WO2011027958A1 - Apparatus for forming solder bumps - Google Patents

Apparatus for forming solder bumps Download PDF

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Publication number
WO2011027958A1
WO2011027958A1 PCT/KR2010/002955 KR2010002955W WO2011027958A1 WO 2011027958 A1 WO2011027958 A1 WO 2011027958A1 KR 2010002955 W KR2010002955 W KR 2010002955W WO 2011027958 A1 WO2011027958 A1 WO 2011027958A1
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WO
WIPO (PCT)
Prior art keywords
solder
chuck
wafer
container
forming apparatus
Prior art date
Application number
PCT/KR2010/002955
Other languages
French (fr)
Korean (ko)
Inventor
엄기상
임철영
Original Assignee
세크론 주식회사
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Application filed by 세크론 주식회사 filed Critical 세크론 주식회사
Publication of WO2011027958A1 publication Critical patent/WO2011027958A1/en

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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L24/10—Bump connectors ; Manufacturing methods related thereto
    • H01L24/11—Manufacturing methods
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K1/00—Soldering, e.g. brazing, or unsoldering
    • B23K1/0008—Soldering, e.g. brazing, or unsoldering specially adapted for particular articles or work
    • B23K1/0016—Brazing of electronic components
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K3/00—Tools, devices, or special appurtenances for soldering, e.g. brazing, or unsoldering, not specially adapted for particular methods
    • B23K3/06—Solder feeding devices; Solder melting pans
    • B23K3/0607—Solder feeding devices
    • B23K3/0623—Solder feeding devices for shaped solder piece feeding, e.g. preforms, bumps, balls, pellets, droplets
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies
    • H01L24/741—Apparatus for manufacturing means for bonding, e.g. connectors
    • H01L24/742—Apparatus for manufacturing bump connectors
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K2101/00—Articles made by soldering, welding or cutting
    • B23K2101/36—Electric or electronic devices
    • B23K2101/42—Printed circuits
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/10—Bump connectors; Manufacturing methods related thereto
    • H01L2224/11—Manufacturing methods
    • H01L2224/11001—Involving a temporary auxiliary member not forming part of the manufacturing apparatus, e.g. removable or sacrificial coating, film or substrate
    • H01L2224/11003—Involving a temporary auxiliary member not forming part of the manufacturing apparatus, e.g. removable or sacrificial coating, film or substrate for holding or transferring the bump preform
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/10—Bump connectors; Manufacturing methods related thereto
    • H01L2224/11—Manufacturing methods
    • H01L2224/113—Manufacturing methods by local deposition of the material of the bump connector
    • H01L2224/1131—Manufacturing methods by local deposition of the material of the bump connector in liquid form
    • H01L2224/11318—Manufacturing methods by local deposition of the material of the bump connector in liquid form by dispensing droplets
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/10—Bump connectors; Manufacturing methods related thereto
    • H01L2224/11—Manufacturing methods
    • H01L2224/113—Manufacturing methods by local deposition of the material of the bump connector
    • H01L2224/1133—Manufacturing methods by local deposition of the material of the bump connector in solid form
    • H01L2224/11334—Manufacturing methods by local deposition of the material of the bump connector in solid form using preformed bumps
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/10—Bump connectors; Manufacturing methods related thereto
    • H01L2224/12—Structure, shape, material or disposition of the bump connectors prior to the connecting process
    • H01L2224/13—Structure, shape, material or disposition of the bump connectors prior to the connecting process of an individual bump connector
    • H01L2224/13001—Core members of the bump connector
    • H01L2224/13099—Material
    • H01L2224/131—Material with a principal constituent of the material being a metal or a metalloid, e.g. boron [B], silicon [Si], germanium [Ge], arsenic [As], antimony [Sb], tellurium [Te] and polonium [Po], and alloys thereof
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/93—Batch processes
    • H01L2224/94—Batch processes at wafer-level, i.e. with connecting carried out on a wafer comprising a plurality of undiced individual devices
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/00013—Fully indexed content
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01006—Carbon [C]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01033—Arsenic [As]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01047—Silver [Ag]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/013—Alloys
    • H01L2924/014—Solder alloys
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/095—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00 with a principal constituent of the material being a combination of two or more materials provided in the groups H01L2924/013 - H01L2924/0715
    • H01L2924/097—Glass-ceramics, e.g. devitrified glass
    • H01L2924/09701—Low temperature co-fired ceramic [LTCC]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/10—Details of semiconductor or other solid state devices to be connected
    • H01L2924/11—Device type
    • H01L2924/14—Integrated circuits

Definitions

  • Embodiments of the present invention relate to a solder bump forming apparatus. More particularly, it relates to an apparatus for forming spherical solder bumps on bump pads on a wafer in microelectronic packaging technology.
  • solder bumps are variously known. For example, electroplating, solder paste printing, evaporative dehydration, direct attachment of solder balls, and the like are known.
  • C4NP controlled collapse chip connection new process
  • spherical solder bumps are formed in the surface cavities of the template and the solder bumps are thermally attached to bump pads formed on the wafer.
  • the bump pads are connected to metal wires of an integrated circuit device such as a semiconductor chip formed on a wafer, and under bump metallurgy (UBM) pads may be provided on the bump pads.
  • UBM pads may be provided to improve adhesion between the solder bumps and bump pads.
  • the semiconductor chips of the wafer to which the solder bumps are transferred may be individualized by a dicing process.
  • the individualized semiconductor chip may be bonded onto a substrate through a thermocompression process and an under fill process, whereby a flip chip may be manufactured.
  • Molten solder may be injected into the surface cavities of the template to form the solder bumps and then solidified.
  • the solders injected into the cavities may be formed into spherical solder bumps through a reflow process, and may be transferred onto bump pads formed on the wafer.
  • a module for injecting the molten solder into the cavities of the template and a module for transferring the solder bumps from the template onto the wafer are required.
  • Embodiments of the present invention have an object of providing a device for forming solder bumps on a wafer having a simple structure and can reduce the time required for the solder bump forming process.
  • the solder bump forming apparatus includes a chuck supporting a wafer on which integrated circuit devices having bump pads are formed, an upper portion open to receive solder material, and a plurality of holes corresponding to the bump pads.
  • a container having a lower panel, a heater thermally connected to the container and a heater for melting the solder material, and a plurality of molten solder drops at the bottom of the holes by pressing molten solder in the container at the top of the container
  • the driving unit may be connected to the chuck.
  • the lower panel may have a plurality of openings corresponding to the integrated circuit elements, and the container may further include a plurality of blocks coupled to the openings.
  • the holes may be formed through the blocks.
  • a flux applying unit may be disposed between the container and the chuck so as to move the flux on the wafer.
  • the flux applying unit may be moved in the horizontal direction by the second drive unit.
  • an image acquisition unit for acquiring images of alignment marks on the lower panel of the vessel and alignment marks on the wafer to align the wafer and the vessel with each other between the vessel and the chuck.
  • This can be arranged to be movable.
  • the driving part may be connected with the chuck and move the chuck vertically to transfer the solder drops onto the bump pads and move the chuck horizontally to align the wafer and the container with each other.
  • the flux applying unit and the image acquisition unit may be moved in the horizontal direction by the second drive unit.
  • the solder bump forming apparatus since the solder bump forming apparatus has a greatly simplified structure compared to the prior art, it is possible to reduce the size and manufacturing cost of the solder bump forming apparatus.
  • the solder bump forming process performed using the solder bump forming apparatus can be very simple as compared with the prior art, the time required for forming the solder bumps can be greatly shortened.
  • FIG. 1 is a schematic diagram illustrating a solder bump forming apparatus according to an embodiment of the present invention.
  • FIG. 2 is a schematic cross-sectional view for describing an example of the lower panel shown in FIG. 1.
  • FIG. 3 is a partial cross-sectional perspective view for explaining the block illustrated in FIG. 2.
  • 4-6 are schematic diagrams for explaining a method of transferring solder bumps onto a wafer.
