plate cylinder 44 rotates clockwise as indicated by an arrow, and the printing plate rotates as the plate cylinder 44 rotates.

The transfer roll 43 is rotatably supported so that its axis CR2 is parallel to the axis CR1 of the plate cylinder 44, and rotates by the driving force from the rotation driving mechanism DRV2. In FIG. 5, it rotates counterclockwise as shown by the arrow. The transfer roll 43 is made of, for example, chromium, chromium oxide, aluminum, aluminum oxide, or the like. The transfer roll 43 may be a so-called anilox roll having irregularities formed on the surface, or may be a transfer roll having a flat surface.

The ink supply source 42 contains ink and supplies it to the transfer roll 43. In this embodiment, the slit nozzle 45 is used to supply ink to the transfer roll 43.

In the present embodiment, the printing apparatus 41 further includes a cleaning mechanism 46. The cleaning mechanism 46 cleans the ink remaining on the transfer roll 43 after the ink is transferred from the transfer roll 43 to the printing plate. For example, the cleaning mechanism 46 includes a doctor blade, and presses the doctor blade against the transfer roll 43 to scrape off ink remaining on the transfer roll 43. The transfer roll 43 may be cleaned using a predetermined rinse liquid.

The printing apparatus 41 further includes a transport table 48 that transports the printing material 47. The transport table 48 holds the printing material 47 and translates in the tangential direction of the printing plate at the same speed as the tangential speed of the printing plate. The transfer table 48 normally moves horizontally. As the transport table 48 moves, the printing medium also moves in parallel.

The ink supplied from the ink supply source 42 is supplied onto the transfer roll 43 through the slit nozzle 45. Thus, the ink roll is rotated while the ink is supplied from the slit nozzle 45, whereby an ink thin film is formed on the surface of the transfer roll 43.

Since the printing plate PP rotates while being in contact with the transfer roll 43, the ink supplied to the transfer roll 43 is sequentially transferred onto the surface of the convex portion of the printing plate PP.

The printing plate PP to which the ink is transferred in this way rotates while being pressed against the printing material 47 as well. Since the printing material 47 moves in parallel with the rotation of the printing plate PP, the ink held on the convex portions of the printing plate PP is sequentially printed on the printing material 47.

The ink remaining on the transfer roll 43 without being transferred to the printing plate PP is removed from the transfer roll 43 by the cleaning mechanism 46.

Through the above steps, a step of printing ink on the printing medium 47 using the printing plate PP is performed. Furthermore, an ink thin film can be formed by solidifying the printed ink.

The ink can be solidified by removing the solvent. The removal of the solvent is performed by, for example, natural drying, heat drying, vacuum drying, or the like. In addition, when the ink contains a material that is cured by applying light or heat, the ink may be solidified by irradiating light or applying heat after the ink is printed on the printing material 47. Good.

As described above, since the printing plate PP has little change in dimensions, there is little printing deviation, and ink can be applied in a pattern as intended.

By using the printing apparatus described above, various types of thin films can be formed on the printing material PP. For example, by appropriately adjusting the ink to be used, a conductive thin film functioning as an electrode or a wiring, an active layer of an organic photoelectric conversion element, a semiconductor layer of an organic thin film transistor, and an organic EL layer of an organic EL element described later can be formed. it can.

An organic EL element can be formed using the printing plate PP of each embodiment described above. That is, the manufacturing method of the organic EL element of the present embodiment is a manufacturing method of an organic EL element including a pair of electrodes and an organic EL layer provided between the electrodes. The step of forming, the step of printing the organic EL ink containing the material to be the organic EL layer on the one electrode using the printing plate described above, the solidifying the organic EL ink, and on the one electrode It is a manufacturing method of an organic EL element including the process of forming an organic EL layer, and the process of forming the other electrode of a pair of electrodes on the said organic EL layer.

An organic EL element is used as a pixel of a display device, for example. In such a display device, as shown in FIG. 6, a plurality of organic EL elements 1 are arranged on a support substrate 6 in a predetermined arrangement. For example, the plurality of organic EL elements 1 are arranged in a matrix on the support substrate 6. That is, the plurality of organic EL elements 1 are arranged in a line with a predetermined interval in a predetermined row direction and with a predetermined interval in a predetermined column direction.

A partition wall IW for separating the plurality of organic EL elements 1 is usually provided on the support substrate 6. The plurality of organic EL elements 1 are respectively formed in regions divided by the partition walls IW.

