WO2010107212A2 - Method of manufacturing case-integrated film type antenna - Google Patents
Method of manufacturing case-integrated film type antenna Download PDFInfo
- Publication number
- WO2010107212A2 WO2010107212A2 PCT/KR2010/001589 KR2010001589W WO2010107212A2 WO 2010107212 A2 WO2010107212 A2 WO 2010107212A2 KR 2010001589 W KR2010001589 W KR 2010001589W WO 2010107212 A2 WO2010107212 A2 WO 2010107212A2
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- WO
- WIPO (PCT)
- Prior art keywords
- film
- antenna radiator
- antenna
- pattern
- forming
- Prior art date
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- 238000004519 manufacturing process Methods 0.000 title claims abstract description 23
- 238000010295 mobile communication Methods 0.000 claims abstract description 19
- 238000000034 method Methods 0.000 claims abstract description 17
- 239000012778 molding material Substances 0.000 claims abstract description 7
- 238000010030 laminating Methods 0.000 claims abstract description 5
- 229910052751 metal Inorganic materials 0.000 abstract description 37
- 239000002184 metal Substances 0.000 abstract description 37
- 238000007747 plating Methods 0.000 description 14
- 239000012790 adhesive layer Substances 0.000 description 12
- 230000015572 biosynthetic process Effects 0.000 description 9
- 239000010410 layer Substances 0.000 description 9
- 230000005855 radiation Effects 0.000 description 8
- 238000005323 electroforming Methods 0.000 description 7
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 description 6
- 229920002120 photoresistant polymer Polymers 0.000 description 6
- 238000002347 injection Methods 0.000 description 5
- 239000007924 injection Substances 0.000 description 5
- 238000000151 deposition Methods 0.000 description 4
- 230000008021 deposition Effects 0.000 description 4
- 230000001965 increasing effect Effects 0.000 description 4
- 238000003475 lamination Methods 0.000 description 4
- 238000004544 sputter deposition Methods 0.000 description 4
- 230000000873 masking effect Effects 0.000 description 3
- 229910052759 nickel Inorganic materials 0.000 description 3
- 238000012545 processing Methods 0.000 description 3
- 238000005406 washing Methods 0.000 description 3
- QAOWNCQODCNURD-UHFFFAOYSA-N Sulfuric acid Chemical compound OS(O)(=O)=O QAOWNCQODCNURD-UHFFFAOYSA-N 0.000 description 2
- 239000002253 acid Substances 0.000 description 2
- 238000007792 addition Methods 0.000 description 2
- 239000000853 adhesive Substances 0.000 description 2
- 230000001070 adhesive effect Effects 0.000 description 2
- 230000003247 decreasing effect Effects 0.000 description 2
- 239000000463 material Substances 0.000 description 2
- 238000012986 modification Methods 0.000 description 2
- 230000004048 modification Effects 0.000 description 2
- 239000011368 organic material Substances 0.000 description 2
- 238000006467 substitution reaction Methods 0.000 description 2
- VYZAMTAEIAYCRO-UHFFFAOYSA-N Chromium Chemical compound [Cr] VYZAMTAEIAYCRO-UHFFFAOYSA-N 0.000 description 1
- 239000011230 binding agent Substances 0.000 description 1
- 229910052804 chromium Inorganic materials 0.000 description 1
- 239000011651 chromium Substances 0.000 description 1
- 239000004020 conductor Substances 0.000 description 1
- 238000001816 cooling Methods 0.000 description 1
- 238000001723 curing Methods 0.000 description 1
- 238000001035 drying Methods 0.000 description 1
- 230000002708 enhancing effect Effects 0.000 description 1
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 description 1
- 229910052737 gold Inorganic materials 0.000 description 1
- 239000010931 gold Substances 0.000 description 1
- 238000003825 pressing Methods 0.000 description 1
- 239000000243 solution Substances 0.000 description 1
- 239000002904 solvent Substances 0.000 description 1
- 238000012546 transfer Methods 0.000 description 1
Images
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01Q—ANTENNAS, i.e. RADIO AERIALS
- H01Q1/00—Details of, or arrangements associated with, antennas
- H01Q1/36—Structural form of radiating elements, e.g. cone, spiral, umbrella; Particular materials used therewith
- H01Q1/38—Structural form of radiating elements, e.g. cone, spiral, umbrella; Particular materials used therewith formed by a conductive layer on an insulating support
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01Q—ANTENNAS, i.e. RADIO AERIALS
- H01Q1/00—Details of, or arrangements associated with, antennas
- H01Q1/12—Supports; Mounting means
- H01Q1/22—Supports; Mounting means by structural association with other equipment or articles
- H01Q1/24—Supports; Mounting means by structural association with other equipment or articles with receiving set
