200845494 九、發明說明 【發明所屬之技術領域] 本發明係關於電路裝置及電路基板 用的異方導電性連接器及使用其之導電 細而言，係關於可以抑制對於高頻訊號 有用以使來自電路裝置等所產生的熱釋 架板的異方導電性連接器、及使用該異 導電連接構造體。 【先前技術】 最近，例如個人電腦或行動電話或 器的輕量化、薄型化、及小型化日益進 電子機器中，高功能化或資訊記錄容量 理能力的高速化也向前邁進著。 伴隨此，電子機器內所使用的1C、 電路裝置更爲微細、高密度化，由此等 ® 熱之問題更爲深刻化。 由此種熱所引起的問題，可舉出： - 密電子零件的溫度上升所產生的該電子 . 作；或電子機器內部的溫度上升所導致 件的不好影響；進而爲了抑制此等誤動 產生於電子機器內設置冷卻風扇之必要 的輕量化、薄型化及小型化變得困難。 且說，異方導電性彈性體薄片，由 焊錫焊接或機械性嵌合等手段，可以達 -5- 等之電性連接所使 連接構造體，更詳 的雜訊，且具備具 放的熱傳導性之框 方導電性連接器的 數位相機等電子機 行之同時，於該等 的增大、及資訊處 CPU、記憶體等之 電路裝置所產生的 由於成爲熱源之精 零件的故障或誤動 之對熱源以外的零 作或不好影響，而 性，使得電子機器 於具有：不需使用 成緻密的電性連接 200845494 :吸收機械性衝撃或變形，得以進行軟性連接等 利用此種特長，例如在個人電腦、行動電話、數 之電子機器的領域中，作爲達成1C、CPU、記憶 路裝置與例如印刷電路基板與無導線晶片載具、 等之相互間的電性連接之連接器而被廣泛地使用 此種異方導電性彈性體薄片，係只於厚度方 電性者、或具有在厚度方向被加壓時，只於厚度 導電性之加壓導電性導電部者，此種異方導電性 片’以往有種種構造者爲所周知。 例如，作爲於無加壓狀態下，只於厚度方向 性之異方導電性彈性體薄片，以於藉由絕緣性橡 的薄片基體中，導電性纖維在厚度方向延伸之方 的狀態下而被排列者、混合有碳黑或金屬粉末而 性橡膠與絕緣性橡膠在面方向交互層積而成者（ 專利文獻1 )等爲所周知。 另一方面，作爲於厚度方向被加壓時，只於 顯示導電性之異方導電性彈性體薄片，以將金屬 地分散於彈性體中所獲得者（例如參照專利文獻 由將導電性磁性體粒子不均勻地分佈於彈性體中 於厚度方向延伸的多數導電部、及將彼等相互絕 部而成者（例如參照專利文獻3);於導電部的 緣部之間形成有段差而成者（例如參照專利文獻 周知。 進而，作爲傳熱性構件，以將導電性金屬粒 之特長， 位相機等 體等之電 液晶面板 〇 向顯示導 方向顯示 彈性體薄 顯示導電 膠所形成 式而定向 成的導電 例如參照 厚度方向 粒子均勻 2);藉 ，來形成 緣之絕緣 表面與絕 4)爲所 子與碳纖 -6- 200845494 維在厚度方向定向於彈性體中’從高熱的電子零件對散熱 部進行熱傳導之異方導電性彈性體薄片爲所周知（例如參 照專利文獻5)。 但是’在將此種異方導電性彈性體薄片當成連接微細 、高密度化的1C、CPU、記憶體等之電路裝置與電路基板 等之連接器使用的情形時，電路裝置所產生的熱，會從該 電路裝置散熱於電路基板，電路基板本身蓄熱而變成高溫 ，其結果爲，存在電路裝置的除熱變得不充分的問題，於 小型化的個人電腦、行動電話、數位相機等之電子機器的 領域中，其散熱性能不充分，期望有散熱性能更高的異方 導電性連接器。 另外，在個人電腦、行動電話、數位相機等之電子機 器的領域中，基於其動作速度的提升，使用輸入輸出時脈 頻率例如1GHZ以上的高頻訊號的1C、CPU、記憶體等之 半導體裝置的情形增加。於小型化的個人電腦、行動電話 、數位相機等之電子機器的領域中，成爲於近距離配置多 數的半導體裝置，如不更嚴密地進行高頻雜訊的對策，也 存在有對於高頻訊號之雜訊的影響變大之問題點。 [專利文獻1]日本專利特開昭50_94495號公報 [專利文獻2]日本專利特開昭5 1 -93 3 93號公報 [專利文獻3 ]日本專利特開昭5 3 - 1 4 7 7 2號公報 [專利文獻4]日本專利特開昭61-250906號公報 [專利文獻5]日本專利特開200 1 -3 1 6502號公報 200845494 【發明內容】 本發明係基於以上情形所完成者，其第1目的，在於 提供··可以達成微細、高密度化的1C、CPU、記憶體等之 電路裝置與電路基板等之穩定地電性連接之異方導電性連 - 接器，及使用其之電極構造體。 - 本發明之第2目的’係於述第1目的之外，在於提供 :於微細化、高密度化的電路裝置與電路基板等進行電性 連接時，顯示良好的散熱性之異方導電性連接器，及使用 其之電極構造體。 本發明之第3目的，係於前述第1目的及第2目的之 外，在於提供：於將時脈頻率例如爲1 GHz以上的高頻訊 號輸入輸出電路裝置時，可以抑制對於高頻訊號之雜訊的 異方導電性連接器，及使用其之電極構造體。 一種異方導電性連接器，其特徵爲： 由：以塞住貫穿厚度方向的開口之方式所形成，且具 I 有熱傳導性的框架板； 及配置於此框架板的開口，且由該開口的周邊部所支 撐的異方導電膜所形成， ~ 前述異方導電膜，係由： ‘ 依循對應應連接電路裝置中之訊號電極的圖案而配置 的連接用導電部；及 依循對應接地電極的圖案而配置的接地用導電部及將 彼等相互絕緣之絕緣部；及 與周緣形成爲一體，且被固定於前述框架板中之開口 -8 - 200845494 的周邊部之被支撐部所形成， 該被支撐部，係含有顯示磁性的導電性粒子。 於前述異方導電性連接器中，以具有：包圍同一連接 用導電部的複數個接地用導電部爲佳。 • 於前述異方導電性連接器中，以對於應連接電路裝置 - 的同一接地電極，配置有複數個接地用導電部爲佳， 於前述異方導電性連接器中，以接地用導電部係包圍 $ 連接用導電部的同軸形狀爲佳。 於前述異方導電性連接器中，以於被支撐部中，顯示 磁性的導電性粒子，係定向於厚度方向爲佳。 於前述異方導電性連接器中，以框架板係由：藉由樹 脂材料或複合樹脂材料所形成的基體；及形成於此基體的 至少其中一面的熱傳導性金屬膜所形成，於該框架板，係 依循對應應連接電路裝置中之電極的圖案而形成有複數個 開口爲佳。 Φ 於前述異方導電性連接器中，以於框架板連接有冷卻 機構爲佳。 本發明之異方導電性連接器，其特徵爲由：薄片狀連 ' 接器元件、及於此連接器元件的兩面之各面形成爲一體的 ' 異方導電膜所形成， 前述連接器元件，係由：絕緣性薄片；及依循對應應 連接電路裝置中之訊號電極的圖案而配置於此絕緣性薄片 ，且延伸於該絕緣性薄片的厚度方向之連接用電極構造體 ;及依循對應應連接電路裝置中之接地電極的圖案而配置 -9 - 200845494 於前述絕緣性薄片，且延伸於該絕緣性薄片的厚度方向之 接地用電極構造體；及依循對應應連接電路裝置中之電源 電極的圖案而配置於前述絕緣性薄片，且延伸於該絕緣性 薄片的厚度方向之電源甩電極構造體所形成， 前述異方導電膜，係由：以位於前述連接器元件的連 接用導電部上之方式而配置的連接用導電部；及以位於該 連接器元件的接地用電極構造體上之方式而配置的接地用 導電部；及以位於該連接器元件的電源用電極構造體上之 方式而配置的電源用導電部；及將彼等相互絕緣的絕緣部 所形成， 於前述絕緣性薄片中之至少其中一面形成：以與前述 連接用電極構造體、前述接地用電極構造體及前述電源用 電極構造體絕緣的狀態下所形成的熱傳導用金屬膜；及將 該接地用電極構造體之各個相互電性連接的接地配線用金 屬膜；及將該電源用電極構造體之各個相互電性連接的電 源配線用金屬膜。 本發明之導電連接構造體，其特徵爲：電路裝置係介 由前述之異方導電性連接器與電路基板電性連接所構成。 如依據本發明之異方導電性連接器，由於具有具熱傳 導性的框架板，所以，可以使電路裝置所產生的熱介由框 架板，對於電路裝置於水平方向散放。 於固定於本發明的異方導電性連接器的框架板中之開 口的周邊部之被支撐部中，導電性粒子係定向於厚度方向 而存在，可使電路裝置中所產生的熱藉由導電性粒子的定 -10- 200845494 向，有效率地往框架板散熱，且介由框架板對於電路裝置 而往水平方向散熱，對於電路裝置之除熱效果變得良好。 而且，介由於框架板的外周部連接冷卻機構，可以更 有效率地進行電路裝置的除熱。 於本發明的異方導電性連接器的異方導電膜，除了連 接於電路裝置的訊號電極之連接用導電部之外，也具備連 接於接地電極的接地用導電部，於電路裝置輸入輸出高頻 訊號時，藉由接地用導電部的存在’對於局頻訊號的雜訊 之影響被降低。而且，接地用導電部係包圍同一連接用導 電部而複數地形成，對於高頻訊號之雜訊降低的效果大。 另外’在接地用導電部形成爲包圍連接用導電部的同 軸狀之情形，對於高頻訊號之雜訊降低的效果更大。 如依據本發明之導電連接構造體，電路裝置與電路基 板係藉由前述異方導電性連接器而被連接，電路裝置的除 熱變得良好，且對於高頻訊號之雜訊的影響變小。 【實施方式】 以下，一面參照圖面一面詳細說明本發明之實施型態 0 第1圖、第2圖及第3圖係表不本發明之異方導電性 連接器的第1例中之構成的說明圖第1圖爲平面圖，第2 圖爲A-A剖面圖，第3圖爲放大的部分剖面圖。 如第4及第5圖也顯示般，於框架板71的中央位置 形成有比異方導電膜1 0A還小尺寸的矩形開口 73，於四 -11 ·200845494 IX. INSTRUCTIONS OF THE INVENTION [Technical Fields of the Invention] The present invention relates to an anisotropic conductive connector for a circuit device and a circuit board, and a conductive thinness therefor, which is useful for suppressing the use of a high frequency signal to An anisotropic conductive connector of a pyroelectric panel produced by a circuit device or the like, and a heteroconductive connection structure using the same. [Prior Art] Recently, for example, lightweight, thinner, and smaller miniaturized personal computers or mobile phones have been moving forward, and high-speed functions such as high-performance or information recording capacity have also moved forward. Along with this, the 1C and circuit devices used in the electronic equipment are finer and higher in density, and the problem of the heat of the ® is further deepened. The problems caused by such heat can be exemplified by: - the electrons generated by the temperature rise of the dense electronic parts; or the bad influence of the temperature rise inside the electronic equipment; and further, in order to suppress such malfunctions It is difficult to reduce the weight, thickness, and size required to provide a cooling fan in an electronic device. In addition, the heteroconductive conductive elastic sheet can be connected by a soldering or mechanical fitting to achieve a connection structure, a more detailed noise, and a thermal conductivity. The electronic camera such as a digital camera of the frame-side conductive connector is at the same time as the above-mentioned increase, and the circuit device such as the CPU and the memory generated by the information device is malfunctioning or malfunctioning due to the fine component that becomes the heat source. Zero or bad influence on the heat source, and the nature, so that the electronic machine has: need not use a dense electrical connection 200845494: absorb mechanical punching or deformation, can be used for soft connection, etc., for example, In the field of personal computers, mobile phones, and digital electronic devices, it is widely used as a connector for achieving electrical connection between 1C, CPU, memory device, and, for example, a printed circuit board and a leadless wafer carrier. The use of such an anisotropically-conductive elastomer sheet is a pressure-conducting conductive conductivity only when the thickness is square or when it is pressurized in the thickness direction. The electric conductor, such an anisotropic conductive sheet has been known in the past. For example, in the non-pressurized state, only the conductive conductive elastic sheet having a thickness directivity is used in a state in which the conductive fibers extend in the thickness direction of the insulating rubber sheet substrate. It is known that the carbon black or the metal powder is mixed and the rubber and the insulating rubber are alternately laminated in the surface direction (Patent Document 1). On the other hand, when it is pressed in the thickness direction, only the conductive conductive conductive elastic sheet is displayed to disperse the metal in the elastic body (for example, refer to the patent document: Conductive magnetic body) The particles are unevenly distributed in a plurality of conductive portions extending in the thickness direction of the elastic body, and are formed to be mutually integral (for example, refer to Patent Document 3); and a step is formed between the edges of the conductive portions. (For example, the heat-transferable member is characterized in that the conductive liquid crystal panel such as the length of the conductive metal particles, the position of the camera, or the like is displayed in the display direction to display the elastic thin display conductive paste. For example, the conductive particles are uniform with reference to the thickness direction; 2); to form the insulating surface of the edge and the 4) for the carbon fiber-6-200845494 dimension oriented in the thickness direction of the elastomer 'from the high heat electronic parts The heteroconductive conductive elastic sheet which conducts heat is known (for example, refer patent document 5). However, when the such heteroconductive conductive elastic sheet is used as a connector for connecting a circuit device such as a thin or high-density 1C, CPU, or memory to a circuit board or the like, the heat generated by the circuit device is The circuit device is dissipated from the circuit board, and the circuit board itself is stored in heat and becomes high temperature. As