The partition wall IW is provided in a stripe shape or a lattice shape, for example. When the stripe-shaped partition wall IW is provided, a plurality of partition walls IW extending in a predetermined direction are provided on the substrate at a predetermined interval. Each organic EL element 1 is provided between the partition walls IW and IW, and is disposed between the partition walls IW and IW with a predetermined interval along the direction in which the partition wall IW extends. When the grid-like partition wall IW is provided, each organic EL element 1 is provided in a region divided by the grid-like partition wall IW.

In the present embodiment, a method for producing a plurality of organic EL elements 1 using the above-described printing plate PP on the substrate 6 provided with the stripe-shaped partition walls IW will be described.

First, one electrode 2 of each organic EL element 1 is formed on the support substrate 6. That is, one electrode 2 having a number corresponding to the number of organic EL elements 1 is formed on the support substrate 6. The plurality of one electrodes 2 are arranged in a matrix in a plan view.

Next, a stripe-shaped partition wall IW is formed. The stripe-shaped partition wall IW is formed between the adjacent one

electrodes

2 and 2. The partition wall IW can be formed by a photolithography method using, for example, a photosensitive resin.

Next, the organic EL layer 10 is formed. In the present embodiment, an organic EL ink containing a material that becomes the organic EL layer 10 is supplied between the stripe-shaped partition walls IW and IW, and further solidified, whereby a strip-shaped partition wall IW and IW are formed between the strip-shaped partition walls IW and IW. The organic EL layer 10 is formed. The organic EL ink is supplied between the stripe-shaped partition walls IW and IW by the printing method using the printing plate PP described above. That is, in the above-described printing method, an organic EL ink containing a material that becomes the organic EL layer 10 is used as the ink, and a stripe-shaped convex portion corresponding to the pattern between the partition walls IW and IW is formed as the printing plate PP. The printed printing plate PP is used. By supplying the organic EL ink between the partition walls IW and IW by the printing method described above and further solidifying it, the strip-shaped organic EL layer 10 can be formed between the partition walls IW and IW.

The organic EL ink used for forming the organic EL layer 10 has a solid content concentration of usually about 0.5 to 3% by weight and a viscosity of usually about 5 to 100 Cp. Since 1 cP (centipoise) = 0.001 Pa · s (Pascal second), 5 cP to 100 cP is 0.005 Pa · s to 0.1 Pa · s. The solvent or dispersion medium of the organic EL ink may be any solvent that uniformly dissolves or disperses the material that becomes the organic EL layer. For example, chlorinated solvents such as chloroform, methylene chloride, dichloroethane, ether solvents such as tetrahydrofuran, aromatic hydrocarbon solvents such as toluene and xylene, ketone solvents such as acetone and methyl ethyl ketone, ethyl acetate, butyl acetate, and ethyl cellosolve An ester solvent such as acetate and water can be appropriately used as a solvent or a dispersion medium. The film thickness of the organic EL layer is usually about 30 nm to 120 nm.

Between the pair of

electrodes

2 and 5, not only one organic EL layer but also a plurality of organic EL layers are provided as necessary. The organic EL layer 10 means all layers provided between the pair of

electrodes

2 and 5. Between the pair of electrodes, at least one light emitting layer is provided as an organic EL layer. When a plurality of organic EL layers are provided, at least one organic EL layer is formed by a printing method using the above-described printing plate. Of the plurality of organic EL layers, the organic EL layer that can be formed by a coating method is preferably formed by a printing method using the printing plate described above. In the case of a color display device, it is necessary to coat organic EL inks that emit red, green, and blue colors between predetermined partitions. In this case, the organic EL ink of each color can be applied separately by forming the pattern of the convex portion of the printing plate so as to correspond to the pattern to which the organic EL ink of each color is supplied.

After forming the organic EL layer, the other electrode is formed on the organic EL layer. As a result, a plurality of organic EL layers are formed on the substrate.

In the present embodiment, the method of forming the plurality of organic EL elements 1 on the substrate 6 on which the stripe-shaped partition walls IW are formed has been described. However, the plurality of organic EL elements are formed on the substrate on which the lattice-shaped partition walls are formed. Even if it is the method of forming, the organic EL layer of each organic EL element can be formed by the printing method mentioned above. In this case, a printing plate on which a plurality of convex portions arranged in a matrix is formed so as to correspond to the matrix pattern divided by the grid-like partition walls may be used.

<Configuration of organic EL element>
The organic EL element can have various layer configurations. The layer structure of the organic EL element, the configuration of each layer, and the method for forming each layer will be described in more detail below.

