CN101666924A - Connecting method of camera with liquid crystal display equipment and equipment - Google Patents

Connecting method of camera with liquid crystal display equipment and equipment Download PDF

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Publication number
CN101666924A
CN101666924A CN200910093434A CN200910093434A CN101666924A CN 101666924 A CN101666924 A CN 101666924A CN 200910093434 A CN200910093434 A CN 200910093434A CN 200910093434 A CN200910093434 A CN 200910093434A CN 101666924 A CN101666924 A CN 101666924A
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CN
China
Prior art keywords
lcd
camera module
chip
driving
ito
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Pending
Application number
CN200910093434A
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Chinese (zh)
Inventor
曲中奎
夏欢林
秦丽芳
韩文军
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ZTE Corp
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ZTE Corp
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Publication date
Application filed by ZTE Corp filed Critical ZTE Corp
Priority to CN200910093434A priority Critical patent/CN101666924A/en
Publication of CN101666924A publication Critical patent/CN101666924A/en
Priority to PCT/CN2010/074690 priority patent/WO2011032415A1/en
Pending legal-status Critical Current

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    • HELECTRICITY
    • H04ELECTRIC COMMUNICATION TECHNIQUE
    • H04MTELEPHONIC COMMUNICATION
    • H04M1/00Substation equipment, e.g. for use by subscribers
    • H04M1/02Constructional features of telephone sets
    • H04M1/0202Portable telephone sets, e.g. cordless phones, mobile phones or bar type handsets
    • H04M1/026Details of the structure or mounting of specific components
    • H04M1/0264Details of the structure or mounting of specific components for a camera module assembly

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  • Engineering & Computer Science (AREA)
  • Signal Processing (AREA)
  • Studio Devices (AREA)
  • Telephone Set Structure (AREA)

Abstract

The invention discloses a connecting method of a camera with liquid crystal display equipment, comprising the step that a camera module assembly is connected with a driver chip or a control mainboardof a liquid crystal display (LCD) through an indium tin oxide (ITO) on the LCD by routing cables. The invention also discloses equipment with the camera and the LCD, which is characterized in that thecamera module assembly is connected with the driver chip or the control mainboard of the LCD through the ITO on the LCD by routing cables. The ITO routing cables on the LCD of hand-held equipment isarranged on the LCD of the hand-held equipment, therefore, a wiring problem cannot be caused, the ITO routing cables do not occupy the volume of the housing of the hand-held equipment, the ITO routingcables are not interfered by a radio-frequency signal wire of the hand-held equipment or other data wires, furthermore, the whole size of the hand-held equipment is smaller and the display effect ofthe LCD of the hand-held equipment can be influenced.

