CN108538823B - Packaging chip of integrated monopole antenna and processing method thereof - Google Patents
Packaging chip of integrated monopole antenna and processing method thereof Download PDFInfo
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- CN108538823B CN108538823B CN201810378103.XA CN201810378103A CN108538823B CN 108538823 B CN108538823 B CN 108538823B CN 201810378103 A CN201810378103 A CN 201810378103A CN 108538823 B CN108538823 B CN 108538823B
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- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/58—Structural electrical arrangements for semiconductor devices not otherwise provided for, e.g. in combination with batteries
- H01L23/64—Impedance arrangements
- H01L23/66—High-frequency adaptations
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- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer or carrier concentration layer
- H01L21/50—Assembly of semiconductor devices using processes or apparatus not provided for in a single one of the subgroups H01L21/06 - H01L21/326, e.g. sealing of a cap to a base of a container
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- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/28—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection
- H01L23/31—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the arrangement or shape
- H01L23/3107—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the arrangement or shape the device being completely enclosed
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01Q—ANTENNAS, i.e. RADIO AERIALS
- H01Q1/00—Details of, or arrangements associated with, antennas
- H01Q1/12—Supports; Mounting means
- H01Q1/22—Supports; Mounting means by structural association with other equipment or articles
- H01Q1/2283—Supports; Mounting means by structural association with other equipment or articles mounted in or on the surface of a semiconductor substrate as a chip-type antenna or integrated with other components into an IC package
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- H—ELECTRICITY
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- H01Q—ANTENNAS, i.e. RADIO AERIALS
- H01Q1/00—Details of, or arrangements associated with, antennas
- H01Q1/36—Structural form of radiating elements, e.g. cone, spiral, umbrella; Particular materials used therewith
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- H—ELECTRICITY
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- H01Q—ANTENNAS, i.e. RADIO AERIALS
- H01Q9/00—Electrically-short antennas having dimensions not more than twice the operating wavelength and consisting of conductive active radiating elements
- H01Q9/04—Resonant antennas
- H01Q9/30—Resonant antennas with feed to end of elongated active element, e.g. unipole
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- H01L2223/58—Structural electrical arrangements for semiconductor devices not otherwise provided for
- H01L2223/64—Impedance arrangements
- H01L2223/66—High-frequency adaptations
- H01L2223/6661—High-frequency adaptations for passive devices
- H01L2223/6677—High-frequency adaptations for passive devices for antenna, e.g. antenna included within housing of semiconductor device
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- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/4805—Shape
- H01L2224/4809—Loop shape
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- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/481—Disposition
- H01L2224/4811—Connecting to a bonding area of the semiconductor or solid-state body located at the far end of the body with respect to the bonding area outside the semiconductor or solid-state body
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- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/481—Disposition
- H01L2224/48135—Connecting between different semiconductor or solid-state bodies, i.e. chip-to-chip
- H01L2224/48137—Connecting between different semiconductor or solid-state bodies, i.e. chip-to-chip the bodies being arranged next to each other, e.g. on a common substrate
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- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/49—Structure, shape, material or disposition of the wire connectors after the connecting process of a plurality of wire connectors
- H01L2224/491—Disposition
- H01L2224/4911—Disposition the connectors being bonded to at least one common bonding area, e.g. daisy chain
- H01L2224/49113—Disposition the connectors being bonded to at least one common bonding area, e.g. daisy chain the connectors connecting different bonding areas on the semiconductor or solid-state body to a common bonding area outside the body, e.g. converging wires
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- H01L2924/19—Details of hybrid assemblies other than the semiconductor or other solid state devices to be connected
- H01L2924/191—Disposition
- H01L2924/19101—Disposition of discrete passive components
- H01L2924/19107—Disposition of discrete passive components off-chip wires
Abstract
The invention relates to the technical field of chip processing, and particularly discloses a packaged chip of an integrated monopole antenna and a processing method thereof. The invention provides a package chip of an integrated monopole antenna, which comprises a bare chip fixed on a substrate, wherein a radio frequency bonding pad is arranged on the bare chip, and the package chip also comprises a positioning bonding pad which is arranged on the bare chip or the substrate; the radio frequency antenna further comprises a monopole antenna, the monopole antenna is an arc-shaped metal wire, one end of the monopole antenna is in bonding connection with the radio frequency bonding pad, the other end of the monopole antenna is in bonding connection with the positioning bonding pad, and the bare chip, the positioning bonding pad and the monopole antenna are all covered with packaging glue. The metal wire is bonded to the positioning bonding pad at the appointed position from the bare chip radio frequency bonding pad to form the monopole antenna, and then the packaging glue is adopted to cover and cure the monopole antenna to form the packaging chip of the integrated monopole antenna, so that the controllability of the length of the metal wire and the fixation of the metal wire can be realized, the packaging process has the condition of batch production, and the packaging process can be widely popularized.
Description
Technical Field
The invention relates to the technical field of chip processing, in particular to a packaged chip of an integrated monopole antenna and a processing method thereof.
