WO2011098428A1 - Method for metallising objects which have at least two different plastics on the surface - Google Patents
Method for metallising objects which have at least two different plastics on the surface Download PDFInfo
- Publication number
- WO2011098428A1 WO2011098428A1 PCT/EP2011/051757 EP2011051757W WO2011098428A1 WO 2011098428 A1 WO2011098428 A1 WO 2011098428A1 EP 2011051757 W EP2011051757 W EP 2011051757W WO 2011098428 A1 WO2011098428 A1 WO 2011098428A1
- Authority
- WO
- WIPO (PCT)
- Prior art keywords
- objects
- solution
- metallisation
- rinsing
- treatment
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Ceased
Links
Classifications
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D5/00—Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
- C25D5/02—Electroplating of selected surface areas
- C25D5/022—Electroplating of selected surface areas using masking means
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
- C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
- C23C18/1601—Process or apparatus
- C23C18/1603—Process or apparatus coating on selected surface areas
- C23C18/1607—Process or apparatus coating on selected surface areas by direct patterning
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
- C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
- C23C18/1601—Process or apparatus
- C23C18/1633—Process of electroless plating
- C23C18/1646—Characteristics of the product obtained
- C23C18/165—Multilayered product
- C23C18/1653—Two or more layers with at least one layer obtained by electroless plating and one layer obtained by electroplating
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
- C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
- C23C18/18—Pretreatment of the material to be coated
- C23C18/20—Pretreatment of the material to be coated of organic surfaces, e.g. resins
- C23C18/2006—Pretreatment of the material to be coated of organic surfaces, e.g. resins by other methods than those of C23C18/22 - C23C18/30
- C23C18/2046—Pretreatment of the material to be coated of organic surfaces, e.g. resins by other methods than those of C23C18/22 - C23C18/30 by chemical pretreatment
- C23C18/2073—Multistep pretreatment
- C23C18/2086—Multistep pretreatment with use of organic or inorganic compounds other than metals, first
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
- C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
- C23C18/18—Pretreatment of the material to be coated
- C23C18/20—Pretreatment of the material to be coated of organic surfaces, e.g. resins
- C23C18/28—Sensitising or activating
- C23C18/30—Activating or accelerating or sensitising with palladium or other noble metal
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
- C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
- C23C18/31—Coating with metals
- C23C18/32—Coating with nickel, cobalt or mixtures thereof with phosphorus or boron
- C23C18/34—Coating with nickel, cobalt or mixtures thereof with phosphorus or boron using reducing agents
- C23C18/36—Coating with nickel, cobalt or mixtures thereof with phosphorus or boron using reducing agents using hypophosphites
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
- C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
- C23C18/31—Coating with metals
- C23C18/38—Coating with copper
- C23C18/40—Coating with copper using reducing agents
- C23C18/405—Formaldehyde
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D5/00—Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
- C25D5/20—Electroplating using ultrasonic waves
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D5/00—Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
- C25D5/54—Electroplating of non-metallic surfaces
- C25D5/56—Electroplating of non-metallic surfaces of plastics
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D5/00—Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
- C25D5/627—Electroplating characterised by the visual appearance of the layers, e.g. colour, brightness or mat appearance
Definitions
- the present invention is based on a conventional method for metallising objects which have at least two different plastics on the surface.
- the objects are A) etched with an etching solution, B) treated with a solution of a colloid or with a solution of a metal compound, the metal being a metal of Group VIIIB or IB of the Periodic Table of the Elements, and C) metallised electrolytically using a metallising solution.
- Plastic objects can be metallised using an electroless metallising method or alternatively by using a direct plating method.
- the object is first cleaned and etched in both methods and then treated with a noble metal and finally metallised.
- the etching is normally undertaken using chromic acid / sulfuric acid.
- Etching solutions made on the basis of organic solvents or an alkaline or acid permanganate solution can be used as an alternative for certain plastics.
- the etching serves to make the surface of the object more accommodating for the subsequent metallisation so that the surfaces of the objects can be wetted well with the respective solutions in the following treatment steps and the deposited metal is adequately firmly bound to the surface.
- ABS copolymer acrylnitrile-butadiene-styrol- copolymer
- chromic acid / sulfuric acid in such a way that surface microcaverns are formed in which metal precipitates and subsequently firmly adheres to the surface there.
- the plastic is activated for electroless metallisation using an activator which contains a noble metal and then electrolessly metallised. A thicker metal layer can then also be applied electrolytically afterwards.
- the etched surface is usually treated with a palladium colloid solution and then with an alkaline solution which contains copper ions forming a complex with a complexing agent. Thereafter the object can then be electrolytically metallised directly (EP 1 054 081 B1 ).
- a plastic object which contains small electrically non-conductive oxide particles of a non-noble metal, for example copper, in the polymer.
- the oxide particles exposed on the surface of the object are reduced to a metal using a reducing agent such as a boron hydride.
- the object can then be coated electrolytically with metal immediately afterwards or at a later point in time.
- This document indicates a copper(l) oxide containing object being put in a water bath to be cleaned by the action of ultrasound.
- the copper(l) oxide in the object is then subsequently reduced to copper using sodium borohydride so that electrolytic copper can be deposited later on the surface of the object.
- the plastic parts to be metallised are usually manufactured using an injection moulding method. If plastic parts made out of two or more different plastics are manufactured in order to obtain different surface characteristics then they can be manufactured using a so-called multiple injection method. In this process a first plastic is injected into an injection mould and then a second plastic is injected into an injection mould having an altered form and which contains the object being produced in the injection method. Correspondingly, objects made out of three different plastics can be manufactured in an appropriate way.