- H01Q1/241—Supports; Mounting means by structural association with other equipment or articles with receiving set used in mobile communications, e.g. GSM
- H01Q1/242—Supports; Mounting means by structural association with other equipment or articles with receiving set used in mobile communications, e.g. GSM specially adapted for hand-held use
- H01Q1/243—Supports; Mounting means by structural association with other equipment or articles with receiving set used in mobile communications, e.g. GSM specially adapted for hand-held use with built-in antennas
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01Q—ANTENNAS, i.e. RADIO AERIALS
- H01Q1/00—Details of, or arrangements associated with, antennas
- H01Q1/12—Supports; Mounting means
- H01Q1/22—Supports; Mounting means by structural association with other equipment or articles
- H01Q1/24—Supports; Mounting means by structural association with other equipment or articles with receiving set
Definitions
- the present invention relates to an antenna of a mobile communication terminal, and, more particularly, to a method of manufacturing a case-integrated film type antenna.
- conductive ink is used on a film to make an antenna radiator. Because such a conductive ink is composed of a conductive material and an adhesive organic material, its electrical conductivity is reduced by the adhesive organic material. Also, because the conductive ink has electrical conductivity which varies with the viscosity (ratio of metal and solvent), a deviation in electrical conductivity occurs, undesirably leading to deviations in antenna performance.
- Sputtering or deposition are typical methods used to make an antenna radiator.
- an object of the present invention is to provide a method of manufacturing a case-integrated film type antenna, which includes forming a metal antenna radiator by electroforming a film thus obtaining a film type antenna, and inserting the film type antenna upon injection of a mobile communication terminal case, thus producing a film type antenna which is integrated with the mobile communication terminal case, and in which the processing time and cost are reduced and the reliability of adhesion between the antenna radiator and the film and the case is increased, thereby improving antenna performance.
- Another object of the present invention is to provide a method of manufacturing a case-integrated film type antenna, in which a film having a metal antenna radiator and a film having a predetermined pattern are laminated to each other, so that the antenna radiator is hid by the predetermined pattern.
- the present invention provides a method of manufacturing a case-integrated film type antenna, including forming an antenna radiator on one surface of a film using electroforming, inserting the film having the antenna radiator into a mold having a shape of a mobile communication terminal case, and injecting a molding material into the mold, thus forming the mobile communication terminal case integrated with the film having the antenna radiator.
- the present invention provides a method of manufacturing a case-integrated film type antenna, including forming an antenna radiator on one surface of a first film, forming a predetermined pattern on one surface of a second film, transferring the antenna radiator formed on the first film to the upper surface of the predetermined pattern formed on the second film, inserting the second film having the predetermined pattern and the transferred antenna radiator into a mold having the shape of a mobile communication terminal case, and injecting a molding material into the mold, thus forming the mobile communication terminal case integrated with the second film having the predetermined pattern and the transferred antenna radiator.
- a method of manufacturing a case-integrated film type antenna may include forming a metal antenna radiator by electroforming a film, thus obtaining a film type antenna, and inserting the film type antenna upon injection of a mobile communication terminal case, thereby manufacturing the film type antenna which is integrated with the mobile communication terminal case.
- the manufacturing process, time and cost may be reduced, and the reliability of adhesion between the antenna radiator and the film and the case may be increased, thereby improving antenna performance.
- the film having the metal antenna radiator and the film having the predetermined pattern may be laminated to each other, so that the antenna radiator is hid by the predetermined pattern, thus preventing the pattern of the antenna radiator from being exposed.
