WO2011062021A1 - Bi-ge-o sintered body sputtering target, method for producing same, and optical recording medium - Google Patents

Abstract

Disclosed are: a Bi-Ge-O sintered body sputtering target which is composed of bismuth (Bi), germanium (Ge) and oxygen (O) and characterized in that the atom number ratio of Bi and Ge satisfies 0.57 < (Bi/(Bi + Ge)) < 0.75 and the crystal phase is configured of two phases, namely Bi₁₂GeO₂₀ and Bi₄Ge₃O₁₂; a method for producing the Bi-Ge-O sintered body sputtering target; and an optical recording medium. Specifically disclosed is a Bi-Ge-O sintered body sputtering target which has excellent thermal shock resistance and is capable of achieving greatly improved production efficiency since the Bi-Ge-O sintered body sputtering target enables high-power sputtering. The Bi-Ge-O sintered body sputtering target does not suffer from cracks and generates little particles during the sputtering, so that a thin film with high quality can be stably produced and an optical recording medium that is free from recording bit errors can be obtained. Also specifically disclosed are: a method for producing the Bi-Ge-O sintered body sputtering target; and an optical recording medium.

Description

Bi-Ge-O-based sintered sputtering target, manufacturing method thereof, and optical recording medium

The present invention relates to a Bi—Ge—O-based sintered sputtering target, a method for producing the target, and an optical recording medium. Particularly, since it has excellent thermal shock resistance and can be sputtered at high power, production efficiency is greatly improved. To obtain an optical recording medium in which no target cracks occur during sputtering, particle generation is small, a high-quality thin film can be stably produced, and recording bit errors do not occur. The present invention relates to a Bi—Ge—O-based sintered sputtering target that can be manufactured, a method for manufacturing the target, and an optical recording medium.

A write once read many (WORM) optical recording medium is an optical recording medium capable of high-density recording even with a laser beam in a blue wavelength region (350 to 500 nm), particularly a multilayer recording medium having high recording sensitivity. An optical recording medium having a recording layer.
In order to meet the demand for higher density optical discs, higher density has been achieved by multilayering. Similarly, optical recording media for high-density recording are being developed for optical discs using blue LDs.

In order to realize a write-once type optical recording medium capable of high-density multilayer recording, a film having a stable composition and structure as well as a film having excellent light transmission characteristics are required. Since it is often an oxide and generally has a high melting point, a sputtering method is often used as a film formation method.

Therefore, a sputtering target suitable for obtaining such a film is required. However, since the form and structure of the compound constituting the target also affect the sputtering characteristics, stable sputtering is performed when the compound constituting the target is suitable for the required film characteristics. Whether it can be done is a problem.

When a thin film for an optical recording medium is formed on a substrate using a sputtering method, the generation of particles may increase depending on the target material, which may reduce the quality. Particularly in a high recording density medium, the occurrence of a recording bit error due to particles or the like becomes a serious problem. This causes a problem that the product becomes defective and the yield decreases.

Conventionally, many materials have been proposed as optical recording media that have been proposed. For example, Patent Document 1 discloses an optical recording medium in which at least a recording layer is formed on a substrate, the main components of the constituent elements of the recording layer are Bi and O (oxygen), contain B, Ge, An optical recording medium containing at least one element X selected from Li, Sn, Cu, Fe, Pd, Zn, Mg, Nd, Mn, and Ni is described.

Patent Document 2 discloses that the recording layer has Bi, M (M is Mg, Al, Cr, Mn, Co, Fe, Cu, Zn, Li, Si, Ge, Zr, Ti, Hf, Sn, Mo, V, Nb, Y, Ta) and oxygen, and the recording mark portion on which the information is recorded is composed of crystals of the elements contained in the recording layer and / or oxides of these elements. A write-once optical recording medium characterized by containing crystals is described.

In addition, Patent Documents 3 to 8 have been proposed. Under such circumstances, a combination of optical recording media composed of bismuth (Bi), germanium (Ge), and oxygen (O) is conceivable, and these optical recording media are described as being formed by sputtering of a sintered target. There is also. However, this Bi-Ge-O-based sintered sputtering target is vulnerable to thermal shock, and often cracks and cracks occur during sputtering with high power, resulting in the generation of particles and improving the quality of the recording film and the like. There was a problem to lose.

