WO2011074777A2 - Led lighting device including led package integrally formed with a circuit board, and method of producing the led lighting device - Google Patents

Led lighting device including led package integrally formed with a circuit board, and method of producing the led lighting device Download PDF

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Publication number
WO2011074777A2
WO2011074777A2 PCT/KR2010/007659 KR2010007659W WO2011074777A2 WO 2011074777 A2 WO2011074777 A2 WO 2011074777A2 KR 2010007659 W KR2010007659 W KR 2010007659W WO 2011074777 A2 WO2011074777 A2 WO 2011074777A2
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WO
WIPO (PCT)
Prior art keywords
substrate
resin layer
led
lighting device
led lighting
Prior art date
Application number
PCT/KR2010/007659
Other languages
French (fr)
Korean (ko)
Other versions
WO2011074777A3 (en
Inventor
전은채
제태진
유영은
윤재성
최두선
조성학
Original Assignee
한국기계연구원
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from KR1020090126621A external-priority patent/KR101078863B1/en
Priority claimed from KR1020100107290A external-priority patent/KR101186244B1/en
Application filed by 한국기계연구원 filed Critical 한국기계연구원
Publication of WO2011074777A2 publication Critical patent/WO2011074777A2/en
Publication of WO2011074777A3 publication Critical patent/WO2011074777A3/en

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Classifications

    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21K—NON-ELECTRIC LIGHT SOURCES USING LUMINESCENCE; LIGHT SOURCES USING ELECTROCHEMILUMINESCENCE; LIGHT SOURCES USING CHARGES OF COMBUSTIBLE MATERIAL; LIGHT SOURCES USING SEMICONDUCTOR DEVICES AS LIGHT-GENERATING ELEMENTS; LIGHT SOURCES NOT OTHERWISE PROVIDED FOR
    • F21K9/00—Light sources using semiconductor devices as light-generating elements, e.g. using light-emitting diodes [LED] or lasers
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21Y—INDEXING SCHEME ASSOCIATED WITH SUBCLASSES F21K, F21L, F21S and F21V, RELATING TO THE FORM OR THE KIND OF THE LIGHT SOURCES OR OF THE COLOUR OF THE LIGHT EMITTED
    • F21Y2105/00—Planar light sources
    • F21Y2105/10—Planar light sources comprising a two-dimensional array of point-like light-generating elements
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21Y—INDEXING SCHEME ASSOCIATED WITH SUBCLASSES F21K, F21L, F21S and F21V, RELATING TO THE FORM OR THE KIND OF THE LIGHT SOURCES OR OF THE COLOUR OF THE LIGHT EMITTED
    • F21Y2115/00—Light-generating elements of semiconductor light sources
    • F21Y2115/10—Light-emitting diodes [LED]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805—Shape
    • H01L2224/4809—Loop shape
    • H01L2224/48091—Arched
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L25/00—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof
    • H01L25/03—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes
    • H01L25/04—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers
    • H01L25/075—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group H01L33/00
    • H01L25/0753—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group H01L33/00 the devices being arranged next to each other
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
    • H01L2924/181—Encapsulation
    • H01L2924/1815—Shape
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L33/00—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L33/48—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
    • H01L33/50—Wavelength conversion elements
    • H01L33/505—Wavelength conversion elements characterised by the shape, e.g. plate or foil
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L33/00—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L33/48—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
    • H01L33/52—Encapsulations
    • H01L33/54—Encapsulations having a particular shape

