WO2010103756A1 - Module component, method for manufacturing same, and electronic apparatus using the module component - Google Patents

Module component, method for manufacturing same, and electronic apparatus using the module component Download PDF

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Publication number
WO2010103756A1
WO2010103756A1 PCT/JP2010/001496 JP2010001496W WO2010103756A1 WO 2010103756 A1 WO2010103756 A1 WO 2010103756A1 JP 2010001496 W JP2010001496 W JP 2010001496W WO 2010103756 A1 WO2010103756 A1 WO 2010103756A1
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WO
WIPO (PCT)
Prior art keywords
circuit board
metal film
module component
sealing
top surface
Prior art date
Application number
PCT/JP2010/001496
Other languages
French (fr)
Japanese (ja)
Inventor
岩宮裕樹
堺幸雄
Original Assignee
パナソニック株式会社
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from JP2009056198A external-priority patent/JP5391747B2/en
Priority claimed from JP2009093819A external-priority patent/JP2010245931A/en
Application filed by パナソニック株式会社 filed Critical パナソニック株式会社
Publication of WO2010103756A1 publication Critical patent/WO2010103756A1/en

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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/552—Protection against radiation, e.g. light or electromagnetic waves
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/28—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection
    • H01L23/31—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the arrangement or shape
    • H01L23/3107—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the arrangement or shape the device being completely enclosed
    • H01L23/3121—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the arrangement or shape the device being completely enclosed a substrate forming part of the encapsulation
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/22—Secondary treatment of printed circuits
    • H05K3/28—Applying non-metallic protective coatings
    • H05K3/284—Applying non-metallic protective coatings for encapsulating mounted components
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2223/00—Details relating to semiconductor or other solid state devices covered by the group H01L23/00
    • H01L2223/58—Structural electrical arrangements for semiconductor devices not otherwise provided for
    • H01L2223/64—Impedance arrangements
    • H01L2223/66—High-frequency adaptations
    • H01L2223/6661—High-frequency adaptations for passive devices
    • H01L2223/6677—High-frequency adaptations for passive devices for antenna, e.g. antenna included within housing of semiconductor device
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L25/00—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof
    • H01L25/03—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes
    • H01L25/04—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers
    • H01L25/065—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group H01L27/00
    • H01L25/0655—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group H01L27/00 the devices being arranged next to each other
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/095—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00 with a principal constituent of the material being a combination of two or more materials provided in the groups H01L2924/013 - H01L2924/0715
    • H01L2924/097—Glass-ceramics, e.g. devitrified glass
    • H01L2924/09701—Low temperature co-fired ceramic [LTCC]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
    • H01L2924/161—Cap
    • H01L2924/1615—Shape
    • H01L2924/16152—Cap comprising a cavity for hosting the device, e.g. U-shaped cap
    • H01L2924/1617—Cavity coating
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
    • H01L2924/181—Encapsulation
    • H01L2924/1815—Shape
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/19—Details of hybrid assemblies other than the semiconductor or other solid state devices to be connected
    • H01L2924/1901—Structure
    • H01L2924/1904—Component type
    • H01L2924/19041—Component type being a capacitor
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/19—Details of hybrid assemblies other than the semiconductor or other solid state devices to be connected
    • H01L2924/191—Disposition
    • H01L2924/19101—Disposition of discrete passive components
    • H01L2924/19105—Disposition of discrete passive components in a side-by-side arrangement on a common die mounting substrate
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/30—Technical effects
    • H01L2924/301—Electrical effects
    • H01L2924/3025—Electromagnetic shielding
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0213—Electrical arrangements not otherwise provided for
    • H05K1/0216—Reduction of cross-talk, noise or electromagnetic interference
    • H05K1/0218—Reduction of cross-talk, noise or electromagnetic interference by printed shielding conductors, ground planes or power plane
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/14—Structural association of two or more printed circuits
    • H05K1/141—One or more single auxiliary printed circuits mounted on a main printed circuit, e.g. modules, adapters
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09145—Edge details
    • H05K2201/0919—Exposing inner circuit layers or metal planes at the side edge of the printed circuit board [PCB] or at the walls of large holes
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09209—Shape and layout details of conductors
    • H05K2201/0929—Conductive planes
    • H05K2201/09354—Ground conductor along edge of main surface
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
    • H05K3/341—Surface mounted components
    • H05K3/3431—Leadless components
    • H05K3/3442—Leadless components having edge contacts, e.g. leadless chip capacitors, chip carriers

Definitions

  • the present invention relates to a module part molded with resin and an electronic device using the module part.
  • FIG. 29 is a cross-sectional view of a conventional module component 1 described in Patent Document 1.
  • the module component 1 includes a circuit board 5, a wiring pattern 4 disposed on the circuit board 5, a ground layer 6 disposed inside the circuit board 5, a component 7 mounted on the wiring pattern 4,
  • the sealing part 3 which seals the circumference
  • the ground layer 6 exposed on the side surface of the circuit board 5 is electrically connected to the metal film 2.
  • the metal film 2 has a shielding effect for suppressing radiation received from the outside of the module component 1 and noise generated from the inside.
  • FIGS. 30A to 30C are cross-sectional views showing a method for manufacturing the module component 1.
  • the ground pattern 8 is arranged on the lower surface of the circuit board 5.
  • the shielding effect can be enhanced by electrically connecting the metal film 2 and the ground pattern 8.
  • a module component 1P is manufactured by mounting the component 7 on the circuit board 5 and providing the sealing portion 3.
  • a resist 9 such as a photoresist is formed on the lower surface of the module component 1P where the metal film 2 is not formed on the portion where the metal film 2 is not formed.
  • a metal film 2 is formed on the surface of the module component 1P to produce the module component 1Q. Since the resist 9 is disposed on the lower surface of the circuit board 5, the metal film 2 is not formed except for the ground pattern 8 on the lower surface.
  • the module 9 is manufactured by removing the resist 9 together with the metal film 2 covering the resist 9 by a patterning method called lift-off or the like.
  • a part of the metal film 2 becomes fragments 11A, 11B, and 11C.
  • the fragment 11C which is a part of those fragments, adheres onto the wiring pattern 4 and causes problems such as a short circuit. Further, the fragments 11A become burrs connected to the metal film 2.
  • the broken pieces 11A may be lost due to vibration or impact when the module component 1 is mounted.
  • the burrs may be peeled off over time. If a part of the metal film 2 is missing, a gap may be generated at the interface between the metal film 2 and the sealing portion 3, which may reduce the shielding effect of the metal film 2, and the module component 1 can be used for a long time. Reliability may be affected.
  • FIG. 31 shows a sectional view of another conventional module component 501.
  • the same reference numerals are assigned to the same portions as those of the module component 1 shown in FIG.
  • a module component 501 shown in FIG. 31 includes a sheet metal cover 502 instead of the metal film 2 of the module component 1 shown in FIG.
  • the cover 502 operates as an inverted F-type antenna and also operates as a shield case.
  • the sheet metal cover 502 has both functions of an antenna and a shield case, but is easily deformed by an external force or the like, and has a limited protection function for the reliability of the electronic component 507. And has a large weight.
  • the module component includes a circuit board, a component mounted on the upper surface of the circuit board, a sealing portion provided on the upper surface of the circuit board and sealing the component, and a ground provided on an outer peripheral portion of the lower surface of the circuit board.
  • a pattern and a metal film covering the sealing portion and the circuit board are provided.
  • the metal film has a top surface portion covering the top surface of the sealing portion, a side surface portion extending from the top surface portion and covering the side surface of the circuit board, and a bottom surface portion extending from the side surface portion and provided on the ground pattern.
  • the bottom surface portion has a thickness that decreases as the distance from the side surface portion increases.
  • the wiring pattern of the circuit board and the metal film can be electrically connected with high reliability.
  • FIG. 1A is a top perspective view of a module component according to Embodiment 1 of the present invention.
  • 1B is a cross-sectional view of the module component shown in FIG. 1A taken along line 1B-1B.
  • FIG. 1C is a cross-sectional view of the metal film of the module component in the first exemplary embodiment.
  • 2A is a top perspective view of another module component according to Embodiment 1.
  • FIG. 2B is a cross-sectional view taken along line 2B-2B of the module component shown in FIG. 2A.
  • FIG. 3A is a cross-sectional view illustrating the method for manufacturing the electronic device in the first embodiment.
  • FIG. 3B is a cross-sectional view illustrating the method for manufacturing the electronic device in the first embodiment.
  • FIG. 4A is a cross-sectional view of the electronic device in Embodiment 1.
  • FIG. 4B is an enlarged cross-sectional view of the electronic device shown in FIG. 4A.
  • 5A is a cross-sectional view of another electronic device according to Embodiment 1.
  • FIG. 5B is an enlarged cross-sectional view of the electronic device shown in FIG. 5A.
  • 6A is a cross-sectional view of still another electronic device according to Embodiment 1.
  • FIG. 6B is an enlarged cross-sectional view of the electronic device shown in FIG. 6A.
  • 7A is a bottom perspective view of the module component according to Embodiment 1.
  • FIG. 7B is a partial cross-sectional view of the module component shown in FIG. 7A.
  • FIG. 8A is a bottom perspective view of another module component according to Embodiment 1.
  • FIG. FIG. 8B is a partially enlarged view of the module component shown in FIG. 8A.
  • FIG. 9A is a cross-sectional view showing the method for manufacturing the electronic device in the second embodiment of the present invention.
  • 9B is a cross-sectional view of the electronic device illustrated in FIG. 9A.
  • 9C is a cross-sectional view of the electronic device illustrated in FIG. 9A.
  • FIG. 10A is a cross-sectional view showing the module component manufacturing method according to Embodiment 3 of the present invention.
  • FIG. 10B is a cross-sectional view illustrating the module component manufacturing method according to Embodiment 3.
  • FIG. 10A is a cross-sectional view showing the module component manufacturing method according to Embodiment 3.
  • FIG. 10C is a cross-sectional view illustrating the module component manufacturing method according to Embodiment 3.
  • FIG. 10D is a cross-sectional view illustrating the module component manufacturing method according to Embodiment 3.
  • FIG. 11A is a cross-sectional view illustrating the module component manufacturing method according to Embodiment 3.
  • FIG. 11B is a cross-sectional view illustrating the module component manufacturing method according to Embodiment 3.
  • FIG. 11C is a cross-sectional view illustrating the module component manufacturing method according to Embodiment 3.
  • FIG. 11D is a cross-sectional view illustrating the module component manufacturing method according to Embodiment 3.
  • FIG. 12A is a cross-sectional view illustrating the module component manufacturing method according to Embodiment 3.
  • FIG. 12B is a cross-sectional view illustrating the module component manufacturing method according to Embodiment 3.
  • FIG. 12C is a cross-sectional view illustrating the module component manufacturing method according to Embodiment 3.
  • FIG. 12D is a cross-sectional view illustrating the module component manufacturing method according to Embodiment 3.
  • FIG. 13A is a cross-sectional view showing the module component manufacturing method according to Embodiment 4 of the present invention.
  • FIG. 13B is a cross-sectional view showing a method of manufacturing the module component shown in FIG. 13A.
  • FIG. 13C is a cross-sectional view showing the module component manufacturing method according to Embodiment 4 of the present invention.
  • FIG. 13D is a cross-sectional view showing a method for manufacturing the module component shown in FIG. 13A.
  • FIG. 14 shows the light reflectance of various metals.
  • FIG. 15A is a top perspective view of a module component according to Embodiment 5 of the present invention.
  • 15B is a cross-sectional view of the module component shown in FIG. 15A taken along line 15B-15B.
  • FIG. 15C is a cross-sectional view of the module component shown in FIG. 15A taken along line 15C-15C.
  • FIG. 15D is a cross-sectional view of the metal film of the module component in the fifth embodiment.
  • FIG. 16 is a cross-sectional view of the module component in the fifth embodiment.
  • FIG. 17 is a top view of the module component in the fifth embodiment.
  • FIG. 18 shows the shielding effect of the module component in the fifth embodiment.
  • FIG. 15A is a top perspective view of a module component according to Embodiment 5 of the present invention.
  • 15B is a cross-sectional view of the module component shown in FIG. 15A taken along line 15B-15B.
  • 19A is a top view showing the radiation distribution of electromagnetic waves of the module component in the fifth embodiment.
  • 19B is a side view showing the radiation distribution of the electromagnetic waves of the module component shown in FIG. 19A.
  • FIG. 20A is a top view showing the electromagnetic wave radiation intensity of the module component of the comparative example.
  • 20B is a side view showing the radiation intensity of the electromagnetic wave of the module component shown in FIG. 20A.
  • FIG. 21A is a top perspective view of another module component according to Embodiment 5.
  • 21B is a cross-sectional view of the module component taken along line 21B-21B shown in FIG. 21A.
  • FIG. 22A is a top perspective view of still another module component according to Embodiment 5.
  • FIG. 22B is a cross-sectional view of the module component taken along line 22B-22B shown in FIG. 22A.
  • FIG. 23 shows the relationship between the frequency of electromagnetic waves emitted from the metal film of the module component according to the fifth embodiment as an antenna and the thickness of the metal film.
  • FIG. 24 shows the relationship between the frequency of electromagnetic waves emitted from the metal film of the module component according to the fifth embodiment as an antenna and the lengths of sides and diagonal lines.
  • FIG. 25A is a cross-sectional view illustrating the method for manufacturing the electronic device in the fifth embodiment.
  • 25B is a cross-sectional view of the electronic device illustrated in FIG. 25A.
  • FIG. 26A is a cross-sectional view showing a module component manufacturing method according to Embodiment 5 of the present invention.
  • FIG. 26B is a cross-sectional view illustrating the module component manufacturing method according to Embodiment 5.
  • FIG. 26C is a cross-sectional view illustrating the module component manufacturing method according to Embodiment 5.
  • FIG. 26D is a cross-sectional view illustrating the module component manufacturing method according to Embodiment 5.
  • FIG. 27A is a cross-sectional view illustrating the module component manufacturing method according to Embodiment 5.
  • FIG. 27B is a cross-sectional view illustrating the module component manufacturing method according to Embodiment 5.
  • FIG. 27C is a cross-sectional view illustrating the module component manufacturing method according to Embodiment 5.
  • FIG. 27D is a cross-sectional view illustrating the module component manufacturing method according to Embodiment 5.
  • FIG. 28A is a perspective view showing another method for manufacturing the module component according to Embodiment 5.
  • FIG. 28B is a perspective view showing another method for manufacturing the module component according to Embodiment 5.
  • FIG. 28C is a perspective view showing another method for manufacturing the module component according to Embodiment 5.
  • FIG. 29 is a cross-sectional view of a conventional module component.
  • 30A is a cross-sectional view showing a method for manufacturing the module component shown in FIG.
  • FIG. 30B is a cross-sectional view showing the method for manufacturing the module component shown in FIG.
  • FIG. 30C is a cross-sectional view showing a method of manufacturing the module component shown in FIG.
  • FIG. 31 is a cross-sectional view of another conventional module component.
  • FIG. 1A is a top perspective view of module component 100 according to Embodiment 1 of the present invention.
  • 1B is a cross-sectional view taken along line 1B-1B of module component 100 shown in FIG. 1A.
  • the module component 100 includes a circuit board 104, a component 108 mounted on the upper surface 104A of the circuit board 104, a sealing portion 109 provided on the upper surface 104A of the circuit board 104, and a metal film 101.
  • the sealing unit 109 seals the component 108.
  • the metal film 101 covers the side surface 104 ⁇ / b> C of the circuit board 104 and the sealing portion 109.
  • the circuit board 104 is, for example, a multilayer resin board, and includes an insulating layer 105 made of an insulating material such as glass epoxy resin or ceramic in which glass fibers are impregnated with epoxy resin.
  • the insulating layer 105 includes an upper surface 105A, a lower surface 105B, and a side surface 105C that become the upper surface 104A, the lower surface 104B, and the side surface 104C of the circuit board 104, respectively.
  • the circuit board 104 includes a wiring pattern 106, a land 113 provided on the upper surface 105A of the insulating layer 105, a ground pattern 110 provided on the lower surface 105B of the insulating layer 105, and a land provided on the lower surface 105B of the insulating layer 105. 111 and a via conductor 107 provided in the insulating layer 105.
  • the wiring pattern 106 is provided in the insulating layer 105 and at least one of the upper surface 105A and the lower surface 105B.
  • a component 108 is mounted on the land 113.
  • the via conductor 107 connects the wiring pattern 106 and the ground pattern 110.
  • the end 106C of the wiring pattern 106 is exposed on the side surface 104C of the circuit board 104, that is, the side surface 105C of the insulating layer 105.
  • the metal film 101 is electrically connected to the exposed end 106 ⁇ / b> C of the wiring pattern 106.
  • the ground pattern 110 is provided on the outer periphery of the lower surface 104B of the circuit board 104, that is, the lower surface 105B of the insulating layer 105.
  • the metal film 101 has a top surface portion 101A that covers the top surface 109A of the sealing portion 109, and a side surface portion 101B that extends from the top surface portion 101A to the side surface 104C of the circuit board 104.
  • the metal film 101 further includes a bottom surface portion 112 that extends from the side surface portion 101B and is located on the lower surface 110B of the ground pattern 110.
  • the bottom surface portion 112 has a thickness gradient with a thickness that decreases from the outer periphery to the inner periphery of the insulating layer 105 (circuit board 104).
  • the side surface portion 101B of the metal film 101 covers the side surface 109C of the sealing portion 109 and the side surface 104C of the circuit board 104, that is, extends beyond the boundary surface 102 between the sealing portion 109 and the circuit substrate 104.
  • the adhesion between the ground pattern 110 and the metal film 101 is enhanced, and no part of the metal film 101 such as a burr starts to be peeled off, thereby improving the electrical connection reliability over a long period of time.
  • the circuit board 104 is a multilayer board using, for example, glass epoxy resin for the insulating layer 105, the land 113, the wiring pattern 106, the ground pattern 110, and the land 111 can be formed of copper foil to reduce the cost.
  • the land 113, the wiring pattern 106, the ground pattern 110, and the land 111 may be formed of silver, silver palladium, or copper.
  • the wiring pattern may be formed by printing and baking a conductive paste, or may be formed by attaching a conductive foil such as a copper foil.
  • the component 108 is, for example, an active component such as a semiconductor integrated circuit (IC) or a passive component such as a coil or a capacitor.
  • IC semiconductor integrated circuit
  • passive component such as a coil or a capacitor.
  • the sealing portion 109 is made of, for example, a thermosetting resin, and when heated while being vacuum-pressed, the resin filler enters the gap between the circuit board 104 and the component 108 without generating a void.
  • the component 108 can be sealed.
  • the lower surface 109B of the sealing portion 109 abuts on the upper surface 104A of the circuit board 104.
  • the metal film 101 can be formed by sputtering or plating, or may be formed by printing and curing a commercially available conductive paste. That is, the metal film 101 is made of any one of a sputtered film, a plated film, a conductive paste, or a combination thereof.
  • the metal film 101 may be composed of two or more elements. For example, by forming a base layer made of copper on the surface of the sealing portion 109 and further providing an upper layer made of zinc, nickel, tin or the like on this base layer, the oxidation of copper in the base layer prevents the occurrence of rust. can do. By providing the upper layer made of silver on the base layer made of copper, the sheet resistance of the metal film 101 can be lowered, and the frequency region having a shielding effect can be widened to the high frequency side.
  • the two kinds of elements used in the metal film 101 may form the metal film 101 as an alloy.
  • Members such as copper and zinc or copper and nickel may be alloyed in advance and used as a sputtering target.
  • a copper target and a zinc target may be prepared separately and alloyed by sputtering them simultaneously. By doing so, man-hours can be reduced and costs can be reduced.
  • FIG. 1C is a cross-sectional view of another example of the metal film 101.
  • the metal film 101 includes a base layer 1101 made of titanium or chromium provided on the surface of the sealing portion 109, a copper layer 2101 formed on the base layer 1101, and zinc or nickel provided on the copper layer 2101. And an upper layer 3101 made of tin, a zinc alloy, a nickel alloy, or a tin alloy. Thereby, the adhesiveness of the sealing part 109 and the metal film 101 can be improved.
  • the surface of the sealing portion 109 is reverse-sputtered with argon (Ar) to clean the surface of the sealing portion 109, thereby further improving the adhesion with the metal film 101. Can be made.
  • the contact resistance can be reduced. Since the bottom surface portion 112 has a thickness that decreases from the outer periphery to the inner periphery of the circuit board 104 (insulating layer 105), it is difficult for stress to be generated and does not peel even by an external force or the like.
  • 2A and 2B are a top perspective view and a cross-sectional view of another module component 1100 according to Embodiment 1, respectively.
  • the same reference numerals are assigned to the same parts as those of the module component 100 shown in FIGS. 1A and 1B.
  • a chamfered portion 114 is provided at the edge of the boundary where the upper surface 109A and the side surface 109C of the sealing portion 109 are connected.
  • the metal film 101 covers the surface of the sealing portion 109 including the chamfered portion 114.
  • the chamfered portion 114 is a C-plane cut made of a plane having a predetermined angle gradient provided at the edge of the substantially perpendicular sealing portion 109.
  • the angle of the gradient is 45 degrees, but is not limited to this.
  • the chamfered portion 114 may have a plurality of angular gradients.
  • the chamfered portion 114 may be R-surface processing having a curved surface having a predetermined curvature radius instead of a flat surface.
  • the curvature radius is, for example, not less than 1 mm and not more than 5 mm, but is not limited thereto.
  • the chamfered portion 114 may have a staircase shape.
  • the chamfered portion 114 may be a plurality of combinations such as C surface cutting and R surface processing. The chamfered portion 114 can reduce the thickness variation when the metal film 101 is formed, and suppress the generation of internal stress of the metal film 101.
  • 3A and 3B are cross-sectional views illustrating a method for manufacturing the electronic device 119 in the first embodiment.
  • the electronic device 119 includes a module component 100, solder 117, a circuit board 118, and a fillet 120.
  • the circuit board 118 includes an insulation layer 105E, a wiring pattern 106B, and a via conductor 107B similar to the insulating layer 105, the wiring pattern 106, and the via conductor 107 of the circuit board 104.
  • the module component 100 is mounted on the upper surface 118A of the circuit board 118.
  • the wiring pattern 106B provided on the upper surface 118A of the circuit board 118 and the land 111 provided on the lower surface 104B of the circuit board 104 of the module component 100 are connected by the solder 117.
  • the solder 117 has a fillet 120 extending toward the top surface portion 101 ⁇ / b> A along the side surface portion 101 ⁇ / b> B of the metal film 101 of the module component 100.
  • the fillet 120 may be formed according to the application.
  • 4A and 4B are a sectional view and an enlarged sectional view showing electric field radiation of the module component 100 of the electronic device 119, respectively.
  • Noise is radiated in a specific frequency band from the circuit configured by the component 108 mounted on the circuit board 104 of the module component 100 (1100). Covering the module component 100 (1100) with a conductor like the metal film 101 provides a shielding effect that reduces noise radiated from the module component 100.
  • the frequency band of noise to be suppressed is around 10 GHz (for example, 9.8 GHz to 10.2 GHz).
  • the frequency of 10 GHz is divided by 1/4 to 2.4 GHz, and the frequency is divided by 1/2 to create a 5.0 GHz carrier wave or the like.
  • the electric field radiation 115A, 115B has a peak 103 at the edge, so that the shielding effect may be insufficient in the metal film 101.
  • the thickness of the metal film 101 is 1 ⁇ m or more and 200 ⁇ m or less, and preferably 10 ⁇ m or more and 100 ⁇ m or less.
  • the thickness is 200 ⁇ m or more, internal stress or the like may easily occur in the metal film 101.
  • the thickness is less than 1 ⁇ m, the shielding effect may be low.
  • FIGS. 5A and 5B are a cross-sectional view and an enlarged cross-sectional view of another electronic device 1119 according to Embodiment 1, respectively.
  • 5A and 5B the same reference numerals are given to the same portions as those of the electronic device 119 shown in FIGS. 4A and 4B.
  • An electronic device 1119 illustrated in FIGS. 5A and 5B includes a module component 3100 instead of the module component 100 of the electronic device 119 illustrated in FIGS. 4A and 4B.
  • the chamfered portion 114 of the module component 3100 shown in FIGS. 5A and 5B has a step shape.
  • the chamfered portion 114 having a staircase shape has a plurality of edges 114A.
