WO2010121674A3 - Structure électronique d'éclairage - Google Patents

Structure électronique d'éclairage Download PDF

Info

Publication number
WO2010121674A3
WO2010121674A3 PCT/EP2009/065329 EP2009065329W WO2010121674A3 WO 2010121674 A3 WO2010121674 A3 WO 2010121674A3 EP 2009065329 W EP2009065329 W EP 2009065329W WO 2010121674 A3 WO2010121674 A3 WO 2010121674A3
Authority
WO
WIPO (PCT)
Prior art keywords
module
substrate
cover layer
electronic component
thermally conductive
Prior art date
Application number
PCT/EP2009/065329
Other languages
English (en)
Other versions
WO2010121674A2 (fr
Inventor
Antoine Luijckx
Original Assignee
Agc Glass Europe
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Agc Glass Europe filed Critical Agc Glass Europe
Priority to EP09755896A priority Critical patent/EP2422589A2/fr
Publication of WO2010121674A2 publication Critical patent/WO2010121674A2/fr
Publication of WO2010121674A3 publication Critical patent/WO2010121674A3/fr

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/325—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by abutting or pinching, i.e. without alloying process; mechanical auxiliary parts therefor
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B17/00—Layered products essentially comprising sheet glass, or glass, slag, or like fibres
    • B32B17/06—Layered products essentially comprising sheet glass, or glass, slag, or like fibres comprising glass as the main or only constituent of a layer, next to another layer of a specific material
    • B32B17/10—Layered products essentially comprising sheet glass, or glass, slag, or like fibres comprising glass as the main or only constituent of a layer, next to another layer of a specific material of synthetic resin
    • B32B17/10005—Layered products essentially comprising sheet glass, or glass, slag, or like fibres comprising glass as the main or only constituent of a layer, next to another layer of a specific material of synthetic resin laminated safety glass or glazing
    • B32B17/10009—Layered products essentially comprising sheet glass, or glass, slag, or like fibres comprising glass as the main or only constituent of a layer, next to another layer of a specific material of synthetic resin laminated safety glass or glazing characterized by the number, the constitution or treatment of glass sheets
    • B32B17/10018—Layered products essentially comprising sheet glass, or glass, slag, or like fibres comprising glass as the main or only constituent of a layer, next to another layer of a specific material of synthetic resin laminated safety glass or glazing characterized by the number, the constitution or treatment of glass sheets comprising only one glass sheet
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B17/00—Layered products essentially comprising sheet glass, or glass, slag, or like fibres
    • B32B17/06—Layered products essentially comprising sheet glass, or glass, slag, or like fibres comprising glass as the main or only constituent of a layer, next to another layer of a specific material
    • B32B17/10—Layered products essentially comprising sheet glass, or glass, slag, or like fibres comprising glass as the main or only constituent of a layer, next to another layer of a specific material of synthetic resin
    • B32B17/10005—Layered products essentially comprising sheet glass, or glass, slag, or like fibres comprising glass as the main or only constituent of a layer, next to another layer of a specific material of synthetic resin laminated safety glass or glazing
    • B32B17/10009—Layered products essentially comprising sheet glass, or glass, slag, or like fibres comprising glass as the main or only constituent of a layer, next to another layer of a specific material of synthetic resin laminated safety glass or glazing characterized by the number, the constitution or treatment of glass sheets
    • B32B17/10036—Layered products essentially comprising sheet glass, or glass, slag, or like fibres comprising glass as the main or only constituent of a layer, next to another layer of a specific material of synthetic resin laminated safety glass or glazing characterized by the number, the constitution or treatment of glass sheets comprising two outer glass sheets
    • B32B17/10045—Layered products essentially comprising sheet glass, or glass, slag, or like fibres comprising glass as the main or only constituent of a layer, next to another layer of a specific material of synthetic resin laminated safety glass or glazing characterized by the number, the constitution or treatment of glass sheets comprising two outer glass sheets with at least one intermediate layer consisting of a glass sheet
    • B32B17/10055—Layered products essentially comprising sheet glass, or glass, slag, or like fibres comprising glass as the main or only constituent of a layer, next to another layer of a specific material of synthetic resin laminated safety glass or glazing characterized by the number, the constitution or treatment of glass sheets comprising two outer glass sheets with at least one intermediate layer consisting of a glass sheet with at least one intermediate air space
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B17/00—Layered products essentially comprising sheet glass, or glass, slag, or like fibres
    • B32B17/06—Layered products essentially comprising sheet glass, or glass, slag, or like fibres comprising glass as the main or only constituent of a layer, next to another layer of a specific material
    • B32B17/10—Layered products essentially comprising sheet glass, or glass, slag, or like fibres comprising glass as the main or only constituent of a layer, next to another layer of a specific material of synthetic resin
    • B32B17/10005—Layered products essentially comprising sheet glass, or glass, slag, or like fibres comprising glass as the main or only constituent of a layer, next to another layer of a specific material of synthetic resin laminated safety glass or glazing
    • B32B17/1055—Layered products essentially comprising sheet glass, or glass, slag, or like fibres comprising glass as the main or only constituent of a layer, next to another layer of a specific material of synthetic resin laminated safety glass or glazing characterized by the resin layer, i.e. interlayer
    • B32B17/10761—Layered products essentially comprising sheet glass, or glass, slag, or like fibres comprising glass as the main or only constituent of a layer, next to another layer of a specific material of synthetic resin laminated safety glass or glazing characterized by the resin layer, i.e. interlayer containing vinyl acetal
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0201—Thermal arrangements, e.g. for cooling, heating or preventing overheating
    • H05K1/0203—Cooling of mounted components
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/03—Use of materials for the substrate
    • H05K1/0306—Inorganic insulating substrates, e.g. ceramic, glass
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/18—Printed circuits structurally associated with non-printed electric components
    • H05K1/182—Printed circuits structurally associated with non-printed electric components associated with components mounted in the printed circuit board, e.g. insert mounted components [IMC]
    • H05K1/183—Components mounted in and supported by recessed areas of the printed circuit board
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/01—Dielectrics
    • H05K2201/0104—Properties and characteristics in general
    • H05K2201/0108—Transparent
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/08—Magnetic details
    • H05K2201/083—Magnetic materials
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10007—Types of components
    • H05K2201/10106—Light emitting diode [LED]
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10431—Details of mounted components
    • H05K2201/10553—Component over metal, i.e. metal plate in between bottom of component and surface of PCB

