WO2010094662A3 - Verdampfer und kühleinrichtung unter verwendung derartiger verdampfer - Google Patents

Verdampfer und kühleinrichtung unter verwendung derartiger verdampfer Download PDF

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Publication number
WO2010094662A3
WO2010094662A3 PCT/EP2010/051881 EP2010051881W WO2010094662A3 WO 2010094662 A3 WO2010094662 A3 WO 2010094662A3 EP 2010051881 W EP2010051881 W EP 2010051881W WO 2010094662 A3 WO2010094662 A3 WO 2010094662A3
Authority
WO
WIPO (PCT)
Prior art keywords
stamping
forms
evaporator
hermetically
expansion chamber
Prior art date
Application number
PCT/EP2010/051881
Other languages
English (en)
French (fr)
Other versions
WO2010094662A2 (de
Inventor
Lothar Stemke
Original Assignee
Stemke, Gudrun
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Stemke, Gudrun filed Critical Stemke, Gudrun
Publication of WO2010094662A2 publication Critical patent/WO2010094662A2/de
Publication of WO2010094662A3 publication Critical patent/WO2010094662A3/de

Links

Classifications

    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F25—REFRIGERATION OR COOLING; COMBINED HEATING AND REFRIGERATION SYSTEMS; HEAT PUMP SYSTEMS; MANUFACTURE OR STORAGE OF ICE; LIQUEFACTION SOLIDIFICATION OF GASES
    • F25B—REFRIGERATION MACHINES, PLANTS OR SYSTEMS; COMBINED HEATING AND REFRIGERATION SYSTEMS; HEAT PUMP SYSTEMS
    • F25B39/00—Evaporators; Condensers
    • F25B39/02—Evaporators
    • F25B39/022—Evaporators with plate-like or laminated elements
    • F25B39/024—Evaporators with plate-like or laminated elements with elements constructed in the shape of a hollow panel
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F25—REFRIGERATION OR COOLING; COMBINED HEATING AND REFRIGERATION SYSTEMS; HEAT PUMP SYSTEMS; MANUFACTURE OR STORAGE OF ICE; LIQUEFACTION SOLIDIFICATION OF GASES
    • F25B—REFRIGERATION MACHINES, PLANTS OR SYSTEMS; COMBINED HEATING AND REFRIGERATION SYSTEMS; HEAT PUMP SYSTEMS
    • F25B39/00—Evaporators; Condensers
    • F25B39/02—Evaporators
    • F25B39/022—Evaporators with plate-like or laminated elements
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28—HEAT EXCHANGE IN GENERAL
    • F28D—HEAT-EXCHANGE APPARATUS, NOT PROVIDED FOR IN ANOTHER SUBCLASS, IN WHICH THE HEAT-EXCHANGE MEDIA DO NOT COME INTO DIRECT CONTACT
    • F28D1/00—Heat-exchange apparatus having stationary conduit assemblies for one heat-exchange medium only, the media being in contact with different sides of the conduit wall, in which the other heat-exchange medium is a large body of fluid, e.g. domestic or motor car radiators
    • F28D1/02—Heat-exchange apparatus having stationary conduit assemblies for one heat-exchange medium only, the media being in contact with different sides of the conduit wall, in which the other heat-exchange medium is a large body of fluid, e.g. domestic or motor car radiators with heat-exchange conduits immersed in the body of fluid
    • F28D1/03—Heat-exchange apparatus having stationary conduit assemblies for one heat-exchange medium only, the media being in contact with different sides of the conduit wall, in which the other heat-exchange medium is a large body of fluid, e.g. domestic or motor car radiators with heat-exchange conduits immersed in the body of fluid with plate-like or laminated conduits
    • F28D1/0308—Heat-exchange apparatus having stationary conduit assemblies for one heat-exchange medium only, the media being in contact with different sides of the conduit wall, in which the other heat-exchange medium is a large body of fluid, e.g. domestic or motor car radiators with heat-exchange conduits immersed in the body of fluid with plate-like or laminated conduits the conduits being formed by paired plates touching each other
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28—HEAT EXCHANGE IN GENERAL
    • F28D—HEAT-EXCHANGE APPARATUS, NOT PROVIDED FOR IN ANOTHER SUBCLASS, IN WHICH THE HEAT-EXCHANGE MEDIA DO NOT COME INTO DIRECT CONTACT
    • F28D15/00—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies
    • F28D15/02—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes
    • F28D15/0266—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes with separate evaporating and condensing chambers connected by at least one conduit; Loop-type heat pipes; with multiple or common evaporating or condensing chambers
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28—HEAT EXCHANGE IN GENERAL
    • F28F—DETAILS OF HEAT-EXCHANGE AND HEAT-TRANSFER APPARATUS, OF GENERAL APPLICATION
    • F28F3/00—Plate-like or laminated elements; Assemblies of plate-like or laminated elements
    • F28F3/12—Elements constructed in the shape of a hollow panel, e.g. with channels
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01B—MEASURING LENGTH, THICKNESS OR SIMILAR LINEAR DIMENSIONS; MEASURING ANGLES; MEASURING AREAS; MEASURING IRREGULARITIES OF SURFACES OR CONTOURS
    • G01B21/00—Measuring arrangements or details thereof, where the measuring technique is not covered by the other groups of this subclass, unspecified or not relevant
