KR100586976B1 - Light Emitting Diode Package with Improved Dispersibility and Brightness - Google Patents

Abstract

The present invention relates to a light emitting diode package, comprising: a light emitting diode chip disposed on a substrate, a phosphor that receives light from the light emitting diode chip and reacts to convert the wavelength of the light; Provided is a light emitting diode package comprising a resin-based light mixture and a resin filler to help scatter light evenly.

According to the present invention, the resin-based photomixer not only increases the probability that the light emitted from the light emitting diode reacts with the phosphor but also provides a path through which the converted light can escape, thereby providing dispersion, color uniformity, and luminance. It is possible to obtain a light emitting diode package having improved characteristics of the light emitting diode.

Light Emitting Diodes, Photomixers, Resins, Epoxy, Silicon

Description

Light Emitting Diode Package with Improved Dispersibility and Brightness             

1 illustrates a conventional light emitting diode in which a case where a light mixture material is layered or locally agglomerated may occur.

Figure 2 shows an electron micrograph of the silicon resin light mixture material used in the present invention.

3 is an electron micrograph showing a state in which a silicon resin photomixer is mixed in a light emitting diode filler (a-surface photograph, b-cross section photograph).

4 is a schematic view showing a light emitting diode to which a resin-based light mixture is applied according to the present invention.

5 is an electron micrograph of a conventional light emitting diode showing a state in which a light mixture material is layered.

6 is an electron micrograph of the light emitting diode of the present invention showing a state in which the light mixture is dispersed evenly.

* Description of the symbols for the main parts of the drawings *

1-light beam 2-filler

3-light emitting diode chip 4-reflector on which the light emitting element is mounted or mounted

5-Photomixer 6-Phosphor

The present invention relates to a light emitting diode package, and more particularly, to a light emitting diode package having improved dispersibility and brightness, in which light generated from the light emitting diode is uniformly applied by applying a resin-based light mixture.

Light emitting diodes (LEDs) emit light of transparent color with high density and high efficiency. In addition, the light emitting diode is thermally free and is a semiconductor element, so it has excellent initial operating characteristics, high vibration resistance and durability to withstand repeated on / off operation. Light emitting diodes are therefore widely used as various indicators and light sources for such applications. In recent years, the light emitting diode is being used as a luminaire and its use range is expanding. The light emitting diode is made of gallium arsenide (GaAs), gallium phosphide (GaP), gallium nitride (GaN), silicon carbide (SiC), etc., depending on the emission color, intensity of illuminance, and the like. When biased in the breakdown region, its PN junction can emit visible light at a relatively low voltage. In the display device, power is supplied by the multiplexing network to reduce power consumption, and the light emitting diodes change their structure to provide light of different wavelengths. Such light emitting diodes are used individually or in a matrix structure.

On the other hand, in a light emitting diode package of a method of generating a desired color using a phosphor containing phosphor, the light emitted from the diode reacts with the phosphor, in which the light emitting diode package (LED PKG) to evenly react with the phosphor The photomixer is mixed. In the case of using the photomixed material, the light emission from the light emitting diodes is varied, thereby increasing the probability of reacting with the phosphor and providing a path through which the changed light can escape, thereby allowing even light emission.

In the related art, in order to evenly react the light emitted from the light emitting diode with the phosphor, an opal-based light mixing material has been added.

However, the opal-based light mixtures that have been used in the past have a high specific gravity, so that the amount of sinking is large, and there are cases where they exist together in a large amount and thus do not sufficiently represent the role of the light mixture.

1 illustrates a conventional light emitting diode to which the opal light-mixing material is applied. As shown in FIG. 1, when an opal-based light mixture such as barium, titanate, titanium oxide, aluminum oxide, silicon dioxide, or the like is applied, the light mixture is layered or locally agglomerated to form chips. This may cause the light emitted from the light emitting diode to pass through the light-mixing material, thereby reducing the brightness of the light emitting diode.

Accordingly, an object of the present invention is to have a specific gravity similar to that of a conventional light emitting diode filler in a light emitting diode package using a phosphorus-containing phosphor, and to apply a resin-based light mixture having excellent dispersibility to precipitate the existing light mixture. Alternatively, the present invention is to provide a light emitting diode package having improved dispersibility and brightness by solving problems such as agglomeration phenomenon and reduced brightness.

