WO2011046557A1 - Wire bonding machine, and method of calibrating a crosshair offset for a wire bonding operation - Google Patents

Wire bonding machine, and method of calibrating a crosshair offset for a wire bonding operation Download PDF

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Publication number
WO2011046557A1
WO2011046557A1 PCT/US2009/060869 US2009060869W WO2011046557A1 WO 2011046557 A1 WO2011046557 A1 WO 2011046557A1 US 2009060869 W US2009060869 W US 2009060869W WO 2011046557 A1 WO2011046557 A1 WO 2011046557A1
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Prior art keywords
crosshair
offset
wire bonding
crosshair offset
offset value
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PCT/US2009/060869
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French (fr)
Inventor
John D. Molnar
Shawn Sarbacker
David Schalcosky
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Kulicke And Soffa Industries, Inc.
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Publication date
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Priority to PCT/US2009/060869 priority Critical patent/WO2011046557A1/en
Publication of WO2011046557A1 publication Critical patent/WO2011046557A1/en

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Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K20/00—Non-electric welding by applying impact or other pressure, with or without the application of heat, e.g. cladding or plating
    • B23K20/002—Non-electric welding by applying impact or other pressure, with or without the application of heat, e.g. cladding or plating specially adapted for particular articles or work
    • B23K20/004—Wire welding
    • B23K20/005—Capillary welding
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies
    • H01L24/78—Apparatus for connecting with wire connectors
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2223/00—Details relating to semiconductor or other solid state devices covered by the group H01L23/00
    • H01L2223/544—Marks applied to semiconductor devices or parts
    • H01L2223/54426—Marks applied to semiconductor devices or parts for alignment
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies and for methods related thereto
    • H01L2224/78—Apparatus for connecting with wire connectors
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/544—Marks applied to semiconductor devices or parts, e.g. registration marks, alignment structures, wafer maps
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/00014—Technical content checked by a classifier the subject-matter covered by the group, the symbol of which is combined with the symbol of this group, being disclosed without further technical details
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/0101—Neon [Ne]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01015—Phosphorus [P]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01075—Rhenium [Re]

Definitions

  • the present invention relates to wire bonding machines, and more particularly, to improved methods of calibrating a crosshair offset for a wire bonding operation.
  • wire bonding continues to be the primary method of providing electrical interconnection between two locations within a package (e.g., between a die pad of a semiconductor die and a lead of a leadframe). More specifically, using a wire bonder (also known as a wire bonding machine) wire loops (and/or conductive bumps) are formed between respective locations to be electrically interconnected. Certain wire bonding machines may be used to form only conductive bumps, where such machines may be referred to as bumping machines, stud bumpers, or the like. Wire bonds (e.g., as part of a wire loop or a conductive bump, etc) are formed using a bonding tool such as a capillary tool or a wedge bonding tool.
  • a bonding tool such as a capillary tool or a wedge bonding tool.
  • Wire bonding machines typically include an optical system (also known as a vision system) for imaging operations.
  • the optical system may be used to teach the bonding locations (e.g., the die pad locations of a semiconductor die, the lead locations of a leadframe, etc.) to the wire bonding machine.
  • the optical system may also be used during the wire bonding operation, for example, to ensure that the wire bonds are being formed at the proper locations.
  • Exemplary elements of the optical system includes cameras or the like.
  • the optical system determines the location of the bonding tool during the wire bonding operation; however, the imaging lens of the optical system is typically positioned above the bondable area of the wire bonding machine. Thus, the optical system can not look at a workpiece directly below the bonding tool because that portion of the workpiece is visibly blocked by the bonding tool (and transducer which hold the bonding tool). Thus, in order to accurately use an optical system to determine the position of the bonding tool (e.g., the position of the bonding tool with respect to the bondable area of the wire bonding machine) a crosshair offset is used.
  • This distance (typically viewed as a distance in the XY plane and may have X and Y axis components) is measured, and is used to adjust the position of the bond head during wire bonding operations.
  • crosshair offset values may be inaccurate in certain applications, and it would be desirable to provide improved methods of calibrating a crosshair offset on a wire bonding machine.
  • a method of calibrating a crosshair offset in connection with a wire bonding operation includes: (1) determining a first crosshair offset value for a first position of a bondable area of a wire bonding machine using an optical system of the wire bonding machine; and (2) repeating step (1) for a plurality of positions of the bondable area such that a plurality of crosshair offset values are determined, each of the plurality of the crosshair offset values corresponding to one of the plurality of positions of the bondable area.
  • a method of calibrating a crosshair offset in connection with a wire bonding operation includes: (1) providing an offset measurement tool carried by a bond head of a wire bonding machine; (2) using an optical system of the wire bonding machine to view a region of the offset measurement tool to determine a crosshair offset value, the crosshair offset value corresponding to a position of a bondable area of the wire bonding machine; (3) moving the bond head to a plurality of locations and repeating step (2) at each of the locations, thereby using the optical system to determine a plurality of crosshair offset values corresponding to different positions of the bondable area; and (4) storing the plurality of crosshair offset values corresponding to the plurality of positions into memory accessible by the wire bonding machine.
  • a method of performing a wire bonding operation includes: (1) performing a crosshair offset calibration process at a plurality of positions of a bondable area of a wire bonding machine, thereby determining a plurality of crosshair offset values, each of the crosshair offset values corresponding to a respective one of the positions of the bondable area; and (2) performing a wire bonding operation, the wire bonding operation utilizing the crosshair offset values, the ones of the crosshair offset values used in connection with the wire bonding operation varying depending upon the position of the bondable area in which the wire bonding operation is performed.