Description

Method of attachment and equipment with camera of liquid crystal display equipment
Technical field
The present invention relates to the interconnection technique of mobile phone cam, relate in particular to a kind of method of attachment of the camera with liquid crystal display equipment and utilize aforementioned method of attachment connection device.
Background technology
At present, LCDs (LCD, Liquid Crystal Display Panel), become the most a kind of display of configuration in the handheld device such as current phone, and camera also becomes a kind of standard configuration of some handheld devices such as mobile phone, MP4 gradually because of its power consumption is little.The screen of handheld devices such as mobile phone and MP4 is to develop toward the high-resolution direction of large scale always at present, and along with the progress of society, the consumer is also more and more to the requirement of the function of these handheld devices, with the mobile phone is example, various processing modules in the mobile phone are integrated in slight mobile phone the inside, must cause the space in the hand set machine shell more and more littler, and the long-pending little requirement of consumer adversary's body is also more and more harsher, each cun space of saving in the mobile phone all seems extremely important.At present, mobile phone cam generally is that the connector by special use is connected on the cell phone mainboard, and the volume of special-purpose connector and special-purpose connector and the connecting line between the mainboard all will take bigger space.Another kind of processing mode is by surface mounting technology (SMT with mobile phone cam, Surface Mounted Technology) is welded on the cell phone mainboard, because the space in the hand set machine shell is limited, it is a lot of to add the inner cabling of cell phone mainboard, the welding difficulty is very big, and need very high solder technology, increased the cost of mobile phone undoubtedly.
The method that is connected to cell phone mainboard of above-mentioned existing mobile phone cam, also there is a serious problem, that is: because the inner cabling of cell phone mainboard is a lot, the rf signal line of mobile phone is easy to the camera module is produced interference, can make to produce the ripples line on the display screen of camera module when preview mode and exposal model, have a strong impact on user's experience.Same problem also can appear in other handheld devices, in personal digital assistant PDA etc.
Summary of the invention
In view of this, fundamental purpose of the present invention is to provide a kind of method of attachment of the camera with liquid crystal display equipment and has camera and the equipment of LCDs, can make the littler and radiofrequency signal of the equipment volume with camera and LCDs can not have influence on the display effect of camera module.
For achieving the above object, technical scheme of the present invention is achieved in that
A kind of method of attachment with camera of liquid crystal display equipment comprises:
Be connected by the indium tin oxide ITO cabling on the LCD between the chip for driving of camera module and LCDs LCD or the control main board.
Preferably, be connected by the ITO cabling on the LCD between the chip for driving of camera module and LCD or the control main board, comprise:
On the LCD that described camera module is installed in, on the ITO of the glass substrate of LCD, etch the circuit that described camera module is connected with chip for driving or the control main board of LCD.
Preferably, on the LCD that the mode that described camera module welds by hot pressing is installed in, the solder joint of welding is positioned at a side of described camera module.
Preferably, when described camera module is connected by the ITO cabling on the LCD with the chip for driving of LCD, as the chip for driving of described camera module, described control main board is connected with the chip for driving of described LCD by flexible circuit board the chip for driving of described LCD simultaneously; The chip for driving of described control main board by described LCD is to described camera module sending controling instruction.
Preferably, when described camera module was connected by the ITO cabling on the LCD with control main board, described control main board was connected with described LCD by flexible circuit board, and passed through described ITO cabling directly to described camera module sending controling instruction.
A kind of equipment with camera and LCDs is connected by the ITO cabling on the LCD between the chip for driving of described camera module and LCD or the control main board.
Preferably, be connected by the ITO cabling on the LCD between the chip for driving of described camera module and LCD or the control main board, comprise:
On the LCD that described camera module is installed in, on the ITO of the glass substrate of LCD, etch the circuit that described camera module is connected with chip for driving or the control main board of LCD.
Preferably, on the LCD that the mode that described camera module welds by hot pressing is installed in, the solder joint of welding is positioned at a side of described camera module.
Preferably, when described camera module is connected by the ITO cabling on the LCD with the chip for driving of LCD, as the chip for driving of described camera module, described control main board is connected with the chip for driving of described LCD by flexible circuit board the chip for driving of described LCD simultaneously; The chip for driving of described control main board by described LCD is to described camera module sending controling instruction.
Preferably, when described camera module was connected by the ITO cabling on the LCD with control main board, described control main board was connected with described LCD by flexible circuit board, and passed through described ITO cabling directly to described camera module sending controling instruction.
Among the present invention, camera is installed on the LCD of handheld device, by the ITO on the LCD of handheld device the handheld device mainboard is connected with the camera module of handheld device, because the ITO cabling on the LCD of handheld device is on the LCD of handheld device, can not produce the volume that wiring problem and this ITO cabling do not take the handheld device casing, this ITO cabling more can not be subjected to the interference of handheld device rf signal line or other data lines, therefore, can make the overall volume of handheld device littler and can not have influence on the display effect of handheld device LCDs.Therefore the present invention, for the handheld device mainboard has been saved structure space, and has reduced the cabling of handheld device mainboard because the camera module has been installed on the LCD, the appearance of the screen horizontal stripe when having avoided the handheld device shooting.
Description of drawings
Fig. 1 is present mobile phone cam distribution schematic diagram;
Fig. 2 is a mobile phone cam distribution schematic diagram of the present invention;
Fig. 3 is the syndeton synoptic diagram of mobile phone cam of the present invention and cell phone mainboard;
Fig. 4 is the solder joint distribution schematic diagram of camera module of the present invention;
Fig. 5 is the structural representation of cell phone mainboard control camera module of the present invention;
Fig. 6 is another structural representation of cell phone mainboard control camera module of the present invention.
Embodiment