a result, there is a problem that the heat removal of the circuit device is insufficient, and the electronic device such as a personal computer, a mobile phone, or a digital camera is reduced in size. In the field of machines, the heat dissipation performance is insufficient, and a heteroconductive connector having higher heat dissipation performance is desired. In the field of electronic devices such as personal computers, mobile phones, and digital cameras, semiconductor devices such as 1C, CPU, and memory that use high-frequency signals with an input/output clock frequency of, for example, 1 GHz or more are used for the improvement of the operating speed. The situation has increased. In the field of electronic devices such as miniaturized personal computers, mobile phones, and digital cameras, many semiconductor devices are arranged in close proximity, and countermeasures for high-frequency noise are not performed more closely, and high-frequency signals are also present. The problem of the influence of noise becomes bigger. [Patent Document 1] Japanese Patent Laid-Open Publication No. Hei No. Hei. No. Hei. No. Hei. [Patent Document 4] Japanese Patent Laid-Open Publication No. SHO 61-250906 [Patent Document 5] Japanese Patent Laid-Open Publication No. Hei No. Hei No. Hei. No. Hei. It is an object of the present invention to provide a heterogeneous conductive connector that can stably and electrically connect a circuit device such as a 1C, a CPU, or a memory, and a circuit board, which are fine and high in density, and an electrode using the same Construct. In addition to the first object of the present invention, in addition to the first object of the present invention, it is possible to provide a heterogeneous conductivity which exhibits good heat dissipation when electrically connected to a circuit device having a high density and a high density. a connector, and an electrode structure using the same. A third object of the present invention is to provide a high-frequency signal input/output circuit device having a clock frequency of, for example, 1 GHz or more, in addition to the first object and the second object. An anisotropic conductive connector for noise, and an electrode structure using the same. An anisotropic conductive connector, characterized by: a frame plate formed by plugging an opening extending through a thickness direction, and having a heat conductive frame; and an opening disposed in the frame plate, and the opening is provided by the opening The hetero-conducting conductive film supported by the peripheral portion is formed, and the hetero-conducting conductive film is: 'corresponding to the connecting conductive portion corresponding to the pattern of the signal electrode to be connected to the circuit device; and the corresponding ground electrode a grounding conductive portion disposed in a pattern and an insulating portion that is insulated from each other; and a supported portion integrally formed with the peripheral edge and fixed to a peripheral portion of the opening -8 - 200845494 in the frame plate, The supported portion contains conductive particles that exhibit magnetic properties. In the above-described heteroconductive connector, it is preferable to have a plurality of grounding conductive portions surrounding the same connecting conductive portion. In the above-described heteroconductive connector, it is preferable to arrange a plurality of grounding conductive portions for the same ground electrode to be connected to the circuit device, and to use the grounding conductive portion in the heterogeneous conductive connector It is preferable to surround the coaxial shape of the conductive portion for connection. In the above-described heteroconductive connector, it is preferable that the conductive particles which are magnetic in the supported portion are oriented in the thickness direction. In the above-described heteroconductive connector, the frame plate is formed of: a base body formed of a resin material or a composite resin material; and a thermally conductive metal film formed on at least one of the base body, the frame plate is formed on the frame plate Preferably, a plurality of openings are formed in accordance with the pattern of the electrodes in the circuit device to be connected. Φ In the above-mentioned heteroconductive connector, it is preferable to connect a cooling mechanism to the frame plate. The heteroconductive conductive connector of the present invention is characterized in that: a tab-shaped connector element and an 'inside conductive film formed integrally with each other on both sides of the connector element, the connector element And an insulating sheet; and an electrode structure for connection which is disposed in the thickness direction of the insulating sheet in accordance with a pattern of the signal electrode in the circuit device to be connected; and the corresponding electrode structure in accordance with the thickness direction of the insulating sheet; -9 - 200845494 is disposed in the pattern of the ground electrode in the circuit device, and the grounding electrode structure extending in the thickness direction of the insulating sheet is disposed in the insulating sheet; and the power supply electrode in the corresponding circuit device is connected The pattern is disposed on the insulating sheet, and is formed by a power supply electrode structure extending in a thickness direction of the insulating sheet. The heteroconductive film is disposed on the connecting conductive portion of the connector element. a conductive portion for connection arranged in a manner; and a grounding portion disposed so as to be positioned on the ground electrode structure of the connector element And a conductive portion for power supply disposed on the power supply electrode assembly of the connector element; and an insulating portion that is insulated from each other, and formed on at least one of the insulating sheets a metal film for heat conduction formed in a state in which the electrode assembly for connection, the ground electrode structure, and the electrode structure for power supply are insulated; and each of the ground electrode structures is electrically connected to each other A metal film for ground wiring; and a metal film for power supply wiring that electrically connects each of the power source electrode structures to each other. The electrically conductive connection structure of the present invention is characterized in that the circuit device is electrically connected to the circuit substrate via the above-described heteroconductive connector. According to the heteroconductive connector according to the present invention, since the frame plate having heat conductivity is provided, the heat generated by the circuit device can be caused to be horizontally dispersed by the frame plate with respect to the circuit device. In the supported portion of the peripheral portion of the opening fixed in the frame plate of the heteroconductive connector of the present invention, the conductive particles are oriented in the thickness direction, and the heat generated in the circuit device can be electrically conductive. The fixing of the particles -10- 200845494, the heat is efficiently dissipated to the frame plate, and the frame plate is dissipated in the horizontal direction with respect to the circuit device, and the heat removal effect of the circuit device becomes good. Further, since the cooling mechanism is connected to the outer peripheral portion of the frame plate, heat removal of the circuit device can be performed more efficiently. The foreign conductive film of the heteroconductive connector of the present invention includes a grounding conductive portion connected to the ground electrode in addition to the connecting conductive portion connected to the signal electrode of the circuit device, and has high input and output in the circuit device. In the case of the frequency signal, the influence of the presence of the grounding conductive portion is reduced for the noise of the local frequency signal. Further, the grounding conductive portion is formed in plural by enclosing the same connecting conductive portion, and has a large effect of reducing the noise of the high frequency signal. Further, in the case where the grounding conductive portion is formed so as to surround the connecting conductive portion, the effect of reducing the noise of the high frequency signal is greater. According to the conductive connection structure of the present invention, the circuit device and the circuit board are connected by the above-described heteroconductive connector, the heat removal of the circuit device becomes good, and the influence on the noise of the high frequency signal becomes small. . [Embodiment] Hereinafter, an embodiment of the present invention will be described in detail with reference to the drawings. Figs. 1 , 2 and 3 show the configuration of the first example of the heteroconductive connector of the present invention. BRIEF DESCRIPTION OF THE DRAWINGS Fig. 1 is a plan view, Fig. 2 is a cross-sectional view taken along line AA, and Fig. 3 is an enlarged partial cross-sectional view. As shown in the fourth and fifth figures, a rectangular opening 73 having a smaller size than the isotropic conductive film 10A is formed at the center of the frame plate 71, as shown in Figs.