  • a wire bonding machine includes: (1) a bond head assembly; (2) a bondable area for receiving workpieces to be wire bonded; (3) an offset measurement tool engaged with the bond head assembly during a crosshair offset calibration process; and (4) an optical system for receiving images of a region of the offset measurement tool at a plurality of positions within the XY range of motion of the bond head assembly, the images being configured for use in connection with the crosshair offset calibration process.
  • FIG. 1 is a perspective view of a portion of a wire bonding machine in accordance with an exemplary embodiment of the present invention
  • FIG. 2 is another perspective view of a portion of the wire bonding machine of FIG. 1 in accordance with an exemplary embodiment of the present invention
  • FIG. 3 is a front view of elements of the wire bonding machine of FIG. 1 in accordance with an exemplary embodiment of the present invention
  • FIG. 4 is a perspective view of a transducer of the wire bonding machine of FIG. 1, carrying an offset measurement tool, in accordance with an exemplary embodiment of the present invention
  • FIGS. 5A-5C are a series of block diagrams illustrating a technique of calibrating a crosshair offset in accordance with an exemplary embodiment of the present invention
  • FIG. 6 is a block diagram illustration of a bondable area of a wire bonding machine in accordance with an exemplary embodiment of the present invention
  • FIG. 7 is a flow diagram illustrating a method of calibrating a crosshair offset in connection with a wire bonding operation in accordance with an exemplary embodiment of the present invention.
  • FIG. 8 is a flow diagram illustrating a method of performing a wire bonding operation in accordance with an exemplary embodiment of the present invention.
  • crosshair offset value is intended to refer to the actual offset between the optical path of a wire bonding machine and a bonding tool position (e.g., the centerline of the bonding tool) in the XY plane, at a given position of the bondable area.
  • the crosshair offset value may have x-axis and y-axis components.
  • the crosshair offset value may also refer to the difference between the actual offset at a given position, and a nominal crosshair offset for the wire bonding machine.
  • Crosshair offset (e.g., the distance between the bonding tool and the optical path) has been discovered to vary as a function of XY table position. For example, such variation may be caused by mechanical influences (e.g., bearings, the linkage carrying the transducer, etc.) of the XY table of the wire bonding machine.
  • This variation in the nominal crosshair offset is an error that undesirably affects the accuracy of wire bond placement (e.g., first bond placement in a wire loop, second bond placement in a wire loop, the bond placement of a stud bump, etc.).
  • a method of mapping the crosshair offset error is provided using an offset measurement tool mounted in the transducer capillary hole.
  • the measurement tool may include a fiducial target positioned in the field of view of the optical path.
  • the target in the field of view allows the optical system to directly measure the crosshair offset variation.
  • the bond head of the wire bonding machine carried by the XY table
  • These crosshair offset change measurements may be used to map the crosshair offset error over the full XY table travel (where the XY table travel can correspond to the respective positions of the bondable area of the wire bonding machine).
  • the stored data can be used to correct 1 st and 2 nd bond positions via software to compensate for the crosshair offset error at given positions. Accordingly, improved accuracy for fine pitch wire bonding applications is provided.
  • the present invention determines the crosshair offset (or crosshair offset error) at a plurality of locations so that the accuracy can be improved across the bondable area of the wire bonder machine. Certain techniques of the present invention capture the crosshair offset error and automatically corrects for the error via software, thereby yielding machine accuracy improvements over the past practices.
  • FIG. 1 is a perspective view of a portion of wire bonding machine 100 including bond head assembly 104 carried on y-axis slide mechanism 102. Also carried by Y slide mechanism 102 is optical assembly 106.
  • FIG. 2 illustrates transducer 108 carried by bond head assembly 104.
  • a wire bonding tool e.g ., a capilary tool
  • offset measurement tool 110 is engaged in hole 108a of transducer 108.
  • Offset measurement tool 110 includes engagement portion 110a (which is engaged in hole 108a), transition portion 110b, and fiducial marking 110c.
  • Transition portion 110b carries fiducial marking 110c into a field of view of optical assembly 106 (i.e., the optical path of optical assembly 106).
  • fiducial marking 110c is below imaging end 106a (e.g., the optics objective lens 106a) of optical assembly 106.
  • fiducial marking 110c of offset measurement tool 110 is desirably positioned at a focal plane of the optical assembly 106.
  • Fiducial marking 110c can be learned by the wire bonding machine (similar to a teaching process done by the optical system), and then learned fiducial marking 110c can be located (and its XY position measured) at a plurality of locations during the crosshair offset calibration.
  • FIG. 3 also illustrates the x-axis offset between the bonding tool location (occupied by engagement portion 110a) and optical path 106b of optical assembly 106. Of course, it is understood that there may be a y-axis component of the offset.
  • FIG. 4 is a detailed perspective view of transducer 108 defining hole
  • fiducial marking 110c carried by transition region 110b.
  • an illuminated "crosshair” or the like of optical system 106 may be measured with respect to fiducial marking 110c at different positions to determine crosshair offset values, where the offset between fiducial marking 110 and the centerline of a bonding tool position engaged with a transducer hole 108a is known.
  • a nominal offset Prior to calibrating the crosshair offset values for a wire bonding operation, a nominal offset may be determined.
  • the nominal offset may be measured at an initial position using optical system 106, or the nominal offset may be determined using design data or the like.
  • the nominal offset may be labelled as "0 N " and may include x-axis and y-axis components, that is, (X N , Y N ).
  • An exemplary nominal offset 0 N including x-axis and y-axis components may be labelled as (10 mm, 0 mm). That is, the nominal offset is 10 mm along the x-axis, and zero along the y-axis.