Background
The monopole antenna is a vertical quarter-wave antenna. The antenna is mounted on a ground plane, the monopole antenna is fed at a lower end, and a ground conductor of the feed is connected to the platform. In free space, the radiation pattern of a quarter-wave monopole antenna in the vertical plane is similar in shape to the pattern of a half-wave dipole antenna in the vertical plane, but without subsurface radiation. In the horizontal plane, the vertical monopole antenna is omni-directional.
When the millimeter wave and terahertz integrated circuits are used as radio frequency front ends, antennas are needed to transmit signals. The current antenna is mainly an off-chip antenna, because the on-chip antenna has a large size and needs to consume a large area of chip. When the chip is connected with the off-chip antenna, a gold wire jumper is needed, and the gold wire jumper brings extra loss. In addition, the gold wire connection between the chip and the off-chip antenna increases the package size of the whole system, which is not favorable for the miniaturization of the system. Therefore, it is desirable to provide an integrated antenna and a packaging technique thereof for solving the problems of millimeter wave and terahertz integrated circuits.
Disclosure of Invention
In view of this, the present application provides a package chip of an integrated monopole antenna and a processing method thereof, which can realize a compact monopole antenna structure, avoid consuming precious wafer area, and simultaneously, the package thereof can be suitable for mass production, thereby ensuring the practicability and reliability of the monopole antenna.
In order to solve the technical problems, the technical scheme provided by the invention is a package chip of an integrated monopole antenna, which comprises a bare chip fixed on a substrate, wherein a radio frequency bonding pad is arranged on the bare chip, and the package chip also comprises a positioning bonding pad which is arranged on the bare chip or the substrate; the radio frequency antenna is characterized by further comprising a monopole antenna, wherein the monopole antenna is an arc-shaped metal wire, one end of the monopole antenna is in bonding connection with the radio frequency bonding pad, the other end of the monopole antenna is in bonding connection with the positioning bonding pad, and the bare chip, the positioning bonding pad and the monopole antenna are all covered with packaging glue.
The invention also provides a package chip of the integrated monopole antenna, which comprises a bare chip fixed on a substrate, wherein a radio frequency bonding pad is arranged on the bare chip, the package chip also comprises a monopole antenna, the monopole antenna is an arc-shaped metal wire, one end of the monopole antenna is in bonding connection with the radio frequency bonding pad, the other end of the monopole antenna is suspended in the air, and package glue covers the bare chip and the monopole antenna.
The invention also provides a package chip of the integrated monopole antenna, which comprises a bare chip fixed on a substrate, wherein the bare chip is provided with a radio frequency bonding pad, and at least two positioning bonding pads, and each positioning bonding pad is arranged on the substrate or the bare chip; still include monopole antenna, monopole antenna is the arc wire, monopole antenna's one end with radio frequency pad bonded connection, the other end and one the positioning pad bonded connection, this one the positioning pad is again with other the positioning pad is bonded connection in proper order, the bare chip the positioning pad with monopole antenna outside all covers has the encapsulation glue.
The invention also provides a package chip of the integrated monopole antenna, which comprises a bare chip fixed on a substrate, wherein a radio frequency bonding pad is arranged on the bare chip, the package chip also comprises a monopole antenna, the monopole antenna is a metal wire vertical to the bare chip, one end of the monopole antenna is in bonding connection with the radio frequency bonding pad, the other end of the monopole antenna is suspended, and package glue covers the bare chip and the monopole antenna.
The invention also provides a processing method of the packaged chip of the integrated monopole antenna, which comprises the following steps:
s11: fixing a bare chip on a substrate, wherein a radio frequency bonding pad is arranged on the bare chip, and a positioning bonding pad is arranged on the bare chip or the substrate;
s12: bonding and connecting the radio frequency bonding pad and the positioning bonding pad through a metal wire, wherein the metal wire connected between the radio frequency bonding pad and the positioning bonding pad forms a monopole antenna;
s13: and packaging and curing the bare chip, the positioning bonding pad and the monopole antenna to form a packaged chip of the integrated monopole antenna.
Preferably, the method for processing the packaged chip of the integrated monopole antenna further comprises the following steps:
s14: and a cutting line is arranged between the bare chip and the positioning bonding pad, the packaged bare chip and the positioning bonding pad are divided along the cutting line to form a packaged chip of the integrated monopole antenna, and the packaged chip of the integrated monopole antenna comprises a suspended monopole antenna and the bare chip.
Preferably, the method for connecting the rf pad and the capture pad by wire bonding in step S12 includes: and connecting the radio frequency bonding pad with the positioning bonding pad through gold wire bonding.
Preferably, the method for curing the die chip, the capture pad and the monopole antenna package in the step S13 includes: and covering the bare chip, the positioning bonding pad and the monopole antenna by using plastic for packaging and curing.
The invention also provides a processing method of the packaged chip of the integrated monopole antenna, which comprises the following steps:
s21: fixing a bare chip on a substrate, wherein two functional chips are arranged on the bare chip, radio frequency bonding pads are arranged on the two functional chips, and a cutting line is arranged between the two functional chips;
s22: bonding and connecting the two radio frequency bonding pads through metal wires, wherein the metal wires connected between the two radio frequency bonding pads form a monopole antenna;
s23: curing the bare chip and the monopole antenna package;
s24: and dividing the two packaged functional chips along the cutting line to form two packaged chips of integrated monopole antennas, wherein each packaged chip of the integrated monopole antenna comprises a suspended monopole antenna and one functional chip.
