WO2010106963A1 - Reflective light emitting diode and reflective light emitting diode light emitting device - Google Patents
Reflective light emitting diode and reflective light emitting diode light emitting device Download PDFInfo
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- H01L33/48—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
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- H01L33/48—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
- H01L33/62—Arrangements for conducting electric current to or from the semiconductor body, e.g. lead-frames, wire-bonds or solder balls
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- H01L33/48—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
- H01L33/64—Heat extraction or cooling elements
- H01L33/647—Heat extraction or cooling elements the elements conducting electric current to or from the semiconductor body
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- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/44—Structure, shape, material or disposition of the wire connectors prior to the connecting process
- H01L2224/45—Structure, shape, material or disposition of the wire connectors prior to the connecting process of an individual wire connector
- H01L2224/45001—Core members of the connector
- H01L2224/45099—Material
- H01L2224/451—Material with a principal constituent of the material being a metal or a metalloid, e.g. boron (B), silicon (Si), germanium (Ge), arsenic (As), antimony (Sb), tellurium (Te) and polonium (Po), and alloys thereof
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- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/481—Disposition
- H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
- H01L2224/48247—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a bond pad of the item
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- H01L25/00—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof
- H01L25/03—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes
- H01L25/04—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers
- H01L25/075—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group H01L33/00
- H01L25/0753—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group H01L33/00 the devices being arranged next to each other
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- H01L33/00—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
- H01L33/64—Heat extraction or cooling elements
- H01L33/642—Heat extraction or cooling elements characterized by the shape
Definitions
- the present invention relates to a surface-mounted reflective light-emitting diode mounted on the surface of a printed circuit board or the like and a reflective light-emitting diode light-emitting device in which the reflective light-emitting diode is surface-mounted.
- a reflective light emitting diode having a light emitting element and a support having a concave reflecting surface fixed to the light emitting element and reflecting the light emitted from the light emitting element at the reflecting surface and outputting the light to the outside It is known (see, for example, Patent Document 1).
- a pair of leads for passing a current to the light emitting element is disposed on the opposite side surface of the support, and each lead extends to the light emitting element disposed above the reflecting surface. ing.
- the light L emitted from the first light-emitting element 11 and the second light-emitting element 12 is directed downward as indicated by an arrow line in FIG. 6, it is reflected by the reflecting surface 2 having a parabolic curved surface. After being reflected by the reflecting surface 2, the light L becomes a substantially parallel light beam and is emitted from the upper surface of the support 6 in a direction perpendicular to the upper surface. For this reason, the light L emitted from the reflective light-emitting diode 1 is light having a strong directivity with a uniform orientation as compared with a light-emitting diode or the like on a bullet-shaped output surface.
- a method for manufacturing the reflective light-emitting diode 1 according to the embodiment of the present invention will be described with reference to steps (a) to (d) in FIGS. It should be noted that the manufacturing method of the reflective light emitting diode 1 described below is an example, and it is needless to say that the present invention can be realized by various other manufacturing methods including this modification.
- the transparent resin 14 is cured and the first bonding wire 101, the second bonding wire 102, and the like are fixed in the recesses of the support 6, and then the first outside the support 6.
- a process of bending the first application lead 7, the intermediate lead 8, and the second application lead 9 is performed. Due to the stress generated during the bending process, between the first wire connecting arm 7a and the first element mounting arm 8a, and between the second wire connecting arm 8b and the second element mounting arm 9a. The force that separates the respective distal ends acts in the arm extending direction.
- the first bonding wire 101 and the second bonding wire 102 are wired along the bonding direction perpendicular to the arm extending direction.
- the 1st bonding wire 101 and the 2nd bonding wire 102 are not pulled by the force which pulls apart the front-end
- the disconnection of the first bonding wire 101 and the second bonding wire 102 that occurs when the first application lead 7, the intermediate lead 8, and the second application lead 9 are bent into a U-shape. This can be effectively prevented and the production yield of the reflective light emitting diode 1 is improved.
- each of the first application leads 7-1 and 7-2 includes the first wire connecting arms 7a1 and 7a2 and the wide lead side surface portion 71-1 disposed along the wall surface of the support 6. 71-2 and wide lead lower surface portions 72-1 and 72-2 disposed along the lower surface of the support 6.
- Each of the second application leads 9-1 and 9-2 includes a second element mounting arm 9a19a2, wide lead side surface portions 91-1 and 91-2 arranged along the wall surface of the support body 6, and the support body 6 respectively.