  • FIG. 7 is a schematic plan view for describing a second driver and an image acquisition unit of the solder bump forming apparatus illustrated in FIG. 1.
  • the element When an element is described as being disposed or connected on another element or layer, the element may be placed or connected directly on the other element, and other elements or layers may be placed therebetween. It may be. Alternatively, where one element is described as being directly disposed or connected on another element, there may be no other element between them. Similar reference numerals will be used throughout for similar elements, and the term “and / or” includes any one or more combinations of related items.
  • first, second, third, etc. may be used to describe various items such as various elements, compositions, regions, layers and / or parts, but the items are not limited by these terms. Will not. These terms are only used to distinguish one element from another. Accordingly, the first element, composition, region, layer or portion described below may be represented by the second element, composition, region, layer or portion without departing from the scope of the invention.
  • Embodiments of the invention are described with reference to cross-sectional illustrations that are schematic illustrations of ideal embodiments of the invention. Accordingly, changes from the shapes of the illustrations, such as changes in manufacturing methods and / or tolerances, are those that can be expected. Accordingly, embodiments of the present invention are not to be described as limited to the particular shapes of the areas described as the illustrations but to include deviations in the shapes. For example, a region described as flat may generally have roughness and / or nonlinear shapes. Also, the sharp edges described as illustrations may be rounded. Accordingly, the regions described in the figures are entirely schematic and their shapes are not intended to describe the precise shape of the regions nor are they intended to limit the scope of the invention.
  • FIG. 1 is a schematic diagram illustrating a solder bump forming apparatus according to an embodiment of the present invention.
  • the solder bump forming apparatus 100 may be used to form solder bumps on the wafer 10 in microelectronic packaging technology.
  • it can be used to form solder bumps 24 (see FIG. 6) having a spherical shape on the semiconductor wafer 10 on which integrated circuit elements 12 (see FIG. 7), such as semiconductor chips, are formed.
  • the solder bump forming apparatus 100 may include a chuck 110 supporting the wafer 10 and a container 120 accommodating the solder material 20.
  • the chuck 110 and the vessel 120 may face each other, for example, the chuck 110 may be disposed under the vessel 120.
  • the wafer 10 may be loaded onto the chuck 110 by a transfer robot (not shown), with the bump pads 12 (see FIG. 6) of the integrated circuit elements 12 facing up. It can be gripped on the chuck 110 by the vacuum pressure.
  • the container 120 has an open top and a lower panel 124 having a plurality of holes 122A corresponding to the bump pads 14 and sidewalls defining a space in which the solder material 20 is accommodated. 126).
  • FIG. 2 is a schematic cross-sectional view for describing an example of the lower panel shown in FIG. 1
  • FIG. 3 is a partial cross-sectional perspective view for explaining the block shown in FIG. 2.
  • the lower panel 124 of the vessel 120 corresponds to a plurality of integrated circuit elements 12 on the wafer 10. May have openings 124A, and blocks 122 having a plurality of holes 122A corresponding to the bump pads 14 may be coupled to the openings 124A, respectively.
  • the blocks 122 may be formed of glass or a ceramic material, and the holes 122A may be formed by laser processing.
  • the inner diameters of the holes 122A may be determined according to the size of the solder bumps 24 to be formed. For example, when the solder bumps 24 have a diameter of about 20 ⁇ m to 30 ⁇ m, the holes 122A are smaller than the diameter of the solder bumps 24, for example, about 5 ⁇ m to It may have an inner diameter of about 20 ⁇ m.
  • the outer surface of the block 122 and the inner surface of the openings 124A may be formed stepped for coupling, respectively.
  • the solder bump forming apparatus 100 may include a heater 130 that is thermally connected to the container 120 to melt the solder material 20.
  • the heater 130 may include an electric resistance heating wire embedded in the sidewall 126.
  • the heater 130 may be embedded in the lower panel 124 and disposed on the outer surfaces of the container 120. The heater 130 may heat the container 120 to a temperature above the melting point of the solder material 20 in order to melt the solder material 20.
  • the solder bump forming apparatus 100 discharges the molten solder 20 in the inner space of the container 120 through the holes 122A to form a plurality of molten solder droplets at the bottom of the holes 122A.
  • 4 may further include a press 140 for forming.
  • the press 140 may be inserted into the inner space of the container 120 and may include an upper panel 142 for pressing the molten solder 20.
  • the solder bump forming apparatus 100 may include a first driver 150 for providing a relative vertical motion between the chuck 110 and the container 120.
  • the first driving unit 150 may be connected to the chuck 110 or the container 120.
  • the first driver 150 may be connected to the chuck 110, and may adjust a gap between the wafer 10 and the container 120.
  • 4-6 are schematic diagrams for explaining a method of transferring solder bumps onto a wafer.
  • the first driver 150 moves the chuck 110 upward so that the bump pads 14 of the wafer 10 come into contact with the molten solder drops 22.
  • the chuck 110 may be moved downward so that the molten solder drops 22 may be transferred onto the bump pads 14 of the wafer 10.
  • the molten solder droplets 22 transferred onto the bump pads 14 may solidify as the temperature decreases, thus spherical solder bumps on the bump pads 14 of the wafer 10. Fields 24 may be formed.
  • each of the bump pads 14 on the wafer 10 may include a UBM pad (not shown) to improve the wetting force.
  • the molten solder drops 22 may contact the bump pads 14 of the wafer 10 moved upward by the first driver 150, and the bump pads 14 may be melted with the bump pads 14.
  • the bump pads 14 may be attached to the bump pads 14 by the wetting force between the solder drops 22.
  • the first driver 150 may move the chuck 110 downward.
  • the molten solder drops 22 may be separated from the blocks 122 of the lower panel 124 by the wetting force, and then solidified on the bump pads 14.
  • the chuck 110 may be thermally connected to a second heater (not shown) for controlling the temperature of the wafer 10.
  • the second heater may be used to maintain the wafer 10 at a temperature lower than the melting point of the solder material.
  • the second heater of the electric resistance heating wire type may be embedded in the chuck 110.
  • the solder bump forming apparatus 100 may include a flux applying unit 160 configured to be movable in a horizontal direction between the chuck 110 and the container 120.
  • the flux applying unit 160 may include a nozzle 162 disposed to face downward to apply flux onto the wafer 10 supported by the chuck 110, and the nozzle 162 may be a flux. It may be connected to a supply unit (not shown).
  • the nozzle 162 may be connected to the flux supply unit through a flux supply pipe (not shown), and an on / off valve (not shown) and a flow controller (not shown) may be installed in the pipe. Can be.
  • FIG. 7 is a schematic plan view for describing a second driver and an image acquisition unit of the solder bump forming apparatus illustrated in FIG. 1.
  • the flux applying unit 160 may be connected to the second driver 170, and may be moved in the horizontal direction by the second driver 170. That is, the flux coating unit 160 may be moved horizontally, for example, in a zigzag form, by the second driving unit 170 in order to uniformly apply the flux on the wafer 10.
  • a rectangular coordinate robot may be used as the second driver 170, and the second driver 170 may be disposed at the side of the chuck 110.
  • the image acquisition unit 180 may be used to align the wafer 10 and the container 120 with each other.
  • alignment marks (not shown) may be provided on the wafer 10 and the lower panel 124 of the container 120, respectively.
  • the image acquisition unit 180 acquires images of alignment marks on the wafer 10 and alignment marks on the lower panel 124 of the container 120, and transmits the acquired image information to a controller (not shown). do.
  • the controller may control the operation of the first driver 150 to align the wafer 10 and the container 120 with each other by analyzing the image information.
  • the first driving unit 150 may be configured to enable not only vertical driving of the chuck 110 but also horizontal driving of the chuck 110.
  • a three-axis Cartesian robot may be used as the first driver 150.
  • the image acquisition unit 180 may include an optical filter including a vision camera and a dichroic mirror and alignment marks on the lower panel 124 of the wafer 10 and the container 120. It may include a light fixture for illuminating them. In addition, the image acquisition unit 180 may be disposed on one side of the flux applying unit 160, and may be moved in the horizontal direction by the second driver 170.
