WO2010094343A1 - Organe de préhension de bernoulli - Google Patents

Organe de préhension de bernoulli Download PDF

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Publication number
WO2010094343A1
WO2010094343A1 PCT/EP2009/056322 EP2009056322W WO2010094343A1 WO 2010094343 A1 WO2010094343 A1 WO 2010094343A1 EP 2009056322 W EP2009056322 W EP 2009056322W WO 2010094343 A1 WO2010094343 A1 WO 2010094343A1
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WO
WIPO (PCT)
Prior art keywords
substrate
receiving surface
handling device
gas
injection port
Prior art date
Application number
PCT/EP2009/056322
Other languages
English (en)
Inventor
Marco Galiazzo
Andrea Baccini
Original Assignee
Applied Materials, Inc.
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Applied Materials, Inc. filed Critical Applied Materials, Inc.
Publication of WO2010094343A1 publication Critical patent/WO2010094343A1/fr

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Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/6838—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping with gripping and holding devices using a vacuum; Bernoulli devices

Definitions

  • Embodiments of the present invention generally relate to a device for handling substrates during manufacturing processes.
  • embodiments of the present invention relate to handling substrates in a system and process for screen printing a multiple layer pattern on a surface of the substrate.
  • Description of the Related Art [0002]
  • Solar cells are photovoltaic (PV) devices that convert sunlight directly into electrical power. Solar cells typically have one or more p-n junctions. Each p-n junction comprises two different regions within a semiconductor material where one side is denoted as the p-type region and the other as the n-type region.
  • Solar cells When the p-n junction of a solar cell is exposed to sunlight (consisting of energy from photons), the sunlight is directly converted to electricity through the PV effect.
  • Solar cells generate a specific amount of electric power and are tiled into modules sized to deliver the desired amount of system power. Solar modules are joined into panels with specific frames and connectors.
  • Solar cells are commonly formed on silicon substrates, which may be single or multicrystalline silicon substrates.
  • a typical solar cell includes a silicon wafer, substrate, or sheet typically less than about 0.3 mm thick with a thin layer of n-type silicon on top of a p-type region formed on the substrate.
  • Embodiments of the present invention generally provide a device for handling substrates.
  • the device includes a body having a substrate receiving surface surrounding a gas injection port and a gas exhaust port.
  • a gas source is connected to the gas injection port.
  • the gas exhaust port is one or more passages positioned near the substrate receiving surface and the gas injection port is one or more passages positioned away from the substrate receiving surface.
  • a method of handling a substrate is provided. The method includes placing a handling device over the substrate.
  • the handling device includes a body having a substrate receiving surface surrounding a gas injection port and a gas exhaust port.
  • a gas source is connected to the gas injection port.
  • the gas exhaust port is one or more passages positioned near the substrate receiving surface and the gas injection port is one or more passages positioned away from the substrate receiving surface.
  • the method includes creating a vacuum region above the substrate by flowing gas out of the gas injection port, over the substrate, towards the substrate receiving surface, and through the gas exhaust port.
  • the method also includes sealing a portion surrounding the vacuum region by causing the substrate to contact the substrate receiving surface and moving the substrate.
  • the screen printing system includes a rotary actuator having a printing nest disposed thereon and movable between a first position, a second position, and a third position, an input conveyor positioned to load a substrate onto the printing nest in the first position, and a pre-centering unit having a non- contact substrate handling device positioned to center a substrate on the input conveyor.
  • the non-contact handling device includes a body having a substrate receiving surface surrounding a gas injection port and a gas exhaust port.
  • a gas source is connected to the gas injection port.
  • the gas exhaust port is one or more passages positioned near the substrate receiving surface and the gas injection port is one or more passages positioned away from the substrate receiving surface.
  • the screen printing system also includes a screen printing chamber having an adjustable screen printing device disposed therein where the screen printing chamber is positioned to print a pattern onto the substrate when the printing nest is in the second position.
  • the pattern comprises a conductive structure of thin lines.
  • an exit conveyor is positioned to unload the substrate when the printing nest is in the third position.
  • a system controller comprising software is configured to actuate the non-contact substrate handling device for moving the substrate and for centering the substrate on the input conveyor.