200845494 角落的各位置形成有定位孔72。而且，異方導電膜 係以覆蓋框架板7 1的開口 73之方式而配置，該異力 膜10A的周緣部係藉由被固定於框架板71而形成窄 撐部30，且被該框架板71所支撐。於被支撐部30中 示熱傳導性之導電性粒子係定向於厚度方向而形成_ 熱傳導部3 1。 此異方導電性連接器10中之異方導電膜10A， 由：個別於厚度方向延伸，且依循對應電路裝置的舒 極的圖案所配置的複數個圓柱狀的連接用導電部1 1 ; 別於厚度方向延伸，且依循對應電路裝置的接地電種 案所配置的複數個圓柱狀的接地用導電部1 2 ;及熱f| 3 1 ;及藉由將此等導電部及熱傳導部予以相互絕緣之 性的彈性高分子物質所形成的絕緣部1 5所構成。 另外，於形成異方導電膜1 0 A的連接用導電部 接地用導電部12的部分，含有顯示磁性的導電性輕 省略圖示）。 於圖示的例子中，對於形成於連接對象的電路裝 4個訊號電極，形成有4個各1個個連接的連接用_ ’對於形成於連接對象的電路裝置之訊號電極的外俱 軸狀的接地電極，配置有對於同一接地電極所連接的 接地用導電部。接地用導電部合計形成有丨6個。 進而，於異方導電膜10A形成有不連接於電路_ 電路基板的電極之無效導電部1 3。 另一方面，絕緣部1 5係以包圍個個導電部的周 1 0A 導電 被支 ，顯 列的 係藉 f號電 及個 丨的圖 i導部 .絕緣 11及 :子（ :置之 I電部 I之同 4個 ί置及 1圍之 -12- 200845494 方式而形成爲一體，藉此，全部的導電部係藉由絕緣部15 而成爲相互絕緣的狀態。 於異方導電膜10A的兩面形成有：形成該導電部的部 分之表面從形成絕緣部15的部分的表面突出的連接用導 電部的突出部分1 la及接地用導電部的突出部分12a。 作爲形成異方導電膜1 〇 A的彈性高分子物質，以具有 架橋構造的高分子物質爲佳。爲了獲得此種彈性高分子物 質所可以使用的硬化性的高分子物質，可以使用種種的物 質，其具體例可舉：聚丁二烯橡膠、天然橡膠、聚異戊二 烯橡膠、苯乙烯-丁二烯共聚物橡膠、丙烯腈一丁二烯共 聚物橡膠等之共軛二烯系橡膠，及彼等之氫添加物；苯乙 烯-丁二烯-二烯嵌段共聚物橡膠、苯乙烯-異戊二烯嵌段共 聚物橡膠等之嵌段共聚物橡膠，及彼等之氫添加物；氯丁 橡膠、尿烷橡膠、聚酯系橡膠、氯甲代氧丙環橡膠、矽橡 膠、乙烯-丙烯共聚物橡膠、乙烯一丙烯一二烯共聚物橡 膠等。 於以上當中，在異方導電性連接器1 0被要求耐候性 的情形時，以使用共軛二烯系橡膠以外者爲佳，特別是， 從成形加工性及電氣特性的觀點而言，以使用矽橡膠爲佳 〇 作爲異方導電膜10A中之連接用導電部1 1及接地用 導電部1 2所含有的導電性粒子，基於藉由後述的方法容 易使該粒子定向之觀點，使用熱傳導性良好之顯示磁性的 導電性粒子。作爲此種導電性粒子的具體例子，可舉··鐵 -13- 200845494 、鈷、鎳等之具有磁性的金屬粒子，或含有彼等之合金的 粒子或彼等之金屬的栗子、或以彼等之粒子爲中心粒子， 於該中心粒子的表面施以金、銀、鈀、鍺等之導電性良好 的金屬電鍍者，或以非磁性金屬粒子或玻璃粒子等之無機 物質粒子或聚合物粒子爲中心粒子，於該中心粒子的表面 施以鎳、鈷等之導電性磁性金屬的電鍍者等。 於此等之中，以使用以鎳粒子爲中心粒子，且於其表 面施以導電性良好的金電鍍或銀電鍍者爲佳。 作爲於中心粒子的表面被覆導電性金屬的手段，並無 特別限定者，例如可以使用：化學電鍍或電解電鍍法、濺 鍍法、蒸鍍法等。 作爲導電性粒子，於使用在中心粒子的表面被覆導電 性金屬者的情形時，基於可以獲得良好的導電性，以粒子 表面中的導電性金屬的被覆率（導電性金屬對於中心粒子 的表面積的被覆面積的比例）爲40 %以上爲佳，以45% 以上更佳，以47〜95%特別佳。 另外，導電性金屬的被覆量，以中心粒子的0.5〜5 0 質量％爲佳，以2〜30質量％更佳，以3〜25質量％又更 好，以4〜25質量％特別好。在所被覆的導電性金屬爲金 的情形時，其被覆量，以中心粒子的〇 . 5〜3 0質量％爲佳 ，以2〜20質量％更佳，以3〜1 5質量％又更好。 另外，導電性粒子的粒子直徑，以1〜ΙΟΟμιη爲佳， 以3〜5 0 μιη更佳。 另外，導電性粒子的粒子直徑分佈（Dw/Dn )，以1 -14- 200845494 〜1 〇爲佳，以1 · 1〜5更佳。 藉由使用滿足此種條件的導電性粒子，所獲得的連接 用導電部1 1及接地用導電部1 2，其加壓變形變得容易， 另外，於該連接用導電部11及接地用導電部12中，導電 性粒子間可以獲得充分的電性接觸。而且，在被支撐部中 ’藉由行程使導電性粒子定向於厚度方向的熱傳導部3 1， 從電路裝置經由對於框架板定向的導電性金屬粒子，可以 將熱容易地予以散熱。 作爲構成框架板71之材料，以熱導電率爲2.5w/m· Κ以上爲佳。 作爲構成顯示此種熱傳導率的框架板之材料，可以使 用金屬材料或非金屬材料，作爲非金屬材料，藉由混合塡 充劑，可以獲得特定的熱傳導率之材料。 具體的材料，可以使用金屬材料或非金屬材料。 金屬材料可以使用：金、銀、銅、鐵、鎳、鈷或彼等 之合金等。 非金屬材料可以使用：聚醯亞胺樹脂、聚酯樹脂、芳 方矢I醯胺樹脂、聚醯胺樹脂等之機械強度高的樹脂材料、 玻璃纖維補強型環氧樹脂、玻璃纖維補強型聚酯樹脂、玻 璃纖維補強型聚醯亞胺樹脂等之複合樹脂材料、於酚樹脂 、環氧樹脂等將金屬粒子或碳纖維、二氧化矽、氧化鋁、 硼氮化物等之無機材料當成塡充物予以混入之複合樹脂材 料等，基於熱膨脹係數小之觀點，以金屬粒子或碳纖維、 添加無機材料之聚醯亞胺樹脂、玻璃纖維補強型環氧樹脂 -15- 200845494 等之複合樹脂材料、以硼氮化物爲塡充物而混入之環氧樹 脂等之複合樹脂材料爲佳。 另外，作爲框架板，也可以使用於藉由前述之樹脂材 料或複合樹脂材料所形成的基體之至少一面形成有由前述 的金屬才要所形成的熱電導性金屬膜所形成者。 此種異方導電性連接器1 〇，例如可以如下述般地製造 〇 第6圖係表示用以製造本發明的異方導電性連接器所 使用的模具之一例中的構成說明用剖面圖。此模具係其上 模50及與其成對的下模55相互相對配置所構成，於上模 50的成形面（第6圖之下面）與下模55的成形面（第6 圖之上面）之間，形成有成形空間5 9。 於上模5 0中，於強磁性體基板5 1的表面（第6圖中 之下面），係依循對應作爲目的之異方導電性連接器1 〇 中的連接用導電部1 1及接地用導電部1 2的圖案之配置圖 案而形成有強磁性體層52，於此強磁性體層52以外之處 所，形成有具有厚度比該強磁性體層52還大的非磁性體 層53，藉由於非磁性體層53與強磁性體層52之間形成階 差，於該上模5 0的成形面形成有用以形成連接用導電部 1 1的突出部分1 1 a及接地用導電部1 2的突出部分1 2 a之 凹部空間5 2 a。 另一方面，於下模55中，於強磁性體基板56的表面 (第6圖中之上面），係依循對應作爲目的之異方導電性 連接器1 〇中之連接用導電部1 1及接地用導電部1 2的圖 -16- 200845494 案之圖案而形成有強磁性體層57，於此強磁性體層57以 外之處所，形成有具有厚度比該強磁性體層57還大的非 磁性體層58，藉由於非磁性體層58與強磁性體層57之間 形成階差，於該下模5 5的成形面形成有用以形成連接用 導電部11的突出部分11a及接地用導電部12的突出部分 12a之凹部空間57a。 構成上模5 0級下模5 5之各模中之強磁性體基板5 1、 5 6的材料，可以使用：鐵、鐵一鎳合金、鐵一鈷合金、鎳 、鈷等之強磁性金屬。此強磁性體基板5 1、56，以其厚度 爲〇·1〜50mm爲佳，以表面平滑，經過化學性脫脂處理， 另外，經過機械性硏磨處理爲佳。 另外，構成上模5 0及下模5 5之各模中的強磁性體層 52、57的材料，可以使用：鐵、鐵一鎳合金、鐵―鈷合金 、鎳、鈷等之強磁性金屬。此強磁性體層52、57，以其厚 度爲1 Ομιη以上爲佳。此厚度未滿1 Ομηΐ之情形時，對於形 成於模具內的成形材料層，要使具有充分的強度分布的磁 場作用變得困難，此結果，要於應成爲該成形材料層中之 連接用導電部1 1及接地用導電部12的部分高密度地集合 導電性粒子變得困難，無法獲得良好的異方導電性連接器 另外，構成上模5 0及下模5 5之各模中的非磁性體層 53、58之材料，雖可以使用：銅等之非磁性金屬、具有耐 熱性的高分子物質等，但是，基於藉由光蝕法之手法，可 以容易地形成非磁性體層5 3、5 8的觀點，以使用藉由放 -17- 200845494 射線可被硬化的高分子材料爲佳，該材料例如可以使用： 丙烯系的乾膜抗蝕劑、環氧系的液狀抗蝕劑、聚醯亞胺系 的液狀抗鈾劑等之光阻劑。 另外，下模5 5中之非磁性體層5 8的厚度，係因應應 形成的突出部分Ua、12a的突出高度及強磁性體層57的 厚度而設定。 使用前述模具，例如如下述般，得以製造異方導電性 連接器1 〇。 首先，如第7圖所示般，準備框狀的間隔物54a、54b 、及具有第4圖及第5圖所示開口 73及定位孔72之框架 板7 1，將此框架板7 1介由框狀的間隔物5 4b而固定配置 於下模55的特定位置，進而將框狀的間隔物54a配置於 上模5 0。 另一方面，藉由於硬化性的高分子物質形成材料中分 散顯示磁性的導電性粒子，來調製糊狀的成形材料。 接著，如第8圖所示般，藉由將成形材料塡充於藉由 間隔物54a而形成於上模50的成形面上之空間內，來形 成第1成形材料層61a，另一方面，藉由將成形材料塡充 於藉由間隔物54b及框架板71而形成於下模55之空間內 ，來形成第2成形材料層6 1 b。 而且，如第9圖所示般，藉由將上模50對位於框架 板71上而配置，於第2成形材料層61b上層積第1成形 材料層6 1 a。 接著，藉由使配置於上模5 0中之強磁性體基板5 1的 -18- 200845494 上面及下模55中之強磁性體基板56的下面之電磁鐵（未 圖示出）動作，使具有強度分布的平行磁場，即於上模5 0 的強磁性體層52及對應其之下模55的強磁性體層57之 間具有大的強度之平行磁場作用於第1成形材料層6 1 a及 第2成形材料層61b的厚度方向。其結果，於第1成形材 料層6 1 a及第2成形材料層6 1 b中，分散於各成形材料層 中之導電性粒子，集合於位於上模50之各強磁性體層52 及對應其之下模5 5之強磁性體層57之間之應成爲連接用 導電部1 1及接地用導電部1 2的部分，並且排列定向於各 成形材料層的厚度方向。 然後，在此狀態下，藉由硬化處理使各成形材料層， 如第1 〇圖所示般，形成：具有導電性粒子於厚度方向排 列定向之狀態下被緊密地塡充於彈性高分子物質中之連接 用導電部η、接地用導電部1 2及無效導電部1 3、及包圍 此等的連接用導電部1 1、接地用導電部1 2及無效導電部 13的周圍而形成，且由完全或幾乎沒有導電性粒子存在的 絕緣性的彈性高分子物質所形成的絕緣部1 5之異方導電 膜1 0 A ;及於框架板7 1的周邊部之被支撐部3 0，導電性 粒子於厚度方向排列定向之狀態下被緊密地塡充於彈性高 分子物質中之熱傳導部31。 然後，取出藉由模具所成形後的異方導電性連接器， 獲得第1圖所示構造的異方導電性連接器1 〇。 於以上’各成形材料層之硬化處理，雖也可以在使平 行磁場作用之狀態下來進行，也可以在使平行磁場的作用 -19- 200845494 停止後來進行。另外，也可以使平行磁場重複作用與 而分成複數次來作用，磁場的作用方向，也可以交互 上下方向反轉來作用。 作用於各成形材料層之平行磁場的強度，以平 20000〜1000000// τ之大小爲佳。 另外’使平行磁場作用於各成形材料層之手段， 以使用永久磁鐵來代替電磁鐵。基於可以獲得前述範 平行磁場的強度，永久磁鐵以鎳鈷合金（Fe-Al-Ni-C 合金）、鐵酸鹽磁體等所形成者爲佳。 各成形材料層之硬化處理，雖可以藉由使用的材 適當地選擇，通常係藉由加熱處理來進行。具體的加 度及加熱時間，則考慮構成成形材料層的高分子物質 材料等之種類、導電性粒子的移動所需要的時間等來 地選擇。 第11圖及第12圖係表示將使用本發明的異方導 連接器之電路裝置與電路基板予以連接所構成的導電 構造體的一例中之構成槪略的說明圖。 第11圖係將第1圖的異方導電性連接器與被檢 路裝置的訊號電極及接地電極一同地表示之平面圖，： 圖係將第1圖的異方導電性連接器與電路裝置、電路 一同地表示之D— D剖面圖。 此電路裝置1係如第13圖所示般，形成有4個 電極，對於各訊號電極’具有同軸狀地形成於訊號電 外側之4個接地電極。 停止 地於 均爲 也可 圍之 0系 料而 熱溫 形成 適當 電性 連接 查電 i 12 基板 訊號 極的 -20 -* 200845494 於電路基板4係形成有4個依循對應前述電路裝置1 的訊號電極2的圖案而配置的連接用電極5，且配置有配 置於連接前述電路裝置1的接地電極3之位置的接地用電 極6。連接用電極5係以電路7所連接。 接地用電極6係對於形成於前述電路裝置1的同軸狀 的接地電極3之1個，配置有4個接地用電極6，合計形 成1 6個接地用電極6。接地用電極6係藉由接地配線8而 被連接。 而且，於前述電路基板4的表面上配置有第1圖〜第 3圖所示構成之異方導電性連接器1 〇。具體而言，藉由於 形成在異方導電性連接器1 0中之框架板7 1的定位孔72 ( 參照第1圖〜第3圖）插入導引銷9，使異方導電膜10A 中之連接用導電部1 1及接地用導電部1 2被定位位於連接 用電極5及接地用電極6上之狀態，將該異方導電性連接 器10固定於電路基板4的表面上。 然後，於異方導電性連接器1 〇的表面上配置前述電 路裝置1。具體而言，對於異方導電性連接器10的異方導 電膜1 ο A中之連接用導電部1 1及接地用導電部1 2，以個 別連接前述電路裝置1的訊號電極2及接地電極3的方式 被層積。 於此狀態下，電路裝置1的訊號電極，爲介由異方導 電性連接器的連接用導電部11而與電路基板4的連接用 電極電性連接，電路裝置1的各同軸狀的接地電極3，爲 藉由異方導電性連接器的4個連接用導電部而與電路基板 -21 - 200845494 5的4個接地用電極6電性連接。 然後，將電路裝置1介由異方導電性連接器按壓於電 路基板4的狀態下，將電路裝置1的周緣部藉由接著劑等 與異方導電性連接器1〇及電路基板4接著，而形成導電 - 連接構造體。 。 於此狀態下，異方導電性連接器的異方導電膜1 ο A及 存在於藉由框架板71所形成的支撐部3 0之熱傳導部31 I 在與電路裝置連接的狀態下被固定，於電路裝置1所產生 的發熱，會介由熱傳導部31而有效率地散熱於框架板71 ，進而，經由框架板71而從異方導電性連接器10的支撐 部3 0，有效率地散熱於框架板7 1的外周部。 第14圖係表示關於本發明之異方導電性連接器與導 電連接構造體的其他例子之構成的槪略說明圖。 於此異方導電性連接器1 〇中，散熱鰭片3 5係被連接 於框架板7 1的外周部。 φ 藉由此散熱鰭片3 5，電路裝置1所產生的熱，會介由 形成於異方導電性連接器1 〇的支撐部3 0之熱傳導部31 而散熱於框架板7 1，且被散熱於框架板7 1的外周部，藉 ' 由連接於框架板7 1的外周部之散熱鰭片3 5而被散熱於外 " 部，散熱效率良好，可以有效率地將電路裝置1所產生的 熱予以除去。 第1 5圖係表示本發明之異方導電性連接器之第2例 子中的構成說明用剖面圖。 於此第2例的異方導電性連接器1 0中，依循對應應 -22- 200845494 連接電路裝置中之電極，例如訊號電極及接地電極的圖案 ，於框架板71形成有複數個開口 73，異方導電膜10A繫 於其之連接用導電部1 1、接地用導電部1 2及無效導電部 1 3之各個位於框架板7 1的開口 73內之狀態下，以覆蓋該 •框架板71的開口 73之各個的方式而被配置。31係熱傳導 • 部。 框架板7 1係藉由：以樹脂材料或複合樹脂材料所形 馨 成的基體7 1 A、及形成於此基體7 i A的一面之熱傳導性金 屬膜7 1 B所構成，熱傳導性金屬膜7 i b係與異方導電膜 1 〇 A中之連接用導電部〗丨及接地用導電部1 2爲絕緣的狀 態。 構成基體7 1 A的樹脂材料，可以使用：聚醯亞胺樹脂 、聚酯樹脂、芳族聚醯胺樹脂、聚醯胺樹脂等之機械強度 高的樹脂材料。 另外’複合樹脂材料，可以使用：玻璃纖維補強型環 φ 氧樹脂、玻璃纖維補強型聚酯樹脂、玻璃纖維補強型聚醯 亞胺樹脂等之複合樹脂材料、於酚樹脂、環氧樹脂等將金 屬粒子或碳纖維、二氧化矽、氧化鋁、硼氮化物等之無機 材料當成塡充物予以混入之複合樹脂材料等，基於熱膨脹 係數小之觀點，以金屬粒子或碳纖維、添加無機材料之聚 醯亞胺樹脂、玻璃纖維補強型環氧樹脂等之複合樹脂材料 、以硼氮化物爲塡充物而混入之環氧樹脂等之複合樹脂材 料爲佳。 作爲熱傳導性金屬膜71B，可以使用：金、銀、銅、 -23- 200845494 鐵、鎳、鈷或彼等之合金等。 此種框架板71可以準備於由樹脂材料或複合樹脂材 料所形成的基體的表面形成有金屬膜所形成的層積材料， 對於該層積材料中之金屬膜，依據所需要的圖案施以蝕刻 - 處理，並且，藉由雷射加工、鑽孔加工或衝壓加工等，於 - 基體形成開口來製造。 異方導電膜1 〇 A係與第1例的異方導電性連接器中之 0 異方導電膜基本上同樣的構成。 如依據此種異方導電性連接器1 0，於框架板7 1形成 有熱傳導性金屬膜71 B，另外，框架板71的開口 73係依 循對應應連接電路裝置中之電極的圖案而形成，可以高效 率地將電路裝置所產生的熱予以散熱。 第16圖係表示本發明之異方導電性連接器的第3例 中之構成的說明用剖面圖。 此第3例之異方導電性連接器1 0，係藉由：薄片狀的 φ 連接器元件40 ;及形成於此連接器元件40的兩面之各面 而成爲一體的異方導電膜10A所構成。 