WO2011002116A1

WO2011002116A1 - Heat sink structure for a housing of a wireless communication apparatus

Info

Publication number: WO2011002116A1
Application number: PCT/KR2009/003569
Authority: WO
Inventors: 김덕용
Original assignee: 주식회사 케이엠더블유
Priority date: 2009-06-30
Filing date: 2009-06-30
Publication date: 2011-01-06

Abstract

The present invention relates to a heat sink structure for a housing of a wireless communication apparatus, wherein the structure comprises a heat sink plate comprising: a plurality of heat sink fins; a mounting structure coupled and fixed to an installation post on which the entire housing is installed to mount the entire housing; and a contacting structure for contacting a portion of an exterior surface of the installation post when installed on the installation post by means of the mounting structure.

Description

Heat Dissipation Structure of Enclosure of Wireless Communication Equipment

The present invention relates to a housing device of a wireless communication device, and more particularly to a heat dissipation structure of the housing device.

As is generally known, various communication devices are installed in a wireless communication device enclosure, among which a high power amplifier, a radio frequency (RF) signal processing block, a high speed signal processing device, a power supply device, and a digital processing unit are generated. Are also equipped.

The heat generated by the devices operating at their maximum load increases the air temperature inside the communication device enclosure containing these devices. As such, if the air temperature inside the enclosure rises, the heat will shorten the life of the equipment and reduce its function, affecting other adjacent devices, and in severe cases, it may cause malfunction or inability to process the data.

Furthermore, since these devices have a sealed structure for waterproofing, moisture proofing, and dustproofing, the temperature rise inside the enclosure can be said to be fatal to the malfunction and damage of the equipment. .

Accordingly, an object of the present invention is to provide a heat dissipation structure of an enclosure of a wireless communication device for enabling more efficient heat dissipation.

Another object of the present invention is to provide a heat dissipation structure of the enclosure of the wireless communication device for improving the heat dissipation efficiency to configure a smaller size of the housing device, to facilitate the configuration and installation of the housing device.

In order to achieve the above object, the present invention, in the heat dissipation structure of the housing device of the wireless communication device, a plurality of heat dissipation fins, and is fixedly coupled to the installation column is installed the whole housing device is mounted to the entire housing device through this And a heat dissipation plate including a mounting structure for contacting and a contact structure for contacting a portion of an outer surface of the mounting pillar when the mounting mechanism is installed to the mounting pillar through the mounting mechanism.

Therefore, the heat dissipation structure of the enclosure of the wireless communication device according to the present invention has a good heat dissipation efficiency of the enclosure and can be miniaturized, and thus can be easily manufactured and installed.

1 is a cross-sectional view of an enclosure of a wireless communication device according to the prior art.

2 is a partial cutaway perspective view of a housing of a wireless communication device according to the prior art;

3 is a perspective view of a heat sink according to the prior art

4 is a perspective view showing a heat dissipation structure of a housing device of a wireless communication device according to an embodiment of the present invention;

Figure 5 is a plan view cut structure of the main part of Figure 4

Hereinafter, exemplary embodiments of the present invention will be described in detail with reference to the accompanying drawings. In the following description, specific details such as specific components are shown, which are provided to help a more general understanding of the present invention, and it is understood that these specific details may be changed or changed within the scope of the present invention. It is self-evident to those of ordinary knowledge in Esau.

1 is a cross-sectional view of a housing device of a wireless communication device according to the prior art, Figure 2 is a partially cut perspective view of the housing device of a wireless communication device according to the prior art, Figure 3 is a perspective view of a heat sink according to the prior art. 1 to 3, an example of a general communication device housing apparatus to which the present invention is applied will be described.

As shown schematically in FIG. 1, a general communication device 100 includes a housing 110 having a predetermined accommodation space, and a communication space such as a high output amplifier, a power supply, and the like in the accommodation space within the housing 110. Electronic devices are mounted.

The rear side of the enclosure 100 is provided with a cooling device 130 for cooling the elevated temperature in the enclosure 100, the cooling device 130 by using a passive cooling method and a fan simply attached to the heat sink 140. By selecting an appropriate method according to the situation of the active cooling system forcibly circulating the air around the heat sink (140).

1 to 3 is provided with a passive cooling method and an active cooling method, as shown in the heat sink 140, the plurality of heat dissipation fins 145 are integrally installed on the rear of the enclosure 110 and Blowing fan 150 installed in the lower portion of the enclosure 110 and the rear side of the enclosure 110 to forcibly blow air into the heat sink 140, a plurality of air to be discharged to the outside It consists of the porous plate 160 with through holes formed therein.

Communication electronic devices 115 are mounted in the enclosure 110, that is, at positions corresponding to the heat sink 140. The door 113 is installed on the front of the enclosure. In addition, the porous plate 160 may be attached to the rear of the housing 110. A plurality of blowing fans 150 may be installed at the lower end between the heat sink 140 and the porous plate 160. And to prevent radiant heat may be additionally installed on the outer circumferential surface of the lower body spaced apart from the radiant heat prevention plate (not shown).

Such communication device enclosures are commonly applied to outdoor communication devices that should be installed high above the ground, such as in the installation pillar of the base station antenna. In this case, in order to improve the heat dissipation efficiency in this case, the structure of the heat dissipating plate 140 is improved, and the heat dissipating plate is directly contacted with the installation pillar, and the installation pillar itself is proposed as a heat dissipation tool. Hereinafter, the heat dissipation structure of the enclosure according to the present invention with reference to FIGS. 3 and 4 will be described in more detail.