  • FIGS. 5A-5C are a series of block diagrams illustrating an exemplary technique of calibrating/mapping the crosshair offset.
  • FIGS. 5A-5C illustrate a top view of transducer 504, offset measurement tool 510, optical path 506b, and illuminated crosshair 506c of the optical system.
  • a crosshair offset value (XA, YA) is determined to be ( 10.02 mm, 0.01 mm). That is, in FIG.
  • a crosshair offset value (X c , Yc) is determined to be (0.98 mm, -0.01 mm).
  • This process of moving the bond head to different locations is continued for a desired number of positions (e.., between 100-1000 points over the XY bondabie area), and the measured crosshair offset values (which may or may not be stored as the measured offset errors as compared to a nominal value) are stored in memory accessible to the wire bonding machine (e.g., in the computer memory of the wire bonding machine).
  • Table 1 below is an example of the data listing that may be stored in memory. It is understood that in connection with the crosshair offset calibration (and the subsequent use of the data in the formation of wire bonds) the data may be measured/ stored as the x-axis and y-axis crosshair offset at each position (as shown in the second and third columns in Table 1), or the data may be measured/stored as the x-axis and y-axis offset error with respect to the nominal offset values (as shown in the third and fourth columns).
  • FIG. 6 is an exemplary map of a bondable area of a wire bonding machine.
  • the first position of the bondable area (PI) corresponds to a first location of the bondhead. That is, the bond head is at a location which corresponds to the bonding tool position being at position "P.”
  • PI is at the upper left corner of the bondable area, but it is understood that PI (i .e., the first point where the crosshair offset, or the crosshair offset error, is measured) may be at any point in the bondable area. For example, PI may be at the center of the bondable area.
  • the crosshair offset is measured and stored in an accessible memory.
  • the bond head moves to a second point corresponding to point P2 of the bondable area to measure and store the crosshair offset (or crosshair offset error).
  • This process continues for a predetermined number of positions of the bond head corresponding to the desired number of positions of the bondable area to be mapped .
  • there are 880 positions in the bondable area i .e., positions PI through P880
  • the data is stored in accessible memory (e.g., in the form of 880 crosshair offset values, in the form of 880 crosshair offset error values, etc.)
  • a wire bonding operation can be performed using the data.
  • the crosshair offset value corresponding to the wire bonding position may be used to adjust the positioning of the bond head (and hence the bonding tool) to form more accurate wire bonds (e.g., first bonds of a wire loops, second bonds of a wire loop, conductive bumps with a single bond, etc.). Further, this inventive technique may be used in connection with other compensation factors (e.g., temperature) to adjust the bond head position.
  • the position of the bondable area where a wire bond is to be formed using a bonding tool may not exactly coincide with one of the points P1-P880 of the bondable area for which crosshair offset values have been determined.
  • the closest point of P1-P880 may be used.
  • the average crosshair offset value of the closest four (or three, five, or any number) of points P1-P880 may be used.
  • crosshair offset values may be averaged (or computed in connection with an algorithm or extrapolation process or the like) to approximate the desired crosshair offset value for point x.
  • a nominal crosshair offset value may be determined as described above in connection with FIGS. 5A-5C (e.g., through an initial measurement or through design data or the like).
  • the error at the positions of the bondable area may be determined.
  • it is not necessary to determine a nominal crosshair offset value For example, it is possible to simply measure the crosshair offset corresponding to each of the positions of the bondable area (i.e., P1-P880) and to use the offset values in the adjustment of the bond head during formation of a wire bond.
  • FIGS. 7-8 are flow diagrams in accordance with certain exemplary embodiments of the present invention. As is understood by those skilled in the art, certain steps included in the flow diagrams may be omitted; certain additional steps may be added; and the order of the steps may be altered from the order illustrated.
  • FIG. 7 is a flow diagram illustrating a method of calibrating a crosshair offset in connection with a wire bonding operation in accordance with an exemplary embodiment of the present invention.
  • an offset measurement tool e.g., tool 110
  • an optical system e.g., system 106 of the wire bonding machine is used to locate a region of the offset measurement tool (e.g., fiducial marking 110c) to determine a crosshair offset value, the crosshair offset value corresponding to a position of a bondable area of the wire bonding machine.
  • step 704 the bond head is moved to a plurality of locations and step 702 is repeated at each of the locations, thereby using the optical system to determine a plurality of crosshair offset values corresponding to different positions (e.g., position P1-P880 of FIG. 6) of the bondable area.
  • step 706 the plurality of crosshair offset values corresponding to the plurality of positions are stored into memory accessible by the wire bonding machine.
  • FIG. 8 is a flow diagram illustrating a method of performing a wire bonding operation in accordance with an exemplary embodiment of the present invention.
  • a crosshair offset calibration process is performed for a plurality of positions of a bondable area of a wire bonding machine, thereby determining a plurality of crosshair offset values, each of the crosshair offset values corresponding to a respective one of the positions of the bondable area.
  • the process described in connection with FIG. 7 (or other techniques disclosed in the present application) may be used for step 800.
  • a wire bonding operation is performed, the wire bonding operation utilizing the crosshair offset values determined in step 800.
  • the crosshair offset values used in connection with the wire bonding operation vary depending upon the position of the bondable area in which the wire bonding operation is performed.
  • the present invention has been described primarily in connection with the use of an offset measurement tool to perform the crosshair offset calibration process; however, it is not limited thereto.
  • the crosshair offset calibration process may be accomplished with a standard bonding tool engaged in the transducer, where the offset is measured with the optical system via identification of the XY location of an imprint made on the bondable area with the bonding tool.
  • crosshair offset values is used herein, it is not intended to be limited to the use of a "crosshair.”
