WO2011070156A3 - Dispositif et procédé de modification d'un substrat semiconducteur par un faisceau d'ions - Google Patents
Dispositif et procédé de modification d'un substrat semiconducteur par un faisceau d'ions Download PDFInfo
- Publication number
- WO2011070156A3 WO2011070156A3 PCT/EP2010/069383 EP2010069383W WO2011070156A3 WO 2011070156 A3 WO2011070156 A3 WO 2011070156A3 EP 2010069383 W EP2010069383 W EP 2010069383W WO 2011070156 A3 WO2011070156 A3 WO 2011070156A3
- Authority
- WO
- WIPO (PCT)
- Prior art keywords
- ion
- semiconductor substrate
- ion beam
- electric potential
- field emission
- Prior art date
Links
- 239000004065 semiconductor Substances 0.000 title abstract 5
- 239000000758 substrate Substances 0.000 title abstract 5
- 238000010884 ion-beam technique Methods 0.000 title abstract 4
- 238000012986 modification Methods 0.000 title abstract 4
- 230000004048 modification Effects 0.000 title abstract 4
- 238000000034 method Methods 0.000 title abstract 2
- 230000001133 acceleration Effects 0.000 abstract 1
- 230000001419 dependent effect Effects 0.000 abstract 1
- 238000002513 implantation Methods 0.000 abstract 1
- 238000005468 ion implantation Methods 0.000 abstract 1
Classifications
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer or carrier concentration layer
- H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic System or AIIIBV compounds with or without impurities, e.g. doping materials
- H01L21/26—Bombardment with radiation
- H01L21/263—Bombardment with radiation with high-energy radiation
- H01L21/265—Bombardment with radiation with high-energy radiation producing ion implantation
- H01L21/26506—Bombardment with radiation with high-energy radiation producing ion implantation in group IV semiconductors
- H01L21/26513—Bombardment with radiation with high-energy radiation producing ion implantation in group IV semiconductors of electrically active species
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
- H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
- H01J37/30—Electron-beam or ion-beam tubes for localised treatment of objects
- H01J37/317—Electron-beam or ion-beam tubes for localised treatment of objects for changing properties of the objects or for applying thin layers thereon, e.g. for ion implantation
- H01J37/3171—Electron-beam or ion-beam tubes for localised treatment of objects for changing properties of the objects or for applying thin layers thereon, e.g. for ion implantation for ion implantation
- H01J37/3172—Maskless patterned ion implantation
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
- H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
- H01J37/02—Details
- H01J37/04—Arrangements of electrodes and associated parts for generating or controlling the discharge, e.g. electron-optical arrangement, ion-optical arrangement
- H01J37/08—Ion sources; Ion guns
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
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- H—ELECTRICITY
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- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67098—Apparatus for thermal treatment
- H01L21/67115—Apparatus for thermal treatment mainly by radiation
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L31/00—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L31/02—Details
- H01L31/0224—Electrodes
- H01L31/022408—Electrodes for devices characterised by at least one potential jump barrier or surface barrier
- H01L31/022425—Electrodes for devices characterised by at least one potential jump barrier or surface barrier for solar cells
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L31/00—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L31/02—Details
- H01L31/0224—Electrodes
- H01L31/022408—Electrodes for devices characterised by at least one potential jump barrier or surface barrier
- H01L31/022425—Electrodes for devices characterised by at least one potential jump barrier or surface barrier for solar cells
- H01L31/022441—Electrode arrangements specially adapted for back-contact solar cells
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- H—ELECTRICITY
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- H01L31/00—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L31/04—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof adapted as photovoltaic [PV] conversion devices
- H01L31/06—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof adapted as photovoltaic [PV] conversion devices characterised by at least one potential-jump barrier or surface barrier
- H01L31/068—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof adapted as photovoltaic [PV] conversion devices characterised by at least one potential-jump barrier or surface barrier the potential barriers being only of the PN homojunction type, e.g. bulk silicon PN homojunction solar cells or thin film polycrystalline silicon PN homojunction solar cells
