WO2011067700A1 - Connexion de substrat par liant thermocollant - Google Patents

Connexion de substrat par liant thermocollant Download PDF

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Publication number
WO2011067700A1
WO2011067700A1 PCT/IB2010/055409 IB2010055409W WO2011067700A1 WO 2011067700 A1 WO2011067700 A1 WO 2011067700A1 IB 2010055409 W IB2010055409 W IB 2010055409W WO 2011067700 A1 WO2011067700 A1 WO 2011067700A1
Authority
WO
WIPO (PCT)
Prior art keywords
binder
substrates
light beam
temperature
binder body
Prior art date
Application number
PCT/IB2010/055409
Other languages
English (en)
Inventor
Petrus H. M. Timmermans
Eric Van Kempen
Renatus H. M. Sanders
Original Assignee
Koninklijke Philips Electronics N.V.
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Koninklijke Philips Electronics N.V. filed Critical Koninklijke Philips Electronics N.V.
Publication of WO2011067700A1 publication Critical patent/WO2011067700A1/fr

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Classifications

    • C—CHEMISTRY; METALLURGY
    • C03—GLASS; MINERAL OR SLAG WOOL
    • C03C—CHEMICAL COMPOSITION OF GLASSES, GLAZES OR VITREOUS ENAMELS; SURFACE TREATMENT OF GLASS; SURFACE TREATMENT OF FIBRES OR FILAMENTS MADE FROM GLASS, MINERALS OR SLAGS; JOINING GLASS TO GLASS OR OTHER MATERIALS
    • C03C27/00—Joining pieces of glass to pieces of other inorganic material; Joining glass to glass other than by fusing
    • C03C27/06—Joining glass to glass by processes other than fusing
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L31/00—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L31/04—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof adapted as photovoltaic [PV] conversion devices
    • H01L31/042—PV modules or arrays of single PV cells
    • H01L31/048—Encapsulation of modules
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K50/00—Organic light-emitting devices
    • H10K50/80—Constructional details
    • H10K50/84—Passivation; Containers; Encapsulations
    • H10K50/842—Containers
    • H10K50/8426—Peripheral sealing arrangements, e.g. adhesives, sealants
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02E—REDUCTION OF GREENHOUSE GAS [GHG] EMISSIONS, RELATED TO ENERGY GENERATION, TRANSMISSION OR DISTRIBUTION
    • Y02E10/00—Energy generation through renewable energy sources
    • Y02E10/50—Photovoltaic [PV] energy

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Geochemistry & Mineralogy (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Electromagnetism (AREA)
  • Ceramic Engineering (AREA)
  • General Physics & Mathematics (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • General Chemical & Material Sciences (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Materials Engineering (AREA)
  • Organic Chemistry (AREA)
  • Optics & Photonics (AREA)
  • Electroluminescent Light Sources (AREA)
  • Joining Of Glass To Other Materials (AREA)

Abstract

La présente invention a trait à un procédé et à un appareil (100) permettant de connecter deux substrats (12, 13) au moyen du corps intermédiaire (11) d'un liant thermocollant, par exemple une fritte. Le corps du liant est localement chauffé à une température supérieure à sa température d'activation, qui peut de préférence être obtenue au moyen d'un faisceau lumineux laser (L). Le refroidissement ultérieur est effectué de manière à ce que, vu en coupe transversale à travers le corps du liant, il n'existe toujours qu'une seule zone (11c) où la température a déjà chuté en dessous de la température de durcissement. Par conséquent, il est possible d'empêcher que la liaison locale entre les deux substrats se produise à deux emplacements distincts entre lesquels les substrats demeurent séparés.
PCT/IB2010/055409 2009-12-02 2010-11-25 Connexion de substrat par liant thermocollant WO2011067700A1 (fr)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
EP09177690 2009-12-02
EP09177690.6 2009-12-02

Publications (1)

Publication Number Publication Date
WO2011067700A1 true WO2011067700A1 (fr) 2011-06-09

Family

ID=43641914

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/IB2010/055409 WO2011067700A1 (fr) 2009-12-02 2010-11-25 Connexion de substrat par liant thermocollant

Country Status (2)

Country Link
TW (1) TW201126787A (fr)
WO (1) WO2011067700A1 (fr)

Citations (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20060082298A1 (en) 2004-10-20 2006-04-20 Becken Keith J Optimization of parameters for sealing organic emitting light diode (OLED) displays
US20070128967A1 (en) * 2005-12-06 2007-06-07 Becken Keith J Method of making a glass envelope
US20070128966A1 (en) 2005-12-06 2007-06-07 Becken Keith J Method of encapsulating a display element
WO2007067533A2 (fr) 2005-12-06 2007-06-14 Corning Incorporated Systeme et procede pour sceller par frittage des conditionnements en verre
US20090086325A1 (en) * 2007-09-28 2009-04-02 Anping Liu Method and apparatus for frit sealing with a variable laser beam
US20090221207A1 (en) 2008-02-28 2009-09-03 Andrew Lawrence Russell Method of sealing a glass envelope
WO2009151592A2 (fr) * 2008-06-11 2009-12-17 Corning Incorporated Masque et procédé de fermeture hermétique d’une enveloppe de verre

Patent Citations (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20060082298A1 (en) 2004-10-20 2006-04-20 Becken Keith J Optimization of parameters for sealing organic emitting light diode (OLED) displays
US20070128967A1 (en) * 2005-12-06 2007-06-07 Becken Keith J Method of making a glass envelope
US20070128966A1 (en) 2005-12-06 2007-06-07 Becken Keith J Method of encapsulating a display element
WO2007067533A2 (fr) 2005-12-06 2007-06-14 Corning Incorporated Systeme et procede pour sceller par frittage des conditionnements en verre
US20090086325A1 (en) * 2007-09-28 2009-04-02 Anping Liu Method and apparatus for frit sealing with a variable laser beam
WO2009045320A2 (fr) 2007-09-28 2009-04-09 Corning Incorporated Soudage à la fritte par faisceau laser variable
US20090221207A1 (en) 2008-02-28 2009-09-03 Andrew Lawrence Russell Method of sealing a glass envelope
WO2009151592A2 (fr) * 2008-06-11 2009-12-17 Corning Incorporated Masque et procédé de fermeture hermétique d’une enveloppe de verre

Also Published As

Publication number Publication date
TW201126787A (en) 2011-08-01

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