- forming the antenna radiator on the first film and forming the predetermined pattern on the second film may be separately performed, thus reducing the manufacturing process and time and decreasing the manufacturing cost. Furthermore, because the antenna radiator and the predetermined pattern are respectively formed on different films, damage to the film may be prevented as much as possible, thus reducing material loss.
- reference holes are formed at predetermined positions of respective films, a jig having reference pins formed at predetermined positions thereof is provided, and respective films are held on the jig in such a way that the reference pins are fit into the reference holes, thus laminating the films.
- the predetermined pattern may be accurately located at the desired position.
- FIG. 1 is a flowchart showing a process of manufacturing a case-integrated film type antenna according to an embodiment of the present invention
- FIG. 2 is a flowchart showing a process of forming an antenna radiator on at least one surface of a film by electroforming
- FIG. 3 is a view showing the configuration of the film type antenna at steps upon lamination of the film having the antenna radiator and the film having the pattern;
- FIG. 4 is a view showing the insert injection state of the film type antenna integrated with a mobile communication terminal case in a mold.
- FIG. 1 is a flowchart showing a process of manufacturing a case-integrated film type antenna according to the present invention.
- the method of manufacturing a case-integrated film type antenna includes forming an antenna radiator 12 on one surface of a first film 10 (SlO), forming a predetermined pattern 21 on one surface of a second film 20 (S 12), transferring the antenna radiator 12 formed on the first film 10 to an upper surface of the predetermined pattern 21 formed on the second film 20 (S 13), inserting the second film 20 having the predetermined pattern 21 and the transferred antenna radiator 12 into a mold having the shape of a mobile communication terminal case (S 14), and injecting a molding material into the mold, thus forming the mobile communication terminal case integrated with the second film 20 having the predetermined pattern 21 and the transferred antenna radiator 12 (S15).
- the antenna radiator 12 is formed by, for example, electroforming, which is described below with reference to FIG. 2.
- the electroforming process includes applying a photoresist film on the upper surface of a metal plate (SlOl), and subjecting the upper surface of the applied photoresist film to exposure thus imprinting a radiation pattern by an opaque film (S 102). Subsequently, the photoresist film which is not fixed on the upper surface of the metal plate upon exposure is removed, thus forming a groove corresponding to the radiation pattern (S 103).
- the developed metal plate is dried at high temperature so that the photoresist film fixed on the upper surface of the metal plate is cured (S 104), and a piece of masking tape is then attached to the cured photoresist film with the exception of the groove corresponding to the radiation pattern formed on the upper surface of the metal plate (S 105).
- the groove corresponding to the radiation pattern is plated with a conductive metal, thus forming the metal antenna radiator on the metal plate (S 106).
- the formation of the antenna radiator plated with the metal includes primary plating (S 106a), acid washing (S 106b), and secondary plating (S 106c), and may further include tertiary plating (S106d).
- the primary plating (S 106a) includes plating the groove corresponding to the radiation pattern of the upper surface of the metal plate with a nickel strike plating solution in order to increase the bondability and adhesion of the plating conductive metal to the groove, thus forming a first metal layer.
- the acid washing (S 106b) includes washing the metal plate subjected to primary plating (S 106a) using dilute sulfuric acid so that the cured photoresist film is dissolved and removed therefrom, followed by drying the metal plate.
- the secondary plating (S 106c) includes plating the upper surface of the first metal layer resulting from primary plating (S 106a) with nickel metal, thus forming a second metal layer.
- the kind of metal used upon formation of the first metal layer and the second metal layer may be variously selected, and the thickness of the first and second metal layers may be controlled.
- the tertiary plating (S106d) includes plating the upper surface of the second metal layer with any one selected from among gold, nickel and chromium, each of which has high conductivity. This tertiary plating (S106d) may further improve the antenna radiation properties.
- Such a metal antenna radiator formed using electroforming is formed on the film, thereby further increasing electrical conductivity and further enhancing the reliability of adhesion between the film and the antenna radiator.
- the first film 10 is adhered to the upper surface of the antenna radiator 12 by means of a first adhesive layer 11 (S 107).
- the antenna radiator 12 having the first film 10 adhered thereto is separated from the metal plate, thus forming the film type antenna (S 108). Subsequently, a second adhesive layer 13 is applied on the lower surface of the separated antenna radiator having the first film.
