WO2011032415A1

WO2011032415A1 - Connection method for camera of device comprising liquid crystal display screen and device comprising camera and liquid crystal display screen

Info

Publication number: WO2011032415A1
Application number: PCT/CN2010/074690
Authority: WO
Inventors: 曲中奎; 夏欢林; 秦丽芳; 韩文军
Original assignee: 中兴通讯股份有限公司
Priority date: 2009-09-21
Filing date: 2010-06-29
Publication date: 2011-03-24
Also published as: CN101666924A

Abstract

A connection method for a camera of a device comprising liquid crystal display (LCD) screen includes connecting a camera module (1) to a driving chip (5) or a main control board of the liquid crystal display via wires (4) of indium tin oxide (ITO) on the LCD (2). A device comprising a camera and a liquid crystal display screen is also disclosed.

Description

Method for connecting camera of device with liquid crystal display and having camera and

LCD display device

The present invention relates to a connection technology of a mobile phone camera, and more particularly to a connection method of a camera having a liquid crystal display device and a connection device using the foregoing connection method. Background technique

At present, LCD (Liquid Crystal Display Panel) has become the most widely used display device in mobile phones and other handheld devices because of its low power consumption, and the camera has gradually become a handheld device such as mobile phones and ΜΡ4. A standard configuration. At present, the screens of mobile phones and handheld devices have been developing in a large-scale and high-resolution manner. With the advancement of society, consumers are increasingly demanding the functions of these handheld devices. The various processing modules are integrated into the small mobile phone, which will inevitably lead to smaller and smaller space in the mobile phone casing, and the consumer demand for the small size of the mobile phone is more and more demanding, saving every inch of space in the mobile phone. It all seems very important. At present, the mobile phone camera is generally connected to the mobile phone motherboard through a dedicated connector, and the size of the dedicated connector and the connection between the dedicated connector and the main board occupy a large space. Another way to deal with this is to solder the phone camera to the phone's motherboard via Surface Mounted Technology (SMT). Due to the limited space inside the phone case, plus the internal wiring of the phone board, it is very difficult to solder. And need high welding technology, which undoubtedly increases the cost of mobile phones.

There is still a serious problem in the method of connecting the above-mentioned existing mobile phone camera to the mobile phone motherboard, that is, since the mobile phone main board has a lot of internal wiring, the radio frequency signal line of the mobile phone easily interferes with the camera module, and the camera module is caused by the camera module. Water ripples appear on the display in preview mode and camera mode, seriously affecting the user experience. The same problem can occur in other handheld devices, such as personal digital assistants (PDAs). Summary of the invention

In view of this, the main object of the present invention is to provide a method for connecting a camera with a liquid crystal display device and a device having a camera and a liquid crystal display, which can make the device with the camera and the liquid crystal display smaller in size and the RF signal is not Will affect the display of the camera module.

In order to achieve the above object, the technical solution of the present invention is achieved as follows:

A method for connecting a camera with a liquid crystal display device, comprising:

The camera module is connected to the LCD driver chip or control board through the indium tin oxide ITO trace on the LCD.

Preferably, the camera module is connected to the driving chip or the control board of the LCD through an ITO trace on the LCD, which is:

The camera module is assembled on the LCD, and the line connecting the camera module to the driving chip of the LCD or the control board is etched on the ITO of the glass substrate of the LCD.

Preferably, the camera module is mounted on the LCD by thermocompression bonding, and the solder joint is located on one side of the camera module.

Preferably, when the camera module and the driving chip of the LCD are connected by the ITO trace on the LCD, the driving chip of the LCD simultaneously serves as a driving chip of the camera module, and the control board passes through the flexible circuit board and the The driving chip of the LCD is connected; the control board sends a control instruction to the camera module through the driving chip of the LCD.

Preferably, when the camera module and the control board are connected by an ITO trace on the LCD, the control board is connected to the LCD through a flexible circuit board, and directly sent to the camera module through the ITO trace. Control instruction.

A device having a camera and a liquid crystal display, wherein the camera module is connected to a driving chip or a control board of the LCD through an ITO trace on the LCD.

Preferably, the camera module is connected to the driving chip or the control board of the LCD through an ITO trace on the LCD, which is: The camera module is assembled on the LCD, and the circuit of the camera module and the driving chip of the LCD or the control board is etched on the ITO of the glass substrate of the LCD.