Basic thought of the present invention is: camera is installed on the LCD of handheld device, by the ITO on the LCD of handheld device the handheld device mainboard is connected with the camera module of handheld device, because the ITO cabling on the LCD of handheld device is on the LCD of handheld device, can not produce the volume that wiring problem and this ITO cabling do not take the handheld device casing, this ITO cabling more can not be subjected to the interference of handheld device rf signal line or other data lines, therefore, can make the overall volume of handheld device littler and can not have influence on the display effect of handheld device LCDs.
For making the purpose, technical solutions and advantages of the present invention clearer, below be embodiment and with reference to accompanying drawing with the mobile phone in the handheld device, the present invention is described in more detail.
Fig. 1 is present mobile phone cam distribution schematic diagram, as shown in Figure 1, the camera 1 of at present traditional mobile phone generally be positioned at LCD of mobile phone 2 above or below (not shown), but the LCD2 of camera and mobile phone does not have tie point, generally directly be connected by corresponding data line with cell phone mainboard, because casing finite volume, inevitably can be equidistant nearer with audio frequency, the radio frequency line of mobile phone, will have influence on the display effect of camera, the installing of existing camera will take the bigger space of hand set machine shell.
Fig. 2 is a mobile phone cam distribution schematic diagram of the present invention, as shown in Figure 2, camera 1 of the present invention is positioned on the LCD 2, and links to each other with chip for driving 5 or the cell phone mainboard (not shown) of LCD 2 by indium tin oxide (ITO, the Indium Tin Oxide) cabling 4 on the LCD 2.Concrete connected mode will be described in detail hereinafter.
Fig. 3 is the syndeton synoptic diagram of mobile phone cam of the present invention and cell phone mainboard, as shown in Figure 3, mobile phone cam module 1 among the present invention is positioned on the glass substrate of LCD 2, and be fixed on the binding position 6 of camera, utilize conductive material ITO matured photoetching process on the LCD glass substrate, on ITO, etch ITO cabling 4 as shown in Figure 3 in advance, the ITO cabling 4 that etched is coupled together with the bottom solder joint of camera module 1 respectively.Concrete, camera module 1 can adopt the mode of hot pressing to be fixed on the glass substrate of LCD, (ACF, AnisotropicConductive adhesive Film) is bundled in camera module 1 on the binding position 6 of camera by the anisotropic conductive film on the LCD.
Fig. 4 is the solder joint distribution schematic diagram of camera module of the present invention, as shown in Figure 4, traditional solder joint generally be positioned at camera module bottom under, and the camera module generally adopts the mode of hot pressing to be connected with mainboard, like this, be easy to cause the damage of camera module, therefore, the present invention is extended to camera bottom solder joint as binding position 6 parts among Fig. 3 (among the figure shown in the dash area), thereby effectively prevent from pressure and the high temperature that produces in the camera module process is installed the infringement of having avoided hot press operation that camera is caused.
The control signal of camera is sent from cell phone mainboard, directly the camera module 1 on the glass substrate is controlled by the ITO cabling on the glass substrate 4.Cell phone mainboard utilizes the flexible circuit board (FPC from the LCD, Flexible Printed Circuit) 3 are connected with LCD and communicate by letter, control signal on the cell phone mainboard is connected on the LCD by FPC 3, then by the ITO cabling 4 on the LCD glass substrate, be connected respectively to LCD device drive chip and webcam driver chip (being arranged in camera module 1), thereby reach the purpose of cell phone mainboard control LCD and camera.Fig. 5 is the structural representation of cell phone mainboard control camera module of the present invention, as shown in Figure 5, the pin of respectively controlling on the cell phone mainboard is connected with each respective pin on the webcam driver chip with LCD device drive chip respectively, ways of connecting is that pin indicates identical interconnecting, and can realize the purpose of cell phone mainboard control LCD and camera.
Need to prove,, do not limit the particular location of camera module 1, only otherwise the demonstration that influences LCD gets final product as long as camera module 1 of the present invention is positioned on the LCD 2.
What above-mentioned facility scheme illustrated is the direct-connected mode of mobile phone cam and cell phone mainboard, the present invention also can directly be connected mobile phone cam with the LCD chip for driving, and webcam driver chip and LCD chip for driving integrated, main frame is by the control to the LCD chip for driving, realization is to the control of webcam driver chip, thereby realize control, below this technical scheme is described by concrete example to camera module of the present invention.In this example, camera module 1 is connected with LCD chip for driving (LCD driving IC), LCD driving IC and camera control IC is integrated, the shared IC of LCD and camera also controls the camera module.
Referring to shown in Figure 3, binding position 6 at the camera module, still utilize conductive material ITO matured photoetching process on the LCD glass substrate, on ITO, etch ITO cabling 4 as shown in FIG. in advance, LCD driving IC is coupled together with the bottom solder joint of shooting module, LCD driving IC and camera control IC integrate, the shared IC of LCD and camera, the camera mode of hot pressing, camera module 1 is bundled on the binding position 6 of glass substrate and camera by ACF (anisotropic conductive film), camera signals sends from cell phone mainboard, arrive integrated IC by FPC 3, and then directly the camera module on the glass substrate is controlled by the ITO cabling on the glass substrate 4.Pad between LCD driving IC and the camera module 1 is extended to 6 places, binding position as Fig. 3 with camera bottom solder joint as shown in Figure 4, thereby the pressure and the high temperature that prevent the pressure head that produces in the binding procedure cause damage to camera.
Fig. 6 is another structural representation of cell phone mainboard control camera module of the present invention, as shown in Figure 6, the present invention is sent by cell phone mainboard the control signal of camera module 1, send to by flexible circuit board on the drive IC of display, by the drive IC inside of display control signal is handled then and be decomposed into two paths of signals, wherein one the tunnel control LCD, another road control camera.Need to prove that the control pin on the cell phone mainboard is pressed the corresponding connection of the label shown in the figure with the pin on the drive IC of display, and the pin on the drive IC of display is connected with LCD, camera respectively and gets final product.
The present invention has put down in writing a kind of mobile phone simultaneously, includes camera, and camera wherein uses aforesaid side's method to be connected with cell phone mainboard or lcd driver.
Need to prove that above-mentioned is to be the explanation that example is carried out with the mobile phone, technical scheme of the present invention is equally applicable to PDA, the MP4 equal-volume is less and have in the handheld device of LCDs and camera, realizes identical in principle and the above-mentioned mobile phone example.
The above is preferred embodiment of the present invention only, is not to be used to limit protection scope of the present invention.