  • the screen printing system includes a rotary actuator having a printing nest disposed thereon and movable between a first position, a second position, and a third position, an input conveyor positioned to load a substrate onto the printing nest in the first position, and a centering conveyor positioned to load a substrate on the input conveyor.
  • the centering conveyor has a non-contact substrate handling device to center a substrate on the centering conveyor.
  • the non-contact handling device includes a body having a substrate receiving surface surrounding a gas injection port and a gas exhaust port.
  • a gas source is connected to the gas injection port.
  • the gas exhaust port is one or more passages positioned near the substrate receiving surface and the gas injection port is one or more passages positioned away from the substrate receiving surface.
  • the screen printing system also includes a screen printing chamber having an adjustable screen printing device disposed therein where the screen printing chamber is positioned to print a pattern onto the substrate when the printing nest is in the second position.
  • the pattern comprises a conductive structure of thin lines.
  • an exit conveyor is positioned to unload the substrate when the printing nest is in the third position.
  • a system controller comprising software is configured to actuate the non-contact substrate handling device for moving the substrate and for centering the substrate on the input conveyor.
  • Figure IA is a schematic isometric view of a system that may be used in conjunction with embodiments of the present invention to form multiple layers of a desired pattern.
  • Figure IB is a schematic top plan view of the system in Figure IA.
  • Figure 2 A is a plan view of a front surface, or light receiving surface, of a solar cell substrate.
  • Figure 2B is a schematic cross-sectional view of a portion of a solar cell substrate having a properly aligned second layer printed atop a first layer.
  • Figure 2C is a schematic isometric view of a solar cell substrate illustrating misalignment of screen printing layers.
  • Figure 3 is a schematic isometric view of the front side of a non-contact substrate handling device according to one embodiment of the present invention.
  • Figure 4 is a schematic isometric view of the back side of a non-contact substrate handling device according to one embodiment of the present invention.
  • Figure 5 A illustrates a schematic cross-sectional view of a substrate and one embodiment of the non-contact substrate handling device before the device handles the substrate.
  • Figure 7 is a top plan view of a system that may be used in conjunction with embodiments of the present invention to form multiple layers of a desired pattern on a substrate.
  • Embodiments of the present invention provide an device and method for handling substrates during processing, such as in a screen printing system, that utilize an improved substrate handling device that may be used for transferring, aligning, and screen printing processes that can improve the device yield performance and cost-of-ownership (CoO) of a substrate processing line.
  • the screen printing system hereafter system, is adapted to perform a screen printing process within a portion of a crystalline silicon solar cell production line in which a substrate is patterned with a desired material in two or more layers and is then processed in one or more subsequent processing chambers.
  • the subsequent processing chambers may be adapted to perform one or more bake steps and one or more cleaning steps.
  • a non-contact substrate handling unit 175 on centering conveyor 170 may be used to pre-center a substrate as it passes between input conveyor 113 and incoming conveyor 111.
  • incoming conveyor 111 may pass through a pre- centering unit 160 having a non-contact substrate handling device to pre-center a substrate 150 as it is transferred from the incoming conveyor 111 to the printing nest 131.
  • the outgoing conveyor 112 may be configured to receive a processed substrate 150 from a printing nest 131 coupled to the rotary actuator assembly 130 and transfer the substrate 150 to the drying chamber 200.
  • the input conveyor 113 and the drier conveyor 114 which is contained in the drying chamber 200, may be automated substrate handling devices that are part of a larger production line.
  • the input conveyor 113 and the exit conveyor 114 may be part of the SoftlineTM tool available from Baccini S.p.A. of Treviso, Italy, of which the system 100 may be a module.
  • the rotary actuator assembly 130 may be rotated and angularly positioned about the "B" axis by a rotary actuator (not shown) and a system controller 101, such that the printing nests 131 may be selectively angularly positioned within the system 100.
  • the rotary actuator assembly 130 may also have one or more supporting components to facilitate the control of the print nests 131 or other automated devices used to perform a substrate processing sequence in the system 100.
  • the rotary actuator assembly 130 includes four printing nests 131, or substrate supports, that are each adapted to support a substrate 150 during the screen printing process performed within the screen printing chamber 102.