  • the solder bump forming apparatus may include a chuck supporting the wafer and a container in which the molten solder is accommodated.
  • the molten solder may be discharged through a plurality of holes formed in the lower panel of the container by a press, and thus molten solder droplets may be formed in the lower portions of the holes.
  • the molten solder droplets may be transferred to the wafer ascending and descending by the chuck.
  • the solder bump forming apparatus has a greatly simplified structure compared with the related art, the size and manufacturing cost of the solder bump forming apparatus can be reduced.
  • the solder bump forming process performed using the solder bump forming apparatus can be very simple as compared with the prior art, the time required for forming the solder bumps can be greatly shortened.

Abstract

Disclosed is an apparatus for forming solder bumps on a wafer on which integrated circuit elements having bump pads are formed. In the apparatus, a wafer is supported by a chuck and a receptacle having an upper portion which opens for receiving solder materials and a lower panel including a plurality of holes corresponding to the bump pads is arranged at the upper part of the chuck. The solder materials are melted by a heater connected thermally with a receptacle and the melted solders are pressed by a press to form a plurality of melted solder drops in the lower part of the holes thereby. The wafer is moved upwardly by a driving unit so that the bump pads of the wafer come in contact with the solder drops. The wafer is moved downwardly by the driving unit so that the solder drops are transferred from the receptacle onto the bump pads.

Description

솔더 범프 형성 장치Solder bump forming device
본 발명의 실시예들은 솔더 범프 형성 장치에 관한 것이다. 보다 상세하게는, 마이크로 전자 패키징(microelectronic packaging) 기술에서 웨이퍼 상의 범프 패드들 상에 구형의 솔더 범프들을 형성하기 위한 장치에 관한 것이다.Embodiments of the present invention relate to a solder bump forming apparatus. More particularly, it relates to an apparatus for forming spherical solder bumps on bump pads on a wafer in microelectronic packaging technology.
최근 마이크로 전자 패키징 기술은 접속 방법에서 와이어 본딩으로부터 솔더 범프로 변화하고 있다. 솔더 범프를 이용하는 기술은 다양하게 알려져 있다. 예를 들면, 전기 도금, 솔더 페이스트 프린팅, 증발 탈수법, 솔더볼의 직접 부착 등이 알려져 있다.Recently, microelectronic packaging technology is changing from wire bonding to solder bumps in the connection method. Techniques for using solder bumps are variously known. For example, electroplating, solder paste printing, evaporative dehydration, direct attachment of solder balls, and the like are known.
특히, C4NP(controlled collapse chip connection new process) 기술은 낮은 비용으로 미세 피치를 구현할 수 있으며 반도체 장치의 신뢰도를 향상시킬 수 있다는 장점으로 인해 크게 주목받고 있다. 상기 C4NP 기술의 예는 미합중국 특허 제5,607,099호, 제5,775,569호, 제6,025,258호, 등에 개시되어 있다.In particular, C4NP (controlled collapse chip connection new process) technology has attracted much attention due to the advantages that can realize a fine pitch at a low cost and improve the reliability of the semiconductor device. Examples of such C4NP technology are disclosed in US Pat. Nos. 5,607,099, 5,775,569, 6,025,258, and the like.
상기 C4NP 기술에 의하면, 구형의 솔더 범프들은 템플릿의 표면 캐버티들 내에서 형성되며 상기 솔더 범프들은 웨이퍼 상에 형성된 범프 패드들 상에 열적으로 부착된다. 상기 범프 패드들은 웨이퍼 상에 형성된 반도체 칩과 같은 집적 회로 소자의 금속 배선들과 연결되어 있으며, 상기 범프 패드들 상에는 UBM(under bump metallurgy) 패드들이 구비될 수 있다. 상기 UBM 패드들은 상기 솔더 범프들과 범프 패드들 사이에서 접착력을 향상시키기 위하여 제공될 수 있다.According to the C4NP technique, spherical solder bumps are formed in the surface cavities of the template and the solder bumps are thermally attached to bump pads formed on the wafer. The bump pads are connected to metal wires of an integrated circuit device such as a semiconductor chip formed on a wafer, and under bump metallurgy (UBM) pads may be provided on the bump pads. The UBM pads may be provided to improve adhesion between the solder bumps and bump pads.
상기와 같이 솔더 범프들이 전달된 웨이퍼의 반도체 칩들은 다이싱 공정에 의해 개별화될 수 있다. 상기 개별화된 반도체 칩은 열압착 공정과 언더필(under fill) 공정을 통해 기판 상에 접합될 수 있으며, 이에 의해 플립칩이 제조될 수 있다.As described above, the semiconductor chips of the wafer to which the solder bumps are transferred may be individualized by a dicing process. The individualized semiconductor chip may be bonded onto a substrate through a thermocompression process and an under fill process, whereby a flip chip may be manufactured.
상기 솔더 범프들을 형성하기 위하여 상기 템플릿의 표면 캐버티들 내에는 용융된 솔더가 주입된 후 응고될 수 있다. 또한, 상기 캐버티들에 주입된 솔더들은 리플로우 공정을 통해 구형의 솔더 범프들로 형성될 수 있으며, 상기 웨이퍼 상에 형성된 범프 패드들 상으로 전달될 수 있다.Molten solder may be injected into the surface cavities of the template to form the solder bumps and then solidified. In addition, the solders injected into the cavities may be formed into spherical solder bumps through a reflow process, and may be transferred onto bump pads formed on the wafer.
상기와 같이 웨이퍼의 범프 패드들 상에 솔더 범프들을 형성하기 위하여는 상기 용융된 솔더를 템플릿의 캐버티들에 주입하는 모듈과 상기 템플릿으로부터 솔더 범프들을 웨이퍼 상으로 전달하는 모듈이 요구되며, 또한 상기 모듈들 사이에서 웨이퍼와 템플릿을 이송하는 모듈이 추가적으로 요구된다. 즉, 상기와 같이 다수의 모듈들이 요구되므로 솔더 범프 형성 장치의 크기를 감소시키기 어려우며 상기 솔더 범프 형성 장치의 제조 비용을 절감하기가 매우 어렵다. 또한, 상기 웨이퍼 상에 솔더 범프들을 형성하는데 소요되는 시간을 단축시키기 매우 어렵다.In order to form solder bumps on the bump pads of the wafer as described above, a module for injecting the molten solder into the cavities of the template and a module for transferring the solder bumps from the template onto the wafer are required. There is an additional need for a module to transfer wafers and templates between modules. That is, since a plurality of modules are required as described above, it is difficult to reduce the size of the solder bump forming apparatus and it is very difficult to reduce the manufacturing cost of the solder bump forming apparatus. In addition, it is very difficult to shorten the time required to form solder bumps on the wafer.
본 발명의 실시예들은 단순한 구조를 가지며 솔더 범프 형성 공정에 소요되는 시간을 단축시킬 수 있는 웨이퍼 상에 솔더 범프들을 형성하는 장치를 제공하는데 그 목적이 있다.Embodiments of the present invention have an object of providing a device for forming solder bumps on a wafer having a simple structure and can reduce the time required for the solder bump forming process.
본 발명의 실시예들에 따른 솔더 범프 형성 장치는, 범프 패드들을 갖는 집적 회로 소자들이 형성된 웨이퍼를 지지하는 척과, 솔더 물질을 수용하며 개방된 상부와 상기 범프 패드들과 대응하는 다수의 홀들이 형성된 하부 패널을 갖는 용기와, 상기 용기와 열적으로 연결되며 상기 솔더 물질을 용융시키기 위한 히터와, 상기 용기의 상부에서 상기 용기 내에서 용융된 솔더를 가압하여 상기 홀들의 하부에서 다수의 용융된 솔더 방울들을 형성하기 위한 프레스와, 상기 척 또는 상기 용기와 연결되어 상기 웨이퍼의 범프 패드들을 상기 솔더 방울들에 접촉시키고 상기 용기로부터 상기 솔더 방울들을 상기 범프 패드들 상으로 전달하기 위하여 상기 척과 상기 용기 사이의 간격을 조절하는 구동부를 포함할 수 있다.The solder bump forming apparatus according to the embodiments of the present invention includes a chuck supporting a wafer on which integrated circuit devices having bump pads are formed, an upper portion open to receive solder material, and a plurality of holes corresponding to the bump pads. A container having a lower panel, a heater thermally connected to the container and a heater for melting the solder material, and a plurality of molten solder drops at the bottom of the holes by pressing molten solder in the container at the top of the container A press between the chuck and the container in contact with the chuck or the container to contact the bump pads of the wafer with the solder drops and transfer the solder drops from the container onto the bump pads. It may include a drive for adjusting the spacing.