  • many conventional wire bonding machines, and illuminated crosshair or the like (such as 506c shown in FIG. 5A) is provided by the optical system, and as such, the term crosshair has meaning in the art.
  • the inventive techniques disclosed herein may be accomplished without use of such a crosshair, where the optical system uses another technique to measure the offset.
  • this crosshair offset is termed camera offset, which is within the scope of the definition of the crosshair offset defined herein.
  • the term “crosshair” is not intended to be limited to optical systems using an illuminated crosshair.

Abstract

A method of calibrating a crosshair offset in connection with a wire bonding operation is provided. The method includes: (1) determining a first crosshair offset value for a first position of a bondable area of a wire bonding machine using an optical system of the wire bonding machine; and (2) repeating step (1) for a plurality of positions of the bondable area such that a plurality of crosshair offset values are determined, each of the plurality of the crosshair offset values corresponding to one of the plurality of positions of the bondable area.

Description

WIRE BONDING MACHINE, AND METHOD OF CALIBRATING A CROSSHAIR OFFSET FOR A WIRE BONDING OPERATION
FIELD OF THE INVENTION
[0001] The present invention relates to wire bonding machines, and more particularly, to improved methods of calibrating a crosshair offset for a wire bonding operation.
BACKGROUND OF THE INVENTION
[0002] In the processing and packaging of semiconductor devices, wire bonding continues to be the primary method of providing electrical interconnection between two locations within a package (e.g., between a die pad of a semiconductor die and a lead of a leadframe). More specifically, using a wire bonder (also known as a wire bonding machine) wire loops (and/or conductive bumps) are formed between respective locations to be electrically interconnected. Certain wire bonding machines may be used to form only conductive bumps, where such machines may be referred to as bumping machines, stud bumpers, or the like. Wire bonds (e.g., as part of a wire loop or a conductive bump, etc) are formed using a bonding tool such as a capillary tool or a wedge bonding tool.
[0003] Wire bonding machines typically include an optical system (also known as a vision system) for imaging operations. For example, prior to the wire bonding operation, the optical system may be used to teach the bonding locations (e.g., the die pad locations of a semiconductor die, the lead locations of a leadframe, etc.) to the wire bonding machine. The optical system may also be used during the wire bonding operation, for example, to ensure that the wire bonds are being formed at the proper locations. Exemplary elements of the optical system includes cameras or the like.
[0004] As the wire bonds are formed using a bonding tool, it would be desirable to use the optical system to determine the location of the bonding tool during the wire bonding operation; however, the imaging lens of the optical system is typically positioned above the bondable area of the wire bonding machine. Thus, the optical system can not look at a workpiece directly below the bonding tool because that portion of the workpiece is visibly blocked by the bonding tool (and transducer which hold the bonding tool). Thus, in order to accurately use an optical system to determine the position of the bonding tool (e.g., the position of the bonding tool with respect to the bondable area of the wire bonding machine) a crosshair offset is used. That is, it is known that there is distance between the viewing area of the optical system (i.e., the optical path) and the bonding tool. This distance (typically viewed as a distance in the XY plane and may have X and Y axis components) is measured, and is used to adjust the position of the bond head during wire bonding operations.
[0005] Unfortunately, crosshair offset values may be inaccurate in certain applications, and it would be desirable to provide improved methods of calibrating a crosshair offset on a wire bonding machine.
SUMMARY OF THE INVENTION
[0006] According to an exemplary embodiment of the present invention, a method of calibrating a crosshair offset in connection with a wire bonding operation is provided. The method includes: (1) determining a first crosshair offset value for a first position of a bondable area of a wire bonding machine using an optical system of the wire bonding machine; and (2) repeating step (1) for a plurality of positions of the bondable area such that a plurality of crosshair offset values are determined, each of the plurality of the crosshair offset values corresponding to one of the plurality of positions of the bondable area.
[0007] According to another exemplary embodiment of the present invention, a method of calibrating a crosshair offset in connection with a wire bonding operation is provided. The method includes: (1) providing an offset measurement tool carried by a bond head of a wire bonding machine; (2) using an optical system of the wire bonding machine to view a region of the offset measurement tool to determine a crosshair offset value, the crosshair offset value corresponding to a position of a bondable area of the wire bonding machine; (3) moving the bond head to a plurality of locations and repeating step (2) at each of the locations, thereby using the optical system to determine a plurality of crosshair offset values corresponding to different positions of the bondable area; and (4) storing the plurality of crosshair offset values corresponding to the plurality of positions into memory accessible by the wire bonding machine.
[0008] According to another exemplary embodiment of the present invention, a method of performing a wire bonding operation is provided. The method includes: (1) performing a crosshair offset calibration process at a plurality of positions of a bondable area of a wire bonding machine, thereby determining a plurality of crosshair offset values, each of the crosshair offset values corresponding to a respective one of the positions of the bondable area; and (2) performing a wire bonding operation, the wire bonding operation utilizing the crosshair offset values, the ones of the crosshair offset values used in connection with the wire bonding operation varying depending upon the position of the bondable area in which the wire bonding operation is performed.
[0009] According to another exemplary embodiment of the present invention, a wire bonding machine is provided. The wire bonding machine includes: (1) a bond head assembly; (2) a bondable area for receiving workpieces to be wire bonded; (3) an offset measurement tool engaged with the bond head assembly during a crosshair offset calibration process; and (4) an optical system for receiving images of a region of the offset measurement tool at a plurality of positions within the XY range of motion of the bond head assembly, the images being configured for use in connection with the crosshair offset calibration process.
