WO2010150414A1 - Web processing apparatus and method of manufacturing electronic device - Google Patents

Web processing apparatus and method of manufacturing electronic device Download PDF

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Publication number
WO2010150414A1
WO2010150414A1 PCT/JP2009/061869 JP2009061869W WO2010150414A1 WO 2010150414 A1 WO2010150414 A1 WO 2010150414A1 JP 2009061869 W JP2009061869 W JP 2009061869W WO 2010150414 A1 WO2010150414 A1 WO 2010150414A1
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WO
WIPO (PCT)
Prior art keywords
web
alignment
electronic device
processing apparatus
sealant
Prior art date
Application number
PCT/JP2009/061869
Other languages
French (fr)
Japanese (ja)
Inventor
江口敏正
Original Assignee
株式会社クラレ
住友化学株式会社
住友ベークライト株式会社
凸版印刷株式会社
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Application filed by 株式会社クラレ, 住友化学株式会社, 住友ベークライト株式会社, 凸版印刷株式会社 filed Critical 株式会社クラレ
Publication of WO2010150414A1 publication Critical patent/WO2010150414A1/en

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    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C65/00—Joining or sealing of preformed parts, e.g. welding of plastics materials; Apparatus therefor
    • B29C65/78—Means for handling the parts to be joined, e.g. for making containers or hollow articles, e.g. means for handling sheets, plates, web-like materials, tubular articles, hollow articles or elements to be joined therewith; Means for discharging the joined articles from the joining apparatus
    • B29C65/7841—Holding or clamping means for handling purposes
    • B29C65/7852—Holding or clamping means for handling purposes using electrostatic forces to hold at least one of the parts to be joined
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C35/00—Heating, cooling or curing, e.g. crosslinking or vulcanising; Apparatus therefor
    • B29C35/02—Heating or curing, e.g. crosslinking or vulcanizing during moulding, e.g. in a mould
    • B29C35/08—Heating or curing, e.g. crosslinking or vulcanizing during moulding, e.g. in a mould by wave energy or particle radiation
    • B29C35/0805—Heating or curing, e.g. crosslinking or vulcanizing during moulding, e.g. in a mould by wave energy or particle radiation using electromagnetic radiation
    • B29C2035/0827—Heating or curing, e.g. crosslinking or vulcanizing during moulding, e.g. in a mould by wave energy or particle radiation using electromagnetic radiation using UV radiation
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C65/00—Joining or sealing of preformed parts, e.g. welding of plastics materials; Apparatus therefor
    • B29C65/02—Joining or sealing of preformed parts, e.g. welding of plastics materials; Apparatus therefor by heating, with or without pressure
    • B29C65/14—Joining or sealing of preformed parts, e.g. welding of plastics materials; Apparatus therefor by heating, with or without pressure using wave energy, i.e. electromagnetic radiation, or particle radiation
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C65/00—Joining or sealing of preformed parts, e.g. welding of plastics materials; Apparatus therefor
    • B29C65/02—Joining or sealing of preformed parts, e.g. welding of plastics materials; Apparatus therefor by heating, with or without pressure
    • B29C65/14—Joining or sealing of preformed parts, e.g. welding of plastics materials; Apparatus therefor by heating, with or without pressure using wave energy, i.e. electromagnetic radiation, or particle radiation
    • B29C65/1403—Joining or sealing of preformed parts, e.g. welding of plastics materials; Apparatus therefor by heating, with or without pressure using wave energy, i.e. electromagnetic radiation, or particle radiation characterised by the type of electromagnetic or particle radiation
    • B29C65/1406—Ultraviolet [UV] radiation
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C65/00—Joining or sealing of preformed parts, e.g. welding of plastics materials; Apparatus therefor
    • B29C65/78—Means for handling the parts to be joined, e.g. for making containers or hollow articles, e.g. means for handling sheets, plates, web-like materials, tubular articles, hollow articles or elements to be joined therewith; Means for discharging the joined articles from the joining apparatus
    • B29C65/7802—Positioning the parts to be joined, e.g. aligning, indexing or centring
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C65/00—Joining or sealing of preformed parts, e.g. welding of plastics materials; Apparatus therefor
    • B29C65/78—Means for handling the parts to be joined, e.g. for making containers or hollow articles, e.g. means for handling sheets, plates, web-like materials, tubular articles, hollow articles or elements to be joined therewith; Means for discharging the joined articles from the joining apparatus
    • B29C65/7841—Holding or clamping means for handling purposes
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C66/00—General aspects of processes or apparatus for joining preformed parts
    • B29C66/001—Joining in special atmospheres
    • B29C66/0012—Joining in special atmospheres characterised by the type of environment
    • B29C66/0014—Gaseous environments
    • B29C66/00145—Vacuum, e.g. partial vacuum
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C66/00—General aspects of processes or apparatus for joining preformed parts
    • B29C66/40—General aspects of joining substantially flat articles, e.g. plates, sheets or web-like materials; Making flat seams in tubular or hollow articles; Joining single elements to substantially flat surfaces
    • B29C66/47—Joining single elements to sheets, plates or other substantially flat surfaces
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C66/00—General aspects of processes or apparatus for joining preformed parts
    • B29C66/90—Measuring or controlling the joining process
    • B29C66/98—Determining the joining area by using markings on at least one of the parts to be joined
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K71/00—Manufacture or treatment specially adapted for the organic devices covered by this subclass
    • H10K71/851—Division of substrate