JP 2008-210492 A JP 2006-116948 A JP 2003-48375 A JP 2005-161831 A JP 2005-108396 A JP 2007-169779 A JP 2008-273167 A Japanese Patent No. 4271063

The present invention relates to a Bi—Ge—O-based sintered sputtering target, a method for producing the target, and an optical recording medium. Particularly, since it has excellent thermal shock resistance and can be sputtered at high power, production efficiency is greatly improved. To obtain an optical recording medium in which no target cracks occur during sputtering, particle generation is small, a high-quality thin film can be stably produced, and recording bit errors do not occur. It is an object of the present invention to provide a Bi—Ge—O-based sintered sputtering target, a method for producing the target, and an optical recording medium.

In order to solve the above-mentioned problems, the present inventors have conducted intensive research. As a result, the Bi ₁₂ GeO ₂₀ particles in the dispersion system are made fine particles, so that the thermal expansion / contraction of each particle during heating / cooling is reduced. It was found that the amount was reduced and the thermal shock resistance was improved.

The present invention is based on this finding,
1) A sintered compact target composed of bismuth (Bi), germanium (Ge), and oxygen (O), and the atomic ratio of Bi and Ge is 0.57 <(Bi / (Bi + Ge)) <0.75. Bi—Ge—O-based sintered sputtering target characterized by being composed of two phases of Bi ₁₂ GeO ₂₀ and Bi ₄ Ge ₃ O ₁₂ as crystal phases 2) Bi ₁₂ GeO ₂₀ and Bi ₄ Ge The Bi—Ge—O-based sintered sputtering target according to 1) above, wherein the molar ratio of ₃ O ₁₂ is (Bi ₁₂ GeO ₂₀ / Bi ₄ Ge ₃ O ₁₂ ) <0.56 3) above 1) or 2) Bi-GeO oxide sintered sputtering target 4 according) data maximum particle size of the _Bi 12 _{GeO 20} of the target sintered body in is equal to or is 3μm or less 1) to 3) above, wherein the average bending strength reduction rate before and after the thermal shock is 50% or less when the get is subjected to thermal shock by quenching in water after heating at 200 ° C. for 30 minutes. 5) A sintered sputtering target according to any one of 5) and 5) an optical recording medium formed by sputtering using the target according to any one of 1) to 4) above.

The present invention also provides:
6) Bi ₁₂ GeO ₂₀ powder obtained by mixing a GeO ₂ powder 14.3 mol% and Bi ₂ O ₃ powder 85.7 mol%, followed by solid phase reaction, GeO ₂ powder 60.0 mol%, and Bi ₂ O ₃ powder Bi-Ge-O is characterized in that a sintered body is produced by hot-pressing Bi ₄ Ge ₃ O ₁₂ powder obtained by mixing solid phase reaction after mixing 40.0 mol%. 7) Manufacturing method of sintered body sputtering target 7) Bi ₁₂ GeO ₂₀ powder and Bi ₄ Ge ₃ O ₁₂ powder are used as starting materials, and the atomic ratio of Bi and Ge is 0.57 <(Bi / (Bi + Ge)) <6> The Bi according to 6) above, wherein the sintered body is prepared by hot pressing at 600 to 840 ° C. and an applied pressure of 0 to 400 kg / cm ² after mixing so as to satisfy <0.75. -Ge- Method for producing O-based sintered sputtering target 8) Bi-Ge-O-based firing as described in 6) or 7) above, wherein Bi ₁₂ GeO ₂₀ powder finely pulverized to an average particle size of 1 μm or less is used. A method for producing a combined sputtering target is provided.

The Bi—Ge—O-based sintered sputtering target of the present invention is particularly excellent in thermal shock resistance and can be sputtered at high power, so that significant improvement in production efficiency can be expected. There is an excellent effect that an optical recording medium can be obtained, in which cracks do not occur, particle generation is small, a high-quality thin film can be stably produced, and no recording bit error occurs.

2 is a photograph showing a scanning electron microscope observation result of the sintered body obtained in Example 1. FIG. 6 is a photograph showing a scanning electron microscope observation result of a sintered body obtained in Comparative Example 1.