본 발명의 실시예들에 따르면, 상기 구동부는 상기 척과 연결될 수 있다.According to embodiments of the present invention, the driving unit may be connected to the chuck.
본 발명의 실시예들에 따르면, 상기 하부 패널은 상기 집적 회로 소자들과 대응하는 다수의 개구들을 가질 수 있으며, 상기 용기는 상기 개구들에 결합된 다수의 블록들을 더 포함할 수 있다. 여기서, 상기 홀들은 상기 블록들을 통해 형성될 수 있다.According to embodiments of the present invention, the lower panel may have a plurality of openings corresponding to the integrated circuit elements, and the container may further include a plurality of blocks coupled to the openings. Here, the holes may be formed through the blocks.
본 발명의 실시예들에 따르면, 상기 용기와 상기 척 사이에는 상기 웨이퍼 상에 플럭스를 도포하기 위하여 플럭스 도포 유닛이 이동 가능하도록 배치될 수 있다. 예를 들면, 상기 플럭스 도포 유닛은 제2 구동부에 의해 수평 방향으로 이동될 수 있다.According to embodiments of the present invention, a flux applying unit may be disposed between the container and the chuck so as to move the flux on the wafer. For example, the flux applying unit may be moved in the horizontal direction by the second drive unit.
본 발명의 실시예들에 따르면, 상기 용기와 상기 척 사이에는 상기 웨이퍼와 상기 용기를 서로 정렬하기 위하여 상기 용기의 하부 패널 상의 정렬 마크와 상기 웨이퍼 상의 정렬 마크에 대한 이미지들을 획득하기 위한 이미지 획득 유닛이 이동 가능하게 배치될 수 있다. 이 경우, 상기 구동부는 상기 척과 연결될 수 있으며 상기 솔더 방울들을 상기 범프 패드들 상으로 전달하기 위하여 상기 척을 수직 방향으로 이동시키고 상기 웨이퍼와 용기를 서로 정렬하기 위하여 상기 척을 수평 방향으로 이동시킬 수 있다. 또한, 상기 플럭스 도포 유닛 및 상기 이미지 획득 유닛은 제2 구동부에 의해 수평 방향으로 이동될 수 있다.According to embodiments of the present invention, an image acquisition unit for acquiring images of alignment marks on the lower panel of the vessel and alignment marks on the wafer to align the wafer and the vessel with each other between the vessel and the chuck. This can be arranged to be movable. In this case, the driving part may be connected with the chuck and move the chuck vertically to transfer the solder drops onto the bump pads and move the chuck horizontally to align the wafer and the container with each other. have. In addition, the flux applying unit and the image acquisition unit may be moved in the horizontal direction by the second drive unit.
상술한 바와 같은 본 발명의 실시예들에 따르면, 상기 솔더 범프 형성 장치는 종래의 기술과 비교하여 크게 단순화된 구조를 갖고 있으므로 상기 솔더 범프 형성 장치의 크기 및 제조 비용을 감소시킬 수 있다. 또한, 상기 솔더 범프 형성 장치를 이용하여 수행되는 솔더 범프 형성 공정이 종래의 기술과 비교하여 매우 단순해질 수 있으므로 상기 솔더 범프들을 형성하는데 소요되는 시간이 크게 단축될 수 있다.According to the embodiments of the present invention as described above, since the solder bump forming apparatus has a greatly simplified structure compared to the prior art, it is possible to reduce the size and manufacturing cost of the solder bump forming apparatus. In addition, since the solder bump forming process performed using the solder bump forming apparatus can be very simple as compared with the prior art, the time required for forming the solder bumps can be greatly shortened.
도 1은 본 발명의 일 실시예에 따른 솔더 범프 형성 장치를 설명하기 위한 개략적인 구성도이다.1 is a schematic diagram illustrating a solder bump forming apparatus according to an embodiment of the present invention.
도 2는 도 1에 도시된 하부 패널의 일 예를 설명하기 위한 개략적인 단면도이다.FIG. 2 is a schematic cross-sectional view for describing an example of the lower panel shown in FIG. 1.
도 3은 도 2에 도시된 블록을 설명하기 위한 부분 단면 사시도이다.3 is a partial cross-sectional perspective view for explaining the block illustrated in FIG. 2.
도 4 내지 도 6은 웨이퍼 상에 솔더 범프들을 전달하는 방법을 설명하기 위한 개략도들이다.4-6 are schematic diagrams for explaining a method of transferring solder bumps onto a wafer.
도 7은 도 1에 도시된 솔더 범프 형성 장치의 제2 구동부와 이미지 획득 유닛을 설명하기 위한 개략적인 평면도이다.FIG. 7 is a schematic plan view for describing a second driver and an image acquisition unit of the solder bump forming apparatus illustrated in FIG. 1.
이하, 본 발명은 본 발명의 실시예들을 보여주는 첨부 도면들을 참조하여 더욱 상세하게 설명된다. 그러나, 본 발명은 하기에서 설명되는 실시예들에 한정된 바와 같이 구성되어야만 하는 것은 아니며 이와 다른 여러 가지 형태로 구체화될 수 있을 것이다. 하기의 실시예들은 본 발명이 온전히 완성될 수 있도록 하기 위하여 제공된다기보다는 본 발명의 기술 분야에서 숙련된 당업자들에게 본 발명의 범위를 충분히 전달하기 위하여 제공된다.The invention is now described in more detail with reference to the accompanying drawings showing embodiments of the invention. However, the present invention should not be construed as limited to the embodiments described below and may be embodied in various other forms. The following examples are provided to fully convey the scope of the invention to those skilled in the art, rather than to allow the invention to be fully completed.
하나의 요소가 다른 하나의 요소 또는 층 상에 배치되는 또는 연결되는 것으로서 설명되는 경우 상기 요소는 상기 다른 하나의 요소 상에 직접적으로 배치되거나 연결될 수도 있으며, 다른 요소들 또는 층들이 이들 사이에 게재될 수도 있다. 이와 다르게, 하나의 요소가 다른 하나의 요소 상에 직접적으로 배치되거나 연결되는 것으로서 설명되는 경우, 그들 사이에는 또 다른 요소가 있을 수 없다. 유사한 요소들에 대하여는 전체적으로 유사한 참조 부호들이 사용될 것이며 또한, "및/또는"이란 용어는 관련된 항목들 중 어느 하나 또는 그 이상의 조합을 포함한다.When an element is described as being disposed or connected on another element or layer, the element may be placed or connected directly on the other element, and other elements or layers may be placed therebetween. It may be. Alternatively, where one element is described as being directly disposed or connected on another element, there may be no other element between them. Similar reference numerals will be used throughout for similar elements, and the term “and / or” includes any one or more combinations of related items.
다양한 요소들, 조성들, 영역들, 층들 및/또는 부분들과 같은 다양한 항목들을 설명하기 위하여 제1, 제2, 제3 등의 용어들이 사용될 수 있으나, 상기 항목들은 이들 용어들에 의하여 한정되지는 않을 것이다. 이들 용어들은 단지 다른 요소로부터 하나의 요소를 구별하기 위하여 사용되는 것이다. 따라서, 하기에서 설명되는 제1 요소, 조성, 영역, 층 또는 부분은 본 발명의 범위를 벗어나지 않으면서 제2 요소, 조성, 영역, 층 또는 부분으로 표현될 수 있을 것이다.Terms such as first, second, third, etc. may be used to describe various items such as various elements, compositions, regions, layers and / or parts, but the items are not limited by these terms. Will not. These terms are only used to distinguish one element from another. Accordingly, the first element, composition, region, layer or portion described below may be represented by the second element, composition, region, layer or portion without departing from the scope of the invention.