- a colloidal activator made on a palladium basis is normally used in the case of plastic metallisation.
- this activator faults in the surface of the object arising from the injection moulding method are covered and therefore concealed.
- objects made in such a way can fail in a subsequent temperature testing method or only after the object is already in its final place of use and, for example, is installed in a device, since it may turn out that the metal layers deposited after activation do not sufficiently adhere to the substrate.
- activators are normally used which are specially equipped, depending on the respective requirements, concerning their composition or the operating parameters required for their use. A maximum coverage of the surfaces of the object with palladium or alternatively an optimal selectivity of the different regions of the surface of the object can be set using such activators. If different objects are manufactured in a metallisation plant, a number of containers for the different activators and optionally additional rinsing tanks have to be available, so that altogether a rather extensive plant technology is required as well as a complex plant control system and logistics.
- the invention is based on the problem that it has not been possible until now, with adequate process security, to achieve selective sharp-edged metallisation of objects on whose respective surfaces at least two different plastics are exposed to obtain secure, flawless metallisation on one of the plastics and a surface which is completely free of deposited metal on the other plastic. Therefore the object of the invention is to guarantee that the areas of the surface not to be metallised are completely free of metal after performing the metallisation step and that the areas of the surface to be metallised are completely and faultlessly covered with metal.
- the method according to the present invention is used to metallise objects which at least partially and preferably completely consist of plastic, in order to provide particularly at least one second surface area of the object fully, that is without any void and without uncoated areas, with a metal layer and to not metallise at least one first surface area, that is to leave this part of the plastic surface totally free of metal.
- the selectivity of the metallisation is made possible in that there is at least one first plastic on the surface of the object which is not coated by the metal at all and a second plastic which is coated with the metal without any voids.
- the border between both surface areas has a sharp edge which means that the surface area coated with the metal extends exactly along the surface boundary line between the first surface area and the second surface area.
- the object can partially consist of metal or another material and partially of the at least two types of plastic.
- the object fully consists of plastic, the majority of which primarily consists of one or optionally a plurality of second plastics which can adherently be metallised and of one or optionally a plurality of first plastics which cannot adherently be metallised or which cannot be metallised at all, which means that this/these plastic(s) completely refuse metal deposition.
- the object consists of one or a plurality of second plastics which can adherently be metallised and of one or a plurality of first plastics which cannot adherently be metallised and which is/are applied at least on the surface thereof to the second plastic(s) which can adherently be metallised.
- C) are finally metallised electrolytically using a metallising solution, they are additionally subjected to a treatment in a further method step, being carried out between method steps B) and C) but not during electroless depositing of metal, by being subjected to ultrasonic treatment.
- This avoids metallisation of at least one first plastic exposed on the surface of the objects while at least one second plastic exposed on the surface of the objects is metallised.
- the above-mentioned method steps A), B) and C) do not necessarily have to be performed immediately one after the other.
- further method steps such as rinsing steps and optionally further treatment steps are carried out between these method steps.
- the object is treated and/or rinsed off in at least one further method step between method steps B) and C).
- the indicated sequence of the method steps A), B) and C) must be observed, however.
- the exposure of ultrasound on the object is applied during any one of the method steps being carried out after treatment of the object with the noble metal colloid solution or with the solution of the noble metal compound according to method step B) and before electrolytically metallising the object in method step C), but not during an electroless metallisation step.
- rinsing steps can be considered for this which are normally executed between both method steps mentioned, B) and C).
- the treatment with ultrasound according to the invention has the effect that no metal coating is deposited at all on the first surface areas of the object or a deposited metal coating is completely removed.
- the conditions for metallisation on the second surface areas can be adjusted in such a way that the metallisation takes place perfectly and without any problems on these areas, which means that the metallisation conditions do not have to be adjusted in such a way that metallisation on the second plastic areas barely takes place in order to ensure that no metal deposits on the first plastic areas. It is therefore possible to open up a wider processing window for successful metallisation without having any metal deposit on the first surface areas. This guarantees a more secure method management so that faulty metallised objects are not produced.
- a second (to be metallised) plastic is an acrylnitrile-butadiene-styrol copolymer (ABS copolymer) or a polyamide or a mixture of an ABS copolymer and at least one other polymer which is different to the ABS copolymer.
- ABS copolymer acrylnitrile-butadiene-styrol copolymer
- PC polycarbonate
- a first plastic is a polycarbonate or a covering lacquer (a stop-off lacquer) used to prevent metallisation of the object.
- covering lacquer have served for a long time to selectively cover surface areas of work pieces which were to be electroplated in order to avoid depositing of metal in the covered surface areas.
- This type of covering lacquer is well known to the person skilled in the art.
- Covering lacquers can be any kind of lacquer which prevent, in particular, metal deposition and also ensure that they adhere well to the plastic body so that no electroplating liquid can penetrate at the interface between the covering lacquer and the plastic body.
- Prevention of metallisation is, for example, achieved by adding substances which inhibit electroless metallisation, for example lead compounds such as lead acetate, lead chloride or cadmium acetate.
- covering lacquers are used on the basis of solutions of tar
- At least one of the following additional method steps are performed between the method steps B) and C), wherein ultrasonic treatment may be performed in one or some or a plurality of these method steps:
- these further method steps are carried out when the objects are to be metallised using an electroless metallisation method which means that a first metal layer is applied on the objects using an electroless method.