The Bi—Ge—O based sintered sputtering target of the present invention is a sintered target made of bismuth (Bi), germanium (Ge), and oxygen (O), and the atomic ratio of Bi and Ge is 0. .57 <(Bi / (Bi + Ge)) <0.75, and the crystal phase is composed of two phases of Bi ₁₂ GeO ₂₀ and Bi ₄ Ge ₃ O ₁₂ . A recording film using this composition is a suitable composition that can achieve high-density recording by multilayering, and can stably perform good sputtering film formation.

In general, when a powder of bismuth oxide (Bi ₂ O ₃ ) and germanium oxide (GeO ₂ ) is used as a starting material and sintered to produce the composition target, Bi ₁₂ GeO ₂₀ and Bi ₄ Ge ₃ O ₁₂ The two-phase coexistence composition.
However, since Bi ₁₂ GeO ₂₀ and Bi ₄ Ge ₃ O ₁₂ have a large difference in thermal expansion coefficient, they are extremely vulnerable to thermal shock, and there arises a problem that cracking occurs during sputtering film formation at high power. Incidentally, the thermal expansion coefficient of Bi ₁₂ GeO ₂₀ is 1.39 × 10 ⁻⁵ , and the thermal expansion coefficient of Bi ₄ Ge ₃ O ₁₂ is 6.00 × 10 ⁻⁶ .

On the other hand, within the composition range, Bi ₄ Ge ₃ O ₁₂ serves as a base material, and Bi ₁₂ GeO ₂₀ particles are dispersed. At this time, it has been found that by making the Bi ₁₂ GeO ₂₀ particles in the dispersion system fine particles, the thermal expansion / shrinkage amount of each particle during heating / cooling is reduced and the thermal shock resistance is improved.
Also, the _Bi 2 _{O 3} and GeO ₂ as starting _materials, when pulverized in a state of Bi 12 _{GeO 20} and _Bi 4 _Ge 3 _{O 12 coexist,} Bi ₄ Ge _{3 O 12} is selectively milled Therefore, it was found that the dispersion system Bi ₁₂ GeO ₂₀ was not easily pulverized.
Therefore, Bi ₁₂ GeO ₂₀ and Bi ₄ Ge ₃ O ₁₂ were used as starting materials, and Bi ₁₂ GeO ₂₀ was finely pulverized in advance to improve thermal shock resistance.

As a result, the thermal shock resistance of the target was improved, which enabled film formation with high power, and a great advantage that production efficiency could be increased was obtained.
In addition, the generation of particles caused by cracks and cracks is remarkably reduced, making it possible to produce stable high quality thin films, producing no recording bit errors, and producing optical recording media that can achieve high recording density. The effect that it becomes possible was obtained.
It is effective in improving the thermal shock resistance that the molar ratio of Bi ₁₂ GeO ₂₀ and Bi ₄ Ge ₃ O ₁₂ is (Bi ₁₂ GeO ₂₀ / Bi ₄ Ge ₃ O ₁₂ ) <0.56.
Further, when the particle size of Bi ₁₂ GeO ₂₀ in the target sintered body is made finer, it is more effective that the maximum particle size is 3 microns or less, preferably the average particle size is 1 μm or less. When the target was subjected to thermal shock by quenching in water after heating at 200 ° C. for 30 minutes, it was possible to achieve an average bending strength reduction rate of 50% or less before and after the thermal shock.

In the case of a target having a two-phase coexisting composition of Bi ₁₂ GeO ₂₀ and Bi ₄ Ge ₃ O _{12 as} a conventional product, the average bending strength reduction rate before and after the thermal shock exceeds 80%, which is a significant improvement. There was an effect. This makes it possible to directly evaluate the characteristics of the target in order to suppress cracking of the target due to thermal shock.
The present invention includes an optical recording medium formed by sputtering using the above target.

In the production of the Bi—Ge—O based sintered sputtering target, 14.3 mol% of GeO ₂ powder and 85.7 mol% of Bi ₂ O ₃ powder were mixed, and then Bi ₁₂ GeO ₂₀ powder obtained by solid phase reaction was used. Then, 60.0 mol% of GeO ₂ powder and 40.0 mol% of Bi ₂ O ₃ powder are mixed, and then Bi ₄ Ge ₃ O ₁₂ powder obtained by solid phase reaction is used as a starting material, and these are mixed and hot pressed. Thus, a sintered body can be produced.