  • the plurality of edges 114A disperse the electric field 116 as compared with the electronic device 119 shown in FIGS. 4A and 4B, so that the peak 103 of the electric field radiation 115A and 115B can be reduced.
  • 6A and 6B are a cross-sectional view and an enlarged cross-sectional view of still another electronic device 2119 according to Embodiment 1, respectively.
  • the same reference numerals are assigned to the same portions as those of the electronic device 1119 shown in FIGS. 5A and 5B.
  • the chamfered portion 114 of the module component 1100 has a C-plane cut formed by the plane shown in FIGS. 2A and 2B.
  • the chamfered portion 114 has a plurality of edges 114A.
  • the plurality of edges 114A disperse the electric field 116 as compared with the electronic device 119 shown in FIGS. 4A and 4B, so that the peak 103 of the electric field radiation 115A and 115B can be reduced.
  • the edge may be removed by performing R surface processing so that the chamfered portion 114 has a curved surface having a predetermined radius of curvature.
  • FIG. 7A is a bottom perspective view of the module component 100.
  • the lower surface of the module component 100 that is, the lower surface 104B (lower surface 105B) of the circuit board 104 (insulating layer 105) has a rectangular shape having four sides constituting the outer peripheral portion.
  • the ground pattern 110 is provided along at least two sides of the four sides of the outer peripheral portion of the lower surface 105B of the insulating layer 105.
  • a bottom surface portion 112 connected to the side surface portion 101 ⁇ / b> B of the metal film 101 is located on the lower surface 110 ⁇ / b> B of the ground pattern 110.
  • FIG. 7B is a partial cross-sectional view of the module component 100 shown in FIG. 7A.
  • the thickness of the bottom surface portion 112 decreases with increasing distance from the side surface portion 101B, that is, continuously decreases monotonically from the outer peripheral portion of the lower surface 105B of the insulating layer 105 toward the center, and the thickness becomes zero at the end 122A. .
  • the end 122A has a linear shape. With this structure, generation of internal stress in the bottom surface portion 112 is prevented, and even when a mechanical external force is applied, the bottom surface portion 112 is hardly peeled off and burrs are not easily generated. As a result, in the module component 100, the metal film 101 is not damaged due to vibration or impact during handling.
  • the lower surface 104B of the circuit board 104 substantially has a rectangular shape having four sides.
  • the ground pattern 110 is provided along at least two of the four sides of the lower surface 104 ⁇ / b> B of the circuit board 104.
  • the bottom surface portion 112 of the metal film 101 is provided on at least two of the four sides of the lower surface 104B of the circuit board 104.
  • the bottom surface portion 112 of the metal film 101 is provided on the ground pattern 110 beyond these two sides.
  • FIG. 8A is a bottom perspective view of still another module component 2100 in the first exemplary embodiment.
  • FIG. 8B is a partial cross-sectional view of the module component 2100 shown in FIG. 8A.
  • the same reference numerals are assigned to the same parts as those of the module component 100 shown in FIGS. 7A and 7B.
  • the thickness of the bottom surface portion 112 decreases as the distance from the side surface portion 101B decreases, that is, decreases continuously and monotonously from the outer peripheral portion of the lower surface 105B of the insulating layer 105 toward the center.
  • the thickness at the end 122 is zero.
  • the end 122 has an indefinite shape such as a zigzag wave shape instead of a linear shape. Since the end 122 has an indefinite shape, generation of internal stress can be further suppressed.
  • the end 122 may have a grain shape or a Damascus steel pattern, for example.
  • the end 122 of the bottom surface portion 112 By making the end 122 of the bottom surface portion 112 indefinite, the end 122 of the bottom surface portion 112 can be made longer than the linear end 122A shown in FIGS. 7A and 7B, and the bottom surface portion 112 is bonded to the insulating layer 105. By increasing the distance, the metal film 101 can be more strongly bonded to the insulating layer 105, and the metal film 101 can be made difficult to peel off.
  • FIG. 9A is a cross-sectional view illustrating a method for manufacturing electronic device 3119 according to Embodiment 2 of the present invention.
  • FIG. 9B is a cross-sectional view of the electronic device 3119.
  • 9A and 9B the same reference numerals are assigned to the same portions as those of the electronic device 119 illustrated in FIGS. 3A and 3B.
  • the solder 117 is provided on the upper surface 118A of the circuit board 118 of the electronic device 3119, and the module component 100 is mounted on the solder 117.
  • the ground pattern 121 A provided on the upper surface 118 A of the circuit board 118 and the ground pattern 110 connected to the metal film 101 of the module component 100 are electrically connected via solder 117.
  • solder 117 As described above, by mounting the module component 100 with high adhesion of the metal film 101 on the electronic device 119, it is possible to provide the electronic device 3119 with high electrical connection reliability.
  • the ground pattern 121A provided on the upper surface 118A of the circuit board 118 and the ground pattern 121B provided on the lower surface 118B of the circuit board 118 are connected by the via conductor 107B.
  • the ground pattern 110 and the ground pattern 121B of the module component 100 are electrically connected via the via conductor 107B.
  • the via conductor 107B is formed of a conductive resin or plating.
  • the via conductor 107B connects the internal layers of the circuit board 118.
  • the via conductor 107B may be formed of a combination of a plurality of via conductors, for example, a plurality of via conductors 107B.
  • the ground pattern 121A formed on the upper surface 118A of the circuit board 118 and the ground pattern 121B formed on the lower surface 118B may be connected by one via conductor 107A. Only one through via conductor 107A that penetrates the circuit board 118 may connect the ground patterns 121A and 121B. By connecting the ground patterns 121A and 121B with a smaller number of via conductors 107A, the yield and the resistance value can be lowered.
  • the ground potentials of the ground patterns 121A and 121B can be stabilized by connecting the via conductor 107A built in the circuit board 118 to the ground patterns 121A and 121B. Thereby, the shielding effect of the electronic device 119 can be stabilized. As a result, as shown in FIG. 9B, by using the via conductor 107A, the noise 103C from the direction from the side surface of the circuit board 118 can be reduced.
  • the ground pattern 121B is not necessarily limited to a large area pattern covering most of the lower surface, and may be a general ground pattern.
  • FIG. 9C is a cross-sectional view of the electronic device 4119 of the comparative example.
  • the electronic device 4119 does not have one via conductor that connects the ground pattern 121A provided on the upper surface 118A of the circuit board 118 and the ground pattern 121B provided on the lower surface 118B.
  • the noise 103E from the side surface of the circuit board 118 and the noise 103F radiated from the lower surface 118B of the circuit board 118 may not be reduced so much.
  • FIG. 3 are cross-sectional views illustrating a method for manufacturing the module component 100 according to Embodiment 3 of the present invention.
  • the circuit board sheet 204 has a land 113 (shown in FIG. 3A) for mounting the component 108 and a wiring pattern.
  • the component 108 is mounted on the land 113 on the circuit board sheet 204.
  • the component 108 is electrically connected to the land 113 with solder 117 (shown in FIG. 3A).
  • the periphery of the component 108 is sealed with a sealing resin 209, and then the circuit board sheet 204 and the sealing resin 209 are divided into pieces 123 as shown in FIG. 10D.
  • the circuit board sheet 204 and the sealing resin 209 are divided into a circuit board 104 and a sealing portion 109, respectively.
  • FIGS. 11A and 11D are cross-sectional views showing a method for manufacturing the module component 100 according to the third embodiment.
  • the obtained piece 123 is placed on a jig 125 having a holding portion 124.
  • An adhesive such as a double-sided tape can be used as the holding portion 124. It is desirable that the holding portion 124 be disposed below the individual pieces 123 and be disposed on the inner side of the peripheral portion of the circuit board 104.
  • a metal film 101 covering the pieces 123 is formed.
  • the piece 123 is placed on the holding portion 124 such that the outer peripheral portion 104T of the lower surface 104B of the circuit board 104 of the piece 123 is exposed from the holding portion 124.
  • the metal film 101 is formed on the outer peripheral portion 104T by wrapping around from the side surface of the piece 123 to the lower surface 104B.
  • the metal film 101 is formed, for example, by sputtering a metal element, the metal element sprayed from the upper surface of the individual piece 123 wraps around the lower surface 104B, so that the metal film 101 formed on the outer peripheral portion 104T of the lower surface 104B.
  • the thickness of the portion decreases from the outer periphery of the lower surface 104B toward the inner side, and the bottom surface portion 112 shown in FIGS. 7A and 8A is formed.
  • the module component 100 is obtained by peeling the piece 123 from the jig 125.
  • the electrical connection is concerned about vibration and impact when handling the module component 100. Reliability can be improved.
  • 12A to 12D are cross-sectional views illustrating another method for manufacturing the module component 100 according to the third embodiment. 12A to 12D, the same reference numerals are assigned to the same parts as those of the module component 100 shown in FIGS. 11A to 11D.
  • the holding part 124 of the jig 125 shown in FIGS. 11A to 11D has a rectangular cross section.
  • the jig 125 shown in FIGS. 12A to 12D includes a holding portion 124A having a trapezoidal cross section.
  • the jig 125 is provided with a hole 126.
  • the pieces 123 are held by the holding portion 124A of the jig 125 by sucking air through the holes 126 in the direction 103A.
  • a metal film 101 that covers the pieces 123 is formed.
  • the piece 123 is placed on the holding portion 124A so that the outer peripheral portion 104T of the lower surface 104B of the circuit board 104 of the piece 123 is exposed from the holding portion 124.
  • the metal film 101 is formed on the outer peripheral portion 104T by wrapping around from the side surface of the piece 123 to the lower surface 104B.
  • the metal film 101 is formed, for example, by sputtering a metal element, the metal element sprayed from the upper surface of the individual piece 123 wraps around the lower surface 104B, so that the metal film 101 formed on the outer peripheral portion 104T of the lower surface 104B.
  • the thickness of the portion decreases from the outer periphery of the lower surface 104B toward the inner side, and the bottom surface portion 112 shown in FIGS. 7A and 8A is formed. Thereafter, as shown in FIG. 12D, the individual parts 123 are removed from the jig 125 by injecting air in the direction 103 ⁇ / b> G, and the module component 100 is manufactured.
  • the holding portion 124A for holding the piece 123 has a trapezoidal cross section having an inclined surface 124B.
  • the slope 124B contacts the circuit board 104 of the module component 100 at an oblique angle. That is, the distance between the slope 214B and the lower surface 104B of the circuit board 104 decreases as it goes from the outer edge of the lower surface 104B to the inner portion. Accordingly, when the metal film 101 is formed by plating or conductive paste, the thickness of the metal film 101 is set to the inner side when the metal film 101 is formed to wrap around the lower surface 104B of the circuit board 104 of the piece 123. It can be made smaller.
  • end 122 having the indefinite shape shown in FIGS. 8A and 8B can be easily formed by the method shown in FIGS. 11A to 11D and FIGS. 12A to 12D.
  • the metal film 101 can be easily formed even by plating or applying a conductive resin, and the electrical connection reliability between the piece 123 and the metal film 101 can be increased.
  • FIGS. 10C and 10D are cross-sectional views showing a method for manufacturing module component 1100 according to Embodiment 4 of the present invention.
  • 13A and 13B the same reference numerals are assigned to the same portions as those in the manufacturing method according to the third embodiment shown in FIGS. 10C and 10D.
  • a groove 127 having a rectangular cross section is provided at the boundary between the pieces 123 in the sealing resin 209 that seals the component 108 mounted on the circuit board sheet 204.
  • the depth of the groove 127 is shorter than the distance from the upper surface of the piece 123 to the circuit board sheet 204, and the groove 127 does not reach the circuit board sheet 204.
  • the sealing resin 209 and the circuit board sheet 204 can be completely divided into a plurality of pieces 123 by cutting from the bottom center of the groove 127 to the lower surface of the circuit board sheet 204. .
  • a module component 1100 having a sealing portion 109 having a chamfered portion 114 having a stepped shape shown in FIGS. 5A and 5B is obtained.
  • FIGS. 13C and 13D are cross-sectional views showing a method for manufacturing another module component 1100 according to Embodiment 4 of the present invention.
  • 13C and FIG. 13D the same reference numerals are assigned to the same portions as those in the manufacturing method according to the third embodiment shown in FIGS. 10C and 10D.
  • a groove 128 having a V-shaped cross section at the boundary between the pieces 123 is provided in the sealing resin 209 that seals the component 108 mounted on the circuit board sheet 204.
  • the depth of the groove 128 is shorter than the distance from the upper surface of the piece 123 to the circuit board sheet 204, and the groove 128 does not reach the circuit board sheet 203.
  • the sealing resin 209 and the circuit board sheet 204 can be completely divided into a plurality of pieces 123 by cutting from the center of the bottom of the groove 128 to the lower surface of the circuit board sheet 204. .
  • a module component 1100 including a sealing portion 109 having a chamfered portion 114 having a C-surface cut shape shown in FIGS. 2A and 2B is obtained.
  • the piece 123 having a corner having a C-shaped corner or a step 123 having a corner shape is cut only by two steps of forming the grooves 127 and 128 and cutting the piece. Can be easily manufactured.
  • a dicing blade for forming the grooves 127 and 128 and a dicing blade for cutting the circuit board sheet 204 and the sealing resin 209 may be used.
  • the blade to be cut is thinner than the blade that forms the grooves 127 and 128.
  • the shape of one or more sides of the sealing portion 109 can be changed to a staircase or C-plane cut, R-plane processing, or These combinations can be formed.
  • the color difference ⁇ E between the lower surface 110B of the ground pattern 110 and the surface of the bottom surface portion 112 of the metal film 101 is 1 or more, preferably 2 or more, and more preferably 3 or more.
  • the presence or absence and shape of the metal film 101 (bottom surface portion 112) formed on the lower surface 110B of the ground pattern 110 can be easily determined by the color difference ⁇ E of these values.
  • FIG. 14 is a graph showing the relationship between the wavelength of light and the reflectance of gold (Au), silver (Ag), and copper (Cu), and shows the differences in the colors of various metals.
  • the horizontal axis indicates the wavelength of light
  • the horizontal axis indicates the reflectance of the light.
  • silver has a reflectance of 95% or more with respect to light at a wavelength of 400 to 700 nm, and as a result, it looks silver.
  • Copper has a low reflectivity with respect to light having a wavelength of 400 to 550 nm, and thus has a high reflectivity with respect to light with a wavelength of 550 nm or more, and thus appears as a kind of red copper color.
  • gold has a higher reflectance with respect to light having a wavelength near 550 nm than copper, and thus appears to be a golden color closer to yellow than copper.
  • the ground pattern 110 when the ground pattern 110 is made of copper foil, it looks reddish copper, and when it is plated with gold, it looks gold.
  • the metal film 101 contains two or more kinds of elements, the surface looks silver due to components such as nickel, zinc, and silver.
  • the color difference ⁇ E between these colors is 1 or more, so the state of the metal film 101 formed on the ground pattern 110 is It can be easily confirmed by visual inspection. Thereby, not only the electrical connection reliability of the metal film 101 but also the state of the bottom surface portion 112 can be reliably determined.
  • JIS L 0804, JIS L 0805, JIS Z 8721, JIS S 6006, 6007, 6016, 6020, 6028, etc. may be referred to.
  • the electrical connection reliability between the metal film 101 and the ground pattern 110 can be increased by the bottom surface portion 112. Therefore, an electronic device incorporating the circuit board 118 on which the module component is mounted can achieve high reliability against external impacts such as vibration during handling and drop impact.
  • FIG. 15A is a top perspective view of module component 600 according to Embodiment 5 of the present invention.
  • FIG. 15B is a cross-sectional view of the module component 600 shown in FIG. 15A taken along line 15B-15B.
  • the module component 600 includes a circuit board 604, a component 608 mounted on the upper surface 604A of the circuit board 604, a sealing portion 609 provided on the upper surface 604A of the circuit board 604, and a metal film 601.
  • the sealing unit 609 seals the component 608.
  • the metal film 601 covers the side surface 604C of the circuit board 604 and the sealing portion 609.
  • the circuit board 604 is, for example, a multilayer resin board, and includes an insulating layer 605 made of an insulating material such as glass epoxy resin or ceramic in which glass fibers are impregnated with epoxy resin.
  • the insulating layer 605 has an upper surface 605A, a lower surface 605B, and a side surface 605C that become the upper surface 604A, the lower surface 604B, and the side surface 604C of the circuit board 604, respectively.
  • the circuit board 604 further includes a wiring pattern 606, lands 606 ⁇ / b> A provided on the upper surface 605 ⁇ / b> A of the insulating layer 605, and via conductors 607 provided in the insulating layer 605.
  • the wiring pattern 606 is provided in the insulating layer 605 and at least one of the upper surface 605A and the lower surface 605B.
  • a component 608 is mounted on the land 606A.
  • the via conductor 607 connects the wiring pattern 606 and the ground pattern 1610.
  • the metal film 601 has a top surface portion 601A covering the top surface 609A of the sealing portion 609, a side surface portion 601B extending from the top surface portion 601A, and a bottom surface portion 601C extending from the side surface portion 601B.
  • the side surface portion 601B covers 604C of the circuit board 604.
  • the bottom surface portion 601C partially covers the ground pattern 1610.
  • the top surface portion 601A has a rectangular shape having a long side 612 extending in the longitudinal direction 600A and a short side 611.
  • the side surface portion 601B is provided with a slit 613 that exposes the side surface 604C of the circuit board 604 and the side surface 609C of the sealing portion 609.
  • FIG. 15C is a cross-sectional view taken along line 15C-15C of the module component 600 shown in FIG. 15A.
  • the slits 613 are respectively provided in the side portions 601B of the metal film 601 facing each other.
  • the slit 613 is not surrounded by the metal film 601 but is opened to form an opening 610.
  • top surface portion 601A and the side surface portion 601B of the metal film 601 function as an antenna that radiates the electromagnetic wave 603B.
  • the side surface portion 601B of the metal film 601 covers the side surface 609C of the sealing portion 609 and the side surface 604C of the circuit board 604, that is, extends beyond the boundary surface 602 between the sealing portion 609 and the circuit board 604.
  • the adhesion between the ground pattern 1610 and the metal film 601 is enhanced, and a portion where the metal film 601 such as a burr starts to be peeled off does not occur, so that electrical connection reliability over a long period is improved.
  • the top surface portion 601A of the metal film 601 is thicker than the portion covering the side surface portion 601B, particularly the side surface 609C of the sealing portion 609. Specifically, the thickness of the top surface portion 601A of the metal film 601 is 1.5 to 5 times the thickness of the portion of the side surface portion 601B that covers the side surface 609C of the sealing portion 609. Thereby, the top surface portion 601A and the side surface portion 601B can be reliably connected.
  • the bottom surface portion 601C of the metal film 601 has a thickness that decreases from the outer periphery to the inner periphery of the insulating layer 605 and has a thickness gradient. As a result, it is difficult for stress to occur, and the bottom surface portion 601C is hardly peeled off from the ground pattern 1610 even by an external force or the like, so that electrical connection reliability over a long period is improved.
  • the land 606A, the wiring pattern 606, and the ground pattern 110 may be formed of silver, silver palladium, or copper.
  • the wiring pattern may be formed by printing and baking a conductive paste, or may be formed by attaching a conductive foil such as a copper foil.
  • the component 608 is, for example, an active component such as a semiconductor integrated circuit (IC) or a passive component such as a coil or a capacitor, and the mounting density can be increased by using a chip component.
  • IC semiconductor integrated circuit
  • passive component such as a coil or a capacitor
  • the sealing portion 609 is made of, for example, a thermosetting resin, and when heated while being vacuum-pressed, the resin filler enters the gap between the circuit board 604 and the component 608 without generating voids.
  • the component 608 can be sealed.
  • a lower surface 609B of the sealing portion 609 abuts on an upper surface 604A of the circuit board 604.
  • the metal film 601 can be formed by sputtering or plating, or may be formed by printing and curing a commercially available conductive paste.
  • the metal film 601 may be composed of two or more elements. For example, by forming a base layer made of copper on the surface of the sealing portion 609 and providing an upper layer made of zinc, nickel, tin, or the like on this base layer, the oxidation of copper in the base layer prevents the occurrence of rust. can do. By providing the upper layer made of silver on the base layer made of copper, the sheet resistance of the metal film 601 can be lowered, and the frequency region having a shielding effect can be widened to the high frequency side.
  • the two kinds of elements used in the metal film 101 may form the metal film 101 as an alloy.
  • Members such as copper and zinc or copper and nickel may be alloyed in advance and used as a sputtering target.
  • a copper target and a zinc target may be prepared separately and alloyed by sputtering them simultaneously. By doing so, man-hours can be reduced and costs can be reduced.
  • FIG. 15D is a cross-sectional view of another example of the metal film 601.
  • the metal film 601 includes a base layer 1601 made of titanium or chromium provided on the surface of the sealing portion 609, a copper layer 2601 formed on the base layer 1601, and zinc or nickel provided on the copper layer 2601. And an upper layer 3601 made of tin, zinc alloy, nickel alloy, or tin alloy. Thereby, the adhesiveness of the sealing part 609 and the metal film 601 can be improved.
  • the surface of the sealing portion 609 is reverse-sputtered with argon (Ar) to clean the surface of the sealing portion 609, thereby further improving the adhesion with the metal film 601. Can be made.
  • the contact resistance can be reduced. Since the bottom surface portion 601C has a thickness that decreases from the outer periphery to the inner periphery of the circuit board 604 (insulating layer 605), stress is not easily generated and is not peeled off even by an external force or the like.
  • the slit 613 enhances the effect of the metal film 601 as an antenna.
  • the side surface 604C of the circuit board 604 or a part of the side surface 609C of the sealing portion 609 is exposed from the slit 613.
  • FIG. 16 is a cross-sectional view of the module component 600.
  • the module component 600 further includes a power supply unit 616, and the power supply unit 616 includes a reactance 614 and a port transmission source 615.
  • the port transmission source 615 includes a wiring pattern 606 located on the upper surface 604A of the circuit board 604.
  • the power feeding unit 616 is provided at a substantially central portion of the top surface portion 601 ⁇ / b> A of the metal film 601.
  • the reactance 514 is a capacitive or inductive space formed between the component 608 mounted near the center of the circuit board 604 and the top surface portion 601A of the metal film 601 or between the port transmission source 615 and the top surface portion 601A. It consists of coupling components and is coupled with parts (capacitive and inductive).
  • the thickness of the top surface portion 601A of the metal film 601 is set to be equal to or greater than the skin depth through which high-frequency current flows due to the skin effect at the frequency of the radiating electromagnetic wave 603, and the power feeding portion 616 provided on the top surface portion 601A of the metal film 601. Increase the power supply efficiency.
  • the thickness of the side surface portion 601B of the metal film 601 is set to be smaller than the skin depth, and thereby the radiation efficiency of electromagnetic waves radiated from the vicinity of the side surface of the module component 600 can be increased.
  • the skin depth D at the frequency f of the electromagnetic wave 603 is expressed by the following equation depending on the conductivity ⁇ and the permeability ⁇ of the metal film 601.
  • the skin depth D when the metal film 601 is made of copper is obtained.
  • the conductivity ⁇ of copper is 5.8 ⁇ 10 7 (S / m)
  • the magnetic permeability ⁇ is 4 ⁇ ⁇ 10 ⁇ 7 (H / m).
  • the skin depth D is about 0.95 ⁇ m according to the above formula.
  • the shielding effect and the antenna effect of the module component 600 are set by setting the thickness of the top surface portion 601A of the metal film 601 to 1 ⁇ m and the thickness of the side surface portion 601B to 0.2 to 0.33 ⁇ m. It is possible to achieve both.
  • the metal film 601 normally electromagnetically shields the module component 600 over a wide band (100 kHz to 12.75 GHz).
  • the metal film 601 functions as an antenna that radiates electromagnetic waves in a specific frequency range.
  • the length of the side 611 or the side 612 of the top surface portion 601A having the rectangular shape of the metal film 601 is set to 3 ⁇ / 10 to 7 ⁇ / 10.
  • the opening 610 formed by the slit 613 is provided on the side surface 609C of the sealing portion 609 and the side surface 604C of the circuit board 604 that are connected to the sides 612 facing each other.
  • the length 610W in the direction of the side 612 of the opening 610 is set to 3 / 10 ⁇ to 7 / 10 ⁇ .