Definitions

  • the present invention relates to a web processing apparatus suitable for manufacturing, for example, a liquid crystal display panel using a flexible substrate, an organic EL display panel, and the like, and a method for manufacturing an electronic device using the web processing apparatus.
  • a method using a glass substrate For example, a liquid crystal display panel and an organic EL display panel are manufactured.
  • an electronic device such as a liquid crystal display element using a glass substrate is dropped, the glass is damaged or has a heavy weight, and if it is thinned, there are defects such as cracking during production and inferior mass productivity.
  • Patent Document 1 An electronic device using a plastic substrate has been manufactured, and when a liquid crystal display element is manufactured using a plastic substrate, it is more flexible and flexible than a glass substrate. In addition, it is possible to dramatically increase the production speed and increase the production efficiency by producing by roll-to-roll method using the web of the plastic substrate. It has become active (Patent Document 1).
  • a film substrate having dichroism and a film substrate having birefringence are bonded at an arbitrary angle, such as bonding of a polarizing film substrate and a retardation film substrate.
  • the conventional film laminating apparatus is used to visually check the edge of the film or detect it with a CCD camera or the like and use it as a reference or by abutting the end faces of both films against the apparatus.
  • the alignment angle is controlled (for example, Patent Document 2 and Patent Document 3).
  • a display device such as a liquid crystal display panel or an organic EL display panel using a web film substrate
  • an electronic device has been improved in definition.
  • the dimensional change of the film substrate due to external force is larger than that of the glass substrate. Therefore, a high-definition device has a problem that it is difficult to precisely align with a web processing device using a conventional web. ing.
  • the present invention has been made in view of such circumstances, and provides a web processing apparatus and an electronic apparatus manufacturing method capable of performing alignment with high accuracy in order to bond a set of substrates using a web film substrate. Is to provide.
  • the present invention is configured as follows.
  • the invention according to claim 1 is an unwinding mechanism for unwinding the web; A web transport mechanism for transporting the web unwound by the unwind mechanism; A vacuum chamber closed across the web to be conveyed; A flat stage for adsorbing and fixing the web in the vacuum chamber; An alignment mechanism that detects a pattern for alignment provided on the web and aligns the web on the planar stage; With When performing alignment by the alignment mechanism, The surface of the planar stage and the surface where the vacuum chamber sandwiches the web, The web processing apparatus is configured to be flush with the web conveyance surface.
  • the invention according to claim 2 has a laminating mechanism for laminating the web and another sheet on the planar stage after alignment. It is.
  • the invention according to claim 3 is a sealant drawing mechanism that provides the web with a sealant used for bonding;
  • the web processing apparatus according to claim 2 further comprising: a sealant curing mechanism that cures the sealant after alignment and bonding.
  • Invention of Claim 4 is a web processing apparatus of Claim 3 which has a liquid crystal dropping mechanism which dripped a liquid crystal to the said web.
  • Invention of Claim 5 is a web processing apparatus of Claim 3 or 4 which has a cutting mechanism which cut
  • Claim 6 uses the web processing apparatus in any one of Claim 1 thru
  • An electronic device manufacturing method is characterized in that an electronic device is manufactured by laminating a web having a circuit formed on either one or both and a sheet.
  • the sealant of the web is an ultraviolet curable resin
  • the invention according to claim 8 is the method of manufacturing an electronic device according to claim 5 or 7, wherein the circuit includes a thin film transistor.
  • the invention according to claim 9 is the method of manufacturing an electronic device according to any one of claims 6 to 8, wherein the electronic device is a liquid crystal display device.
  • the web having a pattern for alignment is a color filter. is there.
  • the present invention has the following effects.
  • the surface of the planar stage that performs alignment and the surface on which the vacuum chamber sandwiches the web are the same surface as the web conveyance surface. In this way, it is possible to precisely align the web by suppressing dimensional changes due to external forces.
  • a precise bonding can be performed by bonding the web and another sheet on the flat stage.
  • a sealing agent used for bonding is provided on the web, and the liquid crystal can be dropped on the web surrounded and sealed by the sealing agent.
  • the sealing agent for the web is an ultraviolet curable resin
  • the sealing agent curing mechanism cures the ultraviolet curable resin by irradiating with ultraviolet rays, and it is simple and reliable without applying heat to the web and deforming it. Can be cured.
  • an electronic device using a web can be manufactured because the circuit includes a thin film transistor.
  • the electronic device is a liquid crystal display device, and the liquid crystal display device can have high definition.
  • the web having the pattern for alignment is a color filter, and the substrate on which the color filter and the circuit are formed can be bonded with high accuracy.
  • FIG. 10 is a schematic configuration diagram of a web processing apparatus at the time of bonding in Comparative Example 2.
  • Embodiments of a web processing apparatus and an electronic apparatus manufacturing method according to the present invention will be described below in detail with reference to the drawings.
  • the embodiment of the present invention shows the most preferable mode of the present invention, and the present invention is not limited to this.
  • the web processing apparatus of this embodiment includes an unwinding mechanism 1, a web transport mechanism 2, a vacuum chamber 3, a flat stage 4, an alignment mechanism 5, and a bonding mechanism 6.
  • the web 90 is wound in a roll shape and unwinds at a predetermined speed during processing.
  • the web 90 is a plastic substrate and has a pattern 11 for alignment on the surface as shown in FIG.
  • the web transport mechanism 2 has a pair of transport rollers 21 and a support roller 22 arranged along the transport path 20 and transports the web 90 unwound by the unwinding mechanism 1.
  • the conveyance roller 2 is composed of a pair of rollers, the web 90 is nipped and conveyed, and the support roller 22 supports the web 90 in a flat state during conveyance.
  • a sealing agent drawing mechanism 7 for providing a sealing agent used for bonding to the web 90 and a liquid crystal dropping mechanism 8 for dropping liquid crystal on the web 90 are disposed.
  • a sealing agent drawing 50 is provided on the bonding surface of the web 90 with the sealing agent.
  • the sealant drawing 50 is provided so as to enclose the entire portion of the plurality of display devices that are actuated by electricity, and further enclose the entire exterior of the portion that is actuated by electricity of the plurality of display devices. You may give to.
  • the sealant drawing 50 is not limited to one that surrounds the entire exterior, but may be applied so as to surround a part of the exterior.
  • a liquid sealing agent placed in a syringe is applied by being discharged from an opening of the dispenser. This dispenser uses a small variation in the discharge amount of the opening at each position in the width direction of the opening row, and by applying the liquid sealing agent in the syringe while extruding it, the sealing agent can be applied easily and reliably. Can be granted.
  • the sealant drawing 50 is composed of an ultraviolet curable resin, a thermosetting resin, a photocurable resin, or the like as the sealant, but the ultraviolet curable resin does not deform the heat applied to the web 90 easily and reliably. It can be cured and is preferred.
  • the sealant drawing 50 is applied to the width of the web 90 to prevent gaps and in-plane deviations of the web 90 and to prevent liquid crystal leakage.
  • the sealant drawing 50 is provided with a liquid crystal injection port (not shown) for partially filling the liquid crystal.
  • the liquid crystal dropping mechanism 8 drops the liquid crystal 51 on the web 90 corresponding to the sealant drawing 50 as shown in FIG.
  • a sealing agent used for bonding is provided on the web 90, and the liquid crystal 51 can be dropped onto the web 90 in a portion surrounded and sealed by the sealing agent.
  • a liquid crystal display device is shown by providing the liquid crystal 51, but the circuit is an electronic device including a thin film transistor, an electronic device such as a color filter, or the like.
  • the display device may be a liquid crystal display device, an organic EL display device, an electrophoretic display device, or the like.
  • the liquid crystal display device has features such as power saving, light weight, thinness, and the like.
  • an organic EL display device has many advantageous characteristics as a display such as a high response speed, a wide viewing angle, good visibility unique to a self-luminous element, and a wide temperature range that can be driven.
  • This organic EL display device has a configuration in which a lower electrode, an organic EL layer of a portion that is operated by electricity, and an upper electrode are laminated from the substrate side in each pixel formed on the substrate, and a current is supplied to the organic EL layer.
  • the light from the organic EL which emits light by flowing, is recognized through at least one of the electrodes (translucent conductive film).
  • an electrophoretic display device a microcapsule electrophoretic method has been put to practical use as one of display devices utilizing an electrophoretic phenomenon. In this type of display device, positively and negatively charged white particles and black particles are placed in a microcapsule that is electrically operated and filled with a transparent solvent, and each particle is pulled up to the display surface by applying an external voltage. To form an image.
  • the vacuum chamber 3 includes a lower chamber portion 3a and an upper chamber portion 3b, and is configured to be closed with a web 90 to be conveyed interposed therebetween.
  • Each of the lower chamber portion 3a and the upper chamber portion 3b has surfaces 3a1 and 3b1 sandwiching the web 90, and the lower chamber portion 3a is disposed at a lower position with respect to the transport surface L of the transport path 20, and the upper chamber The part 3 b is disposed at an upper position with respect to the transport surface L of the transport path 20.
  • the lower chamber portion 3a and the upper chamber portion 3b are closed by bringing the surfaces 3a1 and 3b1 sandwiched between them into contact with each other and bringing the inside into a vacuum state and transporting the web 90 while separating the surfaces 3a1 and 3b1.
  • the vacuum chamber 3 includes a flat stage 4, an alignment mechanism 5, and a bonding mechanism 6 inside.
  • the flat stage 4 sucks and fixes the web 90 to the flat surface 4a and holds the web 90 in a flat state.
  • a large number of adsorption holes 4b are formed on the planar surface 4a, and the vacuum pump of the decompression device 4c communicating with the adsorption hole 4b is driven to place the web 10 on the planar surface 4a. Adsorb and fix.
  • the alignment mechanism 5 includes, for example, a CCD camera 5 a, detects a pattern 11 for performing alignment provided on the web 90, and sends detection information of the pattern 11 to the control device 60.
  • the control device 60 controls the transport mechanism driving device 61, the bonding mechanism driving device 62, and the vacuum chamber driving device 63 based on the detection information of the pattern 11.
  • the transport mechanism driving device 61 is composed of a motor, a sensor, and the like, drives the unwinding mechanism 1 and the web transport mechanism 2, and transports the web 90 by a predetermined amount at a predetermined timing and a predetermined speed.
  • the laminating drive device 62 is composed of an elevating device that moves the laminating mechanism 6 up and down, a sensor that detects the position of elevating and the like, and drives the laminating mechanism 6.
  • the leaf sheet 91 is adsorbed and set.
  • the vacuum chamber driving device 63 includes a lifting device that lifts and lowers the vacuum chamber 3, a sensor that detects a position such as lifting and the like, and a vacuum pump that vacuums the vacuum chamber 3.
  • the conveyance of the web 90 is temporarily stopped, the plane stage 4 is raised to the conveyance surface L, and the sheet 91 is attached to the liquid crystal 51 of the web 90 by the electrostatic chuck 6 a. Is positioned on the dropped portion and aligned with the web 90 on the flat stage 4, and then the vacuum pump of the vacuum chamber driving device 63 is driven to bring the inside of the vacuum chamber 3 into a vacuum state. 90 and another sheet 91 are bonded together.
  • the planar surface 4a of the planar stage 4 When alignment is performed by the alignment mechanism 5, as shown in FIGS. 2 and 3, the planar surface 4a of the planar stage 4, the webs of the lower chamber portion 3a and the upper chamber portion 3b of the vacuum chamber 3 are used.
  • the surfaces 3 a 1 and 3 b 1 sandwiching 90 are configured to be the same surface as the conveyance surface L of the web 90.
  • the lower chamber portion 3a and the planar stage 4 are separate bodies, and the lower chamber portion 3a and the planar stage 4 are separately moved up and down with respect to the conveyance surface L of the web 90, and the plane of the planar stage 4 is
  • the planar surface 4a and the surface 3a1 sandwiching the web 90 of the lower chamber portion 3a are flush with each other.
  • the upper chamber portion 3a and the bonding mechanism 6 are separate from each other, and are separately moved up and down with respect to the conveyance surface L of the web 90 of the upper chamber portion 3a and the bonding mechanism 6, so that the bonding mechanism 6
  • the bonding surface 6a and the surface 3b1 sandwiching the web 90 of the upper chamber portion 3b are the same surface.
  • the lower chamber portion 3a and the flat stage 4 are fixed integrally, and the lower chamber portion 3a and the flat stage 4 are moved up and down integrally with respect to the conveyance surface L of the web 90, and the flat shape of the flat stage 4 is set.
  • the surface 4a and the surface 3a1 sandwiching the web 90 of the lower chamber portion 3a may be the same surface.
  • the planar surface 4a of the flat stage 4 to be aligned the lower chamber portion 3a of the vacuum chamber 6 and the web 90 of the upper chamber portion 3b are arranged. Since the sandwiching surfaces 3a1 and 3b1 are the same surface as the conveyance surface L of the web 90, the web 90 can be precisely aligned while suppressing a dimensional change due to an external force. In addition, after the alignment, the web 90 and another sheet 91 are bonded on the flat stage 4 so that precise bonding is possible.
  • a sealing agent curing mechanism 9 and a cutting mechanism 10 are arranged in this order after the vacuum chamber 3.
  • the sealant curing mechanism 9 cures the sealant after alignment and bonding. Precise bonding is possible by providing the sealing agent used for bonding on the web 90 and curing the sealing agent after positioning and bonding.
  • the sealant for the web 90 is an ultraviolet curable resin, and the sealant curing mechanism 9 irradiates the ultraviolet ray to cure the ultraviolet curable resin.
  • the sealing agent of the web 90 is an ultraviolet curable resin, and the sealing agent curing mechanism cures the ultraviolet curable resin by irradiating with ultraviolet rays, and can be cured easily and reliably without applying heat to the web 90 to deform it.
  • the cutting mechanism 10 cuts the web 90 after the sealant is cured. As described above, after the sealing agent is cured, the web 90 is cut so that the alignment and bonding are not shifted by cutting, and precise bonding is possible.
  • the cutting mechanism 10 uses a cutting device (dicing saw), and by this cutting, an electronic device is manufactured by bonding the web 90 on which one or both of the circuits are formed and the sheet 91.
  • the circuit of at least one of the web 90 and the sheet 91 is an electronic device including a thin film transistor, but is not limited thereto.
  • Example 1 A color filter with a width of 300 mm, a length of 100 m, a thickness of 100 m, and a thickness of 0.1 mm, which is a 4-type size and 320 ⁇ 240 pixels in a 300 mm cycle, is arranged in the width direction.
  • a web-shaped color filter with spacers formed on four surfaces in the longitudinal direction was unwound from the unwinding mechanism 1 of the apparatus shown in FIG.
  • a UV curable sealant was applied around each 4 type color filter by the sealant drawing mechanism 7, and then a predetermined amount of liquid crystal was dropped by the liquid crystal dropping mechanism 8.
  • a sheet in which a TFT array is formed on a 300 mm ⁇ 300 mm, 0.1 mm thick PES film shown in FIG. 91 is attached to the portion of the laminating mechanism 6 that performs laminating with the electrostatic chuck 6a.
  • the conveyance of the web 90 is temporarily stopped, the plane stage 4 is raised to the conveyance surface L of the web-like color filter, and the color filter is adsorbed and fixed by the electrostatic chuck 6a. .
  • the vacuum chamber 3 was closed with the portion of the web 90 where the color filter was not formed sandwiched, and the vacuum chamber 3 was evacuated with a vacuum pump. At this time, the position where the vacuum chamber 3 sandwiches the web 90 is the same as the conveyance surface L of the web 90 as in the flat stage 4.
  • the position of the laminating mechanism 6 for laminating with the single wafer sheet 91 is finely adjusted by the alignment mechanism 5 so that the deviation between the color filter and the TFT array is minimized.
  • the bonding was performed by lowering the bonding mechanism 6 for bonding to the sheet 91.
  • ultraviolet rays 1 J / cm 2 were irradiated to a part of the portion where the sealant was applied by a UV spot irradiation device incorporated in the flat stage 4 to fix the positional relationship between the color filter and the TFT array.
  • the vacuum chamber 3 was returned to atmospheric pressure and opened, the web 90 was conveyed, and the sealing agent was cured by irradiating the entire sealant application part with 1 J / cm 2 at the seal curing mechanism 9. Subsequently, it was cut into 300 mm ⁇ 300 mm by the cutting mechanism 10. Further, this was set in a cutting device having an xy stage, cut into individual pieces, and then a polarizing plate was attached to obtain a 4 type liquid crystal display device.
  • Example 2 As a color filter, a color filter without a spacer is used in the same manner as in Example 1 except that a sheet having a TFT array and a white organic EL is used instead of a sheet having a TFT array, and no liquid crystal is dropped.
  • the organic EL display device was obtained by combining and then cutting into individual pieces.
  • Example 1 A 4-type liquid crystal display was obtained in the same manner as in Example 1 except that the apparatus in which the vacuum chamber 3 shown in FIG. 7 sandwiched the web 90 was 50 mm lower than the conveyance surface L of the web 90 was used.
  • planar surface 4a of the planar stage 4 is flush with the conveyance surface L of the web 90, but the surface 3a1 sandwiching the web 90 of the lower chamber portion 3a of the vacuum chamber 3 and the upper chamber portion 3b, 3b1 is not flush with the conveying surface L of the web 90, and is shifted to a lower position.
  • Example 2 A 4-type liquid crystal display was obtained in the same manner as in Example 1 except that the flat stage 4 shown in FIG. 8 used an apparatus for adsorbing and fixing the color filter at a position 50 mm higher than the conveyance surface L of the web 90.
  • the surfaces 3a1 and 3b1 sandwiching the web 90 of the lower chamber portion 3a and the upper chamber portion 3b of the vacuum chamber 3 are the same surface as the conveying surface L of the web 90, but the planar surface of the planar stage 4 4a is not the same surface as the conveyance surface L of the web 90, and is shifted to an upper position.
  • Example 1 and Example 2 as a result of manufacturing an electronic device using the device of the present invention, it was possible to obtain a defect-free electronic device that was well aligned.
  • Comparative Example 1 since the surface of the vacuum chamber 3 sandwiching the web 90 is different from the transport surface L of the web 90, tension is generated in the transport direction, and due to the elongation of the web 90, good alignment cannot be performed at the time of bonding. It was. In Comparative Example 2, since the height of the flat stage 4 to be bonded is different from the conveyance surface L of the web 90, tension is generated in the conveyance direction, and due to the elongation of the web 90, good alignment cannot be performed at the time of bonding. .
  • the present invention can be applied to, for example, a web processing apparatus suitable for manufacturing a liquid crystal display panel using a flexible substrate, an organic EL display panel, and the like, and an electronic device manufacturing method using the web processing apparatus. It is possible to perform alignment with high accuracy in order to bond a set of substrates using a substrate.