Furthermore, in the production of the Bi—Ge—O based sintered sputtering target of the present invention, Bi ₁₂ GeO ₂₀ powder and Bi ₄ Ge ₃ O ₁₂ powder are used as starting materials, and the atomic ratio of Bi and Ge is 0. .57 <(Bi / (Bi + Ge)) <0.75, and then mixed by hot pressing at 600 to 840 ° C. and pressure of 0 to 400 kg / cm ² to produce a sintered body. Is particularly effective.
Also in this case, it is effective to use Bi ₁₂ GeO ₂₀ powder finely pulverized to an average particle size of 1 μm or less.

This sintering condition is a suitable condition for obtaining a target having a uniform composition. Although the target can be manufactured under sintering conditions outside the above range, the reproducibility of the target quality is inferior, so that the above range is desirable. Further, the atomic ratio of Bi to Ge in the raw material stage, 0.57 <(Bi / (Bi + Ge)) <0.75 is directly reflected on the target, and a target having the same composition ratio can be obtained.

Hereinafter, description will be made based on examples and comparative examples. In addition, a present Example is an example to the last, and is not restrict | limited at all by this example. In other words, the present invention is limited only by the scope of the claims, and includes various modifications other than the examples included in the present invention.

Example 1
Bi ₁₂ GeO ₂₀ powder and Bi ₄ Ge ₃ O ₁₂ powder were prepared in advance using powders of bismuth oxide and germanium oxide having a purity of 3N (99.9%) as a starting material. However, Bi ₁₂ GeO ₂₀ powder 16.67 mol% and Bi ₄ Ge ₃ O ₁₂ powder 83.33 mol% were mixed and mixed, and the mixed powder was filled in a carbon die so as to be 0.67. Then, hot pressing was performed under the conditions of a temperature of 700 ° C. and a pressure of 250 kg / cm ² .

The sintered body after hot pressing was finished to obtain a target. The relative density of the target was 96% (7.15 g / cm ³ at 100% density).
The sintered body by X-ray diffraction _measurement, it was confirmed that a two-phase structure of _{Bi 12 GeO 20, Bi 4 Ge} 3 O 12.
Next, a scanning electron microscope photograph of this sintered body is shown in FIG. Thereby, it was confirmed that Bi ₄ Ge ₃ O ₁₂ became a base material (gray portion in the photograph) and Bi ₁₂ GeO ₂₀ was a dispersion (white portion in the photograph). It was also confirmed that the maximum particle size of Bi ₁₂ GeO ₂₀ was 3 μm or less and the average particle size was 1 μm or less.

Next, this target was heated at 200 ° C. for 30 minutes and then subjected to thermal shock by quenching in water. Thereafter, a bending test according to JIS standard 1601 (from 5 arbitrary points in the target, a test piece having a width of 4 ± 0.1 mm, a height of 3 ± 0.1 mm, and a length of 40 to 50 mm was sampled and measured. The average value of the measurement results of the points was determined), and the average bending strength ratio (strength reduction rate) before and after the thermal shock was measured. The measurement results are similarly shown in Table 1. Some variation occurred depending on the measurement location, but all were less than 50%, and the rate of decrease in strength was small.

Next, using this target, pre-sputtering was performed on a glass substrate at 1 kW for about 1 hour, and then 10 s sputtering at 2 kW and 5 s stop were repeated 10,000 times. After this sputtering cycle, the chamber was opened and visually observed. Thus, the abnormality of the target was observed, but no cracks or cracks were observed in the target. Also, the generation of particles during sputtering was small.
As a result, according to the embodiment of the present invention, there is no generation of cracks in the target, the production efficiency can be increased, and a high-quality thin film can be stably produced. It was a good target having an excellent effect of being able to obtain a medium.

(Comparative Example 1)
A powder of bismuth oxide and germanium oxide having a purity of 3N (99.9%) is used as a starting material, and GeO ₂ powder is 50.0 mol% so that the atomic ratio of Bi and Ge is 0.67, respectively. After preparing 50.0 mol% of Bi ₂ O ₃ powder, it was mixed, and the powder after mixing was filled in a carbon die, and hot pressing was performed under conditions of a temperature of 730 ° C. and a pressure of 250 kg / cm ₂ .