The invention also provides a processing method of the packaged chip of the integrated monopole antenna, which comprises the following steps:
s31: fixing two bare chip chips on a substrate, wherein radio frequency bonding pads are arranged on the two bare chip chips, and a cutting line is arranged between the two bare chip chips;
s32: bonding and connecting the two radio frequency bonding pads through metal wires, wherein the metal wires connected between the two radio frequency bonding pads form a monopole antenna;
s33: curing the two die chips and the monopole antenna package;
s34: and cutting the two packaged bare chip chips along the cutting line to form two packaged chips of integrated monopole antennas, wherein each packaged chip of the integrated monopole antenna comprises a suspended monopole antenna and a bare chip.
The invention also provides a processing method of the packaged chip of the integrated monopole antenna, which comprises the following steps:
s41: fixing a bare chip on a substrate, wherein the bare chip is provided with a radio frequency bonding pad and at least 2 positioning bonding pads, and the positioning bonding pads are arranged on the bare chip or the substrate;
s42: bonding and connecting the radio frequency bonding pad and one positioning bonding pad through a metal wire, bonding and connecting the positioning bonding pad and other positioning bonding pads through the metal wire, and forming a monopole antenna by the metal wire connected between the radio frequency bonding pad and each positioning bonding pad;
s43: and packaging and curing the bare chip, the positioning bonding pad and the monopole antenna to form a packaged chip of the integrated monopole antenna.
The invention also provides a processing method of the packaged chip of the integrated monopole antenna, which comprises the following steps:
s51: fixing a bare chip on a substrate, wherein a radio frequency bonding pad is arranged on the bare chip;
s52: bonding a metal wire perpendicular to the bare chip on the radio frequency bonding pad, wherein the metal wire forms a monopole antenna;
s53: cutting the monopole antenna;
s54: and packaging and curing the bare chip and the monopole antenna to form the packaged chip integrated with the monopole antenna.
Compared with the prior art, the beneficial effects of the method are detailed as follows: the invention provides a package chip of an integrated monopole antenna, which comprises a bare chip fixed on a substrate, wherein a radio frequency bonding pad is arranged on the bare chip, and the package chip also comprises a positioning bonding pad which is arranged on the bare chip or the substrate; the radio frequency antenna further comprises a monopole antenna, the monopole antenna is an arc-shaped metal wire, one end of the monopole antenna is in bonding connection with the radio frequency bonding pad, the other end of the monopole antenna is in bonding connection with the positioning bonding pad, and the bare chip, the positioning bonding pad and the monopole antenna are all covered with packaging glue. The metal wire is bonded to the positioning bonding pad at the appointed position from the bare chip radio frequency bonding pad to form the monopole antenna, and then the packaging glue is adopted to cover the monopole antenna and cure the monopole antenna to form the packaging chip of the integrated monopole antenna, so that the controllability of the length of the metal wire and the fixation of the metal wire can be realized, the antenna packaging has the condition of batch production, and the antenna packaging can be widely popularized and used.
Drawings
Fig. 1 is a schematic structural diagram of a packaged chip of an integrated monopole antenna according to an embodiment of the present invention;
fig. 2 is a schematic structural diagram of a packaged chip of an integrated monopole antenna according to a second embodiment of the present invention;
fig. 3 is a schematic structural diagram of a packaged chip of an integrated monopole antenna according to a third embodiment of the present invention;
fig. 4 is a schematic structural diagram of a packaged chip of an integrated monopole antenna according to a fourth embodiment of the present invention;
fig. 5 is a schematic structural diagram of a packaged chip of an integrated monopole antenna according to a fifth embodiment of the present invention;
fig. 6 is a schematic view illustrating a processing method of a packaged chip of an integrated monopole antenna according to a sixth embodiment of the present invention;
fig. 7 is a schematic structural diagram of a packaged chip of an integrated monopole antenna according to a seventh embodiment of the present invention;
fig. 8 is a schematic view illustrating a processing method of a packaged chip of an integrated monopole antenna according to an eighth embodiment of the present invention;
fig. 9 is a schematic structural diagram of a packaged chip of an integrated monopole antenna according to a ninth embodiment of the present invention;
fig. 10 is a schematic structural diagram of a packaged chip of an integrated monopole antenna according to a tenth embodiment of the present invention;
fig. 11 is a schematic structural diagram of a packaged chip of an integrated monopole antenna according to an eleventh embodiment of the present invention;
fig. 12 is a schematic structural diagram of a packaged chip of an integrated monopole antenna according to a twelfth embodiment of the present invention;
fig. 13 is a schematic structural diagram of a packaged chip integrated with a monopole antenna according to a thirteenth embodiment of the present invention;
the reference signs are: 11-substrate, 12-die chip, 121-first radio frequency pad, 122-first positioning pad, 21-first monopole antenna, 31-packaging glue, 123-second radio frequency pad, 124-second positioning pad, 22-second monopole antenna, 41-fourth monopole antenna, 42-fifth monopole antenna, 43-sixth monopole antenna, 125-third radio frequency pad, 126-third positioning pad, 128-fourth positioning pad, 130-fifth positioning pad, 132-sixth positioning pad, 23-third monopole antenna.
