WO2011081482A2

WO2011081482A2 - Manufacturing system of touch panel pad, manufacturing method thereof, and pad for manufacturing touch panel

Info

Publication number: WO2011081482A2
Application number: PCT/KR2010/009579
Authority: WO
Inventors: 박종호
Original assignee: Park Jong-Ho
Priority date: 2009-12-31
Filing date: 2010-12-30
Publication date: 2011-07-07
Also published as: KR101006291B1; WO2011081482A3

Abstract

The present invention discloses a manufacturing system of a touch panel pad, a manufacturing method thereof, and a pad for manufacturing the touch panel. According to an embodiment of the invention, there is provided a manufacturing system of the touch panel pad including: a dielectric film that has insulating properties; a conductive substance layer that is formed on the upper surface of the dielectric film; and a metal substance layer that is formed on the upper surface of the conductive substance layer. The manufacturing system comprises: a supply roller that supplies a first material which has the conductive substance layer formed on the upper surface of the dielectric film; a DC plasma section that forms a metal substance, which constitutes the metal substance layer, on the conductive substance layer of the first material, which is supplied from the supply roller, by using DC plasma, and discharges the touch panel pad; a receiving roller that receives the touch panel pad which is discharged from the DC plasma section; and a surface treatment section that is disposed between the supply roller and the DC plasma section and performs surface treatment on the conductive substance layer so as to form the metal substance layer on the surface of the first material.

Description

Touch panel pad manufacturing system, manufacturing method and pad for touch panel manufacturing

The present invention relates to a pad for a touch panel, a pad manufacturing system for a touch panel, and a manufacturing method thereof, and in particular, a pad manufacturing system for forming a metal material layer on a conductive material layer constituting a pad used in a capacitive touch panel. A pad manufacturing method and a touch panel pad made by the system and method.

Conventional capacitive touch panel is coupled to the upper portion of the upper touch pad housing made of an insulator and the window portion consisting of a screening portion that is coupled to the bottom edge of the housing to cover the silver paste electrode to be coupled to the lower portion of the housing, It consists of a pad.

The pad controls the electrical signal of the conductive material coating layer and the conductive material coating layer coated with a transparent conductive material, such as ITO, on a portion of the PET film that is to be touch-sensitive (a portion of the window portion that is not a screening portion). It consists of a silver paste electrode that couples to the edge of the conductive material coating layer for delivery. The pad and the window portion (corresponding to the upper panel portion) are joined by an adhesive.

In the case of the conventional capacitive touch panel, silver paste is added to the upper portion of the ITO layer.

However, the electrode formed by the silver paste is thick in micrometers, so that the height of the portion where the silver paste electrode is formed is higher than that of the other portion and a layer having a step is formed.

In this case, bubbles remain between the adhesive layer and the step in the process of bonding the adhesive layer and the window part, so that defects of the film are frequently caused, and it is difficult to manufacture a thin device by increasing the overall height of the touch panel. .

In addition, in forming the electrode, since the silver paste is used, there is a limit in finely decorating the electrode pattern, which makes it difficult to manufacture a touch panel of high resolution.

Therefore, development of a method of forming an electrode on ITO by using a metal other than forming a silver paste electrode is required.

An object of the present invention is to provide a touch panel pad manufacturing system for forming a metal material layer on the upper surface of the conductive material layer used in the capacitive touch panel.

Another object of the present invention is to provide a touch panel pad manufacturing method for forming a metal material layer on an upper surface of a conductive material layer used in a capacitive touch panel.

Another object of the present invention is to provide a pad for a touch panel in which a metal material layer is formed on an upper surface of a conductive material layer used for a capacitive touch panel.