    • G01B21/02—Measuring arrangements or details thereof, where the measuring technique is not covered by the other groups of this subclass, unspecified or not relevant for measuring length, width, or thickness
    • G01B21/04—Measuring arrangements or details thereof, where the measuring technique is not covered by the other groups of this subclass, unspecified or not relevant for measuring length, width, or thickness by measuring coordinates of points
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/42—Fillings or auxiliary members in containers or encapsulations selected or arranged to facilitate heating or cooling
    • H01L23/427—Cooling by change of state, e.g. use of heat pipes
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L31/00—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L31/04—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof adapted as photovoltaic [PV] conversion devices
    • H01L31/052—Cooling means directly associated or integrated with the PV cell, e.g. integrated Peltier elements for active cooling or heat sinks directly associated with the PV cells
    • H01L31/0521—Cooling means directly associated or integrated with the PV cell, e.g. integrated Peltier elements for active cooling or heat sinks directly associated with the PV cells using a gaseous or a liquid coolant, e.g. air flow ventilation, water circulation
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/20—Modifications to facilitate cooling, ventilating, or heating
    • H05K7/2029—Modifications to facilitate cooling, ventilating, or heating using a liquid coolant with phase change in electronic enclosures
    • H05K7/20309—Evaporators
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F25—REFRIGERATION OR COOLING; COMBINED HEATING AND REFRIGERATION SYSTEMS; HEAT PUMP SYSTEMS; MANUFACTURE OR STORAGE OF ICE; LIQUEFACTION SOLIDIFICATION OF GASES
    • F25B—REFRIGERATION MACHINES, PLANTS OR SYSTEMS; COMBINED HEATING AND REFRIGERATION SYSTEMS; HEAT PUMP SYSTEMS
    • F25B2339/00—Details of evaporators; Details of condensers
    • F25B2339/02—Details of evaporators
    • F25B2339/022—Evaporators constructed from a pair of plates forming a space in which is located a refrigerant carrying coil
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F25—REFRIGERATION OR COOLING; COMBINED HEATING AND REFRIGERATION SYSTEMS; HEAT PUMP SYSTEMS; MANUFACTURE OR STORAGE OF ICE; LIQUEFACTION SOLIDIFICATION OF GASES
    • F25B—REFRIGERATION MACHINES, PLANTS OR SYSTEMS; COMBINED HEATING AND REFRIGERATION SYSTEMS; HEAT PUMP SYSTEMS
    • F25B2500/00—Problems to be solved
    • F25B2500/18—Optimization, e.g. high integration of refrigeration components
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28—HEAT EXCHANGE IN GENERAL
    • F28D—HEAT-EXCHANGE APPARATUS, NOT PROVIDED FOR IN ANOTHER SUBCLASS, IN WHICH THE HEAT-EXCHANGE MEDIA DO NOT COME INTO DIRECT CONTACT
    • F28D21/00—Heat-exchange apparatus not covered by any of the groups F28D1/00 - F28D20/00
    • F28D2021/0019—Other heat exchangers for particular applications; Heat exchange systems not otherwise provided for
    • F28D2021/0028—Other heat exchangers for particular applications; Heat exchange systems not otherwise provided for for cooling heat generating elements, e.g. for cooling electronic components or electric devices
    • F28D2021/0029—Heat sinks
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28—HEAT EXCHANGE IN GENERAL
    • F28D—HEAT-EXCHANGE APPARATUS, NOT PROVIDED FOR IN ANOTHER SUBCLASS, IN WHICH THE HEAT-EXCHANGE MEDIA DO NOT COME INTO DIRECT CONTACT
    • F28D21/00—Heat-exchange apparatus not covered by any of the groups F28D1/00 - F28D20/00
    • F28D2021/0019—Other heat exchangers for particular applications; Heat exchange systems not otherwise provided for
    • F28D2021/0068—Other heat exchangers for particular applications; Heat exchange systems not otherwise provided for for refrigerant cycles
    • F28D2021/0071—Evaporators
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28—HEAT EXCHANGE IN GENERAL
    • F28F—DETAILS OF HEAT-EXCHANGE AND HEAT-TRANSFER APPARATUS, OF GENERAL APPLICATION
    • F28F2210/00—Heat exchange conduits
    • F28F2210/02—Heat exchange conduits with particular branching, e.g. fractal conduit arrangements
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28—HEAT EXCHANGE IN GENERAL
    • F28F—DETAILS OF HEAT-EXCHANGE AND HEAT-TRANSFER APPARATUS, OF GENERAL APPLICATION
    • F28F2210/00—Heat exchange conduits
    • F28F2210/10—Particular layout, e.g. for uniform temperature distribution
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28—HEAT EXCHANGE IN GENERAL
    • F28F—DETAILS OF HEAT-EXCHANGE AND HEAT-TRANSFER APPARATUS, OF GENERAL APPLICATION
    • F28F2255/00—Heat exchanger elements made of materials having special features or resulting from particular manufacturing processes
    • F28F2255/02—Flexible elements
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02E—REDUCTION OF GREENHOUSE GAS [GHG] EMISSIONS, RELATED TO ENERGY GENERATION, TRANSMISSION OR DISTRIBUTION
    • Y02E10/00—Energy generation through renewable energy sources
    • Y02E10/50—Photovoltaic [PV] energy