Detailed Description
In order to make the technical solutions of the present invention better understood by those skilled in the art, the present invention will be further described in detail with reference to the accompanying drawings and specific embodiments.
The invention provides a package chip of an integrated monopole antenna, which comprises a bare chip fixed on a substrate, wherein a radio frequency bonding pad is arranged on the bare chip; the positioning welding plate is arranged on the bare chip or the substrate; the radio frequency antenna further comprises a monopole antenna, the monopole antenna is an arc-shaped metal wire, one end of the monopole antenna is in bonding connection with the radio frequency bonding pad, the other end of the monopole antenna is in bonding connection with the positioning bonding pad, and the bare chip, the positioning bonding pad and the monopole antenna are all covered with packaging glue.
The capture pad may be disposed on the die core or on the substrate. When the positioning bonding pad is arranged on the die chip, the position of the positioning bonding pad can be set according to actual needs, which is described in the following examples:
as shown in fig. 1, a package chip of an integrated monopole antenna according to an embodiment of the present invention includes a die chip 12 fixed on a substrate 11, the die chip 12 is provided with a first rf pad 121, and further includes a first positioning pad 122, the first positioning pad 122 is disposed on the die chip 12; the antenna further comprises a first monopole antenna 21, the first monopole antenna 21 is an arc-shaped metal wire, one end of the first monopole antenna 21 is in bonding connection with the first radio frequency bonding pad 121, the other end of the first monopole antenna is in bonding connection with the first positioning bonding pad 122, and the bare chip 12, the first positioning bonding pad 122 and the first monopole antenna 21 are covered with the packaging adhesive 31. The first monopole antenna 21 may be a gold wire. The packaging adhesive 31 may be plastic.
As shown in fig. 2, a second embodiment of the present invention provides a packaged chip of an integrated monopole antenna, which is different from the packaged chip of the integrated monopole antenna provided in fig. 1 in that the first positioning pad 122 is disposed on the bare-chip 12, i.e., on a die, and the difference is that the position of the first positioning pad 122 is different. For a packaged chip of an integrated monopole antenna with capture pads disposed on the die, to save die area, the capture pads may be disposed within the functional area of the die chip as the design allows, as shown in fig. 2, without leaving additional void area for gold wire jumpers alone.
The first embodiment and the second embodiment are the packaged chips of the integrated monopole antenna under the condition of no cutting, and the gold wire jumper wire precision of the packaged chips can be ensured by designing the positions of the positioning bonding pads on the wafer.
The invention also provides a processing method for processing the packaged chip of the monopole antenna integrated in the first embodiment and the second embodiment, which comprises the following steps:
s111: fixing a bare chip on a substrate, wherein a first radio frequency bonding pad and a first positioning bonding pad are arranged on the bare chip;
s121: a gold wire is adopted to bond and connect the first radio frequency bonding pad and the first positioning bonding pad, and the gold wire connected between the first radio frequency bonding pad and the first positioning bonding pad forms a first monopole antenna;
s131: and packaging and curing the bare chip, the first positioning bonding pad and the first monopole antenna to form a packaged chip of the integrated monopole antenna.
The capture pad may also be disposed on the substrate, and the position of the capture pad may be set according to actual needs, for example:
as shown in fig. 3, a packaged chip integrated with a monopole antenna according to a third embodiment of the present invention is different from the packaged chip integrated with a monopole antenna in fig. 1 in that the first positioning pads 122 are disposed on the substrate 11, so that the area of a waste die can be further reduced.
The embodiment of the invention also provides a processing method for processing the packaged chip of the triple-integrated monopole antenna, which comprises the following steps:
s112: fixing a bare chip on a substrate, wherein the bare chip is provided with a first radio frequency bonding pad, and the substrate is provided with a first positioning bonding pad;
s122: a gold wire is adopted to bond and connect the first radio frequency bonding pad and the first positioning bonding pad, and the gold wire connected between the first radio frequency bonding pad and the first positioning bonding pad forms a first monopole antenna;
s132: and packaging and curing the bare chip, the first positioning bonding pad and the first monopole antenna to form a packaged chip of the integrated monopole antenna.
In the package chip integrated with a monopole antenna provided in the embodiment of the present invention, there may be a plurality of radio frequency pads, a plurality of positioning pads, and a plurality of monopole antennas, which are described in the following examples:
as shown in fig. 4, a packaged chip of an integrated monopole antenna according to a fourth embodiment of the present invention includes a die chip 12 fixed on a substrate 11, the die chip 12 is provided with a first rf bonding pad 121 and a second rf bonding pad 123, and further includes a first positioning bonding pad 122 and a second positioning bonding pad 124, where the first positioning bonding pad 122 and the second positioning bonding pad 124 are both disposed on the die chip 12; the antenna further comprises a first monopole antenna 21 and a second monopole antenna 22, wherein the first monopole antenna 21 and the second monopole antenna 22 are both arc-shaped metal wires, one end of the first monopole antenna 21 is in bonding connection with the first radio frequency bonding pad 121, the other end of the first monopole antenna is in bonding connection with the first positioning bonding pad 122, one end of the second monopole antenna 22 is in bonding connection with the second radio frequency bonding pad 123, the other end of the second monopole antenna is in bonding connection with the second positioning bonding pad 124, and the bare chip 12, the first positioning bonding pad 122, the second positioning bonding pad 124 and the monopole antenna 21 are all covered with the packaging adhesive 31. The processing method of the packaged chip integrated with the monopole antenna in the first embodiment can be adopted for processing the packaged chip integrated with the monopole antenna.