  • Figure IB schematically illustrates the position of the rotary actuator assembly 130 in which one printing nest 131 is in position "1" to receive a substrate 150 from the input conveyor 113, another printing nest 131 is in position "2" within the screen printing chamber 102 so that another substrate 150 can receive a screen printed pattern on a surface thereof, another printing nest 131 is in position "3” for transferring a processed substrate 150 to the output conveyor 112, and another printing nest 131 is in position "4", which is an intermediate stage between position "1" and position "3".
  • the screen printing chamber 102 in system 100 uses a conventional screen printing device available from Baccini S.p.A., which is adapted to deposit material in a desired pattern on the surface of the substrate 150 positioned on the printing nest 131 in position "2" during the screen printing process.
  • the screen printing chamber 102 contains a plurality of actuators, for example, actuators 102A (e.g., stepper motors, servomotors) that are in communication with the system controller 101 and are used to adjust the position and/or angular orientation of the screen printing device with respect to the substrate via commands sent from the system controller 101.
  • the screen printing chamber 102 is adapted to deposit a metal containing or dielectric containing material on the solar cell substrate 150.
  • the solar cell substrate 150 has a width between about 125 mm and about 156 mm and a length between about 70 mm and about 156 mm.
  • the system 100 includes an inspection assembly 200 adapted to inspect a substrate 150 located on the printing nest 131 in position "1".
  • the inspection assembly 200 may include one or more cameras 121 positioned to inspect an incoming, or processed substrate 150, located on the printing nest 131 in position "1".
  • the inspection assembly 200 includes at least one camera 121 (e.g., CCD camera) and other electronic components capable of inspecting and communicating the inspection results to the system controller 101 used to analyze the orientation and position of the substrate 150 on the printing nest 131.
  • the system controller 101 facilitates the control and automation of the overall system 100 and may include a central processing unit (CPU) (not shown), memory (not shown), and support circuits (or I/O) (not shown).
  • the CPU may be one of any form of computer processors that are used in industrial settings for controlling various chamber processes and hardware (e.g., conveyors, detectors, motors, fluid delivery hardware, etc.) and monitor the system and chamber processes (e.g., substrate position, process time, detector signal, etc.).
  • the memory is connected to the CPU, and may be one or more of a readily available memory, such as random access memory (RAM), read only memory (ROM), floppy disk, hard disk, or any other form of digital storage, local or remote.
  • RAM random access memory
  • ROM read only memory
  • floppy disk floppy disk
  • hard disk or any other form of digital storage, local or remote.
  • Software instructions and data can be coded and stored within the memory for instructing the CPU.
  • the support circuits are also connected to the CPU for supporting the processor in a conventional manner.
  • the support circuits may include cache, power supplies, clock circuits, input/output circuitry, subsystems, and the like.
  • a program (or computer instructions) readable by the system controller 101 determines which tasks are performable on a substrate.
  • the program is software readable by the system controller 101, which includes code to generate and store at least substrate positional information, the sequence of movement of the various controlled components, substrate inspection system information, and any combination thereof.
  • the system controller 101 includes software to actuate the non-contact substrate handling device for moving the substrate as necessary, such as pre- centering the substrate, as the substrate travels through processing system 100.
  • Figures IA- IB generally illustrate a system configuration that contains a drying chamber 200 that is positioned to receive a substrate 150 from an outgoing conveyor 112, after the substrate 150 has been processed in a screen printing chamber 102.
  • the drying chamber 200 contains a processing region 202 in which energy is delivered from a thermal system 201 to one or more substrates positioned therein, so that the material deposited on a surface of the one or more substrates can be dried.
  • the deposited material is an aluminum (Al) containing paste, such as a lead free aluminum cermet paste (e.g., Al Cermet 6214) that is commonly used in solar cell production processes to form the backside contacts on a crystalline solar cell substrate.
  • the processing region 202 has a drier conveyor 114 that is adapted to receive a substrate from another transferring device (e.g., outgoing conveyor 112), and move and/or position the substrate 150 within the processing region 202. [0034] After drying of the substrates another system 100 may be placed in-line to process the second side of the substrate 150.