BRIEF DESCRIPTION OF THE DRAWINGS
[0010] The invention is best understood from the following detailed description when read in connection with the accompanying drawing. It is emphasized that, according to common practice, the various features of the drawing are not to scale. On the contrary, the dimensions of the various features are arbitrarily expanded or reduced for clarity. Included in the drawing are the following figures:
FIG. 1 is a perspective view of a portion of a wire bonding machine in accordance with an exemplary embodiment of the present invention;
FIG. 2 is another perspective view of a portion of the wire bonding machine of FIG. 1 in accordance with an exemplary embodiment of the present invention;
FIG. 3 is a front view of elements of the wire bonding machine of FIG. 1 in accordance with an exemplary embodiment of the present invention;
FIG. 4 is a perspective view of a transducer of the wire bonding machine of FIG. 1, carrying an offset measurement tool, in accordance with an exemplary embodiment of the present invention;
FIGS. 5A-5C are a series of block diagrams illustrating a technique of calibrating a crosshair offset in accordance with an exemplary embodiment of the present invention;
FIG. 6 is a block diagram illustration of a bondable area of a wire bonding machine in accordance with an exemplary embodiment of the present invention; FIG. 7 is a flow diagram illustrating a method of calibrating a crosshair offset in connection with a wire bonding operation in accordance with an exemplary embodiment of the present invention; and
FIG. 8 is a flow diagram illustrating a method of performing a wire bonding operation in accordance with an exemplary embodiment of the present invention.
DETAILED DESCRIPTION OF THE INVENTION
[0011] As used herein, the term "crosshair offset value" is intended to refer to the actual offset between the optical path of a wire bonding machine and a bonding tool position (e.g., the centerline of the bonding tool) in the XY plane, at a given position of the bondable area. Thus, the crosshair offset value may have x-axis and y-axis components. However, the crosshair offset value may also refer to the difference between the actual offset at a given position, and a nominal crosshair offset for the wire bonding machine.
[0012] Crosshair offset (e.g., the distance between the bonding tool and the optical path) has been discovered to vary as a function of XY table position. For example, such variation may be caused by mechanical influences (e.g., bearings, the linkage carrying the transducer, etc.) of the XY table of the wire bonding machine. This variation in the nominal crosshair offset is an error that undesirably affects the accuracy of wire bond placement (e.g., first bond placement in a wire loop, second bond placement in a wire loop, the bond placement of a stud bump, etc.).
[0013] In accordance with certain exemplary embodiments of the present invention, a method of mapping the crosshair offset error is provided using an offset measurement tool mounted in the transducer capillary hole. Such a offset
measurement tool may include a fiducial target positioned in the field of view of the optical path. The target in the field of view allows the optical system to directly measure the crosshair offset variation. With the tool in place, the bond head of the wire bonding machine (carried by the XY table) is moved to specific positions such that the change in crosshair offset is measured and stored. These crosshair offset change measurements may be used to map the crosshair offset error over the full XY table travel (where the XY table travel can correspond to the respective positions of the bondable area of the wire bonding machine). Once the "map" is captured, the stored data can be used to correct 1st and 2nd bond positions via software to compensate for the crosshair offset error at given positions. Accordingly, improved accuracy for fine pitch wire bonding applications is provided.
[0014] In contrast to conventional techniques (which correct for crosshair offset variation due to temperature at a single XY position, and therefore does not capture the error as a function of XY position), the present invention determines the crosshair offset (or crosshair offset error) at a plurality of locations so that the accuracy can be improved across the bondable area of the wire bonder machine. Certain techniques of the present invention capture the crosshair offset error and automatically corrects for the error via software, thereby yielding machine accuracy improvements over the past practices.
[0015] FIG. 1 is a perspective view of a portion of wire bonding machine 100 including bond head assembly 104 carried on y-axis slide mechanism 102. Also carried by Y slide mechanism 102 is optical assembly 106. FIG. 2 illustrates transducer 108 carried by bond head assembly 104. Typically a wire bonding tool (e.g ., a capilary tool) is engaged in hole 108a in transducer 108 for forming wire bonds; however, in FIG. 2 offset measurement tool 110 is engaged in hole 108a of transducer 108. Offset measurement tool 110 includes engagement portion 110a (which is engaged in hole 108a), transition portion 110b, and fiducial marking 110c. Transition portion 110b carries fiducial marking 110c into a field of view of optical assembly 106 (i.e., the optical path of optical assembly 106). As shown in FIG. 3, fiducial marking 110c is below imaging end 106a (e.g., the optics objective lens 106a) of optical assembly 106. During the crosshair offset calibration, fiducial marking 110c of offset measurement tool 110 is desirably positioned at a focal plane of the optical assembly 106. Fiducial marking 110c can be learned by the wire bonding machine (similar to a teaching process done by the optical system), and then learned fiducial marking 110c can be located (and its XY position measured) at a plurality of locations during the crosshair offset calibration. FIG. 3 also illustrates the x-axis offset between the bonding tool location (occupied by engagement portion 110a) and optical path 106b of optical assembly 106. Of course, it is understood that there may be a y-axis component of the offset.
[0016] FIG. 4 is a detailed perspective view of transducer 108 defining hole
108a, where hole 108a receives engagement portion 110a of offset measurement tool 110. Screw/bolt 108b is used to tightly secure engagement portion 110a in hole 108a. Also detailed is fiducial marking 110c carried by transition region 110b. As will be understood by those skilled in the art, an illuminated "crosshair" or the like of optical system 106 may be measured with respect to fiducial marking 110c at different positions to determine crosshair offset values, where the offset between fiducial marking 110 and the centerline of a bonding tool position engaged with a transducer hole 108a is known.