Definitions

  • the present invention relates to an LED lighting apparatus and a method of manufacturing the same, and more particularly, to an LED lighting apparatus and a method of manufacturing the same.
  • Light emitting devices such as organic EL and LED, which have attracted attention in recent years, have a feature of being composed of numerous thin film layers in addition to the light emitting layer as a thin film type device.
  • Typical LED light emitting devices include a single light emitting layer, a quantum well, between a p-GaN layer and an n-GaN layer at the top and bottom to form a PN junction on a buffer layer and a substrate where GaN is free of impurities.
  • a light emitting layer using a quantum dot is formed, and a p-type transparent metal electrode for electrical contact and hole injection is formed on the p-GaN layer.
  • the metal forming the p-type transparent metal electrode has an opaque property, it is formed as thin as possible.
  • the LED device When the LED device is mounted on a package lead frame, the LED device is bonded to a wire and then packaged to cover a transparent resin, and then mounted on a substrate, and a separate optical component is installed in front of the substrate.
  • the optical component has a filter form and has various optical patterns according to the purpose of the LED light emitting device.
  • the packaged LED device has a complicated manufacturing process, which increases the manufacturing cost, and there are a plurality of layers such as a polymer layer and an adhesive layer between the circuit board and the LED device, thus preventing the efficient generation of heat generated from the LED device. There is.
  • the LED lighting product is made of a variety of forms, when forming a fine pattern in the LED light, there is a problem that must be separately produced stamps for each LED lighting form.
  • the present invention is to provide an LED lighting device and a method of manufacturing the same that can efficiently release heat while improving the productivity by simplifying the manufacturing process.
  • An LED lighting apparatus includes a housing forming an external shape, a plate-shaped circuit board, a plurality of LED elements mounted on the circuit board, and a plurality of LEDs covering the plurality of LEDs and having an optical pattern formed on a surface thereof.
  • An LED package includes a transparent resin layer.
  • the light transmissive resin layer may be formed of one layer, the light transmissive resin layer may be formed to cover all of the LED elements, the light transmissive resin layer is made of a plurality of layers, and the plurality of layers are each It may be formed to cover all the LED elements.
  • a support protrusion may be formed at a side end of the light transmissive resin layer.
  • the light transmitting resin layer may further include a phosphor.
  • a method of manufacturing an LED lighting apparatus includes a substrate preparation step, an LED mounting step of installing an LED element on the substrate, a wire bonding step of electrically connecting the LED element and the substrate, and a plurality of A transparent resin layer forming step of forming a transparent resin layer on the substrate to cover the LED elements, and an optical pattern forming step of forming a pattern on the transparent resin layer.
  • a transparent resin layer may be formed on the entire surface of the substrate except for a portion adjacent to an edge of the substrate.
  • the optical pattern forming step may form a pattern on the surface of the light-transmissive resin layer using a stamp in an imprint method, the optical pattern forming step is a pattern on the surface of the substrate by using a laser pattern Can be formed.
  • the preparing of the substrate may further include forming a support protrusion along the side end of the substrate inside the side end of the substrate, and may further include mounting the substrate in a housing forming an outer shape.
  • a method of manufacturing an LED lighting apparatus a substrate preparing step, an LED mounting step of installing an LED element on the substrate, a wire bonding step of electrically connecting the LED element and the substrate, and a plurality of the LEDs.
  • the transparent resin layer forming step may be formed so that one transparent resin layer covers all the LED elements installed on the substrate, and the transparent resin layer forming step may be performed except for a portion adjacent to an edge of the substrate.
  • the light transmissive resin layer may be formed on the entire surface of the substrate.
  • the stamp cutter may be formed to have an annular cross section corresponding to the cross-sectional shape of the stamp cutter, and the light transmitting resin layer may further include a phosphor.
  • a mold having a pattern in which a pattern is formed on a stamp base material may be rotated to transfer a pattern formed on the mold onto the stamp base material, and the substrate may be a printed circuit board.
  • the preparing of the substrate may further include forming a supporting protrusion along a side end of the substrate inside the edge of the substrate, and may further include mounting the substrate in a housing forming an outer shape.
  • the LED lighting apparatus since a plurality of LED elements are directly mounted on a circuit board, heat generated from the LED elements may be efficiently emitted.
  • the LED devices are covered with a single transparent resin layer, which simplifies the production process and increases productivity.
  • a fine pattern may be easily formed on an LED lighting apparatus having various shapes in which patterns are formed using a stamp cutter.
  • the optical pattern is formed on the transparent resin layer, a separate optical component is not required, and the transparent resin layer itself functions as an optical component, thereby reducing manufacturing costs and further improving productivity.
  • FIG. 1 is a plan view showing an LED lighting apparatus according to a first embodiment of the present invention.
  • FIG. 2 is a cross-sectional view taken along the line II-II of FIG. 1.
  • 3 to 9 are views for explaining the manufacturing method of the LED lighting apparatus according to the first embodiment of the present invention.
  • FIG. 10 is a view for explaining a manufacturing method of the LED lighting apparatus according to the second embodiment of the present invention.
  • FIG. 11 is a plan view of the LED lighting apparatus according to the third embodiment of the present invention.
  • FIG. 12 is a cross-sectional view taken along the line VI-VI in FIG. 11.
  • FIG. 13 to 21 are views for explaining the manufacturing method of the LED lighting apparatus according to the third embodiment of the present invention.
  • stamp base material 362 mold
  • on means to be located above or below the target member, and does not necessarily mean to be located above the gravity direction.
  • FIG. 1 is a plan view showing an LED lighting apparatus according to a first embodiment of the present invention
  • Figure 2 is a cross-sectional view taken along the line II-II in FIG.
  • the LED lighting apparatus 200 includes a circuit board 110, a plurality of LED devices 120 and the LED devices (installed on the circuit board 110).
  • the LED package 100 having the light-transmissive resin layer 130 covering the 120, and the LED package 100 is embedded therein and includes a housing 210.
  • the circuit board 110 may be formed of a plate shape and may be formed of a printed circuit board (PCB) which is commonly used.
  • the circuit board 110 may be formed of various types of plates, such as a square plate, a triangular plate, and a disc.
  • the support protrusion 112 is formed on the circuit board 110 at a position adjacent to the side end of the circuit board 110.
  • the support protrusion 112 is formed to be spaced apart from the side end of the circuit board 110 by a predetermined distance, and is formed along the side end of the circuit board 110. Accordingly, the support protrusion 112 is formed in a ring shape.
  • the LED device 120 is mounted inside the support protrusion 112 and is formed of a conventional LED device including an N-type layer, a light emitting layer, and a P-type layer.
  • a conventional LED device including an N-type layer, a light emitting layer, and a P-type layer.
  • the present invention is not limited to the type of LED device, and various types of LED devices may be applied.
  • the LED element 120 is installed so that the bottom is in close contact with the circuit board 110 and in contact with the circuit board 110. Accordingly, heat generated in the LED device 120 is quickly transferred to the circuit board 110, thereby improving heat dissipation efficiency.
  • the LED device 120 is formed with a wire 125 that electrically connects the LED device 120 and the circuit board 110.
  • the wires 125 are fixed to the LED device 120 and the circuit board 110 to transfer current to the LED device 120.
  • the light transmissive resin layer 130 is formed on the circuit board 110, and the light transmissive resin layer 130 is entirely formed inside the support protrusion 112. Accordingly, the transparent resin layer 130 is formed as one layer on the entire surface of the circuit board 110 except for the portion adjacent to the edge of the circuit board 110.
  • the present invention is not limited thereto, and the light transmissive resin layer 130 may have a structure in which a plurality of layers are stacked.
  • the process time can be shortened as compared with the case where the transparent resin layer 130 is formed for each LED element 120.
  • the production cost can be reduced because expensive equipment for precisely forming the light transmissive resin layer is not required for each LED device.
  • the LED lighting apparatus 200 of the present embodiment can not only simplify the manufacturing process but also improve productivity and reduce manufacturing costs.
  • the transparent resin layer 130 is attached to the circuit board 110 and fixed integrally on the circuit board, and the optical pattern 135 is formed on the surface of the transparent resin layer 130.
  • the optical pattern 135 may be formed of various types of patterns, such as a diffusion pattern, a prism pattern, a concentration pattern, and a fresnel pattern.
  • the light transmissive resin layer 130 may include a phosphor capable of exhibiting a specific color such as white light in the light transmissive resin.
  • the housing 210 has a space in which the LED package 100 is built, and forms an overall appearance of the LED lighting device 200. Openings are formed at the light exiting side of the housing 210. However, transparent glass or the like may be provided in the opening.
  • 3 to 9 are views for explaining the manufacturing method of the LED lighting apparatus according to the first embodiment of the present invention.
  • a substrate preparation step 110 an LED mounting step, a wire 125 bonding step, a transparent resin layer 130 forming step, and an optical pattern 135 are formed. Steps.
  • the substrate preparation step prepares the circuit board 110.
  • the circuit board 110 may be made of a general printed circuit board.
  • the support protrusion 112 spaced at a predetermined interval from the corner of the circuit board 110 is formed.
  • the support protrusion 112 may be integrally manufactured at the time of manufacturing the circuit board 110 or may be separately formed.
  • the LED mounting step mounts the plurality of LED elements 120 on the circuit board 110.
  • the LED elements 120 are mounted at predetermined positions spaced apart from each other by a predetermined interval.
  • the wire bonding step bonds the wires 125 that electrically connect the LED device 120 and the circuit board 110. Bonding the wire 125 allows the current to be stably supplied to the LED device 120 through the circuit board 110.
  • the step of forming the transparent resin layer forms the transparent resin layer 130 on the circuit board 110.
  • the resin having initial fluidity is applied to the circuit board 110 as a whole so that the resin covers the circuit board 110 as a whole.
  • the transparent resin layer 130 is formed on the inner front surface of the support protrusion 112, and one layer is formed to cover all of the LED devices 120 mounted on the circuit board 110.
  • other layers may be stacked on the one layer in the vertical direction so that a plurality of layers may cover all of the LED devices 120.
  • the optical pattern forming step may be performed by imprinting a stamp 150 having the pattern 152 formed on the light transmissive resin layer 130 before the light transmissive resin layer 130 is completely hardened.
  • An optical pattern 135 is formed on the resin layer 130.
  • the transparent resin layer 130 having fluidity is pressed with the stamp 150 to transfer the pattern.
  • the stamp 150 is removed to be placed on the transparent resin layer 130.
  • the optical pattern 135 is formed.
  • the optical pattern 135 is formed on the surface from which light is emitted.
  • the circuit board 110 is mounted on the housing 210 forming the external shape to complete the LED lighting device 200.
  • the LED device 120 is directly attached to the circuit board 110 and the transparent resin layer 130 is formed at one time, thereby greatly simplifying the process compared to the conventional method, thereby improving productivity. do.
  • FIG. 10 is a view for explaining a manufacturing method of the LED lighting apparatus according to the second embodiment of the present invention.
  • the manufacturing method of the LED lighting apparatus according to the present embodiment has the same configuration as the manufacturing method of the LED lighting apparatus according to the first embodiment except for the optical pattern forming step, redundant description of the same configuration will be omitted. .
  • the optical pattern 135 is formed by directly irradiating the laser 160 to the light transmissive resin layer 130. In this way, when the optical pattern 135 is formed by irradiating the laser 160 in a direct processing method, various types of optical patterns 135 may be easily formed.
  • FIG. 11 is a plan view illustrating an LED lighting apparatus according to a third exemplary embodiment of the present invention
  • FIG. 12 is a cross-sectional view taken along line VI-VI in FIG. 11.
  • the LED lighting apparatus 400 includes a substrate 310, a plurality of LED elements 320 installed on the substrate 310, and the LED elements 120.
  • LED package 300 having a transparent resin layer 330 covering the, and the LED package 300 is embedded and includes a housing 410 forming an appearance.
  • the substrate 310 may have a plate shape and may be formed of a printed circuit board (PCB) which is commonly used.
  • PCB printed circuit board
  • the substrate 310 according to the present embodiment has an elliptical shape.
  • the present invention is not limited thereto and may be made of various types of plates such as plates.
  • the support protrusion 312 is formed at a position adjacent to the side end of the substrate 310 on the substrate 310.
  • the support protrusion 312 is formed to be spaced apart from the end of the substrate 310 by a predetermined distance, and is formed along the circumferential direction of the substrate 310. Accordingly, the support protrusion 312 has an elliptical annular cross section.
  • the LED device 320 is mounted inside the support protrusion 312 and is formed of a conventional LED device including an N-type layer, a light emitting layer, and a P-type layer.
  • a conventional LED device including an N-type layer, a light emitting layer, and a P-type layer.
  • the present invention is not limited to the type of LED device, and various types of LED devices may be applied.
  • the LED element 320 is installed so that the bottom is in close contact with the substrate 310 and in contact with the substrate 310. Accordingly, heat generated in the LED device 320 is quickly transferred to the substrate 310, thereby improving heat dissipation efficiency.
  • the LED element 320 is provided with a wire 325 for electrically connecting the LED element 320 and the substrate 310.
  • the wires 325 are respectively fixed to the LED device 320 and the substrate 310 to transfer current to the LED device 320.
  • the light transmissive resin layer 330 is formed on the substrate 310, and the light transmissive resin layer 330 is entirely formed inside the support protrusion 312. Accordingly, the transparent resin layer 330 is formed as one layer on the entire surface of the substrate 310 except for the portion adjacent to the edge of the substrate 310.
  • the present invention is not limited thereto, and the light transmissive resin layer 330 may have a structure in which a plurality of layers are stacked in a direction perpendicular to the substrate 310.
  • the process time can be shortened as compared with the case where the transparent resin layer 330 is formed for each LED element 320.
  • the production cost can be reduced because expensive equipment for precisely forming the light transmissive resin layer is not required for each LED device.
  • the transparent resin layer 330 may be made of a resin containing a phosphor for displaying a specific color, such as white light.
  • the light transmissive resin layer 330 is made of a resin containing phosphors, the light emitted from the LED device 320 has a fluorescent property without applying a separate phosphor.
  • the LED lighting apparatus 400 of the present embodiment may not only simplify the manufacturing process but also improve productivity and reduce manufacturing cost.
  • the transparent resin layer 330 is attached to the substrate 310 to be integrally fixed on the substrate, and an optical pattern 335 is formed on the surface of the transparent resin layer 330.
  • the optical pattern 335 may be formed of various types of patterns, such as a diffusion pattern, a prism pattern, a concentration pattern, a fresnel pattern, and an antireflection pattern.
  • the housing 410 has a space in which the LED package 300 is built, and forms an overall appearance of the LED lighting device 400.
  • An opening is formed at the side from which the light is emitted from the housing 410.
  • transparent glass or the like may be provided in the opening.
  • FIG. 13 to 21 are views for explaining the manufacturing method of the LED lighting apparatus according to the third embodiment of the present invention.
  • the method of manufacturing the LED lighting apparatus according to the present embodiment may include preparing a substrate 310, mounting an LED, bonding a wire 325, forming a transparent resin layer 330, and forming an optical pattern 335. Steps.
  • the substrate preparation step prepares the substrate 310.
  • the substrate 310 may be formed of a general printed circuit board, and may be formed of an elliptic plate.
  • the substrate preparation step includes forming the support protrusion 312 on the substrate. In the forming of the support protrusions 312, when the substrate 310 is prepared, the support protrusions 312 are formed at positions spaced at predetermined intervals from the side ends of the substrate 310 to the inside.
  • the support protrusion 312 is subsequently formed along the circumferential direction of the substrate 310, and may be integrally manufactured at the time of manufacturing the substrate 310 or separately formed after the substrate 310 is manufactured.
  • the LED mounting step mounts the plurality of LED elements 320 on the substrate 310.
  • the LED elements 120 are mounted at predetermined positions spaced apart from each other by a predetermined interval.
  • the wire bonding step bonds the wire 325 electrically connecting the LED device 320 and the substrate 310. Bonding the wire 325 may stably supply current to the LED device 320 through the substrate 310.
  • the step of forming the transparent resin layer forms the transparent resin layer 330 on the substrate 310.
  • the resin having initial fluidity is applied to the substrate 310 as a whole so that the resin covers the substrate 310 as a whole.
  • the transparent resin layer 330 is formed in an elliptic plate shape.
  • the transparent resin layer 330 is formed on the inner front surface of the support protrusion 312, and one layer is formed so as to cover all of the LED device 320 mounted on the substrate 310.
  • other layers may be stacked on the one layer in the vertical direction to form a plurality of layers covering all of the LED elements 320.
  • the transparent resin layer may further include a phosphor by adding a phosphor for displaying a specific color such as white light to the material of the transparent resin layer 330.
  • the optical pattern forming step includes a stamp base material 361 pattern forming step of transferring the pattern 363 onto a stamp base material 361 made of a polymer, and a stamp cutter having an annular cross section ( The cutting step of cutting the stamp base material 361 using the seal 365 and the hardening of the cut stamp 350 to produce the stamp 350, and the imprint to the light-transmissive resin layer 330 using the stamp 350 An imprint step of forming a pattern in a manner.
  • the stamp base material pattern forming step includes placing the mold 362 in a state in which a roll-shaped mold 362 having a pattern 362a is formed on a plate-shaped stamp base material 361 extending in one direction. By rotating, the pattern 363 is transferred onto the stamp base material 361.
  • the stamp base material 361 may be made of photocurable resin or thermosetting resin.
  • the cutting step cuts and extracts the stamp base material 361 using the stamp cutter 365 having an empty oval tube shape.
  • the stamp cutter 365 has an open bottom structure and has a cross-sectional shape corresponding to the cross-sectional shape of the stamp 350.
  • the stamp cutter 365 Since the stamp cutter 365 according to the present exemplary embodiment has a tubular shape, and has a ring-shaped cross section, the stamp cutter 365 presses the stamp base material 361 with the stamp base material 361 to form a stamp 350. Cut into In this embodiment, the stamp cutter 365 is illustrated as being made of a tubular shape, but the present invention is not limited thereto, and the stamp cutter 365 is open at the bottom thereof and is formed of a structure having a ring-shaped cross section, the top of which is blocked. It may be made of a structure.
  • a stamp 350 having a desired shape can be easily extracted from the stamp base material 361 according to the shape of the stamp cutter 365.
  • stamps of various shapes can be easily manufactured.
  • the LED lighting device of various shapes should be manufactured, a variety of stamps can be produced from a single stamp base material.
  • the cut stamp 350 is irradiated with light such as ultraviolet rays to cure the cut stamp 350.
  • a pattern 352 having the same shape as the pattern 363 formed on the stamp base material 361 is formed, and the stamp 350 is formed in a substantially elliptic plate shape.
  • the stamp 350 is made of a photocurable resin to cure the stamp 350 by irradiating light, but the present invention is not limited thereto, and the stamp may be made of a thermosetting resin, in which case the stamp It heats and hardens
  • the stamp 350 on which the pattern 352 is formed is imprinted onto the light transmissive resin layer 330 before the light transmissive resin layer 330 is completely hardened.
  • the optical pattern 335 is formed in the film.
  • the transparent resin layer 330 having fluidity is pressed by the stamp 350 to transfer the pattern.
  • the stamp 350 is removed to form the light on the transparent resin layer 330.
  • the optical pattern 335 is formed.
  • the optical pattern 335 is formed on the surface from which light is emitted.
  • the substrate 310 is mounted on the housing 410 forming the external shape to complete the LED lighting device 400.
  • the LED device 320 is directly attached to the substrate 310 and the light-transmissive resin layer 330 is formed at a time, thereby greatly simplifying the process compared to the conventional method, thereby improving productivity. .