  • a flipping device or unit is positioned to receive and transfer substrates from automatic production system conveyors such as conveyors 113 and 114, which are used to transfer substrates between various processing stages.
  • a pre-centering unit such as units 170 or 160 employing the non-contact handling device as above may also be placed in the production line between the drier 200 and a flipping unit (not shown) to pre-center the substrate 150 to properly align the substrate with the flipping unit.
  • embodiments of the invention may include other units besides pre-centering units that are used to pick and place substrates along the production process or move them in any manner as necessary.
  • the placement of the buss bars 151 and the fingers 152 on the front surface 155 of the substrate 150 depends on the alignment of a screen printing device used in the screen printing chamber 102 ( Figure IA) with respect to the positioning of the substrate 150 on the printing nest 131.
  • the screen printing device is generally a sheet or plate contained in the screen printing chamber 102.
  • the sheet or plate has a plurality of holes, slots, or other features formed therein to define the pattern and placement of screen printed ink or paste on the front surface 155 of the substrate 150.
  • the alignment of the screen printed pattern of fingers 152 and buss bars 151 on the surface of the substrate 150 is dependent on the alignment of the screen printing device to an edge of the substrate 150.
  • the positional offset ( ⁇ X, ⁇ Y) is the error in the placement of the pattern of buss bars 151 and fingers 152 relative to the edges 150A and 150B
  • the angular offset ⁇ R is the error in the angular alignment of the printed pattern of buss bars 151 and fingers 152 relative to the edge 150B of the substrate 150.
  • FIG. 2B is a schematic side cross-sectional view of a portion of the substrate 150 having a properly aligned second layer of buss bars 15 IB and fingers 152B printed atop a first layer of buss bars 15 IA and fingers 152A.
  • Figure 2C is a schematic isometric view of the solar cell substrate 150 illustrating misalignment of screen printing layers.
  • the alignment of the screen printed pattern for the second layer onto the first layer is dependent on the alignment of the screen printing device with respect to edges 150A, 150B of the substrate 150 as shown in Figure 2A.
  • misalignment of the second layer with respect to the first layer may occur due to a change in the positioning of the substrate 150 and/or the compounded effect of the measurement tolerances between the first screen printing operation and successive screen printing operations.
  • the misalignment of the second layer of fingers 152B and buss bars 15 IB with respect to the first layer of fingers 152A and buss bars 15 IA can be described as a positional misalignment (Xl, Yl) and an angular misalignment Rl .
  • embodiments of the invention utilize a non- contact substrate handling device as illustrated in Figures 3 and 4.
  • the embodiments of the invention may be used as part of the pre-centering units discussed above. Indeed, embodiments of the invention not only include such processing units, but also include any handling unit necessary to move a substrate. Moreover, embodiments of the invention may include end effectors used for handling substrates during processing.
  • Figures 3 and 4 show a schematic isometric view of the front side ( Figure 3) or back side ( Figure 4) of a non-contact substrate handling device 300 according to one embodiment of the present invention.
  • the device 300 includes a body 310 having a substrate receiving surface 312 surrounding a gas injection port 314 and a gas exhaust port 316.
  • a gas source 318 is connected to the gas injection port 314 to provide gas for actuating the non-contact substrate handling device.
  • the gas exhaust port 316 is one or more passages 320 positioned near the substrate receiving surface 312.
  • the gas injection port 314 is one or more passages 322 positioned away from the substrate receiving surface 312.
  • the gas injection port 314, including one or more passages 322 may be centrally located along the body 310 as shown in Figures 3 and 4.
  • the gas injection port 314 and the gas exhaust port 316 form a Venturi flow device i.e. a flow device for generating a vacuum by means of air flow or purge-gas flow through a restricted orifice.
  • the gas injection port 314 and the gas exhaust port 316 form a Bernoulli flow device or gripper 330.
  • the substrate receiving surface 312 may be an annular disc surrounding a central depression 306 in the body 310.
  • the annular disc may comprise a detachable ring 334 secured to the body 310, such as by screws 340.
  • the body may generally form other non-circular shapes such as an oval, rectangle, or other polygonal shapes.
  • a closed banded shape corresponding to the perimeter of the body face may also surround and be secured to the body to form the substrate receiving surface 312.
  • the body 310 of the non-contact handling device 300 may comprise a Bernoulli gripper 330 secured within a housing 338 having one or more supporting members 344.
  • the housing 338 has an annular face 332 that extends the surface area of the Bernoulli gripper 330.
  • the housing 338 is secured to a detachable ring 334 at one or more supporting members 344, such as by screws 340.
