WO2011025241A3 - Bonding wire antenna communication module - Google Patents

Bonding wire antenna communication module Download PDF

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Publication number
WO2011025241A3
WO2011025241A3 PCT/KR2010/005668 KR2010005668W WO2011025241A3 WO 2011025241 A3 WO2011025241 A3 WO 2011025241A3 KR 2010005668 W KR2010005668 W KR 2010005668W WO 2011025241 A3 WO2011025241 A3 WO 2011025241A3
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WO
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Patent type
Prior art keywords
communication module
bonding wire
wire antenna
antenna communication
semiconductor chip
Prior art date
Application number
PCT/KR2010/005668
Other languages
French (fr)
Korean (ko)
Other versions
WO2011025241A2 (en )
Inventor
김태욱
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연세대학교 산학협력단
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    • HELECTRICITY
    • H01BASIC ELECTRIC ELEMENTS
    • H01QANTENNAS, i.e. RADIO AERIALS
    • H01Q1/00Details of, or arrangements associated with, antennas
    • H01Q1/12Supports; Mounting means
    • H01Q1/22Supports; Mounting means by structural association with other equipment or articles
    • H01Q1/2283Supports; Mounting means by structural association with other equipment or articles mounted in or on the surface of a semiconductor substrate as a chip-type antenna or integrated with other components into an IC package
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    • H01L23/00Details of semiconductor or other solid state devices
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    • H01L24/10Bump connectors ; Manufacturing methods related thereto
    • H01L24/12Structure, shape, material or disposition of the bump connectors prior to the connecting process
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    • H01LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H01L2225/00Details relating to assemblies covered by the group H01L25/00 but not provided for in its subgroups
    • H01L2225/03All the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L51/00
    • H01L2225/04All the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L51/00 the devices not having separate containers
    • H01L2225/065All the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L51/00 the devices not having separate containers the devices being of a type provided for in group H01L27/00
    • H01L2225/06503Stacked arrangements of devices
    • H01L2225/0651Wire or wire-like electrical connections from device to substrate
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    • H01BASIC ELECTRIC ELEMENTS
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    • H01L2225/00Details relating to assemblies covered by the group H01L25/00 but not provided for in its subgroups
    • H01L2225/03All the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L51/00
    • H01L2225/04All the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L51/00 the devices not having separate containers
    • H01L2225/065All the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L51/00 the devices not having separate containers the devices being of a type provided for in group H01L27/00
    • H01L2225/06503Stacked arrangements of devices
    • H01L2225/06541Conductive via connections through the device, e.g. vertical interconnects, through silicon via [TSV]
    • HELECTRICITY
    • H01BASIC ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H01L23/00Details of semiconductor or other solid state devices
    • H01L23/48Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
    • H01L23/481Internal lead connections, e.g. via connections, feedthrough structures
    • HELECTRICITY
    • H01BASIC ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H01L24/00Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/01Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L24/42Wire connectors; Manufacturing methods related thereto
    • H01L24/47Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L24/48Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • HELECTRICITY
    • H01BASIC ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H01L2924/00Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001Technical content checked by a classifier
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    • H01L2924/00Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001Technical content checked by a classifier
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    • H01LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H01L2924/00Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/15Details of package parts other than the semiconductor or other solid state devices to be connected
    • H01L2924/151Die mounting substrate
    • H01L2924/153Connection portion
    • H01L2924/1531Connection portion the connection portion being formed only on the surface of the substrate opposite to the die mounting surface
    • H01L2924/15311Connection portion the connection portion being formed only on the surface of the substrate opposite to the die mounting surface being a ball array, e.g. BGA

Abstract

Provided is a bonding wire antenna communication module. The bonding wire antenna communication module comprises: a semiconductor chip including bonding pads arranged on a substrate; and bonding wire antennas electrically connected to the bonding pads. The semiconductor chip of the communication module comprises inexpensive CMOS amplifiers, and each of the amplifiers operates at the highest efficiency, thereby providing an inexpensive, high-efficiency and optimized highly integrated communication module.
PCT/KR2010/005668 2009-08-26 2010-08-24 Bonding wire antenna communication module WO2011025241A3 (en)

Priority Applications (6)

Application Number Priority Date Filing Date Title
KR10-2009-0079220 2009-08-26
KR20090079208A KR101133146B1 (en) 2009-08-26 2009-08-26 Bonding Wire Antenna Communication Module
KR10-2009-0079208 2009-08-26
KR20090079220A KR20110021427A (en) 2009-08-26 2009-08-26 Monopole bonding wire antenna communication module
KR10-2010-0007502 2010-01-27
KR20100007502A KR101129553B1 (en) 2010-01-27 2010-01-27 Communication Module

Publications (2)

Publication Number Publication Date
WO2011025241A2 true WO2011025241A2 (en) 2011-03-03
WO2011025241A3 true true WO2011025241A3 (en) 2011-06-23

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ID=43628581

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/KR2010/005668 WO2011025241A3 (en) 2009-08-26 2010-08-24 Bonding wire antenna communication module

Country Status (1)

Country Link
WO (1) WO2011025241A3 (en)

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5682143A (en) * 1994-09-09 1997-10-28 International Business Machines Corporation Radio frequency identification tag
JP2005182330A (en) * 2003-12-18 2005-07-07 Matsushita Electric Ind Co Ltd Semiconductor device and method for manufacturing semiconductor device
WO2006022836A1 (en) * 2004-08-06 2006-03-02 International Business Machines Corporation Apparatus and methods for constructing antennas using wire bonds as radiating elements
KR20090063166A (en) * 2007-12-12 2009-06-17 브로드콤 코포레이션 Method and system for a phased array antenna embedded in an integrated circuit package

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5682143A (en) * 1994-09-09 1997-10-28 International Business Machines Corporation Radio frequency identification tag
JP2005182330A (en) * 2003-12-18 2005-07-07 Matsushita Electric Ind Co Ltd Semiconductor device and method for manufacturing semiconductor device
WO2006022836A1 (en) * 2004-08-06 2006-03-02 International Business Machines Corporation Apparatus and methods for constructing antennas using wire bonds as radiating elements
KR20090063166A (en) * 2007-12-12 2009-06-17 브로드콤 코포레이션 Method and system for a phased array antenna embedded in an integrated circuit package

Also Published As

Publication number Publication date Type
WO2011025241A2 (en) 2011-03-03 application

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