The pad manufacturing system for a touch panel according to an embodiment of the present invention for achieving the technical problem is a dielectric film having an insulating, a conductive material layer formed on the upper surface of the dielectric film and a metal formed on the upper surface of the conductive material layer A pad manufacturing system for a touch panel comprising a material layer,

The metal material forming the metal material layer is formed on the conductive material layer of the first material supplied from the supply roller by a supply roller and a DC plasma supplying the first material having the conductive material layer formed on the dielectric film. A DC plasma part for discharging the pad for the touch panel, an accommodating roller for accommodating the touch panel pad discharged from the DC plasma part, and disposed between the supply roller and the DC plasma part, the surface of the first material And a surface treatment part for surface treatment of the conductive material layer so that the metal material layer is formed thereon.

The surface treatment unit generates an RF plasma using an RF (Radio Frequency) voltage, moves ions and electrons generated by the RF plasma by a magnetic field, and causes the ions and electrons to appear on the surface of the conductive material layer. The surface treatment is performed so that the metal material layer is well formed by the collision.

The surface treatment unit may include a lower plate including an upper plate to which an RF voltage between 200 W and 450 W is applied, and a lower portion including a space portion disposed below the upper plate at a predetermined interval and having a magnetic field formed therein, and between the upper plate and the lower plate. The first material passes through, and ions and electrons generated by ionization of the reaction gas collide with the surface of the conductive material layer.

The upper plate may include an upper electrode in which a cooling water flow path is formed, an upper electrode plate covering the upper electrode upper surface, an insulator plate surrounding upper and both sides of the upper electrode and the upper electrode plate, an upper surface of the insulator plate, and And an injection tube for injecting coolant into a passage through which the coolant flows through the first metal plate and the first metal plate, the insulator plate, and the upper electrode plate surrounding both sides.

The lower plate is a U-shaped cross-section that forms the space portion, the first plate and the magnet having different polarity alternately arranged inside to form a magnetic field in the space portion, disposed below the first plate and flowing coolant A second plate and a second metal plate surrounding the lower surface and both sides of the first plate and the second plate, the magnetic field is more than 3000 gauss, the reaction gas is argon or a combined gas of argon and oxygen.

The DC plasma part is disposed at a predetermined interval away from the main roller and the lower part of the main roller to which the first material is wound and rotated. The metal material is disposed on the upper surface and a negative voltage is applied to the lower surface so that the metal material is reacted by the reaction gas. A negative electrode is formed on the conductive material layer of the first material of the main roller.

A voltage of -2500 W to -4000 W is applied to the negative electrode, and a distance between the main roller and the negative electrode is 4 cm to 15 cm. The metal material is copper, aluminum including copper, nickel, chromium, molybdenum or alloys thereof.

The touch panel pad manufacturing system is a vacuum chamber.

According to another aspect of the present invention, there is provided a method for manufacturing a pad for a touch panel, the dielectric film having an insulating property, a conductive material layer formed on an upper surface of the dielectric film, and an upper surface of the conductive material layer. A touch panel pad manufacturing method comprising a metal material layer,

Forming a first material having the conductive material layer formed on the dielectric film, and surface treating the conductive material layer to form the metal material layer on the surface of the first material by using an RF plasma and a magnetic field. And forming a metal material constituting the metal material layer on the conductive material layer of the first material by using the DC plasma.

In the surface treatment step, an RF plasma is generated using an RF (Radio Frequency) voltage, and the ions and electrons generated on the surface of the conductive material layer are moved by a magnetic field. The surface treatment is performed so that the metal material layer is well formed by the collision.

The surface treatment step, the top plate is applied between the RF voltage between 200W to 450W, and

A lower plate having a space portion disposed below the upper plate at a predetermined interval and having a magnetic field formed therein, wherein the first material passes between the upper plate and the lower plate, and ions generated by ionization of a reaction gas And electrons impinge on the surface of the conductive material layer.

The lower plate has a U-shape in cross section that forms the space portion, and magnets having different polarities are alternately disposed inside to form a magnetic field in the space portion, and the magnetic field is 3000 gauss or more, and the upper electrode is 200W to An RF (Radio Frequency) voltage between 450 W is applied, and the reaction gas is argon or a combined gas of argon and oxygen.