The sintered body after hot pressing was finished to obtain a target. The relative density of the target was 103% (7.44 g / cm ³ at 100% density).
From the X-ray diffraction measurement of this sintered body, it was confirmed that the crystal phase of the target was a two-phase structure of Bi ₁₂ GeO ₂₀ and Bi ₄ Ge ₃ O ₁₂ .
Next, a scanning electron microscope photograph of this sintered body is shown in FIG. Thereby, it was confirmed that Bi ₄ Ge ₃ O ₁₂ became a base material (gray portion in the photograph) and Bi ₁₂ GeO ₂₀ was a dispersion (white portion in the photograph). Further, it was confirmed that the maximum particle size of Bi ₁₂ GeO ₂₀ was 8 μm or less and the average particle size was 4 μm or less.

Next, this target was heated at 200 ° C. for 30 minutes, and then subjected to thermal shock by quenching in water. Then, the bending strength test by JIS1601 was implemented. The measurement results of the average bending strength ratio (strength reduction rate) before and after the thermal shock are also shown in Table 1. As a result, the reduction rate of the average bending strength was 82.1%.
Next, using this target, it was pre-sputtered on a glass substrate at 1 kW for about 1 hour, then 10 s spatter at 2 kW and 5 s stop were repeated 10 times. After this sputtering cycle, the chamber was opened and visually observed. When the abnormality of the target was observed, the target was cracked. In addition, the generation of particles was remarkably increased compared to the examples. This is thought to be caused by cracks in the target during sputtering.

According to the Bi—Ge—O-based sintered sputtering target of the present invention and the method for producing the target, since it is particularly excellent in thermal shock resistance and can be sputtered at high power, significant improvement in production efficiency can be expected. At the same time, the target is not cracked during sputtering, the generation of particles is small, a high-quality thin film can be stably produced, and an optical recording medium free from recording bit errors can be obtained. Has an excellent effect. The production efficiency of film formation of the optical recording medium can be increased, and a suitable target for manufacturing the optical recording medium can be provided.

Claims (8)

1. A sintered compact target composed of bismuth (Bi), germanium (Ge), and oxygen (O), and the atomic ratio of Bi and Ge is 0.57 <(Bi / (Bi + Ge)) <0.75 A Bi—Ge—O-based sintered sputtering target comprising two phases of Bi ₁₂ GeO ₂₀ and Bi ₄ Ge ₃ O ₁₂ as crystal phases.
2. The Bi-Ge-O according to claim 1, wherein the molar ratio of Bi ₁₂ GeO ₂₀ to Bi ₄ Ge ₃ O ₁₂ is (Bi ₁₂ GeO ₂₀ / Bi ₄ Ge ₃ O ₁₂ ) <0.56. -Based sintered sputtering target.
3. 3. The Bi—Ge—O based sintered sputtering target according to claim 1, wherein the maximum particle size of Bi ₁₂ GeO ₂₀ in the target sintered body is 3 μm or less.
4. The average bending strength reduction rate before and after the thermal shock when the target is subjected to thermal shock by quenching in water after heating at 200 ° C for 30 minutes is 50% or less. The sintered compact sputtering target as described in any one of Claims.
5. An optical recording medium formed by sputtering using the target according to any one of claims 1 to 4.
6. After mixing the GeO ₂ powder 14.3 mol% and _Bi 2 _{O 3} powder 85.7mol%, and _Bi 12 _{GeO 20} powder obtained by a solid phase reaction, GeO ₂ powder 60.0 mol% and _Bi 2 _{O 3} powder 40. Bi-Ge-O-based sintering is characterized in that a sintered body is produced by hot-pressing Bi ₄ Ge ₃ O ₁₂ powder obtained by solid-phase reaction after mixing 0 mol% as a starting material. A method for producing a combined sputtering target.
7. After mixing Bi ₁₂ GeO ₂₀ powder and Bi ₄ Ge ₃ O ₁₂ powder as starting materials, the atomic ratio of Bi and Ge is mixed so that 0.57 <(Bi / (Bi + Ge)) <0.75 The Bi-Ge-O-based sintered sputtering target according to claim 6, wherein the sintered body is produced by hot pressing at 600 to 840 ° C and a pressing force of 0 to 400 kg / cm ² . Production method.
8. The method for producing a Bi-Ge-O-based sintered sputtering target according to claim 6 or 7, wherein Bi ₁₂ GeO ₂₀ powder finely pulverized to an average particle size of 1 µm or less is used.

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