- the method steps Ba1 ), Bb1 ), Bc1 ), Bd1 ) and Be1 ) are performed in the sequence given, but not necessarily immediately one after the other.
- a plurality of rinsing steps can be performed respectively instead of each individual of the rinsing steps Ba1 ), Bc1 ), Be1 ).
- ultrasonic treatment is performed in method step Be1 ), i.e. , during the rinsing of the objects after electroless metallization has been performed.
- the accelerating solution preferably serves to remove components of the colloid of the colloid solution according to method step B), for example a protective colloid.
- a solution of an acid is preferably used as an accelerating solution, for example sulfuric acid, hydrochloric acid, citric acid or also tetrafluoboric acid, in order to remove the protective colloid (tin compounds).
- the reducing agent solution is used if a solution of a compound of a noble metal is used in method step B), for example a hydrochloric acid solution of palladium chloride or an acid solution of a silver salt.
- the reducing agent solution in this case is also a hydrochloric acid solution and, for example, contains tin(ll) chloride, or it contains another reducing agent such as NaH 2 P0 2 or a borane or boron hydride, such as an alkali or earth alkali borane or dimethylaminoborane.
- the objects are subjected to ultrasonic treatment during at least one of the method steps Ba1 ), Bb1 ), Bc1 ), Be1 ) wherein the ultrasonic treatment can be done, if a number of rinsing steps are performed instead of just one rinsing step in one or some or in each one of the respective method steps Ba1 ), Bc1 ) or Be1 ), in one of the rinsing steps, in some of the rinsing steps or in all of the rinsing steps, which means that the objects are subjected to ultrasonic treatment in one of the method steps or a plurality of the method steps, including the rinsing steps, after treatment with the colloid solution or with the reducing agent solution, but not, on the other hand, in the method step in which the objects are electroless metallised.
- the electroless metallisation bath would not be stable under the effect of ultrasound. It is possible that catalytic nuclei deposited on the surface of the objects are stripped off by the ultrasonic treatment and, in this way, find their way into the electroless metallisation bath. They would start unintended electroless depositing of metal there. It is, however, possible that the ultrasonic treatment is performed in any one of the method steps following colloid treatment or following treatment with a reducing agent solution. If, on the other hand, a method is preferred in which the objects are not metallised electrolessly but are to be directly metallised using an electrolytic metallisation process (without electroless metallisation), then at least one of the following further method steps are performed in this further preferred embodiment of the invention between method steps B) and C):
- electrically conductive layer is formed on the surface of the objects for direct electrolytic metallisation
- the method steps Ba2), Bb2) and Bc2) are performed in the sequence given, but not necessarily immediately one after the other.
- a plurality of rinsing steps can performed respectively instead of each individual of the rinsing steps Ba2) and Bc2).
- the conversion solution preferably serves to create a sufficiently electrically conductive layer on the surface of the objects in order to subsequently allow direct electrolytic metallisation, without preceding electroless metallisation.
- the colloid of the colloid solution according to method step B) is a palladium/tin colloid then an alkaline solution containing copper ions complexed with a complexing agent is preferably used as a conversion solution.
- the conversion solution can contain an organic complexing agent such as tartaric acid or ethylenediaminetetraacetic acid and/or one of its salts such as a copper salt such as copper sulfate.
- the objects are subjected to ultrasonic treatment during at least one of the method steps Ba2), Bb2), Bc2) wherein the ultrasonic treatment can be done, when a number of rinsing steps are carried out instead of one rinsing step in one or some or in each one of the respective method steps Ba1 ), Bc1 ) or Be1 ), in one of the rinsing steps, in some of the rinsing steps or in all of these rinsing steps, which means that the objects are subjected to ultrasonic treatment in one of the method steps or a plurality of the method steps, including the rinsing steps, after treatment with the colloid solution.
- the ultrasonic treatment can be performed in any of the method steps after the colloid treatment.
- the objects are immersed in treatment tanks containing the respective solutions, with additionally at least one ultrasound emitter being in the respective solution in the treatment tank, in which an ultrasonic treatment is carried out, to expose the objects to ultrasound.
- ultrasound emitters are usually ultrasound generators and ultrasound resonators made in the form of flat plates. These generators can be located in a plane in the treatment tank for efficient ultrasonic treatment which is parallel to the plane in which the objects to be treated are located or which is arranged parallel to this plane. If the objects are, for example, fastened to a rack which has a main plane, the ultrasound generator can be located parallel to this rack plane in the tank. In this way it is possible to obtain a treatment as uniformly as possible of all of the objects fastened to the rack, as the distance between the ultrasound generator and the objects is always the same.
- the ultrasound emitter is located on one side of the objects.
- An additional ultrasound reflector or a further ultrasound emitter can be located on the other side of the objects.
- Both, the first ultrasound emitter and the second ultrasound emitter or, alternatively, the ultrasound reflector can each have a flat shape.
- the ultrasound reflector can, for example, be a metal plate, for example a stainless steel plate (reflection plate).
- the ultrasound emitter(s) for treatment of the objects are immersed in the solution in which the objects will be treated.
- the ultrasound energy in this case is transmitted from the one or more ultrasound emitters through the solution as the medium to the objects.
- an ultrasound emitter can also transmit ultrasound energy to the objects via a holder on which the objects are held, for example a rack.
- the ultrasound emitter can, for example, be placed on a receptacle for holding the rack in the treatment tank and fastened there so that the ultrasound energy is transmitted via this receptacle and the holder to the objects.
- the treatment liquids described below are preferably aqueous.