Forming the pad for the touch panel, the metal material is formed by DC plasma sputtering using a DC voltage of -2500W to -4000W.

The metal material is copper, aluminum including copper, nickel, chromium, molybdenum or an alloy thereof.

The method for manufacturing a pad for touch panels operates in a vacuum chamber.

Touch pad pad according to another embodiment of the present invention for achieving the above technical problem is made by the above-described method for manufacturing a pad for a touch panel and a pad manufacturing system for a touch panel.

As described above, the pad manufacturing system for a touch panel according to the embodiment of the present invention allows the formation of a metal material layer on the conductive material layer very well, and is not possible in the silver paste electrode process, and the roll-to-roll between the supply roller and the receiving roller ( Roll to Roll) can be a continuous operation has the advantage that the productivity of the touch panel pad can be significantly improved. In addition, in the post-manufacturing process of the pad, roll-to-roll etching is possible, so that the productivity is increased by five times or more. In addition, since an alloy including copper or copper is used as the metal material layer, cost can be reduced compared to the silver electrode.

In addition, since the metal electrode has a very thin thickness as compared to the silver electrode, there is no step when forming on the ITO film, thus eliminating the occurrence of bubbles, which occurred between the step and the double side adhesive when providing the double side adhesive. There is an advantage to this.

BRIEF DESCRIPTION OF THE DRAWINGS In order to better understand the drawings cited in the detailed description of the invention, a brief description of each drawing is provided.

1 is a block diagram of a pad manufacturing system for a touch panel.

FIG. 2 is a perspective view illustrating a structure of the surface treatment part of FIG. 1.

3 to 5 illustrate the surface treatment process.

6 is a flowchart for explaining a method for manufacturing a pad for a touch panel.

DETAILED DESCRIPTION In order to fully understand the present invention, the operational advantages of the present invention, and the objects achieved by the practice of the present invention, reference should be made to the accompanying drawings which illustrate preferred embodiments of the present invention and the contents described in the drawings.

Hereinafter, exemplary embodiments of the present invention will be described in detail with reference to the accompanying drawings. Like reference numerals in the drawings denote like elements.

1 is a conceptual diagram illustrating a pad manufacturing system for a touch panel according to an embodiment of the present invention.

FIG. 2 is a structural diagram illustrating a structure of the surface treatment unit of FIG. 1.

3 illustrates a first material entering the surface treatment unit of FIG. 1, FIG. 4 illustrates a first material discharged from the surface treatment unit, and FIG. 4 illustrates a structure of a pad passing through the DC plasma unit.

Referring to FIG. 1, a pad manufacturing system 100 for a touch panel according to an exemplary embodiment of the present invention may include an insulating dielectric film 10, a conductive material layer 20 formed on an upper surface of the dielectric film 10, and The present invention relates to a system for manufacturing a touch panel pad (TP) including a metal material layer 30 formed on an upper surface of a conductive material layer 20.

The pad manufacturing system 100 for a touch panel includes a supply roller R1, a DC plasma unit 110, a receiving roller R2, and a surface treatment unit 130. The pad manufacturing system 100 for a touch panel is a vacuum chamber. That is, the touch panel pad manufacturing system 100 shown in FIG. 1 is a view for explaining the inside of the vacuum chamber.

In order to form the metal material layer 30 on the conductive material layer 20, the touch panel pad manufacturing system 100 according to the embodiment of the present invention uses a sputtering method using a plasma method. Specifically, the metal material layer 30 is coated on the conductive material layer 20 by a DC plasma sputtering method. However, it is not easy to coat the metal material layer 30 on the conductive material layer 20 using only the sputtering method in actual manufacturing.

Therefore, in order to achieve a good coating of the metal material layer 30 on the surface of the conductive material layer 20, the surface of the conductive material layer 20 after the surface treatment, the metal material layer by a sputtering method ( 30) coating.