The invention also provides a package chip of the integrated monopole antenna, which comprises a bare chip fixed on the substrate, wherein a radio frequency bonding pad is arranged on the bare chip, the package chip also comprises a monopole antenna, the monopole antenna is an arc-shaped metal wire, one end of the monopole antenna is bonded and connected with the radio frequency bonding pad, the other end of the monopole antenna is suspended, and package glue covers the bare chip and the monopole antenna. The following examples illustrate:
as shown in fig. 5, a fifth embodiment of the present invention provides a packaged chip integrated with a monopole antenna, including a bare chip 12 fixed on a substrate 11, the bare chip 12 being provided with a first radio frequency bonding pad 121, and further including a fourth monopole antenna 41, the fourth monopole antenna 41 being an arc-shaped metal wire, one end of the fourth monopole antenna 41 being connected to the first radio frequency bonding pad 121 in a bonding manner, and the other end being suspended, the bare chip 12 and the fourth monopole antenna 41 being covered with a packaging adhesive 31. Wherein the side of the die chip 12 provided with the first radio frequency pad 121 is flush with the side of the lower substrate 11.
As shown in fig. 6, a sixth embodiment of the present invention provides a processing method for processing a packaged chip of the integrated monopole antenna shown in fig. 5, which specifically includes:
s21: fixing a bare chip on a substrate, arranging two functional chips which are oppositely arranged on the bare chip, namely a wafer, arranging radio frequency bonding pads on the two functional chips, wherein the two radio frequency bonding pads are adjacent, arranging a cutting line between the two functional chips, and the cutting line is positioned on a middle line between the two functional chips;
s22: the two radio frequency bonding pads are connected in a bonding mode through a gold wire, and the gold wire connected between the two radio frequency bonding pads forms a monopole antenna;
s23: packaging and curing the bare chip and the monopole antenna by using plastic rubber;
s24: and cutting the two packaged functional chips along the middle line between the two functional chips to form two packaged chips of the integrated monopole antenna, wherein each packaged chip of the integrated monopole antenna comprises a suspended monopole antenna and one functional chip.
The processing method can simultaneously realize two chips and the monopole antenna which are well packaged, and in the mode, the two radio frequency bonding pads are realized on a wafer, so that high precision can be realized.
The embodiment of the invention also provides another processing method for processing the packaged chip of the integrated monopole antenna shown in fig. 5, which specifically comprises the following steps:
s113: fixing a bare chip on a substrate, wherein a radio frequency bonding pad is arranged on the bare chip, a positioning bonding pad is arranged on the bare chip, and a cutting line is arranged between the bare chip and the positioning bonding pad;
s123: connecting the radio frequency bonding pad and the positioning bonding pad through gold wire bonding, wherein the gold wire connected between the radio frequency bonding pad and the positioning bonding pad forms a monopole antenna;
s133: curing the bare chip, the positioning bonding pad and the monopole antenna package;
s143: and cutting the packaged bare chip and the positioning bonding pad along a cutting line to form a packaged chip of the integrated monopole antenna, wherein the packaged chip of the integrated monopole antenna comprises a suspended monopole antenna and the bare chip.
It should be noted that the monopole antenna implemented by the method is not cut, that is, the step S143 is not performed, that is, the packaged chip of the integrated monopole antenna shown in fig. 1 is obtained. In the method, the radio frequency bonding pad and the positioning bonding pad are both realized on a wafer, so that high precision can be realized. The dotted line region means that a grounding metal or an insulating medium can be arranged below the gold wire jumper, and the dotted line region needs to be designed according to different application scenes.
As shown in fig. 7, the seventh embodiment of the present invention further provides a packaged chip of an integrated monopole antenna, which is different from the packaged chip of the integrated monopole antenna provided in fig. 5 in that the side of the die chip 12 provided with the first radio frequency pad 121 is not flush with the side of the lower substrate 11, that is, the die chip is not cut from one die chip, but two separate die chips are cut from the die chip.
As shown in fig. 8, an eighth embodiment of the present invention provides a processing method for processing a packaged chip of the integrated monopole antenna shown in fig. 7, including:
s31: fixing two bare chip chips on a substrate, wherein the two bare chip chips are oppositely arranged, radio frequency bonding pads are arranged on the two bare chip chips, the two radio frequency bonding pads are adjacent, a cutting line is arranged between the two bare chip chips, and the cutting line is positioned on a middle line between the two bare chips, namely the substrate;
s32: the two radio frequency bonding pads are connected in a bonding mode through a gold wire, and the gold wire connected between the two radio frequency bonding pads forms a monopole antenna;
s33: covering the two bare chip chips and the monopole antenna by using plastic to carry out packaging and curing;
s34: and cutting the two packaged bare chip along the middle line between the two bare chip to form two packaged chips of the integrated monopole antenna, wherein each packaged chip of the integrated monopole antenna comprises a suspended monopole antenna and one bare chip.
