WO2011038988A3 - Method for producing a cooling plate and device produced by said method - Google Patents

Method for producing a cooling plate and device produced by said method Download PDF

Info

Publication number
WO2011038988A3
WO2011038988A3 PCT/EP2010/062030 EP2010062030W WO2011038988A3 WO 2011038988 A3 WO2011038988 A3 WO 2011038988A3 EP 2010062030 W EP2010062030 W EP 2010062030W WO 2011038988 A3 WO2011038988 A3 WO 2011038988A3
Authority
WO
WIPO (PCT)
Prior art keywords
plates
recesses
plate
producing
device produced
Prior art date
Application number
PCT/EP2010/062030
Other languages
German (de)
French (fr)
Other versions
WO2011038988A2 (en
Inventor
Norbert Huber
Karsten Rechenberg
Original Assignee
Siemens Aktiengesellschaft
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Siemens Aktiengesellschaft filed Critical Siemens Aktiengesellschaft
Priority to EP10745222A priority Critical patent/EP2486359A2/en
Publication of WO2011038988A2 publication Critical patent/WO2011038988A2/en
Publication of WO2011038988A3 publication Critical patent/WO2011038988A3/en

Links

Classifications

    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28—HEAT EXCHANGE IN GENERAL
    • F28F—DETAILS OF HEAT-EXCHANGE AND HEAT-TRANSFER APPARATUS, OF GENERAL APPLICATION
    • F28F3/00—Plate-like or laminated elements; Assemblies of plate-like or laminated elements
    • F28F3/08—Elements constructed for building-up into stacks, e.g. capable of being taken apart for cleaning
    • F28F3/086—Elements constructed for building-up into stacks, e.g. capable of being taken apart for cleaning having one or more openings therein forming tubular heat-exchange passages
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/20—Modifications to facilitate cooling, ventilating, or heating
    • H05K7/20218—Modifications to facilitate cooling, ventilating, or heating using a liquid coolant without phase change in electronic enclosures
    • H05K7/20254—Cold plates transferring heat from heat source to coolant
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28—HEAT EXCHANGE IN GENERAL
    • F28F—DETAILS OF HEAT-EXCHANGE AND HEAT-TRANSFER APPARATUS, OF GENERAL APPLICATION
    • F28F2275/00—Fastening; Joining
    • F28F2275/02—Fastening; Joining by using bonding materials; by embedding elements in particular materials
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28—HEAT EXCHANGE IN GENERAL
    • F28F—DETAILS OF HEAT-EXCHANGE AND HEAT-TRANSFER APPARATUS, OF GENERAL APPLICATION
    • F28F2275/00—Fastening; Joining
    • F28F2275/02—Fastening; Joining by using bonding materials; by embedding elements in particular materials
    • F28F2275/025—Fastening; Joining by using bonding materials; by embedding elements in particular materials by using adhesives
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28—HEAT EXCHANGE IN GENERAL
    • F28F—DETAILS OF HEAT-EXCHANGE AND HEAT-TRANSFER APPARATUS, OF GENERAL APPLICATION
    • F28F2275/00—Fastening; Joining
    • F28F2275/06—Fastening; Joining by welding
    • F28F2275/061—Fastening; Joining by welding by diffusion bonding

Abstract

The invention relates to a method for producing a cooling plate and to a device produced by said method, wherein the method comprises the following steps: providing at least one first and at least one second plate (10, 10') each having recesses (13) and arranging the at least two plates (10, 10') over one another such that the recesses (13) of the at least one first plate (10) overlap with recesses (13) of the at least one second plate (10') and are structured by continuous cooling channels along a longitudinal direction (30) in a plane of the plates (10, 10'). According to the invention, a material for mechanically stable joining of the plates (10, 10') is inserted between the at least two plates (10, 10') substantially does not penetrate into the recesses (13) of the plates (10, 10') upon temporally stable joining.
PCT/EP2010/062030 2009-09-29 2010-08-18 Method for producing a cooling plate and device produced by said method WO2011038988A2 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
EP10745222A EP2486359A2 (en) 2009-09-29 2010-08-18 Method for producing a cooling plate and device produced by said method

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
DE102009043636.7 2009-09-29
DE102009043636 2009-09-29

Publications (2)

Publication Number Publication Date
WO2011038988A2 WO2011038988A2 (en) 2011-04-07
WO2011038988A3 true WO2011038988A3 (en) 2011-07-14