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  • Liquid Crystal (AREA)
  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Lining Or Joining Of Plastics Or The Like (AREA)

Abstract

A web processing apparatus comprises an unwinding mechanism (1) for a web (90), a web conveying mechanism (2) for the web (90) unwound by the mechanism (1), a vacuum chamber (3) for sandwiching and closing the web (90) conveyed thereto, a flat stage (4) for sucking and affixing the web (90) in the chamber (3), and a positioning mechanism (5) for detecting a positioning pattern (11) formed on the web (90) and positioning the web (90) on the flat stage (4).  When the web is positioned by the mechanism (5), the surface (4a) of the flat stage (4) and the surfaces (3a1, 3b1) of the vacuum chamber (3) which sandwich the web (90) are flush with a conveying level (L) for the web (90).  Consequently, when a web film substrate is used, the accuracy of the positioning of a set of substrates can be improved when these substrates are laminated on each other.

Description

ウェブ加工装置及び電子装置の製造方法Web processing apparatus and electronic device manufacturing method
　この発明は、例えば可撓性基板を用いた液晶表示パネル、有機ＥＬ表示パネルなどの製造に好適なウェブ加工装置及びウェブ加工装置を用いた電子装置の製造方法に関する。 The present invention relates to a web processing apparatus suitable for manufacturing, for example, a liquid crystal display panel using a flexible substrate, an organic EL display panel, and the like, and a method for manufacturing an electronic device using the web processing apparatus.
　従来の電子装置の製造方法としては、ガラス基板を用いる方法があり、例えば液晶表示パネル、有機ＥＬ表示パネルが作製されている。ガラス基板を用いた液晶表示素子などの電子装置は落下させるとガラスが破損したり、重量が重く、薄板化すると、生産時に割れが生じて量産性が劣るなどの欠点がある。 As a conventional method for manufacturing an electronic device, there is a method using a glass substrate. For example, a liquid crystal display panel and an organic EL display panel are manufactured. When an electronic device such as a liquid crystal display element using a glass substrate is dropped, the glass is damaged or has a heavy weight, and if it is thinned, there are defects such as cracking during production and inferior mass productivity.
　このため、例えばプラスチック基板を用いた電子装置が作製されており、　プラスチック基板を用い液晶表示素子を作製した場合、ガラス基板に比べ屈曲性、柔軟性が有るため、現行の枚葉方式の生産方法から、プラスチック基板のウェブを用いて、ロール・ツー・ロール方式にて生産することにより、飛躍的に製造スピードを向上させ生産効率を上げることも可能であり、電子装置の高精細化の開発も活発になってきている（特許文献１）。 For this reason, for example, an electronic device using a plastic substrate has been manufactured, and when a liquid crystal display element is manufactured using a plastic substrate, it is more flexible and flexible than a glass substrate. In addition, it is possible to dramatically increase the production speed and increase the production efficiency by producing by roll-to-roll method using the web of the plastic substrate. It has become active (Patent Document 1).
　例えば、液晶表示装置用などに、偏光フィルム基板と位相差フィルム基板の貼り合わせなど、二色性を有するフィルム基板と複屈折性を有するフィルム基板とを任意の角度で貼り合わせることが行われているが、従来のフィルム貼り合わせ装置は、フィルムのエッジを目視で確認するか、ＣＣＤカメラなどで検出し、これを基準にしたり、前記の両フィルムの端面を装置に突き当てたりすることにより貼り合わせ角度を制御している（例えば特許文献２，特許文献３）。 For example, for a liquid crystal display device, a film substrate having dichroism and a film substrate having birefringence are bonded at an arbitrary angle, such as bonding of a polarizing film substrate and a retardation film substrate. However, the conventional film laminating apparatus is used to visually check the edge of the film or detect it with a CCD camera or the like and use it as a reference or by abutting the end faces of both films against the apparatus. The alignment angle is controlled (for example, Patent Document 2 and Patent Document 3).
特開２００６－１４６０３８号公報JP 2006-146038 A 特開２００１－３１８３７５号公報JP 2001-318375 A 特開２００４－１４８７２１号公報JP 2004-148721 A
　このように、プラスチック基板として、ウェブのフィルム基板を用いた液晶表示パネル、有機ＥＬ表示パネルなどの表示装置の開発が活発に行われ、一方電子装置の高精細化も進んでいるが、フィルム基板を用いると、外力によるフィルム基板の寸法変化がガラス基板に比べて大きいため、高精細な装置では、従来のウェブを用いたウェブ加工装置では、精密な位置合わせが困難であるという問題が発生している。 As described above, as a plastic substrate, a display device such as a liquid crystal display panel or an organic EL display panel using a web film substrate has been actively developed. On the other hand, an electronic device has been improved in definition. , The dimensional change of the film substrate due to external force is larger than that of the glass substrate. Therefore, a high-definition device has a problem that it is difficult to precisely align with a web processing device using a conventional web. ing.
　この発明は、かかる実情に鑑みてなされたもので、ウェブのフィルム基板を用い、一組の基板を貼り合わせるために精度よく位置合わせを行うことが可能なウェブ加工装置及び電子装置の製造方法を提供することである。 The present invention has been made in view of such circumstances, and provides a web processing apparatus and an electronic apparatus manufacturing method capable of performing alignment with high accuracy in order to bond a set of substrates using a web film substrate. Is to provide.
　前記課題を解決し、かつ目的を達成するために、この発明は、以下のように構成した。 In order to solve the above-described problems and achieve the object, the present invention is configured as follows.
　請求項１に記載の発明は、ウェブを巻き出す巻き出し機構と、
　前記巻き出し機構により巻き出された前記ウェブを搬送するウェブ搬送機構と、
　前記搬送されるウェブを挟んで閉じる真空チャンバーと、
　前記真空チャンバー内に前記ウェブを吸着固定する平面ステージと、
　前記ウェブに設けられた位置合わせを行うためのパターンを検出して前記ウェブに対して前記平面ステージ上で位置合わせを行う位置合わせ機構と、
　を備え、
　前記位置合わせ機構により位置合わせを行う際に、
　前記平面ステージの面と、前記真空チャンバーが前記ウェブを挟む面とが、
　前記ウェブの搬送面と同一面となるように構成したことを特徴とするウェブ加工装置である。 The invention according to claim 1 is an unwinding mechanism for unwinding the web;
A web transport mechanism for transporting the web unwound by the unwind mechanism;
A vacuum chamber closed across the web to be conveyed;
A flat stage for adsorbing and fixing the web in the vacuum chamber;
An alignment mechanism that detects a pattern for alignment provided on the web and aligns the web on the planar stage;
With
When performing alignment by the alignment mechanism,
The surface of the planar stage and the surface where the vacuum chamber sandwiches the web,
The web processing apparatus is configured to be flush with the web conveyance surface.
　請求項２に記載の発明は、位置合わせ後に前記平面ステージ上で前記ウェブと他の枚葉シートとの貼り合せを行う貼り合せ機構を有することを特徴とする請求項１に記載のウェブ加工装置である。 The invention according to claim 2 has a laminating mechanism for laminating the web and another sheet on the planar stage after alignment. It is.
　請求項３に記載の発明は、貼り合わせに用いるシール剤を前記ウェブに設けるシール剤描画機構と、
　位置合わせおよび貼り合わせ後に前記シール剤を硬化するシール剤硬化機構とを有することを特徴とする請求項２に記載のウェブ加工装置である。 The invention according to claim 3 is a sealant drawing mechanism that provides the web with a sealant used for bonding;
The web processing apparatus according to claim 2, further comprising: a sealant curing mechanism that cures the sealant after alignment and bonding.
　請求項４に記載の発明は、前記ウェブに液晶を滴下する液晶滴下機構を有する請求項３に記載のウェブ加工装置である。 Invention of Claim 4 is a web processing apparatus of Claim 3 which has a liquid crystal dropping mechanism which dripped a liquid crystal to the said web.
　請求項５に記載の発明は、前記シール剤を硬化した後に前記ウェブを切断する切断機構を有する請求項３または４に記載のウェブ加工装置である。 Invention of Claim 5 is a web processing apparatus of Claim 3 or 4 which has a cutting mechanism which cut | disconnects the said web after hardening | curing the said sealing compound.
　請求項６に記載の発明は、請求項１乃至請求項５のいずれかに記載のウェブ加工装置を用いて、
　いずれか一方または両方に回路が形成されているウェブと枚葉シートの貼り合せによって電子装置を製造することを特徴とする電子装置の製造方法である。 Invention of Claim 6 uses the web processing apparatus in any one of Claim 1 thru | or 5,
An electronic device manufacturing method is characterized in that an electronic device is manufactured by laminating a web having a circuit formed on either one or both and a sheet.
　請求項７に記載の発明は、前記ウェブのシール剤が紫外線硬化樹脂であり、
　前記シール剤硬化機構が紫外線照射して前記紫外線硬化樹脂を硬化することを特徴とする請求項６に記載の電子装置の製造方法である。 In the invention according to claim 7, the sealant of the web is an ultraviolet curable resin,
The method of manufacturing an electronic device according to claim 6, wherein the sealing agent curing mechanism cures the ultraviolet curable resin by irradiating ultraviolet rays.
　請求項８に記載の発明は、前記回路が薄膜トランジスタを含むことを特徴とする請求項５または請求項７に記載の電子装置の製造方法である。 The invention according to claim 8 is the method of manufacturing an electronic device according to claim 5 or 7, wherein the circuit includes a thin film transistor.
　請求項９に記載の発明は、前記電子装置が液晶表示装置であることを特徴とする請求項６乃至請求項８のいずれか１項に記載の電子装置の製造方法である。 The invention according to claim 9 is the method of manufacturing an electronic device according to any one of claims 6 to 8, wherein the electronic device is a liquid crystal display device.
　請求項１０に記載の発明は、位置合わせを行うためのパターンを有するウェブがカラーフィルタであることを特徴とする請求項６乃至請求項９のいずれか１項に記載の電子装置の製造方法である。 According to a tenth aspect of the present invention, in the method for manufacturing an electronic device according to any one of the sixth to ninth aspects, the web having a pattern for alignment is a color filter. is there.
　前記構成により、この発明は、以下のような効果を有する。 With this configuration, the present invention has the following effects.
　請求項１に記載の発明では、位置合わせ機構により位置合わせを行う際に、位置合　わせを行う平面ステージの面と、真空チャンバーがウェブを挟む面とが、ウェブの搬送　面と同一面となることで、ウェブに外力による寸法変化を抑えて精密な位置合わせが可　能である。 In the first aspect of the invention, when the alignment is performed by the alignment mechanism, the surface of the planar stage that performs alignment and the surface on which the vacuum chamber sandwiches the web are the same surface as the web conveyance surface. In this way, it is possible to precisely align the web by suppressing dimensional changes due to external forces.
　請求項２に記載の発明では、位置合わせ後に、平面ステージ上でウェブと他の枚葉シートとの貼り合せを行うことで、精密な貼り合せが可能である。 In the invention according to the second aspect, after the positioning, a precise bonding can be performed by bonding the web and another sheet on the flat stage.
　請求項３に記載の発明では、貼り合わせに用いるシール剤をウェブに設け、位置合わせおよび貼り合わせ後にシール剤を硬化することで、精密な貼り合せが可能である。 In the invention according to claim 3, precise bonding is possible by providing a sealing agent used for bonding on the web and curing the sealing agent after alignment and bonding.