  • the top surface portion 601A and the side surface portion 601B of the metal film 601 can be operated as an antenna that emits an electromagnetic wave having a wavelength ⁇ . Openings are not provided on the side surfaces of the sealing portion 609 and the circuit board 604 connected to the side 611, and the entire side surface portion 601 ⁇ / b> B of the metal film 601 is covered.
  • the wiring pattern 606 exposed on the side surface 604C of the circuit board 604 is connected to the side surface portion 601B of the metal film 601 connected to the side 611. Thereby, electromagnetic waves radiated from the side surface portion 601B connected to the side 611 can be suppressed, and the directivity of the metal film 601 as an antenna can be set in a direction perpendicular to the side 612.
  • the top surface portion 601A of the metal film 601 can be considered as a set of half-wave dipole antennas extending in the direction of the side 611.
  • the radiation efficiency of the module component 600 as an antenna by adjusting the area of the opening 610. For example, when the opening 610 is narrowed from the lower surface 104B of the circuit board 104 toward the top surface 601A of the metal film 601, a portion where the side surface 601B is connected to the wiring pattern 606 exposed on the side 604C of the circuit board 604 is formed. Since it can be gradually increased, the radiation efficiency can be adjusted. When the opening 610 is not provided, the radiation efficiency is lowest, which is effective when it is desired to shorten the reach of the radiated electromagnetic wave.
  • the length of the opening 610 is shorter than the desired wavelength of the radiated electromagnetic wave, so that the frequency to operate as an antenna is shifted to a high frequency. Is possible.
  • the side 611 When the metal film 601 is operated as an antenna that emits an electromagnetic wave having a wavelength ⁇ and the relative dielectric constant ⁇ r of the sealing portion 609 is set, the side 611 has a length of about ⁇ / (2 ⁇ ⁇ r 1/2 ) due to the wavelength reduction. Thus, the metal film 601 operates as an antenna that radiates and receives the electromagnetic waves.
  • the half wavelength ⁇ / 2 of an electromagnetic wave having a frequency of 5 GHz is about 3 (cm). In this case, if the length of the side 611 is about 3 / ⁇ r 1/2 (cm), the metal film 601 operates as an antenna that can radiate and receive the electromagnetic wave.
  • the module component 600 can be electromagnetically shielded over a wide band (100 kHz to 12.75 GHz), and electromagnetic waves in a specific frequency range can be generated. Operates as an antenna that can radiate and receive.
  • FIG. 17 is a top view of the module component 600.
  • the top surface portion 601A of the metal film 601 has a rectangular shape.
  • the length of the diagonal 601D of the top surface 601A is set to 1 / 2 ⁇ .
  • the length of the side 611 of the top surface portion 601A is desirably 3 / 10 ⁇ to 7 / 10 ⁇ . Further, the length of the diagonal line 601D of the top surface portion 601A may be set to 3 / 10 ⁇ to 7 / 10 ⁇ .
  • the length L611 of the side 611 is expressed as follows due to the wavelength reduction. .
  • FIG. 18 is a graph showing the electromagnetic shielding effect of metal used for the metal film 601 of the module component 600.
  • the horizontal axis indicates the frequency of the electromagnetic wave
  • the vertical axis indicates the theoretical calculation value of the attenuation amount of the electromagnetic wave.
  • Characteristic P601 indicates the attenuation of a commercially available layer made of white and white having a thickness of 80 ⁇ m.
  • a characteristic P602 indicates the attenuation of a layer made of copper foil having a thickness of 1.0 ⁇ m formed by sputtering.
  • P603 represents the attenuation of a layer made of a commercially available conductive paste having a thickness of 10 ⁇ m.
  • the attenuation amount is the largest for the layer made of conductive paste, the next is the layer made of white, and the attenuation amount of the layer made of copper formed by sputtering is the smallest.
  • the thickness of the top surface portion 601A of the metal film 601 is set to be 1.5 to 5 times the thickness of the side surface portion 601B.
  • the attenuation of electromagnetic waves can be effectively increased even if it is thin, so that the shielding effect of the module component 600 can be enhanced.
  • 19A and 19B are a top view and a side view showing the radiation distribution of electromagnetic waves of the module component 600 provided with the metal film 601 having the slits 613, respectively.
  • 20A and 20B are a top view and a side view showing the electromagnetic wave radiation intensity of the module component of the comparative example provided with the metal film 601 not having the slit 613, respectively.
  • the electric field strength E601A is the largest
  • the electric field strength E601B is the second largest
  • the electric field strength E601C is the third.
  • the electric field strength E601D is the smallest.
  • the electric field strength is high in the region near the module component 600, and the electric field strength is low in the region far from the module component.
  • a region 617A having high electric field strength is formed near the module component 600 shown in FIGS. 19A and 19B.
  • the region 617A having a high electric field strength is not formed.
  • the regions 617B and 617C formed by the module component 600 shown in FIGS. 19A and 19B are narrower than the regions 617B and 617C formed by the module component of the comparative example shown in FIGS. 20A and 20B.
  • the electric field strength can be made higher overall than the electric field strength of the module component of the comparative example shown in FIGS. 20A and 20B.
  • FIG. 21A is a top perspective view of another module component 1600 according to the fifth embodiment.
  • FIG. 21B is a cross-sectional view of the module component 1600 shown in FIG. 21A taken along line 21B-21B.
  • 21A and 21B the same reference numerals are assigned to the same parts as those of the module component 600 shown in FIGS. 15A and 15B.
  • An opening 610 and an opening 610A are provided in the side surface 601B connected to the side 612 of the metal film 601.
  • the opening 610 is provided at the center of the side surface 601B in the direction of the side 612, and the opening 610A is provided at both ends of the side surface 601B in the direction of the side 612.
  • the side surface portion 601B connected to the side 611 of the metal film 601 covers the entire side surface 609C of the sealing portion 609, but does not reach the side surface 604C of the circuit board 604 and is not connected to the wiring pattern 606. Thereby, the directivity of the module component 600 as an antenna can be set in the direction of the side 612, which is effective when the directivity of the module component 600 is to be adjusted.
  • FIG. 22A is a top perspective view of still another module component 2600 in the fifth embodiment.
  • FIG. 22B is a cross-sectional view of the module component 2600 shown in FIG. 22A taken along line 22B-22B.
  • 22A and 22B the same reference numerals are assigned to the same portions as those of the module component 1600 shown in FIGS. 21A and 21B.
  • an opening 610B is provided in a side surface 601B connected to the side 611 of the metal film 601.
  • the opening 610B exposes the side surface 604C of the circuit board 604 and further exposes the side surface 609C of the sealing portion 609 partially.
  • the antenna directivity adjustment range can be expanded.
  • FIG. 23 shows the relationship between the frequency of electromagnetic waves emitted from the metal film 601 as an antenna and the film thicknesses of the top surface portion 601A and the side surface portion 601B.
  • FIG. 24 shows the relationship between the frequency of electromagnetic waves and the lengths of the side 611 and the diagonal line 601D of the metal film 601.
  • the length of the diagonal line 601D shown in FIG. 24 is the maximum when the length of the side 611 of the module component 600 is 7 / 10 ⁇ and the shape of the top surface portion 601A of the metal film 601 is square. As shown in FIG. 24, in the actual calculation, the maximum length of the diagonal line 601D is in the range of 3 / 10 ⁇ to 7 / 10 ⁇ in consideration of the relative dielectric constant of the sealing portion 609.
  • a module component that operates as an antenna of an electromagnetic wave having a desired frequency in the top surface portion 601A and the side surface portion 601B.
  • the radiation efficiency of 600 can be increased.
  • the opening 610 can be formed simultaneously with a mask when the side surface 601B of the metal film 601 is formed.
  • the slit 613 can also be formed by a trimming process in which a slit is formed in the side surface portion 301B after the side surface portion 601B is formed.
  • FIG. 25A and FIG. 25B are cross-sectional views showing a method for manufacturing the electronic device 620 provided with the module component 600 according to the fifth embodiment.
  • the electronic device 620 includes a module component 600 and a circuit board 618 on which the module component 600 is mounted.
  • a wiring pattern 606B is provided on the upper surface 618A of the circuit board 618.
  • Solder 619 is provided on the wiring pattern 606B.
  • the module component 600 is mounted by being connected to the wiring pattern 606B on the upper surface 618A of the circuit board 618 with solder 619.
  • 26A to 26D are cross-sectional views showing a method for manufacturing the module component 600 according to the fifth embodiment.
  • the circuit board sheet 704 has a wiring pattern 606 for mounting the component 608.
  • the component 608 is mounted on the wiring pattern 606 on the circuit board sheet 704.
  • the component 608 is electrically connected to the wiring pattern 606 with solder 619.
  • FIG. 26C after the periphery of the component 608 is sealed with a sealing resin 709, the circuit board sheet 704 and the sealing resin 709 are divided into pieces 621 as shown in FIG. 26D.
  • the circuit board sheet 704 and the sealing resin 709 are divided into a circuit board 604 and a sealing portion 609, respectively.
  • FIGS. 27A to 27D are cross-sectional views showing a method for manufacturing the module component 600.
  • the obtained piece 621 is placed on a jig 623 having a holding portion 622.
  • An adhesive such as a double-sided tape can be used as the holding portion 622.
  • the holding portion 622 is preferably disposed below the piece 621 and on the inner side of the peripheral portion of the circuit board 604.
  • a metal film 601 covering the piece 621 is formed.
  • the piece 621 is placed on the holding portion 622 so that the outer peripheral portion 604T of the lower surface 604B of the circuit board 604 of the piece 621 is exposed from the holding portion 622.
  • the metal film 601 is formed on the outer peripheral portion 604T by wrapping around from the side surface of the piece 621 to the lower surface 604B.
  • the metal film 601 is formed, for example, by sputtering a metal element, the metal element sprayed from the upper surface of the piece 621 wraps around the lower surface 604B, so that the metal film 601 formed on the outer peripheral portion 604T of the lower surface 604B.
  • the thickness of the portion decreases from the outer periphery of the lower surface 604B toward the inside, and the bottom surface portion 662 shown in FIG. 15A is formed.
  • the module component 600 is obtained by peeling the piece 621 from the jig 623.
  • the electrical connection is concerned about vibration and impact when handling the module component 600. Reliability can be improved.
  • FIG. 28A to FIG. 28C are perspective views showing another method for manufacturing a module component, and show a method for forming the metal film 601.
  • the mask 624 is used to form a slit 613 and an opening 610 in the side surface 601B of the metal film 601.
  • the piece 621 is fixed to the jig 623 before the metal film 601 is formed.
  • the side surface of the piece 621 is in contact with the mask 624 or opposed at a small interval.
  • a metal film 601 is formed by a sputtering apparatus on the surface of the individual piece 621 whose side surface is covered with a mask 624. Since the material of the metal film 601 does not adhere to the portion where the mask 624 is in contact with or opposed to the mask 624, the opening 610 and the slit 613 can be formed on the side surface of the piece 621. By adjusting the distance between the mask 624 and the piece 621, a thickness gradient can be formed on the bottom surface portion 601C of the metal film 601 as shown in FIGS. 27B and 27C, for example.
  • the wiring pattern of the circuit board and the metal film can be electrically connected with high reliability, and the electronic device has high reliability against external impacts such as vibration and drop impact during handling. Useful for equipment.

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Abstract

A module component is provided with: a circuit board; a component mounted on the upper surface of the circuit board; a sealing section which is arranged on the upper surface of the circuit board and seals the component; a ground pattern arranged on the outer circumferential portion on the lower surface of the circuit board; and a metal film which covers the sealing section and the circuit board. The metal film has: a top surface section which covers the upper surface of the sealing section; a side surface section which extends from the top surface section and covers the side surfaces of the circuit board; and a bottom surface section which extends from the side surface sections and is arranged on the ground pattern. The bottom surface section has a smaller thickness at a further distance from the side section. In the module component, the wiring pattern on the circuit board can be electrically connected with the metal film with high reliability.

Description

モジュール部品とその製造方法と、およびそのモジュール部品を用いた電子機器MODULE COMPONENT, MANUFACTURING METHOD THEREOF, AND ELECTRONIC DEVICE USING THE MODULE COMPONENT
　本発明は、樹脂でモールド成型されたモジュール部品とこれを用いた電子機器に関する。 The present invention relates to a module part molded with resin and an electronic device using the module part.
　図２９は特許文献１に記載されている従来のモジュール部品１の断面図である。モジュール部品１は、回路基板５と、回路基板５上に配置された配線パターン４と、回路基板５の内部に配置されたグランド層６と、配線パターン４の上に実装された部品７と、部品７の周囲を封止する封止部３と、封止部３の外面に設けられた金属膜２とを備える。回路基板５の側面に露出したグランド層６は金属膜２と電気的に接続される。金属膜２はモジュール部品１の外部から受けるノイズ、および内部から発生するノイズの輻射を抑圧するシールド効果を有する。 FIG. 29 is a cross-sectional view of a conventional module component 1 described in Patent Document 1. The module component 1 includes a circuit board 5, a wiring pattern 4 disposed on the circuit board 5, a ground layer 6 disposed inside the circuit board 5, a component 7 mounted on the wiring pattern 4, The sealing part 3 which seals the circumference | surroundings of the component 7 and the metal film 2 provided in the outer surface of the sealing part 3 are provided. The ground layer 6 exposed on the side surface of the circuit board 5 is electrically connected to the metal film 2. The metal film 2 has a shielding effect for suppressing radiation received from the outside of the module component 1 and noise generated from the inside.
　図３０Ａから図３０Ｃはモジュール部品１の製造方法を示す断面図である。図３０Ａから図３０Ｃに示すモジュール部品１では、回路基板５の下面にグランドパターン８が配置されている。金属膜２とグランドパターン８とを電気的に接続することでシールド効果を高めることができる。 30A to 30C are cross-sectional views showing a method for manufacturing the module component 1. In the module component 1 shown in FIGS. 30A to 30C, the ground pattern 8 is arranged on the lower surface of the circuit board 5. The shielding effect can be enhanced by electrically connecting the metal film 2 and the ground pattern 8.
　図３０Ａに示すように、回路基板５上に部品７を実装して封止部３を設けることによりモジュール部品１Ｐを作製する。金属膜２が形成されていないモジュール部品１Ｐの下面の金属膜２を形成しない部分にフォトレジスト等のレジスト９を形成する。 30A, a module component 1P is manufactured by mounting the component 7 on the circuit board 5 and providing the sealing portion 3. A resist 9 such as a photoresist is formed on the lower surface of the module component 1P where the metal film 2 is not formed on the portion where the metal film 2 is not formed.
　次に、図３０Ｂに示すように、モジュール部品１Ｐの表面に金属膜２を形成してモジュール部品１Ｑを作製する。回路基板５の下面にレジスト９が配置されているので、下面のグランドパターン８以外には金属膜２が形成されない。 Next, as shown in FIG. 30B, a metal film 2 is formed on the surface of the module component 1P to produce the module component 1Q. Since the resist 9 is disposed on the lower surface of the circuit board 5, the metal film 2 is not formed except for the ground pattern 8 on the lower surface.
　次に図３０Ｃに示すように、レジスト９を覆う金属膜２と共にレジスト９をリフトオフ等と呼ばれるパターニング方法で除去してモジュール部品１を作製する。レジスト９と共に金属膜２を剥離すると、金属膜２の一部が破片１１Ａ、１１Ｂ、１１Ｃとなる。それらの破片のうちの一部である破片１１Ｃは配線パターン４の上に付着して短絡等の不具合を発生させる可能性がある。また破片１１Ａは金属膜２に繋がったバリとなる。 Next, as shown in FIG. 30C, the module 9 is manufactured by removing the resist 9 together with the metal film 2 covering the resist 9 by a patterning method called lift-off or the like. When the metal film 2 is peeled off together with the resist 9, a part of the metal film 2 becomes fragments 11A, 11B, and 11C. There is a possibility that the fragment 11C, which is a part of those fragments, adheres onto the wiring pattern 4 and causes problems such as a short circuit. Further, the fragments 11A become burrs connected to the metal film 2.
　バリとなった破片１１Ａは、モジュール部品１を実装する際等の振動や衝撃により欠落する恐れがある。またそのバリは経時変化で剥がれる可能性がある。金属膜２の一部が欠落した場合、金属膜２と封止部３との界面に空隙を生じ、金属膜２によるシールド効果が低下してしまう可能性があり、モジュール部品１の長期に渡る信頼性に影響を与える可能性がある。 The broken pieces 11A may be lost due to vibration or impact when the module component 1 is mounted. In addition, the burrs may be peeled off over time. If a part of the metal film 2 is missing, a gap may be generated at the interface between the metal film 2 and the sealing portion 3, which may reduce the shielding effect of the metal film 2, and the module component 1 can be used for a long time. Reliability may be affected.
　図３１は他の従来のモジュール部品５０１の断面図を示す。図３１において、図２９に示すモジュール部品１と同じ部分には同じ参照番号を付す。図３１に示すモジュール部品５０１は、図２９に示すモジュール部品１の金属膜２の代わりに板金製のカバー５０２を備える。カバー５０２は、逆Ｆ型アンテナとして動作すると共に、シールドケースとしても動作する。 FIG. 31 shows a sectional view of another conventional module component 501. In FIG. 31, the same reference numerals are assigned to the same portions as those of the module component 1 shown in FIG. A module component 501 shown in FIG. 31 includes a sheet metal cover 502 instead of the metal film 2 of the module component 1 shown in FIG. The cover 502 operates as an inverted F-type antenna and also operates as a shield case.
　図３１に示すモジュール部品５０１では、板金製カバー５０２はアンテナとシールドケースとの両方の機能を有しているが、外力等で変形しやすく、電子部品５０７の信頼性等に対する保護機能が限られており、大きい重量を有する。 In the module component 501 shown in FIG. 31, the sheet metal cover 502 has both functions of an antenna and a shield case, but is easily deformed by an external force or the like, and has a limited protection function for the reliability of the electronic component 507. And has a large weight.
特開２００６－２８６９１５号公報JP 2006-286915 A
　モジュール部品は、回路基板と、回路基板の上面に実装された部品と、回路基板の上面に設けられてかつ部品を封止する封止部と、回路基板の下面の外周部分に設けられたグランドパターンと、封止部と回路基板とを覆う金属膜とを備える。金属膜は、封止部の上面を覆う天面部と、天面部から延びてかつ回路基板の側面を覆う側面部と、側面部から延びて、グランドパターン上に設けられた底面部とを有する。底面部は側面部から離れるにしたがって小さくなる厚みを有する。 The module component includes a circuit board, a component mounted on the upper surface of the circuit board, a sealing portion provided on the upper surface of the circuit board and sealing the component, and a ground provided on an outer peripheral portion of the lower surface of the circuit board. A pattern and a metal film covering the sealing portion and the circuit board are provided. The metal film has a top surface portion covering the top surface of the sealing portion, a side surface portion extending from the top surface portion and covering the side surface of the circuit board, and a bottom surface portion extending from the side surface portion and provided on the ground pattern. The bottom surface portion has a thickness that decreases as the distance from the side surface portion increases.
　このモジュール部品では、回路基板の配線パターンと金属膜とを高信頼性で電気的に接続することができる。 In this module component, the wiring pattern of the circuit board and the metal film can be electrically connected with high reliability.