- Wide lead lower surface portions 92-1 and 92-2 disposed along the lower surface of the first and second wide leads. That is, each of the first application leads 7-1 and 7-2 and the second application leads 9-1 and 9-2 is U-shaped along the outer surface of the support 6 so that it can be mounted on the mounting substrate 50. It is bent into a shape.
- a dam 307 is formed in the groove 37 of the support 6 so as to block the step from the upper surface of the fitting portion of the first application lead 7-1 on one side to the upper edge surface of the support 6.
- a dam 309 is formed in the grooves 39a and 39b of the support 6 so as to block the step from the upper surface of the fitting portion of the second application lead 9-1 on one side to the upper edge surface of the support 6. Yes.
- the grooves 38 a to 38 c of the support 6 the steps from the upper surfaces of the fitting portions of the other second application lead 9-2 and the first application lead 7-2 to the upper edge surface of the support 6.
- a dam 308 is formed so as to close the door.
- the first light emitting element 11 and the second light emitting element 12 of the reflection type light emitting diode 1A are connected in series.
- the current flowing through the first application leads 7-1 and 7-2 and the second application leads 9-1 and 9-2 can be reduced.
- a reflective light emitting diode light emitting device that has a plurality of light emitting elements, has high brightness of emitted light, and can suppress an increase in the amount of heat generated at the lead can be realized.
Abstract
Description
本発明の一つの実施の形態に係る反射型発光ダイオード1は、図1に示すように、内部に凹面状の反射面2を有する支持体6と、反射面2の上方中央部から支持体6の第1の壁面に向けて水平に延びる第1のワイヤ接続用アーム7aを有する第1印加リード7と、反射面2の上方中央部から支持体6の第1の壁面に対向する第2の壁面に向けて水平にそれぞれ延びる第1の素子マウント用アーム8a及び第2のワイヤ接続用アーム8bを有する中間リード8と、反射面2の上方中央部から支持体6の第1の壁面に向けて水平に延びる第2の素子マウント用アーム9aを有する第2印加リード9と、反射面2の上方中央部において第1の素子マウント用アーム8aの先端部に反射面2と対向して搭載され、且つ第1のワイヤ接続用アーム7aと電気的に接続された第1の発光素子11と、反射面2の上方中央部において第2の素子マウント用アーム9aの先端部に反射面2と対向して搭載され、且つ第2のワイヤ接続用アーム8bと電気的に接続された第2の発光素子12とを備えている。 (First embodiment-reflective light emitting diode)
As shown in FIG. 1, a reflective light-
本発明の第2の実施の形態に係る反射型発光ダイオード発光装置について、図10~図12を用いて説明する。本実施の形態の反射型発光ダイオード発光装置は、反射型発光ダイオード1Aを実装基板50に実装して成るものである。反射型発光ダイオード1Aは、図1に示した第1の実施の形態の反射型発光ダイオード1とはリードの構造が異なっている。そして、実装基板50側の電極51~53により反射型発光ダイオード1Aにマウントされている2個の発光素子11,12を直列接続とする点を特徴としている。 Second Embodiment-Reflection Type Light Emitting Diode Light Emitting Device
A reflective light-emitting diode light-emitting device according to a second embodiment of the present invention will be described with reference to FIGS. The reflective light-emitting diode light-emitting device of the present embodiment is configured by mounting the reflective light-emitting
上記のように、本発明は実施の形態によって記載したが、この開示の一部をなす論述及び図面はこの発明を限定するものであると理解すべきではない。この開示から当業者には様々な代替実施の形態、実施例及び運用技術が明らかとなろう。 (Other embodiments)
As described above, the present invention has been described according to the embodiment. However, it should not be understood that the description and drawings constituting a part of this disclosure limit the present invention. From this disclosure, various alternative embodiments, examples, and operational techniques will be apparent to those skilled in the art.