　請求項４に記載の発明では、貼り合わせに用いるシール剤をウェブに設け、このシール剤で囲まれてシールされた部分のウェブに液晶を滴下することができる。 In the invention described in claim 4, a sealing agent used for bonding is provided on the web, and the liquid crystal can be dropped on the web surrounded and sealed by the sealing agent.
　請求項５に記載の発明では、シール剤を硬化した後に、ウェブを切断することで、切断によって位置合わせおよび貼り合わせがずれることがなく、精密な貼り合せが可能である。 In the invention according to claim 5, by cutting the web after curing the sealing agent, the alignment and bonding are not shifted by cutting, and precise bonding is possible.
　請求項６に記載の発明では、請求項１乃至請求項５のいずれかに記載のウェブ加工装置を用いて、いずれか一方または両方に回路が形成されているウェブと枚葉シートの貼り合せて精密に行なうことができ、電子装置の高精細化が可能である。 In the invention according to claim 6, by using the web processing apparatus according to any one of claims 1 to 5, the web having a circuit formed on one or both of the web and the sheet is bonded together. This can be performed precisely, and high definition of the electronic device is possible.
　請求項７に記載の発明では、ウェブのシール剤が紫外線硬化樹脂であり、シール剤硬化機構が紫外線照射して紫外線硬化樹脂を硬化し、ウェブに熱を与えて変形させることなく簡単、かつ確実に硬化させることができる。 In the invention of claim 7, the sealing agent for the web is an ultraviolet curable resin, and the sealing agent curing mechanism cures the ultraviolet curable resin by irradiating with ultraviolet rays, and it is simple and reliable without applying heat to the web and deforming it. Can be cured.
　請求項８に記載の発明では、回路が薄膜トランジスタを含むことで、ウェブを用いた電子装置を製造することができる。 In the invention according to claim 8, an electronic device using a web can be manufactured because the circuit includes a thin film transistor.
　請求項９に記載の発明では、電子装置が液晶表示装置であり、液晶表示装置の高精細化が可能である。 In the invention according to claim 9, the electronic device is a liquid crystal display device, and the liquid crystal display device can have high definition.
　請求項１０に記載の発明では、位置合わせを行うためのパターンを有するウェブがカラーフィルタであり、カラーフィルタと回路が形成されている基板の高精度な貼り合わせが可能である。 In the invention described in claim 10, the web having the pattern for alignment is a color filter, and the substrate on which the color filter and the circuit are formed can be bonded with high accuracy.
ウェブ搬送時のウェブ加工装置の概略構成図である。It is a schematic block diagram of the web processing apparatus at the time of web conveyance. 貼り合わせ時のウェブ加工装置の概略構成図である。It is a schematic block diagram of the web processing apparatus at the time of bonding. ウェブの貼り合わせの構成を示す図である。It is a figure which shows the structure of bonding of a web. ウェブの加工を示す図である。It is a figure which shows the process of a web. ウェブの一部の平面図である。It is a top view of a part of web. 枚葉シートの平面図である。It is a top view of a single wafer sheet. 比較例１の貼り合わせ時のウェブ加工装置の概略構成図である。3 is a schematic configuration diagram of a web processing apparatus at the time of bonding in Comparative Example 1. FIG. 比較例２の貼り合わせ時のウェブ加工装置の概略構成図である。10 is a schematic configuration diagram of a web processing apparatus at the time of bonding in Comparative Example 2. FIG.
　以下、この発明のウェブ加工装置及び電子装置の製造方法の実施の形態を、図面に基づいて詳細に説明する。また、この発明の実施の形態は、発明の最も好ましい形態を示すものであり、この発明は、これに限定されない。 Embodiments of a web processing apparatus and an electronic apparatus manufacturing method according to the present invention will be described below in detail with reference to the drawings. The embodiment of the present invention shows the most preferable mode of the present invention, and the present invention is not limited to this.
　　［実施の形態］
　この実施の形態のウェブ加工装置及び電子装置の製造方法を、図１乃至図４に基づいて説明する。この実施の形態のウェブ加工装置は、巻き出し機構１と、ウェブ搬送機構２と
、真空チャンバー３と、平面ステージ４と、位置合わせ機構５と、貼り合せ機構６とを備える。 [Embodiment]
A web processing apparatus and an electronic apparatus manufacturing method according to this embodiment will be described with reference to FIGS. The web processing apparatus of this embodiment includes an unwinding mechanism 1, a web transport mechanism 2, a vacuum chamber 3, a flat stage 4, an alignment mechanism 5, and a bonding mechanism 6.
　巻きだし機構１では、ウェブ９０がロール状に巻かれており、加工時に所定の速度で巻き出す。このウェブ９０はプラスチック基板であり、図４に示すように、表面に位置合わせを行なうためのパターン１１を有する。 In the unwinding mechanism 1, the web 90 is wound in a roll shape and unwinds at a predetermined speed during processing. The web 90 is a plastic substrate and has a pattern 11 for alignment on the surface as shown in FIG.
　ウェブ搬送機構２は、搬送路２０に沿って配置された一対の搬送ローラ２１および支持ローラ２２を有し、巻き出し機構１により巻き出されたウェブ９０を搬送する。搬送ローラ２は一対のローラから構成され、ウェブ９０は挟んで搬送し、支持ローラ２２はウェブ９０を搬送時に平面状態に支持する。 The web transport mechanism 2 has a pair of transport rollers 21 and a support roller 22 arranged along the transport path 20 and transports the web 90 unwound by the unwinding mechanism 1. The conveyance roller 2 is composed of a pair of rollers, the web 90 is nipped and conveyed, and the support roller 22 supports the web 90 in a flat state during conveyance.
　巻き出し機構１と真空チャンバー３との間には、貼り合わせに用いるシール剤をウェブ９０に設けるシール剤描画機構７と、ウェブ９０に液晶を滴下する液晶滴下機構８が配置されている。 Between the unwinding mechanism 1 and the vacuum chamber 3, a sealing agent drawing mechanism 7 for providing a sealing agent used for bonding to the web 90 and a liquid crystal dropping mechanism 8 for dropping liquid crystal on the web 90 are disposed.
　シール剤描画機構７では、図４（ａ）に示すように、シール剤によってウェブ９０の貼り合わせ面にシール剤描画５０を設ける。シール剤描画５０は、複数個の表示装置の電気により作動する部位をそれぞれその外部全体を囲むように付与しているが、さらに複数個の表示装置の電気により作動する部位の外部全体を囲むように付与してもよい。シール剤描画５０は、それぞれ外部全体を囲むものに限らず、外部の一部を囲むように付与してもよい。この実施の形態では、ディスペンサーを用いて、シリンジに入れた液状のシール剤を、ディスペンサーの開口部からを吐出させて塗布して設ける。このディスペンサーは、開口部列の幅方向、各位置の開口部の吐出量のバラツキが小さいものを用い、シリンジに入れた液状のシール剤を押し出しながら塗布することで、シール剤を簡単かつ確実に付与することができる。 In the sealing agent drawing mechanism 7, as shown in FIG. 4A, a sealing agent drawing 50 is provided on the bonding surface of the web 90 with the sealing agent. The sealant drawing 50 is provided so as to enclose the entire portion of the plurality of display devices that are actuated by electricity, and further enclose the entire exterior of the portion that is actuated by electricity of the plurality of display devices. You may give to. The sealant drawing 50 is not limited to one that surrounds the entire exterior, but may be applied so as to surround a part of the exterior. In this embodiment, using a dispenser, a liquid sealing agent placed in a syringe is applied by being discharged from an opening of the dispenser. This dispenser uses a small variation in the discharge amount of the opening at each position in the width direction of the opening row, and by applying the liquid sealing agent in the syringe while extruding it, the sealing agent can be applied easily and reliably. Can be granted.
　シール剤描画５０は、シール剤としては、紫外線硬化樹脂、熱硬化樹脂、光硬化性樹脂などにより構成されるが、紫外線硬化樹脂がウェブ９０に熱を与えて変形させることなく簡単、かつ確実に硬化させることができ好ましい。シール剤描画５０は、ウェブ９０に幅に塗布され、ウェブ９０のギャップおよび面内のずれを防止するとともに、液晶の漏洩を防止する。シール剤描画５０は一部に液晶を充填するための液晶注入口（図示せず）が設けられる。 The sealant drawing 50 is composed of an ultraviolet curable resin, a thermosetting resin, a photocurable resin, or the like as the sealant, but the ultraviolet curable resin does not deform the heat applied to the web 90 easily and reliably. It can be cured and is preferred. The sealant drawing 50 is applied to the width of the web 90 to prevent gaps and in-plane deviations of the web 90 and to prevent liquid crystal leakage. The sealant drawing 50 is provided with a liquid crystal injection port (not shown) for partially filling the liquid crystal.
　液晶滴下機構８では、図４（ｂ）に示すように、シール剤描画５０に対応してウェブ９０に液晶５１を滴下する。貼り合わせに用いるシール剤をウェブ９０に設け、このシール剤で囲まれてシールされた部分のウェブ９０に液晶５１を滴下することができる。この実施の形態では、液晶５１を設けることで液晶表示装置として示しているが、回路が薄膜トランジスタを含む電子装置、カラーフィルタなどの電子装置である。 The liquid crystal dropping mechanism 8 drops the liquid crystal 51 on the web 90 corresponding to the sealant drawing 50 as shown in FIG. A sealing agent used for bonding is provided on the web 90, and the liquid crystal 51 can be dropped onto the web 90 in a portion surrounded and sealed by the sealing agent. In this embodiment, a liquid crystal display device is shown by providing the liquid crystal 51, but the circuit is an electronic device including a thin film transistor, an electronic device such as a color filter, or the like.
　表示装置としては、液晶表示装置、有機ＥＬ表示装置、電気泳動式表示装置などでもよい。液晶表示装置は、その省電力、軽量、薄型等といった特徴を有し、一般的な液晶表示装置としては、入射側の偏光板と出射側の偏光板の基板と、電気により作動する部位の液晶とを有するものが代表的である。有機ＥＬ表示装置は、液晶表示装置と比べ、高速応答速度、広視野角、自発光素子特有の視認性の良さ、また駆動可能な温度範囲が広いなどのディスプレイとして有利な特性を数多く有する。この有機ＥＬ表示装置は、基板上に形成された各画素内に、基板側から下部電極、電気により作動する部位の有機ＥＬ層、および上部電極が積層された構成を備え、有機ＥＬ層に電流を流すことによって発光する有機ＥＬからの光を、少なくとも電極のうち一方の電極（透光性の導電膜）を通して認識するようになっている。電気泳動式表示装置は、電気泳動現象を利用した表示装置の一つとして
、マイクロカプセル型電気泳動方式が実用化されている。この方式の表示装置は、透明溶媒が満たされた電気により作動する部位のマイクロカプセル中に正、負に帯電した白い粒子と黒い粒子を入れ、外部電圧の印加によってそれぞれの粒子を表示面に引き上げて画像を形成するものである。 The display device may be a liquid crystal display device, an organic EL display device, an electrophoretic display device, or the like. The liquid crystal display device has features such as power saving, light weight, thinness, and the like. As a general liquid crystal display device, an incident side polarizing plate, an output side polarizing plate substrate, and a liquid crystal in a portion that is operated by electricity Those having the following are typical. Compared with a liquid crystal display device, an organic EL display device has many advantageous characteristics as a display such as a high response speed, a wide viewing angle, good visibility unique to a self-luminous element, and a wide temperature range that can be driven. This organic EL display device has a configuration in which a lower electrode, an organic EL layer of a portion that is operated by electricity, and an upper electrode are laminated from the substrate side in each pixel formed on the substrate, and a current is supplied to the organic EL layer. The light from the organic EL, which emits light by flowing, is recognized through at least one of the electrodes (translucent conductive film). As an electrophoretic display device, a microcapsule electrophoretic method has been put to practical use as one of display devices utilizing an electrophoretic phenomenon. In this type of display device, positively and negatively charged white particles and black particles are placed in a microcapsule that is electrically operated and filled with a transparent solvent, and each particle is pulled up to the display surface by applying an external voltage. To form an image.