Surface treatment uses a plasma method using a magnetic field and RF (Radio Frequency) voltage.

The pad manufacturing system 100 for a touch panel is a vacuum chamber. That is, the one shown in FIG. 1 maintains a vacuum state as the interior of the vacuum chamber. Further, preferably, the dielectric film 10 is a dielectric film containing polyimide or polyethylene terephthalate (PET). The conductive material layer 20 is a transparent conductive material including ITO or IZO.

In addition, as the material of the metal material layer 30 may be a variety of known metals, and preferably, in consideration of ease of manufacture and electrical conductivity, aluminum, nickel, chromium, molybdenum or the like, including copper and copper Of alloys. That is, copper, aluminum including copper, nickel, chromium, or molybdenum may be used as the material of the metal material layer 30, or two or more alloys of these metals may be used. .

An internal structure of the pad manufacturing system 100 for a touch panel will be described with reference to FIG. 1. The pad manufacturing system 100 for a touch panel includes a supply roller R1, a DC plasma unit 110, a receiving roller R2, and a surface treatment unit 130.

The supply roller R1 supplies the first material having the conductive material layer 20 formed on the upper surface of the dielectric film 10. The surface treatment unit 130 is disposed between the supply roller R1 and the DC plasma unit 110, and the surface treatment of the conductive material layer 20 is performed to form the metal material layer 30 on the surface of the first material well. do.

The DC plasma unit 110 forms a metal material constituting the metal material layer 30 on the conductive material layer 20 of the first material supplied from the supply roller R1 by a DC plasma pad. TP).

And, the accommodation roller (R2) is wrapped around the touch panel pad TP discharged from the DC plasma unit 110 to accommodate. In FIG. 1, auxiliary rollers 150 supporting an intermediate middle in which the touch panel pad TP is transported are illustrated, and FIG. 1 is a conceptual view, and thus, other facilities for constructing a vacuum chamber are omitted. Those skilled in the art will understand.

As described above, in the touch panel pad manufacturing system 100 of the present invention, after surface-treating the surface of the conductive material layer 20 using the surface treatment unit 130, the surface-treated conductive material layer 20 The metal material is coated on the surface by sputtering.

The first roller having the conductive material layer 20 formed on the dielectric film 10 is wound around the supply roller R1. This may be a state in which ITO is coated on PET. Then, the first material wound on the supply roller R1 is wound on the accommodation roller R2 via the surface treatment unit 130 and the DC plasma unit 110.

Referring to Figure 2, the structure and operation of the surface treatment unit 130 will be described in more detail.

The surface treatment unit 130 is composed of an upper plate 210 to which an RF voltage is applied and a lower plate 230 having a space portion 240 disposed below the upper plate 210 at a predetermined interval and having a magnetic field formed therein. .

The upper plate 210 and the lower plate 230 are spaced apart from each other so that the first material passes through the surface of the conductive material layer 20 by the reaction gas and the magnetic field. An interval between the upper plate 210 and the lower plate 230 may be within about 10 mm.

The upper plate 210 is formed of a multi-layer, the upper electrode 217 and the upper electrode plate 215 and the upper electrode 217 covering the upper surface of the upper electrode 217 is formed, the passage 219 through which the coolant flows. And an insulator plate 213 surrounding the top and both sides of the upper electrode plate 215 and a first metal plate 211 surrounding the top and both sides of the insulator plate 213.

As shown in FIG. 2, an injection tube 221 is inserted into the passage 219 through which the coolant flows through the first metal plate 211, the insulator plate 213, and the upper electrode plate 215.

Although not shown in FIG. 2, an application electrode (not shown) for applying an RF voltage to the upper electrode 217 is formed on a cover portion covering the front portion of FIG. 2. The shape in which the passage of the coolant flows in the upper electrode 217 is not limited to that shown in FIG. 2.