In the present invention, the camera is mounted on the LCD of the handheld device, and the handheld device motherboard is connected to the camera module of the handheld device through the ITO on the LCD of the handheld device, because the ITO trace on the LCD of the handheld device is in the handheld device. On the LCD, there is no wiring problem, and the ITO trace does not occupy the volume of the handheld device case. The ITO trace is not interfered by the RF signal line or other data lines of the handheld device, thus enabling the handheld device. The overall size is smaller and does not affect the display of the handheld LCD. Since the camera module is assembled on the LCD, the invention saves the structure space for the handheld device motherboard, reduces the wiring of the handheld device motherboard, and avoids the appearance of the screen horizontal stripes when the handheld device is photographing. DRAWINGS

Figure 1 is a schematic diagram of the current distribution of mobile phone cameras;

2 is a schematic view showing the distribution of a mobile phone camera of the present invention;

3 is a schematic structural diagram of a connection between a mobile phone camera and a mobile phone motherboard according to the present invention;

4 is a schematic view showing a solder joint distribution of a camera module of the present invention;

FIG. 5 is a schematic structural diagram of a camera module for controlling a mobile phone motherboard according to the present invention; FIG. FIG. 6 is another schematic structural diagram of a mobile phone motherboard control camera module according to the present invention. detailed description

The basic idea of the invention is: the camera is mounted on the LCD of the handheld device, and the handheld device motherboard is connected to the camera module of the handheld device through the ITO on the LCD of the handheld device, because the ITO trace on the LCD of the handheld device On the LCD of the handheld device, there is no wiring problem, and the ITO trace does not occupy the volume of the casing of the handheld device, and the ITO trace is not interfered by the RF signal line or other data lines of the handheld device, therefore, The overall size of the handheld device is smaller and does not affect the display of the handheld device's liquid crystal display.

In order to make the objects, technical solutions and advantages of the present invention more comprehensible, the present invention will be further described in detail below with reference to the accompanying drawings.

FIG. 1 is a schematic diagram of current mobile phone camera distribution. As shown in FIG. 1 , the camera 1 of a conventional mobile phone is generally located above or below the LCD 2 of the mobile phone (not shown), but the camera has no connection point with the LCD 2 of the mobile phone. Generally, the mobile phone motherboard is directly connected through the corresponding data line. Due to the limited size of the casing, it is inevitably close to the audio and RF lines of the mobile phone, which will affect the display effect of the camera. The installation of the existing camera will be Take up a lot of space in the phone case.

2 is a schematic view showing the distribution of the mobile phone camera of the present invention. As shown in FIG. 2, the camera 1 of the present invention is located on the LCD 2, and passes through the indium tin oxide (ITO, Indium Tin Oxide) on the LCD 2 and the LCD 2 The driving chip 5 or the mobile phone main board (not shown) is connected. The specific connection method will be described in detail below.

3 is a schematic diagram showing the connection structure of the mobile phone camera and the mobile phone main board of the present invention. As shown in FIG. 3, the mobile phone camera module 1 of the present invention is located on the glass substrate of the LCD 2, and is fixed and fixed at the binding position 6 of the camera. The lithography process of the conductive material ITO on the LCD glass substrate is etched on the ITO by the ITO trace 4 as shown in FIG. 3, and the etched ITO traces 4 are respectively soldered to the bottom of the camera module 1. Connect the points. Specifically, the camera module 1 can be fixed on the glass substrate of the LCD by hot pressing, through an anisotropic conductive film on the LCD. (ACF, Anisotropic Conductive adhesive Film) Binds the camera module 1 to the binding position 6 of the camera.

4 is a schematic view showing the solder joint distribution of the camera module of the present invention. As shown in FIG. 4, the conventional solder joint is generally located directly below the bottom of the camera module, and the camera module is generally used for hot-pressing with the main board. The connection, in this way, can easily lead to damage of the camera module. Therefore, the present invention extends the bottom solder joint of the camera to the binding position 6 (shown in the shaded part of FIG. 3) in FIG. 3, thereby effectively preventing the installation of the camera module. The pressure and high temperature generated during the process avoid the damage caused by the hot pressing operation to the camera.

The control signal of the camera is sent from the main board of the mobile phone, and the camera module 1 on the glass substrate is directly controlled by the ITO trace 4 on the glass substrate. The mobile phone motherboard is connected and communicated with the LCD through a flexible printed circuit (FPC) 3 on the LCD. The control signal on the mobile phone motherboard is connected to the liquid crystal display through the FPC 3, and then through the ITO trace on the glass substrate of the liquid crystal display. 4, respectively connected to the liquid crystal display driver chip and the camera driver chip (located in the camera module 1), thereby achieving the purpose of the mobile phone motherboard to control the liquid crystal display and the camera. 5 is a schematic structural diagram of a mobile phone motherboard control camera module according to the present invention. As shown in FIG. 5, each control pin on the mobile phone mainboard is respectively connected with a corresponding pin on the liquid crystal display driving chip and the camera driving chip, and the connection manner is The pins are labeled with the same interconnection, so that the mobile phone motherboard can control the liquid crystal display and the camera.

It should be noted that the camera module 1 of the present invention is only required to be located on the LCD 2, and does not limit the specific position of the camera module 1, as long as it does not affect the display of the LCD.

