WO2011036158A3 - Wafer pretreatment for copper electroplating - Google Patents
Wafer pretreatment for copper electroplating Download PDFInfo
- Publication number
- WO2011036158A3 WO2011036158A3 PCT/EP2010/063929 EP2010063929W WO2011036158A3 WO 2011036158 A3 WO2011036158 A3 WO 2011036158A3 EP 2010063929 W EP2010063929 W EP 2010063929W WO 2011036158 A3 WO2011036158 A3 WO 2011036158A3
- Authority
- WO
- WIPO (PCT)
- Prior art keywords
- copper electroplating
- pretreatment
- wafer pretreatment
- wafer
- trench
- Prior art date
Links
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 title abstract 2
- 229910052802 copper Inorganic materials 0.000 title abstract 2
- 239000010949 copper Substances 0.000 title abstract 2
- 238000009713 electroplating Methods 0.000 title abstract 2
- JPVYNHNXODAKFH-UHFFFAOYSA-N Cu2+ Chemical compound [Cu+2] JPVYNHNXODAKFH-UHFFFAOYSA-N 0.000 abstract 1
- 229910001431 copper ion Inorganic materials 0.000 abstract 1
- 238000000034 method Methods 0.000 abstract 1
Classifications
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D7/00—Electroplating characterised by the article coated
- C25D7/12—Semiconductors
- C25D7/123—Semiconductors first coated with a seed layer or a conductive layer
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D5/00—Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
- H01L21/28—Manufacture of electrodes on semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/268
- H01L21/283—Deposition of conductive or insulating materials for electrodes conducting electric current
- H01L21/288—Deposition of conductive or insulating materials for electrodes conducting electric current from a liquid, e.g. electrolytic deposition
- H01L21/2885—Deposition of conductive or insulating materials for electrodes conducting electric current from a liquid, e.g. electrolytic deposition using an external electrical current, i.e. electro-deposition
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/70—Manufacture or treatment of devices consisting of a plurality of solid state components formed in or on a common substrate or of parts thereof; Manufacture of integrated circuit devices or of parts thereof
- H01L21/71—Manufacture of specific parts of devices defined in group H01L21/70
- H01L21/768—Applying interconnections to be used for carrying current between separate components within a device comprising conductors and dielectrics
- H01L21/76898—Applying interconnections to be used for carrying current between separate components within a device comprising conductors and dielectrics formed through a semiconductor substrate
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D3/00—Electroplating: Baths therefor
- C25D3/02—Electroplating: Baths therefor from solutions
- C25D3/38—Electroplating: Baths therefor from solutions of copper
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/70—Manufacture or treatment of devices consisting of a plurality of solid state components formed in or on a common substrate or of parts thereof; Manufacture of integrated circuit devices or of parts thereof
- H01L21/71—Manufacture of specific parts of devices defined in group H01L21/70
- H01L21/768—Applying interconnections to be used for carrying current between separate components within a device comprising conductors and dielectrics
- H01L21/76838—Applying interconnections to be used for carrying current between separate components within a device comprising conductors and dielectrics characterised by the formation and the after-treatment of the conductors
- H01L21/76877—Filling of holes, grooves or trenches, e.g. vias, with conductive material
Landscapes
- Engineering & Computer Science (AREA)
- Chemical & Material Sciences (AREA)
- Manufacturing & Machinery (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Electrochemistry (AREA)
- Materials Engineering (AREA)
- Metallurgy (AREA)
- Organic Chemistry (AREA)
- Electroplating Methods And Accessories (AREA)
- Electroplating And Plating Baths Therefor (AREA)
- Electrodes Of Semiconductors (AREA)
Abstract
Priority Applications (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
EP10754951A EP2483456A2 (en) | 2009-09-28 | 2010-09-22 | Wafer pretreatment for copper electroplating |
US13/496,251 US20120175264A1 (en) | 2009-09-28 | 2010-09-22 | Wafer pretreatment for copper electroplating |
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US24616109P | 2009-09-28 | 2009-09-28 | |
US61/246,161 | 2009-09-28 |
Publications (2)
Publication Number | Publication Date |
---|---|
WO2011036158A2 WO2011036158A2 (en) | 2011-03-31 |
WO2011036158A3 true WO2011036158A3 (en) | 2011-06-23 |
Family
ID=43638715
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
PCT/EP2010/063929 WO2011036158A2 (en) | 2009-09-28 | 2010-09-22 | Wafer pretreatment for copper electroplating |
Country Status (5)
Country | Link |
---|---|
US (1) | US20120175264A1 (en) |
EP (1) | EP2483456A2 (en) |
KR (1) | KR20120100947A (en) |
TW (1) | TWI499697B (en) |
WO (1) | WO2011036158A2 (en) |