- the etching solution is a chromic acid / sulfuric acid solution.
- Such solutions typically contain 300 - 400 g/l Cr0 3 and 300 - 400 g/l of cone. H 2 S0 4 in water.
- Particularly preferred is a solution which contains Cr0 3 in a concentration of 360 - 400 g/l and a particularly preferred concentration of 375 - 385 g/l as well as H 2 S0 4 in a concentration of 360 - 400 g/l and a particularly preferred concentration of 375 - 385 g/l.
- the chromic acid / sulfuric acid can also contain a fluorosurfactant to obtain optimal wetting of the surfaces.
- the chromic acid / sulfuric acid can also contain palladium ions, for example in the form of a salt, for example palladium chloride.
- the palladium ions can be present in a concentration of, for example, 5 - 100 mg/l, particularly preferred of 7 - 50 mg/l and most preferred of 10 - 30 mg/l, based on Pd 2+ .
- the chromic acid / sulfuric acid is preferably used at a temperature above room temperature, for example at 30 - 90°C, particularly preferred at 60 - 80°C and most preferred at 65 - 75°C.
- the treatment time is preferably 5 - 30 min, particularly preferred 10 - 20 min.
- a reduction treatment in a reducing agent solution, preferably after one, preferably after a plurality of rinsing steps, for example three, during which the chromium(VI) ions remaining on the surface of the object are reduced to chromium(lll) ions.
- a reducing agent solution preferably after one, preferably after a plurality of rinsing steps, for example three, during which the chromium(VI) ions remaining on the surface of the object are reduced to chromium(lll) ions.
- an aqueous solution of sodium sulfite to do this or a hydroxylammonium salt, for example the chloride or the sulfate.
- This solution is also used at a temperature above room temperature, for example at 30 - 60°C, particularly preferred at 40 - 50°C.
- the treatment time is preferably 0.5 - 5 min, particularly preferred 1 - 3 min and most preferred 1 .5 - 2.5 min.
- etching in the chromic acid / sulfuric acid can also be etching in a sodium or potassium permanganate solution.
- This solution can be acid or alkaline.
- To be acidic it can particularly contain sulfuric acid, and to be alkaline, it can particularly contain sodium hydroxide.
- Potassium permanganate can be present in a concentration of up to about 70 g/l and sodium permanganate in a concentration of up to about 250 g/l. The lower concentration limit of each of these salts is typically 30 g/l.
- the solution is alkaline, it contains 20 - 80 g/l for example, but preferably 30 - 60 g/l NaOH. In this case it can also contain a
- fluorosurfactant to improve wetting of the surfaces of the objects.
- it can contain palladium ions, for example in the form of a palladium salt, in particular palladium chloride, in a concentration, for example, of 5 - 100 mg/l, particularly preferred 7 - 50 mg/l and most preferred 10 - 30 mg/l, based on Pd 2+ .
- the permanganate solution is preferably used at a temperature above room temperature, for example at 60 - 95°C, particularly preferred 80 - 90°C.
- the treatment time is preferably 5 - 30 min, particularly preferred 10 - 20 min.
- the objects are subjected to reduction treatment in a reducing agent solution, after rinsing off the excess permanganate solution, in one or a plurality of, preferably three, rinsing steps, in order to reduce the permanganate still adhering on the surfaces of the objects to manganese(ll) ions.
- a reducing agent solution Preferably, in this case an acid solution of hydroxylammonium sulfate or chloride is used or an acid solution of hydrogen peroxide.
- the solution of the colloid of the metal of Group VIIIB or IB of the Periodic Table of the Elements is an activator solution containing a palladium/tin colloid.
- This colloid solution preferably contains palladium chloride, tin(ll) chloride and hydrochloric acid or sulfuric acid.
- concentration of the palladium chloride is preferably 5 - 100 mg/l, particularly preferred 20 - 50 mg/l and most preferred 30 - 45 mg/l, based on Pd 2+ .
- concentration of the tin(ll) chloride is preferably 0.5 - 10 g/l, particularly preferred 1 - 5 g/l and most preferred 2 - 4 g/l, based on Sn 2+ .
- the concentration of the hydrochloric acid is preferably 100 - 300 ml/l (37% by weight of HCI).
- a palladium/tin colloid solution also preferably contains tin(IV) ions which are generated through oxidation of the tin(ll) ions.
- the temperature of the colloid solution is preferably 20 - 50°C and particularly preferred 30 - 40°C.
- the treatment time is preferably 0.5 - 10 min, particularly preferred 2 - 5 min and most preferred 3.5 - 4.5 min.
- the colloid solution can also contain another metal of Group VIIIB or IB of the Periodic Table of the Elements, for example platinum, iridium, rhodium, gold or silver or a mixture of these metals. It is basically possible for the colloid not to be stabilised with tin ions as a protective colloid but rather another protective colloid being used instead, for example an organic protective colloid like polyvinyl alcohol.
- a solution of a noble metal compound is used instead of a colloid solution, preferably a solution is used which contains an acid, in particular hydrochloric acid, and a noble metal salt.
- the noble metal salt can, for example, be a palladium salt, preferably palladium chloride, palladium sulfate or palladium acetate, or a silver salt, for example silver acetate.
- a noble metal complex can also be used , for example a palladium complex salt such as a salt of a palladium-aminopyridine complex.
- the noble metal compound is present, for example, in a concentration of 40 mg/l to 80 mg/l, based on the noble metal, for example based on Pd 2+ .
- the solution of the noble metal compound can be used at 25°C or at a temperature from 25°C to 70°C.