連接器元件4 0係藉由：絕緣性薄片41、及依循對應 ' 應連接電路裝置中之訊號電極的圖案而配置於此絕緣性薄 _ 片4 1，且於該絕緣性薄片41的厚度方向延伸之連接用電 極構造體42、及依循對應應連接電路裝置中之接地電極的 圖案而配置於絕緣性薄片4 1，且於該絕緣性薄片4 1的厚 度方向延伸的接地用電極構造體43、及依循對應應連接電 路裝置中之電源電極的圖案而配置於絕緣性薄片4 1，且於 -24 - 44 200845494 該絕緣性薄片41的厚度方向延伸之電源用電極構造體 所構成。 連接用電極構造體42之各個，其露出絕緣性薄片 的一面及另一面之各面的電極部42a，係藉由貫穿絕緣 薄片41的厚度方向而延伸的短路部42b而連結爲一體 構成。接地用電極構造體43及電源用電極構造體44也 連接用電極構造體42同樣的構成。 連接用電極構造體42、接地用電極構造體43及電 用電極構造體44 )以下，將此等總稱爲「電極構造體」 ，例如可以藉由電鍍處理來形成。 另外，於絕緣性薄片4 1的一面，在與電極構造體 緣的狀態下，形成有：已覆蓋配置有該絕緣性薄片4 1 一面中之電極構造體的區域以外的區域之形式所形成的 傳導用金屬膜45、及將接地用電極構造體43之各個相 電性連接的接地配線用金屬膜46、及將電源用電極構造 44之各個相互電性連接的電源配線用金屬膜47。 熱傳導用金屬膜4 5、接地配線用金屬膜4 6及電源 線用金屬膜47之各個，可以準備於絕緣性薄片4 1的一 形成有金屬膜所形成的層積材料，且對於此層積材料中 金屬膜’藉由依循所需要的圖案來施以飩刻處理而形成 構成絕緣性薄片4 1的材料，可以使用··聚醯亞胺 脂、聚酯樹脂、芳族聚醯胺樹脂、聚醯胺樹脂等之機械 度高的樹脂材料、玻璃纖維補強型環氧樹脂、玻璃纖維 強型聚酯樹脂、玻璃纖維補強型聚醯亞胺樹脂等之複合 41 性 所 與 源 絕 的 熱 互 體 配 面 之 〇 樹 強 補 樹 -25 - 200845494 脂材料、於酚樹脂、環氧樹脂等將金屬粒子或碳纖維、二 氧化砍、氧化銘、硼氮化物等之無機材料當成塡充物予以 混入之複合樹脂材料等’基於熱膨脹係數小之觀點，以金 屬粒子或碳纖維、添加無機材料之聚醯亞胺樹脂、玻璃纖 維補強型環氧樹脂等之複合樹脂材料、以硼氮化物爲塡充 物而混入之環氧樹脂等之複合樹脂材料爲佳。 構成電極構造體的材料，可以使用：金、銀、銅、鐵 、鎳、銘或此等之合金等。 異方導電膜10A之各個係藉由：位於連接器元件40 的連接用電極構造體42上而配置的連接用導電部11、及 位於連接器元件4 0的接地用電極構造體4 3上而配置的接 地用導電部1 2、及位於連接器元件40的電源用電極構造 體44上而配置的電源用導電部！ 4、及將此等相互絕緣之 絕緣部1 5所構成。異方導電膜1 〇 a中之其他的構成，與 第1例的異方導電性連接器中之異方導電膜基本上相同。 如依據此種異方導電性連接器1 〇，於連接器元件40 形成有熱傳導用金屬膜46，可以將電路裝置所產生的熱介 由連接器元件40，對於電路裝置於水平方向予以散熱。 另外，接地用電極構造體43彼此及電源用電極構造 體44彼此係相互被電性連接，可以抑制過大電流通過電 路裝置中之特定的接地電極或特定的電源電極，藉此，可 以防止過大電流或因其所產生的熱，對電路裝置中之電路 的損傷、電路裝置的電極之損傷或熔解、異方導電膜10A 中之接地用導電部1 2或電源用導電部1 4的損傷。 -26- 200845494 於本發明中，並不限定於前述實施型態，可以加上種 種的變更。 (1 )本發明之異方導電性連接器可以作爲在將電路 裝置與電路基板連接爲一體之狀態下使用的導電連接構造 體使用之外’也可以用於電路裝置的電性檢查。 (2 )不需要於異方導電性連接器的框架板設置散熱 機構，即使是只藉由框架板來構成者亦可。 (3 )設置於異方導電性連接器的框架板之散熱機構 ，在散熱鰭片之外，藉由散熱鰭片或冷卻液的循環機構等 予以強制性地冷卻之機構亦可。 (4 )連接用導電部1 1、接地用導電部1 2、無效導電 部1 3及熱傳導部3 1，各個可以相同直徑或不同直徑來形 成，其配置間距可以爲一定，各個也可以不同間距來配置 〇 (5 )形成熱傳導部31的導電性粒子與形成連接用導 電部1 1、接地用導電部1 2、無效導電部1 3的導電性粒子 ，可以是相同種類者，也可以是不同種類者。 (6 )熱傳導部3 1不使用導電性粒子，以絕緣性之熱 傳導性好的粒子或碳纖維等之短纖維來形成亦可。使用此 等粒子或短纖維來形成熱傳導部31之情形時，例如能夠 藉由以前述方法來製造異方導電膜1 〇 A後，藉由於被支撐 部3 0埋入粒子或短纖維來形成。 (7 )作爲本發明的導電連接構造體的連接對象之電 路裝置1，並無特別限定，可以使用種種元件’例如可舉 -27- 200845494 :電晶體、二極體、繼電器、開關、記憶體、由1C晶片 或 LSI晶片或彼等之封裝或 siP(SysteminaPackage)、 Soc(Systemon Chip)、MCM ( MultiChipModule)等之半導 體裝置所形成的主動零件、電阻、電容器、水晶振動件、 揚聲器、麥克風、變換器（線圈）、電感等之被動元件、 TFT型液晶顯示面板、STN型液晶顯示面板、電漿顯示面 板、電激發光面板等之顯示面板等。 (8 )於第1例及第2例之異方導電性連接器中，異 方導電膜係具有：依循對應應連接電路裝置中之電源電極 的圖案而配置的複數個電源用導電部，該電源用導電部之 各個，可以藉由絕緣部而相互絕緣。 (9 )於第1例及第2例之異方導電性連接器中，異 方導電膜係具有：對應應連接電路裝置中之電源電極的圖 案而配置，例如藉由形成於異方導電膜的表面之印刷配線 等而相互電性連接的複數個電源用導電部，該電源用導電 部之各個，可以藉由絕緣部而與連接用導電部及接地用導 電部之各個絕緣。 (1 0 )於第1例及第2例之異方導電性連接器中，異 方導電膜係具有：藉由形成於其表面之印刷配線等而相互 電性連接的接地用導電部，並且，依循對應應連接電路裝 置中之電源電極的圖案而配置，例如藉由形成於異方導電 膜的表面之印刷配線等而相互電性連接的複數個電源用導 電部，該電源用導電部之各個’可以藉由絕緣部而與連接 用導電部及接地用導電部之各個絕緣。 -28 - 200845494 【圖式簡單說明】 第1圖係表示本發明之異方導電性連接器的第1例之 平面圖。 第2圖係第1圖所示之異方導電性連接器的A-A剖面 圖。 第3圖係將第1圖所示之異方導電性連接器的一部份 予以放大表示之說明用剖面圖。 第4圖係第1圖所示之異方導電性連接器中之框架板 的平面圖。 第5圖係第4圖的框架板之B- B剖面圖。 第6圖係表示異方導電膜成形用之模具的一例中之構 成的說明用剖面圖。 第7圖係表示於下模的成形面上配置有間隔物及框架 板之狀態的說明用剖面圖。 第8圖係表示於上模的成形面形成有第1成形材料層 、於下模的成形面上形成有第2成形材料層之狀態的說明 用剖面圖。 第9圖係表示層積有第1成形材料層與第2成形材料 層之狀態的說明用剖面圖。 第1 0圖係表示形成有異方導電膜之狀態的說明用剖 面圖。 第1 1圖係將本發明之導電連接構造體的一例中之構 成與電路裝置一同表示之說明用平面圖。 第12圖係將第11圖所示之導電連接構造體的構成與 -29- 200845494 電路裝置及電路基板~'问地表不之D-D剖面圖。 第13(a)係第11圖所示之導電連接構造體中之電路 裝置的平面圖，第13(b)圖係第12(a)圖所示之電路 裝置的C - C剖面圖。 ' 第14圖係將本發明之導電連接構造體的其他例中之 * 構成與電路裝置、電路基板一同地表示之說明用剖面圖。 第1 5圖係表示本發明之異方導電性連接器的第2例 ^ 之說明用剖面圖。 第1 6圖係表示本發明之異方導電性連接器的第3例 之構成的說明用剖面圖。 【主要元件符號說明】 1 ·電路裝置’ 2 :訊號電極，3 :接地電極，4 :電路 基板，5 :連接用電極，6 :接地用電極，7 :電路，8 :接 地配線，9 :導引接腳，1 〇 :異方導電性連接器，丨〇 a ··異 • 方導電膜，1 1 :連接用導電部，1 1 a :突出部分，1 2 :接 地用導電部，12a :突出部分，1 3 :無效導電部，14 :電 源用導電部，1 5 ··絕緣部，3 0 ··被支撐部，3 1 :熱傳導部 ，35 :散熱鰭片，40:連接器元件，41 :絕緣性薄片， ' 42 :連接用電極構造體，42a :電極部，42b :短路部， 43 :接地用電極構造體，44 :電源用電極構造體，45 :熱 傳導用金屬膜，46 :接地配線用金屬膜，47 :電源配線用 金屬膜，5 0 :上模，51 ··強磁性體基板，5 2 ··強磁性體層 ，5 2a :凹部空間，53 :非磁性體層，54a、54b :間隔物 -30 - 200845494200845494 Each position of the corner is formed with a positioning hole 72. Further, the dissimilar conductive film is disposed so as to cover the opening 73 of the frame plate 71, and the peripheral portion of the dissimilar film 10A is formed by being fixed to the frame plate 71 to form the narrow stay 30, and is used by the frame plate Supported by 71. The conductive particles having thermal conductivity in the supported portion 30 are oriented in the thickness direction to form the heat conducting portion 31. The foreign conductive film 10A in the hetero-conducting connector 10 is composed of a plurality of columnar connecting conductive portions 1 1 extending in the thickness direction and arranged in accordance with the pattern of the Shu pole of the corresponding circuit device; Extending in the thickness direction, and following a plurality of cylindrical grounding conductive portions 1 2 and heat f| 3 1 disposed in the grounding electrical circuit of the corresponding circuit device; and by electrically conducting the conductive portions and the heat conducting portions The insulating portion 15 formed of an insulating elastic polymer material is composed of. In addition, the portion of the connecting conductive portion for conducting the conductive portion 12 of the conductive conductive film 10A is formed to have light conductivity indicating lightness (not shown). In the example shown in the figure, four signal electrodes are formed in the circuit to be connected to each other, and four connection connections are formed _ 'the outer shaft of the signal electrode formed in the circuit device to be connected The ground electrode is provided with a grounding conductive portion that is connected to the same ground electrode. A total of six conductive members are formed for the grounding. Further, an ineffective conductive portion 13 which is not connected to the electrode of the circuit board is formed in the counter conductive film 10A. On the other hand, the insulating portion 15 is electrically conductively supported by the circumference 10A surrounding the plurality of conductive portions, and the display portion is guided by the f-number electric and the 导 of the guide portion. The insulation 11 and the sub-(: I The electric portion I is formed integrally with the four illuminators and the first -12-200845494, whereby all the conductive portions are insulated from each other by the insulating portion 15. The heteroconductive conductive film 10A The both surfaces of the portion where the conductive portion is formed are formed by the protruding portion 1 la of the connecting conductive portion and the protruding portion 12a of the grounding conductive portion from the surface of the portion where the insulating portion 15 is formed. The elastic polymer material of A is preferably a polymer material having a bridging structure. Various materials can be used for obtaining a curable polymer material which can be used for such an elastic polymer material, and specific examples thereof include poly A conjugated diene rubber such as butadiene rubber, natural rubber, polyisoprene rubber, styrene-butadiene copolymer rubber, acrylonitrile-butadiene copolymer rubber, and hydrogen additives thereof Styrene-butadiene-two Block copolymer rubbers such as block copolymer rubbers, styrene-isoprene block copolymer rubbers, and hydrogen additives thereof; neoprene, urethane rubber, polyester rubber, chlorine An oxypropylene ring rubber, a ruthenium rubber, an ethylene-propylene copolymer rubber, an ethylene-propylene-diene copolymer rubber, etc. In the above, when the heteroconductive conductive connector 10 is required to have weather resistance, a total of It is preferable that the yoke-diene rubber is used, and in particular, from the viewpoint of moldability and electrical properties, the use of the ruthenium rubber is preferable as the connection conductive portion 1 1 and the grounding conductive material in the foreign conductive film 10A. In the conductive particles contained in the portion 1 2, conductive particles having good thermal conductivity are used, and the conductive particles having good thermal conductivity are used as a viewpoint of easily orienting the particles by a method described later. Specific examples of such conductive particles include Iron-13- 200845494, magnetic metal particles such as cobalt and nickel, or chestnuts containing particles of their alloys or their metals, or particles centered on them, on the table of the central particles A metal plating agent having good conductivity such as gold, silver, palladium or rhodium is used, or inorganic particles or polymer particles such as nonmagnetic metal particles or glass particles are used as a central particle, and