Claims (10)

1, a kind of method of attachment with camera of liquid crystal display equipment is characterized in that, comprising:
Be connected by the indium tin oxide ITO cabling on the LCD between the chip for driving of camera module and LCDs LCD or the control main board.
2, method according to claim 1 is characterized in that, is connected by the ITO cabling on the LCD between the chip for driving of camera module and LCD or the control main board, comprising:
On the LCD that described camera module is installed in, on the ITO of the glass substrate of LCD, etch the circuit that described camera module is connected with chip for driving or the control main board of LCD.
3, method according to claim 1 is characterized in that, on the LCD that the mode that described camera module welds by hot pressing is installed in, the solder joint of welding is positioned at a side of described camera module.
4, according to each described method in the claim 1 to 3, it is characterized in that, when described camera module is connected by the ITO cabling on the LCD with the chip for driving of LCD, as the chip for driving of described camera module, described control main board is connected with the chip for driving of described LCD by flexible circuit board the chip for driving of described LCD simultaneously; The chip for driving of described control main board by described LCD is to described camera module sending controling instruction.
5, according to each described method in the claim 1 to 3, it is characterized in that, when described camera module is connected by the ITO cabling on the LCD with control main board, described control main board is connected with described LCD by flexible circuit board, and passes through described ITO cabling directly to described camera module sending controling instruction.
6, a kind of equipment with camera and LCDs is characterized in that, is connected by the ITO cabling on the LCD between the chip for driving of described camera module and LCD or the control main board.
7, equipment according to claim 6 is characterized in that, is connected by the ITO cabling on the LCD between the chip for driving of described camera module and LCD or the control main board, comprising:
On the LCD that described camera module is installed in, on the ITO of the glass substrate of LCD, etch the circuit that described camera module is connected with chip for driving or the control main board of LCD.
8, equipment according to claim 6 is characterized in that, on the LCD that the mode that described camera module welds by hot pressing is installed in, the solder joint of welding is positioned at a side of described camera module.
9, according to each described equipment in the claim 6 to 8, it is characterized in that, when described camera module is connected by the ITO cabling on the LCD with the chip for driving of LCD, as the chip for driving of described camera module, described control main board is connected with the chip for driving of described LCD by flexible circuit board the chip for driving of described LCD simultaneously; The chip for driving of described control main board by described LCD is to described camera module sending controling instruction.
10, according to each described equipment in the claim 6 to 8, it is characterized in that, when described camera module is connected by the ITO cabling on the LCD with control main board, described control main board is connected with described LCD by flexible circuit board, and passes through described ITO cabling directly to described camera module sending controling instruction.
CN200910093434A 2009-09-21 2009-09-21 Connecting method of camera with liquid crystal display equipment and equipment Pending CN101666924A (en)