Abstract

An LED lighting device according to an aspect of the present invention comprises a housing configuring the exterior of the device and an LED package. The LED package includes a plate-shaped circuit board, a plurality of LED devices mounted on the circuit board, and a light transmitting resin layer covering the LED devices and including an optical pattern formed on the surface thereof.

Description

회로기판 일체형 ＬＥＤ 패키지를 갖는 ＬＥＤ 조명 장치 및 그 제조 방법LED lighting device having a circuit board integrated LED package and a method of manufacturing the same
본 발명은 LED 조명 장치 및 그 제조 방법에 관한 것으로서 더욱 상세하게는 제작이 용이한 LED 조명 장치 및 그 제조 방법에 관한 것이다.The present invention relates to an LED lighting apparatus and a method of manufacturing the same, and more particularly, to an LED lighting apparatus and a method of manufacturing the same.
현재 사용되거나 연구되고 있는 발광소자들 중에서 많은 소자들이 점발광소자들이다. 이러한 점발광소자들은 내부의 한점에서 발생한 광자(광)가 공간상의 전방향으로 나아가게 된다. 최근에 관심을 모으고 있는 유기 EL이나 LED 등의 발광소자들은 박막형 소자로써 발광층 외에도 수많은 박막층으로 구성되어 있는 특징을 가진다.Many of the light emitting devices currently used or being studied are point light emitting devices. In such point light emitting devices, photons (light) generated at one point in the interior are advanced in a space in all directions. Light emitting devices, such as organic EL and LED, which have attracted attention in recent years, have a feature of being composed of numerous thin film layers in addition to the light emitting layer as a thin film type device.
일반적인 LED 발광 소자는 버퍼층과 불순물이 주입되지 않은 GaN가 형성되어 있는 기판 상에 PN 접합(junction)을 만들어주기 위하여 상부와 하부의 p-GaN층과 n-GaN층 사이에 단일 발광층, 양자 우물, 양자점등을 이용한 발광층이 형성되고, p-GaN층 상에는 전기적 접촉과 정공 주입을 위한 p형 투명 금속 전극이 형성된 구조를 갖는다. 이때, 상기 p형 투명 금속 전극을 이루는 금속은 불투명한 성질이 있으므로, 가능한 얇게 형성한다.Typical LED light emitting devices include a single light emitting layer, a quantum well, between a p-GaN layer and an n-GaN layer at the top and bottom to form a PN junction on a buffer layer and a substrate where GaN is free of impurities. A light emitting layer using a quantum dot is formed, and a p-type transparent metal electrode for electrical contact and hole injection is formed on the p-GaN layer. At this time, since the metal forming the p-type transparent metal electrode has an opaque property, it is formed as thin as possible.
이러한 LED 소자는 패키지 리드 프레임(lead frame)에 LED 소자가 장착되면 와이어를 본딩한 후 광투과성 레진을 덮는 패키징 공정을 거친 후 기판에 장착되며, 기판의 앞쪽에 별도의 광학 부품을 설치한다. 광학 부품은 필터 형태로 이루어지며 LED 발광 장치의 목적에 따라 다양한 광학 패턴을 갖는다.When the LED device is mounted on a package lead frame, the LED device is bonded to a wire and then packaged to cover a transparent resin, and then mounted on a substrate, and a separate optical component is installed in front of the substrate. The optical component has a filter form and has various optical patterns according to the purpose of the LED light emitting device.
그러나 이와 같이 패키징된 LED 소자는 제작 공정이 복잡하여 제작 원가가 상승하고, 회로 보드와 LED 소자 사이에 폴리머층, 접착층 등 복수 개의 층들이 존재하여 LED 소자에서 발생된 열을 효율적으로 방출시키지 못하는 문제가 있다.However, the packaged LED device has a complicated manufacturing process, which increases the manufacturing cost, and there are a plurality of layers such as a polymer layer and an adhesive layer between the circuit board and the LED device, thus preventing the efficient generation of heat generated from the LED device. There is.
이러한 문제를 해결하기 위해서 LED 소자를 기판에 직접 실장하는 방법이 제안되었다. LED 소자를 기판에 직접 실장하면 LED 소자에서 발생된 열을 기판으로 직접 전달하므로 효율적으로 열을 방출시킬 수 있으나, 각각의 LED 소자에 별도의 레진을 도포해야 하므로 정밀한 디스펜싱 공정 또는 고가의 몰딩 공정이 실시되어야 한다. 이러한 공정은 시간이 오래 걸리거나 제조 원가가 상승하는 문제가 있다. In order to solve this problem, a method of directly mounting an LED device on a substrate has been proposed. Direct mounting of LED elements on a substrate transfers heat generated from the LED elements directly to the substrate, allowing efficient heat dissipation.However, precise dispensing or expensive molding processes must be applied to each LED element. This should be done. Such a process takes a long time or a problem of rising manufacturing cost.
또한, LED 조명 제품은 다양한 형태로 이루어지는 바, LED 조명에 미세 패턴을 형성할 경우, 각각의 LED 조명 형태에 맞는 스탬프를 별도로 제작해야 하는 문제가 있다.In addition, the LED lighting product is made of a variety of forms, when forming a fine pattern in the LED light, there is a problem that must be separately produced stamps for each LED lighting form.
본 발명은 열을 효율적으로 방출하면서도 제작 공정이 단순화되어 생산성을 향상시킬 수 있는 LED 조명 장치 및 이의 제조 방법을 제공하고자 한다.The present invention is to provide an LED lighting device and a method of manufacturing the same that can efficiently release heat while improving the productivity by simplifying the manufacturing process.
본 발명의 일 실시예에 따른 LED 조명 장치는 외형을 이루는 하우징, 및 판 형상의 회로 기판과 상기 회로 기판 상에 실장된 복수 개의 LED 소자와 상기 복수 개의 LED들을 덮으며 표면에 광학 패턴이 형성된 광투과성 레진층을 포함하는 LED 패키지를 포함한다.An LED lighting apparatus according to an embodiment of the present invention includes a housing forming an external shape, a plate-shaped circuit board, a plurality of LED elements mounted on the circuit board, and a plurality of LEDs covering the plurality of LEDs and having an optical pattern formed on a surface thereof. An LED package includes a transparent resin layer.
상기 광투과성 레진층은 하나의 층으로 이루어지고, 상기 광투과성 레진층은 상기 LED 소자들을 모두 덮도록 형성될 수 있으며, 상기 광투과성 레진층은 복수 개의 층으로 이루어지고, 상기 복수의 층이 각각 상기 LED 소자들을 모두 덮도록 형성될 수 있다. 또한, 상기 광투과성 레진층의 측단에는 지지 돌기가 이어져 형성될 수 있다. 또한 상기 광투과성 레진층은 형광체를 더 포함할 수 있다.The light transmissive resin layer may be formed of one layer, the light transmissive resin layer may be formed to cover all of the LED elements, the light transmissive resin layer is made of a plurality of layers, and the plurality of layers are each It may be formed to cover all the LED elements. In addition, a support protrusion may be formed at a side end of the light transmissive resin layer. In addition, the light transmitting resin layer may further include a phosphor.
본 발명의 일 실시예에 따른 LED 조명 장치의 제조 방법은 기판 준비 단계와 상기 기판 상에 LED 소자를 설치하는 LED 실장 단계와, 상기 LED 소자와 기판을 전기적으로 연결하는 와이어 본딩 단계와, 복수 개의 상기 LED 소자들을 덮도록 상기 기판 상에 광투과성 레진층을 형성하는 광투과성 레진층 형성 단계, 및 상기 광투과성 레진층에 패턴을 형성하는 광학 패턴 형성 단계를 포함한다.A method of manufacturing an LED lighting apparatus according to an embodiment of the present invention includes a substrate preparation step, an LED mounting step of installing an LED element on the substrate, a wire bonding step of electrically connecting the LED element and the substrate, and a plurality of A transparent resin layer forming step of forming a transparent resin layer on the substrate to cover the LED elements, and an optical pattern forming step of forming a pattern on the transparent resin layer.
상기 광투과성 레진층 형성 단계는 상기 기판의 모서리와 인접한 부분을 제외한 상기 기판의 전면에 광투과성 레진층을 형성할 수 있다. 또한, 상기 광학 패턴 형성 단계는 스탬프를 이용하여 상기 광투과성 레진층의 표면에 임프린트 방식으로 패턴을 형성할 수 있으며, 상기 광학 패턴 형성 단계는 레이저를 이용하여 상기 기판의 표면에 직가공 방식으로 패턴을 형성할 수 있다.In the step of forming the transparent resin layer, a transparent resin layer may be formed on the entire surface of the substrate except for a portion adjacent to an edge of the substrate. In addition, the optical pattern forming step may form a pattern on the surface of the light-transmissive resin layer using a stamp in an imprint method, the optical pattern forming step is a pattern on the surface of the substrate by using a laser pattern Can be formed.
상기 기판 준비 단계는 상기 기판의 측단 내측에 상기 기판의 측단을 따라 지지돌기를 형성하는 단계를 더 포함할 수 있으며, 상기 기판을 외형을 이루는 하우징에 장착하는 단계를 더 포함할 수 있다.The preparing of the substrate may further include forming a support protrusion along the side end of the substrate inside the side end of the substrate, and may further include mounting the substrate in a housing forming an outer shape.
본 발명의 일 측면에 따른 LED 조명 장치의 제조 방법은 기판 준비 단계와, 상기 기판 상에 LED 소자를 설치하는 LED 실장 단계와 상기 LED 소자와 기판을 전기적으로 연결하는 와이어 본딩 단계와 복수 개의 상기 LED 소자들을 덮도록 상기 기판 상에 광투과성 레진층을 형성하는 광투과성 레진층 형성 단계, 및 상기 광투과성 레진층에 패턴을 형성하는 광학 패턴 형성 단계를 포함하고 상기 광학 패턴 형성 단계는, 레진으로 이루어진 스탬프 모재 상에 패턴을 전사하는 스탬프 모재 패턴 형성 단계와, 스탬프 커터를 이용하여 스탬프 모재를 자르는 커팅 단계와, 잘려진 스탬프 모재를 경화시켜서 스탬프를 제작하는 경화 단계, 및 상기 스탬프를 이용하여 상기 광투과성 레진층에 임프린트 방식으로 패턴을 형성하는 임프린트 단계를 포함한다.According to an aspect of the present invention, there is provided a method of manufacturing an LED lighting apparatus, a substrate preparing step, an LED mounting step of installing an LED element on the substrate, a wire bonding step of electrically connecting the LED element and the substrate, and a plurality of the LEDs. A transparent resin layer forming step of forming a transparent resin layer on the substrate to cover the devices, and an optical pattern forming step of forming a pattern on the transparent resin layer, wherein the optical pattern forming step is formed of a resin A stamp base material pattern forming step of transferring a pattern on a stamp base material, a cutting step of cutting a stamp base material using a stamp cutter, a curing step of hardening a cut stamp base material to produce a stamp, and the light transmitting property using the stamp An imprint step of forming a pattern on the resin layer by an imprint method.
상기 광투과성 레진층 형성 단계는 하나의 광투과성 레진층이 상기 기판 상에 설치된 모든 상기 LED 소자들을 덮도록 형성할 수 있으며, 상기 광투과성 레진층 형성 단계는 상기 기판의 모서리와 인접한 부분을 제외한 상기 기판의 전면에 상기 광투과성 레진층을 형성할 수 있다.The transparent resin layer forming step may be formed so that one transparent resin layer covers all the LED elements installed on the substrate, and the transparent resin layer forming step may be performed except for a portion adjacent to an edge of the substrate. The light transmissive resin layer may be formed on the entire surface of the substrate.
상기 스탬프 커터는 상기 스탬프 커터의 단면 형상과 대응되는 고리 형상의 횡단면을 갖도록 이루어질 수 있으며 상기 광투과성 레진층은 형광체를 더 포함할 수 있다.The stamp cutter may be formed to have an annular cross section corresponding to the cross-sectional shape of the stamp cutter, and the light transmitting resin layer may further include a phosphor.
스탬프 모재 패턴 형성 단계는 스탬프 모재 상에서 패턴이 형상된 롤 형태의 금형을 회전시켜서 상기 금형에 형성된 패턴을 상기 스탬프 모재 상으로 전사할 수 있으며, 상기 기판은 인쇄 회로 기판으로 이루어질 수 있다.In the stamp base material pattern forming step, a mold having a pattern in which a pattern is formed on a stamp base material may be rotated to transfer a pattern formed on the mold onto the stamp base material, and the substrate may be a printed circuit board.
상기 기판 준비 단계는 상기 기판의 모서리 내측에 상기 기판의 측단을 따라 지지돌기를 형성하는 단계를 더 포함할 수 있으며, 상기 기판을 외형을 이루는 하우징에 장착하는 단계를 더 포함할 수 있다.The preparing of the substrate may further include forming a supporting protrusion along a side end of the substrate inside the edge of the substrate, and may further include mounting the substrate in a housing forming an outer shape.