The above facility scheme illustrates the direct connection between the mobile phone camera and the mobile phone motherboard. The invention can also directly connect the mobile phone camera and the LCD driver chip, and integrate the camera driver chip and the LCD driver chip, and the host computer drives the chip through the LCD. The control of the camera driver chip is implemented to realize the control of the camera module of the present invention. The following technical examples are illustrated by specific examples. In this example, the camera module 1 and the LCD driver are driven. The LCD driving IC is connected to integrate the LCD driving IC with the camera control IC. The LCD and the camera share an IC and control the camera module.

As shown in FIG. 3, in the bonding position 6 of the camera module, the ITO trace of the conductive material ITO on the LCD glass substrate is still used, and the ITO trace 4 shown in the figure is etched on the ITO in advance. The LCD driving IC is connected to the bottom solder joint of the camera module. The LCD driving IC is integrated with the camera control IC. The LCD and the camera share an IC. The camera is hot pressed and passed through ACF (anisotropic conductive film). The camera module 1 is bound to the binding position 6 of the glass substrate and the camera. The camera signal is sent from the main board of the mobile phone, reaches the integrated IC through the FPC 3, and then directly passes the ITO trace 4 on the glass substrate to the camera on the glass substrate. The module is controlled. The soldering point between the LCD driving IC and the camera module 1 is as shown in FIG. 4, and the solder joint at the bottom of the camera is extended to the binding position 6 of FIG. 3, thereby preventing the pressure and high temperature of the indenter generated during the binding process. Damage to the camera.

6 is another schematic structural diagram of a mobile phone motherboard control camera module according to the present invention. As shown in FIG. 6, the control signal of the camera module 1 of the present invention is sent by the mobile phone main board and sent to the display IC of the display through the flexible circuit board. The control signal processing is then decomposed into two signals by the drive IC of the display, one of which controls the LCD and the other controls the camera. It should be noted that the control pin on the mobile phone main board and the pin on the display IC of the display are connected according to the labels shown in the figure, and the pins on the display IC of the display are respectively connected with the LCD and the camera.

The invention also describes a mobile phone comprising a camera, wherein the camera is connected to the mobile phone motherboard or LCD driver using the aforementioned method.

It should be noted that the foregoing is a description of a mobile phone as an example. The technical solution of the present invention is also applicable to a handheld device having a small size such as a PDA or an MP4 and having a liquid crystal display and a camera. The implementation principle is the same as that in the above mobile phone example. the same.

The above is only the preferred embodiment of the present invention and is not intended to limit the scope of the present invention.

Claims

Claim

A method for connecting a camera having a liquid crystal display device, characterized in that the method comprises:

Connect the camera module to the driver chip or control board of the LCD LCD through the indium tin oxide ITO trace on the LCD.

The method according to claim 1, wherein the connecting the camera module to the driving chip or the control board of the LCD through the ITO trace on the LCD is:

3. The method according to claim 1, wherein the camera module is mounted on the LCD by thermocompression bonding; the soldered solder joint is located on one side of the camera module.

The method according to any one of claims 1 to 3, wherein when the camera module and the driving chip of the LCD are connected by an ITO trace on the LCD, the driving chip of the LCD simultaneously serves as the a driving chip of the camera module, wherein the control board is connected to the driving chip of the LCD through a flexible circuit board; and the control board sends a control instruction to the camera module through the driving chip of the LCD.

The method according to any one of claims 1 to 3, wherein, when the camera module and the control board are connected by an ITO trace on the LCD, the control board passes through the flexible circuit board and the LCD Connecting, and sending a control instruction directly to the camera module through the ITO trace.

6. A device having a camera and a liquid crystal display, comprising: a camera module and an LCD, wherein the LCD comprises a driving chip and a control board; and the camera module passes through a driving chip or a control board of the LCD The ITO traces on the LCD are connected.

The device according to claim 6, wherein the camera module is assembled on the LCD, and the camera module and the LCD are etched on the ITO of the glass substrate of the LCD. Move the chip or control the line connected to the motherboard.

8. The device according to claim 6, wherein the camera module is mounted on the LCD by thermo-compression bonding; the soldered solder joint is located on one side of the camera module.

The device according to any one of claims 6 to 8, wherein the camera module and the driving chip of the LCD are connected by an ITO trace on the LCD; the driving chip of the LCD serves as the camera at the same time. a driving chip of the module, wherein the control board is connected to the driving chip of the LCD through a flexible circuit board; and the control board sends a control instruction to the camera module through the driving chip of the LCD.

The device according to any one of claims 6 to 8, wherein the camera module and the control board are connected by an ITO trace on the LCD; the control board is connected to the LCD through a flexible circuit board. And sending a control instruction directly to the camera module through the ITO trace.