nickel is applied to the surface of the central particle. In the case of electroplating of a conductive magnetic metal such as cobalt, etc., it is preferable to use gold plating or silver plating which has nickel particles as a central particle and which has excellent conductivity on the surface. The means for coating the surface of the particles with the conductive metal is not particularly limited, and for example, chemical plating, electrolytic plating, sputtering, vapor deposition, or the like can be used. The conductive particles are coated on the surface of the center particle. In the case of a metallic metal, it is preferable that the coverage of the conductive metal in the surface of the particle (the ratio of the coating area of the conductive metal to the surface area of the central particle) is 40% or more, based on the fact that good conductivity can be obtained, and is preferably 45. More than % is better, with 47~95% especially good. Further, the amount of the conductive metal to be coated is preferably 0.5 to 50% by mass of the center particles, more preferably 2 to 30% by mass, still more preferably 3 to 25% by mass, and particularly preferably 4 to 25% by mass. When the coated conductive metal is gold, the amount of coating is preferably 5 to 30% by mass of the center particles, more preferably 2 to 20% by mass, and more preferably 3 to 15% by mass. it is good. Further, the particle diameter of the conductive particles is preferably 1 to ΙΟΟμηη, more preferably 3 to 50 μm. Further, the particle diameter distribution (Dw/Dn) of the conductive particles is preferably from 1 -14 to 200845494 to 1 Torr, more preferably from 1 to 1 to 5. By using the conductive particles satisfying such conditions, the obtained conductive portion 1 1 and the grounded conductive portion 1 2 are easily deformed by pressure, and the conductive portion 11 for connection and the conductive for ground are used. In the portion 12, sufficient electrical contact can be obtained between the conductive particles. Further, in the supported portion, the conductive particles are oriented in the thickness direction of the heat conducting portion 31, and the heat can be easily dissipated from the circuit device via the conductive metal particles oriented toward the frame plate. As a material constituting the frame plate 71, a thermal conductivity of 2.5 w/m·? or more is preferable. As a material constituting the frame plate exhibiting such thermal conductivity, a metal material or a non-metal material can be used as a non-metal material, and a material having a specific thermal conductivity can be obtained by mixing the sizing agent. For specific materials, metal materials or non-metal materials can be used. Metal materials can be used: gold, silver, copper, iron, nickel, cobalt or alloys thereof. Non-metallic materials can be used: resin materials with high mechanical strength such as polyimine resin, polyester resin, aromatic yttrium amine resin, polyamide resin, glass fiber reinforced epoxy resin, glass fiber reinforced polymer A composite resin material such as an ester resin or a glass fiber reinforced polyimide resin, or a metal material such as a phenol resin or an epoxy resin, or an inorganic material such as carbon fiber, cerium oxide, aluminum oxide or boron nitride. Composite resin materials to be mixed, etc., based on the viewpoint of a small thermal expansion coefficient, a composite resin material such as metal particles or carbon fibers, a polyimide material containing an inorganic material, a glass fiber reinforced epoxy resin-15-200845494, or the like A composite resin material such as an epoxy resin in which a nitride is a ruthenium is preferable. Further, the frame plate may be formed by forming a thermoconductive metal film formed of the above-described metal on at least one surface of a substrate formed of the above-mentioned resin material or composite resin material. Such an anisotropic conductive connector 1 can be manufactured, for example, as follows. Fig. 6 is a cross-sectional view showing the configuration of an example of a mold used for producing the heteroconductive connector of the present invention. This mold is composed of an upper mold 50 and a pair of lower molds 55 opposed to each other, and is formed on the molding surface of the upper mold 50 (below the sixth drawing) and the molding surface of the lower mold 55 (above the sixth drawing). A forming space 59 is formed between them. In the upper mold 50, the surface of the ferromagnetic substrate 51 (the lower surface in FIG. 6) is used for the connection conductive portion 1 1 and the ground for the purpose of the opposite-side conductive connector 1 〇 The ferromagnetic layer 52 is formed in the pattern of the pattern of the conductive portion 12, and a non-magnetic layer 53 having a thickness larger than that of the ferromagnetic layer 52 is formed outside the ferromagnetic layer 52, and the non-magnetic layer is formed by the non-magnetic layer. A step is formed between the 53 and the ferromagnetic layer 52, and a protruding portion 1 1 a for forming the connecting conductive portion 11 and a protruding portion 1 2 a for the grounding conductive portion 1 2 are formed on the forming surface of the upper mold 50. The recessed space is 5 2 a. On the other hand, in the lower mold 55, on the surface of the ferromagnetic substrate 56 (the upper surface in Fig. 6), the connecting conductive portion 1 1 and the connecting conductive member 1 in the opposite-side conductive connector 1 are used. A ferromagnetic layer 57 is formed in the pattern of the grounding conductive portion 1 2 of Figs. 16-200845494, and a non-magnetic layer 58 having a thickness larger than the ferromagnetic layer 57 is formed outside the ferromagnetic layer 57. By forming a step between the non-magnetic layer 58 and the ferromagnetic layer 57, a protruding portion 11a for forming the protruding portion 11a of the connecting conductive portion 11 and the grounding conductive portion 12 is formed on the molding surface of the lower mold 55. The recessed space 57a. For the materials of the ferromagnetic substrates 5 1 and 5 6 constituting the respective molds of the upper mold 50 lower mold 5 5 , ferromagnetic metals such as iron, iron-nickel alloy, iron-cobalt alloy, nickel, cobalt, or the like can be used. . The ferromagnetic substrate 5 1 and 56 preferably have a thickness of 〇·1 to 50 mm, a smooth surface, chemical degreasing treatment, and preferably a mechanical honing treatment. Further, as the material of the ferromagnetic layers 52 and 57 constituting each of the upper mold 50 and the lower mold 55, a ferromagnetic metal such as iron, iron-nickel alloy, iron-cobalt alloy, nickel or cobalt may be used. The ferromagnetic layers 52, 57 preferably have a thickness of 1 Ο μηη or more. When the thickness is less than 1 Ομηΐ, it is difficult to make a magnetic field having a sufficient intensity distribution for the layer of the forming material formed in the mold, and as a result, it should be a conductive for connection in the layer of the forming material. It is difficult to collect the conductive particles at a high density in the portion of the portion 1 1 and the grounding conductive portion 12, and it is not possible to obtain a good hetero-conductive connector, and the non-forms in the upper mold 50 and the lower mold 5 5 are not formed. The material of the magnetic layers 53 and 58 may be a non-magnetic metal such as copper or a polymer material having heat resistance. However, the non-magnetic layer 5 3 and 5 can be easily formed by a photo-etching method. The viewpoint of 8 is to use a polymer material which can be hardened by the radiation of -17-200845494, and the material can be used, for example, a propylene-based dry film resist, an epoxy-based liquid resist, and a poly A photoresist such as a liquid uranium-based uranium-based agent. Further, the thickness of the non-magnetic layer 58 in the lower mold 55 is set in accordance with the protruding height of the protruding portions Ua and 12a to be formed and the thickness of the ferromagnetic layer 57. The heteroconductive connector 1 is manufactured using the aforementioned mold, for example, as follows. First, as shown in Fig. 7, the frame-shaped spacers 54a and 54b and the frame plate 711 having the opening 73 and the positioning hole 72 shown in Figs. 4 and 5 are prepared. The frame-shaped spacers 54b are fixedly disposed at a