- the objects are preferably first brought into contact with a pre-dipping solution which has the same composition as the colloid solution but without the metal of the colloid and its protective colloid, which means that this solution, in the case of a palladium/tin colloid solution, just contains hydrochloric acid if the colloid solution also contains hydrochloric acid.
- the objects are brought directly into contact with the colloid solution after treatment in the pre-dipping solution, without rinsing off the objects. After treating the objects with the colloid solution these are typically rinsed and then brought into contact with the accelerating solution in order to remove the protective colloid from the surface of the objects.
- the objects are treated with a solution of a noble metal compound instead of a colloid solution they will be subjected to a reduction treatment after first being rinsed.
- the reducing agent solution used for these cases contains hydrochloric acid and tin(ll) chloride if the solution of the noble metal compound is a hydrochloric acid solution of palladium chloride. It is, however, preferable to use an aqueous solution of NaH 2 P0 2 .
- the objects can first be rinsed after the acceleration or treatment with reducing agent solution and then electrolessly plated with nickel, for example.
- a conventional nickel bath will serve to do this which, for example, contains a number of substances including nickel sulfate, a hypophosphite, for example sodium hypophosphite, as a reducing agent, and organic complexing agents and pH adjusting agents (for example a buffer).
- an electroless copper bath which typically contains a copper salt, for example copper sulfate or copper hypophosphite, and also a reducing agent such as formaldehyde or a hypophosphite salt, for example an alkali or ammonium salt, or hypophosphorous acid, and also one or more complexing agents such as tartaric acid, as well as a pH adjusting agent such as sodium hydroxide.
- a copper salt for example copper sulfate or copper hypophosphite
- a reducing agent such as formaldehyde or a hypophosphite salt, for example an alkali or ammonium salt, or hypophosphorous acid
- complexing agents such as tartaric acid
- pH adjusting agent such as sodium hydroxide.
- Any metal depositing baths can be used for the subsequent electrolytic metallisation, for example for depositing nickel, copper, silver, gold, tin, zinc, iron, lead or their alloys. This type of depositing bath is well known to the person skilled in the
- a Watts nickel bath is normally used as a bright nickel bath which contains nickel sulfate, nickel chloride and boric acid as well as saccharine as an additive.
- a bright copper bath a composition is used which, for example, contains copper sulfate, sulfuric acid, sodium chloride as well as organic sulfur compounds, in which the sulfur is present in a low oxidation stage, for example as an organic sulfide or disulfide, as additives.
- an electrolytic metallisation bath for example a nickel strike bath, which is preferably composed on the basis of a Watts nickel bath.
- nickel strike bath which is preferably composed on the basis of a Watts nickel bath.
- These types of baths for example contain nickel sulfate, nickel chloride and boric acid and saccharine as an additive.
- Treatment of the objects according to the method according to the invention is preferably performed in a conventional dipping process in which the objects are dipped subsequently in solutions in containers in which the respective treatment takes place.
- the objects can either be fastened to racks or filled into drums and dipped in the solutions. Fastening to racks is preferred because a more directed transmission of the ultrasound energy to the objects is possible via the racks.
- the objects can be treated in so-called conveyorized processing plants in which they lay, for example, on racks and are continuously transported in a horizontal direction through the plant and treated with ultrasound, as required.
- Fig. 1 shows a schematic diagram of a treatment tank with an object to be treated and an ultrasound emitter as well as an ultrasound reflector.
- Fig. 1 shows a treatment tank 1 which contains a treatment solution 2 which reaches the liquid level 3 in the treatment tank 1.
- the treatment liquid 2 can, for example, be a rinsing liquid or the colloid solution or an accelerating solution or also another treatment liquid in which the objects are treated according to the invention with ultrasound.
- the treatment tank 1 is designed according to the type of treatment liquid 2 for the respective treatment to fulfil the required functions in this treatment liquid 2.
- the treatment tank 1 can, for example, be equipped with a heater, a filter system, an air injection system, means for moving the objects, vibrating systems for the objects, circulating pumps, metering devices and similar items. The suitable design required for this will be well-known to the person skilled in the art and will be selected appropriately.
- a goods carrier rod 5 on the upper edge 4 of the treatment tank 1.
- This goods carrier rod 5 fully extends over the treatment tank 1.
- the rack 10 with the objects 7 is located in the middle and parallel to a vertical plane in the tank 1.
- an ultrasound emitter 8 located vertically and parallel to this plane at a distance a from the objects which is formed in the form of a plate. In this case it is fastened to the floor and to the side walls of the treatment tank 1.
- There is a second ultrasound emitter 9 in the tank also located vertically and parallel to this plane on the other side of the rack, at a distance b from the objects.
- the parts mentioned were treated in all experiments according to the processing sequence described in Tab. 1 , the respective changes being made in the treatment conditions in the individual examples compared to those given in Tab. 1 and the ultrasonic treatment being performed variously.
- the parts were respectively treated up to metallisation with bright copper for examining the selectivity of the metallisation that means complete, flawless metallisation in the areas which were to be metallised and for examining the total prevention of metallisation in those areas which were not to be metallised.
- a nickel strike instead of a copper strike (Adhemax IC copper): 1 min, 0.5 A dm 2 , up to expiry of 5 min 1 A/dm 2
- a nickel strike instead of a copper strike (Adhemax IC copper): 1 min, 0.5 A/dm 2 , up to expiry of 5 min 1 A/dm 2
- the parts were subsequently rinsed, activated, coated with bright nickel (10 min) and then coated with chromium (2 min).