図１Ａは本発明の実施の形態１におけるモジュール部品の上面斜視図である。FIG. 1A is a top perspective view of a module component according to Embodiment 1 of the present invention. 図１Ｂは図１Ａに示すモジュール部品の線１Ｂ－１Ｂにおける断面図である。1B is a cross-sectional view of the module component shown in FIG. 1A taken along line 1B-1B. 図１Ｃは実施の形態１におけるモジュール部品の金属膜の断面図である。FIG. 1C is a cross-sectional view of the metal film of the module component in the first exemplary embodiment. 図２Ａは実施の形態１における他のモジュール部品の上面斜視図である。2A is a top perspective view of another module component according to Embodiment 1. FIG. 図２Ｂは図２Ａに示すモジュール部品の線２Ｂ－２Ｂにおける断面図である。2B is a cross-sectional view taken along line 2B-2B of the module component shown in FIG. 2A. 図３Ａは実施の形態１における電子機器の製造方法を示す断面図である。FIG. 3A is a cross-sectional view illustrating the method for manufacturing the electronic device in the first embodiment. 図３Ｂは実施の形態１における電子機器の製造方法を示す断面図である。FIG. 3B is a cross-sectional view illustrating the method for manufacturing the electronic device in the first embodiment. 図４Ａは実施の形態１における電子機器の断面図である。4A is a cross-sectional view of the electronic device in Embodiment 1. FIG. 図４Ｂは図４Ａに示す電子機器の拡大断面図である。4B is an enlarged cross-sectional view of the electronic device shown in FIG. 4A. 図５Ａは実施の形態１における他の電子機器の断面図である。5A is a cross-sectional view of another electronic device according to Embodiment 1. FIG. 図５Ｂは図５Ａに示す電子機器の拡大断面図である。FIG. 5B is an enlarged cross-sectional view of the electronic device shown in FIG. 5A. 図６Ａは実施の形態１におけるさらに他の電子機器の断面図である。6A is a cross-sectional view of still another electronic device according to Embodiment 1. FIG. 図６Ｂは図６Ａに示す電子機器の拡大断面図である。6B is an enlarged cross-sectional view of the electronic device shown in FIG. 6A. 図７Ａは実施の形態１におけるモジュール部品の下面斜視図である。7A is a bottom perspective view of the module component according to Embodiment 1. FIG. 図７Ｂは図７Ａに示すモジュール部品の部分断面図である。FIG. 7B is a partial cross-sectional view of the module component shown in FIG. 7A. 図８Ａは実施の形態１における他のモジュール部品の下面斜視図である。8A is a bottom perspective view of another module component according to Embodiment 1. FIG. 図８Ｂは図８Ａに示すモジュール部品の部分拡大図である。FIG. 8B is a partially enlarged view of the module component shown in FIG. 8A. 図９Ａは本発明の実施の形態２における電子機器の製造方法を示す断面図である。FIG. 9A is a cross-sectional view showing the method for manufacturing the electronic device in the second embodiment of the present invention. 図９Ｂは図９Ａに示す電子機器の断面図である。9B is a cross-sectional view of the electronic device illustrated in FIG. 9A. 図９Ｃは図９Ａに示す電子機器の断面図である。9C is a cross-sectional view of the electronic device illustrated in FIG. 9A. 図１０Ａは本発明の実施の形態３におけるモジュール部品の製造方法を示す断面図である。FIG. 10A is a cross-sectional view showing the module component manufacturing method according to Embodiment 3 of the present invention. 図１０Ｂは実施の形態３におけるモジュール部品の製造方法を示す断面図である。FIG. 10B is a cross-sectional view illustrating the module component manufacturing method according to Embodiment 3. 図１０Ｃは実施の形態３におけるモジュール部品の製造方法を示す断面図である。FIG. 10C is a cross-sectional view illustrating the module component manufacturing method according to Embodiment 3. 図１０Ｄは実施の形態３におけるモジュール部品の製造方法を示す断面図である。FIG. 10D is a cross-sectional view illustrating the module component manufacturing method according to Embodiment 3. 図１１Ａは実施の形態３におけるモジュール部品の製造方法を示す断面図である。FIG. 11A is a cross-sectional view illustrating the module component manufacturing method according to Embodiment 3. 図１１Ｂは実施の形態３におけるモジュール部品の製造方法を示す断面図である。FIG. 11B is a cross-sectional view illustrating the module component manufacturing method according to Embodiment 3. 図１１Ｃは実施の形態３におけるモジュール部品の製造方法を示す断面図である。FIG. 11C is a cross-sectional view illustrating the module component manufacturing method according to Embodiment 3. 図１１Ｄは実施の形態３におけるモジュール部品の製造方法を示す断面図である。FIG. 11D is a cross-sectional view illustrating the module component manufacturing method according to Embodiment 3. 図１２Ａは実施の形態３におけるモジュール部品の製造方法を示す断面図である。FIG. 12A is a cross-sectional view illustrating the module component manufacturing method according to Embodiment 3. 図１２Ｂは実施の形態３におけるモジュール部品の製造方法を示す断面図である。FIG. 12B is a cross-sectional view illustrating the module component manufacturing method according to Embodiment 3. 図１２Ｃは実施の形態３におけるモジュール部品の製造方法を示す断面図である。FIG. 12C is a cross-sectional view illustrating the module component manufacturing method according to Embodiment 3. 図１２Ｄは実施の形態３におけるモジュール部品の製造方法を示す断面図である。FIG. 12D is a cross-sectional view illustrating the module component manufacturing method according to Embodiment 3. 図１３Ａは本発明の実施の形態４におけるモジュール部品の製造方法を示す断面図である。FIG. 13A is a cross-sectional view showing the module component manufacturing method according to Embodiment 4 of the present invention. 図１３Ｂは図１３Ａに示すモジュール部品の製造方法を示す断面図である。FIG. 13B is a cross-sectional view showing a method of manufacturing the module component shown in FIG. 13A. 図１３Ｃは本発明の実施の形態４におけるモジュール部品の製造方法を示す断面図である。FIG. 13C is a cross-sectional view showing the module component manufacturing method according to Embodiment 4 of the present invention. 図１３Ｄは図１３Ａに示すモジュール部品の製造方法を示す断面図である。FIG. 13D is a cross-sectional view showing a method for manufacturing the module component shown in FIG. 13A. 図１４は各種金属の光の反射率を示す。FIG. 14 shows the light reflectance of various metals. 図１５Ａは本発明の実施の形態５におけるモジュール部品の上面斜視図である。FIG. 15A is a top perspective view of a module component according to Embodiment 5 of the present invention. 図１５Ｂは図１５Ａに示すモジュール部品の線１５Ｂ－１５Ｂにおける断面図である。15B is a cross-sectional view of the module component shown in FIG. 15A taken along line 15B-15B. 図１５Ｃは図１５Ａに示すモジュール部品の線１５Ｃ－１５Ｃにおける断面図である。FIG. 15C is a cross-sectional view of the module component shown in FIG. 15A taken along line 15C-15C. 図１５Ｄは実施の形態５におけるモジュール部品の金属膜の断面図である。FIG. 15D is a cross-sectional view of the metal film of the module component in the fifth embodiment. 図１６は実施の形態５におけるモジュール部品の断面図である。FIG. 16 is a cross-sectional view of the module component in the fifth embodiment. 図１７は実施の形態５におけるモジュール部品の上面図である。FIG. 17 is a top view of the module component in the fifth embodiment. 図１８は実施の形態５におけるモジュール部品のシールド効果を示す。FIG. 18 shows the shielding effect of the module component in the fifth embodiment. 図１９Ａは実施の形態５におけるモジュール部品の電磁波の放射分布を示す上面図である。FIG. 19A is a top view showing the radiation distribution of electromagnetic waves of the module component in the fifth embodiment. 図１９Ｂは図１９Ａに示すモジュール部品の電磁波の放射分布を示す側面図である。19B is a side view showing the radiation distribution of the electromagnetic waves of the module component shown in FIG. 19A. 図２０Ａは比較例のモジュール部品の電磁波の放射強度を示す上面図である。FIG. 20A is a top view showing the electromagnetic wave radiation intensity of the module component of the comparative example. 図２０Ｂは図２０Ａに示すモジュール部品の電磁波の放射強度を示す側面図である。20B is a side view showing the radiation intensity of the electromagnetic wave of the module component shown in FIG. 20A. 図２１Ａは実施の形態５における他のモジュール部品の上面斜視図である。FIG. 21A is a top perspective view of another module component according to Embodiment 5. 図２１Ｂは図２１Ａに示す線２１Ｂ－２１Ｂにおけるモジュール部品の断面図である。21B is a cross-sectional view of the module component taken along line 21B-21B shown in FIG. 21A. 図２２Ａは実施の形態５におけるさらに他のモジュール部品の上面斜視図である。FIG. 22A is a top perspective view of still another module component according to Embodiment 5. 図２２Ｂは図２２Ａに示す線２２Ｂ－２２Ｂにおけるモジュール部品の断面図である。22B is a cross-sectional view of the module component taken along line 22B-22B shown in FIG. 22A. 図２３は実施の形態５におけるモジュール部品の金属膜がアンテナとして放射する電磁波の周波数と金属膜の膜厚の関係を示す。FIG. 23 shows the relationship between the frequency of electromagnetic waves emitted from the metal film of the module component according to the fifth embodiment as an antenna and the thickness of the metal film. 図２４は実施の形態５におけるモジュール部品の金属膜がアンテナとして放する電磁波の周波数と、辺や対角線の長さの関係を示す。FIG. 24 shows the relationship between the frequency of electromagnetic waves emitted from the metal film of the module component according to the fifth embodiment as an antenna and the lengths of sides and diagonal lines. 図２５Ａは実施の形態５における電子機器の製造方法を示す断面図である。FIG. 25A is a cross-sectional view illustrating the method for manufacturing the electronic device in the fifth embodiment. 図２５Ｂは図２５Ａに示す電子機器の断面図である。25B is a cross-sectional view of the electronic device illustrated in FIG. 25A. 図２６Ａは本発明の実施の形態５におけるモジュール部品の製造方法を示す断面図である。FIG. 26A is a cross-sectional view showing a module component manufacturing method according to Embodiment 5 of the present invention. 図２６Ｂは実施の形態５におけるモジュール部品の製造方法を示す断面図である。FIG. 26B is a cross-sectional view illustrating the module component manufacturing method according to Embodiment 5. 図２６Ｃは実施の形態５におけるモジュール部品の製造方法を示す断面図である。FIG. 26C is a cross-sectional view illustrating the module component manufacturing method according to Embodiment 5. 図２６Ｄは実施の形態５におけるモジュール部品の製造方法を示す断面図である。FIG. 26D is a cross-sectional view illustrating the module component manufacturing method according to Embodiment 5. 図２７Ａは実施の形態５におけるモジュール部品の製造方法を示す断面図である。FIG. 27A is a cross-sectional view illustrating the module component manufacturing method according to Embodiment 5. 図２７Ｂは実施の形態５におけるモジュール部品の製造方法を示す断面図である。FIG. 27B is a cross-sectional view illustrating the module component manufacturing method according to Embodiment 5. 図２７Ｃは実施の形態５におけるモジュール部品の製造方法を示す断面図である。FIG. 27C is a cross-sectional view illustrating the module component manufacturing method according to Embodiment 5. 図２７Ｄは実施の形態５におけるモジュール部品の製造方法を示す断面図である。FIG. 27D is a cross-sectional view illustrating the module component manufacturing method according to Embodiment 5. 図２８Ａは実施の形態５におけるモジュール部品の他の製造方法を示す斜視図である。FIG. 28A is a perspective view showing another method for manufacturing the module component according to Embodiment 5. 図２８Ｂは実施の形態５におけるモジュール部品の他の製造方法を示す斜視図である。FIG. 28B is a perspective view showing another method for manufacturing the module component according to Embodiment 5. 図２８Ｃは実施の形態５におけるモジュール部品の他の製造方法を示す斜視図である。FIG. 28C is a perspective view showing another method for manufacturing the module component according to Embodiment 5. 図２９は従来のモジュール部品の断面図である。FIG. 29 is a cross-sectional view of a conventional module component. 図３０Ａは図２９に示すモジュール部品の製造方法を示す断面図である。30A is a cross-sectional view showing a method for manufacturing the module component shown in FIG. 図３０Ｂは図２９に示すモジュール部品の製造方法を示す断面図である。FIG. 30B is a cross-sectional view showing the method for manufacturing the module component shown in FIG. 図３０Ｃは図２９に示すモジュール部品の製造方法を示す断面図である。FIG. 30C is a cross-sectional view showing a method of manufacturing the module component shown in FIG. 図３１は他の従来のモジュール部品の断面図である。FIG. 31 is a cross-sectional view of another conventional module component.
　（実施の形態１）
　図１Ａは本発明の実施の形態１におけるモジュール部品１００の上面斜視図である。図１Ｂは図１Ａに示すモジュール部品１００の線１Ｂ－１Ｂにおける断面図である。 (Embodiment 1)
FIG. 1A is a top perspective view of module component 100 according to Embodiment 1 of the present invention. 1B is a cross-sectional view taken along line 1B-1B of module component 100 shown in FIG. 1A.
　モジュール部品１００は、回路基板１０４と、回路基板１０４の上面１０４Ａに実装された部品１０８と、回路基板１０４の上面１０４Ａに設けられた封止部１０９と、金属膜１０１とを備える。封止部１０９は部品１０８を封止する。金属膜１０１は回路基板１０４の側面１０４Ｃと封止部１０９とを覆う。 The module component 100 includes a circuit board 104, a component 108 mounted on the upper surface 104A of the circuit board 104, a sealing portion 109 provided on the upper surface 104A of the circuit board 104, and a metal film 101. The sealing unit 109 seals the component 108. The metal film 101 covers the side surface 104 </ b> C of the circuit board 104 and the sealing portion 109.
　回路基板１０４は、例えば、多層の樹脂基板であり、ガラス繊維をエポキシ樹脂で含浸させたガラスエポキシ樹脂やセラミック等の絶縁物よりなる絶縁層１０５を備える。絶縁層１０５は、回路基板１０４のそれぞれ上面１０４Ａと下面１０４Ｂと側面１０４Ｃとなる上面１０５Ａと下面１０５Ｂと側面１０５Ｃとを有する。回路基板１０４は、配線パターン１０６と、絶縁層１０５の上面１０５Ａに設けられたランド１１３と、絶縁層１０５の下面１０５Ｂに設けられたグランドパターン１１０と、絶縁層１０５の下面１０５Ｂに設けられたランド１１１と、絶縁層１０５内に設けられたビア導体１０７とをさらに備える。配線パターン１０６は絶縁層１０５の内部と上面１０５Ａと下面１０５Ｂの少なくとも１つに設けられている。ランド１１３には部品１０８が実装されている。ビア導体１０７は配線パターン１０６やグランドパターン１１０を接続する。 The circuit board 104 is, for example, a multilayer resin board, and includes an insulating layer 105 made of an insulating material such as glass epoxy resin or ceramic in which glass fibers are impregnated with epoxy resin. The insulating layer 105 includes an upper surface 105A, a lower surface 105B, and a side surface 105C that become the upper surface 104A, the lower surface 104B, and the side surface 104C of the circuit board 104, respectively. The circuit board 104 includes a wiring pattern 106, a land 113 provided on the upper surface 105A of the insulating layer 105, a ground pattern 110 provided on the lower surface 105B of the insulating layer 105, and a land provided on the lower surface 105B of the insulating layer 105. 111 and a via conductor 107 provided in the insulating layer 105. The wiring pattern 106 is provided in the insulating layer 105 and at least one of the upper surface 105A and the lower surface 105B. A component 108 is mounted on the land 113. The via conductor 107 connects the wiring pattern 106 and the ground pattern 110.
　配線パターン１０６の端１０６Ｃは回路基板１０４の側面１０４Ｃすなわち絶縁層１０５の側面１０５Ｃに露出する。金属膜１０１は、露出した配線パターン１０６の端１０６Ｃと電気的に接続される。グランドパターン１１０は回路基板１０４の下面１０４Ｂすなわち絶縁層１０５の下面１０５Ｂの外周部に設けられている。金属膜１０１は、封止部１０９の上面１０９Ａを覆う天面部１０１Ａと、天面部１０１Ａから回路基板１０４の側面１０４Ｃまで延びる側面部１０１Ｂとを有する。金属膜１０１は、側面部１０１Ｂから延びて、かつグランドパターン１１０の下面１１０Ｂ上に位置する底面部１１２をさらに有する。底面部１１２は、絶縁層１０５（回路基板１０４）の外周から内周に向かって小さくなる厚みを有して厚み勾配を有する。 The end 106C of the wiring pattern 106 is exposed on the side surface 104C of the circuit board 104, that is, the side surface 105C of the insulating layer 105. The metal film 101 is electrically connected to the exposed end 106 </ b> C of the wiring pattern 106. The ground pattern 110 is provided on the outer periphery of the lower surface 104B of the circuit board 104, that is, the lower surface 105B of the insulating layer 105. The metal film 101 has a top surface portion 101A that covers the top surface 109A of the sealing portion 109, and a side surface portion 101B that extends from the top surface portion 101A to the side surface 104C of the circuit board 104. The metal film 101 further includes a bottom surface portion 112 that extends from the side surface portion 101B and is located on the lower surface 110B of the ground pattern 110. The bottom surface portion 112 has a thickness gradient with a thickness that decreases from the outer periphery to the inner periphery of the insulating layer 105 (circuit board 104).
　金属膜１０１の側面部１０１Ｂは、封止部１０９の側面１０９Ｃと回路基板１０４の側面１０４Ｃとを覆う、すなわち、封止部１０９と回路基板１０４との境界面１０２を超えて延びる。これにより、グランドパターン１１０と金属膜１０１との密着性を高め、バリ等の金属膜１０１の剥がれ始める部分が発生しないので、長期に渡る電気的な接続信頼性が向上する。 The side surface portion 101B of the metal film 101 covers the side surface 109C of the sealing portion 109 and the side surface 104C of the circuit board 104, that is, extends beyond the boundary surface 102 between the sealing portion 109 and the circuit substrate 104. As a result, the adhesion between the ground pattern 110 and the metal film 101 is enhanced, and no part of the metal film 101 such as a burr starts to be peeled off, thereby improving the electrical connection reliability over a long period of time.
　回路基板１０４が絶縁層１０５に例えばガラスエポキシ樹脂を用いた多層基板である場合、ランド１１３、配線パターン１０６、グランドパターン１１０、ランド１１１を銅箔で形成することでコストダウンが可能である。 When the circuit board 104 is a multilayer board using, for example, glass epoxy resin for the insulating layer 105, the land 113, the wiring pattern 106, the ground pattern 110, and the land 111 can be formed of copper foil to reduce the cost.
　回路基板１０４が絶縁層１０５にセラミック基板を用いた場合、ランド１１３、配線パターン１０６、グランドパターン１１０、ランド１１１を銀、銀パラジウム、あるいは銅で形成してもよい。配線パターンは導電ペーストの印刷、焼成で形成しても良く、あるいは銅箔等の導体箔を貼り付けて形成しても良い。 When the circuit board 104 uses a ceramic substrate for the insulating layer 105, the land 113, the wiring pattern 106, the ground pattern 110, and the land 111 may be formed of silver, silver palladium, or copper. The wiring pattern may be formed by printing and baking a conductive paste, or may be formed by attaching a conductive foil such as a copper foil.
　部品１０８は、例えば、半導体集積回路（ＩＣ）等の能動部品やコイル、コンデンサ等の受動部品であり、部品１０８としてチップ部品を用いることで実装密度を高められる。 The component 108 is, for example, an active component such as a semiconductor integrated circuit (IC) or a passive component such as a coil or a capacitor. By using a chip component as the component 108, the mounting density can be increased.
　封止部１０９は、例えば、熱硬化性樹脂にて構成されており、真空加圧しながら加熱すると、樹脂フィラーが回路基板１０４と部品１０８との隙間に入ることで、ボイドを発生させることなく、部品１０８を封止することができる。封止部１０９の下面１０９Ｂは回路基板１０４の上面１０４Ａに当接する。 The sealing portion 109 is made of, for example, a thermosetting resin, and when heated while being vacuum-pressed, the resin filler enters the gap between the circuit board 104 and the component 108 without generating a void. The component 108 can be sealed. The lower surface 109B of the sealing portion 109 abuts on the upper surface 104A of the circuit board 104.
　金属膜１０１は、スパッタまたはめっきで形成でき、あるいは市販の導電性ペーストを印刷して硬化させて形成してもよい。すなわち、金属膜１０１は、スパッタ膜、めっき膜、導電性ペーストのいずれか、あるいはこれらの組み合わせよりなる。 The metal film 101 can be formed by sputtering or plating, or may be formed by printing and curing a commercially available conductive paste. That is, the metal film 101 is made of any one of a sputtered film, a plated film, a conductive paste, or a combination thereof.
　また、金属膜１０１は、二種類以上の元素から構成しても良い。例えば封止部１０９の表面に銅からなる下地層を形成し、この下地層上に、更に亜鉛やニッケル、錫等よりなる上層を設けることで、下地層の銅の酸化は錆びの発生を防止することができる。銅よりなる下地層上に銀よりなる上層を設けることにより金属膜１０１のシート抵抗を下げることができ、シールド効果を有する周波数域を高周波側に広げることができる。 Further, the metal film 101 may be composed of two or more elements. For example, by forming a base layer made of copper on the surface of the sealing portion 109 and further providing an upper layer made of zinc, nickel, tin or the like on this base layer, the oxidation of copper in the base layer prevents the occurrence of rust. can do. By providing the upper layer made of silver on the base layer made of copper, the sheet resistance of the metal film 101 can be lowered, and the frequency region having a shielding effect can be widened to the high frequency side.
　なお、金属膜１０１に使用する２種類の元素は、合金として金属膜１０１を形成してもよい。銅と亜鉛、あるいは銅とニッケル等の部材を予め合金化し、これをスパッタ用ターゲットとしても良い。あるいは銅のターゲットと、亜鉛のターゲットを別々に用意し、これを同時にスパッタすることで、合金化しても良い。こうすることで、工数を低減でき、コストダウンできる。 Note that the two kinds of elements used in the metal film 101 may form the metal film 101 as an alloy. Members such as copper and zinc or copper and nickel may be alloyed in advance and used as a sputtering target. Alternatively, a copper target and a zinc target may be prepared separately and alloyed by sputtering them simultaneously. By doing so, man-hours can be reduced and costs can be reduced.
　図１Ｃは金属膜１０１の他の例の断面図である。金属膜１０１は、封止部１０９の表面に設けられたチタンもしくはクロムよりなる下地層１１０１と、下地層１１０１上に形成された銅層２１０１と、銅層２１０１の上に設けられた亜鉛やニッケル、錫もしくは亜鉛合金やニッケル合金、錫合金よりなる上層３１０１とを有する。これにより、封止部１０９と金属膜１０１との密着性を高めることができる。 FIG. 1C is a cross-sectional view of another example of the metal film 101. The metal film 101 includes a base layer 1101 made of titanium or chromium provided on the surface of the sealing portion 109, a copper layer 2101 formed on the base layer 1101, and zinc or nickel provided on the copper layer 2101. And an upper layer 3101 made of tin, a zinc alloy, a nickel alloy, or a tin alloy. Thereby, the adhesiveness of the sealing part 109 and the metal film 101 can be improved.
　なお、上記の下地層を形成する前に、封止部１０９の表面にアルゴン（Ａｒ）で逆スパッタリングを施して封止部１０９の表面を洗浄することで更に金属膜１０１との密着性を向上させることができる。 In addition, before forming the base layer, the surface of the sealing portion 109 is reverse-sputtered with argon (Ar) to clean the surface of the sealing portion 109, thereby further improving the adhesion with the metal film 101. Can be made.
　図１Ｂに示すように、グランドパターン１１０と金属膜１０１の底面部１１２とは面で接触しているので、接触抵抗を小さくすることができる。底面部１１２は回路基板１０４（絶縁層１０５）の外周から内周に向かって小さくなる厚みを有するので、応力が発生しにくく、外力等でも剥離しない。 As shown in FIG. 1B, since the ground pattern 110 and the bottom surface portion 112 of the metal film 101 are in contact with each other, the contact resistance can be reduced. Since the bottom surface portion 112 has a thickness that decreases from the outer periphery to the inner periphery of the circuit board 104 (insulating layer 105), it is difficult for stress to be generated and does not peel even by an external force or the like.
　図２Ａと図２Ｂはそれぞれ実施の形態１における他のモジュール部品１１００の上面斜視図と断面図である。図２Ａと図２Ｂにおいて、図１Ａと図１Ｂに示すモジュール部品１００と同じ部分には同じ参照番号を付す。図２Ａと図２Ｂに示すモジュール部品１１００では、封止部１０９の上面１０９Ａと側面１０９Ｃとが繋がる境界のエッジには面取り部１１４が設けられている。金属膜１０１は面取り部１１４と含めて封止部１０９の表面を覆う。面取り部１１４は、略直角の封止部１０９のエッジに設けられた所定の角度の勾配を有する平面よりなるＣ面カットである。なお勾配の角度は４５度であるが、これに限定されない。また面取り部１１４は複数の角度の勾配を有していてもよい。また、面取り部１１４は平面ではなく所定の曲率半径を有する曲面を有するＲ面加工であってもよい、曲率半径は例えば１ｍｍ以上半径５ｍｍ以下であるが、これに限定されない。また、面取り部１１４は階段形状を有していてよい。また、面取り部１１４は、Ｃ面カット、Ｒ面加工等の複数の組み合わせであっても良い。面取り部１１４により、金属膜１０１の形成時の厚みバラツキを低減し、金属膜１０１の内部応力の発生を抑制することができる。 2A and 2B are a top perspective view and a cross-sectional view of another module component 1100 according to Embodiment 1, respectively. 2A and 2B, the same reference numerals are assigned to the same parts as those of the module component 100 shown in FIGS. 1A and 1B. In the module component 1100 shown in FIGS. 2A and 2B, a chamfered portion 114 is provided at the edge of the boundary where the upper surface 109A and the side surface 109C of the sealing portion 109 are connected. The metal film 101 covers the surface of the sealing portion 109 including the chamfered portion 114. The chamfered portion 114 is a C-plane cut made of a plane having a predetermined angle gradient provided at the edge of the substantially perpendicular sealing portion 109. The angle of the gradient is 45 degrees, but is not limited to this. Further, the chamfered portion 114 may have a plurality of angular gradients. Further, the chamfered portion 114 may be R-surface processing having a curved surface having a predetermined curvature radius instead of a flat surface. The curvature radius is, for example, not less than 1 mm and not more than 5 mm, but is not limited thereto. Further, the chamfered portion 114 may have a staircase shape. Further, the chamfered portion 114 may be a plurality of combinations such as C surface cutting and R surface processing. The chamfered portion 114 can reduce the thickness variation when the metal film 101 is formed, and suppress the generation of internal stress of the metal film 101.
　図３Ａと図３Ｂは実施の形態１における電子機器１１９の製造方法を示す断面図である。電子機器１１９は、モジュール部品１００と、半田１１７と、回路基板１１８と、フィレット１２０とを備える。回路基板１１８は、回路基板１０４の絶縁層１０５と配線パターン１０６とビア導体１０７と同様の絶縁層１０５Ｅと配線パターン１０６Ｂとビア導体１０７Ｂとを備える。 3A and 3B are cross-sectional views illustrating a method for manufacturing the electronic device 119 in the first embodiment. The electronic device 119 includes a module component 100, solder 117, a circuit board 118, and a fillet 120. The circuit board 118 includes an insulation layer 105E, a wiring pattern 106B, and a via conductor 107B similar to the insulating layer 105, the wiring pattern 106, and the via conductor 107 of the circuit board 104.
　図３Ａに示すように、モジュール部品１００を回路基板１１８の上面１１８Ａに実装する。このとき、回路基板１１８の上面１１８Ａに設けられた配線パターン１０６Ｂとモジュール部品１００の回路基板１０４の下面１０４Ｂに設けられたランド１１１は半田１１７で接続される。図３Ｂに示すように、半田１１７はモジュール部品１００の金属膜１０１の側面部１０１Ｂに沿って天面部１０１Ａに向かって延びるフィレット１２０を有する。フィレット１２０により、回路基板１１８とモジュール部品１００との固定強度（あるいは剥離強度）を高められる。なおフィレット１２０は、用途に応じて形成すれば良い。 3A, the module component 100 is mounted on the upper surface 118A of the circuit board 118. At this time, the wiring pattern 106B provided on the upper surface 118A of the circuit board 118 and the land 111 provided on the lower surface 104B of the circuit board 104 of the module component 100 are connected by the solder 117. As shown in FIG. 3B, the solder 117 has a fillet 120 extending toward the top surface portion 101 </ b> A along the side surface portion 101 </ b> B of the metal film 101 of the module component 100. By the fillet 120, the fixing strength (or peel strength) between the circuit board 118 and the module component 100 can be increased. The fillet 120 may be formed according to the application.
　図４Ａと図４Ｂはそれぞれ電子機器１１９のモジュール部品１００の電界輻射を示す断面図と拡大断面図である。 4A and 4B are a sectional view and an enlarged sectional view showing electric field radiation of the module component 100 of the electronic device 119, respectively.
　モジュール部品１００（１１００）の回路基板１０４に実装された部品１０８で構成された回路から、特定の周波数帯においてノイズが輻射される。金属膜１０１のように導体でモジュール部品１００（１１００）を覆うことでモジュール部品１００から輻射されるノイズを低減するシールド効果が得られる。 Noise is radiated in a specific frequency band from the circuit configured by the component 108 mounted on the circuit board 104 of the module component 100 (1100). Covering the module component 100 (1100) with a conductor like the metal film 101 provides a shielding effect that reduces noise radiated from the module component 100.
