WO2011018544A3 - Magnetron device and method for the uniform erosion of a target using such a device - Google Patents

Magnetron device and method for the uniform erosion of a target using such a device Download PDF

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Publication number
WO2011018544A3
WO2011018544A3 PCT/ES2010/070550 ES2010070550W WO2011018544A3 WO 2011018544 A3 WO2011018544 A3 WO 2011018544A3 ES 2010070550 W ES2010070550 W ES 2010070550W WO 2011018544 A3 WO2011018544 A3 WO 2011018544A3
Authority
WO
WIPO (PCT)
Prior art keywords
target
magnets
network
uniform erosion
areas
Prior art date
Application number
PCT/ES2010/070550
Other languages
Spanish (es)
French (fr)
Other versions
WO2011018544A2 (en
Inventor
Fernando BRIONES FERNÁNDEZ-POLA
Iván FERNÁNDEZ MARTÍNEZ
Original Assignee
Consejo Superior De Investigaciones Cientificas (Csic)
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Consejo Superior De Investigaciones Cientificas (Csic) filed Critical Consejo Superior De Investigaciones Cientificas (Csic)
Publication of WO2011018544A2 publication Critical patent/WO2011018544A2/en
Publication of WO2011018544A3 publication Critical patent/WO2011018544A3/en

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Classifications

    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
    • C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
    • C23C14/34—Sputtering
    • C23C14/35—Sputtering by application of a magnetic field, e.g. magnetron sputtering
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
    • H01J37/32—Gas-filled discharge tubes
    • H01J37/34—Gas-filled discharge tubes operating with cathodic sputtering
    • H01J37/3402—Gas-filled discharge tubes operating with cathodic sputtering using supplementary magnetic fields
    • H01J37/3405—Magnetron sputtering
    • H01J37/3408—Planar magnetron sputtering
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
    • H01J37/32—Gas-filled discharge tubes
    • H01J37/34—Gas-filled discharge tubes operating with cathodic sputtering
    • H01J37/3411—Constructional aspects of the reactor
    • H01J37/345—Magnet arrangements in particular for cathodic sputtering apparatus
    • H01J37/3455—Movable magnets

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Plasma & Fusion (AREA)
  • Analytical Chemistry (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Materials Engineering (AREA)
  • Mechanical Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Physical Vapour Deposition (AREA)

Abstract

The invention relates to a device comprising a specific arrangement of magnets (4) that generate a magnetic field enabling a practically uniform erosion of a cathode or target (2), in such a way that the material thereof is almost fully used. The magnetron device comprises the target (2) fixed to a metallic plate (3) behind which magnets (4) are fixed to a magnetic plate (5). The magnets (4) are arranged according to a periodical two-dimensional network on a magnetic plate (5) that can be moved parallel to the target (2) along one of the axes of the network, between a first position and a second position separated by half of the parameter of the network, in such a way that areas of high plasma concentration generated in the first position correspond to areas of low plasma concentration in the second position and vice versa.
PCT/ES2010/070550 2009-08-14 2010-08-12 Magnetron device and method for the uniform erosion of a target using such a device WO2011018544A2 (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
ES200930600A ES2353102B1 (en) 2009-08-14 2009-08-14 MAGNETRON DEVICE AND UNIFORM EROSION PROCEDURE OF A WHITE USING SUCH DEVICE
ESP200930600 2009-08-14

Publications (2)

Publication Number Publication Date
WO2011018544A2 WO2011018544A2 (en) 2011-02-17
WO2011018544A3 true WO2011018544A3 (en) 2011-07-07

Family

ID=43569209

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/ES2010/070550 WO2011018544A2 (en) 2009-08-14 2010-08-12 Magnetron device and method for the uniform erosion of a target using such a device

Country Status (2)

Country Link
ES (1) ES2353102B1 (en)
WO (1) WO2011018544A2 (en)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
FR3079775B1 (en) * 2018-04-06 2021-11-26 Addup MAGNETIC CONTAINER HEATING DEVICE FOR SELECTIVE ADDITIVE MANUFACTURING APPLIANCE

Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS59133370A (en) * 1983-01-21 1984-07-31 Seiko Instr & Electronics Ltd Magnetron sputtering device
JPH03240953A (en) * 1990-02-16 1991-10-28 Seiko Electronic Components Ltd Magnetron sputtering device
DE4127261C1 (en) * 1991-08-17 1992-06-04 Forschungsges Elektronenstrahl Sputtering equipment for coating large substrates with ferromagnetic and non-magnetic material - has cathode target comprising sub-targets, and cooling plates contg. magnet unit and poles shoes
EP0918351A1 (en) * 1997-11-19 1999-05-26 Sinvaco N.V. Improved planar magnetron with moving magnet assembly
EP1010194A1 (en) * 1997-09-05 2000-06-21 Nordiko Limited Vacuum sputtering apparatus
US20060118412A1 (en) * 2003-05-23 2006-06-08 Jorg Krempel-Hesse Magnetron sputter cathode

Patent Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS59133370A (en) * 1983-01-21 1984-07-31 Seiko Instr & Electronics Ltd Magnetron sputtering device
JPH03240953A (en) * 1990-02-16 1991-10-28 Seiko Electronic Components Ltd Magnetron sputtering device
DE4127261C1 (en) * 1991-08-17 1992-06-04 Forschungsges Elektronenstrahl Sputtering equipment for coating large substrates with ferromagnetic and non-magnetic material - has cathode target comprising sub-targets, and cooling plates contg. magnet unit and poles shoes
EP1010194A1 (en) * 1997-09-05 2000-06-21 Nordiko Limited Vacuum sputtering apparatus
EP0918351A1 (en) * 1997-11-19 1999-05-26 Sinvaco N.V. Improved planar magnetron with moving magnet assembly
US20060118412A1 (en) * 2003-05-23 2006-06-08 Jorg Krempel-Hesse Magnetron sputter cathode

Also Published As

Publication number Publication date
ES2353102A1 (en) 2011-02-25
ES2353102B1 (en) 2011-12-30
WO2011018544A2 (en) 2011-02-17

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