- the case-integrated film type antenna according to the embodiment of the present invention includes the first film 10, the first adhesive layer 11 formed on the lower surface of the first film 10, the metal antenna radiator 12 formed on the lower surface of the first adhesive layer 11, and the second adhesive layer 13 formed on the lower surface of the metal antenna radiator 12.
- the formation of the predetermined pattern 21 on one surface of the second film 20 includes printing the predetermined pattern 21 on one surface of the second film 20.
- the second film 20 having the pattern 21 is configured as illustrated in FIGS. 3B.
- the pattern 21 may be provided in any form including a hair line, a logo, a label, a hiding pattern for hiding the radiation pattern, etc.
- the hair line, logo or label represents the advertisement or trademark of the manufacturer, and the hiding pattern for hiding the radiation pattern is formed to correspond to the antenna radiator 12 so that the antenna radiator 12 is hid, thus preventing the corresponding technique from being exposed.
- the formation of the antenna radiator 12 on the first film 10 (SlO) and the formation of the pattern on the second film 20 (S 12) are separately performed and are carried out in parallel, thus reducing the processing time. Because the film on which the antenna radiator is formed and the film on which the pattern is formed are not the same but different from each other, damage to the film may be prevented as much as possible, thus reducing material loss.
- a jig having reference pins (not shown) is provided, reference holes are formed at predetermined positions of each of the first film 10 and the second film 20, and the first and second films 10, 20 are held on the jig in such a way that the reference pins are fit into the reference holes, thus laminating the first and second films 10, 20.
- the lamination process is performed by fitting the reference pins into the reference holes, the pattern 21 and the antenna radiator 12 may be accurately located at the desired position.
- the lamination process may be performed by forming holding recesses on a rectangular jig so that the films are held therein.
- the film type antenna is formed through the lamination process, which includes the second film 20, the pattern 21 formed on the second film 20, the second adhesive layer 13 formed on the pattern 21, the antenna radiator 12 formed on the second adhesive layer 13, the first adhesive layer 11 formed on the antenna radiator 12, and the first film 10 formed on the first adhesive layer 11.
- the first film 10 is removed from the film type antenna.
- the first adhesive layer 11 is removed together, thus obtaining the film type antenna as shown in (c) of FIG. 3.
- a third adhesive layer 15 such as a binder is applied on the antenna radiator 12, thereby obtaining the film type antenna as shown in (d) of FIG. 3.
- the third adhesive layer 15 functions to further increase adhesion between the case and the antenna radiator 12 upon insert injection.
- this film type antenna is inserted into molds 31, 32 having the shape of a mobile communication terminal case (S 14).
- the case-integrated film type antenna resulting from using the method according to the present invention is advantageous because the antenna radiator is protected by the film and the antenna radiator is hid by the pattern, thus preventing the corresponding technique from being exposed.
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- Engineering & Computer Science (AREA)
- Computer Networks & Wireless Communication (AREA)
- Details Of Aerials (AREA)
Abstract
Disclosed is a method of manufacturing a case-integrated film type antenna, including forming an antenna radiator on a first film, forming a predetermined pattern on a second film, transferring the antenna radiator of the first film to the upper surface of the pattern of the second film, inserting the second film having the pattern and the transferred antenna radiator into a mold having a shape of a mobile communication terminal case, and injecting a molding material into the mold thus forming the mobile communication terminal case integrated with the second film having the pattern and the transferred antenna radiator. This method includes laminating the film having the metal antenna radiator and the film having the pattern, thus forming a film type antenna having the pattern, which is then insert injected resulting in the case-integrated film type antenna, thereby reducing the manufacturing process time and cost, and improving antenna performance.
Description
The present invention relates to an antenna of a mobile communication terminal, and, more particularly, to a method of manufacturing a case-integrated film type antenna.
Consumer demand for smaller mobile communication terminals has resulted in a decrease in the size of antennas. Furthermore, in order to lower the manufacturing cost of the antenna, attempts are being made to simplify the manufacturing process.
In methods typically employed to manufacture film type antennas, conductive ink is used on a film to make an antenna radiator. Because such a conductive ink is composed of a conductive material and an adhesive organic material, its electrical conductivity is reduced by the adhesive organic material. Also, because the conductive ink has electrical conductivity which varies with the viscosity (ratio of metal and solvent), a deviation in electrical conductivity occurs, undesirably leading to deviations in antenna performance.