본 발명에 의한 LED 조명 장치는 복수 개의 LED 소자들이 회로 기판에 직접 실장되므로 LED 소자들에서 발생된 열을 효율적으로 방출할 수 있다. 또한, LED 소자들이 하나의 광투과성 레진층으로 덮여있으므로 생산 공정이 단순화되어 생산성이 향상된다. In the LED lighting apparatus according to the present invention, since a plurality of LED elements are directly mounted on a circuit board, heat generated from the LED elements may be efficiently emitted. In addition, the LED devices are covered with a single transparent resin layer, which simplifies the production process and increases productivity.
본 발명의 일 측면에 따른 LED 조명 장치의 제조 방법은 스탬프 커터를 이용하여 패턴이 형성된 다양한 형상의 LED 조명 장치에 미세 패턴을 용이하게 형성할 수 있다.In the method of manufacturing an LED lighting apparatus according to an aspect of the present invention, a fine pattern may be easily formed on an LED lighting apparatus having various shapes in which patterns are formed using a stamp cutter.
또한, 광투과성 레진층 상에 광학 패턴이 형성되어 있으므로 별도의 광학부품이 필요치 않으며 광투과성 레진층 자체가 광학부품으로 기능을 하므로 제조 원가를 절감하고 생산성이 더욱 향상된다.In addition, since the optical pattern is formed on the transparent resin layer, a separate optical component is not required, and the transparent resin layer itself functions as an optical component, thereby reducing manufacturing costs and further improving productivity.
도 1은 본 발명의 제1 실시예에 따른 LED 조명 장치를 도시한 평면도이다.1 is a plan view showing an LED lighting apparatus according to a first embodiment of the present invention.
도 2는 도 1에서 Ⅱ-Ⅱ선을 따라 잘라 본 단면도이다.FIG. 2 is a cross-sectional view taken along the line II-II of FIG. 1.
도 3 내지 도 9는 본 발명의 제1 실시예에 따른 LED 조명 장치의 제조 방법을 설명하기 위한 도면이다.3 to 9 are views for explaining the manufacturing method of the LED lighting apparatus according to the first embodiment of the present invention.
도 10은 본 발명의 제2 실시예에 따른 LED 조명 장치의 제조 방법을 설명하기 위한 도면이다.10 is a view for explaining a manufacturing method of the LED lighting apparatus according to the second embodiment of the present invention.
도 11은 본 발명의 제3 실시예에 따른 LED 조명 장치를 도시한 평면도이다.11 is a plan view of the LED lighting apparatus according to the third embodiment of the present invention.
도 12는 도 11에서 Ⅵ-Ⅵ선을 따라 잘라 본 단면도이다.12 is a cross-sectional view taken along the line VI-VI in FIG. 11.
도 13 내지 도 21은 본 발명의 제3 실시예에 따른 LED 조명 장치의 제조 방법을 설명하기 위한 도면이다.13 to 21 are views for explaining the manufacturing method of the LED lighting apparatus according to the third embodiment of the present invention.
<도면의 주요 부분에 대한 부호의 설명><Explanation of symbols for the main parts of the drawings>
100, 300: LED 패키지 110: 회로 기판100, 300: LED package 110: circuit board
112, 312: 지지 돌기 120, 320: LED 소자112, 312: support protrusions 120, 320: LED elements
125, 325: 와이어 130, 330: 광투과성 레진층125 and 325 wire 130 and 330 light-transmissive resin layer
135, 335: 광학 패턴 150, 350: 스탬프135, 335: optical patterns 150, 350: stamp
152, 352: 패턴 200, 400: LED 조명 장치152, 352: pattern 200, 400: LED lighting device
210, 410: 하우징 310: 기판210, 410: housing 310: substrate
361: 스탬프 모재 362: 금형361: stamp base material 362: mold
365: 스탬프 커터365: stamp cutter
본 기재에 있어서 "~상에"라 함은 대상부재의 위 또는 아래에 위치함을 의미하는 것이며, 반드시 중력방향을 기준으로 상부에 위치하는 것을 의미하는 것은 아니다.In the present description, "on" means to be located above or below the target member, and does not necessarily mean to be located above the gravity direction.
이하, 첨부된 도면을 참조하여 본 발명이 속하는 기술 분야에서 통상의 지식을 가진 자가 용이하게 실시할 수 있도록 본 발명의 실시예를 상세히 설명한다. 그러나 본 발명은 여러 가지 상이한 형태로 구현될 수 있으며 이하에서 설명하는 실시예에 한정되지 않는다. 그리고 도면에서 본 발명을 명확하게 설명하기 위해서 설명과 관계없는 부분은 생략하였으며, 명세서 전체를 통하여 동일 또는 유사한 구성요소에 대해서는 동일한 참조부호를 붙였다.Hereinafter, exemplary embodiments of the present invention will be described in detail with reference to the accompanying drawings so that those skilled in the art may easily implement the present invention. As those skilled in the art would realize, the described embodiments may be modified in various different ways, all without departing from the spirit or scope of the present invention. In the drawings, parts irrelevant to the description are omitted in order to clearly describe the present invention, and like reference numerals designate like elements throughout the specification.
도 1은 본 발명의 제1 실시예에 따른 LED 조명 장치를 도시한 평면도이고, 도 2는 도 1에서 Ⅱ-Ⅱ선을 따라 잘라 본 단면도이다.1 is a plan view showing an LED lighting apparatus according to a first embodiment of the present invention, Figure 2 is a cross-sectional view taken along the line II-II in FIG.
도 1 및 도 2를 참조하여 설명하면, 본 실시예에 따른 LED 조명 장치(200)는 회로 기판(110)과 회로 기판(110) 상에 설치된 복수 개의 LED 소자(120)와 상기 LED 소자들(120)을 덮는 광투과성 레진층(130)을 갖는 LED 패키지(100), 및 LED 패키지(100)가 내장되며 외형을 이루는 하우징(210)을 포함한다.1 and 2, the LED lighting apparatus 200 according to the present embodiment includes a circuit board 110, a plurality of LED devices 120 and the LED devices (installed on the circuit board 110). The LED package 100 having the light-transmissive resin layer 130 covering the 120, and the LED package 100 is embedded therein and includes a housing 210.
회로 기판(110)은 판 형상으로 이루어지며 통상적으로 이용되는 인쇄 회로 기판(PCB)으로 이루어질 수 있다. 회로 기판(110)은 사각판, 삼각판, 원판 등 다양한 형태의 판으로 이루어질 수 있다.The circuit board 110 may be formed of a plate shape and may be formed of a printed circuit board (PCB) which is commonly used. The circuit board 110 may be formed of various types of plates, such as a square plate, a triangular plate, and a disc.
회로 기판(110) 상에는 회로 기판(110)의 측단과 인접한 위치에 지지 돌기(112)가 형성된다. 지지 돌기(112)는 회로 기판(110)의 측단에서 소정 거리 이격되어 형성되며, 회로 기판(110)의 측단을 따라 이어져 형성된다. 이에 따라 지지 돌기(112)는 고리 형상으로 이루어진다.The support protrusion 112 is formed on the circuit board 110 at a position adjacent to the side end of the circuit board 110. The support protrusion 112 is formed to be spaced apart from the side end of the circuit board 110 by a predetermined distance, and is formed along the side end of the circuit board 110. Accordingly, the support protrusion 112 is formed in a ring shape.
LED 소자(120)는 상기한 지지 돌기(112)의 내측에 실장되며, N형층과 발광층, 및 P형층을 포함하는 통상적인 LED 소자로 이루어진다. 다만, 본 발명이 LED 소자의 종류에 제한되는 것은 아니며 다양한 종류의 LED 소자가 적용될 수 있다. LED 소자(120)는 바닥이 회로 기판(110)과 밀착되어서 회로 기판(110)과 접하도록 설치된다. 이에 따라 LED 소자(120)에서 발생된 열이 회로 기판(110)으로 신속하게 전달되어 열 방출 효율이 향상된다.The LED device 120 is mounted inside the support protrusion 112 and is formed of a conventional LED device including an N-type layer, a light emitting layer, and a P-type layer. However, the present invention is not limited to the type of LED device, and various types of LED devices may be applied. The LED element 120 is installed so that the bottom is in close contact with the circuit board 110 and in contact with the circuit board 110. Accordingly, heat generated in the LED device 120 is quickly transferred to the circuit board 110, thereby improving heat dissipation efficiency.
LED 소자(120)에는 LED 소자(120)와 회로 기판(110)을 전기적으로 연결하는 와이어(125)이 형성되어 있다. 와이어(125)은 LED 소자(120)와 회로 기판(110)에 각각 고정되어 LED 소자(120)로 전류를 전달한다.The LED device 120 is formed with a wire 125 that electrically connects the LED device 120 and the circuit board 110. The wires 125 are fixed to the LED device 120 and the circuit board 110 to transfer current to the LED device 120.
회로 기판(110) 상에는 광투과성 레진층(130)이 형성되는 바, 광투과성 레진층(130)은 지지 돌기(112)의 안쪽에 전체적으로 형성된다. 이에 따라 광투과성 레진층(130)은 회로 기판(110)의 모서리와 인접한 부분을 제외한 회로 기판(110)의 전면에 하나의 층으로 형성된다. 다만, 본 발명이 이에 제한되는 것은 아니며, 광투과성 레진층(130)은 복수개의 층이 적층된 구조로 이루어질 수 있다. 일체로 형성된 광투과성 레진층(130)은 회로 기판(110) 상에 실장된 모든 LED 소자(120)를 덮는다.The light transmissive resin layer 130 is formed on the circuit board 110, and the light transmissive resin layer 130 is entirely formed inside the support protrusion 112. Accordingly, the transparent resin layer 130 is formed as one layer on the entire surface of the circuit board 110 except for the portion adjacent to the edge of the circuit board 110. However, the present invention is not limited thereto, and the light transmissive resin layer 130 may have a structure in which a plurality of layers are stacked. The transparent resin layer 130 formed integrally covers all the LED elements 120 mounted on the circuit board 110.
이와 같이 광투과성 레진층(130)을 일체로 형성하면, 각 LED 소자(120)마다 광투과성 레진층(130)을 형성하는 경우에 비하여 공정 시간을 단축시킬 수 있다. 또한, 각 LED 소자가 설치된 위치 마다 정밀하게 광투과성 레진층을 형성하는 고가의 장비가 필요하지 않으므로 생산 원가를 절감할 수 있다.As such, when the transparent resin layer 130 is integrally formed, the process time can be shortened as compared with the case where the transparent resin layer 130 is formed for each LED element 120. In addition, the production cost can be reduced because expensive equipment for precisely forming the light transmissive resin layer is not required for each LED device.
이와 같이 본 실시예의 LED 조명 장치(200)는 제조 공정이 단순화될 뿐만 아니라, 생산성이 향상되고, 제조 원가를 절감할 수 있다.As described above, the LED lighting apparatus 200 of the present embodiment can not only simplify the manufacturing process but also improve productivity and reduce manufacturing costs.
광투과성 레진층(130)은 회로 기판(110)에 부착되어 회로 기판 상에 일체로 고정되며, 광투과성 레진층(130)의 표면에는 광학 패턴(135)이 형성된다. 광학 패턴(135)은 확산 패턴, 프리즘 패턴, 집중 패턴, 프레넬(fresnel) 패턴 등 다양한 형태의 패턴으로 이루어질 수 있다.The transparent resin layer 130 is attached to the circuit board 110 and fixed integrally on the circuit board, and the optical pattern 135 is formed on the surface of the transparent resin layer 130. The optical pattern 135 may be formed of various types of patterns, such as a diffusion pattern, a prism pattern, a concentration pattern, and a fresnel pattern.
상기 광투과성 레진층(130)은 광투과성 레진에 백색광 등의 특정 색을 나타낼 수 있는 형광체가 포함될 수 있다.The light transmissive resin layer 130 may include a phosphor capable of exhibiting a specific color such as white light in the light transmissive resin.
하우징(210)은 LED 패키지(100)가 내장되는 공간을 갖고, LED 조명 장치(200)의 전체적인 외형을 형성한다. 하우징(210)에서 빛이 출사되는 쪽에는 개구가 형성된다. 다만, 개구에는 투명한 유리 등이 설치될 수도 있다. The housing 210 has a space in which the LED package 100 is built, and forms an overall appearance of the LED lighting device 200. Openings are formed at the light exiting side of the housing 210. However, transparent glass or the like may be provided in the opening.
도 3 내지 도 9는 본 발명의 제1 실시예에 따른 LED 조명 장치의 제조 방법을 설명하기 위한 도면이다.3 to 9 are views for explaining the manufacturing method of the LED lighting apparatus according to the first embodiment of the present invention.
본 실시예에 따른 LED 조명 장치의 제조 방법은 기판 준비(110) 단계와, LED 실장 단계와, 와이어(125) 본딩 단계와, 광투과성 레진층(130) 형성 단계, 및 광학 패턴(135) 형성 단계를 포함한다.In the method of manufacturing an LED lighting apparatus according to the present embodiment, a substrate preparation step 110, an LED mounting step, a wire 125 bonding step, a transparent resin layer 130 forming step, and an optical pattern 135 are formed. Steps.
도 3에 도시된 바와 같이 기판 준비 단계는 회로 기판(110)을 준비한다. 회로 기판(110)은 일반적인 인쇄 회로 기판으로 이루어질 수 있다. 회로 기판(110)이 준비되면 회로 기판(110)의 모서리에서 소정 간격으로 이격된 지지 돌기(112)를 형성한다. 지지 돌기(112)는 회로 기판(110)의 제작 시에 일체로 제작될 수 있으며, 별도로 형성할 수도 있다.As shown in FIG. 3, the substrate preparation step prepares the circuit board 110. The circuit board 110 may be made of a general printed circuit board. When the circuit board 110 is prepared, the support protrusion 112 spaced at a predetermined interval from the corner of the circuit board 110 is formed. The support protrusion 112 may be integrally manufactured at the time of manufacturing the circuit board 110 or may be separately formed.