Family

ID=43826702

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/EP2010/062030 WO2011038988A2 (en) 2009-09-29 2010-08-18 Method for producing a cooling plate and device produced by said method

Country Status (2)

Country Link
EP (1) EP2486359A2 (en)
WO (1) WO2011038988A2 (en)

Families Citing this family (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE102011079637A1 (en) 2011-07-22 2013-01-24 Siemens Aktiengesellschaft Process for the preparation of a seawater-resistant cooling plate and apparatus produced by this method and their use
DE102011079635A1 (en) * 2011-07-22 2013-01-24 Siemens Aktiengesellschaft Cooling plate and method for its production and use of the cooling plate
DE102011079634A1 (en) * 2011-07-22 2013-01-24 Siemens Aktiengesellschaft Device for cooling and method for its production and use of the device
DE102012217607A1 (en) * 2012-09-27 2014-03-27 Siemens Aktiengesellschaft Device for cooling
US20160282059A1 (en) * 2013-03-18 2016-09-29 Mahle International Gmbh Layered heat transfer device and method for producing a layered heat transfer device
DE102017219873A1 (en) 2017-11-08 2019-05-09 Siemens Aktiengesellschaft Cooling structure and basic body element for this
DE102019205383A1 (en) * 2019-04-15 2020-10-15 Vitesco Technologies Germany Gmbh Cooler for cooling an electronic circuit, power electronic device with a cooler

Citations (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
GB1484124A (en) * 1974-11-21 1977-08-24 Ass Eng Ltd Heat exchangers
US4516632A (en) * 1982-08-31 1985-05-14 The United States Of America As Represented By The United States Deparment Of Energy Microchannel crossflow fluid heat exchanger and method for its fabrication
EP0866500A2 (en) * 1997-03-17 1998-09-23 Curamik Electronics GmbH Cooling apparatus or heat sink for electrical devices or circuits and electrical circuit with such a heat sink
WO1999066280A1 (en) * 1998-06-12 1999-12-23 Chart Heat Exchangers Limited Heat exchanger
EP1555079A2 (en) * 2004-01-12 2005-07-20 Jürgen Dr.-Ing. Schulz-Harder Process for manufacturing cooling elements made of plate piling, with soldering material on the inner surfaces of passages or openings of the plates
DE102005007707A1 (en) * 2004-09-27 2006-03-30 Powerfluid Gmbh Recuperator, microchannel recuperator, foil, use of a film and method for producing and operating a recuperator
US7075959B1 (en) * 2003-11-14 2006-07-11 Hamilton Sundstrand Corporation Cooling device for diode pumped laser
FR2889469A1 (en) * 2005-08-02 2007-02-09 United Technologies Corp LIAISON WITH PROVISIONAL LIQUID PHASE OF DISSOLVABLE METALS
US20090071257A1 (en) * 2007-09-14 2009-03-19 Neagle Paul W Pressure vessel testing

Patent Citations (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
GB1484124A (en) * 1974-11-21 1977-08-24 Ass Eng Ltd Heat exchangers
US4516632A (en) * 1982-08-31 1985-05-14 The United States Of America As Represented By The United States Deparment Of Energy Microchannel crossflow fluid heat exchanger and method for its fabrication
EP0866500A2 (en) * 1997-03-17 1998-09-23 Curamik Electronics GmbH Cooling apparatus or heat sink for electrical devices or circuits and electrical circuit with such a heat sink
WO1999066280A1 (en) * 1998-06-12 1999-12-23 Chart Heat Exchangers Limited Heat exchanger
US7075959B1 (en) * 2003-11-14 2006-07-11 Hamilton Sundstrand Corporation Cooling device for diode pumped laser
EP1555079A2 (en) * 2004-01-12 2005-07-20 Jürgen Dr.-Ing. Schulz-Harder Process for manufacturing cooling elements made of plate piling, with soldering material on the inner surfaces of passages or openings of the plates
DE102005007707A1 (en) * 2004-09-27 2006-03-30 Powerfluid Gmbh Recuperator, microchannel recuperator, foil, use of a film and method for producing and operating a recuperator
FR2889469A1 (en) * 2005-08-02 2007-02-09 United Technologies Corp LIAISON WITH PROVISIONAL LIQUID PHASE OF DISSOLVABLE METALS
US20090071257A1 (en) * 2007-09-14 2009-03-19 Neagle Paul W Pressure vessel testing

Also Published As

Publication number Publication date
EP2486359A2 (en) 2012-08-15
WO2011038988A2 (en) 2011-04-07

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