The organic EL element includes a pair of

electrodes

2 and 5 and one or a plurality of organic EL layers 10 provided between the

electrodes

2 and 5, and at least one layer of light emission as one or a plurality of organic EL layers. Has a layer. Note that the organic EL element may include a layer containing an inorganic substance and an organic substance, an inorganic layer, or the like. The organic substance constituting the organic layer may be a low molecular compound or a high molecular compound, or a mixture of a low molecular compound and a high molecular compound. The organic layer preferably contains a polymer compound, and preferably contains a polymer compound having a polystyrene-equivalent number average molecular weight of 10 ³ to 10 ⁸ .

Examples of the organic EL layer provided between the cathode and the light emitting layer include an electron injection layer, an electron transport layer, and a hole blocking layer. When both the electron injection layer and the electron transport layer are provided between the cathode and the light emitting layer, the layer close to the cathode is called an electron injection layer, and the layer close to the light emitting layer is called an electron transport layer. Examples of the organic EL layer provided between the anode and the light emitting layer include a hole injection layer, a hole transport layer, and an electron block layer. When both the hole injection layer and the hole transport layer are provided, a layer close to the anode is referred to as a hole injection layer, and a layer close to the light emitting layer is referred to as a hole transport layer.

The organic EL element can include a predetermined layer in addition to the light emitting layer between the pair of electrodes as described above. Examples of the organic layer 10 formed between the electrode (anode) 2 and the electrode (cathode) 5 formed on the support substrate 6 include the following structures.

As shown in FIG. 7, the organic EL element has an organic layer Y between the electrode (anode) 2 and the light emitting layer 4 and an organic layer between the electrode (cathode) 5 and the light emitting layer 4. It can be set as the structure where the layer X interposes.

As shown in FIG. 8, the organic EL element has a structure in which an organic layer Y is interposed between the electrode (anode) 2 and the light emitting layer 4, and the electrode 5 is formed directly on the light emitting layer 4. It can be set as a structure.

As the structure of the organic EL element, as shown in FIG. 9, the organic layer X is interposed between the electrode (cathode) 5 and the light emitting layer 4, and the light emitting layer 4 is in direct contact with the electrode 2. It can be.

The organic layer X may be composed of two or more kinds of organic layers X1 and X2 as shown in FIG. 10, and the organic layer Y is composed of two or more kinds of organic layers Y1 and Y2 as shown in FIG. It may be.

As the structure of the organic EL element, only the light emitting layer 4 may be formed between the anode 2 and the cathode 5 as shown in FIG.

Examples of the layer X provided between the cathode 5 and the light emitting layer 4 include an electron injection layer, an electron transport layer, and a hole blocking layer. As shown in FIG. 10, when both the electron injection layer X1 and the electron transport layer X2 are provided between the cathode 5 and the light emitting layer 4, the layer in contact with the cathode 5 is referred to as the electron injection layer X1, The layer excluding the electron injection layer X1 is referred to as an electron transport layer X2.

The electron injection layer has a function of improving the electron injection efficiency from the cathode. The electron transport layer has a function of improving electron injection from the layer in contact with the surface on the cathode side. The hole blocking layer has a function of blocking hole transport. In the case where the electron injection layer and / or the electron transport layer have a function of blocking hole transport, these layers may also serve as the hole blocking layer.

The fact that the hole blocking layer has a function of blocking hole transport makes it possible, for example, to produce an element that allows only hole current to flow, and confirm the blocking effect by reducing the current value.

Examples of the layer Y provided between the anode 2 and the light emitting layer 4 include a hole injection layer, a hole transport layer, and an electron block layer. As shown in FIG. 11, when both the hole injection layer Y1 and the hole transport layer Y2 are provided between the anode 2 and the light emitting layer 4, the layer in contact with the anode 2 is the hole injection layer. The layer excluding the hole injection layer Y1 is referred to as Y1, and is referred to as a hole transport layer Y2.

The hole injection layer has a function of improving the hole injection efficiency from the anode. The hole transport layer has a function of improving hole injection from a layer in contact with the surface on the anode side. The electron blocking layer has a function of blocking electron transport. In the case where the hole injection layer and / or the hole transport layer has a function of blocking electron transport, these layers may also serve as an electron blocking layer.

The fact that the electron blocking layer has a function of blocking electron transport makes it possible, for example, to produce an element that allows only electron current to flow, and confirm the blocking effect by reducing the current value.

Note that the electron injection layer and the hole injection layer may be collectively referred to as a charge injection layer, and the electron transport layer and the hole transport layer may be collectively referred to as a charge transport layer.