Families Citing this family (8)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US10214826B2 (en) * | 2013-01-29 | 2019-02-26 | Novellus Systems, Inc. | Low copper electroplating solutions for fill and defect control |
US9598787B2 (en) * | 2013-03-14 | 2017-03-21 | Rohm And Haas Electronic Materials Llc | Method of filling through-holes |
US20140299476A1 (en) * | 2013-04-09 | 2014-10-09 | Ebara Corporation | Electroplating method |
CN104762643A (en) * | 2014-12-17 | 2015-07-08 | 安捷利电子科技(苏州)有限公司 | Copper plating solution capable of realizing co-plating of through hole, blind hole and circuit |
US10508357B2 (en) | 2016-02-15 | 2019-12-17 | Rohm And Haas Electronic Materials Llc | Method of filling through-holes to reduce voids and other defects |
US10512174B2 (en) | 2016-02-15 | 2019-12-17 | Rohm And Haas Electronic Materials Llc | Method of filling through-holes to reduce voids and other defects |
KR20200131909A (en) | 2018-04-09 | 2020-11-24 | 램 리써치 코포레이션 | Copper electrofill on non-copper liner layers |
CN114507886A (en) * | 2022-03-29 | 2022-05-17 | 四会富仕电子科技股份有限公司 | Hole-filling electroplating method |
Citations (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US20070235343A1 (en) * | 2006-04-05 | 2007-10-11 | James Watkowski | Process for electrolytically plating copper |
EP1865093A1 (en) * | 2000-01-20 | 2007-12-12 | Nippon Mining & Metals Co., Ltd. | Copper electroplating liquid, pretreatment liquid for copper electroplating and method of copper electroplating |
US20090020434A1 (en) * | 2007-07-02 | 2009-01-22 | Akira Susaki | Substrate processing method and substrate processing apparatus |
Family Cites Families (11)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US3770598A (en) | 1972-01-21 | 1973-11-06 | Oxy Metal Finishing Corp | Electrodeposition of copper from acid baths |
US4376685A (en) | 1981-06-24 | 1983-03-15 | M&T Chemicals Inc. | Acid copper electroplating baths containing brightening and leveling additives |
US4555315A (en) | 1984-05-29 | 1985-11-26 | Omi International Corporation | High speed copper electroplating process and bath therefor |
US5058799A (en) * | 1986-07-24 | 1991-10-22 | Zsamboky Kalman F | Metallized ceramic substrate and method therefor |
US5340947A (en) * | 1992-06-22 | 1994-08-23 | Cirqon Technologies Corporation | Ceramic substrates with highly conductive metal vias |
US6491806B1 (en) | 2000-04-27 | 2002-12-10 | Intel Corporation | Electroplating bath composition |
US6679983B2 (en) | 2000-10-13 | 2004-01-20 | Shipley Company, L.L.C. | Method of electrodepositing copper |
WO2004107422A2 (en) * | 2003-05-27 | 2004-12-09 | Ebara Corporation | Plating apparatus and plating method |
US7064068B2 (en) * | 2004-01-23 | 2006-06-20 | Taiwan Semiconductor Manufacturing Company, Ltd. | Method to improve planarity of electroplated copper |
US7989347B2 (en) * | 2006-03-30 | 2011-08-02 | Freescale Semiconductor, Inc. | Process for filling recessed features in a dielectric substrate |
JP4822519B2 (en) | 2006-06-26 | 2011-11-24 | Jx日鉱日石金属株式会社 | Semiconductor wafer pretreatment agent and pretreatment method |
-
2010
- 2010-09-22 EP EP10754951A patent/EP2483456A2/en not_active Withdrawn
- 2010-09-22 KR KR1020127010605A patent/KR20120100947A/en not_active Application Discontinuation
- 2010-09-22 WO PCT/EP2010/063929 patent/WO2011036158A2/en active Application Filing
- 2010-09-22 US US13/496,251 patent/US20120175264A1/en not_active Abandoned
- 2010-09-28 TW TW099132878A patent/TWI499697B/en not_active IP Right Cessation
Patent Citations (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
EP1865093A1 (en) * | 2000-01-20 | 2007-12-12 | Nippon Mining & Metals Co., Ltd. | Copper electroplating liquid, pretreatment liquid for copper electroplating and method of copper electroplating |
US20070235343A1 (en) * | 2006-04-05 | 2007-10-11 | James Watkowski | Process for electrolytically plating copper |
US20090020434A1 (en) * | 2007-07-02 | 2009-01-22 | Akira Susaki | Substrate processing method and substrate processing apparatus |
Non-Patent Citations (3)
Title |
---|
D. W. LEE ET AL: "Effect of acidity on defectivity and film properties of electroplated copper films", JOURNAL OF THE ELECTROCHEMICAL SOCIETY, vol. 151, no. 3, 5 February 2004 (2004-02-05), pages C204 - C209, XP002631632 * |
MALTA D ET AL: "Optimization of chemistry and process parameters for void-free copper electroplating of high aspect ratio through-silicon vias for 3D integration", ELECTRONIC COMPONENTS AND TECHNOLOGY CONFERENCE, 2009. ECTC 2009. 59TH, IEEE, PISCATAWAY, NJ, USA, 26 May 2009 (2009-05-26), pages 1301 - 1306, XP031475081, ISBN: 978-1-4244-4475-5 * |
WEI-PING DOW ET AL: "Copper Fill of Microvia Using a Thiol-Modified Cu Seed Layer and Various Levelers", JOURNAL OF THE ELECTROCHEMICAL SOCIETY, vol. 156, no. 8, 10 June 2009 (2009-06-10), pages D314 - D320, XP002631631 * |
Also Published As
Publication number | Publication date |
---|---|
US20120175264A1 (en) | 2012-07-12 |
TWI499697B (en) | 2015-09-11 |
WO2011036158A2 (en) | 2011-03-31 |
TW201129727A (en) | 2011-09-01 |
KR20120100947A (en) | 2012-09-12 |
EP2483456A2 (en) | 2012-08-08 |
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