Sputtering or deposition are typical methods used to make an antenna radiator.
In the manufacture of a film type antenna using sputtering or deposition, masking treatment is carried out at unnecessary portions of the film upon sputtering or deposition and an antenna radiator pattern is only formed at the necessary portion. After the formation of the antenna radiator pattern, an additional process of removing the portion subjected to masking treatment again from the film is required, and thus the typical method of manufacturing the film type antenna is disadvantageous in terms of increasing the processing time and cost.
Moreover, the reliability of adhesion of the antenna radiator is undesirably decreased when formed on the film by sputtering or deposition.
Accordingly, the present invention has been made keeping in mind the above problems encountered in the related art, and an object of the present invention is to provide a method of manufacturing a case-integrated film type antenna, which includes forming a metal antenna radiator by electroforming a film thus obtaining a film type antenna, and inserting the film type antenna upon injection of a mobile communication terminal case, thus producing a film type antenna which is integrated with the mobile communication terminal case, and in which the processing time and cost are reduced and the reliability of adhesion between the antenna radiator and the film and the case is increased, thereby improving antenna performance.
Another object of the present invention is to provide a method of manufacturing a case-integrated film type antenna, in which a film having a metal antenna radiator and a film having a predetermined pattern are laminated to each other, so that the antenna radiator is hid by the predetermined pattern.
In order to accomplish the above object, the present invention provides a method of manufacturing a case-integrated film type antenna, including forming an antenna radiator on one surface of a film using electroforming, inserting the film having the antenna radiator into a mold having a shape of a mobile communication terminal case, and injecting a molding material into the mold, thus forming the mobile communication terminal case integrated with the film having the antenna radiator.
In order to accomplish the above object, the present invention provides a method of manufacturing a case-integrated film type antenna, including forming an antenna radiator on one surface of a first film, forming a predetermined pattern on one surface of a second film, transferring the antenna radiator formed on the first film to the upper surface of the predetermined pattern formed on the second film, inserting the second film having the predetermined pattern and the transferred antenna radiator into a mold having the shape of a mobile communication terminal case, and injecting a molding material into the mold, thus forming the mobile communication terminal case integrated with the second film having the predetermined pattern and the transferred antenna radiator.
According to the present invention, a method of manufacturing a case-integrated film type antenna may include forming a metal antenna radiator by electroforming a film, thus obtaining a film type antenna, and inserting the film type antenna upon injection of a mobile communication terminal case, thereby manufacturing the film type antenna which is integrated with the mobile communication terminal case. Thus, the manufacturing process, time and cost may be reduced, and the reliability of adhesion between the antenna radiator and the film and the case may be increased, thereby improving antenna performance.
According to the present invention, the film having the metal antenna radiator and the film having the predetermined pattern may be laminated to each other, so that the antenna radiator is hid by the predetermined pattern, thus preventing the pattern of the antenna radiator from being exposed.
According to the present invention, forming the antenna radiator on the first film and forming the predetermined pattern on the second film may be separately performed, thus reducing the manufacturing process and time and decreasing the manufacturing cost. Furthermore, because the antenna radiator and the predetermined pattern are respectively formed on different films, damage to the film may be prevented as much as possible, thus reducing material loss.
According to the present invention, in the case where the film having the metal antenna radiator and the film having the predetermined pattern are laminated to each other, reference holes are formed at predetermined positions of respective films, a jig having reference pins formed at predetermined positions thereof is provided, and respective films are held on the jig in such a way that the reference pins are fit into the reference holes, thus laminating the films. Thereby, the predetermined pattern may be accurately located at the desired position.
FIG. 1 is a flowchart showing a process of manufacturing a case-integrated film type antenna according to an embodiment of the present invention;
FIG. 2 is a flowchart showing a process of forming an antenna radiator on at least one surface of a film by electroforming;
FIG. 3 is a view showing the configuration of the film type antenna at steps upon lamination of the film having the antenna radiator and the film having the pattern; and
FIG. 4 is a view showing the insert injection state of the film type antenna integrated with a mobile communication terminal case in a mold.