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L31/00—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L31/04—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof adapted as photovoltaic [PV] conversion devices
- H01L31/06—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof adapted as photovoltaic [PV] conversion devices characterised by at least one potential-jump barrier or surface barrier
- H01L31/068—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof adapted as photovoltaic [PV] conversion devices characterised by at least one potential-jump barrier or surface barrier the potential barriers being only of the PN homojunction type, e.g. bulk silicon PN homojunction solar cells or thin film polycrystalline silicon PN homojunction solar cells
- H01L31/0682—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof adapted as photovoltaic [PV] conversion devices characterised by at least one potential-jump barrier or surface barrier the potential barriers being only of the PN homojunction type, e.g. bulk silicon PN homojunction solar cells or thin film polycrystalline silicon PN homojunction solar cells back-junction, i.e. rearside emitter, solar cells, e.g. interdigitated base-emitter regions back-junction cells
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L31/00—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L31/18—Processes or apparatus specially adapted for the manufacture or treatment of these devices or of parts thereof
- H01L31/1804—Processes or apparatus specially adapted for the manufacture or treatment of these devices or of parts thereof comprising only elements of Group IV of the Periodic System
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
- H01J2237/00—Discharge tubes exposing object to beam, e.g. for analysis treatment, etching, imaging
- H01J2237/06—Sources
- H01J2237/08—Ion sources
- H01J2237/0802—Field ionization sources
- H01J2237/0805—Liquid metal sources
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
- H01J2237/00—Discharge tubes exposing object to beam, e.g. for analysis treatment, etching, imaging
- H01J2237/06—Sources
- H01J2237/08—Ion sources
- H01J2237/0802—Field ionization sources
- H01J2237/0807—Gas field ion sources [GFIS]
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
- H01J2237/00—Discharge tubes exposing object to beam, e.g. for analysis treatment, etching, imaging
- H01J2237/20—Positioning, supporting, modifying or maintaining the physical state of objects being observed or treated
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
- H01J2237/00—Discharge tubes exposing object to beam, e.g. for analysis treatment, etching, imaging
- H01J2237/30—Electron or ion beam tubes for processing objects
- H01J2237/317—Processing objects on a microscale
- H01J2237/31701—Ion implantation
- H01J2237/31706—Ion implantation characterised by the area treated
- H01J2237/3171—Ion implantation characterised by the area treated patterned
- H01J2237/31713—Focused ion beam
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
- H01J2237/00—Discharge tubes exposing object to beam, e.g. for analysis treatment, etching, imaging
- H01J2237/30—Electron or ion beam tubes for processing objects
- H01J2237/317—Processing objects on a microscale
- H01J2237/31749—Focused ion beam
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- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02E—REDUCTION OF GREENHOUSE GAS [GHG] EMISSIONS, RELATED TO ENERGY GENERATION, TRANSMISSION OR DISTRIBUTION
- Y02E10/00—Energy generation through renewable energy sources
- Y02E10/50—Photovoltaic [PV] energy
- Y02E10/547—Monocrystalline silicon PV cells
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- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
- Y02P70/00—Climate change mitigation technologies in the production process for final industrial or consumer products
- Y02P70/50—Manufacturing or production processes characterised by the final manufactured product
Abstract
L'invention concerne un dispositif pour la modification d'un substrat semiconducteur par faisceau d'ions ou par implantation ionique, avec au moins une microsource d'ions composée d'au moins un agencement à émission de champ produisant un faisceau d'ions focalisable, orienté vers le substrat semiconducteur, composé d'un émetteur d'ions avec un réservoir d'ions à un premier potentiel électrique, un extracteur et/ou une lentille électrostatique à un deuxième potentiel électrique et une unité de post-accélération à un troisième potentiel électrique. Dans le procédé, le substrat semiconducteur est soumis à des faisceaux d'ions orientés provenant d'un réseau d'implantation composé de microsources d'ions à émission de champ et, grâce à une réponse pilotée des microsources d'ions à émission de champ, produit dans le substrat semiconducteur un profil de modification qui dépend du lieu dans son extension latérale et/ou dans sa profondeur.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
EP10790430A EP2510534A2 (fr) | 2009-12-11 | 2010-12-10 | Dispositif et procédé de modification d'un substrat semiconducteur par un faisceau d'ions |