- ultrasound was used in a second rinsing tank after the electroless nickel plating.
- the frequency of the ultrasound used was 40 kHz.
- Example 2 of the invention was used to treat 72 thumb lever holders fastened to a rack (with a surface of 15 dm 2 ), but with an altered activator composition (Pd 2+ : 18.9 mg/l, Sn 2+ : 1.40 g/l, HCI (37% by weight): 241 ml/l).
- ultrasound was used in this case in a second rinsing tank after the electroless nickel plating.
- the frequency of the ultrasound used was 40 kHz.
- ultrasound was also used in this case in a second rinsing tank after the electroless nickel plating.
- the frequency of the ultrasound used was again 40 kHz.
- Example 5 of the invention In one further experiment the method according to Example 4 of the invention was used to treat 162 PQ rotary knobs (with a surface of 30 dm 2 ) fastened to a rack, but with an altered activator composition (Pd 2+ : 18.9 mg/l, Sn 2+ : 1.40 g/l, HCI (37% by weight): 241 ml/l).
- an altered activator composition Pd 2+ : 18.9 mg/l, Sn 2+ : 1.40 g/l, HCI (37% by weight): 241 ml/l.
- ultrasound was also used in this case in a second rinsing tank after the electroless nickel plating.
- the frequency of the ultrasound used was again 40 kHz.
- the parts were not metallised using bright nickel and chromium.
- ultrasound was also used in this case in a second rinsing tank after the electroless nickel plating.
- the frequency of the ultrasound used was again 40 kHz.
- PQ rotary knob 9 parts were flawless while 4 parts demonstrated minimal overgrowth in the areas not to be metallised: thus 70% of all parts were flawless;
- Start/Stop press-button 8 parts were flawless; 2 parts demonstrated blow throughs which means that 80% of all parts were flawless; Thumb lever holder: all 6 parts, that is 100% of all parts were flawless;
- Tab. 3 shows the respective underlying conditions for the individual experiments whereby the respective deviations from these conditions given in Tab. 2 are listed separately.
- composition 380 g/l chromic acid (Cr0 3 ), 380 g/l H 2 S0 4 , 1 ml/l wetting agent, 12 mg/l Pd 2+ (as PdCI 2 ); (in addition about 20 g/l Cr 3+ )
- Hydroxylamine compound alternatively also a sulfide compound is possible, alternatively also in combination with admixture of mineral acid (hydrochloric acid or sulfuric acid)
- composition 20-70 ml/l 96% by weight sulfuric acid, 40-100 g/l oxalic acid, nitrate compounds
- Composition contains Ni 2+ , reducing agent, complexing agent, organic and inorganic stabilisers, ammonium compounds
- electrolytic copper bath (bright copper, acid copper bath)
Landscapes
- Chemical & Material Sciences (AREA)
- Engineering & Computer Science (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Materials Engineering (AREA)
- Metallurgy (AREA)
- Organic Chemistry (AREA)
- General Chemical & Material Sciences (AREA)
- Mechanical Engineering (AREA)
- Electrochemistry (AREA)
- Inorganic Chemistry (AREA)
- Chemically Coating (AREA)
- Electroplating Methods And Accessories (AREA)
Abstract
Description
Claims
Priority Applications (4)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2012552355A JP2013519786A (en) | 2010-02-12 | 2011-02-07 | Method for metallizing objects having at least two different plastics on the surface |
| CN201180009084.XA CN102791907B (en) | 2010-02-12 | 2011-02-07 | Object effects on surface with at least two kinds of different plastics carries out metallized method |
| US13/578,315 US20120305406A1 (en) | 2010-02-12 | 2011-02-07 | Method for Metallising Objects Which Have at Least Two Different Plastics on the Surface |
| BR112012020131A BR112012020131A2 (en) | 2010-02-12 | 2011-02-07 | method to metallize objects that have at least two different plastics on the surface |
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| EP10001464.6 | 2010-02-12 | ||
| EP10001464.6A EP2360294B1 (en) | 2010-02-12 | 2010-02-12 | Method for metallising objects with at least two different plastics on their surface |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| WO2011098428A1 true WO2011098428A1 (en) | 2011-08-18 |
Family
ID=42270001
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| PCT/EP2011/051757 Ceased WO2011098428A1 (en) | 2010-02-12 | 2011-02-07 | Method for metallising objects which have at least two different plastics on the surface |
Country Status (10)
| Country | Link |
|---|---|
| US (1) | US20120305406A1 (en) |
| EP (1) | EP2360294B1 (en) |
| JP (1) | JP2013519786A (en) |
| KR (1) | KR20120115993A (en) |
| CN (1) | CN102791907B (en) |
| BR (1) | BR112012020131A2 (en) |
| ES (1) | ES2416982T3 (en) |
| PL (1) | PL2360294T3 (en) |
| PT (1) | PT2360294E (en) |
| WO (1) | WO2011098428A1 (en) |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103220884A (en) * | 2012-01-18 | 2013-07-24 | 光宏精密股份有限公司 | Circuit substrate structure and manufacturing method thereof |
| US11047052B2 (en) | 2014-07-10 | 2021-06-29 | Okuno Chemical Industries Co., Ltd. | Resin plating method |