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Thermal Sciences (AREA)
  • General Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Power Engineering (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Electromagnetism (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Sustainable Development (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
  • Photovoltaic Devices (AREA)

Abstract

Die Erfindung betrifft einen Verdampfer für eine hermetische, mit einem phasenwechselnden Kältemittel befüllte Kühleinrichtung sowie dessen Verwendung vorzugsweise zur Kühlung von Halbleiterbauelementen oder Photovoltaikmodulen. Die Aufgabe der Erfindung besteht darin, den Herstellungsaufwand für flächig ausgebildete Verdampfer zu reduzieren und die Effizienz von Kühleinrichtungen mit Flächenverdampfern zu verbessern. Der erfindungsgemäße Verdampfer für eine mit einem phasenwechselnden Kältemittel befüllte hermetische Kühleinrichtung umfasst einen Träger, der mit Kältemittelkanälen versehen ist. Eine erste Folie (1), die mit wenigstens einer ersten, einen Expansionsraum bildenden Ausprägung (3) sowie wenigstens einer weiteren, einen in den Expansionsraum mündenden Zuführkanal (4) bildenden Ausprägung und wenigstens einer dritten, einen vom Expansionsraum ausgehenden Ableitkanal (5) bildenden Ausprägung versehen ist, ist mit wenigstens einer zweiten Folie (2) flächig die Ausprägungen hermetisch abdeckend verbunden. Jede einen Zuführkanal (4) bildende Ausprägung ist über eine hermetisch anschließbare Verbindungsleitung an den Ausgang eines Verflüssigers und jede einen Ableitkanal (5) bildende Ausprägung ist über eine hermetisch anschließbare Verbindungsleitung an den Eingang eines Verdichters anschließbar.
PCT/EP2010/051881 2009-02-17 2010-02-16 Verdampfer und kühleinrichtung unter verwendung derartiger verdampfer WO2010094662A2 (de)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
DE102009000914.0 2009-02-17
DE102009000914A DE102009000914A1 (de) 2009-02-17 2009-02-17 Verdampfer und Kühleinrichtung unter Verwendung derartiger Verdampfer

Publications (2)

Publication Number Publication Date
WO2010094662A2 WO2010094662A2 (de) 2010-08-26
WO2010094662A3 true WO2010094662A3 (de) 2011-02-24

Family

ID=42338439

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/EP2010/051881 WO2010094662A2 (de) 2009-02-17 2010-02-16 Verdampfer und kühleinrichtung unter verwendung derartiger verdampfer