According to one aspect of the invention,

A light emitting diode package comprising: a light emitting diode chip disposed on a substrate; a phosphor that receives light from the light emitting diode chip and reacts to convert the wavelength of the light; and scatters light so that the light and the phosphor react evenly. There is provided a light emitting diode package comprising a resin-based light mixture and a resin filler.

Hereinafter, the present invention will be described in more detail.

In the light emitting diode package using phosphor-containing phosphors, the present inventors evenly distribute the resin-based light mixtures with the phosphors, evenly dispersing the particles, thereby causing precipitation or agglomeration and luminance of the existing light mixtures. The present inventors have found that problems such as degradation have been solved.

The resin-based photomixer used in the present invention has a specific gravity similar to that of a conventional light emitting diode filler and has excellent dispersibility so that light emitted from the light emitting diode is evenly reacted with a phosphor so that light is emitted evenly at a wide emission angle. help. Existing opal light-mixing materials cannot combine with resin fillers, so the surface energy is high and tends to stick together. In contrast, the resin-based photomixer used in the present invention has a spherical chain structure and unlike the opal-based photomixer, since the metal group can form a linkage with the resin filler, it is easily dispersed in the resin filler. May exist.

Resin-based light mixtures used in the present invention is preferably epoxy resins and silicone resins.

Epoxy resins have a specific gravity of 1.230 ~ 1.189 and are known for their excellent mechanical properties such as bending strength and firmness.

Silicon resin is also called silicon resin, and the molecular structure of silicon resin is based on silicon in the form of siloxane bond (Si-O bond) in which silicon and oxygen alternately, and silicon, methyl group, phenyl group and hydroxy group are added. Thermoplastic synthetic resin.

The resin-based light mixture includes a methyl group, such as silicone resin represented by the following formula (1).

[Formula 1]

Wherein R is a methyl group

Since the resin-based photomixer includes such a methyl group, the resin-based photomixer has excellent binding properties with the resin filler, and the specific gravity is similar to that of the resin filler, and thus may be dispersed evenly without precipitation. In addition, an electron micrograph of the silicon resin photomixer is shown in FIG. 2, and an electron micrograph showing a state in which the silicon resin photomixer is mixed in a light emitting diode filler is shown in FIG. 3 (a-surface photograph, b-cross section). Photo).

4 shows a light emitting diode to which such a resin-based light mixture is applied according to the present invention. As shown in FIG. 4, the resin-based light-mixing material dispersed evenly facilitates light scattering and helps light to be evenly emitted at a wide radiation angle, and when mixed with the phosphor, is evenly distributed between the phosphors. It serves to diversify the path of light emitted from the light emitting diode. As a result, the resin-based photomixer not only increases the probability that the light emitted from the light emitting diode reacts with the phosphor but also provides a path through which the converted light can escape, thereby improving the characteristics of the light emitting diode.

The epoxy resins and the silicone resins may be used alone, respectively, or both may be mixed with each other when they are in powder form. When the mixture can be used, the mixing ratio is preferably 1: 1.

The resin-based light mixture is preferably used having a specific gravity (specific gravity 0.9-1.8) similar to the resin for the filler, the addition amount is 1-20% by weight based on the total weight of the phosphor, the light mixture and the resin filler desirable.

When the phosphor, the light mixture and the resin filler are mixed, the components of the phosphor, the light mixture, and the resin filler are mixed in a ratio of 1 to 90% by weight, 1 to 20% by weight, and 9 to 98% by weight, respectively. desirable.

The phosphor, the light mixture material and the resin filler are disposed to cover the top surface of the diode chip in a mixed form, wherein the light mixture material is uniformly mixed using a mixer to remove bubbles from the vacuum atmosphere. The mixed light mixture is dispersed in the form of beads or particles. The light-mixed material dispersed in the form of beads or particles in this way preferably has a particle size of 0.1 to 30 μm.

Resin fillers useful in the present invention are not particularly limited, but transparent epoxy resin fillers are preferred.

Hereinafter, the present invention will be described in more detail with reference to the following examples, which are merely illustrative of the present invention and do not limit the present invention to the following examples.