An example of a layer structure that can be taken by the organic EL element of the present embodiment is shown below.
a) Anode 2 / light emitting layer 4 / cathode 5 (see FIG. 14)
b) Anode 2 / hole injection layer Y / light emitting layer 4 / cathode 5 (see FIG. 8)
c) Anode 2 / hole injection layer Y / light emitting layer 4 / electron injection layer X / cathode 5 (see FIG. 7)
d) Anode 2 / hole injection layer Y / light emitting layer 4 / electron transport layer X / cathode 5 (see FIG. 7)
e) Anode 2 / hole injection layer Y / light emitting layer 4 / electron transport layer X2 / electron injection layer X1 / cathode 5 (see FIGS. 7 and 10)
f) Anode 2 / hole transport layer Y / light emitting layer 4 / cathode 5 (see FIG. 8)
g) Anode 2 / hole transport layer Y / light emitting layer 4 / electron injection layer X / cathode 5 (see FIG. 7)
h) Anode 2 / hole transport layer Y / light emitting layer 4 / electron transport layer X / cathode 5 (see FIG. 7)
i) Anode 2 / hole transport layer Y / light emitting layer 4 / electron transport layer X2 / electron injection layer X1 / cathode 5 (see FIGS. 7 and 10)
j) Anode 2 / hole injection layer Y1 / hole transport layer Y2 / light emitting layer 4 / cathode 5 (see FIGS. 8 and 11)
k) Anode 2 / hole injection layer Y1 / hole transport layer Y2 / light emitting layer 4 / electron injection layer X / cathode 5 (see FIGS. 7 and 11)
l) Anode 2 / hole injection layer Y1 / hole transport layer Y2 / light emitting layer 4 / electron transport layer X / cathode 5 (see FIGS. 7 and 11)
m) Anode 2 / hole injection layer Y1 / hole transport layer Y2 / light emitting layer 4 / electron transport layer X2 / electron injection layer X1 / cathode 5 (see FIGS. 7, 10 and 11)
n) Anode 2 / light emitting layer 4 / electron injection layer X / cathode 5 (see FIG. 9)
o) Anode 2 / light emitting layer 4 / electron transport layer X / cathode 5 (see FIG. 9)
p) Anode 2 / light emitting layer 4 / electron transport layer X2 / electron injection layer X1 / cathode 5 (see FIGS. 9 and 10)
(Here, the symbol “/” indicates that the layers sandwiching the symbol “/” are adjacently stacked.
same as below. )
The organic EL element of the present embodiment may have two or more light emitting layers. In any one of the layer configurations of a) to p) above, when the laminate sandwiched between the anode and the cathode is referred to as “structural unit A”, the configuration of the organic EL device having two light emitting layers is as follows. And the layer structure shown in the following q). Note that the two (structural unit A) layer structures may be the same or different.
q) Anode 2 / (structural unit A) / charge generation layer Z / (structural unit A) / cathode 5 (see FIG. 12)
Further, when “(structural unit A) / charge generation layer” is “structural unit B”, examples of the configuration of the organic EL device having three or more light emitting layers include the layer configuration shown in the following r).
r) Anode 2 / (structural unit B) x / (structural unit A) / cathode 5 (see FIG. 13)
The symbol “x” represents an integer of 2 or more, and (structural unit B) x represents a stacked body in which the structural unit B is stacked in x stages. A plurality of (structural units B) may have the same or different layer structure.

Here, the charge generation layer Z is a layer that generates holes and electrons by applying an electric field. Examples of the charge generation layer Z include a thin film made of vanadium oxide, indium tin oxide (IndiumＩｎTin Oxide: abbreviated as ITO), molybdenum oxide, or the like.

Organic EL element is usually provided on a support substrate. The organic EL element may be provided on the support substrate with the anode of the pair of electrodes including the anode and the cathode disposed closer to the support substrate than the cathode, and the cathode is disposed closer to the support substrate than the anode. May be provided on the support substrate. For example, in the above-described configurations a) to r), an organic EL element having a structure in which each layer is stacked on the support substrate in order from the right side or an organic EL element having a structure in which each layer is stacked on the support substrate from the left side may be used. .

The order of the layers to be laminated, the number of layers, and the thickness of each layer can be appropriately set in consideration of light emission efficiency and element lifetime.

Next, the material and forming method of each layer constituting the organic EL element will be described more specifically.

<Anode>
In the case of an organic EL element having a configuration in which light emitted from the light emitting layer is emitted outside the element through the anode, an electrode exhibiting optical transparency is used for the anode. As the electrode exhibiting light transmittance, a thin film of metal oxide, metal sulfide, metal or the like can be used, and an electrode having high electrical conductivity and light transmittance is preferably used. Specifically, it includes indium oxide, zinc oxide, tin oxide, indium tin oxide (abbreviated as ITO), indium zinc oxide (abbreviated as IZO), gold, platinum, silver, copper, and the like. A thin film is used, and among these, a thin film made of ITO, IZO, or tin oxide is preferably used. Examples of a method for producing the anode include a vacuum deposition method, a sputtering method, an ion plating method, and a plating method. Further, an organic transparent conductive film such as polyaniline or a derivative thereof, polythiophene or a derivative thereof may be used as the anode.