Claims (4)
- 内部に凹面状の反射面を有する支持体と、
前記反射面の上方中央部から前記支持体の第1の壁面に向けて水平に延びる第1のワイヤ接続用アームを有する第1印加リードと、
前記反射面の上方中央部から前記支持体の前記第1の壁面に対向する第2の壁面に向けて水平にそれぞれ延びる第1の素子マウント用アーム及び第2のワイヤ接続用アームを有する中間リードと、
前記反射面の上方中央部から前記支持体の前記第1の壁面に向けて水平に延びる第2の素子マウント用アームを有する第2印加リードと、
前記反射面の上方中央部において前記第1の素子マウント用アームの先端部に前記反射面と対向して搭載された第1の発光素子と、
前記反射面の上方中央部において前記第2の素子マウント用アームの先端部に前記反射面と対向して搭載された第2の発光素子と、
前記第1のワイヤ接続用アームにおける前記反射面の上方中央部に位置する先端部と前記第1の発光素子とを接続する第1のボンディングワイヤと、
前記第2のワイヤ接続用アームにおける前記反射面の上方中央部に位置する先端部と前記第2の発光素子とを接続する第2のボンディングワイヤとを備えたことを特徴とする反射型発光ダイオード。 A support having a concave reflecting surface inside;
A first application lead having a first wire connecting arm extending horizontally from an upper central portion of the reflecting surface toward a first wall surface of the support;
An intermediate lead having a first element mounting arm and a second wire connection arm extending horizontally from the upper central portion of the reflecting surface toward the second wall surface of the support opposite to the first wall surface. When,
A second application lead having a second element mounting arm extending horizontally from the upper central portion of the reflecting surface toward the first wall surface of the support;
A first light emitting element mounted on the tip of the first element mounting arm at the upper central portion of the reflecting surface so as to face the reflecting surface;
A second light-emitting element mounted on the tip of the second element mounting arm at the upper central portion of the reflecting surface so as to face the reflecting surface;
A first bonding wire that connects the first light emitting element with a tip portion located at an upper central portion of the reflecting surface in the first wire connecting arm;
A reflection type light emitting diode comprising: a tip portion located at an upper center portion of the reflection surface of the second wire connection arm; and a second bonding wire for connecting the second light emitting element. . - 前記第1のワイヤ接続用アーム、前記第2のワイヤ接続用アーム、前記第1の素子マウント用アーム、及び前記第2の素子マウント用アームのそれぞれの前記先端部が、前記第1及び前記第2の壁面と平行方向に沿って配置されていることを特徴とする請求項1に記載の反射型発光ダイオード。 The distal ends of the first wire connecting arm, the second wire connecting arm, the first element mounting arm, and the second element mounting arm are respectively connected to the first and the first elements. The reflective light-emitting diode according to claim 1, wherein the reflective light-emitting diode is disposed along a direction parallel to the wall surface.
- 前記第1印加リード、前記中間リード、及び前記第2印加リードのそれぞれが、前記支持体の外側面に沿って折り曲げられていることを特徴とする請求項1又は2に記載の反射型発光ダイオード。 3. The reflective light emitting diode according to claim 1, wherein each of the first application lead, the intermediate lead, and the second application lead is bent along an outer surface of the support. .
- 内部に凹面状の反射面を有する支持体と、前記反射面の上方中央部から前記支持体の第1の壁面に向けて水平に延びるワイヤ接続用アームを有する片側の第1印加リードと、前記反射面の上方中央部から前記支持体の前記第1の壁面に向けて水平に延びる素子マウント用アームを有する片側の第2印加リードと、前記反射面の上方中央部から前記支持体の前記第1の壁面に対向する第2の壁面に向けて水平に延びる素子マウント用アームを有する他側の第2印加リードと、前記反射面の上方中央部から前記支持体の前記第1の壁面に対向する第2の壁面に向けて水平に延びるワイヤ接続用アームを有する他側の第1印加リードと、前記反射面の上方中央部において前記片側の第2印加リードの素子マウント用アームの先端部に前記反射面と対向して搭載された第1の発光素子と、前記反射面の上方中央部において前記他側の第2印加リードの素子マウント用アームの先端部に前記反射面と対向して搭載された第2の発光素子と、前記片側の第1印加リードのワイヤ接続用アームにおける前記反射面の上方中央部に位置する先端部と前記第1の発光素子とを接続する第1のボンディングワイヤと、前記他側の第1印加リードのワイヤ接続用アームにおける前記反射面の上方中央部に位置する先端部と前記第2の発光素子とを接続する第2のボンディングワイヤとを備え、前記片側、他側それぞれの第1印加リード及び前記片側、他側それぞれの第2印加リードが、前記支持体の外側面に沿って折り曲げられている反射型発光ダイオードと、
前記片側の第1印加リード、片側の第2印加リードそれぞれの前記支持体の底面側に折り曲げられているリード下面部それぞれに接続される互いに分離された電圧印加用の配線パターンと、前記他側の第1印加リード、他側の第2印加リードそれぞれの前記支持体の底面側に折り曲げられているリード下面部それぞれに共に接続される中間配線パターンとを備えた実装基板とから成り、
前記片側の第1印加リード、片側の第2印加リードそれぞれのリード下面部それぞれを前記互いに離れた電圧印加用の配線パターンに個別に接続し、前記他側の第1印加リード、他側の第2印加リードそれぞれのリード下面部それぞれを前記中間配線パターンに共に接続し、前記実装基板上の前記電圧印加用配線パターン及び中間配線パターンを介して片側の第1印加リード、他側の第2印加リード、他側の第1印加リード、片側の第2印加リードを直列接続したことを特徴とする反射型発光ダイオード発光装置。 