[0017] Prior to calibrating the crosshair offset values for a wire bonding operation, a nominal offset may be determined. For example, the nominal offset may be measured at an initial position using optical system 106, or the nominal offset may be determined using design data or the like. In any event, the nominal offset may be labelled as "0N" and may include x-axis and y-axis components, that is, (XN, YN). An exemplary nominal offset 0N including x-axis and y-axis components may be labelled as (10 mm, 0 mm). That is, the nominal offset is 10 mm along the x-axis, and zero along the y-axis. FIGS. 5A-5C are a series of block diagrams illustrating an exemplary technique of calibrating/mapping the crosshair offset. FIGS. 5A-5C illustrate a top view of transducer 504, offset measurement tool 510, optical path 506b, and illuminated crosshair 506c of the optical system. At FIG. 5A, with the bond head at a location corresponding to position "A" of the bondabie area of the wire bonding machine (where position "A" is the bonding tool position on bondabie area 500), a crosshair offset value (XA, YA) is determined to be ( 10.02 mm, 0.01 mm). That is, in FIG. 5A, assume that illuminated crosshair 506c is directly in line with fiducial marking 110c, then the x-axis offset from crosshair 506c and position "A" is 10.02 mm. Of course, if illuminated crosshair 506c is not in line with fiducial marking 110c, then that offset can be considered in the determination of the crosshair offset between crosshair 506c and location A. Then, at FIG. 5B, with the bond head having been moved to a location corresponding to position "B" of the bondabie area of the wire bonding machine, a crosshair offset value (XB, YB) is determined to be (10.01 mm, 0.03 mm). Then, at FIG. 5C, with the bond head having been moved to a location corresponding to position "C" of the bondabie area of the wire bonding machine, a crosshair offset value (Xc, Yc) is determined to be (0.98 mm, -0.01 mm). This process of moving the bond head to different locations (e.g., according to a predetermined order/alogorithm) is continued for a desired number of positions (e.., between 100-1000 points over the XY bondabie area), and the measured crosshair offset values (which may or may not be stored as the measured offset errors as compared to a nominal value) are stored in memory accessible to the wire bonding machine (e.g., in the computer memory of the wire bonding machine). Table 1 below is an example of the data listing that may be stored in memory. It is understood that in connection with the crosshair offset calibration (and the subsequent use of the data in the formation of wire bonds) the data may be measured/ stored as the x-axis and y-axis crosshair offset at each position (as shown in the second and third columns in Table 1), or the data may be measured/stored as the x-axis and y-axis offset error with respect to the nominal offset values (as shown in the third and fourth columns).
Figure imgf000009_0001
[0018] FIG. 6 is an exemplary map of a bondable area of a wire bonding machine. In this example of FIG. 6, the first position of the bondable area (PI) corresponds to a first location of the bondhead. That is, the bond head is at a location which corresponds to the bonding tool position being at position "P." PI is at the upper left corner of the bondable area, but it is understood that PI (i .e., the first point where the crosshair offset, or the crosshair offset error, is measured) may be at any point in the bondable area. For example, PI may be at the center of the bondable area. In any event, at the position of the bond head corresponding to point PI of the bondable area, the crosshair offset is measured and stored in an accessible memory. Then, the bond head moves to a second point corresponding to point P2 of the bondable area to measure and store the crosshair offset (or crosshair offset error). This process continues for a predetermined number of positions of the bond head corresponding to the desired number of positions of the bondable area to be mapped . In FIG. 6, there are 880 positions in the bondable area (i .e., positions PI through P880) . After this process is complete for all 880 positions, and the data is stored in accessible memory (e.g., in the form of 880 crosshair offset values, in the form of 880 crosshair offset error values, etc.), a wire bonding operation can be performed using the data. Thus, when it is desired to form a wire bond at a given position of the bondable area, the crosshair offset value corresponding to the wire bonding position (or the crosshair offset error value corresponding to the wire bonding positon) may be used to adjust the positioning of the bond head (and hence the bonding tool) to form more accurate wire bonds (e.g., first bonds of a wire loops, second bonds of a wire loop, conductive bumps with a single bond, etc.). Further, this inventive technique may be used in connection with other compensation factors (e.g., temperature) to adjust the bond head position. Of course, it is understood by those skilled in the art that the position of the bondable area where a wire bond is to be formed using a bonding tool may not exactly coincide with one of the points P1-P880 of the bondable area for which crosshair offset values have been determined. In such a case, the closest point of P1-P880 may be used. Alternatively, the average crosshair offset value of the closest four (or three, five, or any number) of points P1-P880 may be used.
[0019] For example, referring again to FIG. 6, suppose that it is desired to form a wire bond at point "x" which is located between points P158, P159, P162, and P163. The crosshair offset values (or corresponding error values) may be averaged (or computed in connection with an algorithm or extrapolation process or the like) to approximate the desired crosshair offset value for point x.
[0020] In the calibration of the crosshair offset (and/or the mapping of the crosshair offset values), a nominal crosshair offset value may be determined as described above in connection with FIGS. 5A-5C (e.g., through an initial measurement or through design data or the like). Thus, by determining a nominal crosshair value, the error at the positions of the bondable area may be determined. Conversely, it is not necessary to determine a nominal crosshair offset value. For example, it is possible to simply measure the crosshair offset corresponding to each of the positions of the bondable area (i.e., P1-P880) and to use the offset values in the adjustment of the bond head during formation of a wire bond.
[0021] FIGS. 7-8 are flow diagrams in accordance with certain exemplary embodiments of the present invention. As is understood by those skilled in the art, certain steps included in the flow diagrams may be omitted; certain additional steps may be added; and the order of the steps may be altered from the order illustrated.