　実施の形態１では抑えるノイズの周波数帯域は、例えば無線ＬＡＮの場合、１０ＧＨｚ前後（例えば、９．８ＧＨｚ～１０．２ＧＨｚ）である。１０ＧＨｚの周波数を、１／４分周して２．４ＧＨｚを、１／２分周して５．０ＧＨｚの搬送波等を作成する。 In the first embodiment, for example, in the case of a wireless LAN, the frequency band of noise to be suppressed is around 10 GHz (for example, 9.8 GHz to 10.2 GHz). The frequency of 10 GHz is divided by 1/4 to 2.4 GHz, and the frequency is divided by 1/2 to create a 5.0 GHz carrier wave or the like.
　図４Ｂに示すように、モジュール部品１００のエッジに電界１１６が集中した場合、電界輻射１１５Ａ、１１５Ｂはそのエッジにピーク１０３を有するので、金属膜１０１ではシールド効果が不足する可能性がある。 As shown in FIG. 4B, when the electric field 116 is concentrated on the edge of the module component 100, the electric field radiation 115A, 115B has a peak 103 at the edge, so that the shielding effect may be insufficient in the metal film 101.
　実施の形態１では金属膜１０１の厚みは１μｍ以上２００μｍ以下、望ましくは１０μｍ以上１００μｍ以下である。厚みが２００μｍ以上とした場合、金属膜１０１に内部応力等が発生しやすい場合がある。また、厚みが１μｍ未満の場合、シールド効果が低い場合がある。 In Embodiment 1, the thickness of the metal film 101 is 1 μm or more and 200 μm or less, and preferably 10 μm or more and 100 μm or less. When the thickness is 200 μm or more, internal stress or the like may easily occur in the metal film 101. When the thickness is less than 1 μm, the shielding effect may be low.
　図５Ａと図５Ｂはそれぞれ実施の形態１により他の電子機器１１１９の断面図と拡大断面図である。図５Ａと図５Ｂにおいて、図４Ａと図４Ｂに示す電子機器１１９と同じ部分には同じ参照番号を付す。図５Ａと図５Ｂに示す電子機器１１１９は、図４Ａと図４Ｂに示す電子機器１１９のモジュール部品１００の代わりにモジュール部品３１００を備える。図５Ａと図５Ｂに示すモジュール部品３１００の面取り部１１４は階段形状を有する。 FIGS. 5A and 5B are a cross-sectional view and an enlarged cross-sectional view of another electronic device 1119 according to Embodiment 1, respectively. 5A and 5B, the same reference numerals are given to the same portions as those of the electronic device 119 shown in FIGS. 4A and 4B. An electronic device 1119 illustrated in FIGS. 5A and 5B includes a module component 3100 instead of the module component 100 of the electronic device 119 illustrated in FIGS. 4A and 4B. The chamfered portion 114 of the module component 3100 shown in FIGS. 5A and 5B has a step shape.
　階段形状を有する面取り部１１４は複数のエッジ１１４Ａを有する。複数のエッジ１１４Ａにより、図４Ａと図４Ｂに示す電子機器１１９に比べて電界１１６が分散するので、電界輻射１１５Ａ、１１５Ｂのピーク１０３を小さくすることができる。 The chamfered portion 114 having a staircase shape has a plurality of edges 114A. The plurality of edges 114A disperse the electric field 116 as compared with the electronic device 119 shown in FIGS. 4A and 4B, so that the peak 103 of the electric field radiation 115A and 115B can be reduced.
　図６Ａと図６Ｂはそれぞれ実施の形態１によるさらに他の電子機器２１１９の断面図と拡大断面図である。図６Ａと図６Ｂにおいて、図５Ａと図５Ｂに示す電子機器１１１９と同じ部分には同じ参照番号を付す。図６Ａと図６Ｂに示す電子機器２１１９では、モジュール部品１１００の面取り部１１４は図２Ａと図２Ｂに示す平面よりなるＣ面カットを有する。面取り部１１４は複数のエッジ１１４Ａを有する。複数のエッジ１１４Ａにより、図４Ａと図４Ｂに示す電子機器１１９に比べて電界１１６が分散するので、電界輻射１１５Ａ、１１５Ｂのピーク１０３を小さくすることができる。 6A and 6B are a cross-sectional view and an enlarged cross-sectional view of still another electronic device 2119 according to Embodiment 1, respectively. 6A and 6B, the same reference numerals are assigned to the same portions as those of the electronic device 1119 shown in FIGS. 5A and 5B. In the electronic device 2119 shown in FIGS. 6A and 6B, the chamfered portion 114 of the module component 1100 has a C-plane cut formed by the plane shown in FIGS. 2A and 2B. The chamfered portion 114 has a plurality of edges 114A. The plurality of edges 114A disperse the electric field 116 as compared with the electronic device 119 shown in FIGS. 4A and 4B, so that the peak 103 of the electric field radiation 115A and 115B can be reduced.
　なお、電界１１６を更に分散させるため、面取り部１１４が所定の曲率半径を有する曲面を有するようにＲ面加工を施すことでエッジを除去してもよい。 In addition, in order to further disperse the electric field 116, the edge may be removed by performing R surface processing so that the chamfered portion 114 has a curved surface having a predetermined radius of curvature.
　以上のように、モジュール部品１１００から外部機器に対してノイズによる干渉を抑制することが可能となる。 As described above, it is possible to suppress interference due to noise from the module component 1100 to the external device.
　図７Ａはモジュール部品１００の下面斜視図である。モジュール部品１００下面すなわち回路基板１０４（絶縁層１０５）の下面１０４Ｂ（下面１０５Ｂ）は外周部を構成する４つの辺を有する矩形状を有する。グランドパターン１１０は絶縁層１０５の下面１０５Ｂの外周部の４つの辺のうち少なくとも２つの辺に沿って設けられている。金属膜１０１の側面部１０１Ｂに繋がる底面部１１２はグランドパターン１１０の下面１１０Ｂに位置する。 FIG. 7A is a bottom perspective view of the module component 100. The lower surface of the module component 100, that is, the lower surface 104B (lower surface 105B) of the circuit board 104 (insulating layer 105) has a rectangular shape having four sides constituting the outer peripheral portion. The ground pattern 110 is provided along at least two sides of the four sides of the outer peripheral portion of the lower surface 105B of the insulating layer 105. A bottom surface portion 112 connected to the side surface portion 101 </ b> B of the metal film 101 is located on the lower surface 110 </ b> B of the ground pattern 110.
　図７Ｂは図７Ａに示すモジュール部品１００の部分断面図である。底面部１１２の厚みは側面部１０１Ｂから離れるにつれて小さくなる、すなわち絶縁層１０５の下面１０５Ｂの外周部から中央に向かうにつれて連続的に単調に小さくなっており、端１２２Ａで厚みはゼロになっている。端１２２Ａは直線形状を有する。この構造により底面部１１２における内部応力の発生を防止し、機械的な外力を受けても底面部１１２は剥がれにくく、バリが発生しにくい。この結果、モジュール部品１００では、取り扱い時の振動や衝撃等によっても、金属膜１０１の欠損が発生しない。 FIG. 7B is a partial cross-sectional view of the module component 100 shown in FIG. 7A. The thickness of the bottom surface portion 112 decreases with increasing distance from the side surface portion 101B, that is, continuously decreases monotonically from the outer peripheral portion of the lower surface 105B of the insulating layer 105 toward the center, and the thickness becomes zero at the end 122A. . The end 122A has a linear shape. With this structure, generation of internal stress in the bottom surface portion 112 is prevented, and even when a mechanical external force is applied, the bottom surface portion 112 is hardly peeled off and burrs are not easily generated. As a result, in the module component 100, the metal film 101 is not damaged due to vibration or impact during handling.
　このように、回路基板１０４の下面１０４Ｂは４つの辺を有する矩形状を実質的に有する。グランドパターン１１０は回路基板１０４の下面１０４Ｂの４つの辺のうちの少なくとも２つの辺に沿って設けられている。金属膜１０１の底面部１１２は回路基板１０４の下面１０４Ｂの４つの辺のうちのそれら少なくとも２つの辺に設けられている。金属膜１０１の底面部１１２はそれら２つの辺を超えてグランドパターン１１０に設けられている。 Thus, the lower surface 104B of the circuit board 104 substantially has a rectangular shape having four sides. The ground pattern 110 is provided along at least two of the four sides of the lower surface 104 </ b> B of the circuit board 104. The bottom surface portion 112 of the metal film 101 is provided on at least two of the four sides of the lower surface 104B of the circuit board 104. The bottom surface portion 112 of the metal film 101 is provided on the ground pattern 110 beyond these two sides.
　図８Ａは実施の形態１におけるさらに他のモジュール部品２１００の下面斜視図である。図８Ｂは図８Ａに示すモジュール部品２１００の部分断面図である。図８Ａと図８Ｂにおいて、図７Ａと図７Ｂに示すモジュール部品１００と同じ部分には同じ参照番号を付す。図８Ａと図８Ｂに示すモジュール部品２１００では、底面部１１２の厚みは側面部１０１Ｂから離れるにつれて小さくなる、すなわち絶縁層１０５の下面１０５Ｂの外周部から中央に向かうにつれて連続的に単調に小さくなっており、端１２２で厚みはゼロになっている。端１２２は直線形状ではなくジグザグの波形状等の不定形状を有する。端１２２が不定形状を有することで、さらに内部応力の発生を抑制できる。端１２２は、例えば木目形状あるいはダマスカス鋼の模様の形状を有していてもよい。 FIG. 8A is a bottom perspective view of still another module component 2100 in the first exemplary embodiment. FIG. 8B is a partial cross-sectional view of the module component 2100 shown in FIG. 8A. 8A and 8B, the same reference numerals are assigned to the same parts as those of the module component 100 shown in FIGS. 7A and 7B. In the module component 2100 shown in FIGS. 8A and 8B, the thickness of the bottom surface portion 112 decreases as the distance from the side surface portion 101B decreases, that is, decreases continuously and monotonously from the outer peripheral portion of the lower surface 105B of the insulating layer 105 toward the center. The thickness at the end 122 is zero. The end 122 has an indefinite shape such as a zigzag wave shape instead of a linear shape. Since the end 122 has an indefinite shape, generation of internal stress can be further suppressed. The end 122 may have a grain shape or a Damascus steel pattern, for example.
　底面部１１２の端１２２を不定形状とすることで、底面部１１２の端１２２を、図７Ａと図７Ｂに示す直線形状の端１２２Ａより長くすることができ、底面部１１２を絶縁層１０５と接合させる距離を長くすることで金属膜１０１をより強固に絶縁層１０５に接合させることができ金属膜１０１を剥がれにくくすることができる。 By making the end 122 of the bottom surface portion 112 indefinite, the end 122 of the bottom surface portion 112 can be made longer than the linear end 122A shown in FIGS. 7A and 7B, and the bottom surface portion 112 is bonded to the insulating layer 105. By increasing the distance, the metal film 101 can be more strongly bonded to the insulating layer 105, and the metal film 101 can be made difficult to peel off.
　（実施の形態２）
　図９Ａは本発明の実施の形態２における電子機器３１１９の製造方法を示す断面図である。図９Ｂは電子機器３１１９の断面図である。図９Ａと図９Ｂにおいて、図３Ａと図３Ｂに示す電子機器１１９と同じ部分には同じ参照番号を付す。 (Embodiment 2)
FIG. 9A is a cross-sectional view illustrating a method for manufacturing electronic device 3119 according to Embodiment 2 of the present invention. FIG. 9B is a cross-sectional view of the electronic device 3119. 9A and 9B, the same reference numerals are assigned to the same portions as those of the electronic device 119 illustrated in FIGS. 3A and 3B.
　電子機器３１１９の回路基板１１８の上面１１８Ａに半田１１７が設けられており、半田１１７上にモジュール部品１００が実装される。 The solder 117 is provided on the upper surface 118A of the circuit board 118 of the electronic device 3119, and the module component 100 is mounted on the solder 117.
　図９Ｂに示すように、回路基板１１８の上面１１８Ａに設けられたグランドパターン１２１Ａと、モジュール部品１００の金属膜１０１に接続されたグランドパターン１１０は半田１１７を介して電気的に接続されている。このように、金属膜１０１の密着性が高いモジュール部品１００を電子機器１１９に搭載することで、電気的接続信頼性の高い電子機器３１１９を提供することが可能となる。 As shown in FIG. 9B, the ground pattern 121 A provided on the upper surface 118 A of the circuit board 118 and the ground pattern 110 connected to the metal film 101 of the module component 100 are electrically connected via solder 117. As described above, by mounting the module component 100 with high adhesion of the metal film 101 on the electronic device 119, it is possible to provide the electronic device 3119 with high electrical connection reliability.
　また、回路基板１１８の上面１１８Ａに設けられたグランドパターン１２１Ａと、回路基板１１８の下面１１８Ｂに設けられたグランドパターン１２１Ｂはビア導体１０７Ｂで接続されている。このようにビア導体１０７Ｂを介してモジュール部品１００のグランドパターン１１０とグランドパターン１２１Ｂとが電気的に接続されている。ビア導体１０７Ｂは導電性樹脂またはめっきにより形成される。またビア導体１０７Ｂは回路基板１１８の内部の層間を接続する。 The ground pattern 121A provided on the upper surface 118A of the circuit board 118 and the ground pattern 121B provided on the lower surface 118B of the circuit board 118 are connected by the via conductor 107B. Thus, the ground pattern 110 and the ground pattern 121B of the module component 100 are electrically connected via the via conductor 107B. The via conductor 107B is formed of a conductive resin or plating. The via conductor 107B connects the internal layers of the circuit board 118.
　図９Ｂに示すように、ビア導体１０７Ｂは、複数のビア導体、例えば複数のビア導体１０７Ｂの組み合わせで形成されていてもよい。１つのビア導体１０７Ａで回路基板１１８の上面１１８Ａに形成されたグランドパターン１２１Ａと、下面１１８Ｂに形成されたグランドパターン１２１Ｂとを接続してもよい。回路基板１１８を貫通する１つのみの貫通ビア導体１０７Ａがグランドパターン１２１Ａ、１２１Ｂを接続してもよい。より少ない数のビア導体１０７Ａでグランドパターン１２１Ａ、１２１Ｂを接続することにより歩留まりや抵抗値を低くすることができる。 As shown in FIG. 9B, the via conductor 107B may be formed of a combination of a plurality of via conductors, for example, a plurality of via conductors 107B. The ground pattern 121A formed on the upper surface 118A of the circuit board 118 and the ground pattern 121B formed on the lower surface 118B may be connected by one via conductor 107A. Only one through via conductor 107A that penetrates the circuit board 118 may connect the ground patterns 121A and 121B. By connecting the ground patterns 121A and 121B with a smaller number of via conductors 107A, the yield and the resistance value can be lowered.
　回路基板１１８に内蔵されたビア導体１０７Ａをグランドパターン１２１Ａ、１２１Ｂに接続することで、グランドパターン１２１Ａ，１２１Ｂのグランド電位を安定させることができる。これにより、電子機器１１９のシールド効果を安定させることが可能となる。その結果、図９Ｂに示すように、ビア導体１０７Ａを用いることで、回路基板１１８の側面からの方向からのノイズ１０３Ｃを小さくできる。 The ground potentials of the ground patterns 121A and 121B can be stabilized by connecting the via conductor 107A built in the circuit board 118 to the ground patterns 121A and 121B. Thereby, the shielding effect of the electronic device 119 can be stabilized. As a result, as shown in FIG. 9B, by using the via conductor 107A, the noise 103C from the direction from the side surface of the circuit board 118 can be reduced.
　グランドパターン１２１Ｂは下面のほとんどを覆う大面積のパターンに限定される必要は無く、一般的なグランドパターンでよい。 The ground pattern 121B is not necessarily limited to a large area pattern covering most of the lower surface, and may be a general ground pattern.
　図９Ｃは比較例の電子機器４１１９の断面図である。電子機器４１１９では、回路基板１１８の上面１１８Ａに設けられたグランドパターン１２１Ａと、下面１１８Ｂに設けられたグランドパターン１２１Ｂとを接続する１つのビア導体を有していない。この場合、回路基板１１８の側面からのノイズ１０３Ｅや、回路基板１１８の下面１１８Ｂから放射されるノイズ１０３Ｆがあまり低減されない可能性がある。 FIG. 9C is a cross-sectional view of the electronic device 4119 of the comparative example. The electronic device 4119 does not have one via conductor that connects the ground pattern 121A provided on the upper surface 118A of the circuit board 118 and the ground pattern 121B provided on the lower surface 118B. In this case, the noise 103E from the side surface of the circuit board 118 and the noise 103F radiated from the lower surface 118B of the circuit board 118 may not be reduced so much.
　図９Ｃに示す比較例の電子機器４１１９では、回路基板１１８の上面１１８Ａにモジュール部品１００が実装された場合、グランドパターン１２１Ａのグランド電位が安定せず、回路基板１１８の側面から電界輻射１１５Ａ、１１５Ｂが現れ、シールド効果が低下してしまう可能性がある。したがって、図９Ｂに示すグランドパターン１２１Ａ、１２１Ｂを接続する１つのビア導体１０７Ａを設けることが望ましい。 In the electronic device 4119 of the comparative example shown in FIG. 9C, when the module component 100 is mounted on the upper surface 118A of the circuit board 118, the ground potential of the ground pattern 121A is not stable, and the electric field radiation 115A and 115B from the side surface of the circuit board 118. May appear and the shielding effect may be reduced. Therefore, it is desirable to provide one via conductor 107A that connects the ground patterns 121A and 121B shown in FIG. 9B.
　（実施の形態３）
　図１０Ａから図１０Ｄは本発明の実施の形態３におけるモジュール部品１００の製造方法を示す断面図である。 (Embodiment 3)
10A to 10D are cross-sectional views illustrating a method for manufacturing the module component 100 according to Embodiment 3 of the present invention.
　回路基板シート２０４は部品１０８を実装するためのランド１１３（図３Ａに示す）と配線パターンを有する。まず、図１０Ａに示すように、回路基板シート２０４上のランド１１３に部品１０８を実装する。次に、図１０Ｂに示すように、半田１１７（図３Ａに示す）で部品１０８をランド１１３に電気的に接続する。次に、図１０Ｃに示すように、部品１０８の周囲を封止樹脂２０９により封止した後、図１０Ｄに示すように、回路基板シート２０４と封止樹脂２０９とを個片１２３に分割する。回路基板シート２０４と封止樹脂２０９は分割されてそれぞれ回路基板１０４と封止部１０９となる。 The circuit board sheet 204 has a land 113 (shown in FIG. 3A) for mounting the component 108 and a wiring pattern. First, as shown in FIG. 10A, the component 108 is mounted on the land 113 on the circuit board sheet 204. Next, as shown in FIG. 10B, the component 108 is electrically connected to the land 113 with solder 117 (shown in FIG. 3A). Next, as shown in FIG. 10C, the periphery of the component 108 is sealed with a sealing resin 209, and then the circuit board sheet 204 and the sealing resin 209 are divided into pieces 123 as shown in FIG. 10D. The circuit board sheet 204 and the sealing resin 209 are divided into a circuit board 104 and a sealing portion 109, respectively.
　図１１Ａから図１１Ｄは実施の形態３におけるモジュール部品１００の製造方法を示す断面図である。図１１Ａと図１１Ｂに示すように、保持部１２４を有する治具１２５の上に、得られた個片１２３を配置する。保持部１２４として両面テープ等の接着剤を用いることができる。保持部１２４は個片１２３の下部に配置されるとともに、回路基板１０４の周縁部より内側に配置することが望ましい。 11A to 11D are cross-sectional views showing a method for manufacturing the module component 100 according to the third embodiment. As shown in FIGS. 11A and 11B, the obtained piece 123 is placed on a jig 125 having a holding portion 124. An adhesive such as a double-sided tape can be used as the holding portion 124. It is desirable that the holding portion 124 be disposed below the individual pieces 123 and be disposed on the inner side of the peripheral portion of the circuit board 104.
　次に、図１１Ｃに示すように、個片１２３を覆う金属膜１０１を形成する。個片１２３の回路基板１０４の下面１０４Ｂの外周部１０４Ｔが保持部１２４から露出するように個片１２３が保持部１２４上に載置される。金属膜１０１は、個片１２３の側面から下面１０４Ｂに回りこんで外周部１０４Ｔに形成される。金属膜１０１を例えば金属元素をスパッタリングすることで形成する場合には、個片１２３の上面から吹き付けられた金属元素は下面１０４Ｂに回り込むことで、下面１０４Ｂの外周部１０４Ｔに形成される金属膜１０１の部分の厚みは、下面１０４Ｂの外周から内側に向かって小さくなり、図７Ａや図８Ａに示す底面部１１２が形成される。 Next, as shown in FIG. 11C, a metal film 101 covering the pieces 123 is formed. The piece 123 is placed on the holding portion 124 such that the outer peripheral portion 104T of the lower surface 104B of the circuit board 104 of the piece 123 is exposed from the holding portion 124. The metal film 101 is formed on the outer peripheral portion 104T by wrapping around from the side surface of the piece 123 to the lower surface 104B. When the metal film 101 is formed, for example, by sputtering a metal element, the metal element sprayed from the upper surface of the individual piece 123 wraps around the lower surface 104B, so that the metal film 101 formed on the outer peripheral portion 104T of the lower surface 104B. The thickness of the portion decreases from the outer periphery of the lower surface 104B toward the inner side, and the bottom surface portion 112 shown in FIGS. 7A and 8A is formed.
　最後に、図１１Ｄに示すように、個片１２３を治具１２５から剥離することで、モジュール部品１００が得られる。 Finally, as shown in FIG. 11D, the module component 100 is obtained by peeling the piece 123 from the jig 125.
　このように、個片１２３の下面の端から内側に向かって薄くなる金属膜１０１ではバリの欠落が発生しにくいので、モジュール部品１００を取り扱う際の振動や衝撃に対して懸念される電気的接続信頼性を向上させることができる。 As described above, since the metal film 101 that is thinned inward from the lower surface end of the individual piece 123 is less likely to lose burrs, the electrical connection is concerned about vibration and impact when handling the module component 100. Reliability can be improved.
　図１２Ａから図１２Ｄは、実施の形態３におけるモジュール部品１００の他の製造方法を示す断面図である。図１２Ａから図１２Ｄにおいて、図１１Ａから図１１Ｄに示すモジュール部品１００と同じ部分には同じ参照番号を付す。 12A to 12D are cross-sectional views illustrating another method for manufacturing the module component 100 according to the third embodiment. 12A to 12D, the same reference numerals are assigned to the same parts as those of the module component 100 shown in FIGS. 11A to 11D.
　図１１Ａから図１１Ｄに示す治具１２５の保持部１２４は矩形状の断面を有する。図１２Ａから図１２Ｄに示す治具１２５は台形形状の断面を有する保持部１２４Ａを備える。 The holding part 124 of the jig 125 shown in FIGS. 11A to 11D has a rectangular cross section. The jig 125 shown in FIGS. 12A to 12D includes a holding portion 124A having a trapezoidal cross section.
　図１２Ａに示すように、治具１２５には孔１２６が設けられている。図１２Ｂに示すように、エアーを方向１０３Ａに孔１２６を通して吸い込むことにより個片１２３を治具１２５の保持部１２４Ａに保持する。 As shown in FIG. 12A, the jig 125 is provided with a hole 126. As shown in FIG. 12B, the pieces 123 are held by the holding portion 124A of the jig 125 by sucking air through the holes 126 in the direction 103A.