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Metallurgy (AREA)
  • Manufacturing & Machinery (AREA)
  • Chemical & Material Sciences (AREA)
  • Ceramic Engineering (AREA)
  • Inorganic Chemistry (AREA)
  • Electroluminescent Light Sources (AREA)
  • Coils Or Transformers For Communication (AREA)
  • Arrangement Of Elements, Cooling, Sealing, Or The Like Of Lighting Devices (AREA)
  • Non-Portable Lighting Devices Or Systems Thereof (AREA)

Abstract

L'invention porte sur une structure électronique d'éclairage, comprenant – un substrat (7) portant au moins un chemin électriquement conducteur (2a, 2b) sur un premier côté, au moins une partie dudit substrat étant transparente ou translucide, - au moins un module (11) comprenant un composant électronique (12), ledit composant électronique étant électriquement connecté à l'un desdits chemins électriquement conducteurs, le composant électronique de chacun desdits modules faisant face à une partie transparente ou translucide dudit substrat, au moins un desdits modules étant un module émetteur de lumière, - une couche de revêtement thermiquement conducteur pour dissiper la chaleur générée par ledit composant électronique, ladite couche de revêtement thermiquement conducteur faisant face audit premier côté dudit substrat (7), ladite couche de revêtement thermiquement conducteur étant en contact thermique avec lesdits composants électroniques (12) dudit module, et – un espaceur électriquement isolant séparant ledit chemin électriquement conducteur de ladite couche de revêtement thermiquement conducteur; l'invention porte en outre sur l'utilisation d'une telle structure électronique, sur un tel module (11), sur un tel panneau (1) et sur des procédés de production d'un telle structure électronique, d'un tel panneau (1) et d'un tel module (11).
PCT/EP2009/065329 2009-04-23 2009-11-17 Structure électronique d'éclairage WO2010121674A2 (fr)

Priority Applications (1)

Application Number Priority Date Filing Date Title
EP09755896A EP2422589A2 (fr) 2009-04-23 2009-11-17 Structure électronique d'éclairage

Applications Claiming Priority (4)

Application Number Priority Date Filing Date Title
EPPCT/EP2009/054907 2009-04-23
EP2009054907 2009-04-23
PCT/EP2009/055844 WO2010121666A2 (fr) 2009-04-23 2009-05-14 Structure électronique
EPPCT/EP2009/055844 2009-05-14

Publications (2)

Publication Number Publication Date
WO2010121674A2 WO2010121674A2 (fr) 2010-10-28
WO2010121674A3 true WO2010121674A3 (fr) 2011-02-24