specific position of the lower mold 55, and the frame-shaped spacers 54a are further disposed on the upper mold 50. On the other hand, a paste-shaped molding material is prepared by dispersing magnetically conductive particles in a curable polymer material forming material. Next, as shown in Fig. 8, the first molding material layer 61a is formed by filling the molding material in the space formed on the molding surface of the upper mold 50 by the spacer 54a. The second molding material layer 6 1 b is formed by filling the molding material into the space of the lower mold 55 by the spacer 54b and the frame plate 71. Further, as shown in Fig. 9, the first molding material layer 61a is laminated on the second molding material layer 61b by arranging the upper mold 50 on the frame plate 71. Then, by operating the electromagnet (not shown) on the lower surface of the ferromagnetic substrate 56 disposed on the upper surface of the ferromagnetic substrate 5 1 of the upper mold 50 and the lower surface of the ferromagnetic substrate 56 in the lower mold 55, a parallel magnetic field having an intensity distribution, that is, a parallel magnetic field having a large strength between the ferromagnetic layer 52 of the upper mold 50 and the ferromagnetic layer 57 corresponding to the lower mold 55 acts on the first molding material layer 6 1 a and The thickness direction of the second molding material layer 61b. As a result, in the first molding material layer 6 1 a and the second molding material layer 6 1 b, the conductive particles dispersed in the respective molding material layers are collected in the respective ferromagnetic layers 52 located in the upper mold 50 and corresponding thereto. The portion between the ferromagnetic layers 57 of the lower molds 5 is a portion for connecting the conductive portions 11 and the grounding conductive portions 12, and is arranged in the thickness direction of each of the forming material layers. Then, in this state, each of the molding material layers is formed by the hardening treatment, as shown in Fig. 1 , in which the conductive particles are closely packed in the elastic polymer substance in a state in which the conductive particles are aligned in the thickness direction. The connecting conductive portion η, the grounding conductive portion 1 2 and the ineffective conductive portion 13 , and the surrounding connecting conductive portion 1 1 , the grounding conductive portion 1 2 , and the ineffective conductive portion 13 are formed, and The isotropic conductive film 10A of the insulating portion 15 formed of an insulating elastic polymer material having no or almost no conductive particles, and the supported portion 30 of the peripheral portion of the frame plate 71 are electrically conductive The particles are closely packed in the heat transfer portion 31 in the elastic polymer material in a state in which the particles are aligned in the thickness direction. Then, the anisotropic conductive connector formed by the mold was taken out, and the heteroconductive connector 1 构造 having the structure shown in Fig. 1 was obtained. The above-mentioned hardening treatment of each of the molding material layers may be carried out while the parallel magnetic field is acting, or may be performed after the action of the parallel magnetic field -19-200845494 is stopped. In addition, it is also possible to repeat the action of the parallel magnetic field and divide it into a plurality of times, and the direction of action of the magnetic field can also be reversed by alternating the up and down direction. The strength of the parallel magnetic field acting on each of the forming material layers is preferably 20,000 to 1,000,000 / / τ. Further, a means for causing a parallel magnetic field to act on each of the layers of the forming material to use a permanent magnet instead of the electromagnet. The permanent magnet is preferably formed of a nickel-cobalt alloy (Fe-Al-Ni-C alloy), a ferrite magnet or the like based on the strength of the aforementioned parallel magnetic field. The hardening treatment of each of the molding material layers can be carried out by heat treatment, although it can be appropriately selected by the materials to be used. The specific addition and heating time are selected in consideration of the type of the polymer material or the like constituting the molding material layer, the time required for the movement of the conductive particles, and the like. 11 and 12 are explanatory views showing a schematic configuration of an example of a conductive structure in which a circuit device using the heterodyne connector of the present invention is connected to a circuit board. Fig. 11 is a plan view showing the hetero-conductive connector of Fig. 1 together with the signal electrode and the ground electrode of the device to be inspected, and the drawing shows the hetero-conductive connector and the circuit device of Fig. 1, The circuit shows the D-D profile together. In the circuit device 1, four electrodes are formed as shown in Fig. 13, and four ground electrodes which are coaxially formed on the outer side of the signal electrode are provided for the respective signal electrodes. ○ -20 -20 -20 -20 -20 -20 -20 -20 -20 -20 -20 -20 -20 -20 -20 -20 -20 -20 -20 -20 -20 -20 -20 -20 -20 -20 -20 -20 -20 -20 -20 -20 -20 -20 -20 The connection electrode 5 disposed in the pattern of the electrode 2 is provided with a ground electrode 6 disposed at a position where the ground electrode 3 of the circuit device 1 is connected. The connection electrode 5 is connected by a circuit 7. The grounding electrode 6 is provided with one of the coaxial ground electrodes 3 formed in the circuit device 1, and four grounding electrodes 6 are disposed, and a total of 16 grounding electrodes 6 are formed. The grounding electrode 6 is connected by the ground wiring 8. Further, the heteroconductive connector 1 构成 having the configuration shown in Figs. 1 to 3 is disposed on the surface of the circuit board 4. Specifically, the guide pin 9 is inserted by the positioning hole 72 (refer to FIGS. 1 to 3) of the frame plate 7 1 formed in the anisotropic conductive connector 10, so that the conductive film 10A is formed. The connection conductive portion 1 1 and the ground conductive portion 12 are positioned on the connection electrode 5 and the ground electrode 6, and the isotropic conductive connector 10 is fixed to the surface of the circuit board 4. Then, the above-described circuit device 1 is placed on the surface of the heteroconductive connector 1 。. Specifically, the connection conductive portion 1 1 and the ground conductive portion 12 in the rectangular conductive film 1 a of the anisotropic conductive connector 10 are individually connected to the signal electrode 2 and the ground electrode of the circuit device 1 The way of 3 is layered. In this state, the signal electrodes of the circuit device 1 are electrically connected to the connection electrodes of the circuit board 4 via the connection conductive portions 11 of the hetero-conductive connectors, and the coaxial ground electrodes of the circuit device 1 are connected. 3. It is electrically connected to the four grounding electrodes 6 of the circuit board 21 - 200845494 5 by the four connecting conductive portions of the heteroconductive connector. Then, the circuit device 1 is pressed against the circuit board 4 via the dissimilar conductive connector, and the peripheral portion of the circuit device 1 is followed by the anisotropic conductive connector 1 and the circuit board 4 by an adhesive or the like. A conductive-connected structure is formed. . In this state, the dissimilar conductive film 1 a of the dissimilar conductive connector and the heat conducting portion 31 I existing in the support portion 30 formed by the frame plate 71 are fixed in a state of being connected to the circuit device. The heat generated in the circuit device 1 is efficiently radiated to the frame plate 71 via the heat conduction portion 31, and is efficiently dissipated from the support portion 30 of the foreign conductive connector 10 via the frame plate 71. It is on the outer peripheral portion of the frame plate 71. Fig. 14 is a schematic explanatory view showing the configuration of another example of the heteroconductive connector and the electrically conductive connection structure of the present invention. In the heteroconductive connector 1 ,, the heat radiating fins 35 