[0022] FIG. 7 is a flow diagram illustrating a method of calibrating a crosshair offset in connection with a wire bonding operation in accordance with an exemplary embodiment of the present invention. At step 700, an offset measurement tool (e.g., tool 110) carried by a bond head of a wire bonding machine is provided. At step 702, an optical system (e.g., system 106) of the wire bonding machine is used to locate a region of the offset measurement tool (e.g., fiducial marking 110c) to determine a crosshair offset value, the crosshair offset value corresponding to a position of a bondable area of the wire bonding machine. At step 704, the bond head is moved to a plurality of locations and step 702 is repeated at each of the locations, thereby using the optical system to determine a plurality of crosshair offset values corresponding to different positions (e.g., position P1-P880 of FIG. 6) of the bondable area. At step 706, the plurality of crosshair offset values corresponding to the plurality of positions are stored into memory accessible by the wire bonding machine.
[0023] FIG. 8 is a flow diagram illustrating a method of performing a wire bonding operation in accordance with an exemplary embodiment of the present invention. At step 800, a crosshair offset calibration process is performed for a plurality of positions of a bondable area of a wire bonding machine, thereby determining a plurality of crosshair offset values, each of the crosshair offset values corresponding to a respective one of the positions of the bondable area. For example, the process described in connection with FIG. 7 (or other techniques disclosed in the present application) may be used for step 800. At step 802, a wire bonding operation is performed, the wire bonding operation utilizing the crosshair offset values determined in step 800. The crosshair offset values used in connection with the wire bonding operation vary depending upon the position of the bondable area in which the wire bonding operation is performed.
[0024] The present invention has been described primarily in connection with the use of an offset measurement tool to perform the crosshair offset calibration process; however, it is not limited thereto. For example, the crosshair offset calibration process may be accomplished with a standard bonding tool engaged in the transducer, where the offset is measured with the optical system via identification of the XY location of an imprint made on the bondable area with the bonding tool.
[0025] Although the term "crosshair" offset values is used herein, it is not intended to be limited to the use of a "crosshair." In many conventional wire bonding machines, and illuminated crosshair or the like (such as 506c shown in FIG. 5A) is provided by the optical system, and as such, the term crosshair has meaning in the art. However, the inventive techniques disclosed herein may be accomplished without use of such a crosshair, where the optical system uses another technique to measure the offset. For example, sometimes this crosshair offset is termed camera offset, which is within the scope of the definition of the crosshair offset defined herein. Thus, the term "crosshair" is not intended to be limited to optical systems using an illuminated crosshair. [0026] Although the invention is illustrated and described herein with reference to specific embodiments, the invention is not intended to be limited to the details shown. Rather, various modifications may be made in the details within the scope and range of equivalents of the claims and without departing from the invention.

Claims

What is Claimed :
1. A method of calibrating a crosshair offset in connection with a wire bonding operation, the method comprising the steps of:
(1) determining a first crosshair offset value for a first position of a bondable area of a wire bonding machine using an optical system of the wire bonding machine; and
(2) repeating step (1) for a plurality of positions of the bondable area such that a plurality of crosshair offset values are determined, each of the plurality of the crosshair offset values corresponding to one of the plurality of positions of the bondable area.
2. The method of claim 1 further comprising a step of (3) storing the plurality of crosshair offset values corresponding to the plurality of positions into memory accessible by the wire bonding machine.
3. The method of claim 1 further comprising the step of engaging an offset measurement tool with a transducer of the wire bonding machine where the offset measurement tool includes a region visible to the optical system of the wire bonding machine, such that step (1) includes locating the region using the optical system at the first position to determine the first crosshair offset value.
4. The method of claim 3 wherein the region includes a fiducial marking on the offset measurement tool in the field of view of the optical system.
5. The method of claim 1 wherein the first crosshair offset value and the plurality of crosshair offset values determined in step (2) are offsets in an XY plane between (1) an optical path of the optical system, and (2) a bonding tool position.
6. The method of claim 5 wherein offsets in the XY plane include an x-axis component and a y-axis component.
7. The method of claim 1 wherein the first crosshair offset value and the plurality of crosshair offset values determined in step (2) represent the error between (a) a nominal crosshair offset value, and (b) a measured crosshair offset value at each of the positions.
8. The method of claim 7 wherein each of the first crosshair offset value and the plurality of crosshair offset values determined in step (2) include an x- axis component and a y-axis component.
9. The method of claim 1 wherein the first crosshair offset value is a nominal crosshair offset value, and the plurality of crosshair offset values determined in step (2) represent the difference between (a) the nominal crosshair offset value, and (b) a measured offset value at each of the positions.
10. The method of claim 9 wherein each of the first crosshair offset value and the plurality of crosshair offset values determined in step (2) include an x- axis component and a y-axis component.
11. A method of calibrating a crosshair offset in connection with a wire bonding operation, the method comprising the steps of:
(1) providing an offset measurement tool carried by a bond head of a wire bonding machine;
(2) using an optical system of the wire bonding machine to locate a region of the offset measurement tool to determine a crosshair offset value, the crosshair offset value corresponding to a position of a bondable area of the wire bonding machine;
(3) moving the bond head to a plurality of locations and repeating step (2) at each of the locations, thereby using the optical system to determine a plurality of crosshair offset values corresponding to different positions of the bondable area; and
(4) storing the plurality of crosshair offset values corresponding to the plurality of positions into memory accessible by the wire bonding machine.
12. The method of claim 11 wherein the region includes a fiducial marking on the offset measurement tool .
13. The method of claim 11 wherein the crosshair offset values are offsets in an XY plane between ( 1) an optical path of the optical system, and (2) a bonding tool position.