<Example>

Comparative Example 1

As a light emitting diode, a light emitting diode chip having a light emission wavelength peak of 465 nm and a gallium nitride (GaN) semiconductor structure was used. On the light emitting diode chip, a mixture of a phosphor, an opal light-mixing material, and a resin filler was applied.

90% by weight of silicone resin filler (Dow Corning EG6301), 7% by weight of phosphor (Nemoto YAG 81003) showing yellow light at 465 nm wavelength, and 3% by weight of titanium oxide (density 3.89, light transmittance of 33% or less) were mixed. At this time, the silicone resin filler was in a liquid phase and the phosphor and titanium oxide were in powder form, and then uniformly mixed using a mixer, followed by vacuum treatment to remove bubbles. The mixture was applied onto a diode chip and then cured at 150 ° C. for 1 hour.

As a result of measuring the light emission luminance of the light emitting diode thus obtained, a luminance value of 612 mCd / m 2 was obtained. In addition, as a result of photographing the cross-section of the light emitting diode with an electron microscope, as shown in FIG. 5, it was found that the light-mixed material existed in a layered state.

Example 1

As a light emitting diode, a light emitting diode chip having a light emission wavelength peak of 465 nm and a gallium nitride (GaN) semiconductor structure was used. On this light emitting diode chip, a mixture of phosphor, photomixer and resin filler was applied.

90% by weight of silicone resin filler (Dow Corning EG6301), 7% by weight of phosphor exhibiting yellow light at 465 nm wavelength (Nemoto YAG 81003) and silicon resin light mixture (GETOS (GE-Toshiba) Tospearl 120, density 1.32, light transmittance 90 At least 3%). At this time, the silicone resin filler was in the liquid phase and the phosphor and the silicone resin light mixture were in the form of powder, and uniformly mixed using a mixer, and then vacuum-treated to remove bubbles. The mixture was applied onto a diode chip and then cured at 150 ° C. for 1 hour.

As a result of measuring the light emission luminance of the light emitting diode thus obtained, a luminance value of 654 mCd / m 2 was shown, indicating that the luminance was superior to that of the conventional product of Comparative Example 1. In addition, as a result of photographing the cross-section of the light emitting diode with an electron microscope, it was found that the light-mixed material existed evenly as shown in FIG. 6.

According to the present invention, the resin-based photomixer not only increases the probability that the light emitted from the light emitting diode reacts with the phosphor but also provides a path through which the converted light can escape, thereby providing dispersion, color uniformity, and luminance. A light emitting diode package can be obtained in which the characteristics of the light emitting diode are improved.

In addition, according to the present invention, a light emitting diode package having excellent luminance at a relatively easy and low production cost can be provided without significantly departing from the existing process for manufacturing a light emitting diode using a phosphor.

Claims (10)

In the light emitting diode package, A light emitting diode chip disposed on a reflector on which the device is mounted or mounted, a phosphor that receives light from the light emitting diode chip and reacts to convert the wavelength of the light, and scatters light so that the light and the phosphor react evenly. A light emitting diode package with improved dispersibility and brightness, characterized in that it comprises at least one light mixture and a resin filler selected from the group consisting of an epoxy resin and a silicone resin. delete The light emitting diode package of claim 1, wherein the light mixture is added in an amount of 1-20% by weight based on the total weight of the phosphor, the light mixture, and the resin filler. The light emitting diode package of claim 1, wherein the light mixture has a specific gravity of 0.9-1.8. The light emitting diode package of claim 1, wherein the phosphor, the light mixture, and the resin filler are mixed with 1 to 90% by weight of the phosphor, 1 to 20% by weight of the light mixture, and 9 to 98% by weight of the resin filler. . The light emitting diode package of claim 1, wherein the phosphor, the light mixture, and the resin filler are disposed to cover the top surface of the diode chip in a mixed form. The light emitting diode package of claim 1, wherein the light mixed material is added to the liquid resin filler in powder form, mixed uniformly using a mixer, and then added and mixed in a manner of removing bubbles in a vacuum atmosphere. The light emitting diode package of claim 1, wherein the light mixture is dispersed in the form of beads or particles. The light emitting diode package of claim 8, wherein the light mixture having a bead or particle form has a particle diameter of 0.1 to 30 µm. The light emitting diode package of claim 1, wherein the resin filler is a transparent epoxy resin filler.

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