Hereinafter, a detailed description will be given of embodiments of the present invention with reference to the appended drawings.
FIG. 1 is a flowchart showing a process of manufacturing a case-integrated film type antenna according to the present invention.
As shown in FIGS. 1 and 3, the method of manufacturing a case-integrated film type antenna according to an embodiment of the present invention includes forming an antenna radiator 12 on one surface of a first film 10 (S10), forming a predetermined pattern 21 on one surface of a second film 20 (S12), transferring the antenna radiator 12 formed on the first film 10 to an upper surface of the predetermined pattern 21 formed on the second film 20 (S13), inserting the second film 20 having the predetermined pattern 21 and the transferred antenna radiator 12 into a mold having the shape of a mobile communication terminal case (S14), and injecting a molding material into the mold, thus forming the mobile communication terminal case integrated with the second film 20 having the predetermined pattern 21 and the transferred antenna radiator 12 (S15).
Specifically, in the formation of the antenna radiator 12 on one surface of the first film 10 (S10), the antenna radiator 12 is formed by, for example, electroforming, which is described below with reference to FIG. 2.
The electroforming process includes applying a photoresist film on the upper surface of a metal plate (S101), and subjecting the upper surface of the applied photoresist film to exposure thus imprinting a radiation pattern by an opaque film (S102). Subsequently, the photoresist film which is not fixed on the upper surface of the metal plate upon exposure is removed, thus forming a groove corresponding to the radiation pattern (S103).
Subsequently, the developed metal plate is dried at high temperature so that the photoresist film fixed on the upper surface of the metal plate is cured (S104), and a piece of masking tape is then attached to the cured photoresist film with the exception of the groove corresponding to the radiation pattern formed on the upper surface of the metal plate (S105).
Subsequently, the groove corresponding to the radiation pattern is plated with a conductive metal, thus forming the metal antenna radiator on the metal plate (S106).
As such, the formation of the antenna radiator plated with the metal (S106) includes primary plating (S106a), acid washing (S106b), and secondary plating (S106c), and may further include tertiary plating (S106d). The primary plating (S106a) includes plating the groove corresponding to the radiation pattern of the upper surface of the metal plate with a nickel strike plating solution in order to increase the bondability and adhesion of the plating conductive metal to the groove, thus forming a first metal layer. The acid washing (S106b) includes washing the metal plate subjected to primary plating (S106a) using dilute sulfuric acid so that the cured photoresist film is dissolved and removed therefrom, followed by drying the metal plate. The secondary plating (S106c) includes plating the upper surface of the first metal layer resulting from primary plating (S106a) with nickel metal, thus forming a second metal layer. The kind of metal used upon formation of the first metal layer and the second metal layer may be variously selected, and the thickness of the first and second metal layers may be controlled. Additionally, the tertiary plating (S106d) includes plating the upper surface of the second metal layer with any one selected from among gold, nickel and chromium, each of which has high conductivity. This tertiary plating (S106d) may further improve the antenna radiation properties. Such a metal antenna radiator formed using electroforming is formed on the film, thereby further increasing electrical conductivity and further enhancing the reliability of adhesion between the film and the antenna radiator.
After the formation of the first and second metal layers (or the first to third metal layers) so that the metal antenna radiator 12 is formed on the metal plate, the first film 10 is adhered to the upper surface of the antenna radiator 12 by means of a first adhesive layer 11 (S107).
The antenna radiator 12 having the first film 10 adhered thereto is separated from the metal plate, thus forming the film type antenna (S108). Subsequently, a second adhesive layer 13 is applied on the lower surface of the separated antenna radiator having the first film. With reference to (a) of FIG. 3, the case-integrated film type antenna according to the embodiment of the present invention includes the first film 10, the first adhesive layer 11 formed on the lower surface of the first film 10, the metal antenna radiator 12 formed on the lower surface of the first adhesive layer 11, and the second adhesive layer 13 formed on the lower surface of the metal antenna radiator 12.