　真空チャンバー３は、下部チャンバー部３ａと、上部チャンバー部３ｂを備え、搬送されるウェブ９０を挟んで閉じる構成である。この下部チャンバー部３ａと上部チャンバー部３ｂは、それぞれがウェブ９０を挟む面３ａ１、３ｂ１を有し、下部チャンバー部３ａは、搬送路２０の搬送面Ｌに対して下方位置に配置され、上部チャンバー部３ｂは、搬送路２０の搬送面Ｌに対して上方位置に配置されている。下部チャンバー部３ａと上部チャンバー部３ｂは、貼り合わせ時に挟む面３ａ１，３ｂ１を当接させて閉じ内部を真空状態にし、ウェブ９０を搬送させる時に挟む面３ａ１，３ｂ１を離間させて搬送する。 The vacuum chamber 3 includes a lower chamber portion 3a and an upper chamber portion 3b, and is configured to be closed with a web 90 to be conveyed interposed therebetween. Each of the lower chamber portion 3a and the upper chamber portion 3b has surfaces 3a1 and 3b1 sandwiching the web 90, and the lower chamber portion 3a is disposed at a lower position with respect to the transport surface L of the transport path 20, and the upper chamber The part 3 b is disposed at an upper position with respect to the transport surface L of the transport path 20. The lower chamber portion 3a and the upper chamber portion 3b are closed by bringing the surfaces 3a1 and 3b1 sandwiched between them into contact with each other and bringing the inside into a vacuum state and transporting the web 90 while separating the surfaces 3a1 and 3b1.
　真空チャンバー３は、その内部に平面ステージ４と、位置合わせ機構５と、貼り合せ機構６とを備える。平面ステージ４は、平面状の面４ａにウェブ９０を吸着固定し、ウェブ９０を平面状態に保持する。ウェブ９０を吸着固定する構成としては、平面状の面４ａに吸着孔４ｂを多数形成し、この吸着孔４ｂに連通した減圧装置４ｃの真空ポンプを駆動して平面状の面４ａにウェブ１０を吸着固定する。 The vacuum chamber 3 includes a flat stage 4, an alignment mechanism 5, and a bonding mechanism 6 inside. The flat stage 4 sucks and fixes the web 90 to the flat surface 4a and holds the web 90 in a flat state. As a configuration for adsorbing and fixing the web 90, a large number of adsorption holes 4b are formed on the planar surface 4a, and the vacuum pump of the decompression device 4c communicating with the adsorption hole 4b is driven to place the web 10 on the planar surface 4a. Adsorb and fix.
　位置合わせ機構５は、例えばＣＣＤカメラ５ａを有し、ウェブ９０に設けられた位置合わせを行うためのパターン１１を検出し、このパターン１１の検出情報を制御装置６０に送る。制御装置６０は、パターン１１の検出情報に基づき搬送機構駆動装置６１、貼り合わせ機構駆動装置６２、真空チャンバー駆動装置６３を制御する。 The alignment mechanism 5 includes, for example, a CCD camera 5 a, detects a pattern 11 for performing alignment provided on the web 90, and sends detection information of the pattern 11 to the control device 60. The control device 60 controls the transport mechanism driving device 61, the bonding mechanism driving device 62, and the vacuum chamber driving device 63 based on the detection information of the pattern 11.
　搬送機構駆動装置６１は、モータ、センサ等で構成され、巻き出し機構１及びウェブ搬送機構２を駆動し、所定のタイミング、所定の速度でウェブ９０を所定量搬送する。貼り合わせ駆動装置６２は、貼り合せ機構６を昇降させる昇降装置、昇降などの位置を検出するセンサなどで構成され、貼り合せ機構６を駆動し、貼り合せ機構６は、静電チャック６ａにより枚葉シート９１を吸着してセットする。真空チャンバー駆動装置６３は、真空チャンバー３を昇降させる昇降装置、昇降などの位置を検出するセンサ、真空チャンバー３内を真空状態にする真空ポンプ等で構成される。 The transport mechanism driving device 61 is composed of a motor, a sensor, and the like, drives the unwinding mechanism 1 and the web transport mechanism 2, and transports the web 90 by a predetermined amount at a predetermined timing and a predetermined speed. The laminating drive device 62 is composed of an elevating device that moves the laminating mechanism 6 up and down, a sensor that detects the position of elevating and the like, and drives the laminating mechanism 6. The leaf sheet 91 is adsorbed and set. The vacuum chamber driving device 63 includes a lifting device that lifts and lowers the vacuum chamber 3, a sensor that detects a position such as lifting and the like, and a vacuum pump that vacuums the vacuum chamber 3.
　液晶５１を滴下した部分が真空チャンバー３に進んだ時点でウェブ９０の搬送を一時停止し、搬送面Ｌまで平面ステージ４を上昇させ、静電チャック６ａにより枚葉シート９１をウェブ９０の液晶５１を滴下した部分に位置決めし、ウェブ９０に対して平面ステージ４上で位置合わせ後に、真空チャンバー駆動装置６３の真空ポンプを駆動して真空チャンバー３の内部を真空状態にし、平面ステージ４上でウェブ９０と他の枚葉シート９１との貼り合せを行う。 When the portion where the liquid crystal 51 is dropped advances to the vacuum chamber 3, the conveyance of the web 90 is temporarily stopped, the plane stage 4 is raised to the conveyance surface L, and the sheet 91 is attached to the liquid crystal 51 of the web 90 by the electrostatic chuck 6 a. Is positioned on the dropped portion and aligned with the web 90 on the flat stage 4, and then the vacuum pump of the vacuum chamber driving device 63 is driven to bring the inside of the vacuum chamber 3 into a vacuum state. 90 and another sheet 91 are bonded together.
　この位置合わせ機構５により位置合わせを行う際には、図２及び図３に示すように、平面ステージ４の平面状の面４ａと、真空チャンバー３の下部チャンバー部３ａと上部チャンバー部３ｂのウェブ９０を挟む面３ａ１、３ｂ１とが、ウェブ９０の搬送面Ｌと同一面となるように構成している。この構成は、下部チャンバー部３ａと平面ステージ４とは別体であり、下部チャンバー部３ａと平面ステージ４はウェブ９０の搬送面Ｌに対して別々に上下動するようにし、平面ステージ４の平面状の面４ａと、下部チャンバー部３ａのウェブ９０を挟む面３ａ１とが同一面になるようになっている。また、上部チャンバー部３ａと貼り合せ機構６とは別体であり、上部チャンバー部３ａと貼り合せ機構６のウェブ９０の搬送面Ｌに対して別々に上下動するようにし、貼り合せ機構６の貼り合せ面６ａと、上部チャンバー部３ｂのウェブ９０を挟む面３ｂ１とが同一面となるようになっている。 When alignment is performed by the alignment mechanism 5, as shown in FIGS. 2 and 3, the planar surface 4a of the planar stage 4, the webs of the lower chamber portion 3a and the upper chamber portion 3b of the vacuum chamber 3 are used. The surfaces 3 a 1 and 3 b 1 sandwiching 90 are configured to be the same surface as the conveyance surface L of the web 90. In this configuration, the lower chamber portion 3a and the planar stage 4 are separate bodies, and the lower chamber portion 3a and the planar stage 4 are separately moved up and down with respect to the conveyance surface L of the web 90, and the plane of the planar stage 4 is The planar surface 4a and the surface 3a1 sandwiching the web 90 of the lower chamber portion 3a are flush with each other. Further, the upper chamber portion 3a and the bonding mechanism 6 are separate from each other, and are separately moved up and down with respect to the conveyance surface L of the web 90 of the upper chamber portion 3a and the bonding mechanism 6, so that the bonding mechanism 6 The bonding surface 6a and the surface 3b1 sandwiching the web 90 of the upper chamber portion 3b are the same surface.
　また、例えば下部チャンバー部３ａと平面ステージ４とを一体に固定し、下部チャンバー部３ａと平面ステージ４はウェブ９０の搬送面Ｌに対して一体に上下動するようにし、平面ステージ４の平面状の面４ａと、下部チャンバー部３ａのウェブ９０を挟む面３ａ１とが同一面となるようにしてもよい。 Further, for example, the lower chamber portion 3a and the flat stage 4 are fixed integrally, and the lower chamber portion 3a and the flat stage 4 are moved up and down integrally with respect to the conveyance surface L of the web 90, and the flat shape of the flat stage 4 is set. The surface 4a and the surface 3a1 sandwiching the web 90 of the lower chamber portion 3a may be the same surface.
　このように、位置合わせ機構６により位置合わせを行う際に、位置合わせを行う平　面ステージ４の平面状の面４ａと、真空チャンバー６の下部チャンバー部３ａと上部チ　ャンバー部３ｂのウェブ９０を挟む面３ａ１、３ｂ１とが、ウェブ９０の搬送面Ｌと同一　面となることで、ウェブ９０に外力による寸法変化を抑えて精密な位置合わせが可能で　ある。また、位置合わせ後に、平面ステージ４上でウェブ９０と他の枚葉シート９１と　の貼り合せを行うことで、精密な貼り合せが可能である。 As described above, when alignment is performed by the alignment mechanism 6, the planar surface 4a of the flat stage 4 to be aligned, the lower chamber portion 3a of the vacuum chamber 6 and the web 90 of the upper chamber portion 3b are arranged. Since the sandwiching surfaces 3a1 and 3b1 are the same surface as the conveyance surface L of the web 90, the web 90 can be precisely aligned while suppressing a dimensional change due to an external force. In addition, after the alignment, the web 90 and another sheet 91 are bonded on the flat stage 4 so that precise bonding is possible.
　真空チャンバー３の後段には、シール剤硬化機構９と、切断機構１０が順に配置されている。シール剤硬化機構９は、位置合わせおよび貼り合わせ後にシール剤を硬化する。貼り合わせに用いるシール剤をウェブ９０に設け、位置合わせおよび貼り合わせ後にシール剤を硬化することで、精密な貼り合せが可能である。ウェブ９０のシール剤は、紫外線硬化樹脂であり、シール剤硬化機構９が紫外線照射して紫外線硬化樹脂を硬化する。ウェブ９０のシール剤が紫外線硬化樹脂であり、シール剤硬化機構が紫外線照射して紫外線硬化樹脂を硬化し、ウェブ９０に熱を与えて変形させることなく簡単、かつ確実に硬化させることができる。 A sealing agent curing mechanism 9 and a cutting mechanism 10 are arranged in this order after the vacuum chamber 3. The sealant curing mechanism 9 cures the sealant after alignment and bonding. Precise bonding is possible by providing the sealing agent used for bonding on the web 90 and curing the sealing agent after positioning and bonding. The sealant for the web 90 is an ultraviolet curable resin, and the sealant curing mechanism 9 irradiates the ultraviolet ray to cure the ultraviolet curable resin. The sealing agent of the web 90 is an ultraviolet curable resin, and the sealing agent curing mechanism cures the ultraviolet curable resin by irradiating with ultraviolet rays, and can be cured easily and reliably without applying heat to the web 90 to deform it.
　切断機構１０は、シール剤を硬化した後にウェブ９０を切断する。このように、シール剤を硬化した後に、ウェブ９０を切断することで、切断によって位置合わせおよび貼り合わせがずれることがなく、精密な貼り合せが可能である。切断機構１０は、切断装置（ダイシングソー）を用いており、この切断によって、いずれか一方または両方に回路が形成されているウェブ９０と枚葉シート９１の貼り合せによって電子装置を製造する。このウェブ９０と枚葉シート９１の少なくともいづれかの回路が薄膜トランジスタを含む電子装置であるが、これに限定されない。
（実施例１）
　図５に示す幅３００ｍｍ、長さ１００ｍ、厚さ０．１ｍｍのポリエーテルスルホン（以下ＰＥＳと略す）フィルム上に３００ｍｍ周期で、４型サイズで画素数が３２０×２４０ピクセルのカラーフィルタを幅方向に４面、長手方向に３面形成したウェブ状のスペーサー付カラーフィルタを、図１に示す装置の巻き出し機構１から巻き出し、切断機構１０の部分まで通すようにセットした。 The cutting mechanism 10 cuts the web 90 after the sealant is cured. As described above, after the sealing agent is cured, the web 90 is cut so that the alignment and bonding are not shifted by cutting, and precise bonding is possible. The cutting mechanism 10 uses a cutting device (dicing saw), and by this cutting, an electronic device is manufactured by bonding the web 90 on which one or both of the circuits are formed and the sheet 91. The circuit of at least one of the web 90 and the sheet 91 is an electronic device including a thin film transistor, but is not limited thereto.
