WO2010123206A3 - 상측 배출 타공장치 및 이를 구비한 휴대용 박판형 펀치 - Google Patents
상측 배출 타공장치 및 이를 구비한 휴대용 박판형 펀치 Download PDFInfo
- Publication number
- WO2010123206A3 WO2010123206A3 PCT/KR2010/001832 KR2010001832W WO2010123206A3 WO 2010123206 A3 WO2010123206 A3 WO 2010123206A3 KR 2010001832 W KR2010001832 W KR 2010001832W WO 2010123206 A3 WO2010123206 A3 WO 2010123206A3
- Authority
- WO
- WIPO (PCT)
- Prior art keywords
- piercing
- plate type
- same
- upper discharging
- type punch
- Prior art date
Links
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B26—HAND CUTTING TOOLS; CUTTING; SEVERING
- B26F—PERFORATING; PUNCHING; CUTTING-OUT; STAMPING-OUT; SEVERING BY MEANS OTHER THAN CUTTING
- B26F1/00—Perforating; Punching; Cutting-out; Stamping-out; Apparatus therefor
- B26F1/32—Hand-held perforating or punching apparatus, e.g. awls
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B26—HAND CUTTING TOOLS; CUTTING; SEVERING
- B26F—PERFORATING; PUNCHING; CUTTING-OUT; STAMPING-OUT; SEVERING BY MEANS OTHER THAN CUTTING
- B26F1/00—Perforating; Punching; Cutting-out; Stamping-out; Apparatus therefor
- B26F1/02—Perforating by punching, e.g. with relatively-reciprocating punch and bed
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B26—HAND CUTTING TOOLS; CUTTING; SEVERING
- B26F—PERFORATING; PUNCHING; CUTTING-OUT; STAMPING-OUT; SEVERING BY MEANS OTHER THAN CUTTING
- B26F1/00—Perforating; Punching; Cutting-out; Stamping-out; Apparatus therefor
- B26F1/32—Hand-held perforating or punching apparatus, e.g. awls
- B26F1/36—Punching or perforating pliers
Landscapes
- Life Sciences & Earth Sciences (AREA)
- Forests & Forestry (AREA)
- Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- Perforating, Stamping-Out Or Severing By Means Other Than Cutting (AREA)
Abstract
본 발명에 따르면, 내삽홈과, 내삽홈의 내부에 배치되는 상승유도부를 구비한 하부유닛 및 하부유닛의 상측에 배치되며, 내삽홈에 내삽되는 타공날을 하부에 구비하고, 상승유도부가 내삽되는 관통홀이 형성된 상부유닛을 포함하되, 타공날에 의해 하부유닛의 상측에 놓인 피처리물을 타공하여 발생되는 타공칩이 상승유도부에 의해 밀어올려져 상기 관통홀의 내측으로 상승되어 배출되는 상측 배출 타공장치 및 이를 구비한 휴대용 박판형 펀치가 제공된다. 본 발명의 상측 배출 타공장치 및 이를 구비한 휴대용 박판형 펀치에 따르면, 타공날에 의해 하부유닛의 상측에 놓인 피처리물을 타공하여 발생되는 타공칩이 상승유도부에 의해 밀어올려져 관통홀의 내측으로 상승 배출가능하기 때문에 타공이 간단하고, 타공칩에 의한 오염문제가 없다.
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
KR1020090036151A KR101079432B1 (ko) | 2009-04-24 | 2009-04-24 | 상측 배출 타공장치 및 이를 구비한 휴대용 박판형 펀치 |
KR10-2009-0036151 | 2009-04-24 |
Publications (2)
Publication Number | Publication Date |
---|---|
WO2010123206A2 WO2010123206A2 (ko) | 2010-10-28 |
WO2010123206A3 true WO2010123206A3 (ko) | 2010-12-16 |
Family
ID=43011564
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
PCT/KR2010/001832 WO2010123206A2 (ko) | 2009-04-24 | 2010-03-25 | 상측 배출 타공장치 및 이를 구비한 휴대용 박판형 펀치 |
Country Status (2)
Country | Link |
---|---|
KR (1) | KR101079432B1 (ko) |
WO (1) | WO2010123206A2 (ko) |
Families Citing this family (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
KR102099302B1 (ko) | 2019-12-07 | 2020-04-09 | 주식회사 무진상사 | 타공장치 |
Citations (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH0825295A (ja) * | 1994-07-12 | 1996-01-30 | Yuuji Sakata | スケール付きパンチ |
JPH1190898A (ja) * | 1997-09-19 | 1999-04-06 | Japan Aviation Electron Ind Ltd | 紙用穴あけ機 |
KR200199322Y1 (ko) * | 2000-04-21 | 2000-10-02 | 주식회사아도무종합건축사사무소 | 단열재 현장 천공기 |
JP2004001223A (ja) * | 2003-07-09 | 2004-01-08 | Sakura Seiki Kk | 自動穿孔装置と穿孔構造 |
KR100894777B1 (ko) * | 2006-08-31 | 2009-04-24 | 레이메이후지이 코퍼레이션 | 천공 펀치 |
-
2009
- 2009-04-24 KR KR1020090036151A patent/KR101079432B1/ko active IP Right Grant
-
2010
- 2010-03-25 WO PCT/KR2010/001832 patent/WO2010123206A2/ko active Application Filing
Patent Citations (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH0825295A (ja) * | 1994-07-12 | 1996-01-30 | Yuuji Sakata | スケール付きパンチ |
JPH1190898A (ja) * | 1997-09-19 | 1999-04-06 | Japan Aviation Electron Ind Ltd | 紙用穴あけ機 |
KR200199322Y1 (ko) * | 2000-04-21 | 2000-10-02 | 주식회사아도무종합건축사사무소 | 단열재 현장 천공기 |
JP2004001223A (ja) * | 2003-07-09 | 2004-01-08 | Sakura Seiki Kk | 自動穿孔装置と穿孔構造 |
KR100894777B1 (ko) * | 2006-08-31 | 2009-04-24 | 레이메이후지이 코퍼레이션 | 천공 펀치 |
Also Published As
Publication number | Publication date |
---|---|
KR101079432B1 (ko) | 2011-11-02 |
WO2010123206A2 (ko) | 2010-10-28 |
KR20100117406A (ko) | 2010-11-03 |
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