  • the detachable ring 334 has a substrate receiving surface 312.
  • a gasket 336 may be disposed on the substrate receiving surface 312 to dampen contact made with the substrate 150 during handling and to provide a sealing area.
  • the exhaust passages 320 of exhaust port 316 may be contoured.
  • the gas exhaust port may be two or more passages such as the three passages 320 shown in Figures 3 and 4.
  • the non-contact handling device 300 may be made from material comprising plastic, carbon, metal, aluminum or combinations thereof.
  • portions of body 310 may comprise aluminum and plastic and a detachable ring 330 secured to the body 310 may comprise plastic and rubber.
  • the substrate receiving surface forms a continuous contacting area that touches the substrate to provide better support and balance.
  • less gas pressure is required to actuate the non-contact handling device 300 to more gently handle the fragile substrates 150.
  • Figures 5A and 5B illustrate a schematic cross-sectional view of a substrate and one embodiment of the substrate handling device along line AA — AA of Figure 4. The figures show non-contact handling of the substrate before ( Figure 5A) and during (Figure 5B) handling of the substrate 150.
  • Gas passes from a gas source 318 to the gas injection port 314 injecting gas in to the area between the substrate and the non-contact handling device.
  • the gas may pass around a restriction 342 of the injection port 314 that forms passages 322. Initially, the gas flows without restraint over the substrate and passes through an area in between the handling device and the substrate as generally indicated by arrows "A”.
  • the pressure above the substrate decreases, resulting in a pressure imbalance. As the imbalance increases, the higher gas pressure below the substrate forces the substrate to lift, as indicated by arrows "C”.
  • a vacuum region 510 generally between the substrate and the body 310 is created above the substrate surface as also indicated by arrows "B".
  • the gas subsequently flows across the substrate surface and through the gas exhaust passages 320 of the gas exhaust port 316 as indicated by arrows "A".
  • the rubber gasket 336 prevents the substrate from spinning and stabilizes the substrate while moving the substrate to a new position.
  • the gasket 332 may also seal a portion 520 surrounding the vacuum region 510.
  • the non-contact handling device 300 may have a face 332 of the body 310 that slopes from a central region of the body towards the substrate receiving surface 312.
  • a gap is formed between the substrate 150 and the body 310 of the handling device 300.
  • a declining slope may form from a central region of the body, such as a central depression 306, to an outer edge of the substrate receiving surface 312.
  • the gap between the substrate 150 and the body 310 will decrease. In other words, the gap between body 310 and substrate 150 may vary from center to edge which may help maintain gas flow speed.
  • FIG. 6 is a schematic diagram of an operational sequence for non- contact handling of a substrate according to one embodiment of the present invention.
  • the method 600 of non-contact handling a substrate includes placing a handling device over the substrate, box 602.
  • the handling device includes a body having a substrate receiving surface surrounding a gas injection port and a gas exhaust port, box 604.
  • a gas source is connected to the gas injection port and the gas exhaust port is one or more passages positioned near the substrate receiving surface, and the gas injection port is one or more passages positioned away from the substrate receiving surface, box 606.
  • the method also includes creating a vacuum region above the substrate by flowing gas out of the gas injection port, over the substrate, towards the substrate receiving surface, and through the gas exhaust port, box 608.
  • a portion surrounding the vacuum region is sealed by causing the substrate to contact the substrate receiving surface, box 610, and moving the substrate 150, box 612.
  • FIG. 7 is a top plan view of a system 700 that may be used in conjunction with embodiments of the present invention to form multiple layers of a desired pattern, such as buss bars 151 and fingers 152, on the front surface 150 of the substrate 150.
  • the system 700 differs from the system 100 depicted in Figures IA and IB in that the system 700 includes two input conveyors 111, two non-contact substrate handling units 175 on centering conveyors 170 used to pre-center substrates, two pre-centering units 160, and two output conveyors 112.
  • the system 700 also differs from the system 100 in that the system 700 includes two screen printing chambers 102.
  • the system also includes to drier conveyors 114 with two driers 200.
  • Embodiments of the present invention may provide various advantages during the handling of substrates. Continuous surface contact by the substrate handling device instead of point contact may reduce vibration and induce less mechanical stress within the substrate. The actual area for gas flow is increased resulting in lower pressures necessary to producing the lifting effect of the non- contact handling device.