The processing method has the advantages that the positions of the two bare chip chips are fixed on the substrate, the position precision is not as good as that of the scheme realized on the wafer, but the scheme can save the wafer area because a certain gap between the bare chip chips does not need to be reserved on the wafer.
The embodiment of the invention also provides a processing method for processing the packaged chip of the integrated monopole antenna shown in fig. 7, which comprises the following steps:
s114: fixing a bare chip on a substrate, wherein a radio frequency bonding pad is arranged on the bare chip, a positioning bonding pad is arranged on the substrate, and a cutting line is arranged between the bare chip and the positioning bonding pad;
s124: connecting the radio frequency bonding pad and the positioning bonding pad through gold wire bonding, wherein the gold wire connected between the radio frequency bonding pad and the positioning bonding pad forms a monopole antenna;
s134: curing the bare chip, the positioning bonding pad and the monopole antenna package;
s144: and cutting the packaged bare chip and the positioning bonding pad along a cutting line to form a packaged chip of the integrated monopole antenna, wherein the packaged chip of the integrated monopole antenna comprises a suspended monopole antenna and the bare chip.
The monopole antenna realized by the method is not cut, that is, the step S144 is not performed, and the packaged chip of the integrated monopole antenna is obtained as shown in fig. 3. In this method, the capture pad is implemented on the substrate with a less precise location than if the capture pad were set on the die. The dotted line region means that a grounding metal or an insulating medium can be arranged below the gold wire jumper, and the dotted line region needs to be designed according to different application scenes.
The sixth embodiment and the eighth embodiment can realize that two packaged chips of the integrated monopole antenna are cut at a time, and the consistency of the two packaged chips can be better ensured under the condition of two same chips.
The number of the radio frequency bonding pads of the packaging chip of the integrated monopole antenna can be multiple, the number of the positioning bonding pads can be multiple, and the number of the monopole antenna can be multiple. The above schemes can be combined according to practical situations, can be applied to the case of a plurality of monopole antennas, and can be selected according to situations whether the direction is a single-side direction or a plurality of directions. According to actual needs, one monopole antenna may be bonded and connected with one radio frequency pad and a plurality of positioning pads respectively to form an antenna array, which is described as follows:
for example, as shown in fig. 9, a monopole antenna array formed by several monopole antennas side by side is further provided in an embodiment of the present invention, which includes a bare chip 12 fixed on a substrate 11, the bare chip 12 is provided with a first rf pad 121, a second rf pad 123, a third rf pad 125, a fourth monopole antenna 41, a fifth monopole antenna 42, a sixth monopole antenna 43, the fourth monopole antenna 41, the fifth monopole antenna 42, and the sixth monopole antenna 43 are all arc-shaped metal wires, one end of the fourth monopole antenna 41 is bonded to the first rf pad 121, and the other end is suspended, one end of the fifth monopole antenna 42 is bonded to the second rf pad 123, and the other end is suspended, one end of the sixth monopole antenna 43 is bonded to the third rf pad 125, and the other end is suspended, the bare-chip 12, the fourth monopole antenna 41, the fifth monopole antenna 42, and the sixth monopole antenna 43 are all covered with the package adhesive 31. The processing method of the packaged chip of the integrated monopole antenna can be slightly improved by adopting the processing method in the eighth embodiment.
For example, a monopole antenna array with one rf pad bonded to a plurality of positioning pads is provided, as shown in fig. 10, an embodiment of the present invention provides a package chip integrated with a monopole antenna, including a die chip 12 fixed on a substrate 11, the die chip 12 having a first rf pad 121 thereon, the substrate 11 having a first positioning pad 122, a second positioning pad 124, a third positioning pad 126, a fourth positioning pad 128, a fifth positioning pad 130, and a sixth positioning pad 132 thereon, the first rf pad 121, the first positioning pad 122, the second positioning pad 124, and the third positioning pad 126 being sequentially bonded by gold wires to form a first monopole antenna, the first rf pad 121 and the fourth positioning pad 128 being sequentially bonded by gold wires to form a second monopole antenna, the first rf pad 121, the fifth positioning pad 130, and the sixth positioning pad 132 being sequentially bonded by gold wires to form a third monopole antenna, the bare chip 12 and the exterior of each monopole antenna are covered with the packaging adhesive 31, so that the packaged chip of the integrated monopole antenna array is formed.
For example, as shown in fig. 11, the eleventh embodiment of the present invention provides a package chip integrated with a monopole antenna, which includes a die chip 12 fixed on a substrate 11, the die chip 12 having a first rf pad 121, a second rf pad 123 and a third rf pad 125, the substrate 11 having a first positioning pad 122, a first monopole antenna is formed by connecting the first rf pad 121 and the first positioning pad 122 by gold wire bonding, a second monopole antenna is formed by gold wire bonding to connect the second rf pad 123 and the first positioning pad 122, the third rf bonding pad 125 and the first positioning bonding pad 122 are connected by gold wire bonding to form a third monopole antenna, and the bare chip 12 and the exterior of each monopole antenna are covered with the packaging adhesive 31, so as to form a packaged chip of the integrated monopole antenna array.