　次に、図１２Ｃに示すように、個片１２３を覆う金属膜１０１を形成する。個片１２３の回路基板１０４の下面１０４Ｂの外周部１０４Ｔが保持部１２４から露出するように個片１２３が保持部１２４Ａ上に載置される。金属膜１０１は、個片１２３の側面から下面１０４Ｂに回りこんで外周部１０４Ｔに形成される。金属膜１０１を例えば金属元素をスパッタリングすることで形成する場合には、個片１２３の上面から吹き付けられた金属元素は下面１０４Ｂに回り込むことで、下面１０４Ｂの外周部１０４Ｔに形成される金属膜１０１の部分の厚みは、下面１０４Ｂの外周から内側に向かって小さくなり、図７Ａや図８Ａに示す底面部１１２が形成される。その後、図１２Ｄに示すように、エアーを方向１０３Ｇに噴射することで個片１２３を治具１２５から取り外し、モジュール部品１００を作製する。 Next, as shown in FIG. 12C, a metal film 101 that covers the pieces 123 is formed. The piece 123 is placed on the holding portion 124A so that the outer peripheral portion 104T of the lower surface 104B of the circuit board 104 of the piece 123 is exposed from the holding portion 124. The metal film 101 is formed on the outer peripheral portion 104T by wrapping around from the side surface of the piece 123 to the lower surface 104B. When the metal film 101 is formed, for example, by sputtering a metal element, the metal element sprayed from the upper surface of the individual piece 123 wraps around the lower surface 104B, so that the metal film 101 formed on the outer peripheral portion 104T of the lower surface 104B. The thickness of the portion decreases from the outer periphery of the lower surface 104B toward the inner side, and the bottom surface portion 112 shown in FIGS. 7A and 8A is formed. Thereafter, as shown in FIG. 12D, the individual parts 123 are removed from the jig 125 by injecting air in the direction 103 </ b> G, and the module component 100 is manufactured.
　個片１２３を保持する保持部１２４Ａは斜面１２４Ｂを有する台形形状の断面を有する。斜面１２４Ｂはモジュール部品１００の回路基板１０４に対して斜めの角度で当接する。すなわち、斜面２１４Ｂと回路基板１０４の下面１０４Ｂとの間の距離は、下面１０４Ｂの外縁から内側部分に向かうにしたがって小さくなる。これにより、金属膜１０１をめっきや導電性ペーストで形成する場合に、金属膜１０１が個片１２３の回路基板１０４の下面１０４Ｂに回りこんで形成される際に、金属膜１０１の厚みを内側に向かって小さくすることができる。 The holding portion 124A for holding the piece 123 has a trapezoidal cross section having an inclined surface 124B. The slope 124B contacts the circuit board 104 of the module component 100 at an oblique angle. That is, the distance between the slope 214B and the lower surface 104B of the circuit board 104 decreases as it goes from the outer edge of the lower surface 104B to the inner portion. Accordingly, when the metal film 101 is formed by plating or conductive paste, the thickness of the metal film 101 is set to the inner side when the metal film 101 is formed to wrap around the lower surface 104B of the circuit board 104 of the piece 123. It can be made smaller.
　また、図１１Ａから図１１Ｄや図１２Ａから図１２Ｄに示す方法により、図８Ａと図８Ｂに示す不定形状を有する端１２２を容易に形成することができる。 Further, the end 122 having the indefinite shape shown in FIGS. 8A and 8B can be easily formed by the method shown in FIGS. 11A to 11D and FIGS. 12A to 12D.
　この方法により、めっきや導電性樹脂の塗布によっても金属膜１０１を容易に形成することが可能となり、個片１２３と金属膜１０１との電気的接続信頼性を高くすることができる。 By this method, the metal film 101 can be easily formed even by plating or applying a conductive resin, and the electrical connection reliability between the piece 123 and the metal film 101 can be increased.
　（実施の形態４）
　図１３Ａと図１３Ｂは本発明の実施の形態４におけるモジュール部品１１００の製造方法を示す断面図である。図１３Ａと図１３Ｂにおいて、図１０Ｃと図１０Ｄに示す実施の形態３における製造方法と同じ部分には同じ参照番号を付す。図１３Ａに示すように、回路基板シート２０４の上に実装された部品１０８を封止した封止樹脂２０９に、個片１２３の境目で矩形状の断面を有する溝１２７が設けられる。なお、溝１２７の深さは、個片１２３の上面から回路基板シート２０４までの距離より短く、溝１２７は回路基板シート２０４まで達していない。次に、図１３Ｂに示すように、溝１２７の底の中央から回路基板シート２０４の下面まで裁断して封止樹脂２０９と回路基板シート２０４を複数の個片１２３に完全に分割することができる。個片１２３の表面に金属膜１０１を形成することにより、図５Ａと図５Ｂに示す階段形状を有する面取り部１１４を有する封止部１０９を備えたモジュール部品１１００が得られる。 (Embodiment 4)
13A and 13B are cross-sectional views showing a method for manufacturing module component 1100 according to Embodiment 4 of the present invention. 13A and 13B, the same reference numerals are assigned to the same portions as those in the manufacturing method according to the third embodiment shown in FIGS. 10C and 10D. As shown in FIG. 13A, a groove 127 having a rectangular cross section is provided at the boundary between the pieces 123 in the sealing resin 209 that seals the component 108 mounted on the circuit board sheet 204. The depth of the groove 127 is shorter than the distance from the upper surface of the piece 123 to the circuit board sheet 204, and the groove 127 does not reach the circuit board sheet 204. Next, as shown in FIG. 13B, the sealing resin 209 and the circuit board sheet 204 can be completely divided into a plurality of pieces 123 by cutting from the bottom center of the groove 127 to the lower surface of the circuit board sheet 204. . By forming the metal film 101 on the surface of the piece 123, a module component 1100 having a sealing portion 109 having a chamfered portion 114 having a stepped shape shown in FIGS. 5A and 5B is obtained.
　図１３Ｃと図１３Ｄは本発明の実施の形態４における他のモジュール部品１１００の製造方法を示す断面図である。図１３Ｃと図１３Ｄにおいて、図１０Ｃと図１０Ｄに示す実施の形態３における製造方法と同じ部分には同じ参照番号を付す。図１３Ｃに示すように、回路基板シート２０４の上に実装された部品１０８を封止した封止樹脂２０９に、個片１２３の境目でＶ字形状の断面を有する溝１２８が設けられる。なお、溝１２８の深さは、個片１２３の上面から回路基板シート２０４までの距離より短く、溝１２８は回路基板シート２０３まで達していない。次に、図１３Ｄに示すように、溝１２８の底の中央から回路基板シート２０４の下面まで裁断して封止樹脂２０９と回路基板シート２０４を複数の個片１２３に完全に分割することができる。個片１２３の表面に金属膜１０１を形成することにより、図２Ａと図２Ｂに示すＣ面カット形状を有する面取り部１１４を有する封止部１０９を備えたモジュール部品１１００が得られる。 FIGS. 13C and 13D are cross-sectional views showing a method for manufacturing another module component 1100 according to Embodiment 4 of the present invention. 13C and FIG. 13D, the same reference numerals are assigned to the same portions as those in the manufacturing method according to the third embodiment shown in FIGS. 10C and 10D. As shown in FIG. 13C, a groove 128 having a V-shaped cross section at the boundary between the pieces 123 is provided in the sealing resin 209 that seals the component 108 mounted on the circuit board sheet 204. The depth of the groove 128 is shorter than the distance from the upper surface of the piece 123 to the circuit board sheet 204, and the groove 128 does not reach the circuit board sheet 203. Next, as shown in FIG. 13D, the sealing resin 209 and the circuit board sheet 204 can be completely divided into a plurality of pieces 123 by cutting from the center of the bottom of the groove 128 to the lower surface of the circuit board sheet 204. . By forming the metal film 101 on the surface of the piece 123, a module component 1100 including a sealing portion 109 having a chamfered portion 114 having a C-surface cut shape shown in FIGS. 2A and 2B is obtained.
　図１３Ａから図１３Ｄに示す方法により、溝１２７、１２８の形成と個片の裁断という二回の工程のみで、コーナーがＣ面カットされた個片１２３や階段形状を有するコーナーを有する個片１２３を容易に製造することができる。 The method shown in FIGS. 13A to 13D, the piece 123 having a corner having a C-shaped corner or a step 123 having a corner shape is cut only by two steps of forming the grooves 127 and 128 and cutting the piece. Can be easily manufactured.
　溝１２７、１２８を形成するダイシングブレードと、回路基板シート２０４と封止樹脂２０９を裁断するダイシングブレードとを用いてもよい。裁断するブレードは溝１２７、１２８を形成するブレードよりも薄い。 A dicing blade for forming the grooves 127 and 128 and a dicing blade for cutting the circuit board sheet 204 and the sealing resin 209 may be used. The blade to be cut is thinner than the blade that forms the grooves 127 and 128.
　図１３Ａから図１３Ｄに示す方法において、溝１２７、１２８の断面の形状を選択して変更することで、封止部１０９の一以上の辺の形状を階段またはＣ面カット、Ｒ面加工、あるいはこれらの組み合わせ形状にすることができる。 In the method shown in FIGS. 13A to 13D, by selecting and changing the cross-sectional shape of the grooves 127 and 128, the shape of one or more sides of the sealing portion 109 can be changed to a staircase or C-plane cut, R-plane processing, or These combinations can be formed.
　次に、図７Ａ、図７Ｂ、図８Ａ、図８Ｂに示すモジュール部品１００、２１００において、グランドパターン１１０と金属膜１０１の底面部１１２とを見分ける方法について説明する。 Next, a method for discriminating between the ground pattern 110 and the bottom surface portion 112 of the metal film 101 in the module components 100 and 2100 shown in FIGS. 7A, 7B, 8A, and 8B will be described.
　グランドパターン１１０の下面１１０Ｂと金属膜１０１の底面部１１２の表面の色差ΔＥは１以上、望ましくは２以上、更に望ましくは３以上である。これらの値の色差ΔＥにより、グランドパターン１１０の下面１１０Ｂ上に形成されて金属膜１０１（底面部１１２）の有無や形状を容易に判別できる。 The color difference ΔE between the lower surface 110B of the ground pattern 110 and the surface of the bottom surface portion 112 of the metal film 101 is 1 or more, preferably 2 or more, and more preferably 3 or more. The presence or absence and shape of the metal film 101 (bottom surface portion 112) formed on the lower surface 110B of the ground pattern 110 can be easily determined by the color difference ΔE of these values.
　図１４は、光の波長と、金（Ａｕ）と銀（Ａｇ）と銅（Ｃｕ）の反射率との関係を示すグラフであり、様々な金属の色の違いを示す。図１４において、横軸は光の波長を示し、横軸はその光の反射率を示す。図１４に示すように、銀は、４００～７００ｎｍの波長に光に対して９５％以上の反射率を有しており、この結果として銀色に見える。銅は、４００～５５０ｎｍの波長の光に対して反射率が低く、５５０ｎｍ以上の波長の光に対する反射率が高いので、一種の赤色である銅色として見える。また、金は、銅に比べて、５５０ｎｍ付近の波長の光に対する反射率が高いので、銅色より黄色に近い黄金色に見える。 FIG. 14 is a graph showing the relationship between the wavelength of light and the reflectance of gold (Au), silver (Ag), and copper (Cu), and shows the differences in the colors of various metals. In FIG. 14, the horizontal axis indicates the wavelength of light, and the horizontal axis indicates the reflectance of the light. As shown in FIG. 14, silver has a reflectance of 95% or more with respect to light at a wavelength of 400 to 700 nm, and as a result, it looks silver. Copper has a low reflectivity with respect to light having a wavelength of 400 to 550 nm, and thus has a high reflectivity with respect to light with a wavelength of 550 nm or more, and thus appears as a kind of red copper color. In addition, gold has a higher reflectance with respect to light having a wavelength near 550 nm than copper, and thus appears to be a golden color closer to yellow than copper.
　例えば、グランドパターン１１０が銅箔からなる場合には赤銅色に見え、金めっきが施されている場合には金色に見える。金属膜１０１が２種類以上の元素を含有する場合には、表面はニッケル、亜鉛、銀などの成分による銀色に見える。グランドパターン１１０の下面１１０Ｂと金属膜１０１の表面の色差ΔＥの値が上記の範囲になるようにそれらの材料を選択することにより、金属膜１０１の状態を複雑で高価な装置を使わずとも肉眼で簡単に認識でき、ＣＣＤカメラ等の通常の撮像装置で自動的に容易に判別できる。 For example, when the ground pattern 110 is made of copper foil, it looks reddish copper, and when it is plated with gold, it looks gold. When the metal film 101 contains two or more kinds of elements, the surface looks silver due to components such as nickel, zinc, and silver. By selecting these materials so that the value of the color difference ΔE between the lower surface 110B of the ground pattern 110 and the surface of the metal film 101 falls within the above range, the state of the metal film 101 can be visually checked without using a complicated and expensive device. Can be easily recognized, and can be automatically and easily determined by a normal imaging device such as a CCD camera.
　赤銅色、銀色、金色等をＬ＊ａ＊ｂ表色系で表現すると、それらの色の間の色差ΔＥが１以上となるので、グランドパターン１１０の上に形成される金属膜１０１の状態を目視による検査で容易に確認できる。これにより、金属膜１０１の電気的接続信頼性のみならず、底面部１１２の状態も確実に判別可能となる。なお色差ΔＥ及び色差ΔＥの測定方法及び測定装置等に関しては、ＪＩＳ　Ｌ　０８０４、ＪＩＳ　Ｌ　０８０５、ＪＩＳ　Ｚ　８７２１、ＪＩＳ　Ｓ　６００６、６００７、６０１６、６０２０、６０２８等を参考にすればよい。 If red, bronze, silver, gold, etc. are expressed in the L * a * b color system, the color difference ΔE between these colors is 1 or more, so the state of the metal film 101 formed on the ground pattern 110 is It can be easily confirmed by visual inspection. Thereby, not only the electrical connection reliability of the metal film 101 but also the state of the bottom surface portion 112 can be reliably determined. Regarding the measuring method and measuring device of the color difference ΔE and the color difference ΔE, JIS L 0804, JIS L 0805, JIS Z 8721, JIS S 6006, 6007, 6016, 6020, 6028, etc. may be referred to.
　実施の形態１～４におけるモジュール部品は、底面部１１２により金属膜１０１とグランドパターン１１０の電気的接続信頼性を高くできる。よって、そのモジュール部品が実装された回路基板１１８を内蔵した電子機器は、取扱時の振動や落下衝撃等の外部衝撃に対し、高い信頼性を実現することができる。 In the module parts according to the first to fourth embodiments, the electrical connection reliability between the metal film 101 and the ground pattern 110 can be increased by the bottom surface portion 112. Therefore, an electronic device incorporating the circuit board 118 on which the module component is mounted can achieve high reliability against external impacts such as vibration during handling and drop impact.
　（実施の形態５）
　図１５Ａは本発明の実施の形態５におけるモジュール部品６００の上面斜視図である。図１５Ｂは図１５Ａに示すモジュール部品６００の線１５Ｂ－１５Ｂにおける断面図である。 (Embodiment 5)
FIG. 15A is a top perspective view of module component 600 according to Embodiment 5 of the present invention. FIG. 15B is a cross-sectional view of the module component 600 shown in FIG. 15A taken along line 15B-15B.
　モジュール部品６００は、回路基板６０４と、回路基板６０４の上面６０４Ａに実装された部品６０８と、回路基板６０４の上面６０４Ａに設けられた封止部６０９と、金属膜６０１とを備える。封止部６０９は部品６０８を封止する。金属膜６０１は回路基板６０４の側面６０４Ｃと封止部６０９とを覆う。 The module component 600 includes a circuit board 604, a component 608 mounted on the upper surface 604A of the circuit board 604, a sealing portion 609 provided on the upper surface 604A of the circuit board 604, and a metal film 601. The sealing unit 609 seals the component 608. The metal film 601 covers the side surface 604C of the circuit board 604 and the sealing portion 609.
　回路基板６０４は、例えば、多層の樹脂基板であり、ガラス繊維をエポキシ樹脂で含浸させたガラスエポキシ樹脂やセラミック等の絶縁物よりなる絶縁層６０５を備える。絶縁層６０５は、回路基板６０４のそれぞれ上面６０４Ａと下面６０４Ｂと側面６０４Ｃとなる上面６０５Ａと下面６０５Ｂと側面６０５Ｃとを有する。回路基板６０４は、配線パターン６０６と、絶縁層６０５の上面６０５Ａに設けられたランド６０６Ａと、絶縁層６０５内に設けられたビア導体６０７とをさらに備える。配線パターン６０６は絶縁層６０５の内部と上面６０５Ａと下面６０５Ｂの少なくとも１つに設けられている。ランド６０６Ａには部品６０８が実装されている。ビア導体６０７は配線パターン６０６やグランドパターン１６１０を接続する。 The circuit board 604 is, for example, a multilayer resin board, and includes an insulating layer 605 made of an insulating material such as glass epoxy resin or ceramic in which glass fibers are impregnated with epoxy resin. The insulating layer 605 has an upper surface 605A, a lower surface 605B, and a side surface 605C that become the upper surface 604A, the lower surface 604B, and the side surface 604C of the circuit board 604, respectively. The circuit board 604 further includes a wiring pattern 606, lands 606 </ b> A provided on the upper surface 605 </ b> A of the insulating layer 605, and via conductors 607 provided in the insulating layer 605. The wiring pattern 606 is provided in the insulating layer 605 and at least one of the upper surface 605A and the lower surface 605B. A component 608 is mounted on the land 606A. The via conductor 607 connects the wiring pattern 606 and the ground pattern 1610.
　金属膜６０１は、封止部６０９の上面６０９Ａを覆う天面部６０１Ａと、天面部６０１Ａから延びる側面部６０１Ｂと、側面部６０１Ｂから延びる底面部６０１Ｃとを有する。側面部６０１Ｂは、回路基板６０４の６０４Ｃを覆う。底面部６０１Ｃはグランドパターン１６１０を部分的に覆う。天面部６０１Ａは、長手方向６００Ａに延びる長辺６１２と、短辺６１１とを有する矩形状を有する。側面部６０１Ｂには、回路基板６０４の側面６０４Ｃと封止部６０９の側面６０９Ｃとを露出させるスリット６１３が設けられている。 The metal film 601 has a top surface portion 601A covering the top surface 609A of the sealing portion 609, a side surface portion 601B extending from the top surface portion 601A, and a bottom surface portion 601C extending from the side surface portion 601B. The side surface portion 601B covers 604C of the circuit board 604. The bottom surface portion 601C partially covers the ground pattern 1610. The top surface portion 601A has a rectangular shape having a long side 612 extending in the longitudinal direction 600A and a short side 611. The side surface portion 601B is provided with a slit 613 that exposes the side surface 604C of the circuit board 604 and the side surface 609C of the sealing portion 609.
　図１５Ｃは図１５Ａに示すモジュール部品６００の線１５Ｃ－１５Ｃにおける断面図である。スリット６１３は、金属膜６０１の互いに対向する側面部６０１Ｂにそれぞれ設けられている。スリット６１３は金属膜６０１で囲まれておらず開放されて開口部６１０を構成している。 FIG. 15C is a cross-sectional view taken along line 15C-15C of the module component 600 shown in FIG. 15A. The slits 613 are respectively provided in the side portions 601B of the metal film 601 facing each other. The slit 613 is not surrounded by the metal film 601 but is opened to form an opening 610.
　金属膜６０１の特に天面部６０１Ａと側面部６０１Ｂは電磁波６０３Ｂを放射するアンテナとして機能する。 In particular, the top surface portion 601A and the side surface portion 601B of the metal film 601 function as an antenna that radiates the electromagnetic wave 603B.
　金属膜６０１の側面部６０１Ｂは、封止部６０９の側面６０９Ｃと回路基板６０４の側面６０４Ｃとを覆う、すなわち、封止部６０９と回路基板６０４との境界面６０２を超えて延びる。これにより、グランドパターン１６１０と金属膜６０１との密着性を高め、バリ等の金属膜６０１の剥がれ始める部分が発生しないので、長期に渡る電気的な接続信頼性が向上する。 The side surface portion 601B of the metal film 601 covers the side surface 609C of the sealing portion 609 and the side surface 604C of the circuit board 604, that is, extends beyond the boundary surface 602 between the sealing portion 609 and the circuit board 604. As a result, the adhesion between the ground pattern 1610 and the metal film 601 is enhanced, and a portion where the metal film 601 such as a burr starts to be peeled off does not occur, so that electrical connection reliability over a long period is improved.
　金属膜６０１の天面部６０１Ａは側面部６０１Ｂ、特に封止部６０９の側面６０９Ｃを覆う部分より厚い。具体的には、金属膜６０１の天面部６０１Ａの厚みは、側面部６０１Ｂのうち封止部６０９の側面６０９Ｃを覆う部分の厚みの１．５倍以上５倍以下である。これによって天面部６０１Ａと側面部６０１Ｂとを確実に接続することができる。 The top surface portion 601A of the metal film 601 is thicker than the portion covering the side surface portion 601B, particularly the side surface 609C of the sealing portion 609. Specifically, the thickness of the top surface portion 601A of the metal film 601 is 1.5 to 5 times the thickness of the portion of the side surface portion 601B that covers the side surface 609C of the sealing portion 609. Thereby, the top surface portion 601A and the side surface portion 601B can be reliably connected.
　金属膜６０１の底面部６０１Ｃは、絶縁層６０５の外周から内周に向かって小さくなる厚みを有して厚み勾配を有する。これにより応力が発生しにくく、底面部６０１Ｃは外力等でもグランドパターン１６１０から剥離しにくいので、長期に渡る電気的な接続信頼性が向上する。 The bottom surface portion 601C of the metal film 601 has a thickness that decreases from the outer periphery to the inner periphery of the insulating layer 605 and has a thickness gradient. As a result, it is difficult for stress to occur, and the bottom surface portion 601C is hardly peeled off from the ground pattern 1610 even by an external force or the like, so that electrical connection reliability over a long period is improved.
　回路基板６０４が絶縁層６０５にセラミック基板を用いた場合、ランド６０６Ａ、配線パターン６０６、グランドパターン１１０を銀、銀パラジウム、あるいは銅で形成してもよい。配線パターンは導電ペーストの印刷、焼成で形成しても良く、あるいは銅箔等の導体箔を貼り付けて形成しても良い。 When the circuit board 604 uses a ceramic substrate for the insulating layer 605, the land 606A, the wiring pattern 606, and the ground pattern 110 may be formed of silver, silver palladium, or copper. The wiring pattern may be formed by printing and baking a conductive paste, or may be formed by attaching a conductive foil such as a copper foil.
　部品６０８は、例えば、半導体集積回路（ＩＣ）等の能動部品やコイル、コンデンサ等の受動部品であり、チップ部品とすることで実装密度を高められる。 The component 608 is, for example, an active component such as a semiconductor integrated circuit (IC) or a passive component such as a coil or a capacitor, and the mounting density can be increased by using a chip component.
　封止部６０９は、例えば、熱硬化性樹脂にて構成されており、真空加圧しながら加熱すると、樹脂フィラーが回路基板６０４と部品６０８との隙間に入ることで、ボイドを発生させることなく、部品６０８を封止することができる。封止部６０９の下面６０９Ｂは回路基板６０４の上面６０４Ａに当接する。 The sealing portion 609 is made of, for example, a thermosetting resin, and when heated while being vacuum-pressed, the resin filler enters the gap between the circuit board 604 and the component 608 without generating voids. The component 608 can be sealed. A lower surface 609B of the sealing portion 609 abuts on an upper surface 604A of the circuit board 604.
　金属膜６０１は、スパッタまたはめっきで形成でき、あるいは市販の導電性ペーストを印刷して硬化させて形成してもよい。 The metal film 601 can be formed by sputtering or plating, or may be formed by printing and curing a commercially available conductive paste.
　また金属膜６０１は、二種類以上の元素から構成しても良い。例えば封止部６０９の表面に銅からなる下地層を形成し、この下地層上に、更に亜鉛やニッケル、錫等よりなる上層を設けることで、下地層の銅の酸化は錆びの発生を防止することができる。銅よりなる下地層上に銀よりなる上層を設けることにより金属膜６０１のシート抵抗を下げることができ、シールド効果を有する周波数域を高周波側に広げることができる。 The metal film 601 may be composed of two or more elements. For example, by forming a base layer made of copper on the surface of the sealing portion 609 and providing an upper layer made of zinc, nickel, tin, or the like on this base layer, the oxidation of copper in the base layer prevents the occurrence of rust. can do. By providing the upper layer made of silver on the base layer made of copper, the sheet resistance of the metal film 601 can be lowered, and the frequency region having a shielding effect can be widened to the high frequency side.