Priority Applications (2)

Application Number Priority Date Filing Date Title
CN200910093434A CN101666924A (en) 2009-09-21 2009-09-21 Connecting method of camera with liquid crystal display equipment and equipment
PCT/CN2010/074690 WO2011032415A1 (en) 2009-09-21 2010-06-29 Connection method for camera of device comprising liquid crystal display screen and device comprising camera and liquid crystal display screen

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CN200910093434A CN101666924A (en) 2009-09-21 2009-09-21 Connecting method of camera with liquid crystal display equipment and equipment

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Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2011032415A1 (en) * 2009-09-21 2011-03-24 中兴通讯股份有限公司 Connection method for camera of device comprising liquid crystal display screen and device comprising camera and liquid crystal display screen
CN102314005A (en) * 2010-06-29 2012-01-11 仁宝电脑工业股份有限公司 Display module
US8466999B2 (en) 2010-09-17 2013-06-18 Au Optronics Corporation Display having image capture apparatus
CN104052838A (en) * 2013-03-12 2014-09-17 三星电子株式会社 Electronic device having display module

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* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR100556849B1 (en) * 2003-05-13 2006-03-10 엘지전자 주식회사 Camera module connecting apparatus of mobile phone
JP2007018938A (en) * 2005-07-08 2007-01-25 Fci Asia Technology Pte Ltd Contact with latch mechanism
JP2007199460A (en) * 2006-01-27 2007-08-09 Canon Inc Display device and optical equipment
JP2010133706A (en) * 2007-03-19 2010-06-17 Jsr Corp Anisotropically conductive connector and conductive connecting structure
CN201127096Y (en) * 2007-08-28 2008-10-01 希姆通信息技术(上海)有限公司 Broad screen touch pure plane music mobile phone
CN101335779B (en) * 2008-07-23 2011-03-09 Tcl天一移动通信(深圳)有限公司 Welding construction of mobile phone camera and implementing method
CN101666924A (en) * 2009-09-21 2010-03-10 中兴通讯股份有限公司 Connecting method of camera with liquid crystal display equipment and equipment

Cited By (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2011032415A1 (en) * 2009-09-21 2011-03-24 中兴通讯股份有限公司 Connection method for camera of device comprising liquid crystal display screen and device comprising camera and liquid crystal display screen
CN102314005A (en) * 2010-06-29 2012-01-11 仁宝电脑工业股份有限公司 Display module
CN102314005B (en) * 2010-06-29 2016-01-20 仁宝电脑工业股份有限公司 Display device
US8466999B2 (en) 2010-09-17 2013-06-18 Au Optronics Corporation Display having image capture apparatus
CN104052838A (en) * 2013-03-12 2014-09-17 三星电子株式会社 Electronic device having display module
US20140267990A1 (en) * 2013-03-12 2014-09-18 Samsung Electronics Co., Ltd. Electronic device having display module
US9736956B2 (en) * 2013-03-12 2017-08-15 Samsung Electronics Co., Ltd. Electronic device having display module
CN109688245A (en) * 2013-03-12 2019-04-26 三星电子株式会社 Electronic device with display module

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Application publication date: 20100310