| DE102021117567A1 (en) | 2021-07-07 | 2023-01-12 | Leibniz-Institut Für Polymerforschung Dresden E.V. | Process for the selective coating of multi-component plastic composites and components made of selectively coated multi-component plastic composites |
Families Citing this family (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| EP2639333A1 (en) * | 2012-03-15 | 2013-09-18 | Atotech Deutschland GmbH | Method for metallising non-conductive plastic surfaces |
| LT6070B (en) * | 2012-12-07 | 2014-09-25 | Atotech Deutschland Gmbh | Preparation of plastic surface for chemical metallization process |
| US10895015B1 (en) | 2014-12-16 | 2021-01-19 | Hrl Laboratories, Llc | Thin-walled high temperature alloy structures via multi-material additive manufacturing |
| DE102015204912A1 (en) | 2015-03-18 | 2016-09-22 | Coventya Gmbh | Process for the selective metallization of butadiene-containing plastic areas in a component and kit for carrying out the method |
| JP6750293B2 (en) * | 2016-04-28 | 2020-09-02 | 栗田工業株式会社 | How to treat plastic surface |
| US10525919B2 (en) | 2016-05-27 | 2020-01-07 | Srg Global Inc. | Vehicle exterior components having discontinuous plated features |
| US9914404B2 (en) | 2016-08-08 | 2018-03-13 | Srg Global Inc. | Vehicle components having deep mesh plated features |
| EP3339481A1 (en) * | 2016-12-21 | 2018-06-27 | Dr. M. Kampschulte GmbH & Co. KG | Method and kit of parts for the pretreatment of objects to be chromed |
Citations (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| GB1213177A (en) * | 1967-11-22 | 1970-11-18 | Burroughs Corp | Method of applying metal coatings to articles |
| US4590115A (en) | 1981-12-14 | 1986-05-20 | Rhone-Poulenc Specialites Chimiques | Metallizing of plastic substrata |
| JPH06212440A (en) * | 1992-11-30 | 1994-08-02 | Mitsubishi Kasei Corp | Electroless plating method on non-conductive substrate |
| EP1054081B1 (en) | 1993-03-18 | 2006-02-01 | ATOTECH Deutschland GmbH | Composition and process for treating a surface coated with a self-accelerating and replenishing non-formaldehyde immersion coating |
| WO2007035091A1 (en) * | 2005-09-23 | 2007-03-29 | Nederlandse Organisatie Voor Toegepast-Natuurwetenschappelijk Onderzoek Tno | Method for partially metallizing a product |
| DE102007015625A1 (en) * | 2007-03-29 | 2008-10-02 | Bia Kunststoff- Und Galvanotechnik Gmbh & Co. Kg | Production of a operating, decorative or display element galvanically coated on the front side comprises applying a mask on the front side, holding and contacting the base body outside the mask region and chemically pre-treating the body |
Family Cites Families (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US3515649A (en) * | 1967-05-02 | 1970-06-02 | Ivan C Hepfer | Pre-plating conditioning process |
| JPS4920030A (en) * | 1972-06-15 | 1974-02-22 | ||
| DE2538571A1 (en) * | 1975-08-29 | 1977-03-03 | Siemens Ag | METALIZATION METHOD OF THERMAL PLASTICS, IN PARTICULAR PHENOLIC RESINS |
| US5007990A (en) * | 1987-07-10 | 1991-04-16 | Shipley Company Inc. | Electroplating process |
| JPH06212438A (en) * | 1993-01-19 | 1994-08-02 | Yoshiyama Plast Kogyo Kk | Plastic plated article and its production |
| US6619305B1 (en) * | 2000-01-11 | 2003-09-16 | Seagate Technology Llc | Apparatus for single disc ultrasonic cleaning |
| JP3685999B2 (en) * | 2001-02-16 | 2005-08-24 | 株式会社太洋工作所 | Manufacturing method of plated molded products |
| JP5023705B2 (en) * | 2007-01-10 | 2012-09-12 | 東京エレクトロン株式会社 | Semiconductor device manufacturing method, semiconductor manufacturing apparatus, and storage medium |
-
2010
- 2010-02-12 PL PL10001464T patent/PL2360294T3/en unknown
- 2010-02-12 ES ES10001464T patent/ES2416982T3/en active Active
- 2010-02-12 EP EP10001464.6A patent/EP2360294B1/en not_active Not-in-force
- 2010-02-12 PT PT100014646T patent/PT2360294E/en unknown
-
2011
- 2011-02-07 KR KR1020127020537A patent/KR20120115993A/en not_active Ceased
- 2011-02-07 CN CN201180009084.XA patent/CN102791907B/en not_active Expired - Fee Related
- 2011-02-07 US US13/578,315 patent/US20120305406A1/en not_active Abandoned
- 2011-02-07 WO PCT/EP2011/051757 patent/WO2011098428A1/en not_active Ceased
- 2011-02-07 BR BR112012020131A patent/BR112012020131A2/en not_active IP Right Cessation
- 2011-02-07 JP JP2012552355A patent/JP2013519786A/en active Pending
Patent Citations (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| GB1213177A (en) * | 1967-11-22 | 1970-11-18 | Burroughs Corp | Method of applying metal coatings to articles |
| US4590115A (en) | 1981-12-14 | 1986-05-20 | Rhone-Poulenc Specialites Chimiques | Metallizing of plastic substrata |
| JPH06212440A (en) * | 1992-11-30 | 1994-08-02 | Mitsubishi Kasei Corp | Electroless plating method on non-conductive substrate |
| EP1054081B1 (en) | 1993-03-18 | 2006-02-01 | ATOTECH Deutschland GmbH | Composition and process for treating a surface coated with a self-accelerating and replenishing non-formaldehyde immersion coating |