The upper electrode 217 and the upper electrode plate 215 are made of aluminum and are anodized. The insulator plate 213 is insulated using a Teflon material to prevent the RF plasma from flowing out. The first metal plate 211 serves to protect the inner layer.

The lower plate 230 has a U-shape in which a cross section forms a space portion 240, and a first plate 237 in which magnets 235 having different polarities are alternately disposed inside to form a magnetic field in the space portion 240. ) And a second plate 233 disposed under the first plate 237 and surrounding the bottom and both sides of the first plate 237 and the second plate 233, through which cooling water flows. Equipped.

The magnets 235 shown in FIG. 2 are alternately arranged with the N pole and the S pole, and are inserted and extended inwardly as shown in FIG. 2. Although not shown, a passage through which the coolant flows may also be formed in the second plate 233, and its shape may vary. The first plate 237 surrounding the magnets 235 may be made of a metal of stainless material that does not interfere with the formation of the magnetic field.

An RF (Radio Frequency) voltage between 200W and 450W is applied to the upper electrode 217, and RF plasma is generated when argon or a combined gas of argon and oxygen is injected as a reaction gas into the space part 240. Argon is ionized by RF plasma, and argon ions and secondary electrons are generated. At this time, the secondary electrons are moved and collected near the surface of the conductive material layer 20 of the first material by the magnetic field formed by the magnets 235.

Therefore, the collision of electrons and argon neutral atoms is increased, the chain reaction occurs, and the RF voltage is continuously changed in polarity, so that the argon ions and electrons alternately hit the surface of the conductive material layer 20 and the surface of the conductive material layer 20 Processing is performed.

The magnetic field formed by the magnets 235 is preferably 3000 gauss or more. When argon ions and electrons alternately strike the surface of the conductive material layer 20, the surface is activated (excitation) without changing the surface resistance of the conductive material layer 20. That is, after RF plasma is generated in the surface treatment unit 130 in which argon or argon and oxygen are maintained at an appropriate ratio, the first material entering the surface treatment unit 130 moves without stopping and passes within a predetermined time. The metal material layer is in close contact with the surface of the conductive material layer 20 of one material to form the metal material layer very well.

As such, the surface treatment unit 130 generates an RF plasma using an RF voltage, and moves the ions and electrons generated by the RF plasma to the vicinity of the surface of the conductive material layer 20 by a magnetic field. By causing ions and electrons to collide with the surface of the surface 20, the surface of the metal material 30 is well formed.

The DC plasma unit 110 is disposed at regular intervals apart from the main roller MR and the lower part of the main roller MR on which the first material is wound and rotated, and a metal material 113 is disposed on the upper surface and a negative voltage is applied to the lower surface. The negative electrode 111 is formed so that the metal material 113 is formed on the conductive material layer 20 of the first material of the main roller MR by the reaction gas.

The DC plasma unit 110 uses a sputtering method using a DC power source. That is, a voltage of -2500 W to -4000 W is applied to the negative electrode 111, and a metal material 113 (eg, copper) is disposed on an upper surface thereof. The metal material 113 may be copper, aluminum including copper, nickel, chromium, molybdenum, or an alloy thereof. When the plasma is generated by the applied DC voltage and the ions 117 are accelerated and the accelerated ions 117 collide with the surface of the metal material 113, the atoms and molecules 115 of the metal material are held in the main roller MR. Blown to the conductive material layer 20 of the first material is rotated along to form a thin film. At this time, since the surface of the conductive material layer 20 is a surface treatment in the surface treatment unit 130, the atoms and molecules 115 of the metal material 113 are easily coated.

Preferably, the first material is coated with the metal material layer 30 on the conductive material layer 20 to form a complete touch panel pad TP.