Thereafter, the formation of the predetermined pattern 21 on one surface of the second film 20 (S12) includes printing the predetermined pattern 21 on one surface of the second film 20. The second film 20 having the pattern 21 is configured as illustrated in FIGS. 3B. The pattern 21 may be provided in any form including a hair line, a logo, a label, a hiding pattern for hiding the radiation pattern, etc. The hair line, logo or label represents the advertisement or trademark of the manufacturer, and the hiding pattern for hiding the radiation pattern is formed to correspond to the antenna radiator 12 so that the antenna radiator 12 is hid, thus preventing the corresponding technique from being exposed.
Herein, the formation of the antenna radiator 12 on the first film 10 (S10) and the formation of the pattern on the second film 20 (S12) are separately performed and are carried out in parallel, thus reducing the processing time. Because the film on which the antenna radiator is formed and the film on which the pattern is formed are not the same but different from each other, damage to the film may be prevented as much as possible, thus reducing material loss.
Hereinafter, the transfer of the antenna radiator 12 to the upper surface of the predetermined pattern 21 formed on the second film 20 (S13) will be described.
As shown in (a) of FIG. 3, the second film 20 having the pattern 21 and the first film 10 having the antenna radiator 12 are laminated to each other. To this end, a jig having reference pins (not shown) is provided, reference holes are formed at predetermined positions of each of the first film 10 and the second film 20, and the first and second films 10, 20 are held on the jig in such a way that the reference pins are fit into the reference holes, thus laminating the first and second films 10, 20. When the lamination process is performed by fitting the reference pins into the reference holes, the pattern 21 and the antenna radiator 12 may be accurately located at the desired position.
Alternatively, in order to assure accurate positioning of the pattern 21 and the antenna radiator 12, the lamination process may be performed by forming holding recesses on a rectangular jig so that the films are held therein.
As shown in (b) of FIG. 3, the film type antenna is formed through the lamination process, which includes the second film 20, the pattern 21 formed on the second film 20, the second adhesive layer 13 formed on the pattern 21, the antenna radiator 12 formed on the second adhesive layer 13, the first adhesive layer 11 formed on the antenna radiator 12, and the first film 10 formed on the first adhesive layer 11.
Subsequently, the first film 10 is removed from the film type antenna. As such, the first adhesive layer 11 is removed together, thus obtaining the film type antenna as shown in (c) of FIG. 3. Subsequently, a third adhesive layer 15 such as a binder is applied on the antenna radiator 12, thereby obtaining the film type antenna as shown in (d) of FIG. 3. The third adhesive layer 15 functions to further increase adhesion between the case and the antenna radiator 12 upon insert injection.
After the formation of the film type antenna having the pattern in this way, as shown in FIG. 4, this film type antenna is inserted into molds 31, 32 having the shape of a mobile communication terminal case (S14).
Thereafter, a molding material is injected into the molds 31, 32 via a nozzle, so that the second film 20 is transformed into the shape of the mold 31 by injection pressure, and the molding material is charged in the space between the mold 31 and the mold 32 and thus forms the shape of the case. Subsequently, pressing, cooling and curing are performed, thereby forming the case-integrated film type antenna in which the second film 20 having the pattern 21 and the antenna radiator 12 is integrated with the mobile communication terminal case 30 (S15).
The case-integrated film type antenna resulting from using the method according to the present invention is advantageous because the antenna radiator is protected by the film and the antenna radiator is hid by the pattern, thus preventing the corresponding technique from being exposed.
Although the embodiments of the present invention have been disclosed for illustrative purposes, those skilled in the art will appreciate that a variety of different modifications, additions and substitutions are possible, without departing from the scope and spirit of the invention as disclosed in the accompanying claims. Accordingly, such modifications, additions and substitutions should also be understood as falling within the scope of the present invention.
Claims (4)
- A method of manufacturing a case-integrated film type antenna, comprising:forming an antenna radiator on one surface of a first film;forming a predetermined pattern on one surface of a second film;transferring the antenna radiator formed on the first film to an upper surface of the predetermined pattern formed on the second film;inserting the second film having the predetermined pattern and the transferred antenna radiator into a mold having the shape of a mobile communication terminal case; andinjecting a molding material into the mold, thus forming the mobile communication terminal case integrated with the second film having the predetermined pattern and the transferred antenna radiator.