공간적으로 상대적인 용어들, 예를 들면, "하부" 또는 "바닥" 그리고 "상부" 또는 "맨위" 등의 용어들은 도면들에 설명된 바와 같이 다른 요소들에 대하여 한 요소의 관계를 설명하기 위하여 사용될 수 있다. 상대적 용어들은 도면에 도시된 방위에 더하여 장치의 다른 방위들을 포함할 수 있다. 예를 들면, 도면들 중 하나에서 장치가 방향이 바뀐다면, 다른 요소들의 하부 쪽에 있는 것으로 설명된 요소들이 상기 다른 요소들의 상부 쪽에 있는 것으로 맞추어질 것이다. 따라서, "하부"라는 전형적인 용어는 도면의 특정 방위에 대하여 "하부" 및 "상부" 방위 모두를 포함할 수 있다. 이와 유사하게, 도면들 중 하나에서 장치가 방향이 바뀐다면, 다른 요소들의 "아래" 또는 "밑"으로서 설명된 요소들은 상기 다른 요소들의 "위"로 맞추어질 것이다. 따라서, "아래" 또는 "밑"이란 전형적인 용어는 "아래"와 "위"의 방위 모두를 포함할 수 있다.Spatially relative terms such as "bottom" or "bottom" and "top" or "top" may be used to describe the relationship of one element to other elements as described in the figures. Can be. Relative terms may include other orientations of the device in addition to the orientation shown in the figures. For example, if the device is reversed in one of the figures, the elements described as being on the lower side of the other elements will be tailored to being on the upper side of the other elements. Thus, the typical term "bottom" may include both "bottom" and "top" orientations for a particular orientation in the figures. Similarly, if the device is reversed in one of the figures, the elements described as "below" or "below" of the other elements will be fitted "above" of the other elements. Thus, a typical term "below" or "below" may encompass both orientations of "below" and "above."
하기에서 사용된 전문 용어는 단지 특정 실시예들을 설명하기 위한 목적으로 사용되는 것이며, 본 발명을 한정하기 위한 것은 아니다. 하기에서 사용된 바와 같이, 단수의 형태로 표시되는 것은 특별히 명확하게 지시되지 않는 이상 복수의 형태도 포함한다. 또한, "포함한다" 및/또는 "포함하는"이란 용어가 사용되는 경우, 이는 언급된 형태들, 영역들, 완전체들, 단계들, 작용들, 요소들 및/또는 성분들의 존재를 특징짓는 것이며, 다른 하나 이상의 형태들, 영역들, 완전체들, 단계들, 작용들, 요소들, 성분들 및/또는 이들 그룹들의 추가를 배제하는 것은 아니다.The terminology used herein is for the purpose of describing particular embodiments only and is not intended to be limiting of the invention. As used below, what is shown in the singular also includes the plural unless specifically indicated otherwise. In addition, where the terms “comprises” and / or “comprising” are used, they are characterized by the presence of the forms, regions, integrals, steps, actions, elements and / or components mentioned. It is not intended to exclude the addition of one or more other forms, regions, integrals, steps, actions, elements, components, and / or groups.
달리 한정되지 않는 이상, 기술 및 과학 용어들을 포함하는 모든 용어들은 본 발명의 기술 분야에서 통상적인 지식을 갖는 당업자에게 이해될 수 있는 동일한 의미를 갖는다. 통상적인 사전들에서 한정되는 것들과 같은 상기 용어들은 관련 기술과 본 발명의 설명의 문맥에서 그들의 의미와 일치하는 의미를 갖는 것으로 해석될 것이며, 명확히 한정되지 않는 한 이상적으로 또는 과도하게 외형적인 직감으로 해석되지는 않을 것이다.Unless defined otherwise, all terms including technical and scientific terms have the same meaning as would be understood by one of ordinary skill in the art having ordinary skill in the art. Such terms, such as those defined in conventional dictionaries, will be construed as having meanings consistent with their meanings in the context of the related art and description of the invention, and ideally or excessively intuitional unless otherwise specified. It will not be interpreted.
본 발명의 실시예들은 본 발명의 이상적인 실시예들의 개략적인 도해들인 단면 도해들을 참조하여 설명된다. 이에 따라, 상기 도해들의 형상들로부터의 변화들, 예를 들면, 제조 방법들 및/또는 허용 오차들의 변화들은 예상될 수 있는 것들이다. 따라서, 본 발명의 실시예들은 도해로서 설명된 영역들의 특정 형상들에 한정된 바대로 설명되어지는 것은 아니라 형상들에서의 편차들을 포함하는 것이다. 예를 들면, 평평한 것으로서 설명된 영역은 일반적으로 거칠기 및/또는 비선형적인 형태들을 가질 수 있다. 또한, 도해로서 설명된 뾰족한 모서리들은 둥글게 될 수도 있다. 따라서, 도면들에 설명된 영역들은 전적으로 개략적인 것이며 이들의 형상들은 영역의 정확한 형상을 설명하기 위한 것이 아니며 또한 본 발명의 범위를 한정하고자 하는 것도 아니다.Embodiments of the invention are described with reference to cross-sectional illustrations that are schematic illustrations of ideal embodiments of the invention. Accordingly, changes from the shapes of the illustrations, such as changes in manufacturing methods and / or tolerances, are those that can be expected. Accordingly, embodiments of the present invention are not to be described as limited to the particular shapes of the areas described as the illustrations but to include deviations in the shapes. For example, a region described as flat may generally have roughness and / or nonlinear shapes. Also, the sharp edges described as illustrations may be rounded. Accordingly, the regions described in the figures are entirely schematic and their shapes are not intended to describe the precise shape of the regions nor are they intended to limit the scope of the invention.
도 1은 본 발명의 일 실시예에 따른 솔더 범프 형성 장치를 설명하기 위한 개략적인 구성도이다.1 is a schematic diagram illustrating a solder bump forming apparatus according to an embodiment of the present invention.
도 1을 참조하면, 본 발명의 일 실시예에 따른 솔더 범프 형성 장치(100)는 마이크로 전자 패키징 기술에서 웨이퍼(10) 상에 솔더 범프들을 형성하기 위하여 사용될 수 있다. 특히, 반도체 칩과 같은 집적 회로 소자들(12; 도 7 참조)이 형성된 반도체 웨이퍼(10) 상에 구 형태를 갖는 솔더 범프들(24; 도 6 참조)을 형성하기 위하여 사용될 수 있다.Referring to FIG. 1, the solder bump forming apparatus 100 according to an embodiment of the present invention may be used to form solder bumps on the wafer 10 in microelectronic packaging technology. In particular, it can be used to form solder bumps 24 (see FIG. 6) having a spherical shape on the semiconductor wafer 10 on which integrated circuit elements 12 (see FIG. 7), such as semiconductor chips, are formed.
상기 솔더 범프 형성 장치(100)는 상기 웨이퍼(10)를 지지하는 척(110)과 솔더 물질(20)을 수용하는 용기(120)를 포함할 수 있다. 상기 척(110)과 상기 용기(120)는 서로 마주하도록, 예를 들면, 상기 용기(120) 아래에 상기 척(110)이 배치될 수 있다.The solder bump forming apparatus 100 may include a chuck 110 supporting the wafer 10 and a container 120 accommodating the solder material 20. The chuck 110 and the vessel 120 may face each other, for example, the chuck 110 may be disposed under the vessel 120.
상기 웨이퍼(10)는 이송 로봇(미도시)에 의해 상기 척(110) 상으로 로드될 수 있으며, 상기 집적 회로 소자들(12)의 범프 패드들(12; 도 6 참조)이 위를 향하도록 진공압에 의해 상기 척(110) 상에 파지될 수 있다.The wafer 10 may be loaded onto the chuck 110 by a transfer robot (not shown), with the bump pads 12 (see FIG. 6) of the integrated circuit elements 12 facing up. It can be gripped on the chuck 110 by the vacuum pressure.