Example 1
A color filter with a width of 300 mm, a length of 100 m, a thickness of 100 m, and a thickness of 0.1 mm, which is a 4-type size and 320 × 240 pixels in a 300 mm cycle, is arranged in the width direction. A web-shaped color filter with spacers formed on four surfaces in the longitudinal direction was unwound from the unwinding mechanism 1 of the apparatus shown in FIG.
　シール剤描画機構７により各４型カラーフィルタの周囲にＵＶ硬化型のシール剤を塗布し、続いて液晶滴下機構８により所定量の液晶を滴下した。 A UV curable sealant was applied around each 4 type color filter by the sealant drawing mechanism 7, and then a predetermined amount of liquid crystal was dropped by the liquid crystal dropping mechanism 8.
　一方、図６に示す３００ｍｍ×３００ｍｍ、厚さ０．１ｍｍのＰＥＳフィルム上にカラーフィルタと向かい合わせてパターンが一致するようにＴＦＴアレイが作られたシートを、図１に示す装置の枚葉シート９１と貼り合わせを行う貼り合せ機構６の部分に静電チャック６ａにより吸着してセットした。 On the other hand, a sheet in which a TFT array is formed on a 300 mm × 300 mm, 0.1 mm thick PES film shown in FIG. 91 is attached to the portion of the laminating mechanism 6 that performs laminating with the electrostatic chuck 6a.
　液晶を滴下した部分が真空チャンバー３に進んだ時点でウェブ９０の搬送を一時停止し、ウェブ状カラーフィルタの搬送面Ｌまで平面ステージ４を上昇させ、静電チャック６ａによりカラーフィルタを吸着固定した。 When the portion where the liquid crystal is dropped advances to the vacuum chamber 3, the conveyance of the web 90 is temporarily stopped, the plane stage 4 is raised to the conveyance surface L of the web-like color filter, and the color filter is adsorbed and fixed by the electrostatic chuck 6a. .
　続いて、ウェブ９０のカラーフィルタが形成されていない部分を挟んで真空チャンバー３を閉じ、真空ポンプにより真空チャンバー３内を排気した。このとき、真空チャンバー３がウェブ９０を挟む位置は平面ステージ４と同様にウェブ９０の搬送面Ｌと同一とした。 Subsequently, the vacuum chamber 3 was closed with the portion of the web 90 where the color filter was not formed sandwiched, and the vacuum chamber 3 was evacuated with a vacuum pump. At this time, the position where the vacuum chamber 3 sandwiches the web 90 is the same as the conveyance surface L of the web 90 as in the flat stage 4.
　真空チャンバー３内を排気した後、位置合わせ機構５により枚葉シート９１と貼り合わせを行う貼り合せ機構６の位置を微調整し、カラーフィルタとＴＦＴアレイのずれが最少となるようにして枚葉シート９１と貼り合わせを行う貼り合せ機構６を下げて貼り合わせを行った。 After the vacuum chamber 3 is evacuated, the position of the laminating mechanism 6 for laminating with the single wafer sheet 91 is finely adjusted by the alignment mechanism 5 so that the deviation between the color filter and the TFT array is minimized. The bonding was performed by lowering the bonding mechanism 6 for bonding to the sheet 91.
　この状態で、平面ステージ４に組み込んだＵＶスポット照射装置によりシール剤を塗布した部分の一部に紫外線１Ｊ／ｃｍ２を照射し、カラーフィルタとＴＦＴアレイの位置関係を固定した。 In this state, ultraviolet rays 1 J / cm 2 were irradiated to a part of the portion where the sealant was applied by a UV spot irradiation device incorporated in the flat stage 4 to fix the positional relationship between the color filter and the TFT array.
　次に、真空チャンバー３を大気圧に戻して開き、ウェブ９０を搬送してシール硬化機構９の部分でシール剤塗布部全体に紫外線を１Ｊ／ｃｍ２照射してシール剤を硬化した。続いて、切断機構１０で３００ｍｍ×３００ｍｍに切断した。更に、これをｘｙステージを有する切断装置にセットし、個片に切断した後に偏光板を貼り、４型の液晶表示装置を得た。 Next, the vacuum chamber 3 was returned to atmospheric pressure and opened, the web 90 was conveyed, and the sealing agent was cured by irradiating the entire sealant application part with 1 J / cm 2 at the seal curing mechanism 9. Subsequently, it was cut into 300 mm × 300 mm by the cutting mechanism 10. Further, this was set in a cutting device having an xy stage, cut into individual pieces, and then a polarizing plate was attached to obtain a 4 type liquid crystal display device.
　この液晶表示装置を顕微鏡により観察したところ、ＴＦＴ基板側の配線およびトランジスタ部分がカラーフィルタ側のブラックマトリックスの下からずれて出ている部分は見られず、良好に位置合わせがなされていた。
（実施例２）
　カラーフィルタとして、スペーサー無しのカラーフィルタを、ＴＦＴアレイが作られたシートの代わりにＴＦＴアレイおよび白色有機ＥＬが作られたシートを用い、液晶の滴下を行わず、実施例１と同様にして貼り合わせを行い、その後個片に切断することで有機ＥＬ表示装置を得た。 When this liquid crystal display device was observed with a microscope, the portion where the wiring on the TFT substrate side and the transistor portion were shifted from the bottom of the black matrix on the color filter side was not seen, and the alignment was performed well.
(Example 2)
As a color filter, a color filter without a spacer is used in the same manner as in Example 1 except that a sheet having a TFT array and a white organic EL is used instead of a sheet having a TFT array, and no liquid crystal is dropped. The organic EL display device was obtained by combining and then cutting into individual pieces.
　この有機ＥＬ表示装置を顕微鏡により観察したところＴＦＴ基板側の配線およびトランジスタ部分がカラーフィルタ側のブラックマトリックスの下からずれて出ている部分は見られず、良好に位置合わせがなされていた。
（比較例１）
　図７に示す真空チャンバー３がウェブ９０を挟む位置がウェブ９０の搬送面Ｌより５０ｍｍ低い装置を使った以外は、実施例１と同様に行い４型の液晶表示を得た。 When this organic EL display device was observed with a microscope, the portion where the wiring on the TFT substrate side and the transistor portion were shifted from the bottom of the black matrix on the color filter side was not seen, and the alignment was performed well.
(Comparative Example 1)
A 4-type liquid crystal display was obtained in the same manner as in Example 1 except that the apparatus in which the vacuum chamber 3 shown in FIG. 7 sandwiched the web 90 was 50 mm lower than the conveyance surface L of the web 90 was used.
　位置合わせ時に、平面ステージ４の平面状の面４ａがウェブ９０の搬送面Ｌと同一面となっているが、真空チャンバー３の下部チャンバー部３ａと上部チャンバー部３ｂのウェブ９０を挟む面３ａ１、３ｂ１がウェブ９０の搬送面Ｌと同一面となっておらず、下方位置にずれている。 At the time of alignment, the planar surface 4a of the planar stage 4 is flush with the conveyance surface L of the web 90, but the surface 3a1 sandwiching the web 90 of the lower chamber portion 3a of the vacuum chamber 3 and the upper chamber portion 3b, 3b1 is not flush with the conveying surface L of the web 90, and is shifted to a lower position.
　この液晶表示装置を顕微鏡により観察したところ、ＴＦＴ基板側の配線およびトランジスタ部分がカラーフィルタ側のブラックマトリックスの下からずれて出ている部分が見られ、不良を発生した。
（比較例２）
　図８に示す平面ステージ４がウェブ９０の搬送面Ｌより５０ｍｍ高い位置でカラーフィルタを吸着固定する装置を用いた以外は、実施例１と同様に行い４型の液晶表示を得た。 When this liquid crystal display device was observed with a microscope, a portion in which the wiring on the TFT substrate side and the transistor portion were shifted from the bottom of the black matrix on the color filter side was seen, and a defect occurred.
(Comparative Example 2)
A 4-type liquid crystal display was obtained in the same manner as in Example 1 except that the flat stage 4 shown in FIG. 8 used an apparatus for adsorbing and fixing the color filter at a position 50 mm higher than the conveyance surface L of the web 90.
　位置合わせ時に、真空チャンバー３の下部チャンバー部３ａと上部チャンバー部３ｂのウェブ９０を挟む面３ａ１、３ｂ１がウェブ９０の搬送面Ｌと同一面となっているが、平面ステージ４の平面状の面４ａがウェブ９０の搬送面Ｌと同一面となっておらず、上方位置にずれている。 At the time of alignment, the surfaces 3a1 and 3b1 sandwiching the web 90 of the lower chamber portion 3a and the upper chamber portion 3b of the vacuum chamber 3 are the same surface as the conveying surface L of the web 90, but the planar surface of the planar stage 4 4a is not the same surface as the conveyance surface L of the web 90, and is shifted to an upper position.
　この液晶表示装置を顕微鏡により観察したところ、ＴＦＴ基板側の配線およびトランジ
スタ部分がカラーフィルタ側のブラックマトリックスの下からずれて出ている部分が見られ、不良を発生した。 When this liquid crystal display device was observed with a microscope, a portion in which the wiring on the TFT substrate side and the transistor portion were shifted from the bottom of the black matrix on the color filter side was seen, and a defect occurred.
　実施例１および実施例２では、この発明の装置を用いて電子装置を製造した結果、良好に位置合わせがなされた不良のない電子装置を得ることができた。 In Example 1 and Example 2, as a result of manufacturing an electronic device using the device of the present invention, it was possible to obtain a defect-free electronic device that was well aligned.
　比較例１では、真空チャンバー３が、ウェブ９０を挟む面がウェブ９０の搬送面Ｌと異なるために搬送方向に張力が生じ、これによるウェブ９０の伸びにより貼り合わせ時に良好な位置合わせができなかった。
　比較例２では貼り合わせを行う平面ステージ４の高さがウェブ９０の搬送面Ｌと異なるために搬送方向に張力が生じ、これによるウェブ９０の伸びにより貼り合わせ時に良好な位置合わせができなかった。 In Comparative Example 1, since the surface of the vacuum chamber 3 sandwiching the web 90 is different from the transport surface L of the web 90, tension is generated in the transport direction, and due to the elongation of the web 90, good alignment cannot be performed at the time of bonding. It was.
In Comparative Example 2, since the height of the flat stage 4 to be bonded is different from the conveyance surface L of the web 90, tension is generated in the conveyance direction, and due to the elongation of the web 90, good alignment cannot be performed at the time of bonding. .
　この発明は、例えば可撓性基板を用いた液晶表示パネル、有機ＥＬ表示パネルなどの製造に好適なウェブ加工装置及びウェブ加工装置を用いた電子装置の製造方法に適用可能であり、ウェブのフィルム基板を用い、一組の基板を貼り合わせるために精度よく位置合わせを行うことが可能である。 The present invention can be applied to, for example, a web processing apparatus suitable for manufacturing a liquid crystal display panel using a flexible substrate, an organic EL display panel, and the like, and an electronic device manufacturing method using the web processing apparatus. It is possible to perform alignment with high accuracy in order to bond a set of substrates using a substrate.
　１　巻き出し機構
　２　ウェブ搬送機構
　３　真空チャンバー
　３ａ　上部チャンバー部
　３ｂ　上部チャンバー部
　３ａ１、３ｂ１　ウェブ９０を挟む面
　４　平面ステージ
　４ａ　平面ステージ４の平面状の面
　５　位置合わせ機構
　６　貼り合せ機構
　７　シール剤描画機構
　８　液晶滴下機構
　９　シール剤硬化機構
　１０　切断機構
　１１　パターン
　２０　搬送路
　２１　搬送ローラ
　２２　支持ローラ
　５０　シール剤描画
　５１　液晶
　６０　制御装置
　６１　搬送機構駆動装置
　６２　貼り合わせ駆動装置
　９０　ウェブ
　９１　枚葉シート
　Ｌ　搬送路２０の搬送面
　 DESCRIPTION OF SYMBOLS 1 Unwinding mechanism 2 Web conveyance mechanism 3 Vacuum chamber 3a Upper chamber part 3b Upper chamber part 3a1, 3b1 The surface which pinches | interposes the web 90 4 Planar stage 4a Planar surface of the planar stage 4 5 Positioning mechanism 6 Bonding mechanism 7 Sealing agent Drawing mechanism 8 Liquid crystal dropping mechanism 9 Sealing agent curing mechanism 10 Cutting mechanism 11 Pattern 20 Conveying path 21 Conveying roller 22 Support roller 50 Sealing agent drawing 51 Liquid crystal 60 Controller 61 Conveying mechanism driving device 62 Bonding driving device 90 Web 91 Single wafer sheet L Transport surface of transport path 20

