WO2011025241A3 - Bonding wire antenna communication module - Google Patents

Bonding wire antenna communication module Download PDF

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Publication number
WO2011025241A3
WO2011025241A3 PCT/KR2010/005668 KR2010005668W WO2011025241A3 WO 2011025241 A3 WO2011025241 A3 WO 2011025241A3 KR 2010005668 W KR2010005668 W KR 2010005668W WO 2011025241 A3 WO2011025241 A3 WO 2011025241A3
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WO
WIPO (PCT)
Prior art keywords
communication module
bonding wire
wire antenna
antenna communication
semiconductor chip
Prior art date
Application number
PCT/KR2010/005668
Other languages
French (fr)
Korean (ko)
Other versions
WO2011025241A2 (en
Inventor
김태욱
Original Assignee
연세대학교 산학협력단
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority to KR10-2009-0079220 priority Critical
Priority to KR1020090079208A priority patent/KR101133146B1/en
Priority to KR10-2009-0079208 priority
Priority to KR1020090079220A priority patent/KR20110021427A/en
Priority to KR20100007502A priority patent/KR101129553B1/en
Priority to KR10-2010-0007502 priority
Application filed by 연세대학교 산학협력단 filed Critical 연세대학교 산학협력단
Publication of WO2011025241A2 publication Critical patent/WO2011025241A2/en
Publication of WO2011025241A3 publication Critical patent/WO2011025241A3/en

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    • HELECTRICITY
    • H01BASIC ELECTRIC ELEMENTS
    • H01QANTENNAS, i.e. RADIO AERIALS
    • H01Q1/00Details of, or arrangements associated with, antennas
    • H01Q1/12Supports; Mounting means
    • H01Q1/22Supports; Mounting means by structural association with other equipment or articles
    • H01Q1/2283Supports; Mounting means by structural association with other equipment or articles mounted in or on the surface of a semiconductor substrate as a chip-type antenna or integrated with other components into an IC package
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    • H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/91Methods for connecting semiconductor or solid state bodies including different methods provided for in two or more of groups H01L2224/80 - H01L2224/90
    • H01L2224/92Specific sequence of method steps
    • H01L2224/9202Forming additional connectors after the connecting process
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    • H01L2225/03All the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L51/00
    • H01L2225/04All the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L51/00 the devices not having separate containers
    • H01L2225/065All the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L51/00 the devices not having separate containers the devices being of a type provided for in group H01L27/00
    • H01L2225/06503Stacked arrangements of devices
    • H01L2225/0651Wire or wire-like electrical connections from device to substrate
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    • H01L2225/03All the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L51/00
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    • H01L2225/065All the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L51/00 the devices not having separate containers the devices being of a type provided for in group H01L27/00
    • H01L2225/06503Stacked arrangements of devices
    • H01L2225/06541Conductive via connections through the device, e.g. vertical interconnects, through silicon via [TSV]
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    • H01L23/48Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
    • H01L23/481Internal lead connections, e.g. via connections, feedthrough structures
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    • H01L24/00Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/01Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L24/42Wire connectors; Manufacturing methods related thereto
    • H01L24/47Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L24/48Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
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    • H01L2924/153Connection portion
    • H01L2924/1531Connection portion the connection portion being formed only on the surface of the substrate opposite to the die mounting surface
    • H01L2924/15311Connection portion the connection portion being formed only on the surface of the substrate opposite to the die mounting surface being a ball array, e.g. BGA

Abstract

Provided is a bonding wire antenna communication module. The bonding wire antenna communication module comprises: a semiconductor chip including bonding pads arranged on a substrate; and bonding wire antennas electrically connected to the bonding pads. The semiconductor chip of the communication module comprises inexpensive CMOS amplifiers, and each of the amplifiers operates at the highest efficiency, thereby providing an inexpensive, high-efficiency and optimized highly integrated communication module.
PCT/KR2010/005668 2009-08-26 2010-08-24 Bonding wire antenna communication module WO2011025241A2 (en)

Priority Applications (6)

Application Number Priority Date Filing Date Title
KR10-2009-0079220 2009-08-26
KR1020090079208A KR101133146B1 (en) 2009-08-26 2009-08-26 Bonding Wire Antenna Communication Module
KR10-2009-0079208 2009-08-26
KR1020090079220A KR20110021427A (en) 2009-08-26 2009-08-26 Monopole bonding wire antenna communication module
KR10-2010-0007502 2010-01-27
KR20100007502A KR101129553B1 (en) 2010-01-27 2010-01-27 Communication Module

Publications (2)

Publication Number Publication Date
WO2011025241A2 WO2011025241A2 (en) 2011-03-03
WO2011025241A3 true WO2011025241A3 (en) 2011-06-23

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PCT/KR2010/005668 WO2011025241A2 (en) 2009-08-26 2010-08-24 Bonding wire antenna communication module

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WO (1) WO2011025241A2 (en)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE102017200132A1 (en) * 2017-01-05 2018-07-05 Fraunhofer-Gesellschaft zur Förderung der angewandten Forschung e.V. Antenna device having bonding wires

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5682143A (en) * 1994-09-09 1997-10-28 International Business Machines Corporation Radio frequency identification tag
JP2005182330A (en) * 2003-12-18 2005-07-07 Matsushita Electric Ind Co Ltd Semiconductor device and method for manufacturing semiconductor device
WO2006022836A1 (en) * 2004-08-06 2006-03-02 International Business Machines Corporation Apparatus and methods for constructing antennas using wire bonds as radiating elements
KR20090063166A (en) * 2007-12-12 2009-06-17 브로드콤 코포레이션 Method and system for a phased array antenna embedded in an integrated circuit package

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5682143A (en) * 1994-09-09 1997-10-28 International Business Machines Corporation Radio frequency identification tag
JP2005182330A (en) * 2003-12-18 2005-07-07 Matsushita Electric Ind Co Ltd Semiconductor device and method for manufacturing semiconductor device
WO2006022836A1 (en) * 2004-08-06 2006-03-02 International Business Machines Corporation Apparatus and methods for constructing antennas using wire bonds as radiating elements
KR20090063166A (en) * 2007-12-12 2009-06-17 브로드콤 코포레이션 Method and system for a phased array antenna embedded in an integrated circuit package

Also Published As

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