상기 용기(120)는 개방된 상부와 상기 범프 패드들(14)과 각각 대응하는 다수의 홀들(122A)이 형성된 하부 패널(124) 및 상기 솔더 물질(20)이 수용되는 공간을 한정하는 측벽(126)을 포함할 수 있다.The container 120 has an open top and a lower panel 124 having a plurality of holes 122A corresponding to the bump pads 14 and sidewalls defining a space in which the solder material 20 is accommodated. 126).
도 2는 도 1에 도시된 하부 패널의 일 예를 설명하기 위한 개략적인 단면도이며, 도 3은 도 2에 도시된 블록을 설명하기 위한 부분 단면 사시도이다.FIG. 2 is a schematic cross-sectional view for describing an example of the lower panel shown in FIG. 1, and FIG. 3 is a partial cross-sectional perspective view for explaining the block shown in FIG. 2.
본 발명의 일 실시예들에 따르면, 도 2 및 도 3에 도시된 바와 같이, 상기 용기(120)의 하부 패널(124)은 상기 웨이퍼(10) 상의 집적 회로 소자들(12)과 대응하는 다수의 개구들(124A)을 가질 수 있으며, 상기 개구들(124A) 내에는 상기 범프 패드들(14)과 대응하는 다수의 홀들(122A)이 형성된 블록(122)이 각각 결합될 수 있다.According to one embodiment of the invention, as shown in FIGS. 2 and 3, the lower panel 124 of the vessel 120 corresponds to a plurality of integrated circuit elements 12 on the wafer 10. May have openings 124A, and blocks 122 having a plurality of holes 122A corresponding to the bump pads 14 may be coupled to the openings 124A, respectively.
예를 들면, 상기 블록들(122)은 유리 또는 세라믹 물질로 형성될 수 있으며, 상기 홀들(122A)은 레이저 가공에 의해 형성될 수 있다. 한편, 상기 홀들(122A)의 내경은 형성하고자 하는 솔더 범프들(24)의 크기에 따라 결정될 수 있다. 예를 들면, 상기 솔더 범프들(24)이 약 20㎛ 내지 30㎛ 정도의 직경을 갖는 경우 상기 홀들(122A)은 상기 솔더 범프들(24)의 직경 보다 작은, 예를 들면, 약 5㎛ 내지 20㎛ 정도의 내경을 가질 수 있다.For example, the blocks 122 may be formed of glass or a ceramic material, and the holes 122A may be formed by laser processing. The inner diameters of the holes 122A may be determined according to the size of the solder bumps 24 to be formed. For example, when the solder bumps 24 have a diameter of about 20 μm to 30 μm, the holes 122A are smaller than the diameter of the solder bumps 24, for example, about 5 μm to It may have an inner diameter of about 20㎛.
한편, 도시된 바와 같이 상기 블록들(122)의 외측면들 및 상기 개구들(124A)의 내측면들에는 각각 결합을 위한 계단부들이 형성될 수 있다.On the other hand, as shown in the outer surface of the block 122 and the inner surface of the openings 124A may be formed stepped for coupling, respectively.
다시 도 1을 참조하면, 상기 솔더 범프 형성 장치(100)는 상기 용기(120)와 열적으로 연결되어 상기 솔더 물질(20)을 용융시키기 위한 히터(130)를 포함할 수 있다. 예를 들면, 도시된 바와 같이 상기 히터(130)는 상기 측벽(126)에 내장된 전기저항열선을 포함할 수 있다. 그러나, 상기와 다르게 상기 히터(130)는 상기 하부 패널(124) 내에 내장될 수도 있으며, 상기 용기(120)의 외측 표면들 상에 배치될 수도 있다. 상기 히터(130)는 상기 솔더 물질(20)을 용융시키기 위하여 상기 용기(120)를 상기 솔더 물질(20)의 용융점 이상의 온도로 가열할 수 있다.Referring back to FIG. 1, the solder bump forming apparatus 100 may include a heater 130 that is thermally connected to the container 120 to melt the solder material 20. For example, as illustrated, the heater 130 may include an electric resistance heating wire embedded in the sidewall 126. However, unlike the above, the heater 130 may be embedded in the lower panel 124 and disposed on the outer surfaces of the container 120. The heater 130 may heat the container 120 to a temperature above the melting point of the solder material 20 in order to melt the solder material 20.
상기 솔더 범프 형성 장치(100)는 상기 용기(120)의 내부 공간에서 용융된 솔더(20)를 상기 홀들(122A)을 통해 배출시킴으로써 상기 홀들(122A)의 하부에서 다수의 용융된 솔더 방울들(도 4 참조)을 형성하기 위한 프레스(140)를 더 포함할 수 있다. 특히, 상기 프레스(140)는 상기 용기(120)의 내부 공간으로 삽입되며 상기 용융된 솔더(20)를 가압하기 위한 상부 패널(142)을 포함할 수 있다.The solder bump forming apparatus 100 discharges the molten solder 20 in the inner space of the container 120 through the holes 122A to form a plurality of molten solder droplets at the bottom of the holes 122A. 4 may further include a press 140 for forming. In particular, the press 140 may be inserted into the inner space of the container 120 and may include an upper panel 142 for pressing the molten solder 20.
상기 솔더 범프 형성 장치(100)는 상기 척(110)과 용기(120) 사이에서 상대적인 수직 운동을 제공하기 위한 제1 구동부(150)를 포함할 수 있다. 특히, 상기 제1 구동부(150)는 상기 척(110) 또는 상기 용기(120)와 연결될 수 있다. 예를 들면, 도시된 바와 같이 상기 제1 구동부(150)는 상기 척(110)과 연결될 수 있으며, 상기 웨이퍼(10)와 용기(120) 사이의 간격을 조절할 수 있다.The solder bump forming apparatus 100 may include a first driver 150 for providing a relative vertical motion between the chuck 110 and the container 120. In particular, the first driving unit 150 may be connected to the chuck 110 or the container 120. For example, as illustrated, the first driver 150 may be connected to the chuck 110, and may adjust a gap between the wafer 10 and the container 120.
도 4 내지 도 6은 웨이퍼 상에 솔더 범프들을 전달하는 방법을 설명하기 위한 개략도들이다.4-6 are schematic diagrams for explaining a method of transferring solder bumps onto a wafer.
도 4 내지 도 6을 참조하면, 상기 제1 구동부(150)는 상기 웨이퍼(10)의 범프 패드들(14)이 상기 용융된 솔더 방울들(22)과 접촉하도록 상기 척(110)을 상방으로 이동시킬 수 있으며, 상기 용융된 솔더 방울들(22)이 상기 웨이퍼(10)의 범프 패드들(14) 상으로 전달될 수 있도록 상기 척(110)을 하방으로 이동시킬 수 있다. 상기 범프 패드들(14) 상으로 전달된 상기 용융된 솔더 방울들(22)은 온도 저하에 따라 응고될 수 있으며, 이에 따라 상기 웨이퍼(10)의 범프 패드들(14) 상에 구형의 솔더 범프들(24)이 형성될 수 있다.4 to 6, the first driver 150 moves the chuck 110 upward so that the bump pads 14 of the wafer 10 come into contact with the molten solder drops 22. The chuck 110 may be moved downward so that the molten solder drops 22 may be transferred onto the bump pads 14 of the wafer 10. The molten solder droplets 22 transferred onto the bump pads 14 may solidify as the temperature decreases, thus spherical solder bumps on the bump pads 14 of the wafer 10. Fields 24 may be formed.