Claims (10)

  1. 　ウェブを巻き出す巻き出し機構と、
    　前記巻き出し機構により巻き出された前記ウェブを搬送するウェブ搬送機構と、
    　前記搬送されるウェブを挟んで閉じる真空チャンバーと、
    　前記真空チャンバー内に前記ウェブを吸着固定する平面ステージと、
    　前記ウェブに設けられた位置合わせを行うためのパターンを検出して前記ウェブに対して前記平面ステージ上で位置合わせを行う位置合わせ機構と、
    　を備え、
    　前記位置合わせ機構により位置合わせを行う際に、
    　前記平面ステージの面と、前記真空チャンバーが前記ウェブを挟む面とが、
    　前記ウェブの搬送面と同一面となるように構成したことを特徴とするウェブ加工装置。     An unwinding mechanism for unwinding the web;
    A web transport mechanism for transporting the web unwound by the unwind mechanism;
    A vacuum chamber closed across the web to be conveyed;
    A flat stage for adsorbing and fixing the web in the vacuum chamber;
    An alignment mechanism that detects a pattern for alignment provided on the web and aligns the web on the planar stage;
    With
    When performing alignment by the alignment mechanism,
    The surface of the planar stage and the surface where the vacuum chamber sandwiches the web,
    A web processing apparatus configured to be flush with the web conveyance surface.
  2. 　位置合わせ後に前記平面ステージ上で前記ウェブと他の枚葉シートとの貼り合せを行う貼り合せ機構を有することを特徴とする請求項１に記載のウェブ加工装置。 2. The web processing apparatus according to claim 1, further comprising a laminating mechanism for laminating the web and another single wafer sheet on the planar stage after alignment.
  3. 　貼り合わせに用いるシール剤を前記ウェブに設けるシール剤描画機構と、
    　位置合わせおよび貼り合わせ後に前記シール剤を硬化するシール剤硬化機構とを有することを特徴とする請求項２に記載のウェブ加工装置。     A sealant drawing mechanism for providing the web with a sealant used for bonding;
    The web processing apparatus according to claim 2, further comprising: a sealant curing mechanism that cures the sealant after alignment and bonding.
  4. 　前記ウェブに液晶を滴下する液晶滴下機構を有する請求項３に記載のウェブ加工装置。 4. The web processing apparatus according to claim 3, further comprising a liquid crystal dropping mechanism for dropping liquid crystal on the web.
  5. 　前記シール剤を硬化した後に前記ウェブを切断する切断機構を有する請求項３または４に記載のウェブ加工装置。 The web processing apparatus according to claim 3 or 4, further comprising a cutting mechanism for cutting the web after the sealant is cured.
  6. 　請求項１乃至請求項５のいずれかに記載のウェブ加工装置を用いて、
    　いずれか一方または両方に回路が形成されているウェブと枚葉シートの貼り合せによって電子装置を製造することを特徴とする電子装置の製造方法。     Using the web processing apparatus according to any one of claims 1 to 5,
    An electronic device manufacturing method, wherein an electronic device is manufactured by laminating a web having a circuit formed on either one or both and a sheet.
  7. 　前記ウェブのシール剤が紫外線硬化樹脂であり、
    　前記シール剤硬化機構が紫外線照射して前記紫外線硬化樹脂を硬化することを特徴とする請求項６に記載の電子装置の製造方法。     The sealant of the web is an ultraviolet curable resin,
    The method for manufacturing an electronic device according to claim 6, wherein the sealing agent curing mechanism cures the ultraviolet curable resin by irradiating ultraviolet rays.
  8. 　前記回路が薄膜トランジスタを含むことを特徴とする請求項５または請求項７に記載の電子装置の製造方法。 8. The method of manufacturing an electronic device according to claim 5, wherein the circuit includes a thin film transistor.
  9. 　前記電子装置が液晶表示装置であることを特徴とする請求項６乃至請求項８のいずれか１項に記載の電子装置の製造方法。 The method of manufacturing an electronic device according to any one of claims 6 to 8, wherein the electronic device is a liquid crystal display device.
  10. 　位置合わせを行うためのパターンを有するウェブがカラーフィルタであることを特徴とする請求項６乃至請求項９のいずれか１項に記載の電子装置の製造方法。
    　
    　
    　
    　     The method for manufacturing an electronic device according to claim 6, wherein the web having a pattern for alignment is a color filter.