A support body having a concave reflecting surface therein, a first application lead on one side having a wire connecting arm extending horizontally from an upper central portion of the reflecting surface toward the first wall surface of the support body; A second application lead on one side having an element mounting arm extending horizontally from the upper central portion of the reflecting surface toward the first wall surface of the supporting member; and the first applying lead of the supporting member from the upper central portion of the reflecting surface. A second application lead on the other side having an element mounting arm extending horizontally toward a second wall surface facing the first wall surface, and facing the first wall surface of the support from an upper central portion of the reflection surface; A first application lead on the other side having a wire connection arm extending horizontally toward the second wall surface, and a tip of the element mounting arm of the second application lead on the one side in the upper central portion of the reflection surface. Pair with reflective surface And the second light-emitting element mounted on the tip of the element mounting arm of the second application lead on the other side in the upper central portion of the reflection surface, facing the reflection surface. A light-emitting element; a first bonding wire that connects the first light-emitting element to a tip portion located at an upper central portion of the reflecting surface in the wire connection arm of the first application lead on the one side; and the other side And a second bonding wire for connecting the second light emitting element to the tip portion located at the upper center of the reflecting surface in the wire connecting arm of the first application lead, and each of the one side and the other side. A reflective light emitting diode in which the first application lead and the second application lead on each of the one side and the other side are bent along the outer surface of the support;
The wiring pattern for voltage application separated from each other connected to the lower surface portion of the lead bent on the bottom surface side of the support body of each of the first application lead on one side and the second application lead on one side, and the other side Each of the first application lead, the second application lead on the other side, and a mounting substrate provided with an intermediate wiring pattern connected to each of the lower surface portions of the leads bent to the bottom surface side of the support,
The lower surface portions of the first application lead on one side and the second application lead on one side are individually connected to the wiring patterns for voltage application separated from each other, and the first application lead on the other side and the first application lead on the other side are connected. The two lower surfaces of the two application leads are connected together to the intermediate wiring pattern, and the first application lead on one side and the second application on the other side through the voltage application wiring pattern and the intermediate wiring pattern on the mounting substrate. A reflection type light emitting diode light emitting device, wherein a lead, a first application lead on the other side, and a second application lead on one side are connected in series.
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US7420216B2 (en) | 2003-04-16 | 2008-09-02 | Pearl Lamp Works, Ltd. | Reflection type light-emitting diode device |
JP5336489B2 (en) * | 2008-08-01 | 2013-11-06 | 株式会社 パールライティング | Reflective light emitting diode |
-
2010
- 2010-03-11 KR KR1020117023734A patent/KR101630479B1/en active IP Right Grant
- 2010-03-11 JP JP2011504817A patent/JP5630436B2/en not_active Expired - Fee Related
- 2010-03-11 WO PCT/JP2010/054134 patent/WO2010106963A1/en active Application Filing
Patent Citations (5)
Publication number | Priority date | Publication date | Assignee | Title |
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JPH03171782A (en) * | 1989-11-30 | 1991-07-25 | Iwasaki Electric Co Ltd | Light emitting diode |
JPH07211940A (en) * | 1994-01-21 | 1995-08-11 | Rohm Co Ltd | Planar emission type led light emitting device and its manufacture |
JPH1041551A (en) * | 1996-07-26 | 1998-02-13 | Toyoda Gosei Co Ltd | Light emitting diode lamp assembly |
JP2006005337A (en) * | 2004-05-17 | 2006-01-05 | Tabuchi Electric Co Ltd | Compound reflection type light-emitting device |
JP2008147575A (en) * | 2006-12-13 | 2008-06-26 | Pearl Denkyu Seisakusho:Kk | Light emitting diode |
Also Published As
Publication number | Publication date |
---|---|
KR101630479B1 (en) | 2016-06-14 |
JPWO2010106963A1 (en) | 2012-09-20 |
KR20110128196A (en) | 2011-11-28 |
JP5630436B2 (en) | 2014-11-26 |
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