도 4에 도시된 바와 같이 LED 실장 단계는 회로 기판(110) 상에 복수 개의 LED 소자(120)를 실장한다. LED 소자들(120)은 소정 간격 이격되어 기 설정된 위치에 실장된다.As shown in FIG. 4, the LED mounting step mounts the plurality of LED elements 120 on the circuit board 110. The LED elements 120 are mounted at predetermined positions spaced apart from each other by a predetermined interval.
도 5에 도시된 바와 같이 와이어 본딩 단계는 LED 소자(120)와 회로 기판(110)을 전기적으로 연결하는 와이어(125)를 본딩한다. 와이어(125)를 본딩하면 회로 기판(110)을 통해서 LED 소자(120)로 전류를 안정적으로 공급할 수 있다.As shown in FIG. 5, the wire bonding step bonds the wires 125 that electrically connect the LED device 120 and the circuit board 110. Bonding the wire 125 allows the current to be stably supplied to the LED device 120 through the circuit board 110.
도 6에 도시된 바와 같이 광투과성 레진층 형성 단계는 회로 기판(110) 상에 광투과성 레진층(130)을 형성한다. 최초 유동성을 갖는 레진을 회로 기판(110)에 전체적으로 도포하여 레진이 회로 기판(110)을 전체적으로 덮도록 한다. 광투과성 레진층(130)은 지지 돌기(112)의 안쪽 전면에 형성하며, 하나의 층이 회로 기판(110)에 실장된 LED 소자(120) 모두를 덮도록 형성한다. 또한, 이러한 하나의 층 위에 다른 층들이 상하 방향으로 적층되어 복수 개의 층이 LED 소자(120) 모두를 덮도록 형성할 수도 있다.As shown in FIG. 6, the step of forming the transparent resin layer forms the transparent resin layer 130 on the circuit board 110. The resin having initial fluidity is applied to the circuit board 110 as a whole so that the resin covers the circuit board 110 as a whole. The transparent resin layer 130 is formed on the inner front surface of the support protrusion 112, and one layer is formed to cover all of the LED devices 120 mounted on the circuit board 110. In addition, other layers may be stacked on the one layer in the vertical direction so that a plurality of layers may cover all of the LED devices 120.
도 7 및 도 8에 도시된 바와 같이 광학 패턴 형성 단계는 광투과성 레진층(130)이 완전히 굳기 전에 패턴(152)이 형성된 스탬프(150)를 광투과성 레진층(130) 상에 임프린트하여 광투과성 레진층(130)에 광학 패턴(135)을 형성한다. 유동성을 갖는 광투과성 레진층(130)을 스탬프(150)로 눌러서 패턴을 전사하며, 광투과성 레진층(130)이 어느 정도 굳은 후에 스탬프(150)를 제거하여 광투과성 레진층(130) 상에 광학 패턴(135)을 형성한다. 광학 패턴(135)은 광이 출사되는 면에 형성된다.As shown in FIGS. 7 and 8, the optical pattern forming step may be performed by imprinting a stamp 150 having the pattern 152 formed on the light transmissive resin layer 130 before the light transmissive resin layer 130 is completely hardened. An optical pattern 135 is formed on the resin layer 130. The transparent resin layer 130 having fluidity is pressed with the stamp 150 to transfer the pattern. After the transparent resin layer 130 is hardened to some extent, the stamp 150 is removed to be placed on the transparent resin layer 130. The optical pattern 135 is formed. The optical pattern 135 is formed on the surface from which light is emitted.
도 9에 도시된 바와 같이 회로 기판(110)을 외형을 이루는 하우징(210)에 장착하여 LED 조명 장치(200)를 완성한다. As shown in FIG. 9, the circuit board 110 is mounted on the housing 210 forming the external shape to complete the LED lighting device 200.
이와 같이 본 실시예에 따르면 LED 소자(120)를 회로 기판(110)에 직접 부착하고, 광투과성 레진층(130)을 한번에 형성하므로 종래에 비하여 공정을 현저히 단순화할 수 있으며, 이에 따라 생산성이 향상된다.As such, according to the present embodiment, the LED device 120 is directly attached to the circuit board 110 and the transparent resin layer 130 is formed at one time, thereby greatly simplifying the process compared to the conventional method, thereby improving productivity. do.
도 10은 본 발명의 제2 실시예에 따른 LED 조명 장치의 제조 방법을 설명하기 위한 도면이다.10 is a view for explaining a manufacturing method of the LED lighting apparatus according to the second embodiment of the present invention.
본 실시예에 따른 LED 조명 장치의 제조 방법은 광학 패턴 형성 단계를 제외하고는 상기한 제1 실시예에 따른 LED 조명 장치의 제조 방법과 동일 한 구성으로 이루어지므로 동일한 구성에 대한 중복 설명은 생략한다.Since the manufacturing method of the LED lighting apparatus according to the present embodiment has the same configuration as the manufacturing method of the LED lighting apparatus according to the first embodiment except for the optical pattern forming step, redundant description of the same configuration will be omitted. .
도 10에 도시된 바와 같이 광투과성 레진층(130)에 레이저(160)를 직접 조사하여 직가공 방식으로 광학 패턴(135)을 형성한다. 이와 같이 직가공 방식으로 레이저(160)를 조사하여 광학 패턴(135)을 형성하면, 다양한 종류의 광학 패턴(135)을 용이하게 형성할 수 있다.As shown in FIG. 10, the optical pattern 135 is formed by directly irradiating the laser 160 to the light transmissive resin layer 130. In this way, when the optical pattern 135 is formed by irradiating the laser 160 in a direct processing method, various types of optical patterns 135 may be easily formed.
도 11은 본 발명의 제3 실시예에 따른 LED 조명 장치를 도시한 평면도이고, 도 12는 도 11에서 Ⅵ-Ⅵ선을 따라 잘라 본 단면도이다.FIG. 11 is a plan view illustrating an LED lighting apparatus according to a third exemplary embodiment of the present invention, and FIG. 12 is a cross-sectional view taken along line VI-VI in FIG. 11.
도 11 및 도 12을 참조하여 설명하면, 본 실시예에 따른 LED 조명 장치(400)는 기판(310)과 기판(310) 상에 설치된 복수 개의 LED 소자(320)와 상기 LED 소자들(120)을 덮는 광투과성 레진층(330)을 갖는 LED 패키지(300), 및 LED 패키지(300)가 내장되며 외형을 이루는 하우징(410)을 포함한다.Referring to FIGS. 11 and 12, the LED lighting apparatus 400 according to the present exemplary embodiment includes a substrate 310, a plurality of LED elements 320 installed on the substrate 310, and the LED elements 120. LED package 300 having a transparent resin layer 330 covering the, and the LED package 300 is embedded and includes a housing 410 forming an appearance.
기판(310)은 판 형상으로 이루어지며 통상적으로 이용되는 인쇄 회로 기판(PCB)으로 이루어질 수 있다. 본 실시예에 따른 기판(310)은 타원형상으로 이루어진다. 다만 본 발명이 이에 제한되는 것은 아니며 판 등 다양한 형태의 판으로 이루어질 수 있다.The substrate 310 may have a plate shape and may be formed of a printed circuit board (PCB) which is commonly used. The substrate 310 according to the present embodiment has an elliptical shape. However, the present invention is not limited thereto and may be made of various types of plates such as plates.
기판(310) 상에는 기판(310)의 측단과 인접한 위치에 지지 돌기(312)가 형성된다. 지지 돌기(312)는 기판(310)의 단부에서 내측으로 소정 거리 이격되어 형성되며, 기판(310)의 둘레 방향을 따라 이어져 형성된다. 이에 따라 지지 돌기(312)는 타원형의 고리 형상 단면을 갖는다.The support protrusion 312 is formed at a position adjacent to the side end of the substrate 310 on the substrate 310. The support protrusion 312 is formed to be spaced apart from the end of the substrate 310 by a predetermined distance, and is formed along the circumferential direction of the substrate 310. Accordingly, the support protrusion 312 has an elliptical annular cross section.
LED 소자(320)는 상기한 지지 돌기(312)의 내측에 실장되며, N형층과 발광층, 및 P형층을 포함하는 통상적인 LED 소자로 이루어진다. 다만, 본 발명이 LED 소자의 종류에 제한되는 것은 아니며 다양한 종류의 LED 소자가 적용될 수 있다. LED 소자(320)는 바닥이 기판(310)과 밀착되어서 기판(310)과 접하도록 설치된다. 이에 따라 LED 소자(320)에서 발생된 열이 기판(310)으로 신속하게 전달되어 열 방출 효율이 향상된다.The LED device 320 is mounted inside the support protrusion 312 and is formed of a conventional LED device including an N-type layer, a light emitting layer, and a P-type layer. However, the present invention is not limited to the type of LED device, and various types of LED devices may be applied. The LED element 320 is installed so that the bottom is in close contact with the substrate 310 and in contact with the substrate 310. Accordingly, heat generated in the LED device 320 is quickly transferred to the substrate 310, thereby improving heat dissipation efficiency.
LED 소자(320)에는 LED 소자(320)와 기판(310)을 전기적으로 연결하는 와이어(325)가 설치되어 있다. 와이어(325)은 LED 소자(320)와 기판(310)에 각각 고정되어 LED 소자(320)로 전류를 전달한다.The LED element 320 is provided with a wire 325 for electrically connecting the LED element 320 and the substrate 310. The wires 325 are respectively fixed to the LED device 320 and the substrate 310 to transfer current to the LED device 320.
기판(310) 상에는 광투과성 레진층(330)이 형성되는 바, 광투과성 레진층(330)은 지지 돌기(312)의 안쪽에 전체적으로 형성된다. 이에 따라 광투과성 레진층(330)은 기판(310)의 모서리와 인접한 부분을 제외한 기판(310)의 전면에 하나의 층으로 형성된다. 다만, 본 발명이 이에 제한되는 것은 아니며, 광투과성 레진층(330)은 복수개의 층이 기판(310)에 대하여 수직인 방향으로 적층된 구조로 이루어질 수 있다. 일체로 형성된 하나의 광투과성 레진층(330)이 기판(310) 상에 실장된 모든 LED 소자(320)를 덮는다. 따라서 광투과성 레진층(330)은 대략 타원 형상의 판으로 이루어진다.The light transmissive resin layer 330 is formed on the substrate 310, and the light transmissive resin layer 330 is entirely formed inside the support protrusion 312. Accordingly, the transparent resin layer 330 is formed as one layer on the entire surface of the substrate 310 except for the portion adjacent to the edge of the substrate 310. However, the present invention is not limited thereto, and the light transmissive resin layer 330 may have a structure in which a plurality of layers are stacked in a direction perpendicular to the substrate 310. One light-transmissive resin layer 330 formed integrally covers all the LED elements 320 mounted on the substrate 310. Therefore, the light transmissive resin layer 330 is formed of a substantially elliptic plate.
광투과성 레진층(330)을 일체로 형성하면, 각 LED 소자(320)마다 광투과성 레진층(330)을 형성하는 경우에 비하여 공정 시간을 단축시킬 수 있다. 또한, 각 LED 소자가 설치된 위치 마다 정밀하게 광투과성 레진층을 형성하는 고가의 장비가 필요하지 않으므로 생산 원가를 절감할 수 있다. When the transparent resin layer 330 is integrally formed, the process time can be shortened as compared with the case where the transparent resin layer 330 is formed for each LED element 320. In addition, the production cost can be reduced because expensive equipment for precisely forming the light transmissive resin layer is not required for each LED device.
한편, 광투과성 레진층(330)은 백색광 등의 특정 색을 나타내기 위한 형광체가 포함된 레진으로 이루어질 수 있다. 광투과성 레진층(330)이 형광체가 포함된 레진으로 이루어지면 별도의 형광체를 도포할 필요가 없이 LED 소자(320)에서 출사된 빛이 형광 성질을 갖게 된다.On the other hand, the transparent resin layer 330 may be made of a resin containing a phosphor for displaying a specific color, such as white light. When the light transmissive resin layer 330 is made of a resin containing phosphors, the light emitted from the LED device 320 has a fluorescent property without applying a separate phosphor.
이와 같이 본 실시예의 LED 조명 장치(400)는 제조 공정이 단순화될 뿐만 아니라, 생산성이 향상되고, 제조 원가를 절감할 수 있다.As described above, the LED lighting apparatus 400 of the present embodiment may not only simplify the manufacturing process but also improve productivity and reduce manufacturing cost.
광투과성 레진층(330)은 기판(310)에 부착되어 기판 상에 일체로 고정되며, 광투과성 레진층(330)의 표면에는 광학 패턴(335)이 형성된다. 광학 패턴(335)은 확산 패턴, 프리즘 패턴, 집중 패턴, 프레넬(fresnel) 패턴, 반사방지 패턴 등 다양한 형태의 패턴으로 이루어질 수 있다.The transparent resin layer 330 is attached to the substrate 310 to be integrally fixed on the substrate, and an optical pattern 335 is formed on the surface of the transparent resin layer 330. The optical pattern 335 may be formed of various types of patterns, such as a diffusion pattern, a prism pattern, a concentration pattern, a fresnel pattern, and an antireflection pattern.
