WO2011074777A3 - Led lighting device including led package integrally formed with a circuit board, and method of producing the led lighting device - Google Patents

Led lighting device including led package integrally formed with a circuit board, and method of producing the led lighting device Download PDF

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Publication number
WO2011074777A3
WO2011074777A3 PCT/KR2010/007659 KR2010007659W WO2011074777A3 WO 2011074777 A3 WO2011074777 A3 WO 2011074777A3 KR 2010007659 W KR2010007659 W KR 2010007659W WO 2011074777 A3 WO2011074777 A3 WO 2011074777A3
Authority
WO
WIPO (PCT)
Prior art keywords
lighting device
led lighting
led
circuit board
producing
Prior art date
Application number
PCT/KR2010/007659
Other languages
French (fr)
Korean (ko)
Other versions
WO2011074777A2 (en
Inventor
전은채
제태진
유영은
윤재성
최두선
조성학
Original Assignee
한국기계연구원
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from KR1020090126621A external-priority patent/KR101078863B1/en
Priority claimed from KR1020100107290A external-priority patent/KR101186244B1/en
Application filed by 한국기계연구원 filed Critical 한국기계연구원
Publication of WO2011074777A2 publication Critical patent/WO2011074777A2/en
Publication of WO2011074777A3 publication Critical patent/WO2011074777A3/en

Links

Classifications

    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21K—NON-ELECTRIC LIGHT SOURCES USING LUMINESCENCE; LIGHT SOURCES USING ELECTROCHEMILUMINESCENCE; LIGHT SOURCES USING CHARGES OF COMBUSTIBLE MATERIAL; LIGHT SOURCES USING SEMICONDUCTOR DEVICES AS LIGHT-GENERATING ELEMENTS; LIGHT SOURCES NOT OTHERWISE PROVIDED FOR
    • F21K9/00—Light sources using semiconductor devices as light-generating elements, e.g. using light-emitting diodes [LED] or lasers
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21Y—INDEXING SCHEME ASSOCIATED WITH SUBCLASSES F21K, F21L, F21S and F21V, RELATING TO THE FORM OR THE KIND OF THE LIGHT SOURCES OR OF THE COLOUR OF THE LIGHT EMITTED
    • F21Y2105/00—Planar light sources
    • F21Y2105/10—Planar light sources comprising a two-dimensional array of point-like light-generating elements
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21Y—INDEXING SCHEME ASSOCIATED WITH SUBCLASSES F21K, F21L, F21S and F21V, RELATING TO THE FORM OR THE KIND OF THE LIGHT SOURCES OR OF THE COLOUR OF THE LIGHT EMITTED
    • F21Y2115/00—Light-generating elements of semiconductor light sources
    • F21Y2115/10—Light-emitting diodes [LED]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805—Shape
    • H01L2224/4809—Loop shape
    • H01L2224/48091—Arched
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L25/00—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof
    • H01L25/03—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes
    • H01L25/04—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers
    • H01L25/075—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group H01L33/00
    • H01L25/0753—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group H01L33/00 the devices being arranged next to each other
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
    • H01L2924/181—Encapsulation
    • H01L2924/1815—Shape
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L33/00—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L33/48—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
    • H01L33/50—Wavelength conversion elements
    • H01L33/505—Wavelength conversion elements characterised by the shape, e.g. plate or foil
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L33/00—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L33/48—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
    • H01L33/52—Encapsulations
    • H01L33/54—Encapsulations having a particular shape

Abstract

An LED lighting device according to an aspect of the present invention comprises a housing configuring the exterior of the device and an LED package. The LED package includes a plate-shaped circuit board, a plurality of LED devices mounted on the circuit board, and a light transmitting resin layer covering the LED devices and including an optical pattern formed on the surface thereof.
PCT/KR2010/007659 2009-12-18 2010-11-02 Led lighting device including led package integrally formed with a circuit board, and method of producing the led lighting device WO2011074777A2 (en)

Applications Claiming Priority (4)

Application Number Priority Date Filing Date Title
KR1020090126621A KR101078863B1 (en) 2009-12-18 2009-12-18 Led lighting apparatus having led package intergrated on circuit board and fabricating method thereof
KR10-2009-0126621 2009-12-18
KR10-2010-0107290 2010-10-29
KR1020100107290A KR101186244B1 (en) 2010-10-29 2010-10-29 Fabricating method of led lighting apparatus

Publications (2)

Publication Number Publication Date
WO2011074777A2 WO2011074777A2 (en) 2011-06-23
WO2011074777A3 true WO2011074777A3 (en) 2011-09-09

Family

ID=44167801

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/KR2010/007659 WO2011074777A2 (en) 2009-12-18 2010-11-02 Led lighting device including led package integrally formed with a circuit board, and method of producing the led lighting device

Country Status (1)

Country Link
WO (1) WO2011074777A2 (en)

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20120257386A1 (en) * 2011-06-24 2012-10-11 Xicato, Inc. Led based illumination module with a reflective mask
JP2013197294A (en) * 2012-03-19 2013-09-30 Toshiba Lighting & Technology Corp Luminaire

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR100586976B1 (en) * 2004-06-30 2006-06-08 삼성전기주식회사 Light Emitting Diode Package with Improved Dispersibility and Brightness
KR20060086177A (en) * 2005-01-26 2006-07-31 삼성전자주식회사 Two dimensional light source of using light emitting diode and liquid crystal display panel of using the two dimensional light source
KR100755619B1 (en) * 2006-08-08 2007-09-06 삼성전기주식회사 Method of fabricating led package
KR100809212B1 (en) * 2006-09-29 2008-02-29 삼성전기주식회사 Imprinting stamp for forming pattern and method of fabricating led package using the same

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR100586976B1 (en) * 2004-06-30 2006-06-08 삼성전기주식회사 Light Emitting Diode Package with Improved Dispersibility and Brightness
KR20060086177A (en) * 2005-01-26 2006-07-31 삼성전자주식회사 Two dimensional light source of using light emitting diode and liquid crystal display panel of using the two dimensional light source
KR100755619B1 (en) * 2006-08-08 2007-09-06 삼성전기주식회사 Method of fabricating led package
KR100809212B1 (en) * 2006-09-29 2008-02-29 삼성전기주식회사 Imprinting stamp for forming pattern and method of fabricating led package using the same

Also Published As

Publication number Publication date
WO2011074777A2 (en) 2011-06-23

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