한편, 상기 웨이퍼(10)의 상의 범프 패드들(14) 각각은 젖음력을 향상시키기 위한 UBM 패드(미도시)를 포함할 수 있다. 상기 용융된 솔더 방울들(22)은 상기 제1 구동부(150)에 의해 상방으로 이동된 웨이퍼(10)의 범프 패드들(14)과 접촉할 수 있으며, 상기 범프 패드들(14)과 상기 용융된 솔더 방울들(22) 사이의 젖음력에 의해 상기 범프 패드들(14)로 부착될 수 있다.Meanwhile, each of the bump pads 14 on the wafer 10 may include a UBM pad (not shown) to improve the wetting force. The molten solder drops 22 may contact the bump pads 14 of the wafer 10 moved upward by the first driver 150, and the bump pads 14 may be melted with the bump pads 14. The bump pads 14 may be attached to the bump pads 14 by the wetting force between the solder drops 22.
상기 용융된 솔더 방울들(22)이 상기 범프 패드들(14)에 부착된 후 상기 제1 구동부(150)는 상기 척(110)을 하방으로 이동시킬 수 있다. 이때, 상기 용융된 솔더 방울들(22)은 상기 젖음력에 의해 상기 하부 패널(124)의 블록들(122)로부터 분리될 수 있으며, 이어서 상기 범프 패드들(14) 상에서 응고될 수 있다.After the molten solder droplets 22 are attached to the bump pads 14, the first driver 150 may move the chuck 110 downward. In this case, the molten solder drops 22 may be separated from the blocks 122 of the lower panel 124 by the wetting force, and then solidified on the bump pads 14.
한편, 도시되지는 않았으나, 상기 척(110)은 상기 웨이퍼(10)의 온도를 조절하기 위한 제2 히터(미도시)와 열적으로 연결될 수도 있다. 상기 제2 히터는 상기 웨이퍼(10)를 상기 솔더 물질의 용융점보다 낮은 온도로 유지시키기 위하여 사용될 수 있다. 예를 들면, 상기 척(110) 내에는 전기저항열선 타입의 제2 히터가 내장될 수 있다.Although not shown, the chuck 110 may be thermally connected to a second heater (not shown) for controlling the temperature of the wafer 10. The second heater may be used to maintain the wafer 10 at a temperature lower than the melting point of the solder material. For example, the second heater of the electric resistance heating wire type may be embedded in the chuck 110.
다시 도 1을 참조하면, 상기 솔더 범프 형성 장치(100)는 상기 척(110)과 상기 용기(120) 사이에서 수평 방향으로 이동 가능하도록 구성된 플럭스 도포 유닛(160)을 포함할 수 있다. 상기 플럭스 도포 유닛(160)은 아래를 향하도록 배치되어 상기 척(110)에 의해 지지된 웨이퍼(10) 상으로 플럭스를 도포하는 노즐(162)을 포함할 수 있으며, 상기 노즐(162)은 플럭스 공급부(미도시)와 연결될 수 있다.Referring back to FIG. 1, the solder bump forming apparatus 100 may include a flux applying unit 160 configured to be movable in a horizontal direction between the chuck 110 and the container 120. The flux applying unit 160 may include a nozzle 162 disposed to face downward to apply flux onto the wafer 10 supported by the chuck 110, and the nozzle 162 may be a flux. It may be connected to a supply unit (not shown).
상세히 도시되지는 않았으나, 상기 노즐(162)은 상기 플럭스 공급부와 플럭스 공급 배관(미도시)을 통해 연결될 수 있으며, 상기 배관에는 온/오프 밸브(미도시)와 유량 제어기(미도시)가 설치될 수 있다.Although not shown in detail, the nozzle 162 may be connected to the flux supply unit through a flux supply pipe (not shown), and an on / off valve (not shown) and a flow controller (not shown) may be installed in the pipe. Can be.
도 7은 도 1에 도시된 솔더 범프 형성 장치의 제2 구동부와 이미지 획득 유닛을 설명하기 위한 개략적인 평면도이다.FIG. 7 is a schematic plan view for describing a second driver and an image acquisition unit of the solder bump forming apparatus illustrated in FIG. 1.
도 7을 참조하면, 상기 플럭스 도포 유닛(160)은 제2 구동부(170)와 연결될 수 있으며, 상기 제2 구동부(170)에 의해 수평 방향으로 이동될 수 있다. 즉, 상기 플럭스 도포 유닛(160)은 상기 웨이퍼(10) 상에 플럭스를 균일하게 도포하기 위하여 상기 제2 구동부(170)에 의해 수평 방향으로, 예를 들면, 지그재그 형태로 이동될 수 있다. 일 예로서, 상기 제2 구동부(170)로는 직교 좌표 로봇이 사용될 수 있으며, 상기 제2 구동부(170)는 상기 척(110)의 측방에 배치될 수 있다.Referring to FIG. 7, the flux applying unit 160 may be connected to the second driver 170, and may be moved in the horizontal direction by the second driver 170. That is, the flux coating unit 160 may be moved horizontally, for example, in a zigzag form, by the second driving unit 170 in order to uniformly apply the flux on the wafer 10. As an example, a rectangular coordinate robot may be used as the second driver 170, and the second driver 170 may be disposed at the side of the chuck 110.
이미지 획득 유닛(180)은 상기 웨이퍼(10)와 용기(120)를 서로 정렬하기 위하여 사용될 수 있다. 이 경우, 상기 웨이퍼(10)와 상기 용기(120)의 하부 패널(124) 상에는 각각 정렬 마크(미도시)가 구비될 수 있다. 상기 이미지 획득 유닛(180)은 상기 웨이퍼(10) 상의 정렬 마크와 상기 용기(120)의 하부 패널(124) 상의 정렬 마크에 대한 이미지들을 획득하며, 획득된 이미지 정보를 제어부(미도시)로 전송한다. 상기 제어부는 상기 이미지 정보를 분석하여 상기 웨이퍼(10)와 용기(120)가 서로 정렬되도록 상기 제1 구동부(150)의 동작을 제어할 수 있다. 이때, 상기 제1 구동부(150)는 상기 척(110)의 수직 구동 뿐만 아니라 상기 척(110)의 수평 구동까지도 가능하도록 구성될 수 있다. 예를 들면, 상기 제1 구동부(150)로는 3축 직교 좌표 로봇이 사용될 수 있다.The image acquisition unit 180 may be used to align the wafer 10 and the container 120 with each other. In this case, alignment marks (not shown) may be provided on the wafer 10 and the lower panel 124 of the container 120, respectively. The image acquisition unit 180 acquires images of alignment marks on the wafer 10 and alignment marks on the lower panel 124 of the container 120, and transmits the acquired image information to a controller (not shown). do. The controller may control the operation of the first driver 150 to align the wafer 10 and the container 120 with each other by analyzing the image information. In this case, the first driving unit 150 may be configured to enable not only vertical driving of the chuck 110 but also horizontal driving of the chuck 110. For example, a three-axis Cartesian robot may be used as the first driver 150.
상세히 도시되지는 않았으나, 상기 이미지 획득 유닛(180)은 비전 카메라와 다이크로익 미러(dichroic mirror)를 포함하는 광학 필터 및 상기 웨이퍼(10)와 용기(120)의 하부 패널(124) 상의 정렬 마크들을 조명하는 조명 기구를 포함할 수 있다. 또한, 상기 이미지 획득 유닛(180)은 상기 플럭스 도포 유닛(160)의 일측에 배치될 수 있으며, 상기 제2 구동부(170)에 의해 수평 방향으로 이동될 수 있다.Although not shown in detail, the image acquisition unit 180 may include an optical filter including a vision camera and a dichroic mirror and alignment marks on the lower panel 124 of the wafer 10 and the container 120. It may include a light fixture for illuminating them. In addition, the image acquisition unit 180 may be disposed on one side of the flux applying unit 160, and may be moved in the horizontal direction by the second driver 170.