3 illustrates a state of the first material TP1 entering the surface treatment unit 130, and FIG. 4 illustrates a state of the first material TP2 surface treated and discharged from the surface treatment unit 130. In FIG. 4, 25 is a state where the surface of the conductive material layer 20 is surface-treated by collision with ions and electrons. FIG. 5 illustrates a state in which the metal material layer 30 is formed in the DC plasma unit 110 and the completed touch panel pad TP is discharged. By the system 100, a pad TP, which is a raw material used for the touch panel, may be made.

According to another aspect of the present invention, a method 400 for manufacturing a pad for a touch panel 400 includes forming a first material having a conductive material layer formed on an upper surface of a dielectric film, and using an RF plasma and a magnetic field to form a surface of the first material. The touch panel pad is formed by forming a metal material that forms a metal material layer on the conductive material layer of the first material using step 420 and surface treatment of the conductive material layer so that the formation of the metal material layer on the substrate is performed. Step 430 is provided. In particular, the surface treatment step 420 generates an RF plasma by using a RF (Radio Frequency) voltage, moves ions and electrons generated by the RF plasma by a magnetic field to move the ions onto the surface of the conductive material layer. The formation of the metal material layer is well performed by collision of electrons and electrons.

Since the touch panel pad manufacturing method 400 corresponds to the operation of the touch panel pad manufacturing system 100 described above, a detailed description thereof will be omitted.

In addition, when all of the metal material layers are formed on one side and wound on the receiving roller R2, the metal material layer may be formed on the opposite side of the surface on which the metal material layer is formed, as necessary. That is, when the pad for the touch panel wound around the receiving roller R2 is turned over and then supplied to the supply roller R1, the metal material layers may be formed on both surfaces.

As described above, optimal embodiments have been disclosed in the drawings and the specification. Although specific terms have been used herein, they are used only for the purpose of describing the present invention and are not intended to limit the scope of the invention as defined in the claims or the claims. Therefore, those skilled in the art will understand that various modifications and equivalent other embodiments are possible from this. Therefore, the true technical protection scope of the present invention will be defined by the technical spirit of the appended claims.

The present invention can be used in the field of manufacturing a pad for a touch panel.

Claims

In the pad manufacturing system for a touch panel comprising an insulating dielectric film, a conductive material layer formed on the upper surface of the dielectric film and a metal material layer formed on the upper surface of the conductive material layer,

A supply roller for supplying a first material having the conductive material layer formed on the dielectric film;

A DC plasma part which forms a metal material constituting the metal material layer on the conductive material layer of the first material supplied from the supply roller by DC plasma to discharge the pad for the touch panel;

An accommodation roller accommodating the touch panel pad discharged from the DC plasma portion; And

The touch panel pad is disposed between the supply roller and the DC plasma unit, and includes a surface treatment unit for surface treatment of the conductive material layer to form the metal material layer on the surface of the first material. system.
The method of claim 1, wherein the surface treatment unit,

The metal is generated by generating an RF plasma using an RF (Radio Frequency) voltage, and moving the ions and electrons generated by the RF plasma by a magnetic field to collide with the ions and electrons on the surface of the conductive material layer. The touch panel pad manufacturing system, characterized in that the surface treatment to form the material layer well.
The method of claim 1, wherein the surface treatment unit,

An upper plate to which an RF voltage between 200 W and 450 W is applied; And

A lower plate disposed below the upper plate at a predetermined interval and having a space portion in which a magnetic field is formed;

And the first material passes between the upper plate and the lower plate, and ions and electrons generated by ionization of a reaction gas collide with the surface of the conductive material layer.
The method of claim 3, wherein the top plate,

An upper electrode through which a coolant flows;

An upper electrode plate covering an upper surface of the upper electrode;

An insulator plate surrounding upper and both side surfaces of the upper electrode and the upper electrode plate;

A first metal plate surrounding the top and both sides of the insulator plate; and

And an injection tube for injecting coolant into a passage through which the coolant flows through the first metal plate, the insulator plate, and the upper electrode plate.
The method of claim 3, wherein the lower plate,

A first plate having a U-shaped cross section that forms the space portion, the magnets having different polarities alternately arranged inside thereof to form a magnetic field in the space portion;