- The method according to claim 1, wherein the forming the predetermined pattern on one surface of the second film is performed by printing the predetermined pattern on one surface of the second film.
- The method according to claim 1, wherein the transferring the antenna radiator comprises:laminating the second film having the predetermined pattern and the first film having the antenna radiator, andremoving the first film.
- The method according to claim 3, wherein the laminating the second film and the first film comprises:providing a jig having a reference pin at a predetermined position thereof,forming a reference hole at a predetermined position of each of the first film and the second film, andholding the first film and the second film on the jig in such a way that the reference pin is fit into the reference hole.
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| KR1020090022245A KR101050078B1 (en) | 2009-03-16 | 2009-03-16 | Case-integrated film antenna manufacturing method |
| KR10-2009-0022245 | 2009-03-16 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| WO2010107212A2 true WO2010107212A2 (en) | 2010-09-23 |
| WO2010107212A3 WO2010107212A3 (en) | 2010-12-23 |
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| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| PCT/KR2010/001589 WO2010107212A2 (en) | 2009-03-16 | 2010-03-15 | Method of manufacturing case-integrated film type antenna |
Country Status (2)
| Country | Link |
|---|---|
| KR (1) | KR101050078B1 (en) |
| WO (1) | WO2010107212A2 (en) |
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| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| KR101220524B1 (en) * | 2011-04-06 | 2013-01-21 | 주식회사 에이티앤씨 | Method for manufacturing case of mobile device with antenna |
| KR101942505B1 (en) * | 2012-02-29 | 2019-01-25 | 엘지전자 주식회사 | Mobile terminal |
| KR101465443B1 (en) * | 2013-04-19 | 2014-11-26 | 주식회사 아이엠텍 | Apparatus for laminating wireless antenna |
| KR102288649B1 (en) | 2020-05-12 | 2021-08-10 | 주식회사 이랜텍 | Manufacturing method of an antenna integral case by forming |
| KR102288651B1 (en) | 2020-05-12 | 2021-08-10 | 주식회사 이랜텍 | Manufacturing method of an antenna integral case by molding |
| KR102298547B1 (en) * | 2020-10-13 | 2021-09-03 | 정승규 | A Method for Manufacturing Radiator Structure of 5G Repeater |
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|---|---|---|---|---|
| US6097339A (en) * | 1998-02-23 | 2000-08-01 | Qualcomm Incorporated | Substrate antenna |
| US6784844B1 (en) * | 1999-10-08 | 2004-08-31 | Nokia Mobile Phone Limited | Antenna assembly and method of construction |
| US20040222924A1 (en) * | 2003-02-12 | 2004-11-11 | Dean David M. | Conductive thermoplastic compositions and antennas thereof |
| US20070273592A1 (en) * | 2006-05-16 | 2007-11-29 | Lg Electronics Inc. | Antenna structure and method of manufacturing antenna |
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| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| KR20080025285A (en) * | 2006-09-15 | 2008-03-20 | 삼성전기주식회사 | Method of manufacturing case structure having antenna |
| KR100903373B1 (en) * | 2007-05-14 | 2009-06-22 | 주식회사 미네르바 | Loop Antenna And Manufacturing Method Of The Same |
-
2009
- 2009-03-16 KR KR1020090022245A patent/KR101050078B1/en active IP Right Grant
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2010
- 2010-03-15 WO PCT/KR2010/001589 patent/WO2010107212A2/en active Application Filing
Patent Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US6097339A (en) * | 1998-02-23 | 2000-08-01 | Qualcomm Incorporated | Substrate antenna |
| US6784844B1 (en) * | 1999-10-08 | 2004-08-31 | Nokia Mobile Phone Limited | Antenna assembly and method of construction |
| US20040222924A1 (en) * | 2003-02-12 | 2004-11-11 | Dean David M. | Conductive thermoplastic compositions and antennas thereof |
| US20070273592A1 (en) * | 2006-05-16 | 2007-11-29 | Lg Electronics Inc. | Antenna structure and method of manufacturing antenna |
Also Published As
| Publication number | Publication date |
|---|---|
| KR20100104085A (en) | 2010-09-29 |
| KR101050078B1 (en) | 2011-07-19 |
| WO2010107212A3 (en) | 2010-12-23 |
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