Figure 4 is a perspective view showing the heat dissipation structure of the enclosure of the wireless communication device according to an embodiment of the present invention, Figure 5 is a plan view cut structure of the main part of FIG. 4 and 5, the heat dissipation structure of the housing device according to the present invention is implemented in the heat dissipation plate 240 attached to the housing device 200, such heat dissipation plate 240, first, a plurality of conventional structures The heat dissipation fin 245 is provided.

In this case, the heat sink 240 is fixedly coupled to the installation pillar 300 of the base station antenna according to the characteristics of the present invention is provided with a mounting mechanism for mounting the entire enclosure 200 to the installation pillar 300 of the antenna through this do. The mounting fixture may be a screw groove structure 222, as in the example of FIG. 4, the screw groove structure 222 being screwed to the bracket device 220 which is fixedly coupled to the actual antenna mounting pillar 300. It is coupled through, the entire housing device 200 including the heat sink 240 is fixed to the installation pillar 300 of the antenna via the bracket device 220.

Although only one bracket device 220 is shown in FIG. 4, the bracket device 220 is provided at two positions, respectively, at an upper end and a lower end of the heat sink 240 to be coupled to two places of the elongated mounting pillar 300. Can be. In addition, the heat sink 240 may be formed with a screw groove structure 222 on the top and bottom, respectively, to correspond to the bracket device 220.

In addition, the heat dissipation plate 240 is provided with a contact structure 250 for contacting a part of the outer circumferential surface of the installation pillar 300 when installed on the mounting pillar 300 through the bracket device 220. The contact structure 250 is for transmitting the heat of the heat dissipation 240 to the installation column 300. Typically, since the installation pillar 300 has a cylindrical shape, the contact structure 250 may have a contact surface with the installation pillar 300 having one side curved surface of the cylinder. As the contact area between the contact structure 250 and the installation pillar 300 is wider, heat transfer is made. Therefore, the contact structure 250 is designed to contact the pillar 300 with as many parts as possible, and in addition, the heat sink 240 In consideration of the structure, the structure of the heat dissipation fins 245, and the efficiency of fabrication, they are appropriately designed. In this case, the contact structure 250 may be manufactured integrally with the heat sink 240 through an extrusion method, such as the plurality of heat sink fins 245, or may be manufactured separately from the heat sink 240 body to correspond to the heat sink 240. It may be coupled to the coupling site through screwing or the like.

In addition, in the above, the efficient heat transfer between the contact structure 250 and the installation column 300 of the heat sink 240 is also made so that the enclosure 200 can be more firmly fixed through the contact structure 250. Thermal-pads 260 of suitable materials and structures may be further installed in order to facilitate this. As shown in FIG. 4, the thermal pad 260 preferably has a structure in accordance with the contact surface shape of the contact structure 250 and the installation pillar 300.

As described above, the heat dissipation structure of the enclosure of the wireless communication device according to the embodiment of the present invention may be formed. Meanwhile, in the above description of the present invention, specific embodiments have been described, but various modifications are included in the scope of the present invention. It can be carried out without departing. For example, in the above description, the mounting mechanism is formed on the heat sink, so that the entire enclosure is fixed. However, in another embodiment of the present invention, the mounting mechanism for fixing the enclosure is not provided on the heat sink but the enclosure. It may have a structure which is installed at another part of the device to fix the enclosure to the installation pillar. As such, there may be various modifications of the present invention, and therefore, the scope of the present invention should be determined by the equivalents of the claims and the claims, rather than by the embodiments described.

Claims

In the heat dissipation structure of the enclosure of a wireless communication device,

A number of heat sink fins,

A mounting mechanism fixedly coupled to the installation pillar on which the entire enclosure is installed, and for mounting the entire enclosure device therethrough;

And a heat dissipation plate including a contact structure for coming into contact with a portion of an outer surface of the installation column when the installation mechanism is installed to the installation column.
The method of claim 1,

The heat dissipation structure of the enclosure device, which is installed between the contact structure and the installation pillar, has a structure according to the contact surface shape of the contact structure and the installation pillar, and further includes a pad having a high heat transfer efficiency.
The heat dissipation structure of a housing device according to claim 1 or 2, wherein the contact surface of the contact structure has a curved surface on one side of the cylinder.
The heat dissipation structure of a housing device according to claim 1 or 2, wherein the mounting mechanism is a screw groove structure to be coupled to the bracket device fixedly coupled to the antenna mounting pillar and to the screw device.
In the heat dissipation structure of the enclosure of a wireless communication device,

A mounting mechanism that is fixedly coupled to an installation pillar on which the entire enclosure is installed, and thereby mounts the entire enclosure;

And a heat dissipation plate having a plurality of heat dissipation fins and a contact structure for coming into contact with a portion of an outer surface of the installation column when installed in the installation column through the mounting mechanism.
The method of claim 5,

The heat dissipation structure of the enclosure device, which is installed between the contact structure and the installation column, further includes a pad having a structure corresponding to the contact surface shape of the contact structure and the installation column, and having a high heat transfer efficiency.
The heat dissipation structure of a housing device according to claim 5 or 6, wherein the contact surface of the contact structure has a curved surface on one side of the cylinder.
7. The heat dissipation structure of a housing device according to claim 5 or 6, wherein the mounting mechanism includes a bracket device fixedly coupled to the antenna mounting pillar.