A second plate disposed under the first plate and flowing with cooling water; And

A second metal plate surrounding the lower surface and both side surfaces of the first plate and the second plate;

The magnetic field is more than 3000 gauss,

The reaction gas is argon or a pad manufacturing system for a touch panel, characterized in that the combined gas of argon and oxygen.
The method of claim 1, wherein the DC plasma unit,

A main roller on which the first material is wound and rotated; And

The negative electrode is disposed below the main roller at a predetermined interval, the metal material is disposed on the upper surface and a negative voltage is applied to the lower surface so that the metal material is formed on the conductive material layer of the first material of the main roller by the reaction gas. Pad manufacturing system for a touch panel comprising: a.
According to claim 6, wherein the negative electrode is applied a voltage of -2500W to -4000W,

The distance between the main roller and the negative electrode is a pad manufacturing system for a touch panel, characterized in that 4cm ~ 15cm.
The method of claim 1, wherein the metal material,

Copper, copper containing aluminum, nickel, chromium, molybdenum or an alloy thereof.
According to claim 1, wherein the pad manufacturing system for a touch panel,

Touch panel pad manufacturing system, characterized in that the vacuum chamber.
The touch panel pad made by the system of claim 1.
In the method of manufacturing a pad for a touch panel comprising an insulating dielectric film, a conductive material layer formed on an upper surface of the dielectric film and a metal material layer formed on an upper surface of the conductive material layer,

Forming a first material having the conductive material layer formed on an upper surface of the dielectric film;

Surface treatment of the conductive material layer to form the metal material layer on the surface of the first material by using an RF plasma and a magnetic field; And

And forming a pad for the touch panel by forming a metal material constituting the metal material layer on the conductive material layer of the first material by using a DC plasma.
The method of claim 11, wherein the surface treatment step,

The metal is generated by generating an RF plasma using an RF (Radio Frequency) voltage, and moving the ions and electrons generated by the RF plasma by a magnetic field to collide with the ions and electrons on the surface of the conductive material layer. Method of manufacturing a pad for a touch panel, characterized in that the surface treatment so as to form a material layer well.
The method of claim 11, wherein the surface treatment step,

An upper plate to which an RF voltage between 200 W and 450 W is applied; And

A lower plate disposed below the upper plate at a predetermined interval and having a space portion in which a magnetic field is formed;

And the first material passes between the upper plate and the lower plate, and ions and electrons generated by ionization of a reaction gas collide with the surface of the conductive material layer.
The method of claim 13, wherein the top plate,

An upper electrode through which a coolant flows;

An upper electrode plate covering an upper surface of the upper electrode;

An insulator plate surrounding upper and both side surfaces of the upper electrode and the upper electrode plate;

A first metal plate surrounding the top and both sides of the insulator plate; and

And an injection tube for injecting coolant into a passage through which the coolant flows through the first metal plate, the insulator plate, and the upper electrode plate.
The method of claim 14, wherein the lower plate,

A cross-section is a U-shape to form the space portion, magnets of different polarities are alternately arranged inside to form a magnetic field in the space portion,

The magnetic field is more than 3000 gauss,

RF (Radio Frequency) voltage between 200W and 450W is applied to the upper electrode,

The reaction gas is argon or a pad manufacturing method for a touch panel, characterized in that the combined gas of argon and oxygen.
The method of claim 11, wherein forming the pad for the touch panel comprises:

The metal panel is formed by the DC plasma sputtering (sputtering) using a DC voltage of -2500W to -4000W.
The method of claim 11, wherein the metal material,

Copper, copper containing aluminum, nickel, chromium, molybdenum or an alloy thereof.
The method of claim 11, wherein the pad manufacturing method for the touch panel includes:

Method of manufacturing a pad for a touch panel, characterized in that it operates in a vacuum chamber.
The touch panel pad made by the method of claim 11.