For example, after one rf pad is bonded to one capture pad, the rf pad is further bonded to a plurality of capture pads to form a monopole antenna array, as shown in fig. 12, a twelfth embodiment of the present invention provides a package chip integrated with a monopole antenna, including a die chip 12 fixed on a substrate 11, the die chip 12 having a first rf pad 121, the substrate 11 having a first capture pad 122, a second capture pad 124, and a third capture pad 126, the first rf pad 121 and the first capture pad 122 being connected by gold wire bonding to form a first monopole antenna, the first rf pad 121 and the second capture pad 124 being connected by gold wire bonding to form a second monopole antenna, the first rf pad 121 and the third capture pad 126 being connected by gold wire bonding to form a third monopole antenna, the die chip 12 and each monopole antenna being covered with a package gel 31, thereby forming a packaged chip integrating the monopole antenna array.
The package chip of the integrated monopole antenna array is cured after being covered with plastic after the bonding process is completed, and the positioning bonding pad can be placed on a wafer or a substrate and selected according to different application requirements. The above are examples only, but not limited to the above.
The monopole antenna capable of being produced in batches is realized by bonding plastic and gold wires, and the core idea is to bond the gold wire jumper wire to a specified position from a bare chip radio frequency bonding pad and cure the gold wire jumper wire by plastic covering. The directional diagram and frequency characteristics of the monopole antenna can be adjusted by setting the length and radian of the gold wire jumper. Therefore, the controllability of the length of the gold wire and the fixation of the gold wire can be realized, and the monopole antenna package has the condition of batch production. The length and radian of the gold wire jumper can be adjusted by setting relevant parameters of an automatic bonding machine. The gold wire used in the present invention may also be replaced with other metals, such as copper, aluminum, etc. The invention has various implementation modes, and particularly shows that when the gold wire jumper is bonded to a specified position, the position has diversity in selection. The scheme for realizing the array antenna by bonding the multiple gold wires can design bonding modes and quantity according to actual requirements. There may be different encapsulation processes depending on the location.
As shown in fig. 13, a thirteenth embodiment of the present invention provides a packaged chip integrated with a monopole antenna, including a bare chip 12 fixed on a substrate 11, the bare chip 12 being provided with a first radio frequency bonding pad 121, and further including a third monopole antenna 23, the third monopole antenna 23 being a metal wire perpendicular to the bare chip 12, one end of the third monopole antenna 23 being bonded to the first radio frequency bonding pad 121, and the other end being suspended, the bare chip 12 and the third monopole antenna 23 being covered with a package adhesive 31.
The invention also provides a processing method for processing the packaged chip of the integrated monopole antenna, which comprises the following steps:
s51: fixing a bare chip on a substrate, wherein a radio frequency bonding pad is arranged on the bare chip;
s52: bonding a metal wire perpendicular to the bare chip on the radio frequency bonding pad, wherein the metal wire forms a monopole antenna;
s53: cutting the monopole antenna;
s54: and packaging and curing the bare chip and the monopole antenna to form the packaged chip integrated with the monopole antenna.
It should be noted that, in the package chip of the integrated monopole antenna and the processing method thereof in the above embodiment, the third monopole antenna 23 may be a gold wire, the package adhesive 31 may be a conductive adhesive, and a bonding machine may be used to complete a bonding process. The length of the gold wire can be controlled by cutting, so that the directional diagram and the frequency characteristic of the monopole antenna can be adjusted, and the gold wire is cured by covering the third monopole antenna 23 with conductive adhesive. Therefore, the controllability of the length of the gold wire and the fixation of the gold wire can be realized, and the antenna has the condition of batch production.
The invention utilizes plastic to solidify the bonded gold wire, thereby ensuring that the gold wire is firm and is not easy to bend, deform and damage. Meanwhile, the length of gold wire bonding can realize better precision by designing the position of the positioning bonding pad, and has better repeatability. So that the invention has the condition of large-scale production.
The above is only a preferred embodiment of the present invention, and it should be noted that the above preferred embodiment should not be considered as limiting the present invention, and the protection scope of the present invention should be subject to the scope defined by the claims. It will be apparent to those skilled in the art that various modifications and adaptations can be made without departing from the spirit and scope of the invention, and these modifications and adaptations should be considered within the scope of the invention.
Claims (11)
1. A processing method for a packaged chip of an integrated monopole antenna is characterized by comprising the following steps:
s11: fixing a bare chip on a substrate, wherein a radio frequency bonding pad is arranged on the bare chip, and a positioning bonding pad is arranged on the bare chip or the substrate;
s12: bonding and connecting the radio frequency bonding pad and the positioning bonding pad through a metal wire, wherein the metal wire connected between the radio frequency bonding pad and the positioning bonding pad forms a monopole antenna;
s13: packaging and curing the bare chip, the positioning bonding pad and the monopole antenna to form a packaged chip of the integrated monopole antenna;
s14: and a cutting line is arranged between the bare chip and the positioning bonding pad, the packaged bare chip and the positioning bonding pad are divided along the cutting line to form a packaged chip of the integrated monopole antenna, and the packaged chip of the integrated monopole antenna comprises a suspended monopole antenna and the bare chip.