　なお、金属膜１０１に使用する２種類の元素は、合金として金属膜１０１を形成してもよい。銅と亜鉛、あるいは銅とニッケル等の部材を予め合金化し、これをスパッタ用ターゲットとしても良い。あるいは銅のターゲットと、亜鉛のターゲットを別々に用意し、これを同時にスパッタすることで、合金化しても良い。こうすることで、工数を低減でき、コストダウンできる。 Note that the two kinds of elements used in the metal film 101 may form the metal film 101 as an alloy. Members such as copper and zinc or copper and nickel may be alloyed in advance and used as a sputtering target. Alternatively, a copper target and a zinc target may be prepared separately and alloyed by sputtering them simultaneously. By doing so, man-hours can be reduced and costs can be reduced.
　図１５Ｄは金属膜６０１の他の例の断面図である。金属膜６０１は、封止部６０９の表面に設けられたチタンもしくはクロムよりなる下地層１６０１と、下地層１６０１上に形成された銅層２６０１と、銅層２６０１の上に設けられた亜鉛やニッケル、錫もしくは亜鉛合金やニッケル合金、錫合金よりなる上層３６０１とを有していてもよい。これにより、封止部６０９と金属膜６０１との密着性を高めることができる。 FIG. 15D is a cross-sectional view of another example of the metal film 601. The metal film 601 includes a base layer 1601 made of titanium or chromium provided on the surface of the sealing portion 609, a copper layer 2601 formed on the base layer 1601, and zinc or nickel provided on the copper layer 2601. And an upper layer 3601 made of tin, zinc alloy, nickel alloy, or tin alloy. Thereby, the adhesiveness of the sealing part 609 and the metal film 601 can be improved.
　なお、上記の下地層を形成する前に、封止部６０９の表面にアルゴン（Ａｒ）で逆スパッタリングを施して封止部６０９の表面を洗浄することで更に金属膜６０１との密着性を向上させることができる。 In addition, before forming the base layer, the surface of the sealing portion 609 is reverse-sputtered with argon (Ar) to clean the surface of the sealing portion 609, thereby further improving the adhesion with the metal film 601. Can be made.
　図１５Ｂに示すように、グランドパターン１６１０と金属膜６０１の底面部６０１Ｃとは面で接触しているので、接触抵抗を小さくすることができる。底面部６０１Ｃは回路基板６０４（絶縁層６０５）の外周から内周に向かって小さくなる厚みを有するので、応力が発生しにくく、外力等でも剥離しない。 15B, since the ground pattern 1610 and the bottom surface portion 601C of the metal film 601 are in contact with each other, the contact resistance can be reduced. Since the bottom surface portion 601C has a thickness that decreases from the outer periphery to the inner periphery of the circuit board 604 (insulating layer 605), stress is not easily generated and is not peeled off even by an external force or the like.
　スリット６１３は金属膜６０１のアンテナとしての効果を高める。スリット６１３から回路基板６０４の側面６０４Ｃもしくは封止部６０９の側面６０９Ｃの一部を露出する。 The slit 613 enhances the effect of the metal film 601 as an antenna. The side surface 604C of the circuit board 604 or a part of the side surface 609C of the sealing portion 609 is exposed from the slit 613.
　次に、実施の形態５におけるモジュール部品６００の金属膜６０１の天面部６０１Ａと側面部６０１Ｂのアンテナとしての機能について説明する。図１６はモジュール部品６００の断面図である。 Next, functions of the top surface portion 601A and the side surface portion 601B of the metal film 601 of the module component 600 according to Embodiment 5 as antennas will be described. FIG. 16 is a cross-sectional view of the module component 600.
　モジュール部品６００は給電部６１６をさらに備え、給電部６１６はリアクタンス６１４と、ポート発信源６１５とを有する。ポート発信源６１５は回路基板６０４の上面６０４Ａに位置する配線パターン６０６よりなる。給電部６１６は金属膜６０１の天面部６０１Ａの略中央部に設けられている。 The module component 600 further includes a power supply unit 616, and the power supply unit 616 includes a reactance 614 and a port transmission source 615. The port transmission source 615 includes a wiring pattern 606 located on the upper surface 604A of the circuit board 604. The power feeding unit 616 is provided at a substantially central portion of the top surface portion 601 </ b> A of the metal film 601.
　リアクタンス５１４は、回路基板６０４の中央付近に実装された部品６０８と金属膜６０１の天面部６０１Ａとの間やポート発信源６１５と天面部６０１Ａとの間に形成された容量性または誘導性の空間結合成分よりなり、部品（容量性、誘導性）で結合されている。金属膜６０１の天面部６０１Ａの厚みは、放射する電磁波６０３の周波数での表皮効果により高周波電流が流れる表皮深さ以上に設定されており、金属膜６０１の天面部６０１Ａに設けられた給電部６１６の給電効率を高める。一方、金属膜６０１の側面部６０１Ｂの厚みは、その表皮深さより小さく設定されており、これにより、モジュール部品６００の側面付近から放射される電磁波の放射効率を高めることが可能となる。電磁波６０３の周波数ｆでの表皮深さＤは金属膜６０１の導電率σと透磁率μにより以下の式で表される。 The reactance 514 is a capacitive or inductive space formed between the component 608 mounted near the center of the circuit board 604 and the top surface portion 601A of the metal film 601 or between the port transmission source 615 and the top surface portion 601A. It consists of coupling components and is coupled with parts (capacitive and inductive). The thickness of the top surface portion 601A of the metal film 601 is set to be equal to or greater than the skin depth through which high-frequency current flows due to the skin effect at the frequency of the radiating electromagnetic wave 603, and the power feeding portion 616 provided on the top surface portion 601A of the metal film 601. Increase the power supply efficiency. On the other hand, the thickness of the side surface portion 601B of the metal film 601 is set to be smaller than the skin depth, and thereby the radiation efficiency of electromagnetic waves radiated from the vicinity of the side surface of the module component 600 can be increased. The skin depth D at the frequency f of the electromagnetic wave 603 is expressed by the following equation depending on the conductivity σ and the permeability μ of the metal film 601.
　Ｄ＝１／（π・ｆ・σ・μ）１／２
　例えば、金属膜６０１が銅よりなる場合の表皮深さＤを求める。銅の導電率σは５．８×１０７（Ｓ／ｍ）であり透磁率μは４π×１０－７（Ｈ／ｍ）である。例えば、モジュール部品６００の金属膜６０１から放射する電磁波６０３の周波数ｆが５ＧＨｚである場合には、表皮深さＤは上記の式により約０．９５μｍとなる。 D = 1 / (π · f · σ · μ) 1/2
For example, the skin depth D when the metal film 601 is made of copper is obtained. The conductivity σ of copper is 5.8 × 10 7 (S / m), and the magnetic permeability μ is 4π × 10 −7 (H / m). For example, when the frequency f of the electromagnetic wave 603 radiated from the metal film 601 of the module component 600 is 5 GHz, the skin depth D is about 0.95 μm according to the above formula.
　従って、周波数ｆが５ＭＨｚの場合には金属膜６０１の天面部６０１Ａの厚みを１μｍ、側面部６０１Ｂの厚みを０．２～０．３３μｍに設定することで、モジュール部品６００のシールド効果とアンテナ効果とを両立させることが可能となる。 Accordingly, when the frequency f is 5 MHz, the shielding effect and the antenna effect of the module component 600 are set by setting the thickness of the top surface portion 601A of the metal film 601 to 1 μm and the thickness of the side surface portion 601B to 0.2 to 0.33 μm. It is possible to achieve both.
　金属膜６０１は通常、広帯域（１００ｋＨｚ～１２．７５ＧＨｚ）にわたってモジュール部品６００を電磁的にシールドしている。実施の形態５におけるモジュール部品６００では、金属膜６０１は特定の周波数の範囲の電磁波を放射するアンテナとして機能する。波長λの電磁波を放射する場合に、金属膜６０１の矩形状を有する天面部６０１Ａの辺６１１または辺６１２の長さを３λ／１０～７λ／１０にする。 The metal film 601 normally electromagnetically shields the module component 600 over a wide band (100 kHz to 12.75 GHz). In the module component 600 according to the fifth embodiment, the metal film 601 functions as an antenna that radiates electromagnetic waves in a specific frequency range. When the electromagnetic wave having the wavelength λ is emitted, the length of the side 611 or the side 612 of the top surface portion 601A having the rectangular shape of the metal film 601 is set to 3λ / 10 to 7λ / 10.
　図１５Ｃに示すように、スリット６１３で形成される開口部６１０は互いに対向する辺６１２に繋がる封止部６０９の側面６０９Ｃと回路基板６０４の側面６０４Ｃに設けられている。開口部６１０の辺６１２の方向の長さ６１０Ｗは３／１０λ～７／１０λに設定されている。これにより、金属膜６０１の天面部６０１Ａと側面部６０１Ｂは波長λの電磁波を放射するアンテナとして動作させる事が可能となる。辺６１１に繋がる封止部６０９と回路基板６０４の側面には開口部が設けられておらず、金属膜６０１の側面部６０１Ｂに全体が覆われている。回路基板６０４の側面６０４Ｃに露出する配線パターン６０６が辺６１１に繋がる金属膜６０１の側面部６０１Ｂに接続されている。これにより、辺６１１に繋がる側面部６０１Ｂから放射される電磁波を抑制することができ、辺６１２と直角の方向に金属膜６０１のアンテナとしての指向性を設定することができる。金属膜６０１の天面部６０１Ａは辺６１１の方向に延びる半波長ダイポールアンテナの集合と考えることができる。 As shown in FIG. 15C, the opening 610 formed by the slit 613 is provided on the side surface 609C of the sealing portion 609 and the side surface 604C of the circuit board 604 that are connected to the sides 612 facing each other. The length 610W in the direction of the side 612 of the opening 610 is set to 3 / 10λ to 7 / 10λ. As a result, the top surface portion 601A and the side surface portion 601B of the metal film 601 can be operated as an antenna that emits an electromagnetic wave having a wavelength λ. Openings are not provided on the side surfaces of the sealing portion 609 and the circuit board 604 connected to the side 611, and the entire side surface portion 601 </ b> B of the metal film 601 is covered. The wiring pattern 606 exposed on the side surface 604C of the circuit board 604 is connected to the side surface portion 601B of the metal film 601 connected to the side 611. Thereby, electromagnetic waves radiated from the side surface portion 601B connected to the side 611 can be suppressed, and the directivity of the metal film 601 as an antenna can be set in a direction perpendicular to the side 612. The top surface portion 601A of the metal film 601 can be considered as a set of half-wave dipole antennas extending in the direction of the side 611.
　開口部６１０の面積を調整することで、モジュール部品６００のアンテナとしての放射効率を制御することが可能となる。例えば、回路基板１０４の下面１０４Ｂから金属膜６０１の天面部６０１Ａに向かうにしたがって開口部６１０を狭くする場合、側面部６０１Ｂが回路基板６０４の側面６０４Ｃに露出した配線パターン６０６と接続される部分を徐々に大きくすることができるので、放射効率を調整することができる。開口部６１０が設けられていない場合には最も放射効率が低くなるので、放射する電磁波の到達距離を短縮させたい場合に有効である。 It is possible to control the radiation efficiency of the module component 600 as an antenna by adjusting the area of the opening 610. For example, when the opening 610 is narrowed from the lower surface 104B of the circuit board 104 toward the top surface 601A of the metal film 601, a portion where the side surface 601B is connected to the wiring pattern 606 exposed on the side 604C of the circuit board 604 is formed. Since it can be gradually increased, the radiation efficiency can be adjusted. When the opening 610 is not provided, the radiation efficiency is lowest, which is effective when it is desired to shorten the reach of the radiated electromagnetic wave.
　開口部６１０が天面部６０１Ａと平行な方向で変化する場合には、開口部６１０の長さが、放射する電磁波の所望の波長より短くなるので、アンテナとして動作させる周波数を高域へシフトさせることが可能となる。 When the opening 610 changes in a direction parallel to the top surface 601A, the length of the opening 610 is shorter than the desired wavelength of the radiated electromagnetic wave, so that the frequency to operate as an antenna is shifted to a high frequency. Is possible.
　波長λの電磁波を放射するアンテナとして金属膜６０１を動作させ、封止部６０９の比誘電率εｒとすると、波長短縮により辺６１１が約λ／（２×εｒ１／２）の長さを有することにより、その電磁波を放射かつ受信するアンテナとして金属膜６０１が動作する。例えば、周波数５ＧＨｚの電磁波の半波長λ／２は約３（ｃｍ）である。この場合には、辺６１１の長さが約３／εｒ１／２（ｃｍ）であれば、金属膜６０１はその電磁波を放射かつ受信できるアンテナとして動作する。 When the metal film 601 is operated as an antenna that emits an electromagnetic wave having a wavelength λ and the relative dielectric constant εr of the sealing portion 609 is set, the side 611 has a length of about λ / (2 × εr 1/2 ) due to the wavelength reduction. Thus, the metal film 601 operates as an antenna that radiates and receives the electromagnetic waves. For example, the half wavelength λ / 2 of an electromagnetic wave having a frequency of 5 GHz is about 3 (cm). In this case, if the length of the side 611 is about 3 / εr 1/2 (cm), the metal film 601 operates as an antenna that can radiate and receive the electromagnetic wave.
　金属膜６０１がめっき、蒸着あるいはスパッタで製造された場合、一般的に金属間結合を有するので、広帯域（１００ｋＨｚ～１２．７５ＧＨｚ）にわたってモジュール部品６００を電磁シールドでき、かつ特定の周波数範囲の電磁波を放射し受信できるアンテナとして動作する。 When the metal film 601 is manufactured by plating, vapor deposition, or sputtering, since it generally has an intermetallic bond, the module component 600 can be electromagnetically shielded over a wide band (100 kHz to 12.75 GHz), and electromagnetic waves in a specific frequency range can be generated. Operates as an antenna that can radiate and receive.
　図１７はモジュール部品６００の上面図である。金属膜６０１の天面部６０１Ａは矩形状を有する。天面部６０１Ａの対角線６０１Ｄの長さは１／２λに設定されている。天面部６０１Ａの辺６１１の長さは３／１０λ～７／１０λであることが望ましい。また、天面部６０１Ａの対角線６０１Ｄの長さを３／１０λ～７／１０λに設定してもよい。 FIG. 17 is a top view of the module component 600. The top surface portion 601A of the metal film 601 has a rectangular shape. The length of the diagonal 601D of the top surface 601A is set to 1 / 2λ. The length of the side 611 of the top surface portion 601A is desirably 3 / 10λ to 7 / 10λ. Further, the length of the diagonal line 601D of the top surface portion 601A may be set to 3 / 10λ to 7 / 10λ.
　例えば、前述のように、５ＧＨｚの周波数でアンテナとして動作させるために、封止部６０９の比誘電率εｒ＝４である場合には、波長短縮により辺６１１の長さＬ６１１は以下で表される。 For example, as described above, in order to operate as an antenna at a frequency of 5 GHz, when the relative dielectric constant εr = 4 of the sealing portion 609, the length L611 of the side 611 is expressed as follows due to the wavelength reduction. .
　Ｌ６１１＝λ／（２×εｒ１／２）≒１．５ｃｍ
　図１８はモジュール部品６００の金属膜６０１に用いられる金属の電磁シールド効果を示すグラフである。図１８において、横軸は電磁波の周波数を示し、縦軸は電磁波の減衰量の理論計算値を示す。特性Ｐ６０１は市販の厚み８０μｍの洋白からなる層の減衰量を示す。特性Ｐ６０２はスパッタによって形成した厚み１．０μｍの銅箔からなる層の減衰量を示す。Ｐ６０３は厚み１０μｍの市販の導電性ペーストよりなる層の減衰量を示す。 L611 = λ / (2 × εr 1/2 ) ≈1.5 cm
FIG. 18 is a graph showing the electromagnetic shielding effect of metal used for the metal film 601 of the module component 600. In FIG. 18, the horizontal axis indicates the frequency of the electromagnetic wave, and the vertical axis indicates the theoretical calculation value of the attenuation amount of the electromagnetic wave. Characteristic P601 indicates the attenuation of a commercially available layer made of white and white having a thickness of 80 μm. A characteristic P602 indicates the attenuation of a layer made of copper foil having a thickness of 1.0 μm formed by sputtering. P603 represents the attenuation of a layer made of a commercially available conductive paste having a thickness of 10 μm.
　図１８に示すように、減衰量は、導電性ペーストよりなる層が最も大きく、次が洋白よりなる層が大きく、スパッタで形成されて銅よりなる層の減衰量が最も小さい。金属膜６０１の天面部６０１Ａの厚みを側面部６０１Ｂの厚みの１．５倍以上５倍以下に設定する。これにより、金属膜６０１と特にスパッタで形成する場合に、モジュール部品６００のアンテナとして動作する周波数以外でシールドする周波数帯域でシールド性を劣化させず、かつアンテナとして動作する周波数で放射効率を損なわない。このように、金属膜６０１の天面部６０１Ａと側面部６０１Ｂの厚みを積極的に調整することで、薄くても電磁波の減衰量を効果的に増加できるため、モジュール部品６００のシールド効果を高められる。 As shown in FIG. 18, the attenuation amount is the largest for the layer made of conductive paste, the next is the layer made of white, and the attenuation amount of the layer made of copper formed by sputtering is the smallest. The thickness of the top surface portion 601A of the metal film 601 is set to be 1.5 to 5 times the thickness of the side surface portion 601B. As a result, when the metal film 601 is formed by sputtering in particular, the shielding performance is not deteriorated in a frequency band shielded at a frequency other than the frequency operating as the antenna of the module component 600, and the radiation efficiency is not impaired at the frequency operating as the antenna. . Thus, by actively adjusting the thickness of the top surface portion 601A and the side surface portion 601B of the metal film 601, the attenuation of electromagnetic waves can be effectively increased even if it is thin, so that the shielding effect of the module component 600 can be enhanced. .
　図１９Ａと図１９Ｂは、それぞれスリット６１３を有する金属膜６０１を備えたモジュール部品６００の電磁波の放射分布を示す上面図と側面図である。図２０Ａと図２０Ｂは、それぞれスリット６１３を有していない金属膜６０１を備えた比較例のモジュール部品の電磁波の放射強度を示す上面図と側面図である。 19A and 19B are a top view and a side view showing the radiation distribution of electromagnetic waves of the module component 600 provided with the metal film 601 having the slits 613, respectively. 20A and 20B are a top view and a side view showing the electromagnetic wave radiation intensity of the module component of the comparative example provided with the metal film 601 not having the slit 613, respectively.
　図１９Ａと図１９Ｂ、図２０Ａ、図２０Ｂにおいて、領域６１７Ａ～６１７Ｄでのそれぞれの電界強度Ｅ６０１Ａ～Ｅ６０１Ｄでは、電界強度Ｅ６０１Ａが最も大きく、電界強度Ｅ６０１Ｂが２番目に大きく、電界強度Ｅ６０１Ｃが３番目に大きく、電界強度Ｅ６０１Ｄが最も小さい。このように、モジュール部品６００の近くの領域では電界強度が高く、モジュール部品から遠い領域ほど電界強度は低くなる。図１９Ａと図１９Ｂに示すモジュール部品６００の近くには高い電界強度を有する領域６１７Ａが形成されている。しかし、図２０Ａと図２０Ｂに示す比較例のモジュール部品では、電界強度が高い領域６１７Ａは形成されていない。また、図１９Ａと図１９Ｂに示すモジュール部品６００が形成する領域６１７Ｂ、６１７Ｃは、図２０Ａと図２０Ｂに示す比較例のモジュール部品が形成す領域６１７Ｂ，６１７Ｃより狭い。 19A, 19B, 20A, and 20B, in each of the field strengths E601A to E601D in the regions 617A to 617D, the electric field strength E601A is the largest, the electric field strength E601B is the second largest, and the electric field strength E601C is the third. The electric field strength E601D is the smallest. Thus, the electric field strength is high in the region near the module component 600, and the electric field strength is low in the region far from the module component. A region 617A having high electric field strength is formed near the module component 600 shown in FIGS. 19A and 19B. However, in the module component of the comparative example shown in FIGS. 20A and 20B, the region 617A having a high electric field strength is not formed. Further, the regions 617B and 617C formed by the module component 600 shown in FIGS. 19A and 19B are narrower than the regions 617B and 617C formed by the module component of the comparative example shown in FIGS. 20A and 20B.
　以上説明したように、図１９Ａと図１９Ｂに示すモジュール部品６００にスリット６１３を設けることで、電界強度を図２０Ａと図２０Ｂに示す比較例のモジュール部品の電界強度より全体的に高くできる。 As described above, by providing the slit 613 in the module component 600 shown in FIGS. 19A and 19B, the electric field strength can be made higher overall than the electric field strength of the module component of the comparative example shown in FIGS. 20A and 20B.
　図２１Ａは実施の形態５における他のモジュール部品１６００の上面斜視図である。図２１Ｂは図２１Ａに示すモジュール部品１６００の線２１Ｂ－２１Ｂにおける断面図である。図２１Ａと図２１Ｂにおいて、図１５Ａと図１５Ｂに示すモジュール部品６００と同じ部分には同じ参照番号を付す。金属膜６０１の辺６１２に繋がる側面部６０１Ｂには開口部６１０とさらに開口部６１０Ａが設けられている。開口部６１０は側面部６０１Ｂの辺６１２の方向での中央部に設けられており、開口部６１０Ａは側面部６０１Ｂの辺６１２の方向での両端部に設けられている。金属膜６０１の辺６１１に繋がる側面部６０１Ｂは封止部６０９の側面６０９Ｃの全体を覆うが、回路基板６０４の側面６０４Ｃには達しておらず、配線パターン６０６には接続されていない。これにより、モジュール部品６００のアンテナとしての指向性を辺６１２の方向に設定することができ、モジュール部品６００の指向性を調整したい場合、有効である。 FIG. 21A is a top perspective view of another module component 1600 according to the fifth embodiment. FIG. 21B is a cross-sectional view of the module component 1600 shown in FIG. 21A taken along line 21B-21B. 21A and 21B, the same reference numerals are assigned to the same parts as those of the module component 600 shown in FIGS. 15A and 15B. An opening 610 and an opening 610A are provided in the side surface 601B connected to the side 612 of the metal film 601. The opening 610 is provided at the center of the side surface 601B in the direction of the side 612, and the opening 610A is provided at both ends of the side surface 601B in the direction of the side 612. The side surface portion 601B connected to the side 611 of the metal film 601 covers the entire side surface 609C of the sealing portion 609, but does not reach the side surface 604C of the circuit board 604 and is not connected to the wiring pattern 606. Thereby, the directivity of the module component 600 as an antenna can be set in the direction of the side 612, which is effective when the directivity of the module component 600 is to be adjusted.
　図２２Ａは実施の形態５におけるさらに他のモジュール部品２６００の上面斜視図である。図２２Ｂは図２２Ａに示すモジュール部品２６００の線２２Ｂ－２２Ｂにおける断面図である。図２２Ａと図２２Ｂにおいて、図２１Ａと図２１Ｂに示すモジュール部品１６００と同じ部分には同じ参照番号を付す。モジュール部品２６００では、金属膜６０１の辺６１１に繋がる側面部６０１Ｂに開口部６１０Ｂが設けられている。開口部６１０Ｂは回路基板６０４の側面６０４Ｃを露出させ、さらに封止部６０９の側面６０９Ｃを部分的に露出させる。開口部６１０、６１０Ａ、６１０Ｂにより、アンテナの指向性の調整範囲を拡大させることが可能となる。 FIG. 22A is a top perspective view of still another module component 2600 in the fifth embodiment. FIG. 22B is a cross-sectional view of the module component 2600 shown in FIG. 22A taken along line 22B-22B. 22A and 22B, the same reference numerals are assigned to the same portions as those of the module component 1600 shown in FIGS. 21A and 21B. In the module component 2600, an opening 610B is provided in a side surface 601B connected to the side 611 of the metal film 601. The opening 610B exposes the side surface 604C of the circuit board 604 and further exposes the side surface 609C of the sealing portion 609 partially. With the openings 610, 610A, and 610B, the antenna directivity adjustment range can be expanded.
　図２３は、金属膜６０１がアンテナとして放射する電磁波の周波数と天面部６０１Ａと側面部６０１Ｂの膜厚の関係を示す。また、図２４は、電磁波の周波数と、金属膜６０１の辺６１１や対角線６０１Ｄの長さの関係を示す。 FIG. 23 shows the relationship between the frequency of electromagnetic waves emitted from the metal film 601 as an antenna and the film thicknesses of the top surface portion 601A and the side surface portion 601B. FIG. 24 shows the relationship between the frequency of electromagnetic waves and the lengths of the side 611 and the diagonal line 601D of the metal film 601.