하우징(410)은 LED 패키지(300)가 내장되는 공간을 갖고, LED 조명 장치(400)의 전체적인 외형을 형성한다. 하우징(410)에서 빛이 출사되는 쪽에는 개구가 형성된다. 다만, 개구에는 투명한 유리 등이 설치될 수도 있다. The housing 410 has a space in which the LED package 300 is built, and forms an overall appearance of the LED lighting device 400. An opening is formed at the side from which the light is emitted from the housing 410. However, transparent glass or the like may be provided in the opening.
도 13 내지 도 21은 본 발명의 제3 실시예에 따른 LED 조명 장치의 제조 방법을 설명하기 위한 도면이다.13 to 21 are views for explaining the manufacturing method of the LED lighting apparatus according to the third embodiment of the present invention.
본 실시예에 따른 LED 조명 장치의 제조 방법은 기판(310) 준비 단계와, LED 실장 단계와, 와이어(325) 본딩 단계와, 광투과성 레진층(330) 형성 단계, 및 광학 패턴(335) 형성 단계를 포함한다.The method of manufacturing the LED lighting apparatus according to the present embodiment may include preparing a substrate 310, mounting an LED, bonding a wire 325, forming a transparent resin layer 330, and forming an optical pattern 335. Steps.
도 13에 도시된 바와 같이 기판 준비 단계는 기판(310)을 준비한다. 기판(310)은 일반적인 인쇄 회로 기판으로 이루어질 수 있으며 타원 형상의 판으로 이루어진다. 기판 준비 단계는 기판 상에 지지 돌기(312)를 형성하는 단계를 포함한다. 지지 돌기(312)를 형성하는 단계는 기판(310)이 준비되면 기판(310)의 측단에서 내측으로 소정 간격으로 이격된 위치에 지지 돌기(312)를 형성한다. 지지 돌기(312)는 기판(310)의 둘레 방향을 따라 이어서 형성하며, 기판(310)의 제작 시에 일체로 제작하거나, 기판(310) 제작 후에 별도로 형성할 수도 있다.As shown in FIG. 13, the substrate preparation step prepares the substrate 310. The substrate 310 may be formed of a general printed circuit board, and may be formed of an elliptic plate. The substrate preparation step includes forming the support protrusion 312 on the substrate. In the forming of the support protrusions 312, when the substrate 310 is prepared, the support protrusions 312 are formed at positions spaced at predetermined intervals from the side ends of the substrate 310 to the inside. The support protrusion 312 is subsequently formed along the circumferential direction of the substrate 310, and may be integrally manufactured at the time of manufacturing the substrate 310 or separately formed after the substrate 310 is manufactured.
도 14에 도시된 바와 같이 LED 실장 단계는 기판(310) 상에 복수 개의 LED 소자(320)를 실장한다. LED 소자들(120)은 소정 간격 이격되어 기 설정된 위치에 실장된다.As shown in FIG. 14, the LED mounting step mounts the plurality of LED elements 320 on the substrate 310. The LED elements 120 are mounted at predetermined positions spaced apart from each other by a predetermined interval.
도 15에 도시된 바와 같이 와이어 본딩 단계는 LED 소자(320)와 기판(310)을 전기적으로 연결하는 와이어(325)를 본딩한다. 와이어(325)를 본딩하면 기판(310)을 통해서 LED 소자(320)로 전류를 안정적으로 공급할 수 있다.As shown in FIG. 15, the wire bonding step bonds the wire 325 electrically connecting the LED device 320 and the substrate 310. Bonding the wire 325 may stably supply current to the LED device 320 through the substrate 310.
도 16에 도시된 바와 같이 광투과성 레진층 형성 단계는 기판(310) 상에 광투과성 레진층(330)을 형성한다. 최초 유동성을 갖는 레진을 기판(310)에 전체적으로 도포하여 레진이 기판(310)을 전체적으로 덮도록 한다. 광투과성 레진층(330)은 타원판 형태로 이루어진다.As shown in FIG. 16, the step of forming the transparent resin layer forms the transparent resin layer 330 on the substrate 310. The resin having initial fluidity is applied to the substrate 310 as a whole so that the resin covers the substrate 310 as a whole. The transparent resin layer 330 is formed in an elliptic plate shape.
또한, 광투과성 레진층(330)은 지지 돌기(312)의 안쪽 전면에 형성하며, 하나의 층이 기판(310)에 실장된 LED 소자(320) 모두를 덮도록 형성한다. 또한, 이러한 하나의 층 위에 다른 층들이 상하 방향으로 적층되어 복수 개의 층이 LED 소자(320) 모두를 덮도록 형성할 수도 있다.In addition, the transparent resin layer 330 is formed on the inner front surface of the support protrusion 312, and one layer is formed so as to cover all of the LED device 320 mounted on the substrate 310. In addition, other layers may be stacked on the one layer in the vertical direction to form a plurality of layers covering all of the LED elements 320.
광투과성 레진층 형성 단계에서는 광투과성 레진층(330)을 이루는 물질에 백색광 등의 특정 색을 나타내기 위한 형광체를 추가함으로써 광투과성 레진층이 형광체를 더 포함하도록 할 수 있다.In the step of forming the transparent resin layer, the transparent resin layer may further include a phosphor by adding a phosphor for displaying a specific color such as white light to the material of the transparent resin layer 330.
도 17 내지 도 20에 도시된 바와 같이 광학 패턴 형성 단계는 폴리머로 이루어진 스탬프 모재(361) 상에 패턴(363)을 전사하는 스탬프 모재(361) 패턴 형성 단계와 고리 형상의 횡단면을 갖는 스탬프 커터(365)를 이용하여 스탬프 모재(361)를 자르는 커팅 단계와 잘려진 스탬프(350)를 경화시켜서 스탬프(350)를 제작하는 경화 단계, 및 스탬프(350)를 이용하여 광투과성 레진층(330)에 임프린트 방식으로 패턴을 형성하는 임프린트 단계를 포함한다.As shown in FIGS. 17 to 20, the optical pattern forming step includes a stamp base material 361 pattern forming step of transferring the pattern 363 onto a stamp base material 361 made of a polymer, and a stamp cutter having an annular cross section ( The cutting step of cutting the stamp base material 361 using the seal 365 and the hardening of the cut stamp 350 to produce the stamp 350, and the imprint to the light-transmissive resin layer 330 using the stamp 350 An imprint step of forming a pattern in a manner.
도 17에 도시된 바와 같이 스탬프 모재 패턴 형성 단계는 일방향으로 길게 이어진 판 형상의 스탬프 모재(361) 상에 패턴(362a)이 형성된 롤 형상의 금형(362)을 위치시킨 상태에서 금형(362)을 회전시켜서 스탬프 모재(361) 상에 패턴(363)을 전사한다. 스탬프 모재(361)는 광경화성 레진이나 열경화성 레진으로 이루어질 수 있다.As shown in FIG. 17, the stamp base material pattern forming step includes placing the mold 362 in a state in which a roll-shaped mold 362 having a pattern 362a is formed on a plate-shaped stamp base material 361 extending in one direction. By rotating, the pattern 363 is transferred onto the stamp base material 361. The stamp base material 361 may be made of photocurable resin or thermosetting resin.
도 18에 도시된 바와 같이 커팅 단계는 내부가 비어 있는 타원형 관 형태의 스탬프 커터(365)를 이용하여 스탬프 모재(361)를 잘라서 추출한다. 스탬프 커터(365)는 하부가 개방된 구조로 이루어지며 스탬프(350)의 단면 형상과 대응되는 단면 형상을 갖는다.As shown in FIG. 18, the cutting step cuts and extracts the stamp base material 361 using the stamp cutter 365 having an empty oval tube shape. The stamp cutter 365 has an open bottom structure and has a cross-sectional shape corresponding to the cross-sectional shape of the stamp 350.
본 실시예에 따른 스탬프 커터(365)는 관 형태로 이루어지므로 고리 형상의 횡단면을 갖는 바, 스탬프 커터(365)로 스탬프 모재(361)를 눌러서 스탬프 모재(361)에서 원하는 형상의 스탬프(350)로 자른다. 본 실시예에서는 스탬프 커터(365)가 관 형태로 이루어진 것으로 예시하고 있으나 본 발명이 이에 제한되는 것은 아니며, 스탬프 커터(365)는 하부가 개방되고 고리 형상의 단면을 갖는 구조로 이루어진 것이라면 상부가 막힌 구조로 이루어질 수도 있다.Since the stamp cutter 365 according to the present exemplary embodiment has a tubular shape, and has a ring-shaped cross section, the stamp cutter 365 presses the stamp base material 361 with the stamp base material 361 to form a stamp 350. Cut into In this embodiment, the stamp cutter 365 is illustrated as being made of a tubular shape, but the present invention is not limited thereto, and the stamp cutter 365 is open at the bottom thereof and is formed of a structure having a ring-shaped cross section, the top of which is blocked. It may be made of a structure.
본 실시예에 따르면 스탬프 커터(365)의 형상에 따라 원하는 형태의 스탬프(350)를 스탬프 모재(361)에서 용이하게 추출할 수 있다.According to the present embodiment, a stamp 350 having a desired shape can be easily extracted from the stamp base material 361 according to the shape of the stamp cutter 365.
정밀한 패턴을 갖는 스탬프를 이용하여 임프린트할 때에는 스탬프를 10회 이상 사용하지 못하는 것이 일반적이다. 이는 임프린트할 때마다 스탬프의 패턴이 손상되어 10이상 사용하면 정밀한 패턴을 전사할 수 없기 때문이다. 이러한 스탬프를 하나씩 제작하기 위해서는 많은 비용과 시간이 소비되는 문제가 있다. 그러나 본 실시예에 따르면 다양한 형상의 스탬프를 용이하게 제작할 수 있다. 특히 다양한 형상의 LED 조명 장치를 제조하여야 할 경우에는 하나의 스탬프 모재에서 다양한 스탬프를 제작할 수 있다. When imprinting using a stamp having a precise pattern, it is generally not possible to use the stamp more than 10 times. This is because the pattern of the stamp is damaged each time the imprint is used, and when used more than 10, the precise pattern cannot be transferred. In order to produce such stamps one by one, there is a problem of costly and time consuming. However, according to the present embodiment, stamps of various shapes can be easily manufactured. In particular, when the LED lighting device of various shapes should be manufactured, a variety of stamps can be produced from a single stamp base material.
도 19에 도시된 바와 같이 커팅된 스탬프(350)에 자외선 등의 빛을 조사하여 잘려진 스탬프(350)를 경화시킨다. 스탬프(350) 상에는 스탬프 모재(361)에 형성된 패턴(363)과 동일한 형상의 패턴(352)이 형성되어 있으며 스탬프(350)는 대략 타원 형상의 판 형태로 이루어진다.As shown in FIG. 19, the cut stamp 350 is irradiated with light such as ultraviolet rays to cure the cut stamp 350. On the stamp 350, a pattern 352 having the same shape as the pattern 363 formed on the stamp base material 361 is formed, and the stamp 350 is formed in a substantially elliptic plate shape.
본 실시예에서는 스탬프(350)가 광경화성 레진으로 이루어져 빛을 조사하여 스탬프(350)를 경화시키는 것으로 예시하고 있으나, 본 발명이 이에 제한되는 것은 아니며, 스탬프가 열경화성 레진으로 이루어질 수 있으며 이 경우 스탬프에 열을 가하여 경화시킨다.In this embodiment, the stamp 350 is made of a photocurable resin to cure the stamp 350 by irradiating light, but the present invention is not limited thereto, and the stamp may be made of a thermosetting resin, in which case the stamp It heats and hardens | cures.
도 20에 도시된 바와 같이 임프린트 단계는 광투과성 레진층(330)이 완전히 굳기 전에 패턴(352)이 형성된 스탬프(350)를 광투과성 레진층(330) 상에 임프린트하여 광투과성 레진층(330)에 광학 패턴(335)을 형성한다. 유동성을 갖는 광투과성 레진층(330)을 스탬프(350)로 눌러서 패턴을 전사하며, 광투과성 레진층(330)이 어느 정도 굳은 후에 스탬프(350)를 제거하여 광투과성 레진층(330) 상에 광학 패턴(335)을 형성한다. 광학 패턴(335)은 광이 출사되는 면에 형성된다.As shown in FIG. 20, in the imprinting step, the stamp 350 on which the pattern 352 is formed is imprinted onto the light transmissive resin layer 330 before the light transmissive resin layer 330 is completely hardened. The optical pattern 335 is formed in the film. The transparent resin layer 330 having fluidity is pressed by the stamp 350 to transfer the pattern. After the transparent resin layer 330 is hardened to some extent, the stamp 350 is removed to form the light on the transparent resin layer 330. The optical pattern 335 is formed. The optical pattern 335 is formed on the surface from which light is emitted.
도 21에 도시된 바와 같이, 광투과성 레진층(330)에 광학 패턴(335)이 형성되면 기판(310)을 외형을 이루는 하우징(410)에 장착하여 LED 조명 장치(400)를 완성한다.As illustrated in FIG. 21, when the optical pattern 335 is formed on the light transmissive resin layer 330, the substrate 310 is mounted on the housing 410 forming the external shape to complete the LED lighting device 400.
이와 같이 본 실시예에 따르면 LED 소자(320)를 기판(310)에 직접 부착하고, 광투과성 레진층(330)을 한번에 형성하므로 종래에 비하여 공정을 현저히 단순화할 수 있으며, 이에 따라 생산성이 향상된다.As described above, the LED device 320 is directly attached to the substrate 310 and the light-transmissive resin layer 330 is formed at a time, thereby greatly simplifying the process compared to the conventional method, thereby improving productivity. .
상기에서는 본 발명의 바람직한 실시예에 대하여 설명하였지만, 본 발명은 이에 한정되는 것은 아니며 특허청구범위와 발명의 상세한 설명 및 첨부한 도면의 범위 안에서 여러 가지로 변형하여 실시하는 것이 가능하고 이 또한 본 발명의 범위에 속하는 것은 당연하다.In the above description of the preferred embodiment of the present invention, the present invention is not limited thereto, and various modifications and changes can be made within the scope of the claims and the detailed description of the invention and the accompanying drawings. Naturally, it belongs to the range of.