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
DE102009057970 | 2009-12-11 | ||
DE102009057970.2 | 2009-12-11 |
Publications (2)
Publication Number | Publication Date |
---|---|
WO2011070156A2 WO2011070156A2 (fr) | 2011-06-16 |
WO2011070156A3 true WO2011070156A3 (fr) | 2011-09-09 |
Family
ID=43709165
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
PCT/EP2010/069383 WO2011070156A2 (fr) | 2009-12-11 | 2010-12-10 | Dispositif et procédé de modification d'un substrat semiconducteur par un faisceau d'ions |
Country Status (2)
Country | Link |
---|---|
EP (1) | EP2510534A2 (fr) |
WO (1) | WO2011070156A2 (fr) |
Families Citing this family (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US8697559B2 (en) | 2011-07-07 | 2014-04-15 | Varian Semiconductor Equipment Associates, Inc. | Use of ion beam tails to manufacture a workpiece |
CN110851939A (zh) * | 2018-07-27 | 2020-02-28 | 核工业西南物理研究院 | 圆柱形阳极层霍尔推力器寿命评估的仿真计算方法 |
Citations (11)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
EP0303486A2 (fr) * | 1987-08-12 | 1989-02-15 | Oki Electric Industry Company, Limited | Procédé d'implantation d'ions |
US4902898A (en) * | 1988-04-26 | 1990-02-20 | Microelectronics Center Of North Carolina | Wand optics column and associated array wand and charged particle source |
US20010032939A1 (en) * | 2000-02-09 | 2001-10-25 | Gerlach Robert L. | Multi-column FIB for nanofabrication applications |
US20030122085A1 (en) * | 2000-12-28 | 2003-07-03 | Gerhard Stengl | Field ionization ion source |
US20030226834A1 (en) * | 2002-06-07 | 2003-12-11 | Fuji Photo Film Co., Ltd. & Fuji Photo Optical Co., Ltd. | Laser annealer and laser thin-film forming apparatus |
US20060022143A1 (en) * | 2004-07-28 | 2006-02-02 | Wolfgang Pilz | Emitter for an ion source |
US20070045534A1 (en) * | 2005-07-08 | 2007-03-01 | Zani Michael J | Apparatus and method for controlled particle beam manufacturing |
US20080018460A1 (en) * | 2006-07-19 | 2008-01-24 | Hitachi High-Technologies Corporation | Manufacturing Equipment Using ION Beam or Electron Beam |
EP1956630A1 (fr) * | 2007-02-06 | 2008-08-13 | ICT Integrated Circuit Testing Gesellschaft für Halbleiterprüftechnik mbH | Séparateur de masse achromatique |
DE102008020145A1 (de) * | 2007-04-23 | 2008-11-13 | Hitachi High-Technologies Corp. | Ionenquelle, Ionenstrahlbearbeitungs/-betrachtungsvorrichtung, Vorrichtung mit einem geladenen Teilchenstrahl und Verfahren zum Betrachten des Querschnitts einer Probe |
US20090278434A1 (en) * | 2006-07-07 | 2009-11-12 | Sri International | Liquid Metal Wetting of Micro-Fabricated Charge-Emission Structures |
-
2010
- 2010-12-10 WO PCT/EP2010/069383 patent/WO2011070156A2/fr active Application Filing
- 2010-12-10 EP EP10790430A patent/EP2510534A2/fr not_active Withdrawn
Patent Citations (11)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
EP0303486A2 (fr) * | 1987-08-12 | 1989-02-15 | Oki Electric Industry Company, Limited | Procédé d'implantation d'ions |
US4902898A (en) * | 1988-04-26 | 1990-02-20 | Microelectronics Center Of North Carolina | Wand optics column and associated array wand and charged particle source |
US20010032939A1 (en) * | 2000-02-09 | 2001-10-25 | Gerlach Robert L. | Multi-column FIB for nanofabrication applications |
US20030122085A1 (en) * | 2000-12-28 | 2003-07-03 | Gerhard Stengl | Field ionization ion source |
US20030226834A1 (en) * | 2002-06-07 | 2003-12-11 | Fuji Photo Film Co., Ltd. & Fuji Photo Optical Co., Ltd. | Laser annealer and laser thin-film forming apparatus |
US20060022143A1 (en) * | 2004-07-28 | 2006-02-02 | Wolfgang Pilz | Emitter for an ion source |
US20070045534A1 (en) * | 2005-07-08 | 2007-03-01 | Zani Michael J | Apparatus and method for controlled particle beam manufacturing |
US20090278434A1 (en) * | 2006-07-07 | 2009-11-12 | Sri International | Liquid Metal Wetting of Micro-Fabricated Charge-Emission Structures |
US20080018460A1 (en) * | 2006-07-19 | 2008-01-24 | Hitachi High-Technologies Corporation | Manufacturing Equipment Using ION Beam or Electron Beam |
EP1956630A1 (fr) * | 2007-02-06 | 2008-08-13 | ICT Integrated Circuit Testing Gesellschaft für Halbleiterprüftechnik mbH | Séparateur de masse achromatique |
DE102008020145A1 (de) * | 2007-04-23 | 2008-11-13 | Hitachi High-Technologies Corp. | Ionenquelle, Ionenstrahlbearbeitungs/-betrachtungsvorrichtung, Vorrichtung mit einem geladenen Teilchenstrahl und Verfahren zum Betrachten des Querschnitts einer Probe |
Non-Patent Citations (1)
Title |
---|
BORLAND J O: "Low temperature activation of ion implanted dopants: a review", JUNCTION TECHNOLOGY, 2002. IWJT. EXTENDED ABSTRACTS OF THE THIRD INTER NATIONAL WORKSHOP ON DEC. 2-3, 2002, PISCATAWAY, NJ, USA,IEEE, 2 December 2002 (2002-12-02), pages 85 - 88, XP010653681, ISBN: 978-4-89114-028-1 * |
Also Published As
Publication number | Publication date |
---|---|
WO2011070156A2 (fr) | 2011-06-16 |
EP2510534A2 (fr) | 2012-10-17 |
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