　図２４に示す対角線６０１Ｄの長さは、モジュール部品６００の辺６１１の長さが７／１０λでありかつ金属膜６０１の天面部６０１Ａの形状が正方形である場合に最大となる。図２４に示すように、実際の計算では封止部６０９の比誘電率を考慮して、対角線６０１Ｄの最大長が３／１０λ～７／１０λの範囲に入っている。 The length of the diagonal line 601D shown in FIG. 24 is the maximum when the length of the side 611 of the module component 600 is 7 / 10λ and the shape of the top surface portion 601A of the metal film 601 is square. As shown in FIG. 24, in the actual calculation, the maximum length of the diagonal line 601D is in the range of 3 / 10λ to 7 / 10λ in consideration of the relative dielectric constant of the sealing portion 609.
　図２３に示すように金属膜６０１の天面部６０１Ａの厚みと側面部６０１Ｂの厚みとの関係を維持することにより、天面部６０１Ａと側面部６０１Ｂにおける所望の周波数の電磁波のアンテナとして動作するモジュール部品６００の放射効率を高めることができる。 As shown in FIG. 23, by maintaining the relationship between the thickness of the top surface portion 601A of the metal film 601 and the thickness of the side surface portion 601B, a module component that operates as an antenna of an electromagnetic wave having a desired frequency in the top surface portion 601A and the side surface portion 601B. The radiation efficiency of 600 can be increased.
　なお、開口部６１０は金属膜６０１の側面部６０１Ｂを形成する際にマスクにより同時に形成することができる。スリット６１３は側面部６０１Ｂを形成した後に側面部３０１Ｂに切れ目を入れるトリミング工程で形成することもできる。 The opening 610 can be formed simultaneously with a mask when the side surface 601B of the metal film 601 is formed. The slit 613 can also be formed by a trimming process in which a slit is formed in the side surface portion 301B after the side surface portion 601B is formed.
　図２５Ａと図２５Ｂは実施の形態５におけるモジュール部品６００を備えた電子機器６２０の製造方法を示す断面図である。電子機器６２０は、モジュール部品６００と、モジュール部品６００が実装された回路基板６１８とを備える。回路基板６１８の上面６１８Ａには配線パターン６０６Ｂが設けられている。配線パターン６０６Ｂには半田６１９が設けられている。モジュール部品６００は、回路基板６１８の上面６１８Ａの配線パターン６０６Ｂに半田６１９で接続されて実装される。 FIG. 25A and FIG. 25B are cross-sectional views showing a method for manufacturing the electronic device 620 provided with the module component 600 according to the fifth embodiment. The electronic device 620 includes a module component 600 and a circuit board 618 on which the module component 600 is mounted. A wiring pattern 606B is provided on the upper surface 618A of the circuit board 618. Solder 619 is provided on the wiring pattern 606B. The module component 600 is mounted by being connected to the wiring pattern 606B on the upper surface 618A of the circuit board 618 with solder 619.
　以下、モジュール部品６００の製造方法について説明する。 Hereinafter, a method for manufacturing the module component 600 will be described.
　図２６Ａから図２６Ｄは実施の形態５におけるモジュール部品６００の製造方法を示す断面図である。 26A to 26D are cross-sectional views showing a method for manufacturing the module component 600 according to the fifth embodiment.
　回路基板シート７０４は部品６０８を実装するための配線パターン６０６を有する。まず、図２６Ａに示すように、回路基板シート７０４上の配線パターン６０６に部品６０８を実装する。次に、図２６Ｂに示すように、半田６１９で部品６０８を配線パターン６０６に電気的に接続する。次に、図２６Ｃに示すように、部品６０８の周囲を封止樹脂７０９により封止した後、図２６Ｄに示すように、回路基板シート７０４と封止樹脂７０９とを個片６２１に分割する。回路基板シート７０４と封止樹脂７０９は分割されてそれぞれ回路基板６０４と封止部６０９となる。 The circuit board sheet 704 has a wiring pattern 606 for mounting the component 608. First, as shown in FIG. 26A, the component 608 is mounted on the wiring pattern 606 on the circuit board sheet 704. Next, as shown in FIG. 26B, the component 608 is electrically connected to the wiring pattern 606 with solder 619. Next, as shown in FIG. 26C, after the periphery of the component 608 is sealed with a sealing resin 709, the circuit board sheet 704 and the sealing resin 709 are divided into pieces 621 as shown in FIG. 26D. The circuit board sheet 704 and the sealing resin 709 are divided into a circuit board 604 and a sealing portion 609, respectively.
　図２７Ａから図２７Ｄはモジュール部品６００の製造方法を示す断面図である。図２７Ａと図２７Ｂに示すように、保持部６２２を有する治具６２３の上に、得られた個片６２１を配置する。保持部６２２として両面テープ等の接着剤を用いることができる。保持部６２２は個片６２１の下部に配置されるとともに、回路基板６０４の周縁部より内側に配置することが望ましい。 27A to 27D are cross-sectional views showing a method for manufacturing the module component 600. As shown in FIGS. 27A and 27B, the obtained piece 621 is placed on a jig 623 having a holding portion 622. An adhesive such as a double-sided tape can be used as the holding portion 622. The holding portion 622 is preferably disposed below the piece 621 and on the inner side of the peripheral portion of the circuit board 604.
　次に、図２７Ｃに示すように、個片６２１を覆う金属膜６０１を形成する。個片６２１の回路基板６０４の下面６０４Ｂの外周部６０４Ｔが保持部６２２から露出するように個片６２１が保持部６２２上に載置される。金属膜６０１は、個片６２１の側面から下面６０４Ｂに回りこんで外周部６０４Ｔに形成される。金属膜６０１を例えば金属元素をスパッタリングすることで形成する場合には、個片６２１の上面から吹き付けられた金属元素は下面６０４Ｂに回り込むことで、下面６０４Ｂの外周部６０４Ｔに形成される金属膜６０１の部分の厚みは、下面６０４Ｂの外周から内側に向かって小さくなり、図１５Ａに示す底面部６６２が形成される。 Next, as shown in FIG. 27C, a metal film 601 covering the piece 621 is formed. The piece 621 is placed on the holding portion 622 so that the outer peripheral portion 604T of the lower surface 604B of the circuit board 604 of the piece 621 is exposed from the holding portion 622. The metal film 601 is formed on the outer peripheral portion 604T by wrapping around from the side surface of the piece 621 to the lower surface 604B. When the metal film 601 is formed, for example, by sputtering a metal element, the metal element sprayed from the upper surface of the piece 621 wraps around the lower surface 604B, so that the metal film 601 formed on the outer peripheral portion 604T of the lower surface 604B. The thickness of the portion decreases from the outer periphery of the lower surface 604B toward the inside, and the bottom surface portion 662 shown in FIG. 15A is formed.
　最後に、図２７Ｄに示すように、個片６２１を治具６２３から剥離することで、モジュール部品６００が得られる。 Finally, as shown in FIG. 27D, the module component 600 is obtained by peeling the piece 621 from the jig 623.
　このように、個片６２１の下面の端から内側に向かって薄くなる金属膜６０１ではバリの欠落が発生しにくいので、モジュール部品６００を取り扱う際の振動や衝撃に対して懸念される電気的接続信頼性を向上させることができる。 As described above, since the metal film 601 that becomes thinner from the lower end to the inside of the individual piece 621 is less likely to lose burrs, the electrical connection is concerned about vibration and impact when handling the module component 600. Reliability can be improved.
　図２８Ａから図２８Ｃはモジュール部品の他の製造方法を示す斜視図であり、金属膜６０１の形成方法を示す。マスク６２４は、金属膜６０１の側面部６０１Ｂにスリット６１３や開口部６１０を形成するために用いられる。 FIG. 28A to FIG. 28C are perspective views showing another method for manufacturing a module component, and show a method for forming the metal film 601. The mask 624 is used to form a slit 613 and an opening 610 in the side surface 601B of the metal film 601.
　図２８Ａと図２８Ｂに示すように、金属膜６０１を形成する前に個片６２１を治具６２３に固定する。個片６２１の側面はマスク６２４に当接しているかもしくは小さい間隔で対向している。 28A and 28B, the piece 621 is fixed to the jig 623 before the metal film 601 is formed. The side surface of the piece 621 is in contact with the mask 624 or opposed at a small interval.
　図２８Ｃに示すように、マスク６２４で側面が覆われた個片６２１の表面にスパッタ装置で金属膜６０１を形成する。マスク６２４が当接しているあるいは対向している部分には金属膜６０１の材料が付着しないので、個片６２１の側面に開口部６１０やスリット６１３を形成することができる。なおマスク６２４と個片６２１との距離を調整することで、例えば図２７Ｂと図２７Ｃに示すように、金属膜６０１の底面部６０１Ｃに厚み勾配を形成することができる。 As shown in FIG. 28C, a metal film 601 is formed by a sputtering apparatus on the surface of the individual piece 621 whose side surface is covered with a mask 624. Since the material of the metal film 601 does not adhere to the portion where the mask 624 is in contact with or opposed to the mask 624, the opening 610 and the slit 613 can be formed on the side surface of the piece 621. By adjusting the distance between the mask 624 and the piece 621, a thickness gradient can be formed on the bottom surface portion 601C of the metal film 601 as shown in FIGS. 27B and 27C, for example.
　なお、実施の形態において、「上面」「下面」等の方向を示す用語は回路基板や部品等のモジュール部品の構成部品の相対的な位置関係にのみ依存する相対的な方向を示し、上下方向等の絶対的な方向を示すものではない。 In the embodiment, terms indicating directions such as “upper surface” and “lower surface” indicate relative directions that depend only on the relative positional relationship of the component parts of the module parts such as the circuit board and the parts, and the vertical direction. It does not indicate the absolute direction.
　本発明によるモジュール部品では、回路基板の配線パターンと金属膜とを高信頼性で電気的に接続することができ、取扱時の振動や落下衝撃等の外部衝撃に対して高い信頼性を有する電子機器に有用である。 In the module component according to the present invention, the wiring pattern of the circuit board and the metal film can be electrically connected with high reliability, and the electronic device has high reliability against external impacts such as vibration and drop impact during handling. Useful for equipment.
１００　　モジュール部品
１０１　　金属膜
１０１Ａ　　天面部
１０１Ｂ　　側面部
１０４　　回路基板（第１の回路基板）
１０８　　部品
１０９　　封止部
１１０　　グランドパターン（第１のグランドパターン）
１１２　　底面部
１１８　　回路基板（第２の回路基板）
１１９　　電子機器
１２１Ａ　　グランドパターン（第２のグランドパターン）
１２１Ｂ　　グランドパターン（第３のグランドパターン）
６００　　モジュール部品
６０１　　金属膜
６０１Ａ　　天面部
６０１Ｂ　　側面部
６０１Ｃ　　底面部
６０４　　回路基板
６０８　　部品
６０９　　封止部
６１６　　給電部
６１８　　回路基板（第２の回路基板）
６２０　　電子機器 DESCRIPTION OF SYMBOLS 100 Module component 101 Metal film 101A Top surface part 101B Side surface part 104 Circuit board (1st circuit board)
108 Component 109 Sealing portion 110 Ground pattern (first ground pattern)
112 Bottom portion 118 Circuit board (second circuit board)
119 Electronic equipment 121A Ground pattern (second ground pattern)
121B ground pattern (third ground pattern)
600 Module component 601 Metal film 601A Top surface portion 601B Side surface portion 601C Bottom surface portion 604 Circuit board 608 Component 609 Sealing portion 616 Power feeding portion 618 Circuit board (second circuit board)
620 Electronic equipment

Claims (13)

  1. 上面と下面と側面とを有する回路基板と、
    前記回路基板の前記上面に実装された部品と、
    前記回路基板の前記上面に設けられてかつ前記部品を封止し、上面を有する封止部と、
    前記回路基板の前記下面の外周部分に設けられたグランドパターンと、
    　　　前記封止部の前記上面を覆う天面部と、
    　　　前記天面部から延びてかつ前記回路基板の前記側面を覆う側面部と、
    　　　前記側面部から延びて、前記グランドパターン上に設けられ、前記側面部から離れるにしたがって小さくなる厚みを有する底面部と、
    を有する金属膜と、
    を備えたモジュール部品。     A circuit board having an upper surface, a lower surface and side surfaces;
    Components mounted on the top surface of the circuit board;
    A sealing portion provided on the top surface of the circuit board and sealing the component, and having a top surface;
    A ground pattern provided on an outer peripheral portion of the lower surface of the circuit board;
    A top surface portion covering the upper surface of the sealing portion;
    A side surface portion extending from the top surface portion and covering the side surface of the circuit board;
    A bottom surface portion extending from the side surface portion, provided on the ground pattern, and having a thickness that decreases with increasing distance from the side surface portion;
    A metal film having
    With modular parts.
  2. 前記回路基板の前記下面は４つの辺を有する矩形状を実質的に有し、
    前記グランドパターンは前記回路基板の前記下面の前記４つの辺のうちの少なくとも２つの辺に沿って設けられており、
    前記金属膜の前記底面部は前記回路基板の前記下面の前記４つの辺のうちの前記少なくとも２つの辺を超えて前記グランドパターンに設けられている、請求項１に記載のモジュール部品。     The lower surface of the circuit board substantially has a rectangular shape having four sides;
    The ground pattern is provided along at least two of the four sides of the lower surface of the circuit board;
    2. The module component according to claim 1, wherein the bottom surface portion of the metal film is provided in the ground pattern beyond the at least two sides of the four sides of the lower surface of the circuit board.
  3. 前記金属膜は、スパッタ膜、めっき膜、導電性ペーストのいずれか、あるいはこれらの組み合わせよりなる、請求項１に記載のモジュール部品。 The module component according to claim 1, wherein the metal film is formed of any one of a sputtered film, a plated film, and a conductive paste, or a combination thereof.
  4. 前記グランドパターンの表面と前記金属膜の表面との色差ΔＥが３以上である、請求項１に記載のモジュール部品。 The module component according to claim 1, wherein a color difference ΔE between the surface of the ground pattern and the surface of the metal film is 3 or more.
  5. 前記封止部の、前記金属膜の前記天面部と前記側面部とが繋がる部分は、階段形状またはＣ面カット形状、Ｒ面加工形状、あるいはこれらの組み合わせ形状を有する、請求項１に記載のモジュール部品。 The portion of the sealing portion where the top surface portion and the side surface portion of the metal film are connected has a stepped shape, a C surface cut shape, an R surface processed shape, or a combination shape thereof. Module parts.
  6. 回路基板シートに複数の部品を実装するステップと、
    前記回路基板シートに実装された前記複数の部品を封止樹脂で封止するステップと、
    前記回路基板シートを前記封止樹脂と共に個片に分割するステップと、
    前記個片を治具に保持するステップと、
    前記個片を前記治具に保持するステップの間に、厚み勾配を有する金属膜を前記個片の表面に形成するステップと、
    を含む、モジュール部品の製造方法。     Mounting a plurality of components on a circuit board sheet;
    Sealing the plurality of components mounted on the circuit board sheet with a sealing resin;
    Dividing the circuit board sheet into pieces together with the sealing resin;
    Holding the piece in a jig;
    A step of forming a metal film having a thickness gradient on the surface of the piece during the step of holding the piece on the jig;
    A method for manufacturing a module component, comprising:
  7. 　　　上面と下面と側面とを有する第１の回路基板と、
    　　　前記第１の回路基板の前記上面に実装された部品と、
    　　　前記第１の回路基板の前記上面に設けられてかつ前記部品を封止し、上面を有する封止部と、
    　　　前記第１の回路基板の前記下面の外周部分に設けられた第１のグランドパターンと、
    　　　前記封止部と前記第１の回路基板とを覆う金属膜と、
    を含むモジュール部品と、
    前記モジュール部品が搭載された上面を有する第２の回路基板と、
    を備え、
    前記第１の回路基板は、前記側面に露出する配線パターンを有し、
    前記金属膜は、
    　　　前記封止部の前記上面を覆う天面部と、
    　　　前記天面部から延びてかつ前記回路基板の前記側面を覆い、前記配線パターンに電気的に接続された側面部と、
    　　　前記側面部から延びて、前記第１のグランドパターン上に設けられ、前記側面部から離れるにしたがって小さくなる厚みを有する底面部と、
    を有する、電子機器。     A first circuit board having an upper surface, a lower surface and a side surface;
    Components mounted on the top surface of the first circuit board;
    A sealing portion provided on the upper surface of the first circuit board and sealing the component, and having a top surface;
    A first ground pattern provided on an outer peripheral portion of the lower surface of the first circuit board;
    A metal film covering the sealing portion and the first circuit board;
    Module parts including
    A second circuit board having an upper surface on which the module component is mounted;
    With
    The first circuit board has a wiring pattern exposed on the side surface,
    The metal film is
    A top surface portion covering the upper surface of the sealing portion;
    A side surface portion extending from the top surface portion and covering the side surface of the circuit board and electrically connected to the wiring pattern;
    A bottom surface portion extending from the side surface portion, provided on the first ground pattern, and having a thickness that decreases with increasing distance from the side surface portion;
    Having an electronic device.
  8. 前記第２の回路基板は、
    　　　前記第２の回路基板の前記上面に設けられた第２のグランドパターンと、
    　　　前記第２の回路基板の下面に設けられた第３のグランドパターンと、
    　　　前記モジュール部品の前記第１のグランドパターンに電気的に接続されており、かつ前記第２のグランドパターンと前記第３のグランドパターンとに接続されたビア導体と、
    を有する、請求項７に記載の電子機器。     The second circuit board is:
    A second ground pattern provided on the upper surface of the second circuit board;
    A third ground pattern provided on the lower surface of the second circuit board;
    A via conductor electrically connected to the first ground pattern of the module component and connected to the second ground pattern and the third ground pattern;
    The electronic device according to claim 7, comprising:
  9. 上面と下面と側面とを有する回路基板と、
    前記回路基板の前記上面に実装された部品と、
    前記回路基板の前記上面に設けられてかつ前記部品を封止し、前記回路基板の前記上面に当接する下面と、上面と、側面とを有する封止部と、
    　　　前記封止部の前記上面を覆う天面部と、
    　　　前記天面部から延びてかつ前記回路基板の前記側面と前記封止部の前記側面とを覆う側面部と、
    を有する金属膜と、
    前記金属膜に給電して前記金属膜をアンテナとして動作させる給電部と、
    を備え、
    前記金属膜の前記天面部の厚みは、前記側面部のうちの前記封止部の前記側面を覆う部分の厚みの１．５倍以上５倍以下である、モジュール部品。     A circuit board having an upper surface, a lower surface and side surfaces;
    Components mounted on the top surface of the circuit board;
    A sealing portion that is provided on the upper surface of the circuit board and seals the component, and includes a lower surface that contacts the upper surface of the circuit board, an upper surface, and a side surface;
    A top surface portion covering the upper surface of the sealing portion;
    A side surface portion extending from the top surface portion and covering the side surface of the circuit board and the side surface of the sealing portion;
    A metal film having
    A power feeding unit that feeds power to the metal film and operates the metal film as an antenna;
    With
    The thickness of the said top surface part of the said metal film is a module component which is 1.5 times or more and 5 times or less of the thickness of the part which covers the said side surface of the said sealing part among the said side surface parts.
  10. 前記給電部は前記金属膜の前記天面部と前記回路基板の前記上面との間で形成された結合成分よりなる、請求項９記載のモジュール部品。 The module component according to claim 9, wherein the power feeding portion is formed of a coupling component formed between the top surface portion of the metal film and the upper surface of the circuit board.
  11. 前記金属膜は、スパッタ膜、めっき膜、導電性ペーストのいずれか、あるいはこれらの組み合わせよりなる、請求項９に記載のモジュール部品。 The module component according to claim 9, wherein the metal film is formed of any one of a sputtered film, a plated film, and a conductive paste, or a combination thereof.
  12. 回路基板シートに複数の部品を実装するステップと、
    前記回路基板に実装された前記複数の部品を封止樹脂で封止するステップと、
    前記回路基板シートを前記封止樹脂と共に個片に分割するステップと、
    前記個片を治具に保持する保持工程と、
    前記個片を前記治具に保持するステップの間に、金属膜を前記個片の表面に形成するステップと、
    を含み、
    前記個片は、
    　　　上面と下面と側面とを有する回路基板と、
    　　　前記複数の部品のうちの１つと、
    　　　前記回路基板の前記上面に設けられてかつ前記複数の部品のうちの前記１つを封止し、前記回路基板の前記上面に当接する下面と、上面と、側面とを有して前記封止樹脂よりなる封止部と、
    　　　前記金属膜に給電して前記金属膜をアンテナとして動作させる給電部と、
    を備え、
    前記金属膜は、
    　　　前記封止部の前記上面を覆う天面部と、
    　　　前記天面部から延びてかつ前記回路基板の前記側面と前記封止部の前記側面とを覆う側面部と、
    を有し、
    前記金属膜の前記天面部の厚みは、前記側面部のうちの前記封止部の前記側面を覆う部分の厚みの１．５倍以上５倍以下である、モジュール部品の製造方法。     Mounting a plurality of components on a circuit board sheet;
    Sealing the plurality of components mounted on the circuit board with a sealing resin;
    Dividing the circuit board sheet into pieces together with the sealing resin;
    A holding step of holding the pieces in a jig;
    During the step of holding the piece on the jig, forming a metal film on the surface of the piece;
    Including
    The piece is
    A circuit board having an upper surface, a lower surface and side surfaces;
    One of the plurality of parts;
    The sealing is provided on the upper surface of the circuit board and seals the one of the plurality of components and has a lower surface, an upper surface, and a side surface that are in contact with the upper surface of the circuit board. A sealing portion made of resin;
    A power feeding unit that feeds power to the metal film and operates the metal film as an antenna;
    With
    The metal film is
    A top surface portion covering the upper surface of the sealing portion;
    A side surface portion extending from the top surface portion and covering the side surface of the circuit board and the side surface of the sealing portion;
    Have
    The thickness of the said top surface part of the said metal film is a manufacturing method of the module components which is 1.5 to 5 times the thickness of the part which covers the said side surface of the said sealing part among the said side parts.
  13. 　　　上面と下面と側面とを有する第１の回路基板と、
    　　　前記第１の回路基板の前記上面に実装された部品と、
    　　　前記第１の回路基板の前記上面に設けられてかつ前記部品を封止し、上面と下面と側面とを有する封止部と、
    　　　前記封止部と前記第１の回路基板とを覆う金属膜と、
    　　　前記金属膜に給電して前記金属膜をアンテナとして動作させる給電部と、
    を有するモジュール基板と、
    前記モジュール基板が固定された第２の回路基板と、
    を備え、
    前記第１の回路基板は、前記第１の回路基板の前記側面に露出する配線パターンを有し、
    前記金属膜は、
    　　　前記封止部の前記上面を覆う天面部と、
    　　　前記天面部から延びてかつ前記第１の回路基板の前記側面と前記封止部の前記側面とを覆い、前記配線パターンに電気的に接続された側面部と、
    を有し、
    前記金属膜の前記天面部の厚みは前記金属膜のうちの前記封止部の前記側面を覆う部分の厚みの１．５倍以上５倍以下である、電子機器。     A first circuit board having an upper surface, a lower surface and a side surface;
    Components mounted on the top surface of the first circuit board;
    A sealing portion that is provided on the upper surface of the first circuit board and seals the component, and has an upper surface, a lower surface, and a side surface;
    A metal film covering the sealing portion and the first circuit board;
    A power feeding unit that feeds power to the metal film and operates the metal film as an antenna;
    A module substrate having
    A second circuit board to which the module board is fixed;
    With
    The first circuit board has a wiring pattern exposed on the side surface of the first circuit board;
    The metal film is
    A top surface portion covering the upper surface of the sealing portion;
    A side portion extending from the top surface portion and covering the side surface of the first circuit board and the side surface of the sealing portion and electrically connected to the wiring pattern;
    Have
    The thickness of the said top surface part of the said metal film is an electronic device which is 1.5 times or more and 5 times or less of the thickness of the part which covers the said side surface of the said sealing part among the said metal films.
PCT/JP2010/001496 2009-03-10 2010-03-04 Module component, method for manufacturing same, and electronic apparatus using the module component WO2010103756A1 (en)

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JP2009093819A JP2010245931A (en) 2009-04-08 2009-04-08 Antenna integrated module component, method for manufacturing the same, and electronic apparatus using the module component
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