are connected to the outer peripheral portion of the frame plate 71. φ By the heat dissipation fins 35, the heat generated by the circuit device 1 is dissipated to the frame plate 71 through the heat conduction portion 31 formed on the support portion 30 of the anisotropic conductive connector 1 The heat radiating to the outer peripheral portion of the frame plate 7 1 is radiated to the outer portion by the heat radiating fins 35 connected to the outer peripheral portion of the frame plate 71, and the heat dissipation efficiency is good, so that the circuit device 1 can be efficiently The heat generated is removed. Fig. 15 is a cross-sectional view showing the configuration of the second example of the heteroconductive connector of the present invention. In the hetero-conducting connector 10 of the second example, a plurality of openings 73 are formed in the frame plate 71 according to the pattern of the electrodes in the circuit device, such as the signal electrode and the ground electrode, in accordance with the corresponding -22-200845494. The isotropic conductive film 10A is in a state in which each of the connecting conductive portion 1 1 , the grounding conductive portion 1 2 , and the ineffective conductive portion 13 is located in the opening 73 of the frame plate 7 1 to cover the frame plate 71 Each of the openings 73 is configured in a manner. 31 series heat conduction • Department. The frame plate 7 1 is composed of a base body 7 1 A formed of a resin material or a composite resin material, and a thermally conductive metal film 7 1 B formed on one side of the base body 7 i A, and a thermally conductive metal film. 7 The ib-based and the conductive film 1 〇A and the grounding conductive portion 12 are insulated. As the resin material constituting the substrate 7 1 A, a resin material having high mechanical strength such as a polyimide resin, a polyester resin, an aromatic polyamide resin or a polyamide resin can be used. In addition, 'composite resin materials can be used: composite resin materials such as glass fiber reinforced ring φ oxygen resin, glass fiber reinforced polyester resin, glass fiber reinforced polyimide resin, etc., in phenol resin, epoxy resin, etc. Metal particles or composite materials such as carbon fibers, cerium oxide, aluminum oxide, and boron nitride, which are mixed into a composite resin material, are based on a small thermal expansion coefficient, and are made of metal particles or carbon fibers, and inorganic materials. A composite resin material such as an imide resin or a glass fiber reinforced epoxy resin, or a composite resin material such as an epoxy resin mixed with a boron nitride as a ruthenium is preferable. As the thermally conductive metal film 71B, gold, silver, copper, -23-200845494 iron, nickel, cobalt or an alloy thereof can be used. Such a frame plate 71 can be prepared by forming a laminated material formed of a metal film on the surface of a substrate formed of a resin material or a composite resin material, and etching the metal film in the laminated material according to a desired pattern. - Processing, and manufacturing by forming an opening in the - substrate by laser processing, drilling, or stamping. The isotropic conductive film 1 〇 A is basically configured in the same manner as the 0 heteroconductive film in the heteroconductive connector of the first example. According to the hetero-conductivity connector 10, a thermally conductive metal film 71B is formed on the frame plate 71, and the opening 73 of the frame plate 71 is formed in accordance with the pattern of the electrode in the corresponding connection circuit device. The heat generated by the circuit device can be efficiently dissipated. Fig. 16 is a cross-sectional view for explaining the configuration of the third example of the heteroconductive connector of the present invention. The foreign conductive connector 10 of the third example is formed by a sheet-like φ connector element 40 and an isotropic conductive film 10A formed integrally with each of both surfaces of the connector element 40. Composition. The connector element 40 is disposed on the insulating thin film 41 and in the thickness direction of the insulating thin film 41 by the insulating sheet 41 and the pattern corresponding to the signal electrode in the circuit device to be connected. The electrode assembly 42 for connection that is extended and the ground electrode structure 43 that is disposed in the insulating sheet 4 1 and extends in the thickness direction of the insulating sheet 41 in accordance with the pattern of the ground electrode in the corresponding circuit device. And the power supply electrode structure which is disposed in the insulating sheet 4 1 in accordance with the pattern of the power source electrode in the circuit device to be connected, and which is extended in the thickness direction of the insulating sheet 41 in the range of -24 to 44 200845494. Each of the connection electrode structures 42 is formed such that the electrode portions 42a exposing one surface of the insulating sheet and the other surface of the insulating sheet are integrally connected by a short-circuit portion 42b extending through the thickness direction of the insulating sheet 41. The ground electrode structure 43 and the power source electrode structure 44 are also configured in the same manner as the electrode structure 42 for connection. The connection electrode structure 42, the ground electrode structure 43, and the electric electrode structure 44) are collectively referred to as "electrode structures", and can be formed, for example, by a plating process. Further, on one surface of the insulating sheet 41, in a state of being in contact with the electrode structure, a region other than the region in which the electrode structure is disposed on one surface of the insulating sheet 4 1 is formed. The conductive metal film 45 and the ground wiring metal film 46 that electrically connects the respective phases of the ground electrode structure 43 and the power supply wiring metal film 47 that electrically connect the power supply electrode structures 44 to each other. Each of the heat conduction metal film 45, the ground wiring metal film 46, and the power supply line metal film 47 can be prepared as a laminated material formed of a metal film of the insulating sheet 41, and laminated. In the material, the metal film 'is formed by etching in accordance with a desired pattern to form a material constituting the insulating sheet 41, and polyimine, polyester resin, or aromatic polyamide resin can be used. A composite material such as a resin material such as a polyamide resin, a glass fiber reinforced epoxy resin, a glass fiber strong polyester resin, or a glass fiber reinforced polyimide resin, and the like 〇 强 强 -25 - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - Composite resin materials, etc., based on the viewpoint of a small thermal expansion coefficient, a composite resin material such as metal particles or carbon fibers, a polyimide material to which an inorganic material is added, or a glass fiber reinforced epoxy resin. , Chen boron nitride is mixed into the filling material of the composite resin material such as epoxy being preferred. As the material constituting the electrode structure, gold, silver, copper, iron, nickel, or an alloy of these or the like can be used. Each of the individual conductive films 10A is provided by the connection conductive portion 11 disposed on the connection electrode structure 42 of the connector element 40 and the ground electrode assembly 43 located on the connector element 40. The grounding conductive portion 12 and the power supply conductive portion disposed on the power supply electrode assembly 44 of the connector element 40 are disposed! 