Family

ID=41171143

Family Applications (2)

Application Number Title Priority Date Filing Date
PCT/EP2009/055844 WO2010121666A2 (fr) 2009-04-23 2009-05-14 Structure électronique
PCT/EP2009/065329 WO2010121674A2 (fr) 2009-04-23 2009-11-17 Structure électronique d'éclairage

Family Applications Before (1)

Application Number Title Priority Date Filing Date
PCT/EP2009/055844 WO2010121666A2 (fr) 2009-04-23 2009-05-14 Structure électronique

Country Status (2)

Country Link
EP (2) EP2422593A2 (fr)
WO (2) WO2010121666A2 (fr)

Families Citing this family (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN104913237A (zh) * 2014-03-16 2015-09-16 相阳 电灯具
US10562274B1 (en) 2016-02-22 2020-02-18 Apple Inc. Glass fastening and sealing systems
CN106163112A (zh) * 2016-08-31 2016-11-23 安徽赛福电子有限公司 一种吸合接触式电子元件配套装置
CN106211576A (zh) * 2016-08-31 2016-12-07 安徽赛福电子有限公司 一种吸合接触式电路板
CN106455319A (zh) * 2016-08-31 2017-02-22 安徽赛福电子有限公司 一种吸合接触式电子元件引脚
EP3717238A1 (fr) * 2017-11-30 2020-10-07 Saint-Gobain Glass France Disque composite muni d'un composant électrique intégré
FI20185093A1 (en) 2018-02-01 2019-08-02 Teknologian Tutkimuskeskus Vtt Oy Electronic circuit
CN210351619U (zh) * 2019-08-26 2020-04-17 瑞声科技(新加坡)有限公司 屏幕发声系统
CN112788848B (zh) * 2021-01-25 2022-05-31 邢台职业技术学院 一种用于电路板上电子元件的紧固焊锡结构

Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3612955A (en) * 1969-01-21 1971-10-12 Bell Telephone Labor Inc Circuit board containing magnetic means for positioning devices
GB1299541A (en) * 1969-01-21 1972-12-13 Western Electric Co Electrical components and mounting thereof
DE19528062A1 (de) * 1995-07-31 1997-02-06 Kohler Gerd Dipl Ing Tu Lösbare elektrische Verbindung
WO2007074318A1 (fr) * 2005-12-29 2007-07-05 Saint-Gobain Glass France Structure lumineuse comportant au moins une diode electroluminescente, sa fabrication et ses applications
EP1886804A1 (fr) * 2006-08-02 2008-02-13 AGC Flat Glass Europe SA Eclairage au moyen de LEDs
WO2008149276A1 (fr) * 2007-06-08 2008-12-11 Koninklijke Philips Electronics N.V. Dispositif d'émission lumineuse

Family Cites Families (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE10207367B4 (de) * 2001-03-03 2010-06-24 Langer, Peter Stromschienenanordnung
EP1733653A3 (fr) * 2005-06-13 2007-06-20 SARNO S.p.A. Appareil d'éclairage de vitrines et/ou de zones d'exposition

Patent Citations (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3612955A (en) * 1969-01-21 1971-10-12 Bell Telephone Labor Inc Circuit board containing magnetic means for positioning devices
GB1299541A (en) * 1969-01-21 1972-12-13 Western Electric Co Electrical components and mounting thereof
DE19528062A1 (de) * 1995-07-31 1997-02-06 Kohler Gerd Dipl Ing Tu Lösbare elektrische Verbindung
WO2007074318A1 (fr) * 2005-12-29 2007-07-05 Saint-Gobain Glass France Structure lumineuse comportant au moins une diode electroluminescente, sa fabrication et ses applications
US20090174300A1 (en) * 2005-12-29 2009-07-09 Saint-Gobain Glass France Luminous Structure Comprising at Least One Light-Emitting Diode, Its Manufacture and Its Applications
EP1886804A1 (fr) * 2006-08-02 2008-02-13 AGC Flat Glass Europe SA Eclairage au moyen de LEDs
WO2008149276A1 (fr) * 2007-06-08 2008-12-11 Koninklijke Philips Electronics N.V. Dispositif d'émission lumineuse

Also Published As

Publication number Publication date
WO2010121666A2 (fr) 2010-10-28
WO2010121674A2 (fr) 2010-10-28
EP2422589A2 (fr) 2012-02-29
EP2422593A2 (fr) 2012-02-29
WO2010121666A3 (fr) 2010-12-16

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