2. The method for processing the packaged chip of the integrated monopole antenna according to claim 1, wherein the step of connecting the radio frequency pad and the positioning pad by wire bonding in the step S12 comprises: and connecting the radio frequency bonding pad with the positioning bonding pad through gold wire bonding.
3. The method for processing the packaged chip of the integrated monopole antenna according to claim 1, wherein the step of curing the bare chip, the positioning pad and the monopole antenna package in the step S13 comprises: and covering the bare chip, the positioning bonding pad and the monopole antenna by using plastic for packaging and curing.
4. A packaged chip of an integrated monopole antenna processed by the method for processing the packaged chip of the integrated monopole antenna according to any one of claims 1-3.
5. The packaging chip of the integrated monopole antenna comprises a bare chip fixed on a substrate, wherein a radio frequency bonding pad is arranged on the bare chip, the packaging chip further comprises a monopole antenna, the monopole antenna is an arc-shaped metal wire, one end of the monopole antenna is in bonding connection with the radio frequency bonding pad, the other end of the monopole antenna is suspended, and packaging glue covers the bare chip and the monopole antenna.
6. A processing method for a packaged chip of an integrated monopole antenna is characterized by comprising the following steps:
s21: fixing a bare chip on a substrate, wherein two functional chips are arranged on the bare chip, radio frequency bonding pads are arranged on the two functional chips, and a cutting line is arranged between the two functional chips;
s22: bonding and connecting the two radio frequency bonding pads through metal wires, wherein the metal wires connected between the two radio frequency bonding pads form a monopole antenna;
s23: curing the bare chip and the monopole antenna package;
s24: and dividing the two packaged functional chips along the cutting line to form two packaged chips of integrated monopole antennas, wherein each packaged chip of the integrated monopole antenna comprises a suspended monopole antenna and one functional chip.
7. A packaged chip of an integrated monopole antenna, which is processed by the method for processing the packaged chip of the integrated monopole antenna according to claim 6.
8. The packaging chip of the integrated monopole antenna comprises a bare chip fixed on a substrate, wherein a radio frequency bonding pad is arranged on the bare chip, the packaging chip further comprises a monopole antenna, the monopole antenna is an arc-shaped metal wire, one end of the monopole antenna is in bonding connection with the radio frequency bonding pad, the other end of the monopole antenna is suspended, and packaging glue covers the bare chip and the monopole antenna.
9. A processing method for a packaged chip of an integrated monopole antenna is characterized by comprising the following steps:
s31: fixing two bare chip chips on a substrate, wherein radio frequency bonding pads are arranged on the two bare chip chips, and a cutting line is arranged between the two bare chip chips;
s32: bonding and connecting the two radio frequency bonding pads through metal wires, wherein the metal wires connected between the two radio frequency bonding pads form a monopole antenna;
s33: curing the two die chips and the monopole antenna package;
s34: and cutting the two packaged bare chip chips along the cutting line to form two packaged chips of integrated monopole antennas, wherein each packaged chip of the integrated monopole antenna comprises a suspended monopole antenna and a bare chip.
10. A packaged chip of an integrated monopole antenna, which is manufactured by the method for manufacturing a packaged chip of an integrated monopole antenna according to claim 9.
11. The packaged chip of the integrated monopole antenna comprises a bare chip fixed on a substrate, wherein a radio frequency bonding pad is arranged on the bare chip, and the packaged chip further comprises a monopole antenna, the monopole antenna is an arc-shaped metal wire, one end of the monopole antenna is in bonding connection with the radio frequency bonding pad, the other end of the monopole antenna is suspended, and the bare chip and the monopole antenna are both covered with packaging glue.
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| CN1957506A (en) * | 2004-04-12 | 2007-05-02 | 艾尔加因公司 | Switched multi-beam antenna |
| CN101023560A (en) * | 2004-08-06 | 2007-08-22 | 国际商业机器公司 | Apparatus and methods for constructing antennas using wire bonds as radiating elements |
| WO2011025241A2 (en) * | 2009-08-26 | 2011-03-03 | 연세대학교 산학협력단 | Bonding wire antenna communication module |
| CN103889149A (en) * | 2012-12-21 | 2014-06-25 | 华为终端有限公司 | Electronic device and grid array module |
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| Publication number | Priority date | Publication date | Assignee | Title |
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| US7586193B2 (en) * | 2005-10-07 | 2009-09-08 | Nhew R&D Pty Ltd | Mm-wave antenna using conventional IC packaging |
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|---|---|---|---|---|
| CN1957506A (en) * | 2004-04-12 | 2007-05-02 | 艾尔加因公司 | Switched multi-beam antenna |
| CN101023560A (en) * | 2004-08-06 | 2007-08-22 | 国际商业机器公司 | Apparatus and methods for constructing antennas using wire bonds as radiating elements |
| WO2011025241A2 (en) * | 2009-08-26 | 2011-03-03 | 연세대학교 산학협력단 | Bonding wire antenna communication module |
| CN103889149A (en) * | 2012-12-21 | 2014-06-25 | 华为终端有限公司 | Electronic device and grid array module |
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