4. And the insulating portion 15 which is insulated from each other. The other configuration of the isotropic conductive film 1 〇 a is substantially the same as that of the hetero-conductive film of the hetero-conductive connector of the first example. According to the hetero-conducting connector 1 〇, the metal element 46 for heat conduction is formed in the connector element 40, so that the heat generated by the circuit device can be radiated to the circuit device in the horizontal direction via the connector element 40. Further, the ground electrode structures 43 and the power source electrode structures 44 are electrically connected to each other, and it is possible to suppress excessive current from passing through a specific ground electrode or a specific power source electrode in the circuit device, thereby preventing excessive current Or damage to the circuit in the circuit device, damage or melting of the electrode of the circuit device, damage to the grounding conductive portion 12 or the power supply conductive portion 14 in the foreign conductive film 10A due to the heat generated thereby. -26- 200845494 In the present invention, the present invention is not limited to the above-described embodiment, and various modifications can be added. (1) The heteroconductive connector of the present invention can be used as an electrically conductive connection structure used in a state in which a circuit device and a circuit board are integrally connected. It can also be used for electrical inspection of a circuit device. (2) It is not necessary to provide a heat dissipating mechanism to the frame plate of the dissimilar conductive connector, even if it is constituted only by the frame plate. (3) A heat dissipating mechanism provided on the frame plate of the dissimilar conductive connector may be a mechanism for forcibly cooling the fins or the circulation mechanism of the coolant other than the fins. (4) The connecting conductive portion 1 1 , the grounding conductive portion 1 2 , the ineffective conductive portion 13 , and the heat conducting portion 3 1 may each be formed of the same diameter or different diameters, and the arrangement pitch may be constant, and each may have a different pitch. The conductive particles forming the heat conducting portion 31 and the conductive particles forming the connecting conductive portion 1 1 , the grounding conductive portion 12 , and the ineffective conductive portion 13 may be the same type or different. Type. (6) The heat-conducting portion 31 may be formed of insulating particles having good heat conductivity or short fibers such as carbon fibers without using conductive particles. When the heat conducting portion 31 is formed by using such particles or short fibers, for example, the foreign conductive film 1 〇 A can be produced by the above method, and then formed by embedding particles or short fibers by the supporting portion 30. (7) The circuit device 1 to be connected to the conductive connection structure of the present invention is not particularly limited, and various elements can be used, for example, -27-200845494: transistor, diode, relay, switch, memory Active parts, resistors, capacitors, crystal resonators, speakers, microphones formed by 1C chips or LSI chips or their packages or semiconductor devices such as SiP (SysteminaPackage), Soc (Systemon Chip), MCM (MultiChipModule), etc. A passive panel such as an inverter (coil) or an inductor, a display panel such as a TFT liquid crystal display panel, an STN liquid crystal display panel, a plasma display panel, or an electroluminescence panel. (8) In the heteroconductive conductive connectors of the first and second examples, the heteroconductive film has a plurality of conductive portions for power supply arranged in accordance with a pattern of power supply electrodes in the circuit device to be connected, Each of the conductive portions for the power source can be insulated from each other by the insulating portion. (9) In the heteroconductive conductive connectors of the first and second examples, the heteroconductive film has a pattern corresponding to a power supply electrode to be connected to the circuit device, for example, formed in an anisotropic conductive film. Each of the plurality of power supply conductive portions that are electrically connected to each other by a printed wiring on the surface, and each of the power supply conductive portions may be insulated from each of the connection conductive portion and the ground conductive portion by an insulating portion. (1) In the rectangular conductive connector of the first and second examples, the foreign conductive film has a grounding conductive portion electrically connected to each other by a printed wiring formed on the surface thereof, and And a plurality of power supply conductive portions that are electrically connected to each other by a pattern of a power supply electrode to be connected to the circuit device, for example, a conductive portion formed by a printed wiring formed on a surface of the opposite conductive film, and the conductive portion for the power supply Each of the 'can be insulated from the connection conductive portion and the ground conductive portion by the insulating portion. -28 - 200845494 BRIEF DESCRIPTION OF THE DRAWINGS Fig. 1 is a plan view showing a first example of the heteroconductive connector of the present invention. Fig. 2 is a cross-sectional view taken along the line A-A of the heteroconductive connector shown in Fig. 1. Fig. 3 is a cross-sectional view for explaining a part of the heteroconductive connector shown in Fig. 1 in an enlarged manner. Fig. 4 is a plan view showing a frame plate in the heteroconductive connector shown in Fig. 1. Figure 5 is a B-B cross-sectional view of the frame plate of Figure 4. Fig. 6 is a cross-sectional explanatory view showing the configuration of an example of a mold for forming an isotropic conductive film. Fig. 7 is a cross-sectional view for explaining the state in which the spacer and the frame plate are placed on the molding surface of the lower mold. Fig. 8 is a cross-sectional view showing the state in which the first molding material layer is formed on the molding surface of the upper mold and the second molding material layer is formed on the molding surface of the lower mold. Fig. 9 is a cross-sectional view for explaining the state in which the first molding material layer and the second molding material layer are laminated. Fig. 10 is a cross-sectional view for explaining the state in which the heteroconductive film is formed. Fig. 1 is a plan view showing the configuration of an electrically conductive connection structure of the present invention together with a circuit device. Fig. 12 is a cross-sectional view showing the configuration of the conductive connecting structure shown in Fig. 11 and the circuit device and the circuit board of the -29-200845494. Fig. 13(a) is a plan view of the circuit device in the electrically conductive connection structure shown in Fig. 11, and Fig. 13(b) is a C-C sectional view of the circuit device shown in Fig. 12(a). Fig. 14 is a cross-sectional view for explaining the configuration of the other embodiment of the electrically conductive connection structure of the present invention together with the circuit device and the circuit board. Fig. 15 is a cross-sectional view showing the second example of the heteroconductive connector of the present invention. Fig. 16 is a cross-sectional view for explaining the configuration of a third example of the heteroconductive connector of the present invention. [Description of main component symbols] 1 · Circuit device ' 2 : Signal electrode, 3 : Ground electrode, 4 : Circuit board, 5 : Connection electrode, 6 : Grounding electrode, 7 : Circuit, 8 : Ground wiring, 9 : Guide Lead pin, 1 〇: Heterogeneous conductive connector, 丨〇a ··Different square conductive film, 1 1 : Connecting conductive part, 1 1 a : protruding part, 1 2 : Grounding conductive part, 12a: Projection, 13: Invalid conductive part, 14: Conductive part for power supply, 1 5 · Insulation part, 3 0 · · Supported part, 3 1 : Heat conduction part, 35 : Heat sink fin, 40: Connector element, 41: insulating sheet, '42: connection electrode structure, 42a: electrode part, 42b: short-circuit part, 43: ground electrode structure, 44: power supply electrode structure, 45: heat conduction metal film, 46: Metal film for ground wiring, 47: metal film for power supply wiring, 50: upper mold, 51 · ferromagnetic substrate, 5 2 · ferromagnetic layer, 5 2a : recess space, 53 : non-magnetic layer, 54a, 54b: spacers -30 - 200845494
，5 5 :下模，5 6 :強磁性體基板，5 7 :強磁性體層， 5 7a :凹部空間，58 :非磁性體層，59 :成形空間， 61 a :第1成形材料層，61 b :第2成形材料層，71 :框架 板，7 1 A :基體，71 B :熱傳導性金屬膜，72 :定位孔， 73 :開口。 -31 -, 5 5 : lower mold, 5 6 : ferromagnetic substrate, 5 7 : ferromagnetic layer, 5 7a : recess space, 58 : non-magnetic layer, 59 : forming space, 61 a : first forming material layer, 61 b : second molding material layer, 71: frame plate, 7 1 A: substrate, 71 B: thermally conductive metal film, 72: positioning hole, 73: opening. -31 -