상술한 바와 같은 본 발명의 실시예들에 따르면, 솔더 범프 형성 장치는 웨이퍼를 지지하는 척과 용융된 솔더가 수용되는 용기를 포함할 수 있다. 상기 용융된 솔더는 프레스에 의해 상기 용기의 하부 패널에 형성된 다수의 홀들을 통해 배출될 수 있으며, 이에 따라 상기 홀들의 하부에서 용융된 솔더 방울들이 형성될 수 있다. 상기 용융된 솔더 방울은 상기 척에 의해 상승 및 하강하는 웨이퍼로 전달될 수 있다.According to embodiments of the present invention as described above, the solder bump forming apparatus may include a chuck supporting the wafer and a container in which the molten solder is accommodated. The molten solder may be discharged through a plurality of holes formed in the lower panel of the container by a press, and thus molten solder droplets may be formed in the lower portions of the holes. The molten solder droplets may be transferred to the wafer ascending and descending by the chuck.
상기와 같이 솔더 범프 형성 장치는 종래의 기술과 비교하여 크게 단순화된 구조를 갖고 있으므로 상기 솔더 범프 형성 장치의 크기 및 제조 비용을 감소시킬 수 있다. 또한, 상기 솔더 범프 형성 장치를 이용하여 수행되는 솔더 범프 형성 공정이 종래의 기술과 비교하여 매우 단순해질 수 있으므로 상기 솔더 범프들을 형성하는데 소요되는 시간이 크게 단축될 수 있다.As described above, since the solder bump forming apparatus has a greatly simplified structure compared with the related art, the size and manufacturing cost of the solder bump forming apparatus can be reduced. In addition, since the solder bump forming process performed using the solder bump forming apparatus can be very simple as compared with the prior art, the time required for forming the solder bumps can be greatly shortened.
상기에서는 본 발명의 바람직한 실시예를 참조하여 설명하였지만, 해당 기술 분야의 숙련된 당업자는 하기의 특허 청구의 범위에 기재된 본 발명의 사상 및 영역으로부터 벗어나지 않는 범위 내에서 본 발명을 다양하게 수정 및 변경시킬 수 있음을 이해할 수 있을 것이다.Although described above with reference to a preferred embodiment of the present invention, those skilled in the art will be variously modified and changed within the scope of the invention without departing from the spirit and scope of the invention described in the claims below I can understand that you can.

Claims (8)

  1. 범프 패드들을 갖는 집적 회로 소자들이 형성된 웨이퍼를 지지하는 척;A chuck supporting a wafer on which integrated circuit elements with bump pads are formed;
    솔더 물질을 수용하며 개방된 상부와 상기 범프 패드들과 대응하는 다수의 홀들이 형성된 하부 패널을 갖는 용기;A container having an open top and a bottom panel formed with a plurality of holes corresponding to the bump pads to receive solder material;
    상기 용기와 열적으로 연결되며 상기 솔더 물질을 용융시키기 위한 히터;A heater in thermal communication with the vessel and for melting the solder material;
    상기 용기의 상부에서 상기 용기 내에서 용융된 솔더를 가압하여 상기 홀들의 하부에서 다수의 용융된 솔더 방울들을 형성하기 위한 프레스; 및A press to press the molten solder in the vessel at the top of the vessel to form a plurality of molten solder drops at the bottom of the holes; And
    상기 척 또는 상기 용기와 연결되어 상기 웨이퍼의 범프 패드들을 상기 솔더 방울들에 접촉시키고 상기 용기로부터 상기 솔더 방울들을 상기 범프 패드들 상으로 전달하기 위하여 상기 척과 상기 용기 사이의 간격을 조절하는 구동부를 포함하는 솔더 범프 형성 장치.A driver connected to the chuck or the container to adjust the gap between the chuck and the container to contact the bump pads of the wafer with the solder drops and to deliver the solder drops from the container onto the bump pads. Solder bump forming device.
  2. 제1항에 있어서, 상기 구동부는 상기 척과 연결되는 것을 특징으로 하는 솔더 범프 형성 장치.The solder bump forming apparatus of claim 1, wherein the driving unit is connected to the chuck.
  3. 제1항에 있어서, 상기 하부 패널은 상기 집적 회로 소자들과 대응하는 다수의 개구들을 가지며, 상기 용기는 상기 개구들에 결합된 다수의 블록들을 더 포함하며, 상기 홀들은 상기 블록들을 통해 형성된 것을 특징으로 하는 솔더 범프 형성 장치.The method of claim 1, wherein the lower panel has a plurality of openings corresponding to the integrated circuit elements, the container further comprises a plurality of blocks coupled to the openings, wherein the holes are formed through the blocks. A solder bump forming apparatus characterized by the above-mentioned.
  4. 제1항에 있어서, 상기 용기와 상기 척 사이에서 이동 가능하도록 배치되며 상기 웨이퍼 상에 플럭스를 도포하기 위한 플럭스 도포 유닛을 더 포함하는 것을 특징으로 하는 솔더 범프 형성 장치.2. The solder bump forming apparatus of claim 1, further comprising a flux applying unit arranged to be movable between the container and the chuck and for applying flux on the wafer.
  5. 제4항에 있어서, 상기 플럭스 도포 유닛과 연결되며 상기 플럭스 도포 유닛을 수평 방향으로 이동시키기 위한 제2 구동부를 더 포함하는 것을 특징으로 하는 솔더 범프 형성 장치.The solder bump forming apparatus of claim 4, further comprising a second driving unit connected to the flux applying unit and configured to move the flux applying unit in a horizontal direction.
  6. 제4항에 있어서, 상기 용기와 상기 척 사이에서 이동 가능하도록 배치되며 상기 웨이퍼와 상기 용기를 서로 정렬하기 위하여 상기 용기의 하부 패널 상의 정렬 마크와 상기 웨이퍼 상의 정렬 마크에 대한 이미지들을 획득하기 위한 이미지 획득 유닛을 더 포함하는 것을 특징으로 하는 솔더 범프 형성 장치.5. An image according to claim 4, arranged to be movable between the vessel and the chuck and for obtaining images of alignment marks on the lower panel of the vessel and alignment marks on the wafer to align the wafer and the vessel with each other. The solder bump forming apparatus further comprises an acquisition unit.
  7. 제6항에 있어서, 상기 구동부는 상기 척과 연결되고 상기 솔더 방울들을 상기 범프 패드들 상으로 전달하기 위하여 상기 척을 수직 방향으로 이동시키며 상기 웨이퍼와 용기를 서로 정렬하기 위하여 상기 척을 수평 방향으로 이동시키는 것을 특징으로 하는 솔더 범프 형성 장치.The chuck of claim 6, wherein the driving part is connected to the chuck and moves the chuck in a vertical direction to transfer the solder droplets onto the bump pads, and moves the chuck in a horizontal direction to align the wafer and the container with each other. Solder bump forming apparatus, characterized in that.
  8. 제6항에 있어서, 상기 플럭스 도포 유닛 및 상기 이미지 획득 유닛과 연결되며 상기 플럭스 도포 유닛 및 상기 이미지 획득 유닛을 수평 방향으로 이동시키기 위한 제2 구동부를 더 포함하는 것을 특징으로 하는 솔더 범프 형성 장치.The solder bump forming apparatus of claim 6, further comprising a second driver connected to the flux applying unit and the image acquisition unit and configured to move the flux application unit and the image acquisition unit in a horizontal direction.
PCT/KR2010/002955 2009-09-07 2010-05-10 Apparatus for forming solder bumps WO2011027958A1 (en)

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Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH1140937A (en) * 1997-07-23 1999-02-12 Matsushita Electric Ind Co Ltd Method and apparatus for feeding solder
JP2002019073A (en) * 2000-07-11 2002-01-22 Matsushita Electric Ind Co Ltd Screen printer and paste storage container therefor
KR20090067791A (en) * 2007-12-21 2009-06-25 세크론 주식회사 Method of injecting melted solder into cavities of template and apparatus for performing the same

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH1140937A (en) * 1997-07-23 1999-02-12 Matsushita Electric Ind Co Ltd Method and apparatus for feeding solder
JP2002019073A (en) * 2000-07-11 2002-01-22 Matsushita Electric Ind Co Ltd Screen printer and paste storage container therefor
KR20090067791A (en) * 2007-12-21 2009-06-25 세크론 주식회사 Method of injecting melted solder into cavities of template and apparatus for performing the same

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