Country Status (2)

Country Link
DE (2) DE102009000914A1 (de)
WO (1) WO2010094662A2 (de)

Families Citing this family (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20130319024A1 (en) * 2012-05-29 2013-12-05 Abb Technology Ag Dual Port Heat Pipe Structure For Switchgear
DE102014017031A1 (de) * 2014-11-19 2016-05-19 Fachhochschule Düsseldorf Wärmeübertragerelement und Verfahren zur Wärmeübertragung
US9835382B2 (en) 2015-09-16 2017-12-05 Acer Incorporated Thermal dissipation module
TWI602497B (zh) * 2015-09-16 2017-10-11 宏碁股份有限公司 散熱模組
US9894815B1 (en) 2016-08-08 2018-02-13 General Electric Company Heat removal assembly for use with a power converter
KR101834741B1 (ko) * 2017-05-29 2018-03-06 한국이미지시스템(주) 판형 냉각장치를 구비한 태양광 발전 장치
DE102021203205A1 (de) * 2021-03-30 2022-10-06 Conti Tech Techno-Chemie Gmbh Wärmetauscher

Citations (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US2948053A (en) * 1956-03-23 1960-08-09 Philco Corp Method of manufacturing refrigerating apparatus
US2966781A (en) * 1956-03-05 1961-01-03 Philco Corp Refrigeration apparatus and methods of manufacturing the same
FR2505036A1 (fr) * 1981-05-01 1982-11-05 Little William Dispositif de refrigeration microminiature et son procede de fabrication
WO2002099344A1 (de) * 2001-06-01 2002-12-12 BSH Bosch und Siemens Hausgeräte GmbH Kältegerät und verdampfer dafür
US20030106671A1 (en) * 2001-04-27 2003-06-12 Samsung Electronics Co., Ltd. Flat evaporator
WO2004023049A1 (de) * 2002-08-13 2004-03-18 BSH Bosch und Siemens Hausgeräte GmbH Wärmetauscher-turbine-anordnung
US20060157227A1 (en) * 2003-05-31 2006-07-20 Choi Jae J Cooling device of thin plate type for preventing dry-out

Family Cites Families (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US2626130A (en) * 1949-08-19 1953-01-20 Raskin Leon Heat exchanger device
DE10013435C1 (de) * 2000-03-17 2001-10-31 Xcellsis Gmbh Folienpaket für einen zweigängigen Verdampfer
DE20200484U1 (de) * 2002-01-14 2002-06-20 Mueller Arnold Gmbh Co Kg Kühlvorrichtung für Bauteile, insbesondere für elektrische oder elektronische Bauteile, wie Stromrichter o.dgl.
DE10260165A1 (de) 2002-04-26 2003-12-18 Bsh Bosch Siemens Hausgeraete Wärmetauscher für ein Kältegerät und Verfahren zur Herstellung eines Wärmetauschers
TW540989U (en) * 2002-10-04 2003-07-01 Via Tech Inc Thin planar heat distributor
DE102007017623B4 (de) * 2007-04-12 2009-05-14 Rittal Gmbh & Co. Kg Montageplatte für elektrische oder elektronische Bauteile

Patent Citations (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US2966781A (en) * 1956-03-05 1961-01-03 Philco Corp Refrigeration apparatus and methods of manufacturing the same
US2948053A (en) * 1956-03-23 1960-08-09 Philco Corp Method of manufacturing refrigerating apparatus
FR2505036A1 (fr) * 1981-05-01 1982-11-05 Little William Dispositif de refrigeration microminiature et son procede de fabrication
US20030106671A1 (en) * 2001-04-27 2003-06-12 Samsung Electronics Co., Ltd. Flat evaporator
WO2002099344A1 (de) * 2001-06-01 2002-12-12 BSH Bosch und Siemens Hausgeräte GmbH Kältegerät und verdampfer dafür
WO2004023049A1 (de) * 2002-08-13 2004-03-18 BSH Bosch und Siemens Hausgeräte GmbH Wärmetauscher-turbine-anordnung
US20060157227A1 (en) * 2003-05-31 2006-07-20 Choi Jae J Cooling device of thin plate type for preventing dry-out

Also Published As

Publication number Publication date
DE102009000914A1 (de) 2010-08-19
DE202009019071U1 (de) 2016-03-17
WO2010094662A2 (de) 2010-08-26

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