Claims (20)

  1. 판 형상의 회로 기판; Plate-shaped circuit boards;
    상기 회로 기판 상에 실장된 복수 개의 LED 소자; 및A plurality of LED elements mounted on the circuit board; And
    상기 복수 개의 LED들을 덮으며 표면에 광학 패턴이 형성된 광투과성 레진층;A light transmissive resin layer covering the plurality of LEDs and having an optical pattern formed on a surface thereof;
    을 포함하는 LED 패키지LED package containing
    를 포함하는 LED 조명 장치.LED lighting device comprising a.
  2. 제1항에 있어서,The method of claim 1,
    상기 광투과성 레진층은 하나의 층으로 이루어지고, 상기 광투과성 레진층은 상기 LED 소자들을 모두 덮도록 형성된 LED 조명 장치.The light transmitting resin layer is made of one layer, the light transmitting resin layer is formed to cover all the LED elements LED lighting device.
  3. 제1항에 있어서,The method of claim 1,
    상기 광투과성 레진층은 복수 개의 층으로 이루어지고, 상기 복수의 층이 각각 상기 LED 소자들을 모두 덮도록 형성된 LED 조명 장치.The light transmissive resin layer is composed of a plurality of layers, each of the plurality of layers LED lighting device formed to cover the LED elements.
  4. 제1항에 있어서,The method of claim 1,
    상기 광투과성 레진층의 측단에는 지지 돌기가 이어져 형성된 LED 조명 장치.LED lighting device formed by supporting protrusions are connected to the side end of the transparent resin layer.
  5. 제1항에 있어서,The method of claim 1,
    상기 광투과성 레진층은 형광체를 더 포함하는 LED 조명 장치.The light transmitting resin layer further comprises a phosphor.
  6. 제1항에 있어서,The method of claim 1,
    상기 LED 패키지가 내장되는 하우징을 더 포함하는 LED 조명 장치.LED lighting device further comprises a housing in which the LED package is built.
  7. 기판 준비 단계;Substrate preparation step;
    상기 기판 상에 LED 소자를 설치하는 LED 실장 단계;An LED mounting step of installing an LED element on the substrate;
    상기 LED 소자와 기판을 전기적으로 연결하는 와이어 본딩 단계;A wire bonding step of electrically connecting the LED element and the substrate;
    복수 개의 상기 LED 소자들을 덮도록 상기 기판 상에 광투과성 레진층을 형성하는 광투과성 레진층 형성 단계; 및Forming a transparent resin layer on the substrate to cover the plurality of LED elements; And
    상기 광투과성 레진층에 패턴을 형성하는 광학 패턴 형성 단계;An optical pattern forming step of forming a pattern on the light transmitting resin layer;
    를 포함하는 LED 조명 장치의 제조 방법.Method of manufacturing an LED lighting device comprising a.
  8. 제7항에 있어서,The method of claim 7, wherein
    상기 광투과성 레진층 형성 단계는 상기 기판의 모서리와 인접한 부분을 제외한 상기 기판의 전면에 하나의 층으로 광투과성 레진층을 형성하는 LED 조명 장치의 제조 방법.The transparent resin layer forming step is a method of manufacturing an LED lighting device to form a transparent resin layer in one layer on the front surface of the substrate excluding the portion adjacent to the edge of the substrate.
  9. 제7항에 있어서,The method of claim 7, wherein
    상기 광학 패턴 형성 단계는 스탬프를 이용하여 상기 광투과성 레진층의 표면에 임프린트 방식으로 패턴을 형성하는 LED 조명 장치의 제조 방법.The optical pattern forming step is a method of manufacturing an LED lighting device to form a pattern on the surface of the transparent resin layer by imprinting using a stamp.
  10. 제7항에 있어서,The method of claim 7, wherein
    상기 광학 패턴 형성 단계는 레이저를 이용하여 상기 기판의 표면에 직가공 방식으로 패턴을 형성하는 LED 조명 장치의 제조 방법.The optical pattern forming step is to form a pattern on the surface of the substrate by a laser processing method using a laser.
  11. 제7항에 있어서,The method of claim 7, wherein
    상기 기판 준비 단계는 상기 기판의 측단 내측에 상기 기판의 측단을 따라 지지돌기를 형성하는 단계를 더 포함하는 LED 조명 장치의 제조 방법.The substrate preparation step further comprises the step of forming a support protrusion along the side end of the substrate inside the side end of the substrate.
  12. 제7항에 있어서,The method of claim 7, wherein
    상기 기판을 외형을 이루는 하우징에 장착하는 단계를 더 포함하는 LED 조명 장치의 제조 방법.The method of manufacturing an LED lighting device further comprising the step of mounting the substrate to the housing forming an appearance.
  13. 기판 준비 단계;Substrate preparation step;
    상기 기판 상에 LED 소자를 설치하는 LED 실장 단계;An LED mounting step of installing an LED element on the substrate;
    상기 LED 소자와 기판을 전기적으로 연결하는 와이어 본딩 단계;A wire bonding step of electrically connecting the LED element and the substrate;
    복수 개의 상기 LED 소자들을 덮도록 상기 기판 상에 광투과성 레진층을 형성하는 광투과성 레진층 형성 단계; 및Forming a transparent resin layer on the substrate to cover the plurality of LED elements; And
    상기 광투과성 레진층에 패턴을 형성하는 광학 패턴 형성 단계;An optical pattern forming step of forming a pattern on the light transmitting resin layer;
    를 포함하고Including
    상기 광학 패턴 형성 단계는,The optical pattern forming step,
    레진으로 이루어진 스탬프 모재 상에 패턴을 전사하는 스탬프 모재 패턴 형성 단계;A stamp base material pattern forming step of transferring a pattern onto a stamp base material made of resin;
    스탬프 커터를 이용하여 스탬프 모재를 자르는 커팅 단계;Cutting a stamp base material using a stamp cutter;
    잘려진 스탬프 모재를 경화시켜서 스탬프를 제작하는 경화 단계; 및A curing step of curing the cut stamp base material to produce a stamp; And
    상기 스탬프를 이용하여 상기 광투과성 레진층에 임프린트 방식으로 패턴을 형성하는 임프린트 단계;An imprint step of forming a pattern on the light transmissive resin layer by imprinting using the stamp;
    를 포함하는 LED 조명 장치의 제조 방법.Method of manufacturing an LED lighting device comprising a.
  14. 제13항에 있어서,The method of claim 13,
    상기 광투과성 레진층 형성 단계는 하나의 광투과성 레진층이 상기 기판 상에 설치된 모든 상기 LED 소자들을 덮도록 형성하는 LED 조명 장치의 제조 방법.Wherein the step of forming the transparent resin layer is a method of manufacturing an LED lighting device to form a transparent resin layer to cover all the LED elements installed on the substrate.
  15. 제13항에 있어서,The method of claim 13,
    상기 스탬프 커터는 상기 스탬프의 단면 형상과 대응되는 고리 형상의 횡단면을 갖는 LED 조명 장치의 제조 방법.The stamp cutter has a ring-shaped cross section corresponding to the cross-sectional shape of the stamp manufacturing method of the LED lighting device.
  16. 제13항에 있어서,The method of claim 13,
    상기 광투과성 레진층은 형광체를 더 포함하는 LED 조명 장치의 제조 방법.The light transmitting resin layer further comprises a phosphor manufacturing method of the LED lighting device.
  17. 제13항에 있어서,The method of claim 13,
    상기 광투과성 레진층 형성 단계는 상기 기판의 모서리와 인접한 부분을 제외한 상기 기판의 전면에 상기 광투과성 레진층을 형성하는 LED 조명 장치의 제조 방법.The transparent resin layer forming step is to form the transparent resin layer on the front surface of the substrate except for the portion adjacent to the edge of the substrate manufacturing method of the LED lighting device.
  18. 제13항에 있어서,The method of claim 13,
    스탬프 모재 패턴 형성 단계는 스탬프 모재 상에서 패턴이 형상된 롤 형태의 금형을 회전시켜서 상기 금형에 형성된 패턴을 상기 스탬프 모재 상으로 전사하는 LED 조명 장치의 제조 방법.The stamp base material pattern forming step is a method of manufacturing an LED lighting device by rotating a die in the form of a roll pattern is formed on the stamp base material to transfer the pattern formed on the mold onto the stamp base material.
  19. 제13항에 있어서,The method of claim 13,
    상기 기판은 인쇄 회로 기판인 LED 조명 장치의 제조 방법.And said substrate is a printed circuit board.
  20. 제13항에 있어서,The method of claim 13,
    상기 기판 준비 단계는 상기 기판의 모서리 내측에 상기 기판의 측단을 따라 지지돌기를 형성하는 단계를 더 포함하는 LED 조명 장치의 제조 방법.The substrate preparing step further comprises the step of forming a support protrusion along the side end of the substrate inside the corner of the substrate.
PCT/KR2010/007659 2009-12-18 2010-11-02 Led lighting device including led package integrally formed with a circuit board, and method of producing the led lighting device WO2011074777A2 (en)