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  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
  • Medicines Containing Plant Substances (AREA)
  • Steroid Compounds (AREA)

Abstract

Selon certains modes de réalisation, l'invention concerne de manière générale un dispositif pour manipuler des substrats. Le dispositif comprend un corps ayant une surface de réception de substrat entourant un orifice d'injection de gaz et un orifice de sortie de gaz. Une source de gaz est connectée à l'orifice d'injection de gaz. L'orifice de sortie de gaz consiste en un ou plusieurs passages situés à proximité de la surface de réception de substrat et l'orifice d'injection de gaz consiste en un ou plusieurs passages situés à l'écart de la surface de réception de substrat.
PCT/EP2009/056322 2009-02-23 2009-05-25 Organe de préhension de bernoulli WO2010094343A1 (fr)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
IT000042A ITUD20090042A1 (it) 2009-02-23 2009-02-23 Pinza di bernoulli
ITUD2009A000042 2009-02-23

Publications (1)

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Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US8777284B2 (en) 2012-04-20 2014-07-15 Varian Semiconductor Equipment Associates, Inc. Venturi assisted gripper
WO2021048069A1 (fr) * 2019-09-10 2021-03-18 A O Ideas Gmbh Unité d'aspiration et dispositif d'aspiration
US11284994B2 (en) 2017-11-01 2022-03-29 Alcon Inc. Bernoulli gripper for intraocular and contact lenses

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN108146059B (zh) * 2018-02-06 2023-11-28 深圳市裕同包装科技股份有限公司 全自动丝网印刷机
CN114714757A (zh) * 2022-03-31 2022-07-08 福建坤华智能装备有限公司 一种ptc加热器正电极片自动丝印检测设备

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JPS58141536A (ja) * 1982-02-17 1983-08-22 Sanyo Electric Co Ltd 半導体ウエハ−の吸着ヘツド
EP0201240A1 (fr) * 1985-05-04 1986-11-12 Kabushiki Kaisha Seibu Giken Dispositif pour supporter et/ou convoyer une plaque au moyen d'un fluide sans contact corporel
WO2002003444A1 (fr) * 2000-06-30 2002-01-10 Memc Electronic Materials, Inc. Procede et appareil destines a former une plaquette presentant une zone denudee
EP1722410A1 (fr) * 2004-03-03 2006-11-15 Izumi Akiyama Dispositif de prehension sans contact et dispositif de prehension et transport sans contact
US7396022B1 (en) * 2004-09-28 2008-07-08 Kla-Tencor Technologies Corp. System and method for optimizing wafer flatness at high rotational speeds
WO2008086992A1 (fr) * 2007-01-15 2008-07-24 Thieme Gmbh & Co. Kg Chaîne de traitement pour des éléments du genre plaques, notamment des cellules solaires, et procédé de traitement d'éléments du genre plaques
WO2008145085A1 (fr) * 2007-05-31 2008-12-04 Jonas & Remann Automationstechnik Gmbh Organe de préhension, notamment organe de préhension selon bernoulli
WO2008147558A1 (fr) * 2007-05-25 2008-12-04 Corning Incorporated Appareil de manipulation d'une vitre

Patent Citations (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS58141536A (ja) * 1982-02-17 1983-08-22 Sanyo Electric Co Ltd 半導体ウエハ−の吸着ヘツド
EP0201240A1 (fr) * 1985-05-04 1986-11-12 Kabushiki Kaisha Seibu Giken Dispositif pour supporter et/ou convoyer une plaque au moyen d'un fluide sans contact corporel
WO2002003444A1 (fr) * 2000-06-30 2002-01-10 Memc Electronic Materials, Inc. Procede et appareil destines a former une plaquette presentant une zone denudee
EP1722410A1 (fr) * 2004-03-03 2006-11-15 Izumi Akiyama Dispositif de prehension sans contact et dispositif de prehension et transport sans contact
US7396022B1 (en) * 2004-09-28 2008-07-08 Kla-Tencor Technologies Corp. System and method for optimizing wafer flatness at high rotational speeds
WO2008086992A1 (fr) * 2007-01-15 2008-07-24 Thieme Gmbh & Co. Kg Chaîne de traitement pour des éléments du genre plaques, notamment des cellules solaires, et procédé de traitement d'éléments du genre plaques
WO2008147558A1 (fr) * 2007-05-25 2008-12-04 Corning Incorporated Appareil de manipulation d'une vitre
WO2008145085A1 (fr) * 2007-05-31 2008-12-04 Jonas & Remann Automationstechnik Gmbh Organe de préhension, notamment organe de préhension selon bernoulli

Cited By (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US8777284B2 (en) 2012-04-20 2014-07-15 Varian Semiconductor Equipment Associates, Inc. Venturi assisted gripper
US11284994B2 (en) 2017-11-01 2022-03-29 Alcon Inc. Bernoulli gripper for intraocular and contact lenses
US11864992B2 (en) 2017-11-01 2024-01-09 Alcon Inc. Bernoulli gripper for intraocular and contact lenses
WO2021048069A1 (fr) * 2019-09-10 2021-03-18 A O Ideas Gmbh Unité d'aspiration et dispositif d'aspiration
CN114401830A (zh) * 2019-09-10 2022-04-26 Ao福尔马隆瑞士公司 抽吸单元和抽吸装置

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TW201110264A (en) 2011-03-16
ITUD20090042A1 (it) 2010-08-24

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