| WO2007035091A1 (en) * | 2005-09-23 | 2007-03-29 | Nederlandse Organisatie Voor Toegepast-Natuurwetenschappelijk Onderzoek Tno | Method for partially metallizing a product |
| DE102007015625A1 (en) * | 2007-03-29 | 2008-10-02 | Bia Kunststoff- Und Galvanotechnik Gmbh & Co. Kg | Production of a operating, decorative or display element galvanically coated on the front side comprises applying a mask on the front side, holding and contacting the base body outside the mask region and chemically pre-treating the body |
Non-Patent Citations (3)
| Title |
|---|
| M.Y.ABYANEH ET AL.: "Effects of Ultrasonic Irradiation on the Kinetics of Formation, Structure and Hardness of Electroless Nickel Deposits", J. ELECTROCHEM. SOC., vol. 154, no. 9, 2007, pages D467 - D472 |
| NAGAO T ET AL: "CHALLENGE TO CHROMIUM-FREE PLASTIC PLATING METHOD CHALLENGE TO CHROMIUM-FREE PLASTIC PLATING METHOD", GALVANOTECHNIK, EUGEN G.LEUZE VERLAG, SAULGAU/WURTT, DE, vol. 97, no. 7, 1 September 2006 (2006-09-01), pages 2124 - 2130, XP001501422, ISSN: 0016-4232 * |
| W. EBERHARDT, M. MÜNCH: "Verbundfestigkeit von Thermoplasten bei der zwei-Komponenten-MID-Technik für miniaturisierte Mikrosystemgehäuse", 7 November 2001 (2001-11-07), XP002590284, Retrieved from the Internet <URL:http://www.imat.hsg-imit.de/fileadmin/hsg-imat/pdfs/aif12120.pdf> [retrieved on 20100630] * |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103220884A (en) * | 2012-01-18 | 2013-07-24 | 光宏精密股份有限公司 | Circuit substrate structure and manufacturing method thereof |
| US11047052B2 (en) | 2014-07-10 | 2021-06-29 | Okuno Chemical Industries Co., Ltd. | Resin plating method |
| DE102021117567A1 (en) | 2021-07-07 | 2023-01-12 | Leibniz-Institut Für Polymerforschung Dresden E.V. | Process for the selective coating of multi-component plastic composites and components made of selectively coated multi-component plastic composites |
Also Published As
| Publication number | Publication date |
|---|---|
| BR112012020131A2 (en) | 2018-03-06 |
| US20120305406A1 (en) | 2012-12-06 |
| KR20120115993A (en) | 2012-10-19 |
| PT2360294E (en) | 2013-06-28 |
| PL2360294T3 (en) | 2013-09-30 |
| EP2360294B1 (en) | 2013-05-15 |
| CN102791907A (en) | 2012-11-21 |
| EP2360294A1 (en) | 2011-08-24 |
| JP2013519786A (en) | 2013-05-30 |
| CN102791907B (en) | 2015-08-05 |
| ES2416982T3 (en) | 2013-08-05 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| US20120305406A1 (en) | Method for Metallising Objects Which Have at Least Two Different Plastics on the Surface | |
| US6902765B2 (en) | Method for electroless metal plating | |
| EP2825689B1 (en) | Process for metallizing nonconductive plastic surfaces | |
| WO2008068049A1 (en) | Pre-treatment solution and method of forming a layer of a coating metal on a plastics surface containing substrate | |
| KR20200134345A (en) | Composition for pretreatment for electroless plating, pretreatment method for electroless plating, and electroless plating method | |
| KR100600574B1 (en) | Procedure for the activation of substrates for galvanizing the plastic | |
| CA2866766C (en) | Process for metallizing nonconductive plastic surfaces | |
| EP2767614A1 (en) | Method for depositing a first metallic layer onto non-conductive polymers | |
| KR19980703108A (en) | A method for selectively or partially electrolytic metallizing a substrate surface made of non-conductive material | |
| WO2013182590A1 (en) | Process for metallizing nonconductive plastic surfaces | |
| AU558946B2 (en) | Electroless nickel plating of aluminum | |
| CA1136006A (en) | Bright electroless plating process and plated articles produced thereby | |
| Rantell et al. | Metallising of Circuit Boards Using Mixed SnCl2/PdCl2 Catalysts |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| WWE | Wipo information: entry into national phase |
Ref document number: 201180009084.X Country of ref document: CN |
|
| 121 | Ep: the epo has been informed by wipo that ep was designated in this application |
Ref document number: 11702456 Country of ref document: EP Kind code of ref document: A1 |
|
| DPE1 | Request for preliminary examination filed after expiration of 19th month from priority date (pct application filed from 20040101) | ||
| ENP | Entry into the national phase |
Ref document number: 20127020537 Country of ref document: KR Kind code of ref document: A |
|
| WWE | Wipo information: entry into national phase |
Ref document number: 2012552355 Country of ref document: JP |
|
| NENP | Non-entry into the national phase |
Ref country code: DE |
|
| WWE | Wipo information: entry into national phase |
Ref document number: 13578315 Country of ref document: US |
|
| 122 | Ep: pct application non-entry in european phase |
Ref document number: 11702456 Country of ref document: EP Kind code of ref document: A1 |
|
| REG | Reference to national code |
Ref country code: BR Ref legal event code: B01A Ref document number: 112012020131 Country of ref document: BR |
|
| ENP | Entry into the national phase |
Ref document number: 112012020131 Country of ref document: BR Kind code of ref document: A2 Effective date: 20120810 |