The film thickness of the anode is appropriately set in consideration of the required characteristics and the simplicity of the film forming process, and is, for example, 10 nm to 10 μm, preferably 20 nm to 1 μm, and more preferably 50 nm to 500 nm.

<Hole injection layer>
As the hole injection material constituting the hole injection layer, oxides such as vanadium oxide, molybdenum oxide, ruthenium oxide, and aluminum oxide, phenylamine type, starburst type amine type, phthalocyanine type, amorphous carbon, polyaniline, And polythiophene derivatives.

Examples of the method for forming the hole injection layer include film formation from a solution containing a hole injection material. For example, a hole injection layer can be formed by coating a film containing a hole injection material by a predetermined coating method and solidifying the solution.

As coating methods, spin coating method, casting method, micro gravure coating method, gravure coating method, bar coating method, roll coating method, wire bar coating method, dip coating method, spray coating method, screen printing method, flexographic printing method, offset A printing method, an inkjet printing method, etc. can be mentioned, It is preferable to form by the printing method using the printing plate mentioned above as one Embodiment.

The film thickness of the hole injection layer is appropriately set in consideration of the required characteristics and the simplicity of the film forming process, and is, for example, 1 nm to 1 μm, preferably 2 nm to 500 nm, more preferably 5 nm to 200 nm. is there.

<Hole transport layer>
As the hole transport material constituting the hole transport layer, polyvinylcarbazole or a derivative thereof, polysilane or a derivative thereof, a polysiloxane derivative having an aromatic amine in a side chain or a main chain, a pyrazoline derivative, an arylamine derivative, a stilbene derivative, Triphenyldiamine derivative, polyaniline or derivative thereof, polythiophene or derivative thereof, polyarylamine or derivative thereof, polypyrrole or derivative thereof, poly (p-phenylene vinylene) or derivative thereof, or poly (2,5-thienylene vinylene) or Examples thereof include derivatives thereof.

Among these, hole transport materials include polyvinyl carbazole or derivatives thereof, polysilane or derivatives thereof, polysiloxane derivatives having aromatic amine compound groups in the side chain or main chain, polyaniline or derivatives thereof, polythiophene or derivatives thereof, poly Preferred is a polymeric hole transport material such as arylamine or a derivative thereof, poly (p-phenylene vinylene) or a derivative thereof, or poly (2,5-thienylene vinylene) or a derivative thereof, more preferably polyvinyl carbazole or a derivative thereof. , Polysilane or a derivative thereof, and a polysiloxane derivative having an aromatic amine in the side chain or main chain. In the case of a low-molecular hole transport material, it is preferably used by being dispersed in a polymer binder.

The method for forming the hole transport layer is not particularly limited, but in the case of a low molecular hole transport material, film formation from a mixed solution containing a polymer binder and a hole transport material can be exemplified. Examples of molecular hole transport materials include film formation from a solution containing a hole transport material.

As a film formation method from a solution, the same coating method as the above-described film formation method of the hole injection layer can be exemplified.

As the polymer binder to be mixed, those that do not extremely inhibit charge transport are preferable, and those that weakly absorb visible light are preferably used. For example, polycarbonate, polyacrylate, polymethyl acrylate, polymethyl methacrylate, polystyrene, poly Examples thereof include vinyl chloride and polysiloxane.

The film thickness of the hole transport layer is set in consideration of the required characteristics and the simplicity of the film forming process, and is, for example, 1 nm to 1 μm, preferably 2 nm to 500 nm, more preferably 5 nm to 200 nm. .

<Light emitting layer>
The light emitting layer is usually formed of an organic substance that mainly emits fluorescence and / or phosphorescence, or an organic substance and a dopant that assists the organic substance. The dopant is added, for example, in order to improve the luminous efficiency and change the emission wavelength. In addition, the organic substance which comprises a light emitting layer may be a low molecular compound or a high molecular compound, and when forming a light emitting layer by the apply | coating method, it is preferable that a light emitting layer contains a high molecular compound. The number average molecular weight in terms of polystyrene of the polymer compound constituting the light emitting layer is, for example, about 10 ³ to 10 ⁸ . Examples of the light emitting material constituting the light emitting layer include the following dye materials, metal complex materials, polymer materials, and dopant materials.