14. The method of claim 13 wherein offsets in the XY plane include an x-axis component and a y-axis component.
15. The method of claim 11 wherein the crosshair offset values represent the error between (a) a nomi nal crosshair offset value, and (b) a measu red offset value for each of the positions.
16. The method of claim 15 wherein each of the crosshai r offset values include a x-axis component and a y-axis component.
17. A method of performing a wire bond i ng operation, the method comprising the steps of:
( 1 ) performing a crosshair offset cal i bration process for a plurality of positions of a bondable area of a wire bonding machi ne, thereby determining a plurality of crosshair offset values, each of the crosshair offset values corresponding to a respective one of the positions of the bondable area ; a nd
(2) performing a wi re bondi ng operation, the wi re bond i ng operation utilizing the crosshai r offset values, the ones of the crosshair offset values used i n connection with the wire bonding operation varying depending upon the position of the bondable area in which the wi re bonding operation is performed .
18. The method of claim 17, wherein step ( 1) includes :
(a) determi ning a first crosshair offset value for a first position of the bondable area of the wire bonding machine using an optical system of the wire bonding machine; and
(b) repeating step ( 1) for a plurality of positions of the bondable area such that a plurality of crosshair offset values are determined .
19. The method of claim 18 wherein step ( 1 ) further comprises a step of (c) storing the plu rality of crosshai r offset values correspond i ng to the plurality of positions into accessible memory.
20. The method of claim 18 wherein the fi rst crosshair offset value and the plurality of offset values determined in step (b) are offsets i n an XY pla ne between ( 1 ) an optical path of the optical system, and (2) a bonding tool position .
21. The method of claim 20 wherein offsets in the XY plane i nclude an x-axis component and a y-axis component.
22. The method of claim 18 wherein the first crosshair offset value and the plurality of crosshair offset values determined in step (b) represent the error between (a) a nominal crosshair offset value, and (b) a measured crosshair offset value at each of the positions.
23. The method of claim 22 wherein each of the first crosshair offset value and the plurality of crosshair offset values determined in step (b) include an x- axis component and a y-axis component.
24. The method of claim 18 wherein the first crosshair offset value is a nominal crosshair offset value, and the plurality of crosshair offset values determined in step (b) represent the difference between (a) the nominal crosshair offset value, and (b) a measured crosshair offset value at each of the positions.
25. The method of claim 24 wherein each of the first crosshair offset value and the plurality of crosshair offset values determined in step (b) include an x- axis component and a y-axis component.
26. The method of claim 18 further comprising the step of engaging an offset measurement tool with a transducer of the wire bonding machine where the offset measurement tool includes a region visible to the optical system of the wire bonding machine, such that step (a) includes locating the region using the optical system at the first position to determine the first crosshair offset value.
27. The method of claim 26 wherein the region includes a fiducial marking on the offset measurement tool.
28. A wire bonding machine comprising : a bond head assembly; a bondable area for receiving workpieces to be wire bonded; an offset measurement tool engaged with the bond head assembly during a crosshair offset calibration process; and an optical system for receiving images of a region of the offset measurement tool at a plurality of locations within the XY range of motion of the bond head assembly, the images being configured for use in connection with the crosshair offset calibration process.
29. The wire bond ing machine of clai m 28 wherein the offset measurement tool is engaged with a transducer of the bond head assembly during the crosshair offset calibration process.
30. The wi re bond i ng machine of clai m 29 wherei n the offset measurement tool includes an engagement portion with is engaged with a bonding tool aperture of the transducer.
31. The wire bonding machine of claim 29 where the region of the offset measu rement tool is offset from the transducer such that it extends into a field of view of an i maging portion of the optical system during the crosshair offset calibration process.
32. The wire bonding machine of clai m 28 further comprisi ng a computer for ( 1) receiving the images of the region of the offset measurement tool, and for (2) determining crosshair offset values corresponding to each of a plurality of positions of the bondable a rea .
33. The wi re bonding machine of claim 32 wherein the reg ion of the offset measu rement tool includes a fiducial marking for imaging by the optical system .
PCT/US2009/060869 2009-10-15 2009-10-15 Wire bonding machine, and method of calibrating a crosshair offset for a wire bonding operation WO2011046557A1 (en)

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Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2000021923A (en) * 1998-07-03 2000-01-21 Shinkawa Ltd Bonding method and device thereof
US20010011669A1 (en) * 2000-01-21 2001-08-09 Kabushiki Kaisha Shinkawa Bonding apparatus and bonding method
US20010016062A1 (en) * 1999-12-28 2001-08-23 Kabushiki Kaisha Shinkawa Bonding apparatus and bonding method
JP2005353901A (en) * 2004-06-11 2005-12-22 Ultrasonic Engineering Co Ltd Wire bonding device
KR20090053142A (en) * 2007-11-22 2009-05-27 삼성테크윈 주식회사 Method for compensating bondong position in wire bonding automatically

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2000021923A (en) * 1998-07-03 2000-01-21 Shinkawa Ltd Bonding method and device thereof
US20010016062A1 (en) * 1999-12-28 2001-08-23 Kabushiki Kaisha Shinkawa Bonding apparatus and bonding method
US20010011669A1 (en) * 2000-01-21 2001-08-09 Kabushiki Kaisha Shinkawa Bonding apparatus and bonding method
JP2005353901A (en) * 2004-06-11 2005-12-22 Ultrasonic Engineering Co Ltd Wire bonding device
KR20090053142A (en) * 2007-11-22 2009-05-27 삼성테크윈 주식회사 Method for compensating bondong position in wire bonding automatically

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