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KR1020090126621A KR101078863B1 (en) 2009-12-18 2009-12-18 Led lighting apparatus having led package intergrated on circuit board and fabricating method thereof
KR10-2009-0126621 2009-12-18
KR10-2010-0107290 2010-10-29
KR1020100107290A KR101186244B1 (en) 2010-10-29 2010-10-29 Fabricating method of led lighting apparatus

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Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2012177753A3 (en) * 2011-06-24 2013-05-02 Xicato, Inc. Led based illumination module with a reflective mask
EP2642175A1 (en) * 2012-03-19 2013-09-25 Toshiba Lighting & Technology Corporation Luminaire and manufacturing method of the same

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR100586976B1 (en) * 2004-06-30 2006-06-08 삼성전기주식회사 Light Emitting Diode Package with Improved Dispersibility and Brightness
KR20060086177A (en) * 2005-01-26 2006-07-31 삼성전자주식회사 Two dimensional light source of using light emitting diode and liquid crystal display panel of using the two dimensional light source
KR100755619B1 (en) * 2006-08-08 2007-09-06 삼성전기주식회사 Method of fabricating led package
KR100809212B1 (en) * 2006-09-29 2008-02-29 삼성전기주식회사 Imprinting stamp for forming pattern and method of fabricating led package using the same

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR100586976B1 (en) * 2004-06-30 2006-06-08 삼성전기주식회사 Light Emitting Diode Package with Improved Dispersibility and Brightness
KR20060086177A (en) * 2005-01-26 2006-07-31 삼성전자주식회사 Two dimensional light source of using light emitting diode and liquid crystal display panel of using the two dimensional light source
KR100755619B1 (en) * 2006-08-08 2007-09-06 삼성전기주식회사 Method of fabricating led package
KR100809212B1 (en) * 2006-09-29 2008-02-29 삼성전기주식회사 Imprinting stamp for forming pattern and method of fabricating led package using the same

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2012177753A3 (en) * 2011-06-24 2013-05-02 Xicato, Inc. Led based illumination module with a reflective mask
EP2642175A1 (en) * 2012-03-19 2013-09-25 Toshiba Lighting & Technology Corporation Luminaire and manufacturing method of the same

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