(Dye material)
Examples of dye-based materials include cyclopentamine derivatives, tetraphenylbutadiene derivative compounds, triphenylamine derivatives, oxadiazole derivatives, pyrazoloquinoline derivatives, distyrylbenzene derivatives, distyrylarylene derivatives, pyrrole derivatives, thiophene ring compounds. Pyridine ring compounds, perinone derivatives, perylene derivatives, oligothiophene derivatives, oxadiazole dimers, pyrazoline dimers, quinacridone derivatives, coumarin derivatives, and the like.

(Metal complex materials)
Examples of metal complex materials include rare earth metals such as Tb, Eu, and Dy, or Al, Zn, Be, Ir, Pt, etc. as a central metal, and oxadiazole, thiadiazole, phenylpyridine, phenylbenzimidazole, quinoline. Examples include metal complexes having a structure as a ligand, for example, iridium complexes, platinum complexes and other metal complexes having light emission from a triplet excited state, aluminum quinolinol complexes, benzoquinolinol beryllium complexes, benzoxazolyl zinc A complex, a benzothiazole zinc complex, an azomethylzinc complex, a porphyrin zinc complex, a phenanthroline europium complex, and the like can be given.

(Polymer material)
As polymer materials, polyparaphenylene vinylene derivatives, polythiophene derivatives, polyparaphenylene derivatives, polysilane derivatives, polyacetylene derivatives, polyfluorene derivatives, polyvinylcarbazole derivatives, the above dye materials and metal complex light emitting materials are polymerized. The thing etc. can be mentioned.

Among the luminescent materials described above, materials that emit blue light include distyrylarylene derivatives, oxadiazole derivatives, and polymers thereof, polyvinylcarbazole derivatives, polyparaphenylene derivatives, polyfluorene derivatives, and the like. Of these, polymer materials such as polyvinyl carbazole derivatives, polyparaphenylene derivatives, and polyfluorene derivatives are preferred.

In addition, examples of materials that emit green light include quinacridone derivatives, coumarin derivatives, and polymers thereof, polyparaphenylene vinylene derivatives, polyfluorene derivatives, and the like. Of these, polymer materials such as polyparaphenylene vinylene derivatives and polyfluorene derivatives are preferred.

Examples of materials that emit red light include coumarin derivatives, thiophene ring compounds, and polymers thereof, polyparaphenylene vinylene derivatives, polythiophene derivatives, and polyfluorene derivatives. Among these, polymer materials such as polyparaphenylene vinylene derivatives, polythiophene derivatives, polyfluorene derivatives and the like are preferable.
(Dopant material)
Examples of the dopant material include perylene derivatives, coumarin derivatives, rubrene derivatives, quinacridone derivatives, squarylium derivatives, porphyrin derivatives, styryl dyes, tetracene derivatives, pyrazolone derivatives, decacyclene, phenoxazone, and the like. Note that the thickness of such a light emitting layer is usually about 2 nm to 200 nm.

Examples of the method for forming the light emitting layer include a method of forming a film from a solution, a vacuum deposition method, and a transfer method.

As a method of applying a solution in film formation from a solution, a spin coating method, a casting method, a micro gravure coating method, a gravure coating method, a bar coating method, a roll coating method, a wire bar coating method, a dip coating method, a slit coating method Coating methods such as capillary coating method, spray coating method and nozzle printing method, and coating methods such as gravure printing method, screen printing method, flexographic printing method, offset printing method, reverse printing method, inkjet printing method, etc. It is preferable to form by the printing method using the printing plate described above as one embodiment.

<Electron transport layer>
As the electron transport material constituting the electron transport layer, known materials can be used, such as oxadiazole derivatives, anthraquinodimethane or derivatives thereof, benzoquinone or derivatives thereof, naphthoquinone or derivatives thereof, anthraquinones or derivatives thereof, tetracyanoanthra Quinodimethane or derivatives thereof, fluorenone derivatives, diphenyldicyanoethylene or derivatives thereof, diphenoquinone derivatives, or metal complexes of 8-hydroxyquinoline or derivatives thereof, polyquinoline or derivatives thereof, polyquinoxaline or derivatives thereof, polyfluorene or derivatives thereof, etc. Can be mentioned.

Among these, electron transport materials include oxadiazole derivatives, benzoquinone or derivatives thereof, anthraquinones or derivatives thereof, metal complexes of 8-hydroxyquinoline or derivatives thereof, polyquinoline or derivatives thereof, polyquinoxaline or derivatives thereof, polyfluorenes Or a derivative thereof, preferably 2- (4-biphenylyl) -5- (4-tert-butylphenyl) -1,3,4-oxadiazole, benzoquinone, anthraquinone, tris (8-quinolinol) aluminum, and polyquinoline. preferable.

There are no particular restrictions on the method for forming the electron transport layer, but for low molecular weight electron transport materials, vacuum deposition from powder or film formation from a solution or a molten state can be exemplified. Examples of the material include film formation from a solution or a molten state. In the case of forming a film from a solution or a molten state, a polymer binder may be used in combination. Examples of the method for forming an electron transport layer from a solution include the same film formation method as the method for forming a hole injection layer from a solution described above.

The film thickness of the electron transport layer is appropriately set in consideration of the required characteristics and the simplicity of the film forming process, and is, for example, 1 nm to 1 μm, preferably 2 nm to 500 nm, more preferably 5 nm to 200 nm. .

<Electron injection layer>
As a material constituting the electron injection layer, an optimal material is appropriately selected according to the type of the light emitting layer, and an alloy containing one or more of alkali metals, alkaline earth metals, alkali metals and alkaline earth metals, Alkali metal or alkaline earth metal oxides, halides, carbonates, mixtures of these substances, and the like can be given. Examples of alkali metals, alkali metal oxides, halides, and carbonates include lithium, sodium, potassium, rubidium, cesium, lithium oxide, lithium fluoride, sodium oxide, sodium fluoride, potassium oxide, potassium fluoride , Rubidium oxide, rubidium fluoride, cesium oxide, cesium fluoride, lithium carbonate, and the like. Examples of alkaline earth metals, alkaline earth metal oxides, halides and carbonates include magnesium, calcium, barium, strontium, magnesium oxide, magnesium fluoride, calcium oxide, calcium fluoride, barium oxide, Examples thereof include barium fluoride, strontium oxide, strontium fluoride, and magnesium carbonate. The electron injection layer may be composed of a laminate in which two or more layers are laminated, and examples thereof include LiF / Ca. The electron injection layer is formed by vapor deposition, sputtering, printing, or the like. The thickness of the electron injection layer is preferably about 1 nm to 1 μm.

<Cathode>
A material for the cathode is preferably a material having a low work function, easy electron injection into the light emitting layer, and high electrical conductivity. Moreover, in the organic EL element of the structure which takes out light from an anode side, in order to reflect the light emitted from a light emitting layer to an anode side with a cathode, the material with a high visible light reflectance is preferable as a material of a cathode. As the cathode, for example, an alkali metal, an alkaline earth metal, a transition metal, a Group 13 metal of the periodic table, or the like can be used. Examples of the cathode material include lithium, sodium, potassium, rubidium, cesium, beryllium, magnesium, calcium, strontium, barium, aluminum, scandium, vanadium, zinc, yttrium, indium, cerium, samarium, europium, terbium, ytterbium, and the like. A metal, two or more alloys of the metals, one or more of the metals, and one or more of gold, silver, platinum, copper, manganese, titanium, cobalt, nickel, tungsten, tin An alloy, graphite, or a graphite intercalation compound is used. Examples of alloys include magnesium-silver alloys, magnesium-indium alloys, magnesium-aluminum alloys, indium-silver alloys, lithium-aluminum alloys, lithium-magnesium alloys, lithium-indium alloys, calcium-aluminum alloys, and the like. it can. As the cathode, a transparent conductive electrode made of a conductive metal oxide, a conductive organic material, or the like can be used. Specifically, examples of the conductive metal oxide include indium oxide, zinc oxide, tin oxide, ITO, and IZO, and examples of the conductive organic substance include polyaniline or a derivative thereof, polythiophene or a derivative thereof, and the like. The cathode may be composed of a laminate in which two or more layers are laminated. The electron injection layer may be used as a cathode.

The thickness of the cathode is appropriately set in consideration of the required characteristics and the simplicity of the film forming process, and is, for example, 10 nm to 10 μm, preferably 20 nm to 1 μm, and more preferably 50 nm to 500 nm.

Examples of the method for producing the cathode include a vacuum deposition method, a sputtering method, and a laminating method in which a metal thin film is thermocompression bonded.

(Letterpress printing plate)
As the relief printing plate, a glass with ribs manufactured by Micro Engineering Laboratory was used. In this bendable glass, a PEN (polyethylene naphthalate) film is bonded to the back surface of the glass plate with an adhesive, and a polyester resin is used as a photosensitive resin on the surface of the glass plate. Ribs were formed on the glass plate by photolithography. The PEN film has a thickness of 125 μm, the glass plate has a thickness of 150 μm, and the adhesive layer has a thickness of 25 μm. The glass material is soda glass. On the glass plate, a plurality of convex portions extending in parallel with each other were arranged with a certain interval. That is, a stripe-shaped convex portion was formed. The width of each convex portion was 60 μm, the height was 50 μm, and the interval between adjacent convex portions was 240 μm (that is, the pitch was 300 μm).

(Preparation of substrate)
A transparent glass plate having a size of 200 mm (length) × 200 mm (width) × 0.7 mm (thickness) was prepared as an object to be coated.

(Preparation of organic EL ink)
A mixed solvent comprising 90 parts by weight of anisole and 10 parts by weight of cyclohexylbenzene was prepared, and an organic light emitting material was dissolved in the mixed solvent at a concentration of 1% by weight to prepare an organic EL ink. As the organic light emitting material, a polymer light emitting material (trade name “Green 1300” manufactured by Sumation Co., Ltd.) was used. The viscosity of the prepared organic EL ink was 25 cP (0.025 Pa · S).

(printing)
Printing was performed using a “printed printing experimental apparatus” manufactured by Dainippon Screen Mfg. Co., Ltd., which operates in the same manner as the printing apparatus schematically shown in FIG. The printing plate prepared above was used for the printing plate. The printing plate was installed on the plate cylinder so that the extending direction of the convex portion coincided with the circumferential direction of the plate cylinder. As described above, first, using a slit nozzle (slit width 220 mm, slit gap 50 μm), the organic EL ink was supplied to a transfer roll whose surface was made of chromium oxide, and a thin film of organic EL ink was formed on the surface of the transfer roll. . Further, the printing plate was pressed against the transfer roll so that the convex part of the printing plate was pressed into the transfer roll by 20 μm, and the organic EL ink was transferred from the transfer roll to the convex part of the printing plate. Next, the printing plate was pressed against the glass substrate so that the convex portion of the printing plate was pressed into the glass substrate by 20 μm. Thereafter, the organic EL ink was dried to obtain a plurality of strip-shaped thin films. The length of each thin film in the extending direction was 80 mm.

(Dimension measurement)
Of a plurality of strip-like thin films, the distance between the center position in the width direction of one thin film located at one end and the center position in the width direction of one thin film located at the other end (hereinafter, distance between centers) Measured). A length measuring machine (AMIC-300 manufactured by Sokkia) was used for the measurement. In the above printing, a printing plate designed to have a center-to-center distance of 145 mm was used. The center-to-center distance of the formed thin film was within the range of 145 μm to ± 3 μm over the extending direction of the thin film, and good results were obtained.

(Comparative example)
A plurality of strip-shaped thin films were formed in the same manner as in Example 1 except that only the printing plate was different from that in the example. A flexographic printing plate (material: polyester resin) was used as the printing plate. The design of the convex pattern is the same as in the embodiment.

(Dimension measurement)
The center-to-center distance was measured in the same manner as in the example. The center-to-center distance was 20 μm wider than the set value 145 mm.

DESCRIPTION OF SYMBOLS 101 Printing plate 102 Glass plate 103 Convex part 11 Printing plate 12 Glass plate 13 Convex part 14 Film 21 Printing plate 22 Glass plate 23 Convex part 24 Film 31 Printing plate 32 Glass plate 33 Convex part 34 Film 35 Film 41 Printing apparatus 42 Ink supply Source 43 Transfer roll 44 Plate cylinder 45 Slit nozzle 46 Cleaning mechanism 47 Substrate 48 Table

Claims

A glass plate,
A convex portion provided on the glass plate;
Printing plate with.
A first film showing higher flexibility than the glass plate,
The glass plate is covered with the first film,
The printing plate according to claim 1.
The first film is provided between the glass plate and the convex portion,
The convex portion is provided in contact with the first film,
The printing plate according to claim 2.
A second film showing higher flexibility than the glass plate,
The glass plate is provided between the first film and the second film,
The convex portion is provided on the first film.
The printing plate according to claim 2 or 3.
The first film and the second film are made of the same material,
The printing plate according to claim 4.
A method for producing a thin film, in which an ink is printed on a printing medium using the printing plate according to any one of claims 1 to 5, and the film is solidified to form a thin film.
A method for producing an organic EL element comprising a pair of electrodes and an organic EL layer provided between the electrodes,
Forming one of the pair of electrodes;
Printing an organic EL ink containing a material to be the organic EL layer on the one electrode using the printing plate according to any one of claims 1 to 5;
Solidifying the organic EL ink and forming an organic EL layer on the one electrode;
Forming the other of the pair of electrodes on the organic EL layer;
The manufacturing method of an organic EL element provided with.