PCT/JP2009/061869 2009-06-25 2009-06-29 Web processing apparatus and method of manufacturing electronic device WO2010150414A1 (en)

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Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2002090760A (en) * 2000-09-12 2002-03-27 Matsushita Electric Ind Co Ltd Apparatus and method for manufacturing liquid crystal display panel
WO2006103716A1 (en) * 2005-03-25 2006-10-05 Jsr Corporation Process for producing liquid crystal display and apparatus therefor
WO2007020717A1 (en) * 2005-08-18 2007-02-22 Jsr Corporation Process for producing display unit and display unit production apparatus
JP2008015041A (en) * 2006-07-03 2008-01-24 Dainippon Printing Co Ltd Alignment lamination device and alignment lamination method

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2002090760A (en) * 2000-09-12 2002-03-27 Matsushita Electric Ind Co Ltd Apparatus and method for manufacturing liquid crystal display panel
WO2006103716A1 (en) * 2005-03-25 2006-10-05 Jsr Corporation Process for producing liquid crystal display and apparatus therefor
WO2007020717A1 (en) * 2005-08-18 2007-02-22 Jsr Corporation Process for producing display unit and display unit production apparatus
JP2008015041A (en) * 2006-07-03 2008-01-24